Substrate processing apparatus
Patent Information
- Application Number
- CN202210184146.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2021-06-15
- Filing Date
- 2022-02-24
- Publication Date
- 2026-08-18
- Estimated Expiration
- 2042-02-24
AI Technical Summary
[0046] The length of the outer groove in the vertical direction is greater than the length of the flat section in the vertical direction. Therefore, the outer groove can smoothly supply gas to the flat section. As a result, the flat section can be easily thinned. Therefore, the protruding length of the first gas supply unit can be appropriately reduced.
Smart Images

Figure CN115050668B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a substrate processing apparatus for processing a substrate. The substrate may be, for example, a semiconductor wafer, a substrate for a liquid crystal display, a substrate for an organic EL (Electroluminescence) display, a substrate for an FPD (Flat Panel Display), a substrate for an optical display, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a magneto-optical disk, a substrate for a photomask, or a substrate for solar energy. Background Technology
[0002] Japanese Patent Application Publication No. 2009-200193 discloses a substrate processing apparatus. The substrate processing apparatus includes a processing housing and a gas supply unit. The processing housing processes the substrate inside its interior. The gas supply unit supplies gas (e.g., air) into the interior of the processing housing.
[0003] The air supply unit includes a filter, a duct, and a fan. The filter is located at the top of the processing housing. The filter blows air into the interior of the processing housing. The duct is located on the outside of the processing housing. The duct is connected to the filter. The fan is located on the outside of the processing housing. The fan is connected to the duct.
[0004] The fan is positioned above the filter. Viewed from above, the fan overlaps with the filter. The fan and filter are aligned vertically. A duct extends vertically between the filter and the fan. Summary of the Invention
[0005] [The problem the invention aims to solve]
[0006] However, the substrate processing apparatus disclosed in Japanese Patent Application Publication No. 2009-200193 has the following problems: The filter is positioned at the top of the processing housing. The fan is positioned above the filter. Therefore, the entire fan is positioned above the processing housing. Consequently, the air supply unit protrudes significantly upwards from the processing housing. In other words, the protruding length of the air supply unit extending upwards from the processing housing is relatively large.
[0007] However, by arranging multiple processing housings in the vertical direction, the footprint of the substrate processing apparatus is not increased, while the processing capacity is improved. However, when the gas supply unit protrudes significantly upwards from the processing housing, it is difficult to easily increase the number of processing housings arranged in the vertical direction. This is because the length of the substrate processing apparatus in the vertical direction becomes excessive.
[0008] The present invention was made in view of such matters, and the object is to provide a substrate processing apparatus that can reduce the protruding length of the gas supply unit extending upward from the processing housing.
[0009] [Technical means to solve the problem]
[0010] To achieve this objective, the present invention is configured as follows. Specifically, the present invention is a substrate processing apparatus comprising a first processing housing for processing a substrate inside, and a first gas supply unit for supplying gas to the interior of the first processing housing. The first gas supply unit comprises: a filter disposed on the upper part of the first processing housing to blow gas into the interior of the first processing housing; a duct disposed on the exterior of the first processing housing and connected to the filter; and a fan disposed on the exterior of the first processing housing and connected to the duct. The fan, viewed from above, is positioned at a location that does not overlap with the filter, and at least a portion of the fan is positioned at the same height as the first processing housing.
[0011] The substrate processing apparatus includes a first processing housing and a first gas supply unit. The first processing housing processes the substrate inside its interior. The first gas supply unit supplies gas into the interior of the first processing housing. The first gas supply unit includes a filter, a duct, and a fan. The filter is located at the top of the first processing housing. The filter blows gas into the interior of the first processing housing. The duct and fan are respectively located outside the first processing housing. The duct is connected to the filter. The fan is connected to the duct.
[0012] Here, the fan is positioned so as not to overlap with the filter when viewed from above. Therefore, the filter and fan are not aligned vertically. Furthermore, at least a portion of the fan is positioned at the same height as the first processing housing. Therefore, at least a portion of the fan does not protrude upwards from the first processing housing. This reduces the protruding length of the first air supply unit extending upwards from the first processing housing.
[0013] As described above, the substrate processing apparatus according to the present invention can reduce the protruding length of the first gas supply unit extending upward from the first processing housing. Hereinafter, the protruding length of the first gas supply unit extending upward from the first processing housing will be simply referred to as the "protruding length of the first gas supply unit".
[0014] In the substrate processing apparatus, preferably at least a portion of the fan is positioned lower than the filter. The fan's height is relatively low. Therefore, the protruding length of the first air supply unit is suitably reduced.
[0015] In the substrate processing apparatus, the fan is preferably positioned, when viewed from above, in a location that does not overlap with the first processing housing. The fan is not positioned above the first processing housing. Therefore, the protruding length of the first air supply unit is effectively reduced.
[0016] In the substrate processing apparatus, preferably, the protruding length of the first air supply unit extending upward from the first processing housing is less than twice the length of the filter in the vertical direction. The protruding length of the first air supply unit is sufficiently small.
[0017] In the substrate processing apparatus, the conduit preferably includes: a first horizontal portion extending substantially horizontally from the filter; a vertical portion extending downward from the first horizontal portion; and a second horizontal portion extending substantially horizontally from the vertical portion to the fan, positioned lower than the first horizontal portion. The vertical portion allows the second horizontal portion to be easily positioned lower than the first horizontal portion. The second horizontal portion also allows for easy reduction of the fan's height. Therefore, the protruding length of the first air supply unit is suitably reduced.
[0018] In the substrate processing apparatus, the first processing housing preferably includes an upper plate, the upper plate comprising: a first upper plate portion for mounting the filter; and a second upper plate portion disposed below the vertical portion and the second horizontal portion; the second upper plate portion is lower than the first upper plate portion. The lower height of the vertical portion allows for easy reduction of the vertical position. Furthermore, the height of the second horizontal portion can be easily reduced. Therefore, the height of the fan can be easily reduced. Consequently, the protruding length of the first air supply unit is appropriately reduced.
[0019] In the substrate processing apparatus, preferably a portion of the conduit overlaps with the filter in forward view. In other words, preferably a portion of the conduit is positioned at the same height as the filter. The height of the conduit is relatively low. Therefore, the protruding length of the first air supply unit is suitably reduced.
[0020] In the substrate processing apparatus, the conduit preferably includes a flat portion disposed above the filter, extending horizontally and blowing gas downwards; the length of the flat portion in the vertical direction is less than the length of the filter in the vertical direction. In other words, the flat portion is thinner than the filter. Therefore, the protruding length of the first gas supply unit is appropriately reduced.
[0021] In the substrate processing apparatus, the length of the flat portion and the filter as a whole in the vertical direction is preferably less than twice the length of the filter in the vertical direction. The height of the flat portion is relatively low. Therefore, the protruding length of the first air supply unit is appropriately reduced.
[0022] In the substrate processing apparatus, the height of the upper surface of the flat portion is preferably equivalent to the upper end of the conduit. The upper end of the conduit is relatively low. Therefore, the protruding length of the first gas supply unit is appropriately reduced.
[0023] In the substrate processing apparatus, the conduit preferably includes: an outer groove portion connected to the periphery of the flat portion for conveying gas to the flat portion; the length of the outer groove portion in the vertical direction is greater than the length of the flat portion in the vertical direction. Therefore, the outer groove portion can smoothly supply gas to the flat portion.
[0024] In the substrate processing apparatus, the outer trench portion preferably has an annular shape surrounding the flat portion when viewed from above. The outer trench portion can supply gas to the entire periphery of the flat portion.
[0025] In the substrate processing apparatus, preferably, the outer groove extends downward from the periphery of the flat portion, and at least a portion of the outer groove overlaps with the filter in a forward view. The outer groove extends downward from the periphery of the flat portion. Therefore, the height of the outer groove can be easily reduced. At least a portion of the outer groove overlaps with the filter in a forward view. Therefore, the height of the outer groove is relatively low. Therefore, the protruding length of the first air supply unit is suitably reduced.
[0026] In the substrate processing apparatus, the conduit preferably includes a baffle disposed in the outer groove portion, guiding a portion of the gas flowing through the outer groove portion to the flat portion. The baffle allows the gas to flow more smoothly from the outer groove portion to the flat portion. Therefore, the filter appropriately blows out the gas. Thus, the substrate can be properly processed inside the first processing housing.
[0027] In the substrate processing apparatus, it is preferable that the direction in which the baffle extends relative to the outer groove portion intersects. The baffle can appropriately guide a portion of the gas flowing through the outer groove portion to the flat portion.
[0028] In the substrate processing apparatus, preferably, the substrate processing apparatus includes: a transport space extending in a horizontal first direction and adjacent to the first processing housing; a transport mechanism disposed in the transport space for transporting the substrate into the interior of the first processing housing; and a piping space adjacent to the first processing housing; the first processing housing and the transport space are arranged in a horizontal second direction orthogonal to the first direction when viewed from above, the first processing housing and the piping space are arranged in the first direction, and a fan is opened toward the piping space to deliver gas from the piping space to a filter. The transport space extends in the first direction. The first processing housing and the transport space are arranged in the second direction when viewed from above. The first processing housing and the piping space are arranged in the first direction when viewed from above. Here, the second direction is orthogonal to the first direction. Therefore, the transport space and the piping space do not interfere with each other, and the transport space and the piping space are each adjacent to the first processing housing. The fan is opened toward the piping space adjacent to the first processing housing. The fan delivers gas from the piping space adjacent to the first processing housing to the filter. Therefore, the fan does not interfere with the conveying mechanism, and it can be easily positioned near the first processing housing. Consequently, the first air supply unit can be easily miniaturized.
[0029] In the substrate processing apparatus, the first processing housing preferably includes: an exhaust port formed at a position facing the piping space; and a fan disposed above the exhaust port. The fan does not interfere with the exhaust port.
[0030] In the substrate processing apparatus, preferably, the substrate processing apparatus includes: a horizontal exhaust section disposed in the piping space, connected to the exhaust port, and extending in the horizontal direction; and a vertical exhaust section disposed in the piping space, connected to the horizontal exhaust section, and extending in the vertical direction; the fan is disposed at a position higher than the horizontal exhaust section, and the fan and the vertical exhaust section are arranged in a second direction when viewed from a first direction. The fan is disposed at a position higher than the horizontal exhaust section. Therefore, the fan does not interfere with the horizontal exhaust section. The fan and the vertical exhaust section are arranged in a second direction when viewed from the first direction. In other words, the fan and the vertical exhaust section are arranged in a second direction when viewed from the front. Therefore, the fan does not interfere with the vertical exhaust section.
[0031] In the substrate processing apparatus, the vertical exhaust section preferably includes: a first vertical exhaust pipe extending in the vertical direction; and a second vertical exhaust pipe extending in the vertical direction; the horizontal exhaust section includes: a switching mechanism that switches the exhaust path of the first processing housing to one of the first vertical exhaust pipe and the second vertical exhaust pipe; the fan, the first vertical exhaust pipe, and the second vertical exhaust pipe are arranged in the second direction when viewed from the first direction. Through the switching mechanism, the first vertical exhaust pipe, and the second vertical exhaust pipe, gas can be appropriately discharged from the interior of the first processing housing. Therefore, the substrate can be appropriately processed inside the first processing housing. The fan, the first vertical exhaust pipe, and the second vertical exhaust pipe are arranged in the second direction when viewed from the first direction. In other words, the fan, the first vertical exhaust pipe, and the second vertical exhaust pipe are arranged in the second direction when viewed from the front. Therefore, the fan does not interfere with the first vertical exhaust pipe and the second vertical exhaust pipe.
[0032] In the substrate processing apparatus, it is preferable that the substrate processing apparatus includes: a pressure sensor for measuring the pressure of the gas inside the first processing housing; and a control unit for controlling the fan based on the detection result of the pressure sensor. The control unit can appropriately control the pressure of the gas inside the first processing housing. Therefore, the substrate can be appropriately processed inside the first processing housing.
[0033] The substrate processing apparatus preferably includes: an adjustment section disposed inside the first processing housing, receiving gas blown from the filter and blowing the gas downwards; and a substrate holding section disposed inside the first processing housing, positioned below the adjustment section, holding the substrate; the filter blows the gas downwards, and the adjustment section includes: an adjustment chamber positioned below the filter, extending horizontally, and larger than the filter in plan view; a guide member disposed in the adjustment chamber, guiding the gas downwards in the adjustment chamber; and a blowout plate positioned below the adjustment chamber, extending horizontally, having a plurality of blowout holes; the entire guide member is positioned outside the filter in plan view, and the entire guide member is positioned outside the substrate held in the substrate holding section in plan view.
[0034] The filter blows gas into the interior of the first processing housing. The filter blows the gas downwards. An adjustment unit is located inside the first processing housing. The adjustment unit includes an adjustment chamber. The adjustment chamber is positioned below the filter. Therefore, the adjustment unit can appropriately receive the gas blown from the filter within the adjustment chamber.
[0035] The adjusting unit includes a blower plate. The blower plate is positioned below the adjusting chamber. The blower plate extends horizontally. The blower plate has multiple blow holes. Therefore, the adjusting unit can appropriately blow gas downwards from the blower plate through the blow holes.
[0036] A substrate holding section is disposed inside the first processing housing. The substrate holding section is positioned below the adjustment section. The substrate holding section holds the substrate. Therefore, the adjustment section can appropriately supply gas to the substrate held in the substrate holding section.
[0037] The regulating chamber extends horizontally. Viewed from above, the regulating chamber is larger than the filter. The regulating chamber includes a guiding component. This guiding component is located within the regulating chamber. The guiding component guides the gas downwards within the regulating chamber. The entire guiding component is positioned outside the filter when viewed from above. Therefore, the guiding component prevents the blow-out plate from including a portion with poor blowing out. A portion with poor blowing out is a part of the blow-out plate that substantially does not blow out gas. Therefore, the blow-out plate does not include nozzles that substantially do not blow out gas. All nozzles blow out gas.
[0038] The entire guiding component, viewed from above, is positioned outside the substrate held in the substrate holding section. Here, the portion of the blow-out plate located below the guiding component is referred to as the guiding region. The airflow blowing out of the guiding region is referred to as the third blow-out flow. The guiding region, viewed from above, is positioned outside the substrate held in the substrate holding section. The third blow-out flow is relatively strong. Therefore, the third blow-out flow protects the substrate held in the substrate holding section from the influence of the atmosphere outside the third blow-out flow. Thus, the third blow-out flow keeps the substrate held in the substrate holding section clean. As a result, the substrate processing apparatus can process the substrate held in the substrate holding section with high quality.
[0039] In the substrate processing apparatus, the guiding member is preferably disposed only in the upper part of the conditioning chamber and extends in the vertical direction. The guiding member can suitably guide the gas downwards within the conditioning chamber. Furthermore, the gas flows smoothly through the lower part of the conditioning chamber without stagnation. Therefore, the gas in the conditioning chamber flows smoothly along the blow-out plate. As a result, the guiding member more suitably prevents the blow-out plate from containing defective portions.
[0040] The substrate processing apparatus preferably includes a blocking wall that seals off the side of the conditioning chamber. The blocking wall prevents gas from flowing out of the conditioning chamber through the side. Therefore, all gas inside the conditioning chamber is discharged from the blow-out plate through the blow-out holes. Thus, the blocking component prevents the blow-out plate from having poor blow-out sections.
[0041] The substrate processing apparatus preferably includes: an ejection section disposed inside the first processing housing, which ejects a processing liquid onto a substrate held in the substrate holding section; the ejection section includes a front end portion movable to an ejection position and a standby position; when the front end portion is in the standby position, the front end portion is disposed outside the substrate held in the substrate holding section in plan view; and when the front end portion is in the standby position, a guide member is disposed between the front end portion and the substrate held in the substrate holding section in plan view. When the front end portion is in the standby position, the guide member is disposed between the front end portion and the substrate held in the substrate holding section in plan view. Therefore, when the front end portion is in the standby position, the guide region is disposed between the front end portion and the substrate held in the substrate holding section in plan view. When the front end portion is in the standby position, a third blow-out stream is blown between the front end portion and the substrate held in the substrate holding section. Therefore, when the front end portion is in the standby position, the third blow-out stream protects the substrate held in the substrate holding section from the influence of the front end portion. Therefore, the third blow-out stream keeps the substrate held in the substrate holding section cleaner. As a result, the substrate processing apparatus is able to process the substrate held in the substrate holding section with good quality.
[0042] The substrate processing apparatus preferably includes: a cup disposed inside the first processing housing, arranged around the substrate holding portion, for receiving processing liquid; at least a portion of the guide member overlapping the cup in plan view. At least a portion of the guide member overlaps the cup in plan view. Therefore, at least a portion of the guide region overlaps the cup in plan view. At least a portion of the third blow-out stream is blown towards the cup. Therefore, the third blow-out stream effectively protects the substrate held in the substrate holding portion. Therefore, the third blow-out stream effectively keeps the substrate held in the substrate holding portion clean. As a result, the substrate processing apparatus can process the substrate held in the substrate holding portion with good quality.
[0043] In the substrate processing apparatus, the blow-out plate is preferably detachable from the first processing housing. This allows for easy maintenance of the blow-out plate.
[0044] In the substrate processing apparatus, the blow-out plate preferably includes: a first component; and a second component adjacent to the first component. The blow-out plate includes the first component and the second component. The first component is smaller than the entire blow-out plate. Therefore, the first component can be maintained more easily. The second component is smaller than the entire blow-out plate. Therefore, the second component can be maintained more easily. Therefore, the blow-out plate can be maintained more easily.
[0045] The present invention is a substrate processing apparatus comprising a first processing housing for processing a substrate therein, and a first gas supply unit for supplying gas to the interior of the first processing housing. The first gas supply unit comprises: a filter disposed on the upper part of the first processing housing to blow gas into the interior of the first processing housing; and a conduit disposed on the outside of the first processing housing and connected to the filter. The conduit comprises: a flat portion disposed above the filter and extending horizontally to blow gas downward; and an outer groove portion communicating with the periphery of the flat portion to transport gas to the flat portion. The length of the outer groove portion in the vertical direction is greater than the length of the flat portion in the vertical direction.
[0046] The length of the outer groove in the vertical direction is greater than the length of the flat section in the vertical direction. Therefore, the outer groove can smoothly supply gas to the flat section. As a result, the flat section can be easily thinned. Therefore, the protruding length of the first gas supply unit can be appropriately reduced. Attached Figure Description
[0047] To illustrate the invention, several methods currently considered suitable are illustrated, but the invention is not to be understood as limited to the illustrated configurations and countermeasures.
[0048] Figure 1 This is a top view showing the interior of the substrate processing apparatus according to the embodiment.
[0049] Figure 2 This is the front view of the processing block.
[0050] Figure 3 This is a left-side view showing the left-side configuration of the substrate processing apparatus.
[0051] Figure 4 It is a 3D view of the outer shell.
[0052] Figure 5 This is a top view of the casing.
[0053] Figure 6 This is a side view of the casing.
[0054] Figure 7 This is a front view of the casing.
[0055] Figure 8 This is a vertical sectional view of the outer casing.
[0056] Figure 9 This is a vertical cross-sectional view of a portion of the conduit.
[0057] Figure 10 This is a horizontal cross-sectional view of a portion of the duct.
[0058] Figure 11It is a schematic diagram showing the gas flow in the flat section and the outer groove section.
[0059] Figure 12 It is a schematic diagram showing the gas flow in the flat section and the outer groove section.
[0060] Figure 13 This is a top view showing the interior of the casing.
[0061] Figure 14 This is a control block diagram of the substrate processing device.
[0062] Figure 15 This is a front view of the processing housing in a modified implementation.
[0063] Figure 16 This is a front view of the processing housing in a modified implementation.
[0064] Figure 17 This is a top view showing the interior of the processing housing in a modified implementation.
[0065] Figure 18 This is a vertical cross-sectional view of the processing housing in a variant implementation.
[0066] Figure 19 This is a top view of the adjustment section in a modified implementation.
[0067] Figure 20 This is a top view showing the interior of the processing housing in a modified implementation.
[0068] Figure 21 This is a vertical cross-sectional view of the processing housing in a variant implementation.
[0069] Figure 22 This is a top view of the blower plate in a modified implementation. Detailed Implementation
[0070] Hereinafter, the substrate processing apparatus of the present invention will be described with reference to the accompanying drawings.
[0071] <1. Overview of the Substrate Processing Apparatus>
[0072] Figure 1 This is a top view showing the interior of the substrate processing apparatus 1 according to the embodiment. The substrate processing apparatus 1 processes a substrate (e.g., a semiconductor wafer) W.
[0073] The substrate W is, for example, a semiconductor wafer, a substrate for liquid crystal displays, a substrate for organic EL (Electroluminescence) displays, a substrate for FPD (Flat Panel Display), a substrate for optical displays, a substrate for magnetic disks, a substrate for optical disks, a substrate for magneto-optical disks, a substrate for photomasks, or a substrate for solar energy. The substrate W has a relatively thin, flat plate shape. The substrate W has a roughly circular shape when viewed from above.
[0074] The substrate processing apparatus 1 includes a transfer unit 3 and a processing block 11. The processing block 11 is connected to the transfer unit 3. The transfer unit 3 supplies a substrate W to the processing block 11. The processing block 11 processes the substrate W. The transfer unit 3 retrieves the substrate W from the processing block 11.
[0075] In this specification, for convenience, the direction in which the transport unit 3 and the processing block 11 are arranged is referred to as the "front-rear direction X". The front-rear direction X is horizontal. The direction from the processing block 11 toward the transport unit 3 in the front-rear direction X is called "front". The direction opposite to the front is called "rear". The horizontal direction orthogonal to the front-rear direction X is called the "width direction Y". One direction of the "width direction Y" is appropriately called "right". The direction opposite to the right is called "left". The direction perpendicular to the horizontal direction is called the "vertical direction Z". In each figure, front, rear, right, left, up, and down are appropriately indicated for reference.
[0076] The front-to-back direction X is an example of the first direction of the present invention. The width direction Y is an example of the second direction of the present invention.
[0077] Without specifically distinguishing between "front", "back", "right" and "left", it is referred to as "horizontal direction" or "side".
[0078] The transport section 3 includes multiple (e.g., four) carrier placement sections 4. The carrier placement sections 4 are arranged in the width direction Y. Each carrier placement section 4 holds one carrier C. The carrier C houses multiple substrates W. The carrier C is, for example, a FOUP (front opening unified pod).
[0079] The transport unit 3 has a transport space 5. The transport space 5 is located behind the carrier placement unit 4.
[0080] The transfer section 3 includes a conveying mechanism 6. The conveying mechanism 6 is disposed in the transfer space 5. The conveying mechanism 6 is located behind the carrier placement section 4. The conveying mechanism 6 conveys the substrate W. The conveying mechanism 6 can pick up the carrier C placed in the carrier placement section 4.
[0081] The structure of the conveying mechanism 6 will be described. The conveying mechanism 6 includes a hand 7 and a hand drive unit 8. The hand 7 supports a substrate W in a horizontal position. The hand drive unit 8 is connected to the hand 7. The hand drive unit 8 moves the hand 7.
[0082] The structure of the hand drive unit 8 is illustrated. The hand drive unit 8 includes a first drive unit 8a and a second drive unit 8b. The first drive unit 8a itself cannot move horizontally. The first drive unit 8a supports the second drive unit 8b. The first drive unit 8a causes the second drive unit 8b to move in the vertical direction Z. The first drive unit 8a also causes the second drive unit 8b to rotate about a rotation axis parallel to the vertical direction Z. The second drive unit 8b supports the hand 7. The second drive unit 8b causes the hand 7 to move forward and backward relative to the first drive unit 8a in the horizontal direction. The second drive unit 8b is, for example, composed of a multi-joint arm.
[0083] According to the hand drive unit 8, the hand 7 can move in the vertical direction Z. The hand 7 can move in the horizontal direction. The hand 7 can rotate in the horizontal plane.
[0084] The processing block 11 includes a transport space 12A. The transport space 12A is located at the center of the processing block 11 in the width direction Y. The transport space 12A extends in the front-rear direction X. The front part of the transport space 12A is connected to the transport space 5 of the transport unit 3.
[0085] Processing block 11 has a conveying mechanism 13A. The conveying mechanism 13A is located in the conveying space 12A. The conveying mechanism 13A conveys the substrate W.
[0086] Processing block 11 includes a substrate mounting section 16A. The substrate mounting section 16A is disposed in the transport space 12A. The substrate mounting section 16A is positioned in front of the transport mechanism 13A. The transport mechanism 13A can receive the substrate mounting section 16A. The transport mechanism 6 of the transport section 3 can also receive the substrate mounting section 16A. The substrate mounting section 16A holds the substrate W being transported between the transport mechanism 6 and the transport mechanism 13A.
[0087] Figure 2 This is a front view of processing block 11. In addition to the transport space 12A, processing block 11 also includes a transport space 12B. Transport space 12B is located below transport space 12A. In top view, transport space 12B is positioned at the same location as transport space 12A. Transport space 12B is connected to the transport space 5 of the transfer unit 3.
[0088] The processing block 11 includes a partition 17. The partition 17 is positioned below the transport space 12A and above the transport space 12B. The partition 17 has a horizontal plate shape. The partition 17 separates the transport space 12A from the transport space 12B.
[0089] In addition to the conveying mechanism 13A, the processing block 11 also includes a conveying mechanism 13B. The conveying mechanism 13B is disposed in the conveying space 12B. The conveying mechanism 13B is disposed below the conveying mechanism 13A. The conveying mechanism 13B conveys the substrate W.
[0090] Although not shown in the figure, the processing block 11 has a substrate placement section provided in the transfer space 12B. Therefore, the transfer mechanism 6 and the transfer mechanism 13B can exchange substrates W with each other.
[0091] The conveying mechanisms 13A and 13B have the same structure. Without distinguishing between the conveying mechanisms 13A and 13B, they are appropriately referred to as conveying mechanism 13.
[0092] Without distinguishing between transport spaces 12A and 12B, it is appropriate to refer to it as transport space 12.
[0093] The structure of the conveying mechanism 13 will be described. The conveying mechanism 13 includes a hand 14 and a hand drive unit 15. The hand 14 supports a substrate W in a horizontal position. The hand drive unit 15 is connected to the hand 14. The hand drive unit 15 moves the hand 14. The hand drive unit 15 moves the hand 14 in the front-back direction (X), the width direction (Y), and the vertical direction (Z).
[0094] The structure of the hand-operated unit 15 is illustrated. The hand-operated unit 15 includes, for example, two support columns 15a, a vertical moving part 15b, a horizontal moving part 15c, a rotating part 15d, and a forward / backward moving part 15e. The support columns 15a are fixedly installed. The support columns 15a are disposed on the side of the transport space 12. The two support columns 15a are arranged in the front-rear direction X. Each support column 15a extends in the vertical direction Z. Each support column 15a supports the vertical moving part 15b. The vertical moving part 15b extends in the front-rear direction X, spanning between the two support columns 15a. The vertical moving part 15b moves parallel to the support columns 15a in the vertical direction Z. The vertical moving part 15b supports the horizontal moving part 15c. The horizontal moving part 15c moves parallel to the vertical moving part 15b in the front-rear direction X. The horizontal moving part 15c supports the rotating part 15d. The rotating part 15d rotates relative to the horizontal moving part 15c. The rotating part 15d rotates about a rotation axis parallel to the vertical direction Z. The rotating part 15d supports the retractable moving part 15e. The retractable moving part 15e supports the hand 14. The retractable moving part 15e causes the hand 14 to move forward and backward relative to the rotating part 15d. The retractable moving part 15e causes the hand 14 to move forward and backward relative to the rotating part 15d. The retractable moving part 15e causes the hand 14 to reciprocate in a horizontal direction determined by the direction of the rotating part 15d.
[0095] According to the hand drive unit 15, the hand 14 can move parallel in the vertical direction Z. The hand 14 can move parallel in the forward and backward direction X. The hand 14 can rotate in the horizontal plane. The hand 14 can move forward and backward relative to the rotating unit 15d.
[0096] Processing block 11 includes processing towers 21A, 21B, 21C, and 21D. Processing towers 21A and 21B are located on the left side of the transport space 12. Processing towers 21A and 21B are arranged in the front-back direction X. Processing towers 21C and 21D are located on the right side of the transport space 12. Processing towers 21C and 21D are arranged in the front-back direction X.
[0097] Processing block 11 includes piping spaces 51A, 51B, 51C, and 51D. Piping spaces 51A and 51B are located to the left of conveying space 12. Piping space 51A is adjacent to processing tower 21A. Piping space 51B is adjacent to processing tower 21B. Piping spaces 51C and 51D are located to the right of conveying space 12. Piping space 51C is adjacent to processing tower 21C. Piping space 51D is adjacent to processing tower 21D. Piping spaces 51A-51D are separated from conveying space 12.
[0098] Figure 3 This is a left-side view showing the left-side configuration of the substrate processing apparatus 1. The processing tower 21A has multiple (e.g., 6) processing housings 22. All processing housings 22 belonging to the processing tower 21A are arranged in a row in the vertical direction Z. The processing housings 22 belonging to the processing tower 21A are stacked on top of each other.
[0099] The piping space 51A extends in the vertical direction Z. The piping space 51A is adjacent to each processing shell 22 belonging to the processing tower 21A.
[0100] The piping space 51A opens to the outside of the substrate processing apparatus 1. For example, the processing block 11 has an opening 52 formed in the upper part of the piping space 51A. The piping space 51A communicates with the outside of the substrate processing apparatus 1 through the opening 52.
[0101] refer to Figure 2 Each processing casing 22 belonging to processing tower 21A is adjacent to the transport space 12. A portion of the processing casings 22 belonging to processing tower 21A are adjacent to the transport space 12A. The other processing casings 22 belonging to processing tower 21A are adjacent to the transport space 12B.
[0102] refer to Figure 1-3 Processing tower 21B has multiple (e.g., six) processing enclosures 22. The processing enclosures 22 belonging to processing tower 21B are arranged in the same manner as the processing enclosures 22 belonging to processing tower 21A. The piping space 51B is constructed in the same manner as the piping space 51A. Therefore, each processing enclosure 22 belonging to processing tower 21B is adjacent to the piping space 51B. Each processing enclosure 22 belonging to processing tower 21B is adjacent to the conveying space 12.
[0103] Processing towers 21C and 21D each have multiple (e.g., six) processing enclosures 22. The processing enclosures 22 belonging to processing towers 21C and 21D are each configured in the same manner as the processing enclosures 22 belonging to processing tower 21A. Piping spaces 51C and 51D are each configured in the same manner as piping space 51A. Therefore, each processing enclosure 22 belonging to processing tower 21C is adjacent to piping space 51C. Each processing enclosure 22 belonging to processing tower 21C is adjacent to conveying space 12. Each processing enclosure 22 belonging to processing tower 21D is adjacent to piping space 51D. Each processing enclosure 22 belonging to processing tower 21D is adjacent to conveying space 12.
[0104] The transfer mechanism 13 transfers the substrate W to all the processing housings 22 belonging to the processing towers 21A-21D. Specifically, the transfer mechanism 13A transfers the substrate W to the processing housing 22 adjacent to the transfer space 12A. The transfer mechanism 13B transfers the substrate W to the processing housing 22 adjacent to the transfer space 12B.
[0105] refer to Figure 1 The processing housing 22 and the transport space 12 are arranged in the width direction Y when viewed from above. For example, the processing housing 22 and the transport space 12 belonging to processing tower 21A are arranged in the width direction Y when viewed from above. For example, the processing housing 22 and the transport space 12 belonging to processing tower 21C are arranged in the width direction Y when viewed from above.
[0106] Without distinguishing between piping spaces 51A-51D, it is appropriately referred to as piping space 51. The processing housing 22 and the piping space 51 are arranged in the front-rear direction X when viewed from above. For example, the processing housing 22 belonging to processing tower 21A and the piping space 51A adjacent to processing tower 21A are arranged in the front-rear direction X when viewed from above. For example, the processing housing 22 belonging to processing tower 21C and the piping space 51C adjacent to processing tower 21C are arranged in the front-rear direction X when viewed from above.
[0107] One processing housing 22 is an example of the first processing housing of the present invention.
[0108] <2. Processing the internal structure of the outer casing 22>
[0109] refer to Figure 1 The processing housings 22 belonging to processing towers 21A-21D have the same structure. The processing housing 22 processes the substrate W inside itself. The processing housing 22 divides its interior into processing spaces for processing the substrate W. The substrate processing apparatus 1 includes a substrate holding section 26 and an ejection section 27. The substrate holding section 26 is disposed inside the processing housing 22. The substrate holding section 26 holds the substrate W. The ejection section 27 is disposed inside the processing housing 22. The ejection section 27 ejects processing liquid onto the substrate W held in the substrate holding section 26.
[0110] Figure 4 This is a 3D view of the outer casing 22. Figure 5 This is a top view of the outer casing 22. Figure 6 This is a side view of the housing 22. Figure 6 This is a diagram of the processed outer casing 22 viewed from the width direction Y. Figure 7 This is a front view of the housing 22. Figure 7 This is a view of the processing housing 22 as seen from the front-rear X direction. The processing housing 22 has a roughly box-shaped form.
[0111] The processing housing 22 has a transfer port 25. The transfer port 25 is located adjacent to the transfer space 12. The transfer port 25 faces the transfer space 12. The substrate W can pass through the transfer port 25. The transfer mechanism 13 transfers the substrate W into the interior of the processing housing 22. The transfer mechanism 13 transfers the substrate W to the substrate holding section 26 through the transfer port 25.
[0112] Figure 8 This is a vertical sectional view of the outer casing. Figure 8 For simplicity, the illustration of the ejection section 27 is omitted. The substrate holding section 26 holds a substrate W in a horizontal position.
[0113] The substrate processing apparatus 1 includes a rotation drive unit 28. The rotation drive unit 28 is disposed inside the processing housing 22. The rotation drive unit 28 is connected to the substrate holding unit 26. The rotation drive unit 28 rotates the substrate holding unit 26. The substrate W held in the substrate holding unit 26 rotates integrally with the substrate holding unit 26.
[0114] The substrate processing apparatus 1 includes a cup 29. The cup 29 is disposed inside the processing housing 22. The cup 29 has a generally cylindrical shape. The cup 29 is arranged around the substrate holding portion 26. The cup 29 catches the processing liquid that spills from the substrate W held in the substrate holding portion 26.
[0115] The processing housing 22 has an upper plate 24. The upper plate 24 is disposed on the upper part of the processing housing 22. The upper plate 24 extends in a generally horizontal direction.
[0116] The upper plate 24 has a downwardly recessed space S. Specifically, the upper plate 24 has a first upper plate portion 24a and a second upper plate portion 24b. The second upper plate portion 24b is lower than the first upper plate portion 24a. The second upper plate portion 24b is disposed at a height lower than the first upper plate portion 24a in the vertical direction Z. The first upper plate portion 24a is disposed above the substrate holding portion 26. The second upper plate portion 24b is disposed near the piping space 51. The recessed space S is located above the second upper plate portion 24b.
[0117] <3. Composition of the gas supply unit>
[0118] refer to Figure 2 , 3 The substrate processing apparatus 1 includes multiple (e.g., 24) gas supply units 30. The gas supply units 30 supply gas (e.g., air) to the interior of the processing housing 22.
[0119] One gas supply unit 30 is provided relative to each processing housing 22. Each gas supply unit 30 supplies gas to only one processing housing 22. Each gas supply unit 30 does not supply gas to more than one processing housing 22.
[0120] One gas supply unit 30 is an example of the first gas supply unit of the present invention.
[0121] Figure 8 For simplicity, the overall diagram of the air supply unit 30 is shown. The air supply unit 30 includes a filter 31, a duct 32, and a fan 41. The filter 31 is located on the upper part of the processing housing 22. The filter 31 blows air into the interior of the processing housing 22. The duct 32 is located on the exterior of the processing housing 22. The duct 32 is connected to the filter 31. The fan 41 is located on the exterior of the processing housing 22. The fan 41 is connected to the duct 32.
[0122] A filter 31 is disposed on the upper plate 24. The filter 31 is disposed on the first upper plate portion 24a. The filter 31 is positioned above the substrate holding portion 26.
[0123] Fan 41 delivers gas. Gas flows from fan 41 through duct 32 to filter 31. One fan 41 delivers gas to only one filter 31. Filter 31 filters the gas. Filter 31 blows out the filtered gas. Filter 31 is, for example, an ULPA (Ultra Low Penetration Air) filter. Gas flows from filter 31 into the interior of processing housing 22. One fan 41 delivers gas to only one processing housing 22. The airflow of one fan 41 is equivalent to the gas supply to one processing housing 22.
[0124] Fan 41 delivers gas horizontally. Filter 31 blows gas downwards. Figure 8 This diagram schematically illustrates the airflow delivered by fan 41 and the airflow blown out by filter 31. The airflow direction of fan 41 is different from the airflow direction of filter 31. For example, the airflow direction of fan 41 is orthogonal to the airflow direction of filter 31.
[0125] The gas blown out from the filter 31 reaches the substrate holding portion 26. The downward flowing airflow (downflow) forms around the substrate W held in the substrate holding portion 26.
[0126] This describes the configuration of the housing 22, filter 31, duct 32, and fan 41.
[0127] At least a portion of the filter 31 is positioned higher than the processing housing 22. For example, the entire filter 31 is positioned higher than the processing housing 22. For example, the entire filter 31 is positioned above the processing housing 22.
[0128] A portion of the conduit 32 is positioned higher than the processing housing 22. The remaining portions of the conduit 32 are positioned at the same height as the processing housing 22. Specifically, the processing housing 22 has an upper end 23t and a lower end 23b. For example, the height of the upper plate 24 corresponds to the upper end 23t. For example, the height of the first upper plate portion 24a corresponds to the upper end 23t. A portion of the conduit 32 is positioned higher than the upper end 23t. The remaining portions of the conduit 32 are positioned at a height equal to or lower than the upper end 23t, and equal to or higher than the lower end 23b. The entire conduit 32 is positioned at a height equal to or higher than the lower end 23b.
[0129] At least a portion of the conduit 32 is disposed above the processing housing 22. The conduit 32 is disposed close to the upper plate 24. The conduit 32 extends along the upper plate 24.
[0130] The conduit 32 extends from the filter 31 to a position lower than the filter 31. Specifically, the conduit 32 has a portion disposed at a position higher than the filter 31 and a portion disposed at a position lower than the filter 31. Therefore, the conduit 32 extends from a position higher than the filter 31 to a position lower than the filter 31.
[0131] The conduit 32 has a portion positioned above the filter 31. The conduit 32 covers the top of the filter 31. The conduit 32 extends from the filter 31 in a generally horizontal direction. The conduit 32 extends from the filter 31 into the piping space 51.
[0132] At least a portion of the fan 41 is positioned at the same height as the processing housing 22. At least a portion of the fan 41 is positioned at a height equal to or lower than the upper end 23t and equal to or higher than the lower end 23b.
[0133] The entire fan 41 is positioned higher than the lower end 23b.
[0134] The fan 41 includes a portion positioned higher than the processing housing 22. Therefore, the fan 41 extends from a position higher than the upper end 23t to a position lower than the upper end 23t.
[0135] The fan 41 has a portion positioned lower than the second upper plate 24b. Therefore, the fan 41 extends from a position higher than the first upper plate 24a to a position lower than the second upper plate 24b.
[0136] Fan 41 is positioned on the side of the processing housing 22. Fan 41 is not positioned on top of the processing housing 22.
[0137] At least a portion of the fan 41 is positioned lower than the filter 31. At least a portion of the fan 41 is positioned at a lower height than the filter 31 in the vertical direction Z.
[0138] The fan 41 includes a portion positioned higher than the filter 31. Therefore, the fan 41 extends from a position higher than the filter 31 to a position lower than the filter 31.
[0139] Fan 41 is positioned to the side of filter 31. Fan 41 is not positioned above filter 31. Filter 31 and fan 41 are not aligned in the vertical direction Z.
[0140] At least a portion of the fan 41 is positioned at the same height as or lower than the duct 32. Specifically, the duct 32 has an upper end 32t. At least a portion of the fan 41 is positioned at the same height as or lower than the upper end 32t.
[0141] In this embodiment, the entire fan 41 is positioned lower than the upper end 32t. Therefore, the upper end 32t corresponds to the upper end of the air supply unit 30.
[0142] Figure 5 The filter 31 is indicated by a dashed line. The filter 31 has a roughly rectangular shape when viewed from above. The entire filter 31 overlaps with the processing housing 22 when viewed from above.
[0143] Most of the conduit 32 overlaps with the processing housing 22 in top view. The remaining portion of the conduit 32 does not overlap with the processing housing 22 in top view. The remaining portion of the conduit 32 is disposed in the piping space 51.
[0144] The conduit 32 overlaps with the entire filter 31 when viewed from above.
[0145] The fan 41 is positioned in a location that does not overlap with the processing housing 22 when viewed from above. The fan 41 does not have any portion that overlaps with the processing housing 22 when viewed from above.
[0146] The fan 41 is positioned in a top view that does not overlap with the filter 31. The fan 41 does not have any portion overlapping with the filter 31 when viewed from above.
[0147] Fan 41 is configured in piping space 51. For example, the entire fan 41 is configured in piping space 51.
[0148] Fan 41 is turned on towards piping space 51. Fan 41 extracts gas from piping space 51. Fan 41 delivers the gas from piping space 51 to filter 31.
[0149] Figure 6 A portion of filter 31 is shown in dashed lines. A portion of duct 32 overlaps with filter 31 when viewed from the side of housing 22. Fan 41 does not overlap with housing 22 when viewed from the side of housing 22. In this specification, "side view" means the same as "viewed from the width direction Y".
[0150] Figure 7 A portion of the processing housing 22 is indicated by a dashed line. A portion of the duct 32 overlaps with the filter 31 when viewed from the front of the processing housing 22. At least a portion of the fan 41 overlaps with the processing housing 22 when viewed from the front of the processing housing 22. In this specification, "front view" means the same as "viewed from the front-rear X direction".
[0151] <4. Detailed Composition of Filter 31 and Conduit 32>
[0152] refer to Figure 8 Filter 31 extends horizontally. Filter 31 has a flat shape. Figure 8 This indicates the length L1 of the filter 31 in the vertical direction. The length L1 of the filter 31 in the vertical direction Z is shorter than the length of the filter 31 in the horizontal direction.
[0153] The filter 31 has an upper surface 31a and a lower surface 31b. Both the upper surface 31a and the lower surface 31b are approximately horizontal. The filter 31 draws gas from the upper surface 31a. The filter 31 releases gas from the lower surface 31b. The lower surface 31b corresponds to the outlet surface of the filter 31.
[0154] The upper surface 31a of the filter 31 is positioned higher than the processing housing 22. The lower surface 31b of the filter 31 is positioned at approximately the same height as the first upper plate portion 24a.
[0155] refer to Figure 4 , 6 The conduit 32 includes a first horizontal portion 33, a vertical portion 38, and a second horizontal portion 39. The first horizontal portion 33 extends horizontally from the filter 31. The vertical portion 38 extends downward from the first horizontal portion 33. The second horizontal portion 39 extends horizontally from the vertical portion 38 to the fan 41. At least a portion of the second horizontal portion 39 is positioned lower than the first horizontal portion 33. At least a portion of the second horizontal portion 39 is positioned at a height lower than the first horizontal portion 33 in the vertical direction Z. For example, the entire second horizontal portion 39 is positioned lower than the first horizontal portion 33.
[0156] refer to Figure 5The entire first horizontal portion 33 overlaps with the processing housing 22 when viewed from above. The entire vertical portion 38 overlaps with the processing housing 22 when viewed from above. The second horizontal portion 39 has a portion that overlaps with the processing housing 22 when viewed from above, and a portion that does not overlap with the processing housing 22.
[0157] The first horizontal portion 33 overlaps with the entire filter 31 when viewed from above. The vertical portion 38 does not overlap with the filter 31 when viewed from above. The second horizontal portion 39 does not overlap with the filter 31 when viewed from above.
[0158] The first horizontal portion 33 has a flat portion 34. The flat portion 34 has a peripheral portion 35. The flat portion 34 has a generally rectangular shape when viewed from above.
[0159] The flat portion 34 overlaps with the entire filter 31 when viewed from above. The flat portion 34 has approximately the same size as the filter 31 when viewed from above. The flat portion 34 is slightly larger than the filter 31 when viewed from above.
[0160] The first horizontal portion 33 includes an outer groove portion 36. The outer groove portion 36, viewed from above, is disposed around the flat portion 34. The outer groove portion 36, viewed from above, has an annular shape surrounding the flat portion 34. The outer groove portion 36 is connected to the peripheral edge portion 35 of the flat portion 34. Specifically, the outer groove portion 36 is connected to the peripheral edge portion 35 of the flat portion 34. The outer groove portion 36 is connected to the entire peripheral edge portion 35 of the flat portion 34. The outer groove portion 36 is connected to the entire circumference of the peripheral edge portion 35 of the flat portion 34.
[0161] The outer groove 36 has an annular shape surrounding the filter 31 when viewed from above. The outer groove 36 does not overlap with the filter 31 when viewed from above.
[0162] Furthermore, the outer groove 36 extends from a portion of the peripheral edge 35 of the flat portion 34 to the vertical portion 38. The flat portion 34 is indirectly connected to the vertical portion 38 via the outer groove 36. The vertical portion 38 delivers gas to the outer groove 36. The outer groove 36 delivers gas to the flat portion 34. The flat portion 34 blows gas downwards. The flat portion 34 supplies gas to the filter 31.
[0163] refer to Figure 8 A first horizontal portion 33 is disposed above the first upper plate portion 24a. The first horizontal portion 33 extends along the first upper plate portion 24a. A vertical portion 38 is disposed above the second upper plate portion 24b. The vertical portion 38 extends to a position lower than the first upper plate portion 24a. A second horizontal portion 39 is disposed above the second upper plate portion 24b. At least a portion of the second horizontal portion 39 is disposed at a position lower than the first upper plate portion 24a. The vertical portion 38 and the second horizontal portion 39 are respectively disposed in the recessed space S. The second horizontal portion 39 extends along the second upper plate portion 24b. The second horizontal portion 39 extends to the piping space 51.
[0164] The first horizontal section 33 includes the upper end 32t of the conduit 32.
[0165] The flat portion 34 extends horizontally. The flat portion 34 is positioned above the filter 31. The flat portion 34 covers the top of the filter 31. The flat portion 34 is positioned close to the filter 31. The flat portion 34 blows gas downwards.
[0166] As mentioned above, Figure 8 L1 represents the length of filter 31 in the vertical direction Z. Figure 8 It also indicates the overall length L2 of the flat portion 34 and filter 31 in the vertical direction Z. Length L2 is greater than length L1. Length L2 is less than twice the length L1.
[0167] The outer groove portion 36 extends downward from the flat portion 34. The outer groove portion 36 extends to a position lower than the upper surface 31a of the filter 31. The entire outer groove portion 36 is positioned higher than the lower surface 31b of the filter 31. The outer groove portion 36 is positioned close to the side of the filter 31.
[0168] The outer groove portion 36 does not extend upward from the flat portion 34. The outer groove portion 36 does not extend to a position higher than the flat portion 34. The entire outer groove portion 36 is positioned at the same or lower height as the flat portion 34.
[0169] Figure 6 The first horizontal portion 33 corresponds to the outer groove portion 36. The outer groove portion 36 extends in a generally horizontal direction. At least a portion of the outer groove portion 36 overlaps with the filter 31 when the processing housing 22 is viewed from the side.
[0170] Figure 7 The first horizontal portion 33 corresponds to the outer groove portion 36. At least a portion of the outer groove portion 36 overlaps with the filter 31 when viewed from the front of the processing housing 22.
[0171] Figure 9 This is a vertical sectional view of a portion of the conduit 32. The flat portion 34 has an upper surface 34a. The height of the upper surface 34a corresponds to the upper end 32t of the conduit 32. The height of the upper surface 34a corresponds to the upper end of the air supply unit 30.
[0172] The flat portion 34 has a lower surface 34b and an opening 34c. The lower surface 34b and the opening 34c are disposed below the upper surface 34a. The opening 34c is formed on the lower surface 34b. The opening 34c covers most of the lower surface 34b. The position of the lower surface 34b corresponds to the position of the peripheral portion 35 of the flat portion 34.
[0173] The opening 34c, viewed from above, has approximately the same size as the filter 31. The opening 34c is positioned above the upper surface 31a of the filter 31. The opening 34c is positioned close to the upper surface 31a of the filter 31. Gas is blown out of the flat portion 34 through the opening 34c. The flat portion 34 supplies gas to the filter 31 through the opening 34c.
[0174] The outer groove 36 extends downward from the periphery 35 of the flat portion 34.
[0175] Figure 9 This represents the length L3 of the flat portion 34 in the vertical direction Z. Length L3 is less than length L1. Figure 9 L4 represents the length of the outer groove 36 in the vertical direction Z. Length L4 is greater than length L3.
[0176] Figure 10 This is a horizontal sectional view of a portion of the conduit 32. The peripheral portion 35 includes a first side 35a, a second side 35b, a third side 35c, and a fourth side 35d. The outer groove portion 36 includes a first part 36a, a second part 36b, a third part 36c, and a fourth part 36d. The first part 36a is connected to the first side 35a. The first part 36a extends along the first side 35a. Similarly, the second to fourth parts 36b-36d are respectively connected to the second to fourth sides 35b-35d. The second to fourth parts 36b-36d extend along the second to fourth sides 35b-36d. The first to fourth parts 36a-36d are connected in a ring.
[0177] Part 1 36a and Part 2 36b extend to the vertical portion 38. Part 1 36a and Part 2 36b are close to the vertical portion 38. Part 3 36c and Part 4 36d are far from the vertical portion 38. Part 3 36c is narrower than Part 1 36a and Part 2 36b when viewed from above. Part 4 36d is narrower than Part 1 36a and Part 2 36b when viewed from above.
[0178] The conduit 32 has one or more baffles 37. The baffles 37 are also called barrier plates. The baffles 37 are provided in the outer groove 36. The baffles 37 guide a portion of the gas flowing through the outer groove 36 to the flat section 34.
[0179] The direction in which the baffle 37 extends relative to the outer groove 36 is intersecting. The direction in which the baffle 37 extends relative to the outer groove 36 is orthogonal, for example. The baffle 37 has, for example, a generally vertical plate shape.
[0180] The baffle 37 narrows the flow path of the outer groove 36. The baffle 37 only blocks a portion of the flow path of the outer groove 36. For example, the baffle 37 is only disposed at the lower part of the outer groove 36.
[0181] In this embodiment, the conduit 32 includes three baffles 37. Each baffle 37 is referred to as baffle 37a, 37b, and 37c. Baffle 37a is located in the second portion 36b. Baffle 37b is located in the third portion 36c. Viewed from above, baffle 37b is positioned at the center of the third portion 36c in the direction it extends. Baffle 37c is located in the fourth portion 36d. Viewed from above, baffle 37c is positioned at the center of the fourth portion 36d in the direction it extends.
[0182] The effect of the baffle 37 will be explained. The inventors simulated the gas flow in the flat portion 34 and the outer groove portion 36. Figure 11 , 12 It is a diagram that schematically represents the simulation results. Figure 11 , 12 The gas flow in the flat section 34 and the outer groove section 36 are schematically shown respectively.
[0183] Figure 11 This represents the simulation results when the conduit 32 does not have the baffle 37. Without the baffle 37, the gas tends to swirl easily in the flat section 34.
[0184] Specifically, without the baffle 37, the gas tends to flow in the direction extending from the outer groove 36. Without the baffle 37, the gas does not easily flow from the outer groove 36 to the flattened portion 34. For example, the amount of gas flowing from the first part 36a to the fourth part 36d is relatively large. In other words, the amount of gas flowing from the first part 36a to the first side 35a is relatively small. The amount of gas flowing from the second part 36b to the third part 36c is relatively large. In other words, the amount of gas flowing from the second part 36b to the second side 35b is relatively small. The part connecting the third part 36c and the fourth part 36d is called the "connecting part J". The amount of gas flowing from the third part 36c to the connecting part J is relatively large. The amount of gas flowing from the fourth part 36d to the connecting part J is relatively large. After colliding with the connecting part J and being bounced back, the gas flows to the flattened portion 34. Therefore, the amount of gas flowing from the connecting part J to the third side 35c and the fourth side 35d of the flat part 34 is relatively large. The portion of the flat part 34 near the connecting part J is called the "deep part K". Gas vortices are easily generated in the deep part K. Gas vortices are easily generated in the deep part K. In the region of gas vortices, most of the gas flows roughly horizontally, and less gas flows downward. As a result, in the region where gas vortices are generated, the amount or velocity of the downward flowing gas is significantly reduced. The gas blown out of the flat part 34 is significantly unevenly distributed throughout the flat part 34. In the region where gas vortices are generated, the amount or velocity of the gas flowing from the flat part 34 to the filter 31 is significantly reduced. The gas flowing from the flat part 34 to the filter 31 is significantly unevenly distributed throughout the flat part 34.
[0185] Figure 12 This represents the simulation results when the conduit 32 is equipped with baffle 37. When the conduit 32 is equipped with baffle 37, the gas is less likely to vortex in the flat section 34.
[0186] Specifically, with the baffle 37 in place, gas easily flows from the outer groove 36 to the flattened portion 34. With the baffle 37 in place, gas does not easily flow in the direction extending from the outer groove 36. For example, baffle 37a increases the amount of gas flowing from the second part 36b to the second side 35b. Baffle 37a decreases the amount of gas flowing from the second part 36b to the third part 36c. Baffle 37b increases the amount of gas flowing from the third part 36c to the third side 35c. Baffle 37b decreases the amount of gas flowing from the third part 36c to the connecting portion J. Baffle 37c increases the amount of gas flowing from the fourth part 36d to the fourth side 35d. Baffle 37c decreases the amount of gas flowing from the fourth part 36d to the connecting portion J. As a result, the amount of gas flowing from the connecting portion J to the flattened portion 34 decreases. Gas vortices are less likely to form in the deep portion K. In the portion of the flat section 34 outside the deep section K, gas vortices are not easily generated. In other words, gas vortices are not easily generated throughout the flat section 34. As a result, the gas is blown out of the flat section 34 substantially uniformly throughout the entire flat section 34. The gas flows from the flat section 34 to the filter 31 in a substantially uniform manner throughout the entire flat section 34.
[0187] The inventors also simulated the air velocity distribution in the outlet surface of the filter 31. The outlet surface of the filter 31 is the lower surface 31b. The simulation results when the duct 32 does not have the baffle 37 are shown below.
[0188] The average velocity Va1 of the gas blown out of the surface is 0.18 m / s.
[0189] The maximum gas velocity Vmax1: 0.194 m / s
[0190] Minimum gas velocity Vmin1: 0.153 m / s
[0191] Velocity uniformity U1: 23%
[0192] Here, the velocity uniformity U1 is the value of the difference between the maximum velocity Vmax1 and the minimum velocity Vmin1 divided by the average velocity Va1.
[0193] U1=(Vmax1-Vmin1) / Va1*100
[0194] Although the diagram is omitted, the portion of filter 31 located directly below the deep section K is referred to as "deep section F". The gas velocity in deep section F is significantly lower than the average velocity Va1. The gas velocity in deep section F is close to the minimum velocity Vmin1.
[0195] The simulation results of the conduit 32 with baffle 37 are shown below.
[0196] The average velocity Va2 of the gas blowing out of the surface is 0.18 m / s.
[0197] The maximum gas velocity Vmax2: 0.190 m / s
[0198] Minimum gas velocity Vmin2: 0.176 m / s
[0199] Velocity uniformity U2: 8%
[0200] Here, the velocity uniformity U2 is the value of the difference between the maximum velocity Vmax2 and the minimum velocity Vmin2 divided by the average velocity Va2.
[0201] U2=(Vmax2-Vmin2) / Va2*100
[0202] Thus, the air velocity in the outlet surface of the filter 31 is effectively uniformized by the baffle 37. The baffle 37 improves the uniformity of the air velocity in the outlet surface of the filter 31. As a result, the filter 31 blows gas out of its outlet surface in a substantially uniform manner.
[0203] refer to Figure 8 In this embodiment, no rectifier is provided below the filter 31 and above the substrate holding portion 26. A rectifier is a component that adjusts the gas flow. For example, a rectifier is a plate with multiple small holes. Therefore, during the gas flow from the filter 31 to the substrate holding portion 26, the gas flow path is not reduced to an area smaller than the outlet surface of the filter 31. In other words, the gas flow path is not reduced to an area smaller than the outlet surface of the filter 31, and the gas reaches the substrate holding portion 26 from the filter 31.
[0204] <5. Protruding length of the gas supply unit>
[0205] Figure 6 The protruding length L5 of the air supply unit 30 extending upward from the processing housing 22 is indicated. In this specification, the protruding length L5 of the air supply unit 30 extending upward from the processing housing 22 is appropriately referred to as "the protruding length L5 of the air supply unit 30". The protruding length L5 of the air supply unit 30 is less than twice the length L1 of the filter 31 in the vertical direction Z.
[0206] The protruding length L5 of the air supply unit 30 is defined, for example, as follows. The protruding length L5 of the air supply unit 30 is the distance between the upper end of the overlapping portion in the vertical direction Z and the upper end 23t of the processing housing 22. Here, the "overlapping portion" refers to the portion of the air supply unit 30 that overlaps with the processing housing 22 when viewed from above.
[0207] In this embodiment, the overlapping portion of the air supply unit 30 includes the entire filter 31 and a portion of the conduit 32. The overlapping portion of the air supply unit 30 does not include the fan 41. This is because the fan 41 does not overlap with the processing housing 22 when viewed from above. Therefore, the fan 41 is not a factor contributing to the protrusion length L5. The upper end of the overlapping portion of the air supply unit 30 corresponds to the upper end 32t of the conduit 32. Therefore, the protrusion length L5 of the air supply unit 30 is the distance between the upper end 32t and the upper end 23t in the vertical direction Z.
[0208] The lower of the two adjacent processing housings 22 in the vertical Z direction is referred to as "first processing housing 22A", and the upper processing housing 22 is referred to as "second processing housing 22B". The gas supply unit 30 that supplies gas to the interior of the first processing housing 22A is referred to as "first gas supply unit 30A". In this case, the second processing housing 22B is disposed above the conduit 32 of the first gas supply unit 30A. The second processing housing 22B is disposed close to the conduit 32 of the first gas supply unit 30A.
[0209] The fan 41 of the first air supply unit 30A does not overlap with the second processing housing 22B when viewed from above. Therefore, the fan 41 of the first air supply unit 30A will not interfere with the second processing housing 22B.
[0210] <6. Exhaust configuration of casing 22>
[0211] refer to Figure 7 The processing housing 22 has an exhaust port 53. The exhaust port 53 is formed facing the piping space 51. The exhaust port 53 is formed on the portion of the processing housing 22 that connects to the piping space 51. Internal gases of the processing housing 22 are discharged to the outside of the processing housing 22 through the exhaust port 53. The exhaust port 53 is positioned at the same height as the processing housing 22. The entire exhaust port 53 is positioned at a height equal to or lower than the upper end 23t, and equal to or higher than the lower end 23b. The exhaust port 53 is positioned at a height close to the lower end 23b. The exhaust port 53 is located at the lower part of the processing housing 22.
[0212] The exhaust port 53 is located below the fan 41. The fan 41 and the exhaust port 53 are aligned in the vertical direction Z when the housing 22 is viewed from the side.
[0213] The fan 41 and the exhaust port 53 are respectively positioned near the transport space 12.
[0214] refer to Figure 2 , 4-6. The substrate processing apparatus 1 includes a plurality of (e.g., 24) horizontal exhaust sections 55. One horizontal exhaust section 55 is provided for each processing housing 22. The horizontal exhaust section 55 is disposed in the piping space 51. The horizontal exhaust section 55 is connected to an exhaust port 53. The horizontal exhaust section 55 extends horizontally. The horizontal exhaust section 55 is positioned at the same height as the processing housing 22. The entire horizontal exhaust section 55 is positioned at a height equal to or lower than the upper end 23t and equal to or higher than the lower end 23b. The horizontal exhaust section 55 is positioned at a height close to the lower end 23b.
[0215] The horizontal exhaust section 55 is positioned lower than the fan 41. The horizontal exhaust section 55 is positioned at a lower height than the fan 41 in the vertical direction Z. A portion of the horizontal exhaust section 55 is positioned close to the transport space 12. A portion of the horizontal exhaust section 55 is positioned below the fan 41. A portion of the horizontal exhaust section 55 overlaps with the fan 41 when viewed from above.
[0216] refer to Figure 6 As described above, the fan 41 of the first air supply unit 30A is positioned lower than the upper end 32t of the duct 32 of the first air supply unit 30A. The second processing housing 22B is positioned above the duct 32 of the first air supply unit 30A. Therefore, the fan 41 of the first air supply unit 30A is positioned lower than the second processing housing 22B.
[0217] The horizontal exhaust section 55 connected to the second processing housing 22B is referred to as the "second horizontal exhaust section 55B". The entire second horizontal exhaust section 55B is positioned at the same height as the second processing housing 22B. Therefore, the fan 41 of the first air supply unit 30A is positioned lower than the second horizontal exhaust section 55B. Therefore, the fan 41 of the first air supply unit 30A will not interfere with the second horizontal exhaust section 55B. For the same reason, the fan 41 of the first air supply unit 30A will not interfere with the exhaust port (not shown) of the second processing housing 22B.
[0218] refer to Figure 2 , 4 5. The substrate processing apparatus 1 includes multiple (e.g., four) vertical exhaust sections 60. One vertical exhaust section 60 is provided for each of multiple (e.g., six) processing housings 22 arranged in a single row in the vertical direction Z. The vertical exhaust section 60 is disposed in the piping space 51. The vertical exhaust section 60 is connected to a horizontal exhaust section 55. Each vertical exhaust section 60 is connected to multiple (e.g., six) horizontal exhaust sections 55. The vertical exhaust section 60 extends in the vertical direction Z.
[0219] The vertical exhaust section 60 includes a first vertical exhaust pipe 61, a second vertical exhaust pipe 62, and a third vertical exhaust pipe 63. The first to third vertical exhaust pipes 61-63 are respectively connected to the horizontal exhaust section 55. The first to third vertical exhaust pipes 61-63 extend in the vertical direction Z.
[0220] refer to Figure 2 The vertical exhaust section 60 extends from a position lower than the fan 41 to a position higher than the fan 41. When viewed from the front-to-back direction (X), the fan 41 and the vertical exhaust section 60 are arranged in the width direction (Y). That is, when viewed from the front, the fan 41 and the vertical exhaust section 60 are arranged in the width direction (Y). The fan 41 is positioned close to the transport space 12. The vertical exhaust section 60 is positioned away from the transport space 12.
[0221] The first to third vertical exhaust pipes 61-63 are arranged in the width direction Y when viewed from the front-rear direction X. The first to third vertical exhaust pipes 61-63 extend from a position lower than fan 41 to a position higher than fan 41. Fan 41 and the first to third vertical exhaust pipes 61-63 are arranged in the width direction Y when viewed from the front-rear direction X. That is, fan 41 and the first to third vertical exhaust pipes 61-63 are arranged in the width direction Y when viewed from the front.
[0222] Figure 13 This is a top view of the processing housing 22. The horizontal exhaust section 55 is equipped with a switching mechanism 56. The switching mechanism 56 switches the exhaust path of the processing housing 22 to one of the first to third vertical exhaust pipes 61-63. Here, the exhaust path of the processing housing 22 is divided between the horizontal exhaust section 55 and the vertical exhaust section 60. More specifically, each horizontal exhaust section 55 divides one exhaust path for the processing housing 22. Each vertical exhaust section 60 divides the exhaust paths of all processing housings 22 arranged in a row in the vertical direction Z. The exhaust path of the processing housing 22 does not open into the piping space 51.
[0223] Specifically, the switching mechanism 56 switches between states 1, 2, and 3. In state 1, the switching mechanism 56 connects the processing housing 22 to the first vertical exhaust pipe 61 and blocks the processing housing 22 from the second and third vertical exhaust pipes 62 and 63. In state 1, the first vertical exhaust pipe 61 exclusively discharges gas from the processing housing 22. That is, in state 1, neither the second nor the third vertical exhaust pipe 63 discharges gas from the processing housing 22. In state 2, the switching mechanism 56 connects the processing housing 22 to the second vertical exhaust pipe 62 and blocks the processing housing 22 from the first and third vertical exhaust pipes 61 and 63. In state 2, the second vertical exhaust pipe 62 exclusively discharges gas from the processing housing 22. In state 3, the switching mechanism 56 connects the processing housing 22 to the third vertical exhaust pipe 63 and blocks the processing housing 22 from the first and second vertical exhaust pipes 61 and 62. In the third state, the third vertical exhaust pipe 63 is specifically designed to exhaust gas from the processing housing 22.
[0224] For example, a switching mechanism 56 is provided inside the horizontal exhaust section 55. The switching mechanism 56 includes a first opening / closing part 57, a second opening / closing part 58, and a third opening / closing part 59. The first opening / closing part 57 connects the processing housing 22 to the first vertical exhaust pipe 61 and blocks the processing housing 22 from the first vertical exhaust pipe 61. The second opening / closing part 58 connects the processing housing 22 to the second vertical exhaust pipe 62 and blocks the processing housing 22 from the second vertical pipe 62. The third opening / closing part 59 connects the processing housing 22 to the third vertical exhaust pipe 63 and blocks the processing housing 22 from the third vertical exhaust pipe 63. The first to third opening / closing parts 57-59 are, for example, valves.
[0225] <7. Components used to control the pressure of the internal gas of the processing casing 22>
[0226] The substrate processing apparatus 1 includes an exhaust damper 65. The exhaust damper 65 is provided in the exhaust path of the processing housing 22. The exhaust damper 65 adjusts the flow rate of the gas flowing through the exhaust path of the processing housing 22. For example, the exhaust damper 65 is provided inside the horizontal exhaust section 55.
[0227] The substrate processing apparatus 1 includes a pressure sensor 67. The pressure sensor 67 measures the pressure of the gas inside the processing housing 22. The pressure sensor 67 is disposed inside the processing housing 22.
[0228] Figure 14This is a control block diagram of the substrate processing apparatus 1. The substrate processing apparatus 1 includes a control unit 69. The control unit 69 acquires the detection result of the pressure sensor 67. Based on the detection result of the pressure sensor 67, the control unit 69 controls at least one of the fan 41 and the exhaust damper 65. Thus, the control unit 69 adjusts the pressure of the gas inside the processing housing 22. For example, the control unit 69 controls both the fan 41 and the exhaust damper 65 based on the detection result of the pressure sensor 67. The control unit 69 is communicatively connected to the fan 41, the exhaust damper 65, and the pressure sensor 67.
[0229] For example, the control unit 69 adjusts the air volume of the fan 41. For example, the control unit 69 adjusts the opening of the exhaust damper 65.
[0230] For example, the control unit 69 is adjusted to maintain the detection result of the pressure sensor 67 at a constant level. For example, the control unit 69 is adjusted to maintain the pressure of the gas inside the processing housing 22 at a constant level. For example, the control unit 69 is adjusted to make the detection result of the pressure sensor 67 reach a preset target value. For example, the control unit 69 is adjusted to make the pressure of the gas inside the processing housing 22 reach a preset target value.
[0231] In addition, the control unit 69 controls the conveying mechanism 6, the conveying mechanism 13, the substrate holding unit 26, the ejection unit 27, the rotation drive unit 28, and the switching mechanism 56.
[0232] The control unit 69 is implemented by a central processing unit (CPU) that performs various processes, RAM (Random-Access Memory) which serves as the working area for processing, and storage media such as a fixed disk. The storage media pre-stores various types of information. For example, the storage media stores information (processing parameters) related to the operating conditions (processing parameters) for processing the substrate W inside each processing housing 22. The storage media also stores information related to conditions or target values for the pressure of the gas inside the processing housing 22. Finally, the storage media stores information related to the operating conditions for switching the exhaust path performed by the switching mechanism 56.
[0233] <8. Operation Example of Substrate Processing Apparatus 1>
[0234] A brief explanation of the operation of substrate processing device 1.
[0235] The transfer unit 3 supplies the substrate W to the processing block 11. Specifically, the transfer mechanism 6 transfers the substrate W from the carrier C to the transfer mechanism 13 of the processing block 11.
[0236] The conveying mechanism 13 moves the substrate W from the transfer section 3 to the interior of a processing housing 22 (substrate holding section 26).
[0237] The gas supply unit 30 supplies gas to the processing housing 22. Specifically, the fan 41 delivers gas to the duct 32. The duct 32 delivers gas to the filter 31. Specifically, the gas flows in the order of the second horizontal section 39, the vertical section 38, and the first horizontal section 33. In the first horizontal section 33, the gas flows from the outer groove section 36 to the flat section 34, and from the flat section 34 to the filter 31. The filter filters the gas. The filter 31 blows the filtered gas into the interior of the processing housing 22. The gas flows downward inside the processing housing 22. That is, a downward flow is formed inside the processing housing 22.
[0238] The switching mechanism 56 switches the exhaust path of the processing housing 22 to any one of the first to third vertical exhaust pipes 61-63. For example, the switching mechanism 56 switches the exhaust path of the processing housing 22 according to the type of processing liquid sprayed from the spray section 27.
[0239] For example, the switching mechanism 56 switches the exhaust path of the processing housing 22 to the first vertical exhaust pipe 61. In this case, the internal gas of the processing housing 22 is discharged to the first vertical exhaust pipe 61 through the exhaust port 53 and the horizontal exhaust section 55.
[0240] Based on the detection results of the pressure sensor 67, the control unit 69 controls at least one of the fan 41 and the exhaust damper 65. As a result, the control unit 69 adjusts the pressure of the gas inside the processing housing 22.
[0241] The substrate W is processed inside the processing housing 22. Specifically, the substrate holding part 26 holds the substrate W. The rotation drive part 28 rotates the substrate W held in the substrate holding part 26. The ejection part 27 supplies processing liquid to the substrate W held in the substrate holding part 26. The cup 29 catches the processing liquid that splashes from the substrate W.
[0242] After processing the substrate W inside the processing housing 22, the processing block 11 returns the processed substrate W to the transfer section 3. Specifically, the transfer mechanism 13 obtains the substrate W from inside the processing housing 22 (substrate holding section 26). Then, the transfer mechanism 13 transfers the substrate W to the transfer mechanism 6 of the transfer section 3.
[0243] The transfer unit 3 recovers the substrate W from the processing block 11. Specifically, the transfer mechanism 6 transfers the substrate W from the processing block 11 to the carrier C.
[0244] <9. Effects of the Implementation Method>
[0245] The substrate processing apparatus 1 includes a processing housing 22 and a gas supply unit 30. The processing housing 22 processes the substrate W inside the processing housing 22. The gas supply unit 30 supplies gas into the processing housing 22. The gas supply unit 30 includes a filter 31, a duct 32, and a fan 41. The filter 31 is disposed on the upper part of the processing housing 22. The filter 31 blows gas into the processing housing 22. The duct 32 and the fan 41 are respectively disposed on the outside of the processing housing 22. The duct 32 is connected to the filter 31. The fan 41 is connected to the duct 32.
[0246] The fan 41 is positioned in a top view that does not overlap with the filter 31. In other words, the fan 41 does not have a portion overlapping the filter 31 in a top view. Therefore, the filter 31 and the fan 41 are not aligned in the vertical direction Z. Furthermore, at least a portion of the fan 41 is positioned at the same height as the processing housing 22. In other words, at least a portion of the fan 41 is positioned at a height equal to or lower than the upper end 23t of the processing housing 22, and equal to or higher than the lower end 23b of the processing housing 22. Therefore, at least a portion of the fan 41 does not protrude upward from the processing housing 22. Even when the filter 31 is positioned above the processing housing 22, it also prevents the fan 41 from protruding significantly upward from the processing housing 22. Even when the filter 31 is positioned above the processing housing 22, the fan 41 does not protrude excessively upward from the processing housing 22. Therefore, the protrusion length L5 of the air supply unit 30 is reduced.
[0247] As described above, the protruding length L5 of the gas supply unit 30 can be reduced according to the substrate processing apparatus 1.
[0248] As a result, two adjacent processing housings 22 in the vertical direction Z can be arranged close together. In other words, the separation distance between two adjacent processing housings 22 in the vertical direction Z can be reduced. Therefore, even if the number of processing housings 22 arranged in the vertical direction Z increases, the length of the substrate processing apparatus 1 in the vertical direction Z will not be too large. Therefore, the number of processing housings 22 arranged in the vertical direction Z can be easily increased. As a result, the increase in the area of the substrate processing apparatus 1 can be suppressed, and the processing capacity of the substrate processing apparatus 1 can be improved.
[0249] At least a portion of the fan 41 is positioned lower than the filter 31. Therefore, the height of the fan 41 is relatively low. Consequently, the protruding length L5 of the air supply unit 30 is suitably reduced.
[0250] At least a portion of the duct 32 is positioned lower than the filter 31. Therefore, it is easy to position at least a portion of the fan 41 lower than the filter 31.
[0251] The fan 41 is positioned in a top view that does not overlap with the processing housing 22. In other words, the fan 41 does not have a portion overlapping the processing housing 22 in a top view. Therefore, the fan 41 is not positioned above the processing housing 22. Therefore, the fan 41 is not a factor of the protruding length L5 of the air supply unit 30. Therefore, the protruding length L5 of the air supply unit 30 is effectively reduced.
[0252] The protruding length L5 of the air supply unit 30 is less than twice the length L1 of the filter in the vertical direction Z. The protruding length L5 of the air supply unit 30 is sufficiently small.
[0253] The protruding length L5 of the air supply unit 30 is the distance between the upper end of the overlapping portion of the air supply unit 30 in the vertical direction Z and the upper end 22t of the processing housing 22. Therefore, reducing the protruding length L5 of the air supply unit 30 is equivalent to thinning the overlapping portion of the air supply unit 30. Therefore, by reducing the protruding length L5 of the air supply unit 30, the separation distance between two adjacent processing housings 22 in the vertical direction Z can be reduced.
[0254] The upper end 32t of the conduit 32 corresponds to the upper end of the air supply unit 30. Therefore, the protruding length L5 of the air supply unit 30 is appropriately reduced.
[0255] The duct 32 includes a first horizontal portion 33, a vertical portion 38, and a second horizontal portion 39. The first horizontal portion 33 extends from the filter 31 in a generally horizontal direction. The vertical portion 38 extends downward from the first horizontal portion 33. The second horizontal portion 39 extends from the vertical portion 38 in a generally horizontal direction to the fan 41. The second horizontal portion 39 is positioned lower than the first horizontal portion 33. Thus, the second horizontal portion 39 can be easily positioned lower than the first horizontal portion 33 via the vertical portion 38. The height of the fan 41 can be easily lowered via the second horizontal portion 39. Therefore, the protruding length L5 of the air supply unit 30 is appropriately reduced.
[0256] The processing housing 22 includes an upper plate portion 24. The upper plate 24 includes a first upper plate portion 24a and a second upper plate portion 24b. A filter 31 is disposed on the first upper plate portion 24a. The second upper plate portion 24b is disposed below the vertical portion 38 and the second horizontal portion 39. The second upper plate portion 24b is lower than the first upper plate portion 24a. The vertical portion 38 and the second horizontal portion 39 are disposed above the second upper plate portion 24b. Therefore, the height position of the vertical portion 38 can be easily lowered. In addition, the height position of the second horizontal portion 39 can be easily lowered. Therefore, the height position of the fan 41 can be easily lowered. Therefore, the protruding length L5 of the air supply unit 30 is appropriately reduced.
[0257] A portion of the conduit 32 overlaps with the filter 31 in forward view. In other words, a portion of the conduit 32 is positioned at the same height as the filter 31. Therefore, the height of the conduit 32 is relatively low. Consequently, the protruding length L5 of the air supply unit 30 is suitably reduced.
[0258] The conduit 32 has a flat portion 34. The flat portion 34 is positioned above the filter 31. The flat portion 34 extends horizontally. Gas is blown downwards from the flat portion 34. The length L3 of the flat portion 34 in the vertical direction Z is less than the length L1 of the filter 31 in the vertical direction Z. That is, the flat portion 34 is thinner than the filter 31. Therefore, the protruding length L5 of the air supply unit 30 is appropriately reduced.
[0259] The overall length L2 of the flat portion 34 and filter 31 in the vertical direction Z is less than twice the length L1 of the filter 31 in the vertical direction Z. Therefore, the height of the flat portion 34 is relatively low. Therefore, the protruding length L5 of the air supply unit 30 is appropriately reduced.
[0260] The height of the upper surface 34a of the flat portion 34 corresponds to the upper end 32t of the conduit 32. Therefore, the upper end 32t of the conduit 32 is relatively low. Thus, the protruding length L5 of the air supply unit 30 is appropriately reduced.
[0261] The height of the upper surface 34a of the flat portion 34 corresponds to the upper end of the air supply unit 30. Therefore, the protruding length L5 of the air supply unit 30 is appropriately reduced.
[0262] The conduit 32 has an outer groove 36. The outer groove 36 is connected to the peripheral portion 35 of the flat portion 34. The outer groove 36 delivers gas to the flat portion 34. The length L4 of the outer groove 36 in the vertical direction Z is greater than the length L3 of the flat portion 34 in the vertical direction Z. Therefore, the outer groove 36 smoothly supplies gas to the flat portion 34.
[0263] The outer groove 36, viewed from above, has an annular shape surrounding the flat portion 34. Therefore, the outer groove 36 can supply gas to the entire periphery 35 of the flat portion 34. The outer groove 36 can supply gas to the flat portion 34 through the entire periphery 35.
[0264] The outer groove portion 36 extends downward from the peripheral edge portion 35 of the flat portion 34. Therefore, the height position of the outer groove portion 36 can be easily lowered. At least a portion of the outer groove portion 36 overlaps with the filter 31 when viewed from the front. Therefore, the height position of the outer groove portion 36 is relatively low. Therefore, the protruding length L5 of the air supply unit 30 is suitably reduced.
[0265] The conduit 32 includes a baffle 37. The baffle 37 is disposed in the outer groove portion 36. The baffle 37 guides a portion of the gas flowing through the outer groove portion 36 to the flat portion 34. Through the baffle 37, the gas flows more smoothly from the outer groove portion 36 to the flat portion 34, for example, the gas is substantially uniformly distributed throughout the flat portion 34. For example, the gas swirls in the flat portion 34. Therefore, the flat portion 34 appropriately supplies the gas to the filter 31. For example, the flat portion 34 supplies the gas substantially uniformly to the entire upper surface 31a of the filter 31. Therefore, the filter 31 appropriately blows out the gas. For example, the filter 31 substantially uniformly blows out the gas from its entire blowing surface. For example, the filter 31 blows out the gas from its entire blowing surface at substantially the same wind speed. Therefore, the substrate W can be appropriately processed inside the processing housing 22.
[0266] The direction in which the baffle 37 extends relative to the outer groove 36 intersects. Therefore, the baffle 37 can appropriately guide a portion of the gas flowing through the outer groove 36 to the flat section 34.
[0267] The substrate processing apparatus 1 includes a transport space 12, a transport mechanism 13, and a piping space 51. The transport space 12 extends in the front-rear direction X. The transport space 12 is adjacent to the processing housing 22. The transport mechanism 13 is disposed in the transport space 12. The transport mechanism 13 transports the substrate W into the interior of the processing housing 22. The piping space 51 is adjacent to the processing housing 22. The processing housing 22 and the transport space 12 are arranged in the width direction Y when viewed from above. The processing housing 22 and the piping space 51 are arranged in the front-rear direction X when viewed from above. Therefore, the transport space 12 and the piping space 51 do not interfere with each other.
[0268] Fan 41 opens to the piping space 51. Fan 41 delivers gas from the piping space 51 to filter 31. Therefore, fan 41 does not interfere with the conveying mechanism 13, and fan 41 can be easily configured near the processing housing 22. Therefore, the air supply unit 30 can be easily miniaturized.
[0269] The housing 22 has an exhaust port 53. The exhaust port 53 is formed facing the piping space 51. The fan 41 is positioned above the exhaust port 53. Therefore, the fan 41 does not interfere with the exhaust port 53.
[0270] The substrate processing apparatus 1 includes a horizontal exhaust section 55 and a vertical exhaust section 60. The horizontal exhaust section 55 is disposed in a piping space 51 and connected to an exhaust port 53. The horizontal exhaust section 55 extends in the horizontal direction. The vertical exhaust section 60 is disposed in the piping space 51 and connected to the horizontal exhaust section 55. The vertical exhaust section 60 extends in the vertical direction Z. A fan 41 is positioned higher than the horizontal exhaust section 55. Therefore, the fan 41 does not interfere with the horizontal exhaust section 55. When viewed from the front-rear direction X, the fan 41 and the vertical exhaust section 60 are arranged in the width direction Y. When viewed from the front, the fan 41 and the vertical exhaust section 60 are arranged in the width direction Y. Therefore, the fan 41 does not interfere with the vertical exhaust section 60.
[0271] The vertical exhaust section 60 includes a first vertical exhaust pipe 61 and a second vertical exhaust pipe 62. The horizontal exhaust section 55 includes a switching mechanism 56. The switching mechanism 56 switches the exhaust path of the processing housing 22 to one of the first vertical exhaust pipe 61 and the second vertical exhaust pipe 62. Therefore, gas can be appropriately discharged from the inside of the processing housing 22.
[0272] Furthermore, the vertical exhaust section 60 includes a third vertical exhaust pipe 63. The switching mechanism 56 switches the exhaust path of the processing housing 22 to one of the first to third vertical exhaust pipes 61-63. Therefore, gases can be discharged more appropriately from the inside of the processing housing 22.
[0273] When viewed from the front-to-back direction (X), the fan 41, the first vertical exhaust pipe 61, and the second vertical exhaust pipe 62 are arranged in the width direction (Y). When viewed from the front, the fan 41, the first vertical exhaust pipe 61, and the second vertical exhaust pipe 62 are arranged in the width direction (Y). Therefore, the fan 41 does not interfere with the first vertical exhaust pipe 61 and the second vertical exhaust pipe 62.
[0274] When viewed from the front-to-back direction X, the fan 41, the first vertical exhaust pipe 61, the second vertical exhaust pipe 62, and the third vertical exhaust pipe 63 are arranged in the width direction Y. Therefore, the fan 41 does not interfere with the first to third vertical exhaust pipes 61-63.
[0275] The substrate processing apparatus 1 includes a pressure sensor 67 and a control unit 69. The pressure sensor 67 measures the pressure of the gas inside the processing housing 22. The control unit 69 controls the fan 41 based on the detection result of the pressure sensor 67. For example, the control unit 69 adjusts the airflow of the fan 41 by controlling the fan 41. As a result, the control unit 69 adjusts the amount of gas supplied to the processing housing 22. Therefore, the control unit 69 can appropriately control the pressure of the gas inside the processing housing 22. Thus, the substrate W can be properly processed inside the processing housing 22.
[0276] Fan 41 delivers gas only to processing housing 22. Each fan 41 delivers gas to only one processing housing 22. The airflow of each fan 41 is equivalent to the gas supply to one processing housing 22. Therefore, the gas supply to each processing housing 22 can be easily adjusted.
[0277] The vertical exhaust section 60 allows gas discharged from two or more processing housings 22 to pass through. Therefore, the pressure of the gas inside each processing housing 22 may be affected by the pressure of the other processing housings 22. Specifically, the vertical exhaust section 60 allows gas discharged from all processing housings 22 arranged in a single row in the vertical direction Z to pass through. Therefore, the pressure of the gas inside each processing housing 22 may influence each other among the processing housings 22 arranged in a single row in the vertical direction Z. Consequently, the pressure of the gas inside each processing housing 22 is prone to fluctuation. In this case, the control unit 69 can appropriately control the fluctuation of the pressure of the gas inside each processing housing 22.
[0278] In particular, when the switching mechanism 56 switches the exhaust path of the processing housing 22 between the first vertical exhaust pipe 61 and the second vertical exhaust pipe 62, the pressure of the gas inside the processing housing 22 is prone to fluctuation. When the switching mechanism 56 switches the exhaust path of the processing housing 22 between the first and third vertical exhaust pipes 61-63, the pressure of the gas inside the processing housing 22 is also prone to fluctuation. In such cases, the control unit 69 can appropriately suppress the pressure fluctuation of the gas inside the processing housing 22.
[0279] The substrate processing apparatus 1 includes an exhaust damper 65. The exhaust damper 65 is provided in the exhaust path of the processing housing 22. The control unit 69 controls the fan 41 and the exhaust damper 65 based on the detection result of the pressure sensor 67. For example, the control unit 69 adjusts the opening degree of the exhaust damper 65 by controlling the exhaust damper 65. As a result, the control unit 69 can adjust the amount of gas discharged from the processing housing 22. Therefore, the control unit 69 can more appropriately control the pressure of the gas inside the processing housing 22. Therefore, the substrate W can be processed more appropriately inside the processing housing 22.
[0280] The substrate processing apparatus 1 includes a processing housing 22 and a gas supply unit 30. The gas supply unit 30 includes a filter 31 and a conduit 32. The conduit 32 includes a flat portion 34 and an outer groove portion 36. The length L4 of the outer groove portion 36 in the vertical direction Z is greater than the length L3 of the flat portion 34 in the vertical direction Z. Therefore, the outer groove portion 36 can smoothly supply gas to the flat portion 34. As a result, the flat portion 34 can be easily thinned. Therefore, the protruding length L5 of the gas supply unit 30 can be appropriately reduced.
[0281] This invention is not limited to the embodiments described below, and can also be implemented in different ways as described below.
[0282] In this embodiment, a portion of the fan 41 is positioned at the same height as the processing housing 22. However, this is not a limitation. The entire fan 41 may also be positioned at the same height as the processing housing 22. Specifically, the entire fan 41 may be positioned at a height equal to or lower than the upper end 23t of the processing housing 22, and equal to or higher than the lower end 23b.
[0283] In this embodiment, the fan 41 does not overlap with the processing housing 22 when viewed from above. However, this is not a limitation. At least a portion of the fan 41 may overlap with the processing housing 22 when viewed from above. For example, the entire fan 41 may overlap with the processing housing 22 when viewed from above.
[0284] In this embodiment, the fan 41 is disposed in the piping space 51. However, it is not limited thereto. For example, at least a portion of the fan 41 may be disposed above the processing housing 22. For example, at least a portion of the fan 41 may be disposed above the second upper plate portion 24b of the processing housing 22. For example, at least a portion of the fan 41 may be disposed in the recessed space S.
[0285] In the described embodiment, the fan 41 is not a factor of the protruding length L5 of the air supply unit 30. However, it is not limited to this. The fan 41 may also be a factor of the protruding length L5 of the air supply unit 30.
[0286] In the described embodiment, the protruding length L5 of the air supply unit 30 is the distance between the upper end of the overlapping portion of the air supply unit 30 in the vertical direction Z and the upper end 23t of the processing housing 22. However, it is not limited to this. For example, the protruding length L5 of the air supply unit 30 may also be the distance between the upper end of the air supply unit 30 in the vertical direction Z and the upper end 23t of the processing housing 22.
[0287] In the described embodiment, the entire fan 41 is positioned lower than the upper end 32t of the duct 32. However, this is not a limitation. At least a portion of the fan 41 may be positioned higher than the upper end 32t of the duct 32.
[0288] In the described embodiment, the upper end 32t of the conduit 32 corresponds to the upper end of the air supply unit 30. However, it is not limited to this. The upper end of the fan 41 may also correspond to the upper end of the air supply unit 30.
[0289] In this embodiment, the number of processing housings 22 arranged in the vertical direction Z is six. However, this is not a limitation. The number of processing housings 22 arranged in the vertical direction Z can be appropriately varied.
[0290] In this embodiment, the vertical exhaust section 60 includes a third vertical exhaust pipe 63. However, it is not limited to this. The third vertical exhaust pipe 63 may also be omitted.
[0291] In this embodiment, the exhaust damper 65 is disposed inside the horizontal exhaust section 55. However, it is not limited thereto. At least a portion of the exhaust damper 65 may also be disposed outside the horizontal exhaust section 55. For example, at least a portion of the exhaust damper 65 may be disposed inside the processing housing 22. For example, at least a portion of the exhaust damper 65 may be disposed near the exhaust port 53.
[0292] In this embodiment, the exhaust port 53 is located near the transport space 12. However, it is not limited to this. The position of the exhaust port 53 can also be appropriately changed. With changing the position of the exhaust port 53, the position of the horizontal exhaust section 55 can also be appropriately changed.
[0293] Figure 15 , 16 These are front views of the processing casing in the modified implementation. Furthermore, components identical to those in the original implementation are labeled with the same symbols, and therefore detailed descriptions are omitted. Figure 15 The illustration of the vertical exhaust port 60, etc., is omitted.
[0294] refer to Figure 15 In a variation, the processing housing 22 replaces the exhaust port 53 with an exhaust port 73. The exhaust port 73 is located away from the transport space 12. The exhaust port 73 is not located below the fan 41. The fan 41 and the exhaust port 73 are not aligned in the vertical direction Z when viewed from the front of the processing housing 22.
[0295] refer to Figure 16 In a variation, the substrate processing apparatus 1 replaces the horizontal exhaust section 55 with a horizontal exhaust section 75. The horizontal exhaust section 75 is connected to the exhaust port 73. The horizontal exhaust section 75 extends horizontally from the exhaust port 73. The horizontal exhaust section 75 extends to the vertical exhaust section 60. The vertical exhaust section 60 is connected to the horizontal exhaust section 75. A portion of the horizontal exhaust section 75 is located away from the transport space 12. For example, the horizontal exhaust section 75 does not have a portion close to the transport space 12. Although not shown in the figure, the entire horizontal exhaust section 75 does not overlap with the fan 41 when viewed from above.
[0296] In this embodiment, the substrate processing apparatus 1 does not include an adjustment section for adjusting the gas blown out from the filter 31. However, it is not limited to this. The substrate processing apparatus 1 may include an adjustment section. Hereinafter, a modified embodiment of the substrate processing apparatus 1 will be described in detail.
[0297] Figure 17 This is a top view showing the interior of the processing housing 22 in a modified implementation. Figure 18 This is a vertical sectional view of the processing housing 22 in a modified embodiment. Furthermore, for configurations identical to those in the embodiment, detailed descriptions are omitted by using the same reference numerals.
[0298] First, the configuration of the processing housing 22, the substrate holding part 26, the cup 29, the ejection part 27 and the filter 31 will be explained.
[0299] The processing housing 22 divides the interior into a processing space 81. The processing space 81 is a space.
[0300] The processing housing 22 has a plurality of (e.g., four) sidewalls 82. Each sidewall 82 is disposed on a side of the processing housing 22. Each sidewall 82 extends in the vertical direction Z.
[0301] To distinguish the individual sidewalls 82, they are referred to as sidewalls 82a, 82b, 82c, and 82d. Sidewalls 82a and 82c extend in the width direction Y when viewed from above. Sidewalls 82a and 82c face each other. Sidewalls 82b and 82d extend in the front-rear direction X when viewed from above. Sidewalls 82b and 82d face each other. Sidewall 82b extends from sidewall 82a toward sidewall 82c. Sidewall 82d also extends from sidewall 82a toward sidewall 82c. Sidewall 82d is connected to the transfer space 12. A transfer opening 25 is formed in sidewall 82d.
[0302] As described in the embodiment, the substrate processing apparatus 1 includes a substrate holding section 26. The substrate holding section 26 is disposed inside the processing housing 22. The substrate holding section 26 holds the substrate W. Figure 17 , 18 The central axis Q is indicated. The central axis Q passes through the center of the substrate W supported on the substrate holding part 26 and is parallel to the vertical direction Z.
[0303] As described in the embodiment, the substrate processing apparatus 1 includes a cup 29. The cup 29 is disposed inside the processing housing 22. The cup 29 is disposed in the processing space 81. The cup 29 is arranged around the substrate holding portion 26. The cup 29 receives processing liquid.
[0304] Cup 29 has a vertical wall portion 83, an inclined portion 84, and an upper opening 85. The vertical wall portion 83 extends in the vertical direction Z. The vertical wall portion 83 has a cylindrical shape centered on a central axis Q. The inclined portion 84 is connected to the vertical wall portion 83. The inclined portion 84 extends upward from the vertical wall portion 83 and is close to the central axis Q. The inclined portion 84 has a frustum-shaped cone shape centered on the central axis Q. The inclined portion 84 has an annular shape when viewed from above. The upper opening 85 is disposed inside the inclined portion 84 when viewed from above. The upper opening 85 is formed at approximately the same height as the upper end of the inclined portion 84. The upper opening 85 extends in the horizontal direction. The upper opening 85 has a circular shape centered on the central axis Q. The upper opening 85 is larger than the substrate W when viewed from above. The upper opening 85 overlaps with the entire substrate W held in the substrate holding portion 26 when viewed from above.
[0305] As described in the embodiment, the substrate processing apparatus 1 includes one or more (e.g., three) ejection sections 27. The ejection sections 27 are disposed inside the processing housing 22. The ejection sections 27 are disposed in the processing space 81. The ejection sections 27 eject processing liquid onto the substrate W held in the substrate holding section 26.
[0306] When distinguishing between the various ejection portions 27, they are referred to as ejection portions 27a, 27b, and 27c. Ejection portions 27a-27c are, for example, nozzles. Ejection portions 27a-27c are each positioned at a height higher than the substrate W held in the substrate holding portion 26.
[0307] The substrate processing apparatus 1 includes one or more (e.g., three) moving mechanisms 86. The moving mechanisms 86 move the ejection section 27.
[0308] In the case of distinguishing between the various moving mechanisms 86, they are referred to as moving mechanisms 86a, 86b, and 86c. Moving mechanism 86a is connected to the ejector section 27a. Moving mechanism 86a moves the ejector section 27a. Moving mechanism 86a causes the ejector section 27a to rotate about the rotation axis Ra. Similarly, moving mechanisms 86b and 86c are connected to the ejector sections 27b and 27c, respectively. Moving mechanisms 86b and 86c move the ejector sections 27b and 27c, respectively. Moving mechanisms 86b and 86c cause the ejector sections 27b and 27c to rotate about the rotation axes Rb and Rc, respectively. The rotation axes Ra-Rc are parallel to the vertical direction Z. The rotation axes Ra-Rc pass through moving mechanisms 86a-86c, respectively.
[0309] The ejector portion 27a has a base end portion 87a. The base end portion 87a is connected to the moving mechanism 86a. The base end portion 87a is positioned on the outer side of the cup 29 in plan view. Similarly, ejector portions 27b and 27c each have base ends portion 87b and 87c. The base ends portion 87b and 87c are respectively connected to the moving mechanisms 86b and 86c. The base ends portion 87b and 87c are respectively positioned on the outer side of the cup 29 in plan view.
[0310] The ejection section 27a has a front end portion 88a. The front end portion 88a can be moved to an ejection position and a standby position. Specifically, a moving mechanism 86a moves the front end portion 88a to the ejection position and the standby position. Similarly, ejection sections 27b and 27c each have front ends portion 88b and 88c. The front ends portion 88b and 88c can be moved to an ejection position and a standby position, respectively. Specifically, moving mechanisms 86b and 86c move the front ends portion 88b and 88c to the ejection position and the standby position, respectively.
[0311] Figure 17The front portions 88a-88c in the standby position are indicated by solid lines. When the front portion 88a is in the standby position, it is positioned outside the substrate W held in the substrate holding portion 26 when viewed from above. That is, when the front portion 88a is in the standby position, it does not overlap with the substrate W held in the substrate holding portion 26 when viewed from above. Similarly, when the front portions 88b and 88c are each in the standby position, they are positioned outside the substrate W held in the substrate holding portion 26 when viewed from above. That is, when the front portions 88b and 88c are each in the standby position, they do not overlap with the substrate W held in the substrate holding portion 26 when viewed from above.
[0312] Furthermore, when the front end portion 88a is in the standby position, it is positioned on the outside of the cup 29 when viewed from above. Similarly, when the front ends 88b and 88c are each in the standby position, they are positioned on the outside of the cup 29 when viewed from above.
[0313] When the front end portion 88a is in the standby position, the ejector portion 27a extends along the side wall 82a. Similarly, when the front ends 88b and 88c are in the standby position, the ejector portions 27b and 27c extend along the side walls 82b and 82c, respectively.
[0314] Figure 17 The front portions 88a-88c located at the ejection position are indicated by dashed lines. When the front portion 88a is in the ejection position, it overlaps with the substrate W held in the substrate holding portion 26 when viewed from above. Similarly, when the front portions 88b and 88c are each in the ejection position, they overlap with the substrate W held in the substrate holding portion 26 when viewed from above.
[0315] refer to Figure 18 The front end portion 88a has a spray outlet 89a. The spray outlet 89a is an opening for spraying out the treatment liquid. Similarly, the front end portion 88b has a spray outlet (not shown). The front end portion 88c also has a spray outlet 89c (not shown).
[0316] In the following case, when it is necessary to distinguish between the front ends 88a-88c, it will be referred to as the front end 88.
[0317] As described in the embodiment, the substrate processing apparatus 1 includes a filter 31. The filter 31 is disposed on the upper part of the processing housing 22. The filter 31 is provided on the upper plate 24. The filter 31 is provided on the first upper plate portion 24a. The filter 31 blows gas downwards. The filter 31 blows gas from its lower surface 31b.
[0318] The substrate processing apparatus 1 includes an adjustment unit 91. The adjustment unit 91 receives gas (e.g., air) blown out from the filter 31. The adjustment unit 91 adjusts the gas flow. The adjustment unit 91 blows the gas downwards.
[0319] The adjustment unit 91 is located below the filter 31.
[0320] An adjustment section 91 is disposed inside the processing housing 22. The adjustment section 91 is disposed above the processing space 81. The adjustment section 91 is in contact with the processing space 81. The adjustment section 91 is disposed above the substrate holding section 26. The adjustment section 91 is disposed above the ejection section 27. The adjustment section 91 is disposed above the cup 29.
[0321] The adjustment unit 91 includes an adjustment chamber 92. The adjustment chamber 92 is a space. The adjustment chamber 92 is located below the filter 31. The adjustment chamber 92 is in contact with the filter 31. The adjustment chamber 92 is in contact with the lower surface 31b of the filter 31.
[0322] The adjustment chamber 92 is disposed below the upper plate 24 of the processing housing 22. The adjustment chamber 92 is connected to the upper plate 24. More specifically, the adjustment chamber 92 is disposed below the first upper plate portion 24a. The adjustment chamber 92 is connected to the first upper plate portion 24a.
[0323] The adjustment chamber 92 extends horizontally. The length of the adjustment chamber 92 in the horizontal direction is longer than the length of the filter 31 in the horizontal direction.
[0324] The regulating chamber 92 has a flat shape. The length of the regulating chamber 92 in the vertical direction Z is sufficiently shorter than the length of the regulating chamber 92 in the horizontal direction. The regulating chamber 92 corresponds to a horizontal flow path for the radially flowing gas from the filter 31.
[0325] The adjustment section 91 includes a blower plate 93. The blower plate 93 is disposed below the adjustment chamber 92. The blower plate 93 is connected to the adjustment chamber 92. The blower plate 93 is disposed above the processing space 81. The blower plate 93 is connected to the processing space 81.
[0326] The blow plate 93 has a plate shape. The blow plate 93 extends in a horizontal direction. The blow plate 93 has an upper surface 93a and a lower surface 93b. The upper surface 93a is in contact with the adjustment chamber 92. The lower surface 93b is in contact with the processing space 81.
[0327] The length of the horizontally oriented blow-out plate 93 is longer than the length of the horizontally oriented filter 31. The length of the horizontally oriented blow-out plate 93 is equal to or longer than the length of the horizontally oriented adjustment chamber 92.
[0328] The blow plate 93 has a plurality of blow holes 94. The blow holes 94 are formed on the blow plate 93. The blow holes 94 penetrate the blow plate 93. The blow holes 94 penetrate the blow plate 93 in the vertical direction Z. The blow holes 94 are sufficiently small compared to the blow plate 93. The blow holes 94 are arranged closely together. The blow holes 94 communicate with the adjustment chamber 92 and the processing space 81. The lower surface 93b of the blow plate 93 corresponds to the blow surface of the adjustment section 91.
[0329] The blow-out plate 93 can be installed and removed into the processing housing 22.
[0330] Specifically, the adjustment section 91 includes a support pin 95. The support pin 95 is mounted to the processing housing 22. The support pin 95 protrudes, for example, from the side wall 82 of the processing housing 22. The support pin 95 extends in a horizontal direction. The support pin 95 supports the blow-out plate 93. The blow-out plate 93 is mounted on the support pin 95. The lower surface 93b of the blow-out plate 93 contacts the support pin 95.
[0331] When the support pin 95 supports the blow-out plate 93, the support pin 95 prevents the blow-out plate 93 from moving downward relative to the support pin 95. When the support pin 95 supports the blow-out plate 93, the support pin 95 allows the blow-out plate 93 to move upward relative to the support pin 95 (processing housing 22). Therefore, the blow-out plate 93 can be easily installed and removed from the processing housing 22.
[0332] The adjusting section 91 includes a blocking wall 96. The blocking wall 96 seals the side of the adjusting chamber 92. The blocking wall 96 prevents gas from flowing from the adjusting chamber 92 to the outside of the adjusting chamber 92 through the side of the adjusting section 91.
[0333] A blocking wall 96 is disposed at the peripheral end of the adjustment chamber 92. The blocking wall 96 is disposed between the upper plate 24 and the blow-out plate 93. The blocking wall 93 extends in the vertical direction Z. For example, the blocking wall 96 is supported on the upper plate 24 (specifically, the first upper plate portion 24a). The blocking wall 96 extends downward from the upper plate 24 (specifically, the first upper plate portion 24a). Alternatively, the blocking wall 96 may be supported on the blow-out plate 93. The blocking wall 96 extends upward from the blow-out plate 93.
[0334] The blocking wall 96 allows the blow-out plate 93 to move slightly upward relative to the processing housing 22. Therefore, the blow-out plate 93 can be easily installed onto the processing housing 22. The blow-out plate 93 can be easily removed from the processing housing 22.
[0335] Specifically, the gap is set either between the blocking wall 96 and the upper plate 24, or between the blocking wall 96 and the blow-out plate 93. The gap is a space.
[0336] The gap is sufficiently small. The gap is small enough to substantially inhibit gas from flowing out of the adjustment chamber 92 through the gap. For example, the gap is 1 mm.
[0337] As described above, the adjustment chamber 92 is divided by a filter 31, an upper plate 24 (first upper plate portion 24a), an exhaust plate 93, and a blocking wall 96.
[0338] The adjusting section 91 includes a guiding member 97. The guiding member 97 is disposed in the adjusting chamber 92. The guiding member 97 is positioned above the blow-out plate 93. The guiding member 97 is horizontally positioned between the filter 31 and the blocking wall 96. The guiding member 97 guides the gas downwards within the adjusting chamber 92. A relatively strong downward airflow is formed near the guiding member 97.
[0339] The guide member 97 is disposed on the upper part of the adjusting chamber 92. The guide member 97 is not disposed on the lower part of the adjusting chamber 92. The guide member 97 is disposed only on the upper part of the adjusting chamber 92. The guide member 97 extends in the vertical direction Z. The guide member 97 covers the upper part of the adjusting chamber 92. The guide member 97 prevents airflow from flowing horizontally in the upper part of the adjusting chamber 92. The guide member 97 opens the lower part of the adjusting chamber 92. The guide member 97 opens the lower part of the adjusting chamber 92 horizontally. The guide member 97 allows airflow to flow horizontally in the lower part of the adjusting chamber 92. Therefore, the guide member 97 can appropriately guide the gas downwards within the adjusting chamber 92. Furthermore, the gas flows through the lower part of the adjusting chamber 92 without stagnation. The gas in the adjusting chamber 92 flows smoothly along the upper surface 93a of the blower plate 93. The gas in the adjusting chamber 92 does not stagnate near the upper surface 93a of the blower plate 93.
[0340] Specifically, the guide member 97 has a generally plate-like shape. The guide member 97 is supported on the upper plate 24 (specifically, the first upper plate portion 24a). The guide member 97 is in contact with the upper plate 24 (specifically, the first upper plate portion 24a). The guide member 97 extends downward from the upper plate 24 (specifically, the first upper plate portion 24a). The lower part of the guide member 97 is higher than the blow-out plate 93. The guide member 97 is separated from the blow-out plate 93. The guide member 97 does not contact the blow-out plate 93.
[0341] The length of the guide member 97 in the vertical direction Z is shorter than the length of the adjustment chamber 92 in the vertical direction Z. For example, the length of the guide member 97 in the vertical direction Z is less than half the length of the adjustment chamber 92 in the vertical direction Z.
[0342] A narrow passage 98 is formed between the blow-out plate 93 and the guide member 97. The narrow passage 98 is a space. The narrow passage 98 is located below the guide member 97 and above the blow-out plate 93. Gas can pass through the narrow passage 98. For example, the length of the narrow passage 98 in the vertical direction Z is more than half the length of the adjustment chamber 92 in the vertical direction Z. For example, the length of the narrow passage 98 in the vertical direction Z is 4 mm or more.
[0343] Figure 19 This is a top view of the adjustment section 91 in the modified implementation. Figure 19 For convenience, the blow-out plate 93, the blocking wall 96, and the guide component 97 are indicated by shaded lines.
[0344] The blow plate 93 includes a first component 101 and a second component 102. The first component 101 and the second component 102 are separable from each other. The blow plate 93 can be divided into the first component 101 and the second component 102. The first component 101 and the second component 102 are arranged in a horizontal direction. The second component 102 is adjacent to the first component 101. In top view, the second component 102 and the first component 101 do not substantially overlap.
[0345] Figure 19 The filter 31 is indicated by a dashed line. Viewed from above, the filter 31 has a roughly rectangular shape.
[0346] From a top view, the blow-out plate 93 is larger than the filter 31. From a top view, the blow-out plate 93 overlaps with the entire filter 31. From a top view, the first component 101 overlaps with the entire filter 31. From a top view, the entire second component 102 is positioned outside the filter 31. From a top view, the second component 102 does not overlap with the filter 31.
[0347] From a top view, the entire blocking wall 96 is positioned on the outside of the filter 31. From a top view, the blocking wall 96 does not overlap with the filter 31. From a top view, the blocking wall 96 has a closed ring shape. From a top view, the blocking wall 96 surrounds the filter 31.
[0348] The adjustment chamber 92, viewed from above, is the inner region of the blocking wall 96. Viewed from above, the adjustment chamber 92 is larger than the filter 31. Viewed from above, the adjustment chamber 92 overlaps with the entire filter 31.
[0349] From a top view, the blower plate 93 overlaps with the entire blocking wall 96. From a top view, the blower plate 93 overlaps with the entire adjusting chamber 92. From a top view, the blower plate 93 is the same size as or larger than the adjusting chamber 92. From a top view, the blower plate 93 overlaps with the entire guide component 97.
[0350] From a top view, the entire guide member 97 is disposed on the outside of the filter 31. From a top view, the guide member 97 does not overlap with the filter 31. From a top view, the entire guide member 97 is disposed on the inside of the blocking wall 96. From a top view, the guide member 97 has an open ring shape. The guide member 97 has a first end connected to the blocking wall 96 and a second end connected to the blocking wall 96.
[0351] Viewed from above, the spacing between the filter 31 and the guide member 97 is preferably approximately equal to the spacing between the guide member 97 and the blocking wall 96.
[0352] The blocking wall 96 has blocking portions 96a, 96b, 96c, and 96d. Blocking portions 96a-96d are each part of the blocking wall 96. Each of the blocking portions 96a-96d extends linearly in top view. Blocking portions 96a and 96c each extend in the width direction Y. Blocking portions 96b and 96d each extend in the front-rear direction X. Blocking portion 96a is close to sidewall 82a in top view. Similarly, blocking portions 96b-96d are close to sidewalls 82b-82d in top view.
[0353] The guide component 97 has guide portions 97a, 97b, and 97c. Each of the guide portions 97a, 97b, and 97c is a part of the guide component 97. Each of the guide portions 97a, 97b, and 97c extends linearly in a top view. Guide portions 97a and 97c each extend in the width direction Y. Guide portion 97b extends in the front-rear direction X.
[0354] Guide portion 97a, viewed from above, is positioned between blocking portion 96a and filter 31. Guide portion 97b, viewed from above, is positioned between blocking portion 96b and filter 31. Guide portion 97c, viewed from above, is positioned between blocking portion 96c and filter 31. Blocking portion 97a, guide portion 96a, filter 31, guide portion 97c, and blocking portion 96c are arranged sequentially in the front-to-back direction X. Blocking portion 96b, guide portion 97b, filter 31, and blocking portion 96d are arranged sequentially in the width direction Y.
[0355] Figure 19 This represents distances Da-Dc and Ea-Ec. Distance Da is the distance between filter 31 and guide portion 97a. Distance Db is the distance between filter 31 and guide portion 97b. Distance Dc is the distance between filter 31 and guide portion 97c. Distance Ea is the distance between guide portion 97a and blocking portion 96a. Distance Eb is the distance between guide portion 97b and blocking portion 96b. Distance Ec is the distance between guide portion 97b and blocking portion 96c.
[0356] The distance Ea is preferably approximately equal to the distance Da. The distance Eb is preferably approximately equal to the distance Db. The distance Ec is preferably approximately equal to the distance Dc.
[0357] The distance Db is preferably approximately equal to the distance Da. The distance Dc is preferably approximately equal to the distance Da.
[0358] The distance Eb is preferably approximately equal to the distance Ea. The distance Ec is preferably approximately equal to the distance Ea.
[0359] Figure 20 This is a top view showing the interior of the processing housing 22 in a modified implementation. Figure 20 In the middle, each of the front ends 88a-88c is in the standby position. Figure 20 The filter 31, the blocking wall 96, and the guiding component 97 are indicated by dashed lines.
[0360] Filter 31 overlaps with the substrate W held in the substrate holding portion 26 when viewed from above. Filter 31 largely overlaps with the substrate W held in the substrate holding portion 26 when viewed from above. Filter 31 overlaps with the cup 29 when viewed from above. Filter 31 overlaps with the inclined portion 84 when viewed from above. Filter 31 overlaps with the upper opening 85 when viewed from above. When the front end portion 88a is in the standby position, filter 31 does not overlap with the front end portion 88a when viewed from above. When the front end portion 88a is in the standby position, the front end portion 88a is positioned outside the filter 31 when viewed from above. When the front ends 88b and 88c are in the standby position, filter 31 does not overlap with the front ends 88b and 88c when viewed from above. When the front ends 88b and 88c are in the standby position, the front ends 88b and 88c are each positioned outside the filter 31 when viewed from above.
[0361] The entire blocking wall 96 is disposed on the outside of the substrate W held in the substrate holding portion 26 in plan view. The blocking wall 96 does not overlap with the substrate W held in the substrate holding portion 26 in plan view. The blocking wall 96 surrounds the substrate W held in the substrate holding portion 26 in plan view. At least a portion of the blocking wall 96 is disposed on the outside of the cup 29 in plan view. At least a portion of the blocking wall 96 is disposed on the outside of the inclined portion 84 in plan view. The entire blocking wall 96 is disposed on the outside of the upper opening 85 in plan view. When the front end portion 88a is in the standby position, the front end portion 88a is disposed on the outside of the blocking wall 96 in plan view. When the front end portion 88a is in the standby position, a portion of the ejection portion 27a is disposed on the inside of the blocking wall 96 in plan view. When the front end portion 88b is in the standby position, the front end portion 88b is disposed on the inside of the blocking wall 96 in plan view. When the front end portion 88b is in the standby position, the entire ejector portion 27b is positioned inside the blocking wall 96 in a top view. When the front end portion 88c is in the standby position, a portion of the front end portion 88c is positioned outside the blocking wall 96 in a top view. When the front end portion 88c is in the standby position, a portion of the ejector portion 27c is positioned inside the blocking wall 96 in a top view.
[0362] The entire guide member 97 is disposed outside the substrate W held in the substrate holding portion 26 when viewed from above. The guide member 97 does not overlap with the substrate W held in the substrate holding portion 26 when viewed from above.
[0363] At least a portion of the guide member 97 overlaps with the cup 29 in plan view. In this variation, a portion of the guide member 97 overlaps with the cup 29 in plan view. Other portions of the guide member 97 are positioned outside the cup 29 in plan view. However, this is not a limitation. The entire guide member 97 may overlap with the cup 29 in plan view. At least a portion of the guide member 97 overlaps with the inclined portion 84 in plan view. In this variation, a portion of the guide member 97 overlaps with the inclined portion 84 in plan view. Other portions of the guide member 97 are positioned outside the inclined portion 84 in plan view. However, this is not a limitation. The entire guide member 97 may overlap with the inclined portion 84 in plan view. The entire guide member 97 is positioned outside the upper opening 85 in plan view. The guide member 97 does not overlap with the upper opening 85 in plan view.
[0364] When the front end portion 88 is in the standby position, at least a portion of the ejector portion 27 is positioned outside the guide member 97 in a top view. Specifically, when the front end portion 88a is in the standby position, the entire ejector portion 27a is positioned outside the guide member 97 in a top view. When the front end portion 88b is in the standby position, the entire ejector portion 27b is positioned outside the guide member 97 in a top view. When the front end portion 88c is in the standby position, a portion of the ejector portion 27c is positioned outside the guide member 97 in a top view.
[0365] When the front end portion 88 is in the standby position, it is positioned outside the guide member 97 when viewed from above. When the front end portion 88 is in the standby position, it does not overlap with the guide member 97 when viewed from above. Specifically, when the front end portion 88a is in the standby position, the entire front end portion 88a is positioned outside the guide member 97 when viewed from above. Similarly, when the front ends 88b and 88c are each in the standby position, they are each positioned outside the guide member 97 when viewed from above.
[0366] When the front end portion 88a is in the standby position, the guide portion 97a, viewed from above, is disposed between the front end portion 88a and the substrate W held in the substrate holding portion 26. When the front end portion 88a is in the standby position, the guide portion 97a, viewed from above, extends in a manner that separates the front end portion 88a from the substrate W held in the substrate holding portion 26. Similarly, when the front ends 88b and 88c are in the standby position, the guide portions 97b and 97c, viewed from above, are each disposed between the front ends 88b and 88c and the substrate W held in the substrate holding portion 26. When the front ends 88b and 88c are in the standby position, the guide portions 97b and 97c, viewed from above, extend in a manner that separates the front ends 88b and 88c from the substrate W held in the substrate holding portion 26.
[0367] Figure 21 This is a vertical cross-sectional view of the processing housing 22 in a modified implementation. Figure 21The flow of gas is schematically represented by a single-dot dashed line.
[0368] Filter 31 blows gas downwards. Adjustment unit 91 receives the gas blown out from filter 31. Adjustment unit 91 blows gas downwards. Specifically, adjustment chamber 92 receives gas from filter 31. Blowout plate 93 blows gas into processing space 81.
[0369] Figure 22 This is a top view of the blower plate 93 according to a modified embodiment. For convenience, a core region 103 and a peripheral region 104 are defined for the blower plate 93. The core region 103 is the portion of the blower plate 83 located below the filter 31. In other words, the core region 103 is the portion of the blower plate 83 that overlaps with the filter 31 in the top view. The peripheral region 104 is the portion of the blower plate 83 located outside the core region 103 and inside the blocking wall 96. The peripheral region 104 is disposed outside the filter 31 in the top view. The peripheral region 104 does not overlap with the filter 31 in the top view.
[0370] The peripheral area 104 is defined as guide area 104g, first area 104a, and second area 104b. Guide area 104g is the portion of the peripheral area 104 located below guide member 97. Guide area 104g may also include the portion of the peripheral area 104 located near guide member 97 when viewed from above. First area 104a is the portion of the peripheral area 104 located inside guide area 104g. Second area 104b is the portion of the peripheral area 104 located outside guide area 104g.
[0371] The guide area 104g is positioned outside the filter 31 when viewed from above. The guide area 104g does not overlap with the filter 31 when viewed from above. The same applies to area 104a and area 104b.
[0372] refer to Figure 21 For convenience, the airflow from the blower plate 93 is defined as core blowout flow G0, first blowout flow G1, second blowout flow G2, and third blowout flow G4. Core blowout flow G0 is the airflow blown from the core region 103. First blowout flow G1 is the airflow blown from region 104a. Second blowout flow G2 is the airflow blown from region 2b. Third blowout flow G3 is the airflow blown from the guide region 104g.
[0373] For convenience, processing space 81 is defined as a core region 107, a first region 108, and a second region 109. Core region 107 is the portion of processing space 81 located directly below core region 103. First region 108 is the portion of processing space 81 located directly below first region 104a. First region 108 is located outside core region 107. Second region 109 is the portion of processing space 81 located directly below second region 104b. Second region 109 is located outside first region 108.
[0374] This describes the gas flow within the regulating chamber 92 and the processing space 81. In the regulating chamber 92, gas originates from the filter 31 and reaches the blow-out plate 83. The airflow in the regulating chamber 92 is classified into straight flow and curved flow. The straight flow does not bend horizontally but flows directly downwards. The straight flow reaches the core area 103. The curved flow bends horizontally and then downwards to reach the blow-out plate 83. The curved flow reaches the peripheral area 104.
[0375] The curved flow is further classified into three airflows: Flow 1 bends downwards before reaching guide member 97. Flow 1 reaches zone 104a. Flow 2 bends downwards after passing through guide member 97 (narrow path 98). Flow 2 reaches zone 2 104b. Flow 3 bends downwards near guide member 97. Flow 3 reaches guide zone 104g. Flow 3 is stronger than Flow 1. Flow 3 is stronger than Flow 2.
[0376] Core outflow G0 flows downward from core region 103. Core outflow G0 enters core region 107. First outflow G1 flows downward from zone 104a. First outflow G1 enters zone 108. Second outflow G2 flows downward from zone 2104b. Second outflow G2 enters zone 2109. Third outflow G3 flows downward from guide zone 104g. Third outflow G3 enters between zone 108 and zone 109. First outflow G1 is located outside core outflow G0. Third outflow G3 is located outside first outflow G1. Second outflow G2 is located outside third outflow G3.
[0377] The third outflow G3 is stronger than the first outflow G1. The velocity of the third outflow G3 is greater than that of the first outflow G1. The third outflow G3 is stronger than the second outflow G2. The velocity of the third outflow G3 is greater than that of the second outflow G2. The first outflow G1 is located inside the third outflow G3. The second outflow G2 is located outside the third outflow G3. Therefore, the third outflow G3 branches into an inner flow G3a and an outer flow G3b.
[0378] The inner flow G3a flows downwards and inwards. The inner flow G3a approaches the central axis Q while flowing downwards. The inner flow G3a enters the first region 108 while flowing downwards. Through the inner flow G3a, the first outflow G1 also flows downwards and approaches the central axis Q. The first outflow G1 enters the core region 107 from the first region 108. The core outflow G0 and the first outflow G1 pass through the upper opening 85. The core outflow G0 and the first outflow G1 are supplied to the substrate W held in the substrate holding portion 26. Furthermore, the inner flow G3a can also enter the core region 107 from the first region 108. The inner flow G3a can also pass through the upper opening 85.
[0379] The outflow G3b flows downwards and outwards. The outflow G3b flows downwards while moving away from the central axis Q. The outflow G3b flows downwards while entering the second region 109. Through the outflow G3b, the second outflow G2 also flows downwards while moving away from the central axis Q. The outflow G3b prevents the atmosphere of the second region 109 from affecting the first region 108. The outflow G3b prevents the atmosphere of the second region 109 from passing through the upper opening 85. The outflow G3b prevents the atmosphere of the second region 109 from affecting the substrate W held in the substrate holding portion 26. Therefore, the outflow G3b protects the substrate W held in the substrate holding portion 26 from the influence of the atmosphere of the second region 109. The outflow G3b keeps the substrate W held in the substrate holding portion 26 clean.
[0380] The effects of the modified implementation will be explained. The filter 31 blows gas into the interior of the processing housing 22. The filter 31 blows the gas downwards. The substrate processing apparatus 1 includes an adjustment unit 91. The adjustment unit 91 is disposed inside the processing housing 22. The adjustment unit 91 includes an adjustment chamber 92. The adjustment chamber 92 is disposed below the filter 31. Therefore, the adjustment unit 91 can appropriately receive the gas blown out from the filter 31 in the adjustment chamber 92.
[0381] The adjustment unit 91 includes a blow plate 93. The blow plate 93 is disposed below the adjustment chamber 92. The blow plate 93 extends in a horizontal direction. The blow plate 93 has a plurality of blow holes 94. Therefore, the adjustment unit 91 can appropriately blow gas downward from the blow plate 93 through the blow holes 94.
[0382] A substrate holding portion 26 is disposed inside the processing housing 22. The substrate holding portion 26 is positioned below the adjustment portion 91. The substrate holding portion 26 holds the substrate W. Therefore, the adjustment portion 91 can appropriately supply gas to the substrate W held in the substrate holding portion 26. Specifically, the adjustment portion 91 can form a downflow of gas around the substrate W held in the substrate holding portion 26.
[0383] The regulating chamber 92 extends horizontally. Viewed from above, the regulating chamber 92 is larger than the filter 31. The regulating section 91 includes a guide member 97. The guide member 97 is disposed within the regulating chamber 92. The guide member 97 guides the gas downwards within the regulating chamber 92. Therefore, the guide member 97 prevents the blow-out plate 93 from including a portion with poor blowing. A portion with poor blowing is a portion of the blow-out plate 93 that substantially does not blow out gas. Therefore, the blow-out plate 93 does not include nozzles 94 that substantially do not blow out gas. Gas is blown out through all nozzles 94. Thus, the guide member 97 regulates the gas flow within the regulating chamber 92.
[0384] The blow plate 93 includes a core region 103 and a peripheral region 104. The core region 103 overlaps with the filter 31 in top view. The core region 103 is close to the filter 31. The peripheral region 104 is disposed outside the filter 31 in top view. The peripheral region 104 is far from the filter 31. Therefore, defective ejection portions are more likely to occur in the peripheral region 104 than in the core region 103. The entire guide member 97 is disposed outside the filter 31 in top view. That is, the entire guide member 97 is disposed above the peripheral region 104. Therefore, the guide member 97 prevents the peripheral region 104 from containing defective ejection portions. Specifically, the guide member 97 prevents the velocity of the first blow stream G1 from substantially becoming zero. The guide member 97 prevents the velocity of the second blow stream G2 from substantially becoming zero. The guide member 97 prevents the velocity of the third blow stream G3 from substantially becoming zero.
[0385] The entire guide member 97 is disposed on the outside of the substrate W held in the substrate holding portion 26 when viewed from above. Therefore, the guide region 104g is disposed on the outside of the substrate W held in the substrate holding portion 26 when viewed from above. The third blow-out flow G3 blowing out from the guide region 104g is relatively strong. Therefore, the third blow-out flow G3 protects the substrate W held in the substrate holding portion 26 from the influence of the atmosphere outside the third blow-out flow G3. The atmosphere outside the third blow-out flow G3 is equivalent to the atmosphere of the second region 109. Therefore, the third blow-out flow G3 keeps the substrate W held in the substrate holding portion 26 clean. As a result, the substrate processing apparatus 1 can process the substrate W held in the substrate holding portion 26 with good quality.
[0386] Furthermore, the third blow-out flow G3 increases the amount of gas supplied to the substrate W held in the substrate holding section 26. Therefore, the substrate processing apparatus 1 can process the substrate W held in the substrate holding section 26 with good quality.
[0387] The guide member 97 is disposed at the upper part of the adjustment chamber 92. The guide member 97 extends in the vertical direction Z. Therefore, the guide member 97 can appropriately guide the gas downward in the adjustment chamber 92.
[0388] The guide member 97 is disposed only in the upper part of the adjusting chamber 92. That is, the guide member 97 is not disposed in the lower part of the adjusting chamber 92. The guide member 97 opens the lower part of the adjusting chamber 92. Therefore, the gas flows through the lower part of the adjusting chamber 92 without stagnation. In other words, the gas does not stagnate in the lower part of the adjusting chamber 92. Therefore, the gas in the adjusting chamber 92 flows smoothly along the blow-out plate 93. As a result, the guide member 97 more appropriately prevents the blow-out plate 93 from containing poorly blown portions.
[0389] The guide member 97 is positioned at the upper part of the adjusting chamber 92. That is, the guide member 97 does not open the upper part of the adjusting chamber 92. Therefore, when gas passes through the guide member 97 (narrow passage 98), the gas does not bend upwards. Thus, the gas flows smoothly in the lower part of the adjusting chamber 92. As a result, the guide member 92 can more effectively prevent the blow-out plate 93 from containing defective portions.
[0390] Distance Ea is approximately equal to distance Da. Therefore, the difference in size between region 104a and region 104b is small. For example, viewed from above, the difference in size between region 104a and region 104b is small. Therefore, the velocity difference between the first blown stream G1 and the second blown stream G2 is small. Therefore, the guide member 97 can suitably prevent the peripheral region 104 from containing defective blown portions. Similarly, distance Eb is approximately equal to distance Db. Distance Ec is approximately equal to distance Dc. Therefore, the guide member 97 can more suitably prevent the peripheral region 104 from containing defective blown portions.
[0391] Distances Eb and Ea are approximately equal. Therefore, the velocity of the first outflow G1 is uniform throughout the first zone 104a without excessive unevenness. Thus, the guide member 97 can appropriately prevent the first zone 104a from containing defective outflow portions. Similarly, distances Ec and Ea are approximately equal. Therefore, the guide member 97 can more appropriately prevent the first zone 104a from containing defective outflow portions.
[0392] Preferably, the distances Db and Da are approximately equal. Therefore, the velocity of the second outflow G2 is uniform throughout the second zone 104b without excessive unevenness. Thus, the guide member 97 can suitably prevent the second zone 104b from containing defective outflow portions. Similarly, the distances Dc and Da are approximately equal. Therefore, the guide member 97 can more suitably prevent the second zone 104b from containing defective outflow portions.
[0393] The substrate processing apparatus 1 includes a blocking wall 96. The blocking wall 96 seals the side of the conditioning chamber 92. The blocking wall 96 prevents gas from flowing out of the conditioning chamber 92 through the side of the conditioning chamber 92. Therefore, all gas in the conditioning chamber 92 is discharged from the blow-out plate 93 through the blow-out hole 94. Therefore, the blocking wall 96 prevents the blow-out plate 93 from having defective blow-out portions.
[0394] The substrate processing apparatus 1 includes an ejection section 27. The ejection section 27 is disposed inside the processing housing 22. The ejection section 27 ejects processing liquid onto the substrate W held in the substrate holding section 26. The ejection section 27 includes a front end portion 88 movable to an ejection position and a standby position. When the front end portion 88 is in the standby position, it is disposed outside the substrate W held in the substrate holding section 26 in plan view. When the front end portion 88 is in the standby position, a guide member 97 is disposed between the front end portion 88 and the substrate W held in the substrate holding section 26 in plan view. In other words, when the front end portion 88 is in the standby position, it is located outside the guide member 97 in plan view, and the substrate W held in the substrate holding section 26 is located inside the guide member 97 in plan view. Therefore, when the front end portion 88 is in the standby position, a guide region 104g is disposed between the front end portion 88 and the substrate W held in the substrate holding section 26 in plan view. In other words, when the front end portion 88 is in the standby position, it is located outside the guide region 104g when viewed from above, and the substrate W held in the substrate holding portion 26 is located inside the guide region 104g when viewed from above. When the front end portion 88 is in the standby position, the third blow-out flow G3 is blown out between the front end portion 88 and the substrate W held in the substrate holding portion 26. Therefore, when the front end portion 88 is in the standby position, the third blow-out flow G3 protects the substrate W held in the substrate holding portion 26 from the influence of the front end portion 88. For example, the third blow-out flow G3 blocks the air waves near the front end portion 88 from affecting the substrate W held in the substrate holding portion 26. For example, the third blow-out flow G3 prevents particles from moving from the front end portion 88 to the substrate W held in the substrate holding portion 26. Therefore, the third blow-out flow G3 keeps the substrate W held in the substrate holding portion 26 cleaner. As a result, the substrate processing apparatus 1 can process the substrate W held in the substrate holding portion 26 with good quality.
[0395] The substrate processing apparatus 1 includes a cup 29. The cup 29 is disposed inside the processing housing 22. The cup 29 is arranged around the substrate holding portion 26. The cup 29 receives processing liquid. At least a portion of the guide member 97 overlaps with the cup 29 in plan view. Therefore, at least a portion of the guide region 104g overlaps with the cup 29 in plan view. At least a portion of the third blow-out stream G3 is blown out toward the cup 29. Therefore, the third blow-out stream G3 effectively protects the substrate W held in the substrate holding portion 26. Therefore, the third blow-out stream G3 effectively keeps the substrate W held in the substrate holding portion 26 clean. As a result, the substrate processing apparatus 1 can process the substrate W held in the substrate holding portion 26 with good quality.
[0396] For example, the third blow-out flow G3 effectively suppresses gas flow along the upper surface of the inclined portion 84 towards the central axis Q. For example, the third blow-out flow G3 effectively suppresses gas flow inward along the upper surface of the inclined portion 84 of the cup 29. For example, the third blow-out flow G3 effectively suppresses gas from entering the upper opening 85 near the upper surface of the inclined portion 84. Therefore, the third blow-out flow G3 effectively protects the substrate W held in the substrate holding portion 26 from the influence of the upper surface of the inclined portion 84. For example, the third blow-out flow G3 prevents the atmosphere near the upper surface of the inclined portion 84 from affecting the substrate W held in the substrate holding portion 26. For example, the third blow-out flow G3 prevents particles from moving from the upper surface of the inclined portion 84 to the substrate W held in the substrate holding portion 26.
[0397] The blow plate 93 can be attached to and removed from the processing housing 22. The blow plate 93 can be easily maintained.
[0398] The blow plate 93 includes a first component 101 and a second component 102. The second component 102 is adjacent to the first component 101. The first component 101 is smaller than the entire blow plate 93. For example, the size of the first component 101 is smaller than the overall size of the blow plate 93 when viewed from above. Therefore, the first component 101 can be maintained more easily. The second component 102 is smaller than the entire blow plate 93. For example, the size of the second component 102 is smaller than the overall size of the blow plate 93 when viewed from above. Therefore, the second component 102 can be maintained more easily. Therefore, the blow plate 93 can be maintained more easily.
[0399] Viewed from above, the first component 101 overlaps with the entire filter 31. Viewed from above, the entire second component 102 is disposed on the outside of the filter 31. Therefore, the filter 31 can be properly maintained by removing only the first component 101 from the processing housing 22. The filter 31 can be properly maintained without removing the second component 102 from the processing housing 22.
[0400] Regarding the implementation method and various variations, each component can be appropriately modified by replacing it with other variations or combinations thereof.
[0401] This invention can be implemented in other specific forms without departing from its spirit or essence; therefore, as a description of the invention, reference should be made to the appended claims rather than the foregoing description.
[0402] [Symbol Explanation]
[0403] 1 Substrate processing apparatus
[0404] 11 Processing Blocks
[0405] 12A, 12B, 12 transport spaces
[0406] 13A, 13B, 13 Transport Mechanism
[0407] 22 Processing Casing (First Processing Casing)
[0408] 22A First Processing Housing
[0409] 22B Second Processing Casing
[0410] 23t processing shell upper end
[0411] 23b Processing the lower end of the casing
[0412] 24 board
[0413] 24a 1st upper plate part
[0414] 24b 2nd upper plate part
[0415] 26 Substrate holding section
[0416] 27 Ejector section
[0417] 29 cups
[0418] 30 Gas Supply Unit (Gas Supply Unit 1)
[0419] 30A Gas Supply Unit 1
[0420] 31 Filter
[0421] 31a The upper surface of the filter
[0422] 31b The lower surface of the filter (the outlet surface of the filter)
[0423] 32 catheters
[0424] 33 Level 1
[0425] 34 Flat section
[0426] 34a Upper surface of the flat portion
[0427] 34b Lower surface of the flat section
[0428] 34c Opening of the flat part
[0429] 35. Peripheral part of the flat section
[0430] 36. Outer groove section
[0431] 37, 37a, 37b, 37c baffles
[0432] 38. Vertical section
[0433] 39. Level 2
[0434] 41 Fans
[0435] 51A, 51B, 51C, 51D, 51 Piping space
[0436] Exhaust ports 53 and 73
[0437] 55, 75 horizontal exhaust section
[0438] 56 Switching Mechanism
[0439] 60 Vertical exhaust section
[0440] 61 First vertical exhaust pipe
[0441] 62. Second vertical exhaust pipe
[0442] 63 Third vertical exhaust pipe
[0443] 65 Exhaust damper
[0444] 67 Pressure Sensor
[0445] 69 Control Department
[0446] The front end of the ejector section of 88, 88a, 88b, and 88c
[0447] 91 Adjustment Department
[0448] 92 Adjustment Room
[0449] 93 blow out plate
[0450] 94. Blowout Hole
[0451] 95 Support pin
[0452] 96. Blocking wall
[0453] 97. Guiding Components
[0454] 101 Part 1
[0455] 102 Part 2
[0456] 104g boot sector
[0457] G3 Third Blowout Flow
[0458] G3a inflow
[0459] G3b outflow
[0460] L1 is the length of the filter in the vertical direction.
[0461] L2 Length of the flat section in the vertical direction and the overall length of the filter.
[0462] L3 Length of the flat portion in the vertical direction
[0463] L4 Length of the outer groove in the vertical direction
[0464] The L5 air supply unit extends upwards from the processing housing, representing the protruding length of the air supply unit.
[0465] S-shaped concave space
[0466] W substrate
[0467] X (forward / backward direction, first direction)
[0468] Y-axis (second direction)
[0469] Z represents the vertical direction.
Claims
1. A substrate processing apparatus comprising: The first processing housing, with a processing substrate inside it; and The first gas supply unit supplies gas into the interior of the first processing housing; The first gas supply unit includes: A filter, configured at the upper part of the first processing housing, blows gas into the interior of the first processing housing; A conduit, disposed outside the first processing housing, is connected to the filter; and A fan, disposed outside the first processing housing, is connected to the duct; The fan, viewed from above, is positioned so as not to overlap with the filter. At least a portion of the fan is positioned at the same height as the first processing housing; The catheter has: The first horizontal section extends from the filter in a generally horizontal direction; The vertical portion extends downward from the first horizontal portion; and The second horizontal section extends from the vertical section in a generally horizontal direction to the fan and is positioned lower than the first horizontal section; The first processing housing has an upper plate. The upper board has: The first upper plate portion is for mounting the filter; and The second upper plate is disposed below the vertical portion and the second horizontal portion; The second upper plate portion is lower than the first upper plate portion.
2. A substrate processing apparatus, comprising: The first processing housing, with a processing substrate inside it; and The first gas supply unit supplies gas into the interior of the first processing housing; The first gas supply unit includes: A filter, configured at the upper part of the first processing housing, blows gas into the interior of the first processing housing; a conduit provided outside the first treatment housing and connected to the filter; and A fan, disposed outside the first processing housing, is connected to the duct; The fan, viewed from above, is positioned so as not to overlap with the filter. At least a portion of the fan is positioned at the same height as the first processing housing; The catheter has: The first horizontal section extends from the filter in a generally horizontal direction; The vertical portion extends downward from the first horizontal portion; and The second horizontal section extends from the vertical section in a generally horizontal direction to the fan and is positioned lower than the first horizontal section; The first processing housing has an upper plate. The upper board has: The first upper plate portion is for mounting the filter; and The second upper plate is disposed below the vertical portion and the second horizontal portion; The second upper plate part is lower than the first upper plate part; The catheter has: A flat section, positioned above the filter, extends horizontally and blows gas downwards; and The outer groove is connected to the periphery of the flat portion, and gas is delivered to the flat portion; The length of the outer groove in the vertical direction is greater than the length of the flat portion in the vertical direction.
3. The substrate processing apparatus according to claim 2, wherein The length of the flat portion in the vertical direction is less than the length of the filter in the vertical direction.
4. The substrate processing apparatus according to claim 2, wherein The length of the flat portion and the filter as a whole in the vertical direction is less than twice the length of the filter in the vertical direction.
5. The substrate processing apparatus according to claim 2, wherein The height of the upper surface of the flat portion corresponds to the upper end of the conduit.
6. The substrate processing apparatus according to claim 2, wherein The outer groove has a ring shape that surrounds the flat portion when viewed from above.
7. The substrate processing apparatus according to claim 2, wherein The outer groove extends downward from the peripheral edge of the flat portion. At least a portion of the outer groove overlaps with the filter when viewed from the front.
8. The substrate processing apparatus according to claim 2, wherein The conduit includes a baffle disposed in the outer groove portion, which guides a portion of the gas flowing through the outer groove portion to the flat portion.
9. The substrate processing apparatus according to claim 8, wherein The direction in which the baffle extends relative to the outer groove is intersecting.
10. A substrate processing apparatus comprising: The first processing housing, with a processing substrate inside it; and The first gas supply unit supplies gas into the interior of the first processing housing; The first gas supply unit includes: A filter, configured at the upper part of the first processing housing, blows gas into the interior of the first processing housing; a conduit provided outside the first treatment housing and connected to the filter; and A fan, disposed outside the first processing housing, is connected to the duct; The fan, viewed from above, is positioned so as not to overlap with the filter. At least a portion of the fan is positioned at the same height as the first processing housing; The catheter has: The first horizontal section extends from the filter in a generally horizontal direction; The vertical portion extends downward from the first horizontal portion; and The second horizontal section extends from the vertical section in a generally horizontal direction to the fan and is positioned lower than the first horizontal section; The first processing housing has an upper plate. The upper board has: The first upper plate portion is for mounting the filter; and The second upper plate is disposed below the vertical portion and the second horizontal portion; The second upper plate part is lower than the first upper plate part; The substrate processing apparatus includes: The transport space extends horizontally in a first direction and is adjacent to the first processing housing; A conveying mechanism, disposed in the conveying space, conveys the substrate into the interior of the first processing housing; and The piping space is adjacent to the first processing enclosure; and The first processing housing and the conveying space are arranged in a second horizontal direction orthogonal to the first direction when viewed from above. The first processing housing and the piping space are arranged in the first direction. The fan opens toward the piping space. The fan delivers gas from the piping space to the filter.
11. The substrate processing apparatus according to claim 10, wherein The first processing housing includes: An exhaust port is formed at a location facing the piping space; The fan is positioned above the exhaust port.
12. The substrate processing apparatus according to claim 11, wherein The substrate processing apparatus includes: A horizontal exhaust section is disposed in the piping space, connected to the exhaust port, and extends in a horizontal direction; and A vertical exhaust section is provided in the piping space, connected to the horizontal exhaust section, and extends in the vertical direction; The fan is positioned higher than the horizontal exhaust section. The fan and the vertical exhaust section are arranged in the second direction when viewed from the first direction.
13. The substrate processing apparatus according to claim 12, wherein The vertical exhaust section includes: The first vertical exhaust pipe extends in a vertical direction; and The second vertical exhaust pipe extends in the vertical direction; The horizontal exhaust section includes: The switching mechanism switches the exhaust path of the first processing housing to one of the first vertical exhaust pipe and the second vertical exhaust pipe; The fan, the first vertical exhaust pipe, and the second vertical exhaust pipe are arranged in the second direction when viewed from the first direction.
14. A substrate processing apparatus comprising: The first processing housing, with a processing substrate inside it; and The first gas supply unit supplies gas into the interior of the first processing housing; The first gas supply unit includes: A filter, configured at the upper part of the first processing housing, blows gas into the interior of the first processing housing; A conduit, disposed outside the first processing housing, is connected to the filter; A fan, disposed outside the first processing housing, is connected to the duct; An adjustment unit, located inside the first processing housing, receives gas blown out from the filter and blows the gas downwards; and A substrate holding section is provided inside the first processing housing and positioned below the adjustment section to hold the substrate; The fan, viewed from above, is positioned so as not to overlap with the filter. At least a portion of the fan is positioned at the same height as the first processing housing; The catheter has: The first horizontal section extends from the filter in a generally horizontal direction; The vertical portion extends downward from the first horizontal portion; and The second horizontal section extends from the vertical section in a generally horizontal direction to the fan and is positioned lower than the first horizontal section; The first processing housing has an upper plate. The upper board has: The first upper plate portion is for mounting the filter; and The second upper plate is disposed below the vertical portion and the second horizontal portion; The second upper plate part is lower than the first upper plate part; The filter blows the gas downwards. The adjustment unit includes: An adjustment chamber, located below the filter, extends horizontally and is larger than the filter when viewed from above; A guiding component, disposed in the adjustment chamber, guides the gas downwards within the adjustment chamber; and A blow plate, disposed below the adjustment chamber, extends horizontally and has multiple blow holes; The entire guide component is positioned on the outside of the filter when viewed from above. The entire guiding component, viewed from above, is positioned on the outside of the substrate held in the substrate holding portion. The blow-out plate includes a core area. The airflow blown out by the blower plate includes a core blowout flow. The core outflow is the airflow blown downwards from the core region. The core region overlaps with the substrate held in the substrate holding portion when viewed from above.
15. The substrate processing apparatus according to claim 14, wherein The guide component is disposed only in the upper part of the adjustment chamber and extends in the vertical direction.
16. The substrate processing apparatus according to claim 14, comprising: A blocking wall that seals off the side of the adjustment chamber.
17. The substrate processing apparatus according to claim 14, comprising: An ejection section is provided inside the first processing housing to eject the processing liquid onto the substrate held in the substrate holding section; The ejection section includes a front end portion that can move between an ejection position and a standby position. When the front end is in the standby position, the front end is positioned on the outside of the substrate held in the substrate holding portion when viewed from above. When the front end is in the standby position, the guide member is disposed between the front end and the substrate held in the substrate holding portion when viewed from above.
18. The substrate processing apparatus according to claim 14, comprising: A cup, disposed inside the first processing housing and arranged around the substrate holding portion, receives the processing liquid; At least a portion of the guide member overlaps with the cup when viewed from above.
19. The substrate processing apparatus according to claim 14, wherein The blow-out plate can be attached to or detached from the first processing housing.
20. The substrate processing apparatus according to claim 14, wherein The blow plate has the following features: Component 1; and The second component is adjacent to the first component.
21. The substrate processing apparatus according to any one of claims 1, 2, 10, and 14, wherein At least a portion of the fan is positioned lower than the filter.
22. The substrate processing apparatus according to any one of claims 1, 2, 10, and 14, wherein... The fan is positioned, when viewed from above, in a location that does not overlap with the first processing housing.
23. The substrate processing apparatus according to any one of claims 1, 2, 10, and 14, wherein... The protruding length of the first air supply unit extending upward from the first processing housing is less than twice the length of the filter in the vertical direction.
24. The substrate processing apparatus according to any one of claims 1, 2, 10, and 14, wherein A portion of the conduit overlaps with the filter in forward view.
25. The substrate processing apparatus according to any one of claims 1, 2, 10, and 14, wherein... The substrate processing apparatus includes: A pressure sensor measures the pressure of the gas inside the first processing housing; and The control unit controls the fan based on the detection results of the pressure sensor.
Citation Information
Patent Citations
Substrate processing apparatus and substrate processing method
JP2009200193A
Substrate processing device
JP1997145112A
Substrate processing apparatus
JP2015230921A
Substrate processing apparatus, substrate processing method and storage medium
JP2016127107A