Wafer transport apparatus and method

Abstract

The application discloses a wafer transmission device, which comprises a silicon box upper module, a wafer upper module, and a first carrying assembly. The silicon box upper module comprises a silicon box transmission assembly and a silicon box edge finding assembly. The silicon box transmission assembly is used for transmitting the silicon box into or out of the silicon box edge finding assembly. The silicon box edge finding assembly is used for rotating the silicon box to a set orientation. The wafer upper module comprises a wafer transmission assembly and a wafer edge finding assembly. The wafer transmission assembly is used for transmitting the wafer to the wafer edge finding assembly. The wafer edge finding assembly is used for rotating the wafer to a set orientation. The first carrying assembly is used for placing the wafer in the set orientation into the silicon box in the set orientation. The wafer transmission device and method can automatically realize silicon box transmission and edge finding and wafer transmission and edge finding, realize wafer transmission automation, place the wafer according to a preset angle, improve wafer transmission efficiency, and configure a FUU to prevent wafer pollution in the transmission process.

Description

Technical Field

[0001] This invention relates to the field of wafer transport, and more particularly to a wafer transport device and method. Background Technology

[0002] Currently, in the semiconductor industry, metal-organic chemical vapor deposition (MOCVD) involves manually handling silicon cassettes and manually loading and unloading wafers to achieve wafer transfer. After a single silicon cassette completes the MOCVD process, the operator needs to remove the wafers one by one, replace them with new silicon cassettes, and then place the wafers back into the silicon cassettes according to the required angle and order. The entire wafer transfer process is labor-intensive, time-consuming, and inefficient. Summary of the Invention

[0003] This invention aims to at least partially solve one of the problems in related technologies. Therefore, the object of this invention is to provide a wafer transport device and method capable of automatically realizing silicon cell transport and edge finding, as well as wafer transport and edge finding, achieving automated wafer transport, and placing wafers at preset angles, thereby improving wafer transport efficiency.

[0004] To achieve the above objectives, this application adopts the following technical solution: a wafer transfer device, comprising:

[0005] The silicon cell host module includes a silicon cell transmission component and a silicon cell edge finding component. The silicon cell transmission component is used to transmit the silicon cell into or out of the silicon cell edge finding component, and the silicon cell edge finding component is used to rotate the silicon cell to a set orientation.

[0006] A wafer-level module includes a wafer transport component and a wafer edge-finding component. The wafer transport component is used to transport the wafer to the wafer edge-finding component, and the wafer edge-finding component is used to rotate the wafer to a set orientation.

[0007] The first transport assembly is used to place the wafer with a set orientation into the silicon cassette with a set orientation.

[0008] Furthermore, the wafer edge finding component includes a wafer rotation tray, a wafer detection device, and a wafer control center. The wafer rotation tray and the wafer detection device are simultaneously connected to the wafer control center. The wafer detection device is used to identify the position of the wafer on the wafer rotation tray and transmit the information to the control center. The control center controls the wafer rotation tray to rotate the wafer to a set orientation.

[0009] Furthermore, the wafer inspection device includes a wafer position sensor.

[0010] Furthermore, the wafer inspection device includes a first vision system, which includes a first camera located above the wafer rotating tray and connected to the wafer control center.

[0011] Furthermore, the first vision system also includes a first ring-shaped fill light, which is arranged around the outside of the first camera.

[0012] Furthermore, the silicon cell host module consists of two symmetrically arranged modules.

[0013] Furthermore, the silicon wafer edge-finding assembly includes a silicon wafer rotating tray, a silicon wafer detection device, and a silicon wafer control center. The silicon wafer rotating tray and the silicon wafer detection device are both connected to the silicon wafer control center. The silicon wafer rotating tray contains M silicon wafer placement positions. The silicon wafer detection device is used to identify the position of the silicon wafers on the silicon wafer rotating tray and transmit the information to the silicon wafer control center. The silicon wafer control center controls the silicon wafer rotating tray to rotate the silicon wafers to a set orientation; M is an integer greater than 0.

[0014] Furthermore, the silicon cassette inspection device includes a second vision system, which includes a second camera located above the silicon cassette rotating tray and connected to the silicon cassette control center; the second camera is located in a second camera bracket and is movable along the second camera bracket.

[0015] Furthermore, the silicon cartridge detection device also includes a cleaner for cleaning the silicon cartridge, the cleaner including a suction head connected to a vacuum pipe.

[0016] A method for wafer transfer, characterized by comprising the following steps:

[0017] S1: The wafer transfer assembly transfers the wafer to the wafer edge finding assembly, which rotates the wafer to a set orientation;

[0018] S2: The silicon cell transfer component transmits the silicon cell to the silicon cell edge finding component, which rotates the silicon cell to a set orientation;

[0019] S3: The first transport component places the wafer with the set orientation into the silicon cassette with the set orientation;

[0020] S4: The silicon cell transfer component transfers the silicon cell containing the wafer in the silicon cell edge finding component out of the silicon cell edge finding component.

[0021] Compared with the prior art, the technical solution provided in this application has the following advantages: This application uses a silicon cassette upper module to realize the input and output of silicon cassettes. The silicon cassette transmission component is used to input or output the silicon cassette edge-finding component, and the silicon cassette edge-finding component is used to rotate the silicon cassette to a set orientation. This application uses a wafer transmission component to transmit the wafer to the wafer edge-finding component, and the wafer edge-finding component rotates the wafer to a set orientation. Then, the wafer with the set orientation is placed in the silicon cassette with the set orientation by the first transport component. This application can be applied to wafer transmission after MOCVD is completed. The wafer after MOCVD can be transmitted to the next process through the wafer upper module and the silicon cassette upper module. It can automatically realize silicon cassette transmission and edge-finding as well as wafer transmission and edge-finding, realize wafer transmission automation, and place the wafer according to a preset angle, improve wafer transmission efficiency, and configure FUU to prevent wafer contamination during transmission. Attached Figure Description

[0022] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] In the attached image:

[0025] Figure 1 This is a schematic diagram of the wafer transport device in this application;

[0026] Figure 2 This is a schematic diagram of the structure of the upper-level module on the wafer;

[0027] Figure 3 This is a schematic diagram of the structure of the silicon cell host module;

[0028] Reference numerals: 1. Rack; 2. Material rack; 3. Wafer transport assembly; 4. Wafer edge finding assembly; 41. First camera; 42. First ring light; 43. ID reader; 44. Wafer rotating tray; 5. First handling assembly; 6. Silicon cassette edge finding assembly; 61. Second camera; 62. Second ring light; 63. Strip light source; 64. Silicon cassette; 65. Silicon cassette rotating tray; 8. Silicon cassette transport assembly; 9. Buffer area. Detailed Implementation

[0029] To provide a clearer understanding of the technical features, objectives, and effects of this invention, specific embodiments are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the orientations or positional relationships indicated by terms such as "front," "rear," "upper," "lower," "left," "right," "longitudinal," "horizontal," "vertical," "horizontal," "top," "bottom," "inner," "outer," "head," and "tail" are based on the orientations or positional relationships shown in the accompanying drawings, and are constructed and operated in a specific orientation. They are only for the convenience of describing this technical solution and do not indicate that the referred mechanism or element must have a specific orientation; therefore, they should not be construed as limitations on this invention.

[0030] It should also be noted that, unless otherwise explicitly specified and limited, terms such as "installation," "connection," "linking," "fixing," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. When an component is referred to as being "on" or "below" another component, the component can be located "directly" or "indirectly" on the other component, or there may be one or more intermediary components. The terms "first," "second," "third," etc., are only for the convenience of describing this technical solution and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first," "second," "third," etc., may explicitly or implicitly include one or more of that feature. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0031] In the following description, specific details such as particular system structures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of the invention. However, those skilled in the art will understand that the invention can be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted so as not to obscure the description of the invention with unnecessary detail.

[0032] Please see the appendix Figure 1-3 This application provides a wafer transmission device, comprising:

[0033] The silicon cell upper module includes a silicon cell transmission component 8 and a silicon cell edge finding component 6. The silicon cell transmission component 8 is used to transmit the silicon cell 64 into or out of the silicon cell edge finding component 6, and the silicon cell edge finding component 6 is used to rotate the silicon cell 64 to a set orientation.

[0034] The wafer upper module includes a wafer transfer component 3 and a wafer edge finding component 4. The wafer transfer component 3 is used to transfer the wafer to the wafer edge finding component 4, and the wafer edge finding component 4 is used to rotate the wafer to a set orientation.

[0035] The first transport assembly 5 is used to place a wafer with a set orientation into a silicon cassette 64 with a set orientation.

[0036] In this application, setting the orientation of the wafer refers to orienting the notch or identification mark on the wafer towards a fixed direction. The specific fixed direction can be determined according to actual needs or subsequent processes. Similarly, setting the orientation of the silicon cartridge 64 refers to orienting the identification mark in the silicon cartridge 64 towards a fixed direction. The specific fixed direction can be determined according to actual needs or subsequent processes. During the placement of the wafer into the silicon cartridge 64, in order to ensure the smooth progress of subsequent processes, the notch or other identification mark on the wafer needs to be aligned with a specific position in the silicon cartridge 64. Therefore, the silicon cartridge 64 in this application is also equipped with corresponding identification marks. To facilitate wafer placement, before placing the wafer, the notch or identification mark on the wafer is first oriented towards a fixed direction, and then the identification mark in the silicon cartridge 64 is oriented towards a fixed direction. In this way, the placement of the wafer at a specific angle or position can be achieved with only a fixed action transmission placement.

[0037] This application employs a silicon cassette upper module to realize the input and output of silicon cassette 64. The silicon cassette transfer component 8 is used to input or output silicon cassette 64 to the silicon cassette edge-finding component 6, and the silicon cassette edge-finding component 6 is used to rotate the silicon cassette 64 to a set orientation. This application employs a wafer transfer component 3 to transfer the wafer to the wafer edge-finding component 4, and the wafer edge-finding component 4 rotates the wafer to a set orientation. Then, the first transport component 5 places the wafer with the set orientation into the silicon cassette 64 with the set orientation. This application can be applied to wafer transfer after MOCVD is completed. It can transfer the wafer after MOCVD to the next process through the wafer upper module and the silicon cassette upper module, automatically realizing silicon cassette 64 transfer and edge-finding as well as wafer transfer and edge-finding. It can automate wafer transfer and place the wafer at a preset angle, improving wafer transfer efficiency.

[0038] As attached Figure 1 As shown, in this application, both the wafer host module and the silicon cassette host module are installed in rack 1.

[0039] In this application, the wafer edge finding component 4 includes a wafer rotation tray 44 and a wafer detection component. The wafer detection component is used to identify the position of the wafer on the wafer rotation tray 44 and control the wafer rotation tray 44 to rotate the wafer to a set orientation.

[0040] As attached Figure 2As shown, the wafer rotation tray 44 in this application is a circular tray with wafer placement positions. The wafer rotation tray 44 can rotate, allowing notches or other identification marks on the wafer to face a predetermined direction. In this application, both the wafer rotation tray 44 and the wafer detection device are connected to a wafer control center. The wafer control center controls the rotation of the wafer rotation tray 44 according to the detection structure of the wafer detection device, thereby causing the notches or other identification marks on the wafer to face a specific direction.

[0041] As a specific embodiment, the wafer transfer component 3 in this application can be a robotic arm used to pick up wafers from the rack 2 and place them in the wafer rotating tray 44.

[0042] As a specific embodiment, the wafer inspection device in this application includes a wafer position sensor. The wafer position sensor senses the notch or identification mark in the wafer and transmits its position to the wafer control center. The wafer control center then controls the wafer rotating tray to rotate, causing the notch or identification mark in the wafer to rotate to a specific position.

[0043] As another specific embodiment, see the attached document. Figure 2 As shown, the wafer inspection device in this application includes a first vision system, which includes a first camera 41 located above the wafer rotating tray 44 and connected to a wafer control center. The first camera 41 is used to take pictures of the wafer rotating tray 44 and transmit the images to the wafer control center. The wafer control center identifies the position of the wafer notch or identification mark based on the image and controls the rotation direction and rotation angle of the wafer rotating tray 44 based on the position information, so that the wafer is oriented towards a specific position.

[0044] To ensure clear shooting results from the first camera 41, the first vision system also includes a first ring-shaped fill light 42, which is arranged around the outside of the first camera 41 and is used to provide fill light within the field of view of the first camera 41 when it is shooting.

[0045] In order to record the placement position of the wafer or to clarify the information parameters of the wafer, this application may also set an ID reader 43 above the wafer rotating tray 44 for identifying the wafer, such as obtaining the information parameters of the wafer by scanning the QR code on the wafer.

[0046] The silicon wafer edge-finding component in this application includes a silicon wafer rotating tray 65, a silicon wafer detection device, and a silicon wafer control center. The silicon wafer rotating tray 65 and the silicon wafer detection device are both connected to the silicon wafer control center. The silicon wafer rotating tray 65 contains M silicon wafer placement positions. The silicon wafer detection device is used to identify the position of the silicon wafer 64 on the silicon wafer rotating tray 65 and transmit it to the silicon wafer control center. The silicon wafer control center controls the silicon wafer rotating tray 65 to rotate the silicon wafer 64 to a set orientation; M is an integer greater than 0.

[0047] To improve wafer placement efficiency, the silicon cassette upper-level modules in this application are arranged symmetrically in two. Since there are multiple silicon cassettes 64 in the silicon cassette rotating tray 65, the position of each silicon cassette 64 needs to be adjusted before placing the wafer. When the position of the silicon cassette 64 on one of the silicon cassette rotating trays 65 is adjusted, the first transport component 5 can place the wafer into the adjusted silicon cassette 64 on the other silicon cassette rotating tray 65. The two silicon cassette upper-level modules work together to improve wafer placement efficiency.

[0048] As attached Figure 3 As shown, the silicon cassette rotating tray 65 in this application is a circular tray with multiple silicon cassette placement positions. The silicon cassette rotating tray 65 is rotatable, allowing the identification mark in the silicon cassette 64 to face a predetermined direction. In this application, both the silicon cassette rotating tray 65 and the silicon cassette detection device are connected to a silicon cassette control center. The silicon cassette control center controls the rotation of the silicon cassette rotating tray 65 according to the detection structure of the silicon cassette detection device, thereby causing the identification mark in the silicon cassette 64 to face a specific direction.

[0049] As a specific embodiment, the silicon cassette transfer component 8 in this application is a robotic arm used to grab silicon cassettes 64 from the buffer area 9 and transfer them to the silicon cassette rotating tray 65.

[0050] As a specific embodiment, the silicon cell detection device in this application includes a silicon cell position sensor. The silicon cell position sensor senses the notch or identification mark in the silicon cell 64 and transmits its position to the silicon cell control center. The silicon cell control center then controls the silicon cell rotating tray 65 to rotate, causing the identification mark in the silicon cell 64 to rotate to a specific position.

[0051] In another specific embodiment, the silicon cassette detection device includes a second vision system, which includes a second camera 61 located above the silicon cassette rotating tray 65 and connected to the silicon cassette control center. The second camera 61 is used to take pictures of the silicon cassette rotating tray 65 and transmit the images to the silicon cassette control center. The silicon cassette control center identifies the position of the identification mark of the silicon cassette 64 based on the image and controls the rotation direction and rotation angle of the silicon cassette rotating tray 65 so that the silicon cassette 64 faces a specific position.

[0052] Since there are multiple silicon cassettes 64 in the silicon cassette rotating tray 65, and the field of view of the second camera 61 can only capture images of a portion of the silicon cassettes 64, the second camera 61 in this application is located in a second camera bracket and can move along the bracket in any direction (forward, backward, left, or right) to adjust its position so that it can capture images of the silicon cassettes 64 at different locations. Simultaneously, the silicon cassette rotating tray 65 in this application can rotate, and the movement of the second camera 61 combined with the rotation of the silicon cassette rotating tray 65 allows the second camera 61 to capture images covering the entire surface of the silicon cassette rotating tray 65.

[0053] To ensure clear image capture by the second camera 61, the second vision system also includes a second ring-shaped fill light 62. The second ring-shaped fill light 62 is positioned around the outside of the second camera 61 to provide supplementary lighting within its field of view during image capture. Since the field of view of the second camera 61 is smaller than that of the silicon cartridge rotating tray 65, in this application, the second ring-shaped fill light 62 can be positioned below the second camera 61 and above the silicon cartridge rotating tray 65. Simultaneously, to ensure effective lighting, a strip light source 63 can also be provided on the side of the silicon cartridge rotating tray 65 for supplementary lighting during image capture by the second camera 61.

[0054] In this application, the silicon cassette 64, before being transferred to the silicon cassette rotating tray 65, is located in the atmospheric environment, and there may be particulate impurities on its surface or inside. In order to ensure that the wafer placed in the silicon cassette 64 is not contaminated, the silicon cassette detection device in this application also includes a cleaner for cleaning the silicon cassette 64. The cleaner includes a suction head connected to a vacuum pipe. When the silicon cassette transfer assembly 8 transfers the silicon cassette 64 to the silicon cassette rotating tray 65, the suction head is aligned with the silicon cassette 64, and the particulate impurities on the silicon cassette 64 are cleaned by the vacuuming effect of the vacuum pipe, and then the position of the silicon cassette 64 is adjusted.

[0055] This application also provides a method for wafer transfer, comprising the following steps:

[0056] S1: The wafer transfer component 3 transfers the wafer to the wafer edge finding component 4, and the wafer edge finding component 4 rotates the wafer to a set orientation; specifically including:

[0057] S11: The wafer transfer assembly 3 is a robotic arm that picks up the wafer from the rack 2 and places it in the wafer rotating tray 44;

[0058] S12: The first ring-shaped fill light 52 is turned on to provide fill light, and the first camera 41 is used to take pictures of the wafer rotating tray 44 and transmit the images to the wafer control center. The wafer control center identifies the position of the wafer notch or identification mark based on the image.

[0059] S13: The wafer control center controls the rotation direction and rotation angle of the wafer rotating tray 44 according to the position information, so that the wafer is oriented towards a specific position;

[0060] S2: Silicon cell transfer assembly 8 transmits silicon cell 64 to silicon cell edge finding assembly 6, and silicon cell edge finding assembly 6 rotates silicon cell 64 to a set orientation; specifically including:

[0061] S21: Silicon cassette transfer assembly 8 is a robotic arm that picks up silicon cassette 64 from buffer area 9 and transfers it to silicon cassette rotating tray 65;

[0062] S22: The suction head is aligned with the silicone cartridge 64, and the particulate impurities on the silicone cartridge 64 are cleaned by the vacuuming effect of the vacuum tube.

[0063] S23: The second ring-shaped fill light 62 and the strip light source 63 are turned on for fill lighting. The second camera 61 takes a picture of the silicon cartridge rotating tray 65 and transmits the image to the silicon cartridge control center. The silicon cartridge control center identifies the position of the identification mark on the silicon cartridge 64 based on the image and transmits the position information to the silicon cartridge control center.

[0064] S24: The silicon cell control center controls the rotation direction and rotation angle of the silicon cell rotating tray 65 according to the position information, so that the silicon cell 64 faces a specific position;

[0065] S3: The first transport component 5 places the wafer with the set orientation into the silicon cassette 64 with the set orientation; the first transport component 5 can be a robotic arm, and since the orientation of the wafer and the orientation of the silicon cassette 64 are fixed, the transport action of the first transport component 5 is also fixed.

[0066] S4: After all the silicon cassettes 64 in the silicon cassette rotating tray 65 have been filled with wafers, the silicon cassette transfer assembly 8 transfers the silicon cassettes 64 in the silicon cassette edge finding assembly 6 from the silicon cassette edge finding assembly 6 to the buffer area 9 for storage.

[0067] The cache area 9 in this application can be a cargo vehicle or a storage repository for placing silicon boxes, etc., as is done in the prior art.

[0068] It is understood that the above embodiments only illustrate preferred embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can freely combine the above technical features without departing from the concept of the present invention, and can also make several modifications and improvements, all of which fall within the protection scope of the present invention. Therefore, all equivalent transformations and modifications made with respect to the scope of the claims of the present invention should fall within the scope of the claims of the present invention.

Claims

1. A wafer transport device, suitable for wafer transport after MOCVD is completed, characterized in that, include: The silicon cell host module includes a silicon cell transmission component and a silicon cell edge finding component. The silicon cell transmission component is used to transmit the silicon cell into or out of the silicon cell edge finding component, and the silicon cell edge finding component is used to rotate the silicon cell to a set orientation. The silicon cell edge-finding assembly includes a silicon cell rotating tray, a silicon cell detection component, and a silicon cell control center. The silicon cell rotating tray and the silicon cell detection component are both connected to the silicon cell control center. The silicon cell rotating tray is a circular tray containing M silicon cell placement positions, which are evenly distributed in a ring on the tray. The silicon cell detection component identifies the position of the silicon cells on the rotating tray and transmits this information to the silicon cell control center. The silicon cell control center controls the rotating tray to rotate the silicon cells to a set orientation. M is an integer greater than 0. The silicon cassette inspection device includes a second vision system, which includes a second camera located above the silicon cassette rotating tray. The second camera is connected to the silicon cassette control center. The second camera is located in a second camera bracket and can move back, forth, left, and right along the second camera bracket. The silicon cassette rotating tray can rotate. The movement of the second camera combined with the rotation of the silicon cassette rotating tray allows the shooting range of the second camera to cover the entire surface of the silicon cassette rotating tray. The silicon box upper module consists of two symmetrically arranged modules. When the position of the silicon box on one silicon box rotating tray is adjusted, the first transport component can place the wafer into the silicon box that has been adjusted on the other silicon box rotating tray. The two silicon box upper modules work together. The silicon cartridge inspection device also includes a cleaner for cleaning the silicon cartridge, the cleaner including a suction head connected to a vacuum pipe; when the silicon cartridge transfer assembly transfers the silicon cartridge to the silicon cartridge rotating tray, the suction head is aligned with the silicon cartridge, and the particulate impurities on the silicon cartridge are cleaned by the vacuuming effect of the vacuum pipe, and then the position of the silicon cartridge is adjusted; the top of the silicon cartridge is provided with a groove for placing wafers. A wafer-level module includes a wafer transport component and a wafer edge-finding component. The wafer transport component transports the wafer to the wafer edge-finding component, and the wafer edge-finding component rotates the wafer to a set orientation. The wafer edge-finding component includes a wafer rotation tray, a wafer detection device, and a wafer control center. The wafer rotation tray and the wafer detection device are connected to the wafer control center. The wafer detection device identifies the position of the wafer on the wafer rotation tray and transmits the information to the control center. The control center controls the wafer rotation tray to rotate the wafer to the set orientation. The first transport assembly is used to place the wafer with a set orientation into the silicon cassette with a set orientation.

2. The wafer transport device according to claim 1, characterized in that, Wafer inspection components include wafer position sensors.

3. The wafer transport device according to claim 1, characterized in that, The wafer inspection device includes a first vision system, which includes a first camera located above a wafer rotating tray and connected to a wafer control center.

4. A wafer transport device according to claim 3, characterized in that, The first vision system also includes a first ring-shaped fill light, which is arranged around the outside of the first camera.

5. A method for wafer transfer using the wafer transfer device according to any one of claims 1-4, characterized in that, Includes the following steps: S1: The wafer transfer assembly transfers the wafer to the wafer edge finding assembly, which rotates the wafer to a set orientation; S2: The silicon cell transfer component transmits the silicon cell to the silicon cell edge finding component, which rotates the silicon cell to a set orientation; S3: The first transport component places the wafer with the set orientation into the silicon cassette with the set orientation; S4: The silicon cell transfer component transfers the silicon cell containing the wafer in the silicon cell edge finding component out of the silicon cell edge finding component.

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