Apparatus for processing a substrate

Abstract

An apparatus for processing a substrate includes a housing having an internal space therein, a process container disposed within the internal space and having a process space, a substrate support unit supporting a substrate in the process space, a liquid supply unit supplying a liquid to the substrate supported by the substrate support unit, an exhaust unit exhausting a fume generated in the process space, a gas flow supply unit coupled to a top side of the housing and supplying a gas to the internal space to form a downward gas flow, and a perforated plate disposed between the process container and the gas flow supply unit and discharging the gas to the internal space, the perforated plate including a bottom portion and a side portion, the side portion including a first side portion extending from the bottom portion and upwardly inclined to a first side wall of the housing and having first holes discharging the gas.

Description

Cross-reference to related applications

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2021-0036637, filed with the Korean Patent Office on March 22, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The embodiments of the inventive concept described herein relate to a substrate processing apparatus, and more specifically, to a substrate processing apparatus that supplies downward airflow to the interior space of a housing. Background Technology

[0003] Semiconductor devices are manufactured by performing various processes such as photolithography, thin film deposition, ashing, etching, and ion implantation. Furthermore, cleaning processes are performed before and after each of these processes to remove any remaining particles from the substrate. The substrate cleaning process utilizes various liquids.

[0004] The cleaning process includes: supplying chemicals to a substrate supported and rotated by a rotating head; removing the chemicals from the substrate by supplying a cleaning solution such as deionized water (DIW); replacing the cleaning solution on the substrate with an organic solvent by supplying an organic solvent such as an isopropanol (IPA) solution having a lower surface tension than the cleaning solution; and removing the replaced organic solvent from the substrate.

[0005] Figure 1 This is a cross-sectional view illustrating a known substrate processing apparatus. (Reference) Figure 1 The substrate processing apparatus 1000 has a processing container 1200 disposed within a housing, surrounding a support unit 1100 that supports the substrate, and processes the substrate while supplying liquid to the rotating substrate. A fan filter unit 1300 is configured to provide downward airflow into the interior space of the housing to facilitate the discharge of gases generated during the substrate processing process. Particles, fumes, gases, etc., generated during substrate processing with various processing liquids in the interior space are discharged to the outside through an exhaust device along with the downward airflow. Because the fan filter unit is installed in the opposite position to the processing container, the airflow stagnates near the side wall of the housing. As a result, the exhaust of the exhaust device is not smooth, and therefore the gases generated during substrate processing adhere to the substrate, thereby forming particles in the substrate. Summary of the Invention

[0006] An embodiment of the present invention provides a substrate processing apparatus capable of removing airflow blockage in the interior space of a housing caused by the downward airflow during substrate processing while providing downward airflow to the interior space of the housing.

[0007] An embodiment of the present invention provides a substrate processing apparatus that prevents particles from forming on the substrate while processing the substrate by providing downward airflow into the interior space of the housing.

[0008] The technical objectives of this invention are not limited to those mentioned above, and other unmentioned technical objectives will be apparent to those skilled in the art from the following description.

[0009] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a housing having an internal space therein; a processing container disposed within the internal space and having a processing area; a substrate support unit supporting a substrate in the processing area; a liquid supply unit supplying liquid to the substrate supported by the substrate support unit; an exhaust unit discharging fumes generated in the processing area; an airflow supply unit coupled to the top side of the housing and supplying gas to the internal space to form a downward airflow; and a perforated plate disposed between the processing container and the airflow supply unit and discharging the gas into the internal space, wherein the perforated plate includes: a bottom portion and a side portion, the side portion including a first side portion extending from the bottom portion and inclined upward to a first sidewall of the housing and having a first hole for discharging the gas.

[0010] In one embodiment, the bottom portion of the perforated plate has a bottom hole for discharging the gas, and the opening area of ​​the first hole per unit area of ​​the first side portion is different from the opening area of ​​the bottom hole per unit area of ​​the bottom portion.

[0011] In one embodiment, the opening area of ​​the first hole per unit area on the top surface of the first side portion is smaller than the opening area of ​​the bottom hole per unit area on the top surface of the bottom portion.

[0012] In one embodiment, the first hole is configured to directly discharge the gas in a downward sloping direction toward the first sidewall of the housing.

[0013] In one embodiment, the side portion of the perforated plate further includes a second side portion having a second hole for discharging the gas. The second side portion extends from the bottom portion and slopes upward toward the second sidewall of the housing, which is opposite to the first sidewall of the housing.

[0014] In one embodiment, the first angle between the first side portion of the perforated plate and the first sidewall of the housing is different from the second angle between the second side portion of the perforated plate and the second sidewall of the housing.

[0015] In one embodiment, the first angle is greater than the second angle, and the opening area of ​​the first hole per unit area of ​​the first side portion is set to be smaller than the opening area of ​​the bottom hole per unit area of ​​the bottom portion, and the opening area of ​​the second hole per unit area of ​​the second side portion is smaller than the opening area of ​​the bottom hole per unit area of ​​the top surface of the bottom portion, and larger than the opening area of ​​the first hole per unit area of ​​the top surface of the first side portion.

[0016] In one embodiment, the side portion of the perforated plate further includes: a third side portion located between the first side portion and the second side portion and having a third hole for discharging the gas; and a fourth side portion opposite to the third side portion and located between the first side portion and the second side portion and having a fourth hole for discharging the gas, wherein the third side portion extends from the bottom portion and slopes upward to the third sidewall of the housing, and the fourth side portion extends from the bottom portion and slopes upward to the fourth sidewall of the housing.

[0017] In one embodiment, the angle between the first side portion of the perforated plate and the first sidewall of the housing is greater than the angles between the respective second to fourth side portions of the perforated plate and the respective second to fourth sidewalls of the housing, and the opening area of ​​the first hole per unit area of ​​the first side portion is set to be smaller than the opening area of ​​the bottom hole per unit area of ​​the bottom portion, and the opening areas of the second to fourth holes per unit area of ​​the respective second to fourth side portions are smaller than the opening area of ​​the bottom hole per unit area of ​​the bottom portion and larger than the opening area of ​​the first hole per unit area of ​​the first side portion.

[0018] In one embodiment, the side portion includes a plurality of side portions including the first side portion, and the plurality of side portions excluding (excluding) the first side portion are in contact with each sidewall of the housing.

[0019] In one embodiment, the airflow supply unit includes: a filter for removing impurities from the gas flowing into the filter; and a fan disposed on the top surface of the housing for creating a downward airflow in the interior space.

[0020] In one embodiment, the substrate processing apparatus further includes: an imaging unit mounted adjacent to a first end of the first side portion at the first sidewall of the housing, the first end being opposite to a second end of the first side portion connected to the bottom portion, the imaging unit being mounted such that the optical axis of the imaging unit forms an acute angle with respect to the horizontal plane.

[0021] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a housing having an internal space and including a first sidewall and a second sidewall; a processing container disposed within the internal space and having a processing space; a substrate support unit supporting a substrate in the processing space; a liquid supply unit supplying liquid to the substrate supported by the substrate support unit; an exhaust unit discharging fumes generated in the processing space; an airflow supply unit coupled to the top side of the housing and supplying gas to the internal space to form a downward airflow; and a perforated plate disposed between the processing container and the airflow supply unit and discharging the gas into the internal space, wherein the perforated plate includes: a bottom portion having a bottom hole for discharging the gas in a direction perpendicular to the top surface of the substrate supported by the support unit; and a first side portion extending upward from the bottom portion to the first sidewall of the housing and having a first hole for discharging the gas toward the first sidewall of the housing.

[0022] In one embodiment, the opening area of ​​the first hole per unit area of ​​the top surface of the first side portion is set to be smaller than the opening area of ​​the bottom hole per unit area of ​​the top surface of the bottom portion.

[0023] In one embodiment, the perforated plate includes a second side portion that extends from the bottom portion and slopes upward toward the second sidewall of the housing and has a second hole for discharging the gas toward the second sidewall of the housing. The angle between the first side portion and the first sidewall is greater than the angle between the second side portion and the second sidewall. The opening area of ​​the second hole per unit area of ​​the second side portion is smaller than the opening area of ​​the bottom hole per unit area of ​​the bottom portion but larger than the opening area of ​​the first hole per unit area of ​​the first side portion.

[0024] In one embodiment, the substrate processing apparatus further includes: an imaging unit mounted adjacent to a first end of the first side portion at the first sidewall of the housing, the first end being opposite to a second end of the first side portion connected to the bottom portion, the imaging unit being mounted such that the optical axis of the imaging unit forms an acute angle with respect to a horizontal plane defined by the top surface of the substrate support unit.

[0025] The present invention provides a substrate processing device.

[0026] In one embodiment, the substrate processing apparatus includes: a housing having an internal space and including a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall; a processing container disposed within the internal space and having a processing space; a substrate support unit supporting a substrate in the processing space; a liquid supply unit supplying liquid to the substrate supported by the substrate support unit; an exhaust unit discharging fumes generated in the processing space; an airflow supply unit coupled to the top side of the housing and supplying gas to the internal space to form a downward airflow; and a perforated plate disposed between the processing container and the airflow supply unit and discharging the gas into the internal space, wherein the perforated plate includes: a bottom portion and a first side portion, the bottom portion including a bottom hole for discharging the gas in a direction perpendicular to the top surface of the substrate supported by the support unit, and the first side portion extending upward from the bottom portion to the first sidewall of the housing and having a first hole for discharging the gas toward the first sidewall of the housing.

[0027] In one embodiment, the perforated plate further includes a second side portion, a third side portion, and a fourth side portion, the second side portion, the third side portion, and the fourth side portion extending from the bottom portion and inclined upward to the second side wall, the third side wall, and the fourth side wall, respectively, and the angle between the first side portion of the perforated plate and the first side wall of the housing is greater than the angle between each of the second to fourth side portions of the perforated plate and each of the second to fourth side walls of the housing.

[0028] In one embodiment, the opening area of ​​each of the second to fourth holes per unit area on the top surface of the second to fourth side portions is greater than the opening area of ​​the first hole per unit area on the top surface of the first side portion.

[0029] In one embodiment, the substrate processing apparatus further includes: an imaging unit mounted adjacent to a first end of the first side portion at the first sidewall of the housing, the first end being opposite to a second end of the first side portion connected to the bottom portion, the imaging unit being mounted such that the optical axis of the imaging unit forms an acute angle with respect to a horizontal plane defined by the top surface of the substrate support unit.

[0030] According to one embodiment of the present invention, when the substrate is processed while providing downward airflow to the interior space of the housing, stagnation of airflow in the interior space of the housing can be prevented.

[0031] According to one embodiment of the present invention, particles can be prevented from forming on the substrate while processing the substrate while providing downward airflow to the interior space of the casing.

[0032] According to one embodiment of the present invention, in a structure provided with a perforated plate for providing downward airflow, space can be provided for mounting an imaging unit therein, and downward airflow can be provided to the entire interior space of the housing at the same time. Attached Figure Description

[0033] The above and other objectives and features will become apparent from the following description with reference to the following figures, wherein, unless otherwise specified, the same reference numerals refer to the same parts in the various figures.

[0034] Figure 1 This is a schematic cross-sectional view illustrating the processing chamber of a known substrate processing apparatus.

[0035] Figure 2 This is a schematic plan view illustrating a substrate processing apparatus according to an embodiment of the concept of the present invention.

[0036] Figure 3 It is an illustrative example. Figure 2 A view of one embodiment of the processing chamber of a substrate processing apparatus.

[0037] Figure 4 It is observed from the front of the self-processing room. Figure 3 A view of the perforated plate.

[0038] Figure 5 It is viewed from the side of the processing chamber. Figure 3 A view of the perforated plate.

[0039] Figures 6 to 8 These are illustrative examples. Figure 3 A view of a modified instance of a perforated plate.

[0040] Figure 9 It is an illustrative example. Figure 3 A view of another implementation of the processing room.

[0041] Figure 10 This is a schematic illustration of the airflow inside the processing chamber when the perforated plate has only a bottom surface and no inclined side surface.

[0042] Figure 11 This is a schematic illustration of the airflow inside the processing chamber when the perforated plate has a bottom surface and sloping side surfaces.

[0043] Figure 12 It is an illustrative example. Figure 2 A view of another embodiment of the processing chamber of the substrate processing equipment.

[0044] Figure 13 It is a schematic display Figure 12 A view of the perforated plate.

[0045] Figure 14 It is an illustrative example. Figure 2 A view of another embodiment of the processing chamber of the substrate processing equipment.

[0046] Figure 15 It is an illustrative example. Figure 12 A view of another implementation of the processing room.

[0047] Figure 16 It is an illustrative example. Figure 14 A view of another implementation of the processing room.

[0048] [Symbol Explanation] 1: Substrate processing equipment 10: Indexing Module 12: First Direction 14: Second Direction 16: Third-party 20: Processing Module 120: Loading port 130: Container 140: Teleportation Frame 142: Indexing Track 144: Indexing Robot 144a: Base 144b: Main Body 144c: Indexing arm 220: Buffer unit 240: Teleportation Room 242: Guiding Track 244: The Main Robot 244a: Base 244b: Main body 244c: Main Arm 300: Processing Room 310: Outer shell 311: Top Wall 312: First sidewall 313: Second sidewall 314: Third sidewall 315: Fourth sidewall 320: Handling Containers 321: Guide Wall 322: Internal Recycling Container 322a, 324a, 326a, 322c, 324c, 326c: Space 324: Collect containers in the middle 326: External Recycling Container 322b, 324b, 326b: Recollection pipeline 340: Substrate support unit 342: Main Body 344: Support pin 346: Chuck pin 348: Support shaft 349: Drive Unit 360: Lift / Lower Unit 362: Bracket 364: Moving Axis 366: Driver 370: Liquid supply unit 370a: First processing fluid supply component 370b: Second processing fluid supply component 372: Arm 374: Nozzle 376: Support shaft 378: Driver 380: Exhaust unit 381: Exhaust duct 400: Airflow supply unit 500, 500e, 500f: Perforated plates 510, 510b, 510c, 510d, 510e, 510f: Bottom section 511, 511b, 511c, 511d, 511e, 511f: Bottom holes 520, 520b, 520c, 520d, 520e, 520f: First side portion 521, 521b, 521c, 521d, 521e, 521f: First hole 530, 530b, 530c, 530d: Second side section 531, 531b, 531c, 531d: Second hole 540, 540b, 540c, 540d: Third side section 541, 541b, 541c, 541d: Third hole 550, 550b, 550c, 550d: Fourth side section 551, 551b, 551c, 551d: Fourth hole 700: Imaging Unit 1000: Substrate processing equipment 1100: Support Unit 1200: Processing Container 1300: Fan filter unit A1, A2: Degree of tilt d1, d2, d3, d4, d5: Distance W: substrate Detailed Implementation The inventive concept can be modified in various ways and can take various forms, and specific embodiments thereof will be illustrated and described in detail in the drawings. However, the embodiments of the inventive concept are not intended to limit the specific disclosed forms, and it should be understood that the inventive concept includes all variations, equivalents, and substitutions included within the spirit and technical scope of the inventive concept. In the description of the inventive concept, detailed descriptions of such technologies may be omitted when the nature of the inventive concept may be unclear.

[0049] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well. It will be further understood that when the terms “comprises” and / or “comprising” are used in this specification, they specify the presence of the stated features, integers, steps, operations, components, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, components, components, and / or groups thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Furthermore, the term “exemplary” is intended to mean an example or illustration.

[0050] It will be understood that although the terms "first," "second," "third," etc., may be used herein to describe various components, parts, regions, layers, and / or sections, such components, parts, regions, layers, and / or sections should not be limited by these terms. These terms are used only to distinguish one component, part, region, layer, or section from another component, part, region, layer, or section. Therefore, without departing from the teachings of the inventive concept, the first component, part, region, layer, or section discussed below may be referred to as the second component, part, region, layer, or section.

[0051] In one embodiment of the present invention, a process for liquid treatment of a substrate by supplying a liquid, such as a cleaning solution, to the substrate will be described as an example. However, this embodiment is not limited to cleaning processes and can be applied to various processes that use processing solutions to treat substrates, such as etching processes, ashing processes, developing processes, and the like.

[0052] In the following text, reference will be made to Figures 2 to 16 A detailed description of embodiments of the present invention is provided.

[0053] Figure 2 This is a plan view schematically illustrating an embodiment of a substrate processing apparatus according to a concept of the present invention. (See reference) Figure 2 The substrate processing apparatus 1 includes an indexing module 10 and a processing module 20. The indexing module 10 has a loading port 120 and a transfer frame 140. The loading port 120, the transfer frame 140, and the processing module 20 are arranged sequentially in one direction. In the following, the direction in which the loading port 120, the transfer frame 140, and the processing module 20 are arranged is referred to as the first direction 12, the direction perpendicular to the first direction 12 is referred to as the second direction 14, and the direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as the third direction 16.

[0054] The container 130 for storing the substrate W is housed in the loading port 120. Multiple loading ports 120 are provided and configured along the second direction 14. The number of loading ports 120 can be increased or decreased depending on the process efficiency of the processing module 20 and the coverage area conditions. Multiple slots (not shown) for horizontally holding the substrate W are formed in the container 130. A front-opening unified pod (FOUP) can be used as the container 130.

[0055] Processing module 20 includes a buffer unit 220, a transfer chamber 240, and a processing chamber 300. The transfer chamber 240 is arranged such that its length direction is parallel to a first direction 12. A plurality of processing chambers 300 are respectively arranged on both sides of the transfer chamber 240. On one side and the other side of the transfer chamber 240, the processing chambers 300 are arranged symmetrically about the transfer chamber 240. Some of the plurality of processing chambers 300 are arranged along the longitudinal direction of the transfer chamber 240 (i.e., along the first direction 12). Furthermore, some of the plurality of processing chambers 300 are arranged to stack on top of each other, i.e., along a third direction 16. That is, the processing chambers 300 can be configured in an AXB configuration on one side and / or the other side of the transfer chamber 240. Here, A is the number of processing chambers 300 arranged along the first direction 12, and B is the number of processing chambers 300 arranged along the third direction 16. When four or six processing chambers 300 are arranged on one side of the transfer chamber 240, the processing chambers 300 can be configured in a 2×2 or 3×2 configuration. The number of processing chambers 300 can be increased or decreased. The processing chambers 300 can be arranged only on one side of the transfer chamber 240. In addition, the processing chambers 300 can be arranged in a single layer (not stacked on each other along a third direction) on one and / or both sides of the transfer chamber 240.

[0056] A buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides space between the transfer chamber 240 and the transfer frame 140, where the substrate W rests before being transferred. A slot (not shown) on which the substrate W is held is disposed within the buffer unit 220. Multiple slots (not shown) are spaced apart from each other along a third direction 16. The side of the buffer unit 220 facing the transfer frame 140 and the side facing the transfer chamber 240 are open. The two open sides of the buffer unit 220 may be its two opposite sides.

[0057] A transfer frame 140 transfers substrate W between a container 130 located on a loading port 120 and a buffer unit 220. The transfer frame 140 is provided with an indexing track 142 and an indexing robot 144. The indexing track 142 is configured such that its length direction is parallel to a second direction 14. The indexing robot 144 is mounted on the indexing track 142 and moves linearly along the indexing track 142 in the second direction 14. The indexing robot 144 has a base 144a, a body 144b, and an indexing arm 144c. The base 144a is mounted to be movable along the indexing track 142. The body 144b is coupled to the base 144a. The body 144b is configured to be movable on the base 144a along a third direction 16. Furthermore, the body 144b is configured to be rotatable on the base 144a. The indexing arm 144c is coupled to the body 144b and is configured to be movable back and forth relative to the body 144b. Multiple indexing arms 144c are configured to be driven individually. The indexing arms 144c are arranged and stacked, spaced apart from each other on a third direction 16. Some indexing arms 144c are used to transport the substrate W from the processing module 20 to the container 130, while others are used to transport the substrate W from the container 130 to the processing module 20. This prevents particles generated from the substrate W before processing during the introduction and removal of the substrate W by the indexing robot 144 from adhering to the processed substrate W.

[0058] The transfer chamber 240 transfers substrate W between the buffer unit 220 and the processing chamber 300, and between the processing chambers 300. The transfer chamber 240 is provided with a guide rail 242 and a main robot 244. The guide rail 242 is configured such that its length direction is parallel to a first direction 12. The main robot 244 is mounted on the guide rail 242 and moves linearly along the first direction 12 on the guide rail 242. The main robot 244 has a base 244a, a body 244b, and a main arm 244c. The base 244a is mounted to be movable along the guide rail 242. The body 244b is coupled to the base 244a. The body 244b is configured to be movable along a third direction 16 on the base 244a. Furthermore, the body 244b is configured to be rotatable on the base 244a. The main arm 244c is coupled to the body 244b and is configured to be movable back and forth relative to the body 244b. Multiple main arms 244c are configured to be driven individually. The main arms 244c are arranged to be stacked on a third-direction 16 while being spaced apart from each other.

[0059] The processing chamber 300 may be a liquid processing chamber for supplying liquid to the substrate W to perform a liquid processing process. For example, the liquid processing process may be a cleaning process for cleaning the substrate with a cleaning solution. Chemical treatment, cleaning treatment, and drying treatment can all be performed on the substrate in the processing chamber. In some embodiments, a drying chamber for drying the substrate may be provided separately from the liquid processing chamber.

[0060] Figure 3 It is an illustrative example. Figure 2 A cross-sectional view of an embodiment of the processing chamber. Figure 4 and Figure 5 The diagrams schematically show the views from the front and side of the processing chamber. Figure 3 Perforated plate. (Reference) Figures 3 to 5 The processing chamber 300 includes an outer shell 310, a processing container 320, a substrate support unit 340, a liquid supply unit 370, an exhaust unit 380, an airflow supply unit 400, and a perforated plate 500.

[0061] The housing 310 forms a space therein. The housing 310 has a top wall 311, a bottom wall, and side walls defining the space. According to an embodiment, the housing 310 typically has a cuboid shape, and therefore, the housing may have a first side wall 312, a second side wall 313, a third side wall 314, and a fourth side wall 315. The first side wall 312 and the second side wall 313 are opposite to each other, and the third side wall 314 and the fourth side wall 315 are opposite to each other. The shortest distance from the first side wall 312 to the substrate may be greater than the shortest distances from the second side wall 313, the third side wall 314, and the fourth side wall 315 to the substrate.

[0062] The processing container 320 is located inside the housing 310. The processing container 320 has a processing space for processing the substrate W. The processing container 320 has a guide wall 321, an inner recollection container 322, an intermediate recollection container 324, and an outer recollection container 326. The recollection containers (322, 324, and 326) separate and recover different processing liquids used in the process. The guide wall 321 is configured in an annular shape surrounding the substrate support unit 340, and the inner recollection container 322 is configured in an annular shape surrounding the guide wall 321. The intermediate recollection container 324 is configured in an annular shape surrounding the inner recollection container 322, and the outer recollection container 326 is configured in an annular shape surrounding the intermediate recollection container 324. The space 322a between the inner recollection container 322 and the guide wall 321 serves as a first inlet through which the processing liquid is introduced. The space 324a between the inner recollection container 322 and the intermediate recollection container 324 serves as a second inlet for introducing the treatment liquid. The space 326a between the intermediate recollection container 324 and the outer recollection container 326 serves as a third inlet for introducing the treatment liquid. Furthermore, the space 322c between the bottom end of the guide wall 321 and the inner recollection container 322 serves as a first outlet for discharging the flue gas and airflow generated by the treatment liquid. The space 324c between the bottom end of the inner recollection container 322 and the intermediate recollection container 324 serves as a second outlet for discharging the flue gas and airflow generated by the treatment liquid. The space 326c between the bottom end of the intermediate recollection container 324 and the outer recollection container 326 serves as a third outlet for discharging the flue gas and airflow generated by the treatment liquid. Different types of treatment liquid can be introduced into each recollection container. For each of the recollection containers (322, 324, and 326), recollection lines 322b, 324b, and 326b extending downwards from their respective bottom sides are connected. The treatment liquid, flue gas, and airflow introduced through the collection containers (322, 324, and 326) are discharged from the collection lines 322b, 324b, and 326b. The discharged treatment liquid can be reused through an external treatment liquid regeneration system (not shown).

[0063] The substrate support unit 340 supports and rotates the substrate W during the process. The substrate support unit 340 includes a body 342, a support pin 344, a chuck pin 346, a support shaft 348, and a drive unit (not shown). The body 342 has a top surface that is generally circular when viewed from above. The support shaft 348 is fixedly coupled to the bottom surface of the body 342, and the support shaft 348 is configured to be rotatable by the drive unit 349.

[0064] Multiple support pins 344 are provided. The support pins 344 are arranged on the edge of the top surface of the body 342, spaced apart from each other by a predetermined distance, and protrude upward from the body 342. The support pins 344 are arranged to have an overall annular shape. The support pins 344 support the rear edge of the substrate W, such that the substrate W is spaced apart from the top surface of the body 342 by a predetermined distance.

[0065] Multiple chuck pins 346 are provided. The chuck pins 346 are arranged further away from the center of the body 342 than the support pins 344. The chuck pins 346 are configured to project upwards from the body 342. The chuck pins 346 support the sides of the substrate W so as not to deviate laterally from a predetermined position when the substrate W rotates. The chuck pins 346 are configured to be linearly movable between a standby position and a support position along the radial direction of the body 342. The standby position is the position further away from the center of the body 342 compared to the support position. When the substrate W is loaded or unloaded on the substrate support unit 340, the chuck pins 346 are in the standby position, and when processing is performed on the substrate W, the chuck pins 346 are in the support position. In the support position, the chuck pins 346 contact the sides of the substrate W.

[0066] The lifting / lowering unit 360 linearly moves the processing container 320 in an upward / downward direction. As the processing container 320 moves up and down, its relative height to the substrate support unit 340 changes. The lifting / lowering unit 360 includes a bracket 362, a moving shaft 364, and a driver 366. The bracket 362 is fixedly mounted on the outer wall of the processing container 320, and the moving shaft 364, which moves in the upward / downward direction via the driver 366, is fixedly coupled to the bracket 362. When the substrate W is placed on or lifted from the substrate support unit 340, the processing container 320 is lowered, causing the substrate support unit 340 to protrude upward from the processing container 320. Furthermore, during the processing, the height of the processing container 320 is adjusted so that the processing liquid can flow into a predetermined collection container according to the type of processing liquid supplied to the substrate W. In some embodiments, the lifting / lowering unit 360 can move the substrate support unit 340 in an upward / downward direction.

[0067] The liquid supply unit 370 supplies processing liquid to the substrate W. Multiple liquid supply units 370 are provided, each supplying a different type of processing liquid. According to an embodiment, the liquid supply unit 370 includes a first processing liquid supply member 370a and a second processing liquid supply member 370b.

[0068] The first processing fluid supply component 370a includes a support shaft 376, an arm 372, a driver 3, and a nozzle 374. The support shaft 376 is located on one side of the processing container 320. The support shaft 376 has a rod shape extending along a third direction. The support shaft 376 is configured to be rotatable by the driver 378. The arm 372 is coupled to the top end of the support shaft 376. The arm 372 extends vertically from the support shaft 376. The nozzle 374 is fixedly coupled to one end of the arm 372. When the support shaft 376 rotates, the nozzle 374 can swing together with the arm 372. The nozzle 374 can swing and move to a processing position and a standby position. Here, the processing position is the position where the nozzle 374 faces the substrate W supported by the substrate support unit 340, while the standby position is the position where the nozzle 374 is away from the processing position.

[0069] In some embodiments, arm 372 may be configured to move back and forth along its length. When viewed from above, nozzle 374 may oscillate to be aligned with the central axis of substrate W.

[0070] The second processing liquid supply member 370b supplies the second processing liquid to the substrate W supported by the substrate support unit 340. The second processing liquid supply member 370b is configured to have the same shape as the first processing liquid supply member 370a. Therefore, a detailed description of the second processing liquid supply member 370b will be omitted.

[0071] The first and second treatment solutions can be any of chemicals, cleaning solutions, and organic solvents. The chemicals may include nitric acid, phosphoric acid, or sulfuric acid. The cleaning solution may contain water. The organic solvent may include alcohols such as isopropanol.

[0072] Exhaust unit 380 discharges fumes and gases generated in the processing space. Exhaust unit 380 discharges fumes and gases generated during liquid processing of the substrate. Exhaust unit 380 can be coupled to the bottom surface of processing container 320.

[0073] Exhaust duct 381 discharges fumes and gases generated within the interior space of housing 310. Exhaust duct 381 also discharges fumes and gases that disperse from the processing space during liquid processing of the substrate. Exhaust duct 381 may be coupled to the bottom wall of housing 310.

[0074] During liquid processing of the substrate, fumes and gases can be discharged solely through exhaust unit 380 and exhaust duct 381. In some embodiments, during liquid processing of the substrate, fumes and gases can be discharged simultaneously through exhaust unit 380 and exhaust duct 381. In this case, the exhaust duct 381 can be controlled such that its exhaust pressure is lower than the exhaust pressure of exhaust unit 380 when the substrate undergoes liquid processing, thereby emitting a smaller amount compared to exhaust unit 380. Therefore, fumes generated in the processing space can be prevented from flowing back to the outside of the processing space.

[0075] An airflow supply unit 400 supplies gas to the interior space of the housing 310 to form a downward airflow. The airflow supply unit 400 is connected to the top wall 311 of the housing 310. The gas supplied to the interior space of the housing 310 through the airflow supply unit 400 forms a downward airflow in the interior space. Gas byproducts generated during the processing in the processing space are discharged to the outside of the housing 310 through the exhaust unit 380 by the downward airflow. The airflow supply unit 400 may be configured as a fan filter unit.

[0076] The perforated plate 500 evenly discharges the gas supplied by the airflow supply unit 400 into the interior space of the housing 310. The perforated plate 500 is arranged between the airflow supply unit 400 and the processing container 320. The perforated plate 500 can be arranged at a height spaced apart from the airflow supply unit 400 and the processing container 320.

[0077] The perforated plate 500 has a bottom portion 510 and side portions. The side portions extend from the bottom portion. The side portions include a first side portion 520, a second side portion 530, a third side portion 540, and a fourth side portion 550. The first side portion 520 and the second side portion 530 are opposite to each other, and the third side portion 540 and the fourth side portion 550 are opposite to each other. The first side portion 520 is adjacent to a first sidewall 312 of the housing 310, and the second side portion 530 is adjacent to a second sidewall 313 of the housing 310. Furthermore, the third side portion 540 is adjacent to a third sidewall 314 of the housing 310, and the fourth side portion 550 is adjacent to a fourth sidewall 315 of the housing 310.

[0078] A first side portion 520 extends from each side of the bottom portion 510 toward the first sidewall 312. The first side portion 520 may slope upward toward the first sidewall 312. A second side portion 530 extends from each side of the bottom portion 510 toward the second sidewall 313. The second side portion 530 may slope upward toward the second sidewall 313. A third side portion 540 extends from each side of the bottom portion 510 toward the third sidewall 314. The third side portion 540 may slope upward toward the third sidewall 314. A fourth side portion 550 extends from each side of the bottom portion 510 toward the fourth sidewall 315. The fourth side portion 550 may slope upward toward the fourth sidewall 315.

[0079] At least two of the first side portions 520, second side portions 530, third side portions 540, and fourth side portions 550 may be provided with different degrees of inclination. According to an embodiment, the first side portion 520 is less inclined than the second side portions 530, third side portions 540, and fourth side portions 550. That is, the angle between the first side portion 520 of the perforated plate and the first side wall 312 of the housing may be greater than the angles between each of the second to fourth side portions of the perforated plate and each of the second to fourth side walls of the housing. According to an embodiment, the degree of inclination A1 of the first side portion 520 may be set to be less than the degree of inclination A2 of the second side portion 530. In other words, the angle between the first side portion 520 of the perforated plate and the first side wall 312 of the housing may be greater than the angle between the second side portion 530 of the perforated plate and the second side wall 313 of the housing.

[0080] The first side portion 520 has a first hole 521. Gas supplied from the airflow supply unit 400 is discharged into the interior space through the first hole 521. The first hole 521 is provided in a downwardly inclined direction toward the first sidewall 312 of the housing 310. Therefore, gas supplied from the airflow supply unit 400 can be directly discharged to the edge region in the interior space. A second hole 531 through which gas supplied from the airflow supply unit 400 is discharged is formed in the second side portion 530. The second hole 531 can be configured to directly discharge gas supplied from the airflow supply unit 400 in a downwardly inclined direction toward the second sidewall 313 of the housing 310. A third hole 541 through which gas supplied from the airflow supply unit 400 is discharged is formed in the third side portion 540. The third hole 541 can be configured to directly discharge gas supplied from the airflow supply unit 400 in a downwardly inclined direction toward the third sidewall 314 of the housing 310. A fourth hole 551 through which gas supplied from the airflow supply unit 400 is discharged is formed in the fourth side portion 550. The fourth hole 551 can be configured to directly discharge gas supplied from the airflow supply unit 400 in a downwardly inclined direction toward the fourth sidewall 315 of the housing 310. The bottom hole 511 through which the gas supplied from the airflow supply unit 400 is discharged is formed in the bottom portion 510.

[0081] The first hole 521, the second hole 531, the third hole 541, and the fourth hole 551 are formed in a portion of the perforated plate 500. For example, these holes (521, 531, 541, and 551) may occupy 30% or less of the top surface of the perforated plate 500. The first hole 521, the second hole 531, the third hole 541, the fourth hole 551, and the bottom hole 511 may have a diameter of 4 mm to 12 mm. The distance between the perforated plate 500 and the airflow supply unit 400 may be 10 mm to 80 mm. Gas from the airflow supply unit 400 flows individually through the first hole 521, the second hole 531, the third hole 541, and the fourth hole 551 and descends downward along the first sidewall 312, the second sidewall 313, the third sidewall 314, and the fourth sidewall 315, respectively, thereby preventing collisions between downward airflows in the internal space of the housing 310. As a result, airflow interference in the internal space can be minimized.

[0082] The first to fourth holes 521, 531, 541, and 551, as well as the bottom hole 511, can be formed in the respective side portions and bottom portions to occupy different areas on the top surface of the respective side portions and bottom portions. For example, the opening area of ​​the holes per unit area on the top surface of the respective side portions and bottom portions can be formed differently in at least two side portions and / or between the side portions and the bottom portion. For example, the opening area of ​​the first hole 521 per unit area on the top surface of the first side portion 520 can be smaller than the opening area of ​​the bottom hole 511 per unit area on the top surface of the bottom portion 510. The opening area of ​​the second hole 531 per unit area on the top surface of the second side portion 530 can be smaller than the opening area of ​​the bottom hole 511 per unit area on the top surface of the bottom portion 510, but larger than the opening area of ​​the first hole 521 per unit area on the top surface of the first side portion 520. The first to fourth holes 521, 531, 541, and 551 can be formed in each of the side and bottom portions, such that the distance between two adjacent holes in one side portion is different from the distance between two adjacent holes in another side portion and / or the bottom portion. For example, the distances d1 between holes in the first hole 521, d3 between holes in the second hole 531, d4 between holes in the third hole 541, d5 between holes in the fourth hole 551, and d2 between holes in the bottom hole 511 are different from each other. The distance d1 between holes in the first hole 521 can be set to be less than the distance d2 between holes in the bottom hole 511. The distance d3 between holes in the second hole 531 can be set to be greater than the distance d1 between holes in the first hole 521 and less than the distance d2 between holes in the bottom hole 511. The distances d4 between holes in the third hole 541 and d5 between holes in the fourth hole 551 can be set to be less than the distance d2 between holes in the bottom hole 511. Therefore, the area that is far from the first sidewall 312 of the processing container 320 and the outer casing 310 can greatly increase the downward airflow density compared to the area that is close to the second sidewall 313 of the processing container 320 and the outer casing 310.

[0083] Unlike the embodiments described above, the inclination degree of the first side portion 520b can be set to be equal to the inclination degree of the second side portion 530b, such as... Figure 6 As shown, Figure 6 show Figure 3 A modified example of a perforated plate. In some embodiments, the inclination degrees of the first side portion 520b, the second side portion 530b, the third side portion 540b, and the fourth side portion 550b may be set to be equal. In some embodiments, the inclination degrees of the first side portion 520b and the second side portion 530b may be equal, and the inclination degrees of the third side portion 540b and the fourth side portion 550b may be different from the equal inclination degree of the first side portion 520b.

[0084] The first to fourth holes 521b, 531b, 541b, and 551b can be formed in each of the side portions to occupy the same area on the top surface of each side portion. For example, the opening area of ​​the holes per unit area on the top surface of each side portion and the bottom portion can be formed equally in the side portions. The opening area of ​​the holes in all the side portions can be set to be smaller than the opening area of ​​the bottom hole 511b per unit area on the top surface of the bottom portion 510b. The first to fourth holes 521b, 531b, 541b, and 551b can be formed in each of the side portions and the bottom portion such that the distance between two adjacent holes in one side portion is equal to the distance between two adjacent holes in another side portion. The distance between two adjacent holes in a given side portion can be different from the distance between two adjacent holes in the bottom hole 511b.

[0085] The inclination of the first side portion 520c can be set to be equal to the inclination of the second side portion 530c, such as... Figure 7 As shown, unlike the embodiments described above, Figure 7 show Figure 3 A modified example of a perforated plate. In some embodiments, the inclination degrees of the first side portion 520c, the second side portion 530c, the third side portion 540c, and the fourth side portion 550c may be set to be equal. In some embodiments, the inclination degrees of the first side portion 520c and the second side portion 530c may be equal, and the inclination degrees of the third side portion 540c and the fourth side portion 550c may be different from the equal inclination degree of the first side portion 520c.

[0086] The opening areas of the holes per unit area on the top surfaces of the first side portion 520c, the second side portion 530c, the third side portion 540c, the fourth side portion 550c, and the bottom portion 510c can be set differently. In an embodiment, the opening area of ​​the first hole 521c per unit area on the top surface of the first side portion 520c can be set to be smaller than the opening area of ​​the bottom hole 511c per unit area on the top surface of the bottom portion 510c. The opening areas of the second hole 531c, the third hole 541c, and the fourth hole 551c per unit area on the top surfaces of the second side portion 530c, the third side portion 540c, and the fourth side portion 550c can be smaller than the opening area of ​​the bottom hole 511c per unit area on the top surface of the bottom portion 510c, and larger than the opening area of ​​the first hole 521c per unit area on the top surface of the first side portion 520c. In some embodiments, the opening area of ​​the second hole 531c per unit area on the top surface of the second side portion 530c is greater than the opening area of ​​the first hole 521c per unit area on the top surface of the first side portion 520c, and smaller than the opening area of ​​the bottom hole 511c per unit area on the top surface of the bottom portion 510c, the opening area of ​​the third hole 541c per unit area on the top surface of the third side portion 540c, and the opening area of ​​the fourth hole 551c per unit area on the top surface of the fourth side portion 550c.

[0087] The distances between the first hole 521c, the second hole 531c, the third hole 541c, the fourth hole 551c, and the bottom hole 511c can be set differently. The distance between the holes in the first hole 521c can be less than the distance between the holes in the bottom hole 511c. The distance between the holes in the second hole 531c can be greater than the distance between the holes in the first hole 521c but less than the distance between the holes in the bottom hole 511c. The distances between the holes in the third hole 541c and the fourth hole 551c can be less than the distance between the holes in the bottom hole 511c.

[0088] Unlike the above embodiment, the inclination degrees of the first side portion 520d, the second side portion 530d, the third side portion 540d, and the fourth side portion 550d can be set differently, such as... Figure 8 As shown, Figure 8 show Figure 3 A modified example of the perforated plate. In one embodiment, the inclination of the first side portion 520d can be set to be less than the inclination of the second side portion 530d, the third side portion 540d, and the fourth side portion 550d.

[0089] The opening area per unit area of ​​the top surface of the first side portion 520d, the opening area per unit area of ​​the top surface of the second side portion 530d, the opening area per unit area of ​​the top surface of the third side portion 540d, and the opening area per unit area of ​​the top surface of the fourth side portion 550d are the same, but smaller than the opening area per unit area of ​​the bottom hole 511d on the top surface of the bottom portion 510d. The distance between the holes in the first hole 521d, the second hole 531d, the third hole 541d, and the fourth hole 551d can be set to be the same, and can be different from the distance between the holes in the bottom hole 511d.

[0090] Figure 9 It is an illustrative example. Figure 3 A cross-sectional view of another embodiment of the processing chamber. Figure 9 It may further include an imaging unit 700, which provides Figure 3 The same processing chamber 300 as in the embodiment acquires an image of the object. (See reference...) Figure 9 The imaging unit 700 can image the object to be imaged in a downwardly inclined direction, that is, the optical axis of the imaging unit forms an acute angle with respect to a horizontal plane (e.g., with respect to a plane defined by the top surface of the support unit or a plane defined by the top surface of the substrate supported by the support unit). In one embodiment, the object to be imaged may be a substrate supported by the substrate support unit 340 or a nozzle 374 of the liquid supply unit 370. The imaging unit 700 may be mounted on a first sidewall 312 of the housing 310. The imaging unit 700 may be mounted adjacent to a first end of the first side portion on the first sidewall of the housing, opposite to a second end of the first side portion that connects to the bottom portion. The first side portion 520 of the perforated plate 500 is configured as an inclined surface. The imaging unit 700 is mounted at a position adjacent to the first side portion 520 of the perforated plate 500. The imaging unit 700 may be disposed at a height corresponding to the height of the first side portion 520. Therefore, in a structure with a perforated plate for providing downward airflow, the mounting space for the imaging unit 700 can be ensured, the viewing angle of the imaging unit 700 can be preserved, and downward airflow can be provided to the entire interior space at the same time.

[0091] Figure 10 and Figure 11 The diagram schematically illustrates the airflow within the processing chamber when the perforated plate does not include the inclined side portions and only has a bottom portion, and when the perforated plate has both a bottom portion and inclined side portions. The perforated plate 500 of the above embodiment is described as having inclined side portions. When the perforated plate 500 has only a bottom portion and does not have inclined side portions, as... Figure 10As shown, the airflow stagnates due to the collision between the downward airflow and the upward airflow following the downward airflow in the outer region of the processing container 320 in the internal space.

[0092] However, in the case where the perforated plate 500 has a bottom portion 510 and an inclined side portion according to an exemplary embodiment of the present invention, such as Figure 11 As shown, the gas is discharged through the inclined side portion, thereby minimizing the collision between the downward airflow and the upward airflow following the downward airflow in the outer region of the processing container 320. Therefore, the amount of downward airflow that may interfere with the upward airflow following the downward airflow in the outer region of the processing container 320 is small, and airflow stagnation does not occur.

[0093] Figure 12 schematically shown Figure 2 Another embodiment of the processing chamber. See reference. Figure 12 The perforated plate 500e has a bottom portion 510e and a side portion. The side portion has a first side portion 520e adjacent to a first sidewall 312 of the housing 310. The first side portion 520e extends from each side of the bottom portion 510e toward the first sidewall 312. The first side portion 520e is configured to slope upward toward the first sidewall 312 as its surface faces upward.

[0094] A first hole 521 is formed at the first side portion 520e. Gas supplied from the airflow supply unit 400 is discharged into the interior space through the first hole 521e. The first hole 521e is located in a downwardly inclined direction toward the first sidewall 312 of the housing 310. Therefore, gas supplied from the airflow supply unit 400 can be directly discharged into the edge region of the interior space. A bottom hole 511e is formed at the bottom portion 510e. Gas supplied from the airflow supply unit 400 can be directly discharged toward the processing space through the bottom hole 511e.

[0095] The opening area of ​​the first hole 521e per unit area on the top surface of the first side portion 520e is configured to be different from the opening area of ​​the bottom hole 511e per unit area on the top surface of the bottom portion 510e. The bottom hole 511e and the first hole 521e are formed in the respective bottom and side portions to occupy a portion of the perforated plate 500, for example, the bottom hole 511e and the first hole 521e may occupy 30% or less of the top surface of the perforated plate 500e. The distance between the perforated plate 500e and the airflow supply unit 400 may be from 10 mm to 80 mm. The first hole 521e and the bottom hole 511e may have diameters ranging from 4 mm to 12 mm. Gas discharged through the first hole 521e formed at the inclined first side portion 520e flows downward along the first sidewall 312, thereby minimizing airflow interference caused by downward airflow in the internal space of the housing 310.

[0096] Figure 13 schematically shown Figure 12 Perforated plate. (Reference) Figure 13 The opening area of ​​the first hole 521e per unit area of ​​the top surface of the first side portion 520e can be set to be smaller than the opening area of ​​the bottom hole 511e per unit area of ​​the top surface of the bottom portion 510e. The distance d1 between the holes in the first hole 521e is set to be smaller than the distance d2 between the holes in the bottom hole 511e. Therefore, in the region adjacent to the first sidewall 312 having a relatively large internal space, the downward airflow density can be relatively large. In some embodiments, the opening area of ​​the first hole 521e per unit area of ​​the top surface of the first side portion 520e can be set to be equal to the opening area of ​​the bottom hole 511e per unit area of ​​the top surface of the bottom portion 510e. In some embodiments, the distance d1 between the holes in the first hole 521e and the distance d2 between the holes in the bottom hole 511e can be set to be the same.

[0097] Figure 14 schematically shown Figure 2 Another embodiment of the processing chamber. See reference. Figure 14 The perforated plate 500f uniformly discharges the gas supplied by the airflow supply unit 400 into the interior space of the housing 310. The perforated plate 500f is spaced downward from the airflow supply unit 400 and arranged above the processing container 320. The perforated plate 500f has a bottom portion 510f and a side portion. The side portion has a first side portion 520f adjacent to the first sidewall 312 of the housing 310. The first side portion 520f extends from each side of the bottom portion 510f toward the first sidewall 312. The first side portion 520f is configured to slope upward toward the first sidewall 312. The remaining sides of the bottom portion 510f, except for the side connected to the first side portion 520f, contact the second sidewall 313, the third sidewall 314, and the fourth sidewall 315 of the housing 310.

[0098] A first hole 521f through which gas supplied from the airflow supply unit 400 is discharged is formed in a first side portion 520f. The first hole 521f can be configured to directly discharge the gas supplied from the airflow supply unit 400 in a downwardly inclined direction toward the first sidewall 312 of the housing 310. A bottom hole 511f through which gas supplied from the airflow supply unit 400 is discharged is formed in a bottom portion 510f. The bottom hole 511f and the first hole 521f are formed in their respective bottom and side portions to occupy a portion of the perforated plate 500f; for example, the bottom hole 511f and the first hole 521f may occupy 30% or less of the top surface of the perforated plate 500f. The first hole 521f and the bottom hole 511f may have diameters ranging from 4 mm to 12 mm. The distance between the perforated plate 500f and the airflow supply unit 400 can be formed to be from 10 mm to 80 mm. By allowing the gas discharged from the first hole 521f to travel downward along the first sidewall 312, airflow disturbance caused by downward airflow in the interior space of the housing 310 can be minimized.

[0099] The opening area of ​​the first hole 521f per unit area on the top surface of the first side portion 520f is set to be different from the opening area of ​​the bottom hole 511f per unit area on the top surface of the bottom portion 510f. In one embodiment, the opening area of ​​the first hole 521f per unit area on the top surface of the first side portion 520f may be set to be smaller than the opening area of ​​the bottom hole 511f per unit area on the top surface of the bottom portion 510f. The distance between the holes in the first hole 521f is set to be smaller than the distance between the holes in the bottom hole 511f. In the region adjacent to the first sidewall 312 having a relatively large internal space, the downward airflow density may be relatively large.

[0100] In the above embodiments, cases where the perforated plate has a first side portion, and cases where the perforated plate has a first side portion, a second side portion, a third side portion, and a fourth side portion, are provided as examples. However, the side portion of the perforated plate may have two or three side portions. In the above embodiments, the opening area and spacing of the holes formed in the perforated plate have been described in various embodiments, but the embodiments of the present invention are not limited thereto and can be modified in various ways.

[0101] Figure 15 schematically shown Figure 12 Another embodiment of the processing chamber. Figure 15 It may further include an imaging unit 700, which provides Figure 12 The same processing chamber 300 as in the embodiment acquires an image of the object to be imaged through imaging. (See reference...) Figure 15The imaging unit 700 can image the object to be imaged in a downwardly tilted direction, that is, the optical axis of the imaging unit forms an acute angle with respect to a horizontal plane (e.g., with respect to a plane defined by the top surface of the support unit or a plane defined by the top surface of the substrate supported by the support unit). In one embodiment, the imaging unit 700 can image the substrate supported by the substrate support unit 340 or the nozzle 374 of the liquid supply unit 370, which is the object to be imaged. The imaging unit 700 can be mounted on the first sidewall 312 of the housing 310. The imaging unit 700 can be mounted adjacent to the first end of the first side portion, opposite to the second end of the first side portion connected to the bottom portion, on the first sidewall of the housing. The imaging unit 700 can be disposed at a height corresponding to the inclined surface of the first side portion 520e, adjacent to the first side portion 520e of the perforated plate 500e. Therefore, in a structure with a perforated plate for providing downward airflow, the mounting space for the imaging unit 700 can be ensured, the viewing angle of the imaging unit 700 can be preserved, and downward airflow can be provided to the entire interior space at the same time.

[0102] Figure 16 schematically shown Figure 14 Another embodiment of the processing chamber. Figure 16 It may further include an imaging unit 700, which provides Figure 14 The same processing chamber 300 as in the embodiment acquires an image of the object to be imaged through imaging. (See reference...) Figure 16 The imaging unit 700 can image the object to be imaged in a downwardly tilted direction, that is, the optical axis of the imaging unit forms an acute angle with respect to a horizontal plane (e.g., with respect to a plane defined by the top surface of the support unit or a plane defined by the top surface of the substrate supported by the support unit). In one embodiment, the imaging unit 700 can image the substrate supported by the substrate support unit 340 or the nozzle 374 of the liquid supply unit 370, which is the object to be imaged. The imaging unit 700 can be mounted on the first sidewall 312 of the housing 310. The imaging unit 700 can be mounted adjacent to the first end of the first side portion, opposite to the second end of the first side portion connected to the bottom portion, on the first sidewall of the housing. The imaging unit 700 can be disposed at a height corresponding to the inclined surface of the first side portion 520f, adjacent to the first side portion 520f of the perforated plate 500f. Therefore, in a structure with a perforated plate for providing downward airflow, the mounting space for the imaging unit 700 can be ensured, the viewing angle of the imaging unit 700 can be preserved, and downward airflow can be provided to the entire interior space at the same time.

[0103] The effects of this invention are not limited to those described above, and those skilled in the art to which this invention pertains will clearly understand any effects not mentioned based on this specification and the drawings. Although preferred embodiments of this invention have been illustrated and described to date, this invention is not limited to the specific embodiments described above, and it should be noted that those skilled in the art to which this invention pertains can implement this invention in various ways without departing from the spirit of the invention claimed in the claims, and modifications should not be interpreted as downward airflow density separate from the technical spirit or vision of this invention.

Claims

1. A substrate processing apparatus, the substrate processing apparatus comprising: An outer casing having an internal space therein; A processing container, the processing container being arranged within the internal space and having a processing space; A substrate support unit that supports a substrate in the processing space; A liquid supply unit supplies liquid to the substrate supported by the substrate support unit; An exhaust unit that discharges the flue gas generated in the processing space; An airflow supply unit is coupled to the top side of the housing and supplies gas to the interior space to form a downward airflow; and A perforated plate, disposed between the processing container and the airflow supply unit, discharges the gas into the internal space. The perforated plate comprises: The bottom portion and the side portion, the side portion including a first side portion, the first side portion extending from the bottom portion and sloping upward to a first sidewall of the housing and having a first hole for discharging the gas, the first side portion being connected to the uppermost end of the first sidewall of the housing; The bottom portion of the perforated plate has a bottom hole for discharging the gas, and the distance between the first holes in the first side portion is smaller than the distance between the bottom holes in the bottom portion.

2. The substrate processing apparatus according to claim 1, wherein the opening area of ​​the first hole per unit area of ​​the first side portion is different from the opening area of ​​the bottom hole per unit area of ​​the bottom portion.

3. The substrate processing apparatus according to claim 2, wherein the opening area of ​​the first hole per unit area of ​​the top surface of the first side portion is smaller than the opening area of ​​the bottom hole per unit area of ​​the top surface of the bottom portion.

4. The substrate processing apparatus according to any one of claims 1 to 3, wherein the first hole is configured to directly discharge the gas in a downwardly inclined direction toward the first sidewall of the housing.

5. The substrate processing apparatus according to claim 2 or 3, wherein the side portion of the perforated plate further comprises a second side portion having a second hole for discharging the gas. The second side portion, opposite to the first side portion, extends from the bottom portion and slopes upward to the second sidewall of the housing, the second sidewall of the housing being opposite to the first sidewall of the housing.

6. The substrate processing apparatus of claim 5, wherein the first angle between the first side portion of the perforated plate and the first sidewall of the housing is different from the second angle between the second side portion of the perforated plate and the second sidewall of the housing.

7. The substrate processing apparatus of claim 6, wherein the first angle is greater than the second angle, and the opening area of ​​the first hole per unit area of ​​the first side portion is set to be smaller than the opening area of ​​the bottom hole per unit area of ​​the bottom portion, and The opening area of ​​the second hole per unit area of ​​the second side portion is smaller than the opening area of ​​the bottom hole per unit area of ​​the top surface of the bottom portion, and larger than the opening area of ​​the first hole per unit area of ​​the top surface of the first side portion.

8. The substrate processing apparatus of claim 5, wherein the side portion of the perforated plate further comprises: a third side portion located between the first side portion and the second side portion and having a third hole for discharging the gas; and a fourth side portion opposite to the third side portion and located between the first side portion and the second side portion and having a fourth hole for discharging the gas. The third side portion extends from the bottom portion and slopes upward to the third sidewall of the housing, and The fourth side portion extends from the bottom portion and slopes upward to the fourth sidewall of the housing.

9. The substrate processing apparatus of claim 8, wherein the angle between the first side portion of the perforated plate and the first sidewall of the housing is greater than the angle between each of the second to fourth side portions of the perforated plate and each of the second to fourth sidewalls of the housing. The opening area of ​​the first hole per unit area of ​​the first side portion is set to be smaller than the opening area of ​​the bottom hole per unit area of ​​the bottom portion, and The opening area of ​​each of the second holes to the fourth holes per unit area in the second side portion to the fourth side portion is smaller than the opening area of ​​the bottom hole per unit area in the bottom portion, and larger than the opening area of ​​the first hole per unit area in the first side portion.

10. The substrate processing apparatus according to any one of claims 1 to 3, wherein the side portion comprises a plurality of side portions including the first side portion, and the plurality of side portions excluding the first side portion are in contact with each sidewall of the housing.

11. The substrate processing apparatus according to any one of claims 1 to 3, wherein the airflow supply unit comprises: A filter for removing impurities from the gas flowing into the filter; and A fan is arranged on the top surface of the housing to create a downward airflow in the interior space.

12. The substrate processing apparatus according to any one of claims 1 to 3, wherein the substrate processing apparatus further comprises: An imaging unit is mounted adjacent to a first end of the first side portion on the first side wall of the housing, the first end being opposite to a second end of the first side portion connected to the bottom portion, the imaging unit being mounted such that the optical axis of the imaging unit forms an acute angle with respect to the horizontal plane.

13. A substrate processing apparatus, the substrate processing apparatus comprising: An outer casing having an internal space and including a first sidewall and a second sidewall; A processing container, the processing container being arranged within the internal space and having a processing space; A substrate support unit that supports a substrate in the processing space; A liquid supply unit supplies liquid to the substrate supported by the substrate support unit; An exhaust unit that discharges the flue gas generated in the processing space; An airflow supply unit is coupled to the top side of the housing and supplies gas to the interior space to form a downward airflow; and A perforated plate, disposed between the processing container and the airflow supply unit, discharges the gas into the internal space. The perforated plate comprises: The bottom portion has a bottom hole for discharging the gas in a direction perpendicular to the top surface of the substrate supported by the support unit; and A first side portion extends upward from the bottom portion to the first sidewall of the housing and has a first hole for discharging the gas toward the first sidewall of the housing; the first side portion is connected to the uppermost end of the first sidewall of the housing. The distance between the first holes in the first side portion is less than the distance between the bottom holes in the bottom portion.

14. The substrate processing apparatus of claim 13, wherein the opening area of ​​the first hole per unit area of ​​the top surface of the first side portion is set to be smaller than the opening area of ​​the bottom hole per unit area of ​​the top surface of the bottom portion.

15. The substrate processing apparatus of claim 14, wherein the perforated plate includes a second side portion extending from the bottom portion and inclined upward to the second sidewall of the housing and having a second hole for discharging the gas toward the second sidewall of the housing. The angle between the first side portion and the first sidewall is greater than the angle between the second side portion and the second sidewall, and The opening area of ​​the second hole per unit area of ​​the second side portion is smaller than the opening area of ​​the bottom hole per unit area of ​​the bottom portion, but larger than the opening area of ​​the first hole per unit area of ​​the first side portion.

16. The substrate processing apparatus according to any one of claims 13 to 15, wherein the substrate processing apparatus further comprises: An imaging unit is mounted adjacent to a first end of the first side portion on the first side wall of the housing, the first end being opposite to a second end of the first side portion connected to the bottom portion, the imaging unit being mounted such that the optical axis of the imaging unit forms an acute angle with respect to a horizontal plane defined by the top surface of the substrate support unit.

17. A substrate processing apparatus, the substrate processing apparatus comprising: An outer casing having an internal space and including a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall; A processing container, the processing container being arranged within the internal space and having a processing space; A substrate support unit that supports a substrate in the processing space; A liquid supply unit supplies liquid to the substrate supported by the substrate support unit; An exhaust unit that discharges the flue gas generated in the processing space; An airflow supply unit is coupled to the top side of the housing and supplies gas to the interior space to form a downward airflow; and A perforated plate, disposed between the processing container and the airflow supply unit, discharges the gas into the internal space. The perforated plate comprises: The bottom portion includes a bottom hole for discharging the gas in a direction perpendicular to the top surface of the substrate supported by the support unit; and A first side portion extends upward from the bottom portion to the first sidewall of the housing and has a first hole for discharging the gas toward the first sidewall of the housing; the first side portion is connected to the uppermost end of the first sidewall of the housing. The distance between the first holes in the first side portion is less than the distance between the bottom holes in the bottom portion.

18. The substrate processing apparatus of claim 17, wherein the perforated plate further comprises a second side portion, a third side portion, and a fourth side portion, the second side portion, the third side portion, and the fourth side portion extending from the bottom portion and inclined upward to the second sidewall, the third sidewall, and the fourth sidewall, respectively, and The angle between the first side portion of the perforated plate and the first sidewall of the housing is greater than the angle between each of the second to fourth side portions of the perforated plate and each of the second to fourth sidewalls of the housing.

19. The substrate processing apparatus of claim 18, wherein the opening area of ​​each of the second to fourth holes per unit area on the top surface of the second to fourth side portions is greater than the opening area of ​​the first hole per unit area on the top surface of the first side portion.

20. The substrate processing apparatus according to any one of claims 17 to 19, wherein the substrate processing apparatus further comprises: An imaging unit is mounted adjacent to a first end of the first side portion on the first side wall of the housing, the first end being opposite to a second end of the first side portion connected to the bottom portion, the imaging unit being mounted such that the optical axis of the imaging unit forms an acute angle with respect to a horizontal plane defined by the top surface of the substrate support unit.

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