Package for a vibrator, piezoelectric vibrator and oscillator

Abstract

The frequency indicated by the signal output from the signal output terminal of the oscillator is made more accurate. A piezoelectric vibration piece wiring (60) is provided, which does not overlap the external power source wiring (46) and the signal output wiring (47) when viewed from the normal line direction of the chip mounting side, is arranged across the region where the piezoelectric vibration piece (3) is arranged, and connects the first electrode pad (51) with the chip electrode.

Description

Technical Field

[0001] This invention relates to packages for vibrators, piezoelectric vibrators, and oscillators. Background Technology

[0002] For example, Patent Document 1 discloses a container for a piezoelectric vibrating device used in a piezoelectric vibrating device incorporating a quartz resonator. The container for a piezoelectric vibrating device disclosed in Patent Document 1 has internal wiring for connecting the piezoelectric vibrator to an external electrical source, and external connection terminals are provided on the exposed surface. The external connection terminals are connected to the internal wiring, allowing the quartz resonator to be electrically connected to the outside via the external connection terminals.

[0003] Prior art literature Patent documents Patent document 1: Japanese Patent Application Publication No. 2020-188340. Summary of the Invention

[0004] The problem that the invention aims to solve However, sometimes an oscillator is modularized by directly mounting an integrated circuit chip onto a vibrator package such as a container for a piezoelectric vibration device disclosed in Patent Document 1. In such cases, it is necessary to provide wiring for connecting the piezoelectric vibrating plate to the integrated circuit chip and wiring for connecting the integrated circuit chip to external connection terminals in the vibrator package.

[0005] As the aforementioned external connection terminals, an external power supply connection terminal is provided, serving as a terminal for connecting to an external power source, or a signal output terminal for outputting signals from an integrated circuit chip. Here, if viewed from the normal direction of the surface where the integrated circuit chip is mounted, and the wiring connecting the external power supply connection terminal and the integrated circuit chip intersects with the wiring connecting the piezoelectric vibrator and the integrated circuit chip, the signal flowing through the wiring connecting the piezoelectric vibrator and the integrated circuit chip may sometimes carry noise components, affecting the frequency of the signal output from the signal output terminal. Furthermore, when the wiring connecting the signal output terminal and the integrated circuit chip intersects with the wiring connecting the piezoelectric vibrator and the integrated circuit chip, the frequency of the signal output from the signal output terminal may similarly be affected.

[0006] The present invention was made in view of the above-mentioned problems, and its object is to provide a vibrator package, a piezoelectric vibrator, and an oscillator that can make the frequency indicated by the signal output from the signal output terminal more accurate.

[0007] Solution for solving the problem The present invention, as a solution to the above-mentioned problems, adopts the following configuration.

[0008] The first aspect of the present invention is a vibrator package, comprising a package body having a chip mounting side having an integrated circuit chip and a vibrator mounting side disposed on the opposite side having a piezoelectric vibrator. The package includes: a plurality of chip electrodes disposed on the chip mounting side and connected to terminals of the integrated circuit chip; an external power supply terminal disposed on the chip mounting side and connected to an external power supply; a signal output terminal disposed on the chip mounting side and outputting a signal to the outside; and an external power supply terminal. A power supply wiring is provided on the chip mounting side and connects the chip electrodes to the external power supply terminal; a signal output wiring is provided on the chip mounting side and connects the chip electrodes to the signal output terminal; a diaphragm mounting pad is provided on the diaphragm mounting side and connects to the piezoelectric diaphragm; and a piezoelectric diaphragm wiring is provided that, when viewed from the normal direction of the chip mounting side, does not overlap with the external power supply wiring and the signal output wiring, and spans the area where the piezoelectric diaphragm is disposed, and connects the diaphragm mounting pad to the chip electrodes.

[0009] According to the present invention, the wiring arrangement for the piezoelectric vibrator is configured to span the area where the piezoelectric vibrator is disposed when viewed from the normal direction of the chip mounting side, and further, when viewed from the same direction, it does not overlap with the external power supply wiring and the signal output wiring. Therefore, it is possible to suppress noise components superimposed on the signal flowing through the piezoelectric vibrator wiring or the signal output wiring, making the frequency indicated by the signal output from the signal output terminal more accurate.

[0010] The second aspect of the present invention adopts the following configuration: In the first aspect described above, at least a portion of the wiring for the piezoelectric vibrator is disposed on the mounting side of the vibrator, and has an insulating coating covering the portion of the wiring for the piezoelectric vibrator disposed on the mounting side of the vibrator.

[0011] According to the present invention, the portion of the wiring for the piezoelectric vibrator located on the mounting side of the vibrator is covered by an insulating coating. Therefore, it is possible to prevent foreign objects from contacting the portion of the wiring for the piezoelectric vibrator located on the mounting side of the vibrator. For example, if during manufacturing, a portion of the piezoelectric vibrator is cut to adjust its frequency, metal chips are generated. It is possible to prevent such chips from contacting the portion of the wiring for the piezoelectric vibrator located on the mounting side of the vibrator.

[0012] The third aspect of the present invention adopts the following configuration: In the first or second aspect described above, the piezoelectric vibrator is disposed such that the wiring does not overlap with the top end of the vibrating arm portion of the piezoelectric vibrator when viewed from the normal direction of the chip mounting side.

[0013] During manufacturing, the tip of the vibrating arm of the piezoelectric vibrator is cut to adjust the frequency of the vibrating element. According to the present invention, the wiring for the piezoelectric vibrator is configured to avoid the tip of the vibrating arm, thereby preventing chips generated from cutting the tip from adhering to the wiring for the piezoelectric vibrator.

[0014] The fourth aspect of the present invention adopts the following configuration: In the first aspect described above, the main body of the package is composed of a multilayer body formed by stacking multiple layers, and the piezoelectric vibrating sheet is disposed at the interface between two of the layers by wiring.

[0015] According to the present invention, the piezoelectric vibrator wiring is disposed at the interface of two stacked layers. Therefore, it is possible to prevent chips generated during manufacturing, such as those produced by cutting a portion of the piezoelectric vibrator to adjust its frequency, from contacting the piezoelectric vibrator wiring.

[0016] The fifth aspect of the present invention adopts the following configuration: In any of the first to fourth aspects described above, the main body of the package is formed in a rectangular shape having a pair of long sides and a pair of short sides when viewed from the normal direction of the chip mounting side. The external power supply terminal and the signal output terminal are arranged on one of the long sides in the direction along the short sides, and the chip electrode connecting the piezoelectric vibrating sheet wiring is arranged on the other long side in the direction along the short sides.

[0017] According to the present invention, compared with the case where the chip electrode connecting the piezoelectric vibrator wiring is arranged on one long side, the chip electrode connecting the piezoelectric vibrator wiring can be arranged away from the external power supply terminal and the signal output terminal. Therefore, the signal flowing through the chip electrode connecting the piezoelectric vibrator wiring is prevented from being affected by the voltage applied to the external power supply terminal, and interference with the output signal flowing through the signal output terminal can be suppressed.

[0018] The sixth aspect of the present invention is a piezoelectric vibrator, which adopts the following configuration: a vibrator package of the first to fifth aspects described above and a piezoelectric vibrating plate mounted on the vibrating plate mounting side of the vibrator package described above.

[0019] According to the present invention, the vibrator package of the present invention enables the frequency indicated by the signal output from the signal output terminal to be more accurate.

[0020] The seventh aspect of the present invention is an oscillator, which adopts the following configuration: a piezoelectric oscillator of the sixth aspect described above and an integrated circuit chip mounted on the chip mounting side of the oscillator package described above.

[0021] According to the present invention, the frequency indicated by the signal output from the signal output terminal can be made more accurate.

[0022] The effects of the invention According to the present invention, a vibrator package, a piezoelectric vibrator, and an oscillator can be provided that can make the frequency indicated by the signal output from the signal output terminal more accurate. Attached Figure Description

[0023] Figure 1 This is a perspective view of the oscillator according to the first embodiment of the present invention.

[0024] Figure 2 This is a top view showing the oscillator in the first embodiment of the present invention with the sealing plate removed.

[0025] Figure 3 It is equivalent to Figure 2 A cross-sectional view of line II.

[0026] Figure 4 This is an exploded perspective view of the oscillator in the first embodiment of the present invention.

[0027] Figure 5 This is a bottom view of the package body and conductive part in the first embodiment of the present invention.

[0028] Figure 6 This is a top view of the package body and conductive portion according to the first embodiment of the present invention.

[0029] Figure 7 This is a top view of the piezoelectric vibrating sheet according to the first embodiment of the present invention.

[0030] Figure 8 This is a top view of the package body and conductive part in the second embodiment of the present invention.

[0031] Figure 9 This is a top view of the package body and conductive portion in the third embodiment of the present invention.

[0032] Figure 10 This is a cross-sectional view of the package in the fourth embodiment of the present invention.

[0033] Figure 11 This is a top view of the package body and conductive portion according to the fifth embodiment of the present invention.

[0034] Figure 12 This is a top view of the package body and conductive portion according to the sixth embodiment of the present invention. Detailed Implementation

[0035] Hereinafter, with reference to the accompanying drawings, one embodiment of the vibrator package, piezoelectric vibrator, and oscillator according to the present invention will be described.

[0036] Figure 1 This is a perspective view of the oscillator according to this embodiment. Figure 2 This is a top view showing the oscillator with the sealing plate removed. Figure 3 It is equivalent to Figure 2 A cross-sectional view of line II. Figure 4 This is an exploded perspective view of the oscillator involved in this embodiment. (As shown...) Figures 1-4 As shown in the figure, the oscillator 100 includes a piezoelectric vibrator 10 and an integrated circuit chip 20.

[0037] The piezoelectric vibrator 10 is a surface-mount vibrator of the so-called ceramic package type. The piezoelectric vibrator 10 includes a package 2 (vibrator package) having an internally hermetically sealed cavity C and a piezoelectric vibrating plate 3 housed within the cavity C. Furthermore, the piezoelectric vibrator 10 is rectangular in shape. In this embodiment, viewed from above, the direction of the long side of the piezoelectric vibrator 10 is referred to as the long side direction L, the direction of the short side is referred to as the width direction W, and the direction orthogonal to these long side directions L and width direction W is referred to as the thickness direction T.

[0038] The package 2 includes a package body 4, a sealing plate 5 bonded to the package body 4 and forming a cavity C between the sealing plate 5 and the package body 4, and a conductive part 6 for current flow. The package body 4 includes a first base substrate 2a (layer), a second base substrate 2b (layer), and a third base substrate 2c (layer) bonded to each other in an overlapping state, and a sealing ring 2d bonded to the third base substrate 2c.

[0039] The first base substrate 2a is a ceramic substrate that, when viewed from above, has the same shape as the second base substrate 2b. It is integrally bonded to the second base substrate 2b through sintering or the like while in contact with it. Figures 2-4 As shown, a first through-section 2e is formed on the first base substrate 2a, extending through the first base substrate 2a along the thickness direction T. The first through-section 2e has a rounded rectangular shape when viewed from above. An integrated circuit chip 20 is housed in the first through-section 2e. That is, the first through-section 2e surrounds the integrated circuit chip 20 in a plane including the long side direction L and the width direction W. The surface of the first base substrate 2a on the side opposite to the second base substrate 2b in the thickness direction T (hereinafter referred to as the lower surface 2a1) is the forming surface of the external connection terminals (external power supply terminal 30, signal output terminal 31, ground connection terminal 32, and switch terminal 33) described later, which are part of the conductive portion 6.

[0040] The second base substrate 2b is a rectangular ceramic substrate viewed from above in the thickness direction T. The upper surface 2b1 of the second base substrate 2b forms the bottom of the cavity C. The lower surface 2b2 of the second base substrate 2b is the forming surface of the chip electrodes (external power supply electrode 40, signal output electrode 41, first vibrating plate electrode 42, second vibrating plate electrode 43, ground connection electrode 44, and switch electrode 45), which are part of the conductive portion 6 and will be described later. These chip electrodes are the locations where terminals of the integrated circuit chip 20 are bonded. That is, the lower surface 2b2 of the second base substrate 2b, on which such chip electrodes are provided, is the mounting surface of the integrated circuit chip 20.

[0041] The third base substrate 2c is a ceramic substrate that, when viewed from above, has the same shape as the second base substrate 2b. It is integrally bonded to the second base substrate 2b through sintering or other processes while being superimposed on it. Figure 3 and Figure 4 As shown, a second through-section 2f is formed in the third base substrate 2c, extending through the third base substrate 2c along the thickness direction T. The second through-section 2f has a rounded rectangular shape when viewed from above. On the inner surface of the second through-section 2f, mounting portions (mounting portion 2g and mounting portion 2h) protruding inwards towards the width direction W are formed on both sides. Furthermore, mounting portions 2g and 2h are located at the center of the long side direction L of the third base substrate 2c.

[0042] On the mounting portions 2g and 2h, a first electrode pad 51 and a second electrode pad 52, which are part of the conductive portion 6 (described later), are formed. The first electrode pad 51 is formed on the mounting portion 2g, and the second electrode pad 52 is formed on the mounting portion 2h. These first electrode pads 51 and second electrode pads 52 are the portions where the piezoelectric vibrator 3 is bonded. That is, the upper surface of the mounting portions 2g and 2h (i.e., the upper surface 2c1 of the third base substrate 2c) where the first electrode pads 51 and second electrode pads 52 are provided is the mounting surface of the piezoelectric vibrator 3.

[0043] Furthermore, as ceramic materials used for the first base substrate 2a, the second base substrate 2b, and the third base substrate 2c, materials such as alumina-based HTCC (High Temperature Co-Fired Ceramic) or glass-ceramic-based LTCC (Low Temperature Co-Fired Ceramic) can be used.

[0044] At the four corners of the first base substrate 2a, the second base substrate 2b, and the third base substrate 2c, viewed from above, a quarter-circular cutout 2i is formed throughout the thickness direction T of the first base substrate 2a, the second base substrate 2b, and the third base substrate 2c. The first base substrate 2a, the second base substrate 2b, and the third base substrate 2c are fabricated by, for example, overlapping and bonding three wafer-shaped ceramic substrates, forming multiple through holes penetrating the three ceramic substrates in a matrix pattern, and simultaneously cutting the three ceramic substrates into a grid pattern based on each through hole. At this time, the through holes are divided into four parts, thereby constituting the aforementioned cutout 2i.

[0045] Furthermore, in this embodiment, such as Figure 3 As shown in the diagram, an integrated circuit chip 20 is disposed on the side of the first base substrate 2a of the second base substrate 2b, and a piezoelectric vibrator 3 is disposed on the side of the third base substrate 2c of the second base substrate 2b. That is, in this embodiment, the lower surface 2a1 of the first base substrate 2a and the lower surface 2b2 of the second base substrate 2b form the integrated circuit chip mounting side of the package body 4. In addition, the upper surface 2b1 of the second base substrate 2b and the upper surface 2c1 of the third base substrate 2c form the vibrator mounting side. Furthermore, the "upper and lower" in the names of the lower surface 2a1, upper surface 2b1, lower surface 2b2, and upper surface 2c1 indicates the direction for ease of explanation and does not limit the actual arrangement posture of the oscillator 100 relative to the vertical direction.

[0046] The sealing ring 2d is a conductive frame-shaped component that is slightly smaller in shape than the first base substrate 2a, the second base substrate 2b, and the third base substrate 2c, and is joined to the upper surface of the third base substrate 2c. Specifically, the sealing ring 2d is joined to the third base substrate 2c by soldering with hard solder such as silver solder or soft solder, or by depositing a metal bonding layer formed on the third base substrate 2c. The sealing ring 2d and the inner surface of the third base substrate 2c (the second through portion 2f) together form the sidewall of the cavity C. Furthermore, in the illustrated example, the inner surface of the sealing ring 2d is arranged coplanarly with the inner surface of the third base substrate 2c.

[0047] Examples of suitable materials for the sealing ring 2d include nickel-based alloys, specifically Kovar, Elinvar, Invar, and 42 alloys. Particularly, it is preferable to select a material for the sealing ring 2d with a coefficient of thermal expansion close to that of the second and third base substrates 2b and 2c, which are ceramic substrates. For example, a coefficient of thermal expansion of 6.8 × 10⁻⁶ is used for the second and third base substrates 2b and 2c. -6In the case of alumina at a temperature of / ℃, a coefficient of thermal expansion of 5.2 × 10⁻⁶ is preferred for the sealing ring 2d. -6 Kovar alloy with a coefficient of thermal expansion of 4.5-6.5 × 10⁻⁶ at / ℃. -6 Alloy 42 at / ℃.

[0048] The sealing plate 5 is composed of a conductive substrate and is joined to the sealing ring 2d to hermetically seal the interior of the package body 4. Moreover, the space defined by the sealing ring 2d, the sealing plate 5, the second base substrate 2b, and the third base substrate 2c constitutes a hermetically sealed cavity C.

[0049] The conductive portion 6 is a portion within the package 2 that serves as a conductive path for power or signals. This conductive portion 6 is composed of a single-layer film based on a single metal or a laminated film of different metals, formed by means of methods such as vapor deposition or sputtering.

[0050] Figure 5 This is a bottom view of the package body 4 and the conductive part 6. Additionally, Figure 6 This is a top view of the package body 4 and the conductive part 6. Furthermore, in Figure 6 The sealing ring 2d is omitted from the diagram. (See figure.) Figure 5 As shown in the diagram, in this embodiment, the conductive portion 6 serves as an external connection terminal formed on the lower surface 2a1 of the first base substrate 2a, including an external power supply terminal 30, a signal output terminal 31, a ground connection terminal 32, and a switch terminal 33. Furthermore, the conductive portion 6 serves as a chip electrode formed on the lower surface 2b2 of the second base substrate 2b, including an external power supply electrode 40, a signal output electrode 41, a first vibrating plate electrode 42, and a second vibrating plate electrode 43. Additionally, the conductive portion 6 includes external power supply wiring 46, signal output wiring 47, ground connection wiring 48, and switch wiring 49 formed on the lower surface 2b2 of the second base substrate 2b. These external power supply terminals 30, signal output terminals 31, ground connection terminals 32, switch terminals 33, external power supply electrodes 40, signal output electrodes 41, first vibrating plate electrodes 42, second vibrating plate electrodes 43, ground connection electrodes 44 and switch electrodes 45, external power supply wiring 46, signal output wiring 47, ground connection wiring 48 and switch wiring 49 are formed on the lower surface 2a1 of the first base substrate 2a or the lower surface 2b2 of the second base substrate 2b, i.e., the integrated circuit chip mounting side of the package body 4.

[0051] In addition, such as Figure 6As shown, the conductive portion 6 has a first electrode pad 51 and a second electrode pad 52 formed on the upper surface 2c1 of the third base substrate 2c. Additionally, the conductive portion 6 has piezoelectric resonator wiring 60 formed on the upper surface 2b1 of the second base substrate 2b. These first electrode pads 51, second electrode pads 52, and piezoelectric resonator wiring 60 are formed on the upper surface 2b1 of the second base substrate 2b or the upper surface 2c1 of the third base substrate 2c, i.e., the resonator mounting side of the package body 4. Furthermore, the conductive portion 6 has a plurality of through holes 70 that connect portions disposed at different positions in the thickness direction T to each other in the thickness direction T.

[0052] External connection terminals (external power supply terminal 30, signal output terminal 31, ground connection terminal 32, switch terminal 33) are used to connect the oscillator 100 to external devices, such as... Figure 5 As shown, it is disposed on the lower surface 2a1 of the first base substrate 2a and at the four corners of the first base substrate 2a. Figure 5 and Figure 6 As shown, the package body 4, viewed from the normal direction (thickness direction T) of the chip mounting side, is formed in a rectangular shape with a pair of long sides (long sides 4a and 4b) and a pair of short sides (short sides 4c and 4d). Figure 5 As shown, the external power supply terminal 30 and the signal output terminal 31 are arranged on one long side 4a along the direction of the short side. In addition, the ground connection terminal 32 and the switch terminal 33 are arranged on the other long side 4b along the direction of the short side.

[0053] The external power supply terminal 30 is used to connect the oscillator 100 to an external power supply D, and is located at the intersection of the long side 4a and the short side 4d. The signal output terminal 31 is used to output a signal (output signal S) from the oscillator 100 to an external source, and is located at the intersection of the long side 4a and the short side 4c. This output signal S includes a frequency component output from the piezoelectric vibrator 10. The ground connection terminal 32 is used to connect the oscillator 100 to a ground plane (not shown), and is located at the intersection of the long side 4b and the short side 4d. The switch terminal 33 is used to input a command signal that causes the output signal S to be output to the integrated circuit chip 20, and is located at the intersection of the long side 4b and the short side 4c.

[0054] The chip electrodes (external power supply electrode 40, signal output electrode 41, first vibrating plate electrode 42, second vibrating plate electrode 43, ground connection electrode 44, and switch electrode 45) are electrodes used to bond the integrated circuit chip 20, such as... Figure 5 As shown in the figure, it is disposed on the lower surface 2b2 of the second base substrate 2b and in the central part of the second base substrate 2b.

[0055] The external power supply electrode 40 is an electrode that connects to the power input terminal of the integrated circuit chip 20. This external power supply electrode 40 is positioned along the short side (width direction W) closer to the long side 4a than the central portion. The signal output electrode 41 is an electrode that connects to the signal output terminal of the integrated circuit chip 20. This signal output electrode 41 is positioned along the short side (width direction W) closer to the long side 4a than the central portion.

[0056] The first vibrating plate electrode 42 is an electrode that connects to the terminals of the integrated circuit chip 20 electrically connected to the piezoelectric vibrating plate 3 via the first electrode pad 51. The first vibrating plate electrode 42 is positioned along the short side (width direction W) closer to the long side 4b than the central portion. The second vibrating plate electrode 43 is an electrode that connects to the terminals of the integrated circuit chip 20 electrically connected to the piezoelectric vibrating plate 3 via the second electrode pad 52. The second vibrating plate electrode 43 is positioned along the short side (width direction W) closer to the long side 4b than the central portion.

[0057] Thus, in this embodiment, as Figure 5 As shown, the external power supply terminal 30 and the signal output terminal 31 are arranged with the first vibrating plate electrode 42 and the second vibrating plate electrode 43 sandwiching the central portion of the second base substrate 2b along the direction of the short side (width direction W). That is, the external power supply terminal 30 and the signal output terminal 31 are arranged on one long side 4a along the direction of the short side, and the first vibrating plate electrode 42 (the chip electrode connecting the piezoelectric vibrating plate wiring 60) and the second vibrating plate electrode 43 are arranged on the other long side 4b along the direction of the short side.

[0058] The ground connection electrode 44 is an electrode that bonds to the ground terminal of the integrated circuit chip 20. This ground connection electrode 44 is disposed in the center of the second base substrate 2b along the direction of its short side (width direction W). The switch electrode 45 is an electrode that bonds to the switch signal input terminal of the integrated circuit chip 20. This switch electrode 45 is disposed in the center of the second base substrate 2b along the direction of its short side (width direction W).

[0059] Regarding the external power supply wiring 46, it passes through a through-hole 70 in the first base substrate 2a, with one end connected to the external power supply terminal 30 and the other end connected to the external power supply electrode 40. That is, the external power supply wiring 46 electrically connects the external power supply terminal 30 and the external power supply electrode 40. Figure 5 As shown, the external power supply wiring 46 is arranged on one long side 4a and extends in a straight line along the long side direction L.

[0060] Regarding the signal output wiring 47, it passes through a through-hole 70 in the first base substrate 2a, with one end connected to the signal output terminal 31 and the other end connected to the signal output electrode 41. That is, the signal output wiring 47 electrically connects the signal output terminal 31 and the signal output electrode 41. Figure 5 As shown, the signal output wiring 47 is arranged on one long side 4a and extends in a straight line along the long side direction L.

[0061] Regarding the ground connection wiring 48, it passes through a through-hole 70 in the first base substrate 2a, with one end connected to the ground connection terminal 32 and the other end connected to the ground connection electrode 44. That is, the ground connection wiring 48 electrically connects the ground connection terminal 32 and the ground connection electrode 44. Figure 5 As shown, the ground connection wiring 48 extends from the ground connection terminal 32 to the ground connection electrode 44 in an inclined manner relative to the long side direction L and the width direction W.

[0062] Regarding the switch wiring 49, it passes through a through-hole 70 penetrating the first base substrate 2a, with one end connected to the switch terminal 33 and the other end connected to the switch electrode 45. That is, the switch wiring 49 electrically connects the switch terminal 33 and the switch electrode 45. Figure 5 As shown, the switch wiring 49 extends from the switch terminal 33 to the switch electrode 45 in a manner that is inclined relative to the long side direction L and the width direction W.

[0063] The first electrode pad 51 and the second electrode pad 52 are pads that bond to an electrode film (not shown) disposed on the piezoelectric vibrating sheet 3. Figure 6 As shown, the first electrode pad 51 is formed on the upper surface of the mounting portion 2g (the upper surface 2c1 of the third base substrate 2c) provided on the long side 4a side. The second electrode pad 52 is formed on the upper surface of the mounting portion 2h (the upper surface 2c1 of the third base substrate 2c) provided on the long side 4b side.

[0064] A piezoelectric vibrating element wiring 60 is disposed on the upper surface 2b1 of the second base substrate 2b. One end of the piezoelectric vibrating element wiring 60 is connected to the first electrode pad 51 via a through-hole 70 penetrating the third base substrate 2c. The other end of the piezoelectric vibrating element wiring 60 is connected to the first vibrating element electrode 42 via a through-hole 70 penetrating the second base substrate 2b. In other words, the piezoelectric vibrating element wiring 60 electrically connects the first electrode pad 51 and the first vibrating element electrode 42.

[0065] like Figure 6As shown, viewed from the thickness direction T (the normal direction of the chip mounting side), the piezoelectric vibrator wiring 60 extends from the mounting portion 2g toward the mounting portion 2h along the width direction W and then bends, extending in a straight line until it overlaps with the first vibrator electrode 42. Figure 5 and Figure 6 As shown in the figure, in this embodiment, the piezoelectric vibrating sheet wiring 60 is arranged so that it does not overlap with the external power supply wiring 46 and the signal output wiring 47 when viewed from the thickness direction T, and it spans the area where the piezoelectric vibrating sheet 3 is disposed.

[0066] Furthermore, when viewed from the thickness direction T, the fact that the piezoelectric vibrating sheet wiring 60 does not overlap with the external power supply wiring 46 and the signal output wiring 47 means that the area where the piezoelectric vibrating sheet wiring 60 is visible from the thickness direction T when only the piezoelectric vibrating sheet wiring 60 is left, and the area where the external power supply wiring 46 and the signal output wiring 47 are visible from the same direction when only the external power supply wiring 46 and the signal output wiring 47 are left, do not overlap when they are arranged in the same coordinate space and visible from the same direction.

[0067] In this embodiment, the piezoelectric vibrating element wiring 60, the external power supply wiring 46, and the signal output wiring 47 are located at different positions along the thickness direction T. Furthermore, the piezoelectric vibrating element wiring 60, the external power supply wiring 46, and the signal output wiring 47 are arranged without intersecting when visually discernible from the thickness direction T.

[0068] Furthermore, in this embodiment, the piezoelectric vibrating element wiring 60 is also arranged so that, when viewed from the thickness direction T, it does not overlap with the external power supply terminal 30 and the signal output terminal 31. Similarly, when viewed from the thickness direction T, the piezoelectric vibrating element wiring 60 is also arranged so that, when viewed from the thickness direction T, it does not overlap with the ground connection wiring 48 and the switch wiring 49.

[0069] Furthermore, in this embodiment, the second electrode pad 52 and the second vibrating plate electrode 43 are positioned at an overlapping location when viewed from the thickness direction T. These second electrode pads 52 and the second vibrating plate electrode 43 are connected and connected by a through-hole 70 penetrating the third base substrate 2c.

[0070] The piezoelectric vibrator 3 is housed within the cavity C of the hermetically sealed package 2. In this embodiment, the piezoelectric vibrator 3 includes a piezoelectric plate 3a formed of quartz. The piezoelectric plate 3a has a pair of vibrating arms (first vibrating arm 3b and second vibrating arm 3c) and a pair of supporting arms (first supporting arm 3d and second supporting arm 3e). Within the cavity C, the first supporting arm 3d is supported by the mounting portion 2g and the second supporting arm 3e is supported by the mounting portion 2h using a conductive adhesive, thereby mounting the piezoelectric vibrator 3 to the package 2. Thus, the piezoelectric vibrator 3 is supported within the cavity C in a state where the first vibrating arm 3b and the second vibrating arm 3c are suspended from the second base substrate 2b. On the outer surfaces of the first vibrating arm 3b and the second vibrating arm 3c, there are dual-system excitation electrodes (not shown) that cause the pair of first vibrating arms 3b and second vibrating arms 3c to vibrate when a predetermined voltage is applied.

[0071] Figure 7 This is a top view of the piezoelectric vibrator 3. The piezoelectric vibrator 3 includes a piezoelectric plate 3a and an electrode film (not shown) disposed on the outer surface of the piezoelectric plate 3a, which includes a front surface and a back surface. Furthermore, in this embodiment, the longitudinal direction L, the width direction W, and the thickness direction T of the piezoelectric vibrator 10 are aligned with the longitudinal direction, width direction, and thickness direction of the piezoelectric vibrator 3, respectively. Therefore, in the following description of the piezoelectric vibrator 3, the longitudinal direction L, the width direction W, and the thickness direction T of the piezoelectric vibrator 10 will be used.

[0072] The piezoelectric plate 3a includes a pair of vibrating arms (first vibrating arm 3b and second vibrating arm 3c), a pair of supporting arms (first supporting arm 3d and second supporting arm 3e), and a base 3f. The first vibrating arm 3b and the second vibrating arm 3c extend from the base 3f along the long side direction L. The first supporting arm 3d and the second supporting arm 3e are located on opposite sides of the base 3f in the width direction W. The piezoelectric plate 3a is formed such that its shape, viewed from the thickness direction T in a top view, is approximately symmetrical with respect to the central axis O along the long side direction L. Furthermore, in this embodiment, the piezoelectric material forming the piezoelectric plate 3a is quartz. Alternatively, piezoelectric materials such as lithium tantalate or lithium niobate can also be used to form the piezoelectric plate 3a.

[0073] The first vibrating arm 3b and the second vibrating arm 3c are arranged side by side and parallel along the width direction W, and are each connected to the base 3f. The first vibrating arm 3b and the second vibrating arm 3c vibrate in a direction of mutual approach / separation (width direction W) with the base end on the base 3f side as the fixed end and the top end as the free end. The first vibrating arm 3b and the second vibrating arm 3c have a main body 3g extending from the base end of the first vibrating arm 3b and the second vibrating arm 3c toward the top end, and a counterweight 3h located at the top end of the first vibrating arm 3b and the second vibrating arm 3c.

[0074] A groove 3i is formed in the main body 3g. The groove 3i is recessed along the thickness direction T on both main surfaces of the main body 3g and extends along the long side direction L. The groove 3i is formed from near the base ends of the first vibrating arm 3b and the second vibrating arm 3c to near the top end of the main body 3g.

[0075] The counterweights 3h extend from the top of the main body 3g along the long side direction L. The counterweights 3h are rectangular in shape when viewed from above, and are wider than the main body 3g along the width direction W. This increases the mass of the top ends of the first vibrating arm 3b and the second vibrating arm 3c, as well as their moment of inertia during vibration. Compared to a piezoelectric vibrator 3 without counterweights 3h, the lengths of the first vibrating arm 3b and the second vibrating arm 3c can be shortened.

[0076] Furthermore, a metal film 3j is provided on the surface of the counterweight 3h. The metal film 3j increases the mass of the top ends of the first vibrating arm 3b and the second vibrating arm 3c and the moment of inertia during vibration. During the manufacture of the piezoelectric vibrator 10, a pulsed laser (e.g., a picosecond laser or a femtosecond laser) is used to adjust the metal film 3j as needed. The mass of the top ends of the first vibrating arm 3b and the second vibrating arm 3c can be adjusted by adjusting the metal film 3j. The metal film 3j is composed of, for example, gold (Au) or silver (Ag), and its thickness is approximately 1-10 μm.

[0077] The first support arm 3d and the second support arm 3e, viewed from above, are L-shaped, surrounding the base 3f, the first vibrating arm 3b (main body 3g), and the second vibrating arm 3c (main body 3g) from the outside of the width direction W. The first support arm 3d is positioned on the same side as the first vibrating arm 3b relative to the central axis O. The second support arm 3e is positioned on the same side as the second vibrating arm 3c relative to the central axis O.

[0078] The electrode film is, for example, a laminated film of chromium (Cr) and gold (Au), formed by depositing a chromium film with excellent adhesion to quartz as a substrate, and then laminating a thin gold film on the chromium film. However, the composition of the electrode film is not limited to this. For example, a thin gold film may be further laminated on a laminated film of chromium (Cr) and nickel-chromium alloy (NiCr), or it may be a single-layer film of chromium (Cr), nickel (Ni), aluminum (Al), titanium (Ti), etc.

[0079] The electrode film includes: excitation electrodes, each disposed on the first vibrating arm portion 3b and the second vibrating arm portion 3c; assembly electrodes, which serve as assembly portions when the first support arm portion 3d and the second support arm portion 3e are mounted on the package 2; and connecting wiring, which connects to the excitation electrodes or the assembly electrodes.

[0080] like Figure 3 and Figure 4As shown, the integrated circuit chip 20 is housed in a space (first through-section 2e) surrounded by the lower surface 2b2 of the second base substrate 2b and the inner surface of the first base substrate 2a, and is mounted on the lower surface 2b2 of the second base substrate 2b. The terminals of the integrated circuit chip 20 are conductively connected to chip electrodes (external power supply electrode 40, signal output electrode 41, first vibrating plate electrode 42, second vibrating plate electrode 43, ground connection electrode 44, and switch electrode 45) provided on the lower surface 2b2 of the second base substrate 2b. The integrated circuit chip 20 generates and outputs an output signal S containing a frequency component by performing various arithmetic processing on the electrical signal input from the piezoelectric vibrator 10.

[0081] When the oscillator 100 is in operation, an external power supply is supplied to the external power supply electrode 40. Power is then supplied to the piezoelectric vibrator 3, and current flows through the excitation electrode, generating an electric field. The first vibrating arm 3b and the second vibrating arm 3c vibrate at a predetermined resonant frequency along a direction (width direction W) that leads to, for example, mutual approach / separation. Furthermore, the vibration of the first vibrating arm 3b and the second vibrating arm 3c is converted into an electrical signal according to the piezoelectric characteristics of the piezoelectric vibrator 3. This electrical signal is input to the integrated circuit chip 20. Regarding the integrated circuit chip 20, if a command signal is input from a higher-level control system via the switching electrode 45, an output signal S generated by performing various calculations on the aforementioned electrical signal is output. This output signal S is output to the outside via the signal output electrode 41 through the signal output wiring 47.

[0082] The oscillator 100 of this embodiment, as described above, includes a package 2 comprising a package body 4. Furthermore, the package 2 has a chip mounting side on one side where the integrated circuit chip 20 is mounted, and a vibrating plate mounting side on the opposite side where the piezoelectric vibrating plate 3 is mounted. Additionally, the package 2 includes multiple chip electrodes (external power supply electrode 40, signal output electrode 41, first vibrating plate electrode 42, second vibrating plate electrode 43, ground connection electrode 44, and switch electrode 45) disposed on the chip mounting side and connected to the terminals of the integrated circuit chip 20.

[0083] Additionally, package 2 includes: an external power supply terminal 30 disposed on the chip mounting side and connected to an external power supply D; and a signal output terminal 31 disposed on the chip mounting side and outputting a signal (output signal S) to the outside. Furthermore, package 2 includes: an external power supply wiring 46 disposed on the chip mounting side and connecting chip electrodes to the external power supply terminal 30; and a signal output wiring 47 disposed on the chip mounting side and connecting chip electrodes to the signal output terminal 31.

[0084] Additionally, the package 2 includes a first electrode pad 51 disposed on the vibrator mounting side and connected to the piezoelectric vibrator 3. Furthermore, the package 2 includes piezoelectric vibrator wiring 60. The piezoelectric vibrator wiring 60 is disposed without overlapping the external power supply wiring 46 and the signal output wiring 47 when viewed from the normal direction of the chip mounting side, and spans the area where the piezoelectric vibrator 3 is disposed, and connects the first electrode pad 51 to the chip electrode.

[0085] According to the package 2 of this embodiment, the piezoelectric vibrator wiring 60 is configured to span the area where the piezoelectric vibrator 3 is disposed when viewed from the normal direction of the chip mounting side, and further, when viewed from the same direction, it does not overlap with the external power supply wiring 46 and the signal output wiring 47. Therefore, it is possible to suppress noise components superimposed on the signal flowing through the piezoelectric vibrator wiring 60 or the signal output wiring 47, making the frequency indicated by the signal output from the signal output terminal 31 more accurate.

[0086] Furthermore, in the package 2 of this embodiment, the package body 4 is formed in a rectangular shape having a pair of long sides and a pair of short sides when viewed from the normal direction of the chip mounting side. In addition, the external power supply terminal 30 and the signal output terminal 31 are arranged on one long side 4a along the direction of the short side, and the chip electrodes (first vibrating plate electrode 42 and second vibrating plate electrode 43) connecting the piezoelectric vibrating plate wiring 60 are arranged on the other long side 4b along the direction of the short side.

[0087] According to the package of this embodiment of the present invention, compared with the case where the chip electrodes (first vibrating plate electrode 42 and second vibrating plate electrode 43) connecting the piezoelectric vibrating plate wiring 60 are arranged on one long side 4a, the chip electrodes connecting the piezoelectric vibrating plate wiring 60 can be arranged separately from the external power supply terminal 30 and the signal output terminal 31. Therefore, the influence of the voltage applied to the external power supply terminal 30 on the signal flowing through the chip electrodes (first vibrating plate electrode 42 and second vibrating plate electrode 43) connecting the piezoelectric vibrating plate wiring 60 can be suppressed, and interference with the output signal flowing through the signal output terminal 31 can also be suppressed.

[0088] Furthermore, in this embodiment, the piezoelectric vibrator 10 includes a package 2 and a piezoelectric vibrating plate 3 mounted on the vibrating plate mounting side of the package 2. Therefore, the frequency indicated by the signal output from the signal output terminal 31 can be made more accurate.

[0089] Furthermore, in this embodiment, the oscillator 100 includes a piezoelectric vibrator 10 and an integrated circuit chip 20 mounted on the chip mounting side of the package 2. Therefore, the frequency indicated by the signal output from the signal output terminal 31 can be made more accurate.

[0090] (Second Implementation) Next, refer to Figure 8 The second embodiment of the present invention will now be described. Furthermore, in the description of this embodiment, parts that are the same as those in the first embodiment described above will be omitted or simplified.

[0091] In the first embodiment described above, the piezoelectric vibrating sheet wiring 60 is exposed inside the cavity C. In contrast, in the package 2A of this embodiment, an insulating coating 61 is provided to cover the portion of the piezoelectric vibrating sheet wiring 60 exposed in the cavity C.

[0092] Figure 8 This is a top view of the package body 4 and the conductive portion 6. As shown in this figure, in this embodiment, an insulating coating 61 is provided to cover the wiring 60 for the piezoelectric vibrator. This insulating coating 61 is a coating material formed of, for example, alumina (alumina). Alternatively, the insulating coating 61 may be formed of other materials, such as resin.

[0093] Such an insulating coating 61 can be formed by partially applying a coating material, such as a coating forming material, to the piezoelectric vibrating sheet wiring 60 and drying the coating material. Alternatively, the insulating coating 61 can also be formed entirely or partially on the upper surface 2b1 of the second base substrate 2b exposed in the cavity C.

[0094] Thus, regarding the package 2A of this embodiment, the piezoelectric vibrating sheet wiring 60 is provided on the vibrating sheet mounting side and has an insulating coating 61 covering the portion of the piezoelectric vibrating sheet wiring 60 provided on the vibrating sheet mounting side.

[0095] According to the package 2A of this embodiment, the portion of the piezoelectric vibrator wiring 60 disposed on the vibrator mounting side is covered by an insulating coating 61. Therefore, it is possible to prevent foreign objects from contacting the portion of the piezoelectric vibrator wiring 60 disposed on the vibrator mounting side. For example, if during manufacturing, in order to adjust the frequency of the piezoelectric vibrator 3, the metal film 3j, which is part of the piezoelectric vibrator 3, is cut, metal chips are generated. It is possible to prevent such chips (cutting chips) from contacting the portion of the piezoelectric vibrator wiring 60 disposed on the vibrator mounting side.

[0096] (Third Implementation) Next, refer to Figure 9 The third embodiment of the present invention will now be described. Furthermore, in the description of this embodiment, parts that are the same as those in the first embodiment described above will be omitted or simplified.

[0097] In the first embodiment described above, the first vibrating plate electrode 42 is disposed in the longitudinal direction L on the side closer to the top end of the piezoelectric vibrating plate 3 than the center of the second base substrate 2b. In contrast, in the package 2B of this embodiment, the first vibrating plate electrode 42 is disposed in the longitudinal direction L on the side opposite to the top end of the piezoelectric vibrating plate 3 than the center of the second base substrate 2b.

[0098] Figure 9 This is a top view of the package body 4 and the conductive portion 6. As shown in this figure, in this embodiment, a piezoelectric vibrating sheet wiring 62 is provided instead of the piezoelectric vibrating sheet wiring 60 described in the first embodiment. This piezoelectric vibrating sheet wiring 62 is disposed on the upper surface 2b1 of the second base substrate 2b. Furthermore, one end of the piezoelectric vibrating sheet wiring 62 is connected to the first electrode pad 51 via a through-hole 70 penetrating the third base substrate 2c. The other end of the piezoelectric vibrating sheet wiring 62 is connected to the first vibrating sheet electrode 42 via a through-hole 70 penetrating the second base substrate 2b. That is, the piezoelectric vibrating sheet wiring 62 electrically connects the first electrode pad 51 and the first vibrating sheet electrode 42.

[0099] Viewed from the thickness direction T (the normal direction of the chip mounting side), the piezoelectric vibrator wiring 62 extends from the mounting portion 2g toward the mounting portion 2h along the width direction W and then bends, so as to extend from the first vibrating arm 3b and the second vibrating arm 3c of the piezoelectric vibrator 3 (refer to...). Figure 2 The piezoelectric vibrating plate 3 extends in a straight line from the top part of the piezoelectric vibrating plate 3 to a position where it overlaps with the first vibrating plate electrode 42. In this embodiment, the piezoelectric vibrating plate wiring 62 is arranged so that it does not overlap with the external power supply wiring 46 and the signal output wiring 47 when viewed from the thickness direction T, and it spans the area where the piezoelectric vibrating plate 3 is arranged.

[0100] Furthermore, in this embodiment, the piezoelectric vibrator wiring 62 extends from the mounting portion 2g toward the first vibrator electrode 42 from the first vibrating arm portion 3b and the second vibrating arm portion 3c of the piezoelectric vibrator 3 (see reference). Figure 2 The piezoelectric vibrator wiring 62 extends in a way that separates the top portion of the piezoelectric vibrator 3 from the chip mounting side. Therefore, in this embodiment, the wiring 62 for the piezoelectric vibrator is arranged so that it does not overlap with the top portion of the piezoelectric vibrator 3 when viewed from the normal direction of the chip mounting side. Therefore, it is possible to suppress the adhesion of chips generated by cutting the top portion of the piezoelectric vibrator 3 to the wiring 62 for the piezoelectric vibrator.

[0101] (Fourth implementation) Next, refer to Figure 10 The fourth embodiment of the present invention will now be described. Furthermore, in the description of this embodiment, parts that are the same as those in the first embodiment described above will be omitted or simplified.

[0102] In the first embodiment described above, the second base substrate 2b is a single layer. In contrast, in the package 2C of this embodiment, the second base substrate 2b is divided into a lower layer 2b3 and an upper layer 2b4.

[0103] Figure 10 This is a cross-sectional view of the package 2C. As shown in the figure, in the package 2C of this embodiment, the second base substrate 2b is divided into a lower layer 2b3 and an upper layer 2b4. That is, in this embodiment, the package 2C is composed of a multilayer body consisting of a first base substrate 2a, a lower layer 2b3 of the second base substrate 2b, an upper layer 2b4 of the second base substrate 2b, and a third base substrate 2c, which are stacked sequentially from the bottom.

[0104] Furthermore, in this embodiment, the piezoelectric vibrator wiring 60 is disposed at the interface between the lower layer 2b3 and the upper layer 2b4 of the second base substrate 2b. Therefore, the piezoelectric vibrator wiring 60 is covered by the upper layer 2b4 of the second base substrate 2b and is not exposed inside the cavity C. Thus, it is possible to suppress the adhesion of chips generated during the cutting of the top tip of the piezoelectric vibrator 3 to the piezoelectric vibrator wiring 60.

[0105] (Fifth Embodiment) Next, refer to Figure 11 The fifth embodiment of the present invention will now be described. Furthermore, in the description of this embodiment, parts that are the same as those in the first embodiment described above will be omitted or simplified.

[0106] In the first embodiment described above, the package 2 is provided with a so-called side-arm type piezoelectric vibrator 3. In contrast, the package 2D of this embodiment is provided with a so-called cantilever type piezoelectric vibrator 3A.

[0107] Figure 11 This is a top view of the package body 4 and the conductive part 6 of this embodiment. As shown in this figure, the piezoelectric vibrating plate 3A mounted on the package 2D is formed as a cantilever type with the first vibrating arm 3m and the second vibrating arm 3n extending parallel to the base 3k along the long side direction L.

[0108] In the package 2D of this embodiment, the mounting portion 2g and the mounting portion 2h are disposed on one side of the cavity C in the long side direction L. A piezoelectric vibrating plate wiring 63 is provided to connect the first electrode pad 51 and the first vibrating plate electrode 42. Furthermore, in this embodiment, the second electrode pad 52 and the second vibrating plate electrode 43 are connected via a through-hole 70.

[0109] In this embodiment, such as Figure 11As shown, the piezoelectric vibrator wiring 63 is configured to span the area where the piezoelectric vibrator 3A is disposed when viewed from the normal direction of the chip mounting side, and does not overlap with the external power supply wiring 46 and the signal output wiring 47 when viewed from the same direction. Therefore, noise components superimposed on the signal flowing through the piezoelectric vibrator wiring 63 and the signal output wiring 47 can be suppressed, making the frequency indicated by the signal output from the signal output terminal 31 more accurate.

[0110] (Sixth Embodiment) Next, refer to Figure 12 The sixth embodiment of the present invention will now be described. Furthermore, in the description of this embodiment, parts that are the same as those in the first embodiment described above will be omitted or simplified.

[0111] In the first embodiment described above, the package 2 is provided with a so-called side-arm type piezoelectric vibrator 3. In contrast, the package 2E of this embodiment is provided with a center-arm type piezoelectric vibrator 3B.

[0112] Figure 12 This is a top view of the package body 4 and the conductive portion 6 of this embodiment. As shown in the figure, the piezoelectric vibrating plate 3B mounted on the package 2E is formed as a central arm type having the following: a single support arm 3q, which extends from the base 3p along the long side direction L; and a pair of first vibrating arms 3r and second vibrating arms 3s, which are configured to sandwich the support arm 3q in the width direction W.

[0113] In the package 2E of this embodiment, instead of mounting portions 2g and 2h, a single mounting portion 2j is provided at the center of the cavity C along the long side direction L. A first electrode pad 51 and a second electrode pad 52 are provided on this mounting portion 2j.

[0114] Additionally, the package 2E is provided with piezoelectric vibrating plate wiring 64 that connects the first electrode pad 51 to the first vibrating plate electrode 42.

[0115] In this embodiment, such as Figure 12 As shown, the piezoelectric vibrator wiring 64 is configured to span the area where the piezoelectric vibrator 3B is disposed when viewed from the normal direction of the chip mounting side, and does not overlap with the external power supply wiring 46 and the signal output wiring 47 when viewed from the same direction. Therefore, noise components superimposed on the signal flowing through the piezoelectric vibrator wiring 64 and the signal output wiring 47 can be suppressed, making the frequency indicated by the signal output from the signal output terminal 31 more accurate.

[0116] The above description, with reference to the accompanying drawings, outlines suitable embodiments of the present invention, but the invention is not limited to these embodiments. The various shapes or combinations of the constituent components shown in the above embodiments are examples, and various modifications can be made based on design requirements, etc., without departing from the spirit of the invention.

[0117] Symbol Explanation 10… Piezoelectric vibrator, 20… Integrated circuit chip, 100… Oscillator, 2… Package (vibrator package), 2A… Package (vibrator package), 2B… Package (vibrator package), 2C… Package (vibrator package), 2D… Package (vibrator package), 2E… Package (vibrator package), 2a… First base substrate (layer), 2a1… Lower surface, 2b… Second base substrate (layer), 2b1… Upper surface, 2b2… Lower surface, 2b3… Lower layer (layer), 2b4… Upper layer (layer), 2c… Third base substrate (layer), 2c1… Upper surface, 3… Piezoelectric vibrating plate, 3a… Piezoelectric plate, 3A… Piezoelectric vibrating plate, 4… …Package body, 4a…long side, 4b…long side, 4c…short side, 4d…short side, 6…conductive part, 30…terminal for external power supply, 31…terminal for signal output, 40…electrode for external power supply (electrode for chip), 41…electrode for signal output (electrode for chip), 42…electrode for first vibrator (electrode for chip), 43…electrode for second vibrator (electrode for chip), 44…electrode for ground connection (electrode for chip), 45…electrode for switch (electrode for chip), 46…wiring for external power supply, 60…wiring for piezoelectric vibrator, 61…insulating coating, 62…wiring for piezoelectric vibrator, 63…wiring for piezoelectric vibrator, 64…wiring for piezoelectric vibrator, D…external power supply, S…output signal.

Claims

1. A package for a vibrator, comprising a package body having a chip mounting side having an integrated circuit chip mounted thereon and a vibrating plate mounting side disposed on the side opposite to the chip mounting side and on the side where a piezoelectric vibrating plate is mounted, wherein, have: Multiple chip electrodes are disposed on the chip mounting side and connected to the terminals of the integrated circuit chip; An external power supply terminal is provided on the chip mounting side and is connected to an external power supply. A signal output terminal is provided on the side of the chip mounting and outputs the signal to the outside; An external power supply wiring is provided on the chip mounting side and connects the chip electrodes to the external power supply terminals; Signal output wiring is provided on the chip mounting side and connects the chip electrodes to the signal output terminals; A bonding pad is mounted on the vibrating plate and is disposed on the mounting side of the vibrating plate, and is connected to the piezoelectric vibrating plate; and The wiring for the piezoelectric vibrator is arranged such that, when viewed from the normal direction of the chip mounting side, it does not overlap with the external power supply wiring and signal output wiring, and it spans the area where the piezoelectric vibrator is disposed. The vibrator is connected to the chip electrodes via mounting pads. At least a portion of the wiring for the piezoelectric vibrator is disposed on the mounting side of the vibrator. It has an insulating coating covering the portion of the wiring for the piezoelectric vibrator disposed on the mounting side of the vibrator.

2. The package for a vibrator according to claim 1, wherein, The piezoelectric vibrator is configured such that the wiring, when viewed from the normal direction of the chip mounting side, does not overlap with the top end of the vibrating arm of the piezoelectric vibrator.

3. The vibrator encapsulation according to claim 1 or 2, wherein, The package body is formed in a rectangular shape with a pair of long sides and a pair of short sides when viewed from the normal direction of the chip mounting side. The external power supply terminal and the signal output terminal are arranged on one of the long sides along the direction of the short side. The chip electrode connecting the piezoelectric vibrator wiring is disposed on the other long side in the direction along the short side.

4. A piezoelectric vibrator, comprising: The vibrator package according to any one of claims 1-3; and A piezoelectric vibrating plate is mounted on the vibrating plate mounting side of the vibrator package.

5. An oscillator comprising: The piezoelectric vibrator according to claim 4; and An integrated circuit chip is mounted on the chip mounting side of the vibrator package.

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