Encapsulating apparatus comprising a cleaning function

Abstract

The application discloses a packaging device with a cleaning function, which comprises a packaging device and a cleaning device. The packaging device comprises a plurality of molds, and a packaging cavity is formed between the molds. The packaging cavity is used for accommodating a product to be packaged. The cleaning device comprises a movable cleaning mechanism. The cleaning mechanism can be moved into the packaging cavity to clean the product to be packaged, so that the product is prevented from being contaminated by dust during a cavity dust extraction process. After cleaning, the cleaning mechanism is moved out, and the packaging device performs a packaging operation on the product to be packaged, realizes online cleaning closest to zero interval time before product packaging, and maximally reduces the oxidation and contamination risks of the product.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and more particularly to a packaging device that includes a cleaning function. Background Technology

[0002] After assembly, conventional semiconductor packaging involves encapsulation, where epoxy thermosetting resin is used to encapsulate vulnerable components such as chips, die bonding adhesive, metal wires, and lead frames. From assembly to encapsulation, the cleanliness level increases from Class 10,000 to Class 100,000, leading to an increase in external particulate matter in the environment. Combined with oxidation of the lead frames and solder wires, this makes delamination and other reliability issues during encapsulation highly likely. To prevent this, current practices involve plasma cleaning before encapsulation, manually transporting the product box to the encapsulation equipment, and then using a loading mechanism to lay multiple products flat on a preheating platform for preheating. Finally, a transfer trolley transports the preheated products to the encapsulation mold for encapsulation. To further prevent re-oxidation during transport, Chinese Patent No. CN201910265937.4 discloses an encapsulation preheating station with plasma cleaning function, where preheating and cleaning of the product to be encapsulated are performed simultaneously. The preheated and cleaned product is then output to the encapsulation mold for encapsulation.

[0003] However, the cleaned products still face a short-term risk of oxidation during transportation between the preheating station and the encapsulation mold, and thus do not reach the ideal state. At the same time, the cleaned products are at risk of contamination when passing through the dust extraction area during transportation between the preheating station and the encapsulation mold. Summary of the Invention

[0004] The purpose of this invention is to provide a packaging device that includes a cleaning function, so as to realize cleaning within the packaging device and minimize the risk of product oxidation and contamination.

[0005] To achieve one of the above-mentioned objectives, one embodiment of the present invention provides a packaging device including a cleaning function, the packaging device comprising: The encapsulation device includes multiple molds, which together form an encapsulation cavity for accommodating the product to be encapsulated. A cleaning device includes a movable cleaning mechanism that can be moved into the encapsulation cavity to clean the product to be encapsulated.

[0006] As a further improvement of one embodiment of the present invention, the mold includes an upper mold and a lower mold, the lower mold is used to support and place the product to be packaged, and the upper mold and the lower mold can move relative to each other to form an open mold state and a closed mold state.

[0007] As a further improvement of one embodiment of the present invention, the cleaning device is a plasma cleaning device, which further includes a plasma generating device, a gas source device, a vacuuming device, a vacuuming pipe and a gas input pipe. The plasma generating device is disposed in the cleaning mechanism, the vacuuming pipe connects the vacuuming device and the cleaning mechanism, and the gas input pipe connects the gas source device and the cleaning mechanism.

[0008] As a further improvement of one embodiment of the present invention, the encapsulation device includes a plurality of encapsulation devices, the cleaning device includes a first track, the first track includes a first inlet / outlet track and a first inter-device track, the cleaning mechanism moves along the first inter-device track between the plurality of encapsulation devices, and the cleaning mechanism reciprocates along the first inlet / outlet track to enter and exit the encapsulation cavity.

[0009] As a further improvement of one embodiment of the present invention, the cleaning mechanism includes a cleaning part and a first driving part. The first driving part moves on the first track. The cleaning part is driven by the first driving part to reciprocate and enter and exit the encapsulation cavity, forming a closed cleaning cavity with the lower mold.

[0010] As a further improvement of one embodiment of the present invention, the bottom of the cleaning part is recessed inward to form a groove area, and an elastic device is provided in the cleaning part for moving the groove area toward the lower mold. When the cleaning part is in contact with the lower mold, the groove and the lower mold surround to form the closed cleaning cavity.

[0011] As a further improvement of one embodiment of the present invention, a plurality of through holes are formed on the upper surface of the groove region for connecting the plasma generating device, the vacuum pipe and the gas input pipe.

[0012] As a further improvement of one embodiment of the present invention, the encapsulation device further includes a feeding device for feeding the product to be encapsulated into the encapsulation cavity. The feeding device and the cleaning device are respectively disposed on both sides of the encapsulation device. The feeding device includes a second track, which includes a second inlet / outlet track and a second inter-device track. The feeding device moves between multiple encapsulation devices along the second inter-device track and reciprocates along the second inlet / outlet track to enter and exit the encapsulation cavity.

[0013] As a further improvement of one embodiment of the present invention, the feeding device includes a feeding part and a second driving part, the second driving part moves on the second track, and the feeding part is driven by the second driving part to reciprocate and move in and out of the encapsulation cavity.

[0014] As a further improvement of one embodiment of the present invention, the gas source device is a device that provides a hydrogen-nitrogen mixture, an argon-hydrogen mixture, or other mixed gases that simultaneously possess protective and redox properties. As a further improvement of one embodiment of the present invention, the encapsulation device is further provided with a preheating device.

[0015] The beneficial effects of the present invention are as follows: The present invention provides a packaging device with a cleaning function, including a packaging device and a cleaning device. The cleaning device includes a movable cleaning mechanism that can be moved into the packaging device to clean the product to be packaged, which can avoid dust and contamination of the product during the dust extraction process of the cavity. After cleaning, the cleaning mechanism is removed, and the packaging device performs the packaging operation on the product to be packaged, realizing online cleaning with zero interval time as close as possible to the product before packaging, and minimizing the risk of product oxidation and contamination. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a packaging device including a cleaning function according to one embodiment of the present invention.

[0017] Figure 2 This is a schematic diagram of the encapsulation device structure when the cleaning device enters the encapsulation device according to an embodiment of the present invention.

[0018] Figure 3 This is a schematic diagram of the encapsulation device structure in one embodiment of the present invention, when the cleaning device and the lower mold form a closed cleaning cavity.

[0019] Figure 4 This is a schematic diagram of the encapsulation device structure when the cleaning device and the lower mold form a closed cleaning cavity, according to another embodiment of the present invention.

[0020] Figure 5 This is a schematic diagram of the encapsulation device structure in one embodiment of the present invention, showing the encapsulation device encapsulating the product to be encapsulated after cleaning.

[0021] Figure 6-9 This is a schematic diagram of the process by which the feeding device of the present invention feeds the product to be packaged into the packaging device. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0024] For ease of explanation, this document uses terms indicating relative spatial position, such as "above," "below," "behind," and "front," to describe the relationship of one unit or feature shown in the accompanying drawings relative to another unit or feature. Terms indicating relative spatial position can include different orientations of the device during use or operation besides those shown in the figures. For example, if the device in the figures is flipped, a unit described as being "below" or "above" other units or features will be located "below" or "above" other units or features. Therefore, the exemplary term "below" can encompass both "below" and "above" spatial orientations.

[0025] like Figure 1 As shown, this embodiment provides a packaging device with a cleaning function, including a packaging device 1 and a cleaning device 2.

[0026] The encapsulation device 1 includes multiple molds, which together form an encapsulation cavity 11 for containing the product 3 to be encapsulated.

[0027] Specifically, the mold includes an upper mold 12 and a lower mold 13. The lower mold 13 is used to hold and place the product 3 to be packaged. The upper mold 12 and the lower mold 13 can move relative to each other to form an open mold state and a closed mold state. In one embodiment of the present invention, the lower mold 13 can move towards the upper mold 12. When the lower mold 13 moves away from the upper mold, it forms an open mold state; when the lower mold 13 moves close to the upper mold 12 and contacts the upper mold 12, it forms a closed mold state.

[0028] In other embodiments of the present invention, depending on the specific structural differences of the encapsulated product, the molds may include other mating relationships, and three or more molds may also be provided. The present invention does not impose specific limitations on this.

[0029] In this embodiment, the product 3 to be encapsulated is a lead frame containing electronic devices such as chips, which is encapsulated entirely or partially by the encapsulation equipment provided by the present invention.

[0030] The cleaning device 2 includes a movable cleaning mechanism 21, which can be moved into the encapsulation cavity 11 to clean the product 3 to be encapsulated. Specifically, the cleaning device 2 is a plasma cleaning device, which also includes a plasma generator 22, a gas source device, a vacuum device, a vacuum pipe 23, and a gas input pipe 24. The plasma generator 22 is located inside the cleaning mechanism 21. The vacuum pipe 23 connects the vacuum device and the cleaning mechanism 21, and the gas input pipe 24 connects the gas source device and the cleaning mechanism 21.

[0031] The plasma cleaning process involves creating a high-frequency alternating electric field within the cleaning mechanism. The surrounding gas is agitated by the alternating electric field to form plasma. The active plasma bombards the surface of the item being cleaned through both physical bombardment and chemical reaction, causing the surface material to transform into particles and gaseous substances, which are then discharged through vacuum, thus achieving the cleaning purpose.

[0032] Specifically, the gas source device provides a hydrogen-nitrogen mixed gas, and the gas input pipe 24 is a hydrogen-nitrogen mixed gas input pipe. In the hydrogen-nitrogen mixed gas, nitrogen is a protective gas, and hydrogen is a redox gas. In other embodiments of the present invention, the gas source device may also be a device that provides a hydrogen-nitrogen mixed gas, an argon-hydrogen mixed gas, or other mixed gas that simultaneously has protective and redox properties. The gas input pipe 24 may also be a hydrogen-nitrogen mixed gas, an argon-hydrogen mixed gas, or other mixed gas that simultaneously has protective and redox properties. It is used to heat and fill the space in the cleaning mechanism for protecting and redoxing the space of the product to be packaged 3. The plasma generator 22 is used to form a high-frequency alternating electric field in the internal space of the cleaning mechanism. The gas in the surrounding space forms plasma under the excitation of the alternating electric field, turning the surface material of the item being cleaned into particles and gaseous substances. The vacuum pipe 23 is used to remove the particles and gaseous substances generated on the surface of the item being cleaned.

[0033] In one embodiment of the present invention, the encapsulation equipment includes multiple encapsulation devices 1, which can be used to encapsulate multiple products simultaneously. In this embodiment, the cleaning device 2 further includes a first track 25, which includes a first inlet / outlet track 251 and a first inter-device track (not shown in the figure). The cleaning mechanism 21 can move along the first inter-device track between the multiple encapsulation devices 1, and can also reciprocate along the first inlet / outlet track 251 to enter and exit the encapsulation cavity 11 within the encapsulation device. By using a single cleaning mechanism along the first track, multiple encapsulation devices can be cleaned sequentially, reducing equipment costs while improving cleaning efficiency.

[0034] For example, in this embodiment, multiple encapsulation devices 1 are arranged in parallel. The first inter-device track extends in a straight line along the arrangement direction of the encapsulation devices 1. Multiple first inlet / outlet tracks 251 are respectively arranged at multiple encapsulation devices 1, and are distributed at right angles to each other with the first inter-device track, extending to the encapsulation cavity 11. The cleaning structure 21 moves laterally or longitudinally along the first inlet / outlet track 251 and the first inter-device track, thereby entering each encapsulation cavity 11 to clean the product 3 to be encapsulated.

[0035] In other embodiments of the present invention, the specific arrangement of the first device track and the first entry / exit track 251 can be adjusted according to different distribution patterns of the encapsulation device 1, and the present invention does not impose specific limitations on this.

[0036] The cleaning mechanism 21 includes a cleaning section 211 and a first drive section 212. The first drive section 212 can move on the first track 22. The cleaning section 211 is driven by the first drive section 212 to reciprocate along the first inlet and outlet track 251 to enter and exit the encapsulation cavity 11. When it enters the encapsulation cavity 11, it can form a closed cavity with the lower mold 13, and the product to be encapsulated is cleaned in the closed cavity.

[0037] Specifically, the bottom of the cleaning section 211 is recessed inward to form a groove area 2111. An elastic device is also provided inside the cleaning section 211 for moving the groove area 2111 toward the surface of the lower mold 13. Furthermore, multiple through holes are formed on the upper surface of the groove area 2111 for connecting the plasma generator 22, the vacuum pipe 23, and the gas input pipe 24.

[0038] like Figure 2 and 3 As shown, when the cleaning section 211 is driven by the first driving section 212 to move along the first inlet / outlet track 251 and enter the encapsulation cavity 11, the elastic device inside the cleaning section 211 is controlled to move the groove area 2111 toward the lower mold 13. When the cleaning section 211 is in contact with the lower mold 13, the inner wall of the groove area 2111 and the upper surface of the lower mold 13 form a closed cleaning cavity 4. At this time, the product 3 to be encapsulated placed above the lower mold 13 is inside the closed cleaning cavity 4.

[0039] In other embodiments of the present invention, the structure of the cleaning unit 211 may also be specifically adjusted based on the structure of the product 3 to be encapsulated, as long as it can form a closed cavity with the mold surface to perform plasma cleaning on the product 3 to be encapsulated inside. The present invention does not impose specific limitations on this.

[0040] Specifically, the plasma generator 22 can be installed at the through hole on the lower surface of the cleaning section 211. The vacuum pipe 23 and the gas input pipe 24 are connected to the closed cleaning chamber 4. The pipes are made of a stretchable material and can extend and retract as the groove area 2111 moves up and down. The gas source device inputs a hydrogen-nitrogen mixed gas into the closed cleaning chamber 4 through the gas input pipe 24. When the plasma generator 22 operates, the gas inside the closed cleaning chamber 4 forms plasma under the excitation of the alternating electric field, performing plasma cleaning on the product 3 to be encapsulated. Then, the vacuum device operates, and the particles and gaseous substances generated on the surface of the cleaned product 3 to be encapsulated are discharged through the vacuum pipe 23.

[0041] like Figure 4 As shown, in another embodiment of the present invention, when the cleaning part 211 is driven by the first driving part 212 to move along the first entry and exit track 251 into the encapsulation cavity 11, the cleaning part 211 can be kept stationary, and the lower mold 13 can be controlled to move upward until it contacts the cleaning part 211 to form a closed cleaning cavity 4, and the product 3 to be encapsulated is plasma cleaned.

[0042] After cleaning, the first drive unit 212 drives the cleaning unit 211 to move along the first inter-device track to the encapsulation cavity in the next encapsulation device to perform plasma cleaning on the next product to be encapsulated; or the first drive unit 212 drives the cleaning unit 211 to move along the first in-out track 251 in a direction away from the encapsulation cavity 11, exiting the encapsulation cavity 11. Figure 5 As shown, the lower mold 13 is controlled to move toward the upper mold 12 to complete the packaging operation of the product 3 to be packaged.

[0043] The method for placing the product 3 to be packaged 3 on top of the lower mold 13 can be either manual feeding or machine feeding. To improve the working efficiency of the packaging equipment, such as... Figure 6 As shown, the packaging equipment with cleaning function proposed in this invention also includes a feeding device 5, which is used to feed the product 3 to be packaged into the packaging cavity 11, specifically placing the product 3 to be packaged above the lower mold 13.

[0044] In one embodiment of the present invention, the feeding device 5 and the cleaning device 2 are respectively disposed on both sides of the encapsulation device 1. Specifically, the feeding device 5 includes a second track 51, which specifically includes a second inlet / outlet track 511 and a second inter-device track (not shown in the figure). The feeding device 5 can move between multiple encapsulation devices 1 along the second inter-device track, and can also reciprocate along the second inlet / outlet track 511 to enter and exit the encapsulation cavity 11. By making full use of the front and rear workstation layout of multiple encapsulation devices 1, the feeding device 5 can move between multiple encapsulation devices 1 via the first inter-device track, and products to be encapsulated can be placed in multiple encapsulation devices. The feeding device and the cleaning device form a production line-style working layout, improving work efficiency.

[0045] Furthermore, the feeding device 5 also includes a feeding section 52 and a second driving section 53. The second driving section 53 moves on the second track 51. The feeding section 52 can be driven by the second driving section 53 to reciprocate and enter and exit the encapsulation cavity 11, and can also be driven by the second driving section 53 to move in multiple encapsulation devices.

[0046] For example, in this embodiment, multiple encapsulation devices 1 are arranged in parallel. The second device track extends in a straight line along the arrangement direction of the encapsulation devices 1. Multiple second inlet / outlet tracks 511 are respectively arranged at the multiple encapsulation devices 1, and are distributed at right angles to each other with the second device track, extending to the encapsulation cavity 11. The feeding unit 52 moves laterally or longitudinally along the second inlet / outlet track 511 and the second device track, thereby entering each encapsulation cavity 11 to place the product 3 to be encapsulated.

[0047] In other embodiments of the present invention, the specific arrangement of the second device track and the second entry / exit track 511 can be adjusted according to different distribution patterns of the encapsulation device 1, and the present invention does not impose specific limitations on this.

[0048] like Figure 6-9 The diagram shows the process of the feeding device 5 placing the product to be packaged on the lower mold 13 in one embodiment of the present invention. Specifically, before feeding, the product 3 to be packaged is fixed to the lower surface of the feeding part 52 by a clamping device 54. The feeding part 52 is provided with an elastic device, which can control the lower surface of the feeding part 52 to move downward.

[0049] In a specific embodiment of the present invention, when the feeding part 52 is moved into the encapsulation cavity 11 by the second driving part 53 along the second inlet / outlet track 511, the elastic device inside the feeding part 52 is controlled to move the product 3 to be encapsulated toward the lower mold 13. When the product 3 to be encapsulated moves to a distance of 2-3 cm from the lower mold, the clamping device 54 is controlled to release the product 3 to be encapsulated. After placing it on the upper surface of the lower mold 13, the elastic device is controlled to return to its original position. The second driving part 53 is controlled to drive the feeding part 52 to move along the second device track to the next encapsulation cavity for feeding, or the second driving part 53 is controlled to drive the feeding part 52 to move away from the encapsulation cavity 11 along the second inlet / outlet track 511 to exit.

[0050] In other embodiments of the present invention, when the feeding part 52 is moved into the encapsulation cavity 11 by the second driving part 53 along the second inlet / outlet track 511, the lower mold 13 can also be controlled to move upward to a distance of 2-3 cm from the product to be encapsulated, and then the clamping device 54 can be controlled to release the product 3 to be encapsulated and place it on the upper surface of the lower mold 13.

[0051] Of course, the encapsulation device 1 in the encapsulation equipment proposed in this invention is also equipped with a preheating device to preheat the inside of the encapsulation cavity 11 before feeding.

[0052] The following describes the specific workflow of product 3 to be packaged on the packaging equipment: S1: Control the feeding device 5 to send the product 3 to be packaged into the packaging cavity 11 and place it on the upper surface of the lower mold 13.

[0053] S2: Control the cleaning section 211 to enter the encapsulation cavity 11, forming a closed cleaning cavity 4 between it and the lower mold 13.

[0054] S2a: Control the elastic device inside the cleaning section to move the groove area 2111 toward the lower mold 13. When the cleaning section 211 is in contact with the lower mold 13, the groove area 2111 and the lower mold 13 form a closed cleaning cavity 4.

[0055] S2b: Control the lower mold 13 to move toward the cleaning section 211. When the cleaning section 211 is in contact with the lower mold 13, the groove area 2111 and the lower mold 13 form a closed cleaning cavity 4.

[0056] S3: Control the operation of the plasma generator 22, vacuum pipe 23 and gas input pipe 24 to perform plasma cleaning on the product 3 to be encapsulated in the closed cavity.

[0057] S4: Control the lower mold 13 to move towards the upper mold 12 to complete the product packaging.

[0058] In summary, the encapsulation equipment with a cleaning function proposed in this invention can perform plasma cleaning on the products inside the encapsulation cavity, avoiding dust contamination problems caused by dust removal during the cavity extraction process. This achieves an online cleaning effect that is close to zero-interval aging before encapsulation, minimizing the risk of product oxidation and contamination. Furthermore, the encapsulation equipment specifically includes multiple encapsulation devices. Both the feeding device and the cleaning device can move along an inter-device track between the multiple encapsulation devices, feeding materials to the devices and performing plasma cleaning on the products to be encapsulated within each device, thus improving its working efficiency.

[0059] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0060] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

Claims

1. A packaging device including a cleaning function, characterized in that, The encapsulation device includes: An encapsulation device includes multiple molds forming an encapsulation cavity for accommodating a product to be encapsulated. Each mold includes an upper mold and a lower mold, the lower mold supporting the product to be encapsulated. The upper and lower molds are movable relative to each other, forming an open mold state and a closed mold state. When the mold is in the closed mold state, the encapsulation device encapsulates the product to be encapsulated within the encapsulation cavity. A cleaning device includes a movable cleaning mechanism that can move into the encapsulation cavity to clean the product to be encapsulated. The cleaning mechanism includes a cleaning section and a first driving section. The cleaning section is driven by the first driving section to reciprocate and move in and out of the encapsulation cavity. The bottom of the cleaning section is recessed inward to form a groove area. An elastic device is provided in the cleaning section to move the groove area toward the lower mold. When the cleaning section is in contact with the lower mold, the groove and the lower mold form a closed cleaning cavity.

2. The packaging equipment including a cleaning function according to claim 1, characterized in that, The cleaning device is a plasma cleaning device, which also includes a plasma generator, a gas source device, a vacuum pumping device, a vacuum pumping pipe, and a gas input pipe. The plasma generator is located inside the cleaning mechanism. The vacuum pumping pipe connects the vacuum pumping device and the cleaning mechanism. The gas input pipe connects the gas source device and the cleaning mechanism.

3. The packaging equipment including a cleaning function according to claim 2, characterized in that, The encapsulation equipment includes multiple encapsulation devices, and the cleaning device includes a first track, which includes a first inlet / outlet track and a first inter-device track. The cleaning mechanism moves along the first inter-device track between the multiple encapsulation devices and reciprocates along the first inlet / outlet track to enter and exit the encapsulation cavity.

4. The packaging equipment including a cleaning function according to claim 3, characterized in that... The first drive unit moves on the first track.

5. The packaging equipment including a cleaning function according to claim 4, characterized in that, The upper surface of the groove area has multiple through holes for connecting the plasma generator, the vacuum pipe and the gas input pipe.

6. The packaging equipment including a cleaning function according to claim 2, characterized in that, The encapsulation equipment also includes a feeding device for feeding the product to be encapsulated into the encapsulation cavity. The feeding device and the cleaning device are respectively arranged on both sides of the encapsulation device. The feeding device includes a second track, which includes a second inlet track and a second inter-device track. The feeding device moves between multiple encapsulation devices along the second inter-device track and reciprocates along the second inlet track to enter and exit the encapsulation cavity.

7. The packaging equipment including a cleaning function according to claim 6, characterized in that, The feeding device includes a feeding section and a second driving section. The second driving section moves on the second track, and the feeding section is driven by the second driving section to reciprocate and move in and out of the encapsulation cavity.

8. The packaging equipment including a cleaning function according to claim 2, characterized in that... The gas source device is a device that provides a hydrogen-nitrogen mixture, an argon-hydrogen mixture, or other mixed gases that simultaneously provide protection and oxidation-reduction.

9. The packaging equipment including a cleaning function according to claim 1, characterized in that, The encapsulation device is also equipped with a preheating device.

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