Inductor device and stacked power supply topology

Abstract

Embodiments of the present disclosure relate to inductor devices and stacked power supply topologies. According to one configuration, an inductor device includes a core made of a plurality of different types of magnetically permeable material. The inductor device includes an electrically conductive path extending through the core. A magnitude of the magnetic permeability of the core is related to a distance relative to the electrically conductive path.

Description

Technical Field

[0001] Embodiments of this disclosure relate to inductor devices and stacked power supply topologies. Background Technology

[0002] Conventional switching power supply circuits sometimes include energy storage components such as inductors to generate an output voltage that supplies power to the load. For example, in order to keep the output voltage within a desired range, a controller uses one or more inductors to control the switching of the input current.

[0003] Typically, a conventional inductor is a component comprising wires or other conductive material in the shape of coils or helices to increase the amount of magnetic flux through a given circuit path. Winding the wires into multiple turns of coil increases the number of corresponding magnetic flux lines in the inductor component, thereby increasing the magnetic field and thus increasing the total inductance of the inductor component. Summary of the Invention

[0004] The realization of clean energy (or green technology) is crucial for reducing our impact on the environment as humans. Generally speaking, clean energy includes any evolving methods and materials used to reduce the overall environmental toxicity of energy consumption.

[0005] This disclosure includes the observation that raw energy received from green or non-green energy sources typically needs to be converted into an appropriate form (such as desired AC voltage, DC voltage, etc.) before it can be used to power terminal devices such as servers, computers, mobile communication devices, wireless base stations, etc. In some cases, the energy is stored in one or more corresponding battery resources. Regardless of whether the energy comes from green or non-green energy sources, it is desirable to utilize the raw energy provided by such systems (such as storage and subsequent distribution) most efficiently to reduce our environmental impact. This disclosure contributes to reducing our carbon footprint and better utilizing energy through more efficient energy conversion.

[0006] For example, this disclosure includes the observation that conventional inductor components (such as those used to support power conversion) are suitable for planar circuit applications, where the respective planar surface of a power supply board is filled with multiple different components, which are then coupled to each other via circuit traces disposed on the planar surface. Such a topology (providing horizontal power flow in the power supply board) inevitably makes it difficult to create compact, efficient, and high-current output power supply circuits.

[0007] In contrast to conventional techniques, the embodiments described herein provide novel and improved inductor components for applications such as power conversion. For example, the embodiments herein include novel inductor devices, their respective uses, methods of manufacturing them, etc.

[0008] More specifically, embodiments of this document include novel inductor devices comprising a core made of multiple different types of magnetically permeable materials. The inductor device includes a conductive path extending through the core of the inductor device. The magnitude of the permeability of the core (around the conductive path) is related to the distance relative to the conductive path.

[0009] According to a further example embodiment, the permeability of the core varies depending on the radial distance from the conductive path.

[0010] In yet another example embodiment, the permeability of the magnetic material in the core increases quantitatively with increasing radial distance from the conductive path.

[0011] In a further example embodiment, the core includes a plurality of concentric material layers relative to a conductive path. The plurality of concentric magnetically conductive material layers include a first concentric material layer (at a first radius relative to the conductive path) and a second concentric material layer (at a second radius relative to the conductive path). The second concentric material layer (such as an outer layer relative to the conductive path) has a higher magnetic permeability than the first concentric material layer. In one embodiment, the first concentric material layer is disposed between the conductive path and the second concentric material layer.

[0012] In a further example embodiment, the core of the inductor device, as discussed herein, limits the magnetic flux generated by the current flowing through the conductive path. The permeability of the magnetic material can be any suitable value or one or more. In a non-limiting example embodiment, the permeability of the magnetic material in the core of the inductor device is between 30 and 150 Henry / meter, but it can be any suitable value.

[0013] According to another example embodiment, the permeability of the core varies substantially linearly with respect to distance from the conductive path. For example, in one embodiment, the variable permeability of the magnetic material in the core of the inductor device results in a substantially uniform magnetic flux density across the entire magnetic material, based on the corresponding current flow through the conductive path that generates the magnetic flux.

[0014] In a further example embodiment, the magnetic material in the core of the inductor device includes a first magnetic material and a second magnetic material. The first magnetic material is fabricated as one or more fins extending radially outward from the conductive path. The second magnetic material fills the gaps (such as wedges, fillers, etc.) between the fins in the inductor device.

[0015] In a further example embodiment, the cross-section of the inductor device, viewed along the axis of the conductive path, includes wedges of a second magnetic material disposed between portions (such as fins) of the first magnetic material. The second magnetic material has a higher permeability than the first magnetic material.

[0016] In yet another example embodiment, a first radius around the axis of the conductive path intersects at different angular locations a first magnetic material (such as a fin) and a second magnetic material (such as a wedge between fins) in the core; the second magnetic material has a higher permeability than the first magnetic material.

[0017] In one embodiment, the inductor device includes a first flux path at a first radius relative to the axis of the conductive path. The first flux path alternates between passing through a first magnetic material in the core and through a second magnetic material. As previously described, the second magnetic material has a higher permeability than the first magnetic material. The inductor device also includes a second flux path at a second radius relative to the axis of the conductive path. The second radius is larger than the first radius. The second flux path alternates between passing through the first magnetic material in the core and through the second magnetic material. The second flux path has a higher ratio of second to first magnetic material than the first flux path. The ratio of flux through the second magnetic material to flux through the first magnetic material increases with a larger radius relative to the circuit path.

[0018] The inductor devices described herein offer advantages and are more useful than conventional inductor devices. For example, the inductor devices discussed herein are easy to manufacture and support higher inductance values ​​for conventional inductor components of the same size.

[0019] These and other more specific embodiments are disclosed in more detail below.

[0020] Note that any resources implemented in the systems discussed herein (such as a manufacturer) may include one or more computerized devices, manufacturing equipment, material processors, controllers, mobile communication devices, handheld or laptop computers, etc., to perform and / or support any or all of the methods disclosed herein. In other words, one or more computerized devices or processors may be programmed and / or configured to operate as explained herein to perform the different embodiments described herein.

[0021] Other embodiments described herein include software programs for performing the steps and operations summarized above and disclosed in detail below. One such embodiment includes a computer program product comprising a non-transitory computer-readable storage medium (i.e., any computer-readable hardware storage medium) on which software instructions are encoded for subsequent execution. When executed in a computerized device (hardware) having a processor, the instructions program and / or cause the processor (hardware) to perform the operations disclosed herein. Such arrangements are typically provided as software, code, instructions, and / or other data (e.g., data structures) arranged or encoded on a non-transitory computer-readable storage medium such as an optical medium (e.g., CD-ROM), floppy disk, hard disk, memory stick, memory device, etc., or other media (such as firmware in one or more ROMs, RAMs, PROMs, etc.) or as an application-specific integrated circuit (ASIC). Software or firmware, or other such configurations, may be installed on a computerized device to cause the computerized device to perform the techniques explained herein.

[0022] Therefore, the embodiments herein are directed to methods, systems, computer program products, etc., that support the operations discussed herein.

[0023] One embodiment includes a manufacturer, such as a system including a computer-readable storage medium and / or having instructions stored thereon for manufacturing an inductor device. When executed by computer processor hardware, the instructions cause the computer processor hardware (such as one or more processor devices or hardware located in the same or different locations) to: receive a magnetically conductive material; manufacture the inductor device including a conductive path and the magnetically conductive material, the conductive path extending from a first end of the inductor device through a core to a second end of the inductor device; and the core of the inductor device being manufactured to have a permeability varying according to a radial distance outward relative to the conductive path.

[0024] For clarity, the order of the steps above has been added. Note that any processing steps discussed herein can be performed in any suitable order.

[0025] Other embodiments of this disclosure include software programs and / or corresponding hardware to perform the steps and operations of any of the method embodiments summarized above and disclosed in detail below.

[0026] It should be understood that, as discussed herein, systems, methods, apparatuses, instructions, etc., on computer-readable storage media may also be strictly embodied as software programs, firmware, software, hardware and / or a mixture of firmware, or as hardware alone, such as within a processor (hardware or software), within an operating system, or within a software application.

[0027] It should be noted further that while the embodiments discussed herein are applicable to switched power supplies, the concepts disclosed herein can be advantageously applied to any other suitable topology.

[0028] Additionally, it should be noted that although each of the different features, techniques, configurations, etc., described herein may be discussed in different places within this disclosure, each concept may optionally be implemented independently of each other or in combination of each other where appropriate. Therefore, one or more of the inventions described herein can be embodied and observed in many different ways.

[0029] Furthermore, please note that the preliminary discussion of the embodiments herein (Summary of the Invention) is intentionally not intended to specify every aspect of the novelty of this disclosure or the claimed invention, and / or every incremental aspect thereof. Rather, this brief description presents only general embodiments and corresponding points of novelty relative to conventional techniques. For additional details and / or possible perspectives (arrangements) of the invention, the reader should refer to the detailed description section of this disclosure (which is a summary of the embodiments) and the corresponding drawings, which are discussed further below. Attached Figure Description

[0030] Figure 1 This is an exemplary three-dimensional (perspective) view of an inductor device according to embodiments of this article.

[0031] Figure 2 This is an example diagram illustrating a top view (cross-sectional view) of an inductor device and its corresponding magnetic flux density.

[0032] Figure 3 This is an example diagram illustrating the relationship between permeability and DC magnitude field.

[0033] Figure 4 This is an example diagram illustrating a top view (cross-sectional view) of an inductor device according to embodiments of this document and an example diagram showing the variation of magnetic flux density at different radial distances relative to the conductive path.

[0034] Figure 5A This is an example diagram illustrating the relationship between the permeability of the first material and the magnetization intensity according to an embodiment of this document.

[0035] Figure 5B This is an example diagram illustrating the relationship between the permeability of the second material and the magnetization intensity according to embodiments of this document.

[0036] Figure 6A This is an example 3-D diagram of an inductor device according to an embodiment of this article.

[0037] Figure 6B This is an example top view of an inductor device according to embodiments of this article.

[0038] Figure 7AThis is an example diagram illustrating an inductor device comprising multiple concentric layers of different magnetic materials and a flux path through the layers carrying corresponding flux, according to embodiments of this document.

[0039] Figure 7B This is an example diagram illustrating the variation of the permeability of a core relative to the distance from a conductive path according to an embodiment of this article.

[0040] Figure 8 This is an exemplary three-dimensional view of an inductor device according to embodiments of this document.

[0041] Figure 9 This is an example top view illustrating an inductor device made of various types of magnetically conductive materials and flux flow according to embodiments of this document.

[0042] Figure 10A This is an example top view illustrating an inductor device made of various types of magnetically conductive materials according to embodiments of this document and flux flow in the corresponding flux paths.

[0043] Figure 10B This is an example diagram illustrating the variation of permeability with respect to radius in an inductor device according to embodiments of this article.

[0044] Figure 11 These are example diagrams illustrating a top view (cross-sectional view) of a first implementation of an inductor device according to embodiments of the present invention and example diagrams indicating the variation of magnetic flux density at different radial distances relative to the conductive path.

[0045] Figure 12 These are example diagrams illustrating a top view (cross-sectional view) of a first implementation of an inductor device according to embodiments of the present invention and example diagrams indicating the variation of magnetic flux density at different radial distances relative to the conductive path.

[0046] Figure 13 These are example diagrams illustrating a top view (cross-sectional view) of a first implementation of an inductor device according to embodiments of the present invention and example diagrams indicating the variation of magnetic flux density at different radial distances relative to the conductive path.

[0047] Figure 14 These are example diagrams illustrating a top view (cross-sectional view) of a first implementation of an inductor device according to embodiments of the present invention and example diagrams indicating the variation of magnetic flux density at different radial distances relative to the conductive path.

[0048] Figure 15 This is an example diagram illustrating the connection of circuit components in a power supply including one or more inductor devices according to embodiments of this document.

[0049] Figure 16 The illustration shows a multiphase power supply (in) according to an embodiment of this document. Figure 15 (middle) and an example side view of an inductor device that supports vertical power flow.

[0050] Figure 17 This is an example diagram illustrating a power supply circuit assembly including one or more inductor devices according to embodiments of this document.

[0051] Figure 18 This is an example diagram illustrating a power supply circuit assembly including one or more inductor devices according to embodiments of this document.

[0052] Figure 19 This is an example diagram illustrating a power supply circuit assembly including one or more inductor devices according to embodiments of this document.

[0053] Figure 20 This is an example diagram illustrating an example computer architecture (manufacturing system, hardware, etc.) operable to perform one or more methods according to embodiments of this article.

[0054] Figure 21 This is an example diagram illustrating a method according to an embodiment of the present article.

[0055] The foregoing and other objects, features, and advantages of the embodiments described herein will become apparent from the more specific description that follows, as illustrated in the accompanying drawings, in which the same reference numerals refer to the same parts in different views. The drawings are not necessarily drawn to scale, but rather to emphasize illustrative embodiments, principles, concepts, etc. Detailed Implementation

[0056] Now refer to the attached diagram, Figure 1 This is an example three-dimensional (perspective) view of an inductor device according to embodiments of this article.

[0057] In this example embodiment, the manufacturer 150 receives materials such as metals (conductive materials), metal alloys, first magnetic materials, second magnetic materials, etc.

[0058] Based on the received materials, the fabricator 150 fabricates the inductor device 110 to include a conductive path 131 and a core 120, the core 120 including a magnetically conductive material, such as magnetically conductive material 141 and magnetically conductive material 142. The conductive path 131 extends from a first end 120-1 of the inductor device 110 to a second end 120-2 of the inductor device 110 through the core 120 of the inductor device 110.

[0059] In one embodiment, as further discussed herein, the fabricator 150 fabricates the core 120 (material outside the conductive path 131) of the inductor device 110 to have a permeability that varies according to the radial distance outward relative to the conductive path 131.

[0060] More specifically, Figure 1 The inductor device 110 includes a core 120, such as a magnetically conductive material (MPM) 141 and a magnetically conductive material 142. A conductive path 131 is disposed on an axis 170 and extends between a first axis toward end 120-1 and a second axis toward end 120-2 of the inductor device 110. A core material such as the magnetically conductive material 141 surrounds the conductive path 131. A core material such as the magnetically conductive material 142 surrounds the magnetically conductive material 141. The core 120 includes any number of different layers of magnetically conductive material.

[0061] As needed, the conductive path 131 is surrounded by an insulating material layer (such as a non-conductive material so as not to contact the core material 120). In other words, the conductive path 131 may optionally be coated with an insulating material layer, which is disposed between the conductive path 131 and the magnetic material 141.

[0062] The presence of magnetic materials 141 and 142 transforms the conductive path 131 into an inductive path (also referred to as inductor device 110). For example, current flowing through the conductive path 131 (inductive path) results in a corresponding magnetic flux 199 generated according to the right-hand rule.

[0063] As their names suggest, the magnetically conductive materials 141 and 142 surrounding the conductive path 131 are magnetically conductive. The magnetically conductive materials can be made of any suitable material. In one embodiment, by way of a non-limiting example, the core material 120 has a flux permeability between 25 and 60 Henry / meter or any other suitable value.

[0064] In another embodiment, the inductor device 110 is manufactured by the fabricator 150 as described herein, such that the core material through which the conductive path 131 passes (two or more different magnetic materials, such as magnetic material 141, magnetic material 142, etc.) does not include any air gaps or voids that are not filled with magnetic material.

[0065] Alternatively, further note that embodiments herein include including one or more air gaps in the core of the inductor device 110. For example, embodiments herein include fabricating a core region disposed outside (or outside) the conductive path 131 to include any one of one or more different types of magnetically conductive materials as discussed herein and any number of one or more air gaps having any suitable size.

[0066] In another embodiment, the conductive path 131 is made of any suitable conductive material, such as metal, metal alloy (a combination of multiple different metals), etc.

[0067] Further note that the conductive path 131 can be manufactured in any suitable shape, such as rod-shaped, column-shaped, etc. In one embodiment, the conductive path is a non-winding circuit path 170 extending along axis 170 through the inductor device 110. Note that the inductor device can be manufactured in a cylindrical or any other suitable shape.

[0068] Therefore, embodiments of this document include a novel inductor device 110 comprising a core 120 made of two or more different types of magnetically conductive materials, such as magnetically conductive material 141, magnetically conductive material 142, etc.

[0069] Inductor device 110 includes a conductive path 131 extending through a magnetic core. As shown and further discussed herein, the permeability of the core 120 of inductor device 110 varies in magnitude with respect to the distance relative to the conductive path 131.

[0070] For example, in one embodiment, the core of the inductor device 110 includes a plurality of concentric material layers (such as magnetic material 141 and magnetic material 142) relative to the conductive path 131. The plurality of concentric material layers surrounding the conductive path 131 includes a first concentric magnetic material layer 141 and a second concentric magnetic material layer 142. In one embodiment, the second concentric magnetic material layer 142 has a higher permeability than the first concentric magnetic material layer 141. The first concentric magnetic material layer is disposed between the conductive path 131 and the second concentric magnetic material layer 142.

[0071] In a further example embodiment, the core of inductor device 110 limits the magnetic flux 199 generated by the current 105 flowing from the second end 120-2 through the conductive path 131 to the first end 120-1 according to the right-hand rule as described above. Similarly, the values ​​of the magnetic materials 141 and 142 can be any suitable values. In one embodiment, the permeability of the magnetic material in the core 120 of the inductor device varies between 30 and 150 Henry / meter, but the permeability of materials 141 and 142 can be any suitable values.

[0072] Figure 2 This is a top view (cross-sectional view) of a conventional inductor device and an example diagram showing the corresponding magnetic flux density.

[0073] As shown in the figure, an example of inductor device 210 includes a conductive path 231 (such as being made of one or more metals), which is surrounded by a homogeneous core 120 such as a magnetically permeable material 241 (a homogeneous material having a single magnetic permeability). The magnetic permeability of inductor device 210 is the same between radius C and radius A because inductor device 210 is made of a single selected magnetically permeable material.

[0074] Please note that the vertical current voltage regulator module (VRM) of next-generation CPUs (e.g., advanced AI processors) is designed to support features such as fast load jump response and high current capability (up to 100A per phase). To meet these requirements, it is desirable for inductor devices to have inductance ranging from 20nH (nano-henry) to 60nH and high saturation flux density B. sat Furthermore, such inductor devices must be compact enough to meet typically stringent size requirements, fitting within a small area allocated to the VRM itself, close to or below the CPU. Finally, due to their proximity to the CPU, it is good practice in some cases to avoid any air gaps to minimize or reduce EMI (electromagnetic interference).

[0075] The combination of desired inductance, rated current, available board space, maximum size, and the absence of any air gap determines the appropriate core material used in the corresponding inductor devices discussed herein. According to the foregoing requirements, in one embodiment, a suitable class of materials for such applications is so-called "soft-saturated" low-permeability materials (magnetic materials), typically comprising metal or alloy powders. The initial permeability μ of these materials... i In the range of 40 to 120, the saturation flux B sat >1T.

[0076] One advantage of such materials is their soft saturation behavior, meaning that when the current approaches the saturation level, the inductance value does not suddenly drop to 0H, but rather acts as... Figure 3 The example in the text shows a slow decrease in the relative μ versus Hdc curve described for one of these materials. More specifically, Figure 3 The diagram illustrates that the permeability decreases slowly when the DC magnetic field is increased, i.e., when the current is increased.

[0077] Refer again Figure 2 Unlike a standard inductor, the magnetic flux density B in inductor device 210 is not constant across the cross-section of the core of inductor device 210 between radius C and radius A. For example, Figure 2 The magnetic flux density in device 210 is radially distributed according to the well-known formula for the magnetic field generated by current flowing into a vertical conductor:

[0078]

[0079] B = μ r μ0H

[0080] Where μ r μ is the permeability of the material, and μ0 is the permeability of vacuum.

[0081] In this example, considering the expected maximum magnetic flux density B of approximately 500 mT maxA specific permeability value is given (based on the corresponding DC magnetic field and Figure 3 (The curve in the figure). However, the magnetic flux density drops rapidly to <400mT and is not effectively utilized.

[0082] Such an area (the volume between radius C and radius A) is not effectively used for having, for example, Figure 2 The reason for the uniform permeability of the inductor device 210 shown can be seen by referring to the following formula B = μ r To explain using μ0H: A core area with a flux density B lower than required means that within such an area, the permeability of the material can be higher, resulting in a higher inductance value while maintaining the same physical dimensions. In other words: the permeability of inductor device 110-1 is selected based on the peak flux, which only occurs very close to the center (conductive path 231), and is not optimal for the outer portions of the core (such as the portion of the core magnetic material 210 between radius B and radius A).

[0083] To achieve better core (magnetic material 241) area utilization, embodiments described herein (as discussed in the following figures and corresponding descriptive text) include making the magnetic flux distribution substantially equal over the entire core radius between radius C and radius A, or, as further discussed herein, at least substantially making the magnetic flux density curve 255 in graph 260 flat.

[0084] Figure 4 This is an example diagram illustrating a top view (cross-sectional view) of an inductor device according to embodiments of the present invention and an example diagram showing the variation of magnetic flux density at different radial distances relative to the conductive path.

[0085] exist Figure 4 In this configuration, conductive path 131 is positioned between a diameter defined by radius C and radius E. As previously described, inductor device 110 comprises two concentric rings (layers) of core material, wherein the outer layer (magnetic material 142 between A and B) is made of a material having a higher permeability than the material between radius C and radius B; the inner layer of magnetic material 141 (between radius B and C) has a lower permeability than material 142 and is determined according to formula... It is subjected to a higher H field.

[0086] However, this solution only partially solves the problem, because, as Figure 4 As shown in graph 460, the flux distribution non-uniformity is reduced. The reason why the change in magnetic flux density from radius C to radius B decreases outward (as shown in function 461) is that as the H field further decreases from the core conductive path 131, the magnetic flux density decreases based on the distance radius r from the center point D. To compensate for the decrease in magnetic flux density, the fabricator 150 selects a magnetically permeable material 142 with higher permeability.

[0087] Therefore, in this example embodiment, the magnetic permeability of the material disposed at a greater distance from the conductive path 131 increases with the radius from the conductive path 131. In other words, in one embodiment, as the radius from the conductive path 131 increases, the magnitude of the magnetic permeability of the material farther away from the conductive path 131 increases.

[0088] Figure 5A This is an example diagram illustrating the relationship between the permeability of the first material and the magnetization intensity according to an embodiment of this document.

[0089] In one embodiment, the magnetic material 141 has a permeability 511 as shown in FIG501. However, as previously noted, it should be noted again that the permeability of the magnetic material 141 can be any suitable value.

[0090] Figure 5B This is an example diagram illustrating the relationship between the permeability of the first material and the magnetization intensity according to an embodiment of this document.

[0091] In one embodiment, the magnetic material 142 has a permeability 512 as shown in FIG502. However, as previously noted, it should be noted again that the permeability of the magnetic material 141 can be any suitable value.

[0092] As shown in the figure, the permeability of magnetic material 142 is greater than that of magnetic material 141.

[0093] Figure 6A This is an example 3-D diagram of an inductor device according to an embodiment of this article.

[0094] As described above, the conductive path 131 is surrounded by a magnetically conductive material 141. The magnetically conductive material 141 is then surrounded by a magnetically conductive material 142.

[0095] Figure 6B This is an example top view of an inductor device according to embodiments of this article.

[0096] In one embodiment, Figure 6B The simulation of inductor device 110 in the model demonstrates the increased inductance value resulting from smaller inductor components. For example, the structure of inductor device 110 offers several advantages, such as increased inductance for a significantly smaller core volume (allowing inductor device 110 to fit into a smaller space or volume) and increased magnetic flux density distribution, such as a magnetic flux density distribution exceeding 1 T (Tesla). This indicates that the peak current handling capability of this structure (inductor device 110 with variable permeability) is significantly higher than... Figure 2 Conventional inductor devices (uniform permeability).

[0097] Note that the dimensions of the two core components (such as magnetic material 141 and magnetic material 142) can be optimized based on the permeability characteristics of the two core materials and the target current level.

[0098] Note that other example embodiments include monolithic cores with radially varying permeability characteristics, wherein the magnitude of the material's permeability increases with a larger radius from the conductive path 131. In one embodiment, this is achieved by mixing two or more core materials to obtain different permeabilities (e.g., high and low permeability), such that the ratio of high to low permeability material increases from the interior of the structure (e.g., near the conductive path 131) to the exterior of the structure (away from the conductive path 131). This is in Figure 7B This is further illustrated in the text. Figure 7A Further embodiments of the multilayer inductor device 110 are shown in the figure.

[0099] Figure 7A This is an example diagram illustrating an inductor device according to embodiments of the present invention, comprising multiple concentric layers of different magnetic materials and flux paths passing through the multiple layers and carrying corresponding flux.

[0100] As previously described, in one embodiment, the permeability of the core of the inductor device 110-7 surrounding the conductive path 131 varies according to the radial distance outward from the conductive path 131 (or the center of axis 170).

[0101] More specifically, the permeability of the core material associated with inductor device 110-7 increases by a magnitude with increasing radial distance from conductive path 131.

[0102] Theoretically, inductor device 110-7 ( Figure 1 The version of the inductor device (but with more magnetic material layers) includes an infinite number of flux paths through each magnetic material layer to transmit / carry the corresponding flux generated by the current flowing through the conductive path 131.

[0103] For example, the (homogeneous) magnetic material layer 141 (between radii R1 and R2) includes multiple flux paths, including at least a concentric flux path 741 through the magnetic material 141 (theoretically, the magnetic material layer 141 includes an infinite number of flux paths to carry flux). In this exemplary embodiment, the concentric flux path 741 carries a corresponding flux 791 generated due to current flowing through the conductive path 131.

[0104] The homogeneous magnetic material layer 142 (between radii R2 and R3) includes multiple flux paths, including at least a concentric flux path 742 through the magnetic material 142. The concentric flux path 742 carries a corresponding flux 792 (facing the observer from the figure) generated by the current flowing through the conductive path 131.

[0105] The homogeneous magnetic material layer 143 (between radii R3 and R4) includes multiple flux paths, including at least a concentric flux path 743 through the magnetic material 143. The concentric flux path 743 carries the corresponding flux 793 generated due to the current flowing through the conductive path 131.

[0106] The homogeneous magnetic material layer 144 (between radii R4 and R5) includes multiple flux paths, including a concentric flux path 744 through the magnetic material 144. The concentric flux path 744 carries a corresponding flux 794 generated due to current flowing through the conductive path 131.

[0107] As previously mentioned, the inductor device 110-7 may include any number of magnetically conductive material layers.

[0108] Figure 7B This is an example diagram illustrating the variation of the permeability of an inductor device according to embodiments of this article with respect to the distance from the conductive path.

[0109] More specifically, graph 700 illustrates different ways of changing the permeability value relative to the conductive path 131 (and / or the corresponding center of the inductor device 110-7).

[0110] As shown in Figure 700 via function 781 (line), in one embodiment, the magnetic permeability of the magnetic material 141 disposed in the concentric layer between radii R1 and R2 is MP1; the magnetic permeability of the magnetic material 142 disposed in the concentric layer between R2 and R3 is MP2; the magnetic permeability of the magnetic material 143 disposed in the concentric layer between R3 and R4 is MP3, and so on.

[0111] As mentioned earlier, the permeability of the material increases with increasing distance from the conductive path 131. For example, the permeability MP2 is greater than the permeability MP1; the permeability MP3 is greater than the permeability MP2; the permeability MP4 is greater than the permeability MP3, and so on.

[0112] Other embodiments described herein include (as shown in function 782) implementing a continuous (linear) gradient that varies with the radius by an amount relative to the permeability setting of the core material associated with inductor device 110-7.

[0113] Therefore, as shown in function 782 (or function 781), the permeability of the core of inductor device 110-7 varies substantially linearly with respect to the distance from the conductive path 131. In such an embodiment, the variable permeability of the magnetic material in the core of inductor device 110-7 is based on the corresponding current flowing through the conductive path 131 that generates magnetic flux, resulting in a substantially uniform magnetic flux density across the entire magnetic material (such as materials 141, 142, 143, 144, etc.).

[0114] Figure 8 This is an example 3D diagram and flux flow of an inductor device made of various types of magnetically conductive materials according to embodiments of this document.

[0115] Other embodiments described herein include an inductor device 810 made of two or more different magnetically conductive materials.

[0116] In this exemplary embodiment, the distribution of magnetic materials 841 and 842 within the inductor device 810 creates a novel magnetic structure, allowing the permeability to gradually and continuously increase from the inner portion of the core, such as the conductive path 831, towards the outer radius of the inductor device 810. In this case, the variation in the magnetic materials of the inductor device 810 enables a more uniform flux density distribution generated by the flowing current 805. The fabrication of the inductor device 810, as discussed herein, results in higher inductance and a smaller overall volume (footprint) compared to conventional inductor devices.

[0117] In one embodiment, the higher inductance and better performance associated with inductor device 810 are achieved through... Figure 8 The core shown is optimized for magnetic permeability, which introduces a novel concept called "reverse air gap".

[0118] Note that in conventional magnetic structures, due to the relative permeability of air being 1, an air gap is sometimes introduced to reduce the permeability of the magnetic path, thereby preventing saturation and storing energy when needed. In contrast, an alternative concept is applied in the proposed inductor device 810.

[0119] For example, starting with a core made of a low-permeability material such as material 841 which is closer to the conductive path 831, gaps (such as wedges or other suitable shapes) as discussed herein are intentionally created by removing a portion of material 841, and these gaps are then filled with a magnetic material 842 which has a higher permeability than the magnetic material 841.

[0120] Triangular or wedge-shaped portions (such as magnetic materials 842-1, 842-2, 842-3, 842-4, 842-5, 842-6, 842-7, and 842-8) of the inductor device 810 are disposed between the portions of the magnetic material 841.

[0121] The gaps in the inductor device 810 are filled with a high permeability material 842 (such as the permeable material 842 located between the permeable materials 841) to ensure that the effective permeability of the overall magnetic structure of the inductor device 810 gradually increases from the inside of the core to the outside (such as the closest to the conductive path 831).

[0122] Note that the number, shape, and material of the high permeability gaps (such as magnetic material 842) can, of course, be adjusted according to the requirements of the inductor device 810 (target inductance, current rating, maximum B flux) to achieve a uniform flux distribution as discussed further herein.

[0123] It should be noted further that the embodiments described herein can be extended to standard inductors (e.g., wire-wound toroidal inductors) having one or more arbitrary shapes (e.g., rectangular and elliptical).

[0124] In this example embodiment, the manufacturer 150 receives materials such as one or more metals, metal alloys, a first magnetic material, a second magnetic material, etc.

[0125] The fabricator 150 fabricates the inductor device 810 to include a conductive path 831 and a magnetic material 841. The conductive path 831 extends from the first end 820-1 of the inductor device 810 along the axis 870 through the core of the inductor device 810 to the second end 820-2 of the inductor device 810.

[0126] In one embodiment, the fabricator 150 produces the core of the inductor device 810 as a cylinder, but other shapes are also possible. In a further example embodiment, the fabricator 150 drills a hole along the axis 870 of the cylindrical device of the magnetic material 841 and inserts a conductive path 810. The fabricator 150 removes a portion of the magnetic material 841 from the original cylinder and inserts magnetic material 842 (such as wedges) into the gaps shown. Thus, the fabricator 150 manufactures the core of the inductor device 110 to have a permeability that varies according to the radial distance outward relative to the conductive path 131.

[0127] More specifically, the presence of magnetic materials 841 and 842 transforms the conductive path 831 into an inductive path (also known as inductor device 810). For example, the flow of current 805 through the conductive path 831 (inductive path) results in the generation of a corresponding magnetic flux in a manner similar to that previously discussed.

[0128] In a further embodiment, the inductor device 810 is manufactured by the fabricator 150 as described herein, such that the core material through which the conductive path 831 passes (two or more different magnetic materials, such as magnetic material 841, magnetic material 842, etc.) does not include any air gaps or voids not filled with magnetic material.

[0129] In one embodiment, the conductive path 831 is made of any suitable conductive material, such as metal, metal alloy (a combination of multiple different metals), etc.

[0130] Note further that the conductive path 831 can be fabricated in any suitable shape, such as rod-shaped, column-shaped, etc. In one embodiment, each conductive path is a non-winding circuit path extending through the inductor device 810. Note that the inductor device 810 can be fabricated in a cylindrical or any other suitable shape.

[0131] Therefore, embodiments herein include a novel inductor device 810 comprising a core made of two or more different types of magnetically conductive materials (such as magnetically conductive material 841, magnetically conductive material 842, etc.). Inductor device 810 includes a conductive path 831 extending through the magnetically conductive core. As shown and further discussed herein, the effective permeability of the core of inductor device 810 is related to the distance (radius) relative to the conductive path 831.

[0132] The inductor device 810 shown in the figure supports one or more of the following: i) vertical electric current, ii) reduced EMI (electromagnetic interference) due to the absence of any air gap, iii) more uniform flux distribution in each of the magnetic material layers due to optimized effective permeability, and iv) higher inductance per unit volume compared to conventional inductor devices.

[0133] Figure 9 This is an example diagram and flux flow of an inductor device made of various types of magnetically conductive materials according to embodiments of this document.

[0134] This embodiment illustrates the interleaving of different magnetic materials in inductor device 810 to provide improved performance. Figure 9 The inductor device 810 is observed along axis 870.

[0135] As previously described, the fabricator 150 removes a portion of the original magnetic material 841 to produce fins 841-1, 841-2, 841-3, 841-4, 841-5, 841-6, 841-7, and 841-8. The fabricator 150 uses material 842 to fill the spaces / volumes between the fins to produce wedges (such as magnetic materials 842-1, 842-2, 842-3, 842-4, 842-5, 842-6, 842-7, and 842-8).

[0136] Therefore, in one embodiment, the magnetic material in the core of the inductor device 810 includes alternating instances of a first magnetic material 841 and a second magnetic material 842 along a concentric path. The first magnetic material 841 is fabricated as one or more fins extending radially outward from the conductive path 810. The second magnetic material 842 fills the gaps between the fins to create a wedge shape.

[0137] in this case, Figure 9 When viewed along the axis 870 of the conductive path 810, the cross-section of the inductor device 810 includes a wedge-shaped portion of the second magnetic material 842 disposed between the portions of the first magnetic material 841.

[0138] More specifically, magnetic material 842-1 is disposed between magnetic material 841-8 and magnetic material 841-1; magnetic material 842-2 is disposed between magnetic material 841-1 and magnetic material 841-2; magnetic material 842-3 is disposed between magnetic material 841-2 and magnetic material 841-3, etc.

[0139] As mentioned earlier, the second magnetic material has a higher permeability than the first magnetic material.

[0140] Therefore, in yet another example embodiment, the first radius R1 around the axis 870 of the conductive path 831 intersects only the first magnetic material 841 in the core of the inductor device 810 at the different angular positions shown. However, the second radius R2 around the axis 870 of the conductive path 831 intersects the first magnetic material 841 and the second magnetic material 842 in the core at different angular positions. This is in Figure 10A This is further illustrated in the text.

[0141] Figure 10A This is an example diagram illustrating an inductor device made of various types of magnetically conductive materials according to embodiments of this document, and the magnetic flux flow in the corresponding flux path.

[0142] In this example embodiment, the inductor device 810 includes multiple flux paths to transmit corresponding fluxes between radii R11 and R12 via different magnetically conductive materials 841 and / or 842. Current 805 through conductive path 831 generates corresponding fluxes 891, 892, 893, 894, etc.

[0143] More specifically, the inductor device 810 includes a flux path 861 at a radius R21 relative to the axis 870 of the conductive path 831. The flux path 861 transmits a corresponding flux 891 only through the magnetic material 841.

[0144] The inductor device 810 includes a flux path 862 at a radius R22 relative to the axis 870 of the conductive path 831. As shown, the flux path 862 transmits a corresponding flux 892 through the alternating presence of magnetic material 841 and magnetic material 842.

[0145] The inductor device includes a flux path 863 at a radius R23 relative to the axis 870 of the conductive path 831. As shown, the flux path 863 transmits a corresponding flux 893 through the alternating presence of magnetic materials 841 and 842.

[0146] The inductor device includes a flux path 864 at a radius R24 relative to the axis 870 of the conductive path 831. As shown, the flux path 864 transmits a corresponding flux 894 through the alternating presence of magnetic materials 841 and 842.

[0147] Therefore, certain flux paths (such as 862, 863, 864) alternate between passing through a first magnetic material 841 in the core of the inductor device 810 and passing through a second magnetic material 842. As previously mentioned, the second magnetic material 842 has a higher permeability than the first magnetic material 841.

[0148] like Figure 10A As shown, compared to the corresponding internal flux paths, the flux paths starting from axis 870, each with a larger radius, have a higher ratio of the second magnetic material 842 to the first magnetic material 841.

[0149] For example, along its circumference, flux 892 and the corresponding flux path 862 result in a first ratio (based on path length) of the second magnetic material 842 to the first magnetic material 841. Flux 893 and the corresponding flux path 863 result in a second ratio (based on path length) of the second magnetic material 842 to the first magnetic material 841. Flux 894 and the corresponding flux path 864 result in a third ratio (based on path length) of the second magnetic material 842 to the first magnetic material 841.

[0150] The third ratio is greater than the second ratio; the second ratio is greater than the first ratio. Therefore, at different radii from the axis 870, the effective magnetic permeability of the material (based on the flux through the magnetic materials 841 and 842) increases with increasing radius.

[0151] Figure 1000 illustrates the effective permeability of different flux paths through different magnetic materials in inductor device 810. For example, assume the permeability of magnetic material 841 is MP1, and the permeability of magnetic material 842 is MP2, where MP2 is greater than MP1. The radius R11 of inductor device 810 has a permeability of MP1. As shown in function 1082, the permeability of the core increases linearly with the magnitude of the radius (from R11 to R12).

[0152] Therefore, the increased magnetic material away from the conductive path 831 results in a more uniform distribution of flux throughout the core material, and an increased inductance as further shown below.

[0153] Figure 11 This is a top view (cross-sectional view) of a first implementation of an inductor device according to embodiments of the present invention and an example diagram showing the variation of magnetic flux density at different radial distances relative to the conductive path.

[0154] In one embodiment, the manufacturer 150 manufactures the inductor device 810 to have the following properties:

[0155] Magnetic material 841 has a permeability of μ: 52;

[0156] μ-pair Hdc curve in Figure 3 Depicted in the middle;

[0157] High permeability gaps, such as those made of magnetically conductive material 842, are manufactured using (standard ferrite): μ = 500 (constant wrt Hdc);

[0158] Core height from the first end 820-1 to the second end 820-2: 3.1 mm;

[0159] Core diameters A to G: 6.5mm;

[0160] The diameter of the central copper rod (conductive path 831) is 1.7 mm.

[0161] Current 805: 48 amps DC.

[0162] The obtained flux distributions (magnetic flux density 1101 and magnetic flux density 1201) are in Figure 11 The middle is for axis 971 and in Figure 12The figure is shown with respect to axis 972. As previously described, and also as plotted by function 1101 in Figure 1100 and function 1201 in Figure 1200 (e.g., between levels 1221 and 1222), the permeability and flux distribution above the core have now been significantly equalized (e.g., between levels 1121 and 1122).

[0163] Therefore, as mentioned earlier, the permeability of the inductor device 810 gradually increases with the core radius, and this is a result of the formation of high permeability gaps (842-1, 842-2, 842-3, etc.). The flux density distribution is now pushed up and significantly flattened, as... Figure 11 As shown, it is balanced to ≈350mT (e.g. Figure 11 As shown, it lies between levels 1121 and 1122, and as... Figure 12 (As shown between levels 1221 and 1222). Since the inductance of inductor device 810 is directly proportional to its permeability, pushing and equalizing the magnetic flux density in the outer region (between A and C) of the core of inductor device 810 results in an increase in the inductance associated with inductor device 810-1 compared to an inductor device made of only a single magnetic material.

[0164] Note that the benefits of flux equalization can be used not only to increase inductance (while maintaining the same size), but also to reduce core size.

[0165] Reducing, for example, the height of the core (such as between the first end 820-1 and the second end 820-2) results in a decrease in the core cross-sectional area, and thus an increase in the core reluctance. However, based on the flux balance achieved by the novel use of multiple different magnetically permeable materials to fabricate the inductor device 810, the increase in core reluctance is now compensated by an increase in effective permeability according to the following formula:

[0166]

[0167] Where lm is the magnetic path length (unchanged), Acore is the core area (decreased), and μeff is the effective permeability (increased). See also Figure 13 and Figure 14 The results are used to reduce the size of inductor devices.

[0168] Therefore, the inductor devices described herein offer advantages and are superior to conventional inductor devices. For example, the inductance provided by each conductive path (inductance path) in the inductor devices described herein can be easily controlled based on parameters such as: i) the distance between the first end and the second end of the inductor device, ii) the permeability of the different magnetic materials used to manufacture the core, iii) the increase in overall inductance of smaller-sized components, etc.

[0169] Figure 13 This is a top view (cross-sectional view) of a first implementation of an inductor device according to embodiments of the present invention and an example diagram showing the variation of magnetic flux density at different radial distances relative to the conductive path.

[0170] In this example embodiment, it is assumed that the height of inductor device 810-2 is approximately 30% smaller (i.e., 2.2 mm instead of 3.1 mm), and the same diameter of inductor device 810-1 is also smaller. Figure 11 The same low-permeability material and the same current excitation were used to generate curves 1300 and 1400.

[0171] In a non-limiting example embodiment, the manufacturer 150 manufactures the inductor device 810-2 to have the following characteristics:

[0172] - Low permeability core of magnetic material 841: μ: 52;

[0173] -like Figure 2 The plotted μ-Hdc curve;

[0174] - High permeability gap (standard ferrite): The permeability of the magnetic material 842 is μ = 500 (a constant permeability value relative to Hdc);

[0175] Core height: 2.2mm;

[0176] - Core diameter: 6.5mm;

[0177] - Central copper rod diameter: 1.7mm;

[0178] - Current 805:48Adc.

[0179] The flux equalization associated with this example of inductor device 810-2 enables the effective permeability to be as Figure 13 (Curve 1300 and function 1301 indicate the magnetic flux density along axis 971 based on the above conditions) and Figure 14 (Curves 1400 and function 1401, based on the conditions described above, indicate the magnetic flux density along axis 972.) This increases as shown, allowing the corresponding fabricator to maintain the same inductance value (30% higher relative to a core made only of a low-permeability material), but with a reduced core height. As previously described, and also as plotted by function 1301 in curve 1300 and function 1401 in curve 1400 (e.g., between levels 1421 and 1422), the magnetic flux density above the core 120 is now significantly equalized (e.g., between levels 1321 and 1322) via the novel core 120.

[0180] Figure 15 This is an example diagram illustrating the connectivity of circuit components in a power supply according to an embodiment of this document.

[0181] In this non-limiting example embodiment, the power supply 1500 includes a controller 1540 and multiple phases 221 and 222 that collectively generate a corresponding output voltage 123 (output current) to the electrical load 118. The load 118 can be any suitable circuitry, such as a CPU (Central Processing Unit), GPU, and ASIC (such as including one or more artificial intelligence accelerators), which can be located on a separate circuit board.

[0182] Note that the power supply 1500 may include any number of phases. As needed, the phases may be divided such that the first phase 221 supplies power to a first load, and the second phase 222 supplies power to a second load. Alternatively, a combination of phases 221 and 222 may drive the same load 118.

[0183] As shown in the example embodiment where a combination of phases 221 and 222 is used to power the same load 118, phase 221 includes switches QA1 and QB1 and an inductor path 1531 (such as inductor device 110, inductor device 810, etc.). Phase 222 includes switches QA2 and QB2 and an inductor path 1532.

[0184] Furthermore, in this example embodiment, voltage source 120-1 provides voltage V1 (such as 6VDC or any suitable voltage) to a series combination of switch QA1 (such as a high-side switch) and switch QB1 (such as a low-side switch).

[0185] In one embodiment, the combination of switches QA1 and QB1 and inductor path 1531 (such as an inductor implemented via inductor device 110, inductor device 810, etc.) operate according to the buck converter topology to generate output voltage 123.

[0186] Furthermore, in this example embodiment, note that the drain node (D) of switch QA1 is connected to receive the voltage V1 provided by voltage source 120-1. The source node (S) of switch QA1 is coupled to the drain node (D) of switch QB1 and the input node of inductor path 1531. The source node of switch QB1 is coupled to ground. The output node of inductor path 1531 is coupled to load 118.

[0187] Further in this example embodiment, the drain node of switch QA2 in phase 222 is connected to receive voltage V1 provided by voltage source 120-1. The source node (S) of switch QA2 is coupled to the drain node (D) of switch QB2 and the input node of inductor path 1532 (such as an inductor implemented via inductor device 110, inductor device 810, etc.). The source node of switch QB2 is coupled to ground. The output node of inductor path 1532 is coupled to load 118.

[0188] As previously stated, the combination of phases 221 and 222 produces an output voltage 123 that supplies power to load 118. That is, inductor path 1531 produces output voltage 123; inductor path 1532 produces output voltage 123.

[0189] As shown in the figure, during operation, the controller 1540 generates control signals 105 (such as control signal A1 and control signal B1) to control the state of the corresponding switches QA1 and QB1. For example, control signal A1 generated by the controller 1540 drives and controls the gate node of switch QA1; control signal B1 generated by the controller 1540 drives and controls the gate node of switch QB1.

[0190] Additionally, controller 1540 generates control signals A2 and B2 to control the states of switches QA2 and QB2. For example, control signal A2 generated by controller 1540 drives and controls the gate node of switch QA2; control signal B2 generated by controller 1540 drives and controls the gate node of switch QB2.

[0191] In one embodiment, controller 1540 controls phases 221 and 222 to be 180 degrees out of phase with respect to each other.

[0192] As is known with buck converters, in phase 221, when switch QB1 is deactivated (off), activating high-side switch QA1 to the ON state couples the input voltage V1 to the input of inductor path 1531, resulting in an increase (such as a ramp) in the amount of current supplied to load 118 by inductor path 1531. Conversely, when switch QA1 is deactivated (off), activating low-side switch QB1 to the ON state couples the ground reference voltage to the input of inductor path 1531, resulting in a decrease (such as a ramp) in the amount of current supplied to load 118 by inductor path 1531. Controller 1540 monitors the magnitude of output voltage 123 and controls switches QA1 and QB1 such that output voltage 123 is maintained within a desired voltage range.

[0193] Similarly, via phase 222, when switch QB2 is deactivated (off), activating high-side switch QA2 to the ON state couples the input voltage V1 to the input of inductor path 1532, resulting in an increase in the amount of current supplied to load 118 by inductor path 1532. Conversely, when switch QA2 is deactivated (off), activating low-side switch QB2 to the ON state couples the ground reference voltage to the input of inductor path 1532, resulting in a decrease in the amount of current supplied to load 118 by inductor path 1532. Controller 1540 monitors the magnitude of output voltage 123 and controls switches QA2 and QB2 to maintain output voltage 123 within the desired voltage range.

[0194] Figure 16 The illustration shows an instance of a vertically stacked object according to an embodiment of this document. Figure 15 An example side view of a multiphase power supply.

[0195] The instantiation of power supply 1500 in this example embodiment supports vertical power flow. For example, substrate 1505 and one or more corresponding power sources (such as V1) supply power to power stack assembly 1600, which in turn supplies power to dynamic load 118. A ground reference (GND) provided by power stack assembly 1600 provides a return path for reference voltage and current to be delivered through the stack to load 118.

[0196] In one embodiment, substrate 1505 is a circuit board (such as a stand-alone board, a motherboard, a stand-alone board designed to be coupled to a motherboard, etc.). A power stack assembly 1600, including one or more inductor devices, is coupled to substrate 1505. As previously described, load 118 can be any suitable circuit that can be located on a stand-alone circuit board, such as a CPU (Central Processing Unit), GPU, and ASIC (such as including one or more artificial intelligence accelerators).

[0197] Note that the inductor paths 1531, 1532, etc., in the power stack assembly 1600 (instantiations of any inductor devices 110, 810, etc., discussed herein) can be instantiated in any suitable manner as described herein. In this non-limiting example embodiment, the power stack assembly 1600 includes one or more instances of any inductor devices 110, 810, etc., discussed herein. Therefore, the power stack assembly 1600 can be configured to include any inductor devices as described herein.

[0198] Furthermore, in this example embodiment, the manufacturer 150 manufactures a power stack assembly 1600 (such as a DC-DC power converter) by stacking multiple components, including a first power interface 1601, one or more switches in a switch layer 1610, a connection layer 1620, one or more inductor assemblies (such as including one or more inductor devices), and a second power interface 1602.

[0199] The fabricator 150 further positions a first power interface 1601 at the base of the stack (power assembly 1600 of the component). The base of the power stack assembly 1600 (such as the power interface 1601) couples the power stack assembly 1600 to the substrate 1505.

[0200] In one embodiment, the manufacturer 150 places capacitors 1521 and 1522 in a layer of a power stack assembly 1600 including a power interface 1601.

[0201] Furthermore, when manufacturing the power stack assembly 1600, the manufacturer 150 electrically couples multiple switches (such as switches QA1, QB1, QA2, and QB2) in the power stack assembly 1600 to a first power interface 1601. The first power interface 1601 and its corresponding connection to the substrate 1505 enable switches QA1, QB1, QA2, and QB2 to receive power inputs such as input voltage V1 and GND reference voltage from the substrate 1505. One or more traces, power layers, etc., on the substrate 1505 provide or transmit voltage from a voltage (or power) source to the power interface 1601 of the power stack assembly 1600.

[0202] As previously described, controller 1540 generates control signal 105 to control corresponding switches QA1, QB1, QA2, and QB2 in power stack assembly 1600 (see above). Figure 15 (Interconnection). The manufacturer 150 provides a connection between the controller 1540 and the switches QA1, QB1, QA2 and QB2 in any suitable manner to transmit the corresponding signals 105.

[0203] On top of the switches in the switch layer 1610, the fabricator 150 further fabricates the power stack assembly 1600 to include one or more inductor devices as described herein. Additionally, via the connection layer 1620, the fabricator 150 further connects switches QA1, QB1, QA2, and QB2 to one or more inductor devices 1531, 1532, etc.

[0204] More specifically, in this example embodiment, the manufacturer 150 connects the source node (S) of switch QB1 to a ground reference node 1510-1 in the power interface 1601. Note that the ground reference node 1510-1 (such as a ground reference return path connected to dynamic load 118) extends from the substrate 1505 to dynamic load 118 via an L-shaped ground node 1510-1 (connected to a ground voltage reference). The manufacturer 150 connects the drain node (D) of switch QB1 to node 1621 (such as being made of metal), which is electrically connected to a first end 141 of inductive path 1531 (such as an instantiation of conductive paths 131, 831). Thus, via connection layer 1620, the manufacturer 150 connects the drain node of switch QB1 to multiple paths 1531.

[0205] Fabricator 150 connects the drain node (D) of switch QA1 to the voltage source node 1520 of the first power interface 1601 (which is electrically connected to the input voltage V1). Fabricator 150 connects the source node (S) of switch QA1 to node 1621, which is electrically connected to the first end 141 of a plurality of paths 1531 (such as an example of conductive path 131 or conductive path 831), as previously described. Thus, via connection layer 1620 and the corresponding node 1621, the source node of switch QA1 is connected to the inductor path 1531 of inductor device 110.

[0206] As further shown, fabricator 150 connects the source node (S) of switch QB2 to a ground reference node 1510-2 in power interface 1601. Ground reference node 1510-2 (current return path) extends from substrate 1505 to dynamic load 118 via an L-shaped ground reference node 1510-2 (connected to a ground voltage reference). Fabricator 150 connects the drain node (D) of switch QB2 to node 1622 (e.g., made of metal), which is electrically connected to the first end 141 of inductor path 1532 (e.g., an instance of conductive path 131 or conductive path 831). Thus, via connection layer 1620, the drain node of switch QB2 is connected to the inductor path 1532 of inductor device 110.

[0207] Note that although each of nodes 1510-1 and 1510-2 appears L-shaped from the side view of the power stack assembly 1600, in one embodiment, node 1510 extends circumferentially around the outer surface of the power stack assembly 1600 (in a manner similar to the conductive path 133 discussed earlier).

[0208] As further shown, the fabricator 150 connects the drain node (D) of switch QA2 to the voltage source node 1520 in the power interface 1601 (which is connected to voltage V1). The fabricator 150 connects the source node (S) of switch QA2 to node 1622, which is electrically connected to the first axial end 141 of a plurality of paths 1532 (an example of conductive path 131 or conductive path 831). Thus, via the connection layer 1620 and the corresponding node 1622, the source node of switch QA2 is connected to a plurality of paths 1532 (such as inductor device 110, inductor device 810, etc.).

[0209] Therefore, the manufacturer 150 provides one or more switches (such as QA1, QB1, QA2 and QB2) in the power stack assembly 1600 between the first power interface 1601 and the inductor device 110.

[0210] In a non-limiting example embodiment, each of one or more switches QA1, QB1, QA2, and QB2 in the power stack assembly 1600 is a vertical field-effect transistor (VFET) disposed between the first power interface 1601 and the inductor device. However, additionally or alternatively, note that one or more switches QA1, QB1, QA2, and QB2 can be any suitable type of switch, such as a vertical or lateral VFET, a bipolar junction transistor (BJT), etc. Lateral VFETs are also possible, but vertical VFETs are ideal for this concept because the flip-chip approach minimizes current loops.

[0211] As previously described, the manufacturer 150 manufactures the power stack assembly 1600 to include one or more inductor devices. In this example embodiment, the manufacturer 150 provides a plurality of inductor paths 1531 and 1532 in the power stack assembly 1600 between a plurality of switches QA1, QB1, QA2, and QB2 and the second power interface 1602.

[0212] According to a further embodiment, note that manufacturing multiple inductor paths 1531 and 1532 includes: manufacturing multiple inductor paths including a first inductor path 1531 and a second inductor path 1532, the first inductor path 1531 and the second inductor path 1532 extending through the core material 120 of the respective inductor device 110 between the connection layer 1620 and the power interface 1602. In one embodiment, the manufacturer 150 manufactures each inductor device 1510 to include: i) a core material 120, the core material being a magnetically conductive ferromagnetic material, and ii) a conductive path extending through the core material 120 from a first axis toward end 141 of the inductor device 110 to a second axis toward end 142 of the inductor device 110.

[0213] Furthermore, in this example embodiment, the first inductor path 1531 is disposed in the first phase 221 of the power stack assembly 1600 (power converter circuit). Figure 15 In the power supply stack assembly 1600 (power converter circuit), the second inductor path 1532 is located in the second phase 222. Figure 15 In the power converter (power stack assembly 1600), during operation, the combination of the first phase 221 and the second phase 222, which are configured in parallel, generates the output voltage 123. If necessary, a controller 1540 may also be manufactured into the power stack assembly 1600.

[0214] In one embodiment, each of the one or more inductor paths 1531 and 1532 is a corresponding non-winding path extending from a first layer (such as switch layer 1610) in the stack, which includes multiple switches QA1, QB1, QA2 and QB2, to a second layer in the stack, which includes a second power interface 1602.

[0215] Note that further embodiments herein include parallel connection of multiple inductor paths in inductor device 1510 to increase the inductance of each inductor path. As described herein, any number of inductor paths can be connected in parallel to provide a desired total inductance. Therefore, in addition to control parameters such as the permeability of the core material 120 of the respective inductor device and the corresponding length (between the first end 141 and the second end 142) of each non-winding conductive path (such as a straight or direct path) in inductor device 110, embodiments herein also include parallel connection of multiple inductor paths to control the inductance value provided by the respective inductor device 110. Furthermore, as previously stated, embodiments herein include fabricating the core material 120 in the inductor device such that the value of the permeability of the core varies relative to the corresponding conductive path providing connection between layers 1620 and 1602.

[0216] As further shown, the manufacturer 150 places inductor devices in the power stack assembly 1500 between a plurality of switches (QA1, QB1, QA2 and QB2) in the switch layer 1610 and the second power interface 1602.

[0217] More specifically, the manufacturer 150 manufactures the power supply assembly 1600 to include a second power interface 1602. In one embodiment, the manufacturer 150 connects the output axes of the inductor devices (L1 and L2) to the second power interface 1602 at their respective ends and nodes. The second power interface 1602 is operable to receive the output voltage 123 generated by the inductor devices L1 and L2 and output it to the load 118. The manufacturer 150 couples the output nodes of both inductor paths 1531 and 1532 to an output voltage node 1631 (such as a metal layer). Thus, the output voltage node 1631 is electrically connected to the outputs of the respective inductor paths 1531 and 1532.

[0218] As the name suggests, the output voltage node 1631 transmits the output voltage 123 to power the load 118.

[0219] In one embodiment, one or more nodes or pins, pads, etc. of the dynamic load 118 are coupled to the output voltage node 1631. For example, the output voltage node 1631 of the power stack assembly 1500 delivers the output voltage 123 generated by each of the inductor paths 1531 and 1532 to one or more nodes, pins, pads, etc. of the load 118.

[0220] Therefore, by switching the inductor path between the ground voltage and the input voltage V1, the combination of inductor paths 1531 and 1532 together generates the output voltage 123 to power the load 118.

[0221] As previously described, the power stack assembly 1600 also includes ground nodes 1510-1 and 1510-2. In one embodiment, the instantiation of conductive paths 1510-1 and 1510-2 (such as ground nodes) provides peripheral electromagnetic shielding relative to the power stack assembly 1600, preventing or reducing corresponding radiated emissions into the surrounding environment.

[0222] In another embodiment, the manufacturer 150 manufactures a first power interface 1601 including a first contact element operable to connect the first power interface 1601 located at the base of the power stack assembly 1600 to a main substrate 1505. The manufacturer 150 manufactures a second power interface 1602 including a second contact element operable to secure a dynamic load 118 to the power stack assembly 1600.

[0223] Note that the power stack assembly 1500 is manufactured to further include first capacitors 1521, 1522, etc., thereby providing a connection between the input voltage node 1520 (a first conductive path that provides the input voltage V1 to the power stack assembly 1600) and ground nodes 1510-1 and 1510-2 (such as a second conductive path that provides a ground reference voltage to the power stack assembly 1600).

[0224] The fabricator 150 further provides an output voltage node 1631 (such as another conductive path) in a layer of the power stack assembly 1602, which includes a second power interface 1602. As previously described, the output voltage node 1631 (such as a metal layer) is operable to deliver an output voltage 123 to the dynamic load 118.

[0225] According to a further embodiment, the manufacturer 150 manufactures the power stack assembly 1600 to include a second capacitor (1691, 1692, etc.) connected between the output voltage node 1631 and a corresponding ground node 1510. More specifically, capacitor 1691 is coupled between the output voltage node 1631 and ground node 1510-1; capacitor 1692 is coupled between the output voltage node 1631 and ground node 1510-2.

[0226] Other embodiments described herein include securing a dynamic load 118 to a second power interface 1602. Thus, the dynamic load 118 is secured on top of the power stack assembly 1600.

[0227] The power stacking assembly 1600 described herein (such as a vertically stacked component assembly) offers advantages over conventional power converters. For example, the power stacking assembly 1600 described herein provides novel connections (such as via stacking) of components within the assembly, resulting in shorter circuit paths and lower losses when converting and delivering power to the dynamic load 118.

[0228] As previously mentioned Figure 15 During operation, the inductor devices L1 and L2, and their corresponding inductor paths 1531 and 1532, are operable to generate an output voltage 123 based on the received power (current supplied by the input voltage V1). In other words, the power stack assembly 1600 and the corresponding manufactured component stack (such as the first power interface 1601, one or more switches QA1, QB1, QA2 and QB2, inductor device 110, and the second power interface 1602) are power converters operable to convert the input voltage V1 (such as a DC voltage) received at the first power interface 1601 into an output voltage 123 (such as a DC voltage) output from the second power interface 1602 to the dynamic load 118.

[0229] Other embodiments described herein include the fabrication of a system. For example, embodiments herein include a fabricator 150. The fabricator 150 receives a substrate 1505, such as a circuit board; the fabricator 150 attaches the base (such as interface 1601) of a component stack (such as a power stack assembly 1600) to the circuit board. As previously described, the component stack (power stack assembly 1600) is operable to generate an output voltage 123 to power a load 118. The load 118 is attached to the circuit board or the load 118 is attached to the top of the power stack assembly 1600.

[0230] Furthermore, as previously mentioned, load 118 can be any suitable circuit, such as a CPU (Central Processing Unit), GPU, and ASIC (including one or more artificial intelligence accelerators) that can be located on a separate circuit board.

[0231] Figure 17 This is an example diagram illustrating a circuit assembly according to an embodiment of the present article.

[0232] As shown in this example embodiment, circuit assembly 2100 includes a power stack assembly 1600 disposed in an insertion layer 2110. Insertion layer 2110 provides a circuit path connection between substrate 2190 and load substrate 2130 (and load 118).

[0233] In the manner described above, the power stack assembly (1600) receives an input voltage (and any other voltage reference signals, such as ground and / or V1, V2, etc.) from the substrate 2190. The power stack assembly (1600) converts the input voltage into an output voltage 123 (and / or output current), which powers the respective load 118 and / or other circuit components disposed on the load substrate 2130.

[0234] In one embodiment, substrate 2190 is a printed circuit board (PCB) substrate, but substrate 2190 can be any suitable component to which socket 2150 (optional) or insert layer 2110 is connected. Insert layer 2110 communicates with substrate 2190 by inserting into socket 2150. In the absence of socket 2150, insert layer 2110 is directly connected to substrate 2190.

[0235] Figure 18 This is an example diagram illustrating a circuit assembly according to an embodiment of the present article.

[0236] As shown in this example embodiment, circuit assembly 2200 includes a power stack assembly 1600 disposed in CPU (Central Processing Unit) substrate 2210. In one embodiment, the power stack assembly is integrated into a laminated portion of the CPU substrate 2210 itself. CPU substrate 2210 provides a circuit path connection between substrate 2290 and load 118 (and other components connected to CPU substrate load 2120).

[0237] In the manner described above, the power stack assembly (1600) receives an input voltage (and any other voltage reference signals, such as ground and / or voltages V1, V2, etc.) from the substrate 2290. The power stack assembly (1600) converts the input voltage into an output voltage (and / or output current) that powers the respective load 118 and / or other circuit components disposed on the load CPU substrate 2210.

[0238] In one embodiment, substrate 2290 is a printed circuit board (PCB) substrate, but substrate 2290 can be any suitable component directly connected to socket 2250 (optional) or CPU substrate 2210. By inserting socket 2250, CPU substrate 2210 and power stack components communicate with substrate 2290. Without socket 2250, CPU substrate 2210 is directly connected to substrate 2290.

[0239] Figure 19 This is an example diagram illustrating a circuit assembly according to an embodiment of the present article.

[0240] As shown in this example embodiment, circuit assembly 2300 includes a power stack assembly 1600 disposed in a substrate 2390 such as a circuit board (such as a printed circuit board).

[0241] In one embodiment, the power stack assembly 1600 is embedded or fabricated in an opening in the substrate 2390. In other words, in one embodiment, the power stack assembly 1600 (converter unit) is fabricated (inserted) into an opening beneath the CPU substrate 2310. The CPU substrate 2310 provides a circuit path connection between the substrate 2390 and the load 2320 (and / or other components connected to the CPU substrate load 2310).

[0242] In the manner described above, the power stack assembly (1600) receives an input voltage (and any other voltage reference signals, such as ground and / or V1, V2, etc.) from the substrate 2390. The power stack assembly (1600) converts the input voltage into an output voltage (and / or output current) that powers the corresponding load 2320 and / or other circuit components disposed on the load CPU substrate 2310.

[0243] In one embodiment, substrate 2390 is a printed circuit board (PCB) substrate, but substrate 2390 can be any suitable component to which socket 2350 (optional) or CPU substrate 2310 is directly connected. In one embodiment, CPU substrate 2310 communicates with substrate 2390 by inserting socket 2350. In the absence of socket 2350, CPU substrate 2310 is directly connected to substrate 2390.

[0244] Figure 20 This is a diagram illustrating an example computer architecture operable to perform one or more methods according to embodiments of this document.

[0245] As previously discussed, any resources discussed herein (such as manufacturer 150, etc.) can be configured to include computer processor hardware and / or corresponding executable instructions to perform the various operations discussed herein.

[0246] As shown in the figure, the computer system 2000 of this example includes interconnect 2011, which couples a computer-readable storage medium 2012 (such as a non-transitory type of medium, which may be any suitable type of hardware storage medium in which digital information can be stored and retrieved), a processor 2013 (computer processor hardware), an I / O interface 2014, and a communication interface 2017.

[0247] The (multiple) I / O interfaces 2014 support connection to external hardware 2099 (such as keyboards, displays, storage devices, manufacturing equipment, etc.).

[0248] The computer-readable storage medium 2012 can be any hardware storage device, such as a memory, optical storage device, hard disk drive, floppy disk, etc. In one embodiment, the computer-readable storage medium 2012 stores instructions and / or data.

[0249] As shown in the figure, the computer-readable storage medium 2012 can perform any of the operations discussed herein using manufacturer application program 150-1 (e.g., including instructions) encoding.

[0250] During operation in one embodiment, processor 2013 accesses computer-readable storage medium 2012 via interconnect 2011 to initiate, run, execute, interpret, or otherwise perform instructions in manufacturer application 150-1 stored on computer-readable storage medium 2012. Execution of manufacturer application 150-1 generates manufacturer process 150-2 to perform any operations and / or processes as discussed herein.

[0251] Those skilled in the art will understand that the computer system 2000 may include other processes and / or software and hardware components, such as an operating system that controls the allocation and use of hardware resources to execute the manufacturer application 150-1.

[0252] According to different embodiments, note that the computer system can reside in any variety of devices, including but not limited to power supplies, switching capacitor converters, power converters, mobile computers, personal computer systems, wireless devices, wireless access points, base stations, telephone equipment, desktop computers, laptop computers, notebook computers, netbook computers, mainframe computers, handheld computers, workstations, network computers, application servers, storage devices, consumer electronic devices (such as cameras, camcorders, set-top boxes, mobile devices, video game consoles, handheld video game devices), peripheral devices (such as switches, modems, routers, set-top boxes), content management devices, handheld remote control devices, any type of computing device or electronic device, etc. The computer system 2000 can reside anywhere or can be included in any suitable resource in any network environment to implement the functions discussed herein.

[0253] As described in this article, the functionality supported by one or more resources is achieved through... Figure 21 The following flowchart will be used for discussion. Please note that the steps in the flowchart below can be performed in any suitable order.

[0254] Figure 21 This is a flowchart 2107 illustrating an example method according to an embodiment of this document. Note that there may be some overlap in the concepts discussed above.

[0255] In processing operation 2117, the manufacturer 150 receives magnetically conductive material.

[0256] In processing operation 2127, the fabricator 150 fabricates the inductor device (110, 810) to include conductive paths (131, 831) and magnetic material, the conductive paths extending from a first end of the inductor device through the core to a second end of the inductor device.

[0257] In processing operation 2137, via fabricator 150, the core 120 of the inductor device (110, 810) is fabricated to have a permeability that varies according to the radial distance outward relative to the conductive path (131, 831).

[0258] It should be noted again that the techniques described herein are well-suited for use in the fabrication of inductor devices and their corresponding implementations in power converter applications. However, it should be understood that the embodiments described herein are not limited to such applications, and the techniques discussed herein are also well-suited for other applications.

[0259] Although the invention has been specifically shown and described with reference to its preferred embodiments, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Such changes are intended to be covered by the scope of the invention. Therefore, the foregoing description of embodiments of the invention is not intended to be limiting. Rather, any limitation on the invention is set forth in the appended claims.

Claims

1. An inductor device, comprising: A core made of a magnetically conductive material, the core comprising an inner diameter and an outer diameter, the magnetically conductive material being disposed between the inner diameter and the outer diameter; A conductive path is disposed within the inner diameter of the core, and the outer diameter of the conductive path extends to the inner diameter of the core; and The permeability of the core increases with increasing distance relative to the conductive path; The magnetically conductive material includes a first magnetically conductive material and a second magnetically conductive material, wherein the first magnetically conductive material is manufactured as a fin extending radially outward from the conductive path; and The second magnetic material fills the gaps between the fins.

2. The inductor device of claim 1, wherein the core comprises a plurality of concentric material layers relative to the conductive path.

3. The inductor device according to claim 2, wherein the plurality of concentric material layers includes a first concentric material layer and a second concentric material layer, the second concentric material layer having a higher permeability than the first concentric material layer.

4. The inductor device according to claim 3, wherein the first concentric material layer is disposed between the conductive path and the second concentric material layer.

5. The inductor device of claim 1, wherein the core is operable to limit the magnetic flux generated by the current flowing through the conductive path.

6. The inductor device of claim 1, wherein the permeability of the magnetic material is between 30 and 150 Henry / meter.

7. The inductor device of claim 1, wherein the permeability in the core varies linearly with respect to the distance from the conductive path.

8. The inductor device according to claim 1, The cross-section of the inductor device, viewed along the axis of the conductive path, includes wedges of the second magnetic material disposed between portions of the first magnetic material.

9. The inductor device of claim 1, wherein a second radius relative to the axis of the conductive path intersects with a first magnetic material and a second magnetic material at different angular positions, the second magnetic material having a higher permeability than the first magnetic material.

10. The inductor device according to claim 1, further comprising: A first flux path at a first radius relative to the axis of the conductive path, the first flux path alternates between passing through a first magnetic material in the core and passing through a second magnetic material, the second magnetic material having a higher permeability than the first magnetic material.

11. The inductor device according to claim 10, further comprising: A second flux path at a second radius relative to the axis of the conductive path, the second radius being larger than the first radius, the second flux path alternating between passing through the first magnetic material in the core and passing through the second magnetic material; and The second flux path passes through a higher ratio of the second magnetic material to the first magnetic material than the first flux path.

12. A circuit system comprising: Circuit board; The inductor device according to claim 1, wherein the inductor device is disposed in a power converter, the power converter is fixed to the circuit board, and the power converter operates to generate an output voltage.

13. A method for manufacturing an inductor device, comprising: Receive magnetically conductive material; The inductor device is manufactured including a conductive path and a core made of the magnetically conductive material, wherein the core is manufactured having an inner diameter and an outer diameter, and the magnetically conductive material is disposed between the inner diameter and the outer diameter, the conductive path is disposed within the inner diameter of the core, and the outer diameter of the conductive path extends radially to the inner diameter of the core and extends axially from a first end of the inductor device through the core to a second end of the inductor device; and The core of the inductor device is manufactured to have a permeability that increases with the radial distance outward relative to the conductive path. The magnetically conductive material includes a first magnetically conductive material and a second magnetically conductive material, and the method further includes: The inductor device is manufactured to include fins extending radially outward from the conductive path via the first magnetically conductive material; as well as The gaps between the fins are filled via the second magnetic material.

14. The method of claim 13, further comprising: The core of the inductor device is manufactured as comprising a plurality of concentric material layers relative to the conductive path.

15. The method of claim 14, further comprising: The plurality of concentric material layers are manufactured to include a first concentric material layer and a second concentric material layer, wherein the second concentric material layer has a higher magnetic permeability than the first concentric material layer.

16. The method of claim 15, further comprising: The first concentric material layer is disposed between the conductive path and the second concentric material layer.

17. The method of claim 13, wherein the core is operable to limit the magnetic flux generated when current flows through the first conductive path.

18. The method of claim 13, wherein the magnetic permeability of the magnetic material is between 30 and 150 Henry / meter.

19. The method of claim 13, wherein the permeability in the core varies linearly with respect to the radial distance from the conductive path.

20. The method according to claim 13, further comprising: The inductor device is manufactured such that the cross-section of the inductor device, when viewed along the axis of the conductive path, includes a wedge of the second magnetic material disposed between portions of the first magnetic material.

21. The method of claim 13, further comprising: The core is manufactured such that a concentric path of a second radius relative to the axis of the conductive path intersects a first magnetic material and a second magnetic material at different angular positions, the second magnetic material having a higher permeability than the first magnetic material.

22. The method of claim 13, further comprising: The core of the inductor device is manufactured to include a first flux path at a first radius relative to the axis of the conductive path, the first flux path alternating between passing through a first magnetic material in the core and passing through a second magnetic material having a higher permeability than the first magnetic material.

23. The method of claim 22, further comprising: The core of the inductor device is manufactured to include a second flux path at a second radius relative to the axis of the conductive path, the second radius being larger than the first radius, the second flux path alternating between passing through the first magnetic material in the core and passing through the second magnetic material; and The second flux path passes through a higher ratio of the second magnetic material to the first magnetic material than the first flux path.

24. A method for manufacturing a circuit system, comprising: Receiver circuit board; as well as A power converter is attached to the circuit board, the power converter including the inductor device according to claim 1, the power converter being operable to generate an output voltage to power a load.

Images