Drive circuits and electronic devices

Abstract

This application discloses an electronic device and a driving circuit. The electronic device includes a load, a power module, a cooling channel, and an electromagnetic pump assembly. The electromagnetic pump assembly includes one or more electromagnetic pumps. The cooling channel is connected to the electromagnetic pumps and contains a working fluid for cooling. The power module, the electromagnetic pump assembly, and the load are connected in series. The electromagnetic pumps in the electromagnetic pump assembly are connected in series or in parallel. The power module outputs a high-current power signal to each electromagnetic pump and the load. The electromagnetic pump assembly drives the working fluid to flow in the cooling channel under the influence of the power signal. By using the embodiments of this application, the problems of large size, low efficiency, and severe heat generation caused by configuring a separate power module for the electromagnetic pumps can be avoided. This can effectively improve the heat dissipation efficiency of the electronic device and meet the heat dissipation requirements of the system.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and in particular to a drive circuit and electronic device. Background Technology

[0002] Liquid metal exhibits superior heat transfer performance compared to conventional working fluids such as water or fluorinated liquids. It can be driven by an electromagnetic pump with no moving parts to flow through cooling channels, thus achieving high-performance heat dissipation. Typically, electromagnetic pumps operate under low voltage and high current conditions, therefore placing stringent power supply requirements on the power module.

[0003] In the process of developing this application, the inventors discovered that the related technology has at least the following problems: Existing technologies typically configure a power supply module separately for the electromagnetic pump to meet its power supply requirements. However, the power supply module is large in size and has low conversion efficiency, leading to difficulties in system integration and high heat dissipation. Summary of the Invention

[0004] This application provides a driving circuit and electronic device. This application can avoid the problems of large size, low efficiency and serious heat generation caused by configuring a power supply module separately for the electromagnetic pump group. It can effectively improve the heat dissipation efficiency of electronic devices and meet the heat dissipation requirements of the system.

[0005] In a first aspect, embodiments of this application provide an electronic device, including a load, a power module, a cooling channel, and an electromagnetic pump assembly, wherein the electromagnetic pump assembly includes one or more electromagnetic pumps; the cooling channel is connected to the electromagnetic pumps and contains a working fluid for cooling; the power module, the electromagnetic pump assembly, and the load are connected in series sequentially; the electromagnetic pumps in the electromagnetic pump assembly are connected in series or in parallel; the power module is used to output a power signal with a large current to each electromagnetic pump and the load; the electromagnetic pump assembly is used to drive the working fluid to flow in the cooling channel under the action of the power signal.

[0006] By using the embodiments of this application, the power module, the electromagnetic pump group and the load are connected in series in sequence, and the power module is used to output a large current power signal to simultaneously meet the needs of the electromagnetic pump group and the load. Therefore, the embodiments of this application can use a single power module (such as the power module corresponding to the load in the existing design) to supply power to both the electromagnetic pump group and the load at the same time, avoiding the problems of large size, low efficiency and serious heat generation caused by configuring a separate power module for the electromagnetic pump group.

[0007] In conjunction with the first aspect, in one possible design, the electronic device further includes a power management unit electrically connected to the electromagnetic pump assembly for detecting the status of the electromagnetic pump assembly. Based on this design, the power management unit can monitor the operating status of the electromagnetic pump assembly in real time, thereby ensuring the normal operation of the load.

[0008] In conjunction with the first aspect, in one possible design, the electronic device further includes a switch. A first terminal of the switch is electrically connected to the power management unit, a second terminal of the switch is electrically connected between the power module and the electromagnetic pump assembly, and a third terminal of the switch is electrically connected between the electromagnetic pump assembly and the load. Based on this design, the state of the switch can be controlled according to the operating state of the electromagnetic pump assembly, ensuring the normal operation of the load and enhancing system reliability.

[0009] In conjunction with the first aspect, in one possible design, the electronic device further includes a first resistor, a first end of which is electrically connected to a third end of the switch, and a second end of which is electrically connected between the electromagnetic pump assembly and the load.

[0010] In conjunction with the first aspect, in one possible design, the power management unit is used to output a first signal to the switch when the electromagnetic pump group is in normal operation, to control the switch to open; and to output a second signal to the switch when the electromagnetic pump group is in abnormal operation, to control the switch to close. Based on this design, the state of the switch can be controlled according to the operating state of the electromagnetic pump group, ensuring the normal operation of the load and enhancing system reliability.

[0011] In conjunction with the first aspect, in one possible design, the electronic device further includes a second resistor, with a first terminal electrically connected between the power supply module and the electromagnetic pump assembly, and a second terminal electrically connected between the electromagnetic pump assembly and the load. This design increases the dynamic response capability of the power supply circuit to the load.

[0012] In conjunction with the first aspect, in one possible design, the load is a central processing unit (CPU), and the power supply module is the power supply module corresponding to the CPU. Based on this design, the power supply module corresponding to the CPU outputs a high-current power signal to both the electromagnetic pump assembly and the CPU, thus simultaneously meeting the needs of both.

[0013] In conjunction with the first aspect, in one possible design, the load is a graphics processing unit (GPU), and the power supply module is the power supply module corresponding to the GPU. Based on this design, the power supply module corresponding to the GPU outputs a high-current power signal to both the electromagnetic pump assembly and the GPU, thus simultaneously meeting the needs of both.

[0014] Secondly, embodiments of this application also provide a driving circuit, which is applied to an electronic device. The electronic device includes a load, and the driving circuit includes a power module and an electromagnetic pump group. The power module, the electromagnetic pump group, and the load are connected in series in sequence. Each electromagnetic pump in the electromagnetic pump group is connected in series or in parallel. The power module is used to output a power signal with a large current to each electromagnetic pump in the electromagnetic pump group and the load. The electromagnetic pump group is used to drive the working fluid in the cooling channel to flow under the action of the power signal.

[0015] In this embodiment, the power module, electromagnetic pump group, and load are connected in series in sequence, and the power module's characteristic of outputting a large current power signal is used to simultaneously meet the needs of the electromagnetic pump group and the load. Therefore, this embodiment can avoid the problems of large size, low efficiency, and severe heat generation caused by configuring a power module separately for the electromagnetic pump group.

[0016] In conjunction with the second aspect, in one possible design, the drive circuit further includes a power management unit electrically connected to the electromagnetic pump assembly for detecting the status of the electromagnetic pump assembly. The power management unit can monitor the operating status of the electromagnetic pump assembly in real time, thereby ensuring the normal operation of the load.

[0017] In conjunction with the second aspect, in one possible design, the electronic device further includes a switch and a first resistor. The first terminal of the switch is electrically connected to the power management unit, the second terminal of the switch is electrically connected between the power module and the electromagnetic pump assembly, and the third terminal of the switch is electrically connected between the electromagnetic pump assembly and the load. The first terminal of the first resistor is electrically connected to the third terminal of the switch, and the second terminal of the first resistor is electrically connected between the electromagnetic pump assembly and the load. Based on this design, the state of the switch can be controlled according to the operating state of the electromagnetic pump assembly, ensuring the normal operation of the load and enhancing system reliability.

[0018] In conjunction with the second aspect, in one possible design, the electronic device further includes a second resistor, with a first terminal electrically connected between the power supply module and the electromagnetic pump assembly, and a second terminal electrically connected between the electromagnetic pump assembly and the load. Based on this design, embodiments of this application can increase the dynamic response capability of the power supply circuit to the load.

[0019] In the embodiments of this application, the power module, electromagnetic pump group, and load are connected in series sequentially. The power module's ability to output a large current signal simultaneously satisfies the requirements of both the electromagnetic pump group and the load. Therefore, this embodiment avoids the problems of large size, low efficiency, and severe heat generation associated with configuring a separate power module for the electromagnetic pump group. Furthermore, it saves internal space in the electronic device and improves the efficiency of the drive circuit. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the heat dissipation system provided in an embodiment of this application.

[0021] Figure 2 This is a schematic diagram of the electronic device provided in the embodiments of this application.

[0022] Figure 3 This is a circuit diagram of a driving circuit provided in the first embodiment of this application.

[0023] Figure 4 This is a circuit diagram of a driving circuit provided in the second embodiment of this application.

[0024] Figure 5 This is a schematic diagram of the resistance of the electromagnetic pump assembly in an embodiment of this application.

[0025] Figure 6 This is a circuit diagram of a driving circuit provided in the third embodiment of this application.

[0026] Figure 7 This is a schematic diagram showing the relationship between load power consumption and current in an embodiment of this application.

[0027] Figure 8 This is another schematic diagram showing the relationship between load power consumption and current in an embodiment of this application.

[0028] Explanation of main component symbols

[0029] Cooling system 100

[0030] Drive circuit 200

[0031] Heat exchanger 10

[0032] Central Processing Unit 12

[0033] Cooling channels 20, 22

[0034] Power Module 301

[0035] Electromagnetic pump sets 30, 302

[0036] Load 303

[0037] Bypass circuit 304

[0038] Power Management Unit 305

[0039] Shunt circuit 306

[0040] Radiator 40

[0041] Heat dissipation equipment 42

[0042] Working fluid 50

[0043] First node P1

[0044] Second node P2

[0045] Switch SW1

[0046] Capacitor C1

[0047] Resistors R1-R5

[0048] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0050] In the following description, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more. Directional terms such as "upper," "lower," "left," and "right" are defined relative to the indicated orientation of the components in the accompanying drawings. It should be understood that these directional terms are relative concepts used for relative description and clarification, and they may change accordingly depending on the orientation of the components in the accompanying drawings.

[0051] In this application, unless otherwise expressly specified and limited, the term "connection" shall be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. The term "and / or" as used herein includes any and all combinations of one or more of the related listed items.

[0052] The proposed solution in this application is to use flowing liquid metal for heat dissipation. The liquid metal is driven to flow in the cooling channel by an electromagnetic pump group without moving parts, so as to transfer and dissipate heat, thereby achieving high-performance heat dissipation and ensuring good working stability, safety and reliability. It also has the advantages of long service life and more efficient heat conduction and heat dissipation capacity compared with traditional water cooling shells.

[0053] To achieve more efficient heat dissipation, this application provides a heat dissipation system based on flowing liquid metal. Please refer to... Figure 1 , Figure 1 This is a schematic diagram of a heat dissipation system 100 according to an embodiment of this application.

[0054] In one possible implementation, the heat dissipation system 100 can be applied to electronic devices, such as mobile phones, laptops, servers, and other compact electronic devices with high heat flux density.

[0055] like Figure 1 As shown, the heat dissipation system 100 is used to be installed on the heat source. The heat dissipation system 100 may include a heat exchanger 10, a cooling channel 20, an electromagnetic pump group 30, and a radiator 40.

[0056] In this embodiment, the heat exchanger 10 is disposed on the heat source and is used to absorb the heat generated by the heat source. The cooling channel 20 passes through the heat exchanger 10 and the electromagnetic pump assembly 30 to form a closed cooling channel cavity. The interior of the cooling channel cavity is filled with a working fluid 50, such as liquid metal. The electromagnetic pump assembly 30 can be used to circulate the working fluid 50 within the cooling channel cavity. The radiator 40 is disposed on the cooling channel 20.

[0057] In one embodiment, the heat dissipation system 100 is provided on the heat source, the cooling channel 20 passes through the heat exchanger 10, and the electromagnetic pump group 30 drives the working fluid 50 in the cooling channel 20 to circulate. The flowing working fluid can pass through the heat exchanger 10 to remove the heat from the heat source and transfer the heat to the radiator 40 with a large surface area.

[0058] It is understood that the radiator 40 is used to expand the circulation area of ​​the working fluid 50 and diffuse the heat carried by the working fluid 50 to the outside. In this embodiment of the application, there is no strict requirement for the type of radiator 40, as long as it can dissipate heat to the outside.

[0059] Because liquid metals are liquid at room temperature and have low melting point, high boiling point, low viscosity, high electrical conductivity, and high thermal conductivity, and their chemical properties are stable, they can be a good liquid cooling heat dissipation medium.

[0060] It is understandable that the thermal conductivity of liquid metal is tens of times that of deionized water. When liquid metal flows through the heat exchanger 10 to absorb heat and dissipates it through the radiator 40, the rate at which it transfers heat is much higher than that of deionized water.

[0061] The heat dissipation system 100 provided in this application embodiment can effectively improve the heat dissipation capacity and efficiency of the entire heat dissipation system 100 by increasing the thermal conductivity of the working fluid 50.

[0062] In one possible design, the material used for the cooling channel 20 may be a non-magnetic refractory metal, a thermally conductive plastic, or a composite of a non-magnetic refractory metal and a thermally conductive plastic.

[0063] Please see Figure 2 In addition, a more specific application scenario is provided in the embodiments of this application, as follows: the above-mentioned electronic device can be a laptop computer.

[0064] The following description uses an example of applying the heat dissipation system 100 to a laptop computer. The laptop computer includes a keyboard side and a display screen side.

[0065] The central processing unit (CPU) 12 in the laptop computer can serve as the heat source in this embodiment, and the electromagnetic pump assembly 302 serves as the power source for heat dissipation in the laptop computer, driving the liquid metal to flow in the cooling channel 22. The electromagnetic pump assembly 302 can be located on the keyboard side of the laptop computer. In this embodiment, the liquid metal can be gallium indium tin alloy. Low-melting-point gallium indium tin alloy is liquid at room temperature, and the melting point of the gallium indium tin alloy can be 10°C, 12°C, 16°C, 20°C, etc., which is not limited in this application.

[0066] The electromagnetic pump in the electromagnetic pump assembly 302 can be a liquid metal electromagnetic pump, which drives the fluid by the Ampere force generated in the magnetic field by the current-carrying fluid.

[0067] The cooling channel 22 can be located on the keyboard side of the laptop and in contact with the central processing unit 12. The liquid metal in the cooling channel 22 can absorb the heat generated by the central processing unit 12, and then, driven by the electromagnetic pump assembly 302, transfer it across the axis to the heat dissipation device 42 located on the display screen side. The heat dissipation device 42 can be the display panel, which can dissipate heat to the surrounding environment.

[0068] In the embodiments of this application, liquid metal is used as the circulating working fluid, which can improve the heat dissipation capacity of the heat dissipation system. Moreover, the electromagnetic pump in the electromagnetic pump group 302 has no rotating parts inside, and no mechanical wear will occur during normal operation, so there is no noise, which improves the stability of the heat dissipation system and meets the heat dissipation requirements of electronic equipment.

[0069] It is understandable that, since the electromagnetic pump group 302 is the power source for pumping the working fluid 50 in the heat dissipation system, if a power supply module is configured to power the electromagnetic pump group 302 separately, its power conversion efficiency will be low, and since the power supply module is large in size, it will occupy a lot of space, which is not conducive to the layout of other electronic components.

[0070] Therefore, embodiments of this application also provide a driving circuit 200, which can be applied in electronic devices. Embodiments of this application connect a power module, an electromagnetic pump assembly, and a load in series, utilizing the high current output of a single power module to simultaneously meet the power supply requirements of both the electromagnetic pump assembly and the load, thus avoiding the problems associated with configuring a separate power module for the electromagnetic pump.

[0071] Specifically, please refer to Figure 3 The diagram shows a circuit diagram of a first embodiment of the drive circuit 200 of this application.

[0072] In the embodiments of this application, the driving circuit 200 may include a power supply module 301, an electromagnetic pump group 302, and a load 303.

[0073] The power module 301, the electromagnetic pump group 302, and the load 303 are connected in series. The electromagnetic pump group 302 may include one or more electromagnetic pumps, and the electromagnetic pumps in the electromagnetic pump group 302 may be connected in series or in parallel.

[0074] It is understood that the load 303 is a high-current working load. The load 303 generates heat during operation, and can therefore serve as a heat source in the embodiments of this application.

[0075] It is understood that electromagnetic pumps operate at high current and low voltage, requiring a high current supply from the load. Therefore, this embodiment utilizes the high current output characteristic of a power module to simultaneously meet the power supply needs of both the electromagnetic pump assembly and the load.

[0076] In some potential application scenarios, the power supply module 301 can output a large current of 10A or more; for example, the power supply module 301 may output a large current of 30A to the electromagnetic pump assembly 302. It is understood that the driving capability of an electromagnetic pump is related to the current. Therefore, the greater the current output by the power supply module 301 to the electromagnetic pump assembly 302, the stronger the driving capability of the electromagnetic pump assembly 302.

[0077] Since the electromagnetic pump operates at a low voltage, it will not affect the operation of the load. It is understood that the output voltage of the power module 301 needs to be adapted to the load 303.

[0078] For example, taking the load 303 as a Central Processing Unit (CPU), the power module 301 is the power module corresponding to the CPU. This CPU-corresponding power module can reduce the 5V voltage to 1.2V (i.e., the CPU operating voltage). At this time, the current flowing through the electromagnetic pump assembly and the CPU can be above 30A. Since the 1.2V output from the power module 301 will experience a slight voltage drop after passing through the electromagnetic pump assembly 302, the electromagnetic pump assembly 302 can output 1.19V to the CPU. The CPU can feed back the 1.19V operating voltage to the power module 301. At this time, the power module 301 can output a slightly higher voltage based on the voltage fed back by the CPU, for example, the power module 301 can output a voltage of 1.21V. Based on this design, the voltage received by the CPU can be 1.2V, which meets the CPU's operating voltage requirements.

[0079] In one possible scenario, the load 303 can be a graphics processing unit (GPU). In this scenario, the power module 301 is the power module corresponding to the GPU.

[0080] In another possible scenario, the load 303 can be a solid state disk (SSD). In this scenario, the power module 301 is the power module corresponding to the SSD.

[0081] In this embodiment, the electromagnetic pump assembly 302 is electrically connected between the power supply module 301 and the load 303. One end of the load 303 is electrically connected to the electromagnetic pump assembly 302, and the other end of the load 303 is grounded. The external power supply outputs a first voltage V. in The power supply module 301 supplies power to the first voltage V. in After conversion, the second output voltage V is performed. out1 The current I is such that it meets the operating current requirements of the electromagnetic pump assembly 302 and the load 303. In this embodiment, the electromagnetic pump assembly 302 can serve as a driving device, used to receive the second voltage V. out1 When the current I is applied, the working fluid 50 in the cooling channel 20 is driven to flow.

[0082] It can be understood that the second voltage V out1A slight voltage drop will occur after passing through the electromagnetic pump assembly 302, meaning that the electromagnetic pump assembly 302 will output a third voltage V. out2 To the load 303. The third voltage V out2 It can meet the operating voltage requirements of the load 303.

[0083] Therefore, the electromagnetic pump group 203 can drive the working fluid 50 to flow in the cooling channel according to the current I provided by the power module 301, so as to dissipate heat from the electronic device.

[0084] In some possible embodiments, the electromagnetic pump utilizes the interaction between the magnetic field and the current in the conductive fluid to create a pressure gradient in the fluid under the influence of Ampere's force, thereby driving the working fluid 50 to flow in the cooling channel. Therefore, the driving capability of the electromagnetic pump assembly 302 in driving the working fluid 50 to flow in the cooling channel is directly proportional to the magnitude of its energizing current.

[0085] When the power consumption of the load 303 increases, the current I flowing through the electromagnetic pump group 302 and the load 303 will also increase accordingly, thereby enhancing the driving ability of the electromagnetic pump group 302 to drive the working fluid 50 to flow. The flow rate of the working fluid 50 in the heat dissipation system increases, which can remove more heat and improve the heat dissipation effect.

[0086] In some possible designs, the power module 301 can be a switching power supply or a linear power supply. The switching power supply may include a boost circuit or a buck circuit.

[0087] Please see Figure 4 The diagram shows a circuit diagram of a second embodiment of the drive circuit 200 of this application.

[0088] The difference between the driving circuit 200 in this embodiment and the driving circuit 200 in the first embodiment is as follows:

[0089] In this embodiment, the driving circuit 200 may further include a bypass circuit 304 and a power management unit (PMU) 305.

[0090] The bypass circuit 304 may include a switch SW1 and a resistor R1. The first terminal of the switch SW1 is electrically connected to the power management unit 305, the second terminal of the switch SW1 is electrically connected between the power module 301 and the electromagnetic pump group 302, the third terminal of the switch SW1 is electrically connected through the resistor R1 to a first node P1 between the electromagnetic pump group 302 and the load 303, the power management unit 305 is electrically connected to a second node P2 between the electromagnetic pump group 302 and the load 303, one end of the capacitor C1 is electrically connected to the first node P1, and the other end of the capacitor C1 is grounded.

[0091] In this embodiment, the power module 301 can deliver the first voltage V from the external power supply. in The second voltage V required to convert to the electromagnetic pump assembly 302 and the load 303 is converted. out1 For example, if the first voltage V input to the power module 301 in If the voltage is 12V, then the power module 301 can output a second voltage V of 1.2V. out1 If the first voltage V input to the power module 301 in If the voltage is 5V, then the power module 301 can output a second voltage V of 1V. out1 The first voltage V input to the power module 301 in If the voltage is 3.3V, then the power module 301 can output a second voltage V of 0.8V. out1 Therefore, the power module 301 can convert the higher input voltage of the external power supply into the lower operating voltage required by the electromagnetic pump assembly 302 and the load 303.

[0092] In one possible implementation, the opening or closing of the switch SW1 can be controlled by the power management unit 305.

[0093] For example, if the rated power of the load 303 is 35W and the rated current of the load 303 is 30A, then the power consumption of the electromagnetic pump 202 is 1W. The third voltage V of the load 303... out2 It can be dynamically adjusted according to needs, and the third voltage V is controlled by the power management unit 305. out2 Monitor it.

[0094] When the electromagnetic pump assembly 302 is operating normally, the power management unit 305 detects the third voltage V of the load 303. out2 Normally, for example, when the power management unit 305 detects that the error between the voltage value of the load 303 and the voltage threshold is less than or equal to 0.03V, the power management unit 305 can control the switch SW1 to open.

[0095] When the resistance of the electromagnetic pump assembly 302 increases abnormally, the power management unit 305 detects the third voltage V on the load 303. out2 In case of anomalies, for example, when the power management unit 305 detects that the error between the load voltage value and the voltage threshold is greater than 0.03V, the power management unit 305 can control the switch SW1 to be turned on, thereby bypassing the faulty electromagnetic pump group 302, ensuring the normal operation of the load 303, and enhancing system reliability.

[0096] In the embodiments of this application, the capacitor C1 is provided between the electromagnetic pump group 302 and the load 303, thereby reducing the interference that the electromagnetic pump group 302 may cause to the load 303 when the current of the load 303 changes rapidly.

[0097] In some possible implementations, the drive circuit 200 may include multiple loads 303. The multiple loads 303 may include, but are not limited to, CPUs, GPUs, memory, hard disks, and other high-performance computing units. The multiple loads 303 may be connected in series or in parallel.

[0098] When the working fluid 50 is liquid metal, the internal resistance of the electromagnetic pump 302 is extremely low due to the excellent conductivity of liquid metal. It can be understood that, in one embodiment, the resistance of the electromagnetic pump assembly 302 can be approximately the same as the resistance of the resistor R1.

[0099] Please see Figure 5 The diagram shows a schematic of the resistance of the electromagnetic pump assembly 302.

[0100] like Figure 5 As shown, the resistance of the electromagnetic pump assembly 302 may include a positive electrode resistor R2, a working fluid resistor R3, and a negative electrode resistor R4.

[0101] If the resistance of the electromagnetic pump assembly 302 is denoted as R a Let the resistance of the positive electrode resistor R2 be denoted as R2, the resistance of the working fluid resistor R3 be denoted as R3, and the resistance of the negative electrode resistor R4 be denoted as R4. Then the resistance of the electromagnetic pump 302 is R. a =R2+R3+R4.

[0102] In some embodiments, both the positive electrode resistor R2 and the negative electrode resistor R4 can be made of copper, thus the resistance values ​​of both R2 and R4 are very low. Since the working fluid is a liquid metal, the resistance value of the working fluid resistor R3 is also very low.

[0103] If the pressure drop across the electromagnetic pump assembly 302 can be denoted as ΔV, then ΔV satisfies the following formula:

[0104] ΔV=I×R a ;

[0105] Where I is the current flowing through the electromagnetic pump assembly 302, R a The resistance value of the electromagnetic pump assembly 302.

[0106] For example, suppose the resistance value R of the electromagnetic pump assembly 302 is... a The current I flowing through the electromagnetic pump group 302 is 30A, and the voltage drop ΔV across the electromagnetic pump group 302 is 0.03V.

[0107] Please see Figure 6 The diagram shows a circuit diagram of a third embodiment of the drive circuit 200 of this application.

[0108] The difference between the driving circuit 200 in this embodiment and the driving circuit 200 in the first embodiment is as follows:

[0109] In this embodiment, the driving circuit 200 may further include a shunt circuit 306, which may include a resistor R5.

[0110] The first end of the resistor R5 is electrically connected to one end of the electromagnetic pump assembly 302, and the second end of the resistor R5 is electrically connected to the other end of the electromagnetic pump assembly 302.

[0111] In this embodiment, the electromagnetic pump assembly 302 and the shunt circuit 306 can jointly power the load 303, and the electromagnetic pump assembly 302 and the shunt circuit 306 can shunt the current I. In some embodiments, the shunt circuit 306 may also include multiple resistors R5. The resistors in the shunt circuit 306 need to be set reasonably to ensure reasonable current shunt with the electromagnetic pump assembly 302.

[0112] It is understood that under normal conditions, the resistance value of resistor R5 can be 4 or 5 times the resistance value of electromagnetic pump assembly 302. Under abnormal conditions, the resistance value of electromagnetic pump assembly 302 will be much greater than the resistance value of resistor R5.

[0113] For example, when the electromagnetic pump assembly 302 is working normally, assuming its resistance is 1mΩ, when the electromagnetic pump assembly 302 malfunctions, its resistance can increase to 10mΩ. Therefore, the resistance of the shunt circuit 306 can be set to 5mΩ. When the electromagnetic pump assembly 302 is working normally, the current required by the load 303 mainly flows through the electromagnetic pump assembly 302. When the resistance of the electromagnetic pump assembly 302 increases abnormally, the current required by the load 303 mainly flows through the shunt circuit 306.

[0114] As can be seen from the above, in this embodiment, it is not necessary to set a switching switch between the electromagnetic pump group 302 and the resistor R5, nor is it necessary to set a filter capacitor between the electromagnetic pump group 302 and the load 303. The high dynamic response capability of the power supply circuit to the load 303 can be increased by connecting the shunt circuit 306 in parallel across the two ends of the electromagnetic pump group 302.

[0115] It is understood that the load 303 can adjust its operating current according to system requirements, and the heat generated by the load 303 will also change with the change in its operating current. The driving force of the electromagnetic pump assembly 302 to drive the flow of the working fluid also needs to be adjusted accordingly.

[0116] Therefore, embodiments of this application need to ensure that the heat dissipation capacity of the heat dissipation system always meets the heat dissipation requirements of the electronic device under different currents.

[0117] like Figure 7 As shown, this embodiment can be based on the system thermal resistance R of the heat dissipation system. sys To determine whether the maximum working fluid flow rate Q required by the heat dissipation system is met. max .

[0118] In one embodiment, the system thermal resistance can be the resistance encountered by heat in the heat flow path, and the system thermal resistance R sys This can include contact thermal resistance, convection thermal resistance, thermal capacitance thermal resistance, and heat dissipation thermal resistance, etc. The system thermal resistance R... sys s The following formula can be satisfied:

[0119] R sys =(T max -T air ) / P max ;

[0120] Among them, P max T represents the maximum power consumption of the load 303. max T is the maximum limiting temperature of the load 303. air The ambient temperature.

[0121] As can be seen from the above formula, in this embodiment, the system thermal resistance R of the heat dissipation system can be obtained based on the maximum power consumption, maximum limiting temperature, and ambient temperature of the load 303. sys Therefore, based on the system thermal resistance R sys Determine the maximum working fluid flow rate Q to meet the heat dissipation requirements of the cooling system. max .

[0122] It can be understood that, at the maximum working fluid flow rate Q max Based on this, the embodiments of this application only require that the power consumption of the load 303 is at its maximum (i.e., the current of the load 303 reaches the maximum current I). max When ), the driving force F of the electromagnetic pump assembly 302 max The resulting working fluid flow rate Q is greater than or equal to the maximum working fluid flow rate Q. max This can meet the heat dissipation requirements of electronic devices.

[0123] When the current I of the load 303 drops from the maximum current I max As the load 303 gradually decreases, the rate of decrease in power consumption P will exceed the rate of decrease in system thermal resistance R. sys The increased speed ensures that the temperature of the load 303 will never exceed the maximum limiting temperature T. max This can meet the heat dissipation needs of electronic devices.

[0124] Therefore, the driving force of the electromagnetic pump group 302 to drive the working fluid 50 to flow only needs to be passively adjusted according to the change of the load 303 current, so as to always meet the heat dissipation requirements of the electronic equipment.

[0125] For example, such as Figure 8 As shown in the embodiments of this application, the relationship between the driving force F generated by the electromagnetic pump group 302 and the current I can be: F∝I, where the above relationship can be used to characterize that the driving force F of the electromagnetic pump group 302 is directly proportional to the current I flowing through the electromagnetic pump group 302.

[0126] The relationship between the driving force F of the electromagnetic pump assembly 302 and the working fluid flow rate Q of the heat dissipation system can be: F∝Q (1～2) The above relationship can be used to characterize that the driving force F of the electromagnetic pump group 302 is directly proportional to the working fluid flow rate Q of the heat dissipation system.

[0127] The system thermal resistance R sys The relationship between R and the working fluid flow rate Q can be expressed as: sys ∝Q -(0.1～0.9) Thus, the thermal resistance R of the system can be derived. sys The relationship between R and current I is: sys ∝I-(0.05～0.9) The power consumption P of the load 303 is related to the current I by the following formula: P∝I 2 Therefore, it can be concluded that the power consumption P decreases at a rate greater than that of the system thermal resistance R as the current I decreases. sys The rate at which the temperature of the load 303 increases as the current I decreases will always be less than the maximum limiting temperature T. max .

[0128] By employing the embodiments of this application, connecting the electromagnetic pump assembly 302 in series with the load 303 and supplying power to both the electromagnetic pump assembly 302 and the load 303 through the power module 301, the problems of large size, low efficiency, and severe heat generation associated with configuring a separate power module for the electromagnetic pump assembly 302 can be avoided. Furthermore, through optimized design of the heat dissipation system, a dynamic match between system heat dissipation requirements and heat dissipation capacity can be achieved, thus meeting the heat dissipation needs of electronic devices.

[0129] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application should fall within the scope of protection claimed by this application.

Claims

1. An electronic device, characterized in that, It includes a load, a power module, a cooling channel, and an electromagnetic pump assembly. The load includes a central processing unit, a graphics processing unit, memory, or a hard disk. The electromagnetic pump assembly includes one or more electromagnetic pumps. The cooling channel is used to connect to the electromagnetic pump, and the cooling channel contains a working fluid for cooling. The power module, the electromagnetic pump group, and the load are connected in series in sequence; the electromagnetic pumps in the electromagnetic pump group are connected in series or in parallel. The power module is used to output a power signal with a large current to each electromagnetic pump in the electromagnetic pump group and the load, wherein the large current is greater than or equal to 10A. The power module is used to adjust the output voltage according to the working voltage fed back by the load. After the voltage output by the power module passes through the electromagnetic pump group, it meets the working voltage requirements of the load. The electromagnetic pump assembly is used to drive the working fluid to flow in the cooling channel under the action of the power signal.

2. The electronic device as claimed in claim 1, characterized in that, The electronic device further includes a power management unit electrically connected to the electromagnetic pump assembly for detecting the status of the electromagnetic pump assembly.

3. The electronic device as described in claim 2, characterized in that, The electronic device further includes a switch, the first end of which is electrically connected to the power management unit, the second end of which is electrically connected between the power module and the electromagnetic pump group, and the third end of which is electrically connected between the electromagnetic pump group and the load.

4. The electronic device as claimed in claim 3, characterized in that, The electronic device further includes a first resistor, a first end of which is electrically connected to the third end of the switch, and a second end of which is electrically connected between the electromagnetic pump assembly and the load.

5. The electronic device as described in claim 3 or 4, characterized in that, The power management unit is used for: When the electromagnetic pump assembly is in normal operation, a first signal is output to the switch to control the switch to open. When the electromagnetic pump assembly is in an abnormal state, a second signal is output to the switch to control the switch to turn on.

6. The electronic device as claimed in claim 1, characterized in that, The electronic device further includes a second resistor, the first end of which is electrically connected between the power module and the electromagnetic pump group, and the second end of which is electrically connected between the electromagnetic pump group and the load.

7. The electronic device according to any one of claims 1-6, characterized in that, The load is a central processing unit, and the power module is the power module corresponding to the central processing unit.

8. The electronic device according to any one of claims 1-6, characterized in that, The load is a graphics processing unit, and the power module is the power module corresponding to the graphics processing unit.

9. A driving circuit, characterized in that, The drive circuit is applied to an electronic device, which includes a load, such as a central processing unit, a graphics processing unit, memory, or a hard disk; the drive circuit includes a power module and an electromagnetic pump assembly. The power module, the electromagnetic pump group, and the load are connected in series in sequence; the electromagnetic pumps in the electromagnetic pump group are connected in series or in parallel. The power module is used to output a power signal with a large current to each electromagnetic pump in the electromagnetic pump group and the load, wherein the large current is greater than or equal to 10A. The power module is used to adjust the output voltage according to the working voltage fed back by the load. After the voltage output by the power module passes through the electromagnetic pump group, it meets the working voltage requirements of the load. The electromagnetic pump assembly is used to drive the flow of the working fluid in the cooling channel under the action of the power signal.

10. The driving circuit as described in claim 9, characterized in that, The drive circuit also includes a power management unit, which is electrically connected to the electromagnetic pump group to detect the status of the electromagnetic pump group.

11. The driving circuit as described in claim 10, characterized in that, The electronic device further includes a switch and a first resistor. The first end of the switch is electrically connected to the power management unit, the second end of the switch is electrically connected between the power module and the electromagnetic pump group, the third end of the switch is electrically connected between the electromagnetic pump group and the load, the first end of the first resistor is electrically connected to the third end of the switch, and the second end of the first resistor is electrically connected between the electromagnetic pump group and the load.

12. The driving circuit as described in claim 9, characterized in that, The electronic device further includes a second resistor, the first end of which is electrically connected between the power module and the electromagnetic pump group, and the second end of which is electrically connected between the electromagnetic pump group and the load.

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