一种背钻孔缺陷检测方法及装置

By using ultrasonic waves to detect echo signals from both sides of a printed circuit board and combining this with adaptive filtering technology, the accuracy and safety issues of back-drilling inspection are solved, achieving non-destructive and efficient defect detection.

CN114923985BActive Publication Date: 2026-07-17SUZHOU VEGA TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SUZHOU VEGA TECH CO LTD
Filing Date
2022-04-22
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing technologies for back borehole inspection suffer from problems such as incomplete coverage by destructive measurements, time-consuming complex algorithms, and radiation risks, resulting in low detection accuracy and health hazards.

Method used

Ultrasonic waves are used to detect the back drill hole and the surrounding area from opposite sides of the test plate. The echo signals are obtained. Combined with the number of target copper layers, the copper layer depth is accurately located by adaptive filtering technology. The depth of the back drill hole and the copper layer depth are compared to determine the defects.

Benefits of technology

It enables non-destructive testing, improves testing accuracy, reduces costs, avoids radiation damage to testing personnel, and simplifies the operation process.

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Abstract

本发明公开了一种背钻孔缺陷检测方法及装置,该方法包括:将设置有背钻孔的待测板材置于介质中;通过超声波对待测板材设置有背钻孔的一面进行探测,获取背钻孔的第一回波信号,并根据第一回波信号获取背钻孔的深度;获取背钻孔外围区域的第二回波信号;对待测板材背离背钻孔的一面进行探测,获取背钻孔外围区域的第三回波信号;根据第二回波信号、第三回波信号以及目标铜层沿背钻方向的层数,获取目标铜层的深度;背钻方向为设置有背钻孔的一面指向背离背钻孔的一面的方向;将背钻孔的深度与目标铜层的深度进行比较;若背钻孔的深度大于目标铜层的深度,则判定背钻孔存在缺陷。本发明提供的技术方案,可提高背钻孔缺陷检测的精度。
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