A fully automatic lead cutting device for lead-type electronic components

Abstract

The present invention discloses a fully automatic pin cutting device for lead-type electronic components, which relates to the field of microelectronic processing technology, and includes a base plate, on which a material box and a mounting plate for positioning and supporting products are arranged, and also includes a symmetrically arranged cutting frame 1 and a cutting frame 2, wherein the cutting frame 1 is connected to the mounting plate through a horizontally arranged cylinder, and the cutting frame 2 is slidably sleeved on the material box, and a cutter is fixedly arranged on the side facing the cutting frame 1 and the cutting frame 2, and the cutting frame 1 and the cutting frame 2 are connected through a synchronous mechanism, so that when the cylinder drives the cutting frame 1 to move, the cutting frame 1 and the cutting frame 2 move toward each other to cut the product, and a product collection box and a waste collection box are fixedly arranged on the base plate. The present invention drives the cutting frame 1 to move under the action of the cylinder, and cooperates with the synchronous mechanism to drive the cutting frame 2 to move synchronously toward each other, so that the blade cuts the pins of the electronic components.

Description

Technical Field

[0001] The invention relates to the technical field of microelectronic processing, and in particular to a fully automatic pin cutting device for lead-type electronic components. Background Art

[0002] Electronic components are components of electronic devices and small machines and instruments. They are often composed of several parts and can be used in similar products. Common electronic components include diodes, etc. Lead-type electronic components need to be cut and meet certain quality requirements.

[0003] In order to ensure the performance of the product, when the leads are cut after the product processing is completed, it is necessary to ensure that the length of the cut leads is consistent. The existing technology is divided into cutting equipment cutting and manual cutting. Whether it is cutting equipment or manual cutting, it is difficult to achieve accurate positioning, resulting in different lengths of product pin cutting positions, and manual cutting is greatly affected by the technical level of the staff, resulting in low product processing efficiency and poor production continuity. Summary of the invention

[0004] The purpose of the present invention is to solve the problem in the prior art that it is difficult to accurately position electronic components, resulting in different lengths of product pin cutting positions, and to propose a fully automatic pin cutting device for lead-type electronic components.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A fully automatic pin cutting device for lead-type electronic components comprises a base plate, on which a material box and a mounting plate for positioning and supporting products are arranged, and also comprises a symmetrically arranged cutting frame 1 and a cutting frame 2, wherein the cutting frame 1 is connected to the mounting plate via a horizontally arranged cylinder, and the cutting frame 2 is slidably sleeved on the material box, and cutting knives are fixedly arranged on the sides of the cutting frame 1 and the cutting frame 2 facing each other, and the cutting frame 1 and the cutting frame 2 are connected via a synchronization mechanism, so that when the cylinder drives the cutting frame 1 to move, the cutting frame 1 and the cutting frame 2 are moved towards each other to cut the product, a product collection box and a waste collection box are fixedly arranged on the base plate, and the cutting frame 1 is provided with an adsorption and discharging mechanism for taking out the product, so that after the product is finished cutting, the leftover waste enters the waste collection box, and the product enters the product collection box.

[0007] Preferably, the material box includes a horizontally arranged positioning block, the positioning block is fixedly connected to the bottom plate by a support plate, the cutting frame is slidably sleeved on the positioning block, the positioning block is provided with a first positioning plate at one end close to the cutting frame, a vertically arranged discharge pipe is provided above the first positioning plate, and the discharge pipe is fixedly connected to the positioning block by a second positioning plate.

[0008] Preferably, three first positioning plates are provided, and the three first positioning plates are respectively located on the left, right and lower sides of the end of the positioning block, so that the second positioning plate and the three first positioning plates form a frame structure for supporting the product.

[0009] Preferably, the length and width of the inner wall of the discharge pipe are both greater than the length and thickness of the product with moldings, so that the discharge pipe can accommodate a single product to pass vertically.

[0010] Preferably, four cutting knives are provided on the cutting frame 1 and the cutting frame 2, so that the cutting operations on the four sides of the product can be carried out simultaneously.

[0011] Preferably, the synchronization mechanism includes a mounting rod fixedly arranged on the bottom plate, a gear is fixedly arranged on the mounting rod, and a gear rod meshingly connected to the gear is fixedly arranged on the side walls of the cutting frame 1 and the cutting frame 2, and the two gear rods are respectively located on the upper and lower sides of the gear.

[0012] Preferably, the adsorption and discharging mechanism includes a fixed plate fixedly arranged on the cutting frame, a connecting rod is fixedly connected to the fixed plate, a piston is rotatably arranged on the end of the connecting rod, an air cylinder sealingly and slidingly connected to the piston is provided in the cutting frame, an elastic spring is provided between the air cylinder and the piston, the air cylinder and the cutting frame are connected by a rotating structure, a suction cup connected to the air cylinder is provided on the side of the air cylinder close to the material box, and an exhaust structure for unloading is provided on the air cylinder.

[0013] Preferably, the rotating structure includes a rotating ring rotatably arranged on the cutting frame, the rotating ring is slidably sleeved with the air cylinder, and a torsion spring is provided between the rotating shaft of the rotating ring and the cutting frame, so that the end of the air cylinder with the suction cup always tends to tilt downward.

[0014] Preferably, the exhaust structure comprises a pressure block fixedly arranged on the mounting plate, the pressure block is arranged corresponding to the gas cylinder, and the gas cylinder is provided with an exhaust hole.

[0015] Preferably, bristles are provided at the bottom end of the discharge pipe.

[0016] Compared with the prior art, the present invention has the following advantages:

[0017] 1. The present invention sets a material box, a cutting frame 1 and a cutting frame 2. The electronic components first pass through the discharge pipe vertically to reach the frame structure formed between the first positioning plate and the second positioning plate, so that the electronic components are accurately positioned between the cutting frame 1 and the cutting frame. The cutting frame 1 is driven to move under the action of the cylinder, and the cutting frame 2 is driven to move synchronously toward each other in coordination with the synchronization mechanism, so that the blade cuts off the wire feet of the electronic components. The cutting efficiency is high, the cutting accuracy is high, and the cut wire feet are neat.

[0018] 2. The present invention arranges a piston, an elastic spring, an air cylinder and a suction cup. When the cutting frame is close to the electronic component, the suction cup first contacts the surface of the electronic component, and the air cylinder drives the rotating ring to rotate to a position perpendicular to the surface of the electronic component. At the same time, as the piston goes deeper, the gas in the air cylinder is discharged. When resetting, the piston moves outward a little distance under the action of the elastic spring, so that the suction cup sucks the electronic component and takes it out. At the same time, the rotating ring rotates the suction cup downward by a certain angle under the action of the torsion spring, so that the wire foot waste that may exist on the top of the electronic component is shaken off and enters the waste collection box. At the same time, as the air cylinder moves, the pressure column presses the air cylinder, so that the piston continues to move with the cutting frame to pass through the exhaust hole, so that the inside of the air cylinder loses pressure, and the electronic component falls into the product collection box. The automation degree is high and the production continuity is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the three-dimensional structure of a fully automatic lead cutting device for lead-type electronic components proposed by the present invention;

[0020] Figure 2 This is a schematic structural diagram of a cutting frame 1 in a fully automatic lead cutting device for lead-type electronic components proposed by the present invention;

[0021] Figure 3 This is a structural schematic diagram of a cutting frame 2 in a fully automatic lead cutting device for lead-type electronic components proposed by the present invention;

[0022] Figure 4 This is a schematic diagram of the structure of a material box in a fully automatic lead cutting device for lead-type electronic components proposed by the present invention;

[0023] Figure 5 This is a structural schematic diagram of the positional relationship between a cutting frame 1 and a cutting frame 2 in a fully automatic lead cutting device for lead-type electronic components proposed by the present invention;

[0024] Figure 6 A schematic diagram of the cutting process of a fully automatic lead cutting device for lead-type electronic components proposed by the present invention Figure 1 ;

[0025] Figure 7 A schematic diagram of the cutting process of a fully automatic lead cutting device for lead-type electronic components proposed by the present invention Figure 2 .

[0026] In the figure: 1. bottom plate; 2. mounting plate; 3. material box; 4. cutting frame 1; 5. cutting frame 2; 6. cutter; 7. cylinder; 8. product collection box; 9. waste collection box; 10. positioning block; 11. first positioning plate; 12. discharge pipe; 13. second positioning plate; 14. gear rod; 15. piston; 16. air cylinder; 17. suction cup; 18. rotating ring; 19. pressure block; 20. exhaust hole; 21. bristles; 22. gear. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0028] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0029] Reference Figure 1 A fully automatic lead cutting device for lead-type electronic components includes a base plate 1, on which a material box 3 for positioning and supporting the product and a mounting plate 2 are arranged. The electronic components to be cut are placed in the material box 3, and the electronic components are automatically discharged by their own gravity. The electronic components are positioned in cooperation with the material box 3, so that the length of the wire legs of the electronic components can be ensured to be consistent when cutting the legs.

[0030] Reference Figure 2-3 , and also includes a cutting frame 1 4 and a cutting frame 2 5 which are symmetrically arranged, and the cutting frame 1 4 and the cutting frame 2 5 are connected by a synchronization mechanism. The synchronization mechanism can make the cutting frame 1 4 move and the cutting frame 2 5 can move toward or oppositely to realize the opening and closing action when cutting the pins of electronic components. The cutting frame 1 4 is connected to the mounting plate 2 by a horizontally arranged cylinder 7. The cylinder 7 is extended and retracted to control the movement of the cutting frame 1 4 to realize the cutting of the pins of the electronic components. The cutting frame 2 5 is slidably sleeved on the material box 3. The cutting frame 1 4 and the cutting frame 2 5 are fixedly provided with a cutter 6 on the side facing each other. When the cutter 6 on the cutting frame 1 4 and the cutter 6 on the cutting frame 2 5 are close to each other and stick to each other, a shearing effect is generated to cut the pins of the electronic components located in the middle, so that when the cylinder 7 drives the cutting frame 1 4 to move, the cutting frame 1 4 and the cutting frame 2 5 move toward each other to cut the pins of the product.

[0031] Reference Figure 4The material box 3 includes a horizontally arranged positioning block 10, which is fixedly connected to the bottom plate 1 by a supporting plate, and the cutting frame 25 is slidably sleeved on the positioning block 10. When the cutting frame 25 is cut and opened, it is guided by the positioning block 10. The positioning block 10 is provided with a first positioning plate 11 at one end close to the cutting frame 14, and a vertically arranged discharge pipe 12 is provided above the first positioning plate 11. The discharge port of the discharge pipe 12 corresponds to the first positioning plate 11, so that the electronic components dropped from the discharge pipe 12 fall on the first positioning plate 11. At this time, the packaging shell of the electronic components falls on the first positioning plate 11, and the wire feet are exposed to the outside, so that the height of the electronic components is determined, which is convenient for cutting the wire feet. The discharge pipe 12 is fixedly connected to the positioning block 10 by a second positioning plate 13, and the second positioning plate 13 can be used to limit and guide the electronic components in the vertical direction to reduce the risk of electronic component deflection.

[0032] Reference Figure 4 There are three first positioning plates 11, which are respectively located on the left, right and lower sides of the end of the positioning block 10. The top of the positioning block 10 is provided with a chamfer corresponding to the first positioning plate 11, so that electronic components can fall from above and accurately fall on the first positioning plate 11. The second positioning plate 13 and the three first positioning plates 11 form a frame structure for supporting the product. There is a vertical gap between the first positioning plate 11 and the second positioning plate 13, which is convenient for exposing the side wire feet of the electronic components for cutting, which is beneficial to accurately positioning the main packaging part of the electronic components and making the cutting length of each side wire feet consistent.

[0033] A product collection box 8 and a waste collection box 9 are fixedly arranged on the bottom plate 1. The waste collection box 9 is located directly below the discharge pipe 12, so that the waste materials of the cutting edges can directly fall into the waste collection box 9 for recycling. The product collection box 8 is located on the side of the waste collection box 9 close to the cutting frame 4. The cutting frame 4 is provided with an adsorption discharge mechanism for taking out the product, so that after the product is cut, the waste corners enter the waste collection box 9 and the product enters the product collection box 8.

[0034] Reference Figure 5-7The suction discharging mechanism includes a fixed plate fixedly arranged on the cutting frame 4, a connecting rod is fixedly connected to the fixed plate, a piston 15 is rotatably arranged at the end of the connecting rod, so that the piston 15 moves with the movement of the cutting frame 4, and the piston 15 can rotate at a certain angle in a small range, and an air cylinder 16 is provided in the cutting frame 4 and is sealingly and slidably connected to the piston 15, and an elastic spring is provided between the air cylinder 16 and the piston 15. Under the action of the elastic spring, the piston 15 and the air cylinder 16 are always in a state of tending to move away from each other, and the air cylinder 16 is connected to the cutting frame 4 by a rotating structure, and the rotating structure makes the air cylinder 16 close to the material box 3 always tend to tilt downward, and a suction cup 17 connected to the air cylinder 16 is provided on the side of the air cylinder 16 close to the material box 3. When the suction cup When 17 fits with the surface of the electronic components, a closed space is formed inside the air cylinder 16. Under the action of the elastic spring, the air pressure in the closed space inside the air cylinder 16 is lower than the atmospheric pressure, so that the suction cup 17 generates suction to adsorb the electronic components. The air cylinder 16 is provided with an exhaust structure for unloading, so that the suction cup 17 drives the electronic components away from the material box 3. When the electronic components come to the top of the product collection box 8, the sealed space in the air cylinder 16 is destroyed, and the electronic components are separated from the suction cup 17 and fall into the product collection box 8, completing the collection.

[0035] Reference Figure 5-7 The rotating structure includes a rotating ring 18 rotatably arranged on the cutting frame 4. The rotating ring 18 is slidably connected with the air cylinder 16. The air cylinder 16 is guided and supported by the rotating ring 18. A torsion spring is provided between the rotating shaft of the rotating ring 18 and the cutting frame 4, so that the end of the air cylinder 16 with the suction cup 17 always tends to tilt downward, which is beneficial for tilting the electronic components forward when taking out the electronic components, and the waste thread feet left over from the cutting feet at the top of the processing are shaken off into the waste collection box 9.

[0036] Reference Figure 5-7 The exhaust structure includes a pressing block 19 fixedly arranged on the mounting plate 2. The pressing block 19 is arranged corresponding to the air cylinder 16. When the cutting frame 4 drives the air cylinder 16 to reset, the pressing block 19 presses the air cylinder 16 so that the air cylinder 16 and the suction cup 17 stay above the product collection box 8. The piston 15 continues to move with the cutting frame 4, so that the piston 15 gradually moves away from the suction cup 17. An exhaust hole 20 is opened on the air cylinder 16. After the piston 15 moves beyond the position of the exhaust hole 20, the internal air pressure of the air cylinder 16 is restored, and the suction cup 17 loses its adsorption force, causing the electronic components to fall into the product collection box 8.

[0037] In the above, the material falls vertically in the discharge pipe 12, so that the packaging shell of the electronic component is stuck in the frame structure formed by the first positioning plate 11 and the second positioning plate 13, and the wire feet of the electronic component are exposed to the outside, and the cutting frame 14 is driven to move by the cylinder 7, so that the cutting frame 14 and the cutting frame 25 are close to each other, so that the cutter 6 cuts off the wire feet, and at the same time, the inclined air cylinder 16 drives the suction cup 17 to fit the packaging surface of the electronic component, so that the air cylinder 16 twists the torsion spring, so that the air cylinder 16 is in a horizontal position, and as the piston 15 is pushed forward, the air inside the air cylinder 16 is discharged, and between the cutting frame 14 and the cutting frame 5, the suction cup 17 is pressed against the packaging surface of the electronic component, and ... When frame 2 5 is separated, since the wire foot cutting is completed, the product is directly taken away by the suction cup 17 and passes through the two second positioning plates 13, and the electronic components in the discharge pipe 12 fall down to supplement the next cutting. At the same time, after the air cylinder 16 is separated from the pressing state with the electronic components, the torsion spring is reset, causing the air cylinder 16 to tilt downward, so that the wire foot waste that may exist on the top of the electronic components is shaken off into the waste collection box 9. Under the action of the pressing block 19, after the piston 15 moves beyond the position of the exhaust hole 20, the air pressure inside the air cylinder 16 is restored, and the suction cup 17 loses its adsorption force, causing the electronic components to fall into the product collection box 8.

[0038] Reference Figure 1 The synchronization mechanism includes a mounting rod fixedly arranged on the bottom plate 1, on which a gear 22 is fixedly arranged, and a gear rod 14 meshingly connected with the gear 22 is fixedly arranged on the side walls of the cutting frame 1 4 and the cutting frame 2 5, so that when one of the gear rods 14 moves, the gear 22 is driven to rotate, thereby driving the other gear rod 14 to move, and the two gear rods 14 are respectively located on the upper and lower sides of the gear 22, so that the two gear rods 14 move synchronously in opposite directions.

[0039] Reference Figure 2-3 There are four cutters 6 on the cutting frame 1 4 and the cutting frame 2 5, so that the cutting operations on the four sides of the product can be carried out simultaneously, which is convenient for cutting off the multi-sided wire feet of the electrical components at one time and improving the processing efficiency.

[0040] Reference Figure 4 The length and width of the inner wall of the discharge pipe 12 are greater than the length and thickness of the product with thread feet, so that the discharge pipe 12 can accommodate a single product to pass vertically, so that the electronic components can be stacked one by one under the action of gravity, and the feeding can be completed by relying on its own gravity.

[0041] Reference Figure 1 and 4 A brush 21 is provided at the bottom end of the discharge pipe 12. When the suction cup 17 drives the electronic component to reset and move, the top of the electronic component contacts the brush 21, further reducing the risk of the waste of the thread ends remaining on the top of the electronic component.

[0042] The specific working principle of the present invention is as follows:

[0043] When in use, the electronic components are placed vertically in the discharge pipe 12. First, the electronic components fall onto the first positioning plate 11 along the discharge pipe 12. At this time, the packaging shell of the electronic components falls on the first positioning plate 11, and the wire feet are exposed. The cutting frame 1 4 is driven to move by the cylinder 7, so that the cutting frame 1 4 and the cutting frame 2 5 are close to each other, so that the cutter 6 cuts off the wire feet. At the same time, the inclined air cylinder 16 drives the suction cup 17 to fit the packaging surface of the electronic components, so that the air cylinder 16 twists the torsion spring, so that the air cylinder 16 is in a horizontal position. As the piston 15 is pushed forward, the air inside the air cylinder 16 is discharged, and the air in the cutting frame 1 4 is moved. When separated from the cutting frame 5, since the wire foot cutting is completed, the product is directly taken away by the suction cup 17 and passes through the two second positioning plates 13, and the electronic components in the discharge pipe 12 fall down to supplement the next cutting. At the same time, after the air cylinder 16 is separated from the pressing state with the electronic components, the torsion spring is reset, causing the air cylinder 16 to tilt downward, so that the wire foot waste that may exist on the top of the electronic components is shaken off into the waste collection box 9. Under the action of the pressing block 19, after the piston 15 moves beyond the position of the exhaust hole 20, the air pressure inside the air cylinder 16 is restored, and the suction cup 17 loses its adsorption force, causing the electronic components to fall into the product collection box 8.

[0044] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A fully automatic lead cutting device for lead-type electronic components, comprising a base plate (1), characterized in that: A material box (3) and a mounting plate (2) for positioning and supporting the product are arranged on the bottom plate (1), and the material box also includes a symmetrically arranged cutting frame 1 (4) and a symmetrically arranged cutting frame 2 (5). The cutting frame 1 (4) and the mounting plate (2) are connected via a horizontally arranged cylinder (7). The cutting frame 2 (5) is slidably sleeved on the material box (3). A cutting knife (6) is fixedly arranged on the side of the cutting frame 1 (4) facing the cutting frame 2 (5). The two (5) are connected by a synchronization mechanism, so that when the cylinder (7) drives the cutting frame one (4) to move, the cutting frame one (4) and the cutting frame two (5) move towards each other to cut the product. A product collection box (8) and a waste collection box (9) are fixedly arranged on the bottom plate (1). The cutting frame one (4) is provided with an adsorption discharge mechanism for taking out the product, so that after the product is cut, the corner waste enters the waste collection box (9) and the product enters the product collection box (8); The suction discharge mechanism comprises a fixed plate fixedly arranged on the cutting frame (4), a connecting rod fixedly connected to the fixed plate, a piston (15) rotatably arranged on the end of the connecting rod, an air cylinder (16) sealingly and slidably connected to the piston (15) is arranged in the cutting frame (4), an elastic spring is arranged between the air cylinder (16) and the piston (15), the air cylinder (16) and the cutting frame (4) are connected via a rotating structure, a suction cup (17) connected to the air cylinder (16) is arranged on the side of the air cylinder (16) close to the material box (3), and an exhaust structure for unloading is arranged on the air cylinder (16); The rotating structure comprises a rotating ring (18) rotatably arranged on the cutting frame (4), the rotating ring (18) being slidably sleeved with the air cylinder (16), and a torsion spring being arranged between the rotating shaft of the rotating ring (18) and the cutting frame (4), so that one end of the air cylinder (16) provided with the suction cup (17) always tends to tilt downward.

2. The fully automatic lead cutting device for lead-type electronic components according to claim 1, characterized in that: The material box (3) comprises a horizontally arranged positioning block (10), the positioning block (10) is fixedly connected to the bottom plate (1) via a support plate, the second cutting frame (5) is slidably sleeved on the positioning block (10), a first positioning plate (11) is provided at one end of the positioning block (10) close to the first cutting frame (4), a vertically arranged discharge pipe (12) is provided above the first positioning plate (11), and the discharge pipe (12) is fixedly connected to the positioning block (10) via a second positioning plate (13).

3. The fully automatic lead cutting device for lead-type electronic components according to claim 2, characterized in that: Three first positioning plates (11) are provided, and the three first positioning plates (11) are respectively located on the left, right and lower sides of the end of the positioning block (10), so that the second positioning plate (13) and the three first positioning plates (11) form a frame structure for supporting the product.

4. The fully automatic lead cutting device for lead-type electronic components according to claim 2, characterized in that: The length and width of the inner wall of the discharge pipe (12) are both greater than the length and thickness of the product with the molding, so that the discharge pipe (12) can accommodate a single product to pass vertically.

5. The fully automatic lead cutting device for lead-type electronic components according to claim 1, characterized in that: Four cutting knives (6) are provided on the cutting frame 1 (4) and the cutting frame 2 (5), so that the cutting operations on the four sides of the product can be carried out simultaneously.

6. The fully automatic lead cutting device for lead-type electronic components according to claim 1, characterized in that: The synchronization mechanism comprises a mounting rod fixedly mounted on the bottom plate (1), a gear (22) being fixedly mounted on the mounting rod, and a gear rod (14) meshingly connected to the gear (22) being fixedly mounted on the side walls of the first cutting frame (4) and the second cutting frame (5), the two gear rods (14) being respectively located on the upper and lower sides of the gear (22).

7. The fully automatic lead cutting device for lead-type electronic components according to claim 1, characterized in that: The exhaust structure comprises a pressing block (19) fixedly arranged on the mounting plate (2); the pressing block (19) is arranged corresponding to the air cylinder (16); and an exhaust hole (20) is provided on the air cylinder (16).

8. The fully automatic lead cutting device for lead-type electronic components according to claim 2, characterized in that: Brush bristles (21) are provided at the bottom end of the discharge pipe (12).

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