Wafer bonding apparatus
By using multiple vacuum lines and adsorption areas in the wafer bonding equipment to control the adsorption time and intensity of the wafer in different directions, the problem of low alignment accuracy in wafer bonding is solved, and a more efficient compensation effect is achieved.
CN115116900BActive Publication Date: 2026-06-16YANGTZE MEMORY TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- YANGTZE MEMORY TECH CO LTD
- Filing Date
- 2022-06-16
- Publication Date
- 2026-06-16
Smart Images
Figure CN115116900B_ABST
Abstract
The application provides a wafer bonding device, comprising: a first chuck, a second chuck, K vacuum pipes, a controller, a bonding execution unit; wherein the first chuck and the second chuck are respectively used for carrying a first wafer and a second wafer in a first wafer pair to be bonded; a surface of the first chuck or the second chuck has N adsorption areas distributed along a circumference of a circle where the chuck surface is located, and K is greater than or equal to N; each adsorption area is connected with at least one vacuum pipe; the controller is connected with the K vacuum pipes and is used for controlling, through the K vacuum pipes, an adsorption time length and / or an adsorption force size of the first chuck and / or the second chuck on a corresponding wafer in the first wafer pair to be bonded from the N adsorption areas, so as to perform scaling compensation along N different directions on the first wafer pair to be bonded; and the bonding execution unit is used for bonding the first wafer pair to be bonded after the scaling compensation is performed.
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Bonding apparatus, bonding system, bonding method and computer storage medium
CN108133903A
Wafer bonding device and bonding method for eliminating wafer warping
CN114388392A