Display device

Abstract

A display device includes a display panel including an active area for displaying an image and a non-active area adjacent to the active area, and a metal sheet layer on the display panel, wherein the metal sheet layer includes a heat spreader overlapping the active area, and a coil surrounding the heat spreader and overlapping the non-active area.

Description

Technical Field

[0001] This disclosure relates to display devices. Background Technology

[0002] Display devices are output devices used to present information in a visual form. With the development of multimedia technology, display devices have been used more and more. Therefore, various types of display devices, such as liquid crystal displays (LCDs) and organic light-emitting diode (OLEDs), are now in use.

[0003] Display devices may include touchscreens to support touch input from a part of a user's body (e.g., a finger) and touch input from an electronic pen, such as an electromagnetic resonant (EMR) pen. Touch input using an electronic pen allows the display device to detect touch input more accurately compared to touch input using only a part of the user's body. Summary of the Invention

[0004] Embodiments of this disclosure provide a display device that does not require a separate component for charging an electronic pen, such as a charging coil sheet, has a thin profile, and reduces manufacturing costs.

[0005] According to embodiments of the present disclosure, a display device is provided, comprising: a display panel including an effective area for displaying an image and an ineffective area adjacent to the effective area; and a metal sheet layer on the display panel, wherein the metal sheet layer includes: a heat sink overlapping the effective area; and a coil surrounding the heat sink and overlapping the ineffective area.

[0006] The display device may further include: a printed circuit board connected to a display panel; and a touch driver mounted on the printed circuit board.

[0007] The touch driver can be electrically connected to the coil.

[0008] The display device may further include: a conductive adhesive portion placed between the printed circuit board and the display panel, and an electrical connection of the touch driver to the coil.

[0009] The printed circuit board may include: a base; and through-hole electrodes that penetrate the base and electrically connect conductive adhesive portions to the touch driver.

[0010] The printed circuit board may include: a base; touch driver connection electrodes on the base; and connection wires that electrically connect the touch driver to the coil.

[0011] The connecting line can go around the edge of the base.

[0012] The touch driver can be configured to detect input from the electronic pen.

[0013] The touch driver may include a first touch conductive layer and a second touch conductive layer disposed on the first touch conductive layer, and the touch driver may be configured to detect input from the electronic pen based on the induced current induced in the first touch conductive layer or the second touch conductive layer.

[0014] The touch driver can be configured to charge the electronic pen.

[0015] The coil may include: an extension portion disposed along the boundary of the heat sink; a first coil electrode disposed at a first end of the extension portion; and a second coil electrode disposed at a second end of the extension portion.

[0016] The first and second coil electrodes can overlap with the printed circuit board.

[0017] The first and second coil electrodes can be positioned at the corners of the metal sheet.

[0018] The display device may further include: a first heat dissipation layer and a second heat dissipation layer, disposed between the display panel and the metal sheet layer.

[0019] The first heat dissipation layer may include polyimide or polyethylene terephthalate.

[0020] The second heat dissipation layer may include graphite.

[0021] The display device may further include a buffer layer disposed between the display panel and the first heat dissipation layer.

[0022] According to an embodiment of the present disclosure, a display device is provided, comprising: a display panel; a printed circuit board connected to the display panel and having a touch driver mounted on the printed circuit board; and a heat sink disposed on the display panel, wherein the heat sink comprises: a heat sink unit; and a coil unit surrounding the heat sink unit and electrically connected to the touch driver.

[0023] The display device may further include: a conductive adhesive portion placed between the printed circuit board and the display panel, and an electrical connection of the touch driver to the coil unit.

[0024] The printed circuit board may include: a base; touch driver connection electrodes disposed on the base; and connection wires that electrically connect the touch driver to the coil unit.

[0025] According to an embodiment of the present disclosure, a display device is provided, comprising: a display panel including a first area for displaying an image and a second area for not displaying an image, wherein the second area is adjacent to at least one side of the first area; a heat sink disposed in the first area; and a charging strip disposed in the second area and adjacent to at least one side of the heat sink.

[0026] The heat sink and charging strip can be provided in the same layer.

[0027] The charging bar can be set up to charge external devices.

[0028] The charging strip may include electrodes that are electrically connected to the touch driver of the display device.

[0029] A gap can be provided between the heat sink and the charging strip. Attached Figure Description

[0030] The above and other features of this disclosure will become more apparent from the detailed description of embodiments thereof with reference to the accompanying drawings, in which:

[0031] Figure 1 This is a perspective view of a display device according to an embodiment of the present disclosure;

[0032] Figure 2 This is a plan view of a display panel according to an embodiment of the present disclosure;

[0033] Figure 3 It is along Figure 1 A cross-sectional view taken by line A-A';

[0034] Figure 4 This is a cross-sectional view of a display panel according to an embodiment of the present disclosure;

[0035] Figure 5 This is a cross-sectional view of the cover panel according to an embodiment of the present disclosure;

[0036] Figure 6 This is a plan view of a metal sheet and a printed circuit board according to an embodiment of the present disclosure, wherein the printed circuit board is unfolded;

[0037] Figure 7 This is a plan view of a metal sheet and a printed circuit board according to an embodiment of the present disclosure, wherein the printed circuit board overlaps the metal sheet;

[0038] Figure 8 It is along Figure 7 A cross-sectional view taken from line B-B';

[0039] Figure 9 This is a plan view of the metal sheet and the printed circuit board in an unfolded state, according to another embodiment of the present disclosure.

[0040] Figure 10 This is a plan view of the metal sheet and the printed circuit board in a state of overlapping of the printed circuit board and the metal sheet, according to another embodiment of the present disclosure.

[0041] Figure 11It is along Figure 10 A cross-sectional view taken from line C-C';

[0042] Figure 12 It is along Figure 10 A cross-sectional view taken from line D-D';

[0043] Figure 13 This is a plan view of a metal sheet layer according to yet another embodiment of the present disclosure;

[0044] Figure 14 This is a plan view of a metal sheet layer according to yet another embodiment of the present disclosure;

[0045] Figure 15 This is a plan view of a metal sheet layer according to yet another embodiment of the present disclosure; and

[0046] Figure 16 This is a plan view of a metal sheet layer according to yet another embodiment of the present disclosure. Detailed Implementation

[0047] In the following description, numerous details are set forth to provide a thorough understanding of various embodiments or implementations of this disclosure. As used herein, “embodiment” and “implementation” are interchangeable terms for non-limiting examples of apparatus or methods employing one or more of the embodiments or embodiments disclosed herein. However, it will be apparent, however, that various embodiments may be practiced without these details or with one or more equivalent arrangements. In other instances, structures and apparatus may be shown in block diagram form to avoid unnecessarily obscuring the various embodiments. Furthermore, the various embodiments may be different, but not necessarily exclusive. For example, the shape, configuration, and characteristics of an embodiment may be used or implemented in another embodiment of this disclosure.

[0048] Unless otherwise specified, the illustrated embodiments should be understood as providing detailed features that can be varied in practice to implement this disclosure in one or more ways. Therefore, unless otherwise specified, features, components, modules, layers, films, panels, areas and / or aspects of the various embodiments (hereinafter individually or collectively referred to as “elements”) may be combined, separated, interchanged and / or rearranged in other ways.

[0049] The use of crosshairs and / or shading in the accompanying drawings is provided to clarify the boundaries between adjacent elements. Therefore, unless specified, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for the material, material properties, size, scale, commonalities between illustrated elements, and / or any other characteristics, properties, etc., of the elements. Furthermore, in the drawings, the dimensions and relative dimensions of elements may be exaggerated for clarity and / or descriptive purposes. When embodiments can be implemented differently, the process sequence may be performed differently than the described sequence. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of their description. Additionally, the same reference numerals refer to the same elements.

[0050] When a component or layer is referred to as being "on," "connected to," or "coupled to" another component or layer, the component or layer may be directly on, connected to, or coupled to the other component or layer, or an intermediary component or layer may be present. However, when a component or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another component or layer, an intermediary component or layer is not present. The term "connection" can refer to a physical, electrical, and / or fluid connection with or without an intermediary component. Furthermore, the X-axis, Y-axis, and Z-axis are not limited to the three axes of a Cartesian coordinate system (such as the x-axis, y-axis, and z-axis) and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis may be substantially perpendicular to each other, or they may represent different directions that may not be perpendicular to each other. In this document, "at least one of X, Y, and Z" and "at least one of the groups consisting of X, Y, and Z" can be interpreted as X only, Y only, Z only, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0051] The terms “and” and “or” can be used in the sense of conjunctions or antonymous conjunctions, and can be understood as equivalent to “and / or”.

[0052] Although the terms “first,” “second,” etc., may be used in this document to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, the first element discussed below may be referred to as the second element.

[0053] Spatial relative terms such as “below,” “under,” “below,” “down,” “above,” “above,” “higher,” and “side” (e.g., in “sidewall”) may be used herein for descriptive purposes and thus to describe the relationship of one element to another(s) as illustrated in the accompanying drawings. In addition to the orientations depicted in the drawings, spatial relative terms are intended to cover different orientations of the device in use, operation, and / or manufacture. For example, if the device in the drawings is flipped, an element described as “below” or “under” other elements or features will consequently be oriented “above” other elements or features. Thus, the term “below” can cover both above and below orientations. Furthermore, the device may be oriented in other ways (e.g., rotated 90 degrees or about 90 degrees or otherwise), and therefore, the spatial relative descriptive terms used herein may be interpreted accordingly.

[0054] The term “overlapping” or “overlapping” can mean that the first object is above, below, or to the side of the second object, and vice versa. Additionally, the term “overlapping” can include stacking, overlapping, facing or confronting, extending over, covering, or partially covering.

[0055] When an element is described as “not overlapping” with another element, this can include elements being spaced apart from each other, offset from each other, or separated from each other.

[0056] The terms “facing” and “facing” can mean that the first element is directly or indirectly opposite the second element. When a third element is placed between the first and second elements, the first and second elements can be understood as being indirectly opposite each other, although still facing each other.

[0057] The terminology used herein is for the purpose of describing embodiments and is not intended to be limiting. As used herein, the singular forms “a” and “the (described)” are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, when used in this specification, the terms “comprising,” “including,” “having,” and / or variations thereof specify the presence of stated features, integrals, steps, operations, elements, components, and / or groups thereof, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. It should also be noted that, as used herein, the terms “basically,” “about,” and other similar terms are used as approximate terms and not terms of degree, and are therefore used to account for the inherent biases of measured, calculated, and / or provided values ​​recognized by those skilled in the art.

[0058] Taking into account the measurements discussed and the errors associated with the measurement of specific quantities (e.g., limitations of the measurement system), for example, as used herein, "about" or "approximately" includes the stated value and may mean within an acceptable range of deviation for the specific value as determined by one of ordinary skill in the art. For example, "about" may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0059] Various embodiments are described herein with reference to schematic cross-sectional and / or exploded views that are schematic illustrations of the embodiments and / or intermediate structures. Therefore, variations in the shape of the illustrations can be expected, for example, due to manufacturing techniques and / or tolerances. Consequently, the embodiments disclosed herein should not necessarily be interpreted as limited to the shapes of the illustrated areas, but should include deviations in shape due to, for example, manufacturing processes. In this way, the areas illustrated in the figures can be schematic in nature, and the shapes of these areas may not reflect the actual shapes of the areas of the device, and are therefore not intended to be limiting.

[0060] Some or more embodiments are described and illustrated in the accompanying drawings from the perspective of functional blocks, units, and / or modules. Those skilled in the art will appreciate that these blocks, units, and / or modules are physically implemented by electronic (or optical) circuits (such as logic circuits, discrete components, microprocessors, hardwired circuits, memory elements, and wiring connections, etc.) that can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. Where blocks, units, and / or modules are implemented by microprocessors or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and may optionally be driven by firmware and / or software. It is also contemplated that each block, unit, and / or module can be implemented by dedicated hardware, or implemented as a combination of dedicated hardware performing some or more functions and processors performing other functions (e.g., one or more programmed microprocessors and associated circuitry). Furthermore, each block, unit, and / or module of some or more embodiments can be physically divided into two or more interactive and discrete blocks, units, and / or modules. Furthermore, blocks, units, and / or modules of some or more embodiments can be physically combined into more complex blocks, units, and / or modules.

[0061] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms such as those defined in common dictionaries shall be interpreted as having meanings consistent with their meanings in the context of the relevant art and shall not be interpreted in an idealized or overly formal sense unless specifically limited thereto herein.

[0062] Figure 1This is a perspective view of a display device according to an embodiment of the present disclosure. Figure 2 This is a plan view of a display panel according to an embodiment of the present disclosure. Figure 3 It is along Figure 1 A cross-sectional view taken from line A-A'.

[0063] In the following text, the first direction X, the second direction Y, and the third direction Z intersect each other in different directions. For example, the first direction X is the width direction, the second direction Y is the length direction, and the third direction Z is the thickness direction and / or the height direction. However, the directions described above are not limited to the examples described above.

[0064] Reference Figure 1 Display device 1 is a device for displaying moving or still images. Display device 1 can be used as a display screen for various electronic products such as televisions, laptops, monitors, billboards, and Internet of Things, as well as portable electronic devices such as mobile phones, smartphones, tablet PCs, smartwatches, watch phones, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation systems, and ultra-portable computers (UMPCs).

[0065] The display device 1 may have a basic rectangular shape in a planar view, the basic rectangular shape having two short sides in the first direction X and two long sides in the second direction Y, but this disclosure is not limited thereto. The display device 1 may have various planar shapes such as polygons, circles or ellipses. The display device 1 may have rounded or curved edges extending along the first direction X and / or the second direction Y.

[0066] Display device 1 includes an active area AA and an inactive area NAA.

[0067] The effective area AA can display an image. The effective area AA can detect input for recognizing a user's touch input, fingerprint pattern, or pen input, etc. The effective area AA may include multiple pixels for displaying the image and multiple sensors for detecting the input. In other words, in one embodiment of this disclosure, the effective area AA can be an area for displaying an image and recognizing a user's touch input, fingerprint pattern, or pen input, etc. However, this disclosure is not limited to this, and the effective area AA may be divided into a display area for displaying an image (e.g., a first area) and an input detection area for detecting input for recognizing a user's touch input, fingerprint pattern, or pen input, etc. (e.g., a second area).

[0068] The effective area AA may be located on at least one surface of the display device 1. In one embodiment of this disclosure, the effective area AA may have a generally rectangular shape in a plan view and may be configured to be flat on the top surface of the display device 1, but this disclosure is not limited thereto. The effective area AA may further be located on the edge or side surface of the display device 1, or at least a portion of the effective area AA may be bent.

[0069] Non-valid regions (NAAs) may not display images. Non-valid regions (NAAs) may not detect input used to identify users, such as touch input, fingerprint patterns, or pen input. Non-valid regions (NAAs) can be areas outside of valid regions (AAs).

[0070] A non-effective region NAA can be disposed around an effective region AA. The non-effective region NAA can surround at least a portion of the effective region AA. For example, the non-effective region NAA can be adjacent to at least one side of the effective region AA. In one embodiment of this disclosure, the non-effective region NAA can have a strip-like shape surrounding the edge of the effective region AA, but this disclosure is not limited thereto.

[0071] As described above, the effective area AA can recognize pen input. Pen input can be performed by an electronic pen EPN. The electronic pen EPN can be an electromagnetic resonant (EMR) pen, which detects the resonance caused by electromagnetic induction generated between the display device 1 and the EPN to determine the signal.

[0072] The electronic pen EPN may include at least one resonant circuit RSC. The resonant circuit RSC may include a capacitor C and an inductor L. Although for the sake of simplicity, Figure 1 The diagram shows a capacitor C and an inductor L, but the number of capacitors C and inductors L is not limited to this, and the configuration of the resonant circuit RSC can vary. For example, the electronic pen EPN may include more than one inductor L and more than one capacitor C. Similar to the principle of wireless charging, the electromagnetic waves generated in the display device 1 resonate with the inductor L of the electronic pen EPN to supply energy to the electronic pen EPN, allowing the electronic pen EPN to operate without a separate power source such as a battery.

[0073] The electronic pen EPN can be provided separately from the display device 1. However, this disclosure is not limited thereto, and the electronic pen EPN can be included in the display device 1.

[0074] Reference Figures 1 to 3 The display device 1 may include a display panel DP and a printed circuit board FB.

[0075] The display panel DP may include light-emitting elements. For example, the display panel DP may be an organic light-emitting display panel using organic light-emitting diodes (OLEDs) including organic light-emitting layers, a micro light-emitting diode display panel using micro light-emitting diodes (LEDs), a quantum dot light-emitting display panel using quantum dot light-emitting diodes (LEDs) including quantum dot light-emitting layers, or an inorganic light-emitting display panel using inorganic light-emitting elements including inorganic semiconductors. In one embodiment of this disclosure, the display panel DP may be an organic light-emitting display panel, but is not limited thereto.

[0076] The display panel (DP) can include a main area (MA) and a sub-area (SA).

[0077] The main area MA can have a basic rectangular shape in a planar diagram. However, this disclosure is not limited thereto, and the main area MA can have various planar shapes such as polygons (e.g., squares and rhombuses), circles, or ellipses.

[0078] The valid region AA and the invalid region NAA can be located within the main region MA. The valid region AA can be located at the center of the main region MA and can occupy most of the main region MA. The invalid region NAA can be located at the edge of the main region MA to surround the valid region AA.

[0079] Sub-region SA can be located on one side of main region MA. Sub-region SA can extend from one side of main region MA. In a plan view, sub-region SA can have a width smaller than the width of main region MA and protrude from one side of main region MA. In one embodiment of this disclosure, sub-region SA can be located on the short side of main region MA extending in a first direction X, but this disclosure is not limited thereto. Sub-region SA can also be located on the long side of main region MA extending in a second direction Y.

[0080] Sub-area SA can connect the printed circuit board FB to the main area MA. One side of sub-area SA can be connected to the main area MA, and the other side of sub-area SA can be connected to the printed circuit board FB. In other words, the first side of sub-area SA can be connected to the main area MA, and the second side of sub-area SA can be connected to the printed circuit board FB.

[0081] A display driver DDM for driving multiple pixels arranged in an effective area AA can be mounted on a sub-area SA. The display driver DDM may include a display driver integrated circuit. The sub-area SA can be replaced by a flexible circuit film. In other words, the display driver DDM can be mounted on a flexible circuit film by various methods such as chip-on-plastic (COP), chip-on-film (COF), or chip-on-glass (COG).

[0082] The printed circuit board (FB) can be attached to the other side of the sub-area (SA). The FB can be a flexible circuit board. The touch driver (TDM) for driving the touch sensing unit (TDU), which will be described later, can be mounted on the FB.

[0083] like Figure 3 As shown in the cross-sectional view, sub-region SA can be bent downwards. In this case, at least a portion of sub-region SA, the printed circuit board FB, the display driver DDM, and the touch driver TDM can overlap with the main region MA in the thickness direction (e.g., the third direction Z).

[0084] The display panel (DP) may include a substrate (SUB), a thin film transistor layer (TFTL), a light-emitting element layer (EML), a packaging layer (TFEL), and a touch sensing unit (TDU).

[0085] The substrate SUB can be disposed in a main region MA and a sub-region SA. The substrate SUB can be formed of an insulating material such as glass, quartz, or a polymeric resin. Examples of polymeric materials may include polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl ester, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), or combinations thereof. Alternatively, the substrate SUB may include a metallic material. In one embodiment of this disclosure, the substrate SUB may be a flexible substrate comprising polyimide and capable of being bent, folded, or rolled. However, this disclosure is not limited thereto, and the substrate SUB may be a rigid substrate.

[0086] Thin-film transistor (TFTL) layers can be disposed on one surface of the substrate SUB, for example, in Figure 4 The thin-film transistor layer (TFTL) is disposed on the top surface of the substrate SUB. The TFTL can be located in the active region AA and the inactive region NAA. Figure 4 The thin-film transistor ST shown is used to drive the pixels in the effective region AA. The thin-film transistor layer TFTL can be disposed in the main region MA and the sub-region SA. The TFTL may further include display scan lines, display data lines, power lines, display scan control lines, and wiring connecting display pads to the display data lines, etc.

[0087] The light-emitting element layer (EML) can be disposed on the thin-film transistor layer (TFTL). The EML can be disposed in the effective region AA. The EML may include light-emitting elements arranged in the light-emitting unit.

[0088] A TFEL encapsulation layer can be disposed on the EML (Emitting Material Layer). The TFEL encapsulation layer can cover the opposite side of the EML. The TFEL encapsulation layer can be arranged in the active region AA and the inactive region NAA of the main region MA. The TFEL encapsulation layer can include at least one inorganic layer and at least one organic layer for encapsulating the EML.

[0089] A touch sensing unit (TDU) can be disposed on the package layer TFEL. The touch sensing unit (TDU) can be disposed in the active area AA and the inactive area NAA of the main region MA. The touch sensing unit (TDU) can detect touch from a person or object. As described later, the touch sensing unit (TDU) can further detect input from the electronic pen EPN based on the induced current induced in the touch sensing unit (TDU) due to the inductor L of the electronic pen EPN, but this disclosure is not limited thereto.

[0090] Figure 4 This is a cross-sectional view of a display panel according to an embodiment of the present disclosure.

[0091] Reference Figure 3 and Figure 4 The display panel DP may further include a barrier layer BR.

[0092] A barrier layer BR can be disposed on the top surface of a substrate SUB. The barrier layer BR can block moisture from penetrating through the moisture-permeable substrate SUB. The barrier layer BR can be formed as multiple inorganic layers stacked alternately. For example, the barrier layer BR can be formed by multiple layers in which one or more inorganic layers selected from silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide are stacked alternately.

[0093] The active layer ACT can be disposed on the blocking layer BR. The active layer ACT forms the channel of the thin-film transistor ST. The active layer ACT can be disposed in each pixel in the active region AA, and in some cases, it can also be disposed in the inactive region NAA. The active layer ACT can include polycrystalline silicon, monocrystalline silicon, low-temperature polycrystalline silicon, amorphous silicon, or oxide semiconductor.

[0094] A gate insulating layer 130 may be disposed on the active layer ACT. The gate insulating layer 130 may be disposed throughout the entire substrate SUB. The gate insulating layer 130 may include silicon compounds or metal oxides, etc. For example, the gate insulating layer 130 may include silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, or titanium oxide, etc. These may be used individually or in combination with each other.

[0095] The gate electrode G can be disposed on the gate insulating layer 130. The gate electrode G can overlap with the active layer ACT in the third direction Z. The gate electrode G can be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu) and their alloys.

[0096] A first interlayer insulating layer 141 can be disposed on the gate electrode G. The first interlayer insulating layer 141 can be formed of an inorganic layer (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer). Although in Figure 4 The first interlayer insulation layer 141 is illustrated as a single layer, but the first interlayer insulation layer 141 may also be formed of multiple inorganic layers.

[0097] The capacitor electrode CAE can be disposed on the first interlayer insulating layer 141. The capacitor electrode CAE can overlap with the gate electrode G of the thin-film transistor ST in the third direction Z. Since the first interlayer insulating layer 141 has a predetermined dielectric constant, the capacitor electrode CAE, the gate electrode G, and the first interlayer insulating layer 141 disposed between the capacitor electrode CAE and the gate electrode G can form a capacitor. The capacitor electrode CAE can be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and their alloys.

[0098] The second interlayer insulating layer 142 can be disposed on the capacitor electrode CAE. The second interlayer insulating layer 142 can be formed of an inorganic layer (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer). Although the second interlayer insulating layer 142... Figure 4 The middle layer is shown as a single layer, but the second interlayer insulating layer 142 can also be formed by multiple inorganic layers.

[0099] The source electrode S and drain electrode D can be disposed on the second interlayer insulating layer 142. The source electrode S and drain electrode D can be connected to the active layer ACT through contact holes penetrating the first interlayer insulating layer 141, the second interlayer insulating layer 142, and the gate insulating layer 130. The source electrode S and drain electrode D can be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and their alloys. In another embodiment of this disclosure, the positions of the source electrode S and drain electrode D can be... Figure 4 The configuration shown is the opposite.

[0100] A planarization layer 160 may be disposed on the source electrode S and the drain electrode D. The planarization layer 160 may be formed of an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. In some embodiments of this disclosure, the planarization layer 160 may be formed of multiple layers, and at least one connection electrode may be further disposed between the multiple layers to connect the pixel electrode 171 to the drain electrode D while penetrating the multiple layers. For example, a contact hole may be formed in the planarization layer 160 to accommodate the at least one connection electrode.

[0101] The light-emitting element (LEL) and the embankment 190 can be arranged on the planarization layer 160. Each light-emitting element (LEL) includes a pixel electrode 171, a light-emitting layer 172, and a common electrode 173.

[0102] Pixel electrode 171 can be disposed on planarization layer 160. Pixel electrode 171 can be connected to connection electrode through contact holes penetrating planarization layer 160.

[0103] In the top-emitting structure in which the light-emitting layer 172 emits light toward the common electrode 173, the pixel electrode 171 can be made of a metallic material with high reflectivity, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of silver and indium tin oxide (ITO) (ITO / Ag / ITO), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0104] A dam 190 can be formed on the planarization layer 160 to separate pixel electrodes 171, thereby defining a first light-emitting unit EA1, a second light-emitting unit EA2, and a third light-emitting unit EA3, etc. The dam 190 can be configured to cover the edge of the pixel electrode 171. The dam 190 can be formed from an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. The dam 190 can be referred to as a pixel defining layer.

[0105] Each of the first light-emitting unit EA1, the second light-emitting unit EA2, and the third light-emitting unit EA3 represents a region in which the pixel electrode 171, the light-emitting layer 172, and the common electrode 173 are stacked sequentially, and holes from the pixel electrode 171 and electrons from the common electrode 173 recombine with each other in the light-emitting layer 172 to emit light.

[0106] The light-emitting layer 172 can be disposed on the pixel electrode 171 and the embankment 190. The light-emitting layer 172 may include an organic material that emits light in a predetermined color. For example, the light-emitting layer 172 includes a hole transport layer, an organic material layer, and an electron transport layer.

[0107] A common electrode 173 can be disposed on the light-emitting layer 172. The common electrode 173 can be disposed to cover the light-emitting layer 172. The common electrode 173 can be a common layer formed together at the first light-emitting unit EA1, the second light-emitting unit EA2, and the third light-emitting unit EA3. A capping layer can be formed on the common electrode 173.

[0108] In the top-emitting structure, the common electrode 173 can be formed of a transparent conductive material (TCO) such as ITO or IZO that can transmit light, or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). When the common electrode 173 is formed of a semi-transmissive conductive material, the luminous efficiency can be improved due to the microcavity effect.

[0109] An encapsulation layer TFEL can be disposed on the common electrode 173. The encapsulation layer TFEL includes at least one inorganic layer to prevent oxygen or moisture from penetrating into the light-emitting element layer EML. In addition, the encapsulation layer TFEL includes at least one organic layer to protect the light-emitting element layer EML from foreign matter such as dust. For example, the encapsulation layer TFEL includes a first encapsulation inorganic layer TFE1, an encapsulation organic layer TFE2, and a second encapsulation inorganic layer TFE3.

[0110] A first encapsulating inorganic layer TFE1 can be disposed on the common electrode 173, an encapsulating organic layer TFE2 can be disposed on the first encapsulating inorganic layer TFE1, and a second encapsulating inorganic layer TFE3 can be disposed on the encapsulating organic layer TFE2. The first encapsulating inorganic layer TFE1 and the second encapsulating inorganic layer TFE3 can be formed by multiple layers of alternatingly stacked inorganic layers selected from silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide. The encapsulating organic layer TFE2 can be an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0111] The touch sensing unit (TDU) can be disposed on the encapsulation layer (TFEL). The touch sensing unit (TDU) includes a first touch insulating layer (TINS1), a first touch conductive layer (ML1), a second touch insulating layer (TINS2), a second touch conductive layer (ML2), and a third touch insulating layer (TINS3).

[0112] The first touch insulating layer TINS1 can be formed from an inorganic layer (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0113] The first touch conductive layer ML1 can be disposed on the first touch insulating layer TINS1. The first touch conductive layer ML1 can be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu) and their alloys.

[0114] A second touch insulating layer TINS2 is disposed on the first touch conductive layer ML1. The second touch insulating layer TINS2 may be formed of an inorganic layer (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer). Alternatively, the second touch insulating layer TINS2 may be formed of an organic layer such as an acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0115] The second touch conductive layer ML2 can be disposed on the second touch insulating layer TINS2. The second touch conductive layer ML2 can be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu) and their alloys.

[0116] The first touch conductive layer ML1 and the second touch conductive layer ML2 can be arranged so that they do not overlap with the plurality of light-emitting units EA1, EA2, and EA3 in the third direction Z. A portion of the second touch conductive layer ML2 may overlap with the first touch conductive layer ML1 in the third direction Z. The second touch conductive layer ML2 can be connected to the first touch conductive layer ML1 through a contact hole penetrating the second touch insulating layer TINS2. In addition, at least one of the second touch conductive layers ML2 may not overlap with the first touch conductive layer ML1 in the third direction Z.

[0117] The second touch conductive layer ML2 may include a drive electrode to which a drive signal is applied and a detection electrode for detecting the amount of charge change in the capacitance. The first touch conductive layer ML1 may perform the function of connecting electrically disconnected drive electrodes or detection electrodes, but this disclosure is not limited thereto.

[0118] In one embodiment of this disclosure, the first touch conductive layer ML1 and / or the second touch conductive layer ML2 can perform the sensing electronic pen EPN (see...). Figure 1 The input function can be based on the inductor L of the electronic pen EPN (see...). Figure 1 The magnetic field of the touch sensor ML2 induces a current in the sensing electrode of the second touch conductive layer ML2 to sense the input of the electronic pen EPN. However, this disclosure is not limited to this, and the display device 1 may use an electromagnetic resonant (EMR) sensor provided separately from the touch sensing unit TDU to sense the input of the electronic pen EPN.

[0119] A third touch insulating layer (TINS3) is formed on the second touch conductive layer (ML2). The third touch insulating layer (TINS3) can planarize the stepped portion formed by the driving electrode, the detection electrode, and the first touch conductive layer (ML1). The third touch insulating layer (TINS3) can be formed of an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0120] Figure 5 This is a cross-sectional view of the cover panel according to an embodiment of the present disclosure.

[0121] Reference Figures 1 to 5 The cover panel CPN can be disposed on another surface of the substrate SUB, for example, in Figure 4 On the bottom surface of the substrate SUB. The cover panel CPN may include multiple functional layers for shock absorption, electromagnetic wave shielding, and heat dissipation.

[0122] The cover panel CPN may include a buffer layer BL and a heat dissipation layer HDL.

[0123] A buffer layer BL can be disposed on the other surface of the substrate SUB. The buffer layer BL can absorb external impacts. The buffer layer BL may contain a light-shielding material to prevent the structure disposed above the buffer layer BL from being visually identifiable, but this disclosure is not limited thereto.

[0124] The buffer layer BL may include a first buffer layer BL1 and a second buffer layer BL2 that are sequentially stacked on the substrate SUB.

[0125] A first buffer layer BL1 can be disposed on another surface of the substrate SUB. The first buffer layer BL1 can be an embossed layer. This can be achieved by placing the first buffer layer BL1 on one surface facing the other surface of the substrate SUB (e.g., on...). Figure 5 An embossing process is performed on the top surface of the first buffer layer BL1 to form a non-uniform structure. The non-uniform structure can have a semi-circular or semi-elliptical cross-sectional shape, but the cross-sectional shape of the non-uniform structure is not limited to these.

[0126] The first buffer layer BL1 may be made of a polymer resin such as polyurethane, polycarbonate, polypropylene, or polyethylene, or may contain an elastic material such as rubber, silicone, or a sponge in which polyurethane or acrylic materials are foamed. However, this disclosure is not limited thereto.

[0127] The second buffer layer BL2 can be disposed on the other surface of the first buffer layer BL1, for example, on Figure 5 The first buffer layer BL1 is on the bottom surface of the middle buffer layer. The second buffer layer BL2 can be a padding layer.

[0128] The second buffer layer BL2 may be made of a polymer resin such as polyurethane, polycarbonate, polypropylene, or polyethylene, or may contain an elastic material such as rubber, silicone, or a sponge in which polyurethane or acrylic materials are foamed. However, this disclosure is not limited thereto.

[0129] The buffer layer BL may further include a planarization layer FLM disposed between the substrate SUB and the embossing layer. The planarization layer FLM may also be separable from the buffer layer BL. The planarization layer FLM may be an adhesive layer bonding the embossing layer and the substrate SUB, but this disclosure is not limited thereto. The planarization layer FLM may be provided between the first buffer layer BL1 and the substrate SUB.

[0130] The buffer layer BL can further perform the function of blocking external light. For example, at least one of the first buffer layer BL1 and the second buffer layer BL2 may contain a light-absorbing material such as black pigment or black dye to prevent the component disposed under the buffer layer BL from being visually identified. However, this disclosure is not limited thereto.

[0131] At least one of the first buffer layer BL1, the second buffer layer BL2, and the planarization layer FLM can be omitted. The buffer layer BL can also be a single layer.

[0132] A heat dissipation layer (HDL) can be disposed on a buffer layer (BL). For example, the heat dissipation layer (HDL) can be disposed on a second buffer layer (BL2). The heat dissipation layer (HDL) can dissipate heat generated in the display panel (DP) or other parts of the display device 1.

[0133] The heat dissipation layer HDL may include a first heat dissipation layer HDL1, a second heat dissipation layer HDL2, and a metal sheet layer MS (or heat dissipation section) sequentially stacked on the second buffer layer BL2.

[0134] The first heat dissipation layer HDL1 may include a polymer film. For example, the first heat dissipation layer HDL1 may include, but is not limited to, polyimide (PI), polyethylene terephthalate (PET), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polysulfone (PSF), polymethyl methacrylate (PMMA), triacetyl cellulose (TAC), or cyclic olefin polymer (COP).

[0135] The second heat dissipation layer HDL2 can be disposed on the first heat dissipation layer HDL1. The second heat dissipation layer HDL2 may include a material with excellent thermal conductivity (e.g., graphite or carbon nanotubes), but this disclosure is not limited thereto.

[0136] At least one of the first heat dissipation layer HDL1 and the second heat dissipation layer HDL2 can be omitted.

[0137] A metal sheet layer MS can be disposed on the second heat dissipation layer HDL2. The metal sheet layer MS may include a metal. For example, the metal may include copper, nickel, ferrite, or silver, which have excellent thermal conductivity, but this disclosure is not limited thereto. The metal sheet layer MS can not only perform heat dissipation but also electromagnetic wave shielding. Furthermore, as described later, the metal sheet layer MS may include a coil unit CLP (see [link to documentation]). Figure 6 This is to further perform the function of charging the electronic pen's EPN. The metal sheet layer MS can be a third heat dissipation layer.

[0138] The cover panel CPN may further include at least one bonding member disposed between the multiple layers constituting the cover panel CPN. For example, the bonding member may be provided between the heat dissipation layer HDL and the buffer layer BL. If the touch sensing unit TDU does not perform the function of sensing the input of the electronic pen EPN, the cover panel CPN may further include a digital converter layer containing an electromagnetic resonant (EMR) sensor for sensing the input of the electronic pen EPN. For example, the digital converter layer may be disposed between the first heat dissipation layer HDL1 and the second heat dissipation layer HDL2 or between the second heat dissipation layer HDL2 and the metal sheet layer MS. However, the arrangement of the digital converter layer is not limited to this.

[0139] Figure 6 This is a plan view of a metal sheet and a printed circuit board according to an embodiment of the present disclosure, wherein the printed circuit board is unfolded. Figure 7 This is a plan view of a metal sheet and a printed circuit board according to an embodiment of the present disclosure, wherein the printed circuit board overlaps the metal sheet. Figure 8 It is along Figure 7 The cross-sectional view taken by line B-B'.

[0140] exist Figures 6 to 8 In the diagram, the metal sheet layer MS and the printed circuit board FB are shown in reverse. Figure 6 and Figure 7 The bottom surface of the metal sheet MS and the bottom surface of the printed circuit board FB are shown.

[0141] When the metal sheet MS and the printed circuit board FB are unfolded into a flat plane, the bottom surfaces of the metal sheet MS and the printed circuit board FB can be the opposing surfaces of the top surfaces of the metal sheet MS and the printed circuit board FB in the third direction Z, respectively. The third direction Z can be the direction in which the image is displayed and / or the direction in which the light from the light-emitting element LEL is primarily emitted. The bottom surface of the printed circuit board FB can be the bottom surface of the base FB_B, which will be described later.

[0142] Reference Figure 6 and Figure 7 The metal sheet MS can have a basic rectangular shape in a planar view. Further reference... Figure 2In one embodiment of this disclosure, the metal sheet MS may have a planar shape substantially the same as the planar shape of the main area MA of the display panel DP. In this case, the edges of the metal sheet MS may be aligned to overlap with the edges of the main area MA. However, the shape of the metal sheet MS is not limited to this, and the metal sheet MS may have various planar shapes such as polygons, circles, or ellipses.

[0143] Reference Figure 6 When the printed circuit board FB is unfolded into a flat surface, the printed circuit board FB can be positioned adjacent to the short side of the metal sheet MS extending in the first direction X. However, this disclosure is not limited thereto, and the printed circuit board FB can also be positioned adjacent to the long side of the metal sheet MS extending in the second direction Y. (See also...) Figure 3 and Figure 7 When the sub-region SA of the display panel DP is bent, the printed circuit board FB can overlap with the short side of the metal sheet MS and the portion adjacent to the short side of the metal sheet MS in the third direction Z. In this case, the display driver DDM and the touch driver TDM can overlap with the short side of the metal sheet MS and the portion adjacent to the short side of the metal sheet MS in the third direction Z.

[0144] Reference Figure 1 and Figures 6 to 8 The metal sheet layer MS may include a heat dissipation unit HDP and a coil unit CLP. The heat dissipation unit HDP may be referred to as a heat sink, which can be used to dissipate heat from the display device 1. The coil unit CLP may be referred to as a coil or charging strip.

[0145] The heat dissipation unit HDP can be formed in the central part of the metal sheet MS. In a planar view, the heat dissipation unit HDP can have a basic rectangular shape with rounded corners and can have an area larger than that of the coil unit CLP, but the shape of the heat dissipation unit HDP is not limited to this.

[0146] Further reference Figure 2The heat dissipation unit HDP can have an area substantially the same as the effective region AA in a plan view, and a large portion of the heat dissipation unit HDP can overlap with the effective region AA in the thickness direction. Therefore, heat can be effectively emitted from the effective region AA. In one embodiment of this disclosure, in a plan view, the heat dissipation unit HDP can have an area larger than the effective region AA, and the effective region AA can be located within the heat dissipation unit HDP. In this case, the boundary of the heat dissipation unit HDP and the edge of the heat dissipation unit HDP adjacent to the effective region AA can be located within the non-effective region NAA. However, this disclosure is not limited thereto. In a plan view, the heat dissipation unit HDP and the effective region AA can have substantially the same area, and the boundary of the heat dissipation unit HDP can overlap with the boundary of the effective region AA, or the heat dissipation unit HDP can be located within the effective region AA.

[0147] In the plan view, the coil unit CLP can be arranged to surround the heat dissipation unit HDP. Further reference... Figure 2 The coil unit CLP can be configured to overlap with the ineffective region NAA. For example, the coil unit CLP can be disposed along the edge of the ineffective region NAA. The coil unit CLP can have a planar shape that is substantially the same as or similar to the planar shape of the ineffective region NAA. In one embodiment of this disclosure, the coil unit CLP can have a width smaller than the width of the ineffective region NAA and be located within the ineffective region NAA, but this disclosure is not limited thereto. For example, the coil unit CLP can have a width and / or area substantially the same as the width and / or area of ​​the ineffective region NAA, and in a plan view, the boundary of the coil unit CLP can overlap with the boundary of the ineffective region NAA. In a plan view, the coil unit CLP can have a width larger than the width of the ineffective region NAA, and a portion of the coil unit CLP can overlap with the effective region AA.

[0148] The heat dissipation unit HDP and the coil unit CLP can be integrally formed on the same layer (e.g., metal sheet layer MS).

[0149] In the plan view, the coil unit CLP can be arranged to be wound around the heat dissipation unit HDP at least once. In one embodiment of this disclosure, the coil unit CLP is arranged to be wound around the heat dissipation unit HDP twice, but the number of turns of the coil unit CLP is not limited thereto. In this embodiment, one coil unit CLP is illustrated, but multiple coil units CLP can be arranged.

[0150] The coil unit CLP may include an extension portion EP and a first coil electrode CP1 and a second coil electrode CP2 respectively disposed at both ends of the extension portion EP.

[0151] The extension portion EP can be arranged along the edge of the heat dissipation unit HDP in a stripe shape that surrounds the heat dissipation unit HDP more than once. For example, in a plan view, two adjacent portions of the extension portion EP can be arranged along each side of the heat dissipation unit HDP. In one embodiment of this disclosure, the extension portion EP can be arranged in a strip shape having straight sections extending in a first direction X and a second direction Y to correspond to the planar shape of the heat dissipation unit HDP. However, this disclosure is not limited to this, and the path through which the extension portion EP is arranged can have various planar shapes such as polygons, circles, or ellipses.

[0152] The first coil electrode CP1 and the second coil electrode CP2 can be arranged at the first end EP_E1 and the second end EP_E2 of the extension portion EP, respectively. In the plan view, the first end EP_E1 and the second end EP_E2 of the extension portion EP can be larger than other parts of the extension portion EP, but this disclosure is not limited thereto. The first coil electrode CP1 and the second coil electrode CP2 can be separate components distinct from the coil unit CLP, or they can be specific parts of the coil unit CLP.

[0153] The first end EP_E1 of the extension portion EP, the second end EP_E2 of the extension portion EP, the first coil electrode CP1, and the second coil electrode CP2 can be arranged at the corner portion of the heat dissipation layer HDL. The corner portion of the heat dissipation layer HDL can be formed at the intersection of the short side in the first direction X and the long side in the second direction Y. However, this disclosure is not limited thereto, and the first end EP_E1 of the extension portion EP, the second end EP_E2 of the extension portion EP, the first coil electrode CP1, and the second coil electrode CP2 can be arranged adjacent to the short or long side of the heat dissipation layer HDL located between the corner portions. Figure 6 As shown, in one embodiment of this disclosure, the first end EP_E1 of the extension portion EP, the second end EP_E2 of the extension portion EP, the first coil electrode CP1, and the second coil electrode CP2 can be arranged at a corner portion adjacent to the touch driver TDM between two corner portions that overlap with the printed circuit board FB in the third direction Z (e.g., Figure 6 and Figure 7 (The lower right corner portion). In other words, the first end EP_E1 of the extension portion EP, the second end EP_E2 of the extension portion EP, the first coil electrode CP1, and the second coil electrode CP2 can be arranged at the same corner portion.

[0154] Reference Figure 8The extension portion EP can be configured such that adjacent portions are separated from each other in a cross-sectional view. In the cross-sectional view, the extension portion EP can form a gap between adjacent portions. In some embodiments of this disclosure, the gap can be filled with an insulating material, but this disclosure is not limited thereto.

[0155] In the cross-sectional view, the first end EP_E1 of the extension portion EP can be configured to be separated from another portion of the extension portion EP adjacent to the first end EP_E1. In the cross-sectional view, a gap can be formed between the first end EP_E1 of the extension portion EP and other portions of the extension portion EP adjacent to the first end EP_E1. The gap can overlap with the base FB_B. In some embodiments of this disclosure, the gap can be filled with an insulating material, but this disclosure is not limited thereto. Similarly, the second end EP_E2 of the extension portion EP can also be configured to be separated from other portions of the extension portion EP.

[0156] The coil unit CLP can be configured to be separate from the heat dissipation unit HDP. For example, the extension EP and its first end EP_E1 can be arranged separately from the heat dissipation unit HDP. Figure 8 As shown in the cross-sectional view, gaps may be formed between the extension EP and the heat dissipation unit HDP, and between the first end EP_E1 of the extension EP and the heat dissipation unit HDP. The heat dissipation unit HDP may be configured to be electrically insulated from the coil unit CLP. In some embodiments of this disclosure, the gaps may be filled with insulating material, but this disclosure is not limited thereto.

[0157] Reference Figure 1 and Figures 6 to 8 The display device 1 may further include a first conductive adhesive portion CAD1 and a second conductive adhesive portion CAD2 disposed on the bottom surface of the printed circuit board FB.

[0158] like Figure 7 As shown, when the printed circuit board FB is disposed on the bottom surface of the metal sheet MS to overlap with the metal sheet MS, the first conductive adhesive portion CAD1 and the second conductive adhesive portion CAD2 can be placed between the printed circuit board FB and the metal sheet MS. Figure 8 As shown, the first conductive adhesive portion CAD1 can overlap with the first coil electrode CP1 in the third direction Z. For example, the first conductive adhesive portion CAD1 can directly contact the first coil electrode CP1. Similarly, the second conductive adhesive portion CAD2 can overlap with the second coil electrode CP2 in the third direction Z.

[0159] The first conductive adhesive portion CAD1 and the second conductive adhesive portion CAD2 may have conductive and adhesive properties, enabling the printed circuit board FB and the metal sheet layer MS to be bonded together and the first coil electrode CP1 and the second coil electrode CP2 to be electrically connected to the touch driver TDM. The first conductive adhesive portion CAD1 and the second conductive adhesive portion CAD2 may be, for example, conductive strips, but are not limited thereto.

[0160] Reference Figure 7 and Figure 8 The printed circuit board FB may include a base FB_B, a first through-hole electrode VE1, and a first touch driver connection line TCW1.

[0161] like Figures 6 to 8 As shown, the touch driver TDM can be disposed on the top surface of the base FB_B. However, this disclosure is not limited thereto, and the touch driver TDM can also be disposed on the bottom surface of the base FB_B. The touch driver TDM can be electrically connected to the coil unit CLP to apply current for inducing a magnetic field to the coil unit CLP.

[0162] The first through-hole electrode VE1 can penetrate the base FB_B in the third direction Z. The first through-hole electrode VE1 can electrically connect the first touch driver connection line TCW1 and the first coil electrode CP1.

[0163] The first touch driver connection line TCW1 can be disposed on the top surface of the base FB_B. The top surface of the base FB_B can be the surface opposite to the bottom surface of the base FB_B facing the metal sheet MS. A first side of the first touch driver connection line TCW1 can be connected to the first through-hole electrode VE1, and a second side of the first touch driver connection line TCW1 can be connected to the touch driver TDM. In other words, the first coil electrode CP1 can be electrically connected to the touch driver TDM through the first through-hole electrode VE1 and the first touch driver connection line TCW1.

[0164] The second coil electrode CP2 and the touch driver TDM can be connected in a substantially the same or similar manner as the first coil electrode CP1 and the touch driver TDM. For example, the printed circuit board FB may further include a second touch driver connection line connected to the touch driver TDM and disposed on the top surface of the base FB_B, and a second through-hole electrode penetrating the base FB_B in the third direction Z and connecting the second coil electrode CP2 to the second touch driver connection line. In other words, the second coil electrode CP2 can be electrically connected to the touch driver TDM through the second through-hole electrode and the second touch driver connection line.

[0165] Reference Figure 1 as well as Figures 6 to 8The touch driver TDM applies current to the coil unit CLP, causing the coil unit CLP to generate a magnetic field. This magnetic field, generated by the coil unit CLP, induces a current in the inductor L of the electronic pen EPN, and charge accumulates in the capacitor C of the electronic pen EPN, allowing power to be applied to drive the electronic pen EPN.

[0166] In the display device 1 according to an embodiment of the present disclosure, the heat dissipation unit HDP and the coil unit CLP are provided integrally, making it possible to omit separate components such as charging coil sheets for charging the electronic pen EPN. Therefore, the thickness of the display device 1 can be reduced, and the cost of manufacturing the display device 1 can be reduced.

[0167] According to embodiments of the present disclosure, the display device 1 may include: a display panel DP including an effective area AA for displaying an image and an ineffective area NAA adjacent to the effective area AA; and a metal sheet layer MS on the display panel DP, wherein the metal sheet layer MS includes: a heat sink (e.g., a heat dissipation unit HDP) overlapping the effective area AA; and a coil (e.g., a coil unit CLP) surrounding the heat sink and overlapping the ineffective area NAA.

[0168] Figure 9 This is a plan view of the metal sheet and the printed circuit board in an unfolded state, according to another embodiment of the present disclosure. Figure 10 This is a plan view of the metal sheet and the printed circuit board in a state of overlapping of the printed circuit board and the metal sheet, according to another embodiment of the present disclosure. Figure 11 It is along Figure 10 The cross-sectional view taken from line C-C'. Figure 12 It is along Figure 10 The cross-sectional view taken by line D-D'.

[0169] Figures 9 to 12 Implementation examples and Figures 1 to 8 The main difference in the embodiments lies in the method of electrically connecting the touch driver TDM to the coil unit CLP.

[0170] Reference Figure 1 and Figures 9 to 12 The display device 1 may further include a first connection line CW1 and a second connection line CW2 that electrically connect the coil unit CLP to the touch driver TDM. In this case, the first through-hole electrode VE1, the second through-hole electrode, the first conductive adhesive portion CAD1, and the second conductive adhesive portion CAD2 may be omitted.

[0171] The first connecting line CW1 can connect the first coil electrode CP1 and the touch driver TDM. The first end of the first connecting line CW1 can be connected to the first coil electrode CP1, and the second end of the first connecting line CW1 can be connected to the first touch driver connection electrode CTE1, which will be described later.

[0172] The second connecting line CW2 can connect the second coil electrode CP2 to the touch driver TDM. The first end of the second connecting line CW2 can be connected to the second coil electrode CP2, and the second end of the second connecting line CW2 can be connected to the second touch driver connection electrode CTE2, which will be described later.

[0173] The printed circuit board FB may further include a first touch driver connection electrode CTE1 and a second touch driver connection electrode CTE2.

[0174] The first touch driver connection electrode CTE1 and the second touch driver connection electrode CTE2 can be arranged on the top surface of the base FB_B. For example... Figure 9 and Figure 10 As shown, when the printed circuit board FB overlaps with the metal sheet layer MS, the first touch driver connection electrode CTE1 and the second touch driver connection electrode CTE2 can be arranged to overlap with the first coil electrode CP1 and the second coil electrode CP2 respectively in the third direction Z, but this disclosure is not limited thereto.

[0175] Reference Figure 10 and Figure 12 The first connecting line CW1 and the second connecting line CW2 can be connected to the first touch driver connecting electrode CTE1 and the second touch driver connecting electrode CTE2 respectively, while bypassing the base FB_B of the printed circuit board FB. In other words, the first connecting line CW1 and the second connecting line CW2 do not need to be in direct contact with the base FB_B of the printed circuit board FB.

[0176] like Figure 12 As shown, the first connecting line CW1 can be configured to surround the edge of the base FB_B in the cross-sectional view. The first connecting line CW1 can be configured to surround a portion of the top surface of the base FB_B, a portion of the bottom surface of the base FB_B, and a side surface of the base FB_B between the top and bottom surfaces. For example, the first connecting line CW1 can be curved with a curvature and have a basic "C" shape in the cross-sectional view. However, the shape of the first connecting line CW1 is not limited to this.

[0177] exist Figure 12 In this embodiment, the first connecting line CW1 may be configured to be spaced apart from the edge of the base FB_B. However, this disclosure is not limited thereto, and at least a portion of the first connecting line CW1 may contact the edge of the base FB_B.

[0178] The first connecting line CW1 can be configured to be spaced apart from the heat sink HDP. The first connecting line CW1 can also overlap with the heat sink HDP. The first connecting line CW1 can be configured to be electrically insulated from the heat sink HDP. Similarly, the second connecting line CW2 can be configured to be spaced apart from and electrically insulated from the heat sink HDP.

[0179] The second connecting line CW2 can be configured in a manner substantially the same as or similar to that of the first connecting line CW1 in the cross-sectional view. For example, the second connecting line CW2 can be configured to surround a portion of the top surface of the base FB_B, a portion of the bottom surface of the base FB_B, and the side surface of the base FB_B between the top and bottom surfaces, while also bypassing the edge portion of the base FB_B.

[0180] Reference Figure 11 and Figure 12 The first touch driver connection electrode CTE1 can be electrically connected to the touch driver TDM via the first touch driver connection line TCW1. Similar to the first touch driver connection electrode CTE1, the second touch driver connection electrode CTE2 can be connected to the touch driver TDM via the second touch driver connection line disposed on the base FB_B.

[0181] Besides the method of electrically connecting the touch driver TDM to the coil unit CLP, Figures 9 to 12 Implementation examples and Figures 1 to 8 The embodiments are basically the same or similar, so redundant descriptions have been omitted.

[0182] Figure 13 This is a plan view of a metal sheet layer according to yet another embodiment of the present disclosure.

[0183] Figure 13 Implementation examples and Figures 1 to 8 The main difference in the embodiments lies in the positions of the first coil electrode CP1 and the second coil electrode CP2.

[0184] Reference Figure 13 In the plan view, the first end EP_E1 of the extension EP, the second end EP_E2 of the extension EP, the first coil electrode CP1, and the second coil electrode CP2 are arranged on the metal sheet MSa. Figures 1 to 8 The corners are at different corners.

[0185] For example, the first end EP_E1 of the extension portion EP, the second end EP_E2 of the extension portion EP, the first coil electrode CP1, and the second coil electrode CP2 can be arranged in a corner portion spaced apart from the touch driver TDM (e.g., Figure 13At the lower left corner, the touch driver TDM is positioned between the two corner sections where the short side of the metal sheet layer MSa is located.

[0186] In another example, the first end EP_E1 of the extension EP, the second end EP_E2 of the extension EP, the first coil electrode CP1, and the second coil electrode CP2 can be arranged in a corner portion of the multiple corner portions of the metal sheet MSa that does not overlap with the printed circuit board FB (e.g., Figure 13 The extension portion EP can be located at the upper left or upper right corner, or it can be arranged adjacent to the long or short side between multiple corner portions. Furthermore, the first end EP_E1 (and the first coil electrode CP1) of the extension portion EP and the second end EP_E2 (and the second coil electrode CP2) of the extension portion EP can be arranged at different corner portions.

[0187] In the cases described above, such as Figures 6 to 11 The components such as the first touch driver connection line TCW1, the first through-hole electrode VE1, the first conductive adhesive portion CAD1, and the first connection line CW1, which electrically connect the coil unit CLP to the touch driver TDM, may have variable arrangements or lengths to correspond to changes in the positions of the first end EP_E1 of the extension portion EP, the second end EP_E2 of the extension portion EP, the first coil electrode CP1, and the second coil electrode CP2.

[0188] Apart from the positions of the first coil electrode CP1 and the second coil electrode CP2 Figure 13 Implementation examples and Figures 1 to 8 The embodiments are basically the same or similar, so redundant descriptions have been omitted.

[0189] Figure 14 This is a plan view of a metal sheet layer according to yet another embodiment of the present disclosure.

[0190] Figure 14 Implementation examples and Figures 1 to 8 The main difference in the embodiments lies in the dimensions of the first end EP_E1 of the extension portion EP, the second end EP_E2 of the extension portion EP, the first coil electrode CP1, and the second coil electrode CP2.

[0191] Reference Figure 14 In the plan view, the dimensions of the first end EP_E1 and the second end EP_E2 of the extension portion EP of the metal sheet MSb can be larger than the dimensions of the other parts of the extension portion EP. For example... Figure 14As illustrated in the diagram, other portions of the extension EP may be straight sections extending along the edge of the heat dissipation unit HDP in the first direction X or the second direction Y, as well as corners between the straight sections. The dimensions of the first end EP_E1 and the second end EP_E2 may be the width, diameter, and / or area in the first direction X or the second direction Y in the plan view.

[0192] For example, the first end EP_E1 and the second end EP_E2 of the extension portion EP can have a width greater than the width of other portions of the extension portion EP. In this case, the diameter of the first coil electrode CP1 and the diameter of the second coil electrode CP2 can be greater than or equal to the width of other portions of the extension portion EP. Due to the increased size of the first coil electrode CP1 and the second coil electrode CP2, the first coil electrode CP1 and the second coil electrode CP2 can be easily connected to the touch driver TDM and / or components electrically connected to the first coil electrode CP1 and the second coil electrode CP2. However, this disclosure is not limited thereto, and the dimensions of the first end EP_E1, the second end EP_E2, the first coil electrode CP1, and the second coil electrode CP2 of the extension portion EP can be smaller than or equal to the dimensions of other portions of the extension portion EP. In other words, the dimensions of the first end EP_E1, the second end EP_E2, the first coil electrode CP1, and the second coil electrode CP2 of the extension portion EP can depend on the display device 1 (see [link to relevant documentation]). Figure 2 The design changes accordingly.

[0193] Apart from the dimensions of the first end EP_E1 of the extended portion EP, the second end EP_E2 of the extended portion EP, the first coil electrode CP1, and the second coil electrode CP2. Figure 14 Implementation examples and Figures 1 to 8 The embodiments are basically the same or similar, so redundant descriptions have been omitted.

[0194] Figure 15 This is a plan view of a metal sheet layer according to yet another embodiment of the present disclosure.

[0195] Figure 15 Implementation examples and Figures 1 to 8 The main difference in the embodiments lies in the shape of the first end EP_E1 and the second end EP_E2 of the extension portion EP.

[0196] Reference Figure 15Because the boundaries of the first end EP_E1 and the second end EP_E2 of the extension portion EP of the metal sheet layer MSc have unique shapes compared to the boundaries of other parts of the extension portion EP, the boundaries of the first end EP_E1 and the second end EP_E2 of the extension portion EP can be easily identified from the other parts of the extension portion EP. For example... Figure 15 As shown, with Figure 6 As shown in the plan view, the boundary of the first end EP_E1 of the extension portion EP and the boundary of the second end EP_E2 of the extension portion EP can have an angled shape. In other words, the boundary of the first end EP_E1 of the extension portion EP and the boundary of the second end EP_E2 of the extension portion EP can have the same right-angled shape. For example, the boundary of the first end EP_E1 of the extension portion EP and the boundary of the second end EP_E2 of the extension portion EP can be formed at the point where the two sides of each of the first end EP_E1 and the second end EP_E2 meet in their intersecting directions. However, this disclosure is not limited thereto and depends on the display device 1 (see...). Figure 2 The design of the extension EP allows the boundaries of the first end EP_E1 and the second end EP_E2 of the extension EP to have various shapes such as circles, ellipses, or polygons.

[0197] The first coil electrode CP1 and the second coil electrode CP2 may each have a planar shape different from the planar shape of the boundary of the first end EP_E1 and the boundary of the second end EP_E2 of the extension portion EP, respectively. For example... Figure 15 As shown in the planar diagram, the first coil electrode CP1 and the second coil electrode CP2 can have a generally circular shape, distinct from the boundary of the first end EP_E1 and the boundary of the second end EP_E2 of the extension portion EP. However, this disclosure is not limited thereto, and the first coil electrode CP1 and the second coil electrode CP2 can have various planar shapes such as polygons or ellipses.

[0198] Since the boundaries of the first end EP_E1 of the extension portion EP, the boundaries of the second end EP_E2 of the extension portion EP, the first coil electrode CP1 and the second coil electrode CP2 have various shapes, their positions can be easily identified and they can be easily connected.

[0199] Apart from the shapes of the first end EP_E1 and the second end EP_E2 of the extended portion EP, Figure 15 Implementation examples and Figures 1 to 8 The embodiments are basically the same or similar, so redundant descriptions have been omitted.

[0200] Figure 16This is a plan view of a metal sheet layer according to yet another embodiment of the present disclosure.

[0201] Figure 16 Implementation examples and Figures 1 to 8 The main difference in the embodiments is that the notch NCH is formed at the metal sheet MSd.

[0202] Reference Figure 16 The metal sheet MSd may further include a notched NCH.

[0203] In the plan view, the notch NCH can be set on one of the two short sides of the metal sheet MSd (e.g., the metal sheet MSd is located on one of the two short sides). Figure 16 On the upper short side), and can be recessed toward the center portion of the metal sheet MSd. Further reference... Figure 7 The short side of the metal sheet MSd with the notch NCH can be the short side of the metal sheet MSd that does not overlap with the printed circuit board FB in the third direction Z. However, the location of the notch NCH is not limited to this, and the notch NCH can be located on the long side of the metal sheet MSd, or it can be located on the short side of the metal sheet MSd that overlaps with the printed circuit board FB.

[0204] The shapes of the heat dissipation unit HDP and the extension EP can vary depending on the shape of the notch NCH. For example... Figure 16 As shown, in the plan view, the extension EP can surround the notch NCH with a relatively constant width; however, in the plan view, a portion of the boundary of the heat dissipation unit HDP adjacent to the notch NCH can be recessed towards the center of the heat dissipation unit HDP. For example, in the plan view, the notch NCH, the portion of the extension EP adjacent to the notch NCH, and the boundary of the heat dissipation unit HDP can be arranged in an approximately "U" shape, but the shapes of the notch NCH and the extension EP are not limited to this.

[0205] In addition to the notch NCH forming at the MSd of the metal sheet, Figure 16 Implementation examples and Figures 1 to 8 The embodiments are basically the same or similar, so redundant descriptions have been omitted.

Claims

1. A display device, comprising: The display panel includes an effective area for displaying images and a non-effective area adjacent to the effective area; as well as Metal sheet layer on the display panel, The metal sheet layer includes: The heat sink overlaps with the effective area; and The coil surrounds the heat sink and overlaps with the ineffective area. The coil includes: The extension portion is provided along the boundary of the heat sink; A first coil electrode is disposed at the first end of the extension; and The second coil electrode is disposed at the second end of the extension.

2. The display device according to claim 1, further comprising: A printed circuit board is connected to the display panel; as well as A touch driver is mounted on the printed circuit board.

3. The display device according to claim 2, wherein, The touch driver is electrically connected to the coil.

4. The display device according to claim 3, further comprising: A conductive adhesive portion is placed between the printed circuit board and the display panel, and electrically connects the touch driver to the coil.

5. The display device according to claim 4, wherein, The printed circuit board includes: base; and A through-hole electrode penetrates the base and electrically connects the conductive adhesive portion to the touch driver.

6. The display device according to claim 3, wherein, The printed circuit board includes: Base; Touch driver connection electrodes are located on the base; and A connecting wire electrically connects the touch driver to the coil.

7. The display device according to claim 6, wherein, The connecting line wraps around the edge of the base.

8. The display device according to claim 2, wherein, The touch driver is configured to detect input from the electronic pen.

9. The display device according to claim 8, wherein, The touch driver includes a first touch conductive layer and a second touch conductive layer disposed on the first touch conductive layer, and The touch driver is configured to detect the input from the electronic pen based on the induced current sensed in the first touch conductive layer or the second touch conductive layer.

10. The display device according to claim 8, wherein, The touch driver is configured to charge the electronic pen.

11. The display device according to claim 10, in, The first coil electrode and the second coil electrode overlap with the printed circuit board.

12. The display device according to claim 10, wherein, The first coil electrode and the second coil electrode are disposed at the corner of the metal sheet.

13. The display device according to claim 12, further comprising: The first heat dissipation layer and the second heat dissipation layer are disposed between the display panel and the metal sheet layer.

14. The display device according to claim 13, wherein, The first heat dissipation layer comprises polyimide or polyethylene terephthalate.

15. The display device according to claim 13, wherein, The second heat dissipation layer comprises graphite.

16. The display device according to claim 13, further comprising: A buffer layer is disposed between the display panel and the first heat dissipation layer.

17. A display device, comprising: Display panel; A printed circuit board is connected to the display panel, and a touch driver is mounted on the printed circuit board; as well as A heat dissipation unit is provided on the display panel. The heat dissipation unit includes: Heat dissipation unit; and A coil unit surrounds the heat dissipation unit and is electrically connected to the touch driver. The coil unit includes: The extension portion is provided along the boundary of the heat dissipation unit; A first coil electrode is disposed at the first end of the extension; and The second coil electrode is disposed at the second end of the extension.

18. The display device according to claim 17, further comprising: A conductive adhesive portion is placed between the printed circuit board and the display panel, and electrically connects the touch driver to the coil unit.

19. The display device according to claim 17, wherein, The printed circuit board includes: Base; Touch driver connection electrodes are disposed on the base; and A connecting wire is used to electrically connect the touch driver to the coil unit.

20. A display device, comprising: The display panel includes a first area for displaying an image and a second area for not displaying an image, wherein the second area is adjacent to at least one side of the first area; A radiator is disposed in the first region; and A charging strip is disposed in the second region and adjacent to at least one side of the heat sink. The charging strip includes: The extension portion is provided along the boundary of the heat sink; A first coil electrode is disposed at the first end of the extension; and The second coil electrode is disposed at the second end of the extension.

21. The display device according to claim 20, wherein, The heat sink and the charging strip are provided in the same layer.

22. The display device according to claim 20, wherein, The charging bar is configured to charge external devices.

23. The display device according to claim 20, wherein, At least one of the first coil electrode and the second coil electrode is electrically connected to the touch driver of the display device.

24. The display device according to any one of claims 20 to 23, wherein, A gap is provided between the heat sink and the charging bar.

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