Device and method for monitoring device temperature

Abstract

The present application discloses a device and method for monitoring device temperature. The device includes: a gas release device composed of a temperature-variable sealed outer layer, a gas monitoring sensor, and a communication module. The gas release device is disposed at a temperature measuring point on the device under test, the gas monitoring sensor is disposed within the range where the gas release device releases a special gas, and the communication module is connected to the gas monitoring sensor. The gas release device is used to store the special gas and receive heat conducted from the temperature measuring point on the device under test. When the heat reaches the melting point of the material of the temperature-variable sealed outer layer, the temperature-variable sealed outer layer becomes unsealed, releasing the special gas. The melting point of the material is a preset upper limit of the operating temperature of the device under test. The gas monitoring sensor is used to monitor the special gas. When a special gas signal is detected, the special gas signal is sent to a monitoring backend via the communication module. This solves the technical problems of the existing technology, such as difficult installation and high cost.

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