Display panel, manufacturing method thereof, and display device

Abstract

A display panel has a display area, the display area includes a light-transmitting area and a main display area located around the light-transmitting area. The display panel includes a substrate, a plurality of shielding patterns and a plurality of light-emitting devices, the plurality of shielding patterns are arranged on the substrate and located in the light-transmitting area; the orthographic projections of the plurality of shielding patterns on the substrate are separated from each other. A plurality of light-emitting devices are arranged in the light-transmitting area and on the substrate; each light-emitting device includes a light-emitting layer and a cathode located on a side of the light-emitting layer away from the substrate; each light-emitting device has an effective light-emitting area, and the orthographic projection of the effective light-emitting area on the substrate is located within the orthographic projection range of the cathode of the light-emitting device on the substrate. The orthographic projections of the plurality of cathodes of the plurality of light-emitting devices on the substrate are separated from each other and located on a side of the plurality of shielding patterns away from the substrate; one cathode corresponds to one shielding pattern, and the orthographic projection of each shielding pattern on the substrate covers the orthographic projection of the corresponding cathode on the substrate.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] As people's requirements for visual experience increase, in order to improve the visual effect of the display, it is necessary to increase the proportion of the display area in the display as much as possible, that is, to increase the screen-to-body ratio of the display. Displays with a screen-to-body ratio of 100% or close to 100% are usually called "full screens".

[0003] To achieve a "full screen" design, the front camera needs to be placed on the back side of the display (i.e., the side opposite to the light-emitting side of the display). The front camera needs to have enough light to take clear pictures, so the light transmittance of the area on the display opposite to the front camera is required to be high.

[0004] Public Content

[0005] On the one hand, a display panel is provided. The display panel has a display area, and the display area includes a light-transmitting area and a main display area located around the light-transmitting area. The display panel includes a substrate, a plurality of shielding patterns, and a plurality of light-emitting devices, wherein the plurality of shielding patterns are arranged on the substrate and located in the light-transmitting area; the orthographic projections of the plurality of shielding patterns on the substrate are separated from each other. The plurality of light-emitting devices are arranged in the light-transmitting area and arranged on the substrate; each light-emitting device includes a light-emitting layer and a cathode located on a side of the light-emitting layer away from the substrate; each light-emitting device has an effective light-emitting area, and the orthographic projection of the effective light-emitting area on the substrate is located within the orthographic projection range of the cathode of the light-emitting device on the substrate. The orthographic projections of the plurality of cathodes of the plurality of light-emitting devices on the substrate are separated from each other and located on a side of the plurality of shielding patterns away from the substrate; one cathode corresponds to one shielding pattern, and the orthographic projection of each shielding pattern on the substrate covers the orthographic projection of the corresponding cathode on the substrate.

[0006] In some embodiments, the cathode has a transmittance to visible light that is greater than its transmittance to infrared light; and the shielding pattern has a transmittance to infrared light that is less than or equal to 2%.

[0007] In some embodiments, each light-emitting device further includes an anode, and the anode is located on a side of the light-emitting layer close to the substrate; one anode forms one shielding pattern.

[0008] In some embodiments, each light-emitting device further comprises an anode, and the anode is located on a side of the light-emitting layer close to the substrate. The plurality of shielding patterns are located on a side of the plurality of anodes of the plurality of light-emitting devices close to the substrate; one shielding pattern corresponds to one anode, and the orthographic projection of the shielding pattern on the substrate at least partially overlaps with the orthographic projection of the corresponding anode on the substrate.

[0009] In some embodiments, the display panel further comprises a semiconductor layer, a gate metal layer and a source-drain metal layer. The semiconductor layer is located between the substrate and the plurality of anodes; the gate metal layer is located between the substrate and the plurality of anodes; the source-drain metal layer is away from the substrate relative to the semiconductor layer and the gate metal layer, and is located on a side of the plurality of anodes close to the substrate. The shielding pattern is located on the semiconductor layer or the gate metal layer or the source-drain metal layer.

[0010] In some embodiments, the transmittance of the shielding pattern to visible light is greater than the transmittance to infrared light; and the thickness of the shielding pattern is greater than the thickness of the cathode.

[0011] In some embodiments, the material of the cathode includes a magnesium-silver alloy, and the material of the shielding pattern includes silver.

[0012] In some embodiments, the cathode includes a cathode main body and a cathode connecting portion; the orthographic projection of the anode on the substrate covers the orthographic projection of the cathode main body on the substrate; the cathode connecting portion is electrically connected to the cathode main body, and the orthographic projection of the cathode connecting portion on the substrate does not overlap with the orthographic projection of the anode on the substrate.

[0013] In some embodiments, the blocking pattern includes a blocking pattern main portion and a blocking pattern connecting portion: the orthographic projection of the blocking pattern main portion on the substrate covers the orthographic projection of the cathode main portion on the substrate; the blocking pattern connecting portion is connected to the blocking pattern main portion, and the orthographic projection of the blocking pattern connecting portion on the substrate covers the orthographic projection of the cathode connecting portion on the substrate.

[0014] In some embodiments, the display panel further includes a transparent conductive layer and a first insulating layer. The transparent conductive layer is located between the film layer where the shielding pattern is located and the plurality of anodes; the first insulating layer is located between the transparent conductive layer and the plurality of cathodes. A plurality of first vias are provided in the first insulating layer, and there is a gap between the orthographic projection of each first via on the substrate and the orthographic projection of the anode on the substrate; the orthographic projection of each first via on the substrate is located within the orthographic projection range of the cathode connecting portion on the substrate, and each cathode is electrically connected to the transparent conductive layer through at least one of the first vias.

[0015] In some embodiments, the display panel further comprises at least one cathode connection structure, and the at least one cathode connection structure is made of the same material as the cathode and is disposed in the same layer. The size of the cathode connection structure in the first direction is greater than its size in the second direction; each cathode connection structure is electrically connected to two adjacent cathodes. The first direction is the row direction in which the multiple sub-pixels of the display panel are arranged, and the second direction is the column direction in which the multiple sub-pixels of the display panel are arranged.

[0016] In some embodiments, the display panel includes a plurality of cathode connection structures arranged in a plurality of rows, each row including a plurality of cathode connection structures arranged in sequence along the first direction. Each row of cathode connection structures and the portion of the plurality of cathodes connected to the plurality of cathode connection structures in the row form a cathode connection bar. The cathode connection bar has a size substantially equal to that of the cathode connection structure in the second direction.

[0017] In some embodiments, the display panel further comprises at least one shielding connection structure, and the at least one shielding connection structure is made of the same material as the plurality of shielding patterns and is disposed in the same layer. In the case where the display panel comprises a plurality of cathode connection strips, the display panel comprises a plurality of shielding connection structures arranged in a plurality of rows, each row comprising a plurality of shielding connection structures arranged in sequence along the first direction; each row of shielding connection structures, and the portions of the plurality of shielding patterns connected by the plurality of shielding connection structures in the row, form a shielding connection strip; the orthographic projection of one shielding connection strip on the substrate covers the orthographic projection of one cathode connection strip on the substrate.

[0018] In some embodiments, the anode includes a first anode portion and a second anode portion; the first anode portion and the effective light-emitting area of ​​the light-emitting device in which the first anode portion is located are substantially the same in shape, and the boundary of the first anode portion partially overlaps with the boundary of the anode; the second anode portion is electrically connected to the first anode portion. The cathode includes a first cathode portion and a second cathode portion; the orthographic projection of the first cathode portion on the substrate is covered by the orthographic projection of the first anode portion on the substrate; the second cathode portion is electrically connected to the first cathode portion, and the orthographic projection of the second cathode portion on the substrate is covered by the orthographic projection of the second anode portion on the substrate. In the case where the cathode includes a cathode main body portion and a cathode connecting portion, the first cathode portion and the second cathode portion form the cathode main body portion, and the shape of the cathode main body portion is substantially the same as that of the anode. In the case where the display panel also includes at least one cathode connecting structure, the shape of the cathode is substantially the same as that of the anode.

[0019] In some embodiments, the display panel further includes a pixel circuit layer, a second insulating layer, a connecting line layer, and a third insulating layer, which are sequentially arranged along a direction perpendicular to the substrate and pointing from the substrate to the anode and are arranged between the substrate and the film layer where the multiple anodes are located. The pixel circuit layer includes multiple first pixel circuits arranged around the light-transmitting area; multiple second vias are arranged in the second insulating layer; multiple third vias are arranged in the third insulating layer; the connecting line layer includes multiple connecting lines, the first end of each connecting line is electrically connected to a pixel circuit through a second via, and the second end is electrically connected to the second anode part of an anode through a third via; in the case where the display panel further includes a transparent conductive layer, the transparent conductive layer is located on a side of the third insulating layer away from the substrate, the third via passes through the transparent conductive layer, and the conductive material in the third via for electrically connecting the connecting line and the corresponding anode is electrically insulated from the transparent conductive layer.

[0020] In some embodiments, the connection line layer further comprises a plurality of pads, each of which is electrically connected to the second end of one of the connection lines, and each of which is electrically connected to the second anode portion of one of the anodes through one of the third via holes. In the case where the display panel comprises a plurality of cathode connection bars, the orthographic projections of the third via holes and the pads on the substrate at least partially overlap with the orthographic projection of one of the cathode connection bars on the substrate.

[0021] In some embodiments, the display panel includes a plurality of sub-pixels, each sub-pixel includes a light-emitting device; the plurality of sub-pixels include a plurality of red sub-pixels, a plurality of green sub-pixels, and a plurality of blue sub-pixels. The shape of the first cathode portion of the cathode of the light-emitting device of the green sub-pixel is substantially circular; the shape of the first cathode portion of the cathode of the light-emitting device of the red sub-pixel is substantially elliptical.

[0022] In some embodiments, the minimum spacing between the first cathode portions of two green sub-pixels is smaller than the minimum spacing between the first cathode portions of two other sub-pixels of the same color.

[0023] In some embodiments, the effective light emitting areas of the light emitting devices of the red sub-pixels and the blue sub-pixels are arranged alternately along the first direction; and the effective light emitting areas of the light emitting devices of the green sub-pixels are arranged along the second direction.

[0024] On the other hand, a method for manufacturing a display panel is provided, the method comprising: manufacturing a plurality of mutually separated shielding patterns on a substrate; manufacturing a plurality of light-emitting layers on a side of the plurality of shielding patterns away from the substrate; manufacturing a cathode film on a side of the plurality of light-emitting layers away from the substrate; using a laser to irradiate a region of the substrate corresponding to a light-transmitting region of the display panel from a side of the substrate away from the cathode film, removing a portion of the cathode film in the region that is not shielded by the plurality of shielding patterns, and forming a plurality of mutually separated cathodes. Each light-emitting layer and its corresponding cathode form part of a light-emitting device, each light-emitting device having an effective light-emitting region, the orthographic projection of the effective light-emitting region on the substrate being within the orthographic projection range of the cathode of the light-emitting device on the substrate.

[0025] In some embodiments, the method of manufacturing a plurality of mutually separated shielding patterns on the substrate includes: manufacturing a plurality of mutually separated anodes on the substrate. Each of the light-emitting devices includes an anode, and one anode forms one shielding pattern.

[0026] In some embodiments, the method for making a plurality of mutually separated shielding patterns on a substrate includes: making a patterned semiconductor layer, a patterned gate metal layer, and a patterned source-drain metal layer on the substrate; forming a plurality of shielding patterns in the process of patterning the semiconductor layer or the gate metal layer or the source-drain metal layer; wherein the source-drain metal layer is away from the substrate relative to the semiconductor layer and the gate metal layer. Between making a plurality of mutually separated shielding patterns on a substrate and making a plurality of light-emitting layers, the method further includes: making a plurality of anodes on the substrate; each of the light-emitting devices includes an anode.

[0027] In some embodiments, between making a plurality of mutually separated shielding patterns on the substrate and making a plurality of anodes, the manufacturing method further includes: making a transparent conductive layer on the side of the source-drain metal layer away from the substrate; making a first insulating layer on the side of the transparent conductive layer away from the substrate; and making a plurality of first vias in the first insulating layer. There is a gap between the orthographic projection of each first via on the substrate and the orthographic projection of the anode on the substrate, and the orthographic projection of each first via on the substrate is within the orthographic projection range of the shielding pattern on the substrate.

[0028] In some embodiments, a plurality of shielding connection structures are formed in the process of patterning the semiconductor layer or the gate metal layer or the source-drain metal layer. The plurality of shielding connection structures and the shielding patterns are located in the same film layer; the size of each shielding connection structure in the first direction is larger than its size in the second direction; the first direction is the row direction in which the plurality of sub-pixels of the display panel are arranged, and the second direction is the column direction in which the plurality of sub-pixels of the display panel are arranged. Each of the shielding connection structures is connected to two of the shielding patterns; the plurality of shielding connection structures are arranged in a plurality of rows, and each row includes a plurality of shielding connection structures arranged in sequence along the first direction; each row of shielding connection structures, and the portion of the plurality of shielding patterns connected to the plurality of shielding connection structures in the row, form a shielding connection strip.

[0029] In some embodiments, before using the laser to irradiate the area of ​​the substrate corresponding to the light-transmitting area of ​​the display panel from the side of the substrate away from the cathode film, the manufacturing method further includes: arranging a mask plate on the side of the substrate away from the cathode film. The mask plate includes at least one light blocking line, and the orthographic projection of each light blocking line on the substrate is connected to the orthographic projection of at least two anodes on the substrate.

[0030] In another aspect, a display device is provided, the display device comprising a display panel and a functional device, the display panel being any of the display panels in the above embodiments. The functional device is arranged on the back side of the display panel and is located in a light-transmitting area of ​​the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0032] Figure 1 is a top view of a display panel according to some embodiments;

[0033] Figure 2 for Figure 1 Sectional view along section line AA;

[0034] Figure 3 for Figure 1 A cross-sectional view along section line BB;

[0035] Figure 4 for Figure 1 Enlarged view of the middle area M;

[0036] Figure 5 for Figure 4 A cross-sectional view along section line CC;

[0037] Fig. 6A A top view of a cathode in a light-transmitting region according to some embodiments;

[0038] Figure 6B A top view of an anode of a light-transmitting region according to some embodiments;

[0039] Figure 6C for Fig. 6A A cross-sectional view along section line DD;

[0040] Fig. 7A is another top view of a cathode in a light-transmitting region according to some embodiments;

[0041] Figure 7B is another top view of an anode of a light-transmitting region according to some embodiments;

[0042] Figure 7C is a top view of a shielding pattern according to some embodiments;

[0043] Fig. 8A for Fig. 6A A sectional view along the section line E'-E' to E"-E";

[0044] Figure 8B for Fig. 6A Another cross-sectional view along the section line E'-E' to E"-E";

[0045] Figure 8C for Fig. 6A Another cross-sectional view along the section line E'-E' to E"-E";

[0046] Fig.8D for Fig. 6A Another cross-sectional view along the section line E'-E' to E"-E";

[0047] Fig. 9 is another top view of a cathode in a light-transmitting region according to some embodiments;

[0048] Fig. 10A is another top view of a shielding pattern according to some embodiments;

[0049] Fig. 10B is a schematic diagram of a mask according to some embodiments;

[0050] Fig.11A is another top view of a shielding pattern according to some embodiments;

[0051] Fig. 11B for Fig. 9 A cross-sectional view along section line FF;

[0052] Fig. 11C for Fig. 9 A cross-sectional view along section line GG;

[0053] Fig.11D for Fig. 9 Another cross-sectional view along section line GG;

[0054] Fig.12 is a curve diagram of transmittance of a cathode film to light of different wavelengths according to some embodiments;

[0055] Fig.13 is a curve diagram of transmittance of silver layers of different thicknesses to light of different wavelengths according to some embodiments;

[0056] Fig.14 is an electron microscope image of a boundary between an anode and a cathode according to some embodiments;

[0057] Fig.15 is a flow chart of a method for manufacturing a display panel according to some embodiments;

[0058] Fig.16 is another flow chart of a method for manufacturing a display panel according to some embodiments;

[0059] Fig.17 is another flow chart of a method for manufacturing a display panel according to some embodiments;

[0060] Fig.18 is a schematic diagram of a manufacturing step of a display panel according to some embodiments;

[0061] Fig.19 is a schematic diagram of another manufacturing step of a display panel according to some embodiments;

[0062] Fig. 20 is a schematic diagram of another manufacturing step of a display panel according to some embodiments. DETAILED DESCRIPTION

[0063] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0064] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "some embodiments", "exemplary embodiments", "example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics described may be included in any one or more embodiments or examples in any appropriate manner.

[0065] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0066] When describing some embodiments, the expressions "connected", "electrically connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct or indirect physical contact with each other. For another example, when describing some embodiments, the term "electrically connected" may be used to indicate that two or more components are in direct or indirect electrical contact.

[0067] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of variation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0068] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0069] In this article, the expression "the orthographic projection of A on the substrate covers the orthographic projection of B on the substrate" is used, which means that the boundary of the orthographic projection of A on the substrate coincides with the boundary of the orthographic projection of B on the substrate, or, the boundary of the orthographic projection of A on the substrate and the boundary of the orthographic projection of B on the substrate at least partially do not coincide, and the orthographic projection of B on the substrate is within the range of the orthographic projection of A on the substrate.

[0070] In this article, the expression "same-layer arrangement" is used, which means that a film layer with a specific pattern is formed by a single patterning process using the same mask. Depending on the specific pattern, a single patterning process may include multiple exposure, development or etching processes, and the specific pattern in the formed layer structure may be continuous or discontinuous, and these specific patterns may also be at different heights or have different thicknesses.

[0071] like Figure 1 As shown, some embodiments of the present disclosure provide a display device 100, which can be any product or component with a display function, such as a television, a monitor, a laptop computer, a tablet computer, a mobile phone, a navigator, etc.

[0072] The display device 100 adopts the technology of setting functional components on the back side of the screen, and the functional components are, for example, a front camera component, an under-screen fingerprint component, a 3D face recognition component, an iris recognition component, a proximity sensor, and other components that can realize specific functions. For example, when a front camera component is set on the back side of the screen, the display device 100 adopts the under-screen camera technology.

[0073] See also Figure 1 The display device 100 includes a display panel 110 . The display panel 110 has a display area 10 . The display area 10 includes a light-transmitting area 101 and a main display area 102 located around the light-transmitting area 101 .

[0074] A plurality of sub-pixels are arranged in the main display area 102, which mainly performs the function of displaying images.

[0075] A plurality of sub-pixels are also arranged in the light-transmitting area 101, so that the light-transmitting area 101 can participate in image display and can transmit light. The light-transmitting area 101 is not located in a unique position in the display area 10, for example, it can be arranged in the middle of the upper part of the display area 310 (see Figure 1 ), or it can be set on the left or right side of the upper part of the display area 10, or it can be set in the middle position of the lower part of the display area 10, and so on.

[0076] See also Figure 2 , the functional device 120 is arranged on the back side of the light-transmitting area 101 of the display panel 110. Exemplarily, a front camera assembly is arranged on the back side of the light-transmitting area 101. When the display panel 110 displays a picture, both the light-transmitting area 101 and the main display area 102 can display the picture, and when the front camera assembly captures an image, external light can pass through the light-transmitting area 101 to the front camera assembly.

[0077] In some embodiments, the display panel 110 may further include a peripheral region 20, and the peripheral region 20 may surround the display region 10 (see Figure 1 ), or may only exist on one side or multiple sides of the display area 10. Sub-pixels may also be provided in the peripheral area 20 so that the peripheral area also has a display function, thereby making the screen ratio of the display panel 110 close to or reach 100%.

[0078] In some embodiments, the display panel 110 may be an organic light-emitting diode (OLED) display panel. Figure 3 , Figure 3 for Figure 1 The display panel 110 includes a substrate 11, a sub-pixel 30 disposed on the substrate 11, and an encapsulation layer 40 for encapsulating the sub-pixel 30. Figure 3 Each sub-pixel 30 of the display panel 110 includes a pixel circuit 301 and a light-emitting device 302 disposed on a substrate 11 .

[0079] In some embodiments, see Figure 3 The pixel circuit 301 includes a plurality of thin film transistors TFT and at least one storage capacitor Cst, wherein the thin film transistor TFT includes an active layer 12, a gate 13, a source 14, and a drain 15 arranged on a substrate 11; the storage capacitor Cst includes a first electrode 16 and a second electrode 17 arranged opposite to each other.

[0080] The film layer where the active layer 12 is located is the semiconductor layer 210. The gate electrode 13 and the first electrode 16 are made of the same material and are disposed in the same layer. The film layer where the two are located is called the first gate metal layer 221, and the film layer where the second electrode 17 is located can be called the second gate metal layer 222, that is, the display panel 110 can include two layers of gate metal layers 220. The film layer where the source electrode 14 and the drain electrode 15 are located is called the first source-drain metal layer 231.

[0081] A gate insulating layer 18 is provided between the semiconductor layer 210 and the first gate metal layer 221 ; a first interlayer insulating layer 19 is provided between the first gate metal layer 221 and the second gate metal layer 222 ; and a second interlayer insulating layer 21 is provided between the second gate metal layer 222 and the first source-drain metal layer 231 .

[0082] In addition, a passivation layer 22 and a planarization layer 23 are provided on a side of the first source / drain metal layer 231 away from the substrate 11 .

[0083] One of the source electrode 14 and the drain electrode 15 of the thin film transistor TFT is electrically connected to the light emitting device 302 to transmit a voltage signal to the light emitting device 302 to drive the light emitting device 302 to emit light. The source electrode 14 or the drain electrode 15 of the thin film transistor TFT can be electrically connected to the light emitting device 302 directly or indirectly. Figure 3 As shown, the display panel 110 further includes another source-drain metal layer disposed on the side of the planar layer 23 away from the substrate 11, which may be referred to as a second source-drain metal layer 232. A connecting electrode 24 is disposed in the second source-drain metal layer 232, and the drain electrode 15 of the thin film transistor TFT is electrically connected to the light-emitting device 302 via the connecting electrode 24. In this case, the display panel 110 includes two source-drain metal layers 230.

[0084] See also Figure 3 The light emitting device 302 is located on the side of the film layer where the pixel circuit 301 is located away from the substrate 11, and includes an anode 25, a light emitting layer 26, and a cathode film 27. In the case where the display panel 110 includes two source-drain metal layers 230, at least one insulating layer 28 is provided between the anode 25 and the second source-drain metal layer 232, and the anode 25 is electrically connected to the connection electrode 24 through a via hole provided in the at least one insulating layer 28.

[0085] See also Figure 3 The display panel further includes a pixel defining layer 29, the pixel defining layer 29 includes a plurality of opening areas, one light emitting device 302 corresponds to one opening area, and its light emitting layer 26 is at least partially disposed in the corresponding opening area.

[0086] In some embodiments, the light emitting device 302 further includes one or more layers of an electron transporting layer (ETL), an electron injection layer (EIL), a hole transporting layer (HTL) and a hole injection layer (HIL).

[0087] The display panel 110 may be a top-emitting display panel, in which case the anode 25 close to the substrate 11 is opaque, and the cathode film 27 away from the substrate 11 is transparent or translucent; the display panel 110 may also be a bottom-emitting display panel, in which case the anode 25 close to the substrate 11 is transparent or translucent, and the cathode film 27 away from the substrate 11 is opaque; the display panel 110 may also be a double-sided light-emitting display panel, in which case the anode 25 close to the substrate 11 and the cathode film 27 away from the substrate 11 are both transparent or translucent.

[0088] In order to improve the sensitivity of the functional device 120 disposed on the back side of the light-transmitting area 101 of the display panel 110 , it is necessary to ensure that the functional device 120 can receive a sufficient amount of light, so the light transmittance of the light-transmitting area 101 needs to be improved.

[0089] In some embodiments, reducing the resolution of the light-transmitting area 101 , that is, reducing the distribution density of the sub-pixels 30 in the light-transmitting area 101 , can improve the light transmittance of the light-transmitting area 101 .

[0090] In other embodiments, for an OLED display panel, the cathode film 27 is usually a whole layer design. Although the cathode film 27 can transmit visible light, its transmittance to visible light is low. Therefore, the cathode film 27 located in the light-transmitting area 101 on the display panel 110 can be patterned to improve the transmittance of the light-transmitting area 101.

[0091] In the related art, a mask plate is used in combination with a vapor deposition process to pattern the cathode film in the light-transmitting area. However, due to the influence of positioning error, measurement error, and process accuracy, the accuracy of patterning the cathode film in the related art is low.

[0092] Some embodiments of the present disclosure provide a display panel 110, see Figure 6C The display panel 110 includes a substrate 11, a plurality of shielding patterns 31 and a light emitting device 302. The plurality of shielding patterns 31 are disposed on the substrate 11 and are located in the light transmission area 101.

[0093] See also Figure 6B, the orthographic projections of the plurality of shielding patterns 31 on the substrate 11 are separated from each other.

[0094] See See Fig. 6A and Figure 6C , a plurality of light emitting devices 302 are arranged in the light-transmitting area 101 and on the substrate 11; each light emitting device 302 includes a light emitting layer 26 and a cathode 32 located on the side of the light emitting layer 26 away from the substrate 11. Each light emitting device 302 has an effective light emitting area 261, and the orthographic projection of the effective light emitting area 261 on the substrate 11 is located within the orthographic projection range of the cathode 32 of the light emitting device 302 on the substrate 11.

[0095] See also Fig. 6A , the positive projections of the plurality of cathodes 32 of the plurality of light emitting devices 302 on the substrate 11 are separated from each other; Figure 6C , multiple cathodes 32 of multiple light-emitting devices 302 are located on the side of multiple shielding patterns 31 away from the substrate 11; one cathode 32 corresponds to one shielding pattern 31, and the orthographic projection of each shielding pattern 31 on the substrate 11 covers the orthographic projection of the corresponding cathode 32 on the substrate 11.

[0096] See Figure Figure 6A to Figure 6C In the process of manufacturing the display panel 110, a plurality of mutually separated shielding patterns 31 are first manufactured on the substrate 11; then a light-emitting layer 26 and a cathode film 27 are manufactured on the side of the plurality of shielding patterns 31 away from the substrate 11; a laser is used to irradiate the area of ​​the substrate 11 corresponding to the light-transmitting area 101 of the display panel 110 from the side of the substrate 11 away from the cathode film 27, and the portion of the cathode film 27 in the area that is not blocked by the plurality of shielding patterns 31 is removed, thereby forming a plurality of mutually separated cathodes 32.

[0097] Compared with the method of patterning the cathode film by using a mask plate in combination with vapor deposition, in the display panel 110 of the embodiment of the present disclosure, the laser irradiates the substrate 11 from the side of the substrate 11 away from the cathode film 27. During this process, part of the laser is blocked by multiple shielding patterns 31; the laser that is not blocked by the multiple shielding patterns 31 is irradiated onto the cathode film 27, and the part of the cathode film 27 irradiated by the laser is removed, and the part not irradiated by the laser is retained, forming multiple independent cathodes 32. Based on the principle that light propagates in a straight line, the orthographic projection shape of the cathode 32 on the substrate 11 is substantially the same as the orthographic projection shape of the shielding pattern 31 on the substrate 11, and the orthographic projection of the shielding pattern 31 on the substrate 11 covers the orthographic projection of the cathode 32 on the substrate 11.

[0098] The shielding pattern 31 can be patterned by vapor deposition, etching and other processes, and its patterning production accuracy is high. The position, shape and size of multiple shielding patterns 31 can be controlled to control the pattern formed by multiple cathodes 32, thereby improving the accuracy of patterning the cathode film 27, removing as much unnecessary cathode material as possible, and improving the aperture ratio of the cathode film 27, thereby improving the transmittance of the film layer where the multiple cathodes 32 are located to visible light.

[0099] In some embodiments, the cathode 32 has a transmittance of visible light greater than that of infrared light. The cathode 32 is located on the side of the light-emitting layer 26 away from the substrate 11, and the light emitted by the light-emitting layer 26 needs to be emitted through the cathode 32. If a laser in the visible light band is used to irradiate the cathode film 27, part of the laser will be emitted through the cathode film 27, and the efficiency of laser removal of the cathode film 27 is low. Therefore, a laser in the infrared light band can be used to irradiate the area on the substrate 11 corresponding to the light-transmitting area 101 of the display panel 110 to improve the efficiency of patterning the cathode film 27. The cathode 32 has a transmittance of visible light greater than that of infrared light, so that the cathode 32 can pass through at least part of the visible light for displaying the picture, and can absorb at least part of the infrared light, so that the part of the cathode film 27 irradiated by the laser in the infrared light band can be removed.

[0100] In some embodiments, the transmittance of the shielding pattern 31 to infrared light is less than or equal to 2%, for example, 2%, 1.5%, 1%, 0.5%, or 0%. In this way, when a laser in the infrared light band is used to irradiate the area of ​​the substrate 11 corresponding to the light-transmitting area 101 of the display panel 110, the shielding pattern 31 can absorb most or all of the infrared light, reduce the laser in the infrared light band that passes through the shielding pattern 31, and prevent the infrared light from directly irradiating the part of the cathode film 27 that is blocked by the shielding pattern 31.

[0101] In some embodiments, the material of the cathode film 27 includes magnesium-silver alloy. On the one hand, the magnesium-silver alloy can transmit visible light, and when the display panel displays an image, light can be emitted from multiple cathodes 32. On the other hand, the magnesium-silver alloy can absorb infrared light. When the infrared light is irradiated onto the cathode film 27 made of magnesium-silver alloy, the part not blocked by the blocking pattern 31 can be removed.

[0102] See also Fig.12 , Fig.12The transmittance curve of the cathode film 27 to light of different wavelengths is shown when the thickness of the cathode film 27 is 13 nanometers. In some examples, infrared light with a wavelength of 900 mm can be used, and at this time, the transmittance of the cathode film 27 is about 29%; infrared light with a wavelength of 940 mm can also be used, and at this time, the transmittance of the cathode film 27 is about 27.2%; infrared light with a wavelength of 960 mm can also be used, and at this time, the transmittance of the cathode film 27 is about 26.1%. It should be understood that infrared light of other wavelengths can also be used, which will not be listed here one by one.

[0103] In some embodiments, see Figure 6C Each light emitting device 302 further includes an anode 25, which is located on the side of the light emitting layer 26 close to the substrate 11; one anode 25 forms a shielding pattern 31. When the anode 25 is made of an opaque metal, the anode 25 can absorb infrared light. The anode 25 can be set to the shielding pattern 31, so that the film structure of the display panel 110 is simple, no new film layer needs to be introduced, and the manufacturing cost is low.

[0104] When a shielding pattern 31 is formed on an anode 25, illustratively, the thickness of the anode 25 is 100 nanometers, and the material of the anode 25 is opaque; or; when the thickness of the material of the anode 25 is 100 nanometers, the infrared transmittance is less than or equal to 2%.

[0105] For example, refer to Fig. 6A and Figure 6B Based on the principle that light propagates in a straight line, the orthographic projection of the cathode 32 on the substrate 11 and the orthographic projection of the corresponding anode 25 on the substrate 11 are roughly the same in shape and size, and the orthographic projection of one anode 25 on the substrate 11 covers the orthographic projection of the cathode 32 on the substrate 11 opposite to it.

[0106] Reference Figure 6C As an illustration, the orthographic projection of the boundary of the cathode 32 on the substrate 11 coincides with the orthographic projection of the boundary of the anode 25 on the substrate 11. However, in some embodiments, when the laser is irradiated to the anode 25, the laser may generate a diffraction phenomenon. Fig.14 , Fig.14 When a shielding pattern 31 is made for the anode 25, in the microscopic electron microscope images of the boundary of the anode 25 and the boundary of the cathode 32, the boundary of the orthographic projection of the anode 25 on the substrate 11 exceeds the boundary of the orthographic projection of the cathode 32 on the substrate 11 by a certain distance D4, that is, the boundary of the orthographic projection of the cathode 32 on the substrate 11 is located on the inner side of the boundary of the orthographic projection of the anode 25 on the substrate 11, that is, the orthographic projection area of ​​the anode 25 on the substrate 11 is larger than the orthographic projection area of ​​the cathode 32 on the substrate 11 opposite to it.

[0107] In some embodiments, see Fig. 8A Each light emitting device 302 includes an anode 25, and the anode 25 is located on a side of the light emitting layer 26 close to the substrate 11. A plurality of shielding patterns 31 are located on a side of the anodes 25 of the plurality of light emitting devices 302 close to the substrate 11; one shielding pattern 31 corresponds to one anode 25, and the orthographic projection of the shielding pattern 31 on the substrate 11 at least partially overlaps with the orthographic projection of the corresponding anode 25 on the substrate 11.

[0108] For example, the orthographic projection of the shielding pattern 31 on the substrate 11 partially overlaps with the orthographic projection of its corresponding anode 25 on the substrate 11, that is, the orthographic projection of the shielding pattern 31 on the substrate 11 partially covers the orthographic projection of the anode 25 on the substrate 11. In this case, the shielding pattern 31 and the anode 25 jointly determine the shape of the cathode 32, and the shielding pattern 31 can play a role in partially protecting the anode 25.

[0109] For another example, the orthographic projection of the shielding pattern 31 on the substrate 11 completely overlaps with the orthographic projection of its corresponding anode 25 on the substrate 11, that is, the orthographic projection of the shielding pattern 31 on the substrate 11 completely covers the orthographic projection of the anode 25 on the substrate 11. In this case, the shape of the cathode 32 is determined by the shielding pattern 31, and the shielding pattern 31 can completely protect the anode 25.

[0110] When the material of the anode 25 is a transparent material or a translucent material and the material of the anode 25 can transmit infrared light, or when there is a risk of damaging the anode 25 by laser in the infrared light band, a plurality of shielding patterns 31 are arranged on one side of the anodes 25 close to the substrate 11, and one shielding pattern 31 corresponds to one anode 25, and the shielding pattern 31 can protect the anode 25.

[0111] Infrared light has light energy, and the temperature of the film layer will rise after absorbing infrared light. The anode 25 is a part of the light-emitting device 302, and the increase in the temperature of the anode 25 may cause damage to the anode 25. The shielding pattern 31 can reduce the risk of damage to the anode 25 due to the increase in temperature, and improve the safety and yield rate of the manufacturing process of the display panel 110.

[0112] In some embodiments, see Figure 3 The display panel 110 further includes a semiconductor layer 210, a gate metal layer 220, and a source-drain metal layer 230. The semiconductor layer 210 is located between the substrate 11 and the plurality of anodes 25; the gate metal layer 220 is located between the substrate 11 and the plurality of anodes 25; the source-drain metal layer 230 is away from the substrate 11 relative to the semiconductor layer and the gate metal layer 220, and is located on the side of the plurality of anodes 25 close to the substrate 11. The shielding pattern 31 is located on the semiconductor layer 210, the gate metal layer 220, or the source-drain metal layer 230.

[0113] It should be noted that the gate metal layer 220 may be located on the side of the semiconductor layer 210 away from or close to the substrate 11. In the case where the gate metal layer 220 is located on the side of the semiconductor layer 210 away from the substrate 11, the gate 13 of the thin film transistor of the pixel circuit is located on the side of the active layer 12 away from the substrate 11, and the thin film transistor is a top gate structure; in the case where the gate metal layer 220 is located on the side of the semiconductor layer 210 close to the substrate 11, the gate 13 of the thin film transistor of the pixel circuit is located on the side of the active layer 12 close to the substrate 11, and the thin film transistor is a bottom gate structure.

[0114] In the above embodiment, by setting the blocking pattern 31 in the semiconductor layer 210 or the gate metal layer 220 or the source and drain metal layer 230, it is not necessary to add an additional film layer to the display panel 110, thereby not affecting the thickness of the display panel 110 and without adding additional process steps.

[0115] In which, when the display panel 110 includes two layers of gate metal layers 220, the blocking pattern 31 can be set in either of the two layers of gate metal layers 220; when the display panel 110 includes two layers of source and drain metal layers 230, the blocking pattern 31 can be set in either of the two layers of source and drain metal layers 230.

[0116] For example, see Fig. 8A , the shielding pattern 31 is located in the first source-drain metal layer 231 where the source 14 and the drain 15 of the thin film transistor are located. Figure 8B , the shielding pattern 31 is located in the first gate metal layer 221 where the gate electrode 13 of the thin film transistor is located. Figure 8C , the blocking pattern 31 is located in the semiconductor layer 210 .

[0117] In addition, if Figure 8A to Figure 8C As shown, all of the multiple shielding patterns 31 can be set in the same film layer of the semiconductor layer 210, the gate metal layer 220 and the source-drain metal layer 230. The multiple shielding patterns 31 can also be set in at least two film layers of the semiconductor layer 210, the gate metal layer 220 and the source-drain metal layer 230, respectively. Two or more shielding patterns 31 can also be set under the same light-emitting device 302, so as to achieve a better protection effect on the anode 25 of the light-emitting device 302 by using multiple shielding patterns 31. For example, refer to Fig.8D Two layers of shielding patterns 31 are disposed on a side of each anode 25 close to the substrate 11 , one of the two layers of shielding patterns 31 is located at the semiconductor layer 210 , and the other is located at the first gate metal layer 221 .

[0118] When the shielding pattern 31 is located in the semiconductor layer 210, the gate metal layer 220, or the source-drain metal layer 230, the material of the shielding pattern 31 can be the same as the metal material of the film layer where it is located. Exemplarily, when the shielding pattern 31 is located in the source-drain metal layer 230, the material of the shielding pattern 31 can be the same as the material of the source-drain metal layer 230. In this case, multiple shielding patterns 31 can be formed in the process of manufacturing the patterned source-drain metal layer 230, without adding additional processes, simplifying the manufacturing process of the display panel and reducing the production cost of the display panel.

[0119] In some embodiments, the transmittance of the shielding pattern 31 to visible light is greater than the transmittance to infrared light, so that the shielding pattern 31 can be used to shield the infrared laser to prevent the anode 25 from being damaged by the infrared laser. Exemplarily, the transmittance of the shielding pattern 31 to infrared light is less than or equal to 2%, such as 2%, 1.5%, 1%, 0.5%, or 0%, so as to block most or all of the infrared laser.

[0120] In some embodiments, the thickness of the shielding pattern 31 is greater than the thickness of the cathode 32. Since the transmittance of the shielding pattern 31 and the cathode 32 to visible light is greater than the transmittance to infrared light, if the shielding pattern 31 and the cathode 32 are made of the same or similar materials, the thickness of the shielding pattern 31 is greater than the thickness of the cathode 32. When the area on the substrate 11 corresponding to the light-transmitting area 101 of the display panel 110 is irradiated with a laser in the infrared light band, the shielding pattern 31 can be ensured not to melt into a liquid state or evaporate into a gaseous state under the irradiation of infrared light, while ensuring that the portion of the cathode film 27 irradiated by the infrared light can be removed.

[0121] As mentioned above, when the laser is irradiated onto the shielding pattern 31, the laser generates diffraction that causes the boundary of the orthographic projection of the shielding pattern 31 on the substrate 11 to exceed the boundary of the orthographic projection of the cathode 32 on the substrate 11. When the display panel 110 is in use, when visible light is incident on the light-transmitting area 101 from the light-emitting side of the display panel 110, part of the visible light will be incident on the portion of the shielding pattern 31 that exceeds the boundary of the cathode 32, thereby reducing the transmittance of the visible light in the light-transmitting area 101.

[0122] Based on this, in some embodiments, the material of the shielding pattern 31 includes silver, which can absorb infrared light and can transmit visible light. In the process of patterning the cathode film of the light-transmitting area using a laser in the infrared light band, the shielding pattern 31 can absorb infrared light, thereby blocking the infrared light irradiated to the anode. During the use of the display panel 110, visible light is incident on the light-transmitting area 101 from the light-emitting side of the display panel 110, and the visible light irradiated to the portion of the shielding pattern 31 that exceeds the boundary of the cathode 32 can pass through the shielding pattern 31, thereby reducing the effect of the portion of the shielding pattern 31 that exceeds the boundary of the cathode 32 on the shielding of visible light. It should be noted that the material of the shielding pattern 31 is not limited to silver, and the material of the shielding pattern 31 can also be other materials whose transmittance to visible light is greater than the transmittance to infrared light. In addition, in the case where the material of the shielding pattern 31 includes silver, the material of the cathode 32 may include a magnesium-silver alloy.

[0123] When the material of the shielding pattern 31 includes silver, the transmittance of the shielding pattern 31 to infrared light can be controlled by controlling the thickness of the shielding pattern 31. Fig.13 , Fig.13 Schematic diagram of the transmittance of silver layers of different thicknesses to light of different wavelengths; for example, if infrared light with a wavelength of 920 nanometers is used, the transmittance is about 7.992% when the thickness of the silver layer is 20 nanometers, about 4.169% when the thickness of the silver layer is 25 nanometers, and about 2.773% when the thickness of the silver layer is 30 nanometers. Therefore, when infrared light with a wavelength of 920 nanometers is used as a laser source, silver with a thickness of 30 nanometers or greater than 30 nanometers can be used as the shielding pattern 31; for example, 35 nanometers, 38 nanometers, and 45 nanometers can be used.

[0124] Since the voltage required by the cathode 32 of the light-emitting device 302 of each sub-pixel 30 is the same, the cathodes 32 separated from each other in the light-transmitting area 101 need to be connected to each other. There are many ways to connect multiple separated cathodes 32 to each other. For example, a transparent conductive layer can be provided to connect multiple separated cathodes 32 to the transparent conductive layer. For another example, a cathode connection structure can be provided between multiple separated cathodes 32 to electrically connect multiple separated cathodes 32.

[0125] Regarding the method of connecting a plurality of mutually separated cathodes 32 by providing a transparent conductive layer, in some embodiments, refer to Fig. 7A The cathode 32 includes a cathode main body 321 and a cathode connecting portion 322. Fig. 8A The positive projection of the anode 25 on the substrate 11 covers the positive projection of the cathode main body 321 on the substrate 11; the cathode connecting portion 322 is electrically connected to the cathode main body 321 (see Fig. 7A), and the positive projection of the cathode connecting portion 322 on the substrate 11 does not overlap with the positive projection of the anode 25 on the substrate 11 (see Fig. 8A ).

[0126] See also Fig. 8A , the display panel 110 also includes a transparent conductive layer 33 and a first insulating layer 281. The transparent conductive layer 33 is located between the film layer where the shielding pattern 31 is located and the multiple anodes 25; the first insulating layer 281 is located between the transparent conductive layer 33 and the multiple cathodes 32. A plurality of first via holes 34 are arranged in the first insulating layer 281, and there is a gap between the orthographic projection of each first via hole 34 on the substrate 11 and the orthographic projection of the anode 25 on the substrate 11; the orthographic projection of each first via hole 34 on the substrate 11 is located within the orthographic projection range of the cathode connecting portion 322 on the substrate 11, and each cathode 32 is electrically connected to the transparent conductive layer 33 through at least one first via hole 34. For example, refer to Fig. 8A Each cathode 32 can be electrically connected to the transparent conductive layer 33 through a first via hole 34. For example, the material of the transparent conductive layer 33 can be tin-doped indium oxide (English: Indium Tin Oxide; abbreviated: ITO).

[0127] In this way, by providing a cathode connecting portion 322 extending out from the boundary of the anode 25 in the cathode 32, and providing a first via 34 in the first insulating layer 281 between the cathode 32 and the transparent conductive layer 33, the cathode connecting portion 322 is electrically connected to the transparent conductive layer 33 through the first via 34; and, since there is a gap between the orthographic projection of the first via 34 on the substrate 11 and the orthographic projection of the anode 25 on the substrate 11, the first via 34 and the anode 25 have an avoidance interval, so that the cathode 32 can maintain electrical insulation from the anode 25, thereby preventing a short circuit between the cathode 32 and the anode 25.

[0128] See also Figure 7C In order to form the cathode 32 including the cathode main body 321 and the cathode connecting part 322, the shielding pattern 31 includes a shielding pattern main body 311 and a shielding pattern connecting part 312 corresponding to the cathode 32. Fig. 8A The orthographic projection of the shielding pattern main part 311 on the substrate 11 covers the orthographic projection of the cathode main part 231 on the substrate 11; the shielding pattern connecting part 312 is connected to the shielding pattern main part 311 (see Figure 7C ), and the orthographic projection of the shielding pattern connecting portion 312 on the substrate 11 covers the orthographic projection of the cathode connecting portion 321 on the substrate 11 (see Fig. 8A ), so as to form a cathode 32 having the above structure. Based on the principle that light propagates in a straight line, the positive projection of the cathode 32 on the substrate 11 and the positive projection of the shielding pattern 31 on the substrate 11 opposite thereto are substantially the same in shape and size.

[0129] In the above embodiment, a plurality of separately arranged cathodes 32 in the light-transmitting area 101 are electrically connected via a transparent conductive layer 33. The transparent conductive layer 33 can be directly electrically connected to a signal line for transmitting cathode voltage signals arranged around the display area 10, or can be electrically connected to the cathode film 27 in the main display area 102 to obtain cathode voltage signals and transmit the cathode voltage signals to each cathode 32.

[0130] It should be noted that in addition to the first insulating layer 281, the transparent conductive layer 33 and the multiple cathodes 32 also include a pixel defining layer 29. Therefore, in addition to penetrating the first insulating layer 281, the first via 34 also needs to penetrate the pixel defining layer 29 so that the cathode 32 can be electrically connected to the transparent conductive layer 33 through the first via 34.

[0131] Regarding the method of connecting a plurality of mutually separated cathodes by providing a cathode connection structure, in some embodiments, refer to Fig. 9 The display panel 110 further includes at least one cathode connection structure 35, which is made of the same material as the cathode 32 and is disposed in the same layer. The size of the cathode connection structure 35 in the first direction L1 is greater than its size in the second direction L2; each cathode connection structure 35 is electrically connected to two adjacent cathodes 32. The first direction is the row direction in which the multiple sub-pixels 30 of the display panel 110 are arranged, that is, Fig. 9 The second direction is the direction indicated by the straight line L1 in the display panel 110; the second direction is the column direction in which the plurality of sub-pixels 30 of the display panel 110 are arranged, that is, Fig. 9 The direction shown by the straight line L2 in .

[0132] In the above embodiment, a plurality of cathodes 32 separated from each other are electrically connected via a cathode connection structure 35, the size of the cathode connection structure 35 in the first direction L1 is larger than its size in the second direction L2, and the cathode connection structure 35 connects two cathodes 32 adjacent to each other along the first direction L1. Exemplarily, the cathode connection structure 35 may be directly electrically connected to a signal line for transmitting a cathode voltage signal disposed around the display area 10, or may be electrically connected to a cathode film 27 in the main display area 102, so as to obtain a cathode voltage signal and transmit the cathode voltage signal to each cathode 32.

[0133] The cathode connection structure 35 is made of the same material as the cathode 32, and the cathode connection structure 35 and the cathode 32 are arranged in the same layer, so that the cathode connection structure 35 can be manufactured together with the cathode 32. For example, when infrared light is used to irradiate the cathode film 27 and the area of ​​the cathode film 27 corresponding to the light-transmitting area 101 of the display panel 100 is imaged, the cathode 32 and the cathode connection structure 35 are formed at the same time.

[0134] For example, see Fig. 9 The display panel 110 includes a plurality of cathode connection structures 35 arranged in a plurality of rows, and each row includes a plurality of cathode connection structures 35 sequentially arranged along a first direction L1. The cathode connection structures 35 in each row and the portions of the plurality of cathodes 32 connected to the plurality of cathode connection structures 35 in the row form a cathode connection bar 50; the cathode connection bar 50 has a size substantially equal to that of the cathode connection structure 35 in the second direction.

[0135] For example, the plurality of cathode connection structures 35 in each row are approximately located in a straight line.

[0136] For another example, a plurality of cathodes 32 are disposed on at least one of two opposite sides of the cathode connecting bar 50 in the second direction L2 , and the plurality of cathodes 32 are all connected to the cathode connecting bar 50 .

[0137] For another example, among the cathodes 32 in the same row, any two adjacent cathodes 32 are electrically connected via a cathode connection structure 35; and at least part of the cathodes 32 in the same row are located on the same straight line, and the cathode connection structures 35 in the same row are located on the same straight line.

[0138] The above arrangement is helpful to reduce the total length of the plurality of cathode connection structures 35, thereby reducing the projection area of ​​the plurality of cathode connection structures 35 on the substrate 11, and reducing the influence of the cathode connection structures 35 on the transmittance of the film layer where the plurality of cathodes 32 are located.

[0139] There are many ways to form the cathode connection structure 35. For example, a shielding connection structure 36 having the same shape as the cathode connection structure 35 may be provided on the display panel 110 to form the cathode connection structure; for another example, a mask plate 200 may be provided on a side of the substrate 11 away from the cathode film 27, and the cathode connection structure 35 may be formed using the mask plate 200.

[0140] Regarding the method of forming the cathode connection structure 35 by using the shielding connection structure 36 having the same shape as the cathode connection structure 35, in some embodiments, refer to Fig.11A The display panel 110 further includes at least one shielding connection structure 36, and the at least one shielding connection structure 36 is made of the same material as the plurality of shielding patterns 31 and is disposed on the same layer. Fig.11D , one shielding connection structure 36 corresponds to one cathode connection structure 35, and the orthographic projection of the shielding connection structure 36 on the substrate 11 covers the orthographic projection of the corresponding cathode connection structure 35 on the substrate 11. Fig. 11B, one shielding pattern 31 corresponds to one cathode 32, and the orthographic projection of the shielding pattern 31 on the substrate 11 covers the orthographic projection of the cathode 32 on the substrate 11. The material of the shielding connection structure 36 is the same as that of the shielding pattern 31, and the shielding connection structure 36 and the shielding pattern 31 are arranged in the same layer, and the shielding connection structure 36 can be manufactured at the same time as the patterned shielding pattern 31, without adding additional process flows and film layers, which is conducive to reducing the manufacturing cost of the display panel.

[0141] For example, the shielding connection structure 36 and the shielding pattern 31 may both be located in the semiconductor layer 210, or both be located in the gate metal layer 220, or both be located in the source-drain metal layer 230; when the gate metal layer 220 includes two layers of gate metal layers 220, the shielding connection structure 36 and the shielding pattern 31 may be located in either of the two layers of gate metal layers 220; when the source-drain metal layer 230 includes two layers of source-drain metal layers 230, the shielding connection structure 36 and the shielding pattern 31 may be located in either of the two layers of source-drain metal layers 230.

[0142] In some embodiments, the shielding connection structure 36 may also be disposed in a different film layer from the shielding pattern 31. For example, at least one shielding connection structure 36 may be disposed between the film layer where the shielding pattern 31 is located and the plurality of anodes 25, or at least one shielding connection structure 36 may be disposed between the substrate 11 and the film layer where the shielding pattern 31 is located. For example, when the display panel 110 uses the anode 23 as the shielding pattern 31, at least one shielding connection structure 36 may be disposed between the substrate 11 and the anode 25.

[0143] In the case where the display panel 110 includes a plurality of cathode connection bars 50, the display panel 110 includes a plurality of shielding connection structures 36 arranged in a plurality of rows, and each row includes a plurality of shielding connection structures 36 sequentially arranged along the first direction L1. Fig.11A Each row of shielding connection structures 36 and the portions of the shielding patterns 31 connected to the shielding connection structures 36 in the row form a shielding connection strip 60; see Fig.11D , the orthographic projection of a shielding connecting strip 60 on the substrate 11 covers the orthographic projection of a cathode connecting strip 50 on the substrate 11 .

[0144] For the method of forming the cathode connection structure 35 using the mask plate 200, refer to Fig. 9 and Fig. 10A , the shape of the shielding pattern 31 is substantially the same as the shape of the cathode 32; Fig. 10BThe mask plate 200 includes at least one shielding line 210. The orthographic projection of each shielding line 210 on the substrate 11 is connected to the orthographic projections of at least two anodes 25 on the substrate 11. The orthographic projection of each shielding line 210 on the substrate 11 covers the orthographic projection of a cathode connecting strip 50 on the substrate 11.

[0145] In some embodiments, see Figure 7B The anode 25 includes a first anode portion 251 and a second anode portion 252; the first anode portion 251 has substantially the same shape as the effective light-emitting region 261 of the light-emitting device 302 in which it is located, and the boundary of the first anode portion 251 partially overlaps with the boundary of the anode 25. The second anode portion 252 is electrically connected to the first anode portion 251, one end of the second anode portion 252 is electrically connected to the first anode portion 251, and the other end is used to be electrically connected to the thin film transistor.

[0146] In some embodiments, see Fig. 7A The cathode 32 includes a first cathode portion 323 and a second cathode portion 324, and the second cathode portion 322 is electrically connected to the first cathode portion 321; Fig. 8A , the orthographic projection of the first cathode portion 321 on the substrate 11 is covered by the orthographic projection of the first anode portion 251 on the substrate 11 ; and the orthographic projection of the second cathode portion 322 on the substrate 11 is covered by the orthographic projection of the second anode portion 252 on the substrate 11 .

[0147] See also Fig. 7A In the case where the cathode 32 includes a cathode main body 321 and a cathode connecting portion 322, the first cathode portion 323 and the second cathode portion 324 form the cathode main body 321, referring to Fig. 7A and Figure 7B , and the shape of the cathode main body 321 is substantially the same as the shape of the anode 25 .

[0148] See also Fig. 9 and Figure 7B In the case where the display panel 110 further includes at least one cathode connection structure 35 , the shape of the cathode 32 is substantially the same as that of the anode 25 .

[0149] In some embodiments, see Figure 4 , the pixel circuit of the sub-pixel 30 in the light-transmitting area 101 is arranged around the light-transmitting area 101 , so that the light transmittance of the light-transmitting area 101 can be improved.

[0150] In order to distinguish the pixel circuit 301 of the sub-pixel 30 in the light-transmitting area 101 from the pixel circuit 301 of the sub-pixel 30 in the main display area 102, the pixel circuit of the sub-pixel 30 in the light-transmitting area 101 is referred to as the first pixel circuit 3011 (see Figure 4), the pixel circuit 301 of the sub-pixel 30 in the main display area 102 is referred to as the second pixel circuit 3012 (see Figure 3 In the above embodiment, the first pixel circuit 3011 of the sub-pixel 30 in the light-transmitting region 101 is arranged around the light-transmitting region 101, and the connection line 37 (see Figure 4 371, 372, 373) electrically connect each light-emitting device 302 in the light-transmitting area 101 to a first pixel circuit 3011.

[0151] Since there are multiple sub-pixels 30 in the light-transmitting area 101, multiple connecting wires 37 are required. The film layer of the connecting wires 37 is called the connecting wire layer 240 (see Figure 5 ), the multiple connection lines 37 can be arranged in the same connection line layer 240, or can be arranged in different connection line layers 240, so as to provide sufficient wiring space for the multiple connection lines 37.

[0152] For example, the multiple connecting lines 37 include a first connecting line 371, a second connecting line 372 and a third connecting line 373 respectively located in the three-layer connecting line layer 240, and the first connecting line 371, the second connecting line 372 and the third connecting line 373 are respectively used to electrically connect the light-emitting devices 302 in different areas of the light-transmitting area 101 with the corresponding first pixel circuit 3011.

[0153] Based on the above design, for example, see Figure 5 The cross-sectional structure of the light-transmitting area 10 and its surrounding area of ​​the display panel 110 is as follows: the display panel 110 includes a pixel circuit layer 70, a second insulating layer 282, a connecting line layer 240, and a third insulating layer 283, which are sequentially arranged along a direction perpendicular to the substrate 11 and pointing from the substrate 11 to the anode 25, and are arranged between the substrate 11 and the film layer where the multiple anodes 25 are located. The pixel circuit layer 70 includes a semiconductor layer 210, a gate insulating layer 18, a first gate metal layer 221, a first interlayer insulating layer 19, a second gate metal layer 222, a second interlayer insulating layer 21, a first source-drain metal layer 231, a passivation layer 22, a planarization layer 23, and a second source-drain metal layer 232.

[0154] The pixel circuit layer 70 includes a plurality of first pixel circuits 3011, and the plurality of first pixel circuits 3011 are arranged around the light-transmitting area 101. A plurality of second via holes 38 are arranged in the second insulating layer 282; a plurality of third via holes 39 are arranged in the third insulating layer 283. The first end of the connection line 37 in the connection line layer 240 passes through at least one second via hole 38 to be electrically connected to a first pixel circuit 3011, and the second end passes through at least one third via hole 39 to be electrically connected to a second connection portion 252 of an anode 25.

[0155] Take the display panel 110 including three connection line layers 240 as an example, see Figure 4 and Figure 5 , along the direction perpendicular to the substrate 11 and from the substrate 11 to the anode, the three connecting wire layers 240 are the first connecting wire layer, the second connecting wire layer and the third connecting wire layer in sequence. The first connecting wire layer includes a plurality of first connecting wires 371, the second connecting wire layer includes a plurality of first connecting wires 372, and the third connecting wire layer includes a plurality of first connecting wires 373. A fourth insulating layer 284 is provided between the first connecting wire layer and the second connecting wire layer, and a fifth insulating layer 285 is provided between the second connecting wire layer and the third connecting wire layer.

[0156] Please continue to see Figure 5 For the second connection line 372, the second via hole 38 not only penetrates the second insulating layer 282, but also penetrates the fourth insulating layer 284, so that the second connection line 372 passes through the second via hole 38 and is electrically connected to the first pixel circuit 301; the third via hole 39 not only penetrates the third insulating layer 283, but also penetrates the fifth insulating layer 285, so that the second connection line 372 passes through the third via hole 39 and is electrically connected to the anode 25.

[0157] For example, see Fig. 8A In the case where the display panel 110 further includes a transparent conductive layer 33, the transparent conductive layer 33 is located on the side of the third insulating layer 283 away from the substrate 11; in the case where the display panel 110 includes three layers of connecting line layers 240, the transparent conductive layer 33 is located on the side of the fifth insulating layer 285 away from the substrate 11; this facilitates electrical connection between the plurality of cathodes 32 and the transparent conductive layer 33. The transparent conductive layer 33 can also be disposed at any position below the anode 25, and the present disclosure is not limited thereto.

[0158] Exemplarily, the orthographic projection of the first via 34 for connecting the cathode connecting portion 322 and the transparent conductive layer 33 on the substrate 11 does not overlap with the orthographic projection of the third via 39 for connecting the second anode portion 252 and the connecting line 37 on the substrate 11, so that the cathode 32 and the anode 25 remain electrically insulated.

[0159] like Fig. 8A As shown, the connection line layer 240 further includes a plurality of pads 41, each of which is electrically connected to the second end of a connection line 37, and each of which is electrically connected to the second anode portion 252 of an anode 25 through a third via hole 39. In the case where the display panel 110 includes a plurality of cathode connection bars 50, the orthographic projections of the third via hole 39 and the pads 41 on the substrate 11 at least partially overlap with the orthographic projection of a cathode connection bar 50 on the substrate 11, so that the second anode portion 252 can be electrically connected to the pads 41 through the third via hole 39, thereby electrically connecting the anode 25 to the connection line 37.

[0160] In the case where the display panel 110 includes a plurality of connecting line layers 240, for the first pixel circuit 3011 and the anode 25 of the light-emitting device 302 that need to be electrically connected via connecting lines, in addition to setting a pad 41 in the connecting line layer 240 where the connecting line 37 is set, an auxiliary pad 42 may also be set at a corresponding position of other connecting line layers, and the first pixel circuit 3011 is electrically connected to the anode 25 of the corresponding light-emitting device 302 through the connecting line 37, the pad 41 and the auxiliary pad 42.

[0161] Please continue to see Fig. 8A For example, the display panel 110 includes three connecting wire layers 240, and the connecting wire 37 for electrically connecting the first pixel circuit 3011 and the anode 25 of the light-emitting device 302 is located in the connecting wire layer closest to the substrate 11 among the three connecting wire layers 240, that is, the connecting wire 37 is the first connecting wire 371 in the first connecting wire layer (see Figure 4 ), a pad 41 electrically connected to the first connection line 371 can be provided in the first connection line layer, and in addition, auxiliary pads 42 are provided in the second connection line layer and the third connection line layer, respectively. In this way, the first pixel circuit 3011 can be electrically connected to the anode 25 through the connection line 37, the pad 41 and the two auxiliary pads 42 in sequence.

[0162] In the above embodiment, the switching function of the pad 41 and the auxiliary pad 42 can avoid the connection via depth between the first pixel circuit 3011 and the anode 25 of the light-emitting device 302 being too deep, thereby improving the reliability of the electrical connection between the anode 25 and the first pixel circuit 3011.

[0163] Exemplarily, the orthographic projection of the auxiliary pad 42 on the substrate 11 overlaps at least partially, for example, completely overlaps, with the orthographic projection of the corresponding pad 41 on the substrate 11, so that the occupied area of ​​the pad 41 and the auxiliary pad 42 can be minimized. In addition, along the direction perpendicular to the substrate 11, each via hole (see Fig. 8A The vias 43, 44 in the substrate 11 may be arranged in a staggered manner, so that the orthographic projections of two adjacent vias in a direction perpendicular to the substrate 11 are prevented from overlapping on the substrate 11, thereby further improving the reliability of the electrical connection.

[0164] For example, continue to see Fig. 8A, taking the display panel 110 including three layers of connection line layers 240, and the connection line 37 of the anode 25 for electrically connecting the first pixel circuit 3011 and the light emitting device 302 is located in the connection line layer closest to the substrate 11 among the three layers of connection line layers 240 as an example, two auxiliary pads 42 are arranged on the side of the pad 41 away from the substrate 11, and the pad 41 is connected to the adjacent auxiliary pads 42 through the fourth via 43; the two adjacent auxiliary pads 42 are connected through the fifth via 44; the second anode portion 252 is connected to the auxiliary pad 42 away from the pad 41 through the third via 39. The orthographic projection of the third via 39 on the substrate 11 does not overlap with the orthographic projection of the fifth via 44 on the substrate 11, and the orthographic projection of the fifth via 44 on the substrate 11 does not overlap with the orthographic projection of the fourth via 43 on the substrate, so as to avoid the two adjacent vias in the direction perpendicular to the substrate 11 being located at the same position, and further improve the reliability of the electrical connection between the anode 25 and the first pixel circuit 3011.

[0165] In some embodiments, see Fig. 6A The multiple sub-pixels 30 of the display panel 110 include multiple red sub-pixels 303, multiple green sub-pixels 304 and multiple blue sub-pixels 305; the shape of the first cathode portion 323 of the cathode 32 of the light-emitting device 302 of the green sub-pixel 304 is roughly circular; the shape of the first cathode portion 323 of the cathode 32 of the light-emitting device 302 of the red sub-pixel 303 is roughly elliptical, and the shape of the first cathode 323 of the cathode 32 of the light-emitting device of the blue sub-pixel 305 is roughly circular or elliptical.

[0166] It should be noted that the shapes of the first cathode portions 323 of the red sub-pixel 303, the green sub-pixel 304, and the blue sub-pixel 305 are not limited thereto. For example, the shape of the first cathode portion 323 of the green sub-pixel 304 may also be an ellipse, a square, or a hexagon, etc.; the shape of the first cathode portion 323 of the red sub-pixel 303 may also be a circle, a square, or a hexagon, etc.; the shape of the first cathode portion 323 of the blue sub-pixel 305 may also be a square, or a hexagon, etc.

[0167] In some embodiments, the minimum distance between the first cathode portions 323 of the two green sub-pixels 304 is smaller than the minimum distance between the first cathode portions of the other two sub-pixels of the same color. Fig. 6A The minimum spacing D1 between the first cathode portions 323 of the two green sub-pixels 304 is smaller than the minimum spacing D2 between the first cathode portions 323 of the two red sub-pixels 303 , and is also smaller than the minimum spacing D3 between the first cathode portions 323 of the two blue sub-pixels 305 .

[0168] In some embodiments, see Fig. 6A, the effective light-emitting areas of the light-emitting devices 302 of the red sub-pixels 303 and the blue sub-pixels 302 are alternately arranged along the first direction L1; the effective light-emitting areas of the light-emitting devices 302 of the green sub-pixels 304 are arranged along the second direction L2. The projection of the effective light-emitting area of ​​the sub-pixel 30 on the substrate 11 is covered by the positive projection of the cathode main body 323 on the substrate 11.

[0169] It should be noted that in this article, the cross-sectional view Figure 5 , Figure 6C , Fig. 8A , Figure 8C , Figure 8C , Fig. 11B , Fig. 11C , Fig.11D In the figure, multiple insulating layers are shown between the film layer where the multiple anodes 25 are located and the substrate 11. These cross-sectional views are illustrated with the display panel 110 including two gate metal layers, two source and drain metal layers, and three connecting line layers as the background. In fact, the number of insulating layers between the film layer where the multiple anodes 25 of the display panel 110 are located and the substrate 11 in each embodiment of the present disclosure is not limited thereto. When the display panel 110 adopts other film layer structures, the number of insulating layers can be reduced or increased.

[0170] Some embodiments of the present disclosure further provide a method for manufacturing a display panel, including:

[0171] S100 , a plurality of mutually separated shielding patterns 31 are produced on the substrate 11 .

[0172] The shielding pattern 31 may be any of the shielding patterns 31 in the above embodiments. The shielding pattern 31 may be manufactured by vapor deposition, exposure, etching and other processes, which are not specifically limited here.

[0173] Before making the shielding pattern 31, it is necessary to make one or more conductive film layers and one or more insulating layers 80 on the substrate 11. The one or more conductive film layers may be at least one of the conductive film layers such as the semiconductor layer 210, the gate metal layer 220, the source / drain metal layer 230, and at least one insulating layer 80 is provided between each two adjacent conductive film layers. In the case where the first pixel circuit 3011 of the sub-pixel 30 in the light-transmitting area 101 of the display panel 110 is provided around the light-transmitting area 101, there may be a conductive pattern in the conductive film layer used to form the first pixel circuit 3011 in the light-transmitting area 101. Figures 18 to 20 The cross-sectional structure of the light-transmitting area of ​​the display panel 110 is shown schematically in FIG. Figures 18 to 20 The conductive film layer mentioned above cannot be seen, and only the insulating layer 80 can be seen.

[0174] S200 , forming a plurality of light-emitting layers 26 on a side of the plurality of shielding patterns 31 away from the substrate 11 . Each light-emitting layer 26 corresponds to a light-emitting device 302 .

[0175] In the above steps, a plurality of light-emitting layers 26 may be manufactured by using a vapor deposition or inkjet printing process.

[0176] It should be noted that before manufacturing a plurality of light-emitting layers 26 , a step of manufacturing a pixel defining layer 29 is also included. The pixel defining layer 29 includes a plurality of opening areas, each of which defines an effective light-emitting area 261 of a light-emitting device 302 .

[0177] S300 , forming a cathode film 27 on a side of the plurality of light emitting layers 26 away from the substrate 11 . The cathode film 27 covers the display area 10 of the display panel 110 .

[0178] In the above steps, the cathode film 27 can be manufactured by using an evaporation process.

[0179] S400, using laser to irradiate the area of ​​the substrate 11 corresponding to the light-transmitting area 101 of the display panel 110 from the side of the substrate 11 away from the cathode film 27, so as to remove the part of the cathode film 27 in the area that is not blocked by the multiple blocking patterns 31, and form multiple cathodes 32 separated from each other.

[0180] The orthographic projection of the shielding pattern 31 on the substrate 11 covers the orthographic projections of the plurality of separated cathodes 32 on the substrate 11 .

[0181] Each light-emitting layer 26 and its corresponding cathode 32 form part of a light-emitting device 302 . Each light-emitting device 302 has an effective light-emitting area, and the orthographic projection of the effective light-emitting area on the substrate 11 is located within the orthographic projection range of the cathode 32 of the light-emitting device 302 on the substrate 11 .

[0182] In some embodiments, the cathode film 27 can transmit visible light and absorb infrared light; the shielding pattern 31 can absorb infrared light; and the laser is an infrared light beam.

[0183] The orthographic projection of the shielding pattern 31 on the substrate 11 and the orthographic projection of the cathode 32 on the substrate 11 are substantially the same in shape and size, and the orthographic projection of the shielding pattern 31 on the substrate 11 covers the orthographic projections of multiple separated cathodes 32 on the substrate 11. The shielding pattern 31 can be patterned by vapor deposition, etching and other processes, and its manufacturing accuracy is high. The pattern of the shielding pattern 31 can be precisely controlled to control the pattern of the multiple cathodes 32, thereby improving the accuracy of the patterning of the cathode film 27, improving the aperture ratio of the film layer where the multiple cathodes 32 are located, and improving the transmittance of the film layer where the multiple cathodes 32 are located to visible light.

[0184] In some embodiments, Fig.15 and Fig.18 As shown, the anode is used as the shielding pattern 31, and S100 (forming a plurality of shielding patterns 31 separated from each other on the substrate 11) includes S110.

[0185] S110 , manufacturing a plurality of mutually separated anodes 25 on the substrate 11 .

[0186] Each light emitting device 302 includes an anode 25 , and an anode 25 forms a shielding pattern 31 .

[0187] In the case where one anode 25 is formed with one shielding pattern 31, see Fig.15 and Fig.18 , the manufacturing method of the display panel 110 includes:

[0188] S110 , manufacturing a plurality of mutually separated anodes 25 on the substrate 11 .

[0189] S200 , forming a plurality of light-emitting layers 26 on a side of the plurality of anode-shielding layers 25 away from the substrate 11 .

[0190] S300 , forming a cathode film 27 on a side of the plurality of light-emitting layers 26 away from the substrate 11 .

[0191] S400, using laser to irradiate the area of ​​the substrate 11 corresponding to the light-transmitting area 101 of the display panel 110 from the side of the substrate 11 away from the cathode film 27.

[0192] In the case where one anode 25 forms one shielding pattern 31, the one or more insulating layers 80 at least include all insulating layers in the pixel circuit layer 70 and at least one insulating layer 28 between the pixel circuit layer 70 and the film layer where the anode 25 is located. Figure 5 All the insulating layers in the pixel circuit layer 70 include a gate insulating layer 18, a first interlayer insulating layer 19, a second interlayer insulating layer 21, a passivation layer 22 and a planar layer 23; the at least one insulating layer 28 includes a second insulating layer 282, a fourth insulating layer 284, a fifth insulating layer 285 and a third insulating layer 283. The one or more insulating layers 80 may also include other insulating layers, which are not described one by one here.

[0193] In some embodiments, Fig.16 , Fig.17 , Fig.19 and Fig. 20 As shown, when the light emitting device 302 includes an anode 25 and the plurality of shielding patterns 31 are located on a side of the plurality of anodes 25 of the plurality of light emitting devices 302 close to the substrate, S100 (making a plurality of shielding patterns 31 separated from each other on the substrate 11) includes S120.

[0194] S120, a patterned semiconductor layer 210, a patterned gate metal layer 220, and a patterned source-drain metal layer 230 are fabricated on the substrate 11; a plurality of shielding patterns 31 are formed in the process of patterning the semiconductor layer 210, the gate metal layer 220, or the source-drain metal layer 230. The source-drain metal layer 230 is away from the substrate 11 relative to the semiconductor layer 210 and the gate metal layer 220.

[0195] Between S100 (forming a plurality of shielding patterns 31 separated from each other on the substrate 11 ) and S200 (forming a plurality of light-emitting layers 26 ), S130 is also included.

[0196] S130 , manufacturing a plurality of anodes 25 on the substrate 11 ; each light emitting device 302 includes an anode 25 .

[0197] In some embodiments, when the plurality of cathodes 32 are electrically connected via the transparent conductive layer 33 , S100 (fabricating a plurality of mutually separated shielding patterns on the substrate) and S130 (fabricating a plurality of anodes) further include S121 to S123 .

[0198] S121 , forming a transparent conductive layer 33 on a side of the source / drain metal layer 230 away from the substrate 11 .

[0199] S122 , forming a first insulating layer 281 on a side of the transparent conductive layer 33 away from the substrate 11 .

[0200] S123 , making a plurality of first via holes 34 in the first insulating layer 281 .

[0201] There is a gap between the orthographic projection of each first via 34 on the substrate 11 and the orthographic projection of the anode 25 on the substrate 11, the orthographic projection of each first via 34 on the substrate 11 is located within the orthographic projection range of the shielding pattern 31 on the substrate 11, and multiple first vias 34 penetrate the first insulating layer 281 and are connected to the transparent conductive layer 33.

[0202] When multiple first via holes 34 are made in the first insulating layer 281, during S300 (making the cathode film 27 on the side of the multiple light-emitting layers 26 away from the substrate 11), the material of the cathode film 27 enters the multiple first via holes 34, so that the cathode film 27 is connected to the transparent conductive layer 33 through the cathode material in the multiple first via holes 34.

[0203] See also Fig.17 and Fig.19 In the case where the shielding pattern 31 is located in the semiconductor layer 210 or the gate metal layer 220 or the source-drain metal layer 230, the manufacturing method of the display panel 110 includes:

[0204] S120 , forming a plurality of shielding patterns 31 in the process of manufacturing the patterned semiconductor layer 210 or the gate metal layer 220 or the source-drain metal layer 230 on the substrate 11 .

[0205] S121 , forming a transparent conductive layer 33 on a side of the source / drain metal layer 230 away from the substrate 11 .

[0206] S122 , forming a first insulating layer 281 on a side of the transparent conductive layer 33 away from the substrate 11 .

[0207] S123 , making a plurality of first via holes 34 in the first insulating layer 281 .

[0208] S130 , manufacturing a plurality of anodes 25 on the substrate 11 .

[0209] S200 , forming a plurality of light-emitting layers 26 on a side of the plurality of anode-shielding layers 25 away from the substrate 11 .

[0210] S300 , forming a cathode film 27 on a side of the plurality of light-emitting layers 26 away from the substrate 11 .

[0211] S400, using laser to irradiate the area of ​​the substrate 11 corresponding to the light-transmitting area 101 of the display panel 110 from the side of the substrate 11 away from the cathode film 27.

[0212] In the above embodiment, the shielding pattern 31 is disposed on the side of the anode 25 close to the substrate 11, and the orthographic projection of the shielding pattern 31 on the substrate 11 covers the orthographic projection of the anode 25 on the substrate 11. At this time,

[0213] The one or more insulating layers 80 include insulating layers between the substrate 11 and the film layer where the shielding pattern 31 is located. Exemplarily, when the shielding pattern 31 is located in the film layer where the gate metal layer 220 is located, the one or more insulating layers 80 include the gate insulating layer 18 .

[0214] In some embodiments, a plurality of cathodes 32 separated from each other are electrically connected by a cathode connection structure 35 disposed in the same layer. In this case, the cathode connection structure 35 and the cathodes 32 can be formed in the following two ways.

[0215] Method 1: If Fig.11AAs shown, a plurality of shielding connection structures 36 are formed in the process of patterning the semiconductor layer 210 or the gate metal layer 220 or the source-drain metal layer 230. The plurality of shielding connection structures 36 and the shielding pattern 31 are located in the same film layer; the size of each shielding connection structure 36 in the first direction L1 is greater than its size in the second direction L2; the first direction L1 is the row direction in which the plurality of sub-pixels 30 of the display panel 110 are arranged, and the second direction L2 is the column direction in which the plurality of sub-pixels 30 of the display panel 110 are arranged. Each shielding connection structure 36 is connected to two shielding patterns 31; the plurality of shielding connection structures 36 are arranged in a plurality of rows, each row including a plurality of shielding connection structures 36 arranged in sequence along the first direction L1; each row of shielding connection structures 36 and the portion of the plurality of shielding patterns 31 connected to the plurality of shielding connection structures 36 in the row form a shielding connection bar 60.

[0216] In the above manner, after S400 (using laser to irradiate the area of ​​the substrate 11 corresponding to the light-transmitting area 101 of the display panel 110 from the side of the substrate 11 away from the cathode film 27), refer to Fig. 9 , a plurality of cathodes 32 and a plurality of cathode connection structures 35 can be formed on the cathode film 27; the plurality of cathode connection structures 35 and the plurality of cathodes 32 are located in the same film layer, and the size of each cathode connection structure 35 in the first direction L1 is greater than its size in the second direction L2. Each cathode connection structure 35 is electrically connected to two cathodes 32. The plurality of cathode connection structures 35 are arranged in a plurality of rows, and each row includes a plurality of cathode connection structures 35 arranged in sequence along the first direction L1; each row of cathode connection structures 35 and the portions of the plurality of cathodes 32 connected to the plurality of cathode connection structures 35 in the row form a cathode connection bar 50.

[0217] Method 2: If Fig.17 and Fig. 20 As shown, before S400 (using laser to irradiate the area of ​​the substrate 11 corresponding to the light-transmitting area 101 of the display panel 110 from the side of the substrate 11 away from the cathode film 27), the method for manufacturing the display panel also includes S310.

[0218] S310 , a mask plate 200 is disposed on a side of the substrate 11 away from the cathode film 27 .

[0219] The mask plate 200 includes at least one light-blocking line 210 , and the orthographic projection of each light-blocking line 210 on the substrate 11 is connected to the orthographic projections of at least two anodes 25 on the substrate 11 .

[0220] By the above method, see Fig. 9, multiple cathodes 32 and multiple cathode connection structures 35 can also be formed on the cathode film 27; the multiple cathode connection structures 35 and the multiple cathodes 32 are located in the same film layer, and the size of each cathode connection structure 35 in the first direction L1 is larger than its size in the second direction L2. Each cathode connection structure 35 is electrically connected to two cathodes 32. The multiple cathode connection structures 35 are arranged in multiple rows, and each row includes multiple cathode connection structures 35 arranged in sequence along the first direction L1; each row of cathode connection structures 35 and the parts of the multiple cathodes 32 connected to the multiple cathode connection structures 35 in the row form a cathode connection bar 50.

[0221] See also Fig.18 and Fig. 20 In the case of using the mask 200 to form the cathode connection structure 35, the method for manufacturing the display panel 110 includes:

[0222] S120 , forming a plurality of shielding patterns 31 in the process of manufacturing the patterned semiconductor layer 210 or the gate metal layer 220 or the source-drain metal layer 230 on the substrate 11 .

[0223] S130 , manufacturing a plurality of anodes 25 on the substrate 11 .

[0224] S200 , forming a plurality of light-emitting layers 26 on a side of the plurality of anode-shielding layers 25 away from the substrate 11 .

[0225] S300 , forming a cathode film 27 on a side of the plurality of light-emitting layers 26 away from the substrate 11 .

[0226] S310 , a mask plate 200 is disposed on a side of the substrate 11 away from the cathode film 27 .

[0227] S400, using laser to irradiate the area of ​​the substrate 11 corresponding to the light-transmitting area 101 of the display panel 110 from the side of the substrate 11 away from the cathode film 27.

[0228] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display panel, characterized in that: A display area is provided, wherein the display area includes a light-transmitting area and a main display area located around the light-transmitting area; the display panel includes: substrate; A plurality of shielding patterns are arranged on the substrate and located in the light-transmitting area; the orthographic projections of the plurality of shielding patterns on the substrate are separated from each other; A plurality of light-emitting devices are arranged in the light-transmitting area and on the substrate; each light-emitting device comprises: a light-emitting layer, and a cathode located on a side of the light-emitting layer away from the substrate; each light-emitting device has an effective light-emitting area, and the orthographic projection of the effective light-emitting area on the substrate is located within the orthographic projection range of the cathode of the light-emitting device on the substrate; Among them, the orthographic projections of the multiple cathodes of the multiple light-emitting devices on the substrate are separated from each other and are located on the side of the multiple shielding patterns away from the substrate; one cathode corresponds to one shielding pattern, and the orthographic projection of each shielding pattern on the substrate covers the orthographic projection of the corresponding cathode on the substrate.

2. The display panel according to claim 1, characterized in that: The cathode has a transmittance to visible light greater than a transmittance to infrared light; The infrared light transmittance of the shielding pattern is less than or equal to 2%.

3. The display panel according to claim 1, characterized in that: Each light emitting device further comprises: The anode is located on a side of the light-emitting layer close to the substrate; one anode forms one shielding pattern.

4. The display panel according to claim 1, characterized in that: Each light emitting device further includes: an anode located on a side of the light emitting layer close to the substrate; The plurality of shielding patterns are located on a side of the plurality of anodes of the plurality of light-emitting devices close to the substrate; One shielding pattern corresponds to one anode, and an orthographic projection of the shielding pattern on the substrate at least partially overlaps with an orthographic projection of the corresponding anode on the substrate.

5. The display panel according to claim 4, characterized in that: Also includes: a semiconductor layer, located between the substrate and the plurality of anodes; A gate metal layer, located between the substrate and the plurality of anodes; A source-drain metal layer, which is away from the substrate relative to the semiconductor layer and the gate metal layer, and is located on a side of the plurality of anodes close to the substrate; The shielding pattern is located in the semiconductor layer or the gate metal layer or the source-drain metal layer.

6. The display panel according to claim 4, characterized in that: The transmittance of the shielding pattern to visible light is greater than the transmittance to infrared light; The thickness of the shielding pattern is greater than the thickness of the cathode.

7. The display panel according to claim 6, characterized in that: The material of the cathode includes magnesium-silver alloy, and the material of the shielding pattern includes silver.

8. The display panel according to claim 4, characterized in that: The cathode comprises: a cathode main body, wherein the orthographic projection of the anode on the substrate covers the orthographic projection of the cathode main body on the substrate; A cathode connecting portion is electrically connected to the cathode main body, and an orthographic projection of the cathode connecting portion on the substrate does not overlap with an orthographic projection of the anode on the substrate.

9. The display panel according to claim 8, characterized in that: The blocking pattern includes: a shielding pattern main body, wherein the orthographic projection of the shielding pattern main body on the substrate covers the orthographic projection of the cathode main body on the substrate; The shielding pattern connecting portion is connected to the shielding pattern main body, and the orthographic projection of the shielding pattern connecting portion on the substrate covers the orthographic projection of the cathode connecting portion on the substrate.

10. The display panel according to claim 8, characterized in that: Also includes: A transparent conductive layer, located between the film layer where the shielding pattern is located and the plurality of anodes; A first insulating layer, located between the transparent conductive layer and the plurality of cathodes; Among them, a plurality of first via holes are arranged in the first insulating layer, each of the first via holes has a gap between the orthographic projection of the anode on the substrate and the orthographic projection of the anode on the substrate, and the orthographic projection of each first via hole on the substrate is located within the orthographic projection range of the cathode connecting part on the substrate, and each of the cathodes is electrically connected to the transparent conductive layer through at least one of the first via holes.

11. The display panel according to claim 4, characterized in that: Also includes: At least one cathode connection structure, made of the same material as the cathode and disposed in the same layer; The size of the cathode connection structure in the first direction is greater than its size in the second direction; wherein the first direction is the row direction in which the multiple sub-pixels of the display panel are arranged, and the second direction is the column direction in which the multiple sub-pixels of the display panel are arranged; Each of the cathode connection structures is electrically connected to two adjacent cathodes.

12. The display panel according to claim 11, characterized in that: The display panel comprises a plurality of cathode connection structures arranged in a plurality of rows, each row comprising a plurality of cathode connection structures arranged in sequence along the first direction; Each row of cathode connection structures and the parts of the cathodes connected by the cathode connection structures in the row form a cathode connection bar; the cathode connection bar has a size substantially equal to that of the cathode connection structure in the second direction.

13. The display panel according to claim 12, characterized in that: Also includes: At least one shielding connection structure, which is made of the same material and arranged in the same layer as the plurality of shielding patterns; In the case where the display panel includes a plurality of cathode connection bars, the display panel includes a plurality of the shielding connection structures arranged in a plurality of rows, each row including a plurality of the shielding connection structures sequentially arranged along the first direction; each row of shielding connection structures and a portion of a plurality of shielding patterns connected to the plurality of shielding connection structures in the row form a shielding connection bar; An orthographic projection of one of the shielding connecting strips on the substrate covers an orthographic projection of one of the cathode connecting strips on the substrate.

14. The display panel according to any one of claims 8 to 13, characterized in that: The anode comprises: A first anode portion, having a shape substantially the same as that of an effective light emitting region of the light emitting device in which it is located, and a boundary of the first anode portion partially coincides with a boundary of the anode; a second anode portion, electrically connected to the first anode portion; The cathode comprises: a first cathode portion, wherein an orthographic projection of the first cathode portion on the substrate is covered by an orthographic projection of the first anode portion on the substrate; A second cathode portion, electrically connected to the first cathode portion, wherein an orthographic projection of the second cathode portion on the substrate is covered by an orthographic projection of the second anode portion on the substrate; In the case where the cathode includes a cathode main body and a cathode connecting part, the first cathode part and the second cathode part form the cathode main body, and the shape of the cathode main body is substantially the same as that of the anode; In the case where the display panel further comprises at least one cathode connection structure, the shape of the cathode is substantially the same as the shape of the anode.

15. The display panel according to claim 14, characterized in that: Also includes: A pixel circuit layer, a second insulating layer, a connecting line layer, and a third insulating layer are sequentially arranged along a direction perpendicular to the substrate and pointing from the substrate to the anode and arranged between the substrate and the film layer where the plurality of anodes are located; Wherein, the pixel circuit layer includes a plurality of first pixel circuits, which are arranged around the light-transmitting area; A plurality of second via holes are provided in the second insulating layer; a plurality of third via holes are provided in the third insulating layer; The connection line layer includes a plurality of connection lines, a first end of each connection line is electrically connected to a first pixel circuit through a second via hole, and a second end of each connection line is electrically connected to a second anode portion of an anode through a third via hole; In the case where the display panel also includes a transparent conductive layer, the transparent conductive layer is located on a side of the third insulating layer away from the substrate, the third via hole passes through the transparent conductive layer, and the conductive material in the third via hole used to electrically connect the connecting line and the corresponding anode is electrically insulated from the transparent conductive layer.

16. The display panel according to claim 15, characterized in that: The connection line layer further includes: a plurality of pads, each pad being electrically connected to the second end of one of the connection lines, and each pad being electrically connected to the second anode portion of an anode through one of the third via holes; In the case where the display panel includes a plurality of cathode connecting bars, the orthographic projections of the third via hole and the spacer on the substrate at least partially overlap with the orthographic projection of one cathode connecting bar on the substrate.

17. The display panel according to claim 14, characterized in that: The display panel includes a plurality of sub-pixels, each sub-pixel includes a light-emitting device; the plurality of sub-pixels include a plurality of red sub-pixels, a plurality of green sub-pixels and a plurality of blue sub-pixels; The shape of the first cathode portion of the cathode of the light-emitting device of the green sub-pixel is substantially circular; The shape of the first cathode portion of the cathode of the light emitting device of the red sub-pixel is substantially elliptical.

18. The display panel according to claim 17, characterized in that: The minimum distance between the first cathode portions of the two green sub-pixels is smaller than the minimum distance between the first cathode portions of the other two sub-pixels of the same color.

19. The display panel according to claim 17 or 18, characterized in that: The effective light-emitting areas of the light-emitting devices of the red sub-pixels and the blue sub-pixels are arranged alternately along the first direction; the effective light-emitting areas of the light-emitting devices of the green sub-pixels are arranged along the second direction; wherein the first direction is the row direction of the multiple sub-pixels of the display panel, and the second direction is the column direction of the multiple sub-pixels of the display panel.

20. A method for manufacturing a display panel, characterized in that: include: Making a plurality of mutually separated shielding patterns on a substrate; Making a plurality of light-emitting layers on a side of the plurality of shielding patterns away from the substrate; Making a cathode film on a side of the plurality of light-emitting layers away from the substrate; Using a laser to irradiate a region of the substrate corresponding to a light-transmitting region of the display panel from a side of the substrate away from the cathode film, removing a portion of the cathode film in the region that is not blocked by the plurality of blocking patterns, and forming a plurality of cathodes separated from each other; Each light-emitting layer and its corresponding cathode form part of a light-emitting device, and each light-emitting device has an effective light-emitting area, and the orthographic projection of the effective light-emitting area on the substrate is within the orthographic projection range of the cathode of the light-emitting device on the substrate.

21. The manufacturing method according to claim 20, characterized in that: The step of making a plurality of mutually separated shielding patterns on a substrate comprises: Fabricating a plurality of mutually separated anodes on the substrate; Wherein, each of the light-emitting devices includes an anode, and one anode forms one of the shielding patterns.

22. The method according to claim 20, characterized in that: The step of making a plurality of mutually separated shielding patterns on a substrate comprises: A patterned semiconductor layer, a patterned gate metal layer and a patterned source-drain metal layer are fabricated on the substrate; wherein the source-drain metal layer is away from the substrate relative to the semiconductor layer and the gate metal layer; forming a plurality of the shielding patterns in the process of patterning the semiconductor layer or the gate metal layer or the source / drain metal layer; Between the step of making a plurality of mutually separated shielding patterns on the substrate and the step of making a plurality of light-emitting layers, the method further includes: A plurality of anodes are fabricated on the substrate; each of the light emitting devices comprises an anode.

23. The manufacturing method according to claim 22, characterized in that: Between the step of making a plurality of mutually separated shielding patterns on the substrate and the step of making a plurality of anodes, the method further includes: Making a transparent conductive layer on a side of the source / drain metal layer away from the substrate; Forming a first insulating layer on a side of the transparent conductive layer away from the substrate; A plurality of first via holes are made in the first insulating layer, wherein each first via hole has a gap between the orthographic projection of the anode on the substrate and the orthographic projection of the anode on the substrate, and the orthographic projection of each first via hole on the substrate is within the orthographic projection range of the shielding pattern on the substrate.

24. The method according to claim 22, characterized in that: forming a plurality of shielding connection structures in the process of patterning the semiconductor layer or the gate metal layer or the source / drain metal layer; The plurality of shielding connection structures and the shielding pattern are located in the same film layer; the size of each shielding connection structure in the first direction is larger than its size in the second direction; the first direction is the row direction in which the plurality of sub-pixels of the display panel are arranged, and the second direction is the column direction in which the plurality of sub-pixels of the display panel are arranged; Each of the shielding connection structures is connected to two of the shielding patterns; The plurality of shielding connection structures are arranged into a plurality of rows, each row comprising a plurality of the shielding connection structures sequentially arranged along the first direction; Each row of shielding connection structures and the portion of the plurality of shielding patterns connected by the plurality of shielding connection structures in the row form a shielding connection strip.

25. The manufacturing method according to claim 22, characterized in that: Before using the laser to irradiate the area of ​​the substrate corresponding to the light-transmitting area of ​​the display panel from the side of the substrate away from the cathode film, the method further comprises: Disposing a mask plate on a side of the substrate away from the cathode film; Wherein, the mask plate comprises at least one light-blocking line, and the orthographic projection of each of the light-blocking lines on the substrate is connected to the orthographic projections of at least two anodes on the substrate.

26. A display device, characterized in that: include: The display panel according to any one of claims 1 to 19; The functional device is arranged on the back side of the display panel and located in the light-transmitting area of ​​the display panel.

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