Power generation plant

Abstract

A power generation apparatus according to an embodiment of the present application includes a cooling member, a thermoelectric module provided on a first region of one surface of the cooling member, a connector member provided on a second region of the one surface of the cooling member and connected to the thermoelectric module, a thermal insulation member provided on the connector member and provided so as to expose a side surface of the connector member, a shield member provided so as to cover the thermal insulation member and the connector member, and a first insulating layer provided between the connector member and the shield member.

Description

Technical Field

[0001] This invention relates to power generation equipment, and more particularly, to power generation equipment that generates electricity by utilizing the temperature difference between the low-temperature and high-temperature portions of a thermoelectric element. Background Technology

[0002] Thermoelectric phenomena are caused by the movement of electrons and holes within a material, and refer to the direct energy conversion between heat and electricity.

[0003] Thermoelectric elements are a general term for elements that utilize the thermoelectric phenomenon, and they have a structure in which P-type thermoelectric materials and N-type thermoelectric materials are joined between metal electrodes to form a PN junction pair.

[0004] Thermoelectric elements can be classified into elements that utilize the temperature change of resistance, elements that utilize the Seebeck effect, and elements that utilize the Peltier effect. The Seebeck effect is the phenomenon of generating electromotive force due to a temperature difference, while the Peltier effect is the phenomenon of generating or absorbing heat due to an electric current.

[0005] Thermoelectric elements are widely used in household appliances, electronic components, and communication devices. For example, they can be used in cooling equipment, heating equipment, and power generation equipment. Therefore, the requirements for the thermoelectric performance of thermoelectric elements are gradually increasing.

[0006] Recently, there has been a need to generate electricity using high-temperature waste heat from engines in vehicles, ships, etc., and thermoelectric elements. In this case, a pipe through which the first fluid passes can be located at the low-temperature section of the thermoelectric element, while heat dissipation fins can be located at the high-temperature section, through which a second fluid can pass. Therefore, electricity can be generated using the temperature difference between the low-temperature and high-temperature sections of the thermoelectric element, and the power generation performance can be varied depending on the structure of the power generation equipment. Summary of the Invention

[0007] [Technical Issues]

[0008] The present invention aims to provide a power generation device that generates electricity by utilizing the temperature difference between the low-temperature and high-temperature portions of a thermoelectric element.

[0009] [Technical Solution]

[0010] According to one embodiment of the present invention, a power generation device includes: a cooling component; a thermoelectric module disposed in a first region on a surface of the cooling component; a connector component disposed in a second region on a surface of the cooling component and connected to the thermoelectric module; a heat-insulating member disposed on the connector component and configured to expose a side surface of the connector component; a shielding member configured to cover the heat-insulating member and the connector component; and a first insulating layer disposed between the connector component and the shielding member.

[0011] The height of the connector component can be greater than the height of one surface of the insulation component relative to the cooling component.

[0012] The connector component may include a plurality of connectors spaced apart from each other, and the first insulating layer may be a plurality of first insulating layers provided for each connector.

[0013] The connector component may include a plurality of connectors spaced apart from each other, and the first insulating layer may be integrally disposed on the plurality of connectors.

[0014] The first insulating layer may contain polyimide (PI).

[0015] The power generation equipment may also include a second insulating layer disposed between the thermoelectric module and the side surface of the shielding member.

[0016] The shielding member may include a first surface and a second surface with a height greater than that of the first surface. The second surface may be disposed on the connector component, and a second insulating layer may be disposed on a side surface of the first surface.

[0017] The second insulating layer may extend from the side surface of the first surface to at least one of the bottom surface and the top surface of the first surface.

[0018] The power generation equipment may also include a wire component connected to the connector component, wherein the wire component may be disposed between a surface of the cooling component and an insulating member in the second region.

[0019] The thermoelectric module may include: a thermoelectric element comprising a first substrate, a first electrode disposed on the first substrate, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, and a second substrate disposed on the second electrode; and a connecting electrode component disposed on the first substrate, wherein a connector component may be disposed on the connecting electrode component, and the connecting electrode component may be configured to be spaced apart from the outer edge of the first substrate by a predetermined distance or more.

[0020] According to another embodiment of the present invention, a power generation device includes: a cooling component; a first thermoelectric module and a second thermoelectric module disposed spaced apart from each other on one surface of the cooling component; a first connector component connected to the first thermoelectric module and a second connector component connected to the second thermoelectric module, the first connector component and the second connector component being disposed between the first thermoelectric module and the second thermoelectric module on one surface of the cooling component; a heat insulation member disposed such that at least a portion of the first connector component and at least a portion of the second connector component are exposed on the side surfaces of the first connector component and the second connector component between the first thermoelectric module and the second thermoelectric module on one surface of the cooling component; a shielding member disposed covering the heat insulation member, the first connector component and the second connector component; and a first insulating layer disposed between the first connector component, the second connector component and the shielding member.

[0021] Each of the first connector component and the second connector component may include a plurality of connectors spaced apart from each other, and the first insulating layer may be a plurality of first insulating layers provided for each connector.

[0022] Each of the first connector component and the second connector component may include a plurality of connectors spaced apart from each other, and the first insulating layer may be integrally disposed on the plurality of connectors included in the first connector component and the plurality of connectors included in the second connector component.

[0023] Each of the first connector component and the second connector component may include a plurality of connectors spaced apart from each other, and the first insulating layer may include a plurality of first insulating layers integrally disposed on some of the connectors included in the first connector component and some of the connectors included in the second connector component.

[0024] Each of the first connector component and the second connector component may include a plurality of connectors spaced apart from each other, and the first insulating layer may include a plurality of first insulating layers integrally disposed on the plurality of connectors included in the first connector component and integrally disposed on some of the plurality of connectors included in the second connector component.

[0025] Each of the first connector component and the second connector component may include a plurality of connectors spaced apart from each other. The shielding member may include a first surface and a plurality of second surfaces, the plurality of second surfaces surrounding the first surface and having a height greater than the height of the first surface. One of the plurality of second surfaces may be disposed on some of the connectors included in the first connector component and some of the connectors included in the second connector component. Other surfaces of the plurality of second surfaces may be disposed on other connectors included in the first connector component and other connectors included in the second connector component. The power generation device may also include a second insulating layer disposed between the first thermoelectric module and the lateral surface of the first surface and between the second thermoelectric module and the lateral surface of the first surface.

[0026] A thermoelectric device according to one embodiment of the present invention includes: a thermoelectric element, a connecting electrode component electrically connected to the thermoelectric element, a plurality of bonding layers disposed on the connecting electrode component, and a connector component disposed on the plurality of bonding layers, wherein the plurality of bonding layers are arranged to be spaced apart from each other circumferentially along the bottom surface of the connector component.

[0027] The connecting electrode component may include a first connecting electrode and a second connecting electrode spaced apart from the first connecting electrode. The first connecting electrode may be branched into a first-1 connecting electrode region and a first-2 connecting electrode region, and the second connecting electrode may be branched into a second-1 connecting electrode region and a second-2 connecting electrode region. A plurality of bonding layers may be disposed in each of the first-1 connecting electrode region, the first-2 connecting electrode region, the second-1 connecting electrode region, and the second-2 connecting electrode region.

[0028] The connector component may include multiple connectors, and each connector may be disposed in each of the first-1 connection electrode region, the first-2 connection electrode region, the second-1 connection electrode region, and the second-2 connection electrode.

[0029] The shortest distance between the multiple bonding layers and the outer edge of the thermoelectric element along the first direction may be shorter than the shortest distance between the multiple bonding layers and the outer edge of the thermoelectric element along the second direction. The first direction may be the direction in which the connecting electrode component is connected to the thermoelectric element, and the second direction may be a direction perpendicular to the first direction.

[0030] A portion of the bottom surface of the connector component may include a concave region, and one of the plurality of bonding layers may be configured to correspond to the concave region.

[0031] A concave shape can be set between the inner and outer surfaces of a bonding layer.

[0032] The outer surface of at least one of the multiple bonding layers may be disposed on the outer side of the bottom surface of the connector component.

[0033] The distance between the inner surface of at least one of the multiple bonding layers and the outer side of the bottom surface of the connector component may be greater than the distance between the outer surface of at least one of the multiple bonding layers and the outer side of the bottom surface of the connector component.

[0034] The power generation equipment may also include a wire component connected to a connector component, wherein the connector component may include a first wire fixing member to which the wire component is fixed and a frame configured to receive the first wire fixing member. When the wire component is attached or detached, the first wire fixing member may be movable in a direction toward at least one of a first wall surface of the frame and a second wall surface of the frame facing the first wall surface. A plurality of bonding layers may include a first bonding layer and a second bonding layer. The first bonding layer is disposed between a first bottom surface extending from the first wall surface and a connecting electrode component, and the second bonding layer is disposed between a second bottom surface extending from the second wall surface and spaced apart from the first bottom surface and the connecting electrode component.

[0035] The connecting electrode component and the first wire fixing component can be configured to be spaced apart from each other between the first bonding layer and the second bonding layer, which are spaced apart from each other.

[0036] The multiple bonding layers may also include a third bonding layer and a fourth bonding layer, the third bonding layer being disposed between a third bottom surface extending from the wire inlet of the frame and the connecting electrode component, and the fourth bonding layer being disposed between a fourth bottom surface extending from a third wall surface facing the wire inlet and spaced apart from the third bottom surface and the connecting electrode component.

[0037] The connector component may also include a second wire fixing member extending from the third bottom surface, and the connecting electrode component and the second wire fixing member may be configured to be spaced apart from each other between the third bonding layer and the fourth bonding layer, which are spaced apart from each other.

[0038] The total area of ​​the multiple bonding layers can be 80% to 120% of the total area of ​​the first bottom surface, the second bottom surface, the third bottom surface, and the fourth bottom surface.

[0039] Multiple bonding layers can have a thickness of 0.08 mm to 0.1 mm.

[0040] The thermoelectric element may include a first substrate, a first insulating layer disposed on the first substrate, a plurality of first electrodes disposed on the first insulating layer, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the plurality of first electrodes, a plurality of second electrodes disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs, a second insulating layer disposed on the plurality of second electrodes, and a second substrate disposed on the second insulating layer. The connecting electrode component may be disposed on the side surface of the plurality of first electrodes on the first substrate, and the bonding layer may also be disposed between the plurality of first electrodes and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs.

[0041] Each of the multiple bonding layers disposed between the connecting electrode component and the connector component, and the bonding layer disposed between the multiple first electrodes and the multiple P-type thermoelectric legs and the multiple N-type thermoelectric legs, may have a thickness of 0.8 mm to 0.1 mm.

[0042] Multiple bonding layers can be solder layers.

[0043] [Beneficial Effects]

[0044] According to embodiments of the present invention, a power generation device with excellent power generation performance can be obtained. In particular, according to embodiments of the present invention, by reducing the number of components used and the volume occupied, a power generation device that is simple to assemble and has excellent power generation performance can be obtained.

[0045] Furthermore, according to embodiments of the present invention, a power generation device with improved heat transfer efficiency to thermoelectric elements can be obtained. Additionally, according to embodiments of the present invention, the power generation capacity can be adjusted by changing the number of power generation devices.

[0046] Furthermore, according to embodiments of the present invention, the contact area between the second fluid and the heat dissipation fins of the thermoelectric module can be maximized, thereby maximizing the power generation efficiency.

[0047] In addition, according to embodiments of the present invention, the insulation performance between the shielding member and the thermoelectric module and connector can be improved.

[0048] Furthermore, according to embodiments of the present invention, thermoelectric elements with excellent performance and high reliability can be obtained. In particular, according to embodiments of the present invention, a connector bonding structure capable of satisfying both the solder printing thickness required between the electrode and the thermoelectric leg and the solder printing thickness required between the connecting electrode and the connector can be obtained. Attached Figure Description

[0049] Figure 1 This is a perspective view of a power generation device according to one embodiment of the present invention.

[0050] Figure 2 This is an exploded perspective view of a power generation device according to one embodiment of the present invention.

[0051] Figure 3 This is a top view of the state after the shielding member has been removed from the power generation equipment, according to one embodiment of the present invention.

[0052] Figure 4 This is an enlarged view of a portion of a power generation device according to one embodiment of the present invention.

[0053] Figure 5 and Figure 6 These are cross-sectional and perspective views of a thermoelectric element according to one embodiment of the present invention.

[0054] Figure 7 This is a partial perspective view of a power generation device including a shielding member according to an embodiment of the present invention.

[0055] Figure 8 This is a cross-sectional view around the shielding member of a power generation device including a shielding member according to an embodiment of the present invention.

[0056] Figure 9 This is a top view showing the arrangement of the first insulating layer according to an embodiment of the present invention.

[0057] Figure 10 This is a top view showing the arrangement of the first insulating layer according to another embodiment of the present invention.

[0058] Figure 11 This is a top view showing the arrangement of the first insulating layer according to yet another embodiment of the present invention.

[0059] Figure 12 It is based on Figures 9 to 11 A cross-sectional view of the arrangement structure of the first insulating layer in the embodiment.

[0060] Figure 13 This is a top view showing the arrangement of the first insulating layer according to yet another embodiment of the present invention.

[0061] Figure 14 It is based on Figure 13 A cross-sectional view of the arrangement structure of the first insulating layer in the embodiment.

[0062] Figure 15 This is a top view of a first shielding member having a second insulating layer provided according to an embodiment of the present invention.

[0063] Figure 16 This is a cross-sectional view of a first shielding member having a second insulating layer provided according to an embodiment of the present invention.

[0064] Figure 17This is a top view of the substrate and electrodes included in a thermoelectric element according to an embodiment of the present invention.

[0065] Figure 18 This is a perspective view of a thermoelectric module according to an embodiment of the present invention, wherein a heat sink is disposed on a thermoelectric element.

[0066] Figure 19 This is a perspective view of a connector disposed on a connecting electrode component and a wire connected to the connector, according to an embodiment of the present invention.

[0067] Figure 20 This is a top view of a connector according to an embodiment of the present invention.

[0068] Figure 21 This is a bottom perspective view of the state in which the wire is connected to the connector according to an embodiment of the present invention.

[0069] Figure 22 An example of a pattern of a bonding layer disposed on a connecting electrode according to an embodiment of the present invention is shown. Detailed Implementation

[0070] In the following, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0071] However, the spirit of the present invention is not limited to the described embodiments, but can be implemented in various different forms, and one or more components can be used by selectively coupling or substituting between embodiments without departing from the spirit of the present invention.

[0072] Furthermore, the terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as meanings that would be commonly understood by one of ordinary skill in the art to which this invention pertains, unless specifically defined and explicitly described, and the meanings of commonly used terms, such as those defined in dictionaries, may be interpreted taking into account the contextual meaning of the relevant art.

[0073] Furthermore, the terminology used in the embodiments of the present invention is intended to describe the embodiments and not to limit the invention.

[0074] In this specification, the singular form may also include the plural form unless otherwise stated in the phrase, and when it is described as “at least one (or one or more) of A and B, C”, it may include one or more of all possible combinations of A, B and C.

[0075] Furthermore, when describing components of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used.

[0076] These terms are intended only to distinguish components from other components, and the nature, order, or sequence of the corresponding components are not limited by these terms.

[0077] Furthermore, when describing a component as “connected,” “coupled,” or “joined” to another component, this can include not only cases where the component is directly connected, coupled, or joined to another component, but also cases where the component is “connected,” “coupled,” or “joined” to another component through other components inserted therein.

[0078] Furthermore, when described as being formed or disposed on the "top (above) or bottom (below)" of each component, "top (above)" or "bottom (below)" includes not only the case where two components are in direct contact with each other, but also the case where one or more other components are formed or disposed between the two components. Additionally, when expressed as "top (above)" or "bottom (below)," this can also include the meaning of both upward and downward directions relative to a component.

[0079] Figure 1 This is a perspective view of a power generation device according to one embodiment of the present invention. Figure 2 This is an exploded perspective view of a power generation device according to one embodiment of the present invention. Figure 3 This is a top view of a power generation device according to an embodiment of the present invention with the shielding member removed. Figure 4 This is an enlarged view of a portion of a power generation device according to one embodiment of the present invention.

[0080] Reference Figures 1 to 4 The power generation device 1000 includes a pipe 1100, a first thermoelectric module 1200, a second thermoelectric module 1300, and a branch component 1400. Multiple power generation devices 1000 can be arranged in parallel, spaced apart from each other by a predetermined interval, to form a power generation system. Although not shown, a second fluid can pass between two power generation devices 1000 arranged at a predetermined interval. For example, the second thermoelectric module 1300 of one power generation device 1000 and the first thermoelectric module 1200 of another adjacent power generation device 1000 are arranged in parallel, spaced apart from each other by a predetermined interval, and a second fluid can pass between them.

[0081] The power generation device 1000 according to an embodiment of the present invention can generate electricity using the temperature difference between a first fluid flowing through the interior of the pipe 1100 and a second fluid flowing through the exterior of the pipe 1100. In this specification, the temperature of the first fluid flowing through the interior of the pipe 1100 can be lower than the temperature of the second fluid flowing through the heat dissipation fins of the thermoelectric modules 1200 and 1300 disposed outside the pipe 1100. Therefore, in this specification, the pipe 1100 can be referred to as a cooling component.

[0082] For this purpose, the first thermoelectric module 1200 can be disposed on the first surface 1110 of the cooling component 1100, and the second thermoelectric module 1300 can be disposed on the second surface of the cooling component 1100 facing the first surface 1110. In this case, the surface of each of the two surfaces of the first thermoelectric module 1200 and the second thermoelectric module 1300 facing the cooling component 1100 is a low-temperature portion, and electricity can be generated by using the temperature difference between the low-temperature portion and the high-temperature portion. A branching component 1400 can be disposed on a third surface 1130 perpendicular to the first surface 1110 and the second surface of the cooling component 1100, and the second fluid can be branched by the branching component 1400 to flow onto the first thermoelectric module 1200 and the second thermoelectric module 1300.

[0083] The first fluid introduced into the cooling component 1100 may be water, but is not limited thereto, and may be various types of fluids with cooling properties. The temperature of the first fluid introduced into the cooling component 1100 may be below 100°C, preferably below 50°C, more preferably below 40°C, but is not limited thereto. The temperature of the first fluid discharged after passing through the cooling component 1100 may be higher than the temperature of the first fluid introduced into the cooling component 1100.

[0084] A first fluid is introduced into the cooling component 1100 through a fluid inlet and discharged through a fluid outlet. To facilitate the introduction and discharge of the first fluid and to support the cooling component 1100, an inlet flange (not shown) and an outlet flange (not shown) may be provided at the fluid inlet and outlet of the cooling component 1100, respectively. Alternatively, multiple fluid inlets (not shown) may be formed on a fourth surface 1140 perpendicular to the first surface 1110, the second surface, and the third surface 1130 of the cooling component 1100, and multiple fluid outlets 1162 may be formed on a sixth surface 1160 facing the fourth surface 1140. The multiple fluid inlets and fluid outlets 1162 may be connected to multiple fluid passage pipes (not shown) in the cooling component 1100. Therefore, the first fluid introduced into each fluid inlet can pass through each fluid passage pipe and can then be discharged from each fluid outlet 1162. Therefore, even when the flow rate of the first fluid is insufficient to completely fill the interior of the cooling component 1100 or when the surface area of ​​the cooling component 1100 increases, the first fluid can be uniformly distributed in the cooling component 1100, thereby achieving uniform thermoelectric conversion efficiency over the entire surface of the cooling component 1100, and omitting the inlet flange and outlet flange.

[0085] At this time, each fluid inlet can be connected to the fluid inlet pipe 1182 via a first assembly component (not shown), and each fluid outlet 1162 can be connected to the fluid outlet pipe 1192 via a second assembly component (not shown).

[0086] Here, the fluid inlet pipe 1182 and the fluid outlet pipe 1192 can be configured to protrude from the fourth surface 1140 and the sixth surface 1160 of the cooling component 1100.

[0087] Although not shown, heat dissipation fins can be disposed on the inner wall of the cooling component 1100. The shape and number of heat dissipation fins, as well as the area of ​​the heat dissipation fins occupying the inner wall of the cooling component 1100, can vary depending on the temperature of the first fluid, the temperature of the second fluid, the required power generation capacity, etc. The area of ​​the heat dissipation fins occupying the inner wall of the cooling component 1100 can be, for example, 1% to 40% of the cross-sectional area of ​​the cooling component 1100. Therefore, high thermoelectric conversion efficiency can be obtained without interfering with the flow of the first fluid. In this case, the heat dissipation fins can have a shape that does not interfere with the flow of the first fluid. For example, the heat dissipation fins can be formed in the direction of the first fluid flow. In other words, the heat dissipation fins can have a plate shape extending in the direction from the fluid inlet to the fluid outlet, and multiple heat dissipation fins can be arranged to be spaced apart from each other by a predetermined interval. The heat dissipation fins can be integrally formed with the inner wall of the cooling component 1100.

[0088] Meanwhile, the first thermoelectric module 1200 can be disposed on the first surface 1110 of the cooling component 1100, and the second thermoelectric module 1300 can be disposed symmetrically with the first thermoelectric module 1200 on the second surface of the cooling component 1100.

[0089] The first thermoelectric module 1200 and the second thermoelectric module 1300 can be fastened to the cooling component 1100 using screws. Therefore, the first thermoelectric module 1200 and the second thermoelectric module 1300 can be stably coupled to the surface of the cooling component 1100. Alternatively, at least one of the first thermoelectric module 1200 and the second thermoelectric module 1300 can also be bonded to the surface of the conduit 1100 using a thermal interface material (TIM). Here, the thermal interface material (TIM) is a material having heat transfer and bonding properties, and can be, for example, a resin composition comprising at least one of epoxy resin, silicone resin, and inorganic materials. Here, the inorganic material can be an oxide, carbide, or nitride of aluminum, boron, or silicon.

[0090] Meanwhile, each of the first thermoelectric module 1200 and the second thermoelectric module 1300 includes thermoelectric elements 1210 and 1310 disposed on each of the first surface 1110 and the second surface, and heat dissipation fins 1220 and 1320 disposed on the thermoelectric elements 1210 and 1310. As described above, when the cooling component 1100 through which the first fluid flows is disposed on one of the two surfaces of each of the thermoelectric elements 1210 and 1310, and the heat dissipation fins 1220 and 1320 are disposed on the other surface, and the second fluid flows through the heat dissipation fins 1220 and 1320, the temperature difference between the heat-absorbing surface and the heat-dissipating surface of the thermoelectric elements 1210 and 1310 can be increased, thereby improving the thermoelectric conversion efficiency. At this time, the direction of the first fluid flow and the direction of the second fluid flow can be different. For example, the direction of the first fluid flow and the direction of the second fluid flow can be substantially perpendicular. At this time, the temperature of the second fluid introduced into the power generation device is higher than the temperature of the second fluid discharged after passing through the heat dissipation fins included in the thermoelectric module of the power generation device. For example, the second fluid introduced into the power generation equipment can be waste heat generated from the engine of a car or ship, but is not limited thereto. For example, the temperature of the second fluid introduced into the power generation equipment can be 100°C or higher, preferably 200°C or higher, more preferably 220°C to 250°C, but is not limited thereto.

[0091] At this time, refer to Figure 4 The heat dissipation fins 1220 and 1320, and the thermoelectric elements 1210 and 1310, can be fastened by a plurality of fastening members 1230 and 1330. For this purpose, at least some of the heat dissipation fins 1220 and 1320, and the thermoelectric elements 1210 and 1310, can be formed with through holes S through which the fastening members 1230 and 1330 pass. Here, individual insulators 1240 and 1340 can be further provided between the through holes S and the fastening members 1230 and 1330. The individual insulators 1240 and 1340 can be insulators surrounding the outer peripheral surfaces of the fastening members 1230 and 1330 or insulators surrounding the wall surfaces of the through holes S. For example, the insulators 1240 and 1340 can have an annular shape. The inner circumferential surfaces of the annular insulators 1240 and 1340 can be disposed on the outer circumferential surfaces of the fastening members 1230 and 1330, and the outer circumferential surfaces of the insulators 1240 and 1340 can be disposed on the inner circumferential surface of the through hole S. Therefore, the fastening members 1230 and 1330, the heat dissipation fins 1220 and 1320, and the thermoelectric elements 1210 and 1310 can be insulated.

[0092] At this time, the structures of thermoelectric elements 1210 and 1310 can have Figure 5 and Figure 6 The structure of the thermoelectric element 100 shown is illustrated. (Refer to...) Figure 5 and Figure 6 The thermoelectric element 100 includes a lower substrate 110, a lower electrode 120, a P-type thermoelectric leg 130, an N-type thermoelectric leg 140, an upper electrode 150, and an upper substrate 160.

[0093] A lower electrode 120 is disposed between the lower substrate 110 and the lower bottom surfaces of the P-type thermoelectric legs 130 and N-type thermoelectric legs 140, and an upper electrode 150 is disposed between the upper substrate 160 and the upper bottom surfaces of the P-type thermoelectric legs 130 and N-type thermoelectric legs 140. Therefore, multiple P-type thermoelectric legs 130 and multiple N-type thermoelectric legs 140 are electrically connected through the lower electrode 120 and the upper electrode 150. A pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 disposed between the lower electrode 120 and the upper electrode 150 and electrically connected can form a unit cell.

[0094] For example, when a voltage is applied to the lower electrode 120 and the upper electrode 150 via leads 181 and 182, the substrate from the P-type thermocouple 130 to the N-type thermocouple 140 can absorb heat due to the Peltier effect and thus act as a cooling component. Conversely, the substrate from the N-type thermocouple 140 to the P-type thermocouple 130 can be heated and thus act as a heat-generating component. Alternatively, when a temperature difference is applied between the lower electrode 120 and the upper electrode 150, the charges in the P-type thermocouple 130 and the N-type thermocouple 140 can move due to the Seebeck effect and thus generate electricity.

[0095] Here, the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 can be thermoelectric legs based on bismuth telluride (Bi-Te) with bismuth (Bi) and tellurium (Te) as main raw materials. The P-type thermoelectric leg 130 can be a thermoelectric leg based on bismuth telluride (Bi-Te) containing at least one of antimony (Sb), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), bismuth (Bi), and indium (In). For example, the P-type thermoelectric leg 130 can contain 99% to 99.999% by weight of Bi-Sb-Te as the main raw material, and contain 0.001% to 1% by weight of nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), and indium (In) based on 100% by weight of the total weight. The N-type thermoelectric leg 140 may be a bismuth telluride (Bi-Te) based thermoelectric leg containing at least one of selenium (Se), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), bismuth (Bi), and indium (In). For example, the N-type thermoelectric leg 140 may contain 99% to 99.999% by weight of Bi-Se-Te as the main raw material, and contain 0.001% to 1% by weight of at least one of nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), and indium (In) based on 100% by weight of the total weight. In this specification, the thermoelectric leg may also be referred to as a semiconductor structure, semiconductor device, semiconductor material layer, semiconductor material layer, semiconductor matter layer, conductive semiconductor structure, thermoelectric structure, thermoelectric material layer, thermoelectric material layer, thermoelectric matter layer, etc.

[0096] P-type thermoelectric legs 130 and N-type thermoelectric legs 140 can be formed in bulk-type or stack-type configurations. Generally, bulk-type P-type thermoelectric legs 130 or bulk-type N-type thermoelectric legs 140 can be obtained through the following processes: manufacturing ingots by heat-treating thermoelectric materials, obtaining powder for the thermoelectric legs by grinding and sieving the ingots, sintering the powder, and cutting the sintered body. In this case, P-type thermoelectric legs 130 and N-type thermoelectric legs 140 can be polycrystalline thermoelectric legs. As mentioned above, when P-type thermoelectric legs 130 and N-type thermoelectric legs 140 are polycrystalline thermoelectric legs, their strength can be increased. Stack-type P-type thermoelectric legs 130 or stack-type N-type thermoelectric legs 140 can be obtained through the following process: forming unit components by applying an adhesive including thermoelectric materials onto a sheet substrate, then stacking and cutting the unit components.

[0097] At this time, a pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 can have the same shape and volume, or different shapes and volumes. For example, since the P-type thermoelectric legs 130 and N-type thermoelectric legs 140 have different electrical conductivity characteristics, the height or cross-sectional area of ​​the N-type thermoelectric leg 140 can also be formed to be different from the height or cross-sectional area of ​​the P-type thermoelectric leg 130.

[0098] At this time, the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 can have a cylindrical shape, a polygonal cylindrical shape, an elliptical cylindrical shape, etc.

[0099] The performance of the thermoelectric element according to an embodiment of the present invention can be expressed as a quality factor (ZT). The quality factor (ZT) can be expressed as Equation 1.

[0100] [Equation 1]

[0101] ZT=α 2 ·σ·T / k

[0102] Where α refers to the Seebeck coefficient [V / K], σ refers to the conductivity [S / m], and α 2 σ refers to the power factor [W / mK] 2 Additionally, T refers to temperature, and k refers to thermal conductivity [W / mK]. k can be expressed as a·cp·ρ, where a refers to thermal diffusivity [cm]. 2 / S], cp refers to specific heat [J / gK], ρ refers to density [g / cm³] 3 ].

[0103] To obtain the quality factor of a thermoelectric element, the Z value (V / K) can be measured using a Z meter, and the quality factor (ZT) can be calculated using the measured Z value.

[0104] Here, the lower electrode 120 disposed between the lower substrate 110 and the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140, and the upper electrode 150 disposed between the upper substrate 160 and the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140, may contain at least one of copper (Cu), silver (Ag), aluminum (Al), and nickel (Ni), and have a thickness of 0.01 mm to 0.3 mm. When the thickness of the lower electrode 120 or the upper electrode 150 is less than 0.01 mm, its function as an electrode may degrade, thereby reducing its conductivity. When the thickness of the lower electrode 120 or the upper electrode 150 is greater than 0.3 mm, its conductivity may decrease due to the increase in resistance.

[0105] Furthermore, the lower substrate 110 and upper substrate 160, which are opposite each other, can be metal substrates and can have a thickness of 0.1 mm to 1.5 mm. When the thickness of the metal substrate is less than 0.1 mm or greater than 1.5 mm, the heat dissipation characteristics or thermal conductivity may increase excessively, thereby reducing the reliability of the thermoelectric element. Additionally, when the lower substrate 110 and upper substrate 160 are metal substrates, an insulating layer 170 may be formed between the lower substrate 110 and the lower electrode 120, and between the upper substrate 160 and the upper electrode 150. The insulating layer 170 may include a material with a thermal conductivity of 1 W / mK to 20 W / mK. In this case, the insulating layer 170 may be a resin composition comprising at least one of epoxy resin, silicone resin, and inorganic materials, a layer made of a silicone resin composite comprising silicone resin and inorganic materials, or an alumina layer. Here, the inorganic material may be at least one of oxides, nitrides, and carbides of aluminum, boron, or silicon.

[0106] At this time, the sizes of the lower substrate 110 and the upper substrate 160 can also be formed differently. In other words, the volume, thickness, or area of ​​one of the lower substrate 110 and the upper substrate 160 can be formed to be larger than the volume, thickness, or area of ​​the other. Here, the thickness can be the thickness in the direction from the lower substrate 110 toward the upper substrate 160, and the area can be the area in the direction perpendicular to the direction from the substrate 110 toward the upper substrate 160. Therefore, the heat absorption or heat dissipation performance of the thermoelectric element can be improved. Preferably, the volume, thickness, or area of ​​the lower substrate 110 can be formed to be larger than at least one of the volume, thickness, or area of ​​the upper substrate 160. At this time, when the lower substrate 110 is placed in a high-temperature region targeting the Seebeck effect, when the lower substrate 110 is applied to a heat-generating region targeting the Peltier effect, or when a sealing member configured to protect the thermoelectric element from external environmental influences (described below) is provided on the lower substrate 110, at least one of the volume, thickness, or area of ​​the lower substrate 110 can be greater than at least one of the volume, thickness, or area of ​​the upper substrate 160. In this case, the area of ​​the lower substrate 110 can be formed in the range of 1.2 to 5 times the area of ​​the upper substrate 160. When the area of ​​the lower substrate 110 is less than 1.2 times the area of ​​the upper substrate 160, the impact on improving heat conduction efficiency is not significant; however, when the area of ​​the lower substrate 110 exceeds 5 times the area of ​​the upper substrate 160, the heat conduction efficiency is significantly reduced, and it may be difficult to maintain the basic shape of the thermoelectric module.

[0107] Additionally, a heat dissipation pattern, such as a non-uniform pattern, can be formed on the surface of at least one of the lower substrate 110 and the upper substrate 160. Therefore, the heat dissipation performance of the thermoelectric element can be improved. When a non-uniform pattern is formed on the surface in contact with the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140, the bonding characteristics between the thermoelectric leg and the substrate can also be improved. The thermoelectric element 100 includes a lower substrate 110, a lower electrode 120, a P-type thermoelectric leg 130, an N-type thermoelectric leg 140, an upper electrode 150, and an upper substrate 160.

[0108] Although not shown, a sealing member may be provided between the lower substrate 110 and the upper substrate 160. This sealing member may be provided on the side surfaces of the lower electrode 120, the P-type thermoelectric leg 130, the N-type thermoelectric leg 140, and the upper electrode 150 between the lower substrate 110 and the upper substrate 160. Therefore, the lower electrode 120, the P-type thermoelectric leg 130, the N-type thermoelectric leg 140, and the upper electrode 150 can be sealed and protected from external moisture, heat, contaminants, etc.

[0109] At this time, the lower substrate 110 disposed on the cooling component 1100 can be an aluminum substrate, and the aluminum substrate can be bonded to each of the first surface 1110 and the second surface via a thermal interface material (TIM). Because the aluminum substrate has excellent heat transfer properties, heat transfer can easily occur between one of the two surfaces of the thermoelectric elements 1210 and 1310 and the cooling component 1100 through which the first fluid flows. Furthermore, when the aluminum substrate is bonded to the cooling component 1100 through the thermal interface material (TIM), the heat transfer between the aluminum substrate and the cooling component 1100 through which the first fluid flows is not interrupted.

[0110] Meanwhile, in embodiments of the present invention, a plurality of first thermoelectric modules 1200 disposed on the first surface 1110 of the cooling component 1100, and a plurality of second thermoelectric modules 1300 disposed on the second surface of the cooling component 1100 can be provided. The size and number of thermoelectric modules can be adjusted according to the required power generation.

[0111] At this time, at least some of the plurality of first thermoelectric modules 1200 disposed on the first surface 1110 of the cooling component 1100 can be electrically connected to each other, and at least some of the plurality of second thermoelectric modules 1300 disposed on the second surface of the cooling component 1100 can be electrically connected to each other. For this purpose, wires are connected to some of the plurality of electrodes included in each thermoelectric element and are pulled out to the outside of each thermoelectric element, and the pulled-out wires can be connected to connectors disposed on the outside of each thermoelectric element.

[0112] Meanwhile, the wires and connectors are susceptible to external heat or moisture, and may be damaged when the second fluid passing through the heat sink fins comes into direct contact with them. Therefore, the power generation equipment according to embodiments of the present invention may further include a shielding member configured to cover the wires and connectors. However, when the shielding member is disposed between thermoelectric modules, it may also interfere with the flow path of the second fluid. Embodiments of the present invention aim to provide a structure for a shielding member capable of covering the wires and connectors without interfering with the flow path of the second fluid.

[0113] The power generation device according to an embodiment of the present invention may include: a first shielding member 2100 disposed between two adjacent first thermoelectric modules 1200-1 and 1200-2 among a plurality of first thermoelectric modules 1200; and a second shielding member 2200 disposed between two adjacent second thermoelectric modules 1300-1 and 1300-2 among a plurality of second thermoelectric modules 1300.

[0114] Figure 7 This is a partial perspective view of a power generation device including a shielding member according to an embodiment of the present invention, and Figure 8 yes Figure 7 A cross-sectional view of region R in the power generation equipment.

[0115] Omission and Reference Figures 1 to 6 The descriptions contain overlapping content. For ease of description, a first shielding member disposed between multiple first thermoelectric modules on the first surface of the cooling component will be used as an example, but the same structure can also be applied to a second shielding member.

[0116] Reference Figures 1 to 3 , Figure 7 and Figure 8 A plurality of first thermoelectric modules 1200 are disposed on the first surface 1110 of the cooling component 1100. Each of the plurality of first thermoelectric modules 1200 includes a thermoelectric element 1210 disposed on the first surface 1110 and a heat dissipation fin 1220 disposed on the thermoelectric element 1210. Additionally, a connector 400 is disposed on a connection electrode (not shown) connected to the thermoelectric element 1210 of each first thermoelectric module 1200, and a wire 300 is connected to the connector 400. Here, the wire 300 may correspond to... Figure 6 Leads 181 and 182 in the middle.

[0117] According to an embodiment of the present invention, a first shielding member 2100 may be disposed between a first thermoelectric module 1200-1 and another adjacent thermoelectric module 1200-2, and the first shielding member 2100 may cover the wire 300 and connector 400 between the first thermoelectric module 1200-1 and the other adjacent first thermoelectric module 1200-2. Therefore, the wire 300 and connector 400 may be disposed between the first surface 1110 of the cooling component 1100 and the first shielding member 2100.

[0118] At this time, an insulating member 3000 can also be provided between the first surface 1110 of the cooling component 1100 and the first shielding member 2100. Therefore, since the first fluid in the cooling component 1100 and the second fluid on the first shielding member 2100 can be kept insulated, the temperature difference between the low-temperature part and the high-temperature part of the thermoelectric module can be maximized, and the power generation performance of the power generation equipment can be enhanced.

[0119] Therefore, the second fluid of the power generation device according to an embodiment of the present invention can flow sequentially through the first heat dissipation fin 1220-1 of one of the two adjacent first thermoelectric modules 1200-1 and 1200-2, the first shielding member 2100, and the second heat dissipation fin 1220-2 of the other of the two adjacent first thermoelectric modules 1200-1 and 1200-2. The direction of the second fluid flow can be a second direction perpendicular to the first direction in which the first fluid is introduced into the cooling component 1100 and discharged from the cooling component 1100.

[0120] For ease of explanation, this specification will primarily describe the first shielding member 2100, but the same structure can also be applied to the second shielding member 2200. The first shielding member 2100 can be coupled to the cooling member 1100 using coupling members 1900. In this case, to couple the first shielding member 2100, the cooling member 1100, and the second shielding member 2200 together, a plurality of coupling members 1900 can be arranged symmetrically with respect to the first shielding member 2100 and the second shielding member 2200, and the cooling member 1100 and the heat insulation member 3000 can form through holes h through which the coupling members 1900 pass.

[0121] At this time, the first shielding member 2100 according to an embodiment of the present invention includes a first surface 2110 and a second surface 2120, wherein the height of the second surface 2120 is greater than the height of the first surface 2110. In addition, the first shielding member 2100 may also include a third surface 2130, wherein the height of the third surface 2130 is greater than the height of the first surface 2110 and lower than the height of the second surface 2120.

[0122] At this time, the first surface 2110 can be located at the same height as or below the bottom surface 1222 of the heat dissipation fin 1220. When the first shielding member 2100 is located between two adjacent first thermoelectric modules 1200-1 and 1200-2, the first surface 2110 of the first shielding member 2100 can be formed symmetrically between the two adjacent first thermoelectric modules 1200-1 and 1200-2. Therefore, the second fluid passing through the first heat dissipation fin 1220-1 can be introduced into the second heat dissipation fin 1220-2 along the first shielding member 2100 without interrupting the flow.

[0123] Furthermore, the third surface 2130 can be positioned at a height greater than the height of the wire 300, and the second surface 2120 can be positioned at a height greater than the height of the wire 300 and the connector 400. For example, the maximum height of the second surface 2120 can be set to be 0.25 times, preferably 0.2 times, and more preferably 0.18 times or less of the height difference H between the bottom surface 1222 and the top surface 1224 of the heat dissipation fin 1220 and the bottom surface 1222 of the heat dissipation fin 1220. Therefore, since the area covered by the second surface 2120 of the first heat dissipation fin 1220-1 and the second heat dissipation fin 1220-2 can be minimized, the flow of the second fluid can be kept uninterrupted.

[0124] At this point, the area of ​​the third surface 2130 can be larger than the area of ​​the second surface 2120. In other words, the second surface 2120 can be formed to cover the connector 400, and all areas except the first surface 2110 and the second surface 2120 can be the third surface 2130. The first surface 2110 can be formed along the first heat sink fin 1220-1 and the second heat sink fin 1220-2. In addition, the second surface 2120-1 can be formed to cover the first connector 400-1 and the second connector 400-5, the first connector 400-1 being connected to a wire of either a first polarity or a second polarity to a first thermoelectric module 1200-1, and the second connector 400-5 being connected to a wire of either a first polarity or a second polarity to another first thermoelectric module 1200-2. Additionally, the second surface 2120-2 can be formed to cover the third connector 400-2 and the fourth connector 400-6. The third connector 400-2 is connected to a wire connected to the other of the first polarity and second polarity of a first thermoelectric module 1200-1, and the fourth connector 400-6 is connected to a wire connected to the other of the first polarity and second polarity of another first thermoelectric module 1200-2. As described above, the second surface 2120 can include a plurality of second surfaces 2120-1 and 2120-2 spaced apart from each other. Here, the first connector and the second connector can be a single connector or separate connectors, and the third connector and the fourth connector can be a single connector or separate connectors.

[0125] Furthermore, all areas of the first shielding member 2100 other than the first surface 2110 and the second surface 2120 can be a third surface 2130. In the case where the second surface 2120 comprises a plurality of second surfaces spaced apart from each other, the third surface 2130 can be disposed between two spaced-apart second surfaces 2120-1 and 2120-2. Therefore, since the area of ​​the second surface 2120 can be minimized, the first shielding member 2100 can avoid interfering with the flow path of the second fluid from the first heat dissipation fin 1220-1 to the second heat dissipation fin 1220-2.

[0126] Meanwhile, in embodiments of the present invention, a first connecting surface 2140 connecting the first surface 2110 and the third surface 2130 and a second connecting surface 2150 connecting the third surface 2130 and the second surface 2120 are included.

[0127] Here, the first connecting surface 2140 can be tilted relative to the first surface 2110 at an angle θ1 greater than 0° and less than 90°, preferably at an angle greater than 10° and less than 75°, and more preferably at an angle greater than 20° and less than 60°. Similarly, the second connecting surface 2150 can be tilted relative to the second surface 2120 at an angle θ2 greater than 0° and less than 90°, preferably at an angle greater than 10° and less than 75°, and more preferably at an angle greater than 20° and less than 60°. Therefore, gas passing through the first heat dissipation fin 1220-1 can be introduced into the second heat dissipation fin 1220-2 along the first shielding member 2100 without significant resistance.

[0128] Meanwhile, with the third surface 2130 disposed between two second surfaces 2120-1 and 2120-2 spaced apart from each other, the second connecting surfaces 2150-1 and 2150-2 can be symmetrically disposed such that the second connecting surface 2150-1 connects the third surface 2130 and the second surface 2120-1, and the second connecting surface 2150-2 connects the third surface 2130 and the second surface 2120-2.

[0129] Meanwhile, in the power generation device according to an embodiment of the present invention, a first thermoelectric module 1200 is disposed in a first region A1 of a first surface 1110 of a cooling component 1100, a connector 400 connected to the first thermoelectric module 1200 is disposed in a second region A2 of the first surface 1110 of the cooling component 1100, and a heat insulation member 3000 is disposed in the second region A2 of the first surface 1110 of the cooling component 1100. Additionally, a first shielding member 2100 may be disposed in the second region A2 of the second surface 1110 of the cooling component 1100 to cover the heat insulation member 3000 and the connector 400.

[0130] Typically, when the thermal insulation member 3000 is configured to cover the connector 400, the height of the thermal insulation member 3000 becomes higher than necessary, thus potentially causing flow resistance in the second fluid passing through the first heat sink 1220 of the first thermoelectric module 1200. To address this issue, the height of the thermal insulation member 3000 relative to the first surface 1110 of the cooling member 1100 can be set lower than the height of the connector 400. Therefore, at least a portion of the connector 400 can be exposed to the second surface 2120 of the first shielding member 2100 without being covered by the thermal insulation member 3000. In other words, the thermal insulation member 3000 is not positioned between the connector 400 and the inner surface of the second surface 2120 of the first shielding member 2100, and the upper surface of the connector 400 and the inner surface of the second surface 2120 of the first shielding member 2100 can be configured to face or contact each other.

[0131] For example, the heat insulation member 3000 can be disposed on the side of the connector 400 in the second region A2 of the first surface 1110. In this case, the heat insulation member 3000 may not be disposed between the connector 400 and the first shielding member 2100. In other words, the hole through which the connector 400 passes can also be formed on the heat insulation member 3000. Therefore, since the height of the first shielding member 2100 does not increase due to the heat insulation member 3000, the influence of the heat insulation member 3000 on the flow of the second fluid can be eliminated.

[0132] Typically, the first shielding member 2100 can be made of a metallic material for reasons such as heat resistance, cost, and compatibility. Similarly, since the connector 400 is disposed on the connection electrode of the thermoelectric element, at least a portion of the connector 400 can be made of a metallic material. Therefore, when the first shielding member 2100 is configured to cover the thermal insulation member 3000 and the connector 400, the first shielding member 2100 and the connector 400 can conduct electricity.

[0133] In embodiments of the present invention, such as Figure 8 As shown, a first insulating layer 5000 is disposed between the connector 400 and the first shielding member 2100. Therefore, conductivity between the connector 400 and the first shielding member 2100 can be blocked. Although Figure 8 The second surface 2120 of the shielding member 2100 and the first insulating layer 5000 are shown to be spaced apart from each other, but the invention is not limited thereto, and at least a portion of the first insulating layer 5000 may also contact the second surface 2120 of the shielding member 2100.

[0134] Figure 9 This is a top view showing the arrangement of the first insulating layer according to an embodiment of the present invention. Figure 10 This is a top view showing the arrangement of the first insulating layer according to another embodiment of the present invention. Figure 11 This is a top view showing the arrangement structure of the first insulating layer according to yet another embodiment of the present invention, and Figure 12 It is based on Figures 9 to 11 A cross-sectional view of the arrangement structure of the first insulating layer in the embodiment.

[0135] Reference Figures 9 to 12 The heat insulation component 3000 and multiple connectors 400 can be disposed in the second region A2 of the cooling component 1100. A through-hole h through which the coupling component 1900 passes can be formed in the heat insulation component 3000. In this case, the height of the multiple connectors 400 relative to the cooling component 1100 can be greater than the height of the heat insulation component 3000. Simultaneously, the connectors 400 can include multiple connectors arranged spaced apart from each other. Each of the first thermoelectric modules 1200 can be connected to at least two connectors 400. Figure 3 As shown, when four first thermoelectric modules 1200-1, 1200-2, 1200-3 and 1200-4 are disposed on the first surface 1110 of the cooling component 1100, at least eight connectors 400 may be disposed in the second region A2 of the first surface 1110 of the cooling component 1100.

[0136] At this time, the first insulating layer 5000 can be disposed on the plurality of connectors 400. Therefore, electrical conductivity between the plurality of connectors 400 and the first shielding member 2100 can be prevented.

[0137] Here, the first insulating layer 5000 may comprise polyimide (PI). Therefore, a first insulating layer with excellent fire resistance, heat resistance, and insulation properties can be obtained. Here, the first insulating layer 5000 may be in the form of a polyimide film, a polyimide tape, a polyimide resin, or a sol-gel polyimide-silica composite. Furthermore, the thickness of the first insulating layer 5000 may be from 1 μm to 15 μm, preferably from 3 μm to 10 μm, and more preferably from 5 μm to 10 μm. When the first insulating layer 5000 has a thickness within this range, excellent fire resistance, heat resistance, and insulation properties are achieved, and problems with flow resistance in the second fluid due to the addition of the first insulating layer 5000 can be prevented.

[0138] As described above, when the first insulating layer 5000 is also disposed between the connector 400 and the first shielding member 2100, it can prevent electrical conductivity between the connector 400 and the first shielding member 2100. Furthermore, when the first insulating layer 5000 has fire resistance and heat resistance, it can also insulate the connector 400 from the high-temperature second fluid moving on the first shielding member 2100.

[0139] In addition to polyimide, the first insulating layer 5000 may also include other heat-resistant polymers. For example, the first insulating layer 5000 may also contain at least one selected from polyacetal, polycarbonate, acetal copolymer, polyphenylene oxide, polyphenylene ether, polysulfone, nylon, polyphenylene sulfide, polybutylene terephthalate, polyarylate, polyamide-imide, polyester sulfone, liquid crystal polyester, polyarylate, polyetheretherketone, polyetherimide, aromatic polyetherketone, polyether nitrile, polyaryletherketone, polyketide sulfide, polysulfide sulfone, polytriphenylmethylpyrimidine, and polyarylether sulfide.

[0140] For example, refer to Figure 3 and Figure 9In the first-1 thermoelectric module 1200-1 and the first-3 thermoelectric module 1200-3, which are arranged adjacent to each other along the direction of the first fluid flow, a first insulating layer 5000-1 may be integrally disposed on the two connectors 400-1 and 400-2 connected to the first-1 thermoelectric module 1200-1 and the two connectors 400-3 and 400-4 connected to the first-3 thermoelectric module 1200-1. Similarly, in the first-2 thermoelectric module 1200-2 and the first-4 thermoelectric module 1200-4, which are arranged adjacent to each other along the direction of the first fluid flow, another first insulating layer 5000-2 may be integrally disposed on the two connectors 400-5 and 400-6 connected to the first-2 thermoelectric module 1200-2 and the two connectors 400-7 and 400-8 connected to the first-4 thermoelectric module 1200-4. At this time, the first insulating layer 5000-1 and the first insulating layer 5000-2 can be arranged to be spaced apart from each other.

[0141] As another example, see Figure 3 and Figure 10 In the first-1 thermoelectric module 1200-1 and the first-3 thermoelectric module 1200-3, which are arranged adjacent to each other along the direction of the second fluid flow, a first insulating layer 5000-1 can be integrally disposed on one of the two connectors 400-1 and 400-2 connected to the first-1 thermoelectric module 1200-1, and on one of the two connectors 400-5 and 400-6 connected to the first-2 thermoelectric module 1200-2. Similarly, another first insulating layer 5000-2 can be integrally disposed on the other connector 400-2 connected to the two connectors 400-1 and 400-2 connected to the first-1 thermoelectric module 1200-1, and on the other connector 400-6 connected to the two connectors 400-5 and 400-6 connected to the first-2 thermoelectric module 1200-2. In this case, the first insulating layer 5000-1 and the first insulating layer 5000-2 can be arranged to be spaced apart from each other.

[0142] As another example, see Figure 3 and Figure 11 In the first-1 thermoelectric module 1200-1 and the first-2 thermoelectric module 1200-2, which are arranged adjacent to each other along the direction of the second fluid passage, a first insulating layer 5000-1 may be integrally disposed on the two connectors 400-1 and 400-2 connected to the first-1 thermoelectric module 1200-1 and the two connectors 400-5 and 400-6 connected to the first-2 thermoelectric module 1200-2.

[0143] As described above, when a first insulating layer 5000 is disposed on multiple connectors 400, the process of disposing of the first insulating layer 5000 can be simplified.

[0144] Figure 13 This is a top view showing the arrangement structure of the first insulating layer according to yet another embodiment of the present invention, and Figure 14 It is based on Figure 13 A cross-sectional view of the arrangement structure of the first insulating layer in the embodiment.

[0145] Reference Figure 13 and Figure 14 The heat insulation component 3000 and multiple connectors 400 can be disposed in the second region A2 of the cooling section 1100. In this case, the height of the multiple connectors 400 relative to the cooling section 1100 can be greater than the height of the heat insulation component 3000. Furthermore, the connectors 400 can include multiple connectors spaced apart from each other. Each of the first thermoelectric modules 1200 can be connected to at least two connectors 400. Figure 3 As shown, when four first thermoelectric modules 1200-1, 1200-2, 1200-3 and 1200-4 are disposed on the first surface 1110 of the cooling component 1100, at least eight connectors 400 may be disposed in the second region A2 of the first surface 1110 of the cooling component 1100.

[0146] At this point, a first insulating layer 4000 can be provided for each connector 400.

[0147] For example, refer to Figure 3 and Figure 13 In the first-1 thermoelectric module 1200-1 and the first-2 thermoelectric module 1200-2, which are arranged adjacent to each other along the direction of the second fluid passage, for each connector, the first insulating layer 5000-1, ..., 5000-4 can be provided on the two connectors 400-1 and 400-2 connected to the first-1 thermoelectric module 1200-1 and the two connectors 400-5 and 400-6 connected to the first-2 thermoelectric module 1200-2.

[0148] Therefore, the space between the first insulating layer 5000 and the heat insulation component 3000 can be minimized, and the material cost of the first insulating layer 5000 can be reduced.

[0149] Meanwhile, in another embodiment of the present invention, the second insulating layer may also be disposed between the side surfaces of the thermoelectric module and the shielding member.

[0150] Figure 15 This is a top view of a first shielding member having a second insulating layer provided according to an embodiment of the present invention, and Figure 16This is a cross-sectional view of a first shielding member having a second insulating layer provided according to an embodiment of the present invention.

[0151] Reference Figure 15 and Figure 16 The second insulating layer 6000 can also be disposed between the side surfaces of the first thermoelectric module 1200 and the first shielding member 2100. Therefore, conductivity caused by contact between the first thermoelectric module 1200 and the first shielding member 2100 can be prevented.

[0152] As described above, the first shielding member 2100 includes a first surface 2110 and a second surface 2120 with a height greater than the first surface 2110, and the second surface 2120 may be disposed on the connector 400. Here, the second insulating layer 6000 may be disposed along the edge of the first shielding member 2100 on the side surface of the first surface 2110 of the first shielding member 2100.

[0153] At this time, as Figure 16 As shown in part (a), the second insulating layer 6000 may be disposed on a side surface of the first surface 2110. Here, the thickness of the second insulating layer 6000 may be equal to or greater than the thickness of the first surface 2110. Alternatively, as... Figure 16 As shown in part (b), the second insulating layer 6000 can be disposed on the side surface of the first surface 2110, and can also be disposed extending to at least one of the lower surface and the upper surface of the first surface 2110. In this case, the second insulating layer 6000 can comprise polyimide (PI). Therefore, a second insulating layer with excellent fire resistance, heat resistance, and insulation properties can be obtained. Here, the second insulating layer 6000 can be in the form of a polyimide film, a polyimide tape, a polyimide resin, or a sol-gel polyimide-silica composite. Therefore, not only can insulation be achieved between the first thermoelectric module 1200 and the first shielding member 2100, but external moisture, heat, contaminants, etc., can also be prevented from penetrating between the first thermoelectric module 1200 and the first shielding member 2100.

[0154] The following will describe the connection relationship between the thermoelectric module, connector and wires in a power generation device according to an embodiment of the present invention.

[0155] Figure 17 This is a top view of the substrate and electrodes included in the thermoelectric element of a power generation device according to one embodiment of the present invention. Figure 18 It is a perspective view of a thermoelectric module, wherein a heat sink is disposed on a thermoelectric element of a power generation device according to an embodiment of the present invention.

[0156] Reference Figure 17 and 18The thermoelectric module according to an embodiment of the present invention includes a thermoelectric element 100 and a heat sink 200 disposed on the thermoelectric element 100. Repeated descriptions identical to those described above regarding the thermoelectric element 100 will be omitted.

[0157] The arrangement of the connecting electrode component 400E on the first substrate 110 will be described in the following text.

[0158] As described above, a first insulating layer 170 is disposed on a first substrate 110, and a plurality of first electrodes 120 are disposed on the first insulating layer 170.

[0159] At this time, multiple first electrodes 120 can be provided to form multiple electrode outer edges, and the first substrate 110 can have multiple substrate outer edges corresponding to the multiple electrode outer edges. Here, the electrode outer edge can refer to the edge of the multiple first electrodes 120, and the substrate outer edge can refer to the edge of the first substrate 110. For example, when the multiple first electrodes 120 are provided in a rectangular shape, the multiple first electrodes 120 can have first electrode outer edges E1 to fourth electrode outer edges E4, and the first substrate 110 can have first substrate outer edges S1 to fourth substrate outer edges S4 respectively corresponding to the first electrode outer edges E1 to fourth electrode outer edges E4.

[0160] In embodiments of the present invention, the connecting electrode component 400E may include a first connecting electrode 410E and a second connecting electrode 420E with different polarities. For example, when the (-) terminal is connected to the first connecting electrode 410E, the (+) terminal may be connected to the second connecting electrode 420E. For example, the first connecting electrode 410E of the connecting electrode component 400E may connect the thermoelectric element 100 and the (-) terminal, and the second connecting electrode 420E may connect the thermoelectric element 100 and the (+) terminal. Therefore, the position of the connecting electrode component 400E may affect the insulation resistance of the thermoelectric element 100. Insulation resistance refers to the resistance represented by an insulator when a predetermined voltage is applied, and the thermoelectric element 100 needs to meet a predetermined insulation resistance. For example, when a DC voltage of 500V is applied, the thermoelectric element 100 is required to meet the requirement of having an insulation resistance of 500MΩ or greater.

[0161] In an embodiment of the present invention, when the connecting electrode component 400E is connected to the outer edge E1 of the first electrode, the distance d1 between the outer edge E1 of the first electrode and the outer edge S1 of the first substrate can be longer than the distance d2 to d4 between the outer edges E2 and E4 of the second electrode and the outer edges S2 and S4 of the second substrate. In this case, the connecting electrode component 400E can be extended to the outside of a sealing member (not shown), which is configured to surround the first insulating layer 170, a plurality of first electrodes 120, a plurality of P-type thermoelectric elements 130, a plurality of N-type thermoelectric elements 140, a plurality of second electrodes 150, and the second insulating layer 170 between the first substrate 110 and the second substrate 160.

[0162] Here, the shortest distances A1 and A2 between the connecting electrode component 400E and the outer edge S1 of the first substrate can be 12 mm or more, preferably 14 mm or more, and more preferably 16 mm or more.

[0163] Furthermore, each of the shortest distance B1 between the second substrate outer surface S2 connected to the first substrate outer surface S1 and the first connecting electrode 410E and the shortest distance B2 between the third substrate outer surface S3 connected to the first substrate outer surface S1 and the second connecting electrode 420 can be 12 mm or more, preferably 14 mm or more, and more preferably 16 mm or more.

[0164] Alternatively, the shortest distance F1 from the point where the outer edges S1 and S2 of the first substrate meet (i.e., the vertex between the outer edges S1 and S2 of the first substrate) to the first connecting electrode 410E and the shortest distance F2 from the point where the outer edges S1 and S3 of the first substrate meet (i.e., the vertex between the outer edges S1 and S3 of the first substrate) to the second connecting electrode 420E can be 16 mm or greater, preferably 19 mm or greater, and more preferably 21 mm or greater.

[0165] As described above, by adjusting the distance between the outer edge of the substrate and the connecting electrode component 400E, a thermoelectric element with an insulation resistance of 500MΩ or greater at a DC voltage of 500V can be obtained.

[0166] At this time, a connector 400, on which the wire 300 is detachably mounted, can be provided on each of the first connecting electrode 410E and the second connecting electrode 420E. Each of the electrode connecting member 400E, the first connecting electrode 410E, and the second connecting electrode 420E can be located outside the sealing member (not shown). Therefore, the wire connection can be simple, and the possibility of disconnection between the electrode and the wire can be minimized. Alternatively, two connectors can be provided on each connecting electrode, and the polarities of the wires connected to the two connectors on each connecting electrode can be different or the same.

[0167] Therefore, as shown, each connecting electrode may include multiple branch connecting electrode regions. For example, the first connecting electrode 410E may be branched into a first-1 connecting electrode region 412E and a first-2 connecting electrode region 414E, the second connecting electrode 420E may be branched into a second-1 connecting electrode region 422E and a second-2 connecting electrode region 424E, and a connector may be disposed in each connecting electrode region.

[0168] In an embodiment of the present invention, a connector may be disposed on a connecting electrode component, and a wire may be detachably connected to the connector.

[0169] Figure 19 This is a perspective view of a connector disposed on a connecting electrode component and a wire connected to the connector, according to an embodiment of the present invention. Figure 20 This is a top view of a connector according to an embodiment of the present invention. Figure 21 This is a rear perspective view of the state in which the wires are connected to the connector according to an embodiment of the present invention.

[0170] Reference Figures 19 to 21 Connector 400 is disposed on connecting electrode 400E, and wire 300 is connected to connector 400. At this time, connector 400 can be made of conductive material, so thermoelectric element 100 can be electrically connected to wire 300 through connecting electrode 400E and connector 400.

[0171] At this time, the connector 400 may include a first wire fixing member 410 to which the wire 300 is fixed and a frame 420 configured to receive the first wire fixing member 410. Here, the frame 420 may have an opening shape facing the connection electrode 400E. In other words, the frame 420 may include a first wall surface 4211 and a second wall surface 4212, the first wall surface 4211 including a first bottom surface 4201 facing the connection electrode 400E, and the second wall surface 4212 including a second bottom surface 4202 facing the connection electrode 400E. At this time, the first wire fixing member 410 may be configured to be spaced apart from the connection electrode 400E by a predetermined distance so as not to contact the connection electrode 400E, and when attaching or detaching the wire 300, the first wire fixing member 410 may move in a direction X1 or X2 along at least one of the first wall surface 4201 facing the frame 420 and the second wall surface 4202 facing the first wall surface 4201. Therefore, the first wire fixing member 410 can apply pressure to the wire 300 in the lateral direction. Here, the lateral direction can refer to the direction horizontal to which the connecting electrode 400E is positioned.

[0172] Furthermore, the frame 420 may also include a third bottom surface 4203 extending from the wire inlet In and a fourth bottom surface 4204 extending from the third wall surface 4213, the fourth bottom surface 4204 facing the wire inlet In and spaced apart from the third bottom surface 4203. In this case, the connector 400 may also include a second wire fixing member 430 extending from the third bottom surface 4203. The second wire fixing member 430 may be spaced apart from the connecting electrode 400E by a predetermined distance and is configured to be inclined in a direction opposite to the direction toward the connecting electrode 400E. Therefore, the second wire fixing member 430 can press against the wire 300 in the longitudinal direction. Here, the longitudinal direction may refer to the direction perpendicular to the direction in which the connecting electrode 400E is positioned.

[0173] As described above, the frame 420 may have an opening shape that is spaced at a predetermined distance from the connecting electrode component 400E, except for the first bottom surface 4201 to the fourth bottom surface 4204. Therefore, based on the movement of the first wire fixing member 410 and the second wire fixing member 430 within the frame 420, the wire 300 can be easily inserted, and the inserted wire 300 can be fixed with a high tensile strength, such as 2 kgf or greater. Furthermore, the permissible voltage and permissible current of the connector 400 made of conductive material, such as DC 20V and 1.5 mA, can be met.

[0174] Simultaneously, a plurality of first electrodes 120 and connecting electrodes 400E constituting the thermoelectric element 100 are disposed on the same plane, i.e., disposed on the first insulating layer 170. A plurality of thermoelectric legs are mounted on the plurality of first electrodes 120, and a connector 400 is mounted on the connecting electrode 400E. At this time, the plurality of first electrodes 120 and the plurality of thermoelectric legs, as well as the connecting electrode 400E and the connector 400, can be joined by solder. During the manufacturing process, the process of mounting the plurality of thermoelectric legs on the plurality of first electrodes 120 and the process of mounting the connector 400 on the connecting electrode 400E can be performed simultaneously. Therefore, solder can be printed on the plurality of first electrodes 120 and the connecting electrode 400 simultaneously. In the following, the bonding layer is the layer in which the plurality of first electrodes 120 and the plurality of thermoelectric legs, as well as the connecting electrode 400E and the connector 400 are joined, and can be, for example, a solder layer applied or printed for soldering.

[0175] Meanwhile, for the bonding between the plurality of first electrodes 120 and the plurality of thermoelectric legs, it is preferable that the bond layer after shrinkage has a thickness in the range of 0.08 mm to 0.1 mm. For this purpose, it is preferable that the bond layer is printed on the plurality of first electrodes 120 in the range of 0.145 mm to 0.2 mm.

[0176] However, when the bonding layer is printed over the entire area of ​​the connecting electrode 400E in a range of 0.145 mm to 0.2 mm, the bonding layer can rise to the inner region between the first bottom surface 4201 and the fourth bottom surface 4204 of the connector 400 and cure. In this case, the movement of the first wire fixing member 410 and the second wire fixing member 420 can be restricted, making it difficult to insert the wire 300, or weakening the force that secures the inserted wire 300.

[0177] To address this problem, in embodiments of the present invention, the pattern of the bonding layer on the connecting electrode component is adjusted.

[0178] Figure 22 An example of a pattern of a bonding layer disposed on a connecting electrode according to an embodiment of the present invention is shown.

[0179] Reference Figure 22The bonding layer 700 can be disposed on a portion of the connecting electrode component 400E. For example, the bonding layer 700 can have multiple bonding layers 710, 720, 730, and 740 that are independent of each other on the connecting electrode 400E. As described above, when the bonding layer 700 is disposed on a portion that is not the entire surface of the connecting electrode component 400E, the connecting electrode 400E and the connector 400 can be bonded through the bonding layer 700, and even when the bonding layer 700 is printed with a thickness equal to the thickness of the plurality of first electrodes 120, the problem of the bonding layer 700 rising into the internal region of the connector 400 can be prevented.

[0180] At this time, the bonding layer 700 may include a plurality of bonding layers 710, 720, 730 and 740, and the plurality of bonding layers 710, 720, 730 and 740 may be configured to be spaced apart from each other circumferentially along the bottom surface of the connector 400 on the connecting electrode 400E.

[0181] like Figure 17 and Figure 18 As shown, when the connecting electrode component 400E includes a first connecting electrode 410E and a second connecting electrode 420E, the first connecting electrode 410E branches into a first-1 connecting electrode region 412E and a first-2 connecting electrode region 414E, and the second connecting electrode 420E branches into a second-1 connecting electrode region 422E and a second-2 connecting electrode region 424E. Multiple bonding layers 710, 720, 730 and 740 can be disposed in the corresponding connecting electrode regions 412E, 414E, 422E and 424E, and the connector 400 can be disposed in the connecting electrode regions 412E, 414E, 422E and 424E. Therefore, when the connection direction of the connecting electrode component 400E (i.e., the direction toward the outer edge S1 of the first substrate 110) is referred to as the first direction and the direction perpendicular to the first direction (i.e., the direction toward the outer edge S2 of the first substrate 110) is referred to as the second direction, the shortest distance a1 between the plurality of bonding layers 710, 720, 730, and 740 and the outer edge S1 of the first substrate 110 in the first direction may be shorter than the shortest distance b1 between the plurality of bonding layers 710, 720, 730, and 740 and the outer edge S2 of the first substrate 110 in the second direction. Therefore, it is easier to connect the wire 300 to the connector 400, and the insulation resistance of the thermoelectric element 100 can be improved.

[0182] Meanwhile, as described above, the plurality of bonding layers 710, 720, 730, and 740 can be configured to be spaced apart from each other circumferentially along the bottom surface of the connector 400. Here, when the connector 400 is disposed on the connecting electrode 400E, the bottom surface of the connector 400 can refer to the surface facing the connecting electrode 400E, that is, the surface that is in direct contact with the connecting electrode 400E or in contact with the connecting electrode 400E via the bonding layer 700. In this case, a portion of the bottom surface of the connector 400 may include a concave region C. Here, the concave region C can be a bottom surface extending from the wire inlet In of the connector 400. One of the plurality of bonding layers 710, 720, 730, and 740, bonding layer 730, can be configured to correspond to the region C with the concave shape C1. For example, the concave shape can be disposed between the inner surface 732 and the outer surface 734 of the bonding layer 730. Here, the inner surface of the bonding layer can refer to the surface facing the interior of the connector 400, while the outer surface of the bonding layer can refer to the surface facing the exterior of the connector 400. Therefore, connector 400 can be stably engaged and secured to connection electrode 400E around wire inlet In.

[0183] Simultaneously, the outer surface of at least one of the multiple bonding layers 710, 720, 730, and 740 can be disposed on the outer side of the bottom surface of the connector 400. In this case, the distance t1 between the inner surfaces 712, 722, 732, and 742 of at least one of the multiple bonding layers 710, 720, 730, and 740 and the outer side of the bottom surface of the connector 400 can be greater than the distance t2 between the outer surfaces 714, 724, 734, and 744 of at least one of the multiple bonding layers 710, 720, 730, and 740 and the outer side of the bottom surface of the connector 400. Therefore, since the bottom surface of the connector 400 can be bonded to the connecting electrode 400E through the multiple bonding layers 710, 720, 730, and 740, the bonding strength between the connector 400 and the connecting electrode 400E can be increased.

[0184] More specifically, the multiple bonding layers 710, 720, 730, and 740 can be configured to correspond to the shape of the bottom surface of the frame 420 facing the connecting electrode 400E. For example, the bottom surface of the frame 420 facing the connecting electrode 400E may include a first bottom surface 4201 to a fourth bottom surface 4204. For example, the bonding layer 700 may include a first bonding layer 710 disposed between the first bottom surface 4201 extending from the first wall surface 4211 and the connecting electrode 400E, and a second bonding layer 720 disposed between the second bottom surface 4202 and the connecting electrode 400E, the second bottom surface 4202 extending from the second wall surface 4212 and spaced apart from the first bottom surface 4201. In this case, the first bonding layer 710 and the second bonding layer 720 may be spaced apart from each other. Therefore, the first bonding layer 710 and the second bonding layer 720 are not disposed between the connecting electrode 400E and the first wire fixing member 410, and the first wire fixing member 410 can move freely when attaching or detaching the wire 300.

[0185] Furthermore, the bonding layer 700 may also include a third bonding layer 730 disposed between a third bottom surface 4203 extending from the lead inlet In of the frame 420 and the connecting electrode 400E, and a fourth bonding layer 740 extending from a third wall surface 4213 facing the lead inlet In and spaced apart from the third bottom surface 4203 and the connecting electrode 400E. In this case, the third bonding layer 730 and the fourth bonding layer 740 may be spaced apart from each other. Therefore, the third bonding layer 730 and the fourth bonding layer 740 are not disposed between the connecting electrode 400E and the second lead fixing member 430, and the second lead fixing member 430 can move freely when attaching or detaching the lead 300.

[0186] At this time, the total area of ​​the multiple bonding layers 710, 720, 730, and 740 can be 80% to 120% of the total area of ​​the first bottom surface 4201, the second bottom surface 4202, the third bottom surface 4203, and the fourth bottom surface 4204. Therefore, solder can be printed on the multiple first electrodes 120 and the connecting electrode 400E in a single process with the same thickness. Thus, the bonding layers between the multiple first electrodes 120 and the thermoelectric legs, and between the connecting electrode 400E and the connector 400, can be formed with a thickness in the range of 0.08 mm to 0.1 mm. Therefore, even when the bonding force between the connecting electrode 400E and the connector 400 is high, the bonding layer 700 is not disposed in the internal region of the connector 400, making it easy to insert the wire 300 and maintaining high tensile strength of the inserted wire 300. For example, it can be seen that when the bonding layer 700 is formed between the connecting electrode 400E and the connector 400 according to an embodiment of the present invention, when the wire 300 is inserted into the connector 400, a wire insertion force of 30N or less is required, preferably 15N or less, more preferably 10N or less is required, and when the inserted wire 300 is separated from the connector 400, a tensile strength of 30N or greater is required, preferably 40N or greater, more preferably 50N or greater is required.

[0187] The thermoelectric element according to embodiments of the present invention can be applied to power generation equipment, cooling equipment, heating equipment, etc.

[0188] Although the above description has been made with reference to preferred embodiments of the invention, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and scope of the invention as described in the appended claims.

Claims

1. A power generation device, comprising: Cooling components; A thermoelectric module, which is disposed in a first region on one surface of the cooling component; A connector component, disposed in a second region on one surface of the cooling component, and connected to the thermoelectric module; A heat-insulating member disposed on the side surface of the connector member in the second region of one surface of the cooling member; A shielding member configured to cover the thermal insulation member and the connector component; as well as A first insulating layer is disposed between the connector component and the shielding member. The hole through which the connector component passes is formed on the heat insulation member, and The thickness of the connector component is greater than the thickness of the heat insulation component relative to one surface of the cooling component.

2. The power generation equipment according to claim 1, wherein, The connector component includes a plurality of connectors arranged spaced apart from each other, and The first insulating layer is a plurality of first insulating layers provided for each connector.

3. The power generation equipment according to claim 1, wherein, The connector component includes a plurality of connectors arranged spaced apart from each other, and The first insulating layer is integrally disposed on the plurality of connectors.

4. The power generation equipment according to claim 1, wherein, The first insulating layer comprises polyimide (PI).

5. The power generation equipment according to claim 1 further includes a second insulating layer disposed between the thermoelectric module and the side surface of the shielding member.

6. The power generation equipment according to claim 5, wherein, The shielding component includes a first zone and a second zone with a height greater than that of the first zone. The second area is disposed on the connector component, and The second insulating layer is disposed on the side surface of the first region.

7. The power generation equipment according to claim 6, wherein, The second insulating layer extends from the side surface of the first region to at least one of the bottom surface and the top surface of the first region.

8. The power generation equipment according to claim 1, further comprising a wire component connected to the connector component, in, The conductor component is disposed between one surface of the cooling component and the heat insulation component in the second region.

9. The power generation equipment according to claim 1, wherein, The thermoelectric module includes: A thermoelectric element includes a first substrate, a first electrode disposed on the first substrate, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, and a second substrate disposed on the second electrode; and Connecting electrode components disposed on the first substrate The connector component is disposed on the connecting electrode component, and The connecting electrode component is configured to be spaced apart from the outer edge of the first substrate.

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