Power module and integrally formed inductor
By employing a one-piece molded inductor structure and anti-coupling technology, the challenges of heat dissipation and loss in VRM inductors have been addressed, enabling a highly efficient power module design suitable for high power density environments.
CN115020081BActive Publication Date: 2026-07-24DELTA ELECTRONICS (SHANGHAI) CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- DELTA ELECTRONICS (SHANGHAI) CO LTD
- Filing Date
- 2021-03-04
- Publication Date
- 2026-07-24
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Figure CN115020081B_ABST
Abstract
The application provides an integrated inductor and a power module with good heat dissipation and simple manufacturing. The integrated inductor comprises a magnetic core and a first winding. The magnetic core comprises a first surface, a second surface and a side surface, the first surface and the second surface are oppositely arranged, and the side surface is arranged between the first surface and the second surface. The first winding comprises a first longitudinal part and a second longitudinal part, and the first connecting part is arranged between the first longitudinal part and the second longitudinal part. The first longitudinal part extends to the first surface, and the projection of the first longitudinal part on the first surface is within the range of the magnetic core. The first longitudinal part forms a first pin on the first surface, and the second longitudinal part extends to the plane of the second surface and forms a second pin on the plane of the second surface. The first winding and the magnetic core are integrally pressed by a mold to form the inductor.
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