A test apparatus for a thermoelectric material device

Abstract

The application discloses a testing device for thermoelectric material devices, which comprises a testing base, a door body structure and at least two testing table devices. The testing base has a testing inner cavity, one side of the testing inner cavity has an opening, and the door body structure is connected to the testing base. The testing table device comprises a testing base, a temperature control element, a support structure, a movable block and a first driving assembly. The temperature control element is arranged on the testing base, and has a contact side. The temperature control element can adjust the temperature of the contact side. The support structure has a first end and a second end. The first end is connected to the testing base, and the second end is rotatably connected to the movable block. The first driving assembly is connected to the movable block. The user can change the posture and position of the testing base and the temperature control element through the support structure and the first driving assembly, so as to change the temperature difference direction of the testing device on the device to be tested, and thus the adaptability of the testing device to different testing environments and testing requirements is improved.

Description

Technical Field

[0001] This application relates to the field of thermoelectric testing equipment, specifically to a testing device for thermoelectric material devices. Background Technology

[0002] Thermoelectric materials enable the direct conversion between thermal and electrical energy, playing a crucial role in industrial waste heat and environmental heat recovery. The heat recovery capability of thermoelectric materials is closely related to their properties, with key research parameters including the Seebeck coefficient (S), thermal conductivity (κ), electrical conductivity (σ), and the conversion efficiency (η) of the thermoelectric device. However, due to the relatively small Seebeck coefficient (S) of inorganic thermoelectric materials, the potential they can generate in low-temperature environments is relatively small, especially in wearable devices. The potential generated by thermoelectric devices is far lower than the operating voltage of sensors and wearable devices. Although it can be boosted using DC-DC circuits, the efficiency suffers a significant loss after boosting. Therefore, in recent years, numerous studies have emerged on high-thermoelectric-potential ionic thermoelectric material devices. However, research on this type of ionic thermoelectric material device lacks specialized testing equipment. In particular, existing testing equipment typically applies a fixed and unidirectional temperature difference to the device under test, reducing its adaptability to different testing environments and requirements. Summary of the Invention

[0003] The main technical problem solved by this invention is that the direction of the temperature difference applied to the device under test by existing testing equipment is usually fixed and unidirectional, resulting in poor adaptability of the testing equipment to different testing environments and testing requirements.

[0004] In a first aspect, one embodiment provides a testing device for thermoelectric material devices, comprising:

[0005] A test substrate having a test cavity, one side of which has an opening;

[0006] A gate structure, connected to the test substrate, is used to close the opening; and

[0007] At least two test benches are provided, each test bench comprising a test base, a temperature control element, a support structure, a movable block, and a first drive assembly. The test base is used to support the device under test. The temperature control element is disposed on the test base and has a contact side capable of adjusting the temperature of the contact side, which is used to contact the device under test. The support structure has a first end and a second end. The first end is connected to the test base, and the second end is rotatably connected to the movable block. The first drive assembly is connected to the movable block to drive the movable block to perform linear lifting and lowering motion.

[0008] In one embodiment, the test bench device further includes a rotating shaft and a first locking member. The rotating shaft is rotatably connected to the movable block. The rotating shaft has a through first mounting hole, and the second end of the support structure is inserted into the first mounting hole. The first locking member penetrates the wall of the first mounting hole and contacts the second end of the support structure. The first locking member is threadedly connected to the rotating shaft to press the second end of the support structure against the first mounting hole.

[0009] In one embodiment, the test bench device further includes a socket and a second locking member. The socket has a through second mounting hole, and the first end of the support structure is inserted into the second mounting hole. The second locking member penetrates the wall of the second mounting hole and contacts the first end of the support structure. The second locking member is threadedly connected to the socket to press the first end of the support structure against the second mounting hole.

[0010] In one embodiment, the first driving assembly includes a drive motor, a drive screw, and a guide rod. The drive screw is rotatably disposed, and the guide rod is parallel to the drive screw. The movable block is sleeved with the drive screw and the guide rod. The output end of the drive motor is connected to the drive screw. The drive motor is used to drive the drive screw to rotate, thereby causing the movable block to move along the extension direction of the drive screw and the guide rod.

[0011] In one embodiment, the test bench device further includes a second drive assembly, wherein the temperature control element is movably connected to the test base, the second drive assembly is connected to the temperature control element, and the second drive assembly is used to drive the temperature control element to move on the test base.

[0012] In one embodiment, a hot-cold wall device is further included, the hot-cold wall device including a first heat-conducting block and a first heat-conducting channel, the first heat-conducting block being disposed on the side wall of the test cavity; the first heat-conducting channel being disposed inside the first heat-conducting block, the two ends of the first heat-conducting channel having a first heat-conducting inlet and a first heat-conducting outlet respectively, so that the working fluid can enter the first heat-conducting channel through the first heat-conducting inlet and exit the first heat-conducting channel through the first heat-conducting outlet.

[0013] In one embodiment, the temperature control element includes a thermoelectric cooler, a second heat-conducting block, and a second heat-conducting channel. The second heat-conducting block is connected to the test base. One side of the thermoelectric cooler contacts the second heat-conducting block, and the other side is used to contact the device under test. The second heat-conducting channel is disposed inside the second heat-conducting block, and each end of the second heat-conducting channel has a second heat-conducting inlet and a second heat-conducting outlet, so that the working fluid can enter the second heat-conducting channel through the second heat-conducting inlet and exit the second heat-conducting channel through the second heat-conducting outlet.

[0014] In one embodiment, the system further includes a control base, a control panel, and a control device. The control base is connected to the test substrate, and the control panel and control device are connected to the control base. The control panel is electrically connected to the control device.

[0015] In one embodiment, the control seat has a control cavity, and a circulation device is provided in the control cavity. The circulation device includes a water tank and a heating and cooling circulator. The circulation device is used to provide circulating water for heat exchange.

[0016] In one embodiment, the system further includes an ultraviolet lamp box and a humidity control module, which are disposed within the test cavity. The test substrate is provided with a gas interface and a vacuum extraction interface. The gas interface is used to connect to a gas source to adjust the gas environment of the test cavity, and the vacuum extraction interface is used to connect to a vacuum pump to adjust the vacuum level of the test cavity.

[0017] According to the above embodiment, the testing equipment for thermoelectric material devices includes a test substrate, a door structure, and at least two test stage devices. The test substrate has a test cavity with an opening on one side. The door structure is connected to the test substrate and is used to close the opening. The test stage devices include a test base, a temperature control element, a support structure, a movable block, and a first drive assembly. The test base is used to support the device under test. The temperature control element is disposed on the test base and has a contact side. The temperature control element can adjust the temperature of the contact side, which is used to contact the device under test. The support structure has a first end and a second end. The first end is connected to the test base, and the second end is rotatably connected to the movable block. The first drive assembly is connected to the movable block and is used to drive the movable block to perform linear lifting and lowering motion. When the device under test needs to be tested, the support structure can be rotated relative to the movable block, and the movable block can be driven to make linear lifting and lowering movements through the first drive component to change the posture and position of the test base and temperature control element, thereby changing the direction of the temperature difference applied to the device under test by the test equipment, which in turn helps to improve the adaptability of the test equipment to different test environments and test requirements. Attached Figure Description

[0018] Figure 1This is a three-dimensional structural diagram of the test device in one embodiment of this application;

[0019] Figure 2 This is a schematic diagram of the test device from a frontal view in one embodiment of this application;

[0020] Figure 3 For this application Figure 2 A cross-sectional view along the AA direction;

[0021] Figure 4 This is a schematic diagram of the structure of two test benches in a vertical configuration in one embodiment of this application;

[0022] Figure 5 This is a schematic diagram of the structure of two test benches in a horizontal configuration in one embodiment of this application;

[0023] Figure 6 This is a schematic diagram of the structure of two test bases and temperature control element in a vertical configuration in one embodiment of this application;

[0024] Figure 7 This is a schematic diagram of the structure of a single test bench device in one embodiment of this application;

[0025] Figure 8 This is a three-dimensional structural schematic diagram of the hot and cold wall device in one embodiment of this application;

[0026] Figure 9 This is a schematic diagram of the structure of the hot and cold wall device from a frontal view in one embodiment of this application;

[0027] Figure 10 For this application Figure 9 A cross-sectional view along the BB direction;

[0028] Figure 11 This is a schematic diagram of the structure of the test stage device for clamping a thin-film type device under test in one embodiment of this application;

[0029] Reference numerals: 100, Test substrate; 110, Gas interface; 120, Circulating water interface; 130, Cable interface assembly; 140, Vacuum extraction interface; 150, Humidity control module; 150, Inner test shell; 160, Outer test shell; 200, Door structure; 210, Observation window; 300, Test platform device; 310, Test base; 320, Temperature control element; 321, Semiconductor cooling chip; 322, Second heat-conducting block; 323, Second heat-conducting channel; 330, Support structure; 331, First end; 332, Second end; 340, Movable block; 350, First drive assembly; 351, Drive motor; 352, Drive screw; 353, Guide rod; 360, Rotating shaft; 370, First locking component; 380, Sleeve; 390, Second locking component; 3100, Second drive assembly; 3110, Pressure block; 3120, Fixing bolt; 3130, Heat spreader; 400, Hot and cold wall device; 410, First heat conduction block; 420, First heat conduction channel; 500, Control base; 510, Heat dissipation hole; 600, Control panel; 700, Control device; 800, Circulation device; 900, Ultraviolet lamp box. Detailed Implementation

[0030] The present invention will now be described in further detail with reference to specific embodiments and accompanying drawings. Similar elements in different embodiments are referred to by associated similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of this application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to this application are not shown or described in the specification. This is to avoid obscuring the core parts of this application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0031] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0032] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0033] Please refer to Figure 1-10 This embodiment provides a testing device for hotspot material devices.

[0034] Please refer to Figure 1-10 The testing equipment includes a test base 100, a door structure 200, and at least two test benches 300.

[0035] The test base 100 has a test cavity with an opening on one side. A door structure 200 is connected to the test base 100 and is used to close the opening. The test bench device 300 includes a test base 310, a temperature control element 320, a support structure 330, a movable block 340, and a first drive assembly 350. The test base 310 is used to support the device under test. The temperature control element 320 is disposed on the test base 310 and has a contact side. The temperature control element 320 can adjust the temperature of the contact side, which is used to contact the device under test. The support structure 330 has a first end 331 and a second end 332. The first end 331 is connected to the test base 310, and the second end 332 is rotatably connected to the movable block 340. The first drive assembly 350 is connected to the movable block 340 and is used to drive the movable block 340 to perform linear lifting and lowering motion.

[0036] When the device under test needs to be tested, the support structure 330 can be rotated relative to the movable block 340, and the movable block 340 can be driven to make linear lifting and lowering movements through the first drive component 350. This changes the posture and position of the test base 310 and the temperature control element 320, thereby changing the direction of the temperature difference applied to the device under test by the test equipment, which helps to improve the adaptability of the test equipment to different test environments and test requirements. Specifically, in this embodiment, the test cavity is a sealed cavity. The first end 331 of the support structure 330 is perpendicular to the second end 332 of the support structure 330, making the support structure 330 as a whole "L" shape. In other embodiments, the angle between the first end 331 and the second end 332 of the support structure 330 can also be set to other suitable values ​​according to actual needs, such as 30°, 60°, etc.

[0037] Please refer to Figure 1 and 2 In one embodiment, the door structure 200 is provided with an observation window 210, which can be made of transparent quartz material so that the user can observe the condition inside the test cavity.

[0038] Please refer to Figure 4-7In one embodiment, the test bench device 300 further includes a pivot 360 and a first locking member 370. The pivot 360 is rotatably connected to the movable block 340 and has a through first mounting hole. The second end 332 of the support structure 330 is inserted into the first mounting hole. The first locking member 370 penetrates the wall of the first mounting hole and contacts the second end 332 of the support structure 330. The first locking member 370 is threadedly connected to the pivot 360 to press the second end 332 of the support structure 330 against the first mounting hole.

[0039] The rotational connection between the support structure 330 and the movable block 340 is achieved through the cooperation between the rotating shaft 360 and the second end 332 of the support structure 330. When it is necessary to change the position of the second end 332 of the support structure 330 within the first mounting hole, the first locking member 370 can be loosened, and then the second end 332 of the support structure 330 can be moved within the first mounting hole to move it to a suitable position and orientation. Then, the first locking member 370 is tightened to fix the position and orientation of the second end 332 of the support structure 330. Specifically, in this embodiment, the first locking member 370 can be selected from various suitable screw types.

[0040] Please refer to Figure 4-7 In one embodiment, the test bench device 300 further includes a socket 380 and a second locking member 390. The socket 380 has a through second mounting hole, into which the first end 331 of the support structure 330 is inserted. The second locking member 390 penetrates the wall of the second mounting hole and contacts the first end 331 of the support structure 330. The second locking member 390 is threadedly connected to the socket 380 to secure the first end 331 of the support structure 330 against the second mounting hole.

[0041] When it is necessary to change the position of the first end 331 of the support structure 330 within the second mounting hole, the second locking member 390 can be loosened, and then the first end 331 of the support structure 330 can be moved within the second mounting hole to move it to a suitable position and orientation. Then, the second locking member 390 can be tightened to fix the position and orientation of the first end 331 of the support structure 330. Specifically, in this embodiment, the second locking member 390 can be selected from various suitable screw types.

[0042] Specifically, Figure 4 and Figure 5 This demonstrates two testing configurations of the testing equipment, with two test benches 300 forming the cold and hot ends respectively. Please refer to [the documentation / reference]. Figure 5 , Figure 5 The cold and hot ends are arranged horizontally to apply a temperature difference within the same horizontal plane to the device under test. Please refer to [reference needed]. Figure 4 , Figure 4The cold and hot ends are arranged vertically to apply a temperature difference to the device under test. That is, depending on the test environment, the temperature difference can be applied in the vertical direction or in the same horizontal plane.

[0043] It should be noted that gravity can affect the performance of ion thermoelectric devices (especially those using solution as the solvent). Therefore, by rotating the two test stage devices 300, the effect of gravity on device performance can be eliminated when the hot surface of the temperature control element 320 is parallel to the direction of gravity. Furthermore, when the two test stage devices 300 are positioned on the same horizontal plane, they can be used as a heating device, and with the addition of other components, other types of measurements can be performed.

[0044] For inorganic thermoelectric materials, this embodiment provides a method for rapid identification of the PN type of the material, which can improve the efficiency of preliminary screening. Specifically, the device to be tested is clamped on the testing stage device 300, with the upper end heated as the hot end and the lower end cooled as the cold end. A voltmeter is connected between the hot and cold ends. The conductivity type can be determined by the sign of the voltmeter reading: a positive reading for an n-type sample and a negative reading for a p-type sample. This function can be used to quickly screen the prepared thermoelectric materials, improving experimental efficiency.

[0045] The quality of thermal contact between the test sample and the temperature control element 320 is one of the important factors in ensuring the accuracy of test data. This invention applies a certain pressure between the device under test and the temperature control element 320 to reduce contact thermal resistance, ensuring that the temperature of the temperature control element 320 is as equal as possible to the temperature of the sample. Figure 4 As shown, when using the vertical heating mode, the temperature control element 320 at the hot and cold ends directly applies pressure to the device under test, ensuring good thermal contact. Figure 5 As shown, the test bench device 300 also includes a pressure block 3110, a fixing bolt 3120, and a heat spreader 3130. The heat spreader 3130 covers the side of the thermoelectric cooler 321 that is used to contact the device under test. The fixing bolt 3120 connects the pressure block 3110 to the heat spreader 3130. When measuring thin-film type devices under test, the pressure block 3110 is used. Figure 11 The sample loading method shown involves fixing the pressure block 3110 to the heat spreader 3130 at the hot and cold ends of the device under test using fixing bolts 3120, and pressing the device under test onto the heat spreader 3130 by the pressure block 3110 to ensure good contact between the hot and cold ends of the device under test.

[0046] For device performance testing, this invention uses an electronic load. By adjusting the value of the electronic load, the device's output power, open-circuit voltage, short-circuit current, and internal resistance are measured. The application of the electronic load circuit greatly simplifies the testing of the discharge efficiency of thermoelectric devices, eliminating the need for manual connection of external loads and frequent operation of mechanical switches. This ensures that multiple parameters, including output power, open-circuit voltage, short-circuit current, and internal resistance, are obtained in a single test.

[0047] Please refer to Figure 4-7 In one embodiment, the first drive assembly 350 includes a drive motor 351, a drive screw 352, and a guide rod 353. The drive screw 352 is rotatably arranged, and the guide rod 353 is parallel to the drive screw 352. The movable block 340 is sleeved with the drive screw 352 and the guide rod 353. The output end of the drive motor 351 is connected to the drive screw 352. The drive motor 351 is used to drive the drive screw 352 to rotate, so as to drive the movable block 340 to move along the extension direction of the drive screw 352 and the guide rod 353.

[0048] When it is necessary to drive the movable block 340 to perform linear lifting and lowering motion, the drive motor 351 drives the drive screw 352 to rotate, thereby causing the movable block 340 to move along the extension direction of the drive screw 352 and the guide rod 353.

[0049] Please refer to Figure 4-7 In one embodiment, the testing device further includes a second driving component 3100, the temperature control element 320 is movably connected to the testing base 310, the second driving component 3100 is connected to the temperature control element 320, and the second driving component 3100 is used to drive the temperature control element 320 to move on the testing base 310.

[0050] The temperature control element 320 can be driven to move on the test base 310 by the second drive assembly 3100 to adjust the relative position of the temperature control elements 320 of the two test stage devices 300, thereby further improving the adaptability of the test equipment to devices of different sizes and testing requirements. Specifically, when this function is used for performance testing of thin-film thermoelectric materials and devices, the distance between the cold end and the hot end can be adjusted according to the size of the thin-film device or material. The second drive assembly 3100 can be selected from a motor-driven screw drive structure, a motor-driven rack and pinion drive structure, or a cylinder drive structure.

[0051] Please refer to Figure 1-3In one embodiment, as described in 7-10, the testing equipment further includes a hot-cold wall device 400, which includes a first heat-conducting block 410 and a first heat-conducting channel 420. The first heat-conducting block 410 is disposed on the side wall of the testing cavity. The first heat-conducting channel 420 is disposed inside the first heat-conducting block 410, and has a first heat-conducting inlet and a first heat-conducting outlet at its two ends, respectively, so that the working fluid can enter the first heat-conducting channel 420 through the first heat-conducting inlet and exit the first heat-conducting channel 420 through the first heat-conducting outlet.

[0052] The ambient temperature within the test chamber is rapidly adjusted using the first heat-conducting block 410 and the first heat-conducting channel 420. Specifically, rapid heat exchange is achieved by circulating working fluids of different temperatures into and out of the first heat-conducting channel 420 through the first heat-conducting inlet and outlet. In this embodiment, the first heat-conducting block 410 is made of copper; in other embodiments, other materials with high thermal conductivity can be used. This solution effectively controls the temperature range from -10℃ to 60℃, a range sufficient for testing devices using ion thermoelectric materials. Compared to infrared heating, this solution allows for rapid switching between hot and cold temperatures, accelerating the cooling of the chamber at high temperatures and improving the overall testing efficiency. Furthermore, this solution is simple to implement and has low testing costs.

[0053] Please refer to Figure 1-3 In one embodiment, the test substrate 100 includes a double-layered cavity shell, namely an inner test shell 150 and an outer test shell 160, with a certain gap between the inner test shell 150 and the outer test shell 160 for thermal insulation protection. The inner test shell 150 is made of a high thermal conductivity material and is in direct contact with the hot and cold wall device 400, thereby increasing the heat exchange area and improving the rate of uniform temperature distribution inside the test cavity. The double-layered cavity shell also helps to improve the sealing performance of the test cavity.

[0054] Please refer to Figure 1-3 In one embodiment, multiple temperature sensors are installed inside the test cavity to monitor and provide feedback on the temperature value inside the test cavity, and the temperature inside the cavity is controlled by the PID control principle.

[0055] Please refer to Figure 1-3In one embodiment, the test chamber has sufficient pre-installed interfaces, including a gas interface 110, a cooling water circulation interface 120, a cable interface assembly 130, and a vacuum extraction interface 140. The vacuum extraction port, in conjunction with an external vacuum pump, can create a vacuum environment within the test chamber. Furthermore, nitrogen or helium can be introduced through the gas interface 110 during testing to meet the required testing conditions. To regulate the humidity of the entire chamber, a humidity control module 150 is installed inside, allowing for humidity control throughout the chamber. The cable interface assembly 130 is primarily used for testing the electrical parameters of the test samples inside the chamber, providing power and feedback to the test bench device 300, and for thermocouple quick-connect interfaces. All interfaces are sealed to ensure airtightness under vacuum or other atmospheric conditions.

[0056] Please refer to Figure 4-7 In one embodiment, the temperature control element 320 includes a semiconductor cooling chip 321, a second heat-conducting block 322, and a second heat-conducting channel 323. The second heat-conducting block 322 is connected to the test base 310. One side of the semiconductor cooling chip 321 is in contact with the second heat-conducting block 322, and the other side is used to contact the device under test. The second heat-conducting channel 323 is disposed inside the second heat-conducting block 322. The two ends of the second heat-conducting channel 323 have a second heat-conducting inlet and a second heat-conducting outlet, respectively, so that the working fluid can enter the second heat-conducting channel 323 through the second heat-conducting inlet and exit the second heat-conducting channel 323 through the second heat-conducting outlet.

[0057] The thermoelectric cooler 321 can change the temperature of the side in contact with the device under test (DUT) and create a temperature difference between the thermoelectric coolers 321 in the two test stage devices 300, thereby enabling testing of the DUT that is in contact with both thermoelectric coolers 321 simultaneously. Rapid heat exchange can be achieved on the other side of the thermoelectric cooler 321 via the second heat-conducting block 322 and the second heat-conducting channel 323. Specifically, the Peltier effect of the thermoelectric cooler 321 is used to cool and heat the two sides of the cooler respectively. To accurately control the temperature of the cooler, a thermocouple probe is attached to the surface of the temperature control element 320, and PID temperature control technology is used to achieve temperature control. To reduce power consumption and broaden the temperature control range of the temperature control element 320, the other side of the thermoelectric cooler 321 is in contact with the second heat-conducting block 322.

[0058] Furthermore, since the temperature control element 320 in this application includes a semiconductor cooling chip 321, the hot and cold ends of which can be reversed according to the direction of the current, this testing equipment can also fully perform performance testing of pyroelectric materials by taking advantage of this advantage and the testing principle of pyroelectricity.

[0059] Please refer to Figure 1-3In one embodiment, the testing equipment further includes a control base 500, a control panel 600, and a control device 700. The control base 500 is connected to the testing base 100, and the control panel 600 and control device 700 are connected to the control base 500. The control panel 600 and control device 700 are electrically connected. The user can input control commands through the control panel 600 and control the circuit devices to operate according to the commands through the control device 700.

[0060] Please refer to Figure 1-3 In one embodiment, the control base 500 has a control cavity, within which a circulation device 800 is provided. The circulation device 800 includes a water tank and a heating and cooling circulator, and is used to provide circulating water for heat exchange. Liquid working fluid can be stored in the water tank, and the heating and cooling circulator circulates the working fluid at a certain temperature to the first heat-conducting channel 420 and the second heat-conducting channel 323.

[0061] Please refer to Figure 1-3 In one embodiment, the side wall of the control cavity has heat dissipation holes 510, which are used to cooperate with the fan to form convection to control the heat dissipation inside the cavity.

[0062] Please refer to Figure 1-3 In one embodiment, the testing equipment further includes an ultraviolet lamp box 900, which is disposed within the testing cavity and provides an ultraviolet light irradiation environment to the testing cavity. The ultraviolet lamp box 900 is used to study how ultraviolet light induces changes in the Seebeck coefficient and internal resistance of thermoelectric materials. Combined with the existing functions of this testing equipment, it can perform corresponding performance tests on devices under these conditions.

[0063] On the other hand, this embodiment also provides a testing method for hot-spot material devices, which can be applied to the aforementioned testing equipment.

[0064] The testing method includes a sample loading step, which involves selecting and adjusting the relative positions of the two test stage devices 300 according to the properties of the device under test. For example, when testing a block-shaped device under test (including inorganic blocks and ion thermoelectric material blocks), the placement of the device under test is as follows: Figure 4 As shown, when testing a thin-film type device under test (DUT), the DUT is placed in the following position: Figure 5 As shown. Specifically, the relative positions of the two test stage devices 300 can be adjusted and samples can be loaded by means of the first drive assembly 350, the second drive assembly 3100, the first locking member 370, the second locking member 390 and the rotating shaft 360.

[0065] The closing procedure involves closing the door structure 200 and inputting the target cavity temperature, vacuum level, and adjusting the corresponding atmosphere on the control panel 600.

[0066] The parameter input steps involve inputting the target temperatures for the cold and hot ends on the control panel 600, and then using PID control to bring the cold and hot ends to the target temperatures.

[0067] The testing procedure begins by acquiring voltage signals using a digital multimeter (integrated in the control device 700) and measuring the internal resistance of the sample using the four-wire method. A four-quadrant power supply meter is used to perform IV testing on the device and obtain the output power. When constant resistance discharge is required, only an electronic load needs to be used, and the appropriate resistance value needs to be selected to perform the corresponding test.

[0068] The data processing steps involve using the corresponding software to process the collected data and obtain parameters such as open-circuit voltage, current, Seebeck coefficient (or thermoelectric potential), and power.

[0069] The above examples illustrate the present invention only to aid in understanding it and are not intended to limit the scope of the invention. Those skilled in the art can make various simple deductions, modifications, or substitutions based on the principles of this invention.

Claims

1. A testing device for thermoelectric material devices, characterized in that, include: The test substrate has a test cavity with an opening on one side, and the test cavity is a sealed cavity; A door structure, the door structure being connected to the test substrate, the door structure being used to close the opening; as well as At least two test benches are provided, each forming a cold end and a hot end. Each test bench includes a test base, a temperature control element, a support structure, a movable block, and a first drive assembly. The test base supports the device under test. The temperature control element is disposed on the test base and has a contact side capable of adjusting the temperature of the contact side, which is used to contact the device under test. The support structure has a first end and a second end. The first end is connected to the test base, and the second end is rotatably connected to the movable block. The first end of the support structure is perpendicular to the second end, making the overall support structure L-shaped. The first drive assembly is connected to the movable block to drive the movable block in a linear lifting motion. The test bench device also includes a rotating shaft and a first locking member. The rotating shaft is rotatably connected to the movable block. The rotating shaft has a through first mounting hole, and the second end of the support structure is inserted into the first mounting hole. The first locking member penetrates the wall of the first mounting hole and contacts the second end of the support structure. The first locking member is threadedly connected to the rotating shaft to press the second end of the support structure against the first mounting hole. The test bench device also includes a socket and a second locking member. The socket has a through second mounting hole, and the first end of the support structure is inserted into the second mounting hole. The second locking member penetrates the wall of the second mounting hole and contacts the first end of the support structure. The second locking member is threadedly connected to the socket to press the first end of the support structure against the second mounting hole. The support structure is rotated relative to the movable block, and the movable block is driven to make linear lifting and lowering motion through the first drive component, so as to change the attitude and position of the test base and the temperature control element, thereby changing the direction of the temperature difference applied by the test equipment to the device under test.

2. The testing equipment as described in claim 1, characterized in that, The first driving assembly includes a drive motor, a drive screw, and a guide rod. The drive screw is rotatably arranged, and the guide rod is parallel to the drive screw. The movable block is sleeved with the drive screw and the guide rod. The output end of the drive motor is connected to the drive screw. The drive motor is used to drive the drive screw to rotate, so as to drive the movable block to move along the extension direction of the drive screw and the guide rod.

3. The testing equipment as described in claim 1, characterized in that, The test bench device also includes a second drive assembly. The temperature control element is movably connected to the test base. The second drive assembly is connected to the temperature control element and is used to drive the temperature control element to move on the test base.

4. The testing equipment as described in claim 1, characterized in that, It also includes a hot-cold wall device, which includes a first heat-conducting block and a first heat-conducting channel. The first heat-conducting block is disposed on the side wall of the test cavity. The first heat-conducting channel is disposed inside the first heat-conducting block. The two ends of the first heat-conducting channel have a first heat-conducting inlet and a first heat-conducting outlet, respectively, so that the working fluid can enter the first heat-conducting channel through the first heat-conducting inlet and exit the first heat-conducting channel through the first heat-conducting outlet.

5. The testing equipment as described in claim 1, characterized in that, The temperature control element includes a semiconductor cooling chip, a second heat-conducting block, and a second heat-conducting channel. The second heat-conducting block is connected to the test base. One side of the semiconductor cooling chip is in contact with the second heat-conducting block, and the other side is used to contact the device under test. The second heat-conducting channel is disposed inside the second heat-conducting block. The two ends of the second heat-conducting channel have a second heat-conducting inlet and a second heat-conducting outlet, respectively, so that the working fluid can enter the second heat-conducting channel through the second heat-conducting inlet and exit the second heat-conducting channel through the second heat-conducting outlet.

6. The testing equipment as described in claim 1, characterized in that, It also includes a control base, a control panel, and a control device. The control base is connected to the test base, and the control panel and control device are connected to the control base. The control panel is electrically connected to the control device.

7. The testing equipment as described in claim 6, characterized in that, The control base has a control cavity, and a circulation device is provided in the control cavity. The circulation device includes a water tank and a heating and cooling circulator. The circulation device is used to provide circulating water for heat exchange.

8. The testing equipment according to any one of claims 1-7, characterized in that, It also includes an ultraviolet lamp box and a humidity control module, which are set inside the test cavity; the test substrate is provided with a gas interface and a vacuum pumping interface, the gas interface is used to connect to a gas source to adjust the gas environment of the test cavity, and the vacuum pumping interface is used to connect to a vacuum pump to adjust the vacuum level of the test cavity.

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