Display panel and display device

Abstract

The present invention discloses a display panel and a display device, belonging to the field of display technology. The display panel includes a substrate and a plurality of pad groups on one side of the substrate. The first pad of the pad group is bound to the first pin of the light-emitting device, and the second pad is bound to the second pin of the light-emitting device. In the pad group corresponding to the same light-emitting device, the first pad at least partially overlaps with the first metal part, and the second pad at least partially overlaps with the second metal part. The area S1 where the first pad overlaps with the first metal part is substantially the same as the area S2 where the second pad overlaps with the second metal part; or, in the pad group corresponding to the same light-emitting device, in a direction perpendicular to the plane where the substrate is located, the first pad does not overlap with the first metal part, and the second pad does not overlap with the second metal part. The display device includes the above-mentioned display panel. The present invention can improve the success rate of binding of light-emitting devices, avoid the problems of cold soldering and poor contact, improve product yield, and improve display effect.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and more particularly, to a display panel and a display device. Background Art

[0002] As electronic products such as mobile phones, computers and televisions are widely used in all aspects of life. Electronic display screens such as display panels are widely used. Among them, Micro LED (micro light-emitting diode) / Mini LED (mini light-emitting diode) technology, as a new display technology, has the characteristics of self-luminous display. It has the advantages of full solid state, long life, high brightness, low power consumption, small size, ultra-high resolution, and can be applied to extreme environments such as high temperature or radiation. It has good application prospects. Micro LED / Mini LED technology is LED miniaturization and matrix technology, which refers to the technology of integrating high-density, tiny-sized LED arrays on a chip to reduce the distance between pixels from millimeters to micrometers or even nanometers. Due to the small size of the LED chip, it can be used as a pixel on a display panel.

[0003] In the process of making Micro LED / Mini LED display panel, the Micro LED / Mini LED chip prepared by epitaxial growth on the wafer substrate will be transferred to the driving backplane through the transfer substrate to form an LED array. During the transfer process, the electrodes of the Micro LED / Mini LED chip need to be bound to the pads on the driving backplane. The pins of each LED chip are connected to the pads on the driving backplane by surface spot welding, which can be controlled separately. However, when the driving backplane made in the prior art is bound, due to the huge number of LED chips and the size of the LED chips at the micron level, the spacing between the LED chips is also relatively small, so that the contact area between the pins of the LED chips and the pads is getting smaller and smaller. In the vertical direction, the push-pull force of the LED chip is getting lower and lower, and the pins of the LED chips and the pads often have the phenomenon of cold welding and poor contact, which easily causes the LED chip to fall off, seriously reducing the yield of the product, and then affecting the normal display. Therefore, it is a technical problem to be solved by those skilled in the art to provide a display panel and a display device that can improve the success rate of LED chip binding, avoid the problems of cold welding and poor contact as much as possible, so as to improve the product yield, and then improve the display effect. Summary of the invention

[0004] In view of this, the present invention provides a display panel and a display device to solve the problem in the prior art that the pins and pads of LED chips often have cold solder joints and poor contact, which easily causes the LED chip to fall off, seriously reduces the yield of the product, and further affects the normal display.

[0005] The present invention discloses a display panel, comprising: a substrate; a plurality of pad groups located on one side of the substrate, wherein one pad group comprises a first pad and a second pad; at least one pad group corresponds to one light-emitting device; in one pad group, a first pin of the light-emitting device is bound and electrically connected to the first pad, and a second pin of the light-emitting device is bound and electrically connected to the second pad; a first metal part and a second metal part located on one side of the pad group close to the substrate; wherein, in the pad group corresponding to the same light-emitting device, in a direction perpendicular to the plane where the substrate is located, the first pad at least partially overlaps with the first metal part, the second pad at least partially overlaps with the second metal part, the overlapping area of ​​the first pad and the first metal part is S1, the overlapping area of ​​the second pad and the second metal part is S2, Alternatively, in the pad group corresponding to the same light-emitting device, in a direction perpendicular to the plane where the substrate is located, the first pad does not overlap with the first metal portion, and the second pad does not overlap with the second metal portion.

[0006] Based on the same inventive concept, the present invention also discloses a display device, which includes the above-mentioned display panel.

[0007] Compared with the prior art, the display panel and display device provided by the present invention achieve at least the following beneficial effects:

[0008] The display panel provided by the present invention includes a substrate, which can be used as a supporting base of the display panel, and other structures of the display panel can be made on the substrate. One side of the substrate includes a plurality of pad groups, at least one pad group is arranged corresponding to a light-emitting device, and a pad group includes a first pad and a second pad, the first pad of the pad group is bound to the first pin of the light-emitting device, and the second pad of the pad group is bound to the second pin of the light-emitting device. The display panel includes a first metal part and a second metal part on the side of the pad group close to the substrate. In the pad group corresponding to the same light-emitting device, when there is a first metal part directly below the first pad and a second metal part directly below the second pad, the overlapping area of ​​the first pad and the first metal part is substantially equal to the overlapping area of ​​the second pad and the second metal part, and satisfies Thus, the first pad and the second pad can be kept basically on the same horizontal plane, and the height difference between the first pad and the second pad in the direction perpendicular to the plane where the substrate is located can be avoided as much as possible, which is conducive to improving the flatness of the first pad and the second pad corresponding to the same light-emitting device. Or when the first metal part is not arranged directly below the first pad, and the second metal part is not arranged directly below the second pad, no metal part is arranged below the first pad and the second pad corresponding to a pad group to destroy its flatness, and then when the light-emitting device is subsequently bound to a pad group, it can be avoided as much as possible that there is a metal part directly below one pad in the same pad group to raise the film layer, while there is no metal part under the other pad, resulting in poor flatness of the pad group before the light-emitting device is bound, resulting in a problem of cold welding or poor contact between the light-emitting device and the pad group, and the height difference between the first pad and the second pad in the direction perpendicular to the plane where the substrate is located can be avoided as much as possible, which is conducive to ensuring the electrical connection stability when the light-emitting device is bound to the first pad and the second pad in the pad group, improving the binding yield, and then improving the product yield, which is conducive to improving the display quality.

[0009] Of course, any product implementing the present invention does not necessarily need to achieve all of the above-mentioned technical effects at the same time.

[0010] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0012] Figure 1 is a schematic diagram of a planar structure of a display panel provided by an embodiment of the present invention;

[0013] Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure along the A-A' direction;

[0014] Figure 3 yes Figure 1 Another schematic diagram of the cross-sectional structure along the A-A' direction;

[0015] Figure 4 yes Figure 1 Another schematic diagram of the cross-sectional structure along the A-A' direction;

[0016] Figure 5 yes Figure 1 Another schematic diagram of the cross-sectional structure along the A-A' direction;

[0017] Figure 6 yes Figure 1Another schematic diagram of the cross-sectional structure along the A-A' direction;

[0018] Figure 7 yes Figure 1 Another schematic diagram of the cross-sectional structure along the A-A' direction;

[0019] Figure 8 yes Figure 1 Another schematic diagram of the cross-sectional structure along the A-A' direction;

[0020] Fig. 9 yes Figure 1 Another schematic diagram of the cross-sectional structure along the A-A' direction;

[0021] Fig.10 yes Figure 1 Another schematic diagram of the cross-sectional structure along the A-A' direction;

[0022] Fig.11 yes Figure 1 Another schematic diagram of the cross-sectional structure along the A-A' direction;

[0023] Fig.12 yes Figure 1 Another schematic diagram of the cross-sectional structure along the A-A' direction;

[0024] Fig.13 yes Figure 1 Another schematic diagram of the cross-sectional structure along the A-A' direction;

[0025] Fig.14 is another schematic diagram of a planar structure of a display panel provided by an embodiment of the present invention;

[0026] Fig.15 is another schematic diagram of a planar structure of a display panel provided by an embodiment of the present invention;

[0027] Fig.16 yes Fig.14 Schematic diagram of the cross-sectional structure along the B-B' direction;

[0028] Fig.17 yes Fig.14 Another cross-sectional structure schematic diagram along the B-B' direction;

[0029] Fig.18 yes Fig.14 Another cross-sectional structure schematic diagram along the B-B' direction;

[0030] Fig.19 yes Fig.14 Another cross-sectional structure schematic diagram along the B-B' direction;

[0031] Fig. 20 yes Fig.14 Another cross-sectional structure schematic diagram along the B-B' direction;

[0032] Fig.21 is another schematic diagram of a planar structure of a display panel provided by an embodiment of the present invention;

[0033] Fig. 22 yes Fig.14 Another cross-sectional structure schematic diagram along the B-B' direction;

[0034] Fig.23 is another schematic diagram of a planar structure of a display panel provided by an embodiment of the present invention;

[0035] Fig.24 is another schematic diagram of a planar structure of a display panel provided by an embodiment of the present invention;

[0036] Fig.25 yes Fig.24 Schematic diagram of the local enlarged structure of the middle Q1 area;

[0037] Fig.26 yes Fig.23 Schematic diagram of the local enlarged structure of the middle Q2 area;

[0038] Fig. 27 is another schematic diagram of a planar structure of a display panel provided by an embodiment of the present invention;

[0039] Fig.28 yes Fig. 27 Schematic diagram of the local enlarged structure of the middle Q3 area;

[0040] Fig.29 yes Figure 1 Another schematic diagram of the cross-sectional structure along the A-A' direction;

[0041] Fig.30 yes Figure 1 Another schematic diagram of the cross-sectional structure along the A-A' direction;

[0042] Fig.31 yes Figure 1 Another schematic diagram of the cross-sectional structure along the A-A' direction;

[0043] Fig.32 yes Fig.23 Schematic diagram of the cross-sectional structure along the C-C' direction;

[0044] Fig.33 yes Fig.23 Another cross-sectional structure schematic diagram in the C-C' direction;

[0045] Fig.34 is another schematic diagram of a planar structure of a display panel provided by an embodiment of the present invention;

[0046] Fig.35is another schematic diagram of a planar structure of a display panel provided by an embodiment of the present invention;

[0047] Fig.36 yes Fig.35 Schematic diagram of the local enlarged structure of the middle Q4 area;

[0048] Fig.37 is another schematic diagram of a planar structure of a display panel provided by an embodiment of the present invention;

[0049] Fig.38 yes Fig.37 Schematic diagram of the local enlarged structure of the middle Q5 area;

[0050] Fig.39 is another schematic diagram of a planar structure of a display panel provided by an embodiment of the present invention;

[0051] Fig.40 yes Fig.39 Schematic diagram of the local enlarged structure of the middle Q6 area;

[0052] Fig.41 It is a schematic diagram of the planar structure of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0053] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0054] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0055] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0056] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0057] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0058] Please refer to Figure 1-Figure 5 , Figure 1 is a schematic diagram of a planar structure of a display panel provided by an embodiment of the present invention, Figure 2 yes Figure 1Schematic diagram of the cross-sectional structure along the A-A' direction, Figure 3 yes Figure 1 Another cross-sectional structure schematic diagram along the A-A' direction, Figure 4 yes Figure 1 Another cross-sectional structure schematic diagram along the A-A' direction, Figure 5 yes Figure 1 Another cross-sectional structural diagram along the A-A' direction (it can be understood that in order to clearly illustrate the structure of this embodiment, Figure 1 The display panel 000 provided in this embodiment includes:

[0059] Substrate 10;

[0060] A plurality of pad groups 20 are located on one side of the substrate 10, and one pad group 20 includes a first pad 201 and a second pad 202; at least one pad group 20 corresponds to one light-emitting device 30; in one pad group 20, the first pin 301 of the light-emitting device 30 is bound and electrically connected to the first pad 201, and the second pin 302 of the light-emitting device 30 is bound and electrically connected to the second pad 202;

[0061] A first metal portion 401 and a second metal portion 402 located on a side of the pad group 20 close to the substrate 10;

[0062] in,

[0063] like Figure 2 As shown, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 at least partially overlaps with the first metal portion 401, and the second pad 202 at least partially overlaps with the second metal portion 402. The overlapping area of ​​the first pad 201 and the first metal portion 401 is S1, and the overlapping area of ​​the second pad 202 and the second metal portion 402 is S2. or,

[0064] like Figure 3 As shown, in the pad group 20 corresponding to the same light-emitting device 30 , in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 does not overlap with the first metal portion 401 , and the second pad 202 does not overlap with the second metal portion 402 .

[0065] Specifically, the display panel 000 provided in this embodiment includes a substrate 10, which can be used as a supporting substrate of the display panel 000, and other structures of the display panel 000 can be made on the substrate 10. One side of the substrate 10 includes a plurality of pad groups 20, at least one pad group 20 is arranged corresponding to a light-emitting device 30, and a pad group 20 includes a first pad 201 and a second pad 202. Optionally, the light-emitting device 30 may include mini LED (sub-millimeter light-emitting diode), micro LED (micro light-emitting diode), nano LED (nano light-emitting diode) and combinations thereof, wherein micro LED and mini-LED are smaller than traditional LEDs, and their sizes are about 1 / 5 of the traditional LED size, while nano LED refers to a single LED with a size of less than 1 micron (nanometer level). Micro LED, mini LED, nano LED display technology is a self-luminous technology, and its advantages include low power consumption, high brightness, ultra-high resolution and color saturation, fast response speed, ultra-power saving, long life, high efficiency, etc. Optionally, the pins (such as cathode pins and anode pins) of the light-emitting device 30 in this embodiment can be respectively bound to the first pad 201 and the second pad 202 of a pad group 20, such as the anode pin of the light-emitting device 30 is bound to the first pad 201 to realize the electrical connection between the anode pin of the light-emitting device 30 and the first pad 201, and the cathode pin of the light-emitting device 30 is bound to the second pad 202 to realize the electrical connection between the cathode pin of the light-emitting device 30 and the second pad 202. The anode drive signal can be provided to the anode pin of the light-emitting device 30 through a device in the driving circuit layer connected to the first pad 201 (not shown in the figure, such as a driving transistor), and the cathode drive signal can be provided to the cathode pin of the light-emitting device 30 through a cathode signal line connected to the second pad 202, so as to drive the light-emitting device 30 to emit light. Figure 1 and Figure 2 As shown, the packaging form of the light-emitting device 30 in the display panel 000 of this embodiment can be a horizontal light-emitting chip, and the first pin 301 (such as the P electrode in the PN junction, the anode pin) and the second pin 302 (such as the N electrode in the PN junction, the cathode pin) of the horizontal light-emitting chip are located on the surface of the light-emitting device 30 facing the substrate 10. Therefore, when the light-emitting device 30 is bound to the pad group 20, it is necessary to ensure that the first pad 201 and the second pad 202 of a pad group 20 corresponding to the same light-emitting device 30 have a high flatness to ensure the binding connection effect of the first pin 301 of the light-emitting device 30 and the first pad 201, and the binding connection effect of the second pin 302 and the second pad 202.

[0066] Optionally, in this embodiment Figure 1In the example, one light-emitting device 30 corresponds to at least one pad group 20. In the specific implementation, the number of pad groups 20 corresponding to one light-emitting device 30 includes but is not limited to this. Two pad groups 20 can also be provided for one light-emitting device 30. One of the two pad groups 20 can be used as a spare pad group. When the other pad group 20 fails, the spare pad group can be enabled. Even if one pad group 20 may have a cold solder joint, it can be repaired by another spare pad group to ensure electrical connection, so that the corresponding light-emitting device 30 can emit light normally. Optionally, the light-emitting device 30 and its corresponding pad group 20 can be overlapped in a direction perpendicular to the plane where the substrate 10 is located, that is, the light-emitting device 30 can be bound and provided above the pad group 20. In the prior art, a driving circuit layer 01 may also be provided between the substrate 10 and the pad group 20. The first metal part 401 and the second metal part 402 may be partial structures in the driving circuit layer 01. The driving circuit layer 01 generally includes a plurality of conductive structures (such as metal conductive structures such as transistors) and a plurality of conductive signal lines (such as scanning signal lines, data signal lines, power signal lines, etc.), and may also include a plurality of insulating layers that play an insulating role, etc., which are not shown in the figure. The driving circuit layer 01 is only shown as a plurality of film layer structures. Through the setting of the driving circuit layer 01, the driving signal can be transmitted to each light-emitting device 30 to achieve the normal light-emitting display effect of the light-emitting device 30. Since the driving circuit layer 01 includes more conductive film layers, the graphical circuit routing design can easily lead to excessively large height differences between the first pad 201 and the second pad 202 in the pad group 20, that is, the routing design of the driving circuit layer 01 can easily be unevenly distributed, resulting in excessively large height differences between the first pad 201 and the second pad 202 in the same pad group 20. As a result, when the light-emitting device 30 is bound to the pad group 20, it is easy for problems such as cold solder joints and poor contact to occur between the pins of the light-emitting device 30 and the first pad 201 and the second pad 202 in the pad group 20, thereby seriously affecting the product yield and display quality.

[0067] In order to solve the above problems, the display panel 000 in this embodiment includes a first metal part 401 and a second metal part 402 located on the side of the pad group 20 close to the substrate 10. Optionally, the first metal part 401 and the second metal part 402 can be understood as two metal structures in the same film layer in the driving circuit layer, or can also be understood as two metal structures in different layers of multiple film layers in the driving circuit layer. This embodiment is not limited to this, and it is only required that the first metal part 401 and the second metal part 402 are located on the side of the pad group 20 close to the substrate 10. In the present embodiment, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 at least partially overlaps with the first metal portion 401, and the second pad 202 at least partially overlaps with the second metal portion 402, that is, when the first pad 201 is directly below the first pad 201 and the second pad 202 is directly below the second pad 202, the overlapping area S1 of the first pad 201 and the first metal portion 401 is equal to the overlapping area S2 of the second pad 202 and the second metal portion 402. There may be process errors during the manufacturing process, and the overlapping areas S1 and S2 may not be completely equal, but as long as the first metal portion 401 is satisfied, the area S2 of the second pad 202 and the second metal portion 402 may not be completely equal. It can be understood that the area S1 of the first pad 201 overlapping with the first metal portion 401 is substantially equal to the area S2 of the second pad 202 overlapping with the second metal portion 402, so that in a pad group 20 corresponding to the same light-emitting device 30, the area of ​​the metal portion overlapping with the first pad 201 is substantially equal to the area of ​​the metal portion overlapping with the second pad 202, that is, the first pad 201 and the second pad 202 can be basically maintained on the same horizontal plane, and the height difference between the first pad 201 and the second pad 202 in the direction Z perpendicular to the plane of the substrate 10 can be avoided as much as possible, which is conducive to improving the flatness of the first pad 201 and the second pad 202 corresponding to the same light-emitting device 30; or, Figure 3As shown, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 and the first metal portion 401 do not overlap, and the second pad 202 and the second metal portion 402 do not overlap, that is, the first metal portion 401 is not arranged directly below the first pad 201, and the second metal portion 402 is not arranged directly below the second pad 202. When the metal portion is not arranged below the first pad 201 and the second pad 202 corresponding to one pad group 20 to destroy the flatness thereof, the occurrence of unevenness can be avoided as much as possible when the light-emitting device 30 is subsequently bound to one pad group 20. In the same pad group 20, there is a metal part directly below one pad to raise the film layer, while there is no metal part under the other pad, resulting in poor flatness of the pad group 20 before the light-emitting device 30 is bound, causing problems such as cold soldering or poor contact between the light-emitting device 30 and the pad group 20. The height difference between the first pad 201 and the second pad 202 in the direction Z perpendicular to the plane of the substrate 10 can be avoided as much as possible, which is beneficial to ensure the stability of the electrical connection when the light-emitting device 30 is bound to the first pad 201 and the second pad 202 in the pad group 20, improve the binding yield, and then improve the product yield, which is beneficial to improving the display quality.

[0068] It can be understood that in the present embodiment, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 at least partially overlaps with the first metal portion 401, and the second pad 202 at least partially overlaps with the second metal portion 402, that is, when the first pad 201 has the first metal portion 401 below, and the second pad 202 has the second metal portion 402 below, only the first pad 201 and the second metal portion 402 are overlapped. Figure 2 The diagram shows a configuration structure in which the first metal portion 401 and the second metal portion 402 are located in the same metal film layer. In a specific implementation, the configuration structure of the first metal portion 401 and the second metal portion 402 includes but is not limited to this.

[0069] Optional, such as Figure 2 As shown, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 can at least partially overlap with a first metal part 401, and the second pad 202 can at least partially overlap with a second metal part 402, that is, there is a first metal part 401 under the first pad 201, and there is a second metal part 402 under the second pad 202, and the first metal part 401 and the second metal part 402 can be arranged in the same film layer.

[0070] Optional, such as Figure 4As shown, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 can at least partially overlap with a first metal part 401, and the second pad 202 can at least partially overlap with a second metal part 402, that is, there is a first metal part 401 below the first pad 201, and there is a second metal part 402 below the second pad 202, and the first metal part 401 at least partially overlapping with the first pad 201 and the second metal part 402 at least partially overlapping with the second pad 202 can be arranged in different film layers.

[0071] Optional, such as Figure 5 As shown, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 can at least partially overlap with two or more first metal parts 401, and the second pad 202 can at least partially overlap with two or more second metal parts 402, that is, there is a first metal part 401 below the first pad 201, and there is a second metal part 402 below the second pad 202, and the two first metal parts 401 and the two second metal parts 402 can be arranged in the same film layer. At this time, the area S1 of the first pad 201 overlapping with the first metal part 401 can be understood as the sum of the areas of the first pad 201 overlapping with the two first metal parts 401, and the area S2 of the second pad 202 overlapping with the second metal part 402 can be understood as the sum of the areas of the second pad 202 overlapping with the two second metal parts 402, that is, the sum of the areas of the first pad 201 overlapping with the two first metal parts 401 ( Figure 5 S11+S12=S1) and the overlapped area S2 ( Figure 5 S21+S22=S2) in are basically equal or equal.

[0072] Optional, such as Figure 6 As shown, Figure 6 yes Figure 1Another schematic diagram of the cross-sectional structure along the A-A' direction is shown. In the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 can at least partially overlap with the two first metal parts 401, and the second pad 202 can at least partially overlap with the two second metal parts 402, that is, there are two first metal parts 401 below the first pad 201, and there are two second metal parts 402 below the second pad 202, and the two first metal parts 401 and the two second metal parts 402 can be arranged in different film layers. At this time, the overlapping area S1 of the first pad 201 and the first metal part 401 can be understood as the overlapping area of ​​the first pad 201 and one of the first metal parts 401, and the overlapping area S2 of the second pad 202 and the second metal part 402 can be understood as the overlapping area of ​​the second pad 202 and one of the second metal parts 402, and the two are basically equal or equal.

[0073] Optionally, the first metal portion 401 and the second metal portion 402 may also be other configuration structures, which only need to satisfy that when there is the first metal portion 401 below the first pad 201 and the second metal portion 402 below the second pad 202, the overlapping area S1 of the first pad 201 and the first metal portion 401 is substantially equal to or exactly equal to the overlapping area S2 of the second pad 202 and the second metal portion 402, and have The relationship between the allowable error range is sufficient, and this embodiment does not limit this.

[0074] It can be understood that the present embodiment does not specifically limit the shape and size of the first pad 201 and the second pad 202. In specific implementation, the first pad 201 and the second pad 202 can be both square or long strips, or the first pad 201 and the second pad 202 can be the same in shape and size. The present embodiment does not specifically limit the shape and size of the first metal portion 401 at least partially overlapping with the first pad 201, and the shape and size of the second metal portion 402 at least partially overlapping with the second pad 202 are not specifically limited. The first metal portion 401 and the second metal portion 402 can be a block-shaped conductive structure, or a strip-shaped or linear conductive wire structure. The present embodiment does not specifically limit it. It only needs to satisfy that when there is a first metal portion 401 directly below the first pad 201 and a second metal portion 402 directly below the second pad 202, the overlapping area S1 of the first pad 201 and the first metal portion 401 is equal to or substantially equal to the overlapping area S2 of the second pad 202 and the second metal portion 402.

[0075] It should be noted that the drawings of this embodiment only illustrate the structure of the display panel. In specific implementation, the structure of the display panel 000 includes but is not limited to this, and may also include other structures that can achieve a display effect. The structure of the display panels such as micro LED, mini LED, nano LED, etc. in the relevant technology may be referred to for understanding, and this embodiment will not be elaborated herein.

[0076] It should be further explained that, in this embodiment Figure 1 The example in which a plurality of light emitting devices 30 are arranged in an array on the substrate 10 is used for illustration. In a specific implementation, the arrangement of the light emitting devices 30 on the substrate 10 includes but is not limited to this, and may also be other arrangements, which are not limited in this embodiment.

[0077] Optional, such as Figure 1 and Figure 7 As shown, Figure 7 yes Figure 1 Another cross-sectional structural schematic diagram along the A-A' direction, the pad group 20 in this embodiment includes an electrode layer 20A and a eutectic layer 20B located on a side of the electrode layer 20A away from the substrate 10, the electrode layer 20A may include a first electrode 20A1 and a second electrode 20A2 made of a metal conductive material; the eutectic layer 20B may be made of a high melting point eutectic material, such as a eutectic material of solder and silver or gold, the area where the eutectic layer 20B overlaps with the first electrode 20A1 of the electrode layer 20A can be understood as the area of ​​the first pad 201 in this embodiment, and the area where the eutectic layer 20B overlaps with the second electrode 20A2 of the electrode layer 20A can be understood as the area of ​​the second pad 202 in this embodiment (such as Figure 7 The dotted box in the figure indicates the circled area). The eutectic layer 20B has the characteristics of good electrical conductivity and high heat dissipation performance. The first pin 301 of the light-emitting device 30 can be bound and electrically connected to the first electrode 20A1 through the eutectic layer 20B. The surface of the eutectic layer 20B facing away from the substrate 10 is fixedly bound to the first pin 301 of the light-emitting device 30. The surface of the eutectic layer 20B facing the substrate 10 is fixedly bound to the first electrode 20A1. The second pin 302 of the light-emitting device 30 is bound and electrically connected to the second electrode 20A2 through the eutectic layer 20B. The surface of the eutectic layer 20B facing away from the substrate 10 is fixedly bound to the second pin 302 of the light-emitting device 30. The surface of the eutectic layer 20B facing the substrate 10 is fixedly bound to the second electrode 20A2, thereby achieving the transmission effect of the driving signal.

[0078] In some optional embodiments, please continue to refer to Figure 1 , Figure 2 , Figure 5 and Figure 8 , Figure 8 yes Figure 1Another schematic diagram of the cross-sectional structure along the AA' line, in this embodiment, the first metal portion 401 and the second metal portion 402 are arranged in the same layer.

[0079] This embodiment explains that the first metal portion 401 and the second metal portion 402 can be arranged in the same layer. Figure 2 , Figure 5 and Figure 8 As shown, the first metal part 401 and the second metal part 402 can be metal structures in any film layer in the driving circuit layer 01 between the pad group 20 and the substrate 10. It is only necessary that the first metal part 401 overlaps with the first pad 201 directly below, and the second metal part 402 overlaps with the second pad 202 directly below. The first metal part 401 and the second metal part 402 can be arranged on the same layer. No matter in which film layer of the driving circuit layer 01 the first metal part 401 and the second metal part 402 are located, the overlapping area S1 of the first pad 201 and the first metal part 401 and the overlapping area S2 of the second pad 202 and the second metal part 402 are basically equal or exactly equal, so that the first pad 201 and the second pad 202 can basically be maintained on the same horizontal plane, and the height difference between the first pad 201 and the second pad 202 in the direction Z perpendicular to the plane of the substrate 10 can be avoided as much as possible, which is beneficial to improving the flatness of the first pad 201 and the second pad 202 corresponding to the same light-emitting device 30, ensuring the electrical connection stability when the light-emitting device 30 is bound to the first pad 201 and the second pad 202 in the pad group 20, and improving the binding yield as much as possible, thereby improving the product yield.

[0080] In some optional embodiments, please refer to Figure 1 and Fig. 9 , Fig. 9 yes Figure 1 Another cross-sectional structural schematic diagram along the A-A' direction, in this embodiment, the display panel 000 includes a first metal layer 40 located on the side of the pad group 20 close to the substrate 10, the first metal part 401 and the second metal part 402 are both located in the first metal layer 40, and no other metal layer is included between the first metal layer 40 and the pad group 20.

[0081] This embodiment explains that the first metal part 401 and the second metal part 402 are arranged in the same layer, such as the first metal layer 40 located in the driving circuit layer 01. The first metal layer 40 can be understood as a conductive film layer closest to the pad group 20 among the multiple metal film layers of the driving circuit layer 01, that is, no other metal layer is included between the first metal layer 40 and the pad group 20. When the first metal layer 40 is reused as a metal layer in the driving circuit layer 01, it is preferred to reuse the metal layer closest to the pad group 20, that is, in the manufacturing process of the display panel 000, there is no manufacturing process of other metal layers after the manufacturing process of the first metal layer 40 and before the manufacturing of the pad group 20. There is no other metal structure on the first metal layer 40 that affects the flatness of the film layer below the first pad 201 and the second pad 202 in the pad group 20. After the insulating layer 011 that serves to insulate the first metal layer 40 and the pad group 20 is produced on the first metal layer 40, a relatively flat film layer base can be provided for the production of the pad group 20, so that the first pad 201 and the second pad 202 can be produced with better flatness and can be basically on the same horizontal plane, which can improve the subsequent binding yield of the light-emitting device 30, and thus help to better improve the display effect.

[0082] Optional, such as Fig. 9As shown, in this embodiment, other metal layers may be included between the first metal layer 40 and the substrate 10. The other metal layers may be part of the metal conductive film layer of the driving circuit layer 01, and may be used to make transistor structures or scanning lines or other conductive structures in the driving circuit layer 01. This embodiment does not specifically limit the arrangement of the metal structures in the other metal film layers, but only needs to satisfy that in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 at least partially overlaps with the first metal portion 401 of the first metal layer 40, and the second pad 202 at least partially overlaps with the second metal portion 402 of the first metal layer 40, that is, when there is a first metal portion 401 in the first metal layer 40 directly below the first pad 201 and the closest to it, and there is a second metal portion 402 in the first metal layer 40 directly below the second pad 202 and the closest to it, The overlapping area S1 of the first pad 201 and the first metal portion 401 is equal to or substantially equal to the overlapping area S2 of the second pad 202 and the second metal portion 402, or the first pad 201 and the first metal portion 401 in the first metal layer 40 nearest to it do not overlap, and the second pad 202 and the second metal portion 402 in the first metal layer 40 nearest to it do not overlap, that is, the first metal portion 401 is not arranged directly below the first pad 201, and the second metal portion 402 is not arranged directly below the second pad 202, so that the first pad 201 and the second pad 202 can be basically maintained on the same horizontal plane, and the height difference between the first pad 201 and the second pad 202 in the direction Z perpendicular to the plane of the substrate 10 can be avoided as much as possible, so as to improve the flatness of the first pad 201 and the second pad 202 corresponding to the same light-emitting device 30. This embodiment will not be described in detail here.

[0083] In some optional embodiments, please refer to Figure 1 and Fig.10 , Fig.10 yes Figure 1 Another cross-sectional structural diagram along the A-A' direction, in this embodiment, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 at least partially overlaps with the first metal portion 401, and the second pad 202 at least partially overlaps with the second metal portion 402;

[0084] In the pad group 20 corresponding to the same light-emitting device 30, the orthographic projection of the first metal part 401 overlapping with the first pad 201 on the substrate 10 covers the orthographic projection of the first pad 201 on the substrate 10, and the orthographic projection of the second metal part 402 overlapping with the second pad 202 on the substrate 10 covers the orthographic projection of the second pad 202 on the substrate 10.

[0085] This embodiment explains that in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 at least partially overlaps with the first metal portion 401 of the first metal layer 40, and the second pad 202 at least partially overlaps with the second metal portion 402 of the first metal layer 40, that is, when there is a first metal portion 401 in the first metal layer 40 directly below the first pad 201 and the closest to it, and there is a second metal portion 402 in the first metal layer 40 directly below the second pad 202 and the closest to it, the orthographic projection of the first metal portion 401 overlapping with the first pad 201 on the substrate 10 covers the orthographic projection of the first pad 201 on the substrate 10, and the orthographic projection of the second metal portion 402 overlapping with the second pad 202 on the substrate 10 covers the orthographic projection of the second pad 202 on the substrate 10, that is, When there are metal structures directly below the first pad 201 and the second pad 202 of the same pad group 20, the area of ​​the metal structure directly below the pad is made as large as possible, the first metal part 401 can cover the entire first pad 201, and the second metal part 402 can cover the entire second pad 202, which is equivalent to the metal pad structure below the first pad 201 being able to pad the entire area where the first pad 201 is located, and the metal pad structure below the second pad 202 is also able to pad the entire area where the second pad 202 is located, thereby preventing the first pad 201 from deviating from the area where the first metal part 401 is located below, causing a step difference in the first pad 201 and causing a flatness problem, and preventing the second pad 202 from deviating from the area where the second metal part 402 is located below, causing a step difference in the second pad 202 and causing a flatness problem. It can be understood that at this time, the overlapping area S1 between the first solder pad 201 and the first metal part 401 is the area of ​​the first solder pad 201 itself, and the overlapping area S2 between the second solder pad 202 and the second metal part 402 is the area of ​​the second solder pad 202 itself, and the two are basically equal or equal, so that the first solder pad 201 and the second solder pad 202 are both raised by the metal structure at the same time, and the first solder pad 201 as a whole and the second solder pad 202 as a whole can be better in the same horizontal plane, and the height difference between the first solder pad 201 and the second solder pad 202 in the direction Z perpendicular to the plane of the substrate 10 can be avoided as much as possible, which is conducive to better ensuring the flatness of the pad group 20 corresponding to the same light-emitting device 30, and further improving the yield of the bound light-emitting device 30.

[0086] In some optional embodiments, please refer to Figure 1 , Figure 3 and Figure 11-13 , Fig.11 yes Figure 1 Another cross-sectional structure schematic diagram along the A-A' direction, Fig.12 yes Figure 1 Another cross-sectional structure schematic diagram along the A-A' direction, Fig.13 yes Figure 1 Another cross-sectional structural diagram along the A-A' direction, in this embodiment, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 does not overlap with the first metal portion 401, and the second pad 202 does not overlap with the second metal portion 402;

[0087] In the pad group 20 corresponding to the same light-emitting device 30, in the direction X parallel to the plane of the substrate 10, the minimum distance L1 from the first metal part 401 to the first pad 201 is greater than 8.5μm, and the minimum distance L2 from the second metal part 402 to the second pad 202 is greater than 8.5μm.

[0088] This embodiment explains that in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, when there is no metal structure overlapping with the first pad 201 and the second pad 202 directly below, that is, the first pad 201 does not overlap with the first metal portion 401, and the second pad 202 does not overlap with the second metal portion 402, as shown in FIG. Figure 3 As shown, in the direction X parallel to the plane where the substrate 10 is located, the first metal portion 401 can be located between the first pad 201 and the second pad 202, and the second metal portion 402 can be located on the side of the second pad 202 away from the first pad 201. In this case, the first metal portion 401 located between the first pad 201 and the second pad 202 can also be understood as the second metal portion, and its minimum distance L2 to the second pad 202 must also be greater than 8.5 μm. Or as Fig.11 As shown, the second metal portion 402 may be located between the first pad 201 and the second pad 202, and the first metal portion 401 may be located on the side of the first pad 201 away from the second pad 202. In this case, the second metal portion 402 located between the first pad 201 and the second pad 202 may also be understood as the first metal portion, and its minimum distance L1 to the first pad 201 must also be greater than 8.5 μm. Or as Fig.12 As shown, the first metal portion 401 may be located on a side of the first pad 201 away from the second pad 202, and the second metal portion 402 may be located on a side of the second pad 202 away from the first pad 201; or Fig.13 As shown, the second metal part 402 and the first metal part 401 can be the same structure, that is, the first metal part 401 is reused as the second metal part 402 and is arranged between the first pad 201 and the second pad 202; or the first metal part 401 and the second metal part 402 can also be other arrangements, as long as it is satisfied that in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, there is no metal structure overlapping with the first pad 201 and the second pad 202 directly below.

[0089] like Figure 3 , Figure 11-13 As shown, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, when there is no metal structure overlapping with the first pad 201 and the second pad 202 directly below, in the pad group 20 corresponding to the same light-emitting device 30, in the direction X parallel to the plane where the substrate 10 is located, the minimum distance L1 from the first metal portion 401 to the first pad 201 is greater than 8.5 μm, that is, the distance L1 between the edge 401A of the first metal portion 401 facing the first pad 201 and the edge 201A of the first pad 201 facing the first metal portion 401 is greater than 8.5 μm, and the minimum distance L2 from the second metal portion 402 to the second pad 202 is greater than 8.5 μm, that is, the distance L2 between the edge 402A of the second metal portion 402 facing the second pad 202 and the edge 402A of the second metal portion 402 facing the second pad 202 The distance L2 between the edge 202A of the second metal part 402 and the edge 202A on the side of the second metal part 402 is greater than 8.5μm, thereby offsetting the flatness difference caused by the difference in the stacking of the underlying metal structure directly below the pad, and avoiding that the minimum distance L1 from the first metal part 401 to the first pad 201 is too small, causing the first metal part 401 to raise the insulating film layer covering the first metal part 401, and the raised position is too close to the first pad 201 subsequently manufactured, resulting in unevenness of the first pad 201 manufactured on the insulating layer, and avoiding that the minimum distance L2 from the second metal part 402 to the second pad 202 is too small, causing the second metal part 402 to raise the insulating film layer covering the second metal part 402, and the raised position is too close to the second pad 202 subsequently manufactured, resulting in unevenness of the second pad 202 manufactured on the insulating layer. Therefore, in the present embodiment, in the pad group 20 corresponding to the same light-emitting device 30, in the direction X parallel to the plane where the substrate 10 is located, the minimum distance L1 from the first metal part 401 to the first pad 201 is relatively large, and the minimum distance L2 from the second metal part 402 to the second pad 202 is also relatively large, and both L1 and L2 are greater than 8.5μm. In the pad group 20 corresponding to the same light-emitting device 30, when there is no metal structure overlapping with the first pad 201 and the second pad 202 directly below, the height difference between the first pad 201 and the second pad 202 in the direction Z perpendicular to the plane where the substrate 10 is located can be avoided as much as possible, which is beneficial to further improve the flatness of the first pad 201 and the second pad 202 in the pad group 20 and improve the product yield.

[0090] In some optional embodiments, please refer to Fig.14 , Fig.15 and Figure 16-Figure 20 , Fig.14 is another schematic diagram of a planar structure of a display panel provided by an embodiment of the present invention, Fig.15 is another schematic diagram of a planar structure of a display panel provided by an embodiment of the present invention, Fig.16 yes Fig.14 Schematic diagram of the cross-sectional structure along the B-B' direction, Fig.17 yes Fig.14 Another cross-sectional structure diagram in the B-B' direction, Fig.18 yes Fig.14 Another cross-sectional structure diagram in the B-B' direction, Fig.19 yes Fig.14 Another cross-sectional structure diagram in the B-B' direction, Fig. 20 yes Fig.14 Another cross-sectional structural diagram along the BB' direction (it can be understood that in order to clearly illustrate the structure of this embodiment, Fig.14 and Fig.15 The display panel 000 provided in this embodiment further includes a plurality of light-emitting areas LA and a plurality of light-transmitting areas TA, the light-emitting area LA includes at least one light-emitting device 30, and the orthographic projection of the pad group 20 on the substrate 10 is located in the light-emitting area LA;

[0091] The display panel 000 further includes at least one insulating layer 02, the insulating layer 02 is located on a side of the pad group 20 close to the substrate 10, and the insulating layer 02 includes a through hole 02K located in the light-transmitting area TA;

[0092] In a pad group 20, along a direction X parallel to the plane of the substrate 10, the minimum distance from the first pad 201 to the through hole 02K is W1, and the minimum distance from the second pad 202 to the through hole 02K is W2, wherein |W1-W2|≤1.1 μm.

[0093] This embodiment explains that the display panel 000 may be a transparent display panel, and the display area of ​​the display panel 000 may include a transparent display area AA, and the transparent display area AA may include a plurality of luminous areas LA and a plurality of light-transmitting areas TA, wherein the light-transmitting area TA is arranged adjacent to the luminous area LA in a direction parallel to the plane where the substrate 10 is located, and the transmittance of the light-transmitting area TA is greater than the transmittance of the luminous area LA. Optionally, Fig.14 As shown, the multiple light-emitting areas LA in this embodiment can be arranged in an array, and the multiple light-emitting areas LA are arranged along the first direction X1 to form a light-emitting area row LAH, and the multiple light-emitting areas LA are arranged along the second direction X2 to form a light-emitting area column LAL. In two adjacent light-emitting area rows LAH, the two light-emitting areas LA are located in the same light-emitting area column LAL. The first direction X1 and the second direction X2 intersect in the direction X parallel to the plane where the substrate 10 is located. The figure takes the first direction X1 and the second direction X2 as being perpendicular to each other as an example. Or as Fig.15As shown, the multiple light-emitting areas LA in this embodiment can be arranged in an array, the multiple light-emitting areas LA are arranged along the first direction X1 to form a light-emitting area row LAH, and the multiple light-emitting areas LA are arranged along the second direction X2 to form a light-emitting area column LAL. In two adjacent light-emitting area rows LAH, the two light-emitting areas LA are respectively located in two adjacent light-emitting area columns LAL, that is, the adjacent two light-emitting areas LA in the first direction X1 are arranged alternately in the second direction X2, and the adjacent two light-emitting areas LA in the second direction X2 are arranged alternately in the first direction X1. Optionally, the arrangement of the multiple light-emitting areas LA in this embodiment includes but is not limited to the above structure, and can also be other arrangements, which will not be described in detail in this embodiment.

[0094] The light-emitting area LA of the present embodiment includes at least one light-emitting device 30, and the orthographic projection of the pad group 20 on the substrate 10 is located in the light-emitting area LA, that is, the light-transmitting area TA is not provided with any structure that affects the transmittance. The display panel 000 also includes at least one insulating layer 02, and the insulating layer 02 is located on the side of the pad group 20 close to the substrate 10. Optionally, the insulating layer 02 can be an inorganic insulating layer that plays an insulating role between multiple metal film layers. The insulating layer 02 of the present embodiment is provided with a through hole 02K within the light-transmitting area TA. Further, optionally, during the manufacturing process of the display panel 000, the through hole 02K can be filled with a highly transparent material to further improve the transmittance of the light-transmitting area TA of the display panel 000.

[0095] In the present embodiment, a pad group 20 is provided, and along a direction X parallel to the plane where the substrate 10 is located, the minimum distance from the first pad 201 to the through hole 02K is W1, and the minimum distance from the second pad 202 to the through hole 02K is W2, wherein the minimum distance W1 from the first pad 201 to the through hole 02K can be understood as, in the direction X parallel to the plane where the substrate 10 is located, the distance between the edge of the first pad 201 facing the through hole 02K and the edge of the through hole 02K facing the first pad 201 is W1, and the minimum distance W2 from the second pad 202 to the through hole 02K can be understood as, in the direction X parallel to the plane where the substrate 10 is located, the distance between the second pad 202 and the through hole 02K closest to it is W2. The distance between the edge of the through hole 02K and the edge of the through hole 02K toward the second pad 202 is W2, and W1 is equal to or substantially equal to W2. There may be process errors during the manufacturing process, and W1 and W2 may not be completely equal. However, as long as |W1-W2|≤1.1μm is satisfied, it can be understood that the minimum distance W1 from the first pad 201 to the through hole 02K and the minimum distance W2 from the second pad 202 to the through hole 02K are substantially equal or approximately equal to or equal to each other. In this embodiment, the minimum distance W1 from the first pad 201 to the through hole 02K and the minimum distance W2 from the second pad 202 to the through hole 02K are set to be approximately equal, that is, the distance from the first pad 201 to the through hole 02K nearest thereto and the distance from the second pad 202 to the through hole 02K nearest thereto are substantially consistent. In the prior art, the light-transmitting area TA is generally prepared by firstly opening through holes penetrating through the surface of the substrate 10 in multiple insulating layers of inorganic materials on the substrate 10, and the through holes are located in the light-transmitting area TA. The through hole 02K of the insulating layer 02 of the present embodiment can be understood as the through hole 02K formed in a certain insulating layer 02 when forming the through hole. After the through hole penetrating through the surface of the substrate 10 is formed, an insulating layer of organic material (such as Fig.16 The through hole is filled with an insulating layer of organic material below the first metal part 401. When the insulating layer of organic material fills and covers the through hole, the depth of the through hole will not be filled. Therefore, there will be a height difference between the position of the through hole and other positions where no through hole is opened, resulting in the subsequent insulating layer (such as the insulating layer of organic material used to planarize the first metal part 401 and the second metal part 402) being flat. Fig.16The insulating layer 02 shown in the figure can be a flattening layer) is prone to leveling difference during the process, resulting in poor flatness. And if the distance from the first pad 201 to the nearest through hole 02K is inconsistent with the distance from the second pad 202 to the nearest through hole 02K, there will also be a problem that the inclination of the first pad 201 and the second pad 202 is inconsistent due to the difference in leveling. Therefore, in this embodiment, the distance from the first pad 201 to the nearest through hole 02K is basically consistent with the distance from the second pad 202 to the nearest through hole 02K, so that even if there is a leveling problem in the film layer under the pad group 20, the inclination of the two can be basically consistent, and the height difference between the first pad 201 and the second pad 202 in the direction Z perpendicular to the plane where the substrate 10 is located can be avoided, so that the first pad 201 and the second pad 202 corresponding to the same light-emitting device 30 are on the same horizontal plane as much as possible, thereby improving the flatness of the first pad 201 and the second pad 202 of the pad group 20, which is conducive to ensuring the product yield.

[0096] Optional, such as Figure 14-Figure 20 As shown, a plurality of light-transmitting areas TA are arranged along the first direction X1, and there is a pad group 20 between two adjacent light-transmitting areas TA along the first direction X1, and the first pad 201 and the second pad 202 in one pad group 20 are also arranged along the first direction X1. At this time, along the first direction X1, the through hole 02K closest to the first pad 201 and the through hole 02K closest to the second pad 201 can be two different through holes on opposite sides of the light-transmitting area TA, and the minimum distance W1 from the first pad 201 to the through hole 02K and the minimum distance W2 from the second pad 202 to the through hole 02K can be as follows Figure 14-16 shown.

[0097] Optional, such as Fig.21 As shown, Fig.21 is another schematic diagram of a planar structure of a display panel provided in an embodiment of the present invention (it can be understood that in order to clearly illustrate the structure of this embodiment, Fig.21 In this embodiment, a plurality of light-transmitting areas TA are arranged along the first direction X1, and there is a pad group 20 between two adjacent light-transmitting areas TA along the first direction X1. The first pad 201 and the second pad 202 in a pad group 20 can be arranged along the second direction X2. At this time, along the first direction X1, the through hole 02K closest to the first pad 201 and the through hole 02K closest to the second pad 201 can be the same through hole on the same side of the light-transmitting area TA, and the minimum distance W1 from the first pad 201 to the through hole 02K and the minimum distance W2 from the second pad 202 to the through hole 02K can be as follows: Fig.21 shown.

[0098] It should be noted that the present embodiment does not specifically limit the arrangement of the first pad 201 and the second pad 202 in the pad group 20. During specific implementation, the arrangement of the first pad 201 and the second pad 202 in the same pad group 20 between the two light-transmitting areas TA can be selected according to actual needs, and the present embodiment does not limit this.

[0099] Optional, such as Figure 17-Figure 20 As shown, the first metal part 401 and the second metal part 402 in this embodiment can be arranged in the same layer, and the first metal part 401 and the second metal part 402 can also be arranged in different layers. The first pad 201 in a pad group 20 can correspond to multiple first metal parts 401, and the second pad 202 can correspond to multiple second metal parts 402. For details, please refer to the description in the above embodiments. The settings of the first metal part 401 and the second metal part 402 in the above embodiments can effectively solve the problem of film layer tilting caused by the leveling difference of the film layer below the pad group 20, which is beneficial to ensure that the first pad 201 and the second pad 202 in a pad group 20 between the light-transmitting area TA are on the same horizontal plane as much as possible, thereby ensuring the binding effect of the light-emitting device 30.

[0100] In some optional embodiments, please continue to refer to Figure 14-Figure 21 In this embodiment, in a pad group 20, along a direction X parallel to the plane of the substrate 10, the minimum distance from the first pad 201 to the through hole 02K is W1, and the minimum distance from the second pad 202 to the through hole 02K is W2, W1≥7.5μm, W2≥7.5μm.

[0101] This embodiment explains that the display panel 000 is a transparent display panel, and the display panel 000 includes at least one insulating layer 02, which is located on the side of the pad group 20 close to the substrate 10. When the insulating layer 02 opens a through hole 02K within the light-transmitting area TA of the transparent display panel, in order to avoid the unevenness caused by excessive tilting of the first pad 201 and the second pad 202 due to the difference in leveling of the film layer under the pad group 20, this embodiment sets a pad group 20, along the direction X parallel to the plane where the substrate 10 is located, the minimum distance W1 from the first pad 201 to the through hole 02K, and the minimum distance W2 from the second pad 202 to the through hole 02K are both greater than or equal to 7. 5μm, it can be understood that, along the direction X parallel to the plane where the substrate 10 is located, the minimum distance W1 from the first pad 201 to the through hole 02K can be understood as the distance between the first pad 201 and the nearest through hole 02K, from the edge of the first pad 201 facing the through hole 02K to the edge of the through hole 02K facing the first pad 201 is W1; along the direction X parallel to the plane where the substrate 10 is located, the minimum distance W2 from the second pad 202 to the through hole 02K can be understood as the distance between the second pad 202 and the nearest through hole 02K, from the edge of the second pad 202 facing the through hole 02K to the edge of the through hole 02K facing the second pad 202 is W2. If the minimum distance W1 from the first pad 201 to the through hole 02K and the minimum distance W2 from the second pad 202 to the through hole 02K along the direction X parallel to the plane of the substrate 10 are too small, such as less than 7.5 μm, it is very likely that the insulating layer 02 will tilt downward (toward the direction close to the substrate 10) due to the digging of the through hole 02K, thereby causing the first pad 201 and the second pad 202 to tilt as well, resulting in a height difference and unevenness between the first pad 201 and the second pad 202 in the same pad group 20. In this embodiment, when the minimum distance W1 between the first solder pad 201 and the through hole 02K and the minimum distance W2 between the second solder pad 202 and the through hole 02K are set to be greater than or equal to 7.5μm, the flatness difference caused by the leveling difference of the film layer below the solder pad group 20 can be maintained within 0.1μm, that is, the tilting problem caused by the leveling difference of the film layer caused by digging the through hole 02K can be effectively solved, and the height difference between the first solder pad 201 and the second solder pad 202 in the direction Z perpendicular to the plane of the substrate 10 can be avoided as much as possible, so that the first solder pad 201 and the second solder pad 202 corresponding to the same light-emitting device 30 are on the same horizontal plane as much as possible, thereby improving the flatness of the first solder pad 201 and the second solder pad 202 of the solder pad group 20, which is beneficial to ensuring the product yield.

[0102] In some optional embodiments, please refer to Fig.14 and Fig. 22 , Fig. 22 yes Fig.14Another cross-sectional structural schematic diagram along the BB' direction, in this embodiment, the insulating layer 02 is an organic layer, the organic layer is located on the side of the first metal part 401 and / or the second metal part 402 close to the pad group 20, and the organic layer is in direct contact with the first metal part 401 and / or the second metal part 402.

[0103] This embodiment explains that the insulating layer 02 with the through hole 02K can be an organic layer, and the organic layer can be a planarization layer. The insulating layer 02 made of organic materials such as at least one of polyimide, acrylate and epoxy resin can have high flatness. The organic layer is located on the side of the first metal part 401 and / or the second metal part 402 close to the pad group 20, and the organic layer is in direct contact with the first metal part 401 and / or the second metal part 402, that is, the organic layer covers the film layer where the first metal part 401 and / or the second metal part 402 are located. The organic layer made of organic materials can be used to have a high flatness property, so that the surface of the insulating layer 02 covering the first metal part 401 and / or the second metal part 402 on the side away from the substrate 10 has a high flatness, and the height difference problem caused by the first metal part 401 and / or the second metal part 402 is weakened as much as possible, and then the first pad 201 and the second pad 202 of the pad group 20 made on the side of the organic layer away from the substrate 10 can be on the same horizontal plane as much as possible, which is beneficial to ensure the binding yield of the light-emitting device 30.

[0104] It is understandable that if Fig. 22 As shown, the insulating layer 02 of the organic layer and the substrate 10 of this embodiment may also include other insulating layers, such as a buffer layer 03 located between the substrate 10 and the active layer 70, an insulating layer located between the gate TG of the thin film transistor T, the active part TP of the thin film transistor T, and the film layer where the source TS / drain TD of the thin film transistor T is located, and a passivation layer 04 located on the side of the film layer where the source TS / drain TD of the thin film transistor T is located away from the substrate 10, etc. This embodiment does not specifically limit the setting structure of the insulating film layer between the pad group 20 and the substrate 10, and it is only necessary to satisfy that the insulating layer 02 covering the first metal part 401 and / or the second metal part 402 and the insulating layer 02 under the pad group 20 are the flat organic layer to minimize the height difference problem caused by the first metal part 401 and / or the second metal part 402.

[0105] In some alternative embodiments, please refer to Fig.23 , Fig.23 is another schematic diagram of a planar structure of a display panel provided in an embodiment of the present invention (it can be understood that in order to clearly illustrate the structure of this embodiment, Fig.23In this embodiment, a plurality of light-transmitting areas TA are arranged along a first direction X1, and there is a pad group 20 between two adjacent light-transmitting areas TA along the first direction X1. The first pad 201 and the second pad 202 in a pad group 20 can be arranged along a second direction X2. In the direction parallel to the plane where the substrate 10 is located, the first direction X1 and the second direction X2 intersect. This embodiment is described by taking the first direction X1 and the second direction X2 as being perpendicular to each other in the direction parallel to the plane where the substrate 10 is located as an example.

[0106] This embodiment explains that the display panel 000 can be a transparent display panel, and the display area of ​​the display panel 000 can include a transparent display area AA, and the transparent display area AA can include multiple light-emitting areas LA and multiple light-transmitting areas TA, wherein the light-transmitting area TA is adjacent to the light-emitting area LA along a direction parallel to the plane where the substrate 10 is located, and the transmittance of the light-transmitting area TA is greater than the transmittance of the light-emitting area LA. To achieve a transparent display effect of the display panel 000, the multiple light-transmitting areas TA are arranged along a first direction X1, and there is a pad group 20 between two adjacent light-transmitting areas TA along the first direction X1. Then, the first pad 201 and the second pad 202 in a pad group 20 are arranged along a second direction X2, which is different from the arrangement direction of the light-transmitting area TA, so that the first pad 201 and the second pad 202 of the same pad group 20 can be placed as close to the middle position of the lower wiring stack as possible, and the first pad 201 and the second pad 202 of a pad group 20 can be placed in the same horizontal plane as much as possible. Fig.23 As shown, the first metal portion 401 below the first solder pad 201 and the second metal portion 402 below the second solder pad 202 can be partial structures of the same metal routing J1 extending along the second direction X2, or the first metal portion 401 below the first solder pad 201 and the second metal portion 402 below the second solder pad 202 can also be two independent metal structures, which are also arranged along the second direction X2. Since the first solder pad 201 and the second solder pad 202 of the same solder pad group 20 can be arranged as concentratedly as possible above the same metal routing, the height difference problem between the first solder pad 201 and the second solder pad 202 can be better weakened, thereby improving the binding yield of the light-emitting device 30.

[0107] In some optional embodiments, please refer to Fig.23 , Fig.24 and Fig.25 , Fig.24 is another schematic diagram of a planar structure of a display panel provided in an embodiment of the present invention (it can be understood that in order to clearly illustrate the structure of this embodiment, Fig.23 Transparency filling is performed), Fig.25 yes Fig.24A schematic diagram of a partial enlarged structure of the Q1 region. In this embodiment, the first pad 201 and the second pad 202 in a pad group 20 are arranged along the second direction X2;

[0108] In the second direction X2, the first pad 201 and the second pad 202 of the same pad group 20 at least partially overlap.

[0109] This embodiment explains that the display panel 000 can be a transparent display panel, and the display area of ​​the display panel 000 can include a transparent display area AA, and the transparent display area AA can include a plurality of luminous areas LA and a plurality of light-transmitting areas TA, wherein the light-transmitting area TA is adjacent to the light-emitting area LA along a direction parallel to the plane where the substrate 10 is located, and the transmittance of the light-transmitting area TA is greater than the transmittance of the light-emitting area LA, so as to achieve a transparent display effect of the display panel 000, the plurality of light-transmitting areas TA are arranged along a first direction X1, and there is a pad group 20 between two adjacent light-transmitting areas TA along the first direction X1, and the first pad 201 and the second pad 202 in a pad group 20 are arranged along a second direction X2, then in the second direction X2, the first pad 201 and the second pad 202 of the same pad group 20 at least partially overlap, and in the second direction X2, the first pad 201 and the second pad 202 of the same pad group 20 at least partially overlap, and in the second direction X2, the first pad The first solder pad 201 and the second solder pad 202 may not completely overlap, but have an overlapping portion to avoid the first solder pad 201 and the second solder pad 202 being offset in the first direction X1, so that the first solder pad 201 and the second solder pad 202 of the same solder pad group 20 can be concentrated as much as possible at the same position between adjacent light-transmitting areas TA, and further, the first solder pad 201 and the second solder pad 202 of the same solder pad group 20 can be placed as much as possible in the middle position of the stack of traces below, and the first solder pad 201 and the second solder pad 202 of a solder pad group 20 can be kept in the same horizontal plane as much as possible. Since the first solder pad 201 and the second solder pad 202 of the same solder pad group 20 can be concentrated as much as possible above the same metal trace, the height difference problem between the first solder pad 201 and the second solder pad 202 can be better weakened, thereby improving the binding yield of the light-emitting device 30.

[0110] In some optional embodiments, please refer to Fig.23 , Fig.26 , Fig. 27 and Fig.28 , Fig.26 yes Fig.23 Schematic diagram of the local enlarged structure of the middle Q2 area, Fig. 27 is another schematic diagram of a planar structure of a display panel provided in an embodiment of the present invention (it can be understood that in order to clearly illustrate the structure of this embodiment, Fig. 27 Transparency filling is performed), Fig.28 yes Fig. 27A schematic diagram of a partially enlarged structure of the Q3 region. In this embodiment, when the shape of the orthographic projection of the first pad 201 and the second pad 202 on the substrate 10 is a regular shape, such as a rectangle as shown in the figure, in one pad group 20, the first pad 201 includes a first geometric center point 201O, and the second pad 202 includes a second geometric center point 201O;

[0111] A line connecting the first geometric center point 201O and the second geometric center point 201O is parallel to the second direction X2.

[0112] This embodiment explains that there is a pad group 20 between two adjacent light-transmitting areas TA along the first direction X1, and when the first pad 201 and the second pad 202 in a pad group 20 are arranged along the second direction X2, in order to make the first pad 201 and the second pad 202 of the same pad group 20 as close as possible to the middle position of the lower wiring stack, the distances from the two ends of the first pad 201 along the first direction X1 to the through holes 02K on both sides are as equal as possible, and the distances from the two ends of the second pad 202 along the first direction X1 to the through holes 02K on both sides are as equal as possible. , in a pad group 20, a line connecting the first pad 201 including the first geometric center point 201O and the second pad 202 including the second geometric center point 201O (it can be understood that the line is a virtual line, which is only used to clearly illustrate the parallel relationship with the second direction X2, and is not a line actually existing in the display panel) is parallel to the second direction X2, that is, when the lengths of the first pad 201 and the second pad 202 in the first direction X1 are equal, the first pad 201 and the second pad 202 are completely overlapped in the second direction X2 (such as Fig.23 and Fig.26 The lengths of the first pad 201 and the second pad 202 in the first direction X1 are not equal, as shown in FIG. Fig. 27 and Fig.28When the length of the second pad 202 in the first direction X1 is greater than the length of the first pad 201 in the first direction X1, the second pad 202 covers the first pad 201 in the second direction X2, and the first pad 201 is located at the center of the second pad 202. If the two light-transmitting areas TA on opposite sides of the same pad group 20 along the first direction X1 are named as the first light-transmitting area TA1 and the second light-transmitting area TA2, in this embodiment, the line connecting the first geometric center point 201O and the second geometric center point 201O is set to be parallel to the second direction X2, and the minimum distance D1 from the first geometric center point 201O to the first light-transmitting area TA1 is equal to the minimum distance D2 from the first geometric center point 201O to the second light-transmitting area TA2; the minimum distance D3 from the second geometric center point 202O to the first light-transmitting area TA1 is equal to the minimum distance D4 from the second geometric center point 202O to the second light-transmitting area TA2 (the minimum distance D3 from the second geometric center point 202O to the first light-transmitting area TA1 is equal to the minimum distance D4 from the second geometric center point 202O to the second light-transmitting area TA2 (the minimum distance D4 from the first geometric center point 201O to the second light-transmitting area TA2 is equal to the minimum distance D5 from the second geometric center point 202O to the first light-transmitting area TA1). The minimum distance D1 of a light-transmitting area TA1 can be understood as the distance between the first geometric center point 2010 and the edge of the first light-transmitting area TA1 on one side close to the light-emitting area LA), and optional D1=D3, D2=D4, so that the pad group 20 can be set in the center position between the two light-transmitting areas TA as much as possible, and the first pad 201 and the second pad 202 of the same pad group 20 can be placed in the middle position of the lower wiring stack as much as possible, ensuring that the first pad 201 and the second pad 202 of a pad group 20 are in the same horizontal plane, better weakening the height difference problem between the first pad 201 and the second pad 202, and improving the binding yield of the light-emitting device 30.

[0113] In some optional embodiments, please refer to Figure 1 and Figure 29-Figure 31 , Fig.29 yes Figure 1 Another cross-sectional structure schematic diagram along the A-A' direction, Fig.30 yes Figure 1 Another cross-sectional structure schematic diagram along the A-A' direction, Fig.31 yes Figure 1 Another cross-sectional structural diagram along the A-A' direction, in this embodiment, the display panel 000 further includes a thin film transistor array layer 012, optionally, a driving circuit layer 01 is included between the substrate 10 and the pad group 20, the thin film transistor array layer 012 may be a partial film layer in the driving circuit layer 01, and the thin film transistor array layer 012 is located on a side of the pad group 20 close to the substrate 10; the thin film transistor array layer 012 includes a plurality of thin film transistors T;

[0114] The thin film transistor array layer 012 includes a second metal layer 50, and the source TS and / or drain TD of the thin film transistor T are located in the second metal layer 50, and the second metal layer 50 is located on the side of the first metal part 401 and / or the second metal part 402 facing the substrate 10, or the first metal part 401 and / or the second metal part 402 are located in the second metal layer 50. Optionally, the source TS / drain TD of the thin film transistor T in this embodiment is electrically connected to the first pad 201 (the figure takes the drain TD of the thin film transistor T as an example for illustration), the light emitting device 30 is located on the side of the pad group 20 away from the substrate 10, the first pin 301 of the light emitting device 30 is an anode pin, the second pin 302 can be a cathode pin, the first pin 301 is bound and electrically connected to the first pad 201, and the second pin 302 is bound and electrically connected to the second pad 202.

[0115] This embodiment explains that the display panel 000 may also include a thin film transistor array layer 012 located between the pad group 20 and the substrate 10, and a driving circuit layer 01 is included between the substrate 10 and the pad group 20. The thin film transistor array layer 012 may be a partial film layer in the driving circuit layer 01. The thin film transistor array layer 012 is used to set a plurality of thin film transistors T. The thin film transistor array layer 012 of this embodiment includes at least a second metal layer 50, and the second metal layer 50 may be used to make a source TS and / or a drain TD of the thin film transistor T. Optionally, the thin film transistor array layer 012 may also include a third metal layer 60 and an active layer 70, the third metal layer 60 is located on the side of the second metal layer 50 facing the substrate 10, and the active layer 70 is located on the side of the third metal layer 60 facing the substrate 10. The third metal layer 60 may be used to make a gate TG of the thin film transistor T, and the active layer 70 may be used to make an active portion TP of the thin film transistor T. As shown in FIG. Fig.29 As shown, the second metal layer 50 of this embodiment is located on the side of the first metal part 401 and / or the second metal part 402 facing the substrate 10, that is, when the first metal part 401 and the second metal part 402 are arranged in the same layer, such as when they are both located in the first metal layer 40, the first metal layer 40 can be located on the side of the second metal layer 50 away from the substrate 10, and the first metal layer 40 where the first metal part 401 and the second metal part 402 are located is a metal film layer closest to the pad group 20. At this time, in order to provide a driving signal for the light-emitting device 30, the thin film transistor T needs to be set to electrically connect the drain TD of the thin film transistor T with the first pin 301 (anode pin) of the light-emitting device 30, then the drain TD of the thin film transistor T can be electrically connected to the first metal part 401 through a first via K1, and then the first metal part 401 is electrically connected to the first pad 201 through a second via K2, and then after the light-emitting device 30 is bound to the pad group 20, the thin film transistor T is electrically connected to the light-emitting device 30, and then the transmission of the driving signal is realized.

[0116] Optional, such as Fig.29 As shown, the second metal portion 402 is located in the first metal layer 40, then in the direction perpendicular to the plane of the substrate 10, directly below the first pad 201 at least includes the first metal portion 401 located in the first metal layer 40 and the drain TD located in the second metal layer 50. Therefore, in order to further reduce the height difference between the first pad 201 and the second pad 202, the second metal layer 50 of this embodiment may also include a first metal pad layer 501, and the first metal pad layer 501 is located directly below the second pad 202, that is, directly below the second metal portion 402. The setting of the first metal pad layer 501 in the second metal layer 50 can further raise the position of the second pad 202 and keep the first pad 201 and the second pad 202 on the same horizontal plane as much as possible. It is understandable that the first metal pad layer 501 can be reused as the data line in the display panel 000, that is, the original metal structure that may exist in the second metal layer 50 in the display panel can be used as the first metal pad layer 501, avoiding the need to set up a separate pad layer structure in the display panel 000 to affect the transmittance of the display panel.

[0117] Further optional, such as Fig.29 As shown, in this embodiment, if the first metal part 401 and the second metal part 402 are symmetrical about an axis of symmetry, the drain TD of the thin film transistor T and the first metal pad 501 can also be symmetrical about the axis of symmetry in the second metal layer 50, which is beneficial to make the elevation effect of the drain TD of the thin film transistor T and the first metal pad 501 uniform, and avoid the first metal part 401 and the second metal part 402 being unevenly elevated by the drain TD of the thin film transistor T and the first metal pad 501, causing a large height difference between the first pad 201 and the second pad 202, thereby affecting the flatness.

[0118] like Fig.30As shown, the first metal portion 401 and / or the second metal portion 402 of the present embodiment are located in the second metal layer 50, that is, when the first metal portion 401 and the second metal portion 402 are arranged in the same layer, they can both be located in the second metal layer 50 where the source TS and / or the drain TD of the thin film transistor T are located, and the second metal layer 50 where the first metal portion 401 and the second metal portion 402 are located is a metal film layer closest to the pad group 20. At this time, in order to provide a driving signal for the light-emitting device 30, the drain TD of the thin-film transistor T needs to be set to be electrically connected to the first pin 301 (anode pin) of the light-emitting device 30. Then, the drain TD of the thin-film transistor T can be connected to the first metal part 401 in the same layer, such as by direct contact (it can be understood that the drain TD of the thin-film transistor T at this time can also be understood as the first metal part 401, that is, the first pad 201 includes two directly contacting first metal parts 401, and the overall overlapping area with the first pad 201 is S1), and then electrically connected to the first pad 201 through a third via K3, and then after the light-emitting device 30 is bound to the pad group 20, the electrical connection effect of the thin-film transistor T and the light-emitting device 30 is achieved, thereby realizing the transmission of the driving signal.

[0119] Further optional, such as Fig.30 As shown, in this embodiment, if the first metal part 401 and the second metal part 402 are symmetrical about an axis of symmetry, the overall structure formed by the drain TD of the thin film transistor T and the first metal part 401 and the second metal part 402 can also be symmetrical about the axis of symmetry within the second metal layer 50, which is beneficial to uniformize the effect of raising the first pad 201 and the second pad 202, avoiding a large height difference between the first pad 201 and the second pad 202, thereby affecting the flatness.

[0120] like Fig.31As shown, the first metal portion 401 and / or the second metal portion 402 of the present embodiment are located in the second metal layer 50, that is, when the first metal portion 401 and the second metal portion 402 are arranged in the same layer, they can both be located in the second metal layer 50 where the source TS and / or the drain TD of the thin film transistor T are located, and the second metal layer 50 where the first metal portion 401 and the second metal portion 402 are located is a metal film layer closest to the pad group 20. At this time, in order to provide a driving signal for the light-emitting device 30, the thin film transistor T needs to set the drain TD of the thin film transistor T to be electrically connected to the first pin 301 (anode pin) of the light-emitting device 30, then the drain TD of the thin film transistor T can be understood as the first metal part 401 of this embodiment, that is, the first metal part 401 and the drain TD of the thin film transistor T are reused, and the first metal part 401 is electrically connected to the first pad 201 through a fourth via K4, which can be understood as realizing the electrical connection between the drain TD of the thin film transistor T and the first pad 201, and then after the light-emitting device 30 is bound to the pad group 20, the electrical connection effect of the thin film transistor T and the light-emitting device 30 is realized, thereby realizing the transmission of the driving signal.

[0121] Further optional, such as Fig.31 As shown, in this embodiment, if the first metal part 401 and the second metal part 402 are symmetrical about an axis of symmetry, the drain TD of the thin film transistor T (reused as the first metal part 401) and the second metal part 402 can also be symmetrical about the axis of symmetry within the second metal layer 50, which is beneficial to uniformize the effect of raising the first pad 201 and the second pad 202, avoiding a large height difference between the first pad 201 and the second pad 202, thereby affecting the flatness.

[0122] In some optional embodiments, please refer to Fig.23 and Fig.32 , Fig.32 yes Fig.23Schematic diagram of the cross-sectional structure along the C-C' direction in the middle, in this embodiment, the display panel 000 can be a transparent display panel, the display area of ​​the display panel 000 can include a transparent display area AA, the transparent display area AA can include a plurality of luminous areas LA and a plurality of light-transmitting areas TA, wherein along a direction parallel to the plane where the substrate 10 is located, the light-transmitting area TA is adjacent to the light-emitting area LA, and the transmittance of the light-transmitting area TA is greater than the transmittance of the light-emitting area LA, so as to achieve a transparent display effect of the display panel 000, the plurality of light-transmitting areas TA are arranged along a first direction X1, and there is a pad group 20 between two adjacent light-transmitting areas TA along the first direction X1, then the first pad 201 and the second pad 202 in one pad group 20 are arranged along a second direction X2, which is different from the arrangement direction of the light-transmitting area TA, so that the first pad 201 and the second pad 202 of the same pad group 20 can be arranged as far as possible It may be in the middle position of the lower wiring stack. At this time, the lower wiring stack structure may include a thin film transistor T and a signal line J1 (which may be a data line) connected to the drain TD of the thin film transistor T, and may also include a storage capacitor Cst, etc. The signal line J1 connected to the drain TD of the thin film transistor T can be used as the first metal part 401 and / or the second metal part 402, that is, when the first pad 201 and the second pad 202 in a pad group 20 in this embodiment are arranged along the second direction X2, the first pad 201 and the second pad 202 can be concentrated and arranged directly above the lower metal structure. Since the first pad 201 and the second pad 202 of the same pad group 20 can be concentrated as much as possible above the same signal line J1, it can be ensured that the first pad 201 and the second pad 202 of a pad group 20 are in the same plane as much as possible. Fig.32 As shown, the height difference between the first pad 201 and the second pad 202 can be better weakened, thereby improving the binding yield of the light-emitting device 30.

[0123] Optionally, since the first pad 201 and the second pad 202 of the same pad group 20 can be arranged as concentrated as possible above the same signal line J1, even if the first pad 201 and the second pad 202 of the same pad group 20 are not on the same horizontal plane, they can be ensured to be on the same plane as much as possible, such as Fig.33 As shown, Fig.33 yes Fig.23Another cross-sectional structural schematic diagram along the C-C' direction, due to process errors that may exist during the manufacturing process, the side of the signal line J1 that is away from the substrate 10 may not be a standard horizontal plane, and may have a certain inclination, that is, an inclined plane, and the angle α between the surface of the first pad 201 facing the substrate 10 and the horizontal plane can be set to be less than 3°, and within the range of this angle α, it can be considered that it does not affect the binding yield of the light-emitting device 30. Since the first pad 201 and the second pad 202 of the same pad group 20 are arranged along the second direction X2 and are concentrated above the same signal line J1, the inclinations of the first pad 201 and the second pad 202 of the same pad group 20 are also basically the same, and the angle α is less than 3°, which can avoid the problem that the first pad 201 and the second pad 202 of the same pad group 20 are not at the same height, that is, the height difference between the first pad 201 and the second pad 202 can be better weakened, thereby improving the binding yield of the light-emitting device 30.

[0124] In some optional embodiments, the second solder pad 202 in this embodiment can be bound and electrically connected to the second pin 302 of the light-emitting device 30. The second pin 302 can be understood as the cathode pin of the light-emitting device 30. Since the cathode pin can be connected to the same potential signal, multiple second solder pads 202 of multiple different solder pad groups 20 in this embodiment can be electrically connected together to achieve a common cathode signal for multiple second solder pads 202 in the display panel 000.

[0125] Optional, such as Figure 7 and Fig.34 As shown, Fig.34 is another schematic diagram of a planar structure of a display panel provided in an embodiment of the present invention (it can be understood that in order to clearly illustrate the structure of this embodiment, Fig.34 Transparency filling is performed), the display panel in this embodiment includes a pad connection line JL;

[0126] The plurality of second pads 202 of different pad groups 20 are electrically connected to each other through pad connection lines JL, and the pad connection lines JL are insulated from the first pads 201;

[0127] The pad group 20 includes an electrode layer 20A and a eutectic layer 20B located on a side of the electrode layer 20A away from the substrate 10;

[0128] The pad connection line JL is provided in the same layer as the electrode layer 20A.

[0129] This embodiment explains that there is a pad group 20 between two adjacent light-transmitting areas TA along the first direction X1, and the first pad 201 and the second pad 202 in a pad group 20 are arranged along the second direction X2. The first pin 301 of the light-emitting device 30 can be an anode pin, and the first pin 301 is bound and electrically connected to the first pad 201. The first pin 301 can be understood as the anode pin of the light-emitting device 30. Therefore, the multiple first pads 201 of different pad groups 20 are insulated from each other, so that each light-emitting device 30 can be driven to emit light independently. The second pad 202 can be bound and electrically connected to the second pin 302 of the light-emitting device 30. The second pin 302 can be understood as the cathode pin of the light-emitting device 30. Since the cathode pin can be connected to the same potential signal, as shown in FIG. Fig.34 As shown, in this embodiment, multiple second pads 202 of different pad groups 20 can be electrically connected to each other through pad connection lines JL, so as to realize that multiple second pads 202 in the display panel 000 are commonly supplied with cathode signals. Since the film layer where the pad group 20 is located has fewer conductive structures, the pad connection lines JL can be set in the same film layer as the pad group 20, which can not only avoid occupying space when the pad connection lines JL are set in the driving circuit layer 01, thereby saving wiring space in the driving circuit layer 01, but also reduce the difficulty of connecting the second pads 202 with the pad connection lines JL, which is conducive to improving process efficiency.

[0130] like Figure 7 As shown, the pad group 20 includes an electrode layer 20A and a eutectic layer 20B located on the side of the electrode layer 20A away from the substrate 10. The electrode layer 20A may include a first electrode 20A1 and a second electrode 20A2 made of a metal conductive material; the eutectic layer 20B may be made of a high melting point eutectic material, such as a eutectic material of solder and silver or gold. The area where the eutectic layer 20B overlaps with the first electrode 20A1 of the electrode layer 20A can be understood as the area of ​​the first pad 201 in this embodiment, and the area where the eutectic layer 20B overlaps with the second electrode 20A2 of the electrode layer 20A can be understood as the area of ​​the second pad 202 in this embodiment. The pad connecting line JL of this embodiment can be set in the same layer as the electrode layer 20A in the film layer where the pad group 20 is located, that is, the material for making the pad connecting line JL also adopts a metal conductive material.

[0131] In some optional embodiments, please refer to Figure 35-Figure 38 , Fig.35 is another schematic diagram of a planar structure of a display panel provided by an embodiment of the present invention, Fig.36 yes Fig.35 A schematic diagram of the local enlarged structure of the middle Q4 area. Fig.37 is another schematic diagram of a planar structure of a display panel provided by an embodiment of the present invention, Fig.38 yes Fig.37A schematic diagram of a partially enlarged structure of the Q5 region in the middle (it can be understood that in order to clearly illustrate the structure of this embodiment, Fig.35 and Fig.37 Transparency filling is performed), the display panel 000 in this embodiment includes a pad connection line JL;

[0132] The plurality of second pads 202 of different pad groups 20 are electrically connected to each other through pad connection lines JL, and the pad connection lines JL are insulated from the first pads 201;

[0133] The shape of the orthographic projection of the pad connection line JL on the substrate includes a wave shape or a bow shape.

[0134] This embodiment explains that there is a pad group 20 between two adjacent light-transmitting areas TA along the first direction X1, and the first pad 201 and the second pad 202 in a pad group 20 are arranged along the second direction X2. The first pin 301 of the light-emitting device 30 can be an anode pin, and the first pin 301 is bound and electrically connected to the first pad 201. The first pin 301 can be understood as the anode pin of the light-emitting device 30. Therefore, the multiple first pads 201 of different pad groups 20 are insulated from each other, so that each light-emitting device 30 can be driven to emit light independently. The second pad 202 can be bound and electrically connected to the second pin 302 of the light-emitting device 30. The second pin 302 can be understood as the cathode pin of the light-emitting device 30. Since the cathode pin can be connected to the same potential signal, as shown in FIG. Fig.35 and Fig.37 As shown, in this embodiment, multiple second pads 202 of different pad groups 20 can be electrically connected to each other through pad connection lines JL, so as to realize that multiple second pads 202 in the display panel 000 are commonly supplied with cathode signals. Since the film layer where the pad group 20 is located has fewer conductive structures, the pad connection lines JL can be set in the same film layer as the pad group 20, which can not only avoid occupying space when the pad connection lines JL are set in the driving circuit layer 01, thereby saving wiring space in the driving circuit layer 01, but also reduce the difficulty of connecting the second pads 202 with the pad connection lines JL, which is conducive to improving process efficiency.

[0135] In this embodiment, the shape of the positive projection of the pad connection line JL on the substrate 10 includes a wave shape or a bow shape, which can avoid that the pad connection line JL is only located on the same side of the pad group 20 when it is a straight line, and avoid that the pad connection line JL is only on the side of the pad group 20 facing the first light-transmitting area TA1, or can avoid that the pad connection line JL is only on the side of the pad group 20 facing the second light-transmitting area TA2, resulting in the pad group 20 having a metal conductive structure on one side of the first direction X1, and only having the pad connection line JL on the side of the pad group 20 facing the first light-transmitting area TA1, and no pad connection line with the metal conductive structure on the other side, causing uneven flatness of the light-emitting area LA, thereby affecting the light output quality of the light-emitting device 30. Optionally, as Figure 35-Figure 38 As shown, along the direction parallel to the plane where the substrate 10 is located, the first pad 201 and the second pad 202 of the same pad group 20 are located on different sides of the pad connection line JL; multiple first pads 201 of different pad groups 20 are located on the same side of the pad connection line JL, and multiple second pads 202 of different pad groups 20 are located on the same side of the pad connection line JL. Optionally, as Fig.39 and Fig.40 As shown, Fig.39 is another schematic diagram of a planar structure of a display panel provided by an embodiment of the present invention, Fig.40 yes Fig.39 A partial enlarged structural diagram of the Q6 region in the middle (it can be understood that in order to clearly illustrate the structure of this embodiment, Fig.39 (with transparency filled) Along the direction parallel to the plane where the substrate 10 is located, the first pad 201 and the second pad 202 of the same pad group 20 are located on the same side of the pad connection line JL; two adjacent pad groups 20 are located on different sides of the pad connection line JL. In this embodiment, by designing the shape of the positive projection of the pad connection line JL on the substrate 10 to be a wave shape or a bow shape or other structures that are evenly wound on both sides of the pad group 20, the film thickness of the pad group 20 in the first direction X1 can be balanced, which is conducive to the light-emitting device 30 of the light-emitting area LA being finally bound to a film surface with high flatness, thereby improving the binding yield of the light-emitting device 30 and improving the light output quality.

[0136] In some alternative embodiments, please refer to Fig.41 , Fig.41 1 is a schematic diagram of a planar structure of a display device provided in an embodiment of the present invention. The display device 111 provided in this embodiment includes the display panel 000 provided in the above embodiment of the present invention. Fig.41The embodiment only takes a mobile phone as an example to illustrate the display device 111. It can be understood that the display device 111 provided in the embodiment of the present invention can be a computer, a television, a car display device or other display device 111 with a display function, and the present invention does not specifically limit this. The display device 111 provided in the embodiment of the present invention has the beneficial effects of the display panel 000 provided in the embodiment of the present invention. For details, please refer to the specific description of the display panel 000 in the above embodiments, and this embodiment will not be repeated here.

[0137] It can be seen from the above embodiments that the display panel and the display device provided by the present invention achieve at least the following beneficial effects:

[0138] The display panel provided by the present invention includes a substrate, which can be used as a supporting base of the display panel, and other structures of the display panel can be made on the substrate. One side of the substrate includes a plurality of pad groups, at least one pad group is arranged corresponding to a light-emitting device, and a pad group includes a first pad and a second pad, the first pad of the pad group is bound to the first pin of the light-emitting device, and the second pad of the pad group is bound to the second pin of the light-emitting device. The display panel includes a first metal part and a second metal part on the side of the pad group close to the substrate. In the pad group corresponding to the same light-emitting device, when there is a first metal part directly below the first pad and a second metal part directly below the second pad, the overlapping area of ​​the first pad and the first metal part is substantially equal to the overlapping area of ​​the second pad and the second metal part, and satisfies Thus, the first pad and the second pad can be kept basically on the same horizontal plane, and the height difference between the first pad and the second pad in the direction perpendicular to the plane where the substrate is located can be avoided as much as possible, which is conducive to improving the flatness of the first pad and the second pad corresponding to the same light-emitting device. Or when the first metal part is not arranged directly below the first pad, and the second metal part is not arranged directly below the second pad, no metal part is arranged below the first pad and the second pad corresponding to a pad group to destroy its flatness, and then when the light-emitting device is subsequently bound to a pad group, it can be avoided as much as possible that there is a metal part directly below one pad in the same pad group to raise the film layer, while there is no metal part under the other pad, resulting in poor flatness of the pad group before the light-emitting device is bound, resulting in a problem of cold welding or poor contact between the light-emitting device and the pad group, and the height difference between the first pad and the second pad in the direction perpendicular to the plane where the substrate is located can be avoided as much as possible, which is conducive to ensuring the electrical connection stability when the light-emitting device is bound to the first pad and the second pad in the pad group, improving the binding yield, and then improving the product yield, which is conducive to improving the display quality.

[0139] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A display panel, characterized in that: include: substrate; A plurality of pad groups located on one side of the substrate, wherein one pad group includes a first pad and a second pad; at least one pad group corresponds to a light-emitting device; in one pad group, a first pin of the light-emitting device is bound and electrically connected to the first pad, and a second pin of the light-emitting device is bound and electrically connected to the second pad; A first metal portion and a second metal portion located on a side of the pad group close to the substrate; in, In the pad group corresponding to the same light-emitting device, in a direction perpendicular to the plane where the substrate is located, the first pad at least partially overlaps with the first metal portion, the second pad at least partially overlaps with the second metal portion, the area of ​​overlap between the first pad and the first metal portion is S1, and the area of ​​overlap between the second pad and the second metal portion is S2. Alternatively, in the pad group corresponding to the same light-emitting device, in a direction perpendicular to the plane where the substrate is located, the first pad does not overlap with the first metal portion, and the second pad does not overlap with the second metal portion; The display panel further comprises a plurality of light-emitting areas and a plurality of light-transmitting areas, the light-emitting area comprises at least one light-emitting device, and the orthographic projection of the pad group on the substrate is located in the light-emitting area; The display panel further comprises at least one insulating layer, the insulating layer being located on a side of the pad group close to the substrate, and the insulating layer comprising a through hole located in the light-transmitting area; In one of the pad groups, along a direction parallel to the plane where the substrate is located, the minimum distance from the first pad to the through hole is W1, and the minimum distance from the second pad to the through hole is W2, wherein |W1-W2|≤1.1 μm.

2. The display panel according to claim 1, characterized in that: The first metal portion and the second metal portion are disposed in the same layer.

3. The display panel according to claim 2, characterized in that: The display panel further includes a first metal layer located on a side of the pad group close to the substrate, the first metal portion and the second metal portion are both located on the first metal layer, and no other metal layer is included between the first metal layer and the pad group.

4. The display panel according to claim 1, characterized in that: In the pad group corresponding to the same light-emitting device, in a direction perpendicular to the plane where the substrate is located, the first pad at least partially overlaps with the first metal portion, and the second pad at least partially overlaps with the second metal portion; In the pad group corresponding to the same light-emitting device, the orthographic projection of the first metal part overlapping with the first pad on the substrate covers the orthographic projection of the first pad on the substrate, and the orthographic projection of the second metal part overlapping with the second pad on the substrate covers the orthographic projection of the second pad on the substrate.

5. The display panel according to claim 1, characterized in that: In the pad group corresponding to the same light-emitting device, in a direction perpendicular to the plane where the substrate is located, the first pad does not overlap with the first metal portion, and the second pad does not overlap with the second metal portion; In the pad group corresponding to the same light-emitting device, in a direction parallel to the plane where the substrate is located, the minimum distance from the first metal part to the first pad is greater than 8.5 μm, and the minimum distance from the second metal part to the second pad is greater than 8.5 μm.

6. The display panel according to claim 1, characterized in that: W1≥7.5μm, W2≥7.5μm.

7. The display panel according to claim 1, characterized in that: The insulating layer is an organic layer, the organic layer is located on a side of the first metal portion and / or the second metal portion close to the pad group, and the organic layer is in direct contact with the first metal portion and / or the second metal portion.

8. The display panel according to claim 1, characterized in that: The plurality of light-transmitting areas are arranged along a first direction, and there is a pad group between two adjacent light-transmitting areas along the first direction; The first pads and the second pads in one pad group are arranged along a second direction, wherein the first direction and the second direction intersect in a direction parallel to a plane where the substrate is located.

9. The display panel according to claim 8, characterized in that: The display panel further comprises a thin film transistor array layer, and the thin film transistor array layer is located on a side of the pad group close to the substrate; the thin film transistor array layer comprises a plurality of thin film transistors; The source / drain of the thin film transistor is electrically connected to the first pad; The plurality of second pads in different pad groups are electrically connected to each other.

10. The display panel according to claim 9, characterized in that: The display panel includes a pad connection line; The plurality of second pads in different pad groups are electrically connected to each other through the pad connection wires, and the pad connection wires are insulated from the first pads; The pad group includes an electrode layer and a eutectic layer located on a side of the electrode layer away from the substrate, and an area where the eutectic layer and the electrode layer overlap is the first pad or the second pad; The pad connection line is arranged in the same layer as the electrode layer.

11. The display panel according to claim 9, characterized in that: The display panel includes a pad connection line; The plurality of second pads in different pad groups are electrically connected to each other through the pad connection wires, and the pad connection wires are insulated from the first pads; The shape of the orthographic projection of the pad connection line on the substrate includes a wave shape or a bow shape.

12. The display panel according to claim 11, characterized in that: Along the direction parallel to the plane where the substrate is located, the first pad and the second pad of the same pad group are located on different sides of the pad connecting line; the multiple first pads of different pad groups are located on the same side of the pad connecting line, and the multiple second pads of different pad groups are located on the same side of the pad connecting line.

13. The display panel according to claim 11, characterized in that: Along a direction parallel to the plane where the substrate is located, the first pad and the second pad of the same pad group are located on the same side of the pad connection line; and two adjacent pad groups are located on different sides of the pad connection line.

14. A display device, characterized in that: A display panel comprising any one of claims 1-13.

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