A chain type wet etching apparatus

Abstract

This invention discloses a chain-type wet etching apparatus, relating to the technical field of photovoltaic cell production equipment. The apparatus features an extension channel on the acid pickling tank, extending to a water washing tank. Above the acid pickling tank is a cleaning component for cleaning wafers, and outside the cleaning component is a conveyor for transferring the wafers into the water washing tank. A lifting assembly is located inside the acid pickling tank to lift the wafers onto the cleaning component. In this invention, after the wafers pass through the acid pickling tank, the lifting assembly lifts them to a cleaning position at the top of the tank. The cleaning assembly then washes off and dries the acidic liquid from the wafer surface. The washed-off acidic liquid flows back into the acid pickling tank through the extension channel on one side. The dried wafers then pass through a conveyor roller at the cleaning position into the water washing tank for rinsing. This minimizes the amount of acidic liquid carried into the water washing tank by the wafers, preventing any impact on the cleaning water and ensuring effective cleaning.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic cell production equipment technology, and in particular to a chain-type wet etching equipment. Background Technology

[0002] A solar cell is a device that directly converts light energy into electrical energy through the photoelectric effect or photochemical effect. It can be classified into monocrystalline silicon, polycrystalline silicon, and amorphous silicon solar cells. In terms of overall performance, such as energy conversion efficiency and lifespan, monocrystalline silicon and polycrystalline silicon cells are superior to amorphous silicon cells. Polycrystalline silicon has a lower conversion efficiency than monocrystalline silicon, but it is cheaper.

[0003] Photovoltaic cell manufacturing requires etching of silicon wafers, primarily to create a textured surface on a relatively flat film to increase the optical path and reduce light reflection. Wet etching is generally used in this process. Wet etching utilizes suitable chemical reagents to first decompose the areas of the wafer not covered by photoresist, then converts them into soluble compounds for removal.

[0004] Currently, wet etching is generally used in the early stages of the process, such as wafer preparation and cleaning, which do not involve patterning. In contrast, dry etching has become dominant in pattern transfer.

[0005] Currently, Chinese patent CN204760404U discloses a chain-type wet etching machine, which includes a drying tank, a first water washing tank, an acid washing tank, a second water washing tank, an air knife, and an air inlet pipe. The drying tank, the first water washing tank, the acid washing tank, and the second water washing tank are connected in sequence. The second water washing tank is equipped with an air knife. The second water washing tank and the drying tank are connected through the air inlet pipe.

[0006] This etching machine modifies the structure of the air knife in the water washing tank by directly connecting the compressed air intake pipe of the original air knife to the subsequent drying tank pipe. Hot air is used for drying, reducing the chance of alkali crystallization blockage. The hot air also improves the drying effect of the air knife, thereby reducing the probability of defective products.

[0007] However, wafers produced using this etching machine cannot be promptly removed from the pickling tank after passing through it. This can easily carry a large amount of acidic liquid into the water washing tank, causing the cleaning water in the water washing tank to be acidic and affecting the subsequent cleaning effect. Summary of the Invention

[0008] To address the aforementioned technical problems and overcome the shortcomings of existing technologies, this invention provides a chain-type wet etching apparatus.

[0009] To address the above technical problems, this invention provides a chain-type wet etching apparatus.

[0010] Technical effect: After the wafer passes through the pickling tank, it is lifted to the cleaning position at the top of the pickling tank by the lifting component. The cleaning component washes off the acidic liquid on the surface of the wafer and blows it dry. The washed-off acidic liquid flows back into the pickling tank from the extension channel on one side of the pickling tank. The dried wafer enters the water washing tank through the conveyor roller on the cleaning position for water washing. This ensures that the amount of acidic liquid carried by the wafer into the water washing tank is extremely small, avoiding any impact on the cleaning water in the water washing tank and preventing any impact on the cleaning effect.

[0011] The technical solution further defined by the present invention is: a chain-type wet etching apparatus, comprising an acid pickling tank and a water washing tank. The acid pickling tank is provided with an extension channel extending to the water washing tank. A cleaning component for cleaning wafers is provided above the acid pickling tank. A conveying component for conveying wafers to the water washing tank is provided outside the cleaning component. A lifting assembly is provided inside the acid pickling tank for lifting wafers in the acid pickling tank onto the cleaning component. The cleaning component includes cleaning tubes fixed at equal intervals above the cleaning channel. Several linearly distributed air holes are opened on the cleaning tubes. The cleaning tubes have two parallel rows. Wafers pass between the two rows of cleaning tubes. The air holes on the cleaning tubes are all oriented towards the wafer. The conveying component includes conveying rollers provided at intervals between the cleaning tubes. The diameter of the conveying rollers is the same as the diameter of the cleaning tubes and is driven to rotate by a driving component provided on one side of the acid pickling tank.

[0012] Furthermore, the conveyor rollers are provided with several, and the conveying components include a drive wheel fixed at the end of the conveyor rollers. A conveyor belt is wound around the several drive wheels in sequence to transmit rotational torque. An extension shaft is provided on the end of the conveyor rollers, and a driven gear is sleeved and fixed on the extension shaft.

[0013] The aforementioned chain-type wet etching equipment includes a drive motor as the driving component. The output shaft of the drive motor is equipped with a drive gear, which meshes with the driven gear. Two rows of cleaning tubes are staggered, and the air holes on them are inclined towards the middle position. All cleaning tubes are connected to a blower in the outside.

[0014] The aforementioned chain-type wet etching equipment includes a lifting component comprising a lifting block that is slidably connected to the side wall of the pickling tank perpendicular to the horizontal plane. The lifting block is equipped with a robotic arm for gripping wafers. The lifting block is slidably connected to the side wall of the pickling tank via a groove formed on the side wall of the pickling tank, and is driven to lift by a lifting component provided on the pickling tank.

[0015] The aforementioned chain-type wet etching equipment includes a lifting component comprising a lifting motor fixed at the top of the side of the pickling tank, a lifting screw integrally formed on the output shaft of the lifting motor, the lifting screw being arranged perpendicular to the horizontal plane and downward, and a drive block connected to the lifting block via a fixed rod, the lifting screw penetrating the drive block and being threadedly connected to it.

[0016] The aforementioned chain-type wet etching equipment has a lifting block and a fixing rod both made of acid-resistant material, and the fixing rod has four rods arranged around the lifting block.

[0017] The aforementioned chain-type wet etching equipment has an acid-resistant rubber conveying pad on the outer sleeve of the conveying roller, and several protruding anti-slip protrusions on the outer sleeve of the conveying pad, with the extension track inclined.

[0018] The beneficial effects of this invention are:

[0019] (1) In this invention, after the wafer is etched in the pickling tank, the robotic arm on the lifting component sinks down, grabs the wafer out of the pickling tank, and then lifts the wafer and places it between two rows of cleaning tubes. The conveying rollers set in the interval of the cleaning tubes can drive the wafer to the water washing tank. At the same time, the air holes on the cleaning tubes can continuously spray airflow to the top and bottom surfaces of the wafer. The airflow can wash down the acidic solution remaining on the wafer surface and dry the wafer, thereby ensuring the cleanliness of the wafer surface. After drying, the wafer enters the water washing tank through the conveyor and will not have too much impact on the cleaning water in the water washing tank.

[0020] (2) In this invention, the output shaft of the drive motor drives the active gear to rotate, which in turn drives the driven gear and the conveyor roller at the end position to rotate. Since the conveyor roller is equipped with a conveyor wheel, the conveyor rollers at other positions can rotate synchronously through the conveyor belt, thereby realizing the synchronous transmission of several conveyor rollers and sending the wafer from between the cleaning tubes to the washing tank. The acidic solution flushed down from the cleaning tube can fall into the extension channel and re-enter the acid washing tank.

[0021] (3) In this invention, the lifting motor drives the lifting screw to rotate, and under the action of the screw, it can drive the drive block to move up and down. Since the drive block and the lifting block are connected by a fixed rod, the drive block can drive the lifting block to complete the lifting or lowering, which facilitates the robot arm to grasp the wafer.

[0022] (4) In this invention, after the wafer passes through the pickling tank, it is lifted to the cleaning position at the top of the pickling tank by the lifting component. The cleaning component washes off the acidic liquid on the surface of the wafer and blows it dry. The washed-off acidic liquid flows back into the pickling tank from the extension channel on one side of the pickling tank. The dried wafer enters the water washing tank through the conveyor roller on the cleaning position for water washing. This ensures that the amount of acidic liquid carried into the water washing tank by the wafer is very small, avoiding any impact on the cleaning water in the water washing tank and preventing any impact on the cleaning effect. Attached Figure Description

[0023] Figure 1 This is a structural diagram of Example 1;

[0024] Figure 2 This is a structural diagram of the transmission component and the driving component in Example 1.

[0025] The components include: 1. Pickling tank; 11. Extension channel; 2. Washing tank; 3. Cleaning components; 31. Cleaning pipe; 32. Air vent; 4. Lifting assembly; 41. Lifting block; 42. Robotic arm; 43. Fixed rod; 5. Conveying components; 51. Conveying roller; 511. Drive wheel; 52. Conveyor belt; 53. Extension shaft; 54. Conveying pad; 55. Anti-slip protrusion; 6. Driving components; 61. Drive motor; 62. Drive gear; 63. Driven gear; 7. Lifting components; 71. Lifting motor; 72. Lifting screw; 73. Drive block. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the present invention clearer, a detailed description is provided below in conjunction with the accompanying drawings and specific embodiments. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0027] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0029] This embodiment provides a chain-type wet etching apparatus, the structure of which is as follows: Figure 1-2 As shown, it includes an acid pickling tank 1 and a water washing tank 2. An extension channel 11 is provided on the acid pickling tank 1, which extends to the position of the water washing tank 2. A cleaning component 3 for cleaning wafers is provided above the acid pickling tank 1, and a conveying component 5 for conveying wafers into the water washing tank 2 is provided outside the cleaning component 3.

[0030] like Figure 1-2 As shown, the pickling tank 1 is equipped with a lifting component 4, which is used to lift the wafer in the pickling tank 1 onto the cleaning component 3. The cleaning component 3 includes cleaning tubes 31 that are fixed at equal intervals above the cleaning channel. Several straight-line distributed air holes 32 are opened on the cleaning tubes 31. The cleaning tubes 31 have two parallel rows. The wafer passes between the two rows of cleaning tubes 31. The air holes 32 on the cleaning tubes 31 are all facing the wafer.

[0031] like Figure 1-2 As shown, the conveying component 5 includes conveying rollers 51 positioned at intervals on the cleaning pipe 31. The diameter of the conveying rollers 51 is the same as that of the cleaning pipe 31, and they are driven to rotate by a driving component 6 located on one side of the pickling tank 1. Several conveying rollers 51 are provided. The conveying component 5 includes a transmission wheel 511 fixed at the end of the conveying roller 51. A conveyor belt 52 is sequentially wound around the several transmission wheels 511, and the rotational torque is transmitted through the conveyor belt 52. An extension shaft 53 is provided on the end of the conveying roller 51, and a driven gear 63 is sleeved and fixed on the extension shaft 53.

[0032] like Figure 1-2 As shown, the driving component 6 includes a drive motor 61, with a drive gear 62 on the output shaft of the drive motor 61. The drive gear 62 meshes with a driven gear 63. Two rows of cleaning pipes 31 are staggered, with their air holes 32 tilted towards the center. All cleaning pipes 31 are connected to a blower in the outside. The lifting assembly includes a lifting block 41 that slides vertically to the side wall of the pickling tank 1. The lifting block 41 is equipped with a robotic arm 42 for gripping wafers.

[0033] like Figure 1-2 As shown, the lifting block 41 is slidably connected to the side wall of the pickling tank 1 via a groove formed on the side wall, and is driven to rise and fall by the lifting component 7 provided on the pickling tank 1. The lifting component 7 includes a lifting motor 71 fixed at the top of the side of the pickling tank 1. A lifting screw 72 is integrally formed on the output shaft of the lifting motor 71. The lifting screw 72 is arranged perpendicular to the horizontal plane and downward. A drive block 73 is connected to the lifting block 41 via a fixing rod 43. The lifting screw 72 passes through the drive block 73 and is threadedly connected to it.

[0034] like Figure 1-2 As shown, both the lifting block 41 and the fixing rod 43 are made of acid-resistant material, and the fixing rod 43 has four rods arranged around the lifting block 41. The conveyor roller 51 is covered with a conveyor pad 54 made of acid-resistant rubber, and the conveyor pad 54 has several protruding anti-slip protrusions 55.

[0035] After the wafer is etched in the acid pickling tank 1, the robotic arm 42 on the lifting assembly 4 sinks down, grabs the wafer out of the acid pickling tank 1, and then lifts the wafer and places it between two rows of cleaning tubes 31. The conveying rollers 51 set in the intervals of the cleaning tubes 31 can drive the wafer to the washing tank 2. At the same time, the air holes 32 on the cleaning tubes 31 can continuously spray airflow onto the top and bottom surfaces of the wafer. The airflow can wash down the acid solution remaining on the wafer surface and dry the wafer, thereby ensuring the cleanliness of the wafer surface. After drying, the wafer enters the washing tank 2 through the conveyor 5 without having too much impact on the cleaning water in the washing tank 2.

[0036] In this invention, after the wafer passes through the pickling tank 1, it is lifted to the cleaning position at the top of the pickling tank 1 by the lifting component 4. The cleaning component washes off the acidic liquid on the surface of the wafer and blows it dry. The washed-off acidic liquid flows back into the pickling tank 1 from the extension channel 11 on one side of the pickling tank 1. The dried wafer enters the water washing tank 2 through the conveyor roller 51 on the cleaning position for water washing. This ensures that the amount of acidic liquid carried by the wafer into the water washing tank 2 is extremely small, avoiding any impact on the cleaning water in the water washing tank 2 and preventing any impact on the cleaning effect.

[0037] In addition to the embodiments described above, the present invention may have other implementations. All technical solutions formed by equivalent substitution or equivalent transformation fall within the protection scope claimed by the present invention.

Claims

1. A chain-type wet etching apparatus, comprising an acid washing tank (1) and a water washing tank (2), characterized in that... The pickling tank (1) is provided with an extension channel (11) that extends to the water washing tank (2). A cleaning component (3) for cleaning wafers is provided above the pickling tank (1). A conveying component (5) for conveying wafers into the water washing tank (2) is provided outside the cleaning component (3). A lifting component (4) is provided inside the pickling tank (1) for lifting wafers in the pickling tank (1) onto the cleaning component (3). The cleaning component (3) includes cleaning tubes (31) that are equidistantly fixed above the cleaning channel. The cleaning tube (31) has several linearly distributed air holes (32). The cleaning tube (31) has two parallel rows. The wafer passes between the two rows of cleaning tubes (31). The air holes (32) on the cleaning tube (31) are all facing the wafer. The conveying component (5) includes a conveying roller (51) located at intervals on the cleaning tubes (31). The diameter of the conveying roller (51) is the same as the diameter of the cleaning tube (31). It is driven to rotate by a driving component (6) located on one side of the pickling tank (1). The lifting assembly (4) includes a lifting block (41) that is slidably connected to the side wall of the pickling tank (1) perpendicular to the horizontal plane. The lifting block (41) is equipped with a robotic arm (42) for gripping wafers. The lifting block (41) is slidably connected to the side wall of the pickling tank (1) through a groove opened on the side wall of the pickling tank (1), and is driven to lift by a lifting component (7) provided on the pickling tank (1). The lifting component (7) includes a lifting motor (71) fixed at the top of the side of the pickling tank (1). A lifting screw (72) is integrally formed on the output shaft of the lifting motor (71). The lifting screw (72) is set perpendicular to the horizontal plane and downward. A drive block (73) is connected to the lifting block (41) through a fixing rod (43). The lifting screw (72) penetrates the drive block (73) and is threadedly connected to it. The conveyor roller (51) is covered with an acid-resistant rubber conveyor pad (54), and the conveyor pad (54) is provided with several protruding anti-slip protrusions (55). The extension channel (11) is inclined and extends to the water washing tank (2) to guide the acid liquid flushed down by the cleaning parts back to the acid washing tank (1).

2. The chain-type wet etching equipment according to claim 1, characterized in that... The conveyor roller (51) is provided with several rollers. The conveyor component (5) includes a drive wheel (511) fixed at the end of the conveyor roller (51). A conveyor belt (52) is wound around the several drive wheels (511) in sequence. The rotational torque is transmitted through the conveyor belt (52). An extension shaft (53) is provided on the conveyor roller (51) at the end position. A driven gear (63) is sleeved and fixed on the extension shaft (53).

3. The chain-type wet etching equipment according to claim 2, characterized in that... The drive unit (6) includes a drive motor (61), and the output shaft of the drive motor (61) is provided with a drive gear (62). The drive gear (62) meshes with the driven gear (63). The two rows of cleaning pipes (31) are staggered, and the air holes (32) on them are inclined towards the middle position. The cleaning pipes (31) are all connected to the blower in the outside.

4. The chain-type wet etching equipment according to claim 1, characterized in that... The lifting block (41) and the fixing rod (43) are both made of acid-resistant material, and the fixing rod (43) has four rods arranged around the lifting block (41).

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