Thermal conductivity type hydrogen purity analyzer

Abstract

This invention provides a thermal conductivity hydrogen purity analyzer, including a thermally insulated housing. Inside the housing is a thermal conductivity sensing mechanism. The input end of the sensing mechanism is connected to the output end of a filter via a pipe. The input end of the filter is connected to an inlet valve via a pipe. A calibration valve is located at the rear end of the inlet valve. The output end of the sensing mechanism is connected to an outlet valve via a pipe. A flow meter is located at the front end of the outlet valve. This invention ensures that the operating temperature of the equipment is unaffected by the external ambient temperature through the thermally insulated housing, keeping its operating temperature constant and thus ensuring that the measured values ​​are unaffected by ambient temperature. A multi-layer anti-interference motherboard mechanism ensures stable operation, unaffected by external signal interference. Multiple vibration-damping fixing block units, in conjunction with vibration-damping bolt units, reduce vibration. It achieves real-time and accurate transmission of detection signals, avoiding false values ​​output due to sensor jumps, and ensuring that the measured data shows no significant discrepancies.

Description

Technical Field

[0001] This invention relates to the field of new energy testing equipment technology, specifically to a thermal conductivity hydrogen purity analyzer. Background Technology

[0002] Hydrogen is a highly flammable, colorless, and odorless gas, commonly used as fuel in various industries. Hydrogen has a low specific gravity and light weight, resulting in good heat dissipation. However, due to its relatively reactive nature and poor stability, it is crucial to control the purity of hydrogen in equipment, ensuring it deviates significantly from its limits. This often necessitates online hydrogen purity analyzers to monitor hydrogen purity in real time and prevent potential hazards.

[0003] With the development of technology, the era of hydrogen fuel cell vehicles is gradually beginning, and real-time monitoring of hydrogen purity in automobiles is also essential. At the same time, it is also necessary to consider the need to isolate vibration in the working environment inside the car, ensure that the operating temperature of the equipment is not affected by the external ambient temperature, and reduce signal interference to avoid large errors in the detection data due to the above factors. Summary of the Invention

[0004] In order to address the above problems, the present invention provides a thermal conductivity hydrogen purity analyzer, which aims to solve the technical problems of isolating vibration, ensuring operating temperature and reducing interference mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a thermal conductivity hydrogen purity analyzer, comprising a thermally insulated housing, wherein a thermal conductivity sensing mechanism is provided inside the thermally insulated housing, the input end of the thermal conductivity sensing mechanism is connected to the output end of a filter via a pipe, the input end of the filter is connected to an inlet valve via a pipe, a calibration valve is provided at the rear end of the inlet valve, the output end of the thermal conductivity sensing mechanism is connected to an outlet valve via a pipe, and a flow meter is provided at the front end of the outlet valve.

[0006] Furthermore, the thermal insulation box includes a box shell, a box cover is hinged to one side of the box shell, and thermal insulation aluminum foil layers are respectively provided on the inner side of the box shell and the box cover, and thermal insulation rock wool layers are respectively provided inside the multiple thermal insulation aluminum foil layers.

[0007] Furthermore, the thermal conductivity sensing mechanism includes multiple shock-absorbing fixing block units, one side of each of the multiple shock-absorbing fixing block units is located inside the outer shell of the housing, and the multiple shock-absorbing fixing block units are respectively located at the four corners of the thermal conductivity sensing air chamber mechanism. One side of the thermal conductivity sensing air chamber mechanism is provided with an anti-interference multi-layer main board mechanism, and the four corners of the thermal conductivity sensing air chamber mechanism and the anti-interference multi-layer main board mechanism are respectively provided with shock-absorbing bolt units, and one end of each of the multiple shock-absorbing bolt units is threaded to the middle of the shock-absorbing fixing block unit.

[0008] Furthermore, the shock-absorbing fixing block unit includes a fixing block body, one side of which is located inside the outer shell of the housing, and the other side of which is provided with a shock-absorbing corner pad.

[0009] Furthermore, the thermal conductivity sensing air chamber mechanism includes an air chamber body, the lower part of which is provided with multiple quick-connect interfaces, a sealing ring on one side of the air chamber body, a thermal conductivity sensor embedded in the middle of the sealing ring, and an air chamber pressure cap on one side of the sealing ring.

[0010] Furthermore, the anti-interference multi-layer motherboard mechanism includes an anti-interference housing. The bottom of the anti-interference housing is located on one side of the thermal conductivity sensing air chamber mechanism. A power layer PLC board is provided inside the anti-interference housing. A first gasket is provided on one side of the power layer PLC board. An anti-interference layer is provided on one side of the first gasket. A second gasket is provided on one side of the anti-interference layer. A signal transmission layer PLC board is provided on one side of the second gasket. A third gasket is provided on one side of the signal transmission layer PLC board. An anti-interference cover is provided on one side of the third gasket and the other side of the anti-interference housing.

[0011] Furthermore, the anti-interference shell is provided with support columns at its four corners, and the shock-absorbing bolt unit is provided in the middle of the support columns. The anti-interference shell is provided with multiple first-order positioning strips around its interior perimeter. A second-order positioning strip is provided on one side of each of the multiple first-order positioning strips, and a third-order positioning strip is provided on one side of each of the multiple second-order positioning strips. The multiple first-order positioning strips, the multiple second-order positioning strips, and the multiple third-order positioning strips are arranged at three different heights.

[0012] Furthermore, the power supply layer PLC board and the first gasket are provided with a plurality of first-order positioning grooves around their perimeters, and the positions of the plurality of first-order positioning grooves correspond to a plurality of first-order positioning strips, a plurality of second-order positioning strips, and a plurality of third-order positioning strips, respectively. The anti-interference layer and the second gasket are provided with a plurality of second-order positioning grooves around their perimeters, and the positions of the plurality of second-order positioning grooves correspond to a plurality of second-order positioning strips and a plurality of third-order positioning strips, respectively. The signal transmission layer PLC board and the third gasket are provided with a plurality of third-order positioning grooves around their perimeters, and the positions of the plurality of third-order positioning grooves correspond to a plurality of third-order positioning strips, respectively.

[0013] Furthermore, the shock-absorbing bolt unit includes an extended screw, with a limiting ring at the end of the extended screw near the thread and a shock-absorbing spring fitted at the end of the extended screw that is not threaded.

[0014] Furthermore, the input and output ends of the thermal conductivity sensing mechanism are respectively provided with buffer bellows.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] The thermal insulation enclosure ensures that the equipment's operating temperature is unaffected by the external environment, keeping it constant and thus preventing the measured values ​​from being affected by ambient temperature. An anti-interference multi-layer motherboard mechanism ensures stable operation, free from external signal interference. Multiple shock-absorbing fixing blocks, in conjunction with shock-absorbing bolts, reduce vibration. Real-time and accurate transmission of detection signals is achieved, avoiding false values ​​output due to sensor jumps and ensuring minimal discrepancies in the measured data. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the external structure of the present invention;

[0018] Figure 2 This is a schematic diagram of the internal structure of the present invention when opened;

[0019] Figure 3 This is a frontal sectional view of the internal structure of the present invention;

[0020] Figure 4 This is a cross-sectional schematic diagram of the thermal insulation box structure of the present invention;

[0021] Figure 5 This is a schematic diagram of the thermal conductivity sensing mechanism of the present invention;

[0022] Figure 6 This is an exploded schematic diagram of the thermal conductivity sensing mechanism of the present invention;

[0023] Figure 7 This is an exploded view of the shock-absorbing fixing block unit structure of the present invention;

[0024] Figure 8 This is an exploded schematic diagram of the thermal conductivity sensing gas chamber mechanism of the present invention;

[0025] Figure 9 This is an exploded view of the anti-interference multi-layer motherboard mechanism structure of the present invention;

[0026] Figure 10 This is a cross-sectional schematic diagram of the anti-interference shell structure of the present invention.

[0027] In the diagram: 1. Thermal insulation box; 11. Box shell; 111. Thermal insulation aluminum foil layer; 112. Thermal insulation rock wool layer; 12. Box lid; 2. Thermal conductivity sensing mechanism; 21. Shock-absorbing fixing block unit; 211. Fixing block body; 212. Shock-absorbing corner pad; 22. Thermal conductivity sensing air chamber mechanism; 221. Air chamber body; 222. Quick connector; 223. Sealing ring; 224. Thermal conductivity sensor; 225. Air chamber cover; 23. Anti-interference multi-layer main board mechanism; 231. Anti-interference shell; 2311. Support column; 2312. First-stage positioning strip; 2313. Second-stage positioning strip. Positioning bar; 2314, third-order positioning bar; 232, power supply layer PLC board; 2321, first-order positioning groove; 233, first washer ring; 234, anti-interference layer; 2341, second-order positioning groove; 235, second washer ring; 236, signal transmission layer PLC board; 2361, third-order positioning groove; 237, third washer ring; 238, anti-interference cover plate; 24, shock-absorbing bolt unit; 241, extended screw; 242, limit ring; 243, shock-absorbing spring; 3, filter; 4, inlet valve; 5, calibration valve; 6, outlet valve; 7, flow meter; 8, buffer bellows. Detailed Implementation

[0028] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be given below with reference to the accompanying drawings, which illustrate several embodiments of the present invention. However, the present invention can be implemented in different forms and is not limited to the embodiments described in the text. Rather, these embodiments are provided to make the disclosure of the present invention more thorough and complete.

[0029] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly associated with those skilled in the art to which this invention pertains. The terminology used herein in the specification of this invention is for the purpose of describing particular embodiments and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0031] Please refer to the following examples. Figure 1-3A thermal conductivity hydrogen purity analyzer includes a thermally insulated housing 1. A thermal conductivity sensing mechanism 2 is installed inside the thermally insulated housing 1. The input end of the thermal conductivity sensing mechanism 2 is connected to the output end of a filter 3 via a pipe. The input end of the filter 3 is connected to an inlet valve 4 via a pipe. A calibration valve 5 is installed at the rear end of the inlet valve 4. The output end of the thermal conductivity sensing mechanism 2 is connected to an outlet valve 6 via a pipe. A flow meter 7 is installed at the front end of the outlet valve 6. Buffer insulation cotton 9 is installed between the interior of the thermally insulated housing 1, the thermal conductivity sensing mechanism 2, the filter 3, the inlet valve 4, the calibration valve 5, the outlet valve 6, and the flow meter 7.

[0032] Please refer to the following examples. Figure 4 The thermal insulation box 1 includes a box shell 11, and a box cover 12 is hinged to one side of the box shell 11. The inner sides of the box shell 11 and the box cover 12 are respectively provided with thermal insulation aluminum foil layers 111, and the interior of the multiple thermal insulation aluminum foil layers 111 is respectively provided with thermal insulation rock wool layers 112. This design isolates the external high temperature through the thermal insulation aluminum foil layers 111 and maintains the internal temperature through the thermal insulation rock wool layers 112, thus avoiding the influence of external temperature.

[0033] Please refer to the following examples. Figure 5-6 The thermal conductivity sensing mechanism 2 includes multiple shock-absorbing fixing block units 21. One side of each of the multiple shock-absorbing fixing block units 21 is located inside the outer shell 11 of the housing. The multiple shock-absorbing fixing block units 21 are respectively located at the four corners of the thermal conductivity sensing air chamber mechanism 22. One side of the thermal conductivity sensing air chamber mechanism 22 is provided with an anti-interference multi-layer main board mechanism 23. The four corners of the thermal conductivity sensing air chamber mechanism 22 and the anti-interference multi-layer main board mechanism 23 are respectively provided with shock-absorbing bolt units 24. One end of each of the multiple shock-absorbing bolt units 24 is threaded to the middle of the shock-absorbing fixing block unit 21. This design makes the operation stable and unaffected by external signal interference through the anti-interference multi-layer main board mechanism 22; and reduces vibration by using multiple shock-absorbing fixing block units 21 in conjunction with shock-absorbing bolt units 24.

[0034] Please refer to the following examples. Figure 7 The shock-absorbing fixing block unit 21 includes a fixing block body 211. One side of the fixing block body 211 is located inside the outer shell 11 of the housing, and the other side of the fixing block body 211 is provided with a shock-absorbing corner pad 212.

[0035] Please refer to the following examples. Figure 8 The thermal conductivity sensing air chamber mechanism 22 includes an air chamber body 221. The lower part of the air chamber body 221 is provided with multiple quick-connect interfaces 222. A sealing ring 223 is provided on one side of the air chamber body 221. A thermal conductivity sensor 224 is embedded in the middle of the sealing ring 223. An air chamber pressure cover 225 is provided on one side of the sealing ring 223.

[0036] Please refer to the following examples. Figure 9 The anti-interference multilayer motherboard mechanism 23 includes an anti-interference housing 231. The bottom of the anti-interference housing 231 is located on one side of the thermal conductivity sensing air chamber mechanism 22. A power layer PLC board 232 is provided inside the anti-interference housing 231. A first gasket 233 is provided on one side of the power layer PLC board 232. An anti-interference layer 234 is provided on one side of the first gasket 233. A second gasket 235 is provided on one side of the anti-interference layer 234. A signal transmission layer PLC board 236 is provided on one side of the second gasket 235. A third gasket 237 is provided on one side of the signal transmission layer PLC board 236. An anti-interference cover plate 238 is provided on one side of the third gasket 237 and the other side of the anti-interference housing 231.

[0037] Please refer to the following examples. Figure 10 The anti-interference housing 231 has support columns 2311 at its four corners, and shock-absorbing bolt units 24 are respectively provided in the middle of the support columns 2311. The interior of the anti-interference housing 231 has multiple first-order positioning strips 2312, a second-order positioning strip 2313 is provided on one side of each of the multiple first-order positioning strips 2312, and a third-order positioning strip 2314 is provided on one side of each of the multiple second-order positioning strips 2313. The multiple first-order positioning strips 2312, the multiple second-order positioning strips 2313, and the multiple third-order positioning strips 2314 are set at three different heights.

[0038] Please refer to the following examples. Figure 9 The power layer PLC board 232 and the first gasket 233 are provided with a plurality of first-order positioning grooves 2321 around their perimeters. The positions of the plurality of first-order positioning grooves 2321 correspond to the plurality of first-order positioning strips 2312, the plurality of second-order positioning strips 2313 and the plurality of third-order positioning strips 2314 respectively. The anti-interference layer 234 and the second gasket 235 are provided with a plurality of second-order positioning grooves 2341 around their perimeters. The positions of the plurality of second-order positioning grooves 2341 correspond to the plurality of second-order positioning strips 2313 and the plurality of third-order positioning strips 2314 respectively. The signal transmission layer PLC board 236 and the third gasket 237 are provided with a plurality of third-order positioning grooves 2361 around their perimeters. The positions of the plurality of third-order positioning grooves 2361 correspond to the plurality of third-order positioning strips 2314 respectively.

[0039] Please refer to the following examples. Figure 6 The shock-absorbing bolt unit 24 includes an extended screw 241. A limiting ring 242 is provided at one end of the extended screw 241 near the thread, and a shock-absorbing spring 243 is sleeved at one end of the extended screw 241 in the direction of the thread.

[0040] Please refer to the following examples. Figure 3 The input and output ends of the thermal conductivity sensing mechanism 2 are respectively equipped with buffer bellows 8. This design ensures that the shock absorption effect of the thermal conductivity sensing mechanism 2 is not affected by other pipelines through the buffer bellows 8.

[0041] The present invention has been described by way of example in conjunction with the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any non-substantial improvement made by adopting the inventive concept and technical solution of the present invention, or the direct application of the inventive concept and technical solution of the present invention to other occasions without modification, shall be within the protection scope of the present invention.

Claims

1. A thermal conductivity hydrogen purity analyzer, characterized in that: The device includes a thermal insulation box (1), which is equipped with a thermal conductivity sensing mechanism (2) inside. The input end of the thermal conductivity sensing mechanism (2) is connected to the output end of a filter (3) through a pipe. The input end of the filter (3) is connected to an air inlet valve (4) through a pipe. The rear end of the air inlet valve (4) is equipped with a calibration valve (5). The output end of the thermal conductivity sensing mechanism (2) is connected to an air outlet valve (6) through a pipe. The front end of the air outlet valve (6) is equipped with a flow meter (7). The thermal conductivity sensing mechanism (2) includes multiple shock-absorbing fixing block units (21). One side of each of the multiple shock-absorbing fixing block units (21) is located inside the outer shell (11) of the housing. The multiple shock-absorbing fixing block units (21) are respectively located at the four corners of the thermal conductivity sensing air chamber mechanism (22). One side of the thermal conductivity sensing air chamber mechanism (22) is provided with an anti-interference multi-layer main board mechanism (23). The four corners of the thermal conductivity sensing air chamber mechanism (22) and the anti-interference multi-layer main board mechanism (23) are respectively provided with shock-absorbing bolt units (24). One end of each of the multiple shock-absorbing bolt units (24) is threaded to the middle of the shock-absorbing fixing block unit (21). The anti-interference multilayer motherboard mechanism (23) includes an anti-interference shell (231). The bottom of the anti-interference shell (231) is located on one side of the thermal conductivity sensing air chamber mechanism (22). The interior of the anti-interference shell (231) is provided with a power layer PLC board (232). A first gasket (233) is provided on one side of the power layer PLC board (232). An anti-interference layer (234) is provided on one side of the first gasket (233). A second gasket (235) is provided on one side of the anti-interference layer (234). A signal transmission layer PLC board (236) is provided on one side of the second gasket (235). A third gasket (237) is provided on one side of the signal transmission layer PLC board (236). An anti-interference cover plate (238) is provided on one side of the third gasket (237) and the other side of the anti-interference shell (231). The heat-insulating box (1) includes a box shell (11), a box cover (12) is hinged to one side of the box shell (11), and heat-insulating aluminum foil layers (111) are respectively provided on the inner side of the box shell (11) and the box cover (12). Heat-insulating rock wool layers (112) are respectively provided inside the multiple heat-insulating aluminum foil layers (111). The thermal conductivity sensing air chamber mechanism (22) includes an air chamber body (221), the lower part of which is provided with multiple quick-connect ports (222), a sealing ring (223) is provided on one side of the air chamber body (221), a thermal conductivity sensor (224) is embedded in the middle of the sealing ring (223), and an air chamber cover (225) is provided on one side of the sealing ring (223). The shock-absorbing bolt unit (24) includes an extended screw (241), a limiting ring (242) is provided at the end of the extended screw (241) near the thread, and a shock-absorbing spring (243) is sleeved at the end of the extended screw (241) that is not threaded.

2. The thermal conductivity hydrogen purity analyzer according to claim 1, characterized in that: The shock-absorbing fixing block unit (21) includes a fixing block body (211), one side of which is located inside the outer shell (11) of the box, and the other side of which is provided with a shock-absorbing corner pad (212).

3. The thermal conductivity hydrogen purity analyzer according to claim 1, characterized in that: The anti-interference shell (231) is provided with support columns (2311) at its four corners, and the shock-absorbing bolt unit (24) is provided in the middle of the support column (2311). The anti-interference shell (231) is provided with multiple first-order positioning strips (2312) around its interior. A second-order positioning strip (2313) is provided on one side of each of the multiple first-order positioning strips (2312), and a third-order positioning strip (2314) is provided on one side of each of the multiple second-order positioning strips (2313). The multiple first-order positioning strips (2312), the multiple second-order positioning strips (2313), and the multiple third-order positioning strips (2314) are set at three different heights.

4. The thermal conductivity hydrogen purity analyzer according to claim 3, characterized in that: The power layer PLC board (232) and the first gasket (233) are provided with a plurality of first-order positioning grooves (2321) around their perimeter. The positions of the plurality of first-order positioning grooves (2321) correspond to the positions of the plurality of first-order positioning strips (2312), the plurality of second-order positioning strips (2313), and the plurality of third-order positioning strips (2314). The anti-interference layer (234) and the second gasket (235) are provided with a plurality of second-order positioning grooves (2341) around their perimeter. The positions of the plurality of second-order positioning grooves (2341) correspond to the positions of the plurality of second-order positioning strips (2313) and the plurality of third-order positioning strips (2314). The signal transmission layer PLC board (236) and the third gasket (237) are provided with a plurality of third-order positioning grooves (2361) around their perimeter. The positions of the plurality of third-order positioning grooves (2361) correspond to the positions of the plurality of third-order positioning strips (2314).

5. The thermal conductivity hydrogen purity analyzer according to claim 1, characterized in that: The input and output ends of the thermal conductivity sensing mechanism (2) are respectively provided with buffer bellows (8).

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