Chuck table assembly

Abstract

The present invention provides a chuck table assembly that can easily mount a chuck table, even if the chuck table is heavy, to a table base. The chuck table assembly includes a chuck table having a holding surface that holds a workpiece and a lower surface on the opposite side of the holding surface, and a table base that supports the lower surface of the chuck table in a detachable manner. The table base includes a support surface that supports the lower surface of the chuck table, a central suction hole formed in the central portion of the support surface, and a lower surface holding suction hole formed in the support surface that holds the lower surface of the chuck table by suction. The support surface of the table base has a first magnet embedded in a first region and a second magnet embedded in a second region that is distanced from the first region. The lower surface of the chuck table includes a third magnet embedded in a third region that corresponds to the first region and that is mutually attracted to the first magnet, and a fourth magnet that is mutually attracted to the second magnet embedded in the second region.

Description

Technical Field

[0001] The present invention relates to a chuck table assembly comprising: a chuck table for holding a workpiece; and a table base for detachably supporting the lower surface of the chuck table. Background Technology

[0002] The wafer is divided by multiple intersecting predetermined dividing lines to form multiple devices such as ICs and LSIs on the front side. After the back side of the wafer is ground to the desired thickness by a grinding device, it is divided into individual device chips by processing devices such as laser processing devices and cutting devices. The divided device chips are used in electronic devices such as mobile phones and personal computers.

[0003] The processing apparatus has a chuck stage for attracting and holding wafers, and processes the wafers held by the chuck stage into the desired shape through various processing units such as grinding unit, laser irradiation unit, and cutting unit.

[0004] In addition, there are various diameters of wafers, such as 5 inches, 6 inches, and 8 inches. A chuck stage corresponding to the size of the wafer is prepared, and the chuck stage is changed appropriately according to the size of the wafer (for example, see Patent Document 1).

[0005] Patent Document 1: Japanese Patent No. 3424052

[0006] However, the following problems exist: the chuck table is a heavy object (10kg~30kg). It takes time for the operator to hold the chuck table and place it on the worktable base to make the worktable base and the chuck table accurately match the desired positional relationship, making it difficult to install the chuck table on the worktable base. Summary of the Invention

[0007] Therefore, the object of the present invention is to provide a chuck table assembly that allows the chuck table to be easily installed on the table base even if the chuck table is heavy.

[0008] According to the present invention, a chuck table assembly is provided, wherein the chuck table assembly comprises: a chuck table having a holding surface for holding a workpiece and a lower surface opposite to the holding surface; and a table base supporting the lower surface of the chuck table in a detachable manner, the table base comprising: a support surface supporting the lower surface of the chuck table; a central suction hole formed in the center of the support surface; and a lower surface holding suction hole formed in the support surface for attracting and holding the lower surface of the chuck table, the support surface of the table base having a first magnet embedded in a first region. The lower surface of the chuck table includes a second magnet embedded in a second region away from the first region, and a third magnet embedded in a third region corresponding to the first region, attracting the first magnet; and a fourth magnet embedded in a fourth region corresponding to the second region, attracting the second magnet. The chuck table assembly also includes a compressed air supply unit that supplies compressed air to the lower surface holding suction holes when the chuck table is installed on the support surface of the table base, thereby forming an air layer between the lower surface of the chuck table and the support surface of the table base.

[0009] According to the chuck table assembly of the present invention, even if the chuck table is a relatively heavy object, the movement of the chuck table is facilitated by the air layer formed between the lower surface of the chuck table and the support surface of the table base, and the chuck table is properly positioned on the table base by magnets, thereby eliminating the problem of difficulty in installing the chuck table on the table base. Attached Figure Description

[0010] Figure 1 It is a perspective view of the cutting device with the chuck table assembly installed.

[0011] Figure 2 It is installed at Figure 1 An exploded perspective view of the chuck table assembly of the cutting device.

[0012] Figure 3 (a) is Figure 2 The top view of the workbench base shown. Figure 3 (b) is Figure 3 AA section view of (a).

[0013] Figure 4 (a) is a perspective view of the top of the chuck worktable for a 5-inch chuck. Figure 4 (b) is Figure 4 (a) BB section view, Figure 4 (c) is a top view of the chuck table. Figure 4(d) is a three-dimensional view of the lower part of the chuck's worktable.

[0014] Figure 5 (a) is a perspective view of the top of the chuck table for a 6-inch chuck. Figure 5 (b) is Figure 5 CC section view of (a), Figure 5 (c) is a top view of the chuck table. Figure 5 (d) is a three-dimensional view of the lower part of the chuck's worktable.

[0015] Figure 6 This is a perspective view showing an embodiment in which the operator mounts the chuck worktable onto the worktable base.

[0016] Figure 7 (a)~ Figure 7 (c) is shown based on the passage. Figure 5 A partially enlarged sectional view of the chuck table and table base of the embodiment shown.

[0017] Figure 8 (a) and (b) are lower perspective views illustrating other embodiments of the chuck worktable.

[0018] Label Explanation

[0019] 1: Cutting device; 2: Device housing; 3: Chuck table assembly; 20, 20A, 20B: Chuck table; 30: Chuck table; 20b, 30b: Lower surface; 22, 32: Frame; 222, 322: Connecting hole; 24, 34: Adsorption chuck; 24a, 34a: Holding surface; 4: Cutting unit; 41: Cutting tool; 5: Box; 6: Temporary stage; 7: Transfer unit; 8: Conveying unit; 9: Cleaning unit; 11: Cleaning and conveying unit; 12: Imaging unit; 42: Third magnet; 42a: Upper surface; 42b: Lower surface; 44: Fourth magnet; 44a: Upper surface; 44b: Lower surface; 110: Table base; 120: Table base; 122 123: Support surface; 125: Central attraction hole; 126: First magnet; 127: Second magnet; 128: Upper surface; 129: Lower surface; 120: Lower surface retaining attraction hole; 121: Clamping mechanism; 132: Guide rail; 133a, 134b: Positioning grooves; 135: Clamping part; 146: Locking part; 147: Clamping claw; 148: Compressed air supply unit; 149: Compressed air supply path; 140: On / off valve; 141: Connecting path; 141: Connecting path; 150: Attraction unit; 152: Attraction path; 154: On / off valve; C1: First region; C2: Second region; C3: Third region; C4: Fourth region. Detailed Implementation

[0020] Hereinafter, the chuck worktable assembly according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0021] exist Figure 1 The image shows a cutting device 1 using the chuck stage assembly 3 of this embodiment. The cutting device 1 of this embodiment has a generally cuboid-shaped device housing 2, and is configured to include: a chuck stage assembly 3, which is provided as a holding unit for holding a wafer 10, which is the workpiece; and a cutting unit 4, which has a cutting tool 41 for cutting the wafer 10 held by the chuck stage assembly 3. Furthermore, as... Figure 1 As shown, the wafer 10 processed in this embodiment is, for example, a semiconductor wafer in the shape of a roughly circular plate with a diameter of 5 inches. The wafer 10 is divided by multiple intersecting predetermined dividing lines and has multiple devices formed on its front side, and is supported by an annular frame F by means of adhesive tape T.

[0022] Additionally, the cutting device 1 includes: a cassette 5 (shown by double dashed lines) for storing multiple wafers 10; a temporary stage 6 for temporarily placing the wafers 10 stored in the cassette 5 on the temporary stage 6; a transfer unit 7 for transferring the wafers 10 to the temporary stage 6; a conveying unit 8 for rotating the wafers 10 transferred to the temporary stage 6 and conveying them to the chuck table assembly 3; a cleaning unit 9 (details omitted) for cleaning the wafers 10 after they have been cut by the cutting unit 4; a cleaning and conveying unit 11 for conveying the cut wafers 10 from the chuck table assembly 3 to the cleaning unit 9; an imaging unit 12 for imaging the wafers 10 on the chuck table assembly 3; and a control unit (not shown). The cassette 5 is placed on a cassette stage 5a that is configured to move up and down via a lifting unit (not shown), and the height of the cassette 5 is appropriately adjusted when the wafers 10 are removed from the cassette 5 by the transfer unit 7.

[0023] An X-axis feed unit (not shown) is provided inside the housing 2 of the device. It is a unit that feeds the chuck table assembly 3 and the cutting unit 4 relative to each other, so that the chuck table assembly 3 moves in the X-axis direction indicated by the arrow X, which is the cutting feed direction.

[0024] exist Figure 2 The figure shows a chuck stage assembly 3 mounted on the cutting device 1, and a perspective view showing the chuck stage 20, which is used to hold and hold the wafer 10, being removed upwards from the chuck stage assembly 3. As shown, the chuck stage assembly 3 includes, for example, a chuck stage 20, which has a structure configured to hold the wafer 10... Figure 1The 5-inch diameter wafer 10 shown is held by a retaining surface 24a and a lower surface 20b opposite to the retaining surface 24a; and a stage base 120 that detachably supports the lower surface 20b of the chuck stage 20. The chuck stage 20 is configured to rotate together with the stage base 120 via a rotary drive mechanism (not shown). As described later, the chuck stage assembly 3 allows for changing the chuck stage according to the size of the wafer being processed.

[0025] like Figure 2 As shown, the worktable base 120 has: a support surface 122 that supports the lower surface 20b of the chuck worktable 20; a central suction hole 123 formed in the center of the support surface 122; and lower surface retaining suction holes 127, 127 formed in the support surface 122 to attract and retain the lower surface 20b of the chuck worktable 20. Furthermore, the support surface 122 of the worktable base 120 has: a first magnet 125 embedded in a first region C1 on the support surface 122; and a second magnet 126 embedded in a second region C2 away from the first region C1.

[0026] exist Figure 3 (a) shows a top view of the workbench base 120. Figure 3 (b) shows Figure 3 (a) is a cross-sectional view AA. From these figures, it can be understood that the first magnet 125 is formed in a ring shape and is embedded in the support surface 122 in a manner surrounding the central attraction hole 123. In this embodiment, the center of the first magnet 125 is aligned with the center of the central attraction hole 123. The first magnet 125 is arranged such that the upper surface 125a exposed on the support surface 122 is the N pole and the lower surface 125b embedded is the S pole, and the second magnet 126 is arranged such that the upper surface 126a exposed on the support surface 122 is the S pole and the lower surface 126b embedded is the N pole. Figure 3 As shown in (b), the distance between the center position of the first magnet 125 and the center position of the second magnet 126 is set to W0.

[0027] return Figure 2Continuing the description, a compressed air supply unit 140 and a suction unit 150 are connected to the suction holes 127, 127 on the lower surface of the worktable base 120 constituting the chuck worktable assembly 3 of this embodiment. The compressed air supply unit 140 supplies compressed air H to the suction holes 127, 127 on the lower surface of the worktable base 120 via a compressed air supply path 142, an on / off valve 144 disposed on the compressed air supply path 142, and a connecting path 146. Furthermore, the suction unit 150 is connected to the connecting path 146, which is also used in the supply of compressed air H, via a suction path 152 and an on / off valve 154 disposed on the suction path 152, causing the suction unit 150 to operate and generate a suction negative pressure V in the suction holes 127, 127 on the lower surface of the worktable base 120. In addition, the central suction hole 123 of the workbench base 120 is also connected to a compressed air supply path and a suction path (not shown) via a connecting path 147, configured to provide compressed air H or generate suction negative pressure V at any time while keeping the suction holes 127, 127 separate from the lower surface.

[0028] The chuck table assembly 3 of this embodiment is configured to be used by replacing multiple chuck tables with different outer diameters, and can not only install... Figure 2 The chuck stage 20 shown is used to hold 5-inch diameter wafers and is capable of mounting... Figure 5 (a)~ Figure 5 The chuck stage 30 shown in (d) holds a 6-inch diameter wafer, and the chuck stage for holding an 8-inch diameter wafer (omitted from the illustration).

[0029] Reference Figure 4 (a)~ Figure 4 (d) Figure 4 (a) shows a perspective view of the chuck table 20 from above. Figure 4 (b) shows the chuck table 20. Figure 4 (a) BB section view, Figure 4 (c) shows a top view of the chuck table 20. Figure 4 (d) shows a perspective view of the chuck table 20 from below. Figure 4 (a)~ Figure 4As can be understood in (d), the chuck stage 20 includes at least: a disc-shaped adsorption chuck 24 having a holding surface 24a for attracting and holding wafers with a diameter of 5 inches; and a frame 22 supporting the outer periphery of the adsorption chuck 24, with the adsorption chuck 24 and the frame 22 forming an internal space 221. A connecting hole 222 is formed on the lower surface 20b of the chuck stage 20, which communicates with the internal space 221 and is formed at a position corresponding to the central attraction hole 123 formed on the stage base 120. In addition, the frame 22 is made of a metal such as stainless steel, and the adsorption chuck 24 is made of a porous ceramic such as alumina (Al2O3).

[0030] like Figure 4 As shown in (d), on the lower surface 20b of the chuck table 20, when the chuck table 20 is positioned at a predetermined position on the table base 120, a third magnet 42, which attracts the first magnet 125, is disposed in the third region C3 corresponding to the first region C1 of the table base 120. A fourth magnet 44, which attracts the second magnet 126, is disposed in the fourth region C4 corresponding to the second region C2 of the table base 120. The third magnet 42 is arranged such that its upper surface 42a is the N pole and its lower surface 42b is the S pole, and the fourth magnet 44 is arranged such that its upper surface 44a is the S pole and its lower surface 44b is the N pole. The distance W1 between the center of the third magnet 42 and the center of the fourth magnet 44 of the chuck table 20 is the same as the distance W0 between the center of the first magnet 125 and the center of the second magnet 126. Thus, when the chuck table 20 is positioned at a predetermined position on the table base 120, the N pole of the upper surface 125a of the first magnet 125 attracts the S pole of the lower surface 42b of the third magnet 42, and the S pole of the upper surface 126a of the second magnet 126 attracts the N pole of the lower surface 44b of the fourth magnet 44.

[0031] Reference Figure 5 (a)~ Figure 5 (d) Figure 5 (a) shows a perspective view of the chuck table 30 from above. Figure 5 (b) shows the chuck table 30. Figure 5 CC section view of (a), Figure 5 (c) shows a top view of the chuck table 30. Figure 5 (d) shows a perspective view of the chuck table 30 from below. Figure 5 (a)~ Figure 5The chuck stage 30 shown in (d) has a structure substantially the same as the chuck stage 20 described above, except that the diameter of the wafer it holds is 6 inches. That is, the chuck stage 30 includes at least a disc-shaped adsorption chuck 34 with a holding surface 34a for attracting and holding wafers with a diameter of 6 inches, and a frame 32 supporting the adsorption chuck 34 on its outer periphery. The adsorption chuck 34 and the frame 32 form an internal space 321. A connecting hole 322 is formed on the lower surface 30b of the chuck stage 30, which communicates with the internal space 321 and is formed at a position corresponding to the central attraction hole 123 formed on the stage base 120. The frame 32 is formed of a metal such as SUS, and the adsorption chuck 34 is formed, for example, of a porous ceramic such as alumina (Al2O3).

[0032] like Figure 5 As shown in (d), on the lower surface 30b of the chuck table 30, when the chuck table 30 is positioned at a predetermined position on the table base 120, a third magnet 42, which attracts the first magnet 125, is disposed in the third region C3 corresponding to the first region C1 of the table base 120. A fourth magnet 44, which attracts the second magnet 126, is disposed in the fourth region C4 corresponding to the second region C2 of the table base 120. More specifically, the third magnet 42 is arranged such that its upper surface 42a is the N pole and its lower surface 42b is the S pole, and the fourth magnet 44 is arranged such that its upper surface 44a is the S pole and its lower surface 44b is the N pole. The distance W2 between the center of the third magnet 42 and the center of the fourth magnet 44 of the chuck table 30 is the same as the distances W0 and W1 mentioned above. Thus, when the chuck table 30 is positioned at a predetermined position on the table base 120, the N pole of the upper surface 125a of the first magnet 125 attracts the S pole of the lower surface 42b of the third magnet 42, and the S pole of the upper surface 126a of the second magnet 126 attracts the N pole of the lower surface 44b of the fourth magnet 44.

[0033] return Figure 2 Continuing the description, the chuck table assembly 3 of this embodiment has a table base 110 on which a table base 120 is disposed, and four clamping mechanisms 130 disposed between the table base 110 and the table base 120. The table base 110 is formed in a cylindrical shape and is configured to be driven to rotate at a desired angle by a servo motor (not shown).

[0034] Four clamping mechanisms 130 are evenly arranged at 90° angles along the circumference between the worktable base 110 and the worktable base 120. Each clamping mechanism 130 includes: a pair of guide rails 131 protruding outward; a clamping part 132 mounted in a manner that allows it to move radially along the guide rails 131; and a locking part 133 for fixing the clamping part 132 to the guide rails 131.

[0035] The clamping part 132 has a clamping claw 134 that is driven to rotate in the direction indicated by arrow R1 by providing air to the clamping part 132. The clamping claw 134 presses the frame F that holds the wafer 10 placed on the chuck stage 20 and fixes the frame F to the clamping part 132.

[0036] Multiple positioning grooves are formed on the guide rail 131. These positioning grooves are used to fix the clamping part 132, which moves in the direction indicated by arrow R2 according to the size of the annular frame that holds the wafer placed on the chuck stage assembly 3. Figure 2 The positioning groove 131a shown is used to fix the clamping part 132 when holding the frame that holds an 8-inch wafer, and the positioning groove 131b is used to fix the clamping part 132 when holding the frame that holds a 6-inch wafer. Figure 2 The clamping part 132 shown secures the front end of the locking part 133 (not shown) by locking it in a 5-inch positioning groove (not shown).

[0037] The cutting device 1, which is assembled with the chuck table assembly 3 of this embodiment, has a structure roughly as described above, as shown in the reference. Figure 2 , Figure 6 as well as Figure 7 (a)~ Figure 7 (c) The function and role of the chuck stage assembly 3 of this embodiment will be explained. In addition, in the following embodiments, an embodiment in which the chuck stage 20 holding a 5-inch diameter wafer 10 is mounted on the stage base 120 will be described.

[0038] When placing the chuck table 20 on the table base 120, first make... Figure 2 The compressed air supply unit 140 shown operates, opening the on / off valve 144, and compressed air H is ejected from the suction holes 127, 127 on the lower surface of the worktable base 120 via the compressed air supply passage 142, the on / off valve 144, and the connecting passage 146. Then, as... Figure 6As shown, the operator holds the chuck table 20 with both hands and places it from above onto the support surface 122 of the table base 120 of the chuck table assembly 3 installed in the cutting device 1. Here, when the operator places the chuck table 20 on the table base 120, in the initial state, as... Figure 7 As shown in (a), the positions of the first magnet 125 embedded in the first region C1 of the support surface 122 of the worktable base 120 and the third magnet 42 embedded in the third region C3 of the lower surface 20b of the chuck worktable 20 are inconsistent, and the positions of the second magnet 126 embedded in the second region C2 of the support surface 122 and the fourth magnet 44 (shown by dashed lines) embedded in the fourth region C4 of the lower surface 20b of the chuck worktable 20 are inconsistent. Therefore, the worktable base 120 and the chuck worktable 20 are not in the prescribed positional relationship. At this time, between the lower surface 20b of the chuck worktable 20 and the support surface 122 of the worktable base 120, compressed air H is supplied from the suction holes 127, 127 on the lower surface of the worktable base 120 to form an air layer P, thereby causing the chuck worktable 20 to float on the worktable base 120. As a result, the operator can easily make the chuck worktable 20, which is a heavy object, float horizontally. Figure 6 Moving in the plane defined by the X and Y directions, such as... Figure 7 As shown in (b), the third magnet 42 disposed in the third region C3 of the chuck table 20 can be easily positioned relative to the first magnet 125 embedded in the support surface 122 of the table base 120. When the third magnet 42 of the chuck table 20 is positioned relative to the first magnet 125 of the table base 120, the magnets of the two magnets attract each other, and the center position of the table base 120 coincides with the center position of the chuck table 20, and this position is fixed.

[0039] The first magnet 125 of the worktable base 120 and the third magnet 42 of the chuck worktable 20 attract each other, thereby fixing the center position of the worktable base 120 and the chuck worktable 20, and making the chuck worktable 20 capable of... Figure 6 The movement is indicated by arrow R3 in the direction of rotation. Here, the operator rotates the chuck table 20 in the direction indicated by arrow R3, thereby... Figure 7 As shown in (c), the fourth magnet 44 embedded in the fourth region C4 of the chuck table 20 is positioned relative to the second magnet 126 embedded in the second region C2 of the support surface 122 of the worktable base 120. Thus, the second magnet 126 of the worktable base 120 and the fourth magnet 44 of the chuck table 20 attract each other, and when viewed from above, the position of the chuck table 20 relative to the worktable base 120 is positioned at a predetermined location.

[0040] As described above, if the position of the chuck table 20 is accurately positioned relative to the table base 120, the on / off valve 144 supplying the compressed air H will be closed, and the operation of the compressed air supply unit 140 will be stopped, thus ceasing the supply of compressed air H. Consequently, the chuck table 20 descends, the first magnet 125 and the third magnet 42 come into close contact, and the second magnet 126 and the fourth magnet 44 come into close contact, thus fixing the chuck table 20 relative to the table base 120 in a predetermined positional relationship and completing the installation.

[0041] Once the chuck stage 20 is installed on the stage base 120, the wafer 10 is cut in the cutting device 1. During the cutting process, the suction unit 150 is activated, and the on / off valve 154 is opened, generating a suction negative pressure V on the lower surface holding suction holes 127, 127, attracting the chuck stage 20 onto the stage base 120. Next, the wafer 10, as the workpiece, is placed on the holding surface 24a of the chuck stage 20, and the clamping mechanism 130 is activated to hold the frame F supporting the wafer 10, and then... Figure 2 The connecting path 147, as shown, generates a suction negative pressure V in the central suction hole 123, holding the wafer 10 on the chuck stage 20. While the wafer 10 is held on the chuck stage 20, the X-axis feed unit (not shown) is activated to position the chuck stage assembly 3 directly below the imaging unit 12 for imaging, performing an alignment process. Next, based on the position information of the wafer 10's processing position detected through this alignment process, the chuck stage assembly 3 is positioned directly below the cutting unit 4. The cutting tool 41 of the cutting unit 4 cuts along the predetermined dividing lines of the wafer 10, dividing the wafer 10 into individual device chips (details omitted).

[0042] As described above, if the wafer 10 is divided into individual device chips, the clamping mechanism 130 releases its grip on the frame F, and compressed air H is supplied to the central suction hole 123 of the stage base 120 to remove the wafer 10 from the chuck stage 20. Furthermore, in the above embodiment, an example is shown of a chuck stage 20 for holding a 5-inch diameter wafer 10 mounted on the stage base 120 for the chuck stage assembly 3. However, when mounting a chuck stage 30 for holding a 6-inch diameter wafer, the same installation sequence can be followed, and details are omitted.

[0043] According to the above embodiment, even if the chuck table 20 installed on the worktable base 120 is a relatively heavy object, by providing compressed air H between the lower surface 20b of the chuck table 20 and the support surface 122 of the worktable base 120 to form an air layer P, it is possible to facilitate the horizontal movement of the chuck table 20, and the chuck table 20 can be moved horizontally on the worktable base 120 and positioned in an appropriate position, thus eliminating the problem of difficulty in installing the chuck table 20 on the worktable base 120.

[0044] Furthermore, in the above embodiment, the first magnet 125 and the second magnet 126 embedded in the support surface 122 of the worktable base 120 are set in such a way that the magnetic poles exposed on the support surface 122 side are different. Therefore, it can prevent the fourth magnet 44 of the chuck worktable 20 from being mistakenly attracted to the first magnet 125 of the worktable base 120 or the third magnet 42 from being mistakenly attracted to the second magnet 126.

[0045] Furthermore, the present invention is not limited to the embodiments described above. For example, in the above embodiments, the fourth magnet 44 embedded in the fourth region C4 of the lower surface 20b of the chuck worktable 20 is shaped such that its cross-section is circular, but it could be anything else. Figure 8 The chuck table 20A shown in (a) uses a rectangular cross-section magnet 46 extending radially as the fourth magnet, and the lower surface 46b of the magnet 46 is the N pole. Furthermore, when the fourth magnet is the aforementioned magnet 46, the second magnet 126 on the table base 120 side is also configured as a rectangular cross-section magnet extending radially, corresponding to the magnet 46. This allows the chuck table 20A to... Figure 6 When rotated in the direction indicated by the middle arrow R3, the position of the chuck table 20A relative to the table base 120 can be more accurately positioned at the specified location.

[0046] Furthermore, in the above embodiment, the third magnet 42 is disposed at the center of the lower surface 20b of the chuck worktable 20, corresponding to the position of the first magnet 125, which is formed in a ring shape around the central attraction hole 123, located at the center of the support surface 122 of the worktable base 120. However, the present invention is not limited to this; for example, it can be... Figure 8The structure is as shown in (b) of the chuck worktable 20B. That is, in the chuck worktable 20B, a magnet 47, which serves as a third magnet, is arranged in a designated third region on the lower surface 20Bb, and a magnet 48, which serves as a fourth magnet, is arranged in a designated fourth region away from the magnet 47. In this embodiment, the lower surface 47b of the magnet 47 is also arranged as the S pole and the lower surface 48b of the magnet 48 is the N pole. Although the figure is omitted, on the support surface 122 of the worktable base 120, a first magnet with a shape corresponding to the magnet 47 is embedded in a first region corresponding to the magnet 47, and a second magnet with a shape corresponding to the magnet 48 is embedded in a second region away from the first region corresponding to the magnet 48.

[0047] Furthermore, in the above embodiment, the magnet embedded in the workbench base 120 is described under the premise that it is a permanent magnet, but the present invention is not limited thereto, and it may also be an electromagnet.

[0048] Furthermore, in the above embodiment, an example of applying the chuck table assembly 3 of this embodiment to the cutting device 1 is shown, but the present invention is not limited to this, and can also be applied to laser processing devices and grinding devices, for example. In addition, the description is based on the type of chuck table supported by the table base 120 being 5 inches, 6 inches, or 8 inches, but it is also possible to support other sizes, and is not limited to the above embodiment.

Claims

1. A chuck table assembly, wherein, The chuck table assembly has the following features: A chuck table having a holding surface for holding a workpiece and a lower surface opposite to the holding surface; and The worktable base supports the lower surface of the chuck worktable in a detachable manner. The workbench base includes: The support surface supports the lower surface of the chuck table; A central suction hole is formed in the center of the support surface; and The lower surface retains a suction hole, which is formed in the support surface, to attract and retain the lower surface of the chuck table. The support surface of the workbench base has a first magnet embedded in a first region and a second magnet embedded in a second region away from the first region. The lower surface of the chuck table includes: A third magnet, embedded in a third region corresponding to the first region, attracts the first magnet; and A fourth magnet, embedded in a region corresponding to the second region, attracts the second magnet. The chuck table assembly also includes a compressed air supply unit. When the chuck table is mounted on the support surface of the table base, the compressed air supply unit supplies compressed air to the suction holes on the lower surface, thereby forming an air layer between the lower surface of the chuck table and the support surface of the table base. The first region is the area in the worktable base where the first magnet is embedded in a ring shape around the central attraction hole, and the third magnet is disposed in the center of the lower surface of the chuck worktable, corresponding to the position of the first magnet in the ring shape around the central attraction hole.

2. The chuck table assembly according to claim 1, wherein, The magnetic poles of the first magnet embedded in the support surface of the workbench base that are exposed on the support surface are different from those of the second magnet that are exposed on the support surface.

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