camera device

Abstract

This disclosure provides a camera device capable of efficiently cooling multiple cooling objects with different permissible temperatures within a single duct, wherein multiple fins connected to multiple cooling objects are arranged within a single duct. The camera device (10) includes: a duct (18a); a fan (52) for generating airflow within the duct (18a); first, second, and third cooling objects (14, 32, 42); a first radiator (28) for absorbing heat from the first cooling object (14) and having a first fin (28b) exposed within the duct (18a); a second radiator (38) for absorbing heat from the second cooling object (32) and having a second fin exposed within the duct (18a); and a third radiator for absorbing heat from the third cooling object and having a third fin exposed within the duct. When viewed in the direction of airflow within the duct, the first, second, and third fins extend in mutually different directions until they approach each other at a given distance relative to other fins.

Description

Technical Field

[0001] This disclosure relates to camera devices. Background Technology

[0002] For example, Patent Document 1 discloses a camera device having a cooling mechanism, which includes a pipe, a fan disposed within the pipe, a radiator for absorbing heat from the object being cooled, and a plurality of fins disposed within the pipe for flowing air and thermally connected to the radiator.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: International Publication No. 2016 / 031369

[0006] However, when there are multiple objects to be cooled, and fins are installed for each object separately, and these fins are arranged in a single duct, it is possible that some objects may be unnecessarily cooled. For example, if one object at its allowable temperature is properly cooled, it may be futile to cool another object that has not reached its allowable temperature. Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] Therefore, the subject of this disclosure is to efficiently cool multiple cooling objects with different permissible temperatures in a camera device in which multiple fins, each thermally connected to multiple cooling objects, are arranged in a single pipe.

[0009] Methods for solving problems

[0010] To address the aforementioned issues, according to one aspect of this disclosure, an imaging device is provided, comprising: a duct for flowing air; a fan for generating airflow within the duct; a first cooling object disposed outside the duct; a first radiator for absorbing heat from the first cooling object and having a plurality of first fins exposed within the duct; a second cooling object disposed outside the duct; a second radiator for absorbing heat from the second cooling object and having a plurality of second fins exposed within the duct; a third cooling object disposed outside the duct; and a third radiator for absorbing heat from the third cooling object and having a plurality of third fins exposed within the duct, wherein, when viewed in the direction of airflow within the duct, the first, second, and third fins each extend in mutually different directions until they approach each other at a given distance relative to the other fins.

[0011] Invention Effects

[0012] According to this disclosure, a camera device in which multiple fins, each thermally connected to multiple cooling objects, are arranged in a single pipe can efficiently cool multiple cooling objects with different permissible temperatures. Attached Figure Description

[0013] Figure 1 This is a perspective view of a camera device according to one embodiment of the present disclosure.

[0014] Figure 2 It is a perspective view of a sub-component of the camera device, including components related to cooling.

[0015] Figure 3 yes Figure 2 The exploded 3D view of the sub-components shown.

[0016] Figure 4 This is a 3D exploded view of the camera unit.

[0017] Figure 5 It is a decomposed stereoscopic view of the image processing unit.

[0018] Figure 6 It is a decomposed stereoscopic view of the write cell.

[0019] Figure 7 This is a cross-sectional view showing the camera device used to capture images of the pipeline.

[0020] Figure 8 This is a diagram showing the fin layout inside the pipe.

[0021] Figure 9 The main frame is omitted. Figure 2 The 3D view of the sub-components shown.

[0022] Figure 10 This is a diagram showing the fin surface area determination table used to determine the fin surface area.

[0023] Figure 11 It is shown that... Figure 8 The corresponding fin surface area is determined by the diagram in the table.

[0024] Figure 12 This is a diagram illustrating the fin layout within a pipe in a camera device according to another embodiment.

[0025] Figure 13 It is shown that... Figure 12 The corresponding fin surface area is determined by the diagram in the table.

[0026] Figure 14 This is a diagram illustrating the fin layout within a pipe in a camera device according to different implementations.

[0027] Figure 15 It is shown that... Figure 14 The corresponding fin surface area is determined by the diagram in the table.

[0028] Symbol Explanation

[0029] 10 Camera devices

[0030] 14. First cooling object (camera element);

[0031] 18a Pipeline;

[0032] 28. First radiator (radiator);

[0033] 28b First fin (fin);

[0034] 32. Second cooling target (IC chip);

[0035] 38. Second radiator (radiator);

[0036] 38b Second fin (fin);

[0037] 42. Third cooling object (connector);

[0038] 48. The third radiator (radiator);

[0039] 48b Third fin (fin). Detailed Implementation

[0040] Hereinafter, embodiments will be described in detail with appropriate reference to the accompanying drawings. However, sometimes unnecessary details will be omitted. For example, detailed descriptions of matters that are already widely known, or repetitive descriptions of substantially the same structures, will be omitted. This is to avoid making the following description unnecessarily lengthy and to facilitate understanding by those skilled in the art.

[0041] Furthermore, the inventors have provided the accompanying drawings and the following description in order to enable those skilled in the art to fully understand this disclosure, but these are not intended to limit the subject matter described in the claims.

[0042] The following is a reference to the appendix. Figure 1 The following describes the camera device according to the embodiments of this disclosure.

[0043] Figure 1 This is a perspective view of a camera device according to one embodiment of the present disclosure. Furthermore, Figure 2 This is a perspective view of a sub-assembly of the imaging device, including components related to cooling. Furthermore, Figure 3 yes Figure 2 The exploded 3D view of the sub-components shown.

[0044] Furthermore, the XYZ coordinate system shown in the figure is used to facilitate understanding of this disclosure and is not intended to limit this disclosure. The X-axis direction represents the front-to-back direction of the camera device, the Y-axis direction represents the left-to-right direction of the camera device, and the Z-axis direction represents the height direction. In addition, in this specification, the side of the camera device where the subject is located is designated as the "front side", and the side of the camera device relative to the subject is designated as the "rear side".

[0045] like Figure 1 As shown, in this embodiment, the imaging device 10 has a generally cubical-shaped body 12 and an imaging element (first cooling object) 14 disposed therein. The imaging element 14 is, for example, a CCD image sensor, a CMOS image sensor, etc., and since it generates heat during operation, it needs to be cooled in order to maintain its temperature within an allowable range. Light (the image of the subject) passing through a lens (not shown) mounted on the lens mounting portion 16 is incident on the light-receiving surface 14a of the imaging element 14. The imaging element 14 outputs an electrical signal corresponding to the incident image, that is, it performs imaging (capturing still images or videos).

[0046] like Figure 2 as well as Figure 3 As shown, the camera device 10 also has a main frame 18 disposed within the body 12. The main frame 18 supports the camera unit 20, the image processing unit 22, and the writing unit 24.

[0047] Figure 4 This is a 3D exploded view of the camera unit.

[0048] like Figure 4 As shown, the camera unit 20 includes a camera element 14, a heat sink 26 supporting the camera element 14 and absorbing heat, and a heat sink (first heat sink) 28 mounted on the heat sink 26. The camera element 14 is mounted on a substrate 30, which is supported by the heat sink 26. The substrate 30 is provided with circuitry for processing signals from the camera element 14 and transmitting them to the image processing unit 22. Furthermore, a through-hole 30a is formed in the substrate 30. Through this through-hole 30a, a protrusion 26a provided on the heat sink 26 can directly contact the camera element 14. As a result, the heat sink 26 can efficiently absorb heat from the camera element 14 to cool it.

[0049] The heat sink 28 is made of a metal material such as aluminum with high thermal conductivity, and has a base portion 28a mounted on the heat sink 26 and a plurality of fins (first fins) 28b extending parallel to each other from the base portion 28a. In this embodiment, the heat sink 28 absorbs heat from the imaging element 14 via the heat sink 26. Details will be described later. The plurality of fins 28b of the heat sink 28 are cooled by air flowing within the ducts of the main frame 18.

[0050] Figure 5 It is a decomposed stereoscopic view of the image processing unit.

[0051] like Figure 5 As shown, the image processing unit 22 includes multiple IC chips (second cooling objects) 32 that process images captured by the imaging element 14, a substrate 34 on which the IC chips 32 are mounted, a heat sink 36 that absorbs heat from the IC chips 32, and a heat sink (second heat sink) 38 mounted on the heat sink 36. The IC chips 32 generate heat during operation, and therefore require cooling to maintain their temperature within an allowable range. The heat sink 36 contacts the multiple IC chips 32 via thermally conductive sheets 40. As a result, the heat sink 36 is able to absorb and cool the multiple IC chips 32.

[0052] The heat sink 38 is made of a metal material such as aluminum with high thermal conductivity, and has a base portion 38a mounted on the heat sink 36 and a plurality of fins (second fins) 38b extending parallel to each other from the base portion 38a. In this embodiment, the heat sink 38 absorbs heat from a plurality of IC chips 32 via the heat sink 36. Details will be described later. The plurality of fins 38b of the heat sink 38 are cooled by air flowing within the pipes of the main frame 18.

[0053] Figure 6 It is a decomposed stereoscopic view of the write cell.

[0054] like Figure 6 As shown, the writing unit 24 includes multiple connectors (third cooling objects) 42 into which recording media M1 and M2, which record images processed by IC chip 32, are respectively inserted; a substrate 44 on which the connectors 42 are mounted; a heat sink 46 for absorbing heat from the connectors 42; and a heat sink (third heat sink) 48 mounted on the heat sink 46. The connectors 42 are generally composed of a portion of a substrate 44 having terminals (not shown) electrically connected to the terminals of the recording media M1 and M2, and a connector frame 42a covering a portion of the substrate 44 and maintaining contact between the terminals on the substrate 44 and the terminals of the recording media M1 and M2. The connectors 42 themselves do not generate heat, but the recording media M1 and M2 inserted into the connectors 42 generate heat during writing. To maintain the recording media M1 and M2 at an appropriate temperature, cooling is required via the connectors 42. That is, since the recording media M1 and M2 cannot be directly cooled during writing, the recording media M1 and M2 are indirectly cooled by directly cooling the connectors 42. In addition, the recording media M1 and M2 are, for example, Cfexpress cards.

[0055] The heat sink 46 absorbs heat from a portion of the substrate 44 included in the connector 42 via the heat-conducting plate 50. As a result, the heat sink 46 is able to cool the recording media M1 and M2 inserted into the connector 42. In addition, the heat sink 46 can also cool the recording media M1 and M2 by absorbing heat from the connector frame 42a of the connector 42.

[0056] The heat sink 48 is made of a metal material such as aluminum with high thermal conductivity, and has a base portion 48a mounted on the heat sink 46 and a plurality of fins (third fins) 48b extending parallel to each other from the base portion 48a. In this embodiment, the heat sink 48 absorbs heat from a portion of the substrate 44 included in the plurality of connectors 42 via the heat sink 46. Details will be described later. The plurality of fins 48b of the heat sink 48 are cooled by air flowing within the ducts of the main frame 18.

[0057] As described above, the multiple fins 28b of the heat sink 28 of the camera unit 20, the multiple fins 38b of the heat sink 38 of the image processing unit 22, and the multiple fins 48b of the heat sink 48 of the writing unit 24 are cooled by air flowing within the pipes of the main frame 18.

[0058] Figure 7 This is a cross-sectional view showing the camera device used to monitor the pipeline. Furthermore, Figure 8 It is a diagram showing the fin layout inside the pipe. Furthermore, Figure 9 The frame is omitted. Figure 2 The 3D view of the sub-components shown.

[0059] like Figure 7 As shown, the main frame 18 of the camera device 10 includes a duct 18a for airflow (dashed arrow). Figure 1 As shown, air flows into the pipe 18a through the air intake 12b formed on the right side 12a of the dish body 12. The external gas flowing into the pipe 18a flows out to the outside of the dish body 12 through the exhaust port 12c.

[0060] like Figure 7 As shown, a fan 52 is disposed inside the duct 18a of the main frame 18. By rotating the fan 52, air flows into the duct 18a through the air intake 12b, and the air in the duct 18a flows out to the outside of the body 12 through the exhaust port 12c.

[0061] like Figure 8As shown, the imaging element 14 of the imaging unit 20, the IC chip 32 of the image processing unit 22, and the connector 42 of the writing unit 24 are located outside the conduit 18a. Multiple fins 28b of the heat sink 28 of the imaging unit 20, multiple fins 38b of the heat sink 38 of the image processing unit 22, and multiple fins 48b of the heat sink 48 of the writing unit 24, which absorb their heat, are exposed inside the conduit 18a. Therefore, as... Figure 7 As shown, in pipe 18a, the through hole 18b through which the radiator 28 passes, the through hole 18c through which the radiator 38 passes, and the through hole (not shown) through which the radiator 48 passes are connected in a connected manner.

[0062] In this embodiment, such as Figure 8 As shown, the pipe 18a has a rectangular flow path cross-section. In addition, the camera unit 20 (camera element 14) and the writing unit 24 (connector 42) are supported by the main frame 18 in a manner that sandwiches the pipe 18a and faces each other.

[0063] like Figure 8 As shown, when viewed in the direction of airflow (Z-axis direction) within the pipe 18a, the plurality of fins 28b of the radiator 28, the plurality of fins 38b of the radiator 38, and the plurality of fins 48b of the radiator 48 each extend in different directions. In this embodiment, the plurality of fins 28 and 48b extend in the front-back direction (X-axis direction) of the imaging device 10, and the plurality of fins 38b extend in the left-right direction (Y-axis direction) of the imaging device 10.

[0064] Furthermore, the plurality of fins 28b of radiator 28, the plurality of fins 38b of radiator 38, and the plurality of fins 48b of radiator 48 each extend to approach each other at a given distance relative to the other fins. The given distance is a distance at which no heat transfer occurs between different fins (i.e., between fins 28b and 38b, between fins 38b and 48b, and between fins 48b and 28b). For example, the given distance is wider than a value that would cause interference (contact) due to manufacturing deviations and smaller than the spacing of fins 28b, 38b, and 48b, for example, 0.5 to 3.1 mm.

[0065] Furthermore, in this embodiment, such as Figure 9 As shown, the multiple fins 28b of radiator 28, the multiple fins 38b of radiator 38, and the multiple fins 48b of radiator 48 are positioned in the same direction (Z-axis direction) of airflow within pipe 18a. Furthermore, they have the same dimensions in the flow direction.

[0066] Based on such fins 28b, 38b, and 48b, such as Figure 8As shown, within the entire duct 18a, fins 28b, 38b, and 48b are arranged closely without contacting each other. As a result, the distribution of flow path resistance throughout the duct 18a is set to be uniform. Furthermore, fins 28b, 38b, and 48b are arranged side-by-side relative to the airflow direction (Z-axis direction) within the duct 18a. As a result, air at substantially the same temperature contacts fins 28b, 38b, and 48b. In contrast, when fins 28b, 38b, and 48b are arranged longitudinally along the flow direction, air heated by the upstream fins comes into contact with the downstream fins. As a result, the cooling efficiency of the radiator with the downstream fins decreases.

[0067] These fins 28b, 38b, and 48b are cooled by air under substantially the same conditions and are not thermally connected to each other. That is, fins 28b, 38b, and 48b are not substantially affected by heat from other fins, and are therefore substantially independent of each other in terms of heat. Therefore, the extension length and number of fins 28b, 38b, and 48b can be set based on the heat generated by the camera element 14 of the camera unit 20, the IC chip 32 of the image processing unit 22, and the connector 42 of the writing unit 24.

[0068] The heat generated by the camera element 14 and IC chip 32 is determined by imaging conditions such as image resolution, video resolution, and frame rate, and can be predetermined through experiments. The heat generated by the connector 42 is determined by recording conditions such as the type of data recorded (e.g., image or video file type) and recording format (e.g., relay recording, backup recording), and can be predetermined through experiments. Furthermore, relay recording is a recording format where data is initially recorded on recording medium M1, and if the capacity of recording medium M1 is full, recording begins on recording medium M2. Additionally, backup recording is a recording format where the same data is recorded on multiple recording media M1 and M2.

[0069] Before setting the extension length and number of fins of the multiple fins 28b of radiator 28, the multiple fins 38b of radiator 38, and the multiple fins 48b of radiator 48, the surface area of ​​each fin is first determined.

[0070] Figure 10 A fin surface area determination table is shown.

[0071] like Figure 10As shown, the fin surface area is determined based on the heat and permissible temperature of each of the multiple cooling objects. First, data on the heat and permissible temperature of each of the multiple cooling objects are acquired and their values ​​are compared. In this embodiment, the multiple cooling objects include an image sensor 14, an IC chip 32, and a connector 42. The heat that the image sensor 14, the IC chip 32, and the connector 42 can retain and the permissible temperature (permissible temperature range) for normal operation are acquired. Then, the acquired heat and permissible temperature are compared.

[0072] In this embodiment, regarding heat generation, IC chip 32 has the highest heat output, while connector 42 has the lowest. Regarding permissible temperature, IC chip 32 has the highest permissible temperature, while camera element 14 has the lowest. That is, Figure 10 In the diagram, cooling objects X1 and Y1 are equivalent to IC chip 32, cooling objects X2 and Y3 are equivalent to camera element 1, and cooling objects X3 and Y2 are equivalent to connector 42.

[0073] Figure 11 It shows the relationship with Figure 8 The corresponding fin surface area determination table.

[0074] If in Figure 10 Substituting the camera element 14, IC chip 32, and connector 42 into X1~X3 and Y1~Y3 as shown, we obtain Figure 11 The table shown determines the fin surface area. According to this table, the fin 28b of the heat sink 28 corresponding to the camera element 14 has the largest surface area, while the fin 48b of the heat sink 48 corresponding to the connector 42 has the smallest surface area. Based on these determined relationships of fin surface areas, the extension length and number of fins for fins 28b, 38b, and 48b are determined. Furthermore, the size of the fin surface area indicates the priority of cooling.

[0075] As a result of comparing the size of the fin surface area, such as Figure 8 As shown, the average extension length (dimension in the X-axis direction) of the plurality of fins 28b of the heat sink 28 that absorbs heat from the imaging element 14 is greater than the average extension length (dimension in the Y-axis direction) of the plurality of fins 38b of the other heat sink 38. Furthermore, the number of fins in the plurality of fins 28b of the heat sink 28 is greater than the number of fins in the plurality of fins 38b, 48b of the other heat sinks 38, 48.

[0076] Thus, the fins 28b of the heat sink 28, which has the highest priority for absorbing and cooling the heat of the imaging element 14, have the largest surface area, and therefore their average extension length is greater than that of the fins of other heat sinks, and their number of fins is greater than that of the fins of other heat sinks. As a result, the heat sink 28 can reliably cool the imaging element 14, which has the highest priority for cooling.

[0077] Furthermore, the fins 48b of the heat sink 48 of the connector 42, which has the lowest priority for absorbing heat, have the smallest surface area, and therefore have fewer fins than the other fins 28b and 38b. However, the extension length and number of fins of the multiple fins 48b are set to the extension length and number of fins required for cooling the connector 42. That is, the multiple fins 48b have the minimum required surface area.

[0078] Furthermore, the average extension length and number of fins of the multiple fins 28b, 38b and 48b of the radiators 28, 38 and 48 are determined under the condition that the fan 52 rotates at a speed that allows for permissible wind noise.

[0079] According to this embodiment as described above, in an imaging device 10 in which multiple fins 28b, 38b, and 48b, which are respectively thermally connected to the imaging element 14, IC chip 32, and connector 42 as multiple cooling objects, are arranged in a pipe 18a, it is possible to efficiently cool the imaging element 14, IC chip 32, and connector 42, which are allowed to have different temperatures.

[0080] That is, fins 28b, 38b and 48b are thermally independent, so we only need to study their average extension length and number of fins, in other words, we only need to study their total surface area.

[0081] Furthermore, it's possible that if the average extension length and number of fins of one heatsink are set to the desired values, then the average extension length and number of fins of other heatsinks cannot be set to the desired values. In this case, by increasing the speed of fan 52, the average extension length and number of fins of one heatsink can be set to a lower value. As a result, the average extension length and number of fins of other heatsinks can be set to the desired values.

[0082] The above examples illustrate the embodiments of this disclosure, but the embodiments of this disclosure are not limited to the above-described embodiments.

[0083] For example, in the above-described embodiments, among the camera element 14, IC chip 32, and connector 42, the cooling priority of the camera element 14 is the highest, and the cooling priority of the connector 42 is the lowest. However, the embodiments of this disclosure are not limited thereto.

[0084] Figure 12 This is a diagram illustrating the fin layout within a pipe in a camera device according to another embodiment. Furthermore, Figure 13 It is shown that... Figure 12The corresponding fin surface area is determined by the diagram in the table. Furthermore, Figure 14 This is a diagram illustrating the fin layout within the pipe of a camera device according to different embodiments. Furthermore, Figure 15 It is shown that... Figure 14 The corresponding fin surface area is determined by the diagram in the table.

[0085] exist Figure 12 In the alternative embodiment of the imaging device 110 shown, such as Figure 13 As shown, among the camera element 14, IC chip 32, and connector 42, the cooling priority of IC chip 32 is the highest, and the cooling priority of connector 42 is the lowest. Therefore, the fin surface area of ​​the heat sink 138 corresponding to IC chip 32 is the largest, and the fin area of ​​the heat sink 148 corresponding to connector 42 is the smallest. As a result, the number of fins 138b of heat sink 138 is greater than the number of fins 128b and 148b of heat sinks 128 and 148, respectively.

[0086] exist Figure 14 The different embodiments shown involve the camera device 210, such as Figure 15 As shown, among the camera element 14, IC chip 32, and connector 42, the cooling priority of connector 42 is the highest, and the cooling priority of camera element 14 is the lowest. Therefore, the fin surface area of ​​heat sink 248 corresponding to connector 42 is the largest, and the fin surface area of ​​heat sink 228 corresponding to camera element 14 is the smallest. As a result, the average extension length (dimension in the X-axis direction) of the plurality of fins 248b of heat sink 248 is larger than the average extension length of the plurality of fins 128b and 138b of other heat sinks 128 and 138. Furthermore, the plurality of fins 248b of heat sink 248 extend beyond half of the conduit 18a.

[0087] Furthermore, in the case of the above-described implementation, such as Figure 9 As shown, the dimensions of the plurality of fins 28b, 38b, and 48b in the airflow direction (Z-axis direction) are set to be the same, and their positions in the airflow direction are set to be the same. However, the embodiments of this disclosure are not limited to this. The dimensions in the airflow direction may also be different. However, in this case, in addition to the average extension length of the fins and the number of fins, the dimensions in the airflow direction also need to be considered when studying the fin layout. Furthermore, when the positions in the airflow direction are different, one fin may be slightly affected by the thermal aspects of other fins. That is, a portion of the air heated by the upstream fins may come into contact with the downstream fins.

[0088] Furthermore, in the above-described implementation, such as Figure 8As shown, pipe 18a has a rectangular flow path cross-section. However, the embodiments of this disclosure are not limited to this. The flow path cross-section of pipe 18a may also be a shape other than rectangular, such as triangular.

[0089] Furthermore, in the case of the above-described embodiments, such as Figure 8 As shown, the camera element 14, IC chip 32, and connector 42 are provided as multiple cooling objects, and heat sinks 28, 38, and 48 are respectively provided thereon. However, the embodiments of this disclosure are not limited to this. It is also possible that a battery is provided as a fourth cooling object or as an alternative cooling object, and a heat sink is provided for the battery.

[0090] That is, the imaging device according to the embodiments of this disclosure broadly includes: a duct for flowing air; a fan for generating airflow within the duct; a first cooling object disposed outside the duct; a first radiator for absorbing heat from the first cooling object and having a plurality of first fins exposed within the duct; a second cooling object disposed outside the duct; a second radiator for absorbing heat from the second cooling object and having a plurality of second fins exposed within the duct; a third cooling object disposed outside the duct; and a third radiator for absorbing heat from the third cooling object and having a plurality of third fins exposed within the duct. When viewed in the direction of airflow within the duct, the first, second, and third fins each extend in different directions until they approach each other at a given distance from the other fins.

[0091] As described above, the embodiments described herein are illustrated as examples of the technology in this disclosure. Drawings and detailed descriptions are provided for this purpose. Therefore, the constituent elements described in the drawings and detailed descriptions include not only those necessary to solve the problem, but also those not necessary to solve the problem, in order to illustrate the technology described above. Therefore, these unnecessary constituent elements should not be automatically considered necessary simply because they are described in the drawings and detailed descriptions.

[0092] Furthermore, the above-described embodiments are used to illustrate the technology in this disclosure, so various changes, substitutions, additions, omissions, etc., can be made within the scope of the claim or its equivalents.

[0093] Industrial availability

[0094] This disclosure can be applied to camera devices that have multiple objects to be cooled and that use fins to cool these objects.

Claims

1. A camera device, comprising: Pipes, for flowing air; A fan causes air to flow within the duct. The first cooling object is located outside the pipe; The first radiator absorbs heat from the first object to be cooled and has a plurality of first fins exposed inside the pipe; The second cooling object is located outside the pipe; The second radiator absorbs heat from the second object being cooled and has a plurality of second fins exposed inside the pipe; The third cooling object is located outside the pipe; The third radiator absorbs heat from the third object being cooled and has a plurality of third fins exposed inside the pipe. When viewed in the direction of airflow within the duct, the first, second, and third fins each extend in a different direction until they approach each other at a given distance relative to the other fins. The given distance is the distance at which the first fin, the second fin, and the third fin do not contact each other, and is a distance smaller than the fin spacing of each of the plurality of first fins, the plurality of second fins, and the plurality of third fins.

2. The camera device according to claim 1, wherein, The first fin, the second fin, and the third fin are positioned at the same location in the flow direction.

3. The camera device according to claim 1, wherein, The first fin, the second fin, and the third fin have the same dimensions in the flow direction.

4. The camera device according to claim 1, wherein, The surface area of ​​each of the first fin, the second fin, and the third fin is determined based at least on the heat of each of the first, second, and third cooling objects.

5. The camera device according to claim 4, wherein, The surface area of ​​each of the first fin, the second fin, and the third fin is determined based on the heat and allowable temperature of the first, second, and third cooling objects.

6. The camera device according to claim 4, wherein, Based on the surface area of ​​the fins, the extension length and number of fins of the first fin, the second fin, and the third fin are determined.

7. The camera device according to claim 4, wherein, The radiator, which absorbs heat from the object being cooled with the greatest heat, has multiple fins that extend beyond half of the duct.

8. The camera device according to claim 1, wherein, The flow path profile of the pipe is rectangular. Any two of the first, second, and third cooling objects are positioned opposite each other, sandwiching the pipe.

9. The camera device according to claim 1, wherein, The first object to be cooled is the camera element. The second cooling target is the IC chip that processes the images captured by the imaging element. The third cooling object is a connector that is inserted into a storage medium for recording images processed by the IC chip.

Images