Three-dimensional memory structure and manufacturing method thereof, three-dimensional memory and storage system

CN115020423BActive Publication Date: 2026-08-28YANGTZE MEMORY TECH CO LTD
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Patent Information

Application Number
CN202210568892.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-05-24
Publication Date
2026-08-28
Estimated Expiration
2042-05-24

AI Technical Summary

Technical Problem

[0003]但是,随着三维存储器中堆叠层的单层厚度不断减小,如何提高三维存储器的数据保持特性是当前存储器技术中一个相当困扰的问题,急待提出解决该问题的新方法

Benefits of technology

[0030]本申请实施例的有益效果是:本申请实施例提供的三维存储结构及其制作方法、三维存储器及存储系统,通过形成堆叠结构,堆叠结构包括在纵向上多层交替层叠设置的第一材料层和第二材料层,并形成在纵向上贯穿堆叠结构的沟道孔,然后在露出于沟道孔内壁的第一材料层表面上形成第一电荷存储体,并在第一电荷存储体的在纵向上的至少一侧上形成间隔层,之后在沟道孔内壁上于横向上对应于第二材料层的部位形成第二电荷存储体,第二电荷存储体与第一电荷存储体在纵向上被间隔层隔开,从而能够阻止三维存储结构的电荷存储层中电荷沿沟道方向的迁移,提高了三维存储器的数据保持特性。

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Abstract

The application relates to a three-dimensional storage structure and a manufacturing method thereof, a three-dimensional memory and a storage system, which comprises the following steps: forming a stack structure, wherein the stack structure comprises first material layers and second material layers which are alternately arranged in multiple layers in the longitudinal direction; forming a channel hole which penetrates through the stack structure in the longitudinal direction; forming a first charge storage body on the surface of the first material layer exposed to the inner wall of the channel hole; forming a spacing layer on at least one side of the first charge storage body in the longitudinal direction; and forming a second charge storage body on the inner wall of the channel hole in the transverse direction and corresponding to the second material layer, wherein the second charge storage body is separated from the first charge storage body in the longitudinal direction by the spacing layer, so that the migration of charges in the charge storage layer of the three-dimensional storage structure along the channel direction is prevented, and the data retention characteristic of the three-dimensional memory is improved.
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Citation Information

Patent Citations

  • Semiconductor device

    CN112820731A