Laser package assembly, laser assembly, and laser display device

Abstract

This application provides a laser packaging assembly, a laser assembly, and a laser display device. The laser packaging assembly includes: a base plate on which multiple lasers and at least one switch are mounted; a housing that, together with the base plate, forms a closed space with a light-emitting surface; multiple lasers are arranged in an array, with lasers in the same row connected in series in a forward direction; furthermore, each row of lasers corresponds one-to-one with at least one switch, and the negative terminal of the last laser in each row is connected to one end of the corresponding switch, while the other end of the switch is grounded; the positive terminal of the first laser in each row receives a driving signal for driving that row, and when the switch is on, the driving signal flows through the lasers in that row to drive them to emit light; the switch is used to turn on or off under the control of a high-frequency signal, so as to drive the lasers at a high frequency based on the high-frequency signal. Through the above-described laser packaging assembly, the spectrum of the light emitted by the laser can be broadened to achieve speckle reduction.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and in particular to a laser packaging component, a laser component, and a laser display device. Background Technology

[0002] Currently, lasers are being used more and more widely in displays. However, due to the narrow spectral linewidth of lasers, interference occurs when the laser encounters a rough display screen during transmission. This results in interference fringes or spots in the image on the display screen, affecting the image quality.

[0003] To avoid interference, related technologies include placing devices such as diffusers or scatterers at the laser's emission point in the optical path. By diffusing the angle of the laser beam, the randomness of the laser beam's spatial phase is changed, thereby reducing the probability of interference. Alternatively, polarizers or polarization conversion elements can be used to change the polarity of the linearly polarized laser beam, thereby reducing the correlation between laser beams and thus reducing interference during beam transmission.

[0004] However, on the one hand, because different colors of light beams have different optical properties, their speckle characteristics also vary. Simply adding speckle-reducing devices to the laser's optical path cannot achieve a targeted speckle reduction effect. For example, using the same optical device in the same optical path will result in less effective improvement for red light speckle than for blue light speckle. On the other hand, dedicated speckle-reducing devices increase the complexity and cost of the optical path. Therefore, a more efficient technical solution for reducing laser coherence and improving laser speckle is needed. Summary of the Invention

[0005] This application provides a laser packaging component, a laser component, and a laser display device, offering a more efficient solution for eliminating speckle phenomena during laser imaging.

[0006] In a first aspect, this application provides a laser packaging assembly, comprising: a base plate on which multiple lasers and at least one switch are mounted; and a housing that, together with the base plate, forms a closed space with a light-emitting surface; wherein the multiple lasers are arranged in an array, and the multiple lasers in the same row are connected in series sequentially in the forward direction; each row of lasers corresponds one-to-one with the at least one switch, and the negative terminal of the last laser in each row is connected to one end of the switch corresponding to that row of lasers, and the other end of the switch is grounded; the positive terminal of the first laser in each row receives a driving signal for driving the laser in that row, and when the switch is turned on, the driving signal flows through the laser in that row to drive the laser in that row to emit light; the switch is used to turn on or off under the control of a high-frequency signal, so as to drive the laser at a high frequency based on the high-frequency signal.

[0007] In some embodiments of this application, the housing includes: a surrounding component disposed around the laser and the switch; and a transparent component disposed above a corresponding area of ​​the surrounding component to form an enclosed space with a light-emitting surface.

[0008] In some embodiments of this application, the laser packaging assembly further includes: at least one high-frequency driving circuit;

[0009] The high-frequency driving circuit is used to output high-frequency signals; the output terminal of the at least one high-frequency driving circuit is connected to the control terminal of the switch corresponding to each row of lasers, and each switch corresponds to only one high-frequency driving circuit, and each high-frequency driving circuit corresponds to at least one switch.

[0010] In some embodiments of this application, the high-frequency drive circuit is disposed outside the surrounding component.

[0011] In some embodiments of this application, the high-frequency drive circuit is disposed inside the enclosed space.

[0012] In some embodiments of this application, the high-frequency driving circuit includes a high-frequency signal generator and a high-frequency driving chip;

[0013] The input terminal of the high-frequency driving chip is connected to the high-frequency signal generator, and the output terminal of the high-frequency driving chip is connected to the control terminal of the switch corresponding to the high-frequency driving circuit; the high-frequency signal generator is used to generate an initial high-frequency signal; the high-frequency driving chip is used to output a high-frequency signal to the control terminal of the switch to drive the switch in response to the initial high-frequency signal generated by the high-frequency signal generator.

[0014] In some embodiments of this application, the laser packaging assembly has multiple positive and negative connection pins on both sides, and the side of the housing has through holes through which the positive and negative connection pins are led out; each row of lasers corresponds to a set of positive and negative connection pins, the positive connection terminal of the first laser in each row is electrically connected to the positive connection pin corresponding to that row, and the other end of the switch corresponding to each row of lasers is electrically connected to the negative connection pin corresponding to that row; each high-frequency drive circuit corresponds to a set of positive and negative connection pins, the power supply input terminal of each high-frequency drive circuit is electrically connected to the corresponding positive connection pin, and the ground terminal of each high-frequency drive circuit is electrically connected to the corresponding negative connection pin, wherein the negative connection pin corresponding to the high-frequency drive circuit is used for grounding.

[0015] In some embodiments of this application, the laser packaging assembly further includes a collimating lens module; wherein the collimating lens module is disposed above the corresponding area of ​​the light-emitting surface.

[0016] In some embodiments of this application, the light emission ports of the plurality of lasers all face the same direction, and a reflecting prism is provided at the light emission port of each laser to reflect the light emitted by the laser out of the enclosed space.

[0017] Secondly, this application provides a laser assembly, the laser assembly comprising: a laser packaging assembly as described in any of the first aspects, and an adapter board. The adapter board has a port corresponding to the laser packaging assembly; the laser packaging assembly corresponds to the port of the adapter board and is connected to the adapter board.

[0018] In some embodiments of this application, a power module is provided on the adapter board. The power module is electrically connected to the laser packaging assembly through the wiring pins of the laser packaging assembly to provide a power supply signal to the laser packaging assembly.

[0019] In some embodiments of this application, the adapter board is further provided with a filtering module; the power module is connected to the laser packaging assembly through the filtering module; the filtering module is used to filter the power supply signal output by the power module and output the filtered power supply signal to the laser packaging assembly.

[0020] Thirdly, this application provides a laser display device, comprising: a laser assembly, a main control circuit, a laser driving circuit, a projection lens, and a display screen as described in any of the second aspects; the main control circuit is connected to the laser driving circuit and is used to output an initial enable signal and an initial current control signal according to the displayed image, and transmit them to the laser driving circuit; the output terminal of the laser driving circuit is connected to the positive terminal of the laser and is used to output driving signals to a plurality of lasers in the laser assembly in response to the initial enable signal and the initial current control signal. Light emitted by the lasers in the laser assembly under high-frequency driving is projected onto the display screen through the projection lens.

[0021] This application provides a laser packaging assembly, a laser assembly, and a laser display device. The laser packaging assembly includes: a base plate on which multiple lasers and at least one switch are mounted; and a housing that, together with the base plate, forms a closed space with a light-emitting surface. The multiple lasers are arranged in an array, with lasers in the same row connected in series in a forward direction. Each row of lasers corresponds one-to-one with at least one switch, and the negative terminal of the last laser in each row is connected to one end of the switch corresponding to that row, while the other end of the switch is grounded. The positive terminal of the first laser in each row receives a driving signal for driving that row of lasers. When the switch is on, the driving signal flows through the row of lasers to drive them to emit light. The switch is used to turn on or off under the control of a high-frequency signal, thereby driving the lasers at a high frequency based on the high-frequency signal. The laser packaging components described above enable the laser to switch at a high frequency between the presence and absence of driving current. Based on the principle of laser emission, the laser will frequently switch between laser radiation and spontaneous emission. During spontaneous emission, it emits fluorescence with a spectrum larger than the narrow-band laser spectrum, thereby broadening the spectral range of the laser output light and thus achieving the effect of dissipating the light spot. Attached Figure Description

[0022] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0023] Figure 1 This application provides a schematic diagram of a planar structure of a laser packaging component according to an embodiment of the present application;

[0024] Figure 2 An equivalent circuit diagram of parasitic inductance during high-frequency driving of a laser provided in this application;

[0025] Figure 3 A schematic diagram of laser current variation provided in this application;

[0026] Figure 4A cross-sectional structural diagram of a laser packaging assembly provided in an embodiment of this application;

[0027] Figure 5 A schematic diagram of the principle structure of a laser packaging component provided in this application;

[0028] Figure 6 This is a schematic diagram of the structure of a laser packaging assembly provided in an embodiment of this application;

[0029] Figure 7 A schematic diagram of the back structure of a laser assembly provided in an embodiment of this application;

[0030] Figure 8 This is a schematic diagram of another laser assembly provided in an embodiment of this application;

[0031] Figure 9 This is a schematic diagram of the structure of a laser display device provided in an embodiment of this application.

[0032] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0033] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0034] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0035] Currently, lasers, with their excellent high brightness, monochromaticity, and directionality, are widely used in various fields of life, such as display, medical, and printing. For example, for laser TVs, compared to traditional LCD or color TVs, using lasers as the light source can significantly reduce power consumption, saving resources and making them more economical. Furthermore, due to the monochromaticity of lasers, the final image color is more accurate.

[0036] However, for laser projection devices, because the laser spectrum itself is relatively narrow, when the laser encounters a rough surface during transmission and is scattered, interference will occur in space, which will result in interference fringes and alternating bright and dark spots in the image on the display screen, i.e., speckle.

[0037] In existing technologies, laser beams emitted from lasers can be diffused at different angles by placing devices such as diffusers or speckles in the optical path, thereby reducing laser beam interference. However, because laser beams emitted by different colors of lasers have different optical characteristics, the speckle characteristics they form also differ. This makes it difficult to find suitable devices of appropriate specifications to simultaneously eliminate the speckle generated by laser beams of different colors when setting up speckle removal devices.

[0038] The laser packaging assembly, laser assembly, and laser display device provided in this application are intended to solve the above-mentioned technical problems of the prior art.

[0039] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0040] This application provides a laser packaging assembly. The laser packaging assembly includes: a base plate on which multiple lasers and at least one switch are mounted; and a housing that, together with the base plate, forms a closed space with a single emitting surface.

[0041] In this configuration, multiple lasers are arranged in an array, with lasers in the same row connected in series in a forward direction. Each row of lasers corresponds to at least one switch, and in each row, the negative terminal of the laser at the end of the row is connected to one end of the switch corresponding to that laser, while the other end of the switch is grounded. In each row, the positive terminal of the laser at the beginning of the row receives the driving signal that drives the laser in that row. When the switch is turned on, the driving signal flows through the laser in that row, driving it to emit light. Furthermore, the switch is used to turn on or off under the control of a high-frequency signal, so as to drive the lasers at a high frequency based on the high-frequency signal.

[0042] Figure 1 This is a schematic diagram of a planar structure of a laser packaging component provided in an embodiment of this application. For example... Figure 1 As shown, multiple lasers 11 are arranged in rows and columns and mounted on the base plate 13. In each row, multiple lasers 11 are connected in series through gold wire or other types of wires via their positive and negative terminals. The negative terminal of the last laser 11 in each row is connected to one end of the switch 12 corresponding to that row, and the other end of the switch 12 is grounded. Figure 1 In this configuration, each row of lasers 11 corresponds to a switch 12. The switch 12 also includes a control terminal, which receives a high-frequency signal D from outside the laser 11 packaging assembly, enabling the switch 12 to be turned on or off under the influence of the high-frequency signal. Furthermore, the positive terminal of the first laser 11 in each row receives a driving signal input from outside the laser 11 packaging assembly, thus causing the laser 11 to emit light under high-frequency driving through the continuous switching of the switch 12.

[0043] However, when the laser 11 operates in a high-frequency driven mode, parasitic energy storage elements such as parasitic inductance will be generated in the circuit. Figure 2 This application provides an equivalent circuit diagram of the parasitic inductance during high-frequency laser driving. For example... Figure 2 As shown in the diagram, the positive terminal of laser 11 is connected to the drive signal input terminal, and the negative terminal is connected to one end of switch 12. The other end of switch 12 is grounded, and the control terminal of switch 12 is used to input the high-frequency signal D to control switch 12. When laser 11 operates in high-frequency drive mode, parasitic inductance will appear in the circuit, such as... Figure 2 In the equivalent circuit shown, an equivalent parasitic inductance L1 is generated at the positive terminal of the laser 11, and an equivalent parasitic inductance L2 is generated between the negative terminal of the laser 11 and the switch 12.

[0044] Figure 3 This is a schematic diagram of laser current variation provided for this application. Figure 3 The schematic diagram of laser current change shown illustrates the current change of a laser operating in a high-frequency driving mode in the prior art. Figure 3The diagram includes three signals: a high-frequency signal D used to control the on / off state of switch 12; a current signal I1 passing through laser 11 that changes with the high-frequency signal under ideal conditions; and a current signal I2 passing through laser 11 that changes with the high-frequency signal under actual conditions. The horizontal axis represents time t, and the vertical axis represents the magnitude of the signal current. The values ​​of the high-frequency signal D, current signal I1, current signal I2, and time t are all greater than 0. The high-frequency signal D and current signal I1 are both periodic square waves (solid lines), while current signal I2 is a curve (solid line). The dashed line parallel to the horizontal axis represents the lower limit current value i0.

[0045] During the time interval from time t1 to time t2, switch 12 is in the on state under the influence of the high-frequency signal. At this time, the current loop in laser 11 can be connected to ground through switch 12 in its row. When the circuit is in an ideal state, that is, when the parasitic inductance generated during the high-frequency drive process is not considered, the current through laser 11 remains constant, that is, the value of I1 remains constant during the time interval from time t1 to time t2. However, in the actual state, there is a parasitic inductance between laser 11 and switch 12. When switch 12 is on, the parasitic inductance is in a charging state, consuming some current, causing the current I2 to increase slowly.

[0046] During the time interval from t2 to t3, switch 12 is in the closed state under the influence of the high-frequency signal, and the current in laser 11 drops to 0. When the circuit is in an ideal state, the current flowing through laser 11 drops to 0. However, with the presence of parasitic inductance, the rate at which the current in laser 11 decreases is slowed down. Furthermore, when the high-frequency signal turns switch 12 back on, the current flowing through laser 11 has not yet dropped below the cutoff current i0, causing laser 11 to continue emitting light and unable to be turned off.

[0047] And in Figure 1 In the laser package assembly shown, by integrating the switch 12 and the laser 11 into the same laser package assembly, the high-frequency drive loop is effectively reduced, thereby reducing the energy storage in the parasitic inductance and ensuring that the laser 11 can be turned off in a timely manner. Figure 1 The laser packaging components in the middle can effectively avoid Figure 2 The effect of the equivalent parasitic inductance L2 on the decrease of laser current 11.

[0048] In the embodiments provided in this application, under the action of switch 12, the laser 11 in the laser packaging assembly switches at a high frequency between the presence and absence of driving current. That is, the laser 11 frequently switches between laser radiation and spontaneous emission states. Since the laser 11 emits fluorescence with a spectrum larger than the narrow-band laser spectrum during spontaneous emission, the spectral range of the output light of the laser 11 is broadened, thereby eliminating speckle. Furthermore, the distance between the wire connecting switch 12 and laser 11 is sufficiently short. By reducing the length of the wire between laser 11 and switch 12, the energy stored in the parasitic inductance generated between laser 11 and switch 12 has a smaller impact on the rate of decrease of the current flowing through laser 11 when switch 12 is turned off. Thus, the parasitic inductance between laser 11 and switch 12 is avoided from hindering the rate of decrease of the current flowing through laser 11 when laser 11 is operating under high-frequency drive, preventing the phenomenon of laser 11 failing to turn off on time.

[0049] In some embodiments, the housing includes: a surrounding component, which is disposed on a base plate 13 surrounding the laser 11 and the switch 12; and a transparent component disposed above a corresponding area of ​​the surrounding component to form a closed space with a light-emitting surface, which can typically be a sealed glass.

[0050] In some embodiments, the laser packaging assembly further includes a collimating lens module; wherein the collimating lens module is disposed above the corresponding area of ​​the light-emitting surface for collimating the light beam emitted by the laser 11 outside the enclosed space.

[0051] Figure 4 This is a schematic cross-sectional view of a laser packaging assembly provided in an embodiment of this application. Figure 4 As shown, the figure includes multiple lasers 11 connected in series and a switch 12 connected to the last laser 11 in the row. The lasers 11 are mounted on a base plate 13. A surrounding component surrounds the lasers 11 and the switch 12, and above the corresponding areas of the lasers 11 and switches 12, a transparent component is also included. The transparent component, the surrounding component, and the base plate 13 enclose the lasers 11 and switches 12 within a closed space with a light-emitting surface. A collimating lens group, i.e., the protrusion shown in the figure, is also provided above the light-emitting surface to collimate the diverging beam emitted by the lasers 11. Furthermore, Figure 4 The positive terminal of the first laser 11 can also be connected to a positive pin, and the other end of the switch 12 can also be connected to a negative pin. These positive and negative pins are used to receive drive signals input from outside the laser package assembly to the laser 11. It should be noted that... Figure 4The configuration of the wiring pins is only one example provided in this application. In other examples, wiring pins may not be configured. Instead, the signal input terminals of the laser package component may be configured in the style of gold fingers, and the gold fingers may be used to realize the input of external signals or the output of internal signals.

[0052] In some embodiments, the laser packaging assembly may further include at least one high-frequency driving circuit. This high-frequency driving circuit outputs a high-frequency signal and sends the output high-frequency signal to the control terminal of the corresponding switch 12, causing the switch 12 to be turned on or off under the action of the high-frequency signal.

[0053] Furthermore, when setting up the high-frequency drive circuit, each switch 12 corresponds to only one high-frequency drive circuit, but the high-frequency drive circuit can correspond to one or more switches 12. Specifically, when setting up the high-frequency drive circuit and the switches 12, the number of switches 12 corresponding to each high-frequency drive circuit can be set according to the conduction voltage corresponding to the switch 12 or the other switch parameters that control the switch 12 to turn on.

[0054] In some embodiments, the high-frequency drive circuit is disposed outside the component. Specifically, the high-frequency drive circuit can be disposed outside the component, i.e., outside the enclosed space. For example, space can be created for the high-frequency drive circuit in an area outside the enclosed space on the base plate 13.

[0055] In some embodiments, the high-frequency drive circuit may be located inside an enclosed space.

[0056] In this embodiment, the laser packaging assembly also includes a high-frequency driving circuit, which controls the switching on or off of the switch. Furthermore, in this embodiment, there is no restriction on the location of the high-frequency driving circuit; it can be placed inside or outside the enclosed space within the laser packaging assembly. However, when the high-frequency driving circuit is placed inside the enclosed space of the laser packaging assembly, it can effectively define the transmission path of the high-frequency signal, thereby reducing signal attenuation during transmission.

[0057] In some embodiments, the high-frequency driving circuit includes a high-frequency signal generator and a high-frequency driving chip. The input terminal of the high-frequency driving chip is connected to the high-frequency signal generator, which generates an initial high-frequency signal. The output terminal of the high-frequency driving chip is connected to the control terminal of the corresponding switch 12 in the high-frequency driving circuit. The high-frequency driving chip outputs a high-frequency signal to the control terminal of the switch 12 to drive the switch 12 in response to the initial high-frequency signal generated by the high-frequency signal generator.

[0058] In the embodiments of this application, when the high-frequency driving circuit generates a high-frequency signal to control the on / off state of the switch 12, a high-frequency signal generator can be set in the high-frequency driving circuit to generate an initial high-frequency signal. Furthermore, in order for the initial high-frequency signal generated by the high-frequency signal generator to drive the corresponding switch 12 of the high-frequency driving circuit, the high-frequency signal generator is connected to a high-frequency driving chip to increase the power of the initial high-frequency signal generated by the high-frequency signal generator. This allows the high-frequency signal processed by the high-frequency driving chip to be used to drive more switches 12, reducing the number of devices in the laser packaging assembly and reducing the space occupied by the laser packaging assembly.

[0059] In some embodiments, the laser packaging assembly has multiple positive and negative connection pins on both sides, and the positive and negative connection pins are led out through through holes on the side of the housing; wherein, each row of lasers 11 corresponds to a set of positive and negative connection pins (i.e., one positive connection pin and one negative connection pin), the positive connection terminal of the first laser 11 in each row of lasers 11 is electrically connected to the positive connection pin corresponding to that row, and the other end of the switch 12 corresponding to each row of lasers 11 is electrically connected to the negative connection pin corresponding to that row;

[0060] Furthermore, when the high-frequency driving circuit is located inside the laser packaging assembly, each high-frequency driving circuit corresponds to a set of positive and negative connection pins. The power supply input terminal of each high-frequency driving circuit is electrically connected to the corresponding positive connection pin, and the ground terminal of each high-frequency driving circuit is electrically connected to the corresponding negative connection pin. The negative connection pin of the high-frequency driving circuit is used for grounding.

[0061] Figure 5 This is a schematic diagram illustrating the principle structure of a laser packaging component provided in this application. Figure 5 As shown, in the laser package assembly, the first laser 11 in each row of lasers 11 is connected to a positive terminal pin, and the last laser 11 in each row is connected to the negative terminal pin of that row through a switch 12. In addition, the laser package assembly also includes a high-frequency signal generator 14 and a high-frequency driver chip 15. The output terminals (X1, X2) of the high-frequency signal generator 14 are connected to the input terminals (IN1, IN2) of the high-frequency driver chip 15. Furthermore, the output pin (TH) of the high-frequency driver chip 15 is used to output a high-frequency signal (D) to control the on / off state of the switch 12. The connection relationship between the switch 12 and the output pin (TH) of the high-frequency driver chip 15 is not shown in the figure. The control terminals of the three switches 12 in the figure can be connected to the same output terminal of the high-frequency driver chip 15 or to the output terminals of different high-frequency driver chips 15.

[0062] The input terminals (VCC) of the high-frequency signal generator 14 and the high-frequency driver chip 15 are connected to the corresponding positive pins of their respective rows to receive external power supply signals. The ground terminals (GND) of the high-frequency signal generator 14 and the high-frequency driver chip 15 are connected to the corresponding negative pins of their respective rows. Specifically, when arranging the lasers 11 in rows and columns, the arrangement can be based on the background color of the laser emission, the wavelength of the laser emission, the power required by the laser 11, and other conditions.

[0063] This embodiment effectively reduces the high-frequency signal loop length of the laser 11 by placing the high-frequency drive circuit within the enclosed space of the laser package assembly. This reduces the generation of parasitic inductance in the loop and avoids the phenomenon where the current through the laser 11 cannot drop to the lower current limit of the laser 11 due to the presence of parasitic inductance, thus preventing the laser 11 from turning off. Furthermore, by simply providing an additional power input to the laser package assembly, the laser package assembly can automatically achieve the effect of emitting light from the laser 11 using high-frequency drive. No additional high-frequency circuitry is required externally; the effect of speckle reduction can be achieved simply by inputting a drive signal (e.g., a DC drive signal) through the pins of the laser package assembly.

[0064] In some embodiments, the laser packaging assembly also includes a plurality of reflecting prisms 16. Figure 6 This is a schematic diagram of a laser packaging assembly provided in an embodiment of this application. Figure 6 The assembly contains multiple lasers 11, each mounted on a base plate 13 of the laser 11 packaging component for heat dissipation. The emission ports of each laser 11 face the same direction, and a corresponding reflecting prism 16 is positioned at the emission port of each laser 11. These reflecting prisms 16 can be directly mounted on the base plate 13, and a heat dissipation layer can be placed between each laser 11 and the base plate 13. When light from a laser 11 is emitted from its emission port, the emitted light's propagation direction is altered by the refractive surfaces in the corresponding reflecting prism 16, thus being emitted from the laser packaging component. Figure 6 The specific locations of switch 12 and high-frequency drive circuit are not shown in the text, but can be set with reference to the locations shown in the above embodiments.

[0065] This application also provides a laser assembly. Figure 7 This is a schematic diagram of the back structure of a laser assembly provided in an embodiment of this application. Figure 7As shown, the laser assembly includes: a laser packaging assembly provided in any of the above embodiments, and an adapter plate 21. The adapter plate 21 has a through-hole corresponding to the laser packaging assembly, and the laser packaging assembly is provided with a through-hole in the adapter plate and connected to the adapter plate. For example, Figure 7 The through holes on the adapter board 21 can be in the shape of an "I"; the adapter board 21 and the laser packaging assembly are fixedly connected (e.g., by soldering) through the wiring pins led out from the side of the laser packaging assembly. There are no restrictions on the connection method between the adapter board 21 and the laser packaging assembly.

[0066] In some embodiments, the laser assembly also includes a power supply module 22. Figure 8 This is a schematic diagram of another laser assembly provided in an embodiment of this application. The power module 22 can be mounted on the adapter board 21 in the laser assembly. The power module 22 can be electrically connected to the laser packaging assembly via the positive and negative pins of the laser packaging assembly, and provides power signals to the devices in the laser packaging assembly via the pins.

[0067] In addition, a filter module 23 can be provided on the adapter board 21. The filter module 23 can be used to filter the power supply signal output by the power supply module 22 and then provide the filtered power supply signal to the devices in the laser packaging assembly.

[0068] Figure 9 This is a schematic diagram of the structure of a laser display device provided in an embodiment of this application. Figure 9 As shown, the laser display device includes: any of the laser components in the above embodiments, a main control circuit, a laser driving circuit, a projection lens, and a display screen. The main control circuit is connected to the laser driving circuit and is used to output an initial enable signal (EN) and an initial current control signal (PWM) according to the displayed image, and transmit them to the laser driving circuit. Specifically, the initial enable signal can be used to indicate that a certain color of laser light is emitted. The initial current control signal is used to indicate the emission duration and brightness of the laser. For example, after receiving an externally input image signal, the main control circuit analyzes the image signal (e.g., analyzes the color distribution information and brightness information in the image signal) and outputs the initial enable signal and the initial current control signal to the laser driving circuit to indicate the voltage and current magnitude of the driving signal output by the laser driving circuit.

[0069] The output terminal of the laser driving circuit is connected to the positive terminal of the laser 11, and is used to output driving signals to the plurality of lasers 11 in the laser 11 assembly in response to the initial enable signal and the initial current control signal. Furthermore, the light emitted by the lasers 11 in the laser assembly under high-frequency driving is projected onto the display screen through the projection lens.

[0070] The laser display device provided in this application, by setting the laser component provided in any of the above embodiments, can ensure that the final displayed image will not have alternating bright and dark spots or interference fringes. In addition, since the switch 12 is set close to the laser 11, it avoids the problem that the current of the laser 11 is hindered by parasitic inductance, which slows down the current drop and prevents the laser 11 from turning off in time, thus causing errors in the displayed image.

[0071] The above technical description is illustrated with reference to the accompanying drawings, which form a part of this application, and which show implementations according to the described embodiments. While these embodiments are described in sufficient detail to enable those skilled in the art to implement them, these embodiments are not limiting; thus, other embodiments can be used, and variations can be made without departing from the scope of the described embodiments.

[0072] Furthermore, terminology is used in the above technical description to provide a thorough understanding of the described embodiments. However, excessive detail is not required to implement the described embodiments. Therefore, the above description of the embodiments is presented for illustrative and descriptive purposes. The embodiments presented in the above description, as well as the examples disclosed according to these embodiments, are provided separately to add context and aid in understanding the described embodiments. The above specification is not intended to be exhaustive or to limit the described embodiments to the precise form of this application. Based on the above teachings, several modifications, selections, and variations are possible. In some cases, well-known processing steps have not been described in detail to avoid unnecessarily affecting the described embodiments.

[0073] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0074] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A laser packaging assembly, characterized in that, include: The base plate is fitted with multiple lasers and at least one switch. The shell, together with the base plate, forms a closed space with a light-emitting surface; The housing includes: a surrounding component surrounding the laser and the switch; and a transparent component positioned above a corresponding area of ​​the surrounding component to form an enclosed space with a light-emitting surface. The lasers are arranged in an array, with multiple lasers in the same row connected in series in a forward direction. Each row of lasers corresponds one-to-one with at least one switch, and the negative terminal of the last laser in each row is connected to one end of the switch corresponding to that row, while the other end of the switch is grounded. The positive terminal of the first laser in each row receives a driving signal for driving that row of lasers. When the switch is turned on, the driving signal flows through that row of lasers to drive it to emit light. The switch is used to turn on or off under the control of a high-frequency signal to drive the lasers at a high frequency based on the high-frequency signal. The switch is integrated with the laser within the same laser package assembly.

2. The laser packaging assembly according to claim 1, characterized in that, The laser packaging assembly further includes: at least one high-frequency driving circuit; The high-frequency driving circuit is used to output high-frequency signals; the output terminal of the at least one high-frequency driving circuit is connected to the control terminal of the switch corresponding to each row of lasers, and each switch corresponds to only one high-frequency driving circuit, and each high-frequency driving circuit corresponds to at least one switch.

3. The laser packaging assembly according to claim 2, characterized in that, The high-frequency drive circuit is disposed on the outside of the surrounding component.

4. The laser packaging assembly according to claim 2, characterized in that, The high-frequency drive circuit is located inside the enclosed space.

5. The laser packaging assembly according to claim 2, characterized in that, The high-frequency drive circuit includes a high-frequency signal generator and a high-frequency drive chip. The input terminal of the high-frequency driving chip is connected to the high-frequency signal generator, and the output terminal of the high-frequency driving chip is connected to the control terminal of the switch corresponding to the high-frequency driving circuit; the high-frequency signal generator is used to generate an initial high-frequency signal; the high-frequency driving chip is used to output a high-frequency signal to the control terminal of the switch to drive the switch in response to the initial high-frequency signal generated by the high-frequency signal generator.

6. The laser packaging assembly according to claim 4, characterized in that, The laser packaging assembly has multiple positive and negative connection pins on both sides, and the side of the housing has a through hole, through which the positive and negative connection pins are led out. Each row of lasers corresponds to a set of positive and negative connection pins. The positive connection terminal of the first laser in each row is electrically connected to the positive connection pin corresponding to that row of lasers. The other end of the switch corresponding to each row of lasers is electrically connected to the negative connection pin corresponding to that row of lasers. Each high-frequency drive circuit corresponds to a set of positive and negative connection pins. The power supply input terminal of each high-frequency drive circuit is electrically connected to the corresponding positive connection pin, and the ground terminal of each high-frequency drive circuit is electrically connected to the corresponding negative connection pin. The negative connection pin of the high-frequency drive circuit is used for grounding.

7. The laser packaging assembly according to claim 1, characterized in that, The laser packaging assembly further includes a collimating lens module; wherein the collimating lens module is disposed above the corresponding area of ​​the light-emitting surface.

8. The laser packaging assembly according to any one of claims 1-7, characterized in that, The light-emitting ports of the multiple lasers all face the same direction, and a reflecting prism is provided at the light-emitting port of each laser to reflect the light emitted by the laser out of the enclosed space.

9. A laser assembly, characterized in that, The laser assembly includes: the laser packaging assembly according to any one of claims 1-8, and an adapter board; The adapter board has a port corresponding to the laser packaging assembly; The laser packaging assembly corresponds to the port of the adapter board and is connected to the adapter board.

10. The laser assembly according to claim 9, characterized in that, The adapter board is equipped with a power module, which is electrically connected to the laser packaging assembly through the wiring pins of the laser packaging assembly to provide a power supply signal to the laser packaging assembly.

11. The laser assembly according to claim 10, characterized in that, The adapter board is also equipped with a filtering module; The power supply module is connected to the laser packaging assembly through the filtering module; the filtering module is used to filter the power supply signal output by the power supply module and output the filtered power supply signal to the laser packaging assembly.

12. A laser display device, characterized in that, include: The laser assembly, main control circuit, laser drive circuit, projection lens, and display screen as described in any one of claims 9-11; The main control circuit is connected to the laser driving circuit and is used to output an initial enable signal and an initial current control signal according to the displayed image, and transmit them to the laser driving circuit. The output terminal of the laser driving circuit is connected to the positive terminal of the laser, and is used to output driving signals to multiple lasers in the laser assembly in response to the initial enable signal and the initial current control signal. The light emitted by the laser in the laser assembly under high-frequency drive is projected onto the display screen through the projection lens.

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