Structure and fabrication method of pseudo-active region of MOS transistor
By forming field oxygen on the semiconductor substrate of the MOS transistor and setting up a parallel array of pseudo-active regions, the leakage path problem caused by pseudo-active regions is solved, better isolation effect is achieved, and leakage between MOS transistors is reduced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANGHAI HUALI INTEGRATED CIRCUIT CORP
- Filing Date
- 2022-06-28
- Publication Date
- 2026-07-17
AI Technical Summary
The pseudo-active region design of existing MOS transistors leads to leakage channels, affecting the leakage problem between MOS transistors with adjacent active regions.
A field oxygen is formed on the semiconductor substrate to isolate the active region, and multiple parallel array blocks of pseudo-active regions are arranged around it. The length of the pseudo-active region is shorter than that of the active region. The field oxygen is used to prevent the formation of leakage channels.
It effectively reduces leakage current between MOS transistors and achieves better isolation through the improved pseudo-active region structure, preventing the formation of leakage current channels.
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Figure CN115117148B_ABST