Heating body, atomizer and electronic atomization device

Abstract

This invention relates to a heating element, an atomizer, and an electronic atomization device. The heating element comprises a porous substrate and a heating film. The heating film includes a first sub-film and a second sub-film stacked together. The first sub-film is located on the surface of the porous substrate and has a porous structure. The second sub-film is located on the side of the first sub-film away from the porous substrate. The second sub-film has a porous structure, and its porosity is less than that of the first sub-film; alternatively, the second sub-film may be non-porous. The heating element has low resistance and ensures sufficient atomized substrate during the atomization process, preventing dry burning.

Description

Technical Field

[0001] This invention relates to the field of atomizers, and in particular to a heating element, an atomizer, and an electronic atomization device. Background Technology

[0002] The heating element comprises a porous ceramic substrate and a heating film, which is typically a solid metal film. The liquid atomizing matrix can only wet the heating film from the porous ceramic surface adjacent to it, making complete wetting difficult. Insufficient supply of the atomizing matrix during atomization can easily lead to dry burning, causing the heating film to burn out and resulting in a decrease in mist output. Existing technologies typically address these issues by using porous heating films, which employ a metal film with a porous structure to provide some liquid conductivity and storage capacity. However, the porous nature of the film also results in higher resistance, hindering practical applications. Summary of the Invention

[0003] Therefore, it is necessary to provide a heating element with low resistance that can ensure sufficient atomization matrix during the atomization process and prevent dry burning.

[0004] In addition, it is necessary to provide an atomizer and an electronic atomization device that include the heating element.

[0005] A heating element includes: a porous substrate and a heating film;

[0006] The heating film includes a first sub-film and a second sub-film stacked together. The first sub-film is located on the surface of the porous substrate and has a porous structure.

[0007] The second sub-membrane is disposed on the side of the first sub-membrane away from the porous substrate;

[0008] The second submembrane has a porous structure and its porosity is less than that of the first submembrane; or, the second submembrane has a non-porous structure.

[0009] In one embodiment, the porosity of the first sub-membrane is 3% to 80%; and / or,

[0010] The average pore size of the first sub-membrane is 0.1 mm to 5 mm; and / or,

[0011] The thickness of the first sub-membrane is 40 μm to 1000 μm.

[0012] In one embodiment, the second sub-membrane has a porous structure, and the porosity of the second sub-membrane is ≤20%; and / or,

[0013] The second submembrane has a porous structure, and the average pore size of the second submembrane is 0.1 mm to 1 mm; and / or,

[0014] The thickness of the second sub-film is 2 μm to 50 μm; and / or,

[0015] The thickness of the second sub-membrane is less than the thickness of the first sub-membrane.

[0016] In one embodiment, the heating film further includes a third sub-film disposed between the first sub-film and the second sub-film. The third sub-film has a porous structure, and the porosity of the first sub-film is greater than or equal to the porosity of the third sub-film, which in turn is greater than or equal to the porosity of the second sub-film.

[0017] In one embodiment, there are multiple third sub-membranes, which are sequentially stacked between the first sub-membrane and the second sub-membrane, in a direction that gradually moves away from the porous substrate, wherein the porosity of the previous third sub-membrane is greater than or equal to the porosity of the next third sub-membrane.

[0018] In one embodiment, the first sub-film and the second sub-film are each independently a metal film or an alloy film.

[0019] In one embodiment, the first sub-film and the second sub-film are each independently selected from one of nickel film, titanium film, nickel-iron alloy film, nickel-copper alloy film, nickel-chromium alloy film and iron-chromium alloy film.

[0020] In one embodiment, the shape of the first sub-membrane is linear, curved, zigzag, rectangular, grid-like, or annular; and / or,

[0021] The orthographic projection of the second submembrane onto the first submembrane falls into the first submembrane.

[0022] In one embodiment, at least a portion of the pores in the porous substrate are connected to the pores of the first sub-membrane; and / or,

[0023] The porous matrix is ​​a porous ceramic matrix; and / or...

[0024] The porosity of the porous matrix is ​​25% to 75%; and / or,

[0025] The average pore size of the porous matrix is ​​5 μm to 40 μm.

[0026] In one embodiment, the porous matrix is ​​at least one of porous alumina ceramic, porous silica ceramic, porous silicon carbide ceramic, porous cordierite ceramic, porous mullite ceramic, porous sepiolite ceramic, and porous diatomaceous earth ceramic.

[0027] An atomizer includes a reservoir and a heating element as described above, wherein the reservoir is used to store a substrate to be atomized, and the heating element is used to heat and atomize the substrate in the reservoir.

[0028] An electronic atomizing device includes a power supply assembly and the aforementioned atomizer, wherein the power supply assembly is used to supply power to the atomizer.

[0029] The aforementioned heating element comprises a porous substrate and a heating film. The porous substrate guides the liquid substrate to be atomized, and the heating film heats and atomizes the substrate. The heating film includes a first sub-film and a second sub-film stacked together. The first sub-film is located on the surface of the porous substrate and has a porous structure, enabling it to adsorb the substrate from the substrate surface onto the heating film through capillary action, ensuring sufficient oil supply, achieving a low-temperature atomization effect, and preventing dry burning during atomization. Furthermore, the inventors discovered that when the heating film consists only of the first sub-film, the resistance is high, making practical application difficult. Therefore, a second sub-film with low porosity or no porosity is stacked on top of the first sub-film, which reduces the resistance while ensuring sufficient oil supply and good atomization effect, making the heating element practically applicable. Attached Figure Description

[0030] Figure 1 A schematic diagram of the structure of a heating element according to one embodiment;

[0031] Figure 2 for Figure 1 The diagram shows a cross-sectional view of the heating element.

[0032] Figure 3 for Figure 1 A physical image of the heating element shown;

[0033] Figure 4 for Figure 3 The image shown is a cross-sectional view of the heating element after it has been immersed in the atomization substrate.

[0034] Figure 5 for Figure 3 The top view shown is of the heating element after it has been immersed in the atomizing substrate.

[0035] Figure 6 for Figure 1 Another schematic diagram of the heating film in the heating element is shown;

[0036] Figure 7 for Figure 1 The diagram shows another structural schematic of the heating film in the heating element. Detailed Implementation

[0037] To facilitate understanding of the present invention, a more comprehensive description of the invention will be provided below in conjunction with specific embodiments. Preferred embodiments of the invention are given in the specific embodiments. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the present invention.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0039] The term “and / or” as used herein includes any and all combinations of one or more of the related listed items.

[0040] In this document, terms such as "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," or "third" may explicitly or implicitly include at least one of those features.

[0041] In this description, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] When a numerical range is disclosed herein, the range is considered continuous and includes the minimum and maximum values ​​of the range, as well as every value between the minimum and maximum values. Furthermore, when the range refers to integers, it includes every integer between the minimum and maximum values ​​of the range. Additionally, when multiple ranges are provided to describe a feature or characteristic, the ranges may be combined. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges to which they are incorporated.

[0043] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0044] Please see Figure 1 and Figure 2 A first aspect of the present invention provides a heating element 100 comprising a porous substrate 110 and a heating film 120. The porous substrate 110 is used to guide a liquid substrate to be atomized, and the heating film 120 is used to heat and atomize the substrate. The heating film 120 is disposed on the surface of the porous substrate 110.

[0045] The heating film 120 includes a first sub-film 122 and a second sub-film 124 stacked together. The first sub-film 122 is located on the surface of the porous substrate 110 and has a porous structure.

[0046] The second sub-membrane 124 is stacked on the side of the first sub-membrane 122 away from the porous substrate 110. In some embodiments, the second sub-membrane 124 has a porous structure, and the porosity of the second sub-membrane 124 is less than that of the first sub-membrane 122. In other embodiments, the first sub-membrane 122 has a porous structure, and the second sub-membrane 124 has a non-porous structure.

[0047] Specifically, the porosity of the first sub-membrane 122 is 3% to 80%. In a specific example, the porosity of the first sub-membrane 122 is 3%, 5%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, or any combination of these values. Further, the porosity of the first sub-membrane 122 is 5% to 30%.

[0048] The average pore size of the first sub-membrane 122 is 0.1 mm to 5 mm. In a specific example, the average pore size of the first sub-membrane 122 is 0.1 mm, 0.5 mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, or 5 mm, or any combination of these values. Further, the average pore size of the first sub-membrane 122 is 0.5 mm to 2 mm.

[0049] The thickness of the first sub-film 122 is 40 μm to 1000 μm. In a specific example, the thickness of the first sub-film 122 is 40 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm, 500 μm, 550 μm, 600 μm, 650 μm, 700 μm, 750 μm, 800 μm, 850 μm, 900 μm, 950 μm, 1000 μm, or any combination of these values. Further, the thickness of the first sub-film 122 is 60 μm to 400 μm.

[0050] Specifically, the holes on the first sub-film 122 can be through holes or thick-film holes. In some embodiments, the holes on the first sub-film 122 are through holes, and at least a portion of the holes on the first sub-film 122 penetrate the first sub-film 122 along its thickness direction. In this case, the first sub-film 122 can be a steel mesh film. In other embodiments, the holes on the first sub-film 122 are thick-film holes, and in this case, the first sub-film 122 can be a screen-printed thick film. It can be understood that through holes in this application refer to through holes formed on a thin metal material through processes such as laser drilling, etching, and stamping. The through holes have good consistency in pore size and shape. Thick-film holes in this application refer to relatively irregular porous structures formed in a thick film; this structure is formed in the prepared thick film by adding a certain proportion of pore-forming agent to the raw material slurry and sintering it during the preparation of the thick film.

[0051] In some embodiments, the first sub-membrane 122 is a thick-film pore, and the pore-forming agent used in the preparation of the first sub-membrane 122 is selected from at least one of starch, toner, ammonium bicarbonate, PMMA microspheres (polymethyl methacrylate microspheres), PS microspheres (polystyrene microspheres), limestone, dolomite, calcined stone, perlite and pumice.

[0052] In one embodiment, the first sub-film 122 is a metal film or an alloy film. Specifically, the first sub-film 122 is selected from one of a nickel film, a titanium film, a nickel-iron alloy film, a nickel-copper alloy film, a nickel-chromium alloy film, and an iron-chromium alloy film. In a specific example, the first sub-film 122 is selected from one of a porous nickel film, a porous titanium film, a porous nickel-iron alloy film, a porous nickel-copper alloy film, a porous nickel-chromium alloy film, and a porous iron-chromium-aluminum alloy film.

[0053] The porosity and average pore size of the first sub-membrane 122 are suitable, which can better adsorb the substrate to be atomized from the ceramic surface to the heating film 120 through capillary action, and ensure sufficient oil supply. At the same time, the first sub-membrane 122 itself can be made of metal or alloy material with good electrical and thermal conductivity, which can generate heat or conduct heat, achieve good atomization effect, and avoid dry burning during atomization.

[0054] In some embodiments, the second sub-membrane 124 is a porous structure, and the porosity of the second sub-membrane 124 is less than that of the first sub-membrane 122. Specifically, the porosity of the second sub-membrane 124 is ≤20%. In a specific example, the porosity of the second sub-membrane 124 is 1%, 5%, 10%, 15%, 20%, or a range of any two of these values.

[0055] The average pore size of the second sub-membrane 124 is 0.1 mm to 1 mm. In a specific example, the average pore size of the second sub-membrane 124 is 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, or any combination of these values.

[0056] The thickness of the second sub-film 124 is 2 μm to 50 μm. Further, the thickness of the second sub-film 124 is less than the thickness of the first sub-film 122. In a specific example, the thickness of the second sub-film 124 is 2 μm, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, or a range of any two of these values.

[0057] In one embodiment, the second sub-membrane 124 is a thick-film pore. The pore-forming agent used in the preparation of the second sub-membrane 124 is selected from at least one of starch, carbon powder, ammonium bicarbonate, PMMA microspheres, PS microspheres, limestone, dolomite, zeolite, perlite, and pumice.

[0058] In other embodiments, the second sub-membrane 124 is a non-porous structure. That is, the porosity of the second sub-membrane 124 is 0. When the second sub-membrane 124 is a non-porous structure, due to the small thickness of the second sub-membrane 124 and the high porosity of the first sub-membrane 122, it is still possible to better adsorb the substrate to be atomized from the ceramic surface onto the heating film 120 through capillary action, ensuring sufficient oil supply, good atomization effect, and avoiding dry burning during atomization.

[0059] Specifically, the second sub-film 124 is a metal film or an alloy film. Specifically, the second sub-film 124 is selected from one of nickel film, titanium film, nickel-iron alloy film, nickel-copper alloy film, nickel-chromium alloy film, and iron-chromium alloy film.

[0060] It is understood that the materials of the first sub-membrane 122 and the second sub-membrane 124 can be the same or different. In addition, the materials of the first sub-membrane 122 and the second sub-membrane 124 are not limited to metal or alloy, but can also be other materials that can heat and atomize the substrate to be atomized, such as conductive ceramics, as long as the porosity, average pore size and other parameters of the first sub-membrane 122 and the second sub-membrane 124 meet the above requirements.

[0061] Setting a second sub-membrane 124 with low porosity or no porosity can reduce resistance while ensuring sufficient oil supply and good atomization. Experiments show that when the heating film 120 only includes the first sub-membrane 122, the resistance is between 2Ω and 3Ω, making it difficult to match with batteries. When the heating film 120 includes both the first sub-membrane 122 and the second sub-membrane 124, the resistance can be reduced to 0.8Ω to 1.4Ω, which is sufficient for most applications. Furthermore, the second sub-membrane 124 can also reduce splatter. When the heating film 120 only includes the first sub-membrane 122, the splatter level is 70 dB. When the heating film 120 includes both the first sub-membrane 122 and the second sub-membrane 124, the splatter level is significantly reduced.

[0062] In some embodiments, the porosity of the first sub-membrane 122 is 3% to 80%, and the average pore size is 0.1 mm to 5 mm. The porosity of the second sub-membrane 124 is ≤20%, and the average pore size of the second sub-membrane 124 is 0.1 mm to 1 mm. The porosity of the first sub-membrane 122 is greater than the porosity of the second sub-membrane 124.

[0063] The inventors analyzed that, because the first sub-film 122 and the second sub-film 124 have different porosities, they possess different resistance characteristics, achieving a resistance value characteristic that is well-matched to the battery for the heating film 120. Simultaneously, since the porosity of the first sub-film 122 is greater than that of the second sub-film 124, the liquid content in the first sub-film 122 is greater than that in the second sub-film 124. Therefore, during atomization, the outermost second sub-film 124, with less liquid content, can quickly heat and atomize the liquid under the same heating power, avoiding the formation of a thicker liquid film on its surface, thus preventing the phenomenon of liquid explosion caused by the rupture of a thicker liquid film during atomization. Furthermore, because the first sub-film 122 maintains a higher porosity and also has good heating and / or thermal conductivity, it can ensure a continuous and reliable liquid supply, avoiding dry burning caused by insufficient liquid during atomization.

[0064] Specifically, the porous substrate 110 is a porous ceramic substrate. Porous ceramics are chemically stable and will not react chemically with the matrix to be atomized, and they are also heat-resistant and will not deform due to excessive heating temperature. Therefore, in this embodiment, the porous substrate 110 is preferably a porous ceramic substrate. It is understood that the porous substrate 110 is not limited to porous ceramics, but can also be other porous materials, such as porous glass substrates, porous plastic substrates, porous metal substrates, etc.

[0065] In one embodiment, the porous substrate 110 is at least one of porous alumina ceramic, porous silica ceramic, porous silicon carbide ceramic, porous cordierite ceramic, porous mullite ceramic, porous sepiolite ceramic, and porous diatomaceous earth ceramic.

[0066] Furthermore, at least a portion of the pores in the porous substrate 110 are connected to the pores in the first sub-membrane 122. This arrangement facilitates better guidance of the substrate to be atomized to the first sub-membrane 122.

[0067] Specifically, the porosity of the porous matrix 110 is 25% to 75%. In a specific example, the porosity of the porous matrix 110 is 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, or any combination of these values. The porosity of the porous matrix 110 can also be adjusted according to the composition of the atomizing matrix. For example, when the viscosity of the atomizing matrix is ​​high, a higher porosity is selected to ensure the liquid conduction effect.

[0068] The average pore size of the porous substrate 110 is 5 μm to 40 μm. In a specific example, the average pore size of the porous substrate 110 is 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, or any combination of these values.

[0069] The porous matrix 110 with the above-mentioned pore size and porosity has uniform liquid conduction and good atomization effect.

[0070] Please see Figure 3 , Figure 3 for Figure 1 A physical image of the heating element 100 shown. Figure 4 for Figure 3 The diagram shown is a cross-sectional view of the heating element 100 after it has been immersed in the atomization substrate. Figure 5 for Figure 3 The top view of the heating element 100 after it has been immersed in the substrate to be atomized.

[0071] The above figure only shows one schematic diagram of the heating element 100. In the figure, the first sub-membrane 122 and the second sub-membrane 124 in the heating film 120 are both curved. It can be understood that in other embodiments, the shape of the first sub-membrane 122 and the second sub-membrane 124 is not limited to curved shape, but can also be straight, broken, rectangular, grid or ring. The specific shape can be adjusted according to actual needs.

[0072] In some embodiments, the orthographic projection of the second sub-membrane 124 onto the first sub-membrane 122 falls within the first sub-membrane 122. For example, in one specific example, the second sub-membrane 124 has the exact same shape as the first sub-membrane 122, and the second sub-membrane 124 completely covers the first sub-membrane 122.

[0073] In another specific example, the area of ​​the second sub-membrane 124 is smaller than that of the first sub-membrane 122, and the second sub-membrane 124 partially covers the first sub-membrane 122. Specifically, the second sub-membrane 124 can be located in the center or a non-center position of the first sub-membrane 122. When the first sub-membrane 124 is located in the center of the first sub-membrane 122, the liquid supply can be uniform and reliable, avoiding dry burning; at the same time, the resistance is well improved, with uniform and consistent resistance, avoiding localized resistance inconsistencies that could lead to excessive resistance in certain areas during use, and causing breakage or failure under thermal shock. In addition, because the resistivity of the second sub-membrane 124 is relatively low, the current density is higher, and more heat is generated. Being located in the center, it can dissipate heat evenly through the first sub-membrane 122, resulting in a more uniform heat / thermal field distribution and avoiding localized high temperatures that could cause dry burning. Furthermore, the first sub-membrane 122 can also preheat the substrate to be atomized.

[0074] When the second sub-membrane 124 is located in a non-central position of the first sub-membrane 122, it can be flexibly arranged according to the heating circuit, so that the heat generation or heat field distribution in different areas can be adjusted according to specific needs. Therefore, it is not necessary to adjust the position of the first sub-membrane 122, but only to adjust the second sub-membrane 124 to achieve the above effect.

[0075] like Figure 3 and 5 As shown, in this embodiment, the area of ​​the second sub-film 124 is smaller than the area of ​​the first sub-film 122, and the second sub-film 124 partially covers the first sub-film 122. After soaking the substrate to be atomized, the liquid film thickness on the surface of the heating film 120 is less than that at other locations. That is, the substrate to be atomized forms a liquid film with a gradient thickness on the atomization surface of the heating element 100. The liquid film with a gradient thickness can achieve a good atomization effect and reduce splatter.

[0076] In one embodiment, the preparation steps of the heating element 100 are as follows: a first sub-film 122 and a second sub-film 124 are printed on a porous substrate 110 by screen printing, and then vacuum sintering is performed.

[0077] Specifically, a first sub-film 122 is first screen-printed onto the porous substrate 110; a second sub-film 124 is then overprinted onto the first sub-film 122, the linewidth of the second sub-film 124 being less than or equal to the linewidth of the first sub-film 122. In a specific example, the linewidth of the first sub-film 122 is 0.2 mm to 1 mm, and the linewidth of the second sub-film 124 is 0.2 mm to 1 mm. It is understood that the above only lists one linewidth for the first sub-film 122 and the second sub-film 124, but the linewidths of the first sub-film 122 and the second sub-film 124 are not limited to this and can be adjusted according to actual conditions.

[0078] Please see Figure 6In some embodiments, the heating film 120 further includes a third sub-film 126, which is disposed between the first sub-film 122 and the second sub-film 124. The third sub-film 126 has a porous structure, and the porosity of the first sub-film 122 is greater than or equal to the porosity of the third sub-film 126, which is greater than or equal to the porosity of the second sub-film 124.

[0079] For example, in one specific example, the porosity of the third sub-membrane 126 is the same as that of the first sub-membrane 122; in another specific example, the porosity of the third sub-membrane 126 is the same as that of the second sub-membrane 124; in yet another specific example, the porosity of the third sub-membrane 126 is between that of the first sub-membrane 122 and the second sub-membrane 124.

[0080] Further, please refer to Figure 7 There are multiple third sub-membranes 126, which are sequentially stacked between the first sub-membrane 122 and the second sub-membrane 124, gradually moving away from the porous substrate 110. The porosity of the previous third sub-membrane 126 is greater than or equal to the porosity of the next third sub-membrane 126. Specifically... Figure 7 In the middle, the direction gradually moving away from the porous matrix 110 refers to the direction from bottom to top.

[0081] For example, there may be two, three, four, etc., third sub-membranes 126. The porosities of the multiple third sub-membranes 126 may be the same or different, but the porosity of the multiple third sub-membranes 126 decreases or remains unchanged along the direction gradually away from the porous substrate 110. In one specific example, there are two third sub-membranes 126, and the porosities of the two third sub-membranes 126 decrease progressively along the direction gradually away from the porous substrate 110. In another specific example, there are two third sub-membranes 126, and the porosities of the two third sub-membranes 126 are the same, the same as the porosity of the first sub-membranes 122, the same as the porosity of the second sub-membranes 124, or the porosity is between that of the first sub-membranes 122 and the second sub-membranes 124. It can be understood that when there are three, four, or other types of third sub-membranes 126, the porosities of the multiple third sub-membranes 126 can be set as described above.

[0082] Specifically, the third sub-film 126 is a metal film or an alloy film. More specifically, the third sub-film 126 is selected from one of a nickel film, a titanium film, a nickel-iron alloy film, a nickel-copper alloy film, a nickel-chromium alloy film, and an iron-chromium alloy film. In a specific example, the third sub-film 126 is selected from one of a porous nickel film, a porous titanium film, a porous nickel-iron alloy film, a porous nickel-copper alloy film, a porous nickel-chromium alloy film, and a porous iron-chromium-aluminum alloy film.

[0083] In some embodiments, the third sub-membrane 126 is a thick-film pore, and the pore-forming agent used in the preparation of the third sub-membrane 126 is selected from at least one of starch, toner, ammonium bicarbonate, PMMA microspheres (polymethyl methacrylate microspheres), PS microspheres (polystyrene microspheres), limestone, dolomite, calcined stone, perlite, and pumice.

[0084] Similarly, it is understood that the material of the third sub-membrane 126 can be the same as or different from the materials of the first sub-membrane 122 and the second sub-membrane 124. In addition, the material of the third sub-membrane 126 is not limited to metal or alloy, but can also be other materials that can heat and atomize the substrate to be atomized, such as conductive ceramics, as long as the porosity of the third sub-membrane 126 meets the above requirements.

[0085] A third sub-membrane 126 is provided between the first sub-membrane 122 and the second sub-membrane 124. This can increase the thickness of the heating film 120 and guide the substrate to be atomized onto the heating film 120 through capillary force, thus avoiding dry burning and enabling it to withstand high-power batteries.

[0086] When the heating film 120 also includes a third sub-film 126, the orthographic projection of the third sub-film 126 on the first sub-film 122 falls into the first sub-film 122, and the orthographic projection of the second sub-film 124 on the third sub-film 126 falls into the third sub-film 126.

[0087] The specific steps for preparing the heating element 100 are as follows: the first sub-film 122, the third sub-film 126, and the second sub-film 124 are sequentially printed on the porous substrate 110 by screen printing, and then vacuum sintering is performed.

[0088] Specifically, a first sub-film 122 is first screen-printed onto the porous substrate 110; a third sub-film 126 is then overprinted onto the first sub-film 122, with the linewidth of the third sub-film 126 being less than or equal to the linewidth of the first sub-film 122; a second sub-film 124 is then overprinted onto the third sub-film 126, with the linewidth of the second sub-film 124 being less than or equal to the linewidth of the third sub-film 126. In a specific example, the linewidth of the first sub-film 122 is 0.2mm to 1mm. The linewidth of the third sub-film 126 is 0.2mm to 1mm. The linewidth of the second sub-film 124 is 0.2mm to 1mm. It is understood that the above only lists one linewidth for the first sub-film 122, the third sub-film 126, and the second sub-film 124, but the linewidths of the first sub-film 122, the third sub-film 126, and the second sub-film 124 are not limited to this and can be adjusted according to actual conditions.

[0089] When there are multiple third sub-membranes 126, along the direction away from the porous substrate 110, the orthographic projection of the subsequent third sub-membranes 126 onto the preceding third sub-membranes 126 falls within the preceding third sub-membranes 126. The orthographic projection of the second sub-membranes 124 onto the last third sub-membranes 126 falls within the last third sub-membranes 126.

[0090] The heating element 100 of this embodiment has at least the following advantages:

[0091] (1) The heating element 100 includes a porous substrate 110 and a heating film 120. The porous substrate 110 is used to guide the substrate to be atomized, and the heating film 120 is used to heat and atomize the substrate. The heating film 120 includes a first sub-film 122 and a second sub-film 124 stacked together. The first sub-film 122 is located on the surface of the porous substrate 110. The first sub-film 122 can better adsorb the substrate to be atomized from the ceramic surface to the heating film 120 through capillary action, ensuring sufficient oil supply, achieving a low-temperature atomization effect, and avoiding dry burning during atomization. In addition, the inventors found that when the heating film 120 only includes the first sub-film 122, the resistance is high, making it difficult to apply in practice. Therefore, a second sub-film 124 with low porosity or no pores is stacked on the first sub-film 122, which can reduce the resistance while ensuring sufficient oil supply and good atomization effect, making the heating element 100 practically applicable.

[0092] (2) The second sub-membrane 124 in the heating element 100 can also reduce the amount of splatter liquid. Experiments have shown that when the heating membrane 120 only includes the first sub-membrane 122, the splatter liquid level is 70 dB. When the heating membrane 120 includes the first sub-membrane 122 and the second sub-membrane 124, the splatter liquid level is significantly reduced.

[0093] (3) The heating film 120 of the heating element 100 may also include at least one third sub-film 126, which can guide the substrate to be atomized to the heating film 120 through capillary force while increasing the thickness of the heating film 120, so as to avoid dry burning and allow it to withstand high power batteries.

[0094] A second aspect of the present invention also provides an atomizer according to one embodiment. The atomizer includes a reservoir and a heating element. The reservoir stores a substrate to be atomized, and the heating element heats and atomizes the substrate in the reservoir. The heating element is the same as that described in the above embodiment, and will not be repeated here.

[0095] This atomizer can be used to atomize a substrate and generate an aerosol for various applications, such as medical and electronic aerosolization devices. In one embodiment, the atomizer can be used in an electronic aerosolization device to atomize a substrate and generate an aerosol for inhalation; for example, it can be used in electronic cigarettes. It is understood that in other embodiments, the atomizer is not limited to this and can also be applied to medical devices for treating upper and lower respiratory system diseases, such as atomizing medical medications.

[0096] The atomizer described above provides sufficient oil supply during the atomization process, achieving a low-temperature atomization effect and avoiding dry burning during atomization.

[0097] A third aspect of the present invention also provides an electronic atomizing device according to one embodiment. The electronic atomizing device includes a power supply component and an atomizer, the power supply component being used to supply power to the atomizer. The atomizer is the atomizer of the above embodiment, and will not be described again here. In a specific example, the power supply component may include a battery and a controller, the battery being used to supply power to the atomizer, and the controller being used to control the operation of the atomizer.

[0098] In one embodiment, the electronic atomizing device can be an electronic cigarette.

[0099] The aforementioned electronic atomizing device provides sufficient oil supply during the atomization process, achieving a low-temperature atomization effect and avoiding dry burning during atomization.

[0100] To make the objectives and advantages of the present invention clearer, the heating element and its effects of the present invention will be further described in detail below with reference to specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and should not be used to limit the present invention.

[0101] Example 1

[0102] This embodiment provides a heating element comprising a porous substrate and a heating film. The porous substrate is porous cordierite ceramic with an average pore size of 8-15 μm, a porosity of 50%, and a thickness of 4 mm. The heating film comprises a first sub-film and a second sub-film stacked together. The first sub-film is located on the surface of the porous substrate, is made of nickel-iron alloy, has an average pore size of 1 mm, a porosity of 35%, and a thickness of 500 μm. The second sub-film is located on the side of the first sub-film away from the porous substrate, is also made of nickel-iron alloy, has an average pore size of 0.2 mm, a porosity of 22%, and a thickness of 30 μm. In this embodiment, both the first and second sub-films are screen-printed thick films. Furthermore, the porous structure of both the first and second sub-films consists of thick-film pores.

[0103] Example 2

[0104] This embodiment provides a heating element comprising a porous substrate and a heating film. The porous substrate is porous silica ceramic with an average pore size of 20-25 μm, a porosity of 60%, and a thickness of 3 mm. The heating film comprises a first sub-film and a second sub-film stacked together. The first sub-film is located on the surface of the porous substrate, is made of nickel-chromium alloy, has an average pore size of 0.5 mm, a porosity of 20%, and a thickness of 150 μm. The second sub-film is located on the side of the first sub-film away from the porous substrate, is also made of nickel-chromium alloy, has an average pore size of 0.2 mm, a porosity of 10%, and a thickness of 10 μm. In this embodiment, the pores in the first sub-film penetrate the first sub-film along its thickness direction. The first sub-film is made of a dense metal thin material, and the pores on it can be prepared by laser, etching, stamping, or other methods. The porous structure of the second sub-film is a thick-film pore, and the second sub-film is prepared on the surface of the first sub-film by screen printing.

[0105] Example 3

[0106] This embodiment provides a heating element, which has a similar structure to the heating element in Embodiment 1. The difference is that the heating film also includes a third sub-film, which is disposed between the first and second sub-films. The third sub-film is made of iron-chromium-aluminum, has an average pore size of 0.1 mm, a porosity of 2%, and a thickness of 5 μm.

[0107] Example 4

[0108] This embodiment provides a heating element, which has a similar structure to the heating element in Embodiment 1, except that the second sub-membrane has a non-porous structure.

[0109] Example 5

[0110] This embodiment provides a heating element, which has a similar structure to the heating element in Embodiment 1, except that the porosity of the second sub-membrane is 5%.

[0111] Comparative Example 1

[0112] Comparative Example 1 provides a heating element comprising a porous substrate and a heating film. The porous substrate is a porous silica ceramic with an average pore size of 15 μm, a porosity of 60%, and a thickness of 4 mm. The heating film is a non-porous nickel-chromium metal film with a thickness of 500 μm.

[0113] Comparative Example 2

[0114] Comparative Example 2 provides a heating element that has a similar structure to the heating element of Example 1, except that the heating film only includes a first sub-film and does not contain a second sub-film.

[0115] The heating elements of the above embodiments and comparative examples were tested, and the test data are shown in Table 1 below. The dry-burn resistance test refers to the number of dry burns that occur during the machine's vaping process after the ceramic atomizing core is assembled into the cartridge.

[0116] Table 1 Test data for the examples and comparative examples

[0117] Dry burning resistance test Resistance / Ω Explosive liquid decibels / db Example 1 1200-1500 1.4-1.8 60-65 Example 2 1000-1200 1.0-1.4 55-60 Example 3 1000-1200 0.8-1.2 40-45 Example 4 800-1000 0.8-1.2 40-45 Example 5 800-1000 1.0-1.4 50-55 Comparative Example 1 200-300 0.8-1.2 40-45 Comparative Example 2 1200-1500 1.8-2.4 85-95 Comparative Example 3 400-600 1.4-1.8 60-65

[0118] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0119] The above-described embodiments are merely illustrative of several implementation methods of the present invention, facilitating a detailed understanding of the technical solutions of the present invention, but should not be construed as limiting the scope of protection of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the scope of protection of the present invention. It should be understood that technical solutions obtained by those skilled in the art based on the technical solutions provided by the present invention through logical analysis, reasoning, or limited experimentation are all within the scope of protection of the appended claims. Therefore, the scope of protection of this invention patent should be determined by the content of the appended claims, and the specification and drawings can be used to interpret the content of the claims.

Claims

1. A heating element, characterized in that, include: Porous substrate and heating film; The heating film includes a first sub-film and a second sub-film stacked together. The first sub-film is located on the surface of the porous substrate and has a porous structure. The second sub-membrane is disposed on the side of the first sub-membrane away from the porous substrate; The second sub-membrane has a porous structure, and the porosity of the second sub-membrane is less than that of the first sub-membrane; or, the second sub-membrane has a non-porous structure; the thickness of the second sub-membrane is less than that of the first sub-membrane. The first and second sub-membranes are used to heat and atomize the substrate to be atomized. The heating film further includes a third sub-film, which is disposed between the first sub-film and the second sub-film. The third sub-film has a porous structure, and the porosity of the first sub-film is greater than or equal to the porosity of the third sub-film, which is greater than or equal to the porosity of the second sub-film. The porosity of the first sub-film is 10% to 70%. The third sub-film is selected from one of nickel film, titanium film, nickel-iron alloy film, nickel-copper alloy film, nickel-chromium alloy film, and iron-chromium alloy film; There are multiple third sub-membranes, which are sequentially stacked between the first sub-membrane and the second sub-membrane, in a direction that gradually moves away from the porous matrix, wherein the porosity of the previous third sub-membrane is greater than or equal to the porosity of the next third sub-membrane.

2. The heating element according to claim 1, characterized in that, The porosity of the first sub-membrane is 20%~35%; and / or, The average pore size of the first sub-membrane is 0.1 mm to 5 mm; and / or, The thickness of the first sub-membrane is 40 μm to 1000 μm.

3. The heating element according to claim 1, characterized in that, The second submembrane has a porous structure, and the porosity of the second submembrane is ≤20%; and / or, The second submembrane has a porous structure, and the average pore size of the second submembrane is 0.1 mm to 1 mm; and / or, The thickness of the second sub-membrane is 2μm~50μm.

4. The heating element according to any one of claims 1 to 3, characterized in that, The first sub-membrane and the second sub-membrane are each independently a metal membrane or an alloy membrane.

5. The heating element according to claim 4, characterized in that, The first sub-film and the second sub-film are each independently selected from one of the following: nickel film, titanium film, nickel-iron alloy film, nickel-copper alloy film, nickel-chromium alloy film, and iron-chromium alloy film.

6. The heating element according to any one of claims 1 to 3 and 5, characterized in that, The shape of the first submembrane is linear, curved, zigzag, rectangular, grid-like, or annular; and / or, The orthographic projection of the second submembrane onto the first submembrane falls into the first submembrane.

7. The heating element according to any one of claims 1 to 3 and 5, characterized in that, At least a portion of the pores in the porous matrix are connected to the pores of the first sub-membrane; and / or, The porous matrix is ​​a porous ceramic matrix; and / or... The porosity of the porous matrix is ​​25%~75%; and / or, The average pore size of the porous matrix is ​​5μm~40μm.

8. The heating element according to claim 7, characterized in that, The porous matrix is ​​at least one of porous alumina ceramics, porous silica ceramics, porous silicon carbide ceramics, porous cordierite ceramics, porous mullite ceramics, porous sepiolite ceramics, and porous diatomaceous earth ceramics.

9. An atomizer, characterized in that, It includes a reservoir and a heating element as described in any one of claims 1 to 8, wherein the reservoir is used to store a matrix to be atomized, and the heating element is used to heat and atomize the matrix to be atomized in the reservoir.

10. An electronic atomizing device, characterized in that, It includes a power supply assembly and the atomizer of claim 9, wherein the power supply assembly is used to supply power to the atomizer.

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