A gas collecting device

Abstract

The application provides a gas collecting device, relates to the technical field of liquid cooling, and is used for collecting gas bubbles generated due to loss of a working medium in a liquid cooling device. The gas collecting device comprises a cooling plate, the cooling plate comprises at least one gas collecting structure arranged in the interior of the cooling plate, a first flow channel arranged in the interior of the cooling plate, a second flow channel arranged in the interior of the gas collecting structure, and at least one connecting channel for connecting the first flow channel and the second flow channel; the at least one connecting channel is used for transferring gas bubbles carried by the working medium when the working medium flows in the first flow channel to the second flow channel; and the at least one gas collecting structure is used for collecting the gas bubbles from the second flow channel.

Description

Technical Field

[0001] This application relates to a gas collection device, belonging to the field of liquid cooling technology. Background Technology

[0002] In recent years, as smart terminals have developed towards thinner, smaller, and more portable designs, the increasing power density has led to higher demands for heat dissipation. However, traditional heat dissipation methods are not ideal for small smart terminals. Existing liquid cooling systems use a high-specific-heat-coefficient liquid, such as water, as the working medium, circulating internally to remove heat generated by internal power components. However, leakage and evaporation are difficult to avoid in these systems. After the working medium is lost, external gas enters the system to replenish the lost volume. This external gas, existing as gas columns or bubbles inside the module, affects the pump's normal operation, causing excessive noise, reduced heat dissipation performance, and shortened pump lifespan.

[0003] To address the issue of bubbles generated within liquid cooling devices due to the loss of the working medium, current technical solutions include: 1. Replenishing the lost working medium using a replenishment device; 2. Expelling external gases entering the liquid cooling device using an exhaust device. However, both the replenishment and exhaust devices are relatively large and cannot be applied to small terminal devices such as mobile phones and laptops. Therefore, it is necessary to propose a gas collection device for collecting bubbles within liquid cooling devices suitable for use in small terminal devices. Summary of the Invention

[0004] This application provides a gas collection device for collecting bubbles generated during the operation of a liquid cooling device due to the loss of the working medium. To achieve the above objective, this application provides the following technical solution: In a first aspect, embodiments of this application provide a gas collection device, including: A cooling plate, comprising at least one air collecting structure disposed inside the cooling plate, a first flow channel disposed inside the cooling plate, a second flow channel disposed inside the air collecting structure, and at least one connecting channel for connecting the first flow channel and the second flow channel. The at least one connecting channel is used to transfer air bubbles carried by the working medium as it flows in the first channel to the second channel; The at least one gas collecting structure is used to collect the bubble from the second flow channel.

[0005] In the above structure, compared with traditional replenishment and exhaust devices, the gas collection device is smaller in size, easier to operate, and does not require external energy input to maintain its operation. In one possible implementation, the local resistance experienced by the working medium during its flow in the second flow channel is greater than the local resistance experienced by the working medium during its flow in the first flow channel.

[0006] Because the local resistance experienced by the working medium in the second flow channel is greater than that experienced by the working medium in the first flow channel, the flow velocity of the working medium in the second flow channel is lower than that in the first flow channel. As a result, the bubbles are less likely to be carried back to the first flow channel by the working medium after entering the second flow channel.

[0007] In one possible implementation, the local resistance experienced by the working medium during its flow in the second flow channel can be generated in the following way: Change the cross-section of at least one connecting channel; or, Increase the number of nodes that branch and merge in the second flow channel.

[0008] By altering the cross-section of the at least one connecting channel, or by increasing the number of bifurcated nodes in the second flow channel, local resistance can be generated. This ensures that the local resistance of the working medium within the gas collection structure is further increased without increasing the volume of the gas collection device, thereby reducing the flow velocity of the bubbles after they enter the second flow channel and preventing the bubbles from being carried back to the main flow channel by the working medium.

[0009] In one possible implementation, the at least one connecting channel is in the form of a connecting pipe, one end of which is connected to a local high point of the first flow channel, and the other end of which is connected to the second flow channel.

[0010] By connecting one end of the connecting pipe to a local high point in the first flow channel, it is possible for the bubbles to more easily pass through the connecting pipe and enter the second flow channel from the first flow channel when they rise under the action of buoyancy.

[0011] In one possible implementation, the at least one connection channel is structured as a connection port, which is located...

[0012] At a local high point of the first flow channel, one side of the connection port is connected to the first flow channel, and the other side of the connection port is connected to the second flow channel.

[0013] Compared to connecting pipes, this connector has the advantage of taking up less space.

[0014] In one possible implementation, the cross-section of the connecting pipe is smaller than the cross-sections of the first flow channel and the second flow channel.

[0015] When the working medium enters the connecting pipe from the first flow channel, the cross-sectional area suddenly narrows; when the working medium enters the second flow channel from the connecting pipe, the cross-sectional area suddenly expands. This results in an increase in the local resistance experienced by the working medium, thereby reducing the flow velocity of the bubbles after they enter the second flow channel and preventing the bubbles from being carried back into the first flow channel by the working medium.

[0016] In one possible implementation, the at least one connection channel is related to the flow of the working medium in the first flow channel.

[0017] The angle of inclination between directions is greater than 90 degrees.

[0018] Because the inclination angle between the connecting channel and the flow direction of the working medium in the first flow channel is greater than 90 degrees, it is advantageous...

[0019] This further increases the local resistance of the working medium after it enters the second channel from the first channel through the connecting channel, thereby reducing the flow velocity of the bubbles after they enter the second channel and preventing the bubbles from being carried back to the first channel by the working medium.

[0020] In one possible implementation, the at least one air-collecting structure is a barbed structure, a circular structure, or a labyrinth.

[0021] structure.

[0022] The gas collection structure can be barbed, circular, or labyrinthine to further increase the local resistance of the working medium inside the gas collection structure, thereby reducing the flow velocity of the bubbles after they enter the second flow channel and preventing the bubbles from being carried back to the main flow channel by the working medium.

[0023] In one possible implementation, the at least one gas collecting structure includes a plurality of baffles for increasing the local resistance of the working medium flow in the second flow channel.

[0024] Secondly, embodiments of this application also provide an electronic device, characterized in that it includes: a power component and a liquid cooling device, wherein the power component generates heat when in operation, and the liquid cooling device transfers the heat to the outside; the electronic device further includes the gas collecting device as described in any of the first aspects, wherein the gas collecting device is located inside the liquid cooling device and is used to collect air bubbles in the liquid cooling device. Attached Figure Description

[0025] Figure 1 A schematic diagram of the structure of a liquid cooling device provided in this application; Figure 2 A structural plan view of a liquid cooling device provided in this application; Figure 3 A structural plan view of a gas collection structure provided in this application; Figure 4 A structural plan view of a gas collection structure provided in this application; Figure 5 A structural plan view of a gas collection structure provided in this application; Figure 6 A structural plan view of a gas collection structure provided in this application; Figure 7 A structural plan view of a gas collection structure provided in this application; Figure 8 A structural plan view of a gas collection structure provided in this application; Figure 9 This is a partially enlarged view of a gas collection structure provided in this application. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0027] The following will describe the gas collection device according to a preferred embodiment of this application with reference to the relevant drawings. The illustrations of all embodiments in this application are for illustrative purposes only and do not represent actual dimensions and proportions.

[0028] The directional terms used in this application, such as up, down, left, right, front, or back, are merely for directional definition with reference to the attached illustrations and are intended for illustrative purposes only, not to limit this application.

[0029] To facilitate understanding of the gas collection device provided in this application embodiment, its application devices and scenarios are described below. This gas collection device can be applied to terminal devices employing liquid cooling systems. These terminal devices can be laptops, tablets, mobile phones, or other smart terminal devices. The application scenarios for the gas collection device provided in this application can include cloud computing, video processing, search, or general-purpose scenarios requiring high-power operation.

[0030] Before describing the specific implementation of this application, the following technical terms in this field are defined: 1. Working medium: In this application, the working medium refers to the substance that performs heat exchange, or simply the working fluid. In various liquid cooling devices, the working medium is also called coolant or fluid, and is a medium through which heat energy is exchanged. The working medium can be water, acetone, methanol, ammonia, or Freon-based media, such as R134a, or other working media, selected according to the conditions of use.

[0031] 2. Fluid resistance: Fluid resistance refers to the resistance encountered by a fluid as it flows. It includes two types: (1) the resistance generated by friction between the working medium and the vessel wall, called frictional resistance; (2) the resistance caused by changes in the shape of the flow channel boundary during flow, such as changes in the cross-sectional area of ​​the flow channel, or encountering nodes where the flow channel branches and merges. The speed and direction of the working medium will change, forcing it to exchange momentum. At this time, due to the viscosity of the working medium, a huge resistance is created, which is called local resistance.

[0032] Figure 1 This is a schematic diagram of a gas collection device provided in an embodiment of this application. Figure 1 In the embodiments described in this application, the electronic device is illustrated using a laptop computer as an example, which includes a screen side and a keyboard side. It is understood that the mounting positions of the various components in this schematic diagram are merely examples and not limitations.

[0033] The liquid-gas device includes a cooling plate 100, a pump 200, a heat spreader 300, power components 310, and pipelines 10.

[0034] The cooling plate 100 includes a main flow channel 110 and an air collection structure 120. The air collection structure 120 further includes a secondary flow channel 130 and a connecting channel 140. The main flow channel 110 can also be referred to as the first flow channel, and the secondary flow channel 130 can also be referred to as the second flow channel. Further information on the main flow channel 110 and the secondary flow channel 130 can be found in [reference needed]. Figure 2 .

[0035] The main flow channel 110 is located inside the cooling plate 100. This main flow channel is the primary route for the working medium to flow in the system and performs the heat exchange function of the liquid cooling device. The secondary flow channel 130 is located inside the gas collecting structure 120. This secondary flow channel is the secondary route for the working medium to flow in the system and performs the function of collecting bubbles. The connecting channel 140 is located inside the gas collecting structure 120 and is used to connect the main flow channel 110 and the secondary flow channel 130. Bubbles enter the secondary flow channel 130 from the main flow channel 110 through this connecting channel 140.

[0036] The pipeline 10 includes a first pipeline 11, a second pipeline 12, and a third pipeline 13. The material used for the pipeline 10 can be metal, such as iron or aluminum; or it can be non-metal, such as PTFE, FEP, or EPDM, etc., without specific limitations.

[0037] Furthermore, the cooling plate 100 is located inside the screen side; the power components 310, the heat spreader 300, and the pump 200 are located inside the keyboard side where the heat source is located. The conduit 10 is filled with a working medium for connecting the cooling plate 100, the pump 200, and the heat spreader 300. Notably, the conduit 10 extends from the keyboard side to the cooling plate 100 on the screen side.

[0038] Pump 200 is connected at both ends to cooling plate 100 and heat spreader 300, respectively. Pump 200 pressurizes the interior of the liquid cooling device, providing circulation power for the working medium within it. The power generated by pump 200 overcomes the resistance and gravity of the working medium during circulation within the closed liquid cooling device, driving the working medium to flow between the main flow channel 110 and secondary flow channel 130 on the screen side, the heat spreader 300 on the keyboard side, the interior of pump 200, and the pipeline 10, forming a complete circulation path for the working medium. It is understood that the effects of this application can be achieved by interchanging the positions of pump 200 and heat spreader 300.

[0039] The vapor chamber 300 is equipped with a power component 310. This power component 310 may include, but is not limited to, one or more of the following power components (not shown in the figure): circuit board, sensor, camera, microphone, battery, image processor (GPU), and central processing unit (CPU), etc., without specific limitations. This power component 310 continuously generates heat during operation.

[0040] The heat spreader 300 can be composed of a metal shell. The metal cover is used to absorb the heat energy continuously generated by the power components 310 mounted on the heat spreader 300 during operation, and to evenly distribute the heat energy onto the heat spreader 300, where it is absorbed by the flowing working medium. As the working medium flows through the cooling plate 100, it transfers heat energy to the external environment through heat exchange, thereby reducing the temperature of the working medium.

[0041] Based on the above-described gas collection device structure, the following will describe how the working medium flows within this structure to achieve cooling.

[0042] As the working medium flows through the heat spreader 300, it absorbs heat generated by the power components 310, thus increasing its temperature. The heated working medium then travels through pipe 10 to the cooling plate 100, where it exchanges heat with the external environment via the main flow channel 110, resulting in a cooled working medium. This cooled working medium then flows through pipe 10 again through the heat spreader 300 to absorb heat, repeating the above cyclic heat dissipation process. This continuously releases the heat generated by the power components 310 to the outside environment, achieving the goal of lowering the temperature.

[0043] It is worth noting that the display screen and its driver also generate a significant amount of heat after prolonged operation. The display screen and driver are typically mounted on the side of the screen, allowing them to directly transfer heat to the external environment through heat exchange, thus achieving a cooling effect.

[0044] The gas collecting structure 120 is located inside the cooling plate 100 and serves to collect air bubbles in the liquid cooling device. The gas collecting structure 120 contains several baffles to further increase the local resistance of the working medium flowing through the gas collecting structure 120, thereby reducing the flow rate of the working medium and preventing air bubbles from re-entering the main flow channel 110 from the gas collecting structure 120.

[0045] The working process of the gas collecting structure 120 is as follows: Under the action of the pump 200, bubbles flow with the working medium in the main flow channel 110 and are then drawn into the secondary flow channel 130 by buoyancy. Compared to the main flow channel 110, the working medium in the secondary flow channel 130 experiences greater resistance and lower flow velocity. Bubbles are less likely to be re-entered into the main flow channel 130 by the working medium; instead, they remain at the top of the secondary flow channel 110 due to buoyancy.

[0046] It is understood that the air collection structure 120 can be designed in the left or right region of the cooling plate 100. The number of air collection structures 120 can be one or more. The shape formed by the baffles within the air collection structure 120 can be a barbed structure, a circular structure, or a labyrinth structure. The connecting channel between the secondary flow channel 130 and the main flow channel 110 can be one or more; furthermore, this connecting channel 140 can be in the form of a connecting pipe or a connecting port, without specific limitations. Figure 1 In this embodiment, the connection channel uses a single connection port structure.

[0047] Figure 3 This application provides another embodiment of a gas collection device, compared to... Figure 1 , Figure 3 The gas collecting structure 120 shown has no baffles, and the connecting channel 140 uses a connection port. Two connecting channels 140 connect the main flow channel 110 and the secondary flow channel 130 between the gas collecting structure 120 and the cooling plate 100. One side of each connecting channel 140 is the main flow channel 110, and the other half is the secondary flow channel 130. When bubbles flow through the connecting channel 140 via the working medium, the confluence of the channels changes the cross-section of the channels, increasing the local resistance of the working medium flowing through the connecting channel 140. This reduces the flow velocity of the working medium after entering the gas collecting structure 120, making it difficult for bubbles to be carried back to the main flow channel 110 by the working medium, thus achieving the effect of bubble collection. Because the gas collecting structure 120 of this gas collecting device has no baffles, compared to… Figure 1 The gas collection device, the gas collection structure 120 occupies a smaller area.

[0048] refer to Figure 4 For example, in another possible gas collection device, the internal baffles of the gas collection structure 120 are designed in a labyrinth shape, which can further increase the local resistance of the working medium flowing through the gas collection structure 120, thereby reducing the flow velocity of bubbles within the gas collection structure 120 and causing the bubbles to remain inside the gas collection structure 120. The connecting channel 140 adopts a connector structure to connect the main flow channel 110 and the secondary flow channel 130, which can also achieve the effect of collecting bubbles. It is worth noting that... Figure 4 The gas collection device shown uses a connection channel 140 as a connection port structure.

[0049] refer to Figure 5 For example, in another possible gas collection device, the internal baffles of the gas collection structure 120 can be designed in a barbed shape. This can further increase the local resistance of the working medium flowing through the gas collection structure 120, thereby reducing the flow velocity of bubbles in the gas collection structure 120 and causing the bubbles to remain inside the gas collection structure 120. The number of barbed gas collection structures 120 can be one or more. See reference... Figure 6 The device contains two barbed gas collecting structures 120. If there are too many bubbles, or the bubbles are too large, or the working medium flows too fast, causing the first gas collecting structure 120 to be unable to collect all the bubbles, the second gas collecting structure 120 can collect the remaining bubbles, thus achieving a better bubble collection effect. It is worth noting that... Figure 5 and Figure 6 All the connection channels 140 used are connection ports.

[0050] refer to Figure 7For example, in one possible gas collection device, a connecting channel 140 is provided between the secondary flow channel 130 and the main flow channel 110 for collecting bubbles. This connecting channel 140 has a structure in the form of a connecting pipe. There is at least one connecting pipe, one end of which is located at a local high point of the main flow channel 110 and connected to it, and the other end is connected to the secondary flow channel 130. Bubbles, under buoyancy, enter the secondary flow channel 130 through the connecting channel 140, thus achieving the function of bubble collection. If the number of bubbles is too large, or the bubble volume is too large, or the working medium flow rate is too fast, causing the first connecting pipe to be unable to collect all the bubbles, the remaining bubbles can be collected through other connecting pipes. After the bubbles enter the gas collecting structure 120, due to the multiple confluence and branching nodes within the structure, and the change in the cross-section of the flow channel as the working medium enters the secondary flow channel 130 through the connecting channel 140, the local resistance of the working medium flowing through the secondary flow channel 130 is greater than that flowing through the main flow channel 110, resulting in a slower flow velocity. Because the working medium flows more slowly through the secondary flow channel 130, it is difficult for the bubbles to be re-entrained into the main flow channel 110.

[0051] refer to Figure 8 As can be seen, by way of example, in one possible gas collection device, the arrows within the main flow channel 110 indicate the flow direction of the working medium, and... Figure 7 compared to, Figure 8 The inclination angle between the connecting channel 140 and the working medium in the flow direction of the main flow channel 110 is greater than 90 degrees, that is... Figure 9 In , , Three tilt angles. This increased tilt angle effectively increases the local resistance of the working medium entering the connecting channel 140, thereby reducing the flow velocity of the working medium in the secondary channel 130. Bubbles enter the top of the secondary channel 130 by buoyancy. Because the flow velocity of the working medium in the secondary channel 130 is slower than that in the main channel 110, the bubbles are difficult to be carried away by the working medium and re-enter the main channel 110. It is worth noting that the connecting channel 140 adopts a connecting pipe structure.

[0052] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A gas collecting device, characterized by include: A cooling plate, the cooling plate including at least one air collecting structure disposed inside the cooling plate, a first flow channel disposed inside the cooling plate, a second flow channel disposed inside the air collecting structure, and at least one connecting channel for connecting the first flow channel and the second flow channel; The at least one connecting channel is used to transfer air bubbles carried by the working medium when it flows in the first channel to the second channel, wherein the flow rate of the working medium in the second channel is lower than the flow rate of the working medium in the first channel. The at least one gas collecting structure is used to collect the bubbles from the second flow channel.

2. The gas collecting device according to claim 1, wherein The local resistance experienced by the working medium during its flow in the second flow channel is greater than the local resistance experienced by the working medium during its flow in the first flow channel.

3. The gas collecting device according to claim 2, wherein The local resistance experienced by the working medium during its flow in the second flow channel is generated in the following ways: Change the cross-section of the at least one connecting channel; or, Increase the number of nodes that branch and merge in the second flow channel.

4. The gas collecting device according to claim 1 or 2, characterized in that The at least one connecting channel is structured as a connecting pipe, with one end of the connecting pipe connected to a local high point of the first flow channel and the other end of the connecting pipe connected to the second flow channel.

5. The gas collecting device according to claim 1 or 2, characterized in that The at least one connecting channel is structured as a connection port, which is located at a local high point of the first flow channel. One side of the connection port is connected to the first flow channel, and the other side of the connection port is connected to the second flow channel.

6. The gas collecting device according to claim 4, wherein The cross-section of the connecting pipe is smaller than the cross-sections of the first flow channel and the second flow channel.

7. The gas collecting device according to any one of claims 1 to 5, wherein The inclination angle between the at least one connecting channel and the flow direction of the working medium in the first flow channel is greater than 90 degrees.

8. The gas collection device of claim 1, wherein, The at least one gas-collecting structure is a barbed structure, a circular structure, or a labyrinth structure.

9. The gas collecting device according to claim 1, wherein The at least one gas collecting structure includes a plurality of baffles, which are used to increase the local resistance of the working medium during its flow in the second flow channel.

10. An electronic device, comprising: include: The electronic device includes a power component and a liquid cooling device, wherein the power component generates heat during operation and the liquid cooling device transfers the heat to the outside; the electronic device further includes a gas collecting device as described in any one of claims 1 to 9, the gas collecting device being located inside the liquid cooling device and used to collect air bubbles in the liquid cooling device.

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