Display device

Abstract

A display device includes a display panel including a light emitting element, and an input sensor disposed on the display panel and including a plurality of first areas repeatedly arranged in a first direction and a plurality of second areas repeatedly arranged in the first direction. The input sensor includes an inorganic insulating layer disposed on the plurality of first areas, an organic insulating layer disposed on the plurality of first areas and the plurality of second areas, and a sensing electrode disposed on the organic insulating layer. The plurality of first areas and the plurality of second areas are alternately arranged in the first direction, and in the input sensor, an opening portion is formed corresponding to the plurality of second areas without the inorganic insulating layer being disposed.

Description

Technical Field

[0001] This invention relates to a display device, and more specifically, to a flexible display device. Background Technology

[0002] Electronic devices that provide images to users, such as smartphones, digital cameras, laptops, navigation devices, and smart TVs, include display devices for displaying images. The display device generates images and provides the generated images to the user through a display screen.

[0003] Recently, with the development of display device technology, various forms of display devices are being developed. For example, various flexible display devices that can be deformed into curved shapes, or that can be folded or rolled up are being developed. Flexible display devices are easy to carry and can improve user convenience. Summary of the Invention

[0004] The purpose of this invention is to provide a display device with improved curling characteristics and reliability.

[0005] A display device according to an embodiment of the present invention includes: a display panel including a light-emitting element; and an input sensor disposed on the display panel, and including a plurality of first regions repeatedly arranged along a first direction and a plurality of second regions repeatedly arranged along the first direction.

[0006] The input sensor includes: an inorganic insulating layer disposed in the plurality of first regions; an organic insulating layer disposed in the plurality of first regions and the plurality of second regions; and a sensing electrode disposed on the organic insulating layer.

[0007] The plurality of first regions and the plurality of second regions are arranged alternately in the first direction, and an opening is formed in the plurality of second regions of the input sensor corresponding to the inorganic insulating layer.

[0008] A display device according to an embodiment of the present invention includes: a display panel including a light-emitting element layer and an encapsulation layer disposed on the light-emitting element layer, the light-emitting element layer including light-emitting elements; and an input sensor disposed on the encapsulation layer, and including a plurality of first regions repeatedly arranged along a first direction and a plurality of second regions repeatedly arranged along the first direction.

[0009] The input sensor includes: an organic insulating layer disposed in the plurality of first regions and the plurality of second regions; a plurality of first inorganic insulating layers disposed on the organic insulating layer and respectively disposed in the plurality of first regions; a second inorganic insulating layer disposed in the plurality of second regions; and a sensing electrode disposed on the organic insulating layer.

[0010] The plurality of first regions and the plurality of second regions are arranged alternately in the first direction, and an opening region is formed in the plurality of second regions of the input sensor corresponding to the first inorganic insulating layer and the second inorganic insulating layer.

[0011] According to an embodiment of the present invention, the inorganic insulating layer disposed on the input sensor is repeatedly removed in the curling direction, thereby alternating between a first region where the inorganic insulating layer is disposed and a second region where the inorganic insulating layer is not disposed in the curling direction. Therefore, the pressure applied to the display panel and the input sensor when the display device is curled in the curling direction can be alleviated, resulting in improved curling characteristics and reliability of the display device. Attached Figure Description

[0012] Figure 1 This is a perspective view of a display device according to an embodiment of the present invention.

[0013] Figure 2 It is a diagram. Figure 1 The diagram shows the display device in a curled-up state.

[0014] Figure 3 It is along Figure 1 The cross-sectional view of the display device cut by the cutting line I-I' is shown.

[0015] Figure 4 This is a cross-sectional view of a display panel according to an embodiment of the present invention.

[0016] Figure 5 This is a plan view of an input sensor according to an embodiment of the present invention.

[0017] Figure 6 It is magnification Figure 5 The diagram shows a plan view of part AA according to an embodiment of the present invention.

[0018] Figures 7A to 7C It is along Figure 6 The cross-sectional view of the display device according to an embodiment of the present invention is shown, cut along section line II-II'.

[0019] Figure 8 It is magnification Figure 5 The diagram shown is a plan view of part AA according to an embodiment of the present invention.

[0020] Figure 9 It is along Figure 8 The sectional view shown is cut along section line III-III'.

[0021] Figure 10 It is magnification Figure 5 The diagram shows a plan view of part AA according to an embodiment of the present invention.

[0022] Figure 11 It is along Figure 10 The sectional view shown is cut along section line IV-IV'.

[0023] Figure 12 This is a plan view of an input sensor according to an embodiment of the present invention.

[0024] Figure 13 It is magnification Figure 12 The diagram shows a plan view of the BB portion according to an embodiment of the present invention.

[0025] Figure 14 It is along Figure 13 The sectional view shown is cut along section line V-V'.

[0026] Figure 15 as well as Figure 16 This is a plan view of the input sensor according to an embodiment of the present invention.

[0027] Figure 17 This is a plan view of an input sensor according to an embodiment of the present invention.

[0028] Figure 18 It is shown in magnification Figure 17 The plan view of section CC is shown.

[0029] Figure 19A It is along Figure 18 The sectional view shown is cut along section line VI-VI'.

[0030] Figure 19B It is along Figure 18 The sectional view shown is cut along section line VII-VII'.

[0031] Figure 20 It is shown in magnification Figure 18 The plan view of the EE section is shown. Detailed Implementation

[0032] In this specification, when it is mentioned that a certain component (or region, layer, part, etc.) is "above", "connected" or "combined" with another component, it means that it can be directly arranged on or directly connected / combined with another component, or a third component can be arranged between them.

[0033] The same reference numerals refer to the same constituent elements. Furthermore, in the drawings, the thickness, proportions, and dimensions of the constituent elements are exaggerated for the purpose of effective explanation of the technical content.

[0034] "And / or" includes all combinations of more than one that can be defined in relation to the related composition.

[0035] The terms "first," "second," etc., can be used to describe multiple constituent elements, but the constituent elements should not be limited by the terms. The terms are used only to distinguish one constituent element from another. For example, without departing from the scope of the invention, a first constituent element can be named a second constituent element, and similarly, a second constituent element can be named a first constituent element. Singular expressions include plural expressions unless the context explicitly indicates a different meaning.

[0036] Furthermore, terms such as "below," "lower side," "above," and "upper side" are used to describe the relationships between the components illustrated in the accompanying drawings. These terms are relative concepts and are explained based on the directions shown in the accompanying drawings.

[0037] Unless otherwise defined, all terms (including technical and scientific terms) used in this specification shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, terms such as those defined in commonly used dictionaries shall be interpreted as having the same meaning as in the context of the relevant art, and may be expressly defined herein unless interpreted as having an ideal or overly formal meaning.

[0038] Terms such as “including” or “having” should be understood as being intended to specify the presence of features, figures, steps, operations, constituent elements, components or combinations thereof described in the specification, rather than precluding the presence or possibility of one or more other features or figures, steps, operations, constituent elements, components or combinations thereof.

[0039] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0040] Figure 1 This is a perspective view of a display device according to an embodiment of the present invention. Figure 2 It is a diagram. Figure 1 The diagram shows the curled state of the display device.

[0041] Reference Figure 1 According to an embodiment of the present invention, the display device DD may have a rectangle comprising a long side extending along a first direction DR1 and a short side extending along a second direction DR2 intersecting the first direction DR1. However, it is not limited thereto, and the display device DD may have various shapes such as circles or polygons.

[0042] The direction that substantially intersects the plane defined by the first direction DR1 and the second direction DR2 is defined as the third direction DR3. Furthermore, in this specification, the meaning of "when viewed from a plane" is defined as the state of viewing along the third direction DR3.

[0043] The upper surface of the display device DD can be defined as the display surface DS, and can be parallel to the plane defined by the first direction DR1 and the second direction DR2. The image IM generated by the display device DD can be provided to the user through the display surface DS.

[0044] The display surface DS may include a display area DA and a non-display area NDA surrounding the display area DA. The display area DA may display an image, while the non-display area NDA may not display an image. The non-display area NDA may surround the display area DA and may define the edge of the display device DD printed using predetermined colors.

[0045] The display device DD can be used in large electronic devices such as televisions, monitors, or external billboards. Furthermore, the display device DD can also be used in small to medium-sized electronic devices such as personal computers, laptops, personal digital terminals, car navigation systems, game consoles, smartphones, tablets, or cameras. However, these are merely exemplary embodiments, and it can be used in other electronic devices without departing from the concept of the invention.

[0046] Reference Figure 2 The display device DD can be a flexible display device that can be rolled up. For example, the display device DD can be a rolling display device.

[0047] The display device DD can be rolled up in the first direction DR1. The display device DD can be rolled up into a cylindrical shape. Users can roll up the display device DD for carrying and can unfold the display device DD to view images as needed, thereby improving the portability of the display device DD.

[0048] Figure 3 It is along Figure 1 The cross-sectional view of the display device cut by the cutting line I-I' is shown.

[0049] Reference Figure 3 The display device DD may include a display panel 100 and an input sensor 200. The display panel 100 may include a base layer 110, a circuit layer 120, a light-emitting element layer 130, and an encapsulation layer 140.

[0050] The substrate 110 may be a component that provides a base surface for arranging the circuit layer 120. The substrate 110 may be a glass substrate, a metal substrate, or a polymer substrate, etc. However, the embodiments are not limited to this, and the substrate 110 may be an inorganic layer, an organic layer, or a composite material layer.

[0051] The base layer 110 may have a multi-layer structure. For example, the base layer 110 may include a first synthetic resin layer and silicon dioxide (SiO2) disposed on the first synthetic resin layer. x The system comprises a silicon oxide layer, an amorphous silicon (a-Si) layer disposed on the silicon oxide layer, and a second synthetic resin layer disposed on the amorphous silicon layer. The silicon oxide layer and the amorphous silicon layer can be referred to as the base barrier layer.

[0052] Each of the first and second synthetic resin layers may include a polyimide-based resin. Furthermore, each of the first and second synthetic resin layers may include at least one selected from the following: acrylate-based resin, methacrylate-based resin, polyisoprene-based resin, vinyl-based resin, epoxy-based resin, urethane-based resin, cellulose-based resin, siloxane-based resin, polyamide-based resin, and perylene-based resin.

[0053] Circuit layer 120 can be disposed on substrate 110. Circuit layer 120 may include insulating layers, semiconductor patterns, conductive patterns, and signal wiring. Insulating layers, semiconductor layers, and conductive layers are formed on substrate 110 by means of coating, deposition, etc., and thereafter, the insulating layers, semiconductor layers, and conductive layers can be selectively patterned by multiple photolithography processes. Subsequently, semiconductor patterns, conductive patterns, and signal wiring included in circuit layer 120 can be formed.

[0054] The light-emitting element layer 130 may be disposed on the circuit layer 120. The light-emitting element layer 130 may include light-emitting elements. For example, the light-emitting element layer 130 may include organic light-emitting materials, inorganic light-emitting materials, quantum dots, quantum rods, micro LEDs, or nano LEDs.

[0055] The encapsulation layer 140 can be disposed on the light-emitting element layer 130. The encapsulation layer 140 can protect the light-emitting element layer 130 from foreign matter such as moisture, oxygen and dust particles.

[0056] The input sensor 200 can be arranged on the display panel 100. The input sensor 200 can sense external input applied from the outside. The external input can be user input. User input can include various forms of external input such as a part of the user's body, light, heat, pen, or pressure.

[0057] The input sensor 200 can be formed on the display panel 100 through a continuous process. In this case, the input sensor 200 can be described as being directly disposed on the display panel 100. Direct disposal can mean that no third component is disposed between the input sensor 200 and the display panel 100. That is, no separate adhesive component may be disposed between the input sensor 200 and the display panel 100. Alternatively, the input sensor 200 can be bonded to the display panel 100 by means of adhesive components. The adhesive components may include conventional adhesives or bonding agents.

[0058] Although not shown, the display device DD may further include an anti-reflective layer and an optical layer disposed on the input sensor 200. The anti-reflective layer can reduce the reflectivity of external light incident from the outside of the display device DD. The optical layer can improve the front brightness of the display device DD by controlling the direction of light incident from the display panel 100.

[0059] Figure 4 This is a cross-sectional view of a display panel according to an embodiment of the present invention.

[0060] Reference Figure 4 At least one inorganic layer is formed on the upper surface of the base layer 110. The inorganic layer may include at least one of alumina, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer may be formed using multiple layers. The multiple inorganic layers may constitute a barrier layer and / or a buffer layer. In this embodiment, the display panel 100 is shown as including a buffer layer BFL.

[0061] The buffer layer BFL can improve the adhesion between the base layer 110 and the semiconductor pattern. The buffer layer BFL may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. For example, the buffer layer BFL may include a structure in which silicon oxide layers and silicon nitride layers are stacked alternately.

[0062] Semiconductor patterns can be disposed on the buffer layer BFL. The semiconductor patterns may include polycrystalline silicon. However, they are not limited to this; the semiconductor patterns may also include amorphous silicon, low-temperature polycrystalline silicon, or oxide semiconductors.

[0063] Figure 4 Only a portion of the semiconductor pattern is shown; semiconductor patterns can be arranged in other areas. The semiconductor patterns can be arranged across pixels according to a specific rule. The electrical properties of the semiconductor pattern can vary depending on whether it is doped. The semiconductor pattern can include a first region with high conductivity and a second region with low conductivity. The first region can be doped with N-type or P-type dopant. A P-type transistor can include a doped region doped with P-type dopant, and an N-type transistor can include a doped region doped with N-type dopant. The second region can be an undoped region, or it can be a region doped at a lower concentration than the first region.

[0064] The conductivity of the first region is greater than that of the second region, and it can essentially function as an electrode or signal wiring. The second region can essentially correspond to the active (or channel) region of a transistor. In other words, part of the semiconductor pattern can be the active region of a transistor, another part can be the source or drain of a transistor, and yet another part can be a connecting electrode or a connecting signal wiring.

[0065] Each pixel can have an equivalent circuit including seven transistors, one capacitor, and a light-emitting element, and the equivalent circuit of a pixel can be deformed in various forms. Figure 4 The illustration exemplarily depicts a transistor TR and a light-emitting element ED included in a pixel.

[0066] The source SC, active region AL, and drain DR of a transistor TR can be formed using a semiconductor pattern. The source SC and drain DR can extend in opposite directions from the active region AL in cross-section. Figure 4 A portion of the connection signal wiring SCL formed using a semiconductor pattern is shown. Although not shown separately, the connection signal wiring SCL can be connected on a plane to the drain DR of the transistor TR.

[0067] The first insulating layer 10 may be disposed on the buffer layer BFL. The first insulating layer 10 overlaps multiple pixels and may cover a semiconductor pattern. The first insulating layer 10 may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In this embodiment, the first insulating layer 10 may be a single-layer silicon oxide layer. Not only the first insulating layer 10, but each of the insulating layers included in the circuit layer 120 described later may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. The inorganic layer may include at least one of the above-mentioned substances, but is not limited thereto.

[0068] The gate GT of transistor TR is disposed on the first insulating layer 10. The gate GT may be part of a metal pattern. The gate GT overlaps with the active region AL. In the process of doping semiconductor patterns, the gate GT can function as a mask.

[0069] The second insulating layer 20 is disposed on the first insulating layer 10 and may cover the gate GT. The second insulating layer 20 may overlap the pixel. The second insulating layer 20 may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. The second insulating layer 20 may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. In this embodiment, the second insulating layer 20 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0070] The third insulating layer 30 may be disposed on the second insulating layer 20. The third insulating layer 30 may have a single-layer or multi-layer structure. For example, the third insulating layer 30 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0071] The first connection electrode CNE1 can be disposed on the third insulating layer 30. The first connection electrode CNE1 can be connected to the connection signal wiring SCL through the first contact hole CNT1 that passes through the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30.

[0072] The fourth insulating layer 40 may be disposed on the third insulating layer 30. The fourth insulating layer 40 may be a single layer of silicon oxide. The fifth insulating layer 50 may be disposed on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.

[0073] The second connecting electrode CNE2 can be disposed on the fifth insulating layer 50. The second connecting electrode CNE2 can be connected to the first connecting electrode CNE1 through the second contact hole CNT2 that penetrates the fourth insulating layer 40 and the fifth insulating layer 50.

[0074] The sixth insulating layer 60 is disposed on the fifth insulating layer 50 and may cover the second connecting electrode CNE2. The sixth insulating layer 60 may be an organic layer.

[0075] The light-emitting element layer 130 may be disposed on the circuit layer 120. The light-emitting element layer 130 may include a light-emitting element ED. For example, the light-emitting element layer 130 may include an organic light-emitting material, an inorganic light-emitting material, a quantum dot, a quantum rod, a micro LED, or a nano LED. Hereinafter, the case where the light-emitting element ED is an organic light-emitting element will be described as an example, but it is not particularly limited to this.

[0076] The light-emitting element ED may include a first electrode AE, a light-emitting layer EL, and a second electrode CE.

[0077] The first electrode AE ​​can be disposed on the sixth insulating layer 60. The first electrode AE ​​can be connected to the second connecting electrode CNE2 through the third contact hole CNT3 penetrating the sixth insulating layer 60.

[0078] The light-emitting element layer 130 may include a pixel defining film 70. The pixel defining film 70 is disposed on the sixth insulating layer 60 and may cover a portion of the first electrode AE. A pixel opening 70-OP is defined in the pixel defining film 70. The pixel opening 70-OP of the pixel defining film 70 exposes at least a portion of the first electrode AE.

[0079] Display area DA (reference) Figure 1The light-emitting region PXA may include a light-emitting region PXA and a non-light-emitting region NPXA adjacent to the light-emitting region PXA. The non-light-emitting region NPXA may surround the light-emitting region PXA. In this embodiment, the light-emitting region PXA is defined as a local area corresponding to the first electrode AE ​​exposed by the pixel opening 70-OP.

[0080] The light-emitting layer EL can be disposed on the first electrode AE. The light-emitting layer EL can be disposed in the region corresponding to the pixel opening 70-OP. That is, the light-emitting layer EL can be formed separately in each pixel. When multiple light-emitting layers EL are formed and separated in each pixel, each of the multiple light-emitting layers EL can emit light of at least one color selected from blue, red, and green. However, it is not limited to this; the light-emitting layer EL can also be connected to the pixels and provided jointly. In this case, the light-emitting layer EL can provide blue light, or it can provide white light.

[0081] The second electrode CE can be disposed on the light-emitting layer EL. The second electrode CE can have a single shape and can be disposed together on multiple pixels.

[0082] Although not shown, a hole control layer may be disposed between the first electrode AE ​​and the light-emitting layer EL. The hole control layer may be disposed together in the light-emitting region PXA and the non-light-emitting region NPXA. The hole control layer may include a hole transport layer and may also include a hole injection layer. An electron control layer may be disposed between the light-emitting layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may also include an electron injection layer. The hole control layer and the electron control layer may be formed together in multiple pixels using an open mask.

[0083] The encapsulation layer 140 may be disposed on the light-emitting element layer 130. The encapsulation layer 140 may include a first inorganic layer 141, an organic layer 142 and a second inorganic layer 143 stacked in sequence; however, the layers constituting the encapsulation layer 140 are not limited to these.

[0084] The first inorganic layer 141 and the second inorganic layer 143 protect the light-emitting element layer 130 from moisture and oxygen, while the organic layer 142 protects the light-emitting element layer 130 from foreign matter such as dust particles. The first inorganic layer 141 and the second inorganic layer 143 may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, etc. The organic layer 142 may include an acrylic organic layer, but is not limited thereto.

[0085] Figure 5 This is a plan view of an input sensor according to an embodiment of the present invention. Figure 6 It is shown in magnification Figure 5 The plan view of section AA shown. Figures 7A to 7C It is along Figure 6The cross-sectional view of the display device according to an embodiment of the present invention is shown, cut along section line II-II'.

[0086] Reference Figure 5 and Figure 6 The input sensor 200 can define a sensing area 200A and a non-sensing area 200N. The sensing area 200A can be an area activated by an electrical signal. For example, the sensing area 200A can be an area that actually senses the input. The sensing area 200A can be connected to the display device DD (see reference). Figure 1 The display area DA (refer to) Figure 1 The non-sensing area 200N may overlap with the sensing area 200A. The non-sensing area 200N may overlap with the non-display area NDA of the display device DD (see reference). Figure 1 )overlapping.

[0087] The sensing area 200A may include multiple first areas 1A and multiple second areas 1IA. The multiple first areas 1A are repeatedly arranged on a first direction DR1, and the multiple second areas 1IA are repeatedly arranged on the first direction DR1. The first direction DR1 can be connected to a display device DD (in... Figure 1 The curling direction of the display device DD is parallel to the second direction DR2. If the curling direction of the display device DD is parallel to the second direction DR2, then the first region IA and the second region NIA can be repeatedly arranged on the second direction DR2. That is, the arrangement direction of the first region IA and the second region NIA depends on the curling direction of the display device DD.

[0088] As an example of the present invention, a plurality of first regions IA and a plurality of second regions NIA are alternately arranged in a first direction DR1. The plurality of first regions IA can be defined as regions where the inorganic insulating layer 240 is disposed, and the plurality of second regions NIA can be defined as regions where the inorganic insulating layer 240 is not disposed. Furthermore, the inorganic insulating layer 240 may not be disposed in the non-sensing region 200N. The inorganic insulating layer 240 and the first regions IA and second regions NIA will be described later.

[0089] The input sensor 200 may include a plurality of first sensing electrodes TE1, TE2, TE3, TE4 and a plurality of second sensing electrodes RE1, RE2, RE3, RE4, RE5, RE6. The plurality of first sensing electrodes TE1 to TE4 may extend along a first direction DR1 and may be arranged along a second direction DR2. The plurality of second sensing electrodes RE1 to RE6 may extend along the second direction DR2 and may be arranged along the first direction DR1. The plurality of first sensing electrodes TE1 to TE4 may intersect with the plurality of second sensing electrodes RE1 to RE6. A capacitance may be formed between the plurality of first sensing electrodes TE1 to TE4 and the plurality of second sensing electrodes RE1 to RE6. The number of first sensing electrodes TE1 to TE4 and second sensing electrodes RE1 to RE6 provided in the input sensor 200 is not particularly limited.

[0090] The input sensor 200 may further include a plurality of first signal wirings (not shown) connected to a plurality of first sensing electrodes TE1 to TE4 and a plurality of second signal wirings SL2_1 to SL2_6 (see reference) connected to a plurality of second sensing electrodes RE1 to RE6. Figure 18 , Figure 19A , Figure 19B as well as Figure 20 The first and second signal wirings can be arranged in the non-sensing area 200N.

[0091] Each of the plurality of first sensing electrodes TE1 to TE4 may include a plurality of first sensing portions SP1 and bridging portions BP. Two adjacent first sensing portions SP1 may be electrically connected to each other by means of the bridging portions BP, but are not particularly limited thereto. The plurality of first sensing portions SP1 and bridging portions BP may be arranged on different layers.

[0092] Each of the plurality of second sensing electrodes RE1 to RE6 may include a plurality of second sensing portions SP2 and extension portions EP. The plurality of second sensing portions SP2 and extension portions EP may have an integral shape with each other and may be arranged on the same layer. A bridging portion BP and an extension portion EP may be arranged at the intersection of the first sensing electrodes TE1 to TE4 and the second sensing electrodes RE1 to RE6, and at the intersection, the bridging portion BP may cross in a manner that is insulated from the extension portion EP.

[0093] Reference Figure 6 Each of the plurality of first sensing portions SP1 may have a polygonal shape. As an example of the invention, each of the plurality of first sensing portions SP1 may have a rhomboid shape. However, the shape of each of the plurality of first sensing portions SP1 is not particularly limited.

[0094] Each of the plurality of first sensing portions SP1 may have a grid shape. Each of the plurality of first sensing portions SP1 may include a plurality of first grid lines, and each of the plurality of first grid lines may extend in a direction inclined relative to a first direction DR1 or a second direction DR2. The extension direction of each of the plurality of first grid lines is not particularly limited. For example, each of the plurality of first grid lines may extend parallel to the first direction DR1 or the second direction DR2.

[0095] Each of the plurality of second sensing portions SP2 may be polygonal. As an example of the invention, each of the plurality of second sensing portions SP2 may be rhomboid in shape. However, the shape of each of the plurality of second sensing portions SP2 is not particularly limited.

[0096] Each of the plurality of second sensing portions SP2 may have a grid shape. Each of the plurality of second sensing portions SP2 may include a plurality of second grid lines, and each of the plurality of second grid lines may extend in a direction inclined relative to the first direction DR1 or the second direction DR2. The extension direction of each of the plurality of second grid lines is not particularly limited. For example, each of the plurality of second grid lines may extend parallel to the first direction DR1 or the second direction DR2.

[0097] Reference Figure 6 and Figure 7A An input sensor 200 is provided on the display panel 100. The input sensor 200 can be directly disposed on the encapsulation layer 140. That is, no third component is disposed between the input sensor 200 and the encapsulation layer 140.

[0098] The input sensor 200 may include a base insulating layer 210, an organic insulating layer 220, a first conductive layer 230, an inorganic insulating layer 240, a second conductive layer 250, and a protective insulating layer 260.

[0099] The base insulating layer 210 can be directly disposed on the encapsulation layer 140. The base insulating layer 210 can be an inorganic layer including at least one of silicon nitride, silicon oxynitride, and silicon oxide. The base insulating layer 210 can have a single-layer structure or a multilayer structure stacked along the third direction DR3.

[0100] The base insulating layer 210 may be disposed in multiple first regions IA, but may not be disposed in multiple second regions NIA. That is, the base insulating layer 210 may overlap with multiple first regions IA, but not with multiple second regions NIA. Each of the multiple second regions NIA may have a first opening 211 formed corresponding to the base insulating layer 210, for example, a first opening 211 formed by removing the base insulating layer 210. Each of the first openings 211 may be formed along a second direction DR2.

[0101] An organic insulating layer 220 is disposed on a base insulating layer 210. The organic insulating layer 220 may be disposed together in multiple first regions IA and multiple second regions NIA. The organic insulating layer 220 may overlap with the multiple first regions IA and multiple second regions NIA.

[0102] The organic insulating layer 220 may include at least one selected from acrylic resins, methacrylic resins, polyisoprene, ethylene resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyimide resins, polyamide resins, and perylene resins. The organic insulating layer 220 may have a flat surface. That is, the organic insulating layer 220 can remove or reduce the step difference between the first region 1A and the second region NIA caused by the formation of the first opening 211 in the second region NIA.

[0103] A first conductive layer 230 is disposed on the organic insulating layer 220. As an example of the present invention, the first conductive layer 230 may be disposed in a plane within a plurality of first regions IA. However, the position of the first conductive layer 230 is not particularly limited.

[0104] The first conductive layer 230 may have a monolayer structure or a multilayer structure stacked along the third direction DR3. The monolayer first conductive layer 230 may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). Furthermore, the transparent conductive layer may include conductive polymers such as PEDOT, metal nanowires, graphene, etc.

[0105] The first conductive layer 230 of the multilayer structure may include a metal layer. The metal layer may have a three-layer structure, such as titanium / aluminum / titanium. The first conductive layer 230 of the multilayer structure may include at least one metal layer and at least one transparent conductive layer.

[0106] An inorganic insulating layer 240 is disposed on the first conductive layer 230 and the organic insulating layer 220. The first conductive layer 230 is covered by the inorganic insulating layer 240.

[0107] The inorganic insulating layer 240 may include at least one of silicon nitride, silicon oxynitride, and silicon oxide. The inorganic insulating layer 240 may have a single-layer structure or a multilayer structure stacked along the third direction DR3.

[0108] The inorganic insulating layer 240 may be disposed in multiple first regions IA, but may not be disposed in multiple second regions NIA. That is, the inorganic insulating layer 240 may overlap with multiple first regions IA, but may not overlap with multiple second regions NIA. Second openings 241 corresponding to the inorganic insulating layer 240 may be provided in the multiple second regions NIA, for example, second openings 241 formed by removing the inorganic insulating layer 240 may be provided. Each of the second openings 241 may be formed along a second direction DR2. In the first direction DR1, the width of the first opening 211 may be substantially the same as the width of the second opening 241. However, this is not particularly limiting. In the first direction DR1, the width of the second opening 241 may be greater than the width of the first opening 211.

[0109] A second conductive layer 250 is disposed on the inorganic insulating layer 240. As an example of the present invention, the second conductive layer 250 may be disposed in a plurality of first regions IA and a plurality of second regions NIA. In the plurality of first regions IA, the second conductive layer 250 is disposed on the inorganic insulating layer 240, and in the plurality of second regions NIA, the second conductive layer 250 is disposed on the organic insulating layer 220 exposed through the second opening 241.

[0110] The second conductive layer 250 can have a monolayer structure or a multilayer structure stacked along the third direction DR3. The monolayer second conductive layer 250 can include a metal layer or a transparent conductive layer. The metal layer can include molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The transparent conductive layer can include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). Furthermore, the transparent conductive layer can include conductive polymers such as PEDOT, metal nanowires, graphene, etc.

[0111] The second conductive layer 250 of the multilayer structure may include a metal layer. The metal layer may have a three-layer structure, such as titanium / aluminum / titanium. The second conductive layer 250 of the multilayer structure may include at least one metal layer and at least one transparent conductive layer.

[0112] A protective insulating layer 260 is disposed on the second conductive layer 250. The protective insulating layer 260 may include an organic layer. The organic layer may include at least one selected from acrylic resins, methacrylic resins, polyisoprene, ethylene resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyimide resins, polyamide resins, and perylene resins. The protective insulating layer 260 can protect the first conductive layer 230 and the second conductive layer 250 from foreign matter such as dust particles.

[0113] As an example of the present invention, the bridging portion BP may be included in the first conductive layer 230, and a plurality of first sensing portions SP1, a plurality of second sensing portions SP2 and an extension portion EP may be included in the second conductive layer 250.

[0114] Reference Figure 7B In multiple second regions NIA, a second opening 241a corresponding to the inorganic insulating layer 240a can be provided. For example, a second opening 241a formed by removing the inorganic insulating layer 240a can be provided. The second opening 241a can be formed along a second direction DR2. The inorganic insulating layer 240a includes a side surface 242 defining the second opening 241a. The side surface 242 can be an inclined surface inclined at a first angle θ1 relative to the upper surface 221 of the organic insulating layer 220. As an example of the present invention, the first angle θ1 can be less than 90°.

[0115] If the side surface 242 is an inclined surface, the thickness of the inorganic insulating layer 240a can gradually decrease as it approaches the second opening 241a. Furthermore, the smaller the first angle θ1, the gentler the inclination of the side surface 242. This prevents a sharp increase in the step difference between the inorganic insulating layer 240a and the organic insulating layer 220. Therefore, it can prevent or reduce phenomena such as the second conductive layer 250 breaking at the boundary between the adjacent first region IA and second region NIA due to the aforementioned step difference.

[0116] The shape of the side surface 242 of the inorganic insulating layer 240a is not limited to an inclined surface shape. For example, the side surface 242 can be provided as a stepped shape. Even when the side surface 242 has a stepped shape, it can prevent the step difference between the inorganic insulating layer 240a and the organic insulating layer 220 from increasing or changing abruptly.

[0117] Reference Figure 7CThe encapsulation layer 140a may include a first inorganic layer 141a, an organic layer 142a and a second inorganic layer 143a stacked in sequence.

[0118] The first inorganic layer 141a may be disposed in multiple first regions IA, but may not be disposed in multiple second regions NIA. That is, the first inorganic layer 141a may overlap with multiple first regions IA, but may not overlap with multiple second regions NIA. A third opening 141a_OP corresponding to the first inorganic layer 141a may be provided in each of the multiple second regions NIA. For example, a third opening 141a_OP formed by removing the first inorganic layer 141a may be provided. The third opening 141a_OP may be formed along the second direction DR2.

[0119] An organic layer 142a is disposed on the first inorganic layer 141a. The organic layer 142a can be disposed together in multiple first regions 1A and multiple second regions 1IA. The organic layer 142a can overlap with the multiple first regions 1A and multiple second regions 1IA. The organic layer 142a can have a flat surface. That is, the organic layer 142a can remove or reduce the step difference between the first regions 1A and the second regions 1IA caused by the formation of the third opening 141a_OP in the second region 1IA.

[0120] A second inorganic layer 143a is disposed on the organic layer 142a. The second inorganic layer 143a may be disposed in multiple first regions IA, but may not be disposed in multiple second regions NIA. That is, the second inorganic layer 143a may overlap with multiple first regions IA, but may not overlap with multiple second regions NIA. A fourth opening 143a_OP corresponding to the second inorganic layer 143a may be provided in each of the multiple second regions NIA. For example, a fourth opening 143a_OP formed by removing the second inorganic layer 143a may be provided. The fourth opening 143a_OP may be formed along the second direction DR2.

[0121] A basic insulating layer 210 is disposed on the second inorganic layer 143a. The first opening 211 of the basic insulating layer 210 may be arranged corresponding to the fourth opening 143a_OP of the second inorganic layer 143a. In the first direction DR1, the width of the third opening 141a_OP may be substantially the same as the widths of the first opening 211 and the second opening 241, and the width of the fourth opening 143a_OP may also be substantially the same as the widths of the first opening 211 and the second opening 241. However, this is not particularly limiting. For example, in the first direction DR1, the width of the fourth opening 143a_OP may be smaller than the width of the first opening 211, and the width of the third opening 141a_OP may be smaller than the width of the fourth opening 143a_OP.

[0122] Although Figures 7A to 7C The illustration shows a structure in which a base insulating layer 210 is arranged between the organic insulating layer 220 and the encapsulation layer 140; however, the invention is not limited thereto. That is, the base insulating layer 210 can be omitted. When the base insulating layer 210 is omitted, the organic insulating layer 220 can be directly arranged on the encapsulation layer 140.

[0123] Although Figure 7C The illustration shows a portion of the encapsulation layer 140a (i.e., the first inorganic layer 141a and the second inorganic layer 143a) being removed in the second region NIA; however, embodiments of the invention are not limited to this. For example, only one of the first inorganic layer 141a and the second inorganic layer 143a may be removed in the second region NIA. Furthermore, in addition to the encapsulation layer 140a, other insulating layers constituting the display panel 100 (e.g., buffer layer BFL) may also be removed. Figure 4 (as shown) or at least one of the insulating layers 10 to 50 constituting the circuit layer 120 may be removed in the second region NIA.

[0124] Thus, since the first region IA and the second region NIA are arranged alternately in the curling direction, the problem of unevenness when the display device DD (refer to...) is alleviated. Figure 1 When the display panel DP is curled along the curling direction (refer to...), it is applied to the display panel DP. Figure 3 The pressure of the input sensor 200 is also considered. In particular, layers made of inorganic materials may be subjected to greater pressure during curling compared to layers made of organic materials. To address this, repeatedly removing layers made of inorganic materials (i.e., at least one of the inorganic insulating layer 240, the base insulating layer 210, the first inorganic layer 141a, and the second inorganic layer 143a) along the curling direction can alleviate the pressure applied to these layers. Therefore, the curling characteristics and reliability of the display device DD can be improved.

[0125] Figure 8 It is magnification Figure 5 The plan view of part AA shown is based on an embodiment of the present invention. Figure 9 It is along Figure 8 The sectional view shown is cut along section line III-III'.

[0126] Reference Figure 8 and Figure 9 At least one of the plurality of first sensing portions SP1 includes a first upper sensing portion USP1 disposed in a first region IA and a first lower sensing portion LSP1 disposed in a second region NIA. When at least one of the plurality of first sensing portions SP1 is disposed overlapping both the first region IA and the second region NIA, at least one first sensing portion SP1 may include a first lower sensing portion LSP1 included in a first conductive layer 230 and a first upper sensing portion USP1 included in a second conductive layer 250. However, if at least one of the plurality of first sensing portions SP1 overlaps only with the first region IA but not with the second region NIA, then at least one first sensing portion SP1 may be included in the second conductive layer 250.

[0127] Each of the first lower sensing portion LSP1 and the first upper sensing portion USP1 may have a grid shape. The first lower sensing portion LSP1 may extend to the first region IA and partially overlap with the first upper sensing portion USP1. The inorganic insulating layer 240 may include a first inorganic contact hole 243 exposing a first extended end of the first lower sensing portion LSP1 and a second inorganic contact hole 244 exposing a second extended end opposite to the first extended end.

[0128] The first upper sensing portion USP1 can be directly connected to the first extended end of the first lower sensing portion LSP1 through the first inorganic contact hole 243, and can be directly connected to the second extended end of the first lower sensing portion LSP1 through the second inorganic contact hole 244. Therefore, the first lower sensing portion LSP1 can be electrically connected to the first upper sensing portion USP1.

[0129] At least one of the plurality of second sensing portions SP2 includes a second upper sensing portion USP2 disposed in the first region IA and a second lower sensing portion LSP2 disposed in the second region NIA. When at least one of the plurality of second sensing portions SP2 is disposed overlapping with both the first region IA and the second region NIA, at least one second sensing portion SP2 may include a second lower sensing portion LSP2 included in the first conductive layer 230 and a second upper sensing portion USP2 included in the second conductive layer 250. However, if at least one of the plurality of second sensing portions SP2 overlaps only with the first region IA but not with the second region NIA, then the at least one second sensing portion SP2 may be included in the second conductive layer 250.

[0130] Since the connection structure between the second lower sensing portion LSP2 and the second upper sensing portion USP2 is similar to the connection structure between the first lower sensing portion LSP1 and the first upper sensing portion USP1, specific descriptions of these connection structures between the second lower sensing portion LSP2 and the second upper sensing portion USP2 will be omitted.

[0131] The sensing portion SP1 or SP2, which overlaps with both the first region IA and the second region NIA, is arranged as a lower sensing portion LSP1 or LSP2 and an upper sensing portion USP1 or USP2. This eliminates or reduces defects such as open circuits caused by the step difference between the organic insulating layer 220 and the inorganic insulating layer 240 at the boundary between the first region IA and the second region NIA.

[0132] Figure 10 It is magnification Figure 5 The plan view of part AA shown is based on an embodiment of the present invention. Figure 11 It is along Figure 10 The sectional view shown is cut along section line IV-IV'.

[0133] Reference Figure 10 and Figure 11 At least one of the plurality of first sensing portions SP1 includes a first upper sensing portion USP1 disposed in a first region IA and a first lower sensing portion LSP1 disposed in a second region NIA. When at least one of the plurality of first sensing portions SP1 is disposed overlapping with both the first region IA and the second region NIA, at least one first sensing portion SP1 may include a first lower sensing portion LSP1 included in a first conductive layer 230 and a first upper sensing portion USP1 included in a second conductive layer 250. However, if at least one of the plurality of first sensing portions SP1 overlaps only with the first region IA but not with the second region NIA, then at least one first sensing portion SP1 may be included in the second conductive layer 250.

[0134] Each of the first lower sensing portion LSP1 and the first upper sensing portion USP1 may have a grid shape. The first upper sensing portion USP1 may extend into the second region NIA and partially overlap with the first lower sensing portion LSP1. In the second region NIA, the first lower sensing portion LSP1 is exposed through a second opening 241 provided in the inorganic insulating layer 240. The first upper sensing portion USP1 extending into the second region NIA is directly connected to the first lower sensing portion LSP1 within the second opening 241.

[0135] At least one of the plurality of second sensing portions SP2 includes a second upper sensing portion USP2 disposed in the first region IA and a second lower sensing portion LSP2 disposed in the second region NIA. When at least one of the plurality of second sensing portions SP2 is disposed overlapping with both the first region IA and the second region NIA, at least one second sensing portion SP2 may include a second lower sensing portion LSP2 included in the first conductive layer 230 and a second upper sensing portion USP2 included in the second conductive layer 250. However, if at least one of the plurality of second sensing portions SP2 overlaps only with the first region IA and not with the second region NIA, then the at least one second sensing portion SP2 may be included in the second conductive layer 250.

[0136] Since the connection structure between the second lower sensing portion LSP2 and the second upper sensing portion USP2 is similar to the connection structure between the first lower sensing portion LSP1 and the first upper sensing portion USP1, detailed descriptions of these connection structures between the second lower sensing portion LSP2 and the second upper sensing portion USP2 will be omitted.

[0137] Since the lower sensing portions LSP1 or LSP2 are disposed in the second region NIA, the depth of the second opening 241 provided in the inorganic insulating layer 240 is partially reduced. During the reduced depth of the second opening 241, the lower sensing portion LSP1 or LSP2 can be directly connected to the upper sensing portion USP1 or USP2. This reduced depth of the second opening 241 improves the reliability of the connection between the lower sensing portion LSP1 or LSP2 and the upper sensing portion USP1 or USP2.

[0138] Figure 12 This is a plan view of an input sensor according to an embodiment of the present invention. Figure 13 It is magnification Figure 12 The plan view of the BB portion shown is based on an embodiment of the present invention. Figure 14 It is along Figure 13 The sectional view shown is cut along section line V-V'. Figure 15 This is a plan view of an input sensor according to an embodiment of the present invention. Figures 12 to 15 Among the constituent elements shown, and Figures 5 to 11 The same constituent elements shown are given the same reference numerals, and specific descriptions of them are omitted.

[0139] Reference Figure 12 and Figure 13The input sensor 200 can define a sensing area 200A and a non-sensing area 200N. The sensing area 200A may include a plurality of first areas IA and a plurality of second areas NIA. The plurality of first areas IA are repeatedly arranged in a first direction DR1, and the plurality of second areas NIA are repeatedly arranged in the first direction DR1. As an example of the present invention, the plurality of first areas IA and the plurality of second areas NIA are alternately arranged in the first direction DR1.

[0140] The inorganic insulating layer 240c includes a plurality of first inorganic insulating layers 240_B disposed in a plurality of first regions IA and a plurality of second inorganic insulating layers 240_I disposed in a plurality of second regions NIA. A first opening region 241c corresponding to the first inorganic insulating layers 240_B and the second inorganic insulating layers 240_I can be provided in the plurality of second regions NIA. For example, a first opening region 241c formed by removing the first inorganic insulating layers 240_B and the second inorganic insulating layers 240_I can be provided. Each of the first inorganic insulating layers 240_B has a strip shape extending along a second direction DR2, and each of the second inorganic insulating layers 240_I has an island shape.

[0141] The input sensor 200 may include a plurality of first sensing electrodes TE1 to TE4 and a plurality of second sensing electrodes RE1 to RE6. The plurality of first sensing electrodes TE1 to TE4 may extend along a first direction DR1 and may be arranged along a second direction DR2. The plurality of second sensing electrodes RE1 to RE6 may extend along the second direction DR2 and may be arranged along the first direction DR1.

[0142] Each of the plurality of first sensing electrodes TE1 to TE4 may include a plurality of first sensing portions SP1 and bridging portions BP. Two adjacent first sensing portions SP1 may be electrically connected to each other by means of the bridging portions BP, but are not particularly limited thereto. The plurality of first sensing portions SP1 and bridging portions BP may be arranged on different layers.

[0143] Each of the plurality of second sensing electrodes RE1 to RE6 may include a plurality of second sensing portions SP2 and extension portions EP. The plurality of second sensing portions SP2 and extension portions EP may have an integral shape with each other and may be arranged on the same layer. A bridging portion BP and an extension portion EP may be arranged at the intersection of the first sensing electrodes TE1 to TE4 and the second sensing electrodes RE1 to RE6, and the bridging portion BP may cross at the intersection in a manner that is insulated from the extension portion EP by a second inorganic insulating layer 240_I.

[0144] Reference Figure 13 and Figure 14An input sensor 200 is provided on the display panel 100. The input sensor 200 can be directly disposed on the encapsulation layer 140.

[0145] The input sensor 200 may include a basic insulating layer 210, an organic insulating layer 220, a first conductive layer 230, an inorganic insulating layer 240c, a second conductive layer 250, and a protective insulating layer 260.

[0146] The base insulating layer 210 may be disposed in multiple first regions IA, but may not be disposed in multiple second regions NIA. That is, the base insulating layer 210 may overlap with multiple first regions IA, but may not overlap with multiple second regions NIA. A first opening 211 corresponding to the base insulating layer 210 may be provided in each of the multiple second regions NIA, for example, a first opening 211 formed by removing the base insulating layer 210 may be provided.

[0147] An organic insulating layer 220 is disposed on a base insulating layer 210. The organic insulating layer 220 may be disposed together in multiple first regions IA and multiple second regions NIA. The organic insulating layer 220 may overlap with the multiple first regions IA and multiple second regions NIA.

[0148] The inorganic insulating layer 240c includes a plurality of first inorganic insulating layers 240_B and a plurality of second inorganic insulating layers 240_I. The plurality of first inorganic insulating layers 240_B are respectively disposed in a plurality of first regions IA, and each of the plurality of first inorganic insulating layers 240_B has a strip shape extending along a second direction DR2. The plurality of second inorganic insulating layers 240_I may be disposed in a plurality of second regions NIA, and each of the plurality of second inorganic insulating layers 240_I may have a quadrilateral lattice shape.

[0149] Multiple second regions NIA include a first opening region 241c where the first inorganic insulating layer 240_B and the second inorganic insulating layer 240_I are not disposed.

[0150] The first conductive layer 230 is covered by a second inorganic insulating layer 240_I within a plurality of second regions NIA. The bridging portion BP of the first sensing electrodes TE1 to TE4 is included in the first conductive layer 230.

[0151] A second conductive layer 250 is disposed on the first inorganic insulating layer 240_B and the second inorganic insulating layer 240_I. The first sensing portion SP1 of the first sensing electrodes TE1 to TE4 and the second sensing portion SP2 and extension portion EP of the second sensing electrodes RE1 to RE6 are included in the second conductive layer 250. The second inorganic insulating layer 240_I may provide a contact hole 240_Ic for exposing the bridging portion BP. Therefore, the first sensing portion SP1 can be directly connected to the bridging portion BP within the second region NIA through the contact hole 240_Ic.

[0152] Even though the bridging portion BP and the extension portion EP are located within the second region NIA, the second inorganic insulating layer 240_I is disposed between the bridging portion BP and the extension portion EP within the second region NIA. Therefore, the bridging portion BP and the extension portion EP can be electrically insulated by the second inorganic insulating layer 240_I.

[0153] exist Figures 12 to 14 The diagram illustrates a structure in which the first inorganic insulating layer 240_B and the second inorganic insulating layer 240_I are arranged spaced apart from each other. However, the present invention is not limited thereto.

[0154] like Figure 15 As shown, an inorganic insulating layer 240e according to an embodiment of the present invention includes a plurality of first inorganic insulating layers 240_B disposed in a plurality of first regions IA and a plurality of second inorganic insulating layers 240_E disposed in a plurality of second regions NIA. The second inorganic insulating layers 240_E can extend from the first inorganic insulating layers 240_B. That is, the first inorganic insulating layers 240_B and the second inorganic insulating layers 240_E can have an integral shape. However, a second opening region 241e can be provided in the second region NIA corresponding to the first inorganic insulating layers 204_B and the second inorganic insulating layers 240_E, for example, the second opening region 241e can be formed by removing the first inorganic insulating layers 204_B and the second inorganic insulating layers 240_E.

[0155] The second opening regions 241e can be arranged to be spaced apart from each other in the second direction DR2 by means of the second inorganic insulating layer 240_E, and can be arranged to be spaced apart from each other in the first direction DR1 by means of the first inorganic insulating layer 240_B.

[0156] Thus, when the intersection of the first sensing electrodes TE1 to TE4 and the second sensing electrodes RE1 to RE6 is located in the second region NIA, the inorganic insulating layer can be partially retained in the second region NIA in a manner corresponding to the intersection. Therefore, the second region NIA can also provide a contact structure between the bridging portion BP and the first sensing portion SP1, as well as an electrical insulation structure between the bridging portion BP and the extension portion EP.

[0157] Figure 16 This is a plan view of an input sensor according to an embodiment of the present invention.

[0158] Reference Figure 16 Multiple inorganic insulating layers 240f can be arranged in the sensing area 200A. The multiple inorganic insulating layers 240f are repeatedly arranged in the curling direction R_DR, and are spaced apart from each other in the curling direction R_DR by means of multiple second openings 241f. That is, the multiple inorganic insulating layers 240f and the multiple second openings 241f are arranged alternately in the curling direction R_DR.

[0159] Multiple second openings 241f can have different widths relative to each other in the curling direction R_DR. When in a display device DD (see...) Figure 1 When the location where the curling begins is defined as the first location P1 and the location where the curling ends is defined as the third location P3, the width of the multiple second openings 241f can also be increased from the first location P1 to the third location P3.

[0160] Although the second opening 241f adjacent to the first location P1 may have a first width d1 in the curling direction R_DR, the second opening 241f adjacent to the intermediate location between the first location P1 and the third location P3 (i.e., the second location P2) may have a second width d2 in the curling direction R_DR that is greater than the first width d1. Furthermore, the second opening 241f adjacent to the third location P3 may have a third width d3 in the curling direction R_DR that is greater than the second width d2.

[0161] Although Figure 16 The illustration shows a structure in which the width of the second opening 241f gradually increases from a first location P1 to a third location P3; however, the invention is not limited thereto. For example, the input sensor 200 may be divided into multiple sections in the curling direction R_DR, and the width of the second opening 241f may be set differently for each section.

[0162] Figure 17 This is a plan view of an input sensor according to an embodiment of the present invention. Figure 18 It is shown in magnification Figure 17 The plan view of section CC is shown. Figure 19A It is along Figure 18 The sectional view shown is cut along section line VI-VI'. Figure 19B It is along Figure 18 The sectional view shown is cut along section line VII-VII'. Figure 20 It is shown in magnification Figure 18 The plan view of the EE section is shown. Figures 17 to 20 The constituent elements shown are in Figures 5 to 16 The same constituent elements shown are given the same reference numerals, and specific descriptions of them are omitted.

[0163] Reference Figure 17 and Figure 18 The input sensor 200 can define a sensing area 200A and a non-sensing area 200N. The sensing area 200A is the area that is activated by an electrical signal and can substantially sense the input. The non-sensing area 200N can be the area that does not substantially sense the input and can surround the sensing area 200A.

[0164] Each of the sensing area 200A and the non-sensing area 200N may include a plurality of first areas 1A and a plurality of second areas 1IA. The plurality of first areas 1A are repeatedly arranged along a first direction DR1, and the plurality of second areas 1IA are repeatedly arranged along the first direction DR1. The first direction DR1 can be connected to a display device DD (in... Figure 1 The curling directions (as shown in the diagram) are parallel. As an example of the present invention, a plurality of first regions IA and a plurality of second regions NIA are alternately arranged in the first direction DR1.

[0165] Multiple first regions IA can be defined as regions where the inorganic insulating layer 240g is disposed, and multiple second regions NIA can be defined as regions where the inorganic insulating layer 240g is not disposed. Each of the multiple second regions NIA can be provided with a second opening 241g formed corresponding to the inorganic insulating layer 240g; for example, a second opening 241g formed by removing the inorganic insulating layer 240g can be provided.

[0166] In the non-sensing area 200N, a plurality of first signal wirings (not shown) connected to a plurality of first sensing electrodes TE1 to TE4 respectively and a plurality of second signal wirings SL2_1 to SL2_6 connected to a plurality of second sensing electrodes RE1 to RE6 respectively may be arranged.

[0167] Reference Figure 18 , Figure 19A and Figure 19B Each of the plurality of second signal wirings SL2_1, SL2_2, SL2_3, SL2_4, SL2_5, and SL2_6 can have a multilayer structure in the first region IA, but can have a single-layer structure in the second region NIA. That is, in the first region IA, each of the plurality of second signal wirings SL2_1 to SL2_6 can include a lower wiring LSL and an upper wiring USL. The lower wiring LSL can be disposed on the organic insulating layer 220, and the upper wiring USL can be disposed on the inorganic insulating layer 240g. That is, the lower wiring LSL can be disposed on the first conductive layer 230 (refer to...). Figure 7AOn the same layer as the second conductive layer 250 (see reference 250), and the upper wiring USL can be arranged on the same layer as the second conductive layer 250 (see reference 250). Figure 7A On the same layer.

[0168] In the second region NIA, each of the plurality of second signal wirings SL2_1 to SL2_6 may consist of only one wiring from the lower wiring LSL and the upper wiring USL. Since the inorganic insulating layer 240g and the base insulating layer 210 are removed in the second region NIA, the plurality of second signal wirings SL2_1 to SL2_6 may be arranged on the organic insulating layer 220.

[0169] Each of the plurality of second signal wirings SL2_1 to SL2_6 may have a structure that alternates between multi-layer and single-layer structures in the curling direction. However, the invention is not limited thereto. Each of the plurality of second signal wirings SL2_1 to SL2_6 may have a single-layer structure throughout the second region NIA.

[0170] Reference Figures 18 to 20 The width of each of the plurality of second signal traces SL2_1 to SL2_6 may decrease at the boundary between the first region IA and the second region NIA. For example, each of the plurality of second signal traces SL2_1 to SL2_6 may have a first trace width W1 in a first portion and a second trace width W2 in a second portion. The first portion may overlap with the center portion of each of the first region IA and the second region NIA, and the second portion may overlap with the boundary portion between the first region IA and the second region NIA. Here, the first trace width W1 may be greater than the second trace width W2.

[0171] A step difference is formed between the inorganic insulating layer 240g and the organic insulating layer 220 at the boundary between the first region IA and the second region NIA. In the process of patterning the second signal wirings SL2_1 to SL2_6, short circuits between the second signal wirings SL2_1 to SL2_6 due to the step difference between the inorganic insulating layer 240g and the organic insulating layer 220 can be prevented.

[0172] However, the invention is not limited thereto. For example, when the inorganic insulating layer 240g and the basic insulating layer 210 are completely removed within the second region NIA, each of the second signal wirings SL2_1 to SL2_6 may have a predetermined wiring width.

[0173] While the preferred embodiments of the present invention have been described above, those skilled in the art or with ordinary knowledge of the art will understand that various modifications and alterations can be made to the present invention without departing from the spirit and technical scope of the invention as set forth in the claims. Therefore, the technical scope of the present invention should not be limited to the content described in the detailed specification, but should be determined by the scope of the claims.

Claims

1. A display device, comprising: The display panel includes light-emitting elements and is configured to be able to be rolled up in a first direction; as well as An input sensor is arranged on the display panel and includes a plurality of first regions repeatedly arranged along the first direction and a plurality of second regions repeatedly arranged along the first direction. The input sensor includes: An inorganic insulating layer is disposed in the plurality of first regions; An organic insulating layer is disposed below the inorganic insulating layer and in the plurality of first regions and the plurality of second regions; and Sensing electrodes are arranged on the upper part of the organic insulating layer. The plurality of first regions and the plurality of second regions are arranged alternately in the first direction. In the plurality of second regions of the input sensor, openings are formed corresponding to the inorganic insulating layer. The openings are repeatedly arranged in the first direction and extend along a second direction that intersects the first direction.

2. The display device as claimed in claim 1, wherein, The sensing electrode includes: Multiple first sensing electrodes; and Multiple second sensing electrodes are insulated from and intersect with the multiple first sensing electrodes.

3. The display device as claimed in claim 2, wherein, Each of the plurality of first sensing electrodes includes: Multiple first sensing components; and The bridging portion connects two adjacent first sensing portions among the plurality of first sensing portions. Each of the plurality of second sensing electrodes includes: Multiple second sensing components; and The extension portion extends from two adjacent second sensing portions among the plurality of second sensing portions.

4. The display device as claimed in claim 3, wherein, The input sensor includes: A first conductive layer is disposed on the organic insulating layer; and The second conductive layer is disposed on the inorganic insulating layer.

5. The display device as claimed in claim 4, wherein, The bridging portion is included in the first conductive layer. The plurality of first sensing portions, the plurality of second sensing portions, and the extension portion are included in the second conductive layer.

6. The display device as claimed in claim 4, wherein, The bridging portion is included in the first conductive layer, and the extension portion is included in the second conductive layer.

7. The display device as claimed in claim 6, wherein, At least one of the plurality of first sensing portions includes: A first upper sensing portion is arranged in a corresponding first region of the plurality of first regions; and The first lower sensing portion is arranged in the corresponding second region of the plurality of second regions. At least one of the plurality of second sensing portions includes: The second upper sensing portion is arranged in a corresponding first region of the plurality of first regions; and The second lower sensing portion is arranged in the corresponding second region of the plurality of second regions.

8. The display device as claimed in claim 7, wherein, The first lower sensing portion and the second lower sensing portion are included in the first conductive layer. The first upper sensing portion and the second upper sensing portion are included in the second conductive layer.

9. The display device as claimed in claim 7, wherein, The first lower sensing portion overlaps with the first upper sensing portion within the corresponding first region. The second lower sensing portion overlaps with the second upper sensing portion in the corresponding first region.

10. The display device as claimed in claim 7, wherein, The first lower sensing portion is electrically connected to the first upper sensing portion. The second lower sensing portion is electrically connected to the second upper sensing portion.

11. The display device as claimed in claim 1, wherein, The input sensor also includes a second inorganic insulating layer that partially overlaps with the second region.

12. The display device as claimed in claim 11, wherein, The second inorganic insulating layer is arranged separately from the inorganic insulating layer in the second region.

13. The display device as claimed in claim 11, wherein, The second inorganic insulating layer has a shape that extends from the inorganic insulating layer and is integrally formed with the inorganic insulating layer.

14. The display device as claimed in claim 1, wherein, The inorganic insulating layer includes a side surface that defines the opening. The side surface has an inclined surface shape.

15. The display device as claimed in claim 1, wherein, The input sensor also includes a base insulating layer disposed between the organic insulating layer and the display panel.

16. The display device as claimed in claim 15, wherein, The basic insulating layer comprises inorganic materials. The basic insulating layer is removed in a manner corresponding to the second region.

17. The display device as claimed in claim 1, wherein, The display panel includes: The light-emitting element layer includes the light-emitting element; and An encapsulation layer is disposed on the light-emitting element layer.

18. The display device as claimed in claim 17, wherein, The encapsulation layer includes: First inorganic layer; An organic layer is disposed on the first inorganic layer; and The second inorganic layer is disposed on the organic layer.

19. The display device as claimed in claim 18, wherein, One of the first inorganic layer and the second inorganic layer is removed in a manner corresponding to the second region.

20. A display device, comprising: A display panel includes a light-emitting element layer and an encapsulation layer disposed on the light-emitting element layer, the light-emitting element layer including light-emitting elements, and the display panel is configured to be rollable along a first direction; as well as An input sensor is disposed on the encapsulation layer and includes a plurality of first regions repeatedly arranged along the first direction and extending along a second direction intersecting the first direction, and a plurality of second regions repeatedly arranged along the first direction and extending along the second direction. The input sensor includes: An organic insulating layer is disposed in the plurality of first regions and the plurality of second regions; A first inorganic insulating layer is disposed on top of the organic insulating layer and is disposed in the plurality of first regions respectively; A second inorganic insulating layer is disposed on the same layer as the first inorganic insulating layer and is disposed in the plurality of second regions; and Sensing electrodes are arranged on the upper part of the organic insulating layer. The plurality of first regions and the plurality of second regions are arranged alternately in the first direction. In the plurality of second regions of the input sensor, opening regions are formed corresponding to the first inorganic insulating layer and the second inorganic insulating layer. The second inorganic insulating layer is arranged in the second region, separated from the first inorganic insulating layer.

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