Fingerprint sensor package and smart card comprising the same

Abstract

A fingerprint sensor package and a smart card including the same are provided. The fingerprint sensor package includes a first substrate including a core insulating layer, a first bonding pad on the core insulating layer, and an external connection pad between an edge of a second surface of the core insulating layer and the first bonding pad; a second substrate on the core insulating layer, the second substrate including a plurality of first sensing patterns spaced apart in a first direction and extending in a second direction intersecting the first direction, a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction, and a second bonding pad; a conductive wire electrically connecting the first bonding pad to the second bonding pad; a controller chip on the second substrate; and a molding layer covering the second substrate and the first bonding pad and spaced apart from the external connection pad.

Description

[0001] Cross-references to related applications

[0002] This application is based on and claims priority to Korean Patent Application No. 10-2021-0030940, filed on March 9, 2021, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present invention relates to a fingerprint sensor package and a smart card including the fingerprint sensor package. Background Technology

[0004] Fingerprint recognition technology is used to prevent security incidents by recognizing a user's fingerprint to complete registration and authentication procedures. Specifically, it is applied to network defense for individuals and organizations, protection of various content and data, and secure access to financial information. Fingerprint sensors acquire a user's fingerprint information using optical, capacitive, ultrasonic, and thermal sensing methods. The latest trend in the fingerprint sensor industry is to achieve low cost while continuously reducing product size and thickness. Therefore, fingerprint sensor packages need to be economically viable while maintaining the reliability and sensitivity of fingerprint information acquisition and reducing overall size and height. Summary of the Invention

[0005] The present invention provides a fingerprint sensor package with improved reliability and a smart card including the fingerprint sensor package to prevent financial incidents due to theft or loss of the smart card.

[0006] The technical spirit of this invention is not limited to the problems mentioned above, and those skilled in the art will clearly understand other unmentioned problems based on the following description.

[0007] In some example embodiments, a fingerprint sensor package includes a first substrate, a second substrate, conductive lines, a controller chip, and a molding layer. The first substrate may include: a core insulating layer including a first surface and a second surface opposite to each other; a first bonding pad located on the second surface of the core insulating layer; and an external connection pad located between an edge of the second surface of the core insulating layer and the first bonding pad. The second substrate may be located on the second surface of the core insulating layer and may include: a plurality of first sensing patterns spaced apart from each other in a first direction and extending in a second direction intersecting the first direction; a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction; and a second bonding pad. The conductive lines can connect the first bonding pad to the second bonding pad. The controller chip may be located on the second substrate. The molding layer may be located on the second surface of the core insulating layer and the second substrate. The molding layer may cover the second substrate and the first bonding pad. The molding layer may be spaced apart from the external connection pad.

[0008] In some example embodiments, a fingerprint sensor package may include a first substrate, a second substrate, conductive lines, a controller chip, connection bumps, and a molding layer. The first substrate may include: a core insulating layer including a first surface and a second surface opposite to each other; a coating layer located on the first surface of the core insulating layer; a ground bezel located on the first surface of the core insulating layer and surrounding the coating layer in a first direction and a second direction intersecting the first direction; an adhesive layer located between the coating layer and the core insulating layer, and between the core insulating layer and the ground bezel; a first bonding pad located on the second surface of the core insulating layer; and an external connection pad located between the edge of the second surface of the core insulating layer and the first bonding pad. The second substrate may include: a plurality of first sensing patterns spaced apart from each other in the first direction and extending in the second direction; a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction; and a second bonding pad. The conductive lines can electrically connect the first bonding pad to the second bonding pad. The controller chip may be located on the second substrate. The connection bump may be located between the second substrate and the controller chip, and may electrically connect the second substrate to the controller chip. The molding layer may cover the second substrate and the controller chip, and may extend from the side surface of the second substrate to the boundary between the second bonding pad and the external connection pad. The plurality of first sensing patterns and the plurality of second sensing patterns may be spaced apart from each other in a third direction perpendicular to the first direction and the second direction, and the plurality of first sensing patterns and the plurality of second sensing patterns may together form a plurality of capacitors.

[0009] In some example embodiments, a smart card may include a card body, a security chip, and a fingerprint sensor package. The card body may include a recessed area and connection pads. The security chip may be located within the card body. The fingerprint sensor package may be configured to sense a user's fingerprint and send a signal of the sensing result to the security chip. The fingerprint sensor package may include a first substrate, a second substrate, conductive lines, a controller chip, and a molding layer. The first substrate may include: a core insulating layer including a first surface and a second surface opposite to each other; a first bonding pad located on the second surface of the core insulating layer; and an external connection pad located between an edge of the second surface of the core insulating layer and the first bonding pad. The second substrate may be located on the second surface of the core insulating layer and may include: a plurality of first sensing patterns spaced apart from each other in a first direction and extending in a second direction intersecting the first direction; a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction; and a second bonding pad. The conductive lines may extend between the first bonding pad and the second bonding pad and may electrically connect the first bonding pad to the second bonding pad. The controller chip may be located on the second substrate. The molding layer may be located on the second surface of the core insulating layer and on the second substrate. The molding layer may cover the second substrate and the first bonding pad, but may not cover the external connection pad. The external connection pad of the first substrate may be bonded to the connection pad of the card body. Attached Figure Description

[0010] Example embodiments of the inventive concept will become clearer from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0011] Figure 1 This is a schematic perspective view illustrating some example embodiments of a smart card according to a concept of the present invention;

[0012] Figure 2A This is a bottom view schematically illustrating the layout of some components of a fingerprint sensor package according to some exemplary embodiments of the present invention.

[0013] Figure 2B It is shown Figure 2A A top view of the fingerprint sensor package;

[0014] Figure 2C It is along Figure 2A A cross-sectional view taken from line 2C-2C';

[0015] Figure 2DIt is along Figure 2A A cross-sectional view of the line 2D-2D';

[0016] Figure 2E It is shown Figure 2A The magnified view of the magnified area indicated by "2E" in the image;

[0017] Figure 3 This is a cross-sectional view illustrating some exemplary embodiments of a fingerprint sensor package according to a concept of the present invention;

[0018] Figure 4 and Figure 5 They are Figure 3 The image shows a bottom view of the inner molding layer of the fingerprint sensor package 20.

[0019] Figure 6 and Figure 7 These are top views of a first substrate of a fingerprint sensor package according to some exemplary embodiments of the present invention;

[0020] Figure 8 This is a cross-sectional view illustrating some exemplary embodiments of a fingerprint sensor package according to a concept of the present invention;

[0021] Figure 9 This is a cross-sectional view illustrating some exemplary embodiments of a fingerprint sensor package according to a concept of the present invention;

[0022] Figure 10A , Figure 10B , Figure 10C , Figure 10D , Figure 10E and Figure 10F These are diagrams illustrating, in sequence, methods for manufacturing smart cards according to some exemplary embodiments of the present invention; and

[0023] Figure 11 This is a top view illustrating a mobile device including a fingerprint sensor package, based on some example embodiments of the concept according to the present invention. Detailed Implementation

[0024] In the following, some exemplary embodiments of the technical concept of the present invention will be described in detail with reference to the accompanying drawings.

[0025] It will be understood that when an element, such as a layer, film, region, or substrate, is referred to as being “on” another element, it can be located directly on the other element, or there may be intermediate elements present. In contrast, when an element is referred to as being “on” another element, there are no intermediate elements present. It will also be understood that when an element is referred to as being “on” another element, it can be located directly above or below the other element or adjacent to other elements (e.g., horizontally adjacent).

[0026] It will be understood that elements and / or properties (e.g., structure, surface, orientation, etc.) that can be described as "perpendicular", "parallel", "coplanar" or so relative to other elements and / or their properties (e.g., structure, surface, orientation, etc.) can be "perpendicular", "parallel", "coplanar" or so relative to other elements and / or their properties, respectively, or can be "substantially perpendicular", "substantially parallel", "substantially coplanar".

[0027] An element and / or its properties (e.g., structure, surface, orientation, etc.) that are “substantially perpendicular” to other elements and / or their properties will be understood as being “perpendicular” to other elements and / or their properties within manufacturing and / or material tolerances, and / or having a deviation of the magnitude or angle of “perpendicular” from other elements and / or their properties by an amount equal to or less than 10% (e.g., ±10% tolerance).

[0028] A component and / or its properties that are “substantially parallel” to other components and / or their properties (e.g., structure, surface, orientation, etc.) will be understood as being “parallel” to other components and / or their properties within manufacturing and / or material tolerances, and / or having a deviation of equal to or less than 10% (e.g., ±10% tolerance) from the magnitude or angle of “parallel” relative to other components and / or their properties.

[0029] Elements and / or properties that are “substantially coplanar” relative to other elements and / or their properties (e.g., structure, surface, orientation, etc.) will be understood as being “coplanar” relative to other elements and / or their properties within manufacturing and / or material tolerances, and / or having a deviation of equal to or less than 10% (e.g., ±10% tolerance) from the magnitude or angle of “coplanar” relative to other elements and / or their properties.

[0030] It will be understood that an element and / or its properties may be described herein as “identical” or “equal” to other elements, and it will also be understood that an element and / or its properties described herein as “equivalent,” “identical,” or “equal” to other elements may be “equivalent,” “identical,” or “equal” to other elements or their properties, or “substantially equivalent,” “substantially the same,” or “substantially the same.” Element and / or its properties being “substantially equivalent,” “substantially the same,” or “substantially the same” to other elements and / or their properties will be understood to include elements and / or their properties being equivalent, identical, or equal to other elements and / or their properties within manufacturing tolerances and / or material tolerances. Element and / or its properties being equivalent or substantially equivalent to other elements and / or their properties and / or identical or substantially the same may be structurally identical or substantially identical, functionally identical or substantially identical, and / or compositionally identical or substantially identical.

[0031] It will be understood that elements and / or properties described herein as “substantially” identical and / or equivalent encompass elements and / or properties having a relative difference of 10% or less in magnitude. Furthermore, regardless of whether an element and / or property is modified to “substantially,” it will be understood that such elements and / or properties should be interpreted to include manufacturing or operational tolerances (e.g., ±10%) surrounding said elements and / or properties.

[0032] When the terms “approximately” or “substantially” are used in conjunction with numerical values ​​in this specification, the associated numerical values ​​are intended to include a tolerance of ±10% to the left and right of said value. When a range is specified, the range includes all values ​​in between, such as increments of 0.1%.

[0033] Figure 1 This is a schematic perspective view illustrating some example embodiments of a smart card 1 according to the present invention.

[0034] Reference Figure 1 The smart card 1 may include a fingerprint sensor package 10, a security chip 11, a display unit 12 (e.g., a display device, a light-emitting diode (LED) display, an organic LED (OLED) display, etc.) and a power button 13.

[0035] The smart card 1 may also include a storage device for storing information such as a card number identification unit, an expiration date identification unit, and a username displayed on a traditional credit card or check card. The smart card 1 may also include an RF chip.

[0036] When a user touches their fingerprint with the fingerprint sensor, the fingerprint sensor package 10 can recognize the touched fingerprint. The fingerprint sensor package 10 can compare the recognized fingerprint with a registered fingerprint to determine whether the recognized fingerprint matches the registered fingerprint. The fingerprint sensor package 10 can operate after the smart card 1 is switched to the access state.

[0037] The security chip 11 can store encrypted financial information. When the identified fingerprint matches the registered fingerprint, the security chip 11 can grant payment authorization to the user of the smart card 1. For example, based on the recognition result of the fingerprint sensor package 10, the security chip 11 grants payment authority to the user, enabling the smart card 1 to prevent financial incidents caused by theft or loss.

[0038] The display unit 12 can display whether the recognized fingerprint matches the registered fingerprint, whether there is an on / off state, etc. The display unit 12 can display letters, numbers, special symbols, etc., and in some cases, it may also include a light-emitting unit. However, depending on the type of smart card 1, the display unit 12 may be omitted.

[0039] The power button 13 can connect / disconnect the smart card 1. The smart card 1 can be switched from a disconnected state to a connected state by operating the power button 13, and vice versa. Additionally, after a set time has elapsed since the smart card 1 was switched to the connected state, it can automatically switch back to the disconnected state. However, depending on the type of smart card 1, the power button 13 may be omitted.

[0040] In some example embodiments, the thickness TH of smart card 1 can range from approximately 0.5 mm to approximately 1 mm. Additionally, according to international standards, the thickness TH of smart card 1 can be approximately 0.84 mm or less. For example, the thickness TH of smart card 1 can be approximately 0.76 mm or less.

[0041] Because some example embodiments of the smart card 1 include a fingerprint sensor package 10 and have the same thickness as a traditional credit card or check card, the smart card 1 can provide a high level of user experience. Additionally, the cross-sectional view of the smart card 1 in some example embodiments can be compared with... Figure 10F The cross-sectional views shown schematically are essentially the same or similar.

[0042] Figures 2A to 2E This is a diagram illustrating a fingerprint sensor package 10 according to some example embodiments of the concept of the present invention.

[0043] Specifically, Figure 2A This is a bottom view schematically showing the layout of some components of the fingerprint sensor package 10. Figure 2B It is shown Figure 2A A top view of the fingerprint sensor package 10. Figure 2C It is along Figure 2A A cross-sectional view taken from line 2C-2C'. Figure 2D It is along Figure 2A The cross-sectional view of the line 2D-2D', and Figure 2E It is shown Figure 2A The magnified view of the magnified area indicated by "2E".

[0044] Reference Figures 2A to 2E The fingerprint sensor package 10 may include a first substrate 100, a second substrate 200, a controller chip 310, a passive component 320, and a molding layer 350.

[0045] In some example embodiments, the total thickness of the fingerprint sensor package 10 can be approximately 0.76 mm or less. In some example embodiments, the total thickness of the fingerprint sensor package 10 can be approximately 0.5 mm or less. For example, the total thickness of the fingerprint sensor package 10 can range from approximately 0.1 mm to approximately 0.4 mm. Therefore, the fingerprint sensor package 10 can be readily applied to various products that require bending or thinness (e.g., the smart card described above).

[0046] The first substrate 100 may include a core insulating layer 110, a first bonding pad 120, an external connection pad 130, a coating layer 140, a grounding border 150, and an adhesive layer 160.

[0047] The first substrate 100 may include a printed circuit board (PCB). In some example embodiments, the first substrate 100 may include a flexible and therefore bendable flexible PCB (FPCB). In some example embodiments, the first substrate 100 may include a rigid type of PCB.

[0048] The core insulating layer 110 has a generally film or plate shape and may include a first surface 111 and a second surface 113 opposite to each other. Here, a direction parallel to one pair of edges of the core insulating layer 110 is defined as a first direction (X direction), a direction parallel to another pair of edges is defined as a second direction (Y direction), and a direction perpendicular to the main surface (first surface 111 or second surface 113) of the core insulating layer 110 and therefore perpendicular to both the first and second directions is defined as a third direction (Z direction).

[0049] The core insulation layer 110 may include an insulating material. For example, the core insulation layer 110 may be a flexible film comprising polyimide. For example, the core insulation layer 110 may be formed from an epoxy resin or a synthetic resin such as acrylic resin, polyethernitrile, polyethersulfone, polyethylene terephthalate, or polyethylene naphthalate.

[0050] The second surface 113 of the core insulating layer 110 may include a mounting region on which the first substrate 100 is mounted. A first bonding pad 120 may be disposed (e.g., directly or indirectly disposed) on the second surface 113 of the core insulating layer 110. The first bonding pad 120 may be laterally spaced from the mounting region (e.g., isolated from direct contact with the mounting region). For example, the first bonding pad 120 may be arranged along at least one edge of the mounting region of the core insulating layer 110. The first bonding pad 120 may be connected to a conductive line 340 and may be electrically connected via the conductive line 340 to a second bonding pad 221B of the second substrate 200.

[0051] External connection pads 130 may be disposed (e.g., directly or indirectly disposed) on the second surface 113 of the core insulating layer 110. External connection pads 130 may be disposed adjacent to the edge of the second surface 113 of the core insulating layer 110 and may be arranged along the edge of the second surface 113 of the core insulating layer 110. External connection pads 130 may be closer to the edge of the second surface 113 of the core insulating layer 110 than the first bonding pad 120. That is, the distance between the edge of the second surface 113 of the core insulating layer 110 and the external connection pads 130 may be less than the distance between the edge of the second surface 113 of the core insulating layer 110 and the first bonding pad 120. To reiterate, as at least... Figure 2C As shown, the external connection pad 130 may be located between the edge of the second surface 113 of the core insulation layer 110 and the first bonding pad 120. The external connection pad 130 may be electrically and physically connected to an external device (e.g., Figure 10E The card body 500) has pads. The external connection pad 130 can be electrically connected to the first bonding pad 120 through a conductive pattern provided in the first substrate 100.

[0052] For example, the first bonding pad 120 and the external connection pad 130 may include at least one selected from copper (Cu), aluminum (Al), nickel (Ni), silver (Ag), gold (Au), platinum (Pt), tin (Sn), lead (Pb), titanium (Ti), chromium (Cr), palladium (Pd), indium (In), zinc (Zn), carbon (C), and alloys thereof.

[0053] Coating layer 140 may be disposed (e.g., directly or indirectly disposed) on the first surface 111 of core insulating layer 110. Coating layer 140 is a portion of the first substrate 100 configured to contact (e.g., directly contact) a user's fingerprint and may be disposed above the sensing area SR of the second substrate 200. In top view, coating layer 140 may completely cover the sensing area SR of the second substrate 200 in the third or Z direction (e.g., completely overlap with the sensing area SR in the Z direction). Coating layer 140 may protect the sensing area SR from external influences such as contamination, impact, and scratches. Therefore, coating layer 140 may include, but is not limited to, high-strength glass and / or plastic. In some example embodiments, coating layer 140 may include a material having a dielectric constant suitable for fingerprint recognition (e.g., a high-k material).

[0054] Considering sensing sensitivity, the thickness T1 of the coating layer 140 (e.g., the thickness in the Z direction or a third direction, such as at least...) Figure 2CThe coating layer 140 (as shown in the figure) can be formed to a thickness of about 100 μm or less. In some example embodiments, the thickness T1 of the coating layer 140 can be in the range of about 5 μm to about 100 μm (e.g., about 5 μm to about 100 μm).

[0055] A grounding border 150 may be disposed (e.g., directly or indirectly) on the first surface 111 of the core insulating layer 110 and configured to surround the coating layer 140 (e.g., surrounding the coating layer 140 in the X and Y directions, or in the first and second directions). The grounding border 150 is disposed at the outer portion of the first surface 111 of the core insulating layer 110 when the coating layer 140 is disposed approximately at the center of the first surface 111. The grounding border 150 may be disposed around the coating layer 140 to reduce sensing noise when a user's fingerprint comes into contact with the coating layer 140. For example, the grounding border 150 may comprise a conductive material, such as a metal like copper (Cu) or aluminum (Al).

[0056] The grounding border 150 can be electrically grounded. In some example embodiments, the grounding border 150 can be configured to receive a reference potential through a conductive path 170 penetrating the core insulation layer 110 and the adhesive layer 160. The conductive path 170 is configured to electrically connect the grounding border 150 to the external connection pad 130 and can be used as an electrical path for transmitting the reference potential to the grounding border 150.

[0057] The grounding border 150 may extend along the circumference of the coating layer 140 covering the sensing area SR, and thus may completely surround the coating layer 140 in the first and second directions or the X and Y directions. In a top view, the grounding border 150 may have an annular shape surrounding the coating layer 140. The distance between the grounding border 150 and the coating layer 140 may be constant.

[0058] The grounding frame 150 may be spaced apart from the core insulating layer 110 by a first distance D1 in a first direction (X direction) (isolated so as not to directly contact the core insulating layer 110), and may be spaced apart from the core insulating layer 110 by a second distance D2 in a second direction (Y direction) (isolated so as not to directly contact the core insulating layer 110). In some example embodiments, the first distance D1 and the second distance D2 may be substantially the same. In some example embodiments, both the first distance D1 and the second distance D2 may be in the range of approximately 50 μm or greater. In some example embodiments, both the first distance D1 and the second distance D2 may be approximately 5 mm or less. In some example embodiments, both the first distance D1 and the second distance D2 may be from approximately 50 μm to approximately 5 mm, therefore, the distance between the grounding frame 150 and the coating layer 140 may be from approximately 50 μm to approximately 5 mm.

[0059] An adhesive layer 160 may be disposed between the first surface 111 of the core insulation layer 110 and the coating layer 140 (e.g., disposed therebetween in the third-party orientation) and between the first surface 111 of the core insulation layer 110 and the grounding border 150 (e.g., disposed therebetween in the third-party orientation). The adhesive layer 160 may attach the coating layer 140 to the core insulation layer 110 and the grounding border 150 to the core insulation layer 110. For example, the adhesive layer 160 may be formed of an insulating adhesive.

[0060] In some example embodiments, and as at least Figure 2A As shown, each corner CN of the first substrate 100 may have a circular shape in a first direction and a second direction (e.g., the X direction and the Y direction). As at least Figure 2A As further shown, the first substrate 100 can be a rectangular planar shape with rounded corners CN (e.g., extending in a plane extending in a first direction and a second direction (e.g., the X and Y directions)), the rounded corners CN being rounded (e.g., bent at a 90-degree arc in the plane extending in the first direction and the second direction (e.g., the X and Y directions)). In some example embodiments, the radius of curvature of each corner CN of the first substrate 100 can be in the range of approximately 0.1 mm to approximately 2 mm (e.g., approximately 0.1 mm to approximately 2 mm). For example, the radius of curvature of the corner CN of the first substrate 100 can be approximately 1 mm. The reason for the rounded shape of the corners CN of the first substrate 100 is to effectively prevent the use of the stamping facility PM (refer to...). Figure 10D Cut the first panel substrate 100P (refer to) Figure 10D Cracks may appear in the corner CN during the process.

[0061] The second substrate 200 may be disposed on the first substrate 100. For example, at least Figure 2C As shown, the second substrate 200 may be located (e.g., directly or indirectly) on the second surface 113 of the core insulating layer 110 of the first substrate 100. The second substrate 200 may be mounted on the mounting area of ​​the second surface 113 of the core insulating layer 110. For example, at least... Figure 2C and Figure 2D As shown, the substrate adhesive layer 390 for attaching the second substrate 200 to the core insulating layer 110 may be located between the upper surface 200as of the second substrate 200 and the second surface 113 of the core insulating layer 110. The second substrate 200 may be electrically connected to the first substrate 100 via conductive lines 340.

[0062] The second substrate 200 may include a PCB. In some example embodiments, the second substrate 200 may include a rigid substrate. The second substrate 200 may have a substantially rectangular planar shape or a square planar shape. The second substrate 200 may include an upper surface 200as and a lower surface 200bs opposite to each other, and the upper surface 200as of the second substrate 200 may be a surface in contact with the first substrate 100, and the lower surface 200bs of the second substrate 200 may be a surface on which components such as the controller chip 310 are mounted (e.g., directly or indirectly mounted on the second substrate 200).

[0063] The first length LX of the second substrate 200 in the first direction (X direction) can be in the range of approximately 10 mm to approximately 15 mm. Additionally, the second length LY of the second substrate 200 in the second direction (Y direction) can also be in the range of approximately 10 mm to approximately 15 mm. For example, the first length LX of the second substrate 200 can be approximately 12.7 mm, and the second length LY can be approximately 12.7 mm. However, the first length LX and the second length LY of the second substrate 200 are not limited to the above values.

[0064] Such as at least Figures 2C to 2D As shown, the second substrate 200 may include a substrate layer 211, a lower insulating layer 213 located on (e.g., directly or indirectly located) on the lower surface of the substrate layer 211, an upper insulating layer 215 located on (e.g., directly or indirectly located) on the upper surface of the substrate layer 211, a lower protective layer 217 located on (e.g., directly or indirectly located) on the lower surface of the lower insulating layer 213, and an upper protective layer 219 located on (e.g., directly or indirectly located) on the upper surface of the upper insulating layer 215.

[0065] Additionally, the second substrate 200 may be a multilayer PCB comprising multiple conductive layers. The second substrate 200 may include conductive layers at different vertical heights and conductive pathways for electrically connecting the conductive layers. The conductive layers and conductive pathways may include at least one selected from copper (Cu), aluminum (Al), nickel (Ni), silver (Ag), gold (Au), platinum (Pt), tin (Sn), lead (Pb), titanium (Ti), chromium (Cr), palladium (Pd), indium (In), zinc (Zn), carbon (C), and alloys thereof.

[0066] For example, the second substrate 200 may include a first conductive layer 221, a second conductive layer 223, a third conductive layer 225, and a fourth conductive layer 227 in sequence, spaced apart from the first substrate 100. The first conductive layer 221 may be located on the lower surface of the lower insulating layer 213, the second conductive layer 223 may be located on the lower surface of the substrate layer 211, the third conductive layer 225 may be located on the upper surface of the substrate layer 211, and the fourth conductive layer 227 may be located on the upper surface of the upper insulating layer 215.

[0067] The first conductive layer 221 may include a second bonding pad 221B, a first-first sensing pad 221R, a first-second sensing pad 221T, a first ground pattern 221G, and a power pattern 221P. The second conductive layer 223 may include a second-first sensing pad 223R, a second-second sensing pad 223T, and a second ground pattern 223G. The third conductive layer 225 may include a first sensing pattern 225R, a third-second sensing pad 225T, and a third ground pattern 225G. The fourth conductive layer 227 may include a second sensing pattern 227T and a fourth ground pattern 227G. As shown, the first sensing pattern 225R may be located (directly or indirectly) on the upper surface of the substrate layer 211. As shown, the second sensing pattern 227T may be located (directly or indirectly) on the upper surface of the upper insulating layer 215.

[0068] Furthermore, the second substrate 200 may include a first conductive path 231 for electrically connecting the first conductive layer 221 to the second conductive layer 223, a second conductive path 233 and a third conductive path 235 for electrically connecting the second conductive layer 223 to the third conductive layer 225, and a fourth conductive path 237 for electrically connecting the third conductive layer 225 to the fourth conductive layer 227. The first conductive path 231 may at least partially penetrate the lower insulating layer 213, the second conductive path 233 may partially penetrate the substrate layer 211, the third conductive path 235 may partially penetrate the substrate layer 211, and the fourth conductive path 237 may at least partially penetrate the upper insulating layer 215.

[0069] The first conductive path 231 may include a first-first sensing path 231R for electrically connecting a first-first sensing pad 221R to a second-first sensing pad 223R, a first-second sensing path 231T for electrically connecting a first-second sensing pad 221T to a second-second sensing pad 223T, and a first grounding path 231G for electrically connecting a first grounding pattern 221G to a second grounding pattern 223G. In some example embodiments, the first conductive path 231 may have a tapered structure in which the horizontal width decreases toward the substrate layer 211.

[0070] The second conductive path 233 may include a second-first sensing path 233R for electrically connecting the second-first sensing pad 223R to the first sensing pattern 225R, a second-second sensing path 233T for electrically connecting the second-second sensing pad 223T to the third-second sensing pad 225T, and a second grounding path 233G for electrically connecting the second grounding pattern 223G to the third grounding pattern 225G. The third conductive path 235 may include a third-first sensing path 235R for electrically connecting the second-first sensing pad 223R to the first sensing pattern 225R, a third-second sensing path 235T for electrically connecting the second-second sensing pad 223T to the third-second sensing pad 225T, and a third grounding path 235G for electrically connecting the second grounding pattern 223G to the third grounding pattern 225G.

[0071] The second conductive path 233 can contact the second conductive layer 223, and the third conductive path 235 can contact the third conductive layer 225. Furthermore, the second conductive path 233 and the third conductive path 235 can contact each other. Specifically, the second-first sensing pad 223R and the first sensing pattern 225R can be electrically connected via the vertically connected second-first sensing path 233R and third-first sensing path 235R. Similarly, the second-second sensing pad 223T and the third-second sensing pad 225T can be electrically connected via the vertically connected second-second sensing path 233T and third-second sensing path 235T. Finally, the second ground pattern 223G and the third ground pattern 225G can be electrically connected via the vertically connected second ground path 233G and third ground path 235G.

[0072] In some example embodiments, both the second conductive path 233 and the third conductive path 235 may have a tapered structure in which the horizontal width decreases toward the center along the thickness direction of the substrate layer 211. In some example embodiments, the second conductive path 233 and the third conductive path 235 may have a minimum horizontal width at the contact surface between them.

[0073] The fourth conductive path 237 may include a fourth-second sensing path 237T for electrically connecting the third-second sensing pad 225T to the second sensing pattern 227T and a fourth grounding path 237G for electrically connecting the third grounding pattern 225G to the fourth grounding pattern 227G. In some example embodiments, the fourth conductive path 237 may have a tapered structure in which the horizontal width decreases toward the substrate layer 211.

[0074] The second substrate 200 may include a sensing region SR, a first contact region CR1, a second contact region CR2, a third contact region CR3, an interconnect region YR, and a peripheral region ER. Specifically, the sensing region SR may be a region in which a first sensing pattern 225R and a second sensing region 227T for fingerprint recognition are disposed. The first contact region CR1 and the third contact region CR3 may be regions in which a first-first sensing path 231R, a second-first sensing path 233R, and a third-first sensing path 235R for connecting the first sensing pattern 225R to the controller chip 310 are disposed. The second contact region CR2 may be a region in which a first-second sensing path 231T, a second-second sensing path 233T, a third-second sensing path 235T, and a fourth-second sensing path 237T for connecting the second sensing pattern 227T to the controller chip 310 are disposed. The interconnect region YR may be an area in which at least some of the first ground path 231G, second ground path 233G, third ground path 235G, and fourth ground path 237G for connecting the fourth ground pattern 227G and the controller chip 310 are provided. As shown, the second bonding pad 221B and the controller chip 310 may be located (e.g., directly or indirectly) on the lower surface of the lower insulating layer 213.

[0075] The sensing region SR may be disposed at the center of the second substrate 200. In some example embodiments, the sensing region SR may have a rectangular or square shape in a top view. Within the sensing region SR, a plurality of linear first sensing patterns 225R may be disposed, spaced apart in a first direction (X direction) (e.g., isolated from direct contact with each other) and extending in a second direction (Y direction) intersecting (e.g., perpendicular to) the first direction (e.g., parallel to each other), and a plurality of linear second sensing patterns 227T may be disposed in the second direction (Y direction) (e.g., spaced apart from direct contact with each other) and extending in the first direction (X direction) (e.g., parallel to each other), wherein the first sensing patterns 225R and the second sensing patterns 227T are to be understood as being included in the second substrate 200 (e.g., included in the sensing region SR). As at least Figures 2C to 2D As shown, the first sensing pattern 225R and the second sensing pattern 227T can be isolated so that they do not directly contact each other in the third direction (Z direction).

[0076] The first contact area CR1 can be formed at one end of the sensing area SR in the second direction (Y direction), and the third contact area CR3 can be formed at the other end of the sensing area SR in the second direction (Y direction). In addition, the second contact area CR2 can be formed at one end of the sensing area SR in the first direction (X direction), and the interconnection area YR can be formed at the other end of the sensing area SR in the first direction (X direction).

[0077] The peripheral region ER can be disposed outside the second substrate 200. In a top view (e.g., in the first and second directions), the peripheral region ER can surround the sensing region SR. The second bonding pad 221B can be disposed in the peripheral region ER. A first ground pattern 221G, a second ground pattern 223G, a third ground pattern 225G, and a fourth ground pattern 227G for providing a reference potential and shielding sensing noise can be disposed in the peripheral region ER and can be understood to collectively include a ground pattern surrounding the sensing region SR in a top view (e.g., in the first and second directions).

[0078] The first sensing pattern 225R may extend between the sensing area SR and the first contact area CR1 or between the sensing area SR and the third contact area CR3. The first sensing pattern 225R may be connected to the controller chip 310 via a first-first sensing path 231R, a second-first sensing path 233R, and a third-first sensing path 235R disposed in the first contact area CR1 and the third contact area CR3. In the first contact area CR1, the first-first sensing path 231R, the second-first sensing path 233R, and the third-first sensing path 235R may all be arranged in a first direction (X direction). Additionally, in the third contact area CR3, the first-first sensing path 231R, the second-first sensing path 233R, and the third-first sensing path 235R may all be arranged in the first direction (X direction). Some of the first sensing patterns 225R may be connected to the first-first sensing path 231R, the second-first sensing path 233R, and the third-first sensing path 235R disposed in the first contact area CR1. Additionally, the first sensing pattern 225R in other parts can be connected to the first-first sensing path 231R, the second-first sensing path 233R, and the third-first sensing path 235R disposed in the third contact area CR3. Adjacent first sensing patterns 225R can be electrically isolated.

[0079] The second sensing pattern 227T can extend within the sensing area SR and the second contact area CR2. The second sensing pattern 227T can be connected to the controller chip 310 via a first-second sensing path 231T, a second-second sensing path 233T, a third-second sensing path 235T, and a fourth-second sensing path 237T disposed in the second contact area CR2. The first-second sensing path 231T, the second-second sensing path 233T, the third-second sensing path 235T, and the fourth-second sensing path 237T can all be staggered in a Z-shape in the second direction (Y direction).

[0080] The first sensing pattern 225R may have a first width W1 as its width in a first direction (X direction), and the second sensing pattern 227T may have a second width W2 as its width in a second direction (Y direction). In some example embodiments, the first width W1 may be greater than the second width W2. For example, the first width W1 may be in the range of approximately 2 to approximately 4 times the second width W2. Specifically, the first width W1 may be in the range of approximately 40 μm to approximately 70 μm, and the second width W2 may be in the range of approximately 5 μm to approximately 25 μm.

[0081] The overlapping portion of the first sensing pattern 225R and the second sensing pattern 227T in the third direction (Z direction) can constitute a pixel PX. The first pitch PIX between the centers PXC of the pixel PX in the first direction (X direction) can be substantially the same as the second pitch PIY between the centers PXC of the pixel PX in the second direction (Y direction), but the inventive concept is not limited thereto. For example, both the first pitch PIX and the second pitch PIY can be in the range of approximately 50 μm to approximately 90 μm.

[0082] Pixel PX may have a combined capacitance value of area capacitance AC resulting from the overlapping of the first sensing pattern 225R and the second sensing pattern 227T, and edge capacitance defined by the first sensing pattern 225R and the second sensing pattern 227T.

[0083] When a user's fingerprint touches the coating layer 140, the capacitance value corresponding to each pixel PX changes due to the capacitance sensed between the second sensing pattern 227T and the user's fingerprint. Since the change in capacitance value is determined based on the shape of the user's fingerprint, the controller chip 310 can identify the user's fingerprint from the change in the capacitance value of the pixel PX.

[0084] In a top view, the fourth grounding pattern 227G may surround the sensing area SR in which the second sensing pattern 227T is disposed. The fourth grounding pattern 227G may be at the same vertical height as the second sensing pattern 227T and may surround the second sensing pattern 227T in the top view. For example, the fourth grounding pattern 227G extends continuously along the edge of the sensing area SR on the upper surface of the upper insulating layer 215 to surround the second sensing pattern 227T. The fourth grounding pattern 227G may be disposed around the sensing area SR to reduce sensing noise when a user's fingerprint comes into contact with the coating layer 140.

[0085] The substrate layer 211 may include an insulating material. The substrate layer 211 may include a resin and glass fibers. The resin included in the substrate layer 211 may be at least one selected from phenolic resins, epoxy resins, and polyimides. In some example embodiments, the substrate layer 211 may include at least one material selected from flame retardant 4 (FR4), tetrafunctional epoxyresin, polyphenylene ether, epoxy / polyphenylene ether, Thermount, bismaleimide triazine (BT), cyanate ester, polyimide, prepreg, Ajinomoto deposited film (ABF), and liquid crystal polymers. In other embodiments, the substrate layer 211 may include silicon oxide, silicon nitride, silicon oxynitride, or combinations thereof. The glass fibers included in the substrate layer 211 are reinforcing materials and can be formed by focusing glass fibers obtained by melt-spinning glass materials at high temperatures. The glass fibers may be mineral-processed products comprising silica as a main component.

[0086] In the following text, for ease of description and understanding, the components of the second substrate 200 will be described in order of proximity to the substrate layer 211.

[0087] The second conductive layer 223 may include a second-first sensing pad 223R, a second-second sensing pad 223T, and a second ground pattern 223G to which a reference potential is applied. The second ground pattern 223G may be disposed in the sensing region SR, the interconnect region YR, and the peripheral region ER. A portion of the second ground pattern 223G may overlap with the first sensing pattern 225R and the second sensing pattern 227T in the third direction (Z direction). A portion of the second ground pattern 223G may be located between the second sensing pattern 227T and the controller chip 310. Therefore, the second ground pattern 223G can block external sensing noise from the controller chip 310. The second-first sensing pad 223R may be disposed in the first contact region CR1 and the third contact region CR3, and the second-second sensing pad 223T may be disposed in the second contact region CR2. The second-first sensing pad 223R can provide a path for electrical connection between the first sensing pattern 225R and the controller chip 310, and the second-second sensing pad 223T can provide a path for electrical connection between the second sensing pattern 227T and the controller chip 310.

[0088] The lower insulating layer 213 may be disposed on the lower surface of the substrate layer 211 to cover the second conductive layer 223. The lower insulating layer 213 can electrically isolate the second-first sensing pad 223R, the second-second sensing pad 223T, and the second ground pattern 223G from each other.

[0089] The third conductive layer 225 may include a third ground pattern 225G to which a reference potential is applied, a first sensing pattern 225R for identifying a user's fingerprint, and a third-second sensing pad 225T. The first sensing pattern 225R may be disposed in the sensing region SR, the third ground pattern 225G may be disposed in the interconnect region YR and the peripheral region ER, and the third-second sensing pad 225T may be disposed in the second contact region CR2. The third-second sensing pad 225T can provide a path for electrical connection between the second sensing pattern 227T and the controller chip 310.

[0090] The upper insulating layer 215 can be disposed on the upper surface of the substrate layer 211 to cover the third conductive layer 225. The upper insulating layer 215 can electrically isolate the first sensing pattern 225R, the third-second sensing pad 225T and the third grounding pattern 225G from each other.

[0091] The lower insulating layer 213 and the upper insulating layer 215 may comprise different materials. For example, the upper insulating layer 215 may comprise a material having a dielectric constant suitable for fingerprint recognition in the fingerprint sensor package 10. However, the inventive concept is not limited thereto, and the lower insulating layer 213 and the upper insulating layer 215 may comprise the same material.

[0092] Both the lower insulating layer 213 and the upper insulating layer 215 may comprise at least one selected from phenolic resin, epoxy resin, and polyimide. In some example embodiments, both the lower insulating layer 213 and the upper insulating layer 215 may comprise at least one selected from prepreg, FR4, tetrafunctional epoxy resin, polyphenylene ether, epoxy / polyphenylene ether, Thermount, BT, cyanate ester, polyimide, and liquid crystal polymer.

[0093] A fourth conductive layer 227 may be disposed on the upper surface of the upper insulating layer 215. The fourth conductive layer 227 may include a fourth ground pattern 227G for removing sensing noise and a second sensing pattern 227T for identifying a user's fingerprint. The second sensing pattern 227T may be disposed in the sensing area SR, and the fourth ground pattern 227G may be disposed in the peripheral area ER.

[0094] like Figures 2C to 2D As shown, the second substrate 200 may include a first ground pattern 221G located (e.g., directly or indirectly located) on the lower surface of the lower insulating layer 213, a second ground pattern 223G located (e.g., directly or indirectly located) on the lower surface of the substrate layer 211 and electrically connected to the first ground pattern 221G, a third ground pattern 225G located (e.g., directly or indirectly located) on the upper surface of the substrate layer 211 and electrically connected to the second ground pattern 223G, and a fourth ground pattern 227G located (e.g., directly or indirectly located) on the upper surface of the upper insulating layer 215 and electrically connected to the third ground pattern 225G, wherein, in a top view (e.g., in the first and second directions), the fourth ground pattern 227G surrounds the second sensing pattern 227T.

[0095] like Figures 2C to 2D As further shown, the second substrate may include a first conductive path 231 extending upward in the lower insulating layer 213, a second conductive path 233 extending upward in the substrate layer 211 and coupled to the first conductive path 231, a third conductive path 235 extending upward in the substrate layer 211 and coupled to the second conductive path 233, and a fourth conductive path 237 extending upward in the upper insulating layer 215 and coupled to the third conductive path 235. The first conductive path to the fourth conductive path is electrically connected to the first ground pattern 221G and the fourth ground pattern 227G. The first conductive path to the fourth conductive path tapers toward the center in the thickness direction of the substrate layer 211.

[0096] The second sensing pattern 227T can be spaced apart from the first sensing pattern 225R in the third direction (Z direction), with the upper insulating layer 215 located between them. That is, the second sensing pattern 227T can be electrically insulated from the first sensing pattern 225R through the upper insulating layer 215. Therefore, the first sensing pattern 225R can constitute the first electrode of a capacitor, the upper insulating layer 215 can constitute the dielectric layer of the capacitor, and the second sensing pattern 227T can constitute the second electrode of the capacitor. Therefore, the first sensing pattern 225R and the second sensing pattern 227T can together include (e.g., constitute) multiple capacitors. That is, the capacitor constituting the fingerprint sensor can be formed in the second substrate 200.

[0097] The upper protective layer 219 may be disposed on the upper surface of the upper insulating layer 215 to cover the fourth conductive layer 227.

[0098] The first conductive layer 221 may be disposed on the lower surface of the lower insulating layer 213. The first conductive layer 221 may include a second bonding pad 221B, a first-first sensing pad 221R, a first-second sensing pad 221T, and a first ground pattern 221G to which a reference potential is applied.

[0099] The second bonding pad 120 can be connected to the conductive line 340 and can be electrically connected to the first bonding pad 120 of the first substrate 100 via the conductive line 340. The second bonding pad 221B may include a power pad for being applied with power (e.g., a power potential) supplied from an external device, a ground pad for being applied with a reference potential, and a pad for supplying power to the outside (e.g., ...). Figure 1 The display unit 12 of the smart card 1 outputs the fingerprint recognition result of the fingerprint sensor package 10 via an output pad. The controller chip 310 can receive a power supply potential through some of the second bonding pad 221B and the power supply pattern 221P, and can receive a reference potential through some of the second bonding pad 221B and the first ground pattern 221G. In addition, the controller chip 310 can receive signals identified by the first sensing pattern 225R and the second sensing pattern 227T through the first-first sensing pad 221R and the first-second sensing pad 221T.

[0100] Such as at least Figure 2C As shown, the distance 225RD at which the first sensing pattern 225R is isolated from the first substrate 100 and the distance 227TD at which the second sensing pattern 227T is isolated from the first substrate 100 and the second bonding pad 221B is isolated from the first substrate 100 and the second bonding pad 221BD at which the second bonding pad 221B is isolated from the first substrate 100 and the second bonding pad 221B at which the second bonding pad 221B is isolated from the first substrate 100 and the second bonding pad 221BD at which the second bonding pad 221B is isolated from the first substrate 100 and the second bonding pad 221D ...7T at which the second bonding pad 227

[0101] The first-first sensing pad 221R extends from the first contact area CR1 and the third contact area CR3 to a portion overlapping with the controller chip 310 in the third direction (Z direction), and the first-second sensing pad 221T extends from the second contact area CR2 to a portion overlapping with the controller chip 310 in the third direction (Z direction). The first-first sensing pad 221R can provide a path for electrical connection between the first sensing pattern 225R and the controller chip 310, and the first-second sensing pad 221T can provide a path for electrical connection between the second sensing pattern 227T and the controller chip 310.

[0102] A lower protective layer 217 may be disposed on the lower surface of the lower insulating layer 213 to cover at least a portion of the first conductive layer 221. In some example embodiments, the lower protective layer 217 may be formed to cover a portion of the lower surface of the lower insulating layer 213. In some example embodiments, the lower protective layer 217 may be formed to completely cover the lower surface of the lower insulating layer 213.

[0103] Both the lower protective layer 217 and the upper protective layer 219 can be insulating coating layers 140. In some example embodiments, the lower protective layer 217 and the upper protective layer 219 can be solder resist. In other embodiments, the lower protective layer 217 and the upper protective layer 219 can include polymer materials with excellent heat resistance, insulating properties, and mechanical strength. For example, both the lower protective layer 217 and the upper protective layer 219 can include polyimide, polyamide, polyacetal, polycarbonate, etc.

[0104] The controller chip 310 and active component 320 can be disposed on the lower surface of the second substrate 200. The controller chip 310 can be mounted on the lower surface of the second substrate 200 in a flip-chip manner. Connection bumps 315 for electrically and physically connecting the controller chip 310 to the second substrate 200 can be disposed between the controller chip 310 and the second substrate 200. The connection bumps 315 can be disposed between some patterns of the first conductive layer 221 and the chip pads 311 of the controller chip 310.

[0105] In some example embodiments, the controller chip 310 may be located wholly or partially within the sensing region SR. In other embodiments, the controller chip 310 may be located entirely outside the sensing region SR. Like a memory chip and / or a processor chip, the controller chip 310 may include any configuration required to perform operations for recognizing a user's fingerprint from capacitance changes in the pixel PX. Additionally, the passive component 320 may include, for example, a multilayer ceramic capacitor (MLCC), but is not limited thereto.

[0106] The molding layer 350 may be disposed on the first substrate 100 (e.g., directly or indirectly disposed on the second surface of the core insulating layer 110) and the second substrate 200. For example, at least... Figures 2C to 2D As shown, the molding layer 350 may cover the second substrate 200, the controller chip 310, and the passive component 320 (e.g., surrounding the second substrate 200, the controller chip 310, and the passive component 320 upwards in the first, second, and third directions and / or overlapping with the second substrate 200, the controller chip 310, and the passive component 320). The molding layer 350 may protect the second substrate 200, the controller chip 310, and the passive component 320 from external influences such as contamination and impact. Additionally, the molding layer 350 may cover the first bonding pad 120 disposed on the second surface 113 of the core insulating layer 110 (e.g., surrounding the first bonding pad 120 upwards in the first, second, and third directions and / or overlapping with the first bonding pad 120), but not cover the external connection pad 130, leaving it exposed to the outside (e.g., the external connection pad 130 may be exposed from the molding layer 350, for example, as at least...). Figures 2C to 2D (As shown). For example, as at least Figures 2C to 2D As shown, the molding layer 350 can be isolated from direct contact with the external connection pads 130. The molding layer 350 can extend on the second surface 113 of the core insulating layer 110 along the boundary 199 between the region where the first bonding pad 120 is located and the region where the external connection pad 130 is located. For example, at least... Figures 2C to 2D As shown, the molding layer 350 may extend laterally (e.g., in a first direction and / or a second direction) from one or more side surfaces 200ss of the second substrate 200 to cover the first bonding pad 120, but may be spaced apart from the external connection pad 130. For example, as at least Figures 2C to 2D As shown, the molding layer 350 may extend laterally (e.g., in a first direction and / or a second direction) from one or more side surfaces 200ss of the second substrate 200 to the boundary 199 between the first bonding pad 120 and the external connection pad 130 (which may extend upward in at least a third direction, as shown).

[0107] The molding layer 350 may be formed of an epoxy molding compound. Alternatively, the molding layer 350 may be formed of epoxy materials, thermosetting materials, thermoplastic materials, UV-treated materials, etc.

[0108] Because the sensing area SR corresponding to the fingerprint recognition sensor is included in the second substrate 200 itself, the overall thickness can be reduced, and the fingerprint sensor package 10 of the present invention can be used to manufacture smart cards with a thickness comparable to that of conventional credit cards and check cards.

[0109] Figure 3This is a cross-sectional view illustrating some example embodiments of a fingerprint sensor package 20 according to the present invention. Figure 4 and Figure 5 They are Figure 3 The image shows a bottom view of the inner molding layer 360 of the fingerprint sensor package 20.

[0110] Figure 3 The fingerprint sensor package 20 shown can be used with reference to Figures 2A to 2E The fingerprint sensor package 10 described is substantially the same as or similar to the one described above, except that the fingerprint sensor package 20 also includes an inner molding layer 360. In the following text, emphasis will be placed on its similarity to the referenced layer. Figures 2A to 2E The differences described in the fingerprint sensor package 10 are used to describe Figure 3 20. Fingerprint sensor package.

[0111] Reference Figure 3 The inner molding layer 360 can be disposed on the lower surface of the second substrate 200 to cover the controller chip 310 and the passive component 320 (e.g., surrounding the controller chip 310 and the passive component 320 and / or overlapping with the controller chip 310 and the passive component 320 in the first direction, the second direction, and a third direction upward). In the manufacturing process of the fingerprint sensor package 20, the molding layer 350 can be formed after the inner molding layer 360 is formed. For example, at least... Figure 3 As shown, an inner molding layer 360 may be formed on the lower surface of the second substrate 200 to cover the controller chip 310 and the passive component 320 (e.g., surrounding the controller chip 310 and the passive component 320 and / or overlapping with the controller chip 310 and the passive component 320 in the first direction, the second direction, and a third direction upwards), and a molding layer 350 may be formed to cover the inner molding layer 360 (e.g., surrounding the inner molding layer 360 and / or overlapping with the inner molding layer 360 in the first direction, the second direction, and a third direction upwards). The inner molding layer 360 may be located between the controller chip 310 and the molding layer 350, and between the passive component 320 and the molding layer 350. The inner molding layer 360 may be formed of an epoxy molding compound. Alternatively, the inner molding layer 360 may be formed of an epoxy-based material, a thermosetting material, a thermoplastic material, a UV-treated material, etc. In some example embodiments, the molding layer 350 may be formed of a transparent or translucent material. Since the molding layer 350 is formed of a transparent or translucent material, the shape of the inner molding layer 360 can be confirmed from the outside.

[0112] In some example embodiments, such as Figure 4 As shown, the inner molding layer 360 can be formed to cover a portion of the lower surface of the second substrate 200 and can be spaced apart from the edge of the lower surface of the second substrate 200. The inner molding layer 360 may not cover the area in which the second bonding pad 221B is disposed.

[0113] In some example embodiments, such as Figure 5 As shown, when the lower surface of the second substrate 200 has a first edge and a second edge opposite to each other, the inner molding layer 360 can extend between the first edge and the second edge of the lower surface of the second substrate 200. For example, the inner molding layer 360 can extend from the first edge to the second edge of the lower surface of the second substrate 200 in a second direction (Y direction).

[0114] Figure 6 and Figure 7 These are top views of a first substrate of a fingerprint sensor package, illustrating some exemplary embodiments of the invention.

[0115] Reference Figure 6 The first substrate 101 may include a coating layer 140 and a grounding frame 150a disposed on the first surface of the core insulating layer 110.

[0116] Such as at least Figure 6 As shown, the grounding border 150a may include a plurality of closed line patterns 150ap-1, 150ap-2 spaced apart from each other. The plurality of closed line patterns 150ap-1, 150ap-2 may all extend along the periphery of the coating layer 140 (e.g., at the outer edge of the coating layer 140) and surround the coating layer 140 in a top view (e.g., in a first direction and a second direction). In some example embodiments, the number of closed line patterns 150ap-1, 150ap-2 constituting the plurality of closed line patterns is not limited to the two shown, but may be three or more.

[0117] The distance from the edge of the coating layer 140 to the grounding frame 150a can be spaced by a first distance D1 along a first direction (X direction) and by a second distance D2 along a second direction (Y direction). In some example embodiments, the first distance D1 and the second distance D2 can be substantially the same.

[0118] Reference Figure 7 The first substrate 102 may include a coating layer 140 and a grounding frame 150b disposed on a first surface of the core insulating layer 110.

[0119] like Figure 7 As shown, the grounding border 150b may include multiple sub-patterns 150bp spaced apart from each other (e.g., isolated so as not to directly contact each other). Figure 7 As shown, multiple sub-patterns 150bp can be arranged along the side surface of the coating layer 140. In other words, multiple sub-patterns 150bp can be arranged around the side surface of the coating layer 140, for example, referring to... Figure 8 and 9This will be clearer from the cross-sectional view. In the top view, the multiple sub-patterns 150bp can all have a rectangular shape. For example, the planar shape of the multiple sub-patterns 150bp can be a rectangle, a square, or a rhombus. In some example embodiments, the planar shape of the multiple sub-patterns 150bp can be a circle or a polygon such as a pentagon.

[0120] The distance from the edge of the coating layer 140 to the grounding frame 150b can be spaced by a first distance D1 along a first direction (X direction) and by a second distance D2 along a second direction (Y direction). In some example embodiments, the first distance D1 and the second distance D2 can be substantially the same.

[0121] Figure 8 This is a cross-sectional view showing some example embodiments of a fingerprint sensor package 30 according to the present invention.

[0122] In addition to the second substrate 201 Figure 8 The fingerprint sensor package 30 shown can be used with reference to Figures 2A to 2E The fingerprint sensor package 10 described is substantially the same as or similar to the one in the reference citation. In the following text, emphasis will be placed on its resemblance to the reference citation. Figures 2A to 2E The differences described in the fingerprint sensor package 10 are used to describe Figure 8 30 fingerprint sensor package.

[0123] Reference Figure 8 The fingerprint sensor package 30 may include a first substrate 100, a second substrate 201, a controller chip 310, a passive component 320, and a molding layer 350.

[0124] The second substrate 201 may not include a substrate layer. The second substrate 201 is an insulating material and may include a first insulating layer 212, a second insulating layer 214, and a third insulating layer 216. The second substrate 201 may include a first conductive path 232R in the first insulating layer 212, second conductive paths 234G and 234R in the second insulating layer 214, and a third conductive path 236G in the third insulating layer 216. The first conductive path 232R, the second conductive paths 234G and 234R, and the third conductive path 236G may have a tapered structure facing the lower surface of the second substrate 201 that contacts the controller chip 310.

[0125] The first insulating layer 212 may be disposed on the lower protective layer 217. The first conductive path 232R penetrates the first insulating layer 212 to contact the first conductive layers 221B, 221R and 221P located on the lower surface of the first insulating layer 212 and the second conductive layers 223G and 223R located on the upper surface of the first insulating layer 212.

[0126] The second insulating layer 214 may be disposed on the first insulating layer 212. The second conductive layers 223G and 223R may be covered by the second insulating layer 214. The second conductive paths 234G and 234R penetrate at least a portion of the second insulating layer 214 to contact the second conductive layers 223G and 223R located on the upper surface of the first insulating layer 212 and the third conductive layers 225G and 225R located on the upper surface of the second insulating layer 214.

[0127] The third insulating layer 216 may be disposed on the second insulating layer 214. The third conductive layers 225G and 225R may be covered by the third insulating layer 216. The third conductive path 236G penetrates at least a portion of the third insulating layer 216 to contact the third conductive layers 225G and 225R located on the upper surface of the second insulating layer 214 and the fourth conductive layers 227G and 227T located on the upper surface of the third insulating layer 216.

[0128] Figure 9 This is a cross-sectional view illustrating some example embodiments of a fingerprint sensor package 40 according to the present invention.

[0129] In addition to the second substrate 202 Figure 9 The fingerprint sensor package 40 shown can be used with reference to Figures 2A to 2E The fingerprint sensor package 10 described is substantially the same as or similar to the one in the reference citation. In the following text, emphasis will be placed on its resemblance to the reference citation. Figures 2A to 2E The differences described in the fingerprint sensor package 10 are used to describe Figure 9 40 fingerprint sensor package.

[0130] Reference Figure 9 The fingerprint sensor package 40 includes a first substrate 100, a second substrate 202, a controller chip 310, passive components 320, conductive lines 340, a molding layer 350, and an inner molding layer 370. The fingerprint sensor package 40 may have a fan-out wafer-level package (FO-WLP) structure.

[0131] The second substrate 202 may not include a substrate layer. The second substrate 202 may include a first insulating layer 212, a second insulating layer 214, and a third insulating layer 216 stacked sequentially, as well as a wiring structure. The wiring structure may include first conductive layers 221B, 221G, 221P, and 221R, second conductive layers 223G and 223R, third conductive layers 225G and 225R, and fourth conductive layers 227G and 227T. Additionally, the wiring structure may include first conductive paths 232G and 232R, second conductive paths 234G and 234R, and a third conductive path 236G, having a structure that tapers towards the controller chip 310. In some example embodiments, the wiring structure may be formed using a dual damascene process.

[0132] The inner molding layer 370 may include a step difference formed by partially removing a flat molding material layer. The inner molding layer 370 may include a first molding portion 371 protecting the controller chip 310 and passive components 320, and a second molding portion 373 surrounding the first molding portion 371. The second molding portion 373 may extend along the lower surface of the first insulating layer 212.

[0133] The second bonding pad 221B can be exposed through an opening in the second molding portion 373 (e.g., it can be located within an opening 373o in the second molding portion 373). For example, the second bonding pad 221B can be disposed within an opening formed in the second molding portion 373. A first segment of the second bonding pad 221B can extend on the upper surface of the second molding portion 373 that contacts the first insulating layer 212, and a second segment of the second bonding pad 221B can extend along the inner wall defining the opening formed in the second molding portion 373, and a third segment of the second bonding pad 221B can extend at the same height as the bottom surface of the second molding portion 373. A conductive line 340 can be connected to the third segment of the second bonding pad 221B.

[0134] Figures 10A to 10F These are diagrams illustrating, in sequence, methods for manufacturing smart cards according to some exemplary embodiments of the present invention.

[0135] Reference Figure 10A Prepare a second substrate 200, and mount the controller chip 310 and passive components 320 on the second substrate 200. The controller chip 310 can be mounted on the second substrate 200 using a flip-chip method.

[0136] Reference Figure 10B A first panel substrate 100P on which a second substrate 200 will be mounted is prepared. Most of the components constituting the first panel substrate 100P, and the materials constituting the components, are referenced. Figures 2A to 2E The components and materials of the first substrate 100 of the described fingerprint sensor package 10 are substantially the same or similar. However, the first panel substrate 100P may have a larger planar area than the first substrate 100, allowing multiple second substrates 200 to be mounted thereon. The first panel substrate 100P can be mounted on a roll-up device, and the rolling and unrolling of the first panel substrate 100P can be controlled by the roll-up device.

[0137] After preparing the first panel substrate 100P, the second substrate 200 can be mounted on the mounting area of ​​the second surface 113 of the core insulating layer 110. The second substrate 200 can be fixed to the first panel substrate 100P by the substrate adhesive layer 390.

[0138] After the second substrate 200 is disposed on the first panel substrate 100P, conductive lines 340 for electrically connecting the first panel substrate 100P and the second substrate 200 are formed. The conductive lines 340 may extend between the first bonding pad 120 of the first panel substrate 100P and the second bonding pad 221B of the second substrate 200. The conductive lines 340 may be formed by wire bonding process.

[0139] Reference Figure 10C A molding layer 350 is formed on the second surface 113 of the core insulating layer 110. The molding layer 350 may cover the second substrate 200, the controller chip 310, the passive component 320, and the conductive line 340. Additionally, the molding layer 350 may cover the first bonding pad 120 of the first panel substrate 100P, but may not cover the external connection pad 130. That is, the molding layer 350 may extend laterally along the second surface 113 of the core insulating layer 110 from the side surface of the second substrate 200 to the boundary between the first bonding pad 120 and the external connection terminal.

[0140] refer to Figure 10D The first panel substrate 100P can be cut using a stamping apparatus PM. The stamping apparatus PM can cut the first panel substrate 100P to form a reference. Figures 2A to 2E The fingerprint sensor package 10 is described. Because the first panel substrate 100p is cut, it can be formed from the first panel substrate 100p. Figure 2C Multiple first substrates 100 are included. In order to effectively prevent cracks that may occur during the process of cutting the first panel substrate 100p using a stamping facility and a PM, the stamping facility PM can cut the first panel substrate 100p so that the corners of the first substrate 100 have a rounded shape.

[0141] Reference Figure 10E Prepare a card body 500 including a card board 520, a connecting pad 530 and a security chip 11.

[0142] The card body 500 may include a recessed area 510 for mounting the fingerprint sensor package 10. A card plate 520 and a security chip 11 for storing financial information may be disposed on the card body 500. For example, the card plate 520 may be an FPCB. The security chip 11 may be mounted on the card plate 520. The security chip 11 may be disposed within the card body 500 such that one surface of the security chip 11 is exposed to the outside. Additionally, connection pads 530 may be provided on the card plate 520 for electrical connection between the fingerprint sensor package 10 and other components in the card body 500. The connection pads 530 may include a conductive material. The card body 500 may include a recessed area 510 for mounting the fingerprint sensor package 10.

[0143] Reference Figure 10FA fingerprint sensor package 10 is installed on the card body 500.

[0144] A portion of the fingerprint sensor package 10 can be accommodated in a recessed region 510 of the card body 500. A molding layer 350 of the fingerprint sensor package 10 can be accommodated in the recessed region 510, and an external connection pad 130 of the first substrate 100 can be bonded to a connection pad 530 of the card plate 520. The external connection pad 130 of the first substrate 100 can be physically and electrically connected to the connection pad 530 of the card plate 520. In some example embodiments, the recessed region 510 is not completely filled by the molding layer 350 of the fingerprint sensor package 10, and a flow space can be formed between the molding layer 350 of the fingerprint sensor package 10 and the card body 500. The flow space provides space in which the fingerprint sensor package 10 can flexibly respond according to the degree of bending of the smart card 1. In other embodiments, the flow space can be filled by applying an adhesive. Figure 10E As shown, the fingerprint sensor package 10 can be mounted on the card body 500, such that the coating layer 140 and the grounding frame 150 are exposed to the outside of the smart card 1.

[0145] Refer again Figure 1 The smart card 1 may include a fingerprint sensor package 10, a security chip 11, a display unit 12, and a power button 13. When a user brings their fingerprint into contact with the fingerprint sensor package 10 of the smart card 1, the touched fingerprint can be identified. When the identified fingerprint matches a registered fingerprint, the security chip 11 can grant payment authorization to the user of the smart card 1.

[0146] Figure 11 This is a top view illustrating a mobile device 1000 including a fingerprint sensor package according to some example embodiments of the present invention.

[0147] Reference Figure 11 The mobile device 1000 may include a touch screen type display 1010 and a fingerprint sensor package 1020.

[0148] Mobile device 1000 may also include a camera, speaker, temperature sensor, motion sensor, etc. Although a smartphone is exemplified as mobile device 1000, the inventive concept is not limited thereto. For example, mobile device 1000 may be a wearable device such as a laptop computer, tablet computer, or smartwatch on which a fingerprint sensor package 1020 may be mounted. In mobile device 1000, the fingerprint sensor package 1020 may be disposed on a display 1010. The fingerprint sensor package 1020 may correspond to the one described in the above references. Figures 2A to 9 The fingerprint sensor package 10, 20, 30 and 40 described are selected from.

[0149] While the inventive concept has been specifically shown and described with reference to some exemplary embodiments thereof, it will be understood that various changes in form and detail may be made herein without departing from the spirit and scope of the appended claims.

Claims

1. A fingerprint sensor package, the fingerprint sensor package comprising: A first substrate, the first substrate comprising: A core insulating layer, the core insulating layer comprising a first surface and a second surface opposite to each other. The first bonding pad is located on the second surface of the core insulating layer, and An external connection pad is located between the edge of the second surface of the core insulating layer and the first bonding pad. A second substrate, located on the second surface of the core insulating layer, the second substrate comprising: A plurality of first sensing patterns, the plurality of first sensing patterns being spaced apart from each other in a first direction and extending in a second direction intersecting the first direction. A plurality of second sensing patterns, the plurality of second sensing patterns being spaced apart from each other in the second direction and extending in the first direction, and Second bonding pad; A conductive line that electrically connects the first bonding pad to the second bonding pad; A controller chip, the controller chip being located on the second substrate; and A molding layer is located on the second surface of the core insulating layer and the second substrate, the molding layer covers the second substrate and the first bonding pad, and the molding layer is spaced apart from the external connection pad.

2. The fingerprint sensor package according to claim 1, wherein, The second substrate includes: A sensing area, the sensing area including the plurality of first sensing patterns and the plurality of second sensing patterns, and A peripheral region surrounds the sensing region in both the first and second directions; and The first substrate further includes a coating layer located on the first surface of the core insulating layer and overlapping the sensing area of ​​the second substrate in a third direction perpendicular to the first and second directions.

3. The fingerprint sensor package according to claim 2, wherein, The thickness of the coating layer is from 5 μm to 100 μm.

4. The fingerprint sensor package according to claim 2, wherein the fingerprint sensor package further comprises: A grounding border is located on the first surface of the core insulation layer and surrounds the coating layer in the first and second directions.

5. The fingerprint sensor package according to claim 4, wherein, The first substrate further includes an adhesive layer located between the grounding frame and the core insulating layer, and the adhesive layer is also located between the coating layer and the core insulating layer.

6. The fingerprint sensor package according to claim 4, wherein, The distance between the grounding frame and the coating layer is 50 μm to 5 mm.

7. The fingerprint sensor package according to claim 4, wherein, The grounding frame includes: Multiple line patterns, the multiple line patterns extending around the periphery of the coating layer, or Multiple sub-patterns are arranged around the side surface of the coating layer.

8. The fingerprint sensor package according to claim 1, wherein the fingerprint sensor package further comprises: A substrate adhesive layer is provided, located between the upper surface of the second substrate and the first substrate. The controller chip is located on the lower surface of the second substrate.

9. The fingerprint sensor package according to claim 8, wherein the fingerprint sensor package further comprises: An inner molding layer is located on the lower surface of the second substrate, and the inner molding layer is configured to cover the controller chip. The molding layer covers the inner molding layer.

10. A fingerprint sensor package, the fingerprint sensor package comprising: A first substrate, the first substrate comprising: A core insulating layer, the core insulating layer comprising a first surface and a second surface opposite to each other. A coating layer located on the first surface of the core insulation layer. A grounding border is located on the first surface of the core insulation layer, and the grounding border surrounds the coating layer in a first direction and a second direction intersecting the first direction. An adhesive layer is located between the coating layer and the core insulation layer, and also between the core insulation layer and the grounding frame. The first bonding pad is located on the second surface of the core insulating layer, and An external connection pad is located between the edge of the second surface of the core insulating layer and the first bonding pad. A second substrate, located on the second surface of the core insulating layer, the second substrate comprising: A plurality of first sensing patterns, the plurality of first sensing patterns being spaced apart from each other in the first direction and extending in the second direction. A plurality of second sensing patterns, the plurality of second sensing patterns being spaced apart from each other in the second direction and extending in the first direction, and Second bonding pad; A conductive line that electrically connects the first bonding pad to the second bonding pad; A controller chip, wherein the controller chip is located on the second substrate; A connecting bump, the connecting bump being located between the second substrate and the controller chip, and electrically connecting the second substrate to the controller chip; and A molding layer covers the second substrate and the controller chip, the molding layer extending from a side surface of the second substrate to the boundary between the first bonding pad and the external connection pad. The plurality of first sensing patterns and the plurality of second sensing patterns are spaced apart from each other in a third direction perpendicular to the first direction and the second direction. The plurality of first sensing patterns and the plurality of second sensing patterns together constitute a plurality of capacitors.

11. The fingerprint sensor package according to claim 10, wherein, The second substrate further includes: Matrix layer; A lower insulating layer, the lower insulating layer being located on the lower surface of the substrate layer; and Upper insulating layer, the upper insulating layer being located on the upper surface of the substrate layer. The plurality of first sensing patterns are located on the upper surface of the substrate layer. The plurality of second sensing patterns are located on the upper surface of the upper insulating layer. The second bonding pad and the controller chip are located on the lower surface of the lower insulating layer.

12. The fingerprint sensor package according to claim 11, wherein, The second substrate further includes: A first grounding pattern is located on the lower surface of the lower insulating layer; A second grounding pattern is located on the lower surface of the substrate layer and is electrically connected to the first grounding pattern; A third grounding pattern, the third grounding pattern being located on the upper surface of the substrate layer and electrically connected to the second grounding pattern; and A fourth grounding pattern is located on the upper surface of the upper insulating layer and is electrically connected to the third grounding pattern. In the top view, the fourth grounding pattern surrounds the plurality of second sensing patterns.

13. The fingerprint sensor package according to claim 12, wherein, The second substrate further includes: A first conductive path extends upward in the third party within the lower insulating layer; A second conductive path extends upward in the third party in the substrate layer and is coupled to the first conductive path; A third conductive path, the third conductive path extending upward in the substrate layer and coupled to the second conductive path; and A fourth conductive path extends upward in the upper insulating layer to the third conductive path and is coupled to the third conductive path. The first conductive path, the second conductive path, the third conductive path, and the fourth conductive path are electrically connected to the first grounding pattern and the fourth grounding pattern. The first conductive path, the second conductive path, the third conductive path, and the fourth conductive path gradually narrow towards the center of the substrate layer in the thickness direction.

14. The fingerprint sensor package according to claim 10, further comprising: An inner molding layer covers the controller chip. The second bonding pad is located in the opening of the inner molding layer.

15. The fingerprint sensor package according to claim 10, wherein, The thickness of the coating layer is 5 μm to 50 μm, and The distance between the coating layer and the grounding frame is 50 μm to 5 mm.

16. A smart card, the smart card comprising: The card body includes a recessed area and a connecting pad; A security chip is located within the card body; as well as A fingerprint sensor package configured to sense a user's fingerprint and send a signal of the sensing result to the security chip. The fingerprint sensor package includes A first substrate, the first substrate comprising: A core insulating layer, the core insulating layer comprising a first surface and a second surface opposite to each other. The first bonding pad is located on the second surface of the core insulating layer, and External connection pads are located between the edge of the second surface of the core insulating layer and the first bonding pads. A second substrate, located on the second surface of the core insulating layer, the second substrate comprising: A plurality of first sensing patterns, the plurality of first sensing patterns being spaced apart from each other in a first direction and extending in a second direction intersecting the first direction. A plurality of second sensing patterns, the plurality of second sensing patterns being spaced apart from each other in the second direction and extending in the first direction, and Second bonding pad, A conductive line extends between the first bonding pad and the second bonding pad, electrically connecting the first bonding pad to the second bonding pad. A controller chip, wherein the controller chip is located on the second substrate, and A molding layer is located on the second surface of the core insulating layer and on the second substrate. The molding layer covers the second substrate and the first bonding pad, but does not cover the external connection pad. The external connection pads of the first substrate are bonded to the connection pads of the card body.

17. The smart card according to claim 16, wherein, The first substrate further includes: A coating layer located on the first surface of the core insulation layer; A grounding border extending along the circumference of the coating layer on the first surface of the core insulation layer; and An adhesive layer is located between the coating layer and the core insulation layer, and also between the grounding frame and the core insulation layer. The fingerprint sensor package is mounted on the card body, such that the coating layer and the grounding border are exposed to the outside of the smart card.

18. The smart card according to claim 16, wherein, The fingerprint sensor package further includes an inner molding layer that covers a portion of the lower surface of the second substrate and the controller chip, and is located between the controller chip and the molding layer.

19. The smart card according to claim 16, wherein, The molding layer extends laterally from the side surface of the second substrate to the boundary between the first bonding pad and the external connection pad.

20. The smart card according to claim 16, wherein, The first substrate has a rectangular planar shape with rounded corners.

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