Positioning device

Abstract

The present invention provides a positioning device, comprising: a first positioning module arranged to support and position a first substrate; a second positioning module arranged to support and position a second substrate; a first positioning field in which two positioning modules can be alternately positioned to execute a first processing sequence; and a second positioning field in which two positioning modules can be alternately positioned to execute a second processing sequence, wherein when one of the two positioning modules is executing or completing the first processing sequence, the other positioning module has completed the second processing sequence and is being positioned closer to one of the two positioning modules.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to EP / US application 20154103.4, filed January 28, 2020, which is incorporated herein by reference in its entirety. Technical Field

[0003] This invention relates to a positioning device and a method of using the positioning device. Background Technology

[0004] A lithography apparatus is a machine configured to apply a desired pattern onto a substrate. Lithography apparatus can be used, for example, in the manufacture of integrated circuits (ICs). A lithography apparatus can project a pattern (often referred to as a “design layout” or “design”) from a patterning apparatus (e.g., a mask) onto a layer of radiation-sensitive material (resist) provided on a substrate (e.g., a wafer).

[0005] As semiconductor manufacturing processes continue to advance, the size of circuit components continues to shrink, while the number of functional elements (such as transistors) in each device has steadily increased over decades, exhibiting a trend commonly known as "Moore's Law." To align with Moore's Law, the semiconductor industry is pursuing technologies capable of producing even smaller features. To project patterns onto a substrate, photolithography equipment uses electromagnetic radiation. The wavelength of this radiation determines the minimum size of the feature that can be patterned on the substrate. Typical wavelengths currently used are 365 nm (i-line), 248 nm, 193 nm, and 13.5 nm. Compared to photolithography equipment using radiation with a wavelength of, for example, 193 nm, photolithography equipment using extreme ultraviolet (EUV) radiation in the range of 4 nm to 20 nm, such as 6.7 nm or 13.5 nm, can be used to form even smaller features on the substrate.

[0006] In known embodiments of lithography equipment, the equipment includes a first positioning module for supporting and positioning a first substrate, and a second positioning module for supporting and positioning a second substrate. This type of lithography equipment is commonly referred to as a dual-stage lithography equipment.

[0007] The advantage of this dual-stage lithography equipment is that the first positioning module can be arranged in a first positioning field, cooperating with one or more first processing devices, while the second positioning module can be arranged in a second positioning field, cooperating with one or more second processing devices. For example, the first positioning field is an exposure field, in which a first substrate is exposed to a patterned radiation beam, and the second positioning field is a measurement field, in which the upper surface of the second substrate is measured by a horizontal sensor.

[0008] In this photolithography apparatus, each substrate to be processed is first placed in a measurement field, and then in an exposure field. In both the measurement and exposure fields, the substrates are supported by the same positioning modules. After processing of the substrates supported by the first and second positioning modules is completed, the first and second positioning modules can exchange positions; for example, the second positioning module moves to the first positioning field, and the first positioning module moves to the second positioning field.

[0009] Simultaneous processing of two substrates on two positioning modules alternately arranged in the first and second positioning fields significantly improves the time-efficient use of the projection system of the lithography equipment.

[0010] However, there remains an overall need to use lithography equipment as efficiently as possible. Summary of the Invention

[0011] One object of the present invention is to provide a positioning device that can improve the efficiency of the use of two positioning modules of a positioning device, such as a positioning device for a lithography equipment.

[0012] According to one aspect of the present invention, a positioning device is provided, comprising: a first positioning module arranged to support and position a first substrate; a second positioning module arranged to support and position a second substrate; a first positioning field in which two positioning modules can be alternately positioned to perform a first processing sequence; and a second positioning field in which two positioning modules can be alternately positioned to perform a second processing sequence, wherein when one of the two positioning modules is performing or completing the first processing sequence, the other positioning module has completed the second processing sequence and is positioned (or, in the process of, positioning) closer to one of the two positioning modules. Alternatively or additionally, wherein when one of the two positioning modules is performing or completing the final step of the first processing sequence, the other positioning module has completed the second processing sequence and is positioned (or, in the process of, positioning) closer to one of the two positioning modules.

[0013] According to one aspect of the present invention, a method of using a positioning device is provided. The positioning device includes: a first positioning module arranged to support and position a first substrate; a second positioning module arranged to support and position a second substrate; a first positioning field in which two positioning modules can be alternately positioned to perform a first processing sequence; and a second positioning field in which two positioning modules can be alternately positioned to perform a second processing sequence, wherein when one of the two positioning modules is performing or completing the first processing sequence, the other positioning module has completed the second processing sequence and is positioned (alternatively: being positioned) closer to one of the two positioning modules. Alternatively or additionally, wherein when one of the two positioning modules is performing or completing the final step of the first processing sequence, the other positioning module has completed the second processing sequence and is positioned (alternatively: being positioned) closer to one of the two positioning modules. Attached Figure Description

[0014] Embodiments of the present invention will now be described by way of example only, with reference to the accompanying drawings. In the schematic drawings:

[0015] — Figure 1 A schematic overview of the photolithography equipment is depicted;

[0016] — Figure 2 Depicting Figure 1 Detailed images of the lithography equipment;

[0017] — Figure 3 A position control system is schematically depicted; and

[0018] — Figures 4 to 8 A top view of the positioning module of the positioning device of a photolithography equipment is depicted, wherein the first positioning module and the second positioning module are in different positions. Detailed Implementation

[0019] In this document, the terms “radiation” and “beam” are intended to encompass all types of electromagnetic radiation, including ultraviolet radiation (e.g., wavelengths of 365, 248, 193, 157, or 126 nm) and EUV (extreme ultraviolet radiation, e.g., wavelengths in the range of about 5 to 100 nm).

[0020] As used herein, the terms "mask," "mask," or "patterning apparatus" can be broadly interpreted to refer to a general patterning apparatus capable of imparting a patterned cross-section to an incident radiation beam corresponding to a pattern to be formed on a target portion of a substrate. The term "optical valve" may also be used in this context. Examples of other such patterning apparatuses besides classical masks (transmission or reflection, binary, phase-shifting, hybrid, etc.) include programmable mirror arrays and programmable LCD arrays.

[0021] Figure 1 A lithography apparatus LA is schematically depicted. The lithography apparatus LA includes: an irradiation system (also called an "irradiator") IL, configured to modulate a radiation beam B (e.g., UV radiation, DUV radiation, or EUV radiation); a mask support (e.g., a mask stage) MT, configured to support a pattern forming apparatus (e.g., a mask) MA and connected to a first positioner PM, configured to accurately position the pattern forming apparatus MA according to specific parameters; a substrate support (e.g., a wafer stage) WT, configured to hold a substrate (e.g., a resist-coated wafer) W and connected to a second positioner PW, configured to accurately position the substrate support according to specific parameters; and a projection system (e.g., a refractive projection lens system) PS, configured to project a pattern imparted by the pattern forming apparatus MA to the radiation beam B onto a target portion C (e.g., including one or more molds) of the substrate W.

[0022] In operation, the irradiation system IL receives a radiation beam from the radiation source SO, for example via a beam delivery system BD. The irradiation system IL may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic, and / or other types of optical components or any combination thereof, for guiding, shaping, and / or controlling the radiation. The irradiator IL can be used to adjust the radiation beam B to have a desired spatial and angular intensity distribution in the cross-section of the plane where the pattern forming apparatus MA is located.

[0023] The term "projection system" (PS) as used herein should be interpreted broadly to include all types of projection systems, including refractive, reflective, reflective-refractive, distorting, magnetic, electromagnetic, and / or electrostatic optical systems, or any combination thereof, as suitable for the exposure radiation used, and / or for other factors such as the use of immersion fluids or vacuum. The term "projection lens" as used herein may be considered synonymous with the more general term "projection system" (PS).

[0024] A lithography apparatus LA can be of the type in which at least a portion of the substrate can be covered by a liquid (e.g., water) with a relatively high refractive index to fill the space between the projection system PS and the substrate W—also known as immersion lithography. More information on immersion technology is given in US6952253, which is incorporated herein by reference.

[0025] Photolithography equipment (LA) can also be of the type with two or more substrate supports (WT) (also known as "dual platforms"). In such "multi-platform" machines, substrate supports (WT) can be used in parallel, and / or preparation steps for subsequent exposure of substrate W can be performed on a substrate W located on one substrate support (WT) while another substrate W on another substrate support (WT) is being used to expose a pattern on another substrate W.

[0026] In addition to the substrate support WT, the lithography apparatus LA may also include a measurement platform. The measurement platform is arranged to hold sensors and / or cleaning devices. The sensors may be arranged to measure properties of the projection system PS or the radiation beam B. The measurement platform may hold multiple sensors. The cleaning devices may be arranged as part of the cleaning lithography apparatus, such as part of the projection system PS or part of a system providing immersion liquid. The measurement platform may move below the projection system PS as the substrate support WT moves away from the projection system PS.

[0027] In operation, a radiation beam B is incident on a patterning apparatus (e.g., a mask) MA held on a mask support MT, and the radiation beam B is patterned by a pattern (design layout) present on the patterning apparatus MA. After passing through the patterning apparatus MA, the radiation beam B passes through a projection system PS, which focuses the radiation beam onto a target portion C of the substrate W. With the aid of a second positioner PW and a position measurement system PMS, the substrate support WT can be accurately moved, for example, to position different target portions C in the path of the radiation beam B at focused and aligned positions. Similarly, a first positioner PM and possibly another position sensor ( Figure 1 (Not explicitly shown) can be used to accurately position the pattern forming apparatus MA relative to the path of the radiation beam B. The pattern forming apparatus MA and the substrate W can be aligned using mask alignment marks M1, M2 and substrate alignment marks P1, P2. Although the substrate alignment marks P1, P2 occupy dedicated target portions, they can also be located within the space between target portions. When the substrate alignment marks P1, P2 are located between target portions C, they are called scribing alignment marks.

[0028] To illustrate the invention, a Cartesian coordinate system is used. A Cartesian coordinate system has three axes: the x-axis, the y-axis, and the z-axis. Each of the three axes is orthogonal to the other two axes. A rotation about the x-axis is called an Rx rotation. A rotation about the y-axis is called an Ry rotation. A rotation about the z-axis is called an Rz rotation. The x-axis and y-axis define the horizontal plane, while the z-axis is in the vertical direction. The Cartesian coordinate system is not limiting of the invention but is used for illustration only. Alternatively, another coordinate system, such as a cylindrical coordinate system, can be used to illustrate the invention. The Cartesian coordinate system can have different orientations, for example, such that the z-axis has a component along the horizontal plane.

[0029] Figure 2 Show Figure 1 More detailed partial diagrams of the lithography equipment LA are shown below. The lithography equipment LA can be provided with a base frame BF, a counterweight BM, a measurement frame MF, and a vibration isolation system IS. The measurement frame MF supports the projection system PS. In addition, the measurement frame MF can support part of the position measurement system PMS. The measurement frame MF is supported by the base frame BF via the vibration isolation system IS. The vibration isolation system IS is arranged to prevent or reduce the transmission of vibration from the base frame BF to the measurement frame MF.

[0030] The second positioner PW is arranged to accelerate the substrate support WT by providing a driving force between the substrate support WT and the balancing mass block BM. The driving force accelerates the substrate support WT in the desired direction. Due to the conservation of momentum, an equal driving force is also applied to the balancing mass block BM, but in the opposite direction to the desired direction. Typically, the mass of the balancing mass block BM is significantly greater than the mass of the moving portion of the second positioner PW and the mass of the substrate support WT.

[0031] In one embodiment, the second positioner PW is supported by a balancing mass block BM. For example, the second positioner PW includes a planar motor for suspending the substrate support WT above the balancing mass block BM. In another embodiment, the second positioner PW is supported by a base frame BF. For example, the second positioner PW includes a linear motor, and the second positioner PW includes a bearing, such as a gas bearing, for suspending the substrate support WT above the base frame BF.

[0032] A position measurement system (PMS) can include any type of sensor suitable for determining the position of a substrate stage WT. A position measurement system (PMS) can include any type of sensor suitable for determining the position of a mask stage MT. The sensor can be an optical sensor, such as an interferometer or encoder. A position measurement system (PMS) can include a combined system of interferometers and encoders. The sensor can be another type of sensor, such as a magnetic sensor, a capacitive sensor, or an inductive sensor. A position measurement system (PMS) can determine the position relative to a reference, such as the position relative to a measurement fixture MF or a projection system PS. A position measurement system (PMS) can determine the position of the substrate stage WT and / or the mask stage MT by measuring the position or the time derivative of the position, such as velocity or acceleration.

[0033] A position measurement system (PMS) may include an encoder system. An encoder system is known, for example, from U.S. Patent Application US2007 / 0058173A1, filed September 7, 2006, which is incorporated herein by reference. The encoder system includes an encoder head, a grating, and a sensor. The encoder system can receive a primary radiation beam and a secondary radiation beam. Both the primary and secondary radiation beams originate from the same radiation beam, i.e., the original radiation beam. At least one of the primary and secondary radiation beams is generated by diffracting the original radiation beam using a grating. If both the primary and secondary radiation beams are generated by diffracting the original radiation beam using a grating, the primary radiation beam needs to have a different diffraction order than the secondary radiation beam. Different diffraction orders are, for example, +1, -1, +2, and -2 orders. The encoder system optically combines the primary and secondary radiation beams into a combined radiation beam. A sensor in the encoder head determines the phase or phase difference of the combined radiation beam. The sensor generates a signal based on the phase or phase difference. This signal indicates the position of the encoder head relative to the grating. One of the encoder head and the grating can be arranged on the substrate structure WT. The other of the encoder head and the grating can be arranged on the measurement fixture MF or the base frame BF. For example, multiple encoder heads are arranged on the measurement fixture MF, while the grating is arranged on the top surface of the substrate support WT. In another example, the grating is arranged on the bottom surface of the substrate support WT, and the encoder head is arranged below the substrate support WT.

[0034] A position measurement system (PMS) may include an interferometer system. One such interferometer system is known, for example, from U.S. Patent 6,020,964, filed July 13, 1998, which is incorporated herein by reference. The interferometer system may include a beam splitter, a mirror, a reference mirror, and a sensor. A radiation beam is split into a reference beam and a measurement beam by the beam splitter. The measurement beam propagates to the mirror and is then reflected back to the beam splitter. The reference beam propagates to the reference mirror and is then reflected back to the beam splitter. At the beam splitter, the measurement beam and the reference beam are combined into a combined radiation beam. The combined radiation beam is incident on the sensor. The sensor determines the phase or frequency of the combined radiation beam. The sensor generates a signal based on this phase or frequency. This signal represents the displacement of the mirror. In one embodiment, the mirror is connected to a substrate support WT. The reference mirror may be connected to a measurement fixture MF. In one embodiment, the measurement beam and the reference beam are combined into a combined radiation beam using additional optical components instead of a beam splitter.

[0035] The first positioner PM may include a long-stroke module and a short-stroke module. The short-stroke module is arranged to move the mask support MT relative to the long-stroke module with high accuracy over a small range of motion. The long-stroke module is arranged to move the short-stroke module relative to the projection system PS with relatively low accuracy over a large range of motion. By combining the long-stroke and short-stroke modules, the first positioner PM can move the mask support MT relative to the projection system PS with high accuracy over a large range of motion. Similarly, the second positioner PW may include a long-stroke module and a short-stroke module. The short-stroke module is arranged to move the substrate support WT relative to the long-stroke module with high accuracy over a small range of motion. The long-stroke module is arranged to move the short-stroke module relative to the projection system PS with low accuracy over a large range of motion. By combining the long-stroke and short-stroke modules, the second positioner PW can move the substrate support WT relative to the projection system PS with high accuracy over a large range of motion.

[0036] A first positioner PM and a second positioner PW are each provided with actuators to move a mask support MT and a substrate support WT accordingly. The actuators can be linear actuators to provide driving force along a single axis (e.g., the y-axis). Multiple linear actuators can be applied to provide driving force along multiple axes. The actuators can be planar actuators to provide driving force along multiple axes. For example, a planar actuator can be arranged to move the substrate support WT with six degrees of freedom. The actuators can be electromagnetic actuators, including at least one coil and at least one magnet. The actuators are arranged to move at least one coil relative to at least one magnet by applying current to the at least one coil. The actuators can be moving magnet type actuators, having at least one magnet coupled to the substrate support WT and correspondingly coupled to the mask support MT. The actuators can be moving coil type actuators, having at least one coil coupled to the substrate support WT and correspondingly coupled to the mask support MT. The actuator can be a voice coil actuator, a magnetoresistive actuator, a Lorentz actuator, or a piezoelectric actuator, or any other suitable actuator.

[0037] Photolithography equipment (LA) includes, for example Figure 3 A position control system (PCS) is schematically depicted. The PCS includes a setpoint generator (SP), a feedforward controller (FF), and a feedback controller (FB). The PCS provides a drive signal to an actuator (ACT). The actuator (ACT) can be an actuator of a first positioner (PM) or a second positioner (PW). The actuator (ACT) drives a device (P), which may include a substrate support (WT) or a mask support (MT). The output of the device (P) is a position quantity, such as position, velocity, or acceleration. The position quantity is measured using a position measurement system (PMS). The PMS generates a signal representing the position quantity of the device (P). The setpoint generator (SP) generates a signal representing a reference signal representing the desired position quantity of the device (P). For example, the reference signal represents the desired trajectory of the substrate support (WT). The difference between the reference signal and the position signal forms the input to the feedback controller (FB). Based on this input, the feedback controller (FB) provides at least a portion of the drive signal for the actuator (ACT). The reference signal may form the input to the feedforward controller (FF). Based on this input, the feedforward controller (FF) provides at least a portion of the drive signal for the actuator (ACT). Feedforward FF can utilize relevant information about the dynamic characteristics of the device P, such as mass, stiffness, resonant modes, and eigenfrequency.

[0038] Figure 4 A top view of the first positioning module PW1 and the second positioning module PW2 of the photolithography equipment is shown.

[0039] A first positioning module PW1 and a second positioning module PW2 are respectively arranged to support a substrate. The first positioning module PW1 and the second positioning module PW2 are movable within a first positioning field FI1 and a second positioning field FI2. The first positioning field FI1 and the second positioning field FI2 extend in positioning planes extending along the y-direction and the x-direction, respectively. In the first positioning field FI1, the first positioning module PW1 or the second positioning module PW2 can cooperate with one or more first processing devices to process the substrate supported by the first positioning module PW1 or the second positioning module PW2, respectively. This processing may involve a first processing sequence. In the first positioning field FI1, the two positioning modules can be positioned alternately to execute the first processing sequence. That is, the first positioning module PW1 can be positioned to execute the first processing sequence, then the second positioning module PW2 can be positioned to execute the first processing sequence, then the first positioning module PW1 can be positioned to execute the first processing sequence, and so on.

[0040] In the second positioning field FI2, the first positioning module PW1 or the second positioning module PW2 can cooperate with one or more second processing devices to process the substrate supported by the first positioning module PW1 or the second positioning module PW2, respectively. This processing may involve a second processing sequence. In the second positioning field FI2, the two positioning modules can be positioned alternately to execute the first processing sequence. That is, the second positioning module PW2 can be positioned to execute the second processing sequence, then the first positioning module PW1 can be positioned to execute the second processing sequence, then the second positioning module PW2 can be positioned to execute the second processing sequence, and so on.

[0041] The first positioning field FI1 and the second positioning field FI2 are arranged adjacent to each other in the y-direction. The first positioning field is, for example, an exposure field, whereby one or more processing devices include a projection system arranged to project a patterned radiation beam onto a substrate. The one or more processing devices may also include processing devices that cooperate with a zero position ZS and an aberration control measurement sensor AS mounted on each of the positioning modules in the first positioning module PW1 and the second positioning module PW2.

[0042] The second positioning field FI2 is, for example, a measurement field, in which the upper surface of the substrate can be measured by a horizontal sensor to determine a height map of the upper surface of the substrate. This height map can be used during the projection of a patterned radiation beam into the exposure field to improve the positioning of the upper surface of the substrate W relative to the incident patterned radiation beam. Furthermore, in the second positioning field FI2, the substrate can be mounted on or unloaded from either the first positioning module PW1 or the second positioning module PW2.

[0043] A first position measurement system PMS1 is arranged to measure the position of either the first positioning module PW1 or the second positioning module PW2 when it is positioned in the first positioning field FI1. A second position measurement system PMS2 is arranged to measure the position of either the first positioning module PW1 or the second positioning module PW2 when it is positioned in the second positioning field FI2. The first position measurement system PMS1 and the second position measurement system PMS2 are, for example, interferometer systems. The first positioning module PW1 and the second positioning module PW2 can exchange positions in the y-direction, allowing them to be used alternately in the first positioning field FI1 and the second positioning field FI2. Since the first positioning module PW1 and the second positioning module PW2 are connected to a fixed part of the lithography equipment via cables, the first positioning module PW1 and the second positioning module PW2 can only be used in... Figure 4 The first positioning module PW1 is positioned to the left of the second positioning module PW2 in a manner that passes between them (see also...). Figure 6 During the position exchange, the first side SI-1 of the first positioning module PW1 will face the second side SI-2 of the second positioning module PW2. Since the first positioning module PW1 and the second positioning module PW2 always pass each other on the same side, the first side SI-1 and the second side SI-2 will also face each other in the x-direction.

[0044] exist Figure 4 In this configuration, the first positioning module PW1 is positioned in the first positioning field FI1, and the second positioning module PW2 is positioned in the second positioning field FI2.

[0045] These positions are typically used during the simultaneous processing of two substrates in a photolithography apparatus. For example, while a substrate supported by a second positioning module PW2 is being processed in a second positioning field FI2, a substrate supported by a first positioning module PW1 in a first positioning field FI1 can be exposed to a patterned radiation beam. For example, in the second positioning field FI2, the exposed substrate can be unloaded from the second positioning module PW2, a new substrate can be loaded onto the second positioning module PW2, and the upper surface of the substrate on the second positioning module PW2 can be measured using a measuring device (e.g., a level sensor).

[0046] After the processing of the two substrates in the corresponding positioning fields FI1 and FI2 is completed, the second positioning module PW2 is moved to the first positioning field FI1 to expose the substrate supported by the second positioning module PW2 to the patterned radiation beam. The first positioning module PW1 can be moved to the second positioning field FI2 to unload the substrate supported by the first positioning module PW1, load a new substrate onto the first positioning module PW1, and measure the upper surface of the new substrate using a measuring device.

[0047] In practice, the substrate is typically loaded onto a positioning module in the second positioning field FI2, and the upper surface of the substrate is also measured on this positioning module. Then, the positioning module is moved to the first positioning field FI1, where the substrate is exposed to a patterned radiation beam. After exposure, the positioning module is moved back to the second positioning field to unload the substrate from the positioning module.

[0048] In many applications, the time required to process the substrate in the first positioning field FI1 (i.e., exposure to the patterned radiation beam and related tasks) is longer than the time required to process the substrate in the second positioning field FI2 (i.e., unloading / loading / leveling measurement and related tasks). Therefore, it is desirable to minimize the idle time required between the processing of the substrate on the first positioning module PW1 in the first positioning field FI1 and the processing of the substrate on the second positioning module PW2, as this idle time is critical for the substrate cycle time in the lithography apparatus.

[0049] This patent application proposes to reduce the idle time between subsequent processing of the substrate in the first positioning field FI1. As a first feature, it proposes to move the second positioning module PW2 into the first positioning module PW1 before completing the processing of the substrate supported on the first positioning module PW1 in the first positioning field.

[0050] Figure 5 The diagram shows a second positioning module PW2 located in a first waiting position. The first positioning module PW1 is performing a first processing sequence (e.g., exposing a substrate to a patterned radiation beam). The first waiting position is located in a second positioning field FI2, on the side of the second positioning field FI2 closest to the first positioning field FI1. Once the processing of the substrate supported on the second positioning module PW2 in the second positioning field FI2 is completed, and the second positioning module PW2 cannot yet be safely positioned in the first positioning field FI1, the second positioning module PW2 can be positioned in the first waiting position. For example, processing of the substrate supported on the first positioning module PW1 in the first positioning field FI1 may still require greater movement of the first positioning module PW1 in the first positioning field FI1, preventing the second positioning module PW2 from moving into the first positioning field FI1.

[0051] If there is space in the first positioning field FI1 available for the second positioning module PW2, for example during the final processing step of the substrate supported on the first positioning module PW1 in the first positioning field FI1, the second positioning module PW2 can be arranged in the second waiting position in the first positioning field FI1.

[0052] When the substrate supported on the second positioning module PW2 has been processed in the second positioning field FI2, and there is immediately available space in the first positioning field FI1, the second positioning module PW2 can also be directly placed in the second waiting position.

[0053] Figure 6 A second positioning module PW2 is shown positioned in a second waiting position within the first positioning field FI1. The second positioning module PW2 is close to the first positioning module PW1 but does not obstruct the position measurement of the first positioning module PW1. Because the second positioning module PW2 does not interfere with the position measurement performed by the first position measurement system PMS1, even though the second positioning module PW2 has been positioned in the first positioning field FI1, one or more first processing devices can continue to process the first substrate supported on the first positioning module PW1.

[0054] The final step in processing the substrate in the first positioning field FI1 is to perform measurements using an aberration control measurement sensor AS. As the final processing unit in the first positioning field FI1, the aberration control measurement sensor AS is positioned at the corner of side SI-A and side SI-1 of the first positioning module PW1. Side SI-A faces the second positioning field FI2 in the y-direction, and side SI-1 faces the second positioning module PW2 in the x-direction during position exchange. In other words, the aberration control measurement sensor AS is positioned close to the first side SI-1 of the first positioning module PW1.

[0055] By arranging the final processing unit in the first positioning field FI1 at a corner, additional space is created in the first positioning field FI1 for arranging the second positioning module PW2 while the processing of the substrate on the first positioning module PW1 in the first positioning field FI1 is not yet complete. Accordingly, the final unit (e.g., the aberration control measurement sensor AS of the second positioning module PW2) is arranged at the corner of side SI-B and side SI-2, with side SI-B facing the second positioning field FI2 in the y-direction and the second side SI-2 facing the first positioning module PW1 in the x-direction during position exchange. That is, the aberration control measurement sensor AS is positioned close to the second side SI-2 of the second positioning module PW2. This creates space for positioning the first positioning module PW1 in the first positioning field FI1 while the processing of the substrate on the second positioning module PW2 in the first positioning field FI1 is not yet complete.

[0056] When the first positioning module PW1 is completing or has completed the first processing sequence, the distance between the two positioning modules is less than 20 cm, preferably less than 10 cm, and more preferably less than 5 cm. This distance is defined as the shortest distance between a portion of the first positioning module PW1 and the second positioning module PW2. The shorter this distance, the less time is required to move the second positioning module PW2 to the position where the first processing sequence is performed. On the other hand, this distance cannot be so small that the second positioning module PW2 would obstruct the position measurement of the first position measurement system PMS1.

[0057] The first step in processing the substrate supported by the second positioning module PW2 in the first positioning field FI1 is to measure the zeroing position ZS on the second positioning module PW2 using a zeroing sensor. As a first processing unit, the zeroing position ZS is arranged at the corner of side SI-M and first side SI-1 of the second positioning module PW2, with side SI-M facing away from the second positioning field FI2 in the y-direction and the first side SI-1 facing the first positioning module PW1 in the x-direction during position exchange.

[0058] By arranging the first processing unit in the first positioning field FI1 at the corner, the distance between the second waiting position of the second positioning module PW2 and the first processing position of the second positioning module PW2 used for processing in the first positioning field FI1 using the zero position ZS is relatively small, thereby further reducing the idle time of processing the substrate in the first positioning field FI1.

[0059] Accordingly, the first processing unit (i.e., the zero position ZS) in the first positioning field of the second positioning module PW2 is arranged at the corner of the side SI-N and the second side SI-2. The side SI-N is away from the second positioning field FI2 in the y direction, and the second side SI-2 faces the first positioning module PW1 in the x direction during the position exchange.

[0060] Since the sensor configuration on the first positioning module PW1 and the second positioning module PW2 is arranged to reduce the idle time of processing in the first positioning field FI1, the sensor units of the first positioning module PW1 and the second positioning module PW2 are mirrored with respect to a mirror plane extending in the y direction and the z direction perpendicular to the xy plane. Thus, when the positioning modules PW1 and PW2 pass each other in the y direction during position exchange, the first unit and the final unit are arranged at the sides SI-1 and SI-2 of the positioning modules PW1 and PW2 facing the other positioning module PW2 and PW1.

[0061] The first positioning module PW1 and the second positioning module PW2 each include a long-stroke module and a short-stroke module, wherein the long-stroke module supports the short-stroke module, and the short-stroke module is arranged to support the substrate. The short-stroke module is arranged to move the substrate relative to the long-stroke module with high precision within a small range of motion, and the long-stroke module is arranged to move the short-stroke module with low precision within a large range of motion.

[0062] By arranging the short-stroke module of the first positioning module PW1 at or near the end of the second positioning module PW2 in the x-direction of the long-stroke, large-range movement (e.g., Figure 6 At or near the end of the large stroke in the x-direction of the first positioning module PW1, and the short stroke module of the second positioning module is positioned at or near the end of the large stroke range in the x-direction closest to the first positioning module PW1 (e.g., at the end of the large stroke range in the x-direction of the first positioning module PW1). Figure 6 At or near the end of the long stroke in the negative x-direction, more space is created for arranging the second positioning module PW2 in a second waiting position close to the first positioning module PW1. This can further reduce the idle time of processing the substrate in the first positioning field FI1. The side of the short stroke module of the first positioning module PW1 located further in the x-direction (i.e., the positive x-direction side of the short stroke module of PW1) is positioned in the x-direction as close as possible to the side of the long stroke module of the first positioning module PW1 located further in the x-direction (i.e., the positive x-direction side of the long stroke module of PW1), so that the short stroke module and the long stroke module of PW1 are aligned or nearly aligned. Similarly, the side of the short stroke module of the second positioning module PW2 located further in the negative x-direction (i.e., the negative x-direction side of the short stroke module of PW2) is positioned in the x-direction as close as possible to the side of the long stroke module of the second positioning module PW2 located further in the negative x-direction (i.e., the negative x-direction side of the long stroke module of PW2), so that the short stroke module and the long stroke module of PW2 are aligned or nearly aligned.

[0063] Once the substrate processing on the first positioning module PW1 is completed, the first positioning module PW1 can move toward the second positioning field FI2, and the second positioning module PW2 can be positioned at the zero position to achieve zero measurement.

[0064] Figure 7The positions of the first positioning module PW1 and the second positioning module PW2 are shown, wherein the first positioning module PW1 is moving toward the second positioning field FI2, and the second positioning module PW2 is already in a zeroing position for zeroing measurement. In these positions, the position of the first positioning module PW1 prevents the use of the first position measurement system PMS1 to determine the position of the second positioning module PW2. Since the position of the second positioning module PW2 needs to be measured by the first position measurement system PMS1 in conventional zeroing measurement, conventional zeroing measurement cannot begin as long as the first positioning module PW1 prevents the position measurement of the second positioning module PW2.

[0065] According to one embodiment of the invention, it is proposed to begin zeroing measurements without requiring position measurements from the first position measurement system PMS1. It has been found that zeroing measurements can be initiated using a position determined based on the zeroing measurements. This means that zeroing measurements can begin once the zeroing sensor is aligned with the zeroing position ZS on the second positioning module PW2. These measurements enable the determination of the position of the second positioning module PW2 relative to the zeroing sensor with a certain accuracy. Based on the determined position, the position of the second positioning module PW2 can be adjusted to an improved position for zeroing measurements.

[0066] Figure 8 This shows that the first positioning module PW1 has moved further toward the second positioning field FI2. The first positioning module PW1 no longer prevents the first position measurement system PMS1 from measuring the position of the second positioning module PW2. Once the position of the second positioning module PW2 can be measured, the measured position can be taken into account in the zeroing measurement performed by the zeroing sensor at the zeroing position ZS.

[0067] The second positioning module PW2 will remain in the first positioning field FI1 to further process the substrate supported by the second positioning module PW2 using the processing equipment associated with the first positioning field FI1.

[0068] Simultaneously, the first positioning module PW1 moves to the second positioning field FI2, where the processed substrate is unloaded and the substrate to be processed is loaded onto the first positioning module PW1. Then, the upper surface of the substrate supported by the first positioning module PW1 is measured by a level sensor. Furthermore, other tasks associated with the second positioning field FI2 can be performed on the substrate loaded onto the first positioning module PW1.

[0069] and Figure 4In contrast, the positions of the first positioning module PW1 and the second positioning module PW2 have now been swapped. Since the time consumed by unloading / loading the substrate and measuring the level sensor is usually less than the time consumed by processing the substrate in the first positioning field FI1, the processing of the substrate on the first positioning module PW1 will be completed before the processing of the substrate on the second positioning module PW2 is completed.

[0070] Therefore, after the substrate processing on the first positioning module PW1 is completed, as long as no position is available in the first positioning field, the first positioning module PW1 can be moved to the first waiting position in the second positioning field FI2. When space is available in the first positioning field FI1, for example, when the substrate supported on the second positioning module PW2 is in the final processing step of the first positioning field FI1, the first positioning module PW1 can be positioned in the second waiting position in the first positioning field FI1 near the second positioning module PW2, but this does not prevent the first position measurement system PMS from measuring the position of the second positioning module PW2. The second waiting position of the first positioning module PW1 is approximately... Figure 8 The position of the first positioning module is shown. After the substrate supported by the second positioning module is processed, the positions of the first positioning module PW1 and the second positioning module PW2 can be swapped in essentially the same way as described above, but mirrored in the yz plane.

[0071] In this position exchange, all features that reduce the idle time of the processed substrate W in the first positioning field FI1 can be applied.

[0072] In relation to Figures 4 to 8 In the described embodiment, time is considered critical for substrate processing in the first positioning field FI1. Therefore, the position exchange between the first positioning module PW1 and the second positioning module PW2 is performed in the first positioning field FI1 to minimize idle time in processing the substrate in the first positioning field FI1. Correspondingly, the position exchange between the first positioning module PW1 and the second positioning module PW2 can also be performed in the second positioning field FI2 to minimize idle time in processing the substrate in the second positioning field FI2 when time is critical for processing in the second positioning field FI2.

[0073] While this article specifically refers to the use of photolithography equipment in IC manufacturing, it should be understood that the photolithography equipment described herein can also have other applications. Possible other applications include the fabrication of integrated optical systems, the fabrication of guide and detection patterns for magnetic domain memory, flat panel display manufacturing, liquid crystal display (LCD) manufacturing, and thin-film magnetic head manufacturing.

[0074] Although embodiments of the invention have been specifically referenced herein in the context of lithography equipment, these embodiments can also be used with other equipment. These embodiments can form part of mask inspection equipment, metrology equipment, or any equipment that measures or processes objects such as wafers (or other substrates) or masks (or other patterning apparatus). These devices can be collectively referred to as lithography tools. These lithography tools can utilize vacuum conditions or ambient (non-vacuum) conditions.

[0075] Although specific reference has been made to the use of embodiments of the present invention in the context of optical lithography above, it should be understood that, where the context permits, the present invention is not limited to optical lithography, but can be used in other applications such as imprint lithography.

[0076] Where the context permits, embodiments of the present invention may be implemented in hardware, firmware, software, or any combination thereof. Embodiments of the present invention may also be implemented as instructions stored on a machine-readable medium and read and executed by one or more processors. A machine-readable medium may include any mechanism for storing or transmitting information in a machine-readable form (e.g., a computing device). For example, a machine-readable medium may include read-only memory (ROM); random access memory (RAM); magnetic storage media; optical storage media; flash memory devices; electrical, optical, acoustic, or other forms of propagation signals (e.g., carrier waves, infrared signals, digital signals, etc.). Furthermore, firmware, software, routines, and instructions may be described herein as performing certain actions. However, it should be understood that such description is merely for convenience, and these actions are actually generated by a computing device, processor, controller, or other device executing firmware, software, routines, instructions, etc., and in performing these actions, actuators or other devices may interact with the physical world.

[0077] Although specific embodiments of the invention have been described above, it should be understood that the invention can be practiced in ways other than those described. The above description is intended to be illustrative and not restrictive. Therefore, modifications to the described invention may be made without departing from the scope of the claims set forth below, as will be apparent to those skilled in the art.

[0078] Terms and Conditions

[0079] 1. A positioning device, comprising:

[0080] The first positioning module (PW1) is arranged to support and position the first substrate;

[0081] The second positioning module (PW2) is arranged to support and position the second substrate;

[0082] A first positioning field (FI1) is established in which the first positioning module and the second positioning module can be positioned to cooperate with one or more first processing devices.

[0083] In the second positioning field (FI2), the first positioning module and the second positioning module can be positioned to cooperate with one or more second processing devices.

[0084] The first positioning field and the second positioning field extend within a positioning plane, which extends along a first direction and a second direction perpendicular to the first direction.

[0085] The first positioning field and the second positioning field are arranged adjacent to each other in the first direction, and the first positioning module and the second positioning module are capable of exchanging positions in the first direction. During the position exchange, the first side of the first positioning module faces the second side of the second positioning module in the second direction.

[0086] The first positioning module and the second positioning module each include a first unit for performing a first processing step in the first positioning field, and a final unit for performing a final processing step in the first positioning field.

[0087] The first unit and the final unit are respectively arranged on the first side of the first positioning module and the second side of the second positioning module.

[0088] 2. The positioning device according to Clause 1, wherein the final unit of the first positioning module is arranged near a first corner on the side of the first positioning module and the side of the first positioning module facing the second positioning field when positioned in the first positioning field, and wherein the final unit of the second positioning module is arranged near a second corner on the side of the second positioning module and the side of the second positioning module facing the second positioning field when positioned in the first positioning field.

[0089] 3. The positioning device according to clause 1 or 2, wherein the first unit of the first positioning module is arranged near a second corner on the following side: the first side, and the side of the first positioning module facing away from the second positioning field when it is positioned in the first positioning field, and the first unit of the second positioning module is arranged near a second corner on the following side: the second side, and the side of the second positioning module facing away from the second positioning field when it is positioned in the first positioning field.

[0090] 4. The positioning device according to any of the preceding clauses, wherein the first unit is arranged in a zeroing position in cooperation with a zeroing sensor.

[0091] 5. The positioning device according to Clause 4, wherein the zeroing sensor is arranged to perform a zeroing measurement before the position of the corresponding first positioning module or second positioning module is determined by the position measurement system.

[0092] 6. The positioning device according to any one of the preceding clauses, wherein the final unit is an aberration control measurement sensor, and / or wherein the first positioning field is the exposure field of the positioning device, and wherein the second positioning field is the measurement field of the positioning device.

[0093] 7. The positioning device according to any one of the preceding clauses, wherein the first positioning module and the second positioning module each include a sensor group, wherein a first configuration of the sensor group of the first positioning module and a second configuration of the sensor group of the second positioning module are mirror images of a mirror plane extending in the first direction and in a direction perpendicular to the positioning plane.

[0094] 8. The positioning device according to any one of the preceding clauses, wherein the first positioning module and the second positioning module respectively include a long-stroke module and a short-stroke module, wherein the long-stroke module supports the short-stroke module, and the short-stroke module is arranged to support a substrate, wherein the short-stroke module is arranged to move the substrate relative to the long-stroke module with high precision within a small range of motion, and wherein the long-stroke module is arranged to move the short-stroke module with low precision in the second direction within a large range of motion.

[0095] The control device of the positioning device is arranged to position the short-stroke module of the first positioning module at or near the end of the long-stroke module in the second direction within the large range of movement of the long-stroke module, and to position the short-stroke module of the second positioning module near the end of the first positioning module in the second direction within the large range of movement of the long-stroke module.

[0096] 9. The positioning device according to any one of the preceding clauses, wherein the control device of the positioning device is configured to: arrange the second positioning module at least partially in the first positioning field without obstructing the position measurement of the first positioning module during the processing of the first substrate supported on the first positioning module with the one or more first processing devices, and / or arrange the first positioning module at least partially in the first positioning field without obstructing the position measurement of the second positioning module during the processing of the second substrate supported on the second positioning module with the one or more first processing devices.

[0097] 10. The positioning device according to any one of the preceding clauses, wherein the positioning device comprises: a first position measuring system for determining the position of the first positioning module or the second positioning module in the first positioning field; and a second position measuring system for determining the position of the first positioning module or the second positioning module in the second positioning field.

[0098] 11. A method of using a positioning device, the positioning device comprising:

[0099] The first positioning module is arranged to support and position the first substrate;

[0100] The second positioning module is arranged to support and position the second substrate;

[0101] A first positioning field, in which the first positioning module and the second positioning module can be positioned to cooperate with one or more first processing devices.

[0102] A second positioning field, in which the first positioning module and the second positioning module can be positioned to cooperate with one or more second processing devices.

[0103] The first positioning field and the second positioning field extend within a positioning plane, which extends along a first direction and a second direction perpendicular to the first direction.

[0104] The first positioning field and the second positioning field are arranged close to each other in the first direction, and the first positioning module and the second positioning module are capable of exchanging positions in the first direction. During the position exchange, the first side of the first positioning module faces the second side of the second positioning module in the second direction.

[0105] The method includes the following steps: performing a position exchange between the first positioning module and the second positioning module, wherein moving the first positioning module from the first positioning field to the second positioning field, and moving the second positioning module from the second positioning field to the first positioning field, includes the following steps:

[0106] During the processing of the first substrate supported on the first positioning module using one or more first processing devices, the second positioning module is at least partially arranged in the first positioning field without obstructing the position measurement of the first positioning module, and

[0107] After the processing of the first substrate supported on the first positioning module is completed by the one or more first processing devices, the first positioning module is moved toward the second positioning field and the second positioning module is moved to a position cooperating with the one or more first processing devices, and the second substrate on the second positioning module is processed by the one or more first processing devices.

[0108] 12. The method according to Clause 11, wherein the first step of processing the second substrate comprises: performing a zeroing measurement before the position of the second positioning module is determined by the position measurement system.

[0109] 13. The method according to clause 11 or 12, wherein the first positioning module and the second positioning module respectively: include a first unit for performing a first processing step in the first positioning field; and a final unit for performing a final processing step in the first positioning field, wherein the first unit and the final unit are arranged on a first side of the first positioning module and a second side of the second positioning module.

[0110] 14. The method according to any one of clauses 11 to 13, wherein the method comprises the steps of: performing a position exchange between the second positioning module and the first positioning module, wherein moving the second positioning module from the first positioning field to the second positioning field, and moving the first positioning module from the second positioning field to the first positioning field, comprises the following steps:

[0111] During the processing of the second substrate supported on the second positioning module using one or more first processing devices, the first positioning module is at least partially arranged in the first positioning field without obstructing the position measurement of the second positioning module, and

[0112] After the processing of the second substrate supported on the second positioning module is completed by the one or more first processing devices, the second positioning module is moved toward the second positioning field and the first positioning module is moved to a position cooperating with the one or more first processing devices, and the new first substrate on the first positioning module is processed by the one or more first processing devices.

[0113] 15. A photolithography apparatus comprising a positioning device according to any one of clauses 1 to 10.

[0114] 16. A method of using a positioning device, the positioning device comprising:

[0115] The first positioning module is arranged to support and position the first substrate;

[0116] The second positioning module is arranged to support and position the second substrate;

[0117] In the first positioning field (FI1), the two positioning modules can be positioned alternately to execute a first processing sequence.

[0118] In the second positioning field (FI2), the two positioning modules can be positioned alternately to execute the second processing sequence.

[0119] When one of the two positioning modules is executing or completing the first processing sequence, the other positioning module has completed the second processing sequence and is positioned closer to the first positioning module.

[0120] 17. The method according to Clause 16, comprising the steps of: performing a position exchange between the first positioning module and the second positioning module, wherein moving the first positioning module from the first positioning field to the second positioning field, and moving the second positioning module from the second positioning field to the first positioning field, comprises the following steps:

[0121] While the first positioning module is executing or completing the first processing sequence, the second positioning module is at least partially positioned within the first positioning field without obstructing the position measurement of the first positioning module.

[0122] Once the first processing sequence is completed, the first positioning module is moved toward the second positioning field, and the second positioning module is moved to the position where the first processing sequence was executed.

[0123] 18. The method according to Clause 17, wherein the first step of the first processing sequence of the second positioning module includes: performing a zeroing measurement before the position of the second positioning module is determined by the position measurement system.

[0124] 19. The method according to clause 17 or 18, wherein the first positioning module and the second positioning module each include a final unit for performing final processing steps in the first positioning field.

[0125] The first positioning field and the second positioning field are arranged adjacent to each other in the first direction (y-axis).

[0126] The first positioning module is arranged such that while the first side of the first positioning module faces the second side of the second positioning field in the second direction (x-axis), it exchanges positions with the second positioning module in the first direction.

[0127] The first positioning module and the second positioning module each include a final unit, which is configured to execute the final step of one of the first processing sequence and the second processing sequence.

[0128] The final unit of the first positioning module is arranged close to the first side, and the final unit of the second positioning module is arranged close to the second side.

[0129] 20. The method according to any one of clauses 17 to 19, wherein the method further comprises the step of: performing a position exchange between the second positioning module and the first positioning module, wherein moving the second positioning module from the first positioning field to the second positioning field, and moving the first positioning module from the second positioning field to the first positioning field, comprises the following steps:

[0130] While the second positioning module is executing or completing the first processing sequence, the first positioning module is at least partially positioned within the first positioning field without obstructing the position measurement of the second positioning module.

[0131] Once the first processing sequence is completed, the second positioning module is moved toward the first positioning field, and the first positioning module is moved to the position where the first processing sequence was executed.

Claims

1. A positioning device, comprising: The first positioning module (PW1) is arranged to support and position the first substrate; The second positioning module (PW2) is arranged to support and position the second substrate; In a first positioning field (FI1), the two positioning modules can be positioned alternately to execute a first processing sequence. The first positioning field is configured to allow position measurement when the first positioning module or the second positioning module is respectively within the first positioning field, and to allow zeroing measurement when the first positioning module or the second positioning module is respectively within the first positioning field. In the second positioning field (FI2), the two positioning modules can be positioned alternately to execute the second processing sequence. Specifically, when one of the two positioning modules is executing or completing the first processing sequence, the other positioning module has already completed the second processing sequence and is positioned closer to the first positioning module relative to the location where the second processing sequence occurred. The other positioning module is configured to perform the zeroing measurement of the other positioning module when the position measurement of the other positioning module is not available in the first positioning field.

2. The positioning device of claim 1, wherein, The two positioning modules are configured to alternately execute the two processing sequences, or / and When one of the two positioning modules is executing or completing the first processing sequence, the other positioning module is at least partially arranged in the first positioning field without hindering the position measurement of the one positioning module.

3. The positioning device of claim 1, wherein, When one of the two positioning modules is completing or has completed the first processing sequence, the distance between the two positioning modules is less than 20cm, preferably less than 10cm, and more preferably less than 5cm.

4. The positioning device of claim 1, wherein, The first positioning field and the second positioning field are arranged adjacent to each other in the first direction (y-axis). The first positioning module is arranged such that while the first side of the first positioning module faces the second side of the second positioning module in the second direction (x-axis), it exchanges positions with the second positioning module in the first direction. The first positioning module and the second positioning module each include a final unit, which is configured to execute the final step of one of the first processing sequence and the second processing sequence. The final unit of the first positioning module is arranged close to the first side, and the final unit of the second positioning module is arranged close to the second side.

5. The positioning device according to claim 4, wherein, The second direction is perpendicular to the first direction, or / and the final step belongs to the first processing sequence.

6. The positioning device according to claim 4, wherein, The final unit of the first positioning module is arranged near a first corner on the following side: the first side, and the side on which the first positioning module faces the second positioning field when it is positioned in the first positioning field. Furthermore, the final unit of the second positioning module is arranged near the first corner on the following side: the second side, and the side of the second positioning module facing the second positioning field when it is positioned in the first positioning field.

7. The positioning device according to claim 1, wherein, The first positioning module and the second positioning module each include a first unit for executing a first processing step of the first processing sequence, wherein the first unit is arranged to cooperate with the zeroing sensor at a zeroing position.

8. The positioning device according to claim 7, wherein, The zeroing sensor is configured to perform zeroing measurements before the position of the corresponding first or second positioning module is determined by the position measurement system.

9. The positioning device according to claim 4, wherein, The final unit is an aberration control measurement sensor, and / or, wherein the first positioning field is the exposure field of the positioning device, and wherein the second positioning field is the measurement field of the positioning device.

10. The positioning device according to claim 4 or 5, wherein, The first positioning field and the second positioning field extend in a positioning plane along the first direction and the second direction, respectively; The first positioning module and the second positioning module each include a sensor group, wherein a first configuration of the sensor group of the first positioning module and a second configuration of the sensor group of the second positioning module are mirror images of a mirror plane extending in the first direction and in a direction perpendicular to the positioning plane.

11. The positioning device according to claim 4 or 5, wherein, The first positioning module and the second positioning module each include a long-stroke module and a short-stroke module, wherein the long-stroke module supports the short-stroke module, and the short-stroke module is arranged to support a substrate, wherein the short-stroke module is arranged to move the substrate relative to the long-stroke module with high precision within a small range of motion, and wherein the long-stroke module is arranged to move the short-stroke module with low precision in the second direction within a large range of motion. The control device of the positioning device is arranged to: position the short-stroke module of the first positioning module at or near the end of the long-stroke module in the second direction within the large movement range of the long-stroke module, and position the short-stroke module of the second positioning module near the end of the long-stroke module in the second direction within the large movement range of the long-stroke module.

12. The positioning device according to claim 1, wherein, The control device of the positioning device is configured to: during the processing of the first substrate supported on the first positioning module with one or more first processing devices, arrange the second positioning module at least partially in the first positioning field without obstructing the position measurement of the first positioning module, and / or during the processing of the second substrate supported on the second positioning module with the one or more first processing devices, arrange the first positioning module at least partially in the first positioning field without obstructing the position measurement of the second positioning module.

13. The positioning device according to claim 1, wherein, The positioning device includes: a first position measurement system for determining the position of the first positioning module or the second positioning module in the first positioning field; and a second position measurement system for determining the position of the first positioning module or the second positioning module in the second positioning field.

14. A positioning device, comprising: The first positioning module (PW1) is arranged to support and position the first substrate; The second positioning module (PW2) is arranged to support and position the second substrate; The first positioning module is arranged such that, while its first side faces the second side of the second positioning module in the second direction, it exchanges positions with the second positioning module in the first direction. The first positioning module and the second positioning module each include a final unit for performing final processing steps. These final processing steps do not involve using an encoder or interferometer to measure the position of the respective first or second positioning module. The final unit of the first positioning module is arranged close to the first side, and the final unit of the second positioning module is arranged close to the second side.

15. A photolithography apparatus, comprising the positioning device according to any one of claims 1 to 14.

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