A novel transformer structure and manufacturing method

Abstract

The application discloses a novel transformer structure and a manufacturing method thereof, which comprises an upper layer PCB board, a primary winding formed by a group of etched lines, a lower layer PCB board, a secondary winding formed by a group of etched lines, a soft magnetic permalloy sheet arranged between the upper layer PCB board and the lower layer PCB board, and a plurality of soldering pads arranged on the upper layer PCB board and the lower layer PCB board, wherein the soldering pads on the lower layer PCB board are connected with the head and tail of the primary winding, and the soldering pads on the lower layer PCB board are respectively connected with a power supply and a load end. The transformer is small in size and simple in structure.

Description

Technical Field

[0001] This invention relates to the field of current transformer technology, and specifically to a novel current transformer structure and manufacturing method. Background Technology

[0002] Instrument transformers, also known as instrument transformers, are a general term encompassing both current transformers and voltage transformers. They transform high voltage into low voltage and large current into small current for use in measurement or protection systems. Their primary function is to proportionally convert high voltage or large current into standard low voltage (100V) or standard small current (5A or 1A, both referring to rated values) to facilitate the standardization and miniaturization of measuring instruments, protection equipment, and automatic control devices. Instrument transformers can also be used to isolate high-voltage systems to ensure the safety of personnel and equipment. Currently available instrument transformers are large and complex in structure, making it difficult to miniaturize the overall device size in small and micro-circuits. Summary of the Invention

[0003] The problem to be solved by the present invention is to provide a novel current transformer structure and manufacturing method, which reduces the size of the current transformer and simplifies its structure.

[0004] The technical solution provided by this invention to solve the above problems is: a novel current transformer structure, comprising...

[0005] The upper PCB board is equipped with a primary winding composed of etched lines;

[0006] The lower PCB board is equipped with a secondary winding composed of two etched lines;

[0007] Permalloy soft magnetic sheet is placed between the upper PCB board and the lower PCB board;

[0008] Several pads are disposed on the upper PCB board and the lower PCB board. The pads on the lower PCB board are connected to the beginning and end of the primary winding. The pads on the lower PCB board are respectively connected to the power supply and the load.

[0009] Preferably, the permalloy soft magnetic sheet is disposed between the lower end face of the upper PCB board and the upper end face of the lower PCB board.

[0010] Preferably, the pad is connected to the primary winding via a gold wire, silver wire, or copper wire.

[0011] Another object of the present invention is to disclose a method for manufacturing a novel current transformer structure as described in any one of claims 1-3, the method comprising the following steps:

[0012] (1) The upper PCB board is etched to obtain a primary winding;

[0013] (2) The lower PCB board is etched to obtain secondary windings;

[0014] (3) Place a permalloy soft magnetic sheet between the back of the upper PCB and the front of the lower PCB.

[0015] (4) Connect the primary winding etched on the upper PCB board to the circuit pads etched on the lower PCB board to form a connection between the upper and lower PCB boards.

[0016] (5) The beginning and end of the coils of the last winding and the second winding are led out from several pads on the lower PCB board and connected to the power supply and load terminals respectively.

[0017] Preferably, in step (4), the primary winding etched from the upper PCB board is soldered to the circuit pads etched on the lower PCB board by gold, silver, or copper wires under the action of ultrasonic waves.

[0018] Preferably, in step (4), SMT pads are designed at the PAD positions of the upper PCB and the lower PCB. The primary winding etched on the upper PCB and the circuit pads etched on the lower PCB are connected by SMT solder paste, and the circuits on the upper PCB and the lower PCB are made conductive.

[0019] Preferably, in step (4), a via is designed between the upper PCB board and the lower PCB board. After the upper PCB board and the lower PCB board are pressure bonded together, copper is filled in the via, and the circuits of the upper PCB board and the circuits of the lower PCB board are connected.

[0020] Compared with the prior art, the advantages of the present invention are: the present invention replaces the winding of enameled wire with gold wire ultrasonic welding, SMT welding or copper plugging through holes to conduct through PCB etched circuits, which can reduce the wire width to 0.1 or even 0.05mm, the wire spacing to 0.1mm, the circuit is uniform and neat, and the whole process is automated, which greatly improves the manufacturing efficiency of current transformer products and reduces the overall structural size of the current transformer, increasing the utilization rate of motherboard space or reducing the size of the motherboard for users. Attached Figure Description

[0021] The accompanying drawings, which are provided to further illustrate the invention and constitute a part of this invention, are illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention.

[0022] Figure 1 This is a top view of the upper PCB board in Embodiments 1 and 2 of the present invention;

[0023] Figure 2These are bottom views of the upper PCB board in Embodiments 1 and 2 of the present invention;

[0024] Figure 3 This is a top view of the lower PCB board in Embodiments 1 and 2 of the present invention;

[0025] Figure 4 This is a bottom view of the lower PCB board in Embodiments 1 and 2 of the present invention;

[0026] Figure 5 This is a schematic diagram of the cooperation between the upper PCB board and the lower PCB board in Embodiments 1 and 2 of the present invention;

[0027] Figure 6 These are top views of the upper PCB board in Embodiments 3 and 4 of the present invention;

[0028] Figure 7 This is a top view of the lower PCB board in Embodiments 3 and 4 of the present invention;

[0029] Figure 8 This is a bottom view of the lower PCB board in Embodiments 3 and 4 of the present invention;

[0030] Figure 9 This is a schematic diagram of the cooperation between the upper PCB board and the lower PCB board in Embodiments 3 and 4 of the present invention;

[0031] Figure 10 This is a schematic diagram showing the fit between the upper PCB board, the permalloy soft magnetic sheet, and the lower PCB board.

[0032] Attached image captions: Detailed Implementation

[0033] The following will describe in detail the implementation of the present invention with reference to the accompanying drawings and embodiments, so that the process of how the present invention uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0034] In the description of this invention, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this invention.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Thus, the use of "first" and "second" to define a feature may explicitly or implicitly include one or more of that feature, and in the description of this invention, "a number" means two or more, unless otherwise explicitly specified.

[0036] In this invention, unless otherwise explicitly specified and limited, the terms "assembly," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can also refer to a mechanical connection; they can refer to a direct connection or a connection through an intermediate medium; or they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0037] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0038] It should also be understood that the terminology used in this specification of embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of the invention. As used in this specification of embodiments of the invention and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0039] Example 1

[0040] A novel current transformer structure, including

[0041] The upper PCB board is equipped with a primary winding composed of etched lines;

[0042] The lower PCB board is equipped with a secondary winding composed of two etched lines;

[0043] A permalloy soft magnetic sheet is disposed between the lower end face of the upper PCB board and the upper end face of the lower PCB board;

[0044] Several pads are disposed on the upper PCB board and the lower PCB board. The pads on the lower PCB board are connected end to end of the primary winding through gold wire, silver wire or copper wire. The pads on the lower PCB board are respectively connected to the power supply and the load.

[0045] The method for manufacturing the aforementioned novel current transformer structure includes the following steps:

[0046] (1) The upper PCB board is etched to obtain a primary winding;

[0047] (2) The lower PCB board is etched to obtain secondary windings;

[0048] (3) Place a permalloy soft magnetic sheet between the back of the upper PCB and the front of the lower PCB.

[0049] (4) The primary winding etched on the upper PCB board is soldered to the circuit pads etched on the lower PCB board by gold, silver or copper wires under the action of ultrasonic waves.

[0050] (5) The beginning and end of the coils of the last winding and the second winding are led out from several pads on the lower PCB board and connected to the power supply and load terminals respectively.

[0051] Example 2

[0052] A novel current transformer structure, including

[0053] The upper PCB board is equipped with a primary winding composed of etched lines;

[0054] The lower PCB board is equipped with a secondary winding composed of two etched lines;

[0055] A permalloy soft magnetic sheet is disposed between the lower end face of the upper PCB board and the upper end face of the lower PCB board;

[0056] Several pads are set on the upper PCB board and the lower PCB board. SMT pads are designed on the PAD positions of the upper PCB board and the lower PCB board. The primary winding etched on the upper PCB board and the circuit pad etched on the lower PCB board are connected by SMT solder paste. The pads on the lower PCB board are respectively connected to the power supply and the load.

[0057] The method for manufacturing the aforementioned novel current transformer structure includes the following steps:

[0058] (1) The upper PCB board is etched to obtain a primary winding;

[0059] (2) The lower PCB board is etched to obtain secondary windings;

[0060] (3) Place a permalloy soft magnetic sheet between the back of the upper PCB and the front of the lower PCB.

[0061] (4) Design SMT pads at the PAD positions of the upper and lower PCB boards. Connect the primary winding etched on the upper PCB board to the circuit pads etched on the lower PCB board using SMT solder paste to complete the conduction between the circuits on the upper and lower PCB boards.

[0062] (5) The beginning and end of the coils of the last winding and the second winding are led out from several pads on the lower PCB board and connected to the power supply and load terminals respectively.

[0063] Example 3

[0064] A permalloy soft magnetic sheet is placed between the back of the upper PCB and the front of the lower PCB. The etched circuitry on the upper PCB, using gold, silver, and copper conductors, is ultrasonically soldered to the etched circuit pads on the lower PCB, creating a conductive connection between the two PCBs. This forms the primary and secondary windings of the coil. Finally, the ends of both windings are led out from several pads on the lower PCB and connected to the power supply and load terminals, respectively.

[0065] Example 4

[0066] Based on Example 3, the PAD positions that were originally connected by wires on the upper and lower PCB boards are designed as SMT pads. In this way, the ultrasonic welding that originally connected the upper and lower PCB boards with gold, silver, copper and other wires can be replaced by SMT solder paste welding; or a via design can be used, so that after the upper and lower boards are high pressure pressed together, copper is filled in the via to complete the conduction.

[0067] The above description only illustrates the preferred embodiments of the present invention and should not be construed as limiting the scope of the claims. The present invention is not limited to the above embodiments, and variations in its specific structure are permitted. All modifications made within the scope of the independent claims of this invention are also within the scope of protection of this invention.

Claims

1. A novel current transformer structure, characterized in that, include: The upper PCB board has a primary winding composed of etched lines; The lower PCB board has a secondary winding composed of two etched lines. A permalloy soft magnetic sheet is disposed between the lower end face of the upper PCB board and the upper end face of the lower PCB board; Several pads are provided on the upper PCB board and the lower PCB board. The pads on the lower PCB board are connected to the beginning and end of the primary winding. The beginning and end of the primary winding coil are led out from the pads on the lower PCB board and connected to the power supply. The beginning and end of the secondary winding coil are led out from the pads on the lower PCB board and connected to the load terminal.

2. The novel transformer structure according to claim 1, characterized in that: The pads are connected to the primary winding via gold, silver, or copper wires.

3. A method for manufacturing a novel current transformer structure as described in claim 1 or 2, characterized in that: The method includes the following steps: (1) The upper PCB board is etched to obtain a primary winding; (2) The lower PCB board is etched to obtain the secondary winding; (3) Place a permalloy soft magnetic sheet between the back of the upper PCB and the front of the lower PCB. (4) Connect the primary winding etched on the upper PCB board to the circuit pad etched on the lower PCB board to form a connection between the circuits of the upper PCB board and the lower PCB board. (5) Finally, the beginning and end of the primary winding coil are led out from the pads on the lower PCB board to the power supply, and the beginning and end of the secondary winding coil are led out from the pads on the lower PCB board to the load terminal.

4. The method for manufacturing a novel current transformer structure according to claim 3 is characterized in that: In step (4), the primary winding etched from the upper PCB board is soldered to the circuit pads etched from the lower PCB board by gold, silver, or copper wires under the action of ultrasonic waves.

5. The method for manufacturing a novel current transformer structure according to claim 3 is characterized in that: In step (4), SMT pads are designed at the PAD positions of the upper and lower PCB boards. The primary winding etched on the upper PCB board and the line pad etched on the lower PCB board are connected by SMT solder paste, and the lines of the upper and lower PCB boards are made conductive.

6. The method for manufacturing a novel current transformer structure according to claim 3, characterized in that: In step (4), a via is designed between the upper PCB and the lower PCB. After the upper PCB and the lower PCB are pressed together under high pressure, copper is filled in the via. The primary winding etched on the upper PCB and the line pad etched on the lower PCB are connected by copper filling in the via, and the lines on the upper PCB and the lower PCB are connected.

Images