Electronic component, method for manufacturing the same, and method for manufacturing mounting substrate

Abstract

The present application provides a surface-mounted electronic component that can reduce voids in solder without changing the layout of a land pattern. An electronic component (1) of the present application includes a mounting surface (11) having a terminal formation area (A), and a plurality of terminal electrodes (12) arranged in an array in the terminal formation area (A). A center point (C2) of the terminal formation area (A) is offset from a center point (C1) of the mounting surface (11). Thus, when mounted to a mounting substrate (20), if mounted so that the center point (C0) of the mounting area (1a) coincides with the center point (C1) of the mounting surface (11) after supplying solder paste to the land pattern, a prescribed misalignment occurs in the planar positions of the land pattern (22) and the terminal electrodes (12). Therefore, without changing the layout of the land pattern (22), air inside the solder can be released to the outside.

Description

Technical Field

[0001] This invention relates to electronic components and methods for manufacturing them, and more particularly to surface-mount electronic components having a structure in which a plurality of terminal electrodes are arranged in an array on the mounting surface, and methods for manufacturing them. Furthermore, this invention relates to methods for manufacturing mounting substrates on which such electronic components are mounted. Background Technology

[0002] When mounting surface-mount electronic components onto a mounting substrate, solder paste is supplied to the pad pattern of the mounting substrate. After mounting the electronic components onto the substrate by contacting the terminal electrodes of the electronic components with the solder paste, reflow soldering is performed to melt the solder paste. However, when the solder after reflow soldering contains a large number of voids, problems such as decreased connection strength, decreased heat dissipation, and increased resistance occur. These problems are particularly pronounced when using lead-free solder with low flowability. That is, when using lead-free solder, volatile gases and flux residues generated from the solder paste are difficult to release from the solder to the outside and remain directly inside the solder, thus creating voids.

[0003] As a method to reduce such voids, Patent Document 1 discloses a method of offsetting the pad pattern on the mounting substrate at a predetermined angle relative to the terminal electrodes of the electronic component, or offsetting the planar position. Accordingly, since the surface energy of the solder melted by reflow soldering decreases, the voids inside the solder are easily released to the outside.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2010-206166 Summary of the Invention

[0007] The technical problem that the invention aims to solve

[0008] However, due to the large number of electronic components mounted on the mounting substrate, it is not easy to change the design of the pad pattern.

[0009] Therefore, the object of the present invention is to provide a surface-mount electronic component and a method for manufacturing the same, which can reduce voids remaining in the solder without changing the layout of the pad pattern. Furthermore, the object of the present invention is to provide a method for manufacturing a mounting substrate on which such an electronic component is mounted.

[0010] Problem-solving methods

[0011] An electronic component of one aspect of the present invention is characterized by comprising: a mounting surface having a terminal forming region; and a plurality of terminal electrodes arranged in an array in the terminal forming region, wherein the center point of the terminal forming region is offset relative to the center point of the mounting surface.

[0012] According to the present invention, when mounting to a mounting substrate, after supplying solder paste to the pad pattern, if the mounting is performed with the center point of the mounting area aligned with the center point of the mounting surface, a predetermined misalignment occurs between the planar positions of the pad pattern and the terminal electrodes. Thus, voids within the solder can be released to the outside without altering the layout of the pad pattern.

[0013] In this invention, the mounting surface may also include: a chip surface constituting a terminal forming region, formed by a chip body having internal circuitry connected to multiple terminal electrodes; and a molded surface formed by molded members covering the periphery of the chip body. The mounting surface has a first edge and a second edge opposite to each other, and the width of the first edge and the width of the second edge are different in the width of the molded surface on the mounting surface. By adopting this method, the center point of the terminal forming region can be shifted in one direction without designing the chip body.

[0014] In this case, the mounting surface may also have a third edge and a fourth edge, which are opposite to each other and connect one end of the first edge and the second edge to each other and the other end to each other, respectively. The width of the third edge is different from the width of the fourth edge in the width of the molded surface on the mounting surface. By adopting this method, the center point of the terminal forming area can be offset in the tilt direction without making design changes to the chip body.

[0015] Another aspect of the electronic component of the present invention may include: a mounting surface having a terminal forming region; and a plurality of terminal electrodes arranged in an array in the terminal forming region, each edge of the terminal forming region being divided, and each edge having a predetermined inclination relative to the corresponding edge of the mounting surface.

[0016] According to the present invention, when mounting to a mounting substrate, after supplying solder paste to the pad pattern, if the mounting is performed with the center point of the mounting area aligned with the center point of the mounting surface, a predetermined misalignment occurs between the planar positions of the pad pattern and the terminal electrodes. Thus, voids within the solder can be released to the outside without altering the layout of the pad pattern.

[0017] In this invention, the mounting surface may also include: a chip surface constituting a terminal forming region, formed by a chip body portion having internal circuitry connected to multiple terminal electrodes; and a molding surface formed by molding members covering the periphery of the chip body portion, the width of the molding surface on the mounting surface varying along each edge of the mounting surface. By employing this method, the coordinates of the multiple terminal electrodes can be rotated without requiring design changes to the chip body portion.

[0018] A method for manufacturing an electronic component according to one aspect of the present invention is characterized by comprising: a first step of fabricating a chip body portion having a plurality of terminal electrodes formed on a mounting surface; and a second step of covering a first side surface and a second side surface of the chip body portion perpendicular to the mounting surface with a molding member, wherein in the second step, the molding member covering the second side surface is thicker than the molding member covering the first side surface.

[0019] According to the present invention, electronic components in which the terminal forming area is offset relative to the mounting surface can be easily manufactured.

[0020] Another aspect of the present invention is a method for manufacturing an electronic component, characterized by comprising: a first step of fabricating a chip body portion having a plurality of terminal electrodes formed on a mounting surface; and a second step of covering a side surface of the chip body portion perpendicular to the mounting surface with a molding member, wherein in the second step, the molding member is formed in such a manner that the thickness of the molding member covering the side surface varies along the corresponding edge of the mounting surface.

[0021] According to the present invention, it is possible to easily manufacture electronic components in which the terminal forming area is rotated and misaligned relative to the mounting surface.

[0022] The method for manufacturing a mounting substrate according to the present invention is characterized by comprising: a first step of preparing a mounting substrate having a mounting area provided with a plurality of pad patterns; a second step of mounting the electronic component on the mounting area after supplying solder paste to the plurality of pad patterns; and a third step of melting the solder paste by heating, wherein in the second step, the electronic component is mounted in such a way that regions overlapping with and non-overlapping with corresponding terminal electrodes are generated in the plurality of pad patterns.

[0023] According to the present invention, when the solder paste is melted by heating, the electronic components self-align and the solder paste flows accordingly, thus easily releasing voids to the outside during the flow of the solder paste.

[0024] The effects of the invention

[0025] As described above, according to the present invention, voids remaining in the solder can be reduced without changing the layout of the pad pattern. Attached Figure Description

[0026] Figure 1This is a general cross-sectional view of the electronic component 1 according to the first embodiment of the present invention.

[0027] Figure 2 This is a general top view of electronic component 1 viewed from the mounting side.

[0028] Figure 3 This is a general top view showing a portion of the surface 21 of the mounting substrate 20 on which the electronic component 1 is mounted.

[0029] Figure 4 This is a schematic perspective top view used to illustrate the state of the electronic component 1 mounted in the mounting area 1a of the mounting substrate 20.

[0030] Figure 5 (a) is a general cross-sectional view showing the state immediately after the pad pattern 22 and the terminal electrode 12 have been connected by solder paste 23. Figure 5 (b) is a general cross-sectional view showing the state after reflow soldering.

[0031] Figure 6 This is a general cross-sectional view of the electronic component 2 according to the second embodiment of the present invention.

[0032] Figure 7 This is a general top view of electronic component 2 viewed from the mounting side.

[0033] Figure 8 This is a general cross-sectional view of the electronic component 2a in a modified example of the second embodiment.

[0034] Figure 9 This is a general top view of the electronic component 3 of the third embodiment of the present invention, viewed from the mounting side.

[0035] Figure 10 This is a schematic perspective top view used to illustrate the state of electronic component 3 mounted in mounting area 1a of mounting substrate 20.

[0036] Figure 11 This is a general top view of the electronic component 4 of the fourth embodiment of the present invention, viewed from the mounting side.

[0037] Figure 12 This is a schematic top view used to explain the manufacturing method of the electronic component 1 according to the first embodiment.

[0038] Figure 13 This is a schematic top view used to explain the manufacturing method of the electronic component 3 in the third embodiment.

[0039] Figure 14 This is a process diagram used to explain the manufacturing method of the electronic component 2 in the second embodiment.

[0040] Figure 15 This is a process diagram used to explain the manufacturing method of the electronic component 2 in the second embodiment.

[0041] Figure 16 This is a process diagram used to explain the manufacturing method of the electronic component 2 in the second embodiment.

[0042] Figure 17 This is a process diagram used to explain the manufacturing method of the electronic component 2 in the second embodiment.

[0043] Figure 18 This is a process diagram used to explain the manufacturing method of the electronic component 4 in the fourth embodiment.

[0044] Figure 19 (a) to (f) are schematic top views showing the changes in the relationship between edges Aa to Ad and the edges of sides 14a to 14d.

[0045] Symbol Explanation

[0046] 1-4, 2a Electronic components

[0047] 1a Mounting Area

[0048] 5a and 5b composite substrates

[0049] 6x, 6y cutting regions

[0050] 7x, 7y cutting lines

[0051] 10. Chip body

[0052] 10a is the region containing internal circuitry.

[0053] 11 Mounting surface

[0054] 11a~11d Edge

[0055] 12 terminal electrodes

[0056] 13. Upper surface

[0057] 14a~14d Side view

[0058] 15 terminal electrodes

[0059] 18 Internal Circuits

[0060] 20 Mounting substrate

[0061] 21 Surface of mounting substrate

[0062] 22 Pad Pattern

[0063] 23 Solder paste

[0064] 24 Alignment Marks

[0065] 30 Molded components

[0066] 41-44 Chip Components

[0067] 50 Support

[0068] 51 Heat-resistant sheet material

[0069] 52 Heat-resistant double-sided tape

[0070] A Terminal Formation Area

[0071] Aa~Ad edge

[0072] C0~C4 center point

[0073] S1 chip surface

[0074] S2 Molded Surface Detailed Implementation

[0075] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0076] <First Embodiment>

[0077] Figure 1 This is a general cross-sectional view of the electronic component 1 according to the first embodiment of the present invention. Furthermore, Figure 2 This is a general top view of electronic component 1 viewed from the mounting side.

[0078] like Figure 1 and Figure 2 As shown, the electronic component 1 of the first embodiment includes a chip body 10 and a plurality of terminal electrodes 12 arranged in an array on the mounting surface 11 of the chip body 10. An internal circuit 18 connected to the terminal electrodes 12 is formed inside the chip body 10. The type of internal circuit 18 is not particularly limited.

[0079] like Figure 2 As shown, a terminal forming region A is defined on the mounting surface 11. Terminal forming region A is a rectangular region surrounding all terminal electrodes 12, where multiple terminal electrodes 12 are formed. Figure 2 In the example shown, 16 terminal electrodes 12 are provided, but the number of terminal electrodes 12 is not limited. Furthermore, all terminal electrodes 12 do not necessarily need to be arranged in both the x and y directions; there may be areas within the terminal forming region A without terminal electrodes 12. Moreover, the size and shape of the terminal electrodes 12 do not necessarily need to be identical; for example, some terminal electrodes 12 may be larger. Furthermore, the planar shape of the terminal electrodes 12 is not limited to… Figure 2 The quadrilateral shown can also be a circle or other planar shapes.

[0080] In this embodiment, the planar position of the terminal forming region A is offset relative to the mounting surface 11. That is, the distance between the edge of the terminal forming region A and the edge of the mounting surface 11 is not constant. When the distance between the edges 11a to 11d of the mounting surface 11 and the edges Aa to Ad of the terminal forming region A is set to W1 to W4, the design is as follows:

[0081] W1 < W2 or W3 < W4.

[0082] And it could also be:

[0083] W1 < W2 and W3 < W4. Here, the opposing edges 11a and 11b of the mounting surface 11 and the opposing edges Aa and Ab of the terminal forming region A extend in the y-direction, while the opposing edges 11c and 11d of the mounting surface 11 and the opposing edges Ac and Ad of the terminal forming region A extend in the x-direction. One or both of edges 11a and 11b may have a predetermined inclination relative to the y-direction. Similarly, one or both of edges 11c and 11d may have a predetermined inclination relative to the x-direction. Therefore, edges 11a and 11b need not be strictly perpendicular to edges 11c and 11d; the ends of edges 11a and 11b on one side in the y-direction are connected to each other by edge 11c, and the ends of edges 11a and 11b on the other side in the y-direction are connected to each other by edge 11d. Distances W1 and W2 refer to the distances in the x direction between the edges 11a and 11b of the mounting surface 11 and the edges Aa and Ab of the terminal forming area A, respectively. Distances W3 and W4 refer to the distances in the y direction between the edges 11c and 11d of the mounting surface 11 and the edges Ac and Ad of the terminal forming area A, respectively.

[0084] Therefore, the center point C1 of the mounting surface 11 and the center point C2 of the terminal forming area A are not aligned, and their planar positions are offset. Figure 2 In the example shown, the center point C2 of the terminal forming area A is offset to the left and downward (in the -x and -y directions) relative to the center point C1 of the mounting surface 11.

[0085] Figure 3 This is a general top view showing a portion of the surface 21 of the mounting substrate 20 on which the electronic component 1 is mounted.

[0086] exist Figure 3The surface 21 of the mounting substrate 20 shown defines a mounting region 1a for mounting the electronic component 1. The planar position of the mounting region 1a is identified by alignment marks 24 that can be seen from the surface 21 side. Multiple pad patterns 22 for connection to the terminal electrodes 12 of the electronic component 1 are provided in the mounting region 1a. The multiple pad patterns 22 are not offset relative to the mounting region 1a; therefore, the center point of both the mounting region 1a and the multiple pad patterns 22 is C0.

[0087] Figure 4 This is a schematic perspective top view used to illustrate the state in which the electronic component 1 is mounted in the mounting area 1a of the mounting substrate 20.

[0088] When mounting electronic component 1 on mounting area 1a, after solder paste is supplied to the pad pattern 22, the pick-and-place machine picks up electronic component 1 and mounts it on mounting area 1a in a manner that the center point C0 coincides with C1 and the shape of electronic component 1 matches the shape of mounting area 1a. The result is as follows: Figure 4 As shown, a positional misalignment of the planes is generated between the planar positions of each pad pattern 22 on the mounting substrate 20 and the corresponding terminal electrode 12 of the electronic component 1, corresponding to the offset of the center points C1 and C2. That is, on the terminal electrode 12, there are areas that overlap with the corresponding pad pattern 22 and areas that do not overlap, and on the pad pattern 22, there are areas that overlap with the corresponding terminal electrode 12 and areas that do not overlap. At this time, the area where the terminal electrode 12 of the electronic component 1 overlaps with the pad pattern 22 of the mounting substrate 20 is preferably 40% to 90% of the area of ​​the terminal electrode 12 of the electronic component 1. To achieve such a structure, when the outer dimension of one side of the electronic component 1 is 1 to 10 mm and the dimension of one side of the terminal electrode 12 is 0.1 to 0.6 mm, it is preferable that the offset between the center point C1 of the mounting surface 11 of the electronic component 1 and the center point C2 of the terminal forming region A is 0.03 to 0.25 mm.

[0089] Therefore, when the solder paste 23 is melted by heating, as Figure 5 As shown in (a), the solder paste 23 connecting the pad pattern 22 and the terminal electrode 12 is stretched in the offset direction, increasing its surface area. After cooling, as... Figure 5 (b) shows that the electronic component 1 is self-aligned with the terminal electrode 12 positioned directly above each pad pattern 22. In the self-aligned state, although it is not necessary for the pad pattern 22 to completely overlap with its corresponding terminal electrode 12, the overlap between the pad pattern 22 and its corresponding terminal electrode 12 is at least increased before the solder paste 23 melts.

[0090] Thus, in this embodiment, the electronic component 1, because the center point C2 of the terminal forming region A is offset relative to the center point C1 of the mounting surface 11, will, immediately after being mounted on the mounting substrate 20 and heated, exhibit the following characteristics: Figure 5 As shown in (a), the surface area of ​​the solder paste 23 increases. As a result, voids generated inside the solder paste 23 are easily released to the outside. Furthermore, when the solder paste 23 melts, the electronic component 1 self-aligns, and the solder paste 23 flows accordingly, and voids are easily released to the outside during the flow of the solder paste 23.

[0091] As explained above, according to the electronic component 1 of this embodiment, even when using lead-free solder with low flowability, the voids inside the solder are easily released to the outside. Furthermore, since there is no need to make design changes to the mounting substrate 20, it can function effectively even when mounted on an existing mounting substrate 20.

[0092] <Second Implementation>

[0093] Figure 6 This is a general cross-sectional view of the electronic component 2 according to the second embodiment of the present invention. Furthermore, Figure 7 This is a general top view of electronic component 2 viewed from the mounting side.

[0094] like Figure 6 and Figure 7 As shown, the electronic component 2 of the second embodiment has a plurality of chip components 41, 42 mounted on the upper surface 13 of the chip body portion 10, and the chip body portion 10 is covered by the molding member 30, which differs from the electronic component 1 of the first embodiment. The upper surface 13 is a surface located on the opposite side of the mounting surface 11 and is parallel to the mounting surface 11. Since the other basic structures are the same as those of the electronic component 1 of the first embodiment, the same reference numerals are used for the same elements, and repeated descriptions are omitted.

[0095] Chip components 41 and 42, mounted on the upper surface 13 of the chip body 10, are connected to their respective terminal electrodes 15 via conductive materials such as solder. There is no particular limitation on the type of chip component; for example, chip component 41 is a filter circuit or a semiconductor IC, and chip component 42 is a passive component such as a capacitor or inductor.

[0096] The molding member 30 covers not only the upper surface 13 of the chip body 10, but also the side surfaces 14a to 14d that are perpendicular to the mounting surface 11 and the upper surface 13. The side surfaces 14a to 14d do not need to be strictly perpendicular to the mounting surface 11 and the upper surface 13; they only need to be substantially perpendicular. Side surfaces 14a and 14b extend in the y-direction, and side surfaces 14c and 14d extend in the x-direction. Thus, the mounting surface 11 of the electronic component 2 comprises a chip surface S1 formed by the chip body 10 and a molding surface S2 formed by the molding member 30 covering the periphery of the chip body 10. The chip surface S1 and the molding surface S2 may also form the same plane.

[0097] The thickness of the molded components 30 covering the sides 14a-14d of the chip body 10 is not uniform, such as... Figure 6 As shown, the thickness T2 of the molded member 30 covering side 14b is thicker than the thickness T1 of the molded member 30 covering side 14a. Therefore, when the widths of the molded surfaces S2 located on sides 14a and 14b are set to M1 and M2 respectively, the results are:

[0098] M1 < M2.

[0099] Similarly, the molded component 30 covering sides 14c and 14d, with the widths of the molded surfaces S2 located on sides 14c and 14d set to M3 and M4 respectively, are as follows:

[0100] M3 < M4.

[0101] Therefore, even if the terminal forming region A is not offset relative to the chip surface S1 of the chip body 10, the center point C4 of the terminal forming region A can be offset relative to the center point C3 of the mounting surface 11 of the electronic component 2 including the molding member 30.

[0102] Figure 6 and Figure 7 The electronic component 2 shown has a structure in which chip components 41 and 42 are mounted on the chip body 10, but chip components 41 and 42 may not be mounted on the chip body 10. Alternatively, as... Figure 8 As with the electronic component 2a in the modified example shown, it can also be a structure in which multiple chip components 43, 44 are molded together by the molding member 30, and the terminal electrodes 12 of the chip components 43, 44 are exposed. In this case, the same effect as the electronic component 2 of the second embodiment can be obtained.

[0103] <Third Implementation>

[0104] Figure 9 This is a general top view of the electronic component 3 of the third embodiment of the present invention, viewed from the mounting side.

[0105] like Figure 9 As shown, the electronic component 3 of the third embodiment differs from the electronic component 1 of the first embodiment in that each edge Aa to Ad of the terminal forming region A has a predetermined inclination relative to each edge of the mounting surface 11 formed by the side surfaces 14a to 14d. For other basic structures, since they are the same as those of the electronic component 1 of the first embodiment, the same reference numerals are used for the same elements, and repeated descriptions are omitted.

[0106] The inclination θ of each edge Aa to Ad of the terminal forming region A is preferably between 0.5° and 7°, without departing from the spirit of the invention. Thus, since the edges Aa to Ad have an inclination θ, the distance W5 between the edges Aa to Ad and the sides 14a to 14d varies along the sides 14a to 14d. In this embodiment, the center point of the mounting surface 11 and the center point of the terminal forming region A are both C5. However, the center point of the mounting surface 11 and the center point of the terminal forming region A do not necessarily need to be the same.

[0107] Figure 10 This is a schematic perspective top view used to illustrate the state in which the electronic component 3 is mounted in the mounting area 1a of the mounting substrate 20. The structure of the mounting substrate 20 is as follows: Figure 3 As shown, the center point of the mounting area 1a and the multiple pad patterns 22 is C0. However, the center points of the mounting area 1a and the multiple pad patterns 22 do not necessarily have to be the same.

[0108] like Figure 10 As shown, when mounting electronic component 3 on mounting area 1a, after solder paste is supplied to the pad pattern 22, the pick-and-place machine picks up electronic component 3 and mounts it on mounting area 1a in a manner that the center points C0 and C5 are aligned and the shape of electronic component 3 is aligned with the shape of mounting area 1a. As a result, a rotational misalignment equivalent to angle θ occurs between the planar positions of each pad pattern 22 on the mounting substrate 20 and the corresponding terminal electrode 12 of the electronic component 3. Therefore, if using... Figure 5 As illustrated in (a) and (b), the surface area of ​​solder paste 23 increases, and the voids within solder paste 23 are easily released to the outside through the flow of solder paste 23 during self-alignment.

[0109] Here, the inclination θ of edges Aa to Ad does not need to be the same for each edge; it can be different for each edge. Furthermore, it is not necessary for all edges Aa to Ad to have a predetermined inclination relative to each edge of the mounting surface 11; only a portion of edges Aa to Ad may have a predetermined inclination relative to their corresponding edges of the mounting surface 11. For example, it could be as follows: Figure 19As shown in (a), the edges of edge Ab and side 14b have a prescribed inclination, but the other edges Aa, Ac, and Ad are parallel to the edges of the corresponding sides 14a, 14c, and 14d. Thus, it is also possible for only one edge to have an inclination. Furthermore, as... Figure 19 As shown in (b) and (c), edges Aa, Ab and sides 14a, 14b may have a prescribed inclination, but other edges Ac, Ad are parallel to the edges of the corresponding sides 14c, 14d. Furthermore, as mentioned above, only two edges may be inclined. And, as... Figure 19 As shown in (d) to (f), edges Aa, Ab, Ad and sides 14a, 14b, 14d may have a prescribed inclination, but the remaining edge Ac is parallel to the edge of the corresponding side 14c. Alternatively, as mentioned above, only three edges may have an inclination.

[0110] <The 4th Implementation>

[0111] Figure 11 This is a general top view of the electronic component 4 of the fourth embodiment of the present invention, viewed from the mounting side.

[0112] like Figure 11 As shown, the electronic component 4 of the fourth embodiment differs from the electronic component 3 of the third embodiment in that the sides 14a to 14d of the chip body 10 are covered by the molding member 30, similar to the electronic component 2 of the second embodiment. For other basic structures, since they are the same as the electronic component 3 of the third embodiment, the same reference numerals are used for the same elements, and repeated descriptions are omitted.

[0113] The mounting surface 11 of the electronic component 4 includes a chip surface S1 formed by the chip body portion 10 and a molding surface S2 formed by molding members 30 covering the periphery of the chip body portion 10. Furthermore, the width M5 of the molding surface S2 varies along the side surfaces 14a to 14d. In this embodiment, the center point of the mounting surface 11 and the center point of the terminal forming region A are both C5.

[0114] Therefore, even if the terminal forming region A does not have a rotational misalignment with the mounting surface 11 of the chip body 10, the terminal forming region A can be rotated at any angle relative to the mounting surface 11 of the electronic component 4 including the molding member 30.

[0115] <Manufacturing Methods for Electronic Components>

[0116] Figure 12 This is a schematic top view used to explain the manufacturing method of the electronic component 1 according to the first embodiment.

[0117] Figure 12The assembly substrate 5a shown is a substrate for obtaining multiple electronic components 1. Cutting regions 6x and 6y are defined, avoiding the region 10a where internal circuits are formed. Cutting region 6x extends in the x-direction, and cutting region 6y extends in the y-direction. Furthermore, when cutting the assembly substrate 5a, instead of cutting the center of cutting regions 6x and 6y, it is cut along cutting lines 7x and 7y offset from the center, thereby obtaining multiple electronic components 1 with offset terminal forming regions A.

[0118] Figure 13 This is a schematic top view used to explain the manufacturing method of the electronic component 3 in the third embodiment.

[0119] At once Figure 13 In the case of the assembly substrate 5b shown, the region 10a in which the internal circuit is formed is inclined relative to the cutting lines 7x and 7y. Therefore, if the assembly substrate 5b is cut along the cutting line 7x extending in the x direction and the cutting line 7y extending in the y direction, it is possible to obtain an electronic component 3 with multiple terminal forming regions A rotated and misaligned.

[0120] Figures 14-16 This is a process diagram used to explain the manufacturing method of the electronic component 2 in the second embodiment.

[0121] First, such as Figure 14 As shown, multiple chip body portions 10, each equipped with chip components 41 and 42, are prepared, and the mounting surface 11 of the chip body portion 10 is attached to the support body 50. Figure 14 In the example shown, the support 50 is composed of a heat-resistant sheet 51 and a heat-resistant double-sided tape 52, and the mounting surface 11 of the chip body 10 is attached to the heat-resistant double-sided tape 52.

[0122] Next, as Figure 15 As shown, molding members 30 are supplied in a manner that covers multiple chip body portions 10. Methods for supplying the molding members 30 include dispensing, printing, transfer molding, and compression molding. Thus, chip components 41 and 42 mounted on the upper surface 13 of the chip body portion 10 are embedded in the molding members 30, and the molding members 30 fill the spaces between adjacent chip body portions 10.

[0123] Then, as Figure 16 As shown, after removing the support 50, the molded component 30 is cut to create a single piece. At this time, by offsetting the cutting line 7 relative to the chip body 10, it is possible to obtain an electronic component 3 with multiple terminal forming regions A offset. Alternatively, as... Figure 17As shown, when multiple chip body portions 10 are attached to the support 50, they can be pre-offset relative to the cutting line 7, or the planar position of the chip body portions 10 on the support 50 can be offset by the flow of the molding member 30.

[0124] Furthermore, such as Figure 18 As shown, the electronic component 4 of the fourth embodiment can be manufactured by attaching the chip body 10 to the support 50 in a manner with a predetermined inclination relative to the cutting line 7.

[0125] Thus, in the second and fourth embodiments, the electronic components 2 and 4 do not require the chip body 10 itself to have offset or rotational misalignment, thereby suppressing the increase in manufacturing costs and allowing for arbitrary adjustment of the offset and rotational misalignment.

[0126] The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the embodiments described above, and various changes can be made within the scope of the spirit of the present invention, which are of course also included in the scope of the present invention.

Claims

1. An electronic component, characterized in that, have: The chip body has a mounting surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. The mounting surface extends along a first direction and a second direction perpendicular to the first direction. The first side surface extends along the first direction and a third direction perpendicular to both the first and second directions. The second side surface extends along the first direction and the third direction and is located on the opposite side of the first side surface. The third side surface extends along the second direction and the third direction. The fourth side surface extends along the second direction and the third direction and is located on the opposite side of the third side surface. Multiple terminal electrodes are arranged in an array on the mounting surface of the chip body. as well as A molded component comprising: a first portion covering the first side surface without covering the mounting surface; a second portion covering the second side surface without covering the mounting surface; a third portion covering the third side surface without covering the mounting surface; and a fourth portion covering the fourth side surface without covering the mounting surface. The width of the first portion of the molded member in the second direction is smaller than the width of the second portion of the molded member in the second direction.

2. The electronic component according to claim 1, characterized in that, The width of the third portion of the molded member in the first direction is smaller than the width of the fourth portion of the molded member in the first direction.

3. The electronic component according to claim 1, characterized in that, The mounting surface of the chip body and the bottom surface of the molded component form the same plane.

4. A method for manufacturing an electronic component, characterized in that, have: In the first step of fabricating the chip body, the chip body has a mounting surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. The mounting surface has a plurality of terminal electrodes formed thereon and extends along a first direction and a second direction perpendicular to the first direction. The first side surface extends along the first direction and a third direction perpendicular to the first and second directions. The second side surface extends along the first direction and the third direction and is located on the opposite side of the first side surface. The third side surface extends along the second direction and the third direction. The fourth side surface extends along the second direction and the third direction and is located on the opposite side of the third side surface. and In the second step, the first side to the fourth side are covered by a molded component without covering the mounting surface. In the second step, the thickness of the molded member covering the second side in the second direction is made greater than the thickness of the molded member covering the first side in the second direction.

5. The method for manufacturing an electronic component according to claim 4, characterized in that, In the second step, the thickness of the molded member covering the fourth side in the first direction is made greater than the thickness of the molded member covering the third side in the first direction.

6. A method for manufacturing a mounting substrate, characterized in that, have: The first step is to prepare a mounting substrate with mounting areas having multiple pad patterns. In the second step, after supplying solder paste to the plurality of pad patterns, the electronic component according to any one of claims 1 to 3 is mounted on the mounting area; and The third step involves melting the solder paste by heating. In the second step, the electronic component is mounted in such a way that regions overlapping and non-overlapping with the corresponding terminal electrodes are generated in the plurality of pad patterns.

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