Wafer boxes, wafer handling equipment and control methods, electrical equipment and storage media

Abstract

This application discloses a wafer cassette, wafer handling equipment and control method, electrical equipment and storage medium. The wafer cassette includes a carrier and multiple pressure-emitting or color-changing devices. The carrier includes a receiving space and a pick-and-place port located on one side of the receiving space. The receiving space is used to hold multiple wafers. The carrier includes a substrate and multiple carrier plates connected to the side of the substrate near the receiving space. Each pressure-emitting or color-changing device is disposed corresponding to one carrier plate and is at least partially disposed on the carrier plate to support the wafer. When subjected to pressure from the wafer, the device changes from a first state to a second state, wherein the first state and the second state are respectively a non-emitting state and an emitting state; or the first state and the second state are respectively a first emitting state emitting a first color of light and a second emitting state emitting a second color of light.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, specifically to a wafer cassette, wafer handling equipment and control method, electrical equipment and storage medium. Background Technology

[0002] In semiconductor packaging and testing processes, wafers need to be moved between different devices for operations such as dicing, probe testing, and die bonding. Automated wafer handling and inspection have become crucial links in the semiconductor manufacturing process. Different wafer handling equipment has different requirements for the size, surface quality, and die yield of incoming wafers. Wafers are affected by the environment and operations during storage, transportation, and handling, resulting in a certain degree of damage and defect rate. Therefore, the inability to perform clear force sensing and counting in traditional wafer handling processes poses challenges to the accurate alignment, handling, and automation of wafer operations. Summary of the Invention

[0003] This application discloses a wafer cassette, wafer handling equipment and control method, electrical equipment and storage medium, which can achieve the purpose of precise wafer alignment, handling and automated operation.

[0004] On one hand, this application discloses a wafer cassette, which includes a carrier and a plurality of pressure-emitting or color-changing devices. The carrier includes a receiving space and a pick-and-place port located on one side of the receiving space. The receiving space is used to receive multiple wafers. The carrier includes a substrate and a plurality of carrier plates connected to the side of the substrate near the receiving space. Each pressure-emitting or color-changing device is disposed corresponding to one carrier plate and is at least partially disposed on the carrier plate to support the wafer. When subjected to pressure from the wafer, the device changes from a first state to a second state, wherein the first state and the second state are respectively a non-emitting state and an emitting state; or the first state and the second state are respectively a first color state and a second color state.

[0005] Compared to existing technologies, the wafer cassette proposed in this application, by setting the piezoelectric light-emitting or color-changing device on each of the carrier plates, can change the carrier plate from a first state to a second state when carrying the wafer, thereby indicating the carrying position of the wafer. This facilitates clearer observation of the storage status of the wafers in the wafer cassette. Moreover, the state change is triggered by pressure, eliminating the need for light detection on each wafer, which greatly saves energy. Only the piezoelectric light-emitting or color-changing device under pressure will change state, making it more intelligent and precise.

[0006] According to one embodiment of this application, the portion of the pressure-emitting or color-changing device disposed on the carrier plate extends from one end of the carrier plate away from the pick-and-place port to one end of the carrier plate near the pick-and-place port; or the carrier plate includes a first portion near the pick-and-place port, a second portion away from the pick-and-place port, and an intermediate portion connecting the first portion and the second portion, the portion of the pressure-emitting or color-changing device carrying the wafer is disposed in the intermediate portion, and the length of the portion of the pressure-emitting or color-changing device disposed on the carrier plate is less than or equal to the length of the portion of the wafer carried by the pressure-emitting or color-changing device along a first direction, the first direction being the direction from the first portion to the second portion. By setting the pressure-emitting or color-changing device to extend from the end of the carrier plate away from the pick-and-place port to the end of the carrier plate near the pick-and-place port; or by setting the portion of the pressure-emitting or color-changing device that carries the wafer in the middle portion, and the length of the portion of the pressure-emitting or color-changing device on the carrier plate is less than or equal to the length of the portion of the wafer carried by the pressure-emitting or color-changing device along the first direction, the wafer can be made to fully contact the pressure-emitting or color-changing device when placed on the carrier plate, so that the pressure-emitting or color-changing device can accurately sense the pressure of the wafer, and the state change of the pressure-emitting or color-changing device is not affected by the wafer placement deviation, thus more accurately indicating the wafer placement information.

[0007] According to one embodiment of this application, the pressure-emitting or color-changing device includes a carrier film disposed on the carrier plate for supporting the wafer. The carrier film protrudes from the surface of the carrier plate near the wafer. The carrier film includes a pressure-emitting material for changing from a non-emitting state to an emitting state when subjected to pressure from the wafer. By disposing of the pressure-emitting material as the carrier film on the carrier plate, when the carrier plate is subjected to pressure from the wafer, the pressure-emitting or color-changing device can change from a non-emitting state to an emitting state, thereby indicating the supporting position of the wafer. This facilitates clearer observation of the wafer's storage status in the wafer cassette. Furthermore, the pressure-emitting or color-changing device not only does not occupy space in the wafer cassette and does not obstruct the placement or removal of the wafer, but also requires no external power, saving energy and being more environmentally friendly. Moreover, the state change is triggered by pressure, eliminating the need for light detection on each wafer, making it more intelligent and precise.

[0008] According to one embodiment of this application, the pressure-sensitive light-emitting or color-changing device includes a carrier film disposed on the carrier plate for supporting the wafer. The carrier film includes a pressure-sensitive material for receiving external light and changing from a first color state to a second color state when subjected to pressure from the wafer. By disposing of the pressure-sensitive material as the carrier film on the carrier plate, when the carrier plate is subjected to pressure from the wafer, the pressure-sensitive light-emitting or color-changing device can change from the first color state to the second color state, thereby indicating the supporting position of the wafer. This facilitates clearer observation of the wafer's storage status in the wafer cassette. Furthermore, the pressure-sensitive light-emitting or color-changing device not only does not occupy space in the wafer cassette and does not obstruct the placement or removal of the wafer, but also requires no external power, saving energy and being more environmentally friendly. Moreover, the state change is triggered by pressure, eliminating the need for light detection on each wafer, making it more intelligent and precise.

[0009] According to one embodiment of this application, the number of carriers is at least two, the receiving space is located between the two carriers, each carrier includes a substrate and a plurality of carrier plates connected to the side of the substrate near the receiving space, the two ends of the wafer are respectively disposed on two corresponding carrier plates of the two carriers, and the portion of the carrier plate supporting the wafer is provided with the pressure-emitting or color-changing device; the wafer cassette also includes a back plate connected between the two carriers and located on the side away from the pick-and-place port. By setting the number of carriers to at least two, the carriers can support the wafer more stably.

[0010] According to one embodiment of this application, the substrate includes a back plate portion and two side plate portions connected to both ends of the back plate portion and disposed opposite to each other. A portion of the pressure-emitting or color-changing devices are disposed on the side of the back plate portion near the receiving space and / or one end of the side plate portion connected to the back plate portion. The carrier plate is at least connected to the side plate portion near the receiving space. The surface of the back plate portion facing the receiving space is an arc-shaped surface protruding outwards from the receiving space. By setting the surface of the back plate portion facing the receiving space to an arc-shaped surface protruding outwards from the receiving space, the space within the receiving space can better match the shape of the wafer, making the storage of the wafer more stable.

[0011] Secondly, this application also discloses a wafer handling device, which includes a wafer cassette, a handling module, a vision sensing module, and a control module as described in any of the above embodiments. The handling module is used to acquire or place the wafer from the pick-and-place port; the vision sensing module is used to capture an image of the receiving space on one side of the pick-and-place port and output a first captured image; and the control module is electrically connected to the handling module and the vision sensing module, and is used to receive and control the handling module to perform alignment based on the first captured image, and control the handling module to acquire or place the wafer after the alignment is completed.

[0012] Compared to existing technologies, the wafer handling equipment proposed in this application controls the vision sensing module to capture and output a first captured image, so that the control module controls the handling module to align the wafers based on the first captured image, and controls the handling module to acquire or place the wafers, thereby achieving precise alignment and gripping of the wafers in the wafer box, and thus realizing precise wafer handling and automated operation.

[0013] In addition, this application also discloses a wafer handling device, which includes a wafer cassette, a handling module, a vision sensing module, and a control module as described in any of the above embodiments. The handling module is used to acquire or place the wafer from the pick-and-place port. The vision sensing module is used to capture images of the receiving space on one side of the pick-and-place port and output a first captured image. The control module is electrically connected to the handling module and the vision sensing module, and is used to receive and control the handling module to perform alignment based on the first captured image, and control the handling module to acquire or place the wafer after the alignment is completed.

[0014] Compared to existing technologies, the wafer handling equipment proposed in this application controls the vision sensing module to capture and output a first captured image, so that the control module controls the handling module to align the wafers based on the first captured image, and controls the handling module to acquire or place the wafers, thereby achieving precise alignment and gripping of the wafers in the wafer box, and thus realizing precise wafer handling and automated operation.

[0015] According to one embodiment of this application, the control module crops the first captured image based on a preset region of interest, then uses threshold segmentation to obtain the bright and dark areas in the cropped image to determine the position of the wafer, and controls the handling module to align the wafer based on its position. By identifying and cropping the region of interest in the first captured image, and then using threshold segmentation to obtain the bright and dark areas in the cropped image to determine the accurate position of the wafer, the algorithm is mature, highly accurate, and can quickly achieve automated handling of the wafer.

[0016] In addition, this application also discloses a wafer handling device, which includes a wafer cassette, a handling module, a vision sensing module, and a control module as described in any of the above embodiments. The handling module is used to acquire or place the wafer from the pick-and-place port. The vision sensing module is used to capture images of the receiving space on one side of the pick-and-place port and output a first captured image. The control module is electrically connected to the handling module and the vision sensing module, and is used to receive and control the handling module to perform alignment based on the first captured image, and control the handling module to acquire or place the wafer after the alignment is completed.

[0017] Compared to existing technologies, the wafer handling equipment proposed in this application controls the vision sensing module to capture and output a first captured image, so that the control module controls the handling module to align the wafers based on the first captured image, and controls the handling module to acquire or place the wafers, thereby achieving precise alignment and gripping of the wafers in the wafer box, and thus realizing precise wafer handling and automated operation.

[0018] According to one embodiment of this application, the control module performs image cropping on the first captured image based on a preset region of interest, then performs channel separation on the cropped image based on the HSV color model, performs threshold segmentation in the H channel, extracts the image of the corresponding color range to know the position of the wafer, and controls the alignment of the transport module according to the position of the wafer.

[0019] By identifying and cropping the region of interest in the first captured image, and then performing channel separation on the cropped image using a color-based HSV model, and threshold segmentation within the H channel, the image of the corresponding color range is extracted to determine the accurate location of the wafer. The algorithm is mature, highly accurate, and can quickly achieve automated picking and placing of the wafer.

[0020] In addition, this application also discloses a wafer handling control method, including the following steps:

[0021] A wafer cassette is provided, wherein the wafer cassette is as described in any of the above embodiments;

[0022] A first image of the receiving space is captured on one side of the loading / unloading port.

[0023] The alignment of the transport module is controlled based on the first captured image; and

[0024] After the alignment is completed, the handling module is controlled to acquire or place the wafer.

[0025] Compared to existing technologies, the wafer handling control method proposed in this application acquires a first image of the receiving space on one side of the pick-and-place port, and controls the handling module to align based on the first image to complete the acquisition or placement of the wafer, thereby achieving precise alignment and gripping of the wafer in the wafer box, and thus realizing precise wafer handling and automated operation.

[0026] In addition, this application also discloses an electrical device, which includes a memory and a processor. The memory stores computer-readable instructions, and when the computer-readable instructions are executed by the processor, the processor enables the processor to implement the wafer handling control method as described in any of the above claims.

[0027] In addition, embodiments of this application disclose a computer-readable storage medium storing computer-readable instructions thereon, which, when executed by a processor, implement the wafer handling control method as described in any of the preceding claims. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a three-dimensional schematic diagram of the first wafer handling device disclosed in the embodiments of the present invention;

[0030] Figure 2 This is a three-dimensional schematic diagram of the first type of wafer cassette disclosed in the embodiments of the present invention;

[0031] Figure 3 yes Figure 2 A partially enlarged schematic diagram of the wafer cassette shown;

[0032] Figure 4 yes Figure 2 The first image taken after the wafer cassette was loaded with wafers;

[0033] Figure 5 yes Figure 2 Top view of the wafer cassette shown;

[0034] Figure 6 This is a top view of the second type of wafer cassette disclosed in the embodiments of the invention;

[0035] Figure 7 This is a three-dimensional schematic diagram of the third type of wafer cassette disclosed in an embodiment of the present invention;

[0036] Figure 8 yes Figure 7 A cross-sectional view of the wafer cassette shown;

[0037] Figure 9 This is a three-dimensional schematic diagram of the second type of wafer handling equipment disclosed in the embodiments of the present invention;

[0038] Figure 10 yes Figure 1 A three-dimensional schematic diagram of the wafer handling module shown in the diagram;

[0039] Figure 11 This is a flowchart of the first wafer handling control method disclosed in the embodiments of the present invention;

[0040] Figure 12 This is a use disclosed in one embodiment of the present invention. Figure 11 A flowchart of a wafer handling equipment for a wafer handling control method is shown.

[0041] Figure 13 This is a use disclosed in one embodiment of the present invention. Figure 11 A partial flowchart of a wafer handling equipment for a wafer handling control method is shown.

[0042] Figure 14 This is a perspective view of the third type of wafer handling equipment disclosed in the embodiments of the present invention;

[0043] Figure 15 This is a three-dimensional schematic diagram of the fourth type of wafer cassette disclosed in the embodiments of the present invention;

[0044] Figure 16 yes Figure 15 A partially enlarged schematic diagram of the wafer cassette shown;

[0045] Figure 17 yes Figure 15 The first image taken after the wafer cassette was loaded with wafers;

[0046] Figure 18 This is a perspective view of the fourth wafer handling device disclosed in the embodiments of the present invention;

[0047] Figure 19 yes Figure 14 A three-dimensional schematic diagram of the wafer handling module shown in the diagram;

[0048] Figure 20 This is a flowchart of the second wafer handling control method disclosed in the embodiments of the present invention;

[0049] Figure 21 This is a use disclosed in one embodiment of the present invention. Figure 20 A flowchart of a wafer handling equipment for a wafer handling control method is shown.

[0050] Figure 22 This is a use disclosed in one embodiment of the present invention. Figure 20 A partial flowchart of a wafer handling equipment for a wafer handling control method is shown.

[0051] Figure 23 This is a three-dimensional schematic diagram of the fifth type of wafer handling equipment disclosed in the embodiments of the present invention;

[0052] Figure 24 This is a three-dimensional schematic diagram of the fifth type of wafer cassette disclosed in the embodiments of the present invention;

[0053] Figure 25 yes Figure 24 The front view of the wafer cassette shown;

[0054] Figure 26 yes Figure 24 A cross-sectional view of the wafer cassette shown;

[0055] Figure 27 yes Figure 24 The first image taken after the wafer cassette was loaded with wafers;

[0056] Figure 28 This is a three-dimensional schematic diagram of the sixth type of wafer handling equipment disclosed in the embodiments of the present invention;

[0057] Figure 29 yes Figure 23 A three-dimensional schematic diagram of the wafer handling module shown in the diagram;

[0058] Figure 30 This is a flowchart of the third wafer handling control method disclosed in the embodiments of the present invention;

[0059] Figure 31 This is a use disclosed in one embodiment of the present invention. Figure 30 A flowchart of a wafer handling equipment for a wafer handling control method is shown.

[0060] Figure 32 This is a use disclosed in one embodiment of the present invention. Figure 30 A partial flowchart of a wafer handling equipment for a wafer handling control method is shown.

[0061] Figure 33 This is a schematic diagram of the structure of an electrical device disclosed in one embodiment of the present invention;

[0062] Figure 34 This is a schematic diagram of the structure of a storage medium disclosed in one embodiment of the present invention. Detailed Implementation

[0063] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0064] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing the invention and its embodiments, and are not intended to limit the indicated devices, elements, or components to having a specific orientation, or to be constructed and operated in a specific orientation.

[0065] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in certain situations to indicate a dependency or connection. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0066] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0067] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0068] In some related technologies, wafer handling equipment uses sensors for positioning and transport. However, some sensor-based methods rely on indirect measurement, and when there are installation errors or positional deviations between the sensor position and the actual wafer position, the reliability and safety of precise alignment and transport are difficult to guarantee. Furthermore, some related technologies and methods lack contact force sensing modules during wafer handling, making it difficult to determine actual contact between the wafer carrier and the wafer. When the preset wafer pick-up position deviates, misjudgments may occur, meaning there's a possibility of continuing to the next step even if no wafer is picked up at the preset pick-up position. In addition, some related technologies and methods lack wafer pre-inspection and sorting functions during wafer handling. Since wafer handling essentially serves upstream and downstream process steps, wafer handling without inspection and sorting may result in downstream processes processing defective wafers, wasting manpower and resources, and reducing wafer manufacturing efficiency.

[0069] To address the aforementioned issues, this application discloses a wafer cassette 10, a wafer handling device 1 and control method, an electrical device 2, and a storage medium 3, which can achieve precise wafer handling and automated operation. These will be described in detail below.

[0070] Example 1:

[0071] like Figure 1 As shown in the figure, this application discloses a wafer handling device 1, which includes a wafer cassette 10, a handling module 20, a vision sensing module 30, and a control module 40. In this embodiment, the wafer cassette 10 includes a carrier 11 and a plurality of pressure-emitting or color-changing devices 12. The handling module 20 is used to acquire or place the wafer 100 from the pick-and-place port 112. The vision sensing module 30 is used to capture an image of the receiving space 111 on one side of the pick-and-place port 112 and output a first captured image. The control module 40 is electrically connected to the handling module 20 and the vision sensing module 30, and is used to receive and control the handling module 20 to perform alignment according to the first captured image, and control the handling module 20 to acquire or place the wafer 100 after the alignment is completed.

[0072] It is understood that the wafer handling device 1 proposed in this application can acquire or place the wafer 100 from the wafer cassette 10. During the handling of the wafer 100, the vision sensing module 30 captures an image of the receiving space 111 on one side of the pick-and-place port 112 and outputs a first captured image. The control module 40 controls the handling module 20 to perform alignment based on the first captured image, and acquires or places the wafer 100. Therefore, the wafer handling device 1 can achieve precise alignment and gripping of the wafer 100 in the wafer cassette 10, and further realize precise handling and automated operation of the wafer 100.

[0073] Please see Figures 2 to 4 In this embodiment, the wafer cassette 10 includes a carrier 11 and a plurality of pressure-emitting or color-changing devices 12. The carrier 11 includes a receiving space 111 and a pick-and-place port 112 located on one side of the receiving space 111. The receiving space 111 is used to receive multiple wafers 100. The carrier 11 includes a substrate 113 and a plurality of carrier plates 114 connected to the side of the substrate 113 near the receiving space 111. Each pressure-emitting or color-changing device 12 is disposed corresponding to one carrier plate 114 and is at least partially disposed on the carrier plate 114 for supporting the wafer 100. When subjected to pressure from the wafer 100, it changes from a first state to a second state, wherein the first state and the second state are a non-emitting state and an emitting state, respectively. It is understood that the wafer 100 is flat, and each of the carrier plates 114 is provided with a pressure-emitting or color-changing device 12. When the wafer 100 is placed in the wafer cassette 10 and supported on the carrier plate 114, the pressure-emitting or color-changing device 12 on the carrier plate 114 changes from the first state of non-emitting light to the second state of emitting light under the pressure of the wafer 100. This can indicate the supporting position of the wafer 100, making it easier to observe the storage status of the wafer 100 in the wafer cassette 10. Moreover, the state change of the pressure-emitting or color-changing device 12 only needs to be triggered by pressure, without the need to perform light detection on each wafer 100, which greatly saves energy. As long as it is under pressure, the pressure-emitting or color-changing device 12 will change its state, making it more intelligent and accurate.

[0074] Further, the portion of the pressure-emitting or color-changing device 12 disposed on the carrier plate 114 extends from one end of the carrier plate 114 away from the pick-and-place port 112 to one end of the carrier plate 114 near the pick-and-place port 112; or the carrier plate 114 includes a first portion 114a near the pick-and-place port 112, a second portion 114c away from the pick-and-place port 112, and an intermediate portion 114b connecting the first portion 114a and the second portion 114c, the portion of the pressure-emitting or color-changing device 12 carrying the wafer 100 is disposed in the intermediate portion 114b, and the length of the portion of the pressure-emitting or color-changing device 12 disposed on the carrier plate 114 is less than or equal to the length of the portion of the wafer 100 carried by the pressure-emitting or color-changing device 12 along a first direction, the first direction being the direction from the first portion 114a to the second portion 114c. It should be noted that the pressure-emitting or color-changing device 12 can cover the carrier plate 114, that is, it is disposed from the end of the carrier plate 114 away from the pick-up and drop-off port 112 to the end of the carrier plate 114 near the pick-up and drop-off port 112. In this case, the coverage area of ​​the pressure-emitting or color-changing device 12 is large. Therefore, the state change of the pressure-emitting or color-changing device 12 is not affected by the placement deviation of the wafer 100, and it can more accurately sense the pressure of the wafer 100 and change its state, accurately indicating the position of the wafer 100. In other embodiments, since the wafer 100 is usually of a regular shape, when the wafer 100 is placed on the carrier plate 114, the carrier plate 114 supports the edge of the wafer 100. In order to save space... The raw materials are designed to make the pressure sensing of the wafer 100 more accurate and focused. The portion of the wafer 100 that is supported by the pressure-emitting or color-changing device 12, i.e., the portion that senses the pressure of the wafer 100, can be located in the middle portion 114b of the support plate 114. The length of the portion of the pressure-emitting or color-changing device 12 located on the support plate 114 is less than or equal to the length of the portion of the wafer 100 supported by the pressure-emitting or color-changing device 12 along the first direction. In this case, the wafer 100 can be made to fully contact the pressure-emitting or color-changing device 12 when it is placed on the support plate 114, so that the pressure-emitting or color-changing device 12 can accurately sense the pressure of the wafer 100 and accurately indicate the placement position of the wafer 100.

[0075] Furthermore, the pressure-emitting or color-changing device 12 includes a support film 121 disposed on the support plate 114 for supporting the wafer 100. The support film 121 protrudes from the surface of the support plate 114 near the wafer 100. The support film 121 includes a pressure-emitting material for changing from a non-emitting state to an emitting state when subjected to pressure from the wafer 100. The pressure-emitting material is a type of smart material that emits light under external force, including pressure-sensitive fluorescent color-changing materials, etc. The pressure-emitting material is set as the carrier film 121 on the carrier plate 114. When the carrier plate 114 is subjected to pressure from the wafer 100, the pressure-emitting or color-changing device 12 can change from the non-emitting state to the emitting state, thereby indicating the carrier position of the wafer 100. This makes it easier to observe the storage status of the wafer 100 in the wafer box 10. Furthermore, the pressure-emitting or color-changing device 12 does not occupy the space of the wafer box 10, does not obstruct the placement and removal of the wafer 100, and does not require external energy to emit light, saving energy and being more environmentally friendly. Moreover, the change of state is triggered only by pressure, eliminating the need for light detection on each wafer 100, making it more intelligent and precise.

[0076] Furthermore, such as Figure 5 As shown, the number of carriers 11 is at least two, and the receiving space 111 is located between the two carriers 11. Each carrier 11 includes a substrate 113 and a plurality of carrier plates 114 connected to the side of the substrate 113 near the receiving space 111. The two ends of the wafer 100 are respectively disposed on two corresponding carrier plates 114 of the two carriers 11. The portion of the carrier plate 114 that supports the wafer 100 is provided with the pressure-emitting or color-changing device 12. The wafer cassette 10 also includes a back plate 113c connected between the two carriers 11 and located on the side away from the pick-and-place port 112. In this embodiment, the two adjacent carrier plates 114 and the substrate 113 together form a receiving groove 115 for receiving the edge of the wafer 100. The two substrates 113 and the plurality of carrier plates 114 of the two carriers 11 are arranged opposite to each other to jointly support the wafer 100, ensuring the stability of the wafer 100 placement.

[0077] like Figure 6As shown, in some other embodiments, the substrate 113 includes a back plate portion 113a and two side plate portions 113b connected to both ends of the back plate portion 113a and disposed opposite to each other. Part of the pressure-emitting or color-changing device 12 is disposed on the side of the back plate portion 113a near the receiving space 111 and / or the side plate portion 113b is connected to one end of the back plate portion 113a. The carrier plate 114 is at least connected to the side plate portion 113b near the receiving space 111. The surface of the back plate portion 113a facing the receiving space 111 is an arc-shaped surface protruding outward from the receiving space 111. In this embodiment, the two adjacent support plates 114 and the side plate portion 113b together form a receiving groove 115 for receiving the edge of the wafer 100. The relative arrangement of the two side plate portions 113b together supports the wafer 100, ensuring the stability of the wafer 100. The surface of the back plate portion 113a facing the receiving space 111 is an arc-shaped surface protruding outward from the receiving space 111, which can make the space inside the receiving space 111 more match the shape of the wafer 100, making the storage of the wafer 100 more stable.

[0078] Furthermore, such as Figures 7 to 8 As shown, in some embodiments, the wafer cassette 10 further includes a pressure sensor 13, a counting module 14, and a communication module 15. The pressure sensor 13 is disposed on the side of the support plate 114 that carries the wafer 100, and is electrically connected to the counting module 14 and the communication module 15. The communication module 15 is electrically connected to the control module 40. The pressure sensor 13 is used to sense whether the receiving slot 115 contains the wafer 100 and sends a first sensing signal to the counting module 14, so that the counting module 14 determines the number of wafers based on the first sensing signal. The counting module 14 counts the wafers 100 in the wafer cassette 10, and the communication module 15 sends the counting results recorded by the counting module 14 to the control module 40. The counting module 14 is also used to display the counting results. Pressure sensors 13 are provided on both support plates 114 of the carrier 11, and the number of pressure sensors 13 is twice the number of wafers 100 that the wafer cassette 10 can hold. The pressure sensors 13 are located in the middle portion 114b of the support plate 114 on the side carrying the wafers 100. By providing pressure sensors 13 on both support plates 114 of the carrier 11, the placement of the wafers 100 in the wafer cassette 10 can be accurately obtained through pressure sensing. The counting module 14 then counts and displays the results, and the communication module 15 sends the counting results to the control module 40, facilitating control operations by the control module 40, thereby achieving precise handling and automated operation of the wafers 100.

[0079] Furthermore, the control module 40 performs image cropping on the first captured image based on a preset region of interest, and then obtains the bright and dark areas in the cropped image through threshold segmentation to determine the position of the wafer 100, and controls the alignment of the transport module 20 based on the position of the wafer 100. It is understood that when the wafer 100 is placed in the wafer cassette 10 and supported on the carrier plate 114, the pressure-emitting or color-changing device 12 on the carrier plate 114 changes to the light-emitting state under the pressure of the wafer 100. The brightness of the area where the wafer 100 is supported will be greater than the brightness of the area where the wafer 100 is not placed. The first captured image is the image captured in the accommodating space 111. The preset region of interest can be a part of the accommodating space 111. When performing image analysis on the first captured image, a preset brightness threshold can be set. When the brightness of the preset region of interest is greater than or equal to the preset brightness threshold, it can be considered that the wafer 100 is placed there. When the brightness of the preset region of interest is less than the preset brightness threshold, it can be considered that the wafer 100 is not placed there. By identifying and cropping the region of interest in the first captured image, and then obtaining the bright and dark areas in the cropped image through threshold segmentation to determine the accurate position of the wafer 100, the algorithm is mature, highly accurate, and can quickly realize the automated picking and placing of the wafer 100.

[0080] Further, please refer to Figures 9 to 10 The transport module 20 includes a moving component 21 electrically connected to the control module 40 and a wafer carrier 22 connected to the moving component 21. The moving component 21 drives the wafer carrier 22 to move under the control of the control module 40. The vision sensing module 30 is disposed on the wafer carrier 22, so that the vision sensing module 30 can move together with the wafer carrier 22. By disposing the vision sensing module 30 on the wafer carrier 22 of the transport module 20, the vision sensing module 30 can move together with the wafer carrier 22, thus eliminating the need for other devices to drive the vision sensing module 30 separately. Furthermore, the viewing angle from which the vision sensing module 30 captures the first image is the same as the operating viewing angle of the wafer carrier 22, simplifying the control algorithm and reducing errors. This achieves precise transport and automated operation of the wafer 100 while maintaining higher operational efficiency.

[0081] Specifically, the mobile component 21 includes a base 211, a first movable joint 212 mounted on the base 211 and extendable along a second preset direction, a first rotating arm 213 rotatably connected at one end to the first movable joint 212, a second rotating arm 214 rotatably connected at one end to the other end of the first rotating arm 213, and a wafer carrier 22 rotatably connected to the other end of the second rotating arm 214. In this embodiment, multiple carrier plates 114 are spaced apart along a first preset direction. The first preset direction and the second preset direction can be the same direction. It can be understood that the mobile component 21 is a multi-degree-of-freedom robot. The second rotating arm 214 and the wafer carrier 22 can be integrally connected or rotatably connected. The mobile component 21 can realize precise handling and automated operation of the wafer 100.

[0082] Furthermore, the wafer carrier 22 includes a connecting base 221 and a transport unit 222. The connecting base 221 is disposed on the moving component 21 along the second preset direction, and the transport unit 222 is connected to one side of the connecting base 221. The visual sensing module 30 is disposed along the second preset direction on the side of the connecting base 221 away from the moving component 21, and the visual sensing module 30 is used to capture images towards the side where the transport unit 222 is located. It can be understood that the first moving joint 212, the connecting base 221, and the visual sensing module 30 are all disposed along the second preset direction, so there is no need for position conversion during the pick-up and place process, which improves the accuracy and efficiency of positioning during the pick-up and place process of the wafer 100. By connecting the moving component 21, the visual sensing module 30, and the transport unit 222, the control can be more efficient and the transport more accurate.

[0083] Furthermore, the visual sensing module 30 includes a camera mounting plate 31 disposed on the connecting base 221, a first industrial camera 32 disposed on the camera mounting plate 31, and a first lens 33 mounted on the first industrial camera 32. In this embodiment, the first lens 33 may be a telecentric lens.

[0084] Furthermore, the wafer handling equipment 1 also includes a wafer sensor 50. The wafer sensor 50 is disposed on the surface of the handling section 222 near the wafer 100 and located at the end of the handling section 222 away from the connecting substrate 221. The wafer sensor 50 is electrically connected to the control module 40 and is used to sense the wafer 100 and output a second sensing signal to the control module 40, so that the control module 40 counts and / or monitors the handling of the wafer 100 by the handling module 20. By disposing the wafer sensor 50 on the surface of the handling section 222 near the wafer 100 and located at the end of the handling section 222 away from the connecting substrate 221, the control module 40 can perceive the contact state between the wafer 100 and the handling section 222 in real time through the second sensing signal, accurately perceive and synchronously count the handling of the wafer 100, thereby ensuring the reliability of the handling and transportation process of the wafer 100.

[0085] Specifically, the conveying unit 222 includes two arm portions 222a, both of which are connected to the connecting base 221 and form a U-shape with an opening. The opening faces away from the connecting base 221. The wafer sensor 50 is disposed at the end of the arm portion 222a away from the connecting base 221. A wafer sensor 50 is respectively disposed on the side of the two arm portions 222a that carries the wafer 100. The wafer sensor 50 is a pressure thin-film sensor. In this embodiment, the optical axis direction of the first industrial camera 32 and the first lens 33 is consistent with the axial direction of the U-shaped opening formed by the two arm portions 222a. By providing wafer sensors 50 on one side of the two arms 222a that carry the wafer 100, the pressure sensing of the wafer 100 can be made unaffected by the positional offset of the wafer 100, making the sensing more accurate. At the same time, the wafer sensors 50 are pressure thin film sensors, which can accurately sense the pressure of the wafer 100 without affecting the picking and placing of the wafer 100.

[0086] Furthermore, the control module 40 monitors whether the transport module 20 acquires the wafer 100 from the wafer cassette 10 based on the second sensing signal. When the control module 40 determines that the transport module 20 is in an idle state based on the second sensing signal, the control module 40 controls the visual sensing module 30 to re-capture the updated first captured image of the receiving space 111 from the pick-up and drop-off port 112, and performs re-alignment based on the updated first captured image. After completing the re-alignment, the control module 40 controls the transport module 20 to acquire the wafer 100. It is understood that after each operation of acquiring the wafer 100, the control module 40 will detect the acquisition operation. When it detects that the transport module 20 is in an idle state, it indicates that the acquisition operation of the wafer 100 has failed. At this time, the control module 40 can control the vision sensing module 30 to re-capture the updated first image of the receiving space 111 from the pick-up and put-down port 112, and re-align the wafer 100 based on the updated first image. This avoids subsequent inaccurate acquisition operations caused by erroneous operations, or even shutdown of the entire wafer transport equipment 1. By determining whether the transport module 20 is in an idle state based on the second sensing signal, the control module 40 can re-align the wafer 100 when the transport module 20 is in an idle state, thus avoiding downtime and improving operational efficiency.

[0087] Furthermore, it can be understood that the wafer handling device 1, which includes a wafer cassette 10, a handling module 20, and a vision sensing module 30, can be used to handle wafers in the wafer cassette 10 to other cassettes (such as the first cassette 60 or the second cassette 70), or to handle wafers in other cassettes to the wafer cassette 10 for storage. The following description primarily uses the example of the wafer handling device 1 handling wafers in the wafer cassette 10 to other cassettes.

[0088] Specifically, in one embodiment, the wafer handling device 1 further includes a first material box 60, and the handling module 20 is used to obtain the wafer 100 from the wafer box 10 and transport and place it into the first material box 60. When the control module 40 determines, based on the second sensing signal, that the handling module 20 is still in a carrying state after performing the placement action of placing the wafer 100 into the first material box 60, the control module 40 controls the handling module 20 to perform the placement action of placing the wafer 100 into the first material box 60 again. It is understood that after placing the wafer 100 into the first material container 60, the control module 40 will detect the placement operation. When it detects that the transport module 20 is still in a carrying state, it proves that the placement operation of the wafer 100 has failed. At this time, the control module 40 can control the transport module 20 to perform the placement operation of placing the wafer 100 into the first material container 60 again, avoiding damage caused by misalignment of the wafer 100, or even causing the entire wafer transport equipment 1 to stop. By determining whether the transport module 20 is in a carrying state after performing the placement operation of placing the wafer 100 into the first material container 60 based on the second sensing signal, the control module 40 can perform the placement operation of placing the wafer 100 into the first material container 60 again when the transport module 20 is in a carrying state, avoiding damage to the wafer 100 and downtime, while improving operational efficiency.

[0089] Furthermore, the wafer handling equipment 1 may also include a second cassette 70 and a defect detection module 80. The defect detection module 80 is located on the handling path of the handling module 20 from the wafer cassette 10 to the first cassette 60. The defect detection module 80 is electrically connected to the control module 40. The defect detection module 80 is used to perform defect detection on the wafer 100 transported by the handling module 20 and output defect detection information to the control module 40. The control module 40 is also used to control the handling module 20 to place the qualified wafer 100 in the first cassette 60 and the unqualified wafer 100 in the second cassette 70 according to the defect detection information. It is understood that the transport module 20, on its transport path from the wafer cassette 10 to the first material box 60, will first pass through the defect detection module 80 and perform defect detection at the defect detection module 80. The control module 40 controls the transport module 20 to place the qualified wafer 100 into the first material box 60 and the unqualified wafer 100 into the second material box 70 based on the defect detection information after detection by the defect detection module 80. By setting the defect detection module 80 on the transport path from the wafer cassette 10 to the first material box 60, and simultaneously performing defect detection on the wafer 100, the transport error generated during the transport of the wafer 100 can be reduced, transport time can be saved, and detection efficiency can be improved. At the same time, placing the defective wafer 100 in the second material box 70 allows for pre-inspection and classification during the transport process, providing pre-inspection samples for the subsequent processing of the wafer 100, avoiding waste from entering the later processing steps, thereby improving production efficiency and reducing equipment space occupation.

[0090] It is understood that the first material box 60 and the second material box 70 can have the same structure as the wafer box 10, so the specific structure of the first material box 60 and the second material box 70 will not be described again here.

[0091] Furthermore, the visual sensing module 30 is also used to capture a second image of the receiving space 111 of the first material box 60 from the pick-up / placement port 112 of the first material box 60 before the transport module 20 places the wafer 100 into the first material box 60. The control module 40 is also used to control the transport module 20 to perform placement alignment based on the second image, and after the placement alignment is completed, control the transport module 20 to perform the placement action of placing the wafer 100 into the first material box 60 or the step of detecting the wafer 100. ; and / or the visual sensing module 30 is further configured to capture a third image of the receiving space 111 of the second material box 70 from the pick-up and drop-out port 112 of the second material box 70 before the transport module 20 places the wafer 100 into the second material box 70. The control module 40 is further configured to control the transport module 20 to perform material placement alignment based on the third image, and after the material placement alignment is completed, control the transport module 20 to perform the placement action of placing the wafer 100 into the second material box 70 or the step of detecting the wafer 100. By taking a second image of the receiving space 111 of the first material box 60 from the pick-up / placement port 112 of the first material box 60 before the transport module 20 places the wafer 100 into the first material box 60, and / or taking a third image of the receiving space 111 of the second material box 70 from the pick-up / placement port 112 of the second material box 70 before the transport module 20 places the wafer 100 into the second material box 70, the transport module 20 can operate more accurately during each acquisition and / or placement of the wafer 100, ensuring the reliability of the wafer 100 acquisition and placement operation, while also ensuring operational efficiency.

[0092] Furthermore, the defect detection information includes detection images. The defect detection module 80 includes a camera module 81 and a bracket 82 supporting the camera module 81. The camera module 81 is used to capture the detection images of the wafer 100 transported by the handling module 20. The control module 40 is also used to analyze the defect ratio of the wafer 100 based on the detection images and compare the defect ratio with a preset ratio to determine whether the wafer 100 is qualified.

[0093] Furthermore, the bracket 82 includes a support body 821, a camera support portion 822 connected to one side of the support body 821, and a light source support portion 823 connected to one side of the support body 821. The camera module 81 includes a second industrial camera 811, a second lens 812, and a fill light 813. The second lens 812 is mounted on the second industrial camera 811, and the second industrial camera 811 is located at the end of the camera support portion 822 away from the support body 821. The fill light 813 is located at the end of the light source support portion 823 away from the support body 821. The wafer 100 transported by the transport module 20 is placed parallel to a first reference plane, which is the plane on which the wafer is placed. The second industrial camera 811 faces the wafer 100, and the optical axis of the second industrial camera 811 is perpendicular to the first reference plane. The supplementary light 813 includes a ring-shaped light-emitting element, which is located between the second industrial camera 811 and the transport module 20 and is used to emit light towards the wafer 100. The second industrial camera 811 is used to capture images of the wafer 100 through the hollow area of ​​the ring-shaped light-emitting element to obtain the detection image. In this embodiment, the second lens 812 can be a telecentric lens. By setting the wafer 100 transported by the transport module 20 to be placed parallel to the first reference plane, and the second industrial camera 811 facing the wafer 100 with its optical axis perpendicular to the first reference plane, the second industrial camera 811 can capture images of the wafer 100 vertically. Simultaneously, under the illumination of the supplementary light 813, the defect detection by the defect detection module 80 can be more accurate and precise.

[0094] Please see Figure 11 In one embodiment of this application, when the wafer handling equipment 1 performs the pick-and-place operation of the wafer 100, it can complete the pick-and-place of the wafer 100 by executing a wafer handling control method, the wafer handling control method including the following steps:

[0095] Step S101: Provide wafer cassette 10.

[0096] The wafer cassette 10 includes a carrier 11 and a plurality of pressure-emitting or color-changing devices 12. The carrier 11 includes a receiving space 111 and a pick-and-place port 112 located on one side of the receiving space 111. The receiving space 111 is used to receive multiple wafers 100. The carrier 11 includes a substrate 113 and a plurality of carrier plates 114 connected to the side of the substrate 113 near the receiving space 111. Each pressure-emitting or color-changing device 12 is disposed corresponding to one carrier plate 114 and is at least partially disposed on the carrier plate 114 for supporting the wafer 100. When subjected to pressure from the wafer 100, it changes from a first state to a second state, wherein the first state and the second state are a non-emitting state and an emitting state, respectively.

[0097] Step S102: Acquire a first image of the receiving space 111 taken from one side of the receiving port 112.

[0098] It is understood that when multiple wafers 100 are placed in the wafer cassette 10, the first captured image in step S102 is an image with contrasting stripes, showing the second state in which the pressure-emitting or color-changing device 12 carrying the wafer 100 in the wafer cassette 10 is in an emitting state, and the first state in which the pressure-emitting or color-changing device 12 not carrying the wafer 100 is in an unemitting state.

[0099] It is understood that the wafer handling control method may further include the following steps:

[0100] Step S301: Before acquiring the first captured image, control the transport module 20 to move to the current detection position according to the current detection position parameters.

[0101] The current detection position can be the position where the wafer 100 is picked up or placed. In this embodiment, the current detection position can be the position where the first image is captured.

[0102] Step S302: Based on the first captured image, determine whether the wafer 100 is present at the current picking position or the current unloading position corresponding to the current detection position. If the wafer 100 is present at the current picking position or the wafer 100 is not placed at the current unloading position, then proceed to step S103.

[0103] It can be understood that the aforementioned wafer handling control method can be applied to the picking or unloading of wafers from the wafer cassette 10 to other cassettes (such as the first cassette 60 or the second cassette 70), and can also be applied to the unloading of wafers from other cassettes into the wafer cassette 10. The following explanation will take the unloading of wafers from the wafer cassette 10 to other cassettes using the wafer handling device 1 as an example.

[0104] In step S302, during the material picking operation, if the current picking position has the wafer 100, the picking operation is performed after alignment. During the material unloading operation, if the current unloading position does not have the wafer 100, the unloading operation is performed after alignment. By determining whether the current picking position or the current unloading position corresponding to the current detection position has the wafer 100, the alignment of the handling module 20 is controlled. This avoids misalignment operations when the current picking position does not have the wafer 100 or the current unloading position already has the wafer 100, thereby preventing damage to the wafer 100 and avoiding downtime caused by operational errors, thus improving the reliability and efficiency of the operation.

[0105] In this embodiment, in step S302, if the wafer 100 is not present at the current picking position or the wafer 100 is placed at the current unloading position, it is determined whether the current detection position is the maximum detection position. If the current detection position is the maximum detection position, the transport module 20 is controlled to return to the initial position. If the current detection position is not the maximum detection position, the current detection position parameter, the current picking position parameter, or the current unloading position parameter are adjusted to preset values ​​respectively, and the step of controlling the transport module 20 to move to the current detection position based on the current detection position parameter is executed according to the adjusted current detection position parameter.

[0106] It should be noted that the wafer cassette 10 has a limited number of wafer 100 storage positions, with a preset interval distance between each storage position. In this embodiment, the preset interval distance can be Δz. The maximum detection position is the detection position corresponding to the last storage position of the wafer cassette 10 where the wafer 100 is placed. When the current detection position is the maximum detection position, the handling module 20 is controlled to return to the initial position, which can be the default position. When the current detection position is not the maximum detection position, the current detection position parameter, the current picking position parameter, or the current unloading position parameter are adjusted to preset values ​​to obtain updated current detection position parameters, current picking position parameters, or current unloading position parameters. In this embodiment, the preset value can be the preset interval distance of the wafer cassette 10, i.e., Δz. By determining that the current detection position is the maximum detection position, the handling module 20 can quickly return to the initial position after reaching the maximum detection position to perform subsequent operations, improving operational efficiency.

[0107] Step S103: The transport module 20 is aligned according to the first captured image.

[0108] Image analysis is performed on the first captured image obtained in step S102. The first captured image can be cropped according to a preset region of interest. The preset region of interest in the first captured image can be the location of the bright stripes, which is the location of the wafer 100. Then, the bright and dark areas in the cropped image are obtained by threshold segmentation to know the location of the wafer 100. The storage information of the wafer 100 in the wafer cassette 10 can be obtained, and the alignment of the transport module 20 can be controlled according to the location of the wafer 100.

[0109] It is understood that the control module 40 of the wafer handling equipment 1 may store the current pick-up position parameters or the current unload position parameters. Specifically, step S102 may include the following steps:

[0110] Step S201: Correct the current material picking position parameter or the current material unloading position parameter based on the first captured image to obtain the corrected material picking position parameter or the corrected material unloading position parameter, and update the current material picking position parameter or the current material unloading position parameter based on the corrected material picking position parameter or the corrected material unloading position parameter;

[0111] It can be understood that the current pick-up position parameter is the position parameter of the wafer 100 that needs to be picked up in the wafer cassette 10, and the current unloading position parameter is the position parameter of the wafer 100 that needs to be unloaded that should be placed in the wafer cassette 10. The current pick-up position parameter or the current unloading position parameter can be obtained by calculation. In this embodiment, the wafers 100 in the wafer cassette 10 are stored at intervals, and the interval distance can be a preset interval Δz. After the pick-up or unloading is completed at the current pick-up position or the current unloading position, the current pick-up position parameter is updated to the previous pick-up position parameter + Δz, and the current unloading position parameter is updated to the previous unloading position parameter + Δz. To ensure operational accuracy, before performing material handling or unloading operations, image analysis can be performed on the first captured image to obtain corrected material handling position parameters or corrected unloading position parameters. Finally, the current material handling position parameters or current unloading position parameters are updated based on the corrected material handling position parameters or corrected unloading position parameters. After completing the material handling or unloading operation, the updated current material handling position parameters or current unloading position parameters are incremented by Δz to obtain the current material handling position parameters or current unloading position parameters for the next material handling or unloading operation.

[0112] Step S202: Control the conveying module 20 to move to the current picking position or the current unloading position according to the corrected picking position parameter or the corrected unloading position parameter.

[0113] It is understood that by controlling the transport module 20 to move to the current picking position or the current unloading position based on the corrected picking position parameter or the corrected unloading position parameter obtained from the first captured image, the operation can be more accurate, thereby avoiding damage to the wafer 100, and also avoiding downtime caused by operational errors, thus improving the reliability and efficiency of the operation.

[0114] Step S104: After completing the alignment, control the transport module 20 to acquire or place the wafer 100.

[0115] Based on the corrected material picking position parameter or the corrected material unloading position parameter, the transport module 20 is controlled to move to the current material picking position or the current material unloading position. That is, the transport module 20 extends into the wafer cassette 10 and reaches the current material picking position or the current material unloading position, so that the transport module 20 can perform material picking or unloading operations.

[0116] Specifically, the step of controlling the transport module 20 to place the wafer 100 after completing the alignment may include a step executed after the transport module 20 moves to the current unloading position, controlling the transport module 20 to place and return the wafer 100 according to preset descent and return parameters. It can be understood that after moving to the current unloading position, the transport module 20 descends according to preset descent parameters, placing the wafer 100 on the carrier 11. The preset descent parameters can be a preset descent distance. Then, the transport module 20 returns according to return parameters, which can be a default return position or the position for the next operation. By controlling the transport module 20 to place and return the wafer 100 according to preset descent and return parameters after the transport module 20 moves to the current unloading position, the operational efficiency of the wafer 100 placement and removal operation can be improved.

[0117] The step of controlling the transport module 20 to acquire the wafer 100 after completing the alignment may include a step executed after the transport module 20 moves to the current picking position, controlling the transport module 20 to lift and retrieve the wafer 100 according to preset lifting and retrieval parameters. It can be understood that after moving to the current picking position, the transport module 20 lifts the wafer 100 according to preset lifting parameters, placing the wafer 100 on the transport module 20. The preset lifting parameters can be a preset lifting distance. Then, the transport module 20 retrieves the wafer 100 according to the retrieval parameters. By controlling the transport module 20 to lift and retrieve the wafer 100 according to the preset lifting and retrieval parameters, the wafer 100 can be effectively protected, ensuring the reliability of the retrieval operation.

[0118] The wafer handling control method proposed in this application changes state when the pressure-emitting or color-changing device 12 carries the wafer 100, thereby acquiring a first image of the receiving space 111 captured on one side of the pick-and-place port 112, and controlling the handling module 20 to perform alignment based on the first image to complete the acquisition or placement of the wafer 100, thereby achieving precise alignment and gripping of the wafer 100 in the wafer box 10, and thus realizing precise handling and automated operation of the wafer 100.

[0119] Furthermore, in some embodiments, the transport module 20 includes a wafer carrier 22 for transporting the wafer 100 and a moving component 21 for driving the wafer carrier 22 to move. The wafer carrier 22 is provided with a wafer sensor 50 for sensing the contact state between the wafer carrier 22 and the wafer 100. The wafer transport control method further includes the following steps:

[0120] Step S401: Determine whether the transport module 20 is in an unloaded state or a loaded state based on the sensing signal output by the wafer sensor 50. If the transport module 20 is determined to be in the unloaded state, return to step S301. If the transport module 20 is determined to be in the loaded state, proceed to step S402.

[0121] Step S402: Adjust the current detection position parameter, the current material picking position parameter, or the current material unloading position parameter to preset values ​​respectively, and place the wafer 100 carried by the wafer carrier 22.

[0122] By sensing the pressure of the wafer 100 placed on the wafer carrier 22 by the wafer sensor 50, it can be determined whether the wafer 100 is on the wafer carrier 22. When the wafer 100 is not on the wafer carrier 22, that is, the transport module 20 is in the empty state, the wafer 100 has been placed. The transport module 20 moves to the current detection position according to the current detection position parameter for the next transport. When the wafer 100 is on the wafer carrier 22, that is, the transport module 20 is in the carrying state, step S402 is executed to place the wafer 100, and at the same time, the current detection position parameter, the current picking position parameter, or the current unloading position parameter is updated according to the preset value.

[0123] In the above embodiments, by determining whether the transport module 20 is in the no-load state or the loaded state, the movement of the transport module 20 can be more accurate and efficient, avoiding damage to the wafer 100 and downtime, while improving operational efficiency.

[0124] Specifically, the step of placing the wafer 100 carried by the wafer carrier 22 includes the following steps:

[0125] Step S501: The transfer module 20 performs a placement action to place the wafer 100 into the first material box 60 according to the preset placement parameters.

[0126] Step S502: After performing the placement action, determine whether the transport module 20 is in the no-load state based on the sensing signal of the wafer sensor 50. If the transport module 20 is in the no-load state, return to step S301. If the transport module 20 is in the load state, return to step S501.

[0127] It is understood that the first material box 60 can be a material box used to store the wafer 100 after it is taken out of the wafer box 10. After the wafer 100 is taken out of the wafer box 10, it is placed into the first material box 60 according to the placement parameters. If the placement is successful, the handling module 20 is in the idle state and can return to perform the next material retrieval. If the placement is unsuccessful, the placement operation continues. By determining whether the handling module 20 is in the idle state or the loaded state, the movement of the handling module 20 can be more accurate and efficient, avoiding damage to the wafer 100 and downtime, while improving operational efficiency.

[0128] Furthermore, before the step of placing the wafer 100 carried by the wafer carrier 22, a step of inspecting the wafer 100 may be included, which includes the following steps:

[0129] Step S601: Move the wafer 100 to the preset detection position.

[0130] It should be noted that the preset detection position can be a fixed detection position. Each time the wafer 100 is acquired, the transport module 20 can move the wafer 100 to the preset detection position.

[0131] Step S602: Perform defect detection on the wafer 100 at the preset detection position; if the wafer 100 passes the detection, proceed to step S501; if the wafer 100 fails the detection, proceed to step S603.

[0132] Specifically, the defect detection of the wafer 100 may include the following steps:

[0133] Step S701: Obtain a detection image of the wafer 100 being transported on the transport module 20 by taking a picture at the preset detection position.

[0134] Step S702: Analyze the defect ratio of the wafer 100 based on the detected image, and compare the defect ratio with a preset ratio to determine whether the wafer 100 is qualified.

[0135] In this embodiment, defect detection is performed on the wafer 100. The defect ratio of the wafer 100 is analyzed based on the detection image. This can be the wear defect ratio of the wafer 100. The preset ratio can be a preset wear defect ratio η. When the wear defect ratio of the wafer 100 is less than the preset wear defect ratio η, the wafer 100 is considered to be qualified and is placed into the first material box 60. When the wear defect ratio of the wafer 100 is greater than or equal to the preset wear defect ratio η, the wafer 100 is considered to be unqualified. By obtaining the detection image of the wafer 100 being transported on the transport module 20 by taking a picture at the preset detection position, it is possible to determine whether the wafer 100 is qualified. Pre-detection and classification can be performed during the transport process to provide pre-detection samples for the subsequent processing of the wafer 100, avoid waste materials entering the subsequent processing steps, thereby improving production efficiency and reducing equipment space occupation.

[0136] Step S603: Execute the placement action of the transport module 20 placing the wafer 100 in the second material box 70, and return to execute the step of moving to the current detection position according to the current detection position parameter.

[0137] The second material box 70 can be a recycling box for defective products. Defective wafers 100 can be recycled through the second material box 70. When the wear defect ratio of a wafer 100 is greater than or equal to a preset wear defect ratio η, the wafer 100 is deemed defective and is placed into the second material box 70. By performing the inspection step on the wafer 100 before placing it on the wafer carrier 22, pre-inspection can be carried out during handling, defective products can be detected in a timely manner, and pre-inspection samples can be provided for subsequent processing of the wafer 100, thereby improving production efficiency.

[0138] To ensure the accuracy and reliability of the wafer handling module 20 in placing the wafer 100 into the first material box 60 and the second material box 70, the wafer handling control method may further include the following steps:

[0139] Step S801: Before the transport module 20 places the wafer 100 into the first material box 60, a second image of the accommodating space 111 of the first material box 60 is captured from the pick-up and drop-out port 112 of the first material box 60. Based on the second image, the transport module 20 is controlled to perform material placement and alignment. After the material placement and alignment is completed, the transport module 20 is controlled to perform the placement action of placing the wafer 100 into the first material box 60.

[0140] Step S802: Before the transport module 20 places the wafer 100 into the second material box 70, a third image of the receiving space 111 of the second material box 70 is captured from the pick-up and drop-out port 112 of the second material box 70. Based on the third image, the transport module 20 is controlled to perform material placement and alignment. After the material placement and alignment is completed, the transport module 20 is controlled to perform the placement action of placing the wafer 100 into the second material box 70.

[0141] The process of acquiring the second and third captured images in steps S801 and S802, controlling the transport module 20 to perform material placement and alignment based on the second and third captured images, and then controlling the transport module 20 to place the wafer 100 into the first material box 60 and the second material box 70 after the material placement and alignment are completed is similar to the step of acquiring the first captured image, controlling the transport module 20 to perform material placement and alignment based on the first captured image, and then controlling the transport module 20 to place the wafer 100 into the wafer box 10 after the material placement and alignment are completed. Therefore, it will not be described in detail here. By acquiring the second captured image before the transport module 20 places the wafer 100 into the first material box 60 and / or acquiring the third captured image before the transport module 20 places the wafer 100 into the second material box 70, the transport module 20 can operate more accurately during each acquisition and / or placement of the wafer 100, ensuring the reliability of the wafer 100 handling operations and simultaneously ensuring operational efficiency.

[0142] Please see Figure 12 , Figure 12 This is a use disclosed in one embodiment of the present invention. Figure 11The diagram illustrates the workflow of a wafer handling device 1, which is part of a wafer handling control method. The wafer handling device 1 begins operation. The control module 40 initializes various preset parameters (including current pick-up position parameters, current unload position parameters, maximum detection position parameters, preset values, wear defect ratio η, etc.). Then, the control module 40 controls the handling module 20 and the vision sensing module 30 to move to the current detection position for visual detection based on the current detection position parameters. Specifically, the vision sensing module 30 captures a first image. Further, the control module 40 performs image cropping on the first image based on the first image and a preset region of interest. Then, it uses threshold segmentation to obtain the bright and dark areas in the cropped image to determine the position of the wafer 100, thereby determining the current position. If there is a wafer 100 at the current detection position, and if there is a wafer 100 at the current detection position, the parameters of the current picking position are corrected according to the first captured image, and the transport module 20 is controlled to align with the current detection position and perform the wafer 100 acquisition action according to the parameters of the current picking position. If there is no wafer 100 at the current detection position, it is determined whether the current detection position is the maximum detection position. If so, the loop ends, the work stops, and the work is restarted. If not, the parameters of the current detection position are adjusted to a preset value, and the control module 40 returns to the step of performing visual detection according to the adjusted parameters of the current detection position, that is, it controls the transport module 20 and the visual sensing module 30 to move to the next current detection position for visual detection.

[0143] Furthermore, after the handling module 20 acquires the wafer 100, the control module 40 determines whether the handling module 20 is in a loaded or unloaded state based on the second sensing signal output by the wafer sensor 50 on the handling module 20. If it is in an unloaded state, it returns to the visual inspection step. If it is in a loaded state, the handling module 20 moves the wafer to a preset detection position for defect detection. Specifically, the defect detection module acquires a detection image, and the control module 40 determines whether the defect ratio of the wafer 100 is less than a preset value based on the detection image. If it is less than the preset value, the handling module 20 can place the wafer 100 into the first material box 60. In addition, the detection image can be saved by the control module 40 for later review.

[0144] Specifically, before the wafer 100 is fed into the first material box 60, the transport module 20 can be controlled to move to the current detection position of the first material box 60 according to the pre-stored current detection position parameters of the first material box 60. Then, the visual sensing module 30 captures the accommodating space 111 of the first material box 60 to obtain a second captured image. Based on the second captured image, it is determined whether there is a wafer 100 at the current feeding position of the first material box 60. The current feeding position parameters of the first material box 60 are corrected based on the second captured image. Thus, the transport module 20 accurately aligns and performs the action of placing the wafer 100 into the first material box 60 according to the corrected current feeding position parameters of the first material box 60. Similarly, before the wafer 100 is fed into the second material box 70, the transport module 20 can be controlled to move to the current detection position of the second material box 70 according to the pre-stored current detection position parameters of the second material box 70. Then, the visual sensing module 30 can capture a third image of the accommodating space 111 of the second material box 70. Based on the third image, it can be determined whether there is a wafer 100 at the current feeding position of the second material box 70. The current feeding position parameters of the second material box 70 can be corrected based on the third image. Thus, the transport module 20 can accurately align and perform the action of placing the wafer 100 into the second material box 70 according to the corrected current feeding position parameters of the second material box 70.

[0145] Further, after the transport module 20 performs the placement action, the control module 40 further determines whether the transport module 20 is in a loaded state or an unloaded state based on the second sensing signal output by the wafer sensor 50. If it is in an unloaded state, the current detection position parameter of the pre-stored first material box 60 is updated, such as by adjusting a preset value to correspond to the next detection position of the first material box 60, and the current detection position parameter of the pre-stored second material box 70 is updated, such as by adjusting a preset value to correspond to the next detection position, and the process returns to execute the acquisition action of the next wafer 100 of the wafer box 10; if it is in a loaded state, the control module 40 controls the transport module 20 to return to execute the defect detection step based on the detection image, so that the steps of detecting the defect detection module 80 to capture and acquire the second or third captured image, and the re-placement and other actions can be repeated. In addition, if Figure 13 As shown, in some other embodiments, if it is in the bearing state, the control module 40 can also control the handling module 20 to return to perform the step of detecting the defect detection module 80 to capture a second or third image, as well as the action of re-unloading and placing the material.

[0146] In summary, in the wafer handling equipment 1 and wafer handling control method provided in the embodiments of this application,

[0147] 1. The pressure-emitting or color-changing device 12 and the first industrial camera 32 directly detect the wafer 100 and the wafer box 10, which is not affected by the assembly error between the actual storage slots 115 of the wafer 100. It can realize automatic alignment and precise picking and placing during the wafer handling process, and can also accurately determine the presence or absence of the wafer 100 in real time and count other composite functions. It has a certain adaptive adjustment capability to the positioning error introduced by environmental disturbances, and has good flexibility, compliance and reliability.

[0148] 2. The wafer handling equipment 1 and wafer handling method described above use pressure sensors 13 symmetrically arranged on each layer of the support plate 114 of the wafer box 10 and wafer sensors 50 symmetrically arranged at the end of the wafer carrier 22 to sense the contact state between the wafer 100 and the support plate 114 of the wafer box 10, and between the wafer 100 and the wafer carrier 22 in real time. This allows for precise sensing and synchronous counting of the wafer 100 picking and placing, thereby ensuring the reliability of the wafer 100 picking, placing and handling process.

[0149] 3. The wafer handling equipment 1 and wafer handling method described above use a second industrial camera 811 to perform pre-inspection of the wafer 100 on the necessary path for picking up and placing the wafer 100. The pre-inspection and classification process during the handling process can provide pre-inspection samples for the subsequent processing of the wafer 100, avoid waste materials from entering the subsequent processing steps, and thus improve production efficiency.

[0150] Example 2:

[0151] like Figure 14 As shown in the figure, this application discloses a wafer handling device 1, which includes a wafer cassette 10, a handling module 20, a vision sensing module 30, and a control module 40. In this embodiment, the wafer cassette 10 includes a carrier 11 and a plurality of pressure-emitting or color-changing devices 12. The handling module 20 is used to acquire or place the wafer 100 from the pick-and-place port 112. The vision sensing module 30 is used to capture an image of the receiving space 111 on one side of the pick-and-place port 112 and output a first captured image. The control module 40 is electrically connected to the handling module 20 and the vision sensing module 30, and is used to receive and control the handling module 20 to perform alignment according to the first captured image, and control the handling module 20 to acquire or place the wafer 100 after the alignment is completed.

[0152] It is understood that the wafer handling device 1 proposed in this application can acquire or place the wafer 100 from the wafer cassette 10. During the handling of the wafer 100, the vision sensing module 30 captures an image of the receiving space 111 on one side of the pick-and-place port 112 and outputs a first captured image. The control module 40 controls the handling module 20 to perform alignment based on the first captured image, and acquires or places the wafer 100. Therefore, the wafer handling device 1 can achieve precise alignment and gripping of the wafer 100 in the wafer cassette 10, and further realize precise handling and automated operation of the wafer 100.

[0153] Please see Figures 15 to 17 As shown, in this embodiment, the wafer cassette 10 includes a carrier 11 and a plurality of pressure-emitting or color-changing devices 12. The carrier 11 includes a receiving space 111 and a pick-and-place port 112 located on one side of the receiving space 111. The receiving space 111 is used to receive multiple wafers 100. The carrier 11 includes a substrate 113 and a plurality of carrier plates 114 connected to the side of the substrate 113 near the receiving space 111. Each pressure-emitting or color-changing device 12 is disposed corresponding to one carrier plate 114 and is at least partially disposed on the carrier plate 114 for supporting the wafer 100. When subjected to pressure from the wafer 100, it changes from a first state to a second state, wherein the first state and the second state are a first color state and a second color state, respectively. It is understood that the wafer 100 is flat, and each of the carrier plates 114 is equipped with a pressure-emitting or color-changing device 12. When the wafer 100 is placed in the wafer cassette 10 and supported on the carrier plate 114, when it receives external light, the pressure-emitting or color-changing device 12 on the carrier plate 114 changes from a first color state to a second color state under the pressure of the wafer 100. This indicates the supporting position of the wafer 100, making it easier to observe the storage status of the wafer 100 in the wafer cassette 10. Furthermore, the state change of the pressure-emitting or color-changing device 12 is triggered only by pressure, eliminating the need for light detection on each wafer 100, thus greatly saving energy. The pressure-emitting or color-changing device 12 changes state as soon as it is pressed, making it more intelligent and precise. For example, the first color can be red, and the second color can be green.

[0154] Further, the portion of the pressure-emitting or color-changing device 12 disposed on the carrier plate 114 extends from one end of the carrier plate 114 away from the pick-and-place port 112 to one end of the carrier plate 114 near the pick-and-place port 112; or the carrier plate 114 includes a first portion 114a near the pick-and-place port 112, a second portion 114c away from the pick-and-place port 112, and an intermediate portion 114b connecting the first portion 114a and the second portion 114c, the portion of the pressure-emitting or color-changing device 12 carrying the wafer 100 is disposed in the intermediate portion 114b, and the length of the portion of the pressure-emitting or color-changing device 12 disposed on the carrier plate 114 is less than or equal to the length of the portion of the wafer 100 carried by the pressure-emitting or color-changing device 12 along a first direction, the first direction being the direction from the first portion 114a to the second portion 114c. It should be noted that the pressure-emitting or color-changing device 12 can cover the carrier plate 114, that is, it is disposed from the end of the carrier plate 114 away from the pick-up and drop-off port 112 to the end of the carrier plate 114 near the pick-up and drop-off port 112. In this case, the coverage area of ​​the pressure-emitting or color-changing device 12 is large. Therefore, the state change of the pressure-emitting or color-changing device 12 is not affected by the placement deviation of the wafer 100, and it can more accurately sense the pressure of the wafer 100 and change its state, accurately indicating the position of the wafer 100. In other embodiments, since the wafer 100 is usually of a regular shape, when the wafer 100 is placed on the carrier plate 114, the carrier plate 114 supports the edge of the wafer 100. In order to save space... The raw materials are designed to make the pressure sensing of the wafer 100 more accurate and focused. The portion of the wafer 100 that is supported by the pressure-emitting or color-changing device 12, i.e., the portion that senses the pressure of the wafer 100, can be located in the middle portion 114b of the support plate 114. The length of the portion of the pressure-emitting or color-changing device 12 located on the support plate 114 is less than or equal to the length of the portion of the wafer 100 supported by the pressure-emitting or color-changing device 12 along the first direction. In this case, the wafer 100 can be made to fully contact the pressure-emitting or color-changing device 12 when it is placed on the support plate 114, so that the pressure-emitting or color-changing device 12 can accurately sense the pressure of the wafer 100 and accurately indicate the placement position of the wafer 100.

[0155] Furthermore, the pressure-sensitive light-emitting or color-changing device 12 includes a support film 121 disposed on the support plate 114 for supporting the wafer 100. The support film 121 includes a pressure-sensitive color-changing material for receiving external light and changing from a first color state to a second color state when subjected to pressure from the wafer 100. The pressure-sensitive color-changing material is a type of smart material that changes color under external force, including pressure-sensitive phosphorescent materials, etc. The pressure-sensitive color-changing material is disposed on the carrier plate 114 as the carrier film 121. When the carrier plate 114 is subjected to pressure from the wafer 100, the pressure-sensitive light-emitting or color-changing device 12 can change from the first color state to the second color state, thereby indicating the carrier position of the wafer 100. This makes it easier to observe the storage status of the wafer 100 in the wafer box 10 more clearly. Furthermore, the pressure-sensitive light-emitting or color-changing device 12 does not occupy the space of the wafer box 10, does not obstruct the placement and removal of the wafer 100, and does not require external power, thus saving energy and being more environmentally friendly. Moreover, the change of state is triggered by pressure, eliminating the need for light detection on each wafer 100, making it more intelligent and precise.

[0156] In this embodiment, the wafer cassette 10, except for the structure and features described above, has similar structure and features to the wafer cassette 10 in Embodiment 1, and will not be repeated here.

[0157] Furthermore, the control module 40 performs image cropping on the first captured image based on a preset region of interest, then performs channel separation on the cropped image based on the HSV color model, and performs threshold segmentation within the H channel to extract the image of the corresponding color range to determine the position of the wafer 100, and controls the alignment of the handling module 20 based on the position of the wafer 100. By identifying and cropping the region of interest of the first captured image, performing channel separation on the cropped image based on the HSV color model, performing threshold segmentation within the H channel, and extracting the image of the corresponding color range to determine the accurate position of the wafer 100, the algorithm is mature, highly accurate, and can quickly achieve automated handling of the wafer 100.

[0158] Further, please refer to Figures 18 to 19As shown, the handling module 20 includes a moving component 21 electrically connected to the control module 40 and a wafer carrier 22 connected to the moving component 21. The moving component 21 drives the wafer carrier 22 to move under the control of the control module 40. The vision sensing module 30 is disposed on the wafer carrier 22, so that the vision sensing module 30 can move together with the wafer carrier 22. By disposing the vision sensing module 30 on the wafer carrier 22 of the handling module 20, the vision sensing module 30 can move together with the wafer carrier 22, thus eliminating the need for other devices to drive the movement of the vision sensing module 30 separately. Furthermore, the viewing angle from which the vision sensing module 30 captures the first image is the same as the operating viewing angle of the wafer carrier 22, simplifying the control algorithm and reducing errors. This achieves precise handling and automated operation of the wafer 100 while maintaining higher operational efficiency.

[0159] Specifically, the mobile component 21 includes a base 211, a first movable joint 212 mounted on the base 211 and extendable along a second preset direction, a first rotating arm 213 rotatably connected at one end to the first movable joint 212, a second rotating arm 214 rotatably connected at one end to the other end of the first rotating arm 213, and a wafer carrier 22 rotatably connected to the other end of the second rotating arm 214. In this embodiment, multiple carrier plates 114 are spaced apart along a first preset direction. The first preset direction and the second preset direction can be the same direction. It can be understood that the mobile component 21 is a multi-degree-of-freedom robot. The second rotating arm 214 and the wafer carrier 22 can be integrally connected or rotatably connected. The mobile component 21 can realize precise handling and automated operation of the wafer 100.

[0160] Furthermore, the wafer carrier 22 includes a connecting base 221 and a transport unit 222. The connecting base 221 is disposed on the moving component 21 along the second preset direction, and the transport unit 222 is connected to one side of the connecting base 221. The visual sensing module 30 is disposed along the second preset direction on the side of the connecting base 221 away from the moving component 21, and the visual sensing module 30 is used to capture images towards the side where the transport unit 222 is located. It can be understood that the first moving joint 212, the connecting base 221, and the visual sensing module 30 are all disposed along the second preset direction, so there is no need for position conversion during the pick-up and place process, which improves the accuracy and efficiency of positioning during the pick-up and place process of the wafer 100. By connecting the moving component 21, the visual sensing module 30, and the transport unit 222, the control can be more efficient and the transport more accurate.

[0161] Further, the visual sensing module 30 includes a camera mounting plate 31 disposed on the connecting base 221, a first industrial camera 32 disposed on the camera mounting plate 31, and a first lens 33 and a light source 12a mounted on the first industrial camera 32. In this embodiment, the first lens 33 may be a telecentric lens, and the light source 12a is an external light source used to provide external light to illuminate the pressure-emitting or color-changing device 12, thereby capturing a first image with the pressure-emitting or color-changing device 12 through the first lens 32, and in the first image, the pressure-emitting or color-changing device 12 has a first color or a second color. The light source 12a is a ring-shaped light-emitting element, and the light source 12a emits light from the pick-and-place port 112 side of the wafer cassette 10 into the receiving space 111, and the first industrial camera 32 captures the wafer 100 through the hollow area of ​​the ring-shaped light-emitting element to obtain the first image.

[0162] Furthermore, the wafer handling equipment 1 also includes a wafer sensor 50. The wafer sensor 50 is disposed on the surface of the handling section 222 near the wafer 100 and located at the end of the handling section 222 away from the connecting substrate 221. The wafer sensor 50 is electrically connected to the control module 40 and is used to sense the wafer 100 and output a second sensing signal to the control module 40, so that the control module 40 counts and / or monitors the handling of the wafer 100 by the handling module 20. By disposing the wafer sensor 50 on the surface of the handling section 222 near the wafer 100 and located at the end of the handling section 222 away from the connecting substrate 221, the control module 40 can perceive the contact state between the wafer 100 and the handling section 222 in real time through the second sensing signal, accurately perceive and synchronously count the handling of the wafer 100, thereby ensuring the reliability of the handling and transportation process of the wafer 100.

[0163] Specifically, the conveying unit 222 includes two arm portions 222a, both of which are connected to the connecting base 221 and form a U-shape with an opening. The opening faces away from the connecting base 221. The wafer sensor 50 is disposed at the end of the arm portion 222a away from the connecting base 221. A wafer sensor 50 is respectively disposed on the side of the two arm portions 222a that carries the wafer 100. The wafer sensor 50 is a pressure thin-film sensor. In this embodiment, the optical axis direction of the first industrial camera 32 and the first lens 33 is consistent with the axial direction of the U-shaped opening formed by the two arm portions 222a. By providing wafer sensors 50 on one side of the two arms 222a that carry the wafer 100, the pressure sensing of the wafer 100 can be made unaffected by the positional offset of the wafer 100, making the sensing more accurate. At the same time, the wafer sensors 50 are pressure thin film sensors, which can accurately sense the pressure of the wafer 100 without affecting the picking and placing of the wafer 100.

[0164] Furthermore, the control module 40 monitors whether the transport module 20 acquires the wafer 100 from the wafer cassette 10 based on the second sensing signal. When the control module 40 determines that the transport module 20 is in an idle state based on the second sensing signal, the control module 40 controls the visual sensing module 30 to re-capture the updated first captured image of the receiving space 111 from the pick-up and drop-off port 112, and performs re-alignment based on the updated first captured image. After completing the re-alignment, the control module 40 controls the transport module 20 to acquire the wafer 100. It is understood that after each operation of acquiring the wafer 100, the control module 40 will detect the acquisition operation. When it detects that the transport module 20 is in an idle state, it indicates that the acquisition operation of the wafer 100 has failed. At this time, the control module 40 can control the vision sensing module 30 to re-capture the updated first image of the receiving space 111 from the pick-up and put-down port 112, and re-align the wafer 100 based on the updated first image. This avoids subsequent inaccurate acquisition operations caused by erroneous operations, or even shutdown of the entire wafer transport equipment 1. By determining whether the transport module 20 is in an idle state based on the second sensing signal, the control module 40 can re-align the wafer 100 when the transport module 20 is in an idle state, thus avoiding downtime and improving operational efficiency.

[0165] Furthermore, it can be understood that the wafer handling device 1, which includes a wafer cassette 10, a handling module 20, and a vision sensing module 30, can be used to handle wafers in the wafer cassette 10 to other cassettes (such as the first cassette 60 or the second cassette 70), or to handle wafers in other cassettes to the wafer cassette 10 for storage. The following description primarily uses the example of the wafer handling device 1 handling wafers in the wafer cassette 10 to other cassettes.

[0166] Specifically, in one embodiment, the wafer handling device 1 further includes a first material box 60, and the handling module 20 is used to obtain the wafer 100 from the wafer box 10 and transport and place it into the first material box 60. When the control module 40 determines, based on the second sensing signal, that the handling module 20 is still in a carrying state after performing the placement action of placing the wafer 100 into the first material box 60, the control module 40 controls the handling module 20 to perform the placement action of placing the wafer 100 into the first material box 60 again. It is understood that after placing the wafer 100 into the first material container 60, the control module 40 will detect the placement operation. When it detects that the transport module 20 is still in a carrying state, it proves that the placement operation of the wafer 100 has failed. At this time, the control module 40 can control the transport module 20 to perform the placement operation of placing the wafer 100 into the first material container 60 again, avoiding damage caused by misalignment of the wafer 100, or even causing the entire wafer transport equipment 1 to stop. By determining whether the transport module 20 is in a carrying state after performing the placement operation of placing the wafer 100 into the first material container 60 based on the second sensing signal, the control module 40 can perform the placement operation of placing the wafer 100 into the first material container 60 again when the transport module 20 is in a carrying state, avoiding damage to the wafer 100 and downtime, while improving operational efficiency.

[0167] Furthermore, the wafer handling equipment 1 may also include a second cassette 70 and a defect detection module 80. The defect detection module 80 is located on the handling path of the handling module 20 from the wafer cassette 10 to the first cassette 60. The defect detection module 80 is electrically connected to the control module 40. The defect detection module 80 is used to perform defect detection on the wafer 100 transported by the handling module 20 and output defect detection information to the control module 40. The control module 40 is also used to control the handling module 20 to place the qualified wafer 100 in the first cassette 60 and the unqualified wafer 100 in the second cassette 70 according to the defect detection information. It is understood that the transport module 20, on its transport path from the wafer cassette 10 to the first material box 60, will first pass through the defect detection module 80 and perform defect detection at the defect detection module 80. The control module 40 controls the transport module 20 to place the qualified wafer 100 into the first material box 60 and the unqualified wafer 100 into the second material box 70 based on the defect detection information after detection by the defect detection module 80. By setting the defect detection module 80 on the transport path from the wafer cassette 10 to the first material box 60, and simultaneously performing defect detection on the wafer 100, the transport error generated during the transport of the wafer 100 can be reduced, transport time can be saved, and detection efficiency can be improved. At the same time, placing the defective wafer 100 in the second material box 70 allows for pre-inspection and classification during the transport process, providing pre-inspection samples for the subsequent processing of the wafer 100, avoiding waste from entering the later processing steps, thereby improving production efficiency and reducing equipment space occupation.

[0168] It is understood that the first material box 60 and the second material box 70 can have the same structure as the wafer box 10, so the specific structure of the first material box 60 and the second material box 70 will not be described again here.

[0169] Furthermore, the visual sensing module 30 is also used to capture a second image of the receiving space 111 of the first material box 60 from the pick-up / placement port 112 of the first material box 60 before the transport module 20 places the wafer 100 into the first material box 60. The control module 40 is also used to control the transport module 20 to perform placement alignment based on the second image, and after the placement alignment is completed, control the transport module 20 to perform the placement action of placing the wafer 100 into the first material box 60 or the step of detecting the wafer 100. ; and / or the visual sensing module 30 is further configured to capture a third image of the receiving space 111 of the second material box 70 from the pick-up and drop-out port 112 of the second material box 70 before the transport module 20 places the wafer 100 into the second material box 70. The control module 40 is further configured to control the transport module 20 to perform material placement alignment based on the third image, and after the material placement alignment is completed, control the transport module 20 to perform the placement action of placing the wafer 100 into the second material box 70 or the step of detecting the wafer 100. By taking a second image of the receiving space 111 of the first material box 60 from the pick-up / placement port 112 of the first material box 60 before the transport module 20 places the wafer 100 into the first material box 60, and / or taking a third image of the receiving space 111 of the second material box 70 from the pick-up / placement port 112 of the second material box 70 before the transport module 20 places the wafer 100 into the second material box 70, the transport module 20 can operate more accurately during each acquisition and / or placement of the wafer 100, ensuring the reliability of the wafer 100 acquisition and placement operation, while also ensuring operational efficiency.

[0170] Furthermore, the defect detection information includes detection images. The defect detection module 80 includes a camera module 81 and a bracket 82 supporting the camera module 81. The camera module 81 is used to capture the detection images of the wafer 100 transported by the handling module 20. The control module 40 is also used to analyze the defect ratio of the wafer 100 based on the detection images and compare the defect ratio with a preset ratio to determine whether the wafer 100 is qualified.

[0171] Furthermore, the bracket 82 includes a support body 821, a camera support portion 822 connected to one side of the support body 821, and a light source support portion 823 connected to one side of the support body 821. The camera module 81 includes a second industrial camera 811, a second lens 812, and a fill light 813. The second lens 812 is mounted on the second industrial camera 811, and the second industrial camera 811 is located at the end of the camera support portion 822 away from the support body 821. The fill light 813 is located at the end of the light source support portion 823 away from the support body 821. The wafer 100 transported by the transport module 20 is placed parallel to a first reference plane, which is the plane on which the wafer is placed. The second industrial camera 811 faces the wafer 100, and the optical axis of the second industrial camera 811 is perpendicular to the first reference plane. The supplementary light 813 includes a ring-shaped light-emitting element, which is located between the second industrial camera 811 and the transport module 20 and is used to emit light towards the wafer 100. The second industrial camera 811 is used to capture images of the wafer 100 through the hollow area of ​​the ring-shaped light-emitting element to obtain the detection image. In this embodiment, the second lens 812 can be a telecentric lens. By setting the wafer 100 transported by the transport module 20 to be placed parallel to the first reference plane, and the second industrial camera 811 facing the wafer 100 with its optical axis perpendicular to the first reference plane, the second industrial camera 811 can capture images of the wafer 100 vertically. Simultaneously, under the illumination of the supplementary light 813, the defect detection by the defect detection module 80 can be more accurate and precise.

[0172] Please see Figure 20 As shown in one embodiment of this application, when the wafer handling equipment 1 performs the pick-and-place operation of the wafer 100, it can complete the pick-and-place of the wafer 100 by executing a wafer handling control method. The wafer handling control method includes the following steps:

[0173] Step S101: Provide wafer cassette 10.

[0174] The wafer cassette 10 includes a carrier 11 and a plurality of pressure-emitting or color-changing devices 12. The carrier 11 includes a receiving space 111 and a pick-and-place port 112 located on one side of the receiving space 111. The receiving space 111 is used to receive multiple wafers 100. The carrier 11 includes a substrate 113 and a plurality of carrier plates 114 connected to the side of the substrate 113 near the receiving space 111. Each pressure-emitting or color-changing device 12 is disposed corresponding to one carrier plate 114 and is at least partially disposed on the carrier plate 114 for supporting the wafer 100. When subjected to pressure from the wafer 100, it changes from a first state to a second state, wherein the first state and the second state are a non-emitting state and an emitting state, respectively.

[0175] Step S102: Acquire a first image of the receiving space 111 taken from one side of the receiving port 112.

[0176] It is understood that when multiple wafers 100 are placed in the wafer cassette 10, in step S102, when the light source 12a illuminates the accommodating space 111, the first captured image is an image with color contrast stripes showing the second luminous state of the pressure-emitting or color-changing device 12 carrying the wafer 100 in the wafer cassette 10 receiving external light, and the first luminous state of the pressure-emitting or color-changing device 12 not carrying the wafer 100 receiving external light.

[0177] It is understood that the wafer handling control method may further include the following steps:

[0178] Step S301: Before acquiring the first captured image, control the transport module 20 to move to the current detection position according to the current detection position parameters.

[0179] The current detection position can be the position where the wafer 100 is picked up or placed. In this embodiment, the current detection position can be the position where the first image is captured.

[0180] Step S302: Based on the first captured image, determine whether the wafer 100 is present at the current picking position or the current unloading position corresponding to the current detection position. If the wafer 100 is present at the current picking position or the wafer 100 is not placed at the current unloading position, then proceed to step S103.

[0181] It can be understood that the aforementioned wafer handling control method can be applied to the picking or unloading of wafers from the wafer cassette 10 to other cassettes (such as the first cassette 60 or the second cassette 70), and can also be applied to the unloading of wafers from other cassettes into the wafer cassette 10. The following explanation will take the unloading of wafers from the wafer cassette 10 to other cassettes using the wafer handling device 1 as an example.

[0182] In step S302, during the material picking operation, if the current picking position has the wafer 100, the picking operation is performed after alignment. During the material unloading operation, if the current unloading position does not have the wafer 100, the unloading operation is performed after alignment. By determining whether the current picking position or the current unloading position corresponding to the current detection position has the wafer 100, the alignment of the handling module 20 is controlled. This avoids misalignment operations when the current picking position does not have the wafer 100 or the current unloading position already has the wafer 100, thereby preventing damage to the wafer 100 and avoiding downtime caused by operational errors, thus improving the reliability and efficiency of the operation.

[0183] In this embodiment, in step S302, if the wafer 100 is not present at the current picking position or the wafer 100 is placed at the current unloading position, it is determined whether the current detection position is the maximum detection position. If the current detection position is the maximum detection position, the transport module 20 is controlled to return to the initial position. If the current detection position is not the maximum detection position, the current detection position parameter, the current picking position parameter, or the current unloading position parameter are adjusted to preset values ​​respectively, and the step of controlling the transport module 20 to move to the current detection position based on the current detection position parameter is executed according to the adjusted current detection position parameter.

[0184] It should be noted that the wafer cassette 10 has a limited number of wafer 100 storage positions, with a preset interval distance between each storage position. In this embodiment, the preset interval distance can be Δz. The maximum detection position is the detection position corresponding to the last storage position of the wafer cassette 10 where the wafer 100 is placed. When the current detection position is the maximum detection position, the handling module 20 is controlled to return to the initial position, which can be the default position. When the current detection position is not the maximum detection position, the current detection position parameter, the current picking position parameter, or the current unloading position parameter are adjusted to preset values ​​to obtain updated current detection position parameters, current picking position parameters, or current unloading position parameters. In this embodiment, the preset value can be the preset interval distance of the wafer cassette 10, i.e., Δz. By determining that the current detection position is the maximum detection position, the handling module 20 can quickly return to the initial position after reaching the maximum detection position to perform subsequent operations, improving operational efficiency.

[0185] Step S103: The transport module 20 is aligned according to the first captured image.

[0186] Image analysis is performed on the first captured image obtained in step S102. The first captured image can be cropped according to a preset region of interest. The preset region of interest in the first captured image can be the location of the stripes of the second color light, that is, the location of the wafer 100. Then, based on the color HSV model, channel separation is performed on the cropped image, and threshold segmentation is performed in the H channel to extract the image of the corresponding color range to know the location of the wafer 100. Thus, the storage information of the wafer 100 in the wafer cassette 10 can be obtained, and the alignment of the transport module 20 can be controlled according to the location of the wafer 100.

[0187] It is understood that the control module 40 of the wafer handling equipment 1 may store the current pick-up position parameters or the current unload position parameters. Specifically, step S102 may include the following steps:

[0188] Step S201: Correct the current material picking position parameter or the current material unloading position parameter based on the first captured image to obtain the corrected material picking position parameter or the corrected material unloading position parameter, and update the current material picking position parameter or the current material unloading position parameter based on the corrected material picking position parameter or the corrected material unloading position parameter;

[0189] It can be understood that the current pick-up position parameter is the position parameter of the wafer 100 that needs to be picked up in the wafer cassette 10, and the current unloading position parameter is the position parameter of the wafer 100 that needs to be unloaded that should be placed in the wafer cassette 10. The current pick-up position parameter or the current unloading position parameter can be obtained by calculation. In this embodiment, the wafers 100 in the wafer cassette 10 are stored at intervals, and the interval distance can be a preset interval Δz. After the pick-up or unloading is completed at the current pick-up position or the current unloading position, the current pick-up position parameter is updated to the previous pick-up position parameter + Δz, and the current unloading position parameter is updated to the previous unloading position parameter + Δz. To ensure operational accuracy, before performing material handling or unloading operations, image analysis can be performed on the first captured image to obtain corrected material handling position parameters or corrected unloading position parameters. Finally, the current material handling position parameters or current unloading position parameters are updated based on the corrected material handling position parameters or corrected unloading position parameters. After completing the material handling or unloading operation, the updated current material handling position parameters or current unloading position parameters are incremented by Δz to obtain the current material handling position parameters or current unloading position parameters for the next material handling or unloading operation.

[0190] Step S202: Control the conveying module 20 to move to the current picking position or the current unloading position according to the corrected picking position parameter or the corrected unloading position parameter.

[0191] It is understood that by controlling the transport module 20 to move to the current picking position or the current unloading position based on the corrected picking position parameter or the corrected unloading position parameter obtained from the first captured image, the operation can be more accurate, thereby avoiding damage to the wafer 100, and also avoiding downtime caused by operational errors, thus improving the reliability and efficiency of the operation.

[0192] Step S104: After completing the alignment, control the transport module 20 to acquire or place the wafer 100.

[0193] Based on the corrected material picking position parameter or the corrected material unloading position parameter, the transport module 20 is controlled to move to the current material picking position or the current material unloading position. That is, the transport module 20 extends into the wafer cassette 10 and reaches the current material picking position or the current material unloading position, so that the transport module 20 can perform material picking or unloading operations.

[0194] Specifically, the step of controlling the transport module 20 to place the wafer 100 after completing the alignment may include a step executed after the transport module 20 moves to the current unloading position, controlling the transport module 20 to place and return the wafer 100 according to preset descent and return parameters. It can be understood that after moving to the current unloading position, the transport module 20 descends according to preset descent parameters, placing the wafer 100 on the carrier 11. The preset descent parameters can be a preset descent distance. Then, the transport module 20 returns according to return parameters, which can be a default return position or the position for the next operation. By controlling the transport module 20 to place and return the wafer 100 according to preset descent and return parameters after the transport module 20 moves to the current unloading position, the operational efficiency of the wafer 100 placement and removal operation can be improved.

[0195] The step of controlling the transport module 20 to acquire the wafer 100 after completing the alignment may include a step executed after the transport module 20 moves to the current picking position, controlling the transport module 20 to lift and retrieve the wafer 100 according to preset lifting and retrieval parameters. It can be understood that after moving to the current picking position, the transport module 20 lifts the wafer 100 according to preset lifting parameters, placing the wafer 100 on the transport module 20. The preset lifting parameters can be a preset lifting distance. Then, the transport module 20 retrieves the wafer 100 according to the retrieval parameters. By controlling the transport module 20 to lift and retrieve the wafer 100 according to the preset lifting and retrieval parameters, the wafer 100 can be effectively protected, ensuring the reliability of the retrieval operation.

[0196] The wafer handling control method proposed in this application changes state when the pressure-emitting or color-changing device 12 carries the wafer 100, thereby acquiring a first image of the receiving space 111 captured on one side of the pick-and-place port 112, and controlling the handling module 20 to perform alignment based on the first image to complete the acquisition or placement of the wafer 100, thereby achieving precise alignment and gripping of the wafer 100 in the wafer box 10, and thus realizing precise handling and automated operation of the wafer 100.

[0197] Furthermore, in some embodiments, the transport module 20 includes a wafer carrier 22 for transporting the wafer 100 and a moving component 21 for driving the wafer carrier 22 to move. The wafer carrier 22 is provided with a wafer sensor 50 for sensing the contact state between the wafer carrier 22 and the wafer 100. The wafer transport control method further includes the following steps:

[0198] Step S401: Determine whether the transport module 20 is in an unloaded state or a loaded state based on the sensing signal output by the wafer sensor 50. If the transport module 20 is determined to be in the unloaded state, return to step S301. If the transport module 20 is determined to be in the loaded state, proceed to step S402.

[0199] Step S402: Adjust the current detection position parameter, the current material picking position parameter, or the current material unloading position parameter to preset values ​​respectively, and place the wafer 100 carried by the wafer carrier 22.

[0200] By sensing the pressure of the wafer 100 placed on the wafer carrier 22 by the wafer sensor 50, it can be determined whether the wafer 100 is on the wafer carrier 22. When the wafer 100 is not on the wafer carrier 22, that is, the transport module 20 is in the empty state, the wafer 100 has been placed. The transport module 20 moves to the current detection position according to the current detection position parameter for the next transport. When the wafer 100 is on the wafer carrier 22, that is, the transport module 20 is in the carrying state, step S402 is executed to place the wafer 100, and at the same time, the current detection position parameter, the current picking position parameter, or the current unloading position parameter is updated according to the preset value.

[0201] In the above embodiments, by determining whether the transport module 20 is in the no-load state or the loaded state, the movement of the transport module 20 can be more accurate and efficient, avoiding damage to the wafer 100 and downtime, while improving operational efficiency.

[0202] Specifically, the step of placing the wafer 100 carried by the wafer carrier 22 includes the following steps:

[0203] Step S501: The transfer module 20 performs a placement action to place the wafer 100 into the first material box 60 according to the preset placement parameters.

[0204] Step S502: After performing the placement action, determine whether the transport module 20 is in the no-load state based on the sensing signal of the wafer sensor 50. If the transport module 20 is in the no-load state, return to step S301. If the transport module 20 is in the load state, return to step S501.

[0205] It is understood that the first material box 60 can be a material box used to store the wafer 100 after it is taken out of the wafer box 10. After the wafer 100 is taken out of the wafer box 10, it is placed into the first material box 60 according to the placement parameters. If the placement is successful, the handling module 20 is in the idle state and can return to perform the next material retrieval. If the placement is unsuccessful, the placement operation continues. By determining whether the handling module 20 is in the idle state or the loaded state, the movement of the handling module 20 can be more accurate and efficient, avoiding damage to the wafer 100 and downtime, while improving operational efficiency.

[0206] Furthermore, before the step of placing the wafer 100 carried by the wafer carrier 22, a step of inspecting the wafer 100 may be included, which includes the following steps:

[0207] Step S601: Move the wafer 100 to the preset detection position.

[0208] It should be noted that the preset detection position can be a fixed detection position. Each time the wafer 100 is acquired, the transport module 20 can move the wafer 100 to the preset detection position.

[0209] Step S602: Perform defect detection on the wafer 100 at the preset detection position; if the wafer 100 passes the detection, proceed to step S501; if the wafer 100 fails the detection, proceed to step S603.

[0210] Specifically, the defect detection of the wafer 100 may include the following steps:

[0211] Step S701: Obtain a detection image of the wafer 100 being transported on the transport module 20 by taking a picture at the preset detection position.

[0212] Step S702: Analyze the defect ratio of the wafer 100 based on the detected image, and compare the defect ratio with a preset ratio to determine whether the wafer 100 is qualified.

[0213] In this embodiment, defect detection is performed on the wafer 100. The defect ratio of the wafer 100 is analyzed based on the detection image. This can be the wear defect ratio of the wafer 100. The preset ratio can be a preset wear defect ratio η. When the wear defect ratio of the wafer 100 is less than the preset wear defect ratio η, the wafer 100 is considered to be qualified and is placed into the first material box 60. When the wear defect ratio of the wafer 100 is greater than or equal to the preset wear defect ratio η, the wafer 100 is considered to be unqualified. By obtaining the detection image of the wafer 100 being transported on the transport module 20 by taking a picture at the preset detection position, it is possible to determine whether the wafer 100 is qualified. Pre-detection and classification can be performed during the transport process to provide pre-detection samples for the subsequent processing of the wafer 100, avoid waste materials entering the subsequent processing steps, thereby improving production efficiency and reducing equipment space occupation.

[0214] Step S603: Execute the placement action of the transport module 20 placing the wafer 100 in the second material box 70, and return to execute the step of moving to the current detection position according to the current detection position parameter.

[0215] The second material box 70 can be a recycling box for defective products. Defective wafers 100 can be recycled through the second material box 70. When the wear defect ratio of a wafer 100 is greater than or equal to a preset wear defect ratio η, the wafer 100 is deemed defective and is placed into the second material box 70. By performing the inspection step on the wafer 100 before placing it on the wafer carrier 22, pre-inspection can be carried out during handling, defective products can be detected in a timely manner, and pre-inspection samples can be provided for subsequent processing of the wafer 100, thereby improving production efficiency.

[0216] To ensure the accuracy and reliability of the wafer handling module 20 in placing the wafer 100 into the first material box 60 and the second material box 70, the wafer handling control method may further include the following steps:

[0217] Step S801: Before the transport module 20 places the wafer 100 into the first material box 60, a second image of the accommodating space 111 of the first material box 60 is captured from the pick-up and drop-out port 112 of the first material box 60. Based on the second image, the transport module 20 is controlled to perform material placement and alignment. After the material placement and alignment is completed, the transport module 20 is controlled to perform the placement action of placing the wafer 100 into the first material box 60.

[0218] Step S802: Before the transport module 20 places the wafer 100 into the second material box 70, a third image of the receiving space 111 of the second material box 70 is captured from the pick-up and drop-out port 112 of the second material box 70. Based on the third image, the transport module 20 is controlled to perform material placement and alignment. After the material placement and alignment is completed, the transport module 20 is controlled to perform the placement action of placing the wafer 100 into the second material box 70.

[0219] The process of acquiring the second and third captured images in steps S801 and S802, controlling the transport module 20 to perform material placement and alignment based on the second and third captured images, and then controlling the transport module 20 to place the wafer 100 into the first material box 60 and the second material box 70 after the material placement and alignment are completed is similar to the step of acquiring the first captured image, controlling the transport module 20 to perform material placement and alignment based on the first captured image, and then controlling the transport module 20 to place the wafer 100 into the wafer box 10 after the material placement and alignment are completed. Therefore, it will not be described in detail here. By acquiring the second captured image before the transport module 20 places the wafer 100 into the first material box 60 and / or acquiring the third captured image before the transport module 20 places the wafer 100 into the second material box 70, the transport module 20 can operate more accurately during each acquisition and / or placement of the wafer 100, ensuring the reliability of the wafer 100 handling operations and simultaneously ensuring operational efficiency.

[0220] Please see Figure 21 , Figure 21 This is a use disclosed in one embodiment of the present invention. Figure 20The diagram illustrates the workflow of a wafer handling device 1, which is part of a wafer handling control method. The wafer handling device 1 begins operation with the light source 12a turned on. The control module 40 initializes various preset parameters (including current pick-up position parameters, current unload position parameters, maximum detection position parameters, preset values, wear defect ratio η, etc.). Then, the control module 40 controls the handling module 20 and the vision sensing module 30 to move to the current detection position for visual detection based on the current detection position parameters. Specifically, the vision sensing module 30 captures a first image. Further, the control module 40 performs image cropping on the first image based on the first image and a preset region of interest. Then, based on the HSV color model, it performs channel separation on the cropped image and threshold segmentation within the H channel to extract the image corresponding to the color range. To determine the position of the wafer 100, the system determines whether there is a wafer 100 at the current detection position. If there is a wafer 100 at the current detection position, the system corrects the current picking position parameters based on the first captured image and controls the transport module 20 to align with the current detection position and acquire the wafer 100 based on the current picking position parameters. If there is no wafer 100 at the current detection position, the system determines whether the current detection position is the maximum detection position. If so, the loop ends, the work stops, and the system waits to restart. If not, the current detection position parameters are adjusted to a preset value. The control module 40 returns to the visual detection step based on the adjusted current detection position parameters, that is, it controls the transport module 20 and the visual sensing module 30 to move to the next current detection position for visual detection.

[0221] Furthermore, after the handling module 20 acquires the wafer 100, the control module 40 determines whether the handling module 20 is in a loaded or unloaded state based on the second sensing signal output by the wafer sensor 50 on the handling module 20. If it is in an unloaded state, it returns to the visual inspection step. If it is in a loaded state, the handling module 20 moves the wafer to a preset detection position for defect detection. Specifically, the defect detection module acquires a detection image, and the control module 40 determines whether the defect ratio of the wafer 100 is less than a preset value based on the detection image. If it is less than the preset value, the handling module 20 can place the wafer 100 into the first material box 60. In addition, the detection image can be saved by the control module 40 for later review.

[0222] Specifically, before the wafer 100 is fed into the first material box 60, the transport module 20 can be controlled to move to the current detection position of the first material box 60 according to the pre-stored current detection position parameters of the first material box 60. Then, the visual sensing module 30 captures the accommodating space 111 of the first material box 60 to obtain a second captured image. Based on the second captured image, it is determined whether there is a wafer 100 at the current feeding position of the first material box 60. The current feeding position parameters of the first material box 60 are corrected based on the second captured image. Thus, the transport module 20 accurately aligns and performs the action of placing the wafer 100 into the first material box 60 according to the corrected current feeding position parameters of the first material box 60. Similarly, before the wafer 100 is fed into the second material box 70, the transport module 20 can be controlled to move to the current detection position of the second material box 70 according to the pre-stored current detection position parameters of the second material box 70. Then, the visual sensing module 30 can capture a third image of the accommodating space 111 of the second material box 70. Based on the third image, it can be determined whether there is a wafer 100 at the current feeding position of the second material box 70. The current feeding position parameters of the second material box 70 can be corrected based on the third image. Thus, the transport module 20 can accurately align and perform the action of placing the wafer 100 into the second material box 70 according to the corrected current feeding position parameters of the second material box 70.

[0223] Further, after the transport module 20 performs the placement action, the control module 40 further determines whether the transport module 20 is in a loaded state or an unloaded state based on the second sensing signal output by the wafer sensor 50. If it is in an unloaded state, the current detection position parameter of the pre-stored first material box 60 is updated, such as by adjusting a preset value to correspond to the next detection position of the first material box 60, and the current detection position parameter of the pre-stored second material box 70 is updated, such as by adjusting a preset value to correspond to the next detection position, and the process returns to execute the acquisition action of the next wafer 100 of the wafer box 10; if it is in a loaded state, the control module 40 controls the transport module 20 to return to execute the defect detection step based on the detection image, so that the steps of detecting the defect detection module 80 to capture and acquire the second or third captured image, and the re-placement and other actions can be repeated. In addition, if Figure 22 As shown, in some other embodiments, if it is in the bearing state, the control module 40 can also control the handling module 20 to return to perform the step of detecting the defect detection module 80 to capture a second or third image, as well as the action of re-unloading and placing the material.

[0224] In summary, in the wafer handling equipment 1 and wafer handling control method provided in the embodiments of this application,

[0225] 1. The pressure-emitting or color-changing device 12 and the first industrial camera 32 directly detect the wafer 100 and the wafer box 10, which is not affected by the assembly error between the actual storage slots 115 of the wafer 100. It can realize automatic alignment and precise picking and placing during the wafer handling process, and can also accurately determine the presence or absence of the wafer 100 in real time and count other composite functions. It has a certain adaptive adjustment capability to the positioning error introduced by environmental disturbances, and has good flexibility, compliance and reliability.

[0226] 2. The wafer handling equipment 1 and wafer handling method described above use pressure sensors 13 symmetrically arranged on each layer of the support plate 114 of the wafer box 10 and wafer sensors 50 symmetrically arranged at the end of the wafer carrier 22 to sense the contact state between the wafer 100 and the support plate 114 of the wafer box 10, and between the wafer 100 and the wafer carrier 22 in real time. This allows for precise sensing and synchronous counting of the wafer 100 picking and placing, thereby ensuring the reliability of the wafer 100 picking, placing and handling process.

[0227] 3. The wafer handling equipment 1 and wafer handling method described above use a second industrial camera 811 to perform pre-inspection of the wafer 100 on the necessary path for picking up and placing the wafer 100. The pre-inspection and classification process during the handling process can provide pre-inspection samples for the subsequent processing of the wafer 100, avoid waste materials from entering the subsequent processing steps, and thus improve production efficiency.

[0228] Example 3:

[0229] like Figure 23 As shown in the figure, this application discloses a wafer handling device 1, which includes a wafer cassette 10, a handling module 20, a vision sensing module 30, and a control module 40. In this embodiment, the wafer cassette 10 includes a carrier 11 and a plurality of pressure-emitting or color-changing devices 12. The handling module 20 is used to acquire or place the wafer 100 from the pick-and-place port 112. The vision sensing module 30 is used to capture an image of the receiving space 111 on one side of the pick-and-place port 112 and output a first captured image. The control module 40 is electrically connected to the handling module 20 and the vision sensing module 30, and is used to receive and control the handling module 20 to perform alignment according to the first captured image, and control the handling module 20 to acquire or place the wafer 100 after the alignment is completed.

[0230] It is understood that the wafer handling device 1 proposed in this application can acquire or place the wafer 100 from the wafer cassette 10. During the handling of the wafer 100, the vision sensing module 30 captures an image of the receiving space 111 on one side of the pick-and-place port 112 and outputs a first captured image. The control module 40 controls the handling module 20 to perform alignment based on the first captured image, and acquires or places the wafer 100. Therefore, the wafer handling device 1 can achieve precise alignment and gripping of the wafer 100 in the wafer cassette 10, and further realize precise handling and automated operation of the wafer 100.

[0231] Please see Figures 24 to 27 In this embodiment, the wafer cassette 10 includes a carrier 11 and a plurality of pressure-emitting or color-changing devices 12. The carrier 11 includes a receiving space 111 and a pick-and-place port 112 located on one side of the receiving space 111. The receiving space 111 is used to receive multiple wafers 100. The carrier 11 includes a substrate 113 and a plurality of carrier plates 114 connected to the side of the substrate 113 near the receiving space 111. Each pressure-emitting or color-changing device 12 is disposed corresponding to one carrier plate 114 and is at least partially disposed on the carrier plate 114 for supporting the wafer 100. When subjected to pressure from the wafer 100, it changes from a first state to a second state, wherein the first state and the second state are a non-emitting state and an emitting state, respectively. It is understood that the wafer 100 is flat, and each of the carrier plates 114 is provided with a pressure-emitting or color-changing device 12. When the wafer 100 is placed in the wafer cassette 10 and supported on the carrier plate 114, the pressure-emitting or color-changing device 12 on the carrier plate 114 changes from the first state of non-emitting light to the second state of emitting light under the pressure of the wafer 100. This can indicate the supporting position of the wafer 100, making it easier to observe the storage status of the wafer 100 in the wafer cassette 10. Moreover, the state change of the pressure-emitting or color-changing device 12 only needs to be triggered by pressure, without the need to perform light detection on each wafer 100, which greatly saves energy. As long as it is under pressure, the pressure-emitting or color-changing device 12 will change its state, making it more intelligent and accurate.

[0232] Furthermore, the pressure-induced light emission or color-changing device 12 includes a pressure sensor 13 disposed on the support plate 114 for supporting the wafer 100 and a light-emitting element 122 disposed on the support member 11. The pressure sensor 13 senses the pressure of the wafer 100 and outputs a pressure sensing signal to the control module 40, so that the control module 40 controls the light-emitting element 122 to emit light when the pressure sensor 13 supports the wafer 100, based on the pressure sensing signal. By setting the pressure sensor 13 and the light-emitting element 122, the light-emitting element 122 can be controlled to emit light when the pressure sensor 13 senses the pressure of the wafer 100, which can increase the brightness inside the wafer cassette 10, making it easier to observe the storage status of the wafers 100 in the wafer cassette 10 more clearly. Moreover, the change of state is triggered by pressure, eliminating the need for light detection on each wafer 100, greatly saving energy. Only the pressure-induced light emission device under pressure will change state, making it more intelligent and precise.

[0233] Furthermore, the light-emitting element 122 is disposed on the end face of the pick-and-place port 112 on the support plate 114 and / or on the end face of the pick-and-place port 112 on the substrate 113. It can be understood that disposing the light-emitting element 122 on the end face of the pick-and-place port 112 allows the light-emitting element 122 to emit light directly towards the outside of the pick-and-place port 112, resulting in higher brightness, easier observation of the storage status of the wafer 100 in the wafer cassette 10, greater energy efficiency, and no obstruction to the pick-and-place of the wafer 100 within the wafer cassette 10.

[0234] In this embodiment, the wafer cassette 10, except for the structure and features described above, has similar structure and features to the wafer cassette 10 in Embodiment 1, and will not be repeated here.

[0235] Furthermore, the control module 40 performs image cropping on the first captured image based on a preset region of interest, and then obtains the bright and dark areas in the cropped image through threshold segmentation to determine the position of the wafer 100, and controls the alignment of the transport module 20 based on the position of the wafer 100. It is understood that when the wafer 100 is placed in the wafer cassette 10 and supported on the carrier plate 114, the pressure sensor 13 on the carrier plate 114 controls the light-emitting element 122 to emit light under the pressure of the wafer 100. The brightness of the area where the wafer 100 is supported will be greater than the brightness of the area where the wafer 100 is not placed. The first captured image is the image captured in the accommodating space 111. The preset region of interest can be a part of the accommodating space 111. When performing image analysis on the first captured image, a preset brightness threshold can be set. When the brightness of the preset region of interest is greater than or equal to the preset brightness threshold, it can be considered that the wafer 100 is placed there. When the brightness of the preset region of interest is less than the preset brightness threshold, it can be considered that the wafer 100 is not placed there. By identifying and cropping the region of interest in the first captured image, and then obtaining the bright and dark areas in the cropped image through threshold segmentation to determine the accurate position of the wafer 100, the algorithm is mature, highly accurate, and can quickly realize the automated picking and placing of the wafer 100.

[0236] Further, please refer to Figures 28 to 29 The transport module 20 includes a moving component 21 electrically connected to the control module 40 and a wafer carrier 22 connected to the moving component 21. The moving component 21 drives the wafer carrier 22 to move under the control of the control module 40. The vision sensing module 30 is disposed on the wafer carrier 22, so that the vision sensing module 30 can move together with the wafer carrier 22. By disposing the vision sensing module 30 on the wafer carrier 22 of the transport module 20, the vision sensing module 30 can move together with the wafer carrier 22, thus eliminating the need for other devices to drive the vision sensing module 30 separately. Furthermore, the viewing angle from which the vision sensing module 30 captures the first image is the same as the operating viewing angle of the wafer carrier 22, simplifying the control algorithm and reducing errors. This achieves precise transport and automated operation of the wafer 100 while maintaining higher operational efficiency.

[0237] Specifically, the mobile component 21 includes a base 211, a first movable joint 212 mounted on the base 211 and extendable along a second preset direction, a first rotating arm 213 rotatably connected at one end to the first movable joint 212, a second rotating arm 214 rotatably connected at one end to the other end of the first rotating arm 213, and a wafer carrier 22 rotatably connected to the other end of the second rotating arm 214. In this embodiment, multiple carrier plates 114 are spaced apart along a first preset direction. The first preset direction and the second preset direction can be the same direction. It can be understood that the mobile component 21 is a multi-degree-of-freedom robot. The second rotating arm 214 and the wafer carrier 22 can be integrally connected or rotatably connected. The mobile component 21 can realize precise handling and automated operation of the wafer 100.

[0238] Furthermore, the wafer carrier 22 includes a connecting base 221 and a transport unit 222. The connecting base 221 is disposed on the moving component 21 along the second preset direction, and the transport unit 222 is connected to one side of the connecting base 221. The visual sensing module 30 is disposed along the second preset direction on the side of the connecting base 221 away from the moving component 21, and the visual sensing module 30 is used to capture images towards the side where the transport unit 222 is located. It can be understood that the first moving joint 212, the connecting base 221, and the visual sensing module 30 are all disposed along the second preset direction, so there is no need for position conversion during the pick-up and place process, which improves the accuracy and efficiency of positioning during the pick-up and place process of the wafer 100. By connecting the moving component 21, the visual sensing module 30, and the transport unit 222, the control can be more efficient and the transport more accurate.

[0239] Furthermore, the visual sensing module 30 includes a camera mounting plate 31 disposed on the connecting base 221, a first industrial camera 32 disposed on the camera mounting plate 31, and a first lens 33 mounted on the first industrial camera 32. In this embodiment, the first lens 33 may be a telecentric lens.

[0240] Furthermore, the wafer handling equipment 1 also includes a wafer sensor 50. The wafer sensor 50 is disposed on the surface of the handling section 222 near the wafer 100 and located at the end of the handling section 222 away from the connecting substrate 221. The wafer sensor 50 is electrically connected to the control module 40 and is used to sense the wafer 100 and output a second sensing signal to the control module 40, so that the control module 40 counts and / or monitors the handling of the wafer 100 by the handling module 20. By disposing the wafer sensor 50 on the surface of the handling section 222 near the wafer 100 and located at the end of the handling section 222 away from the connecting substrate 221, the control module 40 can perceive the contact state between the wafer 100 and the handling section 222 in real time through the second sensing signal, accurately perceive and synchronously count the handling of the wafer 100, thereby ensuring the reliability of the handling and transportation process of the wafer 100.

[0241] Specifically, the conveying unit 222 includes two arm portions 222a, both of which are connected to the connecting base 221 and form a U-shape with an opening. The opening faces away from the connecting base 221. The wafer sensor 50 is disposed at the end of the arm portion 222a away from the connecting base 221. A wafer sensor 50 is respectively disposed on the side of the two arm portions 222a that carries the wafer 100. The wafer sensor 50 is a pressure thin-film sensor. In this embodiment, the optical axis direction of the first industrial camera 32 and the first lens 33 is consistent with the axial direction of the U-shaped opening formed by the two arm portions 222a. By providing wafer sensors 50 on one side of the two arms 222a that carry the wafer 100, the pressure sensing of the wafer 100 can be made unaffected by the positional offset of the wafer 100, making the sensing more accurate. At the same time, the wafer sensors 50 are pressure thin film sensors, which can accurately sense the pressure of the wafer 100 without affecting the picking and placing of the wafer 100.

[0242] Furthermore, the control module 40 monitors whether the transport module 20 acquires the wafer 100 from the wafer cassette 10 based on the second sensing signal. When the control module 40 determines that the transport module 20 is in an idle state based on the second sensing signal, the control module 40 controls the visual sensing module 30 to re-capture the updated first captured image of the receiving space 111 from the pick-up and drop-off port 112, and performs re-alignment based on the updated first captured image. After completing the re-alignment, the control module 40 controls the transport module 20 to acquire the wafer 100. It is understood that after each operation of acquiring the wafer 100, the control module 40 will detect the acquisition operation. When it detects that the transport module 20 is in an idle state, it indicates that the acquisition operation of the wafer 100 has failed. At this time, the control module 40 can control the vision sensing module 30 to re-capture the updated first image of the receiving space 111 from the pick-up and put-down port 112, and re-align the wafer 100 based on the updated first image. This avoids subsequent inaccurate acquisition operations caused by erroneous operations, or even shutdown of the entire wafer transport equipment 1. By determining whether the transport module 20 is in an idle state based on the second sensing signal, the control module 40 can re-align the wafer 100 when the transport module 20 is in an idle state, thus avoiding downtime and improving operational efficiency.

[0243] Furthermore, it can be understood that the wafer handling device 1, which includes a wafer cassette 10, a handling module 20, and a vision sensing module 30, can be used to handle wafers in the wafer cassette 10 to other cassettes (such as the first cassette 60 or the second cassette 70), or to handle wafers in other cassettes to the wafer cassette 10 for storage. The following description primarily uses the example of the wafer handling device 1 handling wafers in the wafer cassette 10 to other cassettes.

[0244] Specifically, in one embodiment, the wafer handling device 1 further includes a first material box 60, and the handling module 20 is used to obtain the wafer 100 from the wafer box 10 and transport and place it into the first material box 60. When the control module 40 determines, based on the second sensing signal, that the handling module 20 is still in a carrying state after performing the placement action of placing the wafer 100 into the first material box 60, the control module 40 controls the handling module 20 to perform the placement action of placing the wafer 100 into the first material box 60 again. It is understood that after placing the wafer 100 into the first material container 60, the control module 40 will detect the placement operation. When it detects that the transport module 20 is still in a carrying state, it proves that the placement operation of the wafer 100 has failed. At this time, the control module 40 can control the transport module 20 to perform the placement operation of placing the wafer 100 into the first material container 60 again, avoiding damage caused by misalignment of the wafer 100, or even causing the entire wafer transport equipment 1 to stop. By determining whether the transport module 20 is in a carrying state after performing the placement operation of placing the wafer 100 into the first material container 60 based on the second sensing signal, the control module 40 can perform the placement operation of placing the wafer 100 into the first material container 60 again when the transport module 20 is in a carrying state, avoiding damage to the wafer 100 and downtime, while improving operational efficiency.

[0245] Furthermore, the wafer handling equipment 1 may also include a second cassette 70 and a defect detection module 80. The defect detection module 80 is located on the handling path of the handling module 20 from the wafer cassette 10 to the first cassette 60. The defect detection module 80 is electrically connected to the control module 40. The defect detection module 80 is used to perform defect detection on the wafer 100 transported by the handling module 20 and output defect detection information to the control module 40. The control module 40 is also used to control the handling module 20 to place the qualified wafer 100 in the first cassette 60 and the unqualified wafer 100 in the second cassette 70 according to the defect detection information. It is understood that the transport module 20, on its transport path from the wafer cassette 10 to the first material box 60, will first pass through the defect detection module 80 and perform defect detection at the defect detection module 80. The control module 40 controls the transport module 20 to place the qualified wafer 100 into the first material box 60 and the unqualified wafer 100 into the second material box 70 based on the defect detection information after detection by the defect detection module 80. By setting the defect detection module 80 on the transport path from the wafer cassette 10 to the first material box 60, and simultaneously performing defect detection on the wafer 100, the transport error generated during the transport of the wafer 100 can be reduced, transport time can be saved, and detection efficiency can be improved. At the same time, placing the defective wafer 100 in the second material box 70 allows for pre-inspection and classification during the transport process, providing pre-inspection samples for the subsequent processing of the wafer 100, avoiding waste from entering the later processing steps, thereby improving production efficiency and reducing equipment space occupation.

[0246] It is understood that the first material box 60 and the second material box 70 can have the same structure as the wafer box 10, so the specific structure of the first material box 60 and the second material box 70 will not be described again here.

[0247] Furthermore, the visual sensing module 30 is also used to capture a second image of the receiving space 111 of the first material box 60 from the pick-up / placement port 112 of the first material box 60 before the transport module 20 places the wafer 100 into the first material box 60. The control module 40 is also used to control the transport module 20 to perform placement alignment based on the second image, and after the placement alignment is completed, control the transport module 20 to perform the placement action of placing the wafer 100 into the first material box 60 or the step of detecting the wafer 100. ; and / or the visual sensing module 30 is further configured to capture a third image of the receiving space 111 of the second material box 70 from the pick-up and drop-out port 112 of the second material box 70 before the transport module 20 places the wafer 100 into the second material box 70. The control module 40 is further configured to control the transport module 20 to perform material placement alignment based on the third image, and after the material placement alignment is completed, control the transport module 20 to perform the placement action of placing the wafer 100 into the second material box 70 or the step of detecting the wafer 100. By taking a second image of the receiving space 111 of the first material box 60 from the pick-up / placement port 112 of the first material box 60 before the transport module 20 places the wafer 100 into the first material box 60, and / or taking a third image of the receiving space 111 of the second material box 70 from the pick-up / placement port 112 of the second material box 70 before the transport module 20 places the wafer 100 into the second material box 70, the transport module 20 can operate more accurately during each acquisition and / or placement of the wafer 100, ensuring the reliability of the wafer 100 acquisition and placement operation, while also ensuring operational efficiency.

[0248] Furthermore, the defect detection information includes detection images. The defect detection module 80 includes a camera module 81 and a bracket 82 supporting the camera module 81. The camera module 81 is used to capture the detection images of the wafer 100 transported by the handling module 20. The control module 40 is also used to analyze the defect ratio of the wafer 100 based on the detection images and compare the defect ratio with a preset ratio to determine whether the wafer 100 is qualified.

[0249] Furthermore, the bracket 82 includes a support body 821, a camera support portion 822 connected to one side of the support body 821, and a light source support portion 823 connected to one side of the support body 821. The camera module 81 includes a second industrial camera 811, a second lens 812, and a fill light 813. The second lens 812 is mounted on the second industrial camera 811, and the second industrial camera 811 is located at the end of the camera support portion 822 away from the support body 821. The fill light 813 is located at the end of the light source support portion 823 away from the support body 821. The wafer 100 transported by the transport module 20 is placed parallel to the first reference plane, which is the plane on which the wafer is placed. The second industrial camera 811 faces the wafer 100, and the optical axis of the second industrial camera 811 is perpendicular to the first reference plane. The supplementary light 813 includes a ring-shaped light-emitting element, which is located between the second industrial camera 811 and the transport module 20 and is used to emit light towards the wafer 100. The second industrial camera 811 is used to capture images of the wafer 100 through the hollow area of ​​the ring-shaped light-emitting element to obtain the detection image. In this embodiment, the second lens 812 can be a telecentric lens. By setting the wafer 100 transported by the transport module 20 to be placed parallel to the first reference plane, and the second industrial camera 811 facing the wafer 100 with its optical axis perpendicular to the first reference plane, the second industrial camera 811 can capture images of the wafer 100 vertically. Simultaneously, under the illumination of the supplementary light 813, the defect detection by the defect detection module 80 can be more accurate and precise.

[0250] Please see Figure 30 In one embodiment of this application, when the wafer handling equipment 1 performs the pick-and-place operation of the wafer 100, it can complete the pick-and-place of the wafer 100 by executing a wafer handling control method, the wafer handling control method including the following steps:

[0251] Step S101: Provide wafer cassette 10.

[0252] The wafer cassette 10 includes a carrier 11 and a plurality of pressure-emitting or color-changing devices 12. The carrier 11 includes a receiving space 111 and a loading / unloading port 112 located on one side of the receiving space 111. The receiving space 111 is used to receive multiple wafers 100. The carrier 11 includes a substrate 113 and a plurality of carrier plates 114 connecting the side of the substrate 113 near the receiving space 111. Each pressure-emitting or color-changing device 12 is disposed corresponding to one carrier plate 114 and is at least partially disposed on the carrier plate 114. The carrier plate 114 is used to support the wafer 100. When the wafer 100 is subjected to pressure, the carrier plate 114 has a pressure sensor 13 for supporting the wafer 100 and a light-emitting element 122 disposed on the carrier member 11. The pressure sensor 13 senses the pressure of the wafer 100 and outputs a pressure sensing signal to the control module 40, so that the control module 40 controls the light-emitting element 122 to emit light when the pressure sensor 13 supports the wafer 100 according to the pressure sensing signal.

[0253] Step S102: Acquire a first image of the receiving space 111 taken from one side of the receiving port 112.

[0254] It is understood that when multiple wafers 100 are placed in the wafer cassette 10, the first captured image in step S102 is an image with contrasting stripes where the light-emitting element 122 corresponding to the carrier plate 114 carrying the wafer 100 emits light, and the light-emitting element 122 corresponding to the carrier plate 114 not carrying the wafer 100 does not emit light.

[0255] It is understood that the wafer handling control method may further include the following steps:

[0256] Step S301: Before acquiring the first captured image, control the transport module 20 to move to the current detection position according to the current detection position parameters.

[0257] The current detection position can be the position where the wafer 100 is picked up or placed. In this embodiment, the current detection position can be the position where the first image is captured.

[0258] Step S302: Based on the first captured image, determine whether the wafer 100 is present at the current picking position or the current unloading position corresponding to the current detection position. If the wafer 100 is present at the current picking position or the wafer 100 is not placed at the current unloading position, then proceed to step S103.

[0259] It can be understood that the aforementioned wafer handling control method can be applied to the picking or unloading of wafers from the wafer cassette 10 to other cassettes (such as the first cassette 60 or the second cassette 70), and can also be applied to the unloading of wafers from other cassettes into the wafer cassette 10. The following explanation will take the unloading of wafers from the wafer cassette 10 to other cassettes using the wafer handling device 1 as an example.

[0260] In step S302, during the material picking operation, if the current picking position has the wafer 100, the picking operation is performed after alignment. During the material unloading operation, if the current unloading position does not have the wafer 100, the unloading operation is performed after alignment. By determining whether the current picking position or the current unloading position corresponding to the current detection position has the wafer 100, the alignment of the handling module 20 is controlled. This avoids misalignment operations when the current picking position does not have the wafer 100 or the current unloading position already has the wafer 100, thereby preventing damage to the wafer 100 and avoiding downtime caused by operational errors, thus improving the reliability and efficiency of the operation.

[0261] In this embodiment, in step S302, if the wafer 100 is not present at the current picking position or the wafer 100 is placed at the current unloading position, it is determined whether the current detection position is the maximum detection position. If the current detection position is the maximum detection position, the transport module 20 is controlled to return to the initial position. If the current detection position is not the maximum detection position, the current detection position parameter, the current picking position parameter, or the current unloading position parameter are adjusted to preset values ​​respectively, and the step of controlling the transport module 20 to move to the current detection position based on the current detection position parameter is executed according to the adjusted current detection position parameter.

[0262] It should be noted that the wafer cassette 10 has a limited number of wafer 100 storage positions, with a preset interval distance between each storage position. In this embodiment, the preset interval distance can be Δz. The maximum detection position is the detection position corresponding to the last storage position of the wafer cassette 10 where the wafer 100 is placed. When the current detection position is the maximum detection position, the handling module 20 is controlled to return to the initial position, which can be the default position. When the current detection position is not the maximum detection position, the current detection position parameter, the current picking position parameter, or the current unloading position parameter are adjusted to preset values ​​to obtain updated current detection position parameters, current picking position parameters, or current unloading position parameters. In this embodiment, the preset value can be the preset interval distance of the wafer cassette 10, i.e., Δz. By determining that the current detection position is the maximum detection position, the handling module 20 can quickly return to the initial position after reaching the maximum detection position to perform subsequent operations, improving operational efficiency.

[0263] Step S103: The transport module 20 is aligned according to the first captured image.

[0264] Image analysis is performed on the first captured image obtained in step S102. The first captured image can be cropped according to a preset region of interest. The preset region of interest in the first captured image can be the location of the bright stripes, which is the location of the wafer 100. Then, the bright and dark areas in the cropped image are obtained by threshold segmentation to know the location of the wafer 100. The storage information of the wafer 100 in the wafer cassette 10 can be obtained, and the alignment of the transport module 20 can be controlled according to the location of the wafer 100.

[0265] It is understood that the control module 40 of the wafer handling equipment 1 may store the current pick-up position parameters or the current unload position parameters. Specifically, step S102 may include the following steps:

[0266] Step S201: Correct the current material picking position parameter or the current material unloading position parameter based on the first captured image to obtain the corrected material picking position parameter or the corrected material unloading position parameter, and update the current material picking position parameter or the current material unloading position parameter based on the corrected material picking position parameter or the corrected material unloading position parameter;

[0267] It can be understood that the current pick-up position parameter is the position parameter of the wafer 100 that needs to be picked up in the wafer cassette 10, and the current unloading position parameter is the position parameter of the wafer 100 that needs to be unloaded that should be placed in the wafer cassette 10. The current pick-up position parameter or the current unloading position parameter can be obtained by calculation. In this embodiment, the wafers 100 in the wafer cassette 10 are stored at intervals, and the interval distance can be a preset interval Δz. After the pick-up or unloading is completed at the current pick-up position or the current unloading position, the current pick-up position parameter is updated to the previous pick-up position parameter + Δz, and the current unloading position parameter is updated to the previous unloading position parameter + Δz. To ensure operational accuracy, before performing material handling or unloading operations, image analysis can be performed on the first captured image to obtain corrected material handling position parameters or corrected unloading position parameters. Finally, the current material handling position parameters or current unloading position parameters are updated based on the corrected material handling position parameters or corrected unloading position parameters. After completing the material handling or unloading operation, the updated current material handling position parameters or current unloading position parameters are incremented by Δz to obtain the current material handling position parameters or current unloading position parameters for the next material handling or unloading operation.

[0268] Step S202: Control the conveying module 20 to move to the current picking position or the current unloading position according to the corrected picking position parameter or the corrected unloading position parameter.

[0269] It is understood that by controlling the transport module 20 to move to the current picking position or the current unloading position based on the corrected picking position parameter or the corrected unloading position parameter obtained from the first captured image, the operation can be more accurate, thereby avoiding damage to the wafer 100, and also avoiding downtime caused by operational errors, thus improving the reliability and efficiency of the operation.

[0270] Step S104: After completing the alignment, control the transport module 20 to acquire or place the wafer 100.

[0271] Based on the corrected material picking position parameter or the corrected material unloading position parameter, the transport module 20 is controlled to move to the current material picking position or the current material unloading position. That is, the transport module 20 extends into the wafer cassette 10 and reaches the current material picking position or the current material unloading position, so that the transport module 20 can perform material picking or unloading operations.

[0272] Specifically, the step of controlling the transport module 20 to place the wafer 100 after completing the alignment may include a step executed after the transport module 20 moves to the current unloading position, controlling the transport module 20 to place and return the wafer 100 according to preset descent and return parameters. It can be understood that after moving to the current unloading position, the transport module 20 descends according to preset descent parameters, placing the wafer 100 on the carrier 11. The preset descent parameters can be a preset descent distance. Then, the transport module 20 returns according to return parameters, which can be a default return position or the position for the next operation. By controlling the transport module 20 to place and return the wafer 100 according to preset descent and return parameters after the transport module 20 moves to the current unloading position, the operational efficiency of the wafer 100 placement and removal operation can be improved.

[0273] The step of controlling the transport module 20 to acquire the wafer 100 after completing the alignment may include a step executed after the transport module 20 moves to the current picking position, controlling the transport module 20 to lift and retrieve the wafer 100 according to preset lifting and retrieval parameters. It can be understood that after moving to the current picking position, the transport module 20 lifts the wafer 100 according to preset lifting parameters, placing the wafer 100 on the transport module 20. The preset lifting parameters can be a preset lifting distance. Then, the transport module 20 retrieves the wafer 100 according to the retrieval parameters. By controlling the transport module 20 to lift and retrieve the wafer 100 according to the preset lifting and retrieval parameters, the wafer 100 can be effectively protected, ensuring the reliability of the retrieval operation.

[0274] The wafer handling control method proposed in this application changes state when the pressure-emitting or color-changing device 12 carries the wafer 100, thereby acquiring a first image of the receiving space 111 captured on one side of the pick-and-place port 112, and controlling the handling module 20 to perform alignment based on the first image to complete the acquisition or placement of the wafer 100, thereby achieving precise alignment and gripping of the wafer 100 in the wafer box 10, and thus realizing precise handling and automated operation of the wafer 100.

[0275] Furthermore, in some embodiments, the transport module 20 includes a wafer carrier 22 for transporting the wafer 100 and a moving component 21 for driving the wafer carrier 22 to move. The wafer carrier 22 is provided with a wafer sensor 50 for sensing the contact state between the wafer carrier 22 and the wafer 100. The wafer transport control method further includes the following steps:

[0276] Step S401: Determine whether the transport module 20 is in an unloaded state or a loaded state based on the sensing signal output by the wafer sensor 50. If the transport module 20 is determined to be in the unloaded state, return to step S301. If the transport module 20 is determined to be in the loaded state, proceed to step S402.

[0277] Step S402: Adjust the current detection position parameter, the current material picking position parameter, or the current material unloading position parameter to preset values ​​respectively, and place the wafer 100 carried by the wafer carrier 22.

[0278] By sensing the pressure of the wafer 100 placed on the wafer carrier 22 by the wafer sensor 50, it can be determined whether the wafer 100 is on the wafer carrier 22. When the wafer 100 is not on the wafer carrier 22, that is, the transport module 20 is in the empty state, the wafer 100 has been placed. The transport module 20 moves to the current detection position according to the current detection position parameter for the next transport. When the wafer 100 is on the wafer carrier 22, that is, the transport module 20 is in the carrying state, step S402 is executed to place the wafer 100, and at the same time, the current detection position parameter, the current picking position parameter, or the current unloading position parameter is updated according to the preset value.

[0279] In the above embodiments, by determining whether the transport module 20 is in the no-load state or the loaded state, the movement of the transport module 20 can be more accurate and efficient, avoiding damage to the wafer 100 and downtime, while improving operational efficiency.

[0280] Specifically, the step of placing the wafer 100 carried by the wafer carrier 22 includes the following steps:

[0281] Step S501: The transfer module 20 performs a placement action to place the wafer 100 into the first material box 60 according to the preset placement parameters.

[0282] Step S502: After performing the placement action, determine whether the transport module 20 is in the no-load state based on the sensing signal of the wafer sensor 50. If the transport module 20 is in the no-load state, return to step S301. If the transport module 20 is in the load state, return to step S501.

[0283] It is understood that the first material box 60 can be a material box used to store the wafer 100 after it is taken out of the wafer box 10. After the wafer 100 is taken out of the wafer box 10, it is placed into the first material box 60 according to the placement parameters. If the placement is successful, the handling module 20 is in the idle state and can return to perform the next material retrieval. If the placement is unsuccessful, the placement operation continues. By determining whether the handling module 20 is in the idle state or the loaded state, the movement of the handling module 20 can be more accurate and efficient, avoiding damage to the wafer 100 and downtime, while improving operational efficiency.

[0284] Furthermore, before the step of placing the wafer 100 carried by the wafer carrier 22, a step of inspecting the wafer 100 may be included, which includes the following steps:

[0285] Step S601: Move the wafer 100 to the preset detection position.

[0286] It should be noted that the preset detection position can be a fixed detection position. Each time the wafer 100 is acquired, the transport module 20 can move the wafer 100 to the preset detection position.

[0287] Step S602: Perform defect detection on the wafer 100 at the preset detection position; if the wafer 100 passes the detection, proceed to step S501; if the wafer 100 fails the detection, proceed to step S603.

[0288] Specifically, the defect detection of the wafer 100 may include the following steps:

[0289] Step S701: Obtain a detection image of the wafer 100 being transported on the transport module 20 by taking a picture at the preset detection position.

[0290] Step S702: Analyze the defect ratio of the wafer 100 based on the detected image, and compare the defect ratio with a preset ratio to determine whether the wafer 100 is qualified.

[0291] In this embodiment, defect detection is performed on the wafer 100. The defect ratio of the wafer 100 is analyzed based on the detection image. This can be the wear defect ratio of the wafer 100. The preset ratio can be a preset wear defect ratio η. When the wear defect ratio of the wafer 100 is less than the preset wear defect ratio η, the wafer 100 is considered to be qualified and is placed into the first material box 60. When the wear defect ratio of the wafer 100 is greater than or equal to the preset wear defect ratio η, the wafer 100 is considered to be unqualified. By obtaining the detection image of the wafer 100 being transported on the transport module 20 by taking a picture at the preset detection position, it is possible to determine whether the wafer 100 is qualified. Pre-detection and classification can be performed during the transport process to provide pre-detection samples for the subsequent processing of the wafer 100, avoid waste materials entering the subsequent processing steps, thereby improving production efficiency and reducing equipment space occupation.

[0292] Step S603: Execute the placement action of the transport module 20 placing the wafer 100 in the second material box 70, and return to execute the step of moving to the current detection position according to the current detection position parameter.

[0293] The second material box 70 can be a recycling box for defective products. Defective wafers 100 can be recycled through the second material box 70. When the wear defect ratio of a wafer 100 is greater than or equal to a preset wear defect ratio η, the wafer 100 is deemed defective and is placed into the second material box 70. By performing the inspection step on the wafer 100 before placing it on the wafer carrier 22, pre-inspection can be carried out during handling, defective products can be detected in a timely manner, and pre-inspection samples can be provided for subsequent processing of the wafer 100, thereby improving production efficiency.

[0294] To ensure the accuracy and reliability of the wafer handling module 20 in placing the wafer 100 into the first material box 60 and the second material box 70, the wafer handling control method may further include the following steps:

[0295] Step S801: Before the transport module 20 places the wafer 100 into the first material box 60, a second image of the accommodating space 111 of the first material box 60 is captured from the pick-up and drop-out port 112 of the first material box 60. Based on the second image, the transport module 20 is controlled to perform material placement and alignment. After the material placement and alignment is completed, the transport module 20 is controlled to perform the placement action of placing the wafer 100 into the first material box 60.

[0296] Step S802: Before the transport module 20 places the wafer 100 into the second material box 70, a third image of the receiving space 111 of the second material box 70 is captured from the pick-up and drop-out port 112 of the second material box 70. Based on the third image, the transport module 20 is controlled to perform material placement and alignment. After the material placement and alignment is completed, the transport module 20 is controlled to perform the placement action of placing the wafer 100 into the second material box 70.

[0297] The process of acquiring the second and third captured images in steps S801 and S802, controlling the transport module 20 to perform material placement and alignment based on the second and third captured images, and then controlling the transport module 20 to place the wafer 100 into the first material box 60 and the second material box 70 after the material placement and alignment are completed is similar to the step of acquiring the first captured image, controlling the transport module 20 to perform material placement and alignment based on the first captured image, and then controlling the transport module 20 to place the wafer 100 into the wafer box 10 after the material placement and alignment are completed. Therefore, it will not be described in detail here. By acquiring the second captured image before the transport module 20 places the wafer 100 into the first material box 60 and / or acquiring the third captured image before the transport module 20 places the wafer 100 into the second material box 70, the transport module 20 can operate more accurately during each acquisition and / or placement of the wafer 100, ensuring the reliability of the wafer 100 handling operations and simultaneously ensuring operational efficiency.

[0298] Please see Figure 31 , Figure 31 This is a use disclosed in one embodiment of the present invention. Figure 30The diagram illustrates the workflow of a wafer handling device 1, which is part of a wafer handling control method. The wafer handling device 1 begins operation. The control module 40 initializes various preset parameters (including current pick-up position parameters, current unload position parameters, maximum detection position parameters, preset values, wear defect ratio η, etc.). Then, the control module 40 controls the handling module 20 and the vision sensing module 30 to move to the current detection position for visual detection based on the current detection position parameters. Specifically, the vision sensing module 30 captures a first image. Further, the control module 40 performs image cropping on the first image based on the first image and a preset region of interest. Then, it uses threshold segmentation to obtain the bright and dark areas in the cropped image to determine the position of the wafer 100, thereby determining the current position. If there is a wafer 100 at the current detection position, and if there is a wafer 100 at the current detection position, the parameters of the current picking position are corrected according to the first captured image, and the transport module 20 is controlled to align with the current detection position and perform the wafer 100 acquisition action according to the parameters of the current picking position. If there is no wafer 100 at the current detection position, it is determined whether the current detection position is the maximum detection position. If so, the loop ends, the work stops, and the work is restarted. If not, the parameters of the current detection position are adjusted to a preset value, and the control module 40 returns to the step of performing visual detection according to the adjusted parameters of the current detection position, that is, it controls the transport module 20 and the visual sensing module 30 to move to the next current detection position for visual detection.

[0299] Furthermore, after the handling module 20 acquires the wafer 100, the control module 40 determines whether the handling module 20 is in a loaded or unloaded state based on the second sensing signal output by the wafer sensor 50 on the handling module 20. If it is in an unloaded state, it returns to the visual inspection step. If it is in a loaded state, the handling module 20 moves the wafer to a preset detection position for defect detection. Specifically, the defect detection module acquires a detection image, and the control module 40 determines whether the defect ratio of the wafer 100 is less than a preset value based on the detection image. If it is less than the preset value, the handling module 20 can place the wafer 100 into the first material box 60. In addition, the detection image can be saved by the control module 40 for later review.

[0300] Specifically, before the wafer 100 is fed into the first material box 60, the transport module 20 can be controlled to move to the current detection position of the first material box 60 according to the pre-stored current detection position parameters of the first material box 60. Then, the visual sensing module 30 captures the accommodating space 111 of the first material box 60 to obtain a second captured image. Based on the second captured image, it is determined whether there is a wafer 100 at the current feeding position of the first material box 60. The current feeding position parameters of the first material box 60 are corrected based on the second captured image. Thus, the transport module 20 accurately aligns and performs the action of placing the wafer 100 into the first material box 60 according to the corrected current feeding position parameters of the first material box 60. Similarly, before the wafer 100 is fed into the second material box 70, the transport module 20 can be controlled to move to the current detection position of the second material box 70 according to the pre-stored current detection position parameters of the second material box 70. Then, the visual sensing module 30 can capture a third image of the accommodating space 111 of the second material box 70. Based on the third image, it can be determined whether there is a wafer 100 at the current feeding position of the second material box 70. The current feeding position parameters of the second material box 70 can be corrected based on the third image. Thus, the transport module 20 can accurately align and perform the action of placing the wafer 100 into the second material box 70 according to the corrected current feeding position parameters of the second material box 70.

[0301] Further, after the transport module 20 performs the placement action, the control module 40 further determines whether the transport module 20 is in a loaded state or an unloaded state based on the second sensing signal output by the wafer sensor 50. If it is in an unloaded state, the current detection position parameter of the pre-stored first material box 60 is updated, such as by adjusting a preset value to correspond to the next detection position of the first material box 60, and the current detection position parameter of the pre-stored second material box 70 is updated, such as by adjusting a preset value to correspond to the next detection position, and the process returns to execute the acquisition action of the next wafer 100 of the wafer box 10; if it is in a loaded state, the control module 40 controls the transport module 20 to return to execute the defect detection step based on the detection image, so that the steps of detecting the defect detection module 80 to capture and acquire the second or third captured image, and the re-placement and other actions can be repeated. In addition, if Figure 32 As shown, in some other embodiments, if it is in the bearing state, the control module 40 can also control the handling module 20 to return to perform the step of detecting the defect detection module 80 to capture a second or third image, as well as the action of re-unloading and placing the material.

[0302] In summary, in the wafer handling equipment 1 and wafer handling control method provided in the embodiments of this application,

[0303] 1. The pressure-emitting or color-changing device 12 and the first industrial camera 32 directly detect the wafer 100 and the wafer box 10, which is not affected by the assembly error between the actual storage slots 115 of the wafer 100. It can realize automatic alignment and precise picking and placing during the wafer handling process, and can also accurately determine the presence or absence of the wafer 100 in real time and count other composite functions. It has a certain adaptive adjustment capability to the positioning error introduced by environmental disturbances, and has good flexibility, compliance and reliability.

[0304] 2. The wafer handling equipment 1 and wafer handling method described above use pressure sensors 13 symmetrically arranged on each layer of the support plate 114 of the wafer box 10 and wafer sensors 50 symmetrically arranged at the end of the wafer carrier 22 to sense the contact state between the wafer 100 and the support plate 114 of the wafer box 10, and between the wafer 100 and the wafer carrier 22 in real time. This allows for precise sensing and synchronous counting of the wafer 100 picking and placing, thereby ensuring the reliability of the wafer 100 picking, placing and handling process.

[0305] 3. The wafer handling equipment 1 and wafer handling method described above use a second industrial camera 811 to perform pre-inspection of the wafer 100 on the necessary path for picking up and placing the wafer 100. The pre-inspection and classification process during the handling process can provide pre-inspection samples for the subsequent processing of the wafer 100, avoid waste materials from entering the subsequent processing steps, and thus improve production efficiency.

[0306] Please see Figure 33 , Figure 33 This is a schematic diagram of the structure of an electrical device 2 disclosed in an embodiment of the present invention. The electrical device 2 includes a memory 91 and a processor 92.

[0307] The memory 91 stores computer-readable instructions 93, which, when executed by the processor 92, cause the processor 92 to implement the wafer handling control method as described in any of the above.

[0308] Please see Figure 34 , Figure 34 This is a schematic diagram of the structure of a storage medium disclosed in an embodiment of the present invention. The computer-readable storage medium 3 stores computer-readable instructions 93. When the computer-readable instructions 93 are executed by the processor 92, they implement the wafer handling control method as described in any of the above claims.

[0309] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of this application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also recognize that the embodiments described in the specification are optional embodiments, and the actions and modules involved are not necessarily essential to this application.

[0310] In the various embodiments of this application, it should be understood that the sequence number of each process does not necessarily imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0311] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units; they can be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0312] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0313] If the integrated units described above are implemented as software functional units and sold or used as independent products, they can be stored in a computer-accessible memory. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a memory and includes several requests to cause an electrical device (which can be a personal computer, server, or network device, specifically a processor in the electrical device) to execute some or all of the steps of the methods described in the various embodiments of this application.

[0314] Those skilled in the art will understand that all or part of the steps in the various methods of the above embodiments can be implemented by a program instructing related hardware. The program can be stored in a computer-readable storage medium, including read-only memory (ROM), random access memory (RAM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), one-time programmable read-only memory (OTPROM), electrically-Erasable Programmable Read-Only Memory (EEPROM), compact disc read-only memory (CD-ROM) or other optical disc storage, disk storage, magnetic tape storage, or any other computer-readable medium capable of carrying or storing data.

[0315] The foregoing has provided a detailed description of a wafer cassette 10, a wafer handling device 1 and control method, an electrical device 2 and a storage medium 3 disclosed in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the methods and core ideas of this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A wafer cassette, characterized in that, The wafer cassette includes: A carrier includes a receiving space and a loading / unloading port located on one side of the receiving space, the receiving space being used to accommodate multiple wafers; the carrier includes a substrate and multiple carrier plates connecting the side of the substrate near the receiving space; and Multiple pressure-emitting or color-changing devices are provided, each corresponding to a carrier plate. Each pressure-emitting or color-changing device includes a carrier film disposed on the carrier plate for supporting the wafer. The carrier film protrudes from the surface of the carrier plate near the wafer to support the wafer and changes from a first state to a second state when subjected to pressure from the wafer. Wherein, the first state and the second state are respectively a non-light-emitting state and a light-emitting state; or the first state and the second state are respectively a first color state and a second color state.

2. The wafer cassette as described in claim 1, characterized in that, The portion of the pressure-emitting or color-changing device disposed on the carrier plate extends from the end of the carrier plate away from the pick-and-place port to the end of the carrier plate near the pick-and-place port; or The carrier plate includes a first portion near the pick-and-place port, a second portion away from the pick-and-place port, and an intermediate portion connecting the first portion and the second portion. The portion of the pressure-emitting or color-changing device that carries the wafer is disposed in the intermediate portion, and the length of the portion of the pressure-emitting or color-changing device disposed on the carrier plate is less than or equal to the length of the portion of the wafer carried by the pressure-emitting or color-changing device along a first direction, the first direction being the direction from the first portion to the second portion.

3. The wafer cassette as described in claim 1 or 2, characterized in that, The supporting film includes a pressure-luminescent material, which is used to change from the non-luminescent state to the luminescent state when subjected to pressure from the wafer.

4. The wafer cassette as described in claim 1 or 2, characterized in that, The carrier film includes a pressure-sensitive color-changing material, which receives external light and changes from the first color state to the second color state when subjected to pressure from the wafer.

5. The wafer cassette as described in claim 1, characterized in that, The number of carriers is at least two, the accommodating space is located between the two carriers, each carrier includes a substrate and a plurality of carrier plates connected to the side of the substrate near the accommodating space, the two ends of the wafer are respectively disposed on two corresponding carrier plates of the two carriers, and the portion of the carrier plate that supports the wafer is provided with the pressure-emitting or color-changing device; the wafer box also includes a back plate connected between the two carriers and located on the side away from the pick-and-place port.

6. The wafer cassette as claimed in claim 1, characterized in that, The substrate includes a back plate portion and two side plate portions connected to both ends of the back plate portion and disposed opposite to each other. Some of the pressure-emitting or color-changing devices are disposed on the side of the back plate portion near the receiving space and / or one end of the side plate portion connected to the back plate portion. The carrier plate is at least connected to the side plate portion near the receiving space. The surface of the back plate portion facing the receiving space is an arc-shaped surface protruding outward from the receiving space.

7. A wafer handling device, characterized in that, The wafer handling equipment includes: The wafer cassette as described in any one of claims 1-2 and 5-6; A handling module for picking up or placing the wafer from the pick-and-place port; A visual sensing module is used to capture images of the receiving space from one side of the retrieval port and output a first captured image; and A control module, electrically connected to the transport module and the vision sensing module, is used to receive and control the transport module to perform alignment based on the first captured image, and to control the transport module to acquire or place the wafer after the alignment is completed.

8. A wafer handling device, characterized in that, The wafer handling equipment includes: The wafer cassette as described in claim 3; A handling module for picking up or placing the wafer from the pick-and-place port; A visual sensing module is used to capture images of the receiving space from one side of the retrieval port and output a first captured image; and A control module, electrically connected to the transport module and the vision sensing module, is used to receive and control the transport module to perform alignment based on the first captured image, and to control the transport module to acquire or place the wafer after the alignment is completed.

9. The wafer handling equipment as described in claim 8, characterized in that, The control module performs image cropping on the first captured image based on a preset region of interest, and then obtains the bright and dark areas in the cropped image through threshold segmentation to determine the position of the wafer, and controls the transport module to perform alignment based on the position of the wafer.

10. A wafer handling device, characterized in that, The wafer handling equipment includes: The wafer cassette as described in claim 4; A handling module for picking up or placing the wafer from the pick-and-place port; A visual sensing module is used to capture images of the receiving space from one side of the retrieval port and output a first captured image; and A control module, electrically connected to the transport module and the vision sensing module, is used to receive and control the transport module to perform alignment based on the first captured image, and to control the transport module to acquire or place the wafer after the alignment is completed.

11. The wafer handling equipment as described in claim 10, characterized in that, The control module performs image cropping on the first captured image based on a preset region of interest, then performs channel separation on the cropped image based on the HSV color model, and performs threshold segmentation in the H channel to extract the image of the corresponding color range to determine the position of the wafer, and controls the alignment of the transport module based on the position of the wafer.

12. A wafer handling control method, characterized in that, Includes the following steps: A wafer cassette is provided, wherein the wafer cassette is as described in any one of claims 1-6; A first image of the receiving space is captured on one side of the loading / unloading port. The alignment of the transport module is controlled based on the first captured image; as well as After the alignment is completed, the handling module is controlled to acquire or place the wafer.

13. An electrical device comprising a memory and a processor, the memory storing computer-readable instructions which, when executed by the processor, cause the processor to perform the method of claim 12.

14. A computer-readable storage medium storing computer-readable instructions thereon, characterized in that, When the computer-readable instructions are executed by a processor, they implement the method as described in claim 12.

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