Wafer cassette transfer assembly

Abstract

A wafer cassette transfer assembly includes a wafer cassette port for receiving a wafer cassette, a transfer shaft coupled to the wafer cassette port, a shaft receiver, a shaft coupled to both the transfer shaft and the shaft receiver, a strap coupled to both the transfer shaft and the shaft, a pin passing through the shaft receiver and the shaft, and a pin buckle including a first ring and a second ring, wherein the pin includes a first end and a second end opposite to the first end. The pin buckle is coupled to the pin, the first ring surrounds the first end of the pin, and the second ring surrounds the second end of the pin.

Description

Technical Field

[0001] Embodiments of the present invention relate to a semiconductor device, and more specifically, to a wafer cassette transfer assembly. Background Technology

[0002] During semiconductor device manufacturing, semiconductor wafers undergo one or more semiconductor device manufacturing steps, each of which is performed at a dedicated wafer workstation within a wafer processing device. A wafer pod transports semiconductor wafers from outside the wafer processing device to inside and from inside the wafer processing device to outside. Each wafer pod can transport several wafers. Wafer pods are designed with a specific internal environment, such as being relatively contamination-free, thus limiting the wafers' exposure to contaminants, particles, debris, etc. Summary of the Invention

[0003] According to some embodiments, a wafer cassette transfer assembly includes a wafer cassette port for receiving a wafer cassette, a transfer shaft coupled to the wafer cassette port, a shaft receiver, a shaft coupled to both the transfer shaft and the shaft receiver, a pin passing through the shaft receiver and the shaft, and a pin buckle including a first ring and a second ring, wherein the pin includes a first end and a second end opposite to the first end. The pin buckle is coupled to the pin, the first ring surrounds the first end of the pin, and the second ring surrounds the second end of the pin.

[0004] According to some embodiments, a wafer cassette transfer assembly includes a wafer cassette port for receiving a wafer cassette, a shaft coupled to the wafer cassette port, a shaft receiver coupled to the shaft, a pin passing through the shaft receiver and through the shaft, and a pin buckle coupled to the pin, wherein the pin buckle includes a first ring surrounding a first end of the pin, a second ring surrounding a second end of the pin different from the first end of the pin, and a C-shaped portion between the first ring and the second ring, wherein the C-shaped portion partially surrounds the shaft receiver.

[0005] According to some embodiments, a wafer cassette transfer assembly includes a shaft receiver having a first inner surface defining a shaft receiving region and a second inner surface defining a pin receiving region. The wafer cassette transfer assembly includes a shaft disposed within the shaft receiving region and a pin including a first pin region, a first end, and a second end extending across the pin receiving region. The wafer cassette transfer assembly includes a pin catch including a first ring surrounding the first end of the pin, a second ring surrounding the second end of the pin, and a C-shaped portion between the first and second rings. The wafer cassette transfer assembly includes a drive assembly coupled to the shaft and a tilting assembly coupled to the drive assembly. Attached Figure Description

[0006] The various aspects of this disclosure are best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, in accordance with industry standard practice, the features are not drawn to scale. In fact, the dimensions of the features may be arbitrarily increased or decreased for clarity of explanation.

[0007] Figure 1A This is an illustration of a wafer cassette transfer assembly according to some embodiments.

[0008] Figure 1B According to some embodiments Figure 1A A diagram of the pin locking mechanism of the wafer cassette transfer assembly.

[0009] Figure 2 This is an illustration of a pin locking mechanism according to some embodiments.

[0010] Figure 3 This is a perspective view of a latch according to some embodiments.

[0011] Figure 4 This is an illustration of a wafer cassette transfer assembly according to some embodiments.

[0012] Figure 5 This is an illustration of a tilting assembly according to some embodiments.

[0013] Figure 6 This is an illustration of a tilting assembly according to some embodiments.

[0014] Figure 7 This is an illustration of a wafer processing device according to some embodiments.

[0015] Figure 8 This is a perspective view of a wafer cassette according to some embodiments.

[0016] Figure 9 This is a schematic top view of a wafer processing station according to some embodiments.

[0017] Figure 10 Examples of computer-readable media according to some embodiments are shown, which may include processor-executable instructions configured to embody one or more of the specifications set forth herein.

[0018] Figure 11 Example computing environments are shown according to some embodiments, wherein one or more of the provisions set forth herein may be implemented.

[0019] Explanation of icon numbers

[0020] 100: Wafer cartridge transfer assembly;

[0021] 102: Rotating assembly;

[0022] 104: Drive assembly;

[0023] 106: Inclined assembly;

[0024] 108: Electric motor;

[0025] 110: First gear;

[0026] 112: Motor shaft;

[0027] 114: First gear tooth;

[0028] 116: Second gear;

[0029] 118: Second gear tooth;

[0030] 120: Shaft receiver;

[0031] 122: First internal surface;

[0032] 124: Shaft receiving area;

[0033] 126: Shaft;

[0034] 128: Shaft coupler;

[0035] 130: Second internal surface;

[0036] 132, 136: Pin receiving area;

[0037] 134: Internal surface;

[0038] 138: Pin;

[0039] 140: First pin area;

[0040] 142: Second latch area;

[0041] 144: Bolt latch;

[0042] 145: Pin screw;

[0043] 146, 158: Pin locking mechanism;

[0044] 147: Side surface;

[0045] 148: First end;

[0046] 150: Second end;

[0047] 152: First ring;

[0048] 154: Second Ring;

[0049] 156: C-shaped portion;

[0050] 159: Straps;

[0051] 160: Inclined assembly coupler;

[0052] 162: Transfer axis;

[0053] 164: Chip box port;

[0054] 166: Wafer cartridge carrier arm;

[0055] 168: Chip box;

[0056] 170: Chip cassette;

[0057] 172: Recessed surface;

[0058] 174: Wafer box carrier arm receiving container;

[0059] 176: Back surface;

[0060] 178, 702: Outer casing;

[0061] 180: Surface;

[0062] 182: Horizontal groove;

[0063] 184, 910: Chips;

[0064] 186, 188: Bottom surface;

[0065] 190: The first chip;

[0066] 192: Second chip;

[0067] 194: Load port;

[0068] 196, 920: Interface modules;

[0069] 198: Load the interlocked vacuum chamber;

[0070] 200: Controller;

[0071] 700: Chip processing device;

[0072] 704: Wafer cartridge transfer assembly chamber;

[0073] 900: Chip processing station;

[0074] 902: Central transfer chamber;

[0075] 904: Loading the interlocked vacuum chamber;

[0076] 906: Cooling platform;

[0077] 912: Platform;

[0078] 914: Processing module;

[0079] 916: Interface robot;

[0080] 918: Equipment front-end module;

[0081] 1000: Example;

[0082] 1002: Computer-readable media;

[0083] 1004: Computer-readable data;

[0084] 1006: The processor can execute computer instructions;

[0085] 1008: Method;

[0086] 1100: System;

[0087] 1102, 1118, 1122: Computing devices;

[0088] 1104: Processing unit;

[0089] 1106: Memory;

[0090] 1108: Dashed line;

[0091] 1110: Storage device;

[0092] 1112: Communication interface;

[0093] 1114: Input device;

[0094] 1116: Output device;

[0095] 1120: Network;

[0096] D: Diameter;

[0097] H: Height;

[0098] L: Length;

[0099] P: Spacing;

[0100] R: Rotation. Detailed Implementation

[0101] The following disclosure provides several different embodiments or examples for implementing various features of the provided subject matter. Specific examples of components and arrangements are described below to simplify this disclosure. Of course, these components and arrangements are merely examples and are not intended to be limiting. For example, in the following description, the formation of a first feature over or on a second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where additional features are formed between the first and second features such that the first and second features are not in direct contact. Additionally, reference numerals or letters may be repeated in various instances of this disclosure. Such repetition is for simplicity and clarity and does not, in itself, presuppose a relationship between the various embodiments or configurations discussed.

[0102] Furthermore, for ease of description, spatially related terms such as “below,” “under,” “lower,” “above,” and “upper” may be used herein to describe the relationship between one element or feature and another element(s) as shown in the figures. In addition to the orientations shown in the figures, spatially related terms are intended to cover different orientations of the device in use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein shall be interpreted accordingly. Additionally, relational terms such as “connected to,” “adjacent to,” “coupled to,” and similar terms may be used herein to describe direct and indirect relationships. “Direct” connection, proximity, or coupling may refer to a relationship in which no intervening component, device, or structure exists. “Indirect” connection, proximity, or coupling may refer to a relationship in which an intervening component, device, or structure exists.

[0103] To process semiconductor wafers, wafers are transported from outside the wafer processing device to inside for wafer processing. Processed wafers are then transported from inside the wafer processing device to outside. Within the wafer processing device, wafers can be transported from one wafer workstation to another. Wafers can also be transported from one wafer workstation within one wafer processing device to another wafer processing station within another wafer processing device. Within the wafer processing device, wafers undergo processes such as photolithography, chemical mechanical polishing (CMP), annealing, cooling, or other suitable wafer processing processes. Wafer processing can be performed at one or more wafer workstations within a wafer processing device. For example, a wafer can be processed at a photolithography workstation within a wafer photolithography processing device and at a CMP workstation within a wafer CMP processing device.

[0104] Unprocessed and processed wafers are loaded into protective wafer cassettes for transport to and from wafer processing devices. The protective wafer cassettes, enclosing the unprocessed and / or processed wafers, are transported to and from the wafer processing devices via a wafer cassette transfer assembly. A wafer cassette comprises one or more wafer cassettes, each containing a wafer. If a wafer becomes misaligned within a wafer cassette, the cost of damage, failure, etc., can be substantial. To address this problem, a tilting assembly of the wafer cassette transfer assembly tilts the wafer cassette upwards and backwards. When tilted in this manner, the wafers inside the wafer cassette are subjected to gravity against the rear surface of the wafer cassette, thereby positioning them to prevent misposition or dislodgement that may be caused by vibrations of the wafer cassette transfer assembly.

[0105] To further prevent wafer damage, malfunction, misalignment, etc., in wafer cassettes, thereby increasing the yield of the resulting semiconductor devices, reducing their cost, improving their reliability and performance, a wafer cassette transfer assembly is provided, wherein vibration of the wafer cassette transfer assembly is reduced or eliminated by maintaining stable and safe positioning and movement of its components and mechanisms. According to some embodiments, the wafer cassette transfer assembly includes a tilting assembly with several moving components to tilt the wafer cassette upwards and backwards. The wafer cassette transfer assembly may be located within and / or used in association with a wafer processing device (such as a photolithography device, a wafer CMP processing device, etc.). According to some embodiments, the wafer cassette transfer assembly includes a wafer cassette port for receiving a wafer cassette. The wafer cassette port is coupled to a tilting assembly coupler. The wafer cassette port and the received wafer cassette may tilt about a tilting axis of the tilting assembly coupler. A strap is coupled to the tilting assembly coupler and to a shaft. The tilting assembly coupler rotates partially and the received wafer cassette tilts as the shaft rotates partially. The shaft is coupled to a gear. The gear is coupled to a motor and to a shaft receiver. A pin secures the shaft in the shaft receiver, allowing the shaft to rotate as the shaft receiver rotates. A pin screw secures the pin within the shaft receiver to prevent displacement of the pin within the shaft receiver and / or the shaft. Furthermore, a pin catch secures the pin within the shaft receiver to prevent displacement of the pin within the shaft receiver and / or the shaft. If the pin screw becomes loose or falls out, the pin catch holds the pin within the shaft receiver and the shaft.

[0106] Holding the pin within the spindle receiver and spindle reduces spindle tilt relative to the spindle receiver. Reducing spindle tilt relative to the spindle receiver prevents tilting of the tilting mechanism. Preventing tilting of the tilting mechanism reduces wafer misalignment within the wafer cassette. Reducing wafer misalignment within the wafer cassette helps reduce wafer damage and wafer processing station downtime. For example, when wafers are loaded into the wafer workstation, reducing wafer misalignment within the wafer cassette reduces wafer misalignment.

[0107] Figure 1A This is an illustration of a wafer cassette transfer assembly 100 according to some embodiments. The wafer cassette transfer assembly 100 includes a rotating assembly 102, a driving assembly 104, and a tilting assembly 106. The rotating assembly 102 is mechanically or electromagnetically coupled to the driving assembly 104. The driving assembly 104 is mechanically or electromagnetically coupled to the tilting assembly 106. Other configurations of the wafer cassette transfer assembly 100 are within the scope of this disclosure.

[0108] According to some embodiments, the rotating assembly 102 includes a motor 108 coupled to a first gear 110. A motor shaft 112 couples the motor 108 to the first gear 110. The first gear 110 includes first gear teeth 114. The rotating assembly 102 includes a second gear 116, which includes second gear teeth 118. The second gear teeth 118 mesh with the first gear teeth 114 of the first gear 110. The second gear 116 is coupled to a shaft receiver 120 such that when the first gear 110 rotates the second gear 116, the second gear 116 rotates the shaft receiver 120. According to some embodiments, the second gear 116 includes the shaft receiver 120. Other configurations for rotating the shaft receiver 120 are within the scope of this disclosure.

[0109] The shaft receiver 120 includes a first inner surface 122 defining a shaft receiving region 124 within the shaft receiver 120. A shaft 126 is disposed within the shaft receiving region 124 of the shaft receiver 120. The shaft 126 is coupled to a shaft coupler 128 such that when the shaft receiver 120 rotates (R) the shaft 126, the shaft coupler 128 rotates with the shaft 126. The rotational torque of the first gear 110 is transferred to the tilting assembly 106 by means of a second gear 116, the shaft receiver 120, the shaft 126, the shaft coupler 128, and the drive assembly 104. Further configurations of the rotating assembly 102 for transferring the rotational torque from the first gear 110 to the tilting assembly 106 are within the scope of this disclosure.

[0110] According to some embodiments, the shaft receiver 120 includes a second inner surface 130 defining a pin receiving region 132 of the shaft receiver 120, and the shaft 126 includes an inner surface 134 defining a pin receiving region 136 of the shaft 126. A pin 138 includes a first pin region 140 traversing the pin receiving region 132 of the shaft receiver 120 and the pin receiving region 136 of the shaft 126. The pin 138 also includes a second pin region 142 disposed outside the shaft receiver 120. Other configurations of the shaft receiver 120 and the pin 138 are within the scope of this disclosure.

[0111] According to some embodiments, the rotating assembly 102 includes a pin screw 145 passing through a shaft receiver 120 and through a shaft 126. The pin screw 145 abuts against a side surface 147 of a pin 138 to forcefully secure the pin 138 to an inner surface 134 of the shaft 126. According to some embodiments, the pin screw 145 is oriented perpendicular to the orientation of the pin 138. In some embodiments, the pin catch 144 is oriented parallel to the orientation of the pin 138. Other configurations for securing the pin 138 to the inner surface 134 of the shaft 126 are within the scope of this disclosure.

[0112] like Figure 1B As shown, according to some embodiments, the pin 138 and the pin catch 144 include a pin locking mechanism 146. The pin 138 includes a first end 148 and a second end 150 opposite to the first end 148. The pin catch 144 includes a first ring 152 surrounding the first end 148 of the pin 138 and a second ring 154 surrounding the second end 150 of the pin 138. According to some embodiments, the pin catch 144 is a C-shaped pin catch including a C-shaped portion 156 between the first ring 152 and the second ring 154. The C-shaped portion 156 may partially surround the shaft receiver 120 (e.g., Figure 1A (As shown in the illustration). Other configurations and shapes of the latch 144 are within the scope of this disclosure.

[0113] Figure 2 This is an illustration of a pin locking mechanism 158 according to some embodiments. The pin locking mechanism 158 includes... Figure 1BThe pin locking mechanism 146 is an assembly. According to some embodiments, the diameter D of the C-shaped portion 156 of the pin locking mechanism 158 is smaller than the length L of the pin 138. In some embodiments, the measured value of the diameter D of the C-shaped portion 156 is 2 / 3 of the measured value of the length L of the pin 138. This 2 / 3 relative dimension between the diameter D of the C-shaped portion 156 of the pin locking mechanism 158 and the length L of the pin 138 is sufficient to allow the length L of the C-shaped pin to temporarily extend for positioning the first ring 152 and the second ring 154 over the first end 148 and the second end 150 of the pin 138 without permanently altering the diameter D of the C-shaped portion 156. Other relative dimensions between the diameter D of the C-shaped portion 156 of the pin locking mechanism 158 and the length L of the pin 138 are within the scope of this disclosure.

[0114] Figure 3 This is a perspective view of a latch 144 according to some embodiments. The latch 144 includes a C-shaped portion 156, a first ring 152, and a second ring 154.

[0115] Figure 4 This is an illustration of a wafer cassette transfer assembly 100 according to some embodiments. The wafer cassette transfer assembly 100 includes a motor 108, a first gear 110, a second gear 116, a shaft receiver 120, a shaft 126, a pin 138, a pin catch 144, a pin screw 145, a shaft coupler 128, a drive assembly 104, and a tilting assembly 106. According to some embodiments, the drive assembly 104 includes a tilting assembly coupler 160 coupled to the shaft coupler 128. A strap 159 couples the tilting assembly coupler 160 to the shaft coupler 128 such that when the shaft 126 rotates the shaft coupler 128, the shaft coupler 128 causes the strap 159 to rotate, and the rotating strap 159 causes the tilting assembly coupler 160 to rotate.

[0116] The tilting assembly 106 includes a wafer cassette port 164, which includes a wafer cassette carrier arm 166. The wafer cassette carrier arm 166 is configured to rotate to engage with a wafer cassette 168. The wafer cassette 168 may include a recessed surface 172 defining a wafer cassette carrier arm receiving container 174 for tilting and / or moving the wafer cassette 168, and releasing the wafer cassette 168 at a predetermined location inside or outside a wafer processing device (not shown). The wafer cassette 168 includes a wafer cassette 170 for receiving wafers (not shown). According to some embodiments, a transfer shaft 162 is coupled to the wafer cassette port 164 and to the tilting assembly coupler 160.

[0117] like Figure 4As indicated, pin 138 prevents shaft 126 from tilting in the direction of the dashed arrow (downward to the right). Preventing shaft 126 from tilting in the direction of the dashed arrow reduces the degree of tilting of wafer cassette 168 and wafer holder 170 in the direction of the dashed arrow, making it less likely that the wafer will be misaligned within wafer holder 170.

[0118] Figure 5 This is an illustration of a tilted assembly 106 in a non-tilted orientation according to some embodiments. When the tilted assembly 106 is tilted upward and backward, as... Figure 6 As shown, the wafer within the wafer cassette 170 rests against the rear surface 176 of the wafer cassette 170. The wafer cassette 168 tilts upward and backward relative to rotation of the shaft 126, rotation of the tilting assembly coupler 160, and rotation of the wafer cassette port 164. According to some embodiments, a standard mechanical interface load port transfer (SMIF-LPT) includes the wafer cassette port 164 and is configured to transfer the wafer cassette port 164 to a tool load lock.

[0119] Figure 7 This is an illustration of a wafer processing device 700 according to some embodiments. The wafer processing device 700 includes a housing 702 defining a wafer cassette transfer assembly chamber 704. The wafer cassette transfer assembly chamber 704 houses a wafer cassette transfer assembly 100, which includes a rotary assembly 102, a shaft coupler 128, a strap 159, a tilting assembly coupler 160, a transfer shaft 162, a wafer cassette port 164, and a wafer cassette carrier arm 166. The wafer processing device 700 includes a loading port 194 adapted to receive and carry a plurality of wafers (not shown). An interface module 196 communicates between the loading port 194 and a loading interlock vacuum chamber 198 to transfer wafers between the loading port 194 and the loading interlock vacuum chamber 198.

[0120] The controller 200 is connected to the rotating assembly 102 to control the motor 108 to rotate the shaft 126, thereby tilting the wafer cassette port 164 so that the wafer is subjected to gravity and pressed against the rear surface of the wafer cassette 170. The wafer is thus positioned to prevent misalignment or displacement that may be caused by vibrations of the wafer cassette transfer assembly 100.

[0121] The controller 200 communicates with the wafer cassette port 164 to control the movement of the wafer cassette carrier arm 166 to engage with the wafer cassette 168. For example, the controller 200 may communicate with the wafer cassette port 164 to rotate the wafer cassette carrier arm 166 to engage with a recessed surface 172 of the wafer cassette 168, the recessed surface 172 defining a wafer cassette carrier arm receiving container 174 of the wafer cassette 168.

[0122] Figure 8 This is a perspective view of a wafer cassette 170 according to some embodiments. The wafer cassette 170 may include a housing 178. The housing 178 may include an open, forward-facing surface 180 defining a plurality of parallel, spaced-apart horizontal slots 182. The horizontal slots 182 are configured to receive and hold a plurality of wafers 184 and allow wafers 184 to be loaded into and unloaded from the wafer cassette 170. The loading and unloading of wafers 184 may be performed using a precision robot (not shown in the figure).

[0123] Loading and unloading wafers 184 into and from wafer cassette 170 can be performed automatically. Typically, a fully loaded wafer cassette 170, holding multiple wafers, is placed in the unloading compartment of a chemical mechanical polishing (CMP) machine, cleaning machine, or other wafer processing device or station. According to some embodiments, an unloading robotic arm sequentially removes wafers 184 from wafer cassette 170 one at a time and delivers each of the wafers 184 to a wafer processing station. The wafers 184 can then be moved through several wafer processing stations within the wafer processing device. When wafer processing is complete, a loading robotic arm removes the wafers 184 from the final wafer processing station and delivers and loads them into slots in empty wafer cassettes within the loading compartment of the wafer processing device 700 (not shown). In some embodiments, after the wafer cassette has been loaded with processed wafers, it can be gripped by a handle (not shown) and delivered to a subsequent wafer processing device. For economic and interchangeability purposes, the same or similar wafer cassette housings can be used as both unloading and loading wafer cassettes, and can be configured for use with a wide variety of wafer processing devices.

[0124] The wafer cassette 170 has a height H. According to some embodiments, wafers 184 may be loaded into the wafer cassette 170 to define a spacing P between each of the wafers 184. The spacing P may be measured, for example, from the bottom surface 186 of a first wafer 190 to the bottom surface 188 of a second wafer 192 adjacent to the first wafer 190. The spacing P between two wafers 184 may be defined as the height H of the wafer cassette 170 divided by the number of wafers 184 in the wafer cassette 170. In some embodiments, the number of horizontal slots 182 may be greater than the number of wafers 184 in the wafer cassette 170. For example, such as... Figure 8As shown, the number of wafers 184 is four, and the number of horizontal slots 182 is 24. In some embodiments, the number of horizontal slots 182 and the number of wafers are the same. In some embodiments, the number of wafers 184 is predetermined to achieve a desired pitch P. As the number of wafers 184 decreases, the value of pitch P increases. As the number of wafers 184 increases, the value of pitch P decreases. According to some embodiments, a larger pitch P corresponds to a larger wafer cooling rate for the processed wafers. As an example, a larger wafer cooling rate can improve the efficiency and speed of the wafer annealing process. Other configurations of the wafer cassette 170 are within the scope of this disclosure.

[0125] Figure 9 This is a schematic top view of a wafer processing station 900 according to some embodiments. The wafer processing station 900 may include a wafer cassette transfer assembly 100, a central transfer chamber 902, a loading interlock vacuum chamber 904, and a cooling stage 906. The wafer processing station 900 includes a plurality of loading ports 194. One or more loading ports 194 may accommodate one or more wafer cassettes 168. One or more wafer cassettes 168 may accommodate one or more wafer holders 170 containing one or more wafers 184. One or more wafer cassettes 168 may be loaded into one or more loading ports 194 via a tilting assembly 106 of the wafer cassette transfer assembly 100. As described above and further discussed below, the tilting assembly facilitates wafer handling, loading, etc., in a contemplated manner to mitigate wafer misalignment, thereby increasing yield, reducing waste, preventing defects, and facilitating the desired device formation, etc.

[0126] A loading interlock vacuum chamber 904 may be positioned adjacent to a central transfer chamber 902. The loading interlock vacuum chamber 904 may be adapted to accommodate a plurality of wafers 184. In some embodiments, a cooling stage 906 is positioned adjacent to both the loading interlock vacuum chamber 904 and the central transfer chamber 902. The central transfer chamber 902 may be configured to communicate with both the cooling stage 906 and the loading interlock vacuum chamber 904 for transferring wafers 184 between the cooling stage 906 and the loading interlock vacuum chamber 904.

[0127] In some embodiments, the wafer processing station 900 includes a platform 912 disposed adjacent to a central transfer chamber 902. The platform 912 includes a plurality of processing modules 914. The central transfer chamber 902 communicates between the platform 912 and a load-interlocked vacuum chamber 904 to transfer wafers 910 between the platform 912 and the load-interlocked vacuum chamber 904. Specifically, the central transfer chamber 902 may be surrounded by load-interlocked vacuum chambers 904 (two are shown), cooling stages 906 (two are shown), and the platform 912 having processing modules 914 (two are shown). The number of load-interlocked vacuum chambers 904, the number of cooling stages 906, and / or the number of processing modules 914 shown are merely exemplary. In some embodiments, the number of load-interlocked vacuum chambers 904, the number of cooling stages 906, and the number of processing modules 914 may be adjustable to accommodate wafer processing requirements.

[0128] In some embodiments, the central transfer chamber 902 is connected between the processing module 914, the loading interlocked vacuum chamber 904, and the cooling stage 906 via an interface robot 916 configured to move throughout the central transfer chamber 902. The interface robot 916 can carry a wafer 910 and place the wafer 910 in one of the processing module 914, the loading interlocked vacuum chamber 904, and / or the cooling stage 906. Figure 9 In this illustration, each of the processing module 914, the loading interlock vacuum chamber 904, and the cooling stage 906 is depicted as carrying a wafer for descriptive purposes only and is merely exemplary. During operation of the wafer processing station 900, each of the processing module 914, the loading interlock vacuum chamber 904, and / or the cooling stage 906 may not carry a wafer.

[0129] In some embodiments, the wafer processing station 900 includes an equipment front end module (EFEM) 918. The EFEM 918 includes an interface module 920 and a plurality of loading ports 194 (three are shown as an example). The interface module 920 of the EFEM 918 communicates between the loading ports 194 and a loading interlock vacuum chamber 904 to transfer wafers between the loading ports 194 and the loading interlock vacuum chamber 904. Figure 9 The shapes of the components of the wafer processing station 900 shown are merely exemplary and are only examples for illustrative purposes.

[0130] In some embodiments, interface module 920 transfers a wafer (the wafer to be processed) from loading port 194 to a corresponding loading interlock vacuum chamber 904. Thus, the central transfer chamber 902 and interface robot 916 can transport the wafer to be processed from loading interlock vacuum chamber 904 to processing module 914. In some embodiments, while processing a wafer, interface robot 916 can transport another wafer from loading interlock vacuum chamber 904 to another processing module 914. After processing a wafer in interface robot 916, interface robot 916 can remove the processed wafer and transport it to cooling stage 906 for cooling. After cooling the processed wafer to a specific temperature, interface robot 916 can move the processed wafer from cooling stage 906 to loading interlock vacuum chamber 904. This process can continue when the processed wafer has been pre-determined to a temperature sufficient for movement into loading interlock vacuum chamber 904, and when interface robot 916 moves the wafer from loading interlock vacuum chamber 904 to processing module 914 for processing and from processing module 914 to cooling stage 906. After cooling the processed wafer at the cooling stage 906, the interface robot 916 can move the processed wafer from the cooling stage 906 to the loading interlock vacuum chamber 904. When the loading interlock vacuum chamber 904 is full of processed wafers, the interface module 920 can transfer the processed wafer to the loading port 194 to leave the wafer processing station 900.

[0131] In some embodiments, the cooling stage 906 is cooled to a predetermined temperature before receiving the processed wafer. The cooling stage 906 is cooled by allowing coolant to flow through it. In some embodiments, the cooling stage 906 may have a coolant fluid below it to reduce the temperature of the cooling stage 906. Cooling of the processed wafer can then begin immediately by placing it into the cooling stage 906. The coolant may flow continuously below the cooling stage 906. According to some embodiments, the frequency and amount of coolant flowing around or below the cooling stage 906 may be adjustable.

[0132] In some embodiments, because the wafer processing station 900 includes a cooling stage 906, faster cooling of the cooling stage 906 during wafer processing (e.g., annealing to reduce hillock) provides a faster annealing process. A faster annealing process can improve the efficiency of scaling up the metal grain size (e.g., copper grain size) of the processed wafer. The cooling effect provided by the cooling stage 906 can improve the efficiency and speed of the annealing process used to reduce hillock.

[0133] As disclosed, the wafer cassette transfer assembly 100 includes a tilting assembly 106 for loading wafers as needed into a wafer processing station 900. The wafer cassette transfer assembly 100 includes a pin 138 traversing a pin receiving area 132 of a spindle receiver 120 and a pin receiving area 136 of a spindle 126. The pin 138 includes a second pin area 142 disposed outside the spindle receiver 120. The pin 138 includes a first end 148 and a second end 150 opposite the first end 148. A pin catch 144 includes a first ring 152 surrounding the first end 148 of the pin 138 and a second ring 154 surrounding the second end 150 of the pin 138. The pin catch 144 may be a C-shaped pin catch including a C-shaped portion 156 between the first ring 152 and the second ring 154. The C-shaped portion 156 may partially surround the spindle receiver 120. The latch 144 secures the pin 138 within the shaft receiver 120 to prevent the pin 138 from shifting within the shaft receiver 120 and / or the shaft 126. If the pin screw 145 becomes loose or falls off, the latch 144 maintains the pin 138 within the shaft receiver 120 and the shaft 126.

[0134] The pin 138 is held within the shaft receiver 120, and the shaft 126 reduces tilting relative to the shaft receiver 120. Reducing the tilt of the shaft 126 relative to the shaft receiver 120 prevents tilting of the tilt assembly 106. Preventing tilting of the tilt assembly 106 reduces wafer misalignment within the wafer cassette 170. Reducing wafer misalignment within the wafer cassette 170 helps reduce wafer damage and wafer processing station 900 downtime. For example, reducing wafer misalignment within the wafer cassette reduces wafer misalignment when wafers are loaded into the wafer processing station 900.

[0135] Another embodiment relates to a computer-readable medium comprising processor-executable instructions configured to implement one or more of the techniques presented herein. Figure 10 Exemplary computer-readable media are illustrated herein, wherein embodiment 1000 includes computer-readable media 1002 (e.g., CD-R, DVD-R, flash drive, hard disk platter, etc.) on which encoded computer-readable data 1004 is present. This computer-readable data 1004 further includes a set of processor-executable computer instructions 1006 configured to operate according to one or more of the principles set forth herein. In some embodiments of 1000, the processor-executable computer instructions 1006 are configured to perform a method 1008, as at least some of the methods described above. In some embodiments, the processor-executable computer instructions 1006 are configured to implement a system, as at least some of the systems described above. Many such computer-readable media can be designed by those skilled in the art and configured to operate according to the techniques presented herein.

[0136] Figure 11 The following discussion provides a brief, general description of a suitable computing environment for implementing one or more embodiments of the specifications set forth herein. Figure 11 The operating environment described herein is merely one example of a suitable operating environment and is not intended to imply any limitation on the scope of use or functionality of the operating environment. Instance computing devices include, but are not limited to, personal computers, server computers, handheld or laptop computers, mobile devices (e.g., mobile phones, personal digital assistants (PDAs), media players, etc.), multiprocessor systems, consumer electronics devices, microcomputers, mainframe computers, and distributed computing environments containing any of the aforementioned systems or devices.

[0137] While not strictly required, embodiments are described in the general context of “computer-readable instructions” executed by one or more computing devices. Computer-readable instructions may be distributed via computer-readable media (discussed below). Computer-readable instructions may be implemented as program modules, such as functions, objects, application programming interfaces (APIs), data structures, etc., which perform a specific task or implement a specific abstract data type. Typically, the functionality of computer-readable instructions can be combined or distributed across multiple environments as needed.

[0138] Figure 11 Examples of systems 1100 including computing devices 1102 for implementing some of the embodiments provided herein are depicted. In some configurations, computing device 1102 includes at least one processing unit 1104 and memory 1106. Depending on the exact configuration and type of computing device, memory 1106 may be volatile (e.g., RAM), non-volatile (e.g., ROM, flash memory, etc.), or some combination of both. This configuration in Figure 11 The middle is represented by the dashed line 1108.

[0139] In some embodiments, the computing device 1102 may include additional features and / or functionality. For example, the computing device 1102 may also include additional storage devices (e.g., removable and / or non-removable), including, but not limited to, magnetic storage devices, optical storage devices, etc. Such additional storage devices... Figure 11 The image is shown in storage device 1110. In some embodiments, computer-readable instructions implementing one or more embodiments provided herein may be stored in storage device 1110. Storage device 1110 may also store other computer-readable instructions for implementing operating systems, applications, etc. Computer-readable instructions may be loaded into memory 1106 for execution by, for example, processing unit 1104.

[0140] As used herein, the term "computer-readable media" includes computer storage media. Computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technique for storing information such as computer-readable instructions or other data. Memory 1106 and storage device 1110 are examples of computer storage media. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, Digital Versatile Disks (DVDs) or other optical storage devices, magnetic tape, magnetic tape, disk storage devices or other magnetic storage devices, or any other media that can be used to store desired information and is accessible by computing device 1102. Any such computer storage media may be part of computing device 1102.

[0141] In some embodiments, computing device 1102 includes a communication interface 1112 or multiple communication interfaces that allow computing device 1102 to communicate with other devices. Communication interface 1112 may include, but is not limited to, a modem, a network interface card (NIC), an integrated network interface, a radio frequency transmitter / receiver, an infrared port, a Universal Serial Bus (USB) connection, or other interfaces for connecting computing device 1102 to other computing devices. Communication interface 1112 may implement wired or wireless connections. Communication interface 1112 may transmit and / or receive communication media.

[0142] The term "computer-readable media" may include communication media. Communication media typically carries computer-readable instructions or other data in a carrier wave or other transmission mechanism and includes any information transfer medium. The term "modulated data signal" may include a signal having one or more of its characteristic groups or a signal modified in a manner that encodes information in the signal.

[0143] The computing device 1102 may include input devices 1114, such as a keyboard, mouse, pen, voice input device, touch input device, infrared camera, video input device, and / or any other suitable input device. The computing device 1102 may also include output devices 1116, such as one or more displays, speakers, printers, and / or any other suitable output devices. Input devices 1114 and output devices 1116 may be connected to the computing device 1102 via wired connections, wireless connections, or any combination thereof. In some embodiments, an input device or output device from another computing device may be used as input device 1114 or output device 1116 of the computing device 1102.

[0144] Components of computing device 1102 can be connected via various interconnects (such as buses). These interconnects may include peripheral component interconnects (PCI), such as PCI Express, USB, FireWire (IEEE 1394), optical bus architectures, etc. In some embodiments, components of computing device 1102 can be interconnected via a network. For example, memory 1106 may consist of multiple physical memory cells located in different physical locations and interconnected via a network.

[0145] Those skilled in the art will recognize that storage devices for storing computer-readable instructions can be distributed across a network. For example, computing device 1118, accessible via network 1120, can store computer-readable instructions to implement one or more embodiments provided herein. Computing device 1102 can access computing device 1118 and download some or all of the computer-readable instructions for execution. Alternatively, computing device 1102 can download fragments of computer-readable instructions as needed, or some instructions may be executable at computing device 1102 and some instructions may be executable at computing device 1118.

[0146] According to some embodiments, a wafer cassette transfer assembly includes a wafer cassette port for receiving a wafer cassette, a transfer shaft coupled to the wafer cassette port, a shaft receiver, a shaft coupled to both the transfer shaft and the shaft receiver, a pin passing through the shaft receiver and the shaft, and a pin buckle including a first ring and a second ring, wherein the pin includes a first end and a second end opposite to the first end. The pin buckle is coupled to the pin, the first ring surrounds the first end of the pin, and the second ring surrounds the second end of the pin.

[0147] In some embodiments, the wafer cassette transfer assembly includes a strap coupled to the transfer shaft and coupled to the shaft. In some embodiments, the latch is a C-type latch. In some embodiments, the shaft is located within the shaft receiver. In some embodiments, the wafer cassette transfer assembly includes a gear coupled to the shaft receiver. In some embodiments, the gear includes the shaft receiver. In some embodiments, the wafer cassette transfer assembly includes a latch screw passing through the shaft receiver and through the shaft, wherein the latch screw abuts against a side surface of the latch. In some embodiments, the wafer cassette transfer assembly includes a wafer cassette port coupled to the transfer shaft, wherein the wafer cassette port includes a wafer cassette carrier arm configured to rotate to engage with a wafer cassette. In some embodiments, the diameter of the latch is smaller than the length of the latch.

[0148] According to some embodiments, the wafer cassette transfer assembly includes a wafer cassette port for receiving a wafer cassette, a shaft coupled to the wafer cassette port, a shaft receiver coupled to the shaft, a pin passing through the shaft receiver and through the shaft, and a pin buckle coupled to the pin, wherein the pin buckle includes a first ring surrounding a first end of the pin, a second ring surrounding a second end of the pin different from the first end of the pin, and a C-shaped portion between the first ring and the second ring, wherein the C-shaped portion partially surrounds the shaft receiver.

[0149] In some embodiments, the wafer cassette transfer assembly includes a pin screw passing through the shaft receiver and through the shaft. In some embodiments, the pin screw is oriented perpendicular to the pin, and the pin buckle is oriented parallel to the pin's orientation. In some embodiments, the shaft is located within the shaft receiver. In some embodiments, the diameter of the pin buckle is smaller than the length of the pin.

[0150] According to some embodiments, the wafer cassette transfer assembly includes a shaft receiver having a first inner surface defining a shaft receiving region and a second inner surface defining a pin receiving region. The wafer cassette transfer assembly includes a shaft disposed within the shaft receiving region and a pin including a first pin region, a first end, and a second end extending across the pin receiving region. The wafer cassette transfer assembly includes a pin catch including a first ring surrounding the first end of the pin, a second ring surrounding the second end of the pin, and a C-shaped portion between the first and second rings. The wafer cassette transfer assembly includes a drive assembly coupled to the shaft and a tilting assembly coupled to the drive assembly.

[0151] In some embodiments, the wafer cassette transfer assembly includes a pin screw passing through the shaft receiver and through the shaft, wherein the pin screw abuts against a side surface of the pin. In some embodiments, the tilting assembly includes a wafer cassette port coupled to the drive assembly. In some embodiments, the tilting assembly includes a wafer cassette carrier arm configured to engage a wafer cassette. In some embodiments, the wafer cassette transfer assembly includes a motor, a first gear coupled to the motor for movement by the motor, and a second gear including second gear teeth meshing with the first gear teeth, wherein the first gear includes first gear teeth, and the second gear is coupled to the shaft receiver, wherein rotational torque of the first gear generated by the movement of the motor is transferred to the tilting assembly by means of the second gear, the shaft receiver, the shaft, and the drive assembly. In some embodiments, the C-shaped portion of the pin latch partially surrounds the shaft receiver.

[0152] The foregoing summary outlines features of several embodiments to enable those skilled in the art to better understand various aspects of this disclosure. Those skilled in the art will understand that this disclosure can be readily used as a basis for designing or modifying other processes and structures for implementing the embodiments introduced herein and / or achieving the same benefits. Those skilled in the art will also recognize that these equivalent constructions do not depart from the spirit and scope of this disclosure, and that various changes, substitutions, and modifications can be made herein without departing from the spirit and scope of this disclosure.

[0153] Although the subject matter has been described in language specifically addressing structural features or methodological actions, it should be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or actions described above. Rather, the specific features and actions described above are disclosed as examples of implementing at least some of the claims.

[0154] Various operations are provided in the embodiments herein. The order of some or all of the described operations should not be construed as implying that these operations necessarily depend on the order. It should be understood that alternative orders are of interest to this specification. Furthermore, it should be understood that not all operations are necessarily present in every embodiment provided herein. Additionally, it should be understood that not all operations are necessarily present in some embodiments.

[0155] It should be understood that the layers, features, elements, etc., described herein are shown with respect to each other in specific dimensions (e.g., structural dimensions or orientations), for example, for simplicity and ease of understanding, and in some embodiments, their actual dimensions are substantially different from those shown herein. Furthermore, various techniques exist for forming the layers, regions, features, elements, etc., mentioned herein, such as at least one of etching techniques, planarization techniques, implantation techniques, doping techniques, spin coating techniques, sputtering techniques, growth techniques, or deposition techniques such as CVD.

[0156] Furthermore, “exemplary” is used herein to mean serving as an instance, situation, illustration, etc., and is not necessarily advantageous. As used herein, “or” is intended to mean inclusive “or” rather than exclusive “or.” Additionally, unless otherwise specified or explicitly indicated from the context, “a (a and an)” as used in this application and the appended claims is generally interpreted as meaning “one or more.” Furthermore, at least one of A and B and / or the like generally means A or B, or both A and B. Moreover, with regard to the use of “comprising,” “having / has / with,” or variations thereof, such terms are intended to be inclusive in a manner similar to the term “including.” Additionally, unless otherwise specified, “first,” “second,” or the like are not intended to imply temporal, spatial, or sequential aspects. Rather, these terms are used only as identifiers, names, etc., of features, elements, articles, etc. For example, a first element and a second element generally correspond to element A and element B, or two different or two identical elements, or the same element.

[0157] Furthermore, while this disclosure has been illustrated and described with respect to one or more embodiments, equivalent changes and modifications will be apparent to those skilled in the art upon reading and understanding this specification and the accompanying drawings. This disclosure includes all such modifications and changes and is limited only by the scope of the appended claims. In particular, with respect to the various functions performed by the foregoing components (e.g., elements, resources, etc.), unless otherwise indicated, the terms used to describe these components are intended to correspond to any component performing the specified function of the described component (e.g., functionally equivalent), even if structurally not equivalent to the disclosed structure. Moreover, while specific features of this disclosure may have been disclosed with respect to only one of several embodiments, these features may be combined with one or more other features of other embodiments, which may be desirable and advantageous for any given or particular application.

Claims

1. A wafer cassette transfer assembly, comprising: The chip box port is used to receive the chip box. The transfer axis is coupled to the wafer cassette port; Shaft receiver; A shaft, coupled to the transfer shaft and coupled to the shaft receiver; A strap, coupled to the transfer shaft and coupled to the shaft; A pin passes through the shaft receiver and through the shaft, wherein the pin includes a first end and a second end opposite to the first end; as well as The latch includes a first ring and a second ring, wherein: The latch is coupled to the latch. The first ring surrounds the first end of the pin, and The second ring surrounds the second end of the pin.

2. The wafer cassette transfer assembly according to claim 1, wherein the latch is a C-type latch.

3. The wafer cassette transfer assembly of claim 1, wherein the shaft is located within the shaft receiver.

4. The wafer cassette transfer assembly of claim 1, comprising a gear coupled to the shaft receiver.

5. The wafer cassette transfer assembly of claim 4, wherein the gear includes the shaft receiver.

6. The wafer cassette transfer assembly of claim 1, comprising a pin screw passing through the shaft receiver and through the shaft, wherein the pin screw is abutting the side surface of the pin.

7. The wafer cassette transfer assembly of claim 1, wherein the wafer cassette port includes a wafer cassette carrier arm configured to rotate to engage with the wafer cassette.

8. The wafer cassette transfer assembly according to claim 1, wherein the diameter of the latch is smaller than the length of the latch.

9. The wafer cassette transfer assembly of claim 1, comprising a pin screw passing through the shaft receiver and through the shaft.

10. A wafer cassette transfer assembly, comprising: The chip box port is used to receive the chip box. A shaft is coupled to the wafer cassette port; A shaft receiver, coupled to the shaft; A pin screw passes through the shaft receiver and through the shaft; A pin passes through the shaft receiver and through the shaft; as well as A latch, coupled to the latch, wherein the latch includes: The first ring surrounds the first end of the pin; A second ring surrounds a second end of the pin, different from the first end of the pin; and A C-shaped portion is located between the first ring and the second ring, wherein the C-shaped portion partially surrounds the shaft receiver.

11. The wafer cassette transfer assembly of claim 10, wherein: The pin screw is oriented perpendicular to the pin, and The pin buckle orientation is parallel to the orientation of the pin.

12. The wafer cassette transfer assembly of claim 10, wherein the shaft is located within the shaft receiver.

13. The wafer cassette transfer assembly of claim 10, wherein the diameter of the latch is smaller than the length of the latch.

14. The wafer cassette transfer assembly of claim 10, comprising: The transfer axis is coupled to the wafer cassette port; as well as The strap is coupled to the transfer shaft and also to the shaft rod.

15. A wafer cassette transfer assembly, comprising: Shaft receiver, including: A first internal surface defines the shaft receiving area of ​​the shaft receiver; and The second inner surface defines the pin receiving area of ​​the shaft receiver; A shaft is disposed within the shaft receiving area; Pins, including: The first pin area extends across the pin receiving area; The first end; and The second end; The latch includes: The first ring surrounds the first end of the pin; A second ring surrounds the second end of the pin; and The C-shaped portion is located between the first ring and the second ring; A pin screw passes through the shaft receiver and through the shaft, wherein the pin screw is close to the side surface of the pin; Drive assembly, coupled to the shaft; and The tilting assembly is coupled to the drive assembly.

16. The wafer cassette transfer assembly of claim 15, wherein the tilting assembly includes a wafer cassette port coupled to the drive assembly.

17. The wafer cassette transfer assembly of claim 15, wherein the tilting assembly includes a wafer cassette carrier arm configured to engage the wafer cassette.

18. The wafer cassette transfer assembly of claim 15, comprising: Electric motor; A first gear is coupled to the electric motor to move via the electric motor, wherein the first gear includes first gear teeth; as well as The second gear includes second gear teeth that mesh with the first gear teeth, wherein the second gear is coupled to the shaft receiver, wherein: The rotational torque of the first gear generated by the movement of the electric motor is transferred to the tilting assembly by means of the second gear, the shaft receiver, the shaft, and the drive assembly.

19. The wafer cassette transfer assembly of claim 15, wherein the C-shaped portion of the pin buckle partially surrounds the shaft receiver.

20. The wafer cassette transfer assembly according to claim 15, wherein: The tilting assembly includes a wafer cassette port for receiving a wafer cassette and a transfer shaft coupled to the wafer cassette port, and The drive assembly includes a strap coupled to the transfer shaft and coupled to the shaft.

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