Display panel and manufacturing method thereof, display device

Abstract

A display panel (10) and a manufacturing method thereof, a display device, the display panel (10) comprising: a substrate (1); a light emitting device layer (3) disposed on the substrate (1); a first thin film encapsulation layer (41) disposed on a side of the light emitting device layer (3) away from the substrate (1), the first thin film encapsulation layer (41) comprising at least one organic layer (413); a color film layer (6) disposed on a side of the first thin film encapsulation layer (41) away from the substrate (1); and a second thin film encapsulation layer (42) disposed on a side of the color film layer (6) away from the substrate (1), the second thin film encapsulation layer (42) comprising at least one organic layer (421), wherein the display panel (10) further comprises: an adhesive film layer (51, 52) disposed on at least one side of the color film layer (6), the adhesive film layer (51, 52) being in direct contact with and stacked with the color film layer (6), and a viscosity of a material of the adhesive film layer (51, 52) being greater than a viscosity of a material of each of the organic layer (413, 421) in the first thin film encapsulation layer (41) and the second thin film encapsulation layer (42).

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more particularly to a display panel and its manufacturing method, and a display device. Background Technology

[0002] Compared to traditional AMOLED display technology, silicon-based OLED microdisplays, using monocrystalline silicon as a substrate and leveraging mature CMOS processes, offer smaller pixel sizes and higher integration, enabling the creation of near-eye display products comparable to large-screen displays, thus attracting widespread attention. Based on its technological advantages and vast market potential, silicon-based OLED microdisplays are poised to usher in a new wave of near-eye displays in both military and consumer electronics fields, bringing users an unprecedented visual experience. Summary of the Invention

[0003] This disclosure provides a display panel in some embodiments, the display panel comprising: a substrate; a light-emitting device layer disposed on the substrate; a first thin-film encapsulation layer disposed on the side of the light-emitting device layer away from the substrate, the first thin-film encapsulation layer comprising at least one organic layer; a color filter layer disposed on the side of the first thin-film encapsulation layer away from the substrate; and a second thin-film encapsulation layer disposed on the side of the color filter layer away from the substrate, the second thin-film encapsulation layer comprising at least one organic layer, wherein the display panel further comprises: an adhesive film layer disposed on at least one side of the color filter layer, the adhesive film layer being in direct contact with the color filter layer and being stacked thereon, the viscosity of the adhesive film layer material being greater than the viscosity of the organic layer material in each of the first and second thin-film encapsulation layers.

[0004] In some embodiments, the adhesive film layer is in direct contact with the organic layer of at least one of the first thin film encapsulation layer and the second thin film encapsulation layer.

[0005] In some embodiments, the adhesive film layer includes:

[0006] A first adhesive film layer is disposed between the first thin film encapsulation layer and the color filter layer; and

[0007] The second adhesive film layer is disposed between the color filter layer and the second thin film encapsulation layer.

[0008] In some embodiments, the orthographic projection of the color filter layer on the substrate falls within the orthographic projection of at least one of the first adhesive film and the second adhesive film on the substrate.

[0009] In some embodiments, the orthographic projection of the color filter layer on the substrate falls within the orthographic projection of the first thin-film encapsulation layer on the substrate;

[0010] The orthographic projection of the first thin film encapsulation layer on the substrate falls within the orthographic projection of the first adhesive film layer on the substrate;

[0011] The orthographic projection of the first adhesive film layer on the substrate falls within the orthographic projection of the second adhesive film layer on the substrate; and

[0012] The orthographic projection of the second adhesive film layer on the substrate falls within the orthographic projection of the second thin film encapsulation layer on the substrate.

[0013] In some embodiments, the areas of the color filter layer, the first thin film encapsulation layer, the first adhesive film layer, the second adhesive film layer, and the second thin film encapsulation layer projected onto the substrate increase sequentially.

[0014] In some embodiments, the display panel includes a display area and a peripheral area surrounding the display area, the orthographic projection of the color filter layer on the substrate falls within the display area, and the edges of the first thin film encapsulation layer, the first adhesive film layer, the second adhesive film layer, and the second thin film encapsulation layer are all located in the peripheral area.

[0015] In some embodiments, in the direction from the display area toward the surrounding area, the edges of the first thin film encapsulation layer, the first adhesive film layer, the second adhesive film layer, and the second thin film encapsulation layer are sequentially disposed away from the display area and are spaced apart in sequence.

[0016] In some embodiments, the distance between the edge of the first thin film encapsulation layer and the edge of the first adhesive film layer is greater than four times the size of the pixel unit of the panel;

[0017] The distance between the edge of the first adhesive film layer and the edge of the second adhesive film layer is greater than four times the size of the pixel unit of the panel; and

[0018] The distance between the edge of the second adhesive film layer and the edge of the second thin film encapsulation layer is greater than four times the pixel unit size of the panel.

[0019] In some embodiments, the film layer comprises an organic material, which includes at least one of 1-methoxy-2-propanol, propylene glycol monomethyl ether ester, multifunctional acrylic monomers, oxime derivatives, and acrylic resin derivatives.

[0020] In some embodiments, the thickness of the first adhesive film layer is less than the thickness of the second adhesive film layer.

[0021] In some embodiments, the thickness of the second adhesive film layer is approximately three times the thickness of the first adhesive film layer.

[0022] In some embodiments, the first film encapsulation layer includes a first sublayer, a second sublayer, and a third sublayer stacked sequentially away from the substrate. The materials of the first sublayer, the second sublayer, and the third sublayer include silicon nitride, aluminum oxide, and parylene, respectively. The first film layer is in direct contact with the third sublayer.

[0023] In some embodiments, the thickness of the first adhesive film layer is greater than half the thickness of the third sublayer.

[0024] In some embodiments, the second film encapsulation layer includes a fourth sublayer and a fifth sublayer stacked sequentially away from the substrate, the materials of the fourth sublayer and the fifth sublayer respectively including parylene and silicon oxide, and the second film layer is in direct contact with the fourth sublayer.

[0025] In some embodiments, the light-emitting device layer includes a plurality of light-emitting devices arranged in an array, each light-emitting device including a first electrode, a light-emitting functional part, and a second electrode sequentially located away from the substrate.

[0026] For any two adjacent light-emitting devices, the first electrodes of the two adjacent light-emitting devices are spaced apart from each other, the light-emitting functional parts of the two adjacent light-emitting devices are an integral structure, and the second electrodes of the two adjacent light-emitting devices are an integral structure.

[0027] The color filter layer includes multiple color filters, each corresponding to one of the multiple light-emitting devices. For each light-emitting device, the orthographic projection of the first electrode of the light-emitting device on the substrate falls within the orthographic projection of the corresponding color filter on the substrate.

[0028] In some embodiments, the plurality of light-emitting devices include a first light-emitting device and a second light-emitting device that are sequentially adjacent to each other, with a gap between the first electrode of the first light-emitting device and the first electrode of the second light-emitting device.

[0029] The color filter layer includes a first color filter and a second color filter with different colors. The first color filter and the second color filter correspond to the first light-emitting device and the second light-emitting device, respectively. The first color filter and the second color filter have an overlapping portion.

[0030] The orthographic projection of the gap onto the substrate falls within the orthographic projection of the overlapping portion onto the substrate.

[0031] In some embodiments, an integral structure consisting of the light-emitting functional layer of the first light-emitting device and the light-emitting functional part of the second light-emitting device fills the gap.

[0032] In some embodiments, the substrate is a silicon substrate, and the display panel is a silicon-based display panel.

[0033] This disclosure provides a display device, including a display panel according to the foregoing embodiments, in some embodiments.

[0034] This disclosure provides a method for manufacturing a display panel, the method comprising: forming a light-emitting device layer on a substrate; forming a first thin-film encapsulation layer on a side of the light-emitting device layer away from the substrate, the first thin-film encapsulation layer comprising at least one organic layer; forming a color filter layer on the side of the first thin-film encapsulation layer away from the substrate; and forming a second thin-film encapsulation layer on the side of the color filter layer away from the substrate, the second thin-film encapsulation layer comprising at least one organic layer, wherein the manufacturing method further comprises: forming an adhesive film layer on at least one side of the color filter layer, the adhesive film layer material having a viscosity greater than the viscosity of the organic layer material in each of the first and second thin-film encapsulation layers. Attached Figure Description

[0035] Other features, objects, and advantages of this disclosure will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0036] Figure 1 This is a cross-sectional schematic diagram of a display panel according to some embodiments of the present disclosure;

[0037] Figure 2 This is a plan view of a display panel according to some embodiments of the present disclosure, in which only the substrate, the first thin film encapsulation layer, the first adhesive film layer, the color filter layer, the second adhesive film layer, and the second thin film encapsulation layer are shown;

[0038] Figure 3 for Figure 1 Enlarged schematic diagram of the M region;

[0039] Figure 4 for Figure 1 Enlarged schematic diagram of the N region;

[0040] Figure 4A for Figure 4 Corresponding electron microscope image;

[0041] Figure 5 for Figure 4 A magnified schematic diagram of the first electrode;

[0042] Figure 6 This is a partial top view schematic diagram of the pixel definition layer according to an embodiment of the present disclosure;

[0043] Figure 7 This is a partial top view of the pixel definition layer and the first electrode layer according to an embodiment of the present disclosure;

[0044] Figure 8A schematic diagram of a display device provided according to some embodiments of the present disclosure; and

[0045] Figure 9 A flowchart illustrating a method for manufacturing a display device according to some embodiments of the present disclosure. Detailed Implementation

[0046] The present disclosure will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0047] It should be noted that, unless otherwise specified, the embodiments and features described in this disclosure can be combined with each other.

[0048] Furthermore, in the following detailed description, numerous specific details are set forth for ease of explanation to provide a thorough understanding of the embodiments disclosed herein. However, it will be apparent that one or more embodiments may be practiced without these specific details.

[0049] It should be understood that although the terms first, second, etc., may be used herein to describe different elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the exemplary embodiments, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0050] It should be understood that when an element or layer is said to be "formed on" another element or layer, that element or layer can be formed directly or indirectly on the other element or layer. That is, for example, intermediate elements or intermediate layers can exist. Conversely, when an element or layer is said to be "directly formed on" another element or layer, there are no intermediate elements or intermediate layers. Other terms used to describe relationships between elements or layers (e.g., "between" and "directly between," "adjacent" and "directly adjacent," etc.) should be interpreted in a similar manner.

[0051] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the embodiments. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that when the terms “comprising” and / or “including” are used herein, it indicates the presence of the said features, integrals, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof.

[0052] In this document, unless otherwise specified, the expressions "located on the same layer" or "set on the same layer" generally indicate that the first component and the second component can use the same material and can be formed by the same patterning process. The expressions "located on different layers" or "set on different layers" generally indicate that the first component and the second component are formed by different patterning processes.

[0053] Most methods for achieving full-color silicon-based OLED display panels in related technologies employ white OLED (WOED) + color filter (CF) technology. Specifically, after forming a light-emitting device layer comprising multiple arrayed OLEDs on a silicon substrate, the light-emitting device layer is encapsulated with a thin film. For example, a first thin film encapsulation layer is formed on the side of the light-emitting device layer away from the silicon substrate. Subsequently, a color filter layer is formed on the first thin film encapsulation layer to achieve color display in the silicon-based OLED display panel. Next, the silicon-based OLED display panel with the color filter layer is encapsulated with a thin film again, for example, a second thin film encapsulation layer is formed on the side of the color filter layer away from the silicon substrate. The first and second thin film encapsulation layers typically employ a stacked structure of inorganic layer + organic layer + inorganic layer.

[0054] The inventors discovered the following problems with silicon-based OLED display panels in related technologies: Both the first and second thin-film encapsulation layers in these technologies are in direct contact with the color filter layer, serving only a sealing function. During the manufacturing process, impurity particles introduced onto the upper and lower surfaces of the color filter layer can release water and oxygen, causing the color filter layer to be eroded by internal water and oxygen, resulting in display defects. Furthermore, each sub-layer in the first and second thin-film encapsulation layers that contacts the color filter layer is an inorganic layer. The stress at the interface between the inorganic layer and the color filter layer is relatively high, making the thin-film encapsulation layer easily punctured by impurity particles on the surface of the color filter layer, leading to the color filter layer being eroded by external water and oxygen.

[0055] To address the problem of water and oxygen erosion affecting the color filter of silicon-based OLEDs in related technologies, this disclosure provides a display panel comprising: a substrate; a light-emitting device layer disposed on the substrate; a first thin-film encapsulation layer disposed on the side of the light-emitting device layer away from the substrate, the first thin-film encapsulation layer comprising at least one organic layer; a color filter layer disposed on the side of the first thin-film encapsulation layer away from the substrate; and a second thin-film encapsulation layer disposed on the side of the color filter layer away from the substrate, the second thin-film encapsulation layer comprising at least one organic layer. The display panel further comprises: an adhesive film layer disposed on at least one side of the color filter layer, the adhesive film layer being in direct contact with and stacked with the color filter layer, the viscosity of the adhesive film layer material being greater than the viscosity of the organic layer material in each of the first and second thin-film encapsulation layers.

[0056] In some embodiments, the adhesive film layer includes: a first adhesive film layer disposed between the first film encapsulation layer and the color filter layer; and a second adhesive film layer disposed between the color filter layer and the second film encapsulation layer.

[0057] In the embodiments of this disclosure, an adhesive film layer is disposed between the color filter layer and the thin film encapsulation layer (the first thin film encapsulation layer and / or the second thin film encapsulation layer), which increases the adhesion between the color filter layer and the thin film encapsulation layer, making the encapsulation performance of the thin film encapsulation layer stronger. In addition, the adhesive film layer is disposed adjacent to the color adhesive, so that impurity particles on the upper and lower surfaces of the color adhesive introduced during the manufacturing process enter the adhesive film layer and are completely encapsulated by the adhesive film layer. On the one hand, these impurity particles cannot release water and oxygen, thus preventing the color filter from being corroded by internal water and oxygen. On the other hand, the adhesive film is disposed between the color filter and the thin film encapsulation layer and has a predetermined thickness, preventing the thin film encapsulation layer from being punctured by impurity particles, thereby protecting the color filter layer from external water and oxygen corrosion.

[0058] The following embodiments of this disclosure are illustrated using a silicon-based OLED display panel as an example. Those skilled in the art will understand that the solutions disclosed herein can also be applied to other display panels, such as glass-based OLEDs.

[0059] Figure 1 A cross-sectional schematic diagram of a display panel according to some embodiments of the present disclosure is shown, such as... Figure 1 As shown, the display panel 10 includes a substrate 1, a driving circuit layer 2, and a light-emitting device layer 3 disposed on the substrate 1. The substrate 1 is, for example, a silicon substrate, which is made of monocrystalline silicon. The light-emitting device layer 3 is disposed on the side of the driving circuit layer 2 away from the substrate 1. The light-emitting device layer 3 includes a first electrode layer 31, a light-emitting functional layer 32, and a second electrode layer 33 disposed sequentially away from the substrate 1. The first electrode layer 31 is, for example, an anode layer, the second electrode layer 33 is, for example, a cathode layer, and the light-emitting functional layer 32 includes, for example, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer disposed sequentially away from the substrate 1. In some embodiments, the light-emitting device layer 3 includes multiple light-emitting devices arranged in an array, such as OLEDs, and the display is achieved by controlling the light emission of multiple light-emitting devices.

[0060] like Figure 1 As shown, the display panel 10 also includes a first thin-film encapsulation layer 41, which covers the light-emitting device layer 3 and the driving circuit layer 2. Specifically, the first thin-film encapsulation layer 41 covers the side of the light-emitting device layer 3 away from the substrate 1 and encapsulates the sidewalls of the light-emitting device layer 3 and the driving circuit layer 2. The orthographic projection of the light-emitting device layer 3 and the driving circuit layer 2 onto the substrate 1 falls within the orthographic projection of the first thin-film encapsulation layer 41 onto the substrate 1. The first thin-film encapsulation layer 41 serves to seal the light-emitting device layer 3 and the driving circuit layer 2, preventing water and oxygen from corroding the light-emitting device layer 3 and the driving circuit layer 2.

[0061] like Figure 1 As shown, the display panel 10 also includes a first adhesive film layer 51, which covers the first thin-film encapsulation layer 41. Specifically, the first adhesive film layer 51 covers the side of the first thin-film encapsulation layer 41 away from the substrate 1 and covers the sidewall of the first thin-film encapsulation layer 41. The orthographic projection of the first thin-film encapsulation layer 41 on the substrate 1 falls within the orthographic projection of the first adhesive film layer 51 on the substrate 1.

[0062] In some embodiments, the first adhesive layer 51 is, for example, an organic adhesive, specifically one or more of 1-methoxy-2-propanol, propylene glycol monomethyl ether ester, multifunctional acrylic monomers, oxime derivatives, and acrylic resin derivatives. This design allows the first adhesive layer 51 to directly contact the subsequently formed color filter layer 6. Impurity particles on the lower surface of the color filter layer 6, i.e., the surface facing the substrate 1, can be immersed in the first adhesive layer 51 and completely encapsulated by it, preventing these impurity particles from releasing water and oxygen, thus avoiding corrosion of the color filter layer 6.

[0063] In some embodiments, the thickness of the first adhesive film layer 51 is, for example, 1000~3000 angstroms, which allows the aforementioned impurity particles to be completely encapsulated within the first adhesive film layer 51, preventing them from puncturing the first thin film encapsulation layer 41 and ensuring the encapsulation effect.

[0064] like Figure 1 As shown, the display panel 10 also includes a color filter layer 6, which is disposed on the side of the first adhesive layer 51 away from the substrate 1. The color filter layer 6 includes, for example, multiple color filters, each corresponding to a plurality of light-emitting devices in the light-emitting device layer 3. These light-emitting devices in the light-emitting device layer 3 are, for example, white OLEDs. When the white light emitted by the white OLED passes through the corresponding color filter, only light with a specific extension is allowed to pass through, thereby achieving full-color display of the display panel. The orthographic projection of the color filter layer 6 onto the substrate 1 substantially coincides with the orthographic projection of the light-emitting device layer 3 onto the substrate 1. In some embodiments, the thickness of the color filter layer 6 is 9000~11000 angstroms.

[0065] like Figure 1 As shown, the display panel 10 also includes a second adhesive film layer 52, which covers the color filter layer 6 and the first adhesive film layer 51. Specifically, the second adhesive film layer 52 covers the side of the color filter layer 6 away from the substrate 1 and the sidewall of the color filter layer 6, and also covers the portion of the first adhesive film layer 51 not covered by the color filter layer. The orthographic projections of the color filter layer 6 and the first adhesive film layer 51 onto the substrate 1 both fall within the orthographic projection of the second adhesive film layer 52 onto the substrate 1.

[0066] In some embodiments, the second adhesive layer 52 is, for example, an organic adhesive, specifically one or more of 1-methoxy-2-propanol, propylene glycol monomethyl ether ester, multifunctional acrylic monomers, oxime derivatives, and acrylic resin derivatives. This design allows the second adhesive layer 53 to directly contact the color filter layer 6, enabling impurity particles on the upper surface of the color filter layer 6, i.e., the surface away from the substrate 1, to be immersed in the second adhesive layer 52 and completely encapsulated by it, preventing these impurity particles from releasing water and oxygen and corroding the color filter layer 6.

[0067] In some embodiments, the thickness of the second adhesive film layer 52 is, for example, 3000~5000 angstroms, which allows the aforementioned impurity particles to be completely encapsulated within the second adhesive film layer 52, preventing them from puncturing the subsequently formed second thin film encapsulation layer 42 and ensuring the encapsulation effect.

[0068] like Figure 1 As shown, the display panel 10 also includes a second thin-film encapsulation layer 42, which covers the second adhesive film layer 52. Specifically, the second thin-film encapsulation layer 42 covers the side of the second adhesive film layer 52 away from the substrate 1 and encapsulates the sidewalls of the second adhesive film layer 52. The orthographic projection of the second adhesive film layer 52 onto the substrate 1 falls within the orthographic projection of the second thin-film encapsulation layer 42 onto the substrate 1.

[0069] like Figure 1 As shown, the display panel 10 also includes a cover plate 8, which is made of a transparent material, such as a glass cover plate. The cover plate 8 is bonded to the substrate 1 after the second thin film encapsulation layer 8 is formed by a sealant 7. The sealant 7 and the cover plate 12 provide additional multiple layers of protection against the intrusion of external water and oxygen.

[0070] In the embodiments of this disclosure, an adhesive layer (first adhesive layer and / or second adhesive layer) is disposed between the color filter layer and the thin film encapsulation layer (first thin film encapsulation layer and / or second thin film encapsulation layer), which increases the adhesion between the color filter layer and the thin film encapsulation layer, making the encapsulation performance of the thin film encapsulation layer stronger; and the adhesive layer is disposed adjacent to the color adhesive, so that impurity particles on the upper and lower surfaces of the color adhesive introduced during the manufacturing process enter into the adhesive layer and are completely encapsulated by the adhesive layer. On the one hand, these impurity particles cannot release water and oxygen, avoiding the color filter from being corroded by internal water and oxygen; on the other hand, the adhesive layer is disposed between the color filter and the thin film encapsulation layer and has a predetermined thickness, preventing the thin film encapsulation layer from being punctured by impurity particles, thereby protecting the color filter layer from external water and oxygen corrosion and ensuring the service life of the display panel.

[0071] Figure 2A plan view of a display panel according to some embodiments of the present disclosure is shown, showing only the substrate, the first thin film encapsulation layer, the first adhesive film layer, the color filter layer, the second adhesive film layer, and the second thin film encapsulation layer, to illustrate the relative positional relationship of the edges of the first thin film encapsulation layer, the first adhesive film layer, the color filter layer, the second adhesive film layer, and the second thin film encapsulation layer.

[0072] Those skilled in the art will understand that, in order to clearly show the edges of the first thin-film encapsulation layer, the first adhesive film layer, the color filter layer, the second adhesive film layer, and the second thin-film encapsulation layer, the edges of the first thin-film encapsulation layer, the first adhesive film layer, the color filter layer, the second adhesive film layer, and the second thin-film encapsulation layer are all drawn with solid lines. This does not indicate the positional relationship of the first thin-film encapsulation layer, the first adhesive film layer, the color filter layer, the second adhesive film layer, and the second thin-film encapsulation layer in the direction perpendicular to the substrate. Specifically, in conjunction with... Figure 1 The first thin film encapsulation layer, the first adhesive film layer, the color filter layer, the second adhesive film layer, and the second thin film encapsulation layer are arranged sequentially away from the substrate.

[0073] See Figure 1 and Figure 2 The display panel 10 has a display area DA and a peripheral area PA surrounding the display area. The orthographic projections of the light-emitting device layer 3 and the color filter layer 6 onto the substrate 1 both fall within the display area DA. The orthographic projections of the first thin-film encapsulation layer 41, the first adhesive film layer 51, the second adhesive film layer 52, and the second thin-film encapsulation layer 42 onto the substrate 1 all extend from the display area DA into the peripheral area PA. That is, the orthographic projections of the edges of the first thin-film encapsulation layer 41, the first adhesive film layer 51, the second adhesive film layer 52, and the second thin-film encapsulation layer 42 onto the substrate 1 are all located within the peripheral area PA. It can be considered that the orthographic projections of the first thin-film encapsulation layer 41, the first adhesive film layer 51, the second adhesive film layer 52, and the second thin-film encapsulation layer 42 onto the substrate 1 all cover the display area DA and a portion of the peripheral area PA.

[0074] like Figure 2 As shown, the orthographic projections of the first thin-film encapsulation layer 41, the first adhesive film layer 51, the color filter layer 6, the second adhesive film layer 52, and the second thin-film encapsulation layer 42 onto the substrate 1 are all rectangles. Those skilled in the art will understand that in other embodiments, the orthographic projections of the first thin-film encapsulation layer 41, the first adhesive film layer 51, the color filter layer 6, the second adhesive film layer 52, and the second thin-film encapsulation layer 42 onto the substrate 1 can be rectangles or other shapes, such as hexagons, circles, etc.

[0075] In some embodiments, such as Figure 1 and Figure 2As shown, the orthographic projection of the color filter layer 6 on the substrate 1 falls within the orthographic projection of the first thin-film encapsulation layer 41 on the substrate 1; the orthographic projection of the first thin-film encapsulation layer 41 on the substrate 1 falls within the orthographic projection of the first adhesive film layer 51 on the substrate 1; the orthographic projection of the first adhesive film layer 51 on the substrate 1 falls within the orthographic projection of the second adhesive film layer 52 on the substrate 1; and the orthographic projection of the second adhesive film layer 52 on the substrate 1 falls within the orthographic projection of the second thin-film encapsulation layer 42 on the substrate 1. The areas of the orthographic projections of the color filter layer 6, the first thin-film encapsulation layer 41, the first adhesive film layer 51, the second adhesive film layer 52, and the second thin-film encapsulation layer 42 on the substrate 1 increase sequentially.

[0076] In some embodiments, in the direction from the display area DA toward the peripheral area PA, the edges of the first thin film encapsulation layer 41, the first adhesive film layer 51, the second adhesive film layer 52, and the second thin film encapsulation layer 42 are sequentially disposed away from the display area and are spaced apart in sequence.

[0077] Specifically, the orthographic projections of the first thin-film encapsulation layer 41, the first adhesive film layer 51, the color filter layer 6, the second adhesive film layer 52, and the second thin-film encapsulation layer 42 onto the substrate 1 are all rectangles, and each of these layers includes four edges, i.e., as shown in the figure. Figure 2 The top edge, bottom edge, left edge, and right edge of a line are collectively referred to as the edge.

[0078] For ease of explanation, the upper edges of the first thin-film encapsulation layer 41, the first adhesive film layer 51, the color filter layer 6, the second adhesive film layer 52, and the second thin-film encapsulation layer 42 are referred to as the upper edge group; the lower edges of the first thin-film encapsulation layer 41, the first adhesive film layer 51, the color filter layer 6, the second adhesive film layer 52, and the second thin-film encapsulation layer 42 are referred to as the lower edge group; the right edges of the first thin-film encapsulation layer 41, the first adhesive film layer 51, the color filter layer 6, the second adhesive film layer 52, and the second thin-film encapsulation layer 42 are referred to as the left edge group; and the right edges of the first thin-film encapsulation layer 41, the first adhesive film layer 51, the color filter layer 6, the second adhesive film layer 52, and the second thin-film encapsulation layer 42 are referred to as the right edge group.

[0079] For any one of the upper edge group, lower edge group, left edge group, and right edge group, the edges of the first thin film encapsulation layer 41, the first adhesive film layer 51, the second adhesive film layer 52, and the second thin film encapsulation layer 42 are sequentially disposed away from the display area and are sequentially spaced apart.

[0080] For example, see the right edge group. Figure 1 and Figure 2In the first direction X, the right edge of the first thin film encapsulation layer 41, the right edge of the first adhesive film layer 51, the right edge of the second adhesive film layer 52, and the right edge of the second thin film encapsulation layer 42 are sequentially disposed away from the display area DA and are spaced apart from each other.

[0081] Specifically, in the first direction X, the distance between the right edge of the first thin-film encapsulation layer 41 and the right edge of the first adhesive film layer 51 is d1, referred to as the first distance d1. The first distance d1 is substantially greater than the sum of the alignment accuracy of the first thin-film encapsulation layer 41 and the alignment accuracy of the first adhesive film layer 51. In some embodiments, the first thin-film encapsulation layer 41 is formed using an open mask process, and the alignment accuracy of the first thin-film encapsulation layer 41 refers to the alignment accuracy between the mask used to form the first thin-film encapsulation layer 41 and the substrate 10. The first adhesive film layer 51 is also formed using an open mask process, and the alignment accuracy of the first adhesive film layer 51 refers to the alignment accuracy between the mask used to form the first adhesive film layer 51 and the substrate 10. This ensures that the first adhesive film layer 51 completely covers the first thin-film encapsulation layer 41. In actual production processes, even if there are positional deviations between the first adhesive film layer 51 and the first thin-film encapsulation layer 41, the first adhesive film layer 51 will not expose the first thin-film encapsulation layer 41.

[0082] The distance d2 between the right edge of the first adhesive layer 51 and the right edge of the second adhesive layer 52 is called the second distance d2. The second distance d2 is substantially greater than the sum of the alignment accuracy of the first adhesive layer 51 and the alignment accuracy of the second adhesive layer 52. In some embodiments, the second adhesive layer 52 is also formed using an open mask process, where the alignment accuracy of the second adhesive layer 52 refers to the alignment accuracy between the mask and the substrate 10 used when forming the second adhesive layer 52. This ensures that the second adhesive layer 52 completely covers the first adhesive layer 51. In actual production processes, even if there are positional deviations between the first adhesive layer 51 and the second adhesive layer 52, the second adhesive layer 52 will not expose the first adhesive layer 51.

[0083] The distance d3 between the right edge of the second adhesive film layer 52 and the right edge of the second thin film encapsulation layer 42 is called the third distance d3. The third distance d3 is substantially greater than the sum of the alignment accuracy of the second adhesive film layer 52 and the alignment accuracy of the second thin film encapsulation layer 42. In some embodiments, the second thin film encapsulation layer 42 is also formed using an open mask process. The alignment accuracy of the second thin film encapsulation layer 42 refers to the alignment accuracy between the mask used to form the second thin film encapsulation layer 42 and the substrate 10. This ensures that the second thin film encapsulation layer 42 completely covers the second adhesive film layer 52. In actual production processes, even if there are positional deviations between the second thin film encapsulation layer 42 and the second adhesive film layer 52, the second thin film encapsulation layer 42 will not expose the second adhesive film layer 52.

[0084] In some embodiments, the alignment accuracy of any two of the first thin film encapsulation layer 41, the second thin film encapsulation layer 42, the first adhesive film layer 51, and the second adhesive film layer 52 may be the same or different. For example, the alignment accuracy of the first thin film encapsulation layer 41, the second thin film encapsulation layer 42, the first adhesive film layer 51, and the second adhesive film layer 52 may all be 10 μm.

[0085] In some embodiments, the size of the pixel unit in the display panel is approximately 4.6 to 5.2 μm, which can be understood to mean that each of the aforementioned first distance d1, second distance d2, and third distance d3 is greater than four times the size of the pixel unit of the panel.

[0086] Those skilled in the art will understand that, similarly, in the first direction X, the left edges of the first thin-film encapsulation layer 41, the first adhesive film layer 51, the second adhesive film layer 52, and the second thin-film encapsulation layer 42 are sequentially disposed away from the display area DA and are spaced apart from each other; in the second direction Y perpendicular to the first direction X, the upper edges of the first thin-film encapsulation layer 41, the first adhesive film layer 51, the second adhesive film layer 52, and the second thin-film encapsulation layer 42 are sequentially disposed away from the display area DA and are spaced apart from each other; in the second direction Y, the lower edges of the first thin-film encapsulation layer 41, the first adhesive film layer 51, the second adhesive film layer 52, and the second thin-film encapsulation layer 42 are sequentially disposed away from the display area DA and are spaced apart from each other, which will not be elaborated further here.

[0087] Figure 3 for Figure 1 An enlarged schematic diagram of region M. In some embodiments, combined with... Figure 1 and Figure 3As shown, the first thin-film encapsulation layer 41 includes a first sub-layer 411, a second sub-layer 412, and a third sub-layer 413, sequentially located away from the substrate 1. The first sub-layer 411 is, for example, silicon nitride (SiNx), with a thickness of, for example, 2500-3500 angstroms. The second sub-layer 412 is, for example, aluminum oxide (Al2O3), with a thickness of, for example, 400-600 angstroms. The third organic layer 413 is in direct contact with the first adhesive film layer 51. The third sub-layer 413 is, for example, parylene, with a thickness of, for example, 4500-5500 angstroms. The adhesion of the third sub-layer 413, as an organic layer, to the first adhesive film layer 51 allows for a tighter bond between the first thin-film encapsulation layer 41 and the first adhesive film layer 51. The total thickness of the first thin-film encapsulation layer 41 is, for example, 7400-9600 angstroms.

[0088] In some embodiments, combined with Figure 1 and Figure 3 As shown, the second thin-film encapsulation layer 42 includes a fourth sub-layer 421 and a fifth sub-layer 422 sequentially disposed away from the substrate 1. The fourth sub-layer 421 is, for example, parylene, with a thickness of, for example, 4500-5500 angstroms. The fifth sub-layer 422 is, for example, silicon oxide (SiO2), with a thickness of, for example, 950-1050 angstroms. The fourth organic layer 421 is in direct contact with the second adhesive film layer 52. The adhesion between the fourth sub-layer 421, as an organic layer, and the second adhesive film layer 52 allows for a tighter bond between the second thin-film encapsulation layer 42 and the second adhesive film layer 52. The total thickness of the second thin-film encapsulation layer 42 is, for example, 5450-6550 angstroms.

[0089] In some embodiments, the characteristics of the organic layers, such as the third sublayer 413 or the fourth sublayer 421, in the adhesive film layer, such as the first adhesive film layer 51 or the second adhesive film layer 52, and the thin film encapsulation layer, such as the first thin film encapsulation layer 41 or the second thin film encapsulation layer 42, are compared in Table 1 below:

[0090] membrane Viscosity (mPa·s) Refractive index Density (g / cm^3) Light transmittance film layer 1.750 1.4034 0.922 0.90 Organic layer (Parylene) 0.648 1.592 1.289 0.95

[0091] In some embodiments, as shown in Table 1, the viscosity of the adhesive film layer, such as the first adhesive film layer 51 or the second adhesive film layer 52, is greater than the viscosity of the organic layer in the thin film encapsulation layer, such as the third sublayer 413 or the fourth sublayer 421. Due to the higher viscosity, the adhesive film layer easily adsorbs impurity particles, and because the adhesive film layer has a certain degree of fluidity, it easily encapsulates the adsorbed impurity particles.

[0092] In some embodiments, the refractive index and density of the adhesive film layer are both greater than those of the organic layer (Parylene), and the light transmittance of the adhesive film layer is substantially the same as that of the organic layer (Parylene).

[0093] In some embodiments, the thickness of the second adhesive layer 52 is greater than the thickness of the first adhesive layer 51. A thicker adhesive layer can cover more impurity particles. In the display panel forming process, the impurity particles generated during the formation of the color filter layer 6 are significantly more numerous than those generated during the formation of the third sub-layer 413. In some embodiments, the color filter layer 6 comprises three color filters and requires three film-forming processes to form. The impurity particles generated during the formation of the color filter layer 6 are approximately three times more numerous than those generated during the formation of the third sub-layer 413. To ensure that the impurity particles substantially do not affect the color filter layer, the thickness of the second adhesive layer 52 can be set to approximately three times the thickness of the first adhesive layer 51, or greater.

[0094] In some embodiments, during the process of forming the third sublayer 413, the size of the impurity particles formed is typically less than half the thickness of the third sublayer 413. In order for the impurity particles formed in this process to be covered by the first adhesive film layer 51, the thickness of the first adhesive film layer 51 may be approximately half the thickness of the third sublayer 413 or greater.

[0095] The foregoing embodiments provide an example where both sides of the color filter layer are covered by an adhesive film layer. Those skilled in the art will understand that in other embodiments, the adhesive film layer may be provided only on one side of the color filter layer, i.e., the display panel may only include a first adhesive film layer or a second adhesive film layer, which can also solve the problem of the color filter layer being eroded by internal and external water and oxygen to a certain extent.

[0096] Figure 4 for Figure 1 Enlarged diagram of the N region, Figure 4A for Figure 4 The corresponding electron microscope image. In some embodiments, such as Figure 4 and Figure 4A As shown, the light-emitting device layer includes multiple light-emitting devices P, each of which includes a first electrode 31', a light-emitting functional part 32', and a second electrode 33' sequentially located away from the substrate 1. The first electrode 31' is, for example, an anode, and the second electrode 33' is, for example, a cathode. For any two adjacent light-emitting devices P, their first electrodes 31' are spaced apart from each other, for example, there is a gap T between the first electrodes 31' of two adjacent light-emitting devices P, to prevent the first electrodes 31' of the two adjacent light-emitting devices P from being electrically connected. The light-emitting functional parts 32' of two adjacent light-emitting devices P are an integral structure, and the second electrodes 33' of two adjacent light-emitting devices P are an integral structure. That is, the light-emitting functional parts 32' of the multiple light-emitting devices P are connected as a whole to form the aforementioned light-emitting functional layer 32. The second electrodes 33' of the multiple light-emitting devices P are connected as a whole to form the aforementioned second electrode layer 33.

[0097] In some embodiments, the color filter layer 6 includes a plurality of color filters 61, which correspond one-to-one with the plurality of light-emitting devices P. For each light-emitting device P, the orthographic projection of the first electrode 31' of the light-emitting device P onto the substrate 1 falls within the orthographic projection of the color filter 61 corresponding to the light-emitting device P onto the substrate.

[0098] Each light-emitting device P, together with its corresponding color filter 61, constitutes a pixel unit. All light-emitting devices P emit white light. The white light emitted by the light-emitting device P passes through its corresponding color filter 61, allowing only light of a specific color to pass through the corresponding color filter, thereby realizing full-color display of the display panel.

[0099] In some embodiments, such as Figure 4 and Figure 4A As shown, the color filter layer 6 includes a first color filter 611, a second color filter 612, and a third color filter 613 that are sequentially adjacent to each other. These correspond to the first light-emitting device P1, the second light-emitting device P2, and the third light-emitting device P3 that are sequentially adjacent to each other. The first color filter 611, the second color filter 612, and the third color filter 613 have different colors. For example, the first color filter 611 is a red color filter that only allows red light to pass through; the second color filter 612 is a green color filter that only allows green light to pass through; and the third color filter 613 is a blue color filter that only allows blue light to pass through. The first color filter 611, the second color filter 612, and the third color filter 613, together with their corresponding first light-emitting devices P1, P2, and P3, respectively constitute a first pixel unit, a second pixel unit, and a third pixel unit. The first pixel unit, the second pixel unit, and the third pixel unit can emit red light, green light, and blue light, respectively, and are also called red pixel units, green pixel units, and blue pixel units, thereby realizing the full-color display of the display panel.

[0100] For any two adjacent pixel units, they have color filters of different colors, and their color filters have an overlapping portion. The gap between the first electrodes of their light-emitting devices is projected onto the substrate and falls within the projection of the overlapping portion onto the substrate. This arrangement makes the overlapping portion of the different colored color filters opaque, avoiding light interference between adjacent pixel units. By using a partially overlapping method of different colored color filters, the black matrix between adjacent color filters in related technologies can be omitted.

[0101] Specifically, taking the adjacent first pixel unit and second pixel unit as an example, such as... Figure 4 and Figure 4AAs shown, the first color filter 61 of the first pixel unit and the second color filter 62 of the second pixel unit have an overlapping portion OP. Specifically, the first color filter 61 covers the edge of the second color filter 62 near the first color filter 61. Since the first color filter 61 and the second color filter 62 are red and green color filters respectively, the overlapping portion OP of the first color filter 61 and the second color filter 62 of the second pixel unit is opaque, which can avoid light interference between adjacent first pixel units and second pixel units. There is a gap T between the first electrode 31' of the first light-emitting device P1 of the first pixel unit and the first electrode 31' of the second light-emitting device P2 of the second pixel unit. The orthographic projection of the gap T on the substrate 1 falls within the orthographic projection of the overlapping portion OP on the substrate 1.

[0102] In some embodiments, during the formation of the color filter layer 6, a third color filter 63 is first formed, followed by a second color filter 62, such that the second color filter 62 and the third color filter 63 partially overlap to form an overlap between the second color filter 62 and the third color filter 63. Then, a first color filter 61 is formed such that the first color filter 61 and the second color filter 62 partially overlap to form an overlap between the first color filter 61 and the second color filter 62, and simultaneously, the first color filter 61 and the third color filter 63 partially overlap to form an overlap between the first color filter 61 and the third color filter 63.

[0103] In some embodiments, such as Figure 4 and Figure 4A As shown, the light-emitting functional part 32' of the light-emitting device P forms an integral structure, namely the light-emitting functional layer 32, which fills the gap T.

[0104] In some embodiments, such as Figure 4 and Figure 4A As shown, in the display panel 10, the driving circuit layer 2 includes a planarization layer 20 near the first electrode layer 31, the first electrode layer 3 is disposed on the side of the planarization layer 20 away from the substrate 1 and adjacent to the planarization layer 2, and the display panel 10 also includes a pixel definition layer 9, wherein:

[0105] The planarization layer 20 has a plurality of partition grooves 201 on the surface opposite to the substrate 1 to divide the planarization layer 20 into a plurality of driving regions 202, and the driving regions 202 are distributed in an array. The orthographic projection of each partition groove 201 on the substrate 1 falls within the orthographic projection of its corresponding gap T on the substrate 1.

[0106] Figure 5 for Figure 4 An enlarged schematic diagram of the first electrode 31' is shown below. Figure 4 and Figure 5As shown, the first electrode layer 31 is disposed on the surface of the planarization layer 20 away from the substrate 1, and includes a plurality of first electrodes 31' distributed in an array. The orthographic projection of each first electrode 31' onto the planarization layer 20 corresponds one-to-one with that of each driving region 202. The first electrode 31' includes a flat middle portion 310 and an edge portion 311 surrounding the middle portion 310; the edge portion 311 includes a flat portion 3110 surrounding the middle portion 310 and a ramp portion 3111 connecting the middle portion 310 and the flat portion 3110, and the thickness of the flat portion 3110 is less than that of the middle portion 310.

[0107] The pixel definition layer 9 is disposed on the surface of the planarization layer 20 away from the substrate 1 and exposes at least a portion of the middle portion 310. It can be understood that the pixel definition layer 9 covers the edge portion 311 of the first electrode 31'.

[0108] The light-emitting functional layer 32 covers the pixel definition layer 9, the middle portion 310 of the first electrode 31' exposed by the pixel definition layer 9, and the planarization layer 2. The light-emitting functional layer 32 fills the partition groove 201. The second electrode layer 33 covers the entire surface of the light-emitting functional layer 32.

[0109] Since the orthographic projections of the first electrode 31' on the planarization layer 20 are located within each driving region 202, the orthographic projections of the first electrode 31' on the planarization layer do not overlap with the partition groove 201. It can be understood that the orthographic projections of the partition groove 201 on the substrate 1 fall within the orthographic projections of its corresponding interval T on the substrate. When forming the light-emitting function 32, the light-emitting function layer 32 can be recessed into the substrate 1 at the location of the partition groove 201, thereby forming a recessed portion 331 in the second electrode layer 33 at the recessed location. The orthographic projection of the recessed portion 331 on the planarization layer 20 does not overlap with the orthographic projection of the middle portion 310 of the first electrode 31' on the planarization layer 2. Thus, the position of the recessed portion 331 of the second electrode layer 33 can be restricted by the partition groove 201, preventing tip discharge or even short circuit between the recessed portion 331 and the middle portion 310 of the first electrode 31', which is beneficial to ensure the stable light emission of the light-emitting device. At the same time, it can reduce or even avoid light emission within the recessed area 331, thereby reducing mutual interference between adjacent light-emitting devices.

[0110] The following is a detailed description of each part of the display panel 10 in the embodiments of this disclosure.

[0111] like Figure 4 As shown, the material of substrate 1 can be semiconductor materials such as monocrystalline silicon or polycrystalline silicon, or other hard or soft materials such as glass.

[0112] In some embodiments of this disclosure, a plurality of driving transistors may be disposed on the substrate 1 to drive various light-emitting devices to emit light in order to display images. Taking a top-gate structure driving transistor as an example, the driving circuit layer 2 of the display panel 10 further includes a gate insulating layer GI, a gate G, a first insulating layer 21, and a first wiring layer 22, wherein: the material of the substrate 1 may be a semiconductor material such as monocrystalline silicon or polycrystalline silicon, and the substrate 1 includes an active region 101 and source 1011 and drain 1012 located at both ends of the active region 101. The gate insulating layer GI covers the active region 101; the gate G is disposed on the surface of the gate insulating layer GI away from the substrate 1, and the material of the gate G may include polycrystalline silicon. The first insulating layer 21 covers the gate G and the substrate 1, and its material may include at least one of silicon oxide and silicon nitride. The first wiring layer 22 is disposed on the surface of the first insulating layer 21 away from the substrate 1, and the gate G, source 1011, and drain 1012 are all connected to the first wiring layer 10 through vias filled with tungsten or other metals.

[0113] In addition, the display panel 10 may also include a second insulating layer 23 and a second wiring layer 24. The second insulating layer 23 covers the first wiring layer 22 and the first insulating layer 21. The second wiring layer 24 is disposed on the surface of the second insulating layer 23 away from the substrate 1. The specific pattern of the second wiring layer 24 is not particularly limited here. It can be connected to the first wiring layer 22 through vias filled with tungsten or other metals.

[0114] like Figure 4 As shown, a planarization layer 20 is disposed on one side of the substrate 1. In some embodiments of this disclosure, the planarization layer 20 may cover the second wiring layer 24, and the first electrode 31' may be connected to the second wiring layer 24 through vias filled with tungsten or other metals. The material of the planarization layer 20 may include at least one of silicon nitride and silicon oxide, and may also include other insulating materials. For example, the planarization layer 20 may be planarized by a polishing process.

[0115] Multiple partition grooves 201 can be formed on the surface of the planarization layer 20 away from the substrate 1. The depth of the partition grooves 201 is less than the thickness of the planarization layer 20, that is, the partition grooves 201 will not penetrate the planarization layer 20 in the depth direction. Multiple driving regions 202 can be divided on the planarization layer 20 through the partition grooves 201, and the driving regions 202 are distributed in an array.

[0116] The shape of the orthographic projection of the driving region 202 onto the base 1 can be a rectangle, pentagon, hexagon, or other polygon. Of course, it can also be a circle or other shapes, without any special limitation. At the same time, the shape and size of different driving regions 202 can be different.

[0117] Each partition groove 201 may include two opposing sidewalls 2011 and a bottom wall 2012 connecting the two sidewalls 2011. The two sidewalls 2011 may be arranged in parallel, meaning that in a direction perpendicular to the base 1, the two sidewalls 2011 and their extending surfaces do not intersect. Alternatively, the two sidewalls 2011 may be arranged at a certain angle.

[0118] In some embodiments, the bottom wall 2012 may be substantially parallel to the surface of the planarization layer 20 opposite to the substrate 1, or, as... Figure 4 As shown, the bottom wall 2012 can also be a curved surface that protrudes in the direction away from the base 1. The curvature and shape of the surface are not specifically limited here. In the cross section perpendicular to the base 1, the outline of the bottom wall 2012 can be roughly arc-shaped, parabolic, or wavy. Of course, it can also be other regular or irregular shapes, as long as it protrudes in the direction away from the base 1.

[0119] In some embodiments of this disclosure, the two sidewalls 2011 taper towards the bottom wall 2012, meaning the distance between the two sidewalls 2011 gradually decreases towards the bottom wall 2012, resulting in the sidewalls 2011 having a slope relative to the surface of the flattening layer 20 facing away from the substrate 1. This slope is the angle between the sidewalls 2011 and the surface of the flattening layer 20 facing away from the substrate 1. Further, this slope is not less than 70° and not greater than 90°; for example, the slope can be 70°, 80°, or 90°, etc.

[0120] In some embodiments of this disclosure, the distance between the two sidewalls 2011 of the partition groove 201 can be 0.2μm-0.7μm, for example 0.2μm-0.3μm, 0.5μm or 0.7μm.

[0121] like Figure 1 As shown, the first electrode layer 31 is disposed on the surface of the planarization layer 20 facing away from the substrate 1, and includes a plurality of first electrodes 31' arranged in an array. The orthographic projection of each first electrode 31' onto the planarization layer 20 is located within each driving region 202, that is, the boundary of the orthographic projection of each first electrode 31' onto the substrate 1 is located within the boundary of the orthographic projection of each driving region 202 onto the substrate 1. Only one first electrode 31' is disposed on each driving region 202. Since the driving region 202 is divided by the partition groove 201, and the first electrode 31' is located on the driving region 202, the partition groove 201 is located outside the first electrode 31'. The shape of the orthographic projection of each first electrode 31' onto the planarization layer 20 can be the same as the shape of the driving region 202 it is located in, and the boundary of the first electrode 31' is located within the driving region 202 it is located in.

[0122] In a direction parallel to the substrate 1, at least one first electrode 31' may include a middle portion 310 and an edge portion 311 surrounding the middle portion 310, wherein the middle portion 310 is a flat structure, that is, the middle portion 310 is substantially parallel to the surface of the flat layer 20 away from the substrate 1.

[0123] In some embodiments of this disclosure, the boundary of the orthographic projection of the middle portion 310 of each first electrode 31' onto the substrate 1 may be located within the boundary of the orthographic projection of the driving region 202 on the substrate 1, that is, the boundary of the orthographic projection of the middle portion 310 onto the substrate 1 and the boundary of the orthographic projection of the driving region 202 on the substrate 1 have a predetermined distance. For example, the predetermined distance is not less than 0.15 μm, and for example, the distance may be 0.15 μm, 0.2 μm, 0.25 μm, etc.

[0124] The edge portion 311 may include a flat portion 3110 and a ramp portion 3111, wherein the flat portion 3110 is located on the surface of the flattening layer 20 facing away from the substrate 1 and is disposed around the middle portion 310, and the flat portion 3110 is substantially parallel to the surface of the flattening layer 20 facing away from the substrate 1. Meanwhile, the thickness of the flat portion 3110 is less than the thickness of the middle portion 310. In some embodiments of this disclosure, there is a predetermined distance between the boundary of the orthographic projection of the flat portion 3110 onto the substrate 1 and the boundary of the orthographic projection of the driving region 202 to which it is located onto the substrate 1. Optionally, the boundary of the orthographic projection of the flat portion 3110 onto the substrate 1 overlaps with the boundary of the orthographic projection of the driving region 202 to which it is located onto the substrate 1.

[0125] The ramp portion 3111 connects the intermediate portion 310 and the flat portion 3110, that is, the ramp portion 3111 surrounds the intermediate portion 310, and the flat portion 3110 surrounds the ramp portion 3111. In some embodiments of this disclosure, the slope of the ramp portion 3111 relative to the surface of the flat layer 20 away from the substrate 1 is not less than 30°, and this slope is the angle between the surface of the ramp portion 3111 and the surface of the flat layer 20 away from the substrate 1.

[0126] The first electrode 31' includes a first conductive layer 320, a second conductive layer 321, and a third conductive layer 322. The first conductive layer 320 is disposed on the surface of the planarization layer 2 away from the substrate 1. The second conductive layer 321 is disposed on the surface of the first conductive layer 320 away from the substrate 1. The third conductive layer 322 is disposed on the surface of the second conductive layer 321 away from the substrate 1 and extends to the planarization layer 20 at a certain slope, thereby covering the first conductive layer 320 and the second conductive layer 321 and protecting the first conductive layer 320 and the second conductive layer 321.

[0127] The middle portion 310 of the first electrode 31' includes a region where the third conductive layer 322 is located on the surface of the second conductive layer 321 facing away from the substrate 1, as well as the first conductive layer 320 and the second conductive layer 321. The edge portion 311 includes a region where the third conductive layer 322 covers the edges of the first conductive layer 320 and the second conductive layer 321, i.e., a region extending toward the planarization layer 20. For example, the material of the first conductive layer 320 may include titanium (Ti), the material of the second conductive layer 321 may include silver (Ag), and the material of the third conductive layer 322 may include indium tin oxide (ITO). Of course, other materials may also be used.

[0128] like Figure 1 As shown, the pixel definition layer 9 is made of an insulating material and, along with the first electrode layer 31, is disposed on the surface of the planarization layer 20 facing away from the substrate 1. The pixel definition layer 9 covers the edge of the first electrode 31', for example, the pixel definition layer 9 covers the edge portion 311 of the first electrode 31'. At the same time, the pixel definition layer 9 exposes at least a portion of the middle portion 310 of the first electrode 31.

[0129] In some embodiments of this disclosure, each first electrode 31' does not completely cover the driving region 202 in which it is located, and the boundary of the orthographic projection of the flat portion 3110 of the first electrode 31' onto the substrate 1 has a certain distance from the boundary of the orthographic projection of the driving region 202 in which it is located onto the substrate 1. The pixel definition layer 9 extends to the sidewall 2011 and bottom wall 2012 of the partition groove 201, that is, the pixel definition layer 9 conformally fits the driving region 202 not covered by the first electrode 31', so that the pixel definition layer 9 is recessed in the area corresponding to the partition groove 201. The pixel definition layer 9 is provided with a plurality of openings 901 that correspond to at least a portion of each intermediate portion 310, thereby defining the light emission range of the light-emitting device through the pixel definition layer 9, and the size of the pixel unit can be represented by the size of its corresponding opening 901.

[0130] Figure 6 This is a partial top view of a pixel definition layer according to an embodiment of the present disclosure. Figure 7 This is a partial top view of the pixel definition layer and the first electrode layer according to an embodiment of the present disclosure. Figure 6 and Figure 7 As shown, in some embodiments of this disclosure, the opening 901 of the pixel definition layer 9 can be hexagonal or other polygonal structures, and the first electrode 31' can also be a polygonal structure with the same shape as the opening 901. Of course, the first electrode 31' can also be other shapes. Figure 6 As shown, the size d4 of the opening 901 is approximately 4.6~5.2μm, which means the size of the pixel unit is approximately 4.6~5.2μm.

[0131] like Figure 4As shown, the light-emitting functional layer 32 can be a continuous film layer and at least partially covers the middle portion 310 of each first electrode 31', that is, covers the area exposed by the opening 901. At the same time, the light-emitting functional layer 32 also covers the pixel definition layer 9. When the light-emitting functional layer 32 is formed by vapor deposition or other processes, the light-emitting functional layer 32 is recessed towards the substrate 1 in the area corresponding to the partition groove 201.

[0132] In some embodiments of this disclosure, the light-emitting functional layer 32 includes a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer that are sequentially stacked along a direction away from the substrate 1.

[0133] like Figure 4 As shown, the second electrode layer 33 covers the light-emitting functional layer 32, and can apply a driving signal to the first electrode 31' and the second electrode 33, so that the portion of the light-emitting functional layer 32 located between the first electrode 31' and the second electrode layer 33 emits light.

[0134] The morphology of the second electrode layer 33 matches that of the light-emitting functional layer 32. It is recessed at the recessed portion of the light-emitting functional layer 32, forming a recessed portion 331, and a smooth portion 332 is formed in the region corresponding to the middle portion 310 of the first electrode 31. This ensures that the orthographic projection of the recessed portion 331 onto the planarization layer 20 does not overlap with the orthographic projection of the middle portion 310 of the first electrode 31' onto the planarization layer 20, reducing or preventing tip discharge between the first electrode 31' and the recessed portion 61 of the second electrode layer 33. The material of the second electrode layer 33 can be an alloy material, for example, Mg and Ag; or, an Al and Li alloy. Of course, other alloys or elemental metals can also be used for the second electrode layer 33, which will not be listed here.

[0135] It should be noted that in some embodiments, if the pixel definition layer 9 covers the edge of the middle portion 310 of the first electrode 31', the smooth portion 332 may protrude in the direction away from the substrate 1 in the area corresponding to the pixel definition layer 9 covering the middle portion 310, but the height of the protrusion is less than the thickness of the first middle portion 310, so that the smooth portion 332 remains approximately smooth.

[0136] Furthermore, such as Figure 4 As shown, in some embodiments of this disclosure, the lowest point of the recess 331 of the second electrode layer 32 on a cross section perpendicular to the substrate 1 is completely within the partition groove 201 in the orthogonal projection of the flat layer 20.

[0137] In some embodiments of this disclosure, the maximum depth of the partition groove 201 is 1000 angstroms to 3000 angstroms.

[0138] Furthermore, in some examples of this disclosure, such as Figure 4As shown, the display panel 10 may further include a light extraction layer 11, which covers the surface of the second electrode layer 33 facing away from the substrate 1 and is recessed in the region corresponding to the recessed portion 331. A first thin film encapsulation layer 41 is disposed on the side of the light extraction layer 11 facing away from the substrate 1. The refractive index of the light extraction layer 11 is greater than that of the second electrode layer 33, which can improve the light extraction efficiency, and the higher the refractive index, the higher the light extraction efficiency.

[0139] Some embodiments of this disclosure also provide a display device. Figure 8 This is a schematic diagram of a display device provided according to some embodiments of the present disclosure, such as... Figure 8 As shown, the display device 100 includes the display panel 10 in the aforementioned embodiments, such as an OLED display panel. The display device can be any product or component with display function, such as smart glasses, projector, television, monitor, digital photo frame, mobile phone, smartwatch, or tablet computer.

[0140] Some embodiments of this disclosure also provide a method for manufacturing a display panel. Figure 9 A flowchart illustrating a method for manufacturing a display device according to some embodiments of this disclosure. For example... Figure 9 As shown, the manufacturing method of the display panel includes the following steps:

[0141] S10: Forming a light-emitting device layer on the substrate;

[0142] S20: A first thin-film encapsulation layer is formed on the side of the light-emitting device layer away from the substrate;

[0143] S30: A color filter layer is formed on the side of the first thin-film encapsulation layer away from the substrate; and

[0144] S40: A second thin-film encapsulation layer is formed on the side of the color filter layer away from the substrate.

[0145] The manufacturing method further includes:

[0146] An adhesive film layer is formed on at least one side of the color filter layer and is in contact with and stacked with the color filter layer.

[0147] Specifically, before forming the color filter layer on the side of the first thin-film encapsulation layer away from the substrate, the manufacturing method further includes:

[0148] S25: A first adhesive film layer is formed on the side of the first thin film encapsulation layer away from the substrate;

[0149] Before forming a second thin-film encapsulation layer on the side of the color filter layer away from the substrate, the manufacturing method further includes:

[0150] S35: A second adhesive film layer is formed on the side of the color filter layer away from the substrate.

[0151] In steps S20, S25, S35, and S40, the first thin film encapsulation layer, the first adhesive film layer, the second adhesive film layer, and the second thin film encapsulation layer are all manufactured using an open mask process.

[0152] In the display device manufactured using the above method, an adhesive film layer (first adhesive film layer and / or second adhesive film layer) is added between the color filter layer and the thin film encapsulation layer (first thin film encapsulation layer and / or second thin film encapsulation layer). This increases the adhesion between the color filter layer and the thin film encapsulation layer, making the encapsulation performance of the thin film encapsulation layer stronger. Furthermore, the adhesive film layer is disposed adjacent to the color adhesive, allowing impurity particles on the upper and lower surfaces of the color adhesive introduced during the manufacturing process to enter the adhesive film layer and be completely encapsulated by it. On the one hand, these impurity particles cannot release water and oxygen, preventing the color filter from being corroded by internal water and oxygen. On the other hand, the adhesive film is disposed between the color filter and the thin film encapsulation layer and has a predetermined thickness, preventing the thin film encapsulation layer from being punctured by impurity particles, thereby protecting the color filter layer from external water and oxygen corrosion and ensuring the service life of the display panel.

[0153] The above description is merely a preferred embodiment of this disclosure and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this disclosure is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above-described features with (but not limited to) technical features disclosed in this disclosure that have similar functions.

Claims

1. A display panel, characterized in that, The display panel includes: Base; A light-emitting device layer is disposed on the substrate; A first thin-film encapsulation layer is disposed on the side of the light-emitting device layer away from the substrate, and the first thin-film encapsulation layer includes at least one organic layer; A color filter layer is disposed on the side of the first thin-film encapsulation layer away from the substrate; and A second thin-film encapsulation layer is disposed on the side of the color filter layer away from the substrate, and the second thin-film encapsulation layer includes at least one organic layer. The display panel further includes: An adhesive film layer is disposed on at least one side of the color filter layer. The adhesive film layer is in direct contact with the color filter layer and is stacked on top of it. The viscosity of the adhesive film layer material is greater than the viscosity of the organic layer material in each of the first thin film encapsulation layer and the second thin film encapsulation layer.

2. The display panel according to claim 1, wherein, The adhesive film layer is in direct contact with the organic layer of at least one of the first thin film encapsulation layer and the second thin film encapsulation layer.

3. The display panel according to claim 1 or 2, wherein, The adhesive film layer includes: A first adhesive film layer is disposed between the first thin film encapsulation layer and the color filter layer; and The second adhesive film layer is disposed between the color filter layer and the second thin film encapsulation layer.

4. The display panel according to claim 3, wherein, The orthographic projection of the color filter layer on the substrate falls within the orthographic projection of at least one of the first and second adhesive films on the substrate.

5. The display panel according to claim 3, wherein, The orthographic projection of the color filter layer on the substrate falls within the orthographic projection of the first thin-film encapsulation layer on the substrate; The orthographic projection of the first thin film encapsulation layer on the substrate falls within the orthographic projection of the first adhesive film layer on the substrate; The orthographic projection of the first adhesive film layer on the substrate falls within the orthographic projection of the second adhesive film layer on the substrate; as well as The orthographic projection of the second adhesive film layer on the substrate falls within the orthographic projection of the second thin film encapsulation layer on the substrate.

6. The display panel according to claim 5, wherein, The areas of the color filter layer, the first thin film encapsulation layer, the first adhesive film layer, the second adhesive film layer, and the second thin film encapsulation layer projected onto the substrate increase sequentially.

7. The display panel according to claim 5, wherein, The display panel includes a display area and a peripheral area surrounding the display area. The orthographic projection of the color filter layer on the substrate falls within the display area. The edges of the first thin film encapsulation layer, the first adhesive film layer, the second adhesive film layer, and the second thin film encapsulation layer are all located in the peripheral area.

8. The display panel according to claim 7, wherein, In the direction from the display area toward the surrounding area, the edges of the first thin film encapsulation layer, the first adhesive film layer, the second adhesive film layer, and the second thin film encapsulation layer are sequentially disposed away from the display area and are spaced apart in sequence.

9. The display panel according to claim 8, wherein, The distance between the edge of the first thin film encapsulation layer and the edge of the first adhesive film layer is greater than four times the size of the pixel unit of the panel; The distance between the edge of the first adhesive film layer and the edge of the second adhesive film layer is greater than four times the size of the pixel unit of the panel; as well as The distance between the edge of the second adhesive film layer and the edge of the second thin film encapsulation layer is greater than four times the pixel unit size of the panel.

10. The display panel according to claim 1 or 2, wherein, The film layer comprises an organic material, which includes at least one of 1-methoxy-2-propanol, propylene glycol monomethyl ether ester, multifunctional acrylic monomer, oxime derivative, and acrylic resin derivative.

11. The display panel according to claim 3, wherein the thickness of the first adhesive film layer is less than the thickness of the second adhesive film layer.

12. The display panel of claim 11, wherein the thickness of the second adhesive film layer is approximately three times the thickness of the first adhesive film layer.

13. The display panel according to claim 3, wherein, The first thin film encapsulation layer includes a first sublayer, a second sublayer, and a third sublayer stacked sequentially away from the substrate. The materials of the first sublayer, the second sublayer, and the third sublayer include silicon nitride, aluminum oxide, and parylene, respectively. The first film layer is in direct contact with the third sublayer.

14. The display panel according to claim 13, wherein, The thickness of the first adhesive film layer is greater than half the thickness of the third sub-layer.

15. The display panel according to claim 3, wherein, The second thin-film encapsulation layer includes a fourth sub-layer and a fifth sub-layer stacked sequentially away from the substrate. The materials of the fourth sub-layer and the fifth sub-layer include parylene and silicon oxide, respectively. The second film layer is in direct contact with the fourth sub-layer.

16. The display panel according to claim 1 or 2, wherein, The light-emitting device layer includes multiple light-emitting devices arranged in an array. Each light-emitting device includes a first electrode, a light-emitting functional part, and a second electrode arranged sequentially away from the substrate. For any two adjacent light-emitting devices, the first electrodes of the two adjacent light-emitting devices are spaced apart from each other, the light-emitting functional parts of the two adjacent light-emitting devices are an integral structure, and the second electrodes of the two adjacent light-emitting devices are an integral structure. The color filter layer includes multiple color filters, each corresponding to one of the multiple light-emitting devices. For each light-emitting device, the orthographic projection of the first electrode of the light-emitting device on the substrate falls within the orthographic projection of the corresponding color filter on the substrate.

17. The display panel according to claim 16, wherein, The plurality of light-emitting devices include a first light-emitting device and a second light-emitting device that are sequentially adjacent to each other, with a gap between the first electrode of the first light-emitting device and the first electrode of the second light-emitting device. The color filter layer includes a first color filter and a second color filter with different colors. The first color filter and the second color filter correspond to the first light-emitting device and the second light-emitting device, respectively. The first color filter and the second color filter have an overlapping portion. The orthographic projection of the gap onto the substrate falls within the orthographic projection of the overlapping portion onto the substrate.

18. The display panel according to claim 17, wherein, The gap is filled by an integral structure consisting of the light-emitting functional layer of the first light-emitting device and the light-emitting functional part of the second light-emitting device.

19. The display panel according to claim 1 or 2, wherein the substrate is a silicon substrate and the display panel is a silicon-based display panel.

20. A display device comprising a display panel as described in any one of claims 1-19.

21. A method for manufacturing a display panel, characterized in that, The manufacturing method includes: A light-emitting device layer is formed on the substrate; A first thin-film encapsulation layer is formed on the side of the light-emitting device layer away from the substrate, and the first thin-film encapsulation layer includes at least one organic layer; A color filter layer is formed on the side of the first thin-film encapsulation layer away from the substrate; and A second thin-film encapsulation layer is formed on the side of the color filter layer away from the substrate, the second thin-film encapsulation layer comprising at least one organic layer. The manufacturing method further includes: An adhesive film layer is formed on at least one side of the color filter layer and is stacked in contact with the color filter layer. The viscosity of the adhesive film layer material is greater than the viscosity of the organic layer material in each of the first thin film encapsulation layer and the second thin film encapsulation layer.

22. The method according to claim 21, wherein, Before forming a color filter layer on the side of the first thin film encapsulation layer away from the substrate, the manufacturing method further includes: forming a first adhesive film layer on the side of the first thin film encapsulation layer away from the substrate; Before forming a second thin-film encapsulation layer on the side of the color filter layer away from the substrate, the manufacturing method further includes forming a second adhesive film layer on the side of the color filter layer away from the substrate.

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