Substrate processing apparatus and substrate processing method

Abstract

A substrate processing apparatus and a substrate processing method are provided. The substrate processing apparatus (100) has a processing unit, a storage portion (31), a processing liquid pipe (32), a pump (34), a filter (35), a first flow portion (36), a first return pipe (51), a first adjustment valve (52), a second return pipe (41), a branch supply pipe (16), a second flow portion (42), and a control portion. The first flow portion (36) is disposed in the processing liquid pipe (32) and measures a flow rate or a pressure of a processing liquid flowing in the processing liquid pipe (32). The first adjustment valve (52) is disposed in the first return pipe (51) and adjusts a flow rate of the processing liquid flowing in the first return pipe (51). The control portion controls an opening degree of the first adjustment valve (52) in accordance with the flow rate or the pressure of the processing liquid measured by the first flow portion (36).

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus and a substrate processing method. Background Technology

[0002] In the manufacturing process of semiconductor devices or liquid crystal display devices, substrate processing apparatuses are used to process substrates such as semiconductor wafers or glass substrates for liquid crystal display devices. Single-sheet substrate processing apparatuses that process substrates one by one are disclosed. Such substrate processing apparatuses include: a processing unit; a processing liquid tank that stores processing liquid supplied to the processing unit; a circulation piping that circulates the processing liquid in the processing liquid tank; a pump that delivers the processing liquid in the processing liquid tank to the circulation piping; and a filter that filters the processing liquid flowing in the circulation piping (for example, see Patent Documents 1 and 2).

[0003] Existing technical documents

[0004] Patent Document 1: Japanese Patent Application Publication No. 2013-175552

[0005] Patent Document 2: Japanese Patent Application Publication No. 2007-266211 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] However, in the substrate processing apparatus described in Patent Documents 1 and 2, there are cases where multiple particles in the processing liquid are not sufficiently removed by the filter.

[0008] The present invention was made in view of the above-mentioned problems, and its object is to provide a substrate processing apparatus and a substrate processing method capable of supplying a processing liquid with a low particle content to a processing unit.

[0009] Methods for solving problems

[0010] The substrate processing apparatus of the present invention includes: a processing unit, a storage unit, a processing liquid piping, a pump, a filter, a first flow section, a first return pipe, a first adjusting valve, a second return pipe, a branch supply pipe, a second flow section, and a control unit. The processing unit processes the substrate using a processing liquid. The storage unit stores the processing liquid. The processing liquid piping is connected to the storage unit to supply the processing liquid. The pump is disposed on the processing liquid piping and supplies the processing liquid from the storage unit to the processing unit. The filter is disposed on the processing liquid piping to capture particles in the processing liquid. The first flow section is disposed on the processing liquid piping to measure the flow rate or pressure of the processing liquid flowing in the processing liquid piping. The first return pipe is connected to the downstream end of the processing liquid piping and returns the processing liquid to the storage unit. The first adjusting valve is disposed on the first return pipe to adjust the flow rate of the processing liquid flowing in the first return pipe. The second return pipe is connected to the downstream end of the processing liquid piping and returns the processing liquid to the storage unit. The branch supply pipe branches off from the second return pipe and supplies the processing fluid to the processing unit. The second flow meter measures the flow rate of the processing fluid flowing in the second return pipe. The control unit controls the opening of the first adjusting valve based on the flow rate or pressure of the processing fluid measured by the first flow meter.

[0011] The substrate processing apparatus of the present invention includes: a processing unit, a storage unit, a processing liquid piping, a pump, a filter, a first flow meter, a first return pipe, a first adjusting valve, a second return pipe, a branch supply pipe, a second flow meter, and a control unit. The processing unit processes the substrate using a processing liquid. The storage unit stores the processing liquid. The processing liquid piping is connected to the storage unit to supply the processing liquid. The pump is disposed on the processing liquid piping and supplies the processing liquid from the storage unit to the processing unit. The filter is disposed on the processing liquid piping to capture particles in the processing liquid. The first flow meter is disposed on the processing liquid piping to measure the flow rate of the processing liquid flowing in the processing liquid piping. The first return pipe is connected to the downstream end of the processing liquid piping and returns the processing liquid to the storage unit. The first adjusting valve is disposed on the first return pipe to adjust the flow rate of the processing liquid flowing in the first return pipe. The second return pipe is connected to the downstream end of the processing liquid piping and returns the processing liquid to the storage unit. The branch supply pipe branches off from the second return pipe and supplies the treatment fluid to the processing unit. A second flow meter is disposed on the second return pipe, located upstream of the branch supply pipe, and measures the flow rate of the treatment fluid flowing in the branch supply pipe. The control unit controls the opening degree of the first adjusting valve based on the flow rate of the treatment fluid measured by the first flow meter.

[0012] In one embodiment, the second flow section is disposed in the second return pipe, located further downstream than the branch supply pipe, and the pressure of the processing liquid flowing in the second return pipe is measured.

[0013] In one embodiment, the control unit controls the opening of the first adjusting valve so that the flow rate of the treatment fluid flowing in the treatment fluid piping becomes a predetermined flow rate.

[0014] In one embodiment, the substrate processing apparatus further includes a temperature controller disposed in the processing liquid piping. The temperature controller adjusts the temperature of the processing liquid flowing in the processing liquid piping.

[0015] In one embodiment, the substrate processing apparatus further includes a second regulating valve disposed in the second return pipe, for regulating the flow rate of the processing liquid flowing in the second return pipe. The control unit controls the opening degree of the first regulating valve and the opening degree of the second regulating valve.

[0016] In one embodiment, the substrate processing apparatus further includes: a thermometer disposed in the processing liquid piping to measure the temperature of the processing liquid flowing in the processing liquid piping, and a control unit controlling the opening degree of the second adjusting valve based on the temperature of the processing liquid measured by the thermometer.

[0017] In one embodiment, the processing unit includes: a nozzle disposed at the downstream end of the branch supply pipe; a switching unit that switches the supply and cessation of the processing liquid from the branch supply pipe to the nozzle; and a third return pipe that branches off from the branch supply pipe and connects to the second return pipe further downstream than the second regulating valve.

[0018] The substrate processing method of the present invention is a substrate processing apparatus comprising: a processing unit that processes a substrate using a processing liquid; a storage unit that stores the processing liquid; a processing liquid piping connected to the storage unit for supplying the processing liquid; a pump disposed on the processing liquid piping; a filter disposed on the processing liquid piping; a first flow section disposed on the processing liquid piping; a first return pipe connected to the downstream end of the processing liquid piping for returning the processing liquid to the storage unit; a first adjusting valve disposed on the first return pipe for adjusting the flow rate of the processing liquid flowing in the first return pipe; a second return pipe connected to the downstream end of the processing liquid piping for returning the processing liquid to the storage unit; a branch supply pipe branching from the second return pipe for supplying the processing liquid to the processing unit; and a second flow section disposed on the second return pipe. The substrate processing method includes: a step of supplying the processing liquid from the storage unit to the processing liquid piping; a step of capturing particles in the processing liquid; a step of measuring the flow rate or pressure of the processing liquid flowing in the processing liquid piping; a step of measuring the flow rate or pressure of the processing liquid flowing in the second return pipe; and a step of controlling the opening of the first adjusting valve based on the flow rate or pressure of the processing liquid measured by the first flow unit.

[0019] Invention Effects

[0020] According to the substrate processing apparatus and substrate processing method of the present invention, a processing liquid with a low particle content can be supplied to the processing unit. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the substrate processing apparatus according to Embodiment 1 of the present invention.

[0022] Figure 2 This is a schematic diagram of the processing tower included in the substrate processing apparatus of Embodiment 1.

[0023] Figure 3 This is a block diagram illustrating the substrate processing apparatus of Embodiment 1.

[0024] Figure 4 This is a schematic diagram of the substrate processing apparatus according to Embodiment 1.

[0025] Figure 5 This is a flowchart illustrating the processing performed by the control unit of the substrate processing apparatus in Embodiment 1.

[0026] Figure 6 This is a schematic diagram of the processing tower included in the substrate processing apparatus of Embodiment 2 of the present invention.

[0027] Figure 7This is a schematic diagram of the processing tower included in the substrate processing apparatus of Embodiment 3 of the present invention.

[0028] Figure 8 This is a schematic diagram of the substrate processing apparatus according to Embodiment 4 of the present invention.

[0029] Figure 9 This is a schematic diagram of the processing tower included in the substrate processing apparatus of Embodiment 4.

[0030] Figure 10 This is a block diagram illustrating the substrate processing apparatus of Embodiment 4.

[0031] Explanation of reference numerals in the attached figures

[0032] 16: Branch supply pipe; 31: Processing liquid tank (storage section); 32: Processing liquid piping; 34: Pump; 35: Filter; 36: First flow meter; 41: External circulation piping (second return pipe); 42: External circulation flow meter (second flow meter); 51: First return pipe; 52: First regulating valve; 100: Substrate processing device. Detailed Implementation

[0033] The following refers to the attached diagram ( Figures 1-10 The embodiments of the present invention will be described below. However, the present invention is not limited to the following embodiments. In addition, descriptions that are repeated are sometimes appropriately omitted. Also, in the figures, the same or equivalent parts are labeled with the same reference numerals without being described repeatedly.

[0034] The substrate processing apparatus and method of the present invention can be used on various substrates, such as semiconductor wafers, photomask glass substrates, liquid crystal display glass substrates, plasma display glass substrates, FED (Field Emission Display) substrates, optical disc substrates, magnetic disk substrates, and optical disk substrates, as the substrates to be processed. Hereinafter, this embodiment will be described primarily using a disc-shaped semiconductor wafer as an example, but the substrate processing apparatus and method of the present invention can also be applied to various substrates other than semiconductor wafers. Furthermore, the shape of the substrate is not limited to a disc shape; the substrate processing apparatus and method of the present invention can be applied to substrates of various shapes.

[0035] In this embodiment, the "processing solution" includes: an etching solution, a rinsing solution, SC1, and SC2. The etching solution etches the substrate W. Examples of the etching solution include fluoronitric acid (a mixture of hydrofluoric acid (HF) and nitric acid (HNO3), hydrofluoric acid, borofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), sulfuric acid (H2SO4), or phosphoric acid (H3PO4). The rinsing solution rinses the substrate W. Specifically, the rinsing solution is used to rinse away any remaining etching solution on the substrate W. Examples of the rinsing solution include deionized water, carbonated water, electrolyzed ionized water, hydrogen water, ozone water, hydrochloric acid diluted to a concentration of approximately 10 ppm to 100 ppm, or an organic solvent. Examples of organic solvents include IPA (isopropanol) or sulfuric acid. SC1 and SC2 clean the substrate W respectively. SC1 is, for example, a mixture containing NH4OH and H2O2. The processing solution is not particularly limited; in embodiments 1 to 3, the case where the processing solution is IPA will be described below.

[0036] [Implementation Method 1]

[0037] The following is for reference Figures 1-5 Embodiment 1 of the present invention will be described. First, refer to... Figure 1 and Figure 2 The substrate processing apparatus 100 of Embodiment 1 will be described. Figure 1 This is a schematic diagram of the substrate processing apparatus 100 according to Embodiment 1. In detail, Figure 1 This is a schematic cross-sectional view of the substrate processing apparatus 100. The substrate processing apparatus 100 processes the substrate W. More specifically, the substrate processing apparatus 100 is a single-sheet apparatus.

[0038] like Figure 1 As shown, the substrate processing apparatus 100 includes: multiple processing towers 10, multiple branch supply pipes 16, multiple external circulation pipes 41, a fluid tank 30, and a platform 20. The multiple external circulation pipes 41 are examples of "second return pipes".

[0039] Fluid cabinet 30 includes a processing liquid tank 31. The processing liquid tank 31 is an example of a "storage section". The processing liquid tank 31 stores the processing liquid.

[0040] Multiple external circulation pipes 41 respectively return the processed liquid supplied from the fluid tank 30 to the processed liquid tank 31. Each of the multiple external circulation pipes 41 is a tubular component with a flow path for the processed liquid. Specifically, the upstream end of each of the multiple external circulation pipes 41 is connected to the fluid tank 30. The downstream end of each of the multiple external circulation pipes 41 is connected to the processed liquid tank 31.

[0041] Specifically, the plurality of external circulation pipes 41 include, for example, a first external circulation pipe 41A, a second external circulation pipe 41B, and a third external circulation pipe 41C. In other words, the substrate processing apparatus 100 of Embodiment 1 has three external circulation pipes 41.

[0042] The plurality of processing towers 10 includes, for example, a first processing tower 10A, a second processing tower 10B, and a third processing tower 10C. In other words, the substrate processing apparatus 100 of Embodiment 1 has three processing towers 10. The plurality of processing towers 10 have the same structure as each other.

[0043] The multiple branch supply pipes 16 include, for example, a first branch supply pipe 16A, a second branch supply pipe 16B, and a third branch supply pipe 16C. The first branch supply pipe 16A branches off from the first external circulation pipe 41A and supplies the processed liquid to the first processing tower 10A. The second branch supply pipe 16B branches off from the second external circulation pipe 41B and supplies the processed liquid to the second processing tower 10B. The third branch supply pipe 16C branches off from the third external circulation pipe 41C and supplies the processed liquid to the third processing tower 10C.

[0044] Next, refer to Figure 2 The first processing tower 10A will be described. Figure 2 This is a schematic diagram of the processing tower 10 included in the substrate processing apparatus 100 of Embodiment 1. More specifically, Figure 2 This is a schematic cross-sectional view of the processing tower 10. (See attached image.) Figure 2 As shown, the first processing tower 10A has multiple processing units 11.

[0045] Multiple processing units 11 supply processing liquid to the substrate W to process the substrate W. The multiple processing units 11 are single-sheet processing units 11 that process the substrate W one by one.

[0046] Specifically, the first processing tower 10A includes a plurality of processing units 11 stacked vertically. The plurality of processing units 11 includes, for example, a first processing unit 11A, a second processing unit 11B, and a third processing unit 11C. In other words, the processing unit 11 of Embodiment 1 has three processing units 11.

[0047] The first branch supply pipe 16A includes, for example, a first supply pipe 16AA, a second supply pipe 16AB, and a third supply pipe 16AC. The first branch supply pipe 16A is a tubular component having a flow path for the processing liquid to flow through.

[0048] The first supply pipe 16AA supplies processing fluid to the first processing unit 11A from the first external circulation pipe 41A. The second supply pipe 16AB supplies processing fluid to the second processing unit 11B from the first external circulation pipe 41A. The third supply pipe 16AC supplies processing fluid to the third processing unit 11C from the first external circulation pipe 41A. The multiple processing units 11 have the same structure as each other. The first processing unit 11A will be described below.

[0049] The first processing unit 11A includes a chamber 12, a rotary chuck 13, a nozzle 14, and an on / off valve 15. The chamber 12 has a generally box-shaped form. The chamber 12 houses the substrate W, the rotary chuck 13, and the nozzle 14. The rotary chuck 13 holds the substrate W in a horizontal position while rotating the substrate W about a vertical axis of rotation passing through the center of the substrate W.

[0050] Nozzle 14 is connected to the downstream end of the first supply pipe 16AA. Nozzle 14 is positioned above the substrate W. As a result, nozzle 14 sprays processing liquid from above the substrate W toward the substrate W.

[0051] The on / off valve 15 opens and closes the first supply pipe 16AA. That is, the on / off valve 15 switches the supply and cessation of the treatment fluid from the first external circulation pipe 41A to the nozzle 14. The on / off valve 15 is, for example, a motor needle valve that is electrically controlled to open and close.

[0052] Next, the fluid cabinet 30 will be described in detail. Specifically, the fluid cabinet 30 also includes a processing fluid piping 32 and a first return pipe 51.

[0053] The processing fluid piping 32 is connected to the processing fluid tank 31. Specifically, the upstream end of the processing fluid piping 32 is connected to the processing fluid tank 31. The processing fluid piping 32 is a tubular component having a flow path for the processing fluid to flow. Furthermore, the cross-sectional area of ​​the flow path of the processing fluid piping 32 in a plane perpendicular to the flow direction of the processing fluid is greater than the total cross-sectional area. The total cross-sectional area represents the area obtained by adding the cross-sectional areas of the flow paths of the first external circulation piping 41A, the second external circulation piping 41B, and the third external circulation piping 41C.

[0054] The fluid tank 30 also includes a pump 34, a filter 35, a first flow meter 36, and a heater 37. The first flow meter 36 is an example of a "first flow section". The heater 37 is an example of a "temperature controller". The first flow meter 36, pump 34, heater 37, and filter 35 are arranged in this order from upstream to downstream of the processed fluid piping 32.

[0055] The first flow meter 36 measures the flow rate of the treatment fluid flowing in the treatment fluid piping 32. "Flow rate" means, for example, the flow rate of treatment fluid passing through a unit area per unit time.

[0056] Pump 34 supplies treatment fluid from treatment fluid tank 31 to treatment fluid piping 32. Pump 34 is, for example, a bellows pump. The material of pump 34 is, for example, synthetic resin. For example, when high-temperature IPA (treatment fluid) flows inside pump 34, the synthetic resin constituting the bellows pump, etc., dissolves, sometimes producing multiple particles. Therefore, there is a situation where IPA (treatment fluid) containing multiple particles flows.

[0057] Heater 37 adjusts the temperature of the processing liquid flowing in the processing liquid piping 32. Specifically, heater 37 heats the processing liquid flowing in the processing liquid piping 32.

[0058] Filter 35 captures multiple particles in the treated liquid. Specifically, filter 35 has multiple pores. These pores are interconnected in the flow direction of the treated liquid. More specifically, the treated liquid flows from the upstream side of filter 35 to the downstream side, passing through the multiple pores. Multiple particles contained in the treated liquid flowing upstream of filter 35 are adsorbed by the walls of the pores as they pass through them. As a result, multiple particles are removed from the treated liquid.

[0059] Filter 35, for example, includes a PTFE (polytetrafluoroethylene) hydrophilic membrane as a filter membrane. The PTFE hydrophilic membrane is obtained by hydrophilizing the surface of a PTFE substrate. The pore size of the PTFE hydrophilic membrane used as filter 35 is, for example, less than 7 nm (a specified diameter). For example, particles larger than 7 nm (a specified diameter) cannot pass through the pore size; depending on the capture capacity of filter 35, particles smaller than 7 nm (a specified diameter) are adsorbed onto the wall surface, removing multiple particles from the treated liquid. Furthermore, the capture capacity of filter 35 varies, for example, depending on the type of treated liquid passing through filter 35 (e.g., the solubility of synthetic resin relative to IPA), the flow rate of the treated liquid passing through filter 35 (the velocity acting on the particles), or the temperature of the treated liquid passing through filter 35.

[0060] The downstream end of the processing fluid piping 32 is connected to a plurality of external circulation piping 41. As a result, in each of the plurality of external circulation piping 41, particles are removed and heated processing fluid flows. In other words, a particle-removed and heated processing fluid is supplied to a plurality of processing towers 10.

[0061] The fluid tank 30 also includes a first return pipe 51 and a first regulating valve 52. The first return pipe 51 returns the processed liquid supplied from the processed liquid tank 31 back to the processed liquid tank 31. Specifically, the upstream end of the first return pipe 51 is connected to the downstream end of the processed liquid piping 32. The downstream end of the first return pipe 51 is connected to the processed liquid tank 31. The first return pipe 51 is a tubular component having a flow path for the processed liquid to flow. Furthermore, the cross-sectional area of ​​the flow path of the first return pipe 51 in a plane perpendicular to the flow direction of the processed liquid is greater than the total cross-sectional area. The total cross-sectional area represents the area obtained by adding the cross-sectional areas of the flow paths of the first external circulation piping 41A, the second external circulation piping 41B, and the third external circulation piping 41C.

[0062] In detail, the cross-sectional area of ​​the flow path of the first return pipe 51 is larger than the cross-sectional area of ​​the flow path of each of the plurality of external circulation pipes 41. Furthermore, unlike the plurality of external circulation pipes 41, the first return pipe 51 is not connected to the processing tower 10. Also, unlike the plurality of external circulation pipes 41, the first return pipe 51 is disposed within the fluid cabinet 30.

[0063] A first regulating valve 52 is disposed on a first return pipe 51. The first regulating valve 52 regulates the flow rate of the processed liquid flowing in the first return pipe 51. The first regulating valve 52 adjusts its opening degree to regulate the flow rate of the processed liquid flowing in the first return pipe 51. The first regulating valve 52 is, for example, an overflow valve whose opening degree is controlled by air pressure. Since the opening degree can be controlled by air pressure, the control unit and the like can control the first regulating valve 52 with good responsiveness.

[0064] Again Figure 1 As shown, the fluid cabinet 30 also includes a plurality of external circulation flow meters 42. The plurality of external circulation flow meters 42 are examples of a "second flow section". The plurality of external circulation flow meters 42 include, for example, a first external circulation flow meter 42A, a second external circulation flow meter 42B, and a third external circulation flow meter 42C.

[0065] The first external circulation flow meter 42A is disposed in the first external circulation pipe 41A. Specifically, the first external circulation flow meter 42A is disposed upstream of the first branch supply pipe 16A. The first external circulation flow meter 42A measures the flow rate of the treatment liquid flowing in the first external circulation pipe 41A.

[0066] The second external circulation flow meter 42B is disposed in the second external circulation piping 41B. Specifically, the second external circulation flow meter 42B is disposed upstream of the second branch supply pipe 16B. The second external circulation flow meter 42B measures the flow rate of the treatment liquid flowing in the second external circulation piping 41B.

[0067] The third external circulation flow meter 42C is configured in the third external circulation piping 41C. Specifically, the third external circulation flow meter 42C is configured upstream of the third branch supply pipe 16C. The third external circulation flow meter 42C measures the flow rate of the treatment fluid flowing in the third external circulation piping 41C.

[0068] In addition, the substrate processing apparatus 100 also includes a plurality of external circulation regulating valves 43. Each of the plurality of external circulation regulating valves 43 is an example of a "second regulating valve". The plurality of external circulation regulating valves 43 are disposed on the platform 20. In other words, the plurality of external circulation regulating valves 43 are disposed outside the fluid tank 30. The plurality of external circulation regulating valves 43 include, for example, a first external circulation regulating valve 43A, a second external circulation regulating valve 43B, and a third external circulation regulating valve 43C.

[0069] The first external circulation regulating valve 43A is disposed on the first external circulation pipe 41A. Specifically, the first external circulation regulating valve 43A is disposed downstream of the first branch supply pipe 16A. The first external circulation regulating valve 43A regulates the flow rate of the processed fluid flowing in the first external circulation pipe 41A. The first external circulation regulating valve 43A adjusts the opening degree to regulate the flow rate of the processed fluid flowing in the first external circulation pipe 41A. The first external circulation regulating valve 43A is, for example, an overflow valve whose opening degree is controlled by air pressure.

[0070] The second external circulation regulating valve 43B is disposed on the second external circulation pipe 41B. Specifically, the second external circulation regulating valve 43B is disposed downstream of the second branch supply pipe 16B. The second external circulation regulating valve 43B regulates the flow rate of the processed fluid flowing in the second external circulation pipe 41B. The second external circulation regulating valve 43B adjusts the opening degree to regulate the flow rate of the processed fluid flowing in the second external circulation pipe 41B. The second external circulation regulating valve 43B is, for example, an overflow valve whose opening degree is controlled by air pressure.

[0071] The third external circulation regulating valve 43C is located on the third external circulation pipe 41C. Specifically, the third external circulation regulating valve 43C is located downstream of the third branch supply pipe 16C. The third external circulation regulating valve 43C regulates the flow rate of the processed fluid flowing in the third external circulation pipe 41C. The third external circulation regulating valve 43C adjusts its opening to regulate the flow rate of the processed fluid flowing in the third external circulation pipe 41C. The third external circulation regulating valve 43C is, for example, an overflow valve whose opening is controlled by air pressure.

[0072] Next, refer to Figure 3 The control device 60 will be described. Figure 3 This is a block diagram representing the substrate processing apparatus 100. (Example) Figure 3 As shown, the control device 60 controls the operation of each part of the board processing apparatus 100. Specifically, the control device 60 includes a control unit 61 and a storage unit 62.

[0073] The control unit 61 has a processor. The control unit 61 may have, for example, a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). Alternatively, the control unit 61 may also have a general-purpose arithmetic logic unit (ALU).

[0074] Storage unit 62 stores data and computer programs. The data includes process data. The process data contains information representing multiple processes. Each process specifies the processing content and procedure for the substrate W.

[0075] Storage unit 62 has a main storage device. The main storage device is, for example, a semiconductor memory. Storage unit 62 may also have an auxiliary storage device. The auxiliary storage device includes, for example, at least one of a semiconductor memory and a hard disk drive. Storage unit 62 may also include a removable medium.

[0076] The control unit 61 controls the operation of each part of the board processing apparatus 100 based on the computer program and data stored in the storage unit 62. For example, the control unit 60 controls the first regulating valve 52, the first external circulation regulating valve 43A, the second external circulation regulating valve 43B, and the third external circulation regulating valve 43C. In addition, the control unit 60 obtains measurement results from each of the first flow meter 36, the first external circulation flow meter 42A, the second external circulation flow meter 42B, and the third external circulation flow meter 42C.

[0077] Here, refer to Figure 1 and Figure 3 The “first state” of the substrate processing apparatus 100 processing the substrate W will be described. The “first state” refers to the state in which the substrate W is processed by all of the first processing tower 10A, the second processing tower 10B and the third processing tower 10C.

[0078] Specifically, the control unit 61 controls the first external circulation regulating valve 43A based on the flow rate of the processed liquid measured by the first external circulation flow meter 42A, so that the processed liquid with a flow rate of RA flows in the first external circulation pipe 41A. Furthermore, it controls the second external circulation regulating valve 43B based on the flow rate of the processed liquid measured by the second external circulation flow meter 42B, so that the processed liquid with a flow rate of RB flows in the second external circulation pipe 41B. And, it controls the third external circulation regulating valve 43C based on the flow rate of the processed liquid measured by the third external circulation flow meter 42C, so that the processed liquid with a flow rate of RC flows in the third external circulation pipe 41C.

[0079] Furthermore, the control unit 61 controls the first regulating valve 52 based on the flow rate of the processed liquid measured by the first flow meter 36, so that the processed liquid at a specified flow rate RT flows in the processed liquid piping 32. The specified flow rate RT is arbitrary, for example, preset according to the capture capacity of the filter 35. As a result, the processed liquid at the specified flow rate RT passes sequentially through the heater 37 and the filter 35. And, the processed liquid at a flow rate RD flows in the first return pipe 51. The processed liquid at a flow rate RD is the processed liquid at the specified flow rate RT after removing the processed liquid at flow rates RA, RB, and RC.

[0080] Next, refer to Figure 4 The "second state" of the substrate processing apparatus 100 processing substrate W will be described. Figure 4 This is a schematic diagram of the substrate processing apparatus according to Embodiment 1. Furthermore, Figure 4 This diagram illustrates the state in which the substrate processing apparatus 100 is operating in a "second state." Open valves are indicated in white, and closed valves in black. The "second state" refers to a state where maintenance is performed using any one of the processing towers 10, namely the first processing tower 10A, the second processing tower 10B, and the third processing tower 10C. In the "second state," for example, the substrate W is processed using the first processing tower 10A and the second processing tower 10B, while maintenance is performed using the third processing tower 10C. Alternatively, maintenance can be performed simultaneously on multiple processing towers 10.

[0081] Specifically, maintenance personnel close all the on / off valves 15 included in the third treatment tower 10C. Furthermore, the control unit 61 controls the first external circulation regulating valve 43A based on the flow rate of the treated liquid measured by the first external circulation flow meter 42A, so that the treated liquid with a flow rate of RA flows in the first external circulation piping 41A. Additionally, the second external circulation regulating valve 43B is controlled based on the flow rate of the treated liquid measured by the second external circulation flow meter 42B, so that the treated liquid with a flow rate of RB flows in the second external circulation piping 41B. Finally, the third external circulation regulating valve 43C is controlled based on the flow rate of the treated liquid measured by the third external circulation flow meter 42C, so that the treated liquid does not flow in the third external circulation piping 41C.

[0082] Furthermore, the control unit 61 controls the first regulating valve 52 based on the flow rate of the processed liquid measured by the first flow meter 36, so that the processed liquid at a specified flow rate RT flows in the processed liquid piping 32. As a result, the processed liquid at the specified flow rate RT passes sequentially through the heater 37 and the filter 35. Meanwhile, the processed liquid at a flow rate of (RD+RC) flows in the first return pipe 51. The processed liquid at a flow rate of (RD+RC) is the processed liquid at the specified flow rate RT after removing the processed liquid at flow rates RA and RB.

[0083] The above, such as Figures 1 to 4 As shown, Embodiment 1 of the present invention has been described. According to Embodiment 1, the control unit 61 controls the first regulating valve 52 based on the flow rate of the processed liquid measured by the first flow meter 36. As a result, the flow rate of the processed liquid flowing in the processed liquid piping 32 is adjusted, and therefore, the filter 35 can efficiently capture multiple particles in the processed liquid. Therefore, a processed liquid with a low particle content can be supplied to the processing tower 10.

[0084] Furthermore, the control unit 61 controls the opening of the first regulating valve 52 to ensure that the flow rate of the processed liquid flowing in the processed liquid piping 32 is a predetermined flow rate RT. As a result, the processed liquid at the predetermined flow rate RT flows in the processed liquid piping 32, and therefore, the filter 35 performs its predetermined capture capacity. Thus, a processed liquid with a lower particle content can be supplied to the processing tower 10.

[0085] Furthermore, the control unit 61 controls the opening degree of the first regulating valve 52 and the opening degree of the external circulation regulating valve 43. As a result, regardless of whether it is the "first state" or the "second state", the specified flow rate RT of the processed liquid flows in the processed liquid piping 32, and therefore, the filter 35 performs its specified capture capacity. Therefore, the third processing tower 10C can be maintained, and a processed liquid with a lower particle content can be supplied to the first processing tower 10A and the second processing tower 10B.

[0086] Furthermore, heater 37 adjusts the temperature of the processed liquid flowing in processed liquid piping 32. As a result, regardless of whether it is the "first state" or the "second state," the processed liquid at a specified flow rate RT flows in processed liquid piping 32, and therefore, heater 37 is able to adjust the temperature of the processed liquid to a constant temperature. Thus, processed liquid at a constant temperature can be supplied to the processing tower 10.

[0087] Next, refer to Figure 5 The substrate processing method of Embodiment 1 will be described below. The substrate processing method of Embodiment 1 is based on [reference needed]. Figures 1-4 The substrate processing apparatus 100 described herein is used. Figure 5 This is a flowchart illustrating the processing performed by the control unit 61 of the substrate processing apparatus 100 in Embodiment 1.

[0088] like Figure 5As shown, firstly, the control unit 61 controls the first external circulation regulating valve 43A based on the flow rate of the processed liquid measured by the first external circulation flow meter 42A, so that the processed liquid with a flow rate of RA flows in the first external circulation pipe 41A. Additionally, it controls the second external circulation regulating valve 43B based on the flow rate of the processed liquid measured by the second external circulation flow meter 42B, so that the processed liquid with a flow rate of RB flows in the second external circulation pipe 41B. Furthermore, it controls the third external circulation regulating valve 43C based on the flow rate of the processed liquid measured by the third external circulation flow meter 42C, so that the processed liquid with a flow rate of RC flows in the third external circulation pipe 41C. Finally, the control unit 61 controls the first regulating valve 52 based on the flow rate of the processed liquid measured by the first flow meter 36, so that the processed liquid with a specified flow rate of RT flows in the processed liquid pipe 32 (step S101).

[0089] The control unit 61 determines whether the flow rate of the processed liquid measured by the first flow meter 36 is the specified flow rate RT (step S102). If the control unit 61 determines that the flow rate of the processed liquid measured by the first flow meter 36 is the specified flow rate RT (step S102 is yes), it returns to step S102.

[0090] On the other hand, if the control unit 61 determines that the flow rate of the processed liquid measured by the first flow meter 36 is not the specified flow rate RT (step S102 is not), the control unit 61 controls the first adjusting valve 52 to make the flow rate of the processed liquid measured by the first flow meter 36 become the specified flow rate RT (step S103). When the processing ends, return to step S102.

[0091] [Implementation Method 2]

[0092] Reference Figure 6 Embodiment 2 of the present invention will be described. Figure 6 This is a schematic diagram of the substrate processing apparatus 100 according to Embodiment 2. Furthermore, Figure 6 This diagram illustrates the state in which the substrate processing apparatus 100 is performing a "third state." The "third state" indicates a state in which the substrate W is processed by all of the first processing tower 10A, the second processing tower 10B, and the third processing tower 10C, and at least one processing unit 11 is maintained. However, descriptions will be provided for matters different from Embodiment 1, while descriptions for matters identical to those in Embodiment 1 will be omitted.

[0093] In the "third state," for example, the substrate W is processed by all three processing towers: the first processing tower 10A, the second processing tower 10B, and the third processing tower 10C, while maintenance is performed on one processing unit 11A within the first processing tower 10A. Specifically, the maintenance operator closes the on / off valve 15 located on the first supply pipe 16AA. Furthermore, the control unit 61 controls the first external circulation regulating valve 43A based on the flow rate of the processed liquid measured by the first external circulation flow meter 42A, so that a flow rate (RA-Ra) of processed liquid flows in the first external circulation pipe 41A. Additionally, the second external circulation regulating valve 43B is controlled based on the flow rate of the processed liquid measured by the second external circulation flow meter 42B, so that a flow rate of processed liquid RB flows in the second external circulation pipe 41B. Finally, the third external circulation regulating valve 43C is controlled based on the flow rate of the processed liquid measured by the third external circulation flow meter 42C, so that a flow rate of processed liquid RC flows in the third external circulation pipe 41C.

[0094] Furthermore, the control unit 61 controls the first regulating valve 52 based on the flow rate of the processed liquid measured by the first flow meter 36, so that the processed liquid at a specified flow rate RT flows in the processed liquid piping 32. As a result, the processed liquid at the specified flow rate RT passes sequentially through the heater 37 and the filter 35. Meanwhile, the processed liquid at a flow rate of (RD+Ra) flows in the first return pipe 51. The processed liquid at a flow rate of (RD+Ra) is the processed liquid at the specified flow rate RT after removing the processed liquid at a flow rate of (RA-Ra), a flow rate of RB, and a flow rate of RC.

[0095] The above, such as Figure 6 As shown, Embodiment 2 of the present invention has been described. According to Embodiment 2, the control unit 61 controls the first regulating valve 52 based on the flow rate of the treatment liquid measured by the first flow meter 36. As a result, regardless of whether it is the "first state" or the "third state," the treatment liquid at a specified flow rate RT flows in the treatment liquid piping 32, and therefore, the filter 35 performs its specified capture capacity. Therefore, the treatment unit 11 can be maintained, and a treatment liquid with a lower particle content can be supplied to other treatment units 11.

[0096] [Implementation Method 3]

[0097] Reference Figure 7 Embodiment 3 of the present invention will be described. Figure 7 This is a schematic diagram of the substrate processing apparatus 100 according to Embodiment 3. Furthermore, Figure 7 This diagram illustrates the state in which the substrate processing apparatus 100 is performing a "third state". However, descriptions will be provided for aspects that differ from Embodiment 2, while descriptions of aspects that are the same as in Embodiment 2 will be omitted. The difference between Embodiment 3 and Embodiment 2 is that it has a third return tube 18.

[0098] like Figure 7 As shown, each of the multiple processing units 11 has an on / off valve 19 and a third return pipe 18. The on / off valve 19 is an example of a "switching unit". The on / off valve 19 switches the supply and stop of the processing fluid from the branch supply pipe 16 to the nozzle 14. The on / off valve 19 is, for example, a motor needle valve that is electrically controlled to open and close.

[0099] The third return pipe 18 branches off from the branch supply pipe 16A. The third return pipe 18 connects to the external circulation pipe 41 further downstream than the external circulation regulating valve 43. The third return pipe 18 is a tubular component with a flow path for the processing fluid. When the on / off valve 19 is closed, the processing fluid flows in the third return pipe 18. As a result, by circulating the heated processing fluid in the third return pipe 18, the temperature of the nozzle 14 can be maintained.

[0100] Specifically, maintenance personnel close the on / off valve 19 of the nozzle 14 connected to the first supply pipe 16AA. Furthermore, the control unit 61 controls the first external circulation regulating valve 43A based on the flow rate of the treated fluid measured by the first external circulation flow meter 42A, so that the treated fluid at a flow rate (RA-Raa) flows in the first external circulation pipe 41A. Additionally, the second external circulation regulating valve 43B is controlled based on the flow rate of the treated fluid measured by the second external circulation flow meter 42B, so that the treated fluid at a flow rate RB flows in the second external circulation pipe 41B. Finally, the third external circulation regulating valve 43C is controlled based on the flow rate of the treated fluid measured by the third external circulation flow meter 42C, so that the treated fluid at a flow rate RC flows in the third external circulation pipe 41C.

[0101] Furthermore, the control unit 61 controls the first regulating valve 52 based on the flow rate of the processed liquid measured by the first flow meter 36, so that the processed liquid at a specified flow rate RT flows in the processed liquid piping 32. As a result, the processed liquid at the specified flow rate RT passes sequentially through the heater 37 and the filter 35. Meanwhile, the processed liquid at a flow rate of (RD+Raa) flows in the first return pipe 51. The processed liquid at a flow rate of (RD+Raa) is the processed liquid at the specified flow rate RT after removing the processed liquid at a flow rate of (RA-Raa), a flow rate of RB, and a flow rate of RC.

[0102] The above, such as Figure 7 As shown, Embodiment 3 of the present invention has been described. According to Embodiment 3, the control unit 61 controls the first regulating valve 52 based on the flow rate of the treatment liquid measured by the first flow meter 36. Whether in the "first state" or the "third state," the treatment liquid at a specified flow rate RT flows in the treatment liquid piping 32, thus the filter 35 performs its specified capture capacity. Therefore, the treatment unit 11 can be maintained, and a treatment liquid with a lower particle content can be supplied to other treatment units 11.

[0103] [Implementation Method 4]

[0104] Reference Figure 8 and Figure 9 Embodiment 4 of the present invention will be described. Figure 8 This is a schematic diagram of the substrate processing apparatus 1100 according to Embodiment 4. Figure 9 This is a schematic diagram of the processing tower 1010 included in the substrate processing apparatus 1100 of Embodiment 4. However, descriptions will be given of matters that differ from Embodiment 1, while descriptions of matters that are the same as those in Embodiment 1 will be omitted.

[0105] In Embodiment 4, the case where the treatment solution is sulfuric acid will be described. For example... Figure 8 and Figure 9 As shown, treatment liquid tank 31 stores the treatment liquid. The treatment liquid may contain, for example, sulfuric acid. The viscosity of sulfuric acid increases at low temperatures and decreases at high temperatures. High-viscosity liquids may be difficult to measure accurately using a flow meter.

[0106] The difference between Embodiment 4 and Embodiment 1 is that Embodiment 4 has multiple external circulation pressure gauges 1042 instead of multiple external circulation flow meters 42. Specifically, the platform 20 also includes multiple external circulation pressure gauges 1042. The multiple external circulation pressure gauges 1042 are examples of a "second flow section". The multiple external circulation pressure gauges 1042 include, for example, a first external circulation pressure gauge 1042A, a second external circulation pressure gauge 1042B, and a third external circulation pressure gauge 1042C.

[0107] The first external circulation pressure gauge 1042A is disposed on the first external circulation pipe 41A. Specifically, the first external circulation pressure gauge 1042A is disposed downstream of the first branch supply pipe 16A. The first external circulation pressure gauge 1042A is disposed upstream of the first external circulation regulating valve 43A. The first external circulation pressure gauge 1042A measures the pressure of the processed fluid flowing in the first external circulation pipe 41A.

[0108] The second external circulation pressure gauge 1042B is disposed on the second external circulation piping 41B. Specifically, the second external circulation pressure gauge 1042B is disposed downstream of the second branch supply pipe 16B. The second external circulation pressure gauge 1042B is disposed upstream of the second external circulation regulating valve 43B. The second external circulation pressure gauge 1042B measures the pressure of the processed fluid flowing in the second external circulation piping 41B.

[0109] The third external circulation pressure gauge 1042C is configured in the third external circulation piping 41C. Specifically, the third external circulation pressure gauge 1042C is configured downstream of the third branch supply pipe 16C. The third external circulation pressure gauge 1042C is configured upstream of the third external circulation regulating valve 43C. The third external circulation pressure gauge 1042C measures the pressure of the processed fluid flowing in the third external circulation piping 41C.

[0110] The fluid cabinet 1030 also includes: a pump 34, a filter 35, a first flow meter 36, a heater 37, and a thermometer 1038. The first flow meter 36, pump 34, heater 37, thermometer 1038, and filter 35 are arranged in this order from upstream to downstream of the processed fluid piping 32.

[0111] Thermometer 1038 measures the temperature of the treatment liquid flowing in treatment liquid piping 32.

[0112] Next, refer to Figure 10 The control device 1060 will be described. Figure 4 This is a block diagram representing the substrate processing apparatus 1100. (Example) Figure 4 As shown, the control device 1060 includes a control unit 61 and a storage unit 1062.

[0113] The storage unit 1062 stores data and computer programs. The data includes first data representing the relationship between the temperature of the processing fluid flowing in the processing fluid piping 32, the pressure of the processing fluid flowing in the piping, and the flow rate of the processing fluid flowing in the piping. Alternatively, the data may also be second data representing the relationship between the temperature of the processing fluid flowing in the processing fluid piping 32, the pressure of the processing fluid flowing in the piping, and the speed of the pump 34, by understanding the relationship between the rotational speed of the pump 34 and the flow rate of the processing fluid flowing in the piping.

[0114] The control unit 61 controls the operation of each part of the board processing apparatus 100 based on the computer program and data stored in the storage unit 1062. For example, the control unit 1060 obtains measurement results from each of the first flow meter 36, the first external circulation pressure gauge 1042A, the second external circulation pressure gauge 1042B, the third external circulation pressure gauge 1042C, and the thermometer 1038. The control unit 1060 controls the first regulating valve 52, the first external circulation regulating valve 43A, the second external circulation regulating valve 43B, the third external circulation regulating valve 43C, and the pump 34 based on the first data. Specifically, the control unit 1060 performs feedback control on the first regulating valve 52, the first external circulation regulating valve 43A, the second external circulation regulating valve 43B, the third external circulation regulating valve 43C, and the pump 34.

[0115] The above, such as Figures 8 to 10As shown, Embodiment 4 of the present invention has been described. According to Embodiment 4, the control unit 61 controls the first regulating valve 52 based on the flow rate of the processed liquid measured by the first flow meter 36. As a result, the flow rate of the processed liquid flowing in the processed liquid piping 32 is adjusted, and therefore, the filter 35 can efficiently capture multiple particles in the processed liquid. Therefore, a processed liquid with a low particle content can be supplied to the processing tower 10.

[0116] Furthermore, Embodiment 4 includes multiple external circulation pressure gauges 1042, thus enabling precise adjustment of the flow rate of the treatment liquid flowing in the treatment liquid piping 32, even when the treatment liquid is high-viscosity sulfuric acid. Therefore, a treatment liquid with a low particle content can be supplied to the treatment tower 10.

[0117] The above is with reference to the attached diagram ( Figures 1-10 The embodiments of the present invention have been described. However, the present invention is not limited to the embodiments described above, and can be implemented in various ways without departing from its spirit. In addition, the various structural elements disclosed in the above embodiments can be appropriately modified. For example, a structural element from all the structural elements shown in one embodiment may be added to the structural elements of other embodiments, or several structural elements from all the structural elements shown in one embodiment may be deleted from the embodiment.

[0118] Regarding the accompanying drawings, for ease of understanding of the invention, the various structural elements are shown schematically. The thickness, length, number, spacing, etc., of the structural elements shown may sometimes differ from the actual figures for the purpose of creating the drawings. Furthermore, the structures of the structural elements shown in the above embodiments are merely examples and are not particularly limited; various modifications can certainly be made without substantially departing from the effects of the invention.

[0119] (1) For example, in the “second state”, the substrate W is processed by the first processing tower 10A and the second processing tower 10B, and the third processing tower 10C is used for maintenance, but there is no particular limitation. In the “second state”, preparation for processing the substrate W can also be performed by the first processing tower 10A, the second processing tower 10B and the third processing tower 10C as maintenance.

[0120] Specifically, all on / off valves 15 are closed. Furthermore, the control unit 61 controls the first external circulation regulating valve 43A based on the flow rate of the processed liquid measured by the first external circulation flow meter 42A, so that the processed liquid does not flow in the first external circulation pipe 41A. Additionally, the second external circulation regulating valve 43B is controlled based on the flow rate of the processed liquid measured by the second external circulation flow meter 42B, so that the processed liquid does not flow in the second external circulation pipe 41B. And, the third external circulation regulating valve 43C is controlled based on the flow rate of the processed liquid measured by the third external circulation flow meter 42C, so that the processed liquid does not flow in the third external circulation pipe 41C.

[0121] Furthermore, the control unit 61 controls the first regulating valve 52 based on the flow rate of the processed liquid measured by the first flow meter 36, so that the processed liquid at a specified flow rate RT flows in the processed liquid piping 32. As a result, the processed liquid at the specified flow rate RT passes sequentially through the heater 37 and the filter 35. And the processed liquid at a flow rate of (RD+RA+RB+RC) flows in the first return pipe 51.

[0122] (2) For example, the downstream end of the first return pipe 51 is connected to the processing liquid tank 31, but there is no particular limitation. The downstream end of the first return pipe 51 may also be connected to the downstream end of the external circulation pipe 41.

[0123] (3) For example, the first flow meter 36, pump 34, heater 37 and filter 35 are arranged in this order from upstream to downstream of the processing fluid piping 32, but there is no particular limitation. The first flow meter 36 may also be arranged at any position on the processing fluid piping 32.

[0124] (4) For example, the external circulation regulating valve 43 may be located on the external circulation piping 41 at a position downstream of the branch supply pipe 16, but this is not particularly limited. The external circulation flow meter 42 may also be located on the external circulation piping 41 at a position upstream of the branch supply pipe 16.

[0125] (5) For example, a maintenance worker operates the on / off valves 15 and 19, but there are no particular limitations. The control device 60 can also control the on / off valves 15 and 19.

[0126] (6) For example, fluid cabinet 30 includes a first flow meter 36, but is not particularly limited thereto. Fluid cabinet 30 may also include a first pressure gauge instead of the first flow meter 36.

[0127] Industrial availability

[0128] This invention is useful in the field of substrate processing.

Claims

1. A substrate processing apparatus characterized by comprising: have: The processing unit uses a processing liquid to process the substrate; Storage section, which stores the treatment solution; A treatment fluid piping system is provided, which is connected to the storage unit to allow the treatment fluid to flow. A pump, which is configured in the processing fluid piping, supplies the processing fluid from the storage unit to the processing fluid piping; A filter, configured in the treatment fluid piping, captures particles in the treatment fluid; A first flow meter is disposed in the treatment fluid piping to measure the flow rate or pressure of the treatment fluid flowing in the treatment fluid piping. The first return pipe is connected to the downstream end of the treatment liquid piping and returns the treatment liquid to the storage section; A first regulating valve is disposed in the first return pipe to regulate the flow rate of the treatment liquid flowing in the first return pipe; Multiple second return pipes are connected to the downstream end of the treatment liquid piping to return the treatment liquid to the storage section; A branch supply pipe, which branches from a plurality of second return pipes, supplies the processing liquid to the processing unit; The second flow section measures the flow rate or pressure of the treatment liquid flowing in the plurality of second return pipes; The control unit, which receives a measurement value measured by the first flow unit and a measurement value measured by the second flow unit, controls the opening of the first regulating valve disposed on the first return pipe in such a way that the flow rate of the processed liquid flowing in the first return pipe is the flow rate after deducting the total flow rate of the processed liquid flowing in the plurality of second return pipes from the flow rate of the processed liquid flowing in the processed liquid piping, so that a certain predetermined flow rate of the processed liquid flows in the processed liquid piping.

2. A substrate processing apparatus characterized by comprising: have: The processing unit uses a processing liquid to process the substrate; Storage section, which stores the treatment solution; A treatment fluid piping system is provided, which is connected to the storage unit to allow the treatment fluid to flow. A pump, which is configured in the processing fluid piping, supplies the processing fluid from the storage unit to the processing fluid piping; A filter, configured in the treatment fluid piping, captures particles in the treatment fluid; A first flow meter is disposed in the treatment liquid piping to measure the flow rate of the treatment liquid flowing in the treatment liquid piping; The first return pipe is connected to the downstream end of the treatment liquid piping and returns the treatment liquid to the storage section; A first regulating valve is disposed in the first return pipe to regulate the flow rate of the treatment liquid flowing in the first return pipe; Multiple second return pipes are connected to the downstream end of the treatment liquid piping to return the treatment liquid to the storage section; A branch supply pipe, which branches from a plurality of second return pipes, supplies the processing liquid to the processing unit; A second flow meter, which is disposed in a plurality of second return pipes and located upstream of the branch supply pipe, measures the flow rate of the treatment liquid flowing in the branch supply pipe; The control unit, which receives a measurement value measured by the first flow meter and a measurement value measured by the second flow meter, controls the opening of the first regulating valve disposed on the first return pipe in such a way that the flow rate of the processed liquid flowing in the first return pipe is the flow rate after deducting the total flow rate of the processed liquid flowing in the plurality of second return pipes from the flow rate of the processed liquid flowing in the processed liquid piping, so that a certain predetermined flow rate of the processed liquid flows in the processed liquid piping.

3. The substrate processing apparatus according to claim 1, characterized in that, The second flow section is disposed in each of the second return pipes, located further downstream than the branch supply pipe, and measures the pressure of the processing liquid flowing in each of the second return pipes.

4. The substrate processing apparatus according to claim 1, characterized in that, The substrate processing apparatus further includes a temperature controller disposed in the processing liquid piping. The temperature controller adjusts the temperature of the treatment fluid flowing in the treatment fluid piping.

5. The substrate processing apparatus according to claim 4, characterized in that, The substrate processing apparatus further includes: a second regulating valve disposed in each of the second return pipes, for regulating the flow rate of the processing liquid flowing in each of the second return pipes. The control unit controls the opening degree of the first adjusting valve and the opening degree of the second adjusting valve.

6. The substrate processing apparatus according to claim 5, characterized in that, The substrate processing apparatus further includes: a thermometer disposed in the processing liquid piping, for measuring the temperature of the processing liquid flowing in the processing liquid piping. The control unit controls the opening degree of the second adjusting valve based on the temperature of the treatment liquid measured by the thermometer.

7. The substrate processing apparatus according to claim 5 or 6, characterized in that, The processing unit has: A nozzle is disposed at the downstream end of the branch supply pipe; A switching unit that switches the supply and stop of the treatment fluid from the branch supply pipe to the nozzle; The third return pipe branches off from the branch supply pipe and connects to the second return pipe further downstream than the second regulating valve.

8. A substrate processing method of a substrate processing apparatus, The substrate processing apparatus includes: The processing unit uses a processing liquid to process the substrate; Storage section, which stores the treatment solution; A treatment fluid piping system is provided, which is connected to the storage unit to allow the treatment fluid to flow. Pumps are configured in the processing fluid piping; A filter is disposed in the processing fluid piping; The first flow section is configured in the processing liquid piping; The first return pipe is connected to the downstream end of the treatment liquid piping and returns the treatment liquid to the storage section; A first regulating valve is disposed in the first return pipe to regulate the flow rate of the treatment liquid flowing in the first return pipe; Multiple second return pipes are connected to the downstream end of the treatment liquid piping to return the treatment liquid to the storage section; A branch supply pipe, which branches from a plurality of second return pipes, supplies the processing liquid to the processing unit; The second flow section is configured in multiple second return pipes. Its features are, The substrate processing method includes: The process of supplying the processing liquid from the storage unit to the processing liquid via piping; The process of capturing particles in the treatment liquid; A process for measuring the flow rate or pressure of the treatment fluid flowing in the treatment fluid piping by the first flow unit; A process in which the flow rate or pressure of the processed liquid flowing in the plurality of second return pipes is measured by the second flow section; Based on the measured values ​​obtained by the first flow unit and the measured values ​​obtained by the second flow unit, the opening of the first regulating valve disposed on the first return pipe is controlled such that the flow rate of the processed liquid flowing in the first return pipe is the flow rate after deducting the total flow rate of the processed liquid flowing in the plurality of second return pipes from the flow rate of the processed liquid flowing in the processed liquid piping, thereby causing a certain predetermined flow rate of the processed liquid to flow in the processed liquid piping.

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