Control method and device of electronic expansion valve, electronic equipment and storage medium

Abstract

The embodiment of the application provides a kind of electronic expansion valve control method, device, electronic equipment and storage medium, by based on preset period, according to ambient temperature, suction temperature, exhaust temperature, evaporation temperature, condensation temperature and liquid pipe temperature, determine the first superheat deviation value, the first superheat change value and the current supercooling degree of main road electronic expansion valve, according to ambient temperature, auxiliary road entrance temperature and auxiliary road exit temperature, determine the second superheat deviation value, the second superheat change value of auxiliary road electronic expansion valve, according to the first superheat deviation value, the first superheat change value and the current supercooling degree, the opening of main road electronic expansion valve is adjusted, according to the second superheat deviation value and the second superheat change value, the opening of auxiliary road electronic expansion valve is adjusted, increase the stability of system under low ambient temperature high heating demand scene, improve the heating effect of system.

Description

Technical Field

[0001] This application relates to the field of heat pump system technology, and in particular to a control method, device, electronic device and storage medium for an electronic expansion valve. Background Technology

[0002] Heat pump systems are units primarily designed for heating. However, when operating in environments with low ambient temperatures and high heating demands, the heating capacity decreases due to the larger suction volume of the compressor and lower suction flow rate at lower ambient temperatures, failing to meet the higher indoor heating load requirements. To address this issue, a quasi-two-stage compression heat pump system with an economizer, namely the vapor injection enthalpy-increasing heat pump system, has emerged on the market.

[0003] Current technology determines the actual superheat of the electronic expansion valve based on the difference between the compressor inlet temperature and the evaporator outlet temperature. By comparing the actual superheat with the target superheat, the opening adjustment value of the electronic expansion valve is determined, thereby controlling the electronic expansion valve to adjust to the corresponding opening.

[0004] However, existing technologies essentially regulate electronic expansion valves based on the superheat deviation between the actual superheat and the target superheat, which can easily lead to large fluctuations in the regulation amount, affecting the stability of the system and resulting in the system still having poor heating performance. Summary of the Invention

[0005] This application provides a control method, device, electronic equipment, and storage medium for an electronic expansion valve, which increases the stability of the system in scenarios with low ambient temperature and high heating demand, and improves the heating effect of the system.

[0006] In a first aspect, embodiments of this application provide a control method for an electronic expansion valve. The electronic expansion valve includes a main electronic expansion valve and an auxiliary electronic expansion valve, which are installed in a heat pump system. The heat pump system also includes a compressor, a condenser, an economizer, and an evaporator. The outlet of the compressor is connected to the inlet of the condenser, the outlet of the condenser is connected to the first inlet of the economizer, the first outlet of the economizer is connected to the inlet of the evaporator, and the outlet of the evaporator is connected to the first inlet of the compressor. The main electronic expansion valve is installed on a main pipeline between the inlet of the evaporator and the first outlet of the economizer. The second inlet of the economizer is connected to a target node on the main pipeline via an auxiliary pipeline. The target node is located between the main electronic expansion valve and the economizer. The second outlet of the economizer is connected to the second inlet of the compressor. The auxiliary electronic expansion valve is installed on an auxiliary pipeline. The method includes:

[0007] Based on a preset cycle, the ambient temperature, the suction and discharge temperatures of the compressor, the evaporation temperature of the evaporator, the condensation temperature of the condenser, the liquid pipe temperature at the target location on the main pipeline, and the auxiliary inlet and outlet temperatures of the economizer are acquired. The target location is located between the main electronic expansion valve and the target node.

[0008] Based on the ambient temperature, the intake temperature, the exhaust temperature, the evaporation temperature, the condensation temperature, and the liquid pipe temperature, determine the first superheat deviation value, the first superheat change value, and the current subcooling value of the main circuit electronic expansion valve;

[0009] Based on the ambient temperature, the auxiliary road inlet temperature, and the auxiliary road outlet temperature, determine the second superheat deviation value and the second superheat change value of the auxiliary road electronic expansion valve;

[0010] The opening of the main circuit electronic expansion valve is adjusted based on the first superheat deviation value, the first superheat change value, and the current subcooling.

[0011] The opening degree of the auxiliary electronic expansion valve is adjusted according to the second superheat deviation value and the second superheat change value.

[0012] Secondly, embodiments of this application provide a control device for an electronic expansion valve. The electronic expansion valve includes a main electronic expansion valve and an auxiliary electronic expansion valve, which are respectively installed on the main pipeline and the auxiliary pipeline of a heat pump system. The heat pump system also includes a compressor, a condenser, an economizer, and an evaporator. The main pipeline is installed between the evaporator and the economizer, and the auxiliary pipeline is installed between the economizer and a target node on the main pipeline. The main electronic expansion valve is installed between the evaporator and the target node. The device includes:

[0013] The acquisition module is used to acquire, based on a preset period, the ambient temperature, the suction temperature and discharge temperature of the compressor, the evaporation temperature of the evaporator, the condensation temperature of the condenser, the liquid pipe temperature at a target location on the main pipeline, and the auxiliary pipeline inlet temperature and auxiliary pipeline outlet temperature of the economizer, wherein the target location is located between the main pipeline electronic expansion valve and the target node;

[0014] The processing module is used to determine the first superheat deviation value, the first superheat change value, and the current subcooling value of the main circuit electronic expansion valve based on the ambient temperature, the intake temperature, the exhaust temperature, the evaporation temperature, the condensation temperature, and the liquid pipe temperature; and to determine the second superheat deviation value and the second superheat change value of the auxiliary circuit electronic expansion valve based on the ambient temperature, the auxiliary circuit inlet temperature, and the auxiliary circuit outlet temperature.

[0015] The control module is used to adjust the opening of the main circuit electronic expansion valve according to the first superheat deviation value, the first superheat change value and the current subcooling value; and to adjust the opening of the auxiliary circuit electronic expansion valve according to the second superheat deviation value and the second superheat change value.

[0016] Thirdly, embodiments of this application provide an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the control method of the electronic expansion valve as described in the first aspect above.

[0017] Fourthly, embodiments of this application provide a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the control method for the electronic expansion valve as described in the first aspect above.

[0018] The electronic expansion valve control method, device, electronic equipment, and storage medium provided in this application embodiment acquire ambient temperature, compressor suction temperature, compressor discharge temperature, evaporator evaporation temperature, condenser condensation temperature, liquid pipe temperature at a target location on the main pipeline, auxiliary pipeline inlet temperature, and auxiliary pipeline outlet temperature based on a preset cycle. Based on these parameters, a first superheat deviation value, a first superheat change value, and a current subcooling value for the main pipeline electronic expansion valve are determined. A second superheat deviation value and a second superheat change value for the auxiliary pipeline electronic expansion valve are determined based on the ambient temperature, auxiliary pipeline inlet temperature, and auxiliary pipeline outlet temperature. The opening degree of the main pipeline electronic expansion valve is adjusted based on these parameters. The opening degree of the auxiliary pipeline electronic expansion valve is adjusted based on the second superheat deviation value and the second superheat change value. When regulating the opening of the electronic expansion valve, not only are the changes in actual superheat compared to the target superheat considered, but also the changes in actual superheat in the current cycle compared to the previous cycle. This achieves continuous dynamic control of the electronic expansion valve, ensuring that the refrigerant flow rate in the system does not fluctuate significantly. This increases the system's stability under low ambient temperature and high heating demand scenarios, thus improving the system's heating performance. Furthermore, the regulation of the main circuit electronic expansion valve also considers its actual subcooling, ensuring that the high-temperature, high-pressure refrigerant vapor discharged from the compressor remains subcooled after condensation in the condenser and heat exchange in the economizer. This guarantees the cooling effect of the auxiliary circuit, thereby reducing the compressor discharge temperature and increasing the system's refrigerant circulation volume. This further increases the system's stability under low ambient temperature and high heating demand scenarios, improving the system's heating performance.

[0019] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of a heat pump system provided in an embodiment of this application;

[0022] Figure 2 A schematic flowchart illustrating the control method for the electronic expansion valve provided in Embodiment 1 of this application;

[0023] Figure 3 This is a schematic diagram of the control device for the electronic expansion valve provided in Embodiment 3 of this application;

[0024] Figure 4 This is a schematic diagram of the structure of an electronic device provided in Embodiment 4 of this application. Detailed Implementation

[0025] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0026] It should be noted that the terms "first," "second," "objective," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0027] Heat pump systems are units primarily designed for heating. When operating in environments with low ambient temperatures and high heating demands, the heating capacity decreases due to the larger suction volume of the compressor and lower suction flow rate at lower temperatures, failing to meet the high indoor heating load requirements. To address this issue, a quasi-two-stage compression heat pump system with an economizer, namely the vapor injection enthalpy-enhancing heat pump system, has emerged on the market. This system improves the heating performance and coefficient of performance (COP) of the heat pump system in low-temperature operating environments by using a vapor injection enthalpy-enhancing circuit.

[0028] In existing technologies, the actual superheat of the electronic expansion valve is determined based on the difference between the compressor inlet temperature and the evaporator outlet temperature. This actual superheat is then compared with the target superheat to determine the valve's opening adjustment value, thereby controlling the valve to adjust to the corresponding opening. However, this existing technology essentially regulates the electronic expansion valve based on the superheat deviation between the actual and target superheat. One specific approach involves dividing the deviation into multiple intervals, fixing the valve opening within each interval. When the control parameter is at the critical value between two intervals, the valve opening fluctuates between the set values ​​of the two intervals, causing fluctuations in refrigerant flow within the system and affecting system stability. On the other hand, existing technologies rely solely on superheat to control the valve opening of the electronic expansion valve. For compressors that use gas injection and enthalpy enhancement, this may result in incomplete condensation of the high-temperature, high-pressure refrigerant vapor discharged from the compressor after entering the condenser. Consequently, some of the refrigerant entering the economizer remains in a gaseous state. This gaseous refrigerant releases a large amount of heat in the economizer, leading to poor liquid extraction in the auxiliary circuit and poor cooling effect on the compressor's exhaust temperature. This prevents the compressor from achieving its gas injection and enthalpy enhancement effect, resulting in poor heat pump system performance.

[0029] The main idea of ​​this application's technical solution is as follows: This application provides a control method for electronic expansion valves. By periodically acquiring the ambient temperature and the temperature of relevant equipment in the system, the superheat deviation value, superheat change value, and subcooling value of the main circuit electronic expansion valve are calculated. The superheat deviation value and superheat change value of the auxiliary circuit electronic expansion valve are also calculated. Based on the calculation results, the opening adjustment values ​​of the main circuit and auxiliary circuit electronic expansion valves are determined respectively, and the main circuit and auxiliary circuit electronic expansion valves are regulated accordingly. On one hand, in this embodiment, the superheat deviation value and superheat change rate within one cycle are used as one of the control parameters for adjusting the valve opening of the electronic expansion valves (main circuit and auxiliary circuit). Considering the actual superheat change of the electronic expansion valve within the current cycle, continuous dynamic control of the electronic expansion valve is achieved, ensuring that the refrigerant flow rate in the system does not fluctuate significantly, thereby increasing the system's stability and improving its heating effect. On the other hand, using subcooling as one of the control parameters for adjusting the opening of the electronic expansion valve (main circuit) ensures that the high-temperature and high-pressure refrigerant vapor discharged from the compressor remains in a subcooled liquid state after being condensed by the condenser and heat exchanged by the economizer. This ensures the cooling effect of the auxiliary circuit, thereby achieving the purpose of reducing the compressor discharge temperature and increasing the refrigerant circulation volume in the system, further increasing the stability of the system and improving the heating effect of the system.

[0030] For example, Figure 1 This is a schematic diagram of the structure of a heat pump system provided in an embodiment of this application, as shown below. Figure 1 As shown, the heat pump system in this embodiment includes: a compressor, a condenser, an economizer, an evaporator, a main electronic expansion valve (hereinafter referred to as the main valve), and an auxiliary electronic expansion valve (hereinafter referred to as the auxiliary valve). The compressor outlet is connected to the condenser inlet, the condenser outlet is connected to the first inlet of the economizer, the first outlet of the economizer is connected to the evaporator inlet, and the evaporator outlet is connected to the first inlet of the compressor. The main electronic expansion valve is installed on the main pipeline between the evaporator inlet and the first outlet of the economizer. The second inlet of the economizer is connected to a target node on the main pipeline through the auxiliary pipeline. The target node is located between the main electronic expansion valve and the economizer. The second outlet of the economizer is connected to the second inlet of the compressor. The auxiliary electronic expansion valve is installed on the auxiliary pipeline.

[0031] Example 1

[0032] based on Figure 1 The heat pump system shown is exemplary. Figure 2 This is a flowchart illustrating the control method for an electronic expansion valve provided in Embodiment 1 of this application. The method in this embodiment can be executed by the control device for the electronic expansion valve provided in this embodiment. This device can be implemented in software and / or hardware and can be integrated into electronic devices such as computers and smart terminals. Figure 2As shown, the control method for the electronic expansion valve in this embodiment includes:

[0033] S201. Based on a preset cycle, acquire the ambient temperature, the compressor's suction and discharge temperatures, the evaporator's evaporation temperature, the condenser's condensation temperature, the liquid pipe temperature at the target location on the main pipeline, and the economizer's auxiliary pipeline inlet and outlet temperatures.

[0034] Among them, the ambient temperature, that is, the temperature of the outdoor environment, can be obtained by a temperature sensor installed in the outdoor environment.

[0035] The compressor's suction temperature, i.e. Figure 1 The temperature at the first inlet of the compressor can, for example, be obtained by a temperature sensor located at position ①.

[0036] The compressor's discharge temperature, i.e. Figure 1 The temperature at the outlet of the compressor can, for example, be obtained by a temperature sensor located at position ②.

[0037] The evaporation temperature of the evaporator, i.e. Figure 1 The temperature at the inlet of the evaporator can, for example, be obtained by a temperature sensor located at position ③.

[0038] The condensing temperature of the condenser, i.e. Figure 1 The temperature at the compressor outlet can, for example, be obtained by converting pressure detected by a pressure sensor located at position ④.

[0039] The temperature of the liquid pipe at the target location on the main pipeline, i.e. Figure 1 The temperature of the pipeline between the main electronic expansion valve and the target node can, for example, be obtained by a temperature sensor located at position ⑤.

[0040] The auxiliary inlet temperature of the economizer, i.e. Figure 1 The temperature at the second outlet of the medium-sized economizer can, for example, be obtained by a temperature sensor located at position ⑥.

[0041] The auxiliary outlet temperature of the economizer, i.e. Figure 1 The temperature at the second outlet of the medium-sized economizer can, for example, be obtained by a temperature sensor located at position ⑦.

[0042] It should be noted that the temperature and pressure sensors mentioned above are both installed on the pipeline and detect the temperature or pressure of the refrigerant in the pipeline.

[0043] The preset cycle is a pre-set cycle used to regulate the opening of the main circuit electronic expansion valve and the auxiliary circuit electronic expansion valve. To ensure the stability of the system, the preset cycle can be set to a short time. For example, the cycle can be on the order of seconds.

[0044] Furthermore, depending on the application scenario, the control cycles set for the main circuit electronic expansion valve and the auxiliary circuit electronic expansion valve can be the same or different, depending on the actual scenario. It should be noted that if they are the same, all the above temperature parameters can be acquired simultaneously within each control cycle in this step; if they are different, the temperatures required to determine the opening degree of the main circuit electronic expansion valve and the auxiliary circuit electronic expansion valve can be acquired separately according to their respective cycles. For example, assuming the control cycles set for the main circuit electronic expansion valve and the auxiliary circuit electronic expansion valve are the first cycle and the second cycle, respectively, in this step, the ambient temperature, intake temperature, exhaust temperature, evaporation temperature, condensation temperature, and liquid pipe temperature required to determine the opening degree of the main circuit electronic expansion valve can be acquired periodically according to the first cycle, while the ambient temperature, auxiliary circuit inlet temperature, and auxiliary circuit outlet temperature required to determine the opening degree of the auxiliary circuit electronic expansion valve can be acquired periodically according to the second cycle.

[0045] S202. Based on the ambient temperature, intake temperature, exhaust temperature, evaporation temperature, condensation temperature, and liquid pipe temperature, determine the first superheat deviation value, the first superheat change value, and the current subcooling value of the main circuit electronic expansion valve.

[0046] In this step, based on the ambient temperature, intake temperature, exhaust temperature, evaporation temperature, condensation temperature, and liquid pipe temperature obtained in S201, the superheat deviation value, superheat change value, and current subcooling value of the main circuit electronic expansion valve are determined respectively. The superheat deviation value is the difference between the actual superheat (i.e., current superheat) and the target superheat in the current cycle; the superheat change value is the difference between the actual superheat in the current cycle and the actual superheat in one cycle (i.e., the previous superheat); and the current subcooling value is the subcooling value in the current cycle.

[0047] For ease of distinction, in this embodiment, the target superheat, current superheat, previous superheat, superheat deviation value, and superheat change value of the main circuit electronic expansion valve are respectively called the first target superheat, the first current superheat, the first previous superheat, the first superheat deviation value, and the first superheat change value.

[0048] To calculate the first superheat deviation value, it is necessary to first determine the first current superheat and the first target superheat.

[0049] In one possible implementation, the first current superheat of the main circuit electronic expansion valve is determined by calculating the difference between the compressor's suction temperature and the evaporator's evaporation temperature.

[0050] In one possible implementation, the initial superheat of the main circuit electronic expansion valve can be determined by looking up a table based on the ambient temperature.

[0051] In one possible implementation, the target initial superheat of the main circuit electronic expansion valve can be determined first based on the ambient temperature. Then, a correction value for the target initial superheat of the main circuit electronic expansion valve can be determined based on the compressor's discharge temperature. Finally, the first target superheat of the main circuit electronic expansion valve is determined by summing the target initial superheat and the correction value. By correcting the target initial superheat based on the compressor's discharge temperature, the actual situation of the compressor is taken into account, making the first target superheat dynamic, which is beneficial to further improve the stability of the system.

[0052] In this embodiment, the target initial superheat value of the main circuit electronic expansion valve under different ambient temperatures and the correction value of the target initial superheat value under different compressor exhaust temperatures can be determined in advance through a large number of experiments. A data table showing the correspondence between ambient temperature and target initial superheat value, as well as the correspondence between compressor exhaust temperature and target initial superheat correction value, are generated and stored in the first data table. Accordingly, when determining the first target superheat value, the target initial superheat value and the target initial superheat correction value can be determined by looking up the table.

[0053] In one possible implementation, the first superheat deviation value of the main circuit electronic expansion valve is determined by calculating the difference between the first current superheat and the first target superheat.

[0054] Based on the above calculation process, in one possible implementation, the first superheat value of the main circuit electronic expansion valve is determined by obtaining the first current superheat and the first previous superheat, and calculating the difference between the first current superheat and the first previous superheat. It should be noted that in this embodiment, the data generated in each cycle, such as the actual superheat and the target superheat, can be stored as needed for retrieval and use in subsequent processing steps or related scenarios such as system optimization and troubleshooting.

[0055] In one possible implementation, the current subcooling of the main electronic expansion valve is determined by calculating the difference between the condenser's condensing temperature and the liquid line temperature. In this implementation, by calculating the actual subcooling of the main electronic expansion valve based on the liquid line temperature of the pipe before the main electronic expansion valve, the liquid intake of the auxiliary electronic expansion valve is ensured, which helps to reduce the compressor discharge temperature and increase the system refrigerant circulation.

[0056] S203. Based on the ambient temperature, the auxiliary road inlet temperature, and the auxiliary road outlet temperature, determine the second superheat deviation value and the second superheat change value of the auxiliary road electronic expansion valve.

[0057] In this step, based on the ambient temperature, the auxiliary circuit inlet temperature, and the auxiliary circuit outlet temperature obtained in S201, the superheat deviation value and superheat change value of the auxiliary circuit electronic expansion valve are determined respectively. For ease of distinction, in this embodiment, the target superheat, current superheat, previous superheat, superheat deviation value, and superheat change value of the auxiliary circuit electronic expansion valve are respectively referred to as the second target superheat, the second current superheat, the second previous superheat, the second superheat deviation value, and the second superheat change value.

[0058] Similarly, in this step, to calculate the second superheat deviation value, it is necessary to first determine the second current superheat and the second target superheat.

[0059] In one possible implementation, the second current superheat of the auxiliary circuit electronic expansion valve is determined by calculating the difference between the outlet temperature and the inlet temperature of the economizer auxiliary circuit.

[0060] In one possible implementation, the second target superheat of the auxiliary circuit electronic expansion valve can be determined by looking up a table based on the ambient temperature. In this implementation, the target superheat value of the auxiliary circuit electronic expansion valve at different ambient temperatures can be determined in advance through a large number of experiments, generating a correspondence between the ambient temperature and the second target superheat, and storing it in a second data table.

[0061] It should be noted that the second data table relating storage ambient temperature to the second target superheat is different from the first data table relating storage ambient temperature to the first target initial superheat, as they were obtained through different experiments. Therefore, for the same ambient temperature, the values ​​of the second target superheat determined in this step and the first target initial superheat determined in S202 can be the same or different.

[0062] In one possible implementation, the second superheat deviation value of the auxiliary electronic expansion valve is determined by calculating the difference between the second current superheat and the second target superheat.

[0063] In one possible implementation, the second superheat change value of the auxiliary circuit electronic expansion valve is determined by acquiring the second current superheat and the second previous superheat, and calculating the difference between the second current superheat and the second previous superheat.

[0064] It should be noted that step (S203) and step (S202) are parallel and have no sequential order. If the control cycles of the main electronic expansion valve and the auxiliary electronic expansion valve are the same, then in this embodiment, steps (S202 and S203) can be executed simultaneously. If the control cycles of the main electronic expansion valve and the auxiliary electronic expansion valve are different, then in this embodiment, steps (S202 and S203) are executed according to the corresponding control cycles of the main electronic expansion valve and the auxiliary electronic expansion valve.

[0065] S204. Adjust the opening of the main circuit electronic expansion valve according to the first superheat deviation value, the first superheat change value and the current subcooling.

[0066] In this step, based on the first superheat deviation value, the first superheat change value, and the current subcooling value calculated in S202, the opening adjustment value of the main circuit electronic expansion valve is determined, and then the opening of the main circuit electronic expansion valve is adjusted according to the determined opening adjustment value.

[0067] In one possible implementation, a first adjustment value for the main circuit electronic expansion valve is determined based on a first superheat deviation value and a first superheat change value; a second adjustment value for the main circuit electronic expansion valve is determined based on the current subcooling; and the main circuit electronic expansion valve is controlled to adjust to a first opening degree based on the first and second adjustment values.

[0068] For example, the correspondence between the first superheat deviation value and the first superheat change value and the main circuit electronic expansion valve opening adjustment value can be generated in advance through a large number of experiments and stored in a third data table. Accordingly, in this embodiment, the first adjustment value of the main circuit electronic expansion valve opening can be determined by looking up the table based on the calculated first superheat deviation value and the first superheat change value.

[0069] In one possible implementation, when determining the second adjustment value, the current subcooling degree can be compared with the target subcooling degree, and the difference can be calculated to determine the subcooling degree deviation value. Then, the second adjustment value can be determined based on the subcooling degree deviation value. Similarly, a correspondence between the subcooling degree deviation value and the main circuit electronic expansion valve opening adjustment value can be generated in advance through numerous experiments and stored in a fourth data table. Accordingly, in this embodiment, based on the calculated subcooling degree deviation value, the second adjustment value of the main circuit electronic expansion valve opening can be determined by looking up the table.

[0070] The target supercooling is similar to the target superheating and can also be determined by looking up a table based on the ambient temperature. The specific determination process is similar to that of the target superheating, and will not be repeated here.

[0071] In one possible implementation, a target adjustment value for the main circuit electronic expansion valve is determined by summing a first adjustment value and a second adjustment value. Then, based on the target adjustment value and the current opening degree of the main circuit electronic expansion valve, a first control command is sent to the main circuit electronic expansion valve to control the rotation of the main circuit electronic expansion valve to a first opening degree, wherein the first control command includes the first opening degree.

[0072] S205. Adjust the opening of the auxiliary electronic expansion valve according to the second superheat deviation value and the second superheat change value.

[0073] In this step, the opening adjustment value of the auxiliary electronic expansion valve is determined based on the second superheat deviation value and the second superheat change value calculated in S203, and then the opening of the auxiliary electronic expansion valve is adjusted according to the determined opening adjustment value.

[0074] In one possible implementation, a third adjustment value for the auxiliary electronic expansion valve is determined based on a second superheat deviation value and a second superheat change value, and then the auxiliary electronic expansion valve is controlled to adjust to a second opening degree based on the third adjustment value.

[0075] In one possible implementation, the correspondence between the second superheat deviation value, the second superheat change value, and the auxiliary circuit electronic expansion valve opening adjustment value can be generated in advance through a large number of experiments and stored in the fifth data table. Accordingly, in this embodiment, based on the calculated second superheat deviation value and the second superheat change value, the third adjustment value of the auxiliary circuit electronic expansion valve opening can be determined by looking up the table.

[0076] In one possible implementation, after determining the third adjustment value, a second control command is sent to the auxiliary electronic expansion valve to control the rotation of the auxiliary electronic expansion valve to a second opening degree, wherein the second control command includes the second opening degree.

[0077] It is understood that this step (S205) is parallel to S204 and there is no specific order between them. If the control cycles of the main electronic expansion valve and the auxiliary electronic expansion valve are the same, then in this embodiment, S204 and S205 can be executed simultaneously; if the control cycles of the main electronic expansion valve and the auxiliary electronic expansion valve are different, then in this embodiment, S204 and S205 can be executed according to the corresponding control cycles of the main electronic expansion valve and the auxiliary electronic expansion valve.

[0078] On the one hand, in this embodiment, by taking into account the actual superheat of the main circuit electronic expansion valve and the auxiliary circuit electronic expansion valve in the current cycle relative to the actual superheat of the previous cycle, and by reasonably setting the control cycle of the main circuit electronic expansion valve and the auxiliary circuit electronic expansion valve, the opening degree of the main circuit electronic expansion valve and the auxiliary circuit electronic expansion valve can be adjusted in small steps. This allows the refrigerant flow in the system to increase or decrease little by little, avoiding large fluctuations in the refrigerant flow in the system. This achieves continuous dynamic control of the electronic expansion valve, thereby increasing the system stability and improving the system heating effect in scenarios with low ambient temperature and high heating demand.

[0079] On the other hand, in this embodiment, the actual subcooling of the main electronic expansion valve is also considered in the regulation of the main electronic expansion valve. Since the actual subcooling is determined based on the condenser condensing temperature and the liquid pipe temperature of the main pipeline between the main electronic expansion valve and the target node (the connection point between the auxiliary pipeline and the main pipeline), it can reflect the actual state of the refrigerant flowing through the condenser and the economizer. Therefore, by using the actual subcooling as one of the factors in determining the opening adjustment value of the main electronic expansion valve, the opening of the main electronic expansion valve is regulated, thereby ensuring that the high-temperature and high-pressure refrigerant vapor discharged from the compressor remains in a subcooled liquid state after condensation in the condenser and heat exchange in the economizer. This ensures the cooling effect of the auxiliary pipeline, thereby achieving the purpose of reducing the compressor discharge temperature and increasing the refrigerant circulation volume in the system. This further increases the stability of the system under low ambient temperature and high heating demand scenarios and improves the heating effect of the system.

[0080] Example 2

[0081] The following will illustrate the control process of the main circuit electronic expansion valve and the auxiliary circuit electronic expansion valve using a specific embodiment.

[0082] (1) Electronic expansion valve adjustment range: It can only be adjusted between the maximum opening and the minimum opening.

[0083] (2) Reset of electronic expansion valve: After the electronic expansion valve is powered on, it is necessary to reset the electronic expansion valve first.

[0084] (3) Control of the main circuit electronic expansion valve

[0085] a. Initialization: Assuming the control cycle of the main circuit electronic expansion valve is H1 during the initialization phase, when the compressor starts running for a preset time t1, the initialization phase begins. Using H1 as the cycle, the initial opening of the main circuit electronic expansion valve is determined based on different ambient temperatures and required outlet water temperatures, and the opening of the main circuit electronic expansion valve is controlled.

[0086] b. Superheat and Subcooling Control Stage: Assuming the control cycle of the main circuit electronic expansion valve in the superheat and subcooling control stage is H2, when the compressor start-up time reaches the preset time t2 (t2>t1), the superheat and subcooling control stage begins. Using H2 as the cycle, the compressor suction temperature Ts, compressor discharge temperature Td, evaporator evaporation temperature Te, liquid pipe temperature Tl at the target location on the main circuit pipeline, and condenser condensation temperature Tc are acquired. The actual superheat (first current superheat) and actual subcooling (current subcooling) of the main circuit electronic expansion valve are determined. The actual superheat is compared with the target superheat (first target superheat), and the actual subcooling is compared with the target subcooling to determine the opening degree of the main circuit electronic expansion valve. Specifically:

[0087] Different initial superheats (SHT0) are matched according to different ambient temperatures;

[0088] Within different exhaust temperature ranges Td, the target superheat SHT is corrected by x based on the exhaust temperature Td.

[0089] First target superheat SHT = First target initial superheat SHT0 + correction value x;

[0090] First current superheat SH = suction temperature Ts – evaporation temperature Te;

[0091] The first superheat deviation value ΔSH = SH - SHT;

[0092] The first superheat change value ΔSH' = the first current superheat SH – the first previous superheat SH;

[0093] The opening degree of the main circuit electronic expansion valve is corrected n1 based on different first superheat deviation values ​​ΔSH and first superheat change values ​​ΔSH'.

[0094] Current subcooling UC = condensing temperature Tc - liquid line temperature Tl;

[0095] Within different subcooling ranges, the opening degree of the main circuit electronic expansion valve is corrected by n2.

[0096] Within each adjustment cycle H2, the adjustment value of the opening of the main circuit electronic expansion valve is n1+n2.

[0097] (4) Control of auxiliary circuit electronic expansion valve

[0098] c. Initialization: Assuming the control cycle of the auxiliary electronic expansion valve is H3 during the initialization phase, the initialization phase begins when the opening time of the auxiliary electronic expansion valve reaches the preset time t3. Using H3 as the cycle, the initial opening degree of the auxiliary electronic expansion valve is determined according to different ambient temperatures and required outlet water temperatures, and the opening degree of the auxiliary electronic expansion valve is controlled.

[0099] d. Superheat Control Stage: Assuming the control cycle of the auxiliary electronic expansion valve in the superheat control stage is H4, the superheat control stage begins when the opening time of the auxiliary electronic expansion valve reaches the preset time t4 (t4>t3). Using H4 as the cycle, the auxiliary inlet temperature Ti, auxiliary outlet temperature To, and compressor discharge temperature Td are acquired to determine the actual superheat (first current superheat) and target superheat (second target superheat) of the auxiliary electronic expansion valve. The actual superheat is then compared with the target superheat to determine the opening degree of the auxiliary electronic expansion valve. Specifically:

[0100] Different secondary target superheats (SHTs) are matched according to different ambient temperatures;

[0101] Second current superheat SH = Economizer auxiliary circuit outlet temperature To - Economizer auxiliary circuit inlet temperature Ti;

[0102] Second superheat deviation value ΔSH = Second actual superheat SH - Second target superheat SHT;

[0103] The second superheat change value ΔSH' = the second current superheat SH – the second previous superheat SH;

[0104] Within each adjustment cycle H4, the opening degree of the auxiliary electronic expansion valve is corrected n3 according to different second superheat deviation values ​​ΔSH and second heat change values ​​ΔSH.

[0105] Example 3

[0106] based on Figure 1 The heat pump system shown is exemplary. Figure 3 This is a schematic diagram of the control device for the electronic expansion valve provided in Embodiment 3 of this application. The device in this embodiment can be implemented by software and / or hardware, and can be integrated into electronic devices such as computers and smart terminals. Figure 3 As shown, the control device 10 for the electronic expansion valve in this embodiment includes:

[0107] Acquisition module 11, processing module 12, and control module 13.

[0108] The acquisition module 11 is used to acquire the ambient temperature, the compressor's suction temperature and discharge temperature, the evaporation temperature of the evaporator, the condensation temperature of the condenser, the liquid pipe temperature at the target location on the main pipeline, the auxiliary pipeline inlet temperature and the auxiliary pipeline outlet temperature of the economizer, based on a preset cycle. The target location is located between the main pipeline electronic expansion valve and the target node.

[0109] Processing module 12 is used to determine the first superheat deviation value, the first superheat change value, and the current subcooling value of the main circuit electronic expansion valve based on ambient temperature, intake temperature, exhaust temperature, evaporation temperature, condensation temperature, and liquid pipe temperature; and to determine the second superheat deviation value and the second superheat change value of the auxiliary circuit electronic expansion valve based on ambient temperature, auxiliary circuit inlet temperature, and auxiliary circuit outlet temperature.

[0110] The control module 13 is used to adjust the opening of the main circuit electronic expansion valve according to the first superheat deviation value, the first superheat change value and the current subcooling value; and to adjust the opening of the auxiliary circuit electronic expansion valve according to the second superheat deviation value and the second superheat change value.

[0111] Optionally, the control module 13 is specifically used for:

[0112] Based on the first superheat deviation value and the first superheat change value, determine the first adjustment value of the main circuit electronic expansion valve;

[0113] Determine the second adjustment value of the main circuit electronic expansion valve based on the current subcooling.

[0114] Based on the first adjustment value and the second adjustment value, the main circuit electronic expansion valve is adjusted to the first opening degree.

[0115] Optionally, the control module 13 is specifically used for:

[0116] Based on the second superheat deviation value and the second superheat change value, determine the third adjustment value of the auxiliary circuit electronic expansion valve;

[0117] Based on the third adjustment value, the electronic expansion valve of the control auxiliary circuit is adjusted to the second opening degree.

[0118] Optionally, the processing module 12 is specifically used for:

[0119] Determine the first current superheat of the main circuit electronic expansion valve based on the intake temperature and evaporation temperature;

[0120] The first superheat deviation value of the main circuit electronic expansion valve is determined based on the ambient temperature, exhaust temperature, and first current superheat.

[0121] The first superheat change value of the main circuit electronic expansion valve is determined based on the first current superheat and the first previous superheat of the main circuit electronic expansion valve.

[0122] Determine the current subcooling of the main electronic expansion valve based on the condensation temperature and the liquid line temperature.

[0123] Optionally, the processing module 12 is specifically used for:

[0124] Determine the target initial superheat of the main circuit electronic expansion valve based on the ambient temperature;

[0125] The first target superheat of the main circuit electronic expansion valve is determined based on the target initial superheat and exhaust temperature.

[0126] The superheat deviation value of the main circuit electronic expansion valve is determined based on the first current superheat and the first target superheat.

[0127] Optionally, the processing module 12 is specifically used for:

[0128] Determine the correction value for the target initial superheat based on the exhaust temperature;

[0129] The first target superheat is determined based on the initial target superheat and the correction value.

[0130] Optionally, the processing module 12 is specifically used for:

[0131] The second current superheat of the electronic expansion valve in the auxiliary circuit is determined based on the inlet temperature and outlet temperature of the auxiliary circuit.

[0132] The second target superheat of the economizer is determined based on the ambient temperature.

[0133] The second superheat deviation value of the economizer is determined based on the second current superheat and the second target superheat.

[0134] The second superheat change value of the auxiliary electronic expansion valve is determined based on the second current superheat and the second previous superheat of the auxiliary electronic expansion valve.

[0135] The control device for the electronic expansion valve provided in this embodiment can execute the control method for the electronic expansion valve provided in the above-described method embodiments, and has the corresponding functional modules and beneficial effects of the method execution. The implementation principle and technical effects of this embodiment are similar to those of the above-described method embodiments, and will not be repeated here.

[0136] Example 4

[0137] Figure 4 This is a schematic diagram of the structure of an electronic device provided in Embodiment 4 of this application, as shown below. Figure 4 As shown, the electronic device 20 includes a memory 21, a processor 22, and a computer program stored in the memory and executable on the processor; the electronic device 20 may have one or more processors 22. Figure 4 Taking a processor 22 as an example; the processor 22 and memory 21 in the electronic device 20 can be connected via a bus or other means. Figure 4 Taking the example of a connection between China and Israel via a bus.

[0138] The memory 21, as a computer-readable storage medium, can be used to store software programs, computer-executable programs, and modules, such as the program instructions / modules corresponding to the acquisition module 11, processing module 12, and control module 13 in the embodiments of this application. The processor 22 executes various functional applications and data processing of the electronic device by running the software programs, instructions, and modules stored in the memory 21, thereby realizing the above-described control method for the electronic expansion valve.

[0139] The memory 21 may primarily include a program storage area and a data storage area. The program storage area may store the operating system and at least one application program required for a given function; the data storage area may store data created based on terminal usage. Furthermore, the memory 21 may include high-speed random access memory and non-volatile memory, such as at least one disk storage device, flash memory, or other non-volatile solid-state storage device. In some instances, the memory 21 may further include memory remotely located relative to the processor 22, which can be connected to the electronic device via a grid. Examples of such grids include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0140] Example 5

[0141] Embodiment 5 of this application also provides a computer-readable storage medium storing a computer program thereon, the computer program being executed by a computer processor to perform a control method for an electronic expansion valve, the method comprising:

[0142] Based on a preset cycle, the ambient temperature, compressor suction and discharge temperatures, evaporator evaporation temperature, condenser condensation temperature, liquid pipe temperature at the target location on the main pipeline, and auxiliary pipeline inlet and outlet temperatures of the economizer are obtained. The target location is located between the main pipeline electronic expansion valve and the target node.

[0143] Based on the ambient temperature, intake temperature, exhaust temperature, evaporation temperature, condensation temperature, and liquid pipe temperature, determine the first superheat deviation value, the first superheat change value, and the current subcooling value of the main circuit electronic expansion valve;

[0144] Based on the ambient temperature, the auxiliary road inlet temperature, and the auxiliary road outlet temperature, determine the second superheat deviation value and the second superheat change value of the auxiliary road electronic expansion valve;

[0145] The opening of the main circuit electronic expansion valve is adjusted based on the first superheat deviation value, the first superheat change value, and the current subcooling.

[0146] The opening degree of the auxiliary electronic expansion valve is adjusted based on the second superheat deviation value and the second superheat change value.

[0147] Of course, the computer program of the computer-readable storage medium provided in the embodiments of this application is not limited to the operation of the method described above, but can also perform related operations in the control method of the electronic expansion valve provided in any embodiment of this application.

[0148] Based on the above description of the implementation methods, those skilled in the art can clearly understand that this application can be implemented using software and necessary general-purpose hardware, and of course, it can also be implemented using hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as a computer floppy disk, read-only memory (ROM), random access memory (RAM), flash memory, hard disk, or optical disk, etc., including several instructions to cause a computer device (which may be a personal computer, server, or grid device, etc.) to execute the methods described in the various embodiments of this application.

[0149] It is worth noting that in the embodiments of the control device for the electronic expansion valve described above, the various units and modules included are only divided according to functional logic, but are not limited to the above division, as long as the corresponding functions can be achieved; in addition, the specific names of each functional unit are only for easy differentiation and are not used to limit the scope of protection of this application.

[0150] Note that the above are merely preferred embodiments and the technical principles employed in this application. Those skilled in the art will understand that this application is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of this application. Therefore, although this application has been described in detail through the above embodiments, this application is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of this application, the scope of which is determined by the scope of the appended claims.

Claims

1. A control method for an electronic expansion valve, characterized in that, The electronic expansion valve includes a main circuit electronic expansion valve and an auxiliary circuit electronic expansion valve, which are respectively installed on the main circuit pipeline and the auxiliary circuit pipeline of the heat pump system. The heat pump system also includes a compressor, a condenser, an economizer, and an evaporator. The main circuit pipeline is located between the evaporator and the economizer, and the auxiliary circuit pipeline is located between the economizer and a target node on the main circuit pipeline. The main circuit electronic expansion valve is located between the evaporator and the target node. The method includes: Based on a preset cycle, the ambient temperature, the suction and discharge temperatures of the compressor, the evaporation temperature of the evaporator, the condensation temperature of the condenser, the liquid pipe temperature at the target location on the main pipeline, and the auxiliary inlet and outlet temperatures of the economizer are acquired. The target location is located between the main electronic expansion valve and the target node. Based on the ambient temperature, the intake temperature, the exhaust temperature, the evaporation temperature, the condensation temperature, and the liquid pipe temperature, determine the first superheat deviation value, the first superheat change value, and the current subcooling value of the main circuit electronic expansion valve; Based on the ambient temperature, the auxiliary road inlet temperature, and the auxiliary road outlet temperature, determine the second superheat deviation value and the second superheat change value of the auxiliary road electronic expansion valve; The opening of the main circuit electronic expansion valve is adjusted based on the first superheat deviation value, the first superheat change value, and the current subcooling. The opening degree of the auxiliary electronic expansion valve is adjusted according to the second superheat deviation value and the second superheat change value. The step of adjusting the opening of the main circuit electronic expansion valve based on the first superheat deviation value, the first superheat change value, and the current subcooling degree includes: Based on the first superheat deviation value and the first superheat change value, determine the first adjustment value of the main circuit electronic expansion valve; Based on the current subcooling, determine the second adjustment value of the main circuit electronic expansion valve; Based on the first adjustment value and the second adjustment value, the main circuit electronic expansion valve is controlled to adjust to the first opening degree; Specifically, controlling the adjustment of the main circuit electronic expansion valve to the first opening degree based on the first adjustment value and the second adjustment value includes: The target adjustment value of the main circuit electronic expansion valve is determined by summing the first adjustment value and the second adjustment value; Based on the target adjustment value and the current opening degree of the main electronic expansion valve, a first control command is sent to the main electronic expansion valve to control the rotation of the main electronic expansion valve to the first opening degree; The first control command includes a first opening degree.

2. The method according to claim 1, characterized in that, The step of adjusting the opening of the auxiliary electronic expansion valve based on the second superheat deviation value and the second superheat change value includes: Based on the second superheat deviation value and the second superheat change value, determine the third adjustment value of the auxiliary electronic expansion valve; Based on the third adjustment value, the auxiliary electronic expansion valve is controlled to adjust to the second opening degree.

3. The method according to claim 1, characterized in that, The step of determining the first superheat deviation value, the first superheat change value, and the current subcooling value of the main circuit electronic expansion valve based on the ambient temperature, the intake temperature, the exhaust temperature, the evaporation temperature, the condensation temperature, and the liquid pipe temperature includes: The first current superheat of the main circuit electronic expansion valve is determined based on the intake temperature and the evaporation temperature; The first superheat deviation value of the main circuit electronic expansion valve is determined based on the ambient temperature, the exhaust temperature, and the first current superheat. The first superheat change value of the main circuit electronic expansion valve is determined based on the first current superheat and the first previous superheat of the main circuit electronic expansion valve. The current subcooling of the main electronic expansion valve is determined based on the condensation temperature and the liquid pipe temperature.

4. The method according to claim 3, characterized in that, The step of determining the first superheat deviation value of the main circuit electronic expansion valve based on the ambient temperature, the exhaust temperature, the first current superheat, and the first previous superheat of the main circuit electronic expansion valve includes: Based on the ambient temperature, determine the target initial superheat of the main circuit electronic expansion valve; The first target superheat of the main circuit electronic expansion valve is determined based on the target initial superheat and the exhaust temperature. The superheat deviation value of the main circuit electronic expansion valve is determined based on the first current superheat and the first target superheat.

5. The method according to claim 4, characterized in that, The step of determining the first target superheat of the main circuit electronic expansion valve based on the target initial superheat and the exhaust temperature includes: Based on the exhaust temperature, determine the correction value for the target initial superheat. The first target superheat is determined based on the initial target superheat and the correction value.

6. The method according to claim 1, characterized in that, The step of determining the second superheat deviation value and the second superheat change value of the auxiliary circuit electronic expansion valve based on the ambient temperature, the auxiliary circuit inlet temperature, and the auxiliary circuit outlet temperature includes: The second current superheat of the auxiliary circuit electronic expansion valve is determined based on the auxiliary circuit inlet temperature and the auxiliary circuit outlet temperature. Based on the ambient temperature, determine the second target superheat of the economizer; The second superheat deviation value of the economizer is determined based on the second current superheat and the second target superheat. The second superheat change value of the auxiliary electronic expansion valve is determined based on the second current superheat and the second previous superheat of the auxiliary electronic expansion valve.

7. A control device for an electronic expansion valve, characterized in that, The electronic expansion valve includes a main circuit electronic expansion valve and an auxiliary circuit electronic expansion valve, which are respectively installed on the main circuit pipeline and the auxiliary circuit pipeline of the heat pump system. The heat pump system also includes a compressor, a condenser, an economizer, and an evaporator. The main circuit pipeline is located between the evaporator and the economizer, and the auxiliary circuit pipeline is located between the economizer and a target node on the main circuit pipeline. The main circuit electronic expansion valve is located between the evaporator and the target node. The device includes: The acquisition module is used to acquire, based on a preset period, the ambient temperature, the suction temperature and discharge temperature of the compressor, the evaporation temperature of the evaporator, the condensation temperature of the condenser, the liquid pipe temperature at a target location on the main pipeline, and the auxiliary pipeline inlet temperature and auxiliary pipeline outlet temperature of the economizer, wherein the target location is located between the main pipeline electronic expansion valve and the target node; The processing module is used to determine the first superheat deviation value, the first superheat change value, and the current subcooling value of the main circuit electronic expansion valve based on the ambient temperature, the intake temperature, the exhaust temperature, the evaporation temperature, the condensation temperature, and the liquid pipe temperature; and to determine the second superheat deviation value and the second superheat change value of the auxiliary circuit electronic expansion valve based on the ambient temperature, the auxiliary circuit inlet temperature, and the auxiliary circuit outlet temperature. The control module is used to adjust the opening of the main circuit electronic expansion valve according to the first superheat deviation value, the first superheat change value and the current subcooling value; and to adjust the opening of the auxiliary circuit electronic expansion valve according to the second superheat deviation value and the second superheat change value. Specifically, the control module is used for: Based on the first superheat deviation value and the first superheat change value, determine the first adjustment value of the main circuit electronic expansion valve; Determine the second adjustment value of the main circuit electronic expansion valve based on the current subcooling. Based on the first adjustment value and the second adjustment value, control the adjustment of the main circuit electronic expansion valve to the first opening degree; Specifically, the control module is also used for: The target adjustment value of the main circuit electronic expansion valve is determined by summing the first adjustment value and the second adjustment value; Based on the target adjustment value and the current opening degree of the main electronic expansion valve, a first control command is sent to the main electronic expansion valve to control the rotation of the main electronic expansion valve to the first opening degree; The first control command includes a first opening degree.

8. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the control method for the electronic expansion valve as described in any one of claims 1-6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When executed by the processor, the program implements the control method for the electronic expansion valve as described in any one of claims 1-6.

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