Wafer cleaning apparatus and cleaning liquid supply device therefor

Abstract

The application discloses a wafer cleaning equipment and a cleaning liquid supply device thereof, which comprises a mixing tank, M overflow tank areas and a supply tank area sequentially connected in the mixing tank, the height of the tank opening of the M overflow tank areas and the supply tank area is sequentially reduced along the direction close to the supply tank area, the supply tank area is used for receiving the mixed cleaning liquid overflowed from the M overflow tank areas and supplying outward, and M is an integer greater than 1; a circulating heating device connected with the M overflow tank areas and used for circulating heating the mixed cleaning liquid in the M overflow tank areas; and a plurality of liquid storage tanks used for storing and providing corresponding liquid to the mixing tank. The application reduces the control complexity of the cleaning liquid supply device and the complexity of the cleaning liquid supply device.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and more particularly to a wafer cleaning equipment and a cleaning fluid supply device thereof. Background Technology

[0002] In leaf-type cleaning equipment, in order to ensure a continuous supply of mixed cleaning solution to the process chamber at the required temperature and concentration, two mixing tanks are usually used to supply the mixed cleaning solution. Because it takes a certain amount of time for the mixed cleaning solution to reach the required concentration and temperature, one mixing tank supplies the process chamber with the solution that has reached the required temperature and concentration, while the other mixing tank heats the mixed cleaning solution for later use. Therefore, two mixing tanks are needed to work together to continuously supply the process chamber with the mixed cleaning solution that meets the required temperature and concentration conditions, resulting in high complexity of the cleaning solution supply device and complex control. Summary of the Invention

[0003] This invention provides a wafer cleaning equipment and its cleaning fluid supply device, which solves the technical problem in related technologies that requires two mixing tanks to work together to continuously supply mixed cleaning fluid to the process chamber.

[0004] In a first aspect, embodiments of the present invention provide a wafer cleaning fluid supply device, comprising: A mixing tank is divided into M sequentially adjacent overflow tank areas and supply tank areas. The height of the openings of the M overflow tank areas and the supply tank areas decreases sequentially along the direction closer to the supply tank area. The supply tank area is used to receive the mixed cleaning liquid that overflows sequentially from the M overflow tank areas and supply it to the outside. M is an integer greater than 1. A circulating heating device is connected to the M overflow tank areas and is used to circulate and heat the mixed cleaning solution in the M overflow tank areas. Multiple liquid storage tanks are used to store and supply the corresponding liquids to the mixing tank.

[0005] Optionally, the M overflow tank areas include an input tank area and at least one intermediate tank area disposed between the input tank area and the supply tank area; the circulating heating device includes: The return pipe connects the M overflow tank areas to the input tank area. A heater is provided in the return pipe for heating the mixed cleaning solution flowing through the return pipe.

[0006] Optionally, each of the liquid storage tanks is connected to the input tank area through a corresponding input pipe, and each of the liquid storage tanks is equipped with a flow meter. The device further includes: A liquid level sensor is installed at a position corresponding to the height of the opening of the input tank area to detect the actual liquid level height in the input tank area. A concentration controller, electrically connected to the liquid level sensor and each of the flow meters, is used to control the flow meters of each of the liquid storage tanks according to the actual liquid level height detected by the liquid level sensor, so as to adjust the supply amount of the corresponding liquid from each of the liquid storage tanks to the input tank area.

[0007] Optionally, the device further includes: A concentration meter is installed in the return pipe to detect the concentration data of the mixed cleaning solution flowing through the return pipe; The concentration controller is also connected to the concentration meter, and the concentration controller is used to control the amount of liquid supplied from the corresponding storage tank to the input tank area based on the concentration data detected by the concentration meter.

[0008] Optionally, the device further includes: A first temperature sensor is installed in the supply tank area to detect the temperature of the mixed cleaning solution in the supply tank area; A second temperature sensor is installed at the output end of the heater to detect the temperature of the mixed cleaning solution at the output end. A temperature controller, electrically connected to the first temperature sensor and the second temperature sensor, is used to control the heating temperature of the heater based on the temperature detected by the first temperature sensor and the temperature detected by the second temperature sensor.

[0009] Optionally, the device further includes: A filter is installed in the return pipe to filter the mixed cleaning solution flowing through the return pipe.

[0010] Optionally, the volume of the supply tank area is greater than the volume of each of the M overflow tank areas.

[0011] Optionally, the return pipe includes: The first pipe body connects each of the overflow trough areas to the input trough area; A return pump, connected to the first pipeline body, is used to unidirectionally deliver the mixed cleaning fluid from each of the overflow tank areas to the input tank areas.

[0012] Optionally, the device further includes: A supply pipe is provided, and a liquid supply port is provided on the outer wall of the mixing tank where the supply tank area is located. The liquid supply port is connected to the supply pipe, and the supply pipe is used to supply the mixed cleaning liquid in the supply tank area to the outside.

[0013] In a second aspect, embodiments of the present invention provide a wafer cleaning apparatus, comprising: at least one process chamber for processing wafers, and a wafer cleaning fluid supply device as described in any of the first aspects, wherein the wafer cleaning fluid supply device is used to supply a mixed cleaning fluid to the process chamber.

[0014] One or more technical solutions provided in the embodiments of the present invention have at least the following technical effects or advantages: The wafer cleaning fluid supply device provided in this embodiment of the invention has M sequentially adjacent overflow tank areas and supply tank areas within the mixing tank, where M is an integer greater than 1. The supply tank area receives the mixed cleaning fluid that overflows sequentially from the M overflow tank areas and supplies it outwards. Since the height of the openings of the M overflow tank areas and the supply tank area decreases sequentially towards the supply tank area, and a circulating heating device is connected to the M overflow tank areas, the mixed cleaning fluid in the mixing tank can sequentially overflow and transfer within the M overflow tank areas. During the transfer process, the mixed cleaning fluid in each overflow tank area is circulated and heated by the circulating heating device. Therefore, the mixed cleaning fluid can be heated multiple times during the transfer process in each overflow tank area, ensuring that the mixed cleaning fluid overflowing into the supply tank area is maintained at the temperature required by the process. Consequently, it is not necessary to set up a spare mixing tank. Therefore, the complexity of the cleaning fluid supply device can be reduced, and switching between two or more mixing tanks is unnecessary, thereby reducing the control complexity of the cleaning fluid supply device. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This diagram illustrates the connection between the wafer cleaning fluid supply device and the process chamber in an embodiment of the present invention. Figure 2 A schematic diagram of the temperature control connection of the wafer cleaning fluid supply device in an embodiment of the present invention is shown. Figure 3 A schematic diagram of the concentration control connection of the wafer cleaning fluid supply device in an embodiment of the present invention is shown. Detailed Implementation

[0017] This invention provides a wafer cleaning equipment and its cleaning fluid supply device, which solves the technical problem in the prior art that requires two mixing tanks to work together to continuously supply mixed cleaning fluid to the process chamber.

[0018] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0019] First, it should be clarified that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0020] Firstly, reference Figures 1-3 As shown, this embodiment of the invention provides a wafer cleaning fluid supply device 10 for supplying a mixed cleaning fluid required for wafer processing to a process cavity 200 for processing wafers. The wafer cleaning fluid supply device 100 provided in this embodiment includes: a mixing tank 110, a circulating heating device 130 connected to the mixing tank 110 via a pipeline, and a plurality of storage tanks 120 connected to the mixing tank 110 via pipelines.

[0021] The mixing tank 110 is divided into M sequentially adjacent overflow tank areas 112 and supply tank areas 113. The height of the openings of the M overflow tank areas 112 and supply tank areas 113 decreases sequentially towards the supply tank area 113, where M is an integer greater than 1. Because the height of the openings of the M overflow tank areas 112 decreases sequentially towards the supply tank area 113, the mixed cleaning fluid overflows from one overflow tank area 112 to another, and finally overflows into the supply tank area 113, within the mixing tank 110. The supply tank area 113 receives the mixed cleaning fluid that overflows sequentially from the M overflow tank areas 112 and supplies it externally.

[0022] Each liquid storage tank 120 is used to store and supply a corresponding liquid to the mixing tank 110. In some embodiments, each liquid storage tank 120 stores a specific liquid, thereby allowing different liquids required for mixing the cleaning solution to be supplied to the mixing tank 110 from different liquid storage tanks 120, where they are mixed. Furthermore, based on the functional and locational differences of each overflow tank area 112, the M overflow tank areas 112 are further distinguished, specifically divided into: an input tank area, and at least one intermediate tank area② disposed between the input tank area and the supply tank area 113.

[0023] In some implementations, such as Figure 1As shown, the mixing tank 110 is divided into two adjacent overflow tank areas 112 and a supply tank area 113, namely: an input tank area ①, an intermediate tank area ②, and a supply tank area 113. The opening of the input tank area ① is higher than the opening of the intermediate tank area ②, and the opening of the intermediate tank area ② is higher than the opening of the supply tank area 113. This allows the mixed cleaning solution in the input tank area ① to overflow into the intermediate tank area ②, and then overflow from the intermediate tank area ② into the supply tank area 113.

[0024] It should be noted that each storage tank 120 specifically supplies liquid to the input tank area within the mixing tank 110. Thus, different liquids from different storage tanks 120 are mixed in the input tank area to form a mixed cleaning solution. Based on this, each storage tank 120 can be connected to the input tank area within the mixing tank 110 via a corresponding input pipe 122. Each storage tank 120 is equipped with a flow meter 121, allowing for individual control of the liquid supply from each storage tank 120 to the input tank area, thereby providing a precise supply.

[0025] This disclosure does not limit the number of liquid storage tanks 120 or the specific type of liquid stored in each tank. The number of liquid storage tanks 120 and the specific type of liquid stored in each tank will vary depending on the actual wafer fabrication process used. For example, refer to... Figure 1 As shown, three storage tanks 120 can be set up according to process requirements to store three different liquids. For example, the three storage tanks 120 can store NH4OH solution, H2O2 (hydrogen peroxide) and DIW (deionized water) respectively.

[0026] The supply tank 113 is used to supply a mixed cleaning solution with the required temperature and concentration for the process. Specifically, the supply tank 113 supplies the mixed cleaning solution to the process cavity 200 for wafer processing. More specifically, in order to supply the mixed cleaning solution to the process cavity 200, the wafer cleaning solution supply device 100 also includes a supply pipe 140. A liquid supply port is provided on the outer wall of the mixing tank 110 where the supply tank 113 is located. The liquid supply port is connected to the supply pipe 140, so that the supply tank 113 supplies the mixed cleaning solution to the process cavity 200 through the liquid supply port and the supply pipe 140. One end of the supply pipe 140 can be connected to the liquid supply port, and the other end of the supply pipe 140 can be connected to the process cavity 200.

[0027] Specifically, the supply pipeline 140 includes a second pipeline body 142 and a supply pump 141 disposed on the second pipeline body 142, so that the mixed cleaning liquid in the supply tank area 113 can be supplied unidirectionally to the process chamber 200 through the supply pipeline 140.

[0028] In some embodiments, the volume of the supply tank 113 is larger than the volume of each overflow tank 112, so that the supply tank 113 can hold more mixed cleaning fluid, ensuring a continuous supply of mixed cleaning fluid within the supply tank 113. Furthermore, the volume of each overflow tank 112 is smaller, allowing for rapid circulation of the mixed cleaning fluid within the overflow tank 112 and quickly reaching the set temperature required by the process. The set temperature can be a single temperature value or a temperature range.

[0029] In practice, the volumes of the overflow trough areas 112 can be the same or different. For example, each overflow trough area 112 may have the same volume, while the volume ratio between each overflow trough area 112 and the supply trough area 113 can be 1.5:6. Of course, this volume ratio can be adjusted according to actual needs.

[0030] The circulating heating device 130 is connected to M overflow tank areas 112 and is used to circulate and heat the mixed cleaning solution in the M overflow tank areas 112 and the supply tank area 113, so that the mixed cleaning solution overflowing into the supply tank area 113 can reach the set temperature required by the process. Furthermore, the circulating heating device 130 can also be connected to both the M overflow tank areas 112 and the supply tank area 113 simultaneously, thereby circulating and heating the mixed cleaning solution in each overflow tank area 112 and the mixed cleaning solution in each supply tank area 113, improving heating efficiency.

[0031] In some implementations, the circulating heating device 130 includes a return pipe 135 and a heater 132. The supply tank 113 and the M overflow tanks 112 are all connected to the input tank (the overflow tank 112) via the return pipe 135. Thus, the mixed cleaning fluid in each overflow tank 112 and the mixed cleaning fluid in the supply tank 113 can be returned to the input tank via the return pipe 135, allowing the mixed cleaning fluid in each tank to be transferred back to its original tank area, i.e., the input tank. The heater 132 is located in the return pipe 135 to heat the mixed cleaning fluid flowing through it, increasing the path of the mixed cleaning fluid. This ensures that the mixed cleaning fluid in the supply tank 113 and the M overflow tanks 112 is repeatedly circulated, heated, and transferred, thereby maintaining the temperature of the mixed cleaning fluid in the supply tank 113 at the set temperature required by the process.

[0032] Specifically, for each overflow tank area 112, the bottom of the overflow tank area 112 is connected to a return inlet of the return pipe 135, and the return outlet of the return pipe 135 is connected to the side wall of the input tank area. The bottom of the supply tank area 113 is also connected to a return inlet of the return pipe 135.

[0033] To ensure timely replenishment of the solution required for forming the mixed cleaning fluid in the mixing tank 110, the wafer cleaning fluid supply device 100 may further include a level sensor 111 and a concentration controller 139. The concentration controller 139 is electrically connected to the level sensor 111 and also electrically connected to the flow meter 121 of each storage tank 120. The level sensor 111 is located within the input tank area, specifically at a position corresponding to the height of the tank opening. The level sensor 111 detects the actual liquid level in the input tank area. The concentration controller 139 controls the flow meter 121 of each storage tank 120 based on the actual liquid level detected by the level sensor 111, thereby controlling the amount of liquid supplied from the corresponding storage tank 120 to the input tank area.

[0034] Specifically, the concentration controller 139 determines whether the actual liquid level of the mixed cleaning fluid in the input tank area is lower than the set liquid level. If so, the concentration controller 139 synchronously controls the flow meter 121 of each storage tank 120 to increase the supply of each type of liquid from each storage tank 120 to the input tank area of ​​the mixing tank 110, thereby maintaining the supply of mixed cleaning fluid from the mixing tank 110 to the process chamber 200.

[0035] In order to maintain the concentration of the mixed cleaning solution supplied from the mixing tank 110 to the process chamber 200 within the target concentration range, the wafer cleaning solution supply device 100 may further include: a concentration meter 134 disposed in the return pipe 135, a concentration controller 139 electrically connected to the concentration meter 134, the concentration meter 134 being used to detect the concentration data of the mixed cleaning solution flowing through the return pipe 135; the concentration controller 139 being used to control the supply amount of solution from the corresponding storage tank 120 to the input tank area based on the concentration data detected by the concentration meter 134, thereby adjusting the concentration of the mixed cleaning solution so that the mixed cleaning solution finally supplied to the tank area 113 meets the target concentration range.

[0036] Specifically, the concentration data can include the concentration of each solute in the mixed cleaning solution. The flow meter 121 of the corresponding storage tank 120 is then adjusted according to the concentration of each solute in the mixed cleaning solution to change the concentration of various components in the mixed cleaning solution.

[0037] In order to accurately control the temperature of the mixed cleaning solution in the supply tank 113 to meet the set temperature required by the process, the wafer cleaning solution supply device 100 may further include: a first temperature sensor 137, a second temperature sensor 138, and a temperature controller 136, wherein the first temperature sensor 137 and the second temperature sensor 138 are both electrically connected to the temperature controller 136.

[0038] The first temperature sensor 137 is disposed in the supply tank area 113 and is used to detect the temperature of the mixed cleaning liquid in the supply tank area 113; the second temperature sensor 138 is disposed at the output end of the heater 132 and is used to detect the temperature of the mixed cleaning liquid after heating; the temperature controller 136 is used to control the heating temperature of the heater 132 according to the temperature detected by the first temperature sensor 137 and the temperature detected by the second temperature sensor 138.

[0039] Specifically, the temperature difference between the two locations can be calculated based on the temperature detected by the second temperature sensor 138 and the temperature detected by the first temperature sensor 137. The heating temperature of the heater 132 can then be set based on the temperature difference value, thereby controlling the heating temperature of the heater 132.

[0040] For example, the target concentration range of the mixed cleaning solution required for wafer processing is a mass ratio of NH4OH:H2O2:DIW of 1:4:50, with a set temperature of 50°C. The concentration meter 134 on the return pipe 135 detects the concentration data of the mixed cleaning solution (containing NH4OH, H2O2, and DIW) flowing through the return pipe 135 and feeds this data back to the concentration controller 139. The concentration controller 139 adjusts the flow meter 121 of the corresponding storage tank 120 based on the difference between the concentration data fed back by the concentration meter 134 and the 1:4:50 ratio, thereby changing the ratio between the different components in the mixed cleaning solution to achieve the required mass ratio of 1:4:50. The temperature controller 136 calculates the temperature difference value based on the temperature ranges of the first temperature sensor 137 and the second temperature sensor 138, and resets the heating temperature of the heater 132 based on the temperature difference value to maintain the temperature in the supply tank area 113 at approximately 50°C.

[0041] It should be noted that the temperature controller 136 and the concentration controller 139 can be the same controller or independent controllers.

[0042] Furthermore, in order to improve the quality of the mixed cleaning solution supplied to the process chamber 200, the wafer cleaning solution supply device 100 may also include a filter 133 disposed in the return pipe 135 for filtering the mixed cleaning solution flowing through the return pipe 135, thereby filtering out particulate impurities in the mixed cleaning solution and ensuring the quality of the mixed cleaning solution.

[0043] Specifically, the return pipe 135 includes a first pipe body and a return pump 131. The first pipe body connects each overflow tank area 112 to the input tank area. The return pump 131 is connected to the first pipe body and is used to unidirectionally deliver the mixed cleaning solution in each overflow tank area 112 to the input tank area. It can also unidirectionally deliver the mixed cleaning solution in the supply tank to the input tank area.

[0044] refer to Figure 1 Specifically, the mixed cleaning solution in the input tank ①, intermediate tank ②, and supply tank 113 sequentially passes through the return pump 131, heater 132, and filter 133 on the return pipe 135, returning to the input tank ①. This continuously transfers the mixed cleaning solution back to its initial position, achieving cyclic heating and filtration during the transfer process. During this circulation, the amount of mixed cleaning solution in the input tank ① gradually increases, overflowing into the intermediate tank ②. Similarly, the amount of mixed cleaning solution in the intermediate tank ② gradually increases, overflowing again into the supply tank 113. It can be seen that the input tank ①, intermediate tank ②, and supply tank 113 are continuously circulated by the return pump 131, causing it to overflow and be transferred back. This cyclical transfer process ensures that the mixed cleaning solution in the supply tank 113 is maintained at the set temperature required by the process.

[0045] Secondly, embodiments of the present invention provide a wafer cleaning apparatus, with reference to... Figures 1-3 As shown, the device includes: at least one process chamber 200 for processing wafers, and a wafer cleaning solution supply device 100 according to any embodiment of the first aspect. Specific implementation details of the wafer cleaning solution supply device 100 are referred to in the first aspect. For the sake of brevity, the contents of this disclosure will not be repeated. The wafer cleaning solution supply device 100 is used to supply a mixed cleaning solution to the process chamber 200.

[0046] The present invention provides one or more technical solutions, wherein the mixing tank is divided into M sequentially adjacent overflow tank areas and supply tank areas, where M is an integer greater than 1. The supply tank area is used to receive the mixed cleaning liquid overflowing from the M overflow tank areas sequentially and supply it outward. Since the height of the openings of the M overflow tank areas and the supply tank area decreases sequentially towards the supply tank area, and the circulating heating device is connected to the M overflow tank areas, the mixed cleaning liquid in the mixing tank can overflow and transfer sequentially from the M overflow tank areas. During the transfer process, the mixed cleaning liquid in each overflow tank area is circulated and heated by the circulating heating device. Therefore, the mixed cleaning liquid can be heated multiple times during the transfer process in each overflow tank area, so that the mixed cleaning liquid overflowing into the supply tank area can be maintained at the temperature required by the process. Thus, it is not necessary to set up a spare mixing tank. Therefore, the complexity of the cleaning liquid supply device can be reduced, and it is not necessary to switch between two or more mixing tanks, thereby reducing the control complexity of the cleaning liquid supply device.

[0047] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the invention.

[0048] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A wafer cleaning solution supply device, characterized in that, include: A mixing tank is divided into M sequentially adjacent overflow tank areas and supply tank areas. The height of the openings of the M overflow tank areas and the supply tank areas decreases sequentially along the direction closer to the supply tank area. The supply tank area is used to receive the mixed cleaning liquid that overflows sequentially from the M overflow tank areas and supply it to the outside. The M overflow tank areas include an input tank area and at least one intermediate tank area disposed between the input tank area and the supply tank area, where M is an integer greater than 1. A circulating heating device is connected to the M overflow tank areas and is used to circulate and heat the mixed cleaning liquid in the M overflow tank areas. The circulating heating device includes a return pipe and a heater. The M overflow tank areas are connected to the input tank area through the return pipe. The heater is disposed in the return pipe and is used to heat the mixed cleaning liquid flowing through the return pipe. A first temperature sensor is installed in the supply tank area to detect the temperature of the mixed cleaning solution in the supply tank area; A second temperature sensor is installed at the output end of the heater to detect the temperature of the mixed cleaning solution at the output end. A temperature controller, electrically connected to the first temperature sensor and the second temperature sensor, is used to control the heating temperature of the heater based on the temperature detected by the first temperature sensor and the temperature detected by the second temperature sensor. Multiple liquid storage tanks are used to store and supply the corresponding liquids to the mixing tank.

2. The apparatus as claimed in claim 1, characterized in that, Each of the liquid storage tanks is connected to the input tank area through a corresponding input pipe, and each liquid storage tank is equipped with a flow meter. The device further includes: A liquid level sensor is installed at a position corresponding to the height of the opening of the input tank area to detect the actual liquid level height in the input tank area. A concentration controller, electrically connected to the liquid level sensor and each of the flow meters, is used to control the flow meters of each of the liquid storage tanks according to the actual liquid level height detected by the liquid level sensor, so as to adjust the supply amount of the corresponding liquid from each of the liquid storage tanks to the input tank area.

3. The apparatus as described in claim 2, characterized in that, The device further includes: A concentration meter is installed in the return pipe to detect the concentration data of the mixed cleaning solution flowing through the return pipe; The concentration controller is also connected to the concentration meter, and the concentration controller is used to control the amount of liquid supplied from the corresponding storage tank to the input tank area based on the concentration data detected by the concentration meter.

4. The apparatus as claimed in claim 1, characterized in that, The device further includes: A filter is installed in the return pipe to filter the mixed cleaning solution flowing through the return pipe.

5. The apparatus as described in any one of claims 1-4, characterized in that, The volume of the supply tank area is greater than the volume of each of the M overflow tank areas.

6. The apparatus as claimed in claim 2, characterized in that, The return pipe includes: The first pipe body connects each of the overflow trough areas to the input trough area; A return pump, connected to the first pipeline body, is used to unidirectionally deliver the mixed cleaning fluid from each of the overflow tank areas to the input tank areas.

7. The apparatus as claimed in claim 1, characterized in that, The device further includes: A supply pipe is provided, and a liquid supply port is provided on the outer wall of the mixing tank where the supply tank area is located. The liquid supply port is connected to the supply pipe, and the supply pipe is used to supply the mixed cleaning liquid in the supply tank area to the outside.

8. A wafer cleaning device, characterized in that, include: At least one process chamber for processing wafers, and a wafer cleaning fluid supply device as described in any one of claims 1-7, the wafer cleaning fluid supply device being used to supply a mixed cleaning fluid to the process chamber.

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