Heat dissipation system for portable electronic device

Abstract

A heat dissipation system for a portable electronic device is disclosed. The heat dissipation system includes a first processing element, a second processing element, a heat dissipation module, a first thermal transfer member, and a second thermal transfer member. The first processing element has a region one and a region two. The heat dissipation module is positioned between the first processing element and the second processing element. The first thermal transfer member thermally contacts the region one, the second processing element, and the heat dissipation module. The second thermal transfer member thermally contacts the region two and the heat dissipation module.

Description

Technical Field

[0001] This invention relates to a heat dissipation system, and more particularly to a heat dissipation system for a portable electronic device. Background Technology

[0002] Generally speaking, in order to prevent the electronic components inside portable electronic devices from experiencing temporary or permanent failures due to overheating, fans are usually installed on electronic components that are prone to overheating, such as the power supply, central processing unit (CPU), and graphics processing unit (GPU) of the computer host, to dissipate heat from the electronic components and quickly remove the heat generated by the electronic components when operating at high speed, thereby reducing the temperature of the electronic components themselves.

[0003] However, with the current trend of portable electronic devices moving towards thinner and lighter designs, the internal space of the casing is constantly shrinking, which leads to electronic components having to be arranged quite tightly. At the same time, the fans used for heat dissipation are also limited by the internal space of the casing, thus limiting their heat dissipation capacity and making the heat dissipation problem increasingly serious. Summary of the Invention

[0004] The purpose of this invention is to provide a heat dissipation system for portable electronic devices, which provides a corresponding configuration between heat pipes, heat sources, and heat dissipation modules to achieve the effects of heat diversion and buffering.

[0005] The portable electronic device heat dissipation system of the present invention includes a first processing element, a second processing element, a heat dissipation module, a first heat transfer element, and a second heat transfer element. The first processing element has a region 1 and a region 2. The heat dissipation module is located between the first processing element and the second processing element. The first heat transfer element has thermal contact with region 1, the second processing element, and the heat dissipation module. The second heat transfer element has thermal contact with region 2 and the heat dissipation module. When the first processing element is in load mode 1, it generates heat from region 1. When the first processing element is in load mode 2, it generates heat from both region 1 and region 2. The heat generated by the first processing element in load mode 1 is less than the heat generated in load mode 2. When the first processing element is in load mode 1 and the second processing element is not activated, the heat generated from region 1 is transferred to the heat dissipation module and the second processing element via the first heat transfer element. When the first processing element is in load mode 2 and the second processing element is not activated, the heat generated from region 1 is transferred to the heat dissipation module and the second processing element via the first heat transfer element, and the heat generated from region 2 is transferred to the heat dissipation module via the second heat transfer element.

[0006] Based on the above, the heat dissipation system of the portable electronic device makes thermal contact between a first heat transfer element and regions one of the first processing element, the second processing element, and the heat dissipation module, and between a second heat transfer element and regions two of the heat dissipation module. This arrangement, using specific configurations of the first and second heat transfer elements, allows the second processing element to store heat from the first processing element when not in use. For the first processing element, this undoubtedly provides additional heat dissipation and storage areas, while also reducing the burden on the heat dissipation module and delaying the rapid rise in internal temperature of the portable electronic device, thereby improving heat dissipation capacity. Attached Figure Description

[0007] Figure 1 This is a schematic diagram of a heat dissipation system for a portable electronic device according to an embodiment of the present invention.

[0008] Figure 2 This is a schematic diagram of a heat dissipation system for a portable electronic device according to another embodiment of the present invention.

[0009] The attached figures are labeled as follows:

[0010] 100: Heat dissipation system for portable electronic devices

[0011] 110: First processing element

[0012] 111, 121: Chips

[0013] 111a: Area 1

[0014] 111b: Area Two

[0015] 112a: Region Three

[0016] 112, 122: Ontology

[0017] 120: Second processing element

[0018] 123a: Area Four

[0019] 123b: Area Five

[0020] 130: Heat dissipation module

[0021] 131: Fan

[0022] 131a: Opening

[0023] 132: Fins

[0024] MB: Circuit Board

[0025] P1: First heat transfer component

[0026] P2: Second heat transfer component

[0027] P3: Third heat transfer component

[0028] P4: Fourth heat transfer component Detailed Implementation

[0029] Figure 1 This is a schematic diagram of a heat dissipation system for a portable electronic device according to an embodiment of the present invention. Only a portion of the portable electronic device is shown here as an example. Please refer to... Figure 1 In this embodiment, the heat dissipation system 100 of the portable electronic device includes a first processing element 110, a second processing element 120, a heat dissipation module 130, a first heat transfer element P1, and a second heat transfer element P2. The first processing element 110 has a region 111a and a region 111b. The heat dissipation module 130 is located between the first processing element 110 and the second processing element 120. The first heat transfer element P1 has thermal contact with region 111a, the second processing element 120, and the heat dissipation module 130. The second heat transfer element P2 has thermal contact with region 111b and the heat dissipation module 130, but does not have thermal contact with the second processing element 120. The first processing element 110 and the second processing element 120 are disposed on the circuit board MB of the portable electronic device. The heat dissipation module 130 includes a fan 131 and fins 132. The heat generated by the first processing element 110 and the second processing element 120 can be transferred to the heat dissipation module 130 and further dissipated upwards in the figure, as shown by the arrows. Furthermore, the heat transfer components described in this case, such as the aforementioned first heat transfer component P1, second heat transfer component P2, and those mentioned subsequently, are composed of at least one heat pipe for heat transfer, and there is no limitation on the form or number of heat pipes. It should also be noted that this embodiment does not limit the type and number of fins 132 and fans 131 in the heat dissipation module 130, which can be appropriately adjusted according to the total amount of heat generated by the portable electronic device. For example, the heat dissipation module 130 in this embodiment is composed of two fans 131, and there is an opening 131a between the two fans 131 to facilitate airflow communication or convergence. In another embodiment not shown, a single fan with a larger flow rate and volume can also be provided.

[0030] In short, the component layout of this embodiment is based on the following premises: the heat dissipation capacity of the heat dissipation module 130 is greater than the maximum heat generated by the first processing element 110, the heat dissipation capacity of the heat dissipation module 130 is greater than the maximum heat generated by the second processing element 120, and the heat dissipation capacity of the heat dissipation module 130 is less than the sum of the maximum heat generated by the first processing element 110 and the maximum heat generated by the second processing element 120. Furthermore, in the actual operation of a portable electronic device, the first processing element 110 and the second processing element 120 will not be under heavy load simultaneously. Therefore, under the above premises, the component layout of this invention can achieve the effect of heat diversion. For example, the maximum power output of the first processing element 110 is 35W, the maximum power output of the second processing element 120 is 35W, and the heat dissipation module 130 has a heat dissipation capacity of 50W. Therefore, the components need to be arranged as in this embodiment so that the heat transfer elements (e.g., the first heat transfer element P1 and the second heat transfer element P2), the heat source (the first processing element 110 and the second processing element 120) and the heat dissipation module 130 maintain a specific correspondence, so that the three components with the aforementioned unequal capabilities can be properly combined and the heat dissipation module 130 can still dissipate heat smoothly.

[0031] Furthermore, in this embodiment, when the first processing element 110 is in load mode one, the first processing element 110 generates heat only from region one 111a. When the first processing element 110 is in load mode two, the first processing element 110 generates heat from both region one 111a and region two 111b. The heat generated by the first processing element 110 in load mode one is less than the heat generated in load mode two. When the first processing element 110 is in load mode one and the second processing element 120 is not activated, the heat generated from region one 111a is transferred to the heat dissipation module 130 and the second processing element 120 through the first heat transfer element P1. When the first processing element 110 is in load mode two and the second processing element 120 is not activated, the heat generated from region one 111a is transferred to the heat dissipation module 130 and the second processing element 120 through the first heat transfer element P1, and the heat generated from region two 111b is transferred to the heat dissipation module 130 through the second heat transfer element P2.

[0032] like Figure 1As shown, the first processing element 110 in this embodiment includes a chip (die) 111 and a body 112 (including a packaging structure and a thermally conductive shell) that encapsulates and covers the chip 111. Here, the first processing element 110 is a central processing unit (CPU) with multiple cores, with at least one core corresponding to each of region 111a and region 111b of the chip 111. Taking a dual-core CPU as an example, it has a first core (e.g., core 0) and a second core (e.g., core 1), where the first core is the core 0. Figure 1 The area shown is 111a, and the second core is the corresponding... Figure 1 The area shown is 111b. Generally, when a computer system performs text processing or similar low-level functions, the central processing unit (CPU) only needs to engage the first core in the work. However, when the computer system needs to perform multiplexing or similar high-level functions, the CPU will engage both the first and second cores simultaneously.

[0033] In this embodiment, the second processing element 120 is a graphics processing unit (GPU), which allows the first processing element 110 to switch the second processing element 120 on or off via control means, such as NVIDIA's Optimus technology, to achieve energy saving. Generally, when the computer system is turned on, the first processing element 110 (CPU) is usually always active, while the second processing element 120 (GPU) can be turned on or off as needed. Therefore, there is no state where the second processing element 120 is on but the first processing element 110 is off.

[0034] As mentioned above, when performing low-level functions, it is equivalent to the first processing element 110 generating heat only from region 111a. Therefore, it correspondingly activates the first heat transfer element P1 to transfer heat to the heat dissipation module 130 and the second processing element 120. If the second processing element 120 is in an inactive state, it can successfully absorb some of the heat transferred from the first processing element 110. The inactive state of the second processing element 120 is achieved, for example, by the aforementioned technology. In other words, the inactive second processing element 120 can be regarded as a heat diversion and storage object of the first processing element 110, providing an additional area for heat storage, thereby enhancing the heat dissipation effect of the heat dissipation module 130.

[0035] Please refer to this again. Figure 1In this embodiment, the heat dissipation system 100 of the portable electronic device further includes a third heat transfer element P3, which thermally contacts region 112a of the first processing element 110, the heat dissipation module 130, and the second processing element 120. Compared with the aforementioned first heat transfer element P1 and second heat transfer element P2, the third heat transfer element P3 does not directly contact the heat-generating area of ​​the first processing element 110. That is, regions 111a and 111b correspond to the chip 111 of the first processing element 110, while region 112a corresponds to the chipless area of ​​the first processing element 110, which is equivalent to region 112a corresponding to the coreless area of ​​the central processing unit (first processing element 110). Therefore, as Figure 1 As shown, the first heat transfer element P1 and the third heat transfer element P3 are essentially located on opposite sides of the second heat transfer element P2, equivalent to region 2 111b being located between region 1 111a and region 3 112a. On the other side, the third heat transfer element P3 corresponds to the chipless location of the second processing element 120, which is also relative to the first heat transfer element P1, which corresponds to the chip 121 location of the second processing element 120. Here, the corresponding location of the first heat transfer element P1 can be regarded as region 4 123a, and the chipless location (the corresponding location of the third heat transfer element P3) can be regarded as region 5 123b, where region 4 123a is adjacent to region 5 123b.

[0036] Based on the above, through the relative configuration of the first heat transfer element P1, the second heat transfer element P2 and the third heat transfer element P3, each of them has a specific positional relationship with the first processing element 110 and the second processing element 120, thereby enabling the heat dissipation system of this embodiment to have the effect of heat diversion, wherein the first processing element 110 has been described above in load mode one and load mode two. Next, when the first processing element 110 generates even more heat during operation and enters load mode three, the heat generated in regions 111a and 111b has already spread throughout the entire structure of the first processing element 110. Due to the aforementioned configuration of the third heat transfer element P3, the first processing element 110 gains an additional heat transfer path, namely, heat transferred to the heat dissipation module 130 and the second processing element 120 via the third heat transfer element P3. At this point, the heat from the third heat transfer element P3, besides being dissipated in the heat dissipation module 130, is primarily transferred to the second processing element 120, thus achieving a temperature uniformity between the first processing element 110 and the second processing element 120. This effectively provides an additional cooling path for the first processing element 110. Here, the heat generated by the first processing element 110 in load mode three is greater than the heat generated by the first processing element 110 in load mode two, and also greater than the sum of the heat transfer capabilities of the first heat transfer element P1 and the second heat transfer element P2.

[0037] The above describes the heat transfer characteristics of the heat dissipation system of this embodiment for the first processing element 110 under different load modes. The boundary between load mode one and load mode two is 40% of the power generated by the first processing element 110 relative to the maximum power of the first processing element 110.

[0038] On the other hand, regarding the second processing element 120, when it is in load mode five, that is, when the power of the second processing element 120 is 0 to 15% of its maximum power, given that the first processing element 110 is in a constant operating state and the temperature and power of the first processing element 110 are usually lower than those of the second processing element 120, the heat generated by the second processing element 120 can be transferred to the heat dissipation module 130 and the first processing element 110 through the first heat transfer element P1. However, at this time, for the first heat transfer element P1, the heat transfer directions at its two ends are opposite. Therefore, in addition to the difficulty in generating heat transfer, it is also easy to accumulate heat quickly, causing the second processing element 120 to switch to load mode four (that is, the power of the second processing element 120 reaches more than 15% of its maximum power). At this time, the heat generated by the second processing element 120 is transferred to the heat dissipation module 130 via the first heat transfer element P1. The heat generated by the chip 121 is also transferred to the body 122 of the second processing element 120 (the body 122 encapsulates and covers the chip 121). Therefore, the third heat transfer element P3 can be further activated to transfer the heat to the first processing element 110 via the third heat transfer element P3, and then to the heat dissipation module 130 via the second heat transfer element P2.

[0039] Here, the heat generated by the second processing element 120 in load mode 5 is less than the heat generated in load mode 4. The heat generated by the second processing element 120 in load mode 5 is transferred to the heat dissipation module 130 and the first processing element 110 only through the first heat transfer element P1. Due to the presence of the second heat transfer element P2, the heat generated by the second processing element 120 in load mode 4 is further transferred to the heat dissipation module 130 through the second heat transfer element P2 after being transferred to the first processing element 110 through the first heat transfer element P1 and the third heat transfer element P3, so as to avoid the accumulation of heat at the first processing element 110 and the resulting rapid increase in temperature.

[0040] Figure 2 This is a schematic diagram of a heat dissipation system for a portable electronic device according to another embodiment of the present invention. Please refer to... Figure 2This embodiment can be considered a partial modification of the aforementioned embodiment, namely, the addition of a fourth heat transfer element P4 to the heat dissipation system, which makes thermal contact with the second processing element 120 and the heat dissipation module 130. More specifically, the opposite ends of the fourth heat transfer element P4 correspond to the chipless portion of the second processing element 120 and the fins 132, respectively. Here, the fourth heat transfer element P4 is used to transfer heat from the second processing element 120 to the heat dissipation module 130. The heat at the second processing element 120 can be generated by itself or transferred from the first processing element 110 through the first heat transfer element P1; the source of heat at the second processing element 120 is not limited here.

[0041] In summary, in the above embodiments of the present invention, the heat dissipation system of the portable electronic device makes thermal contact between the first heat transfer element and region one of the first processing element, the second processing element and the heat dissipation module, and makes thermal contact between the second heat transfer element and region two of the heat dissipation module, so that the first processing element, the second processing element and the heat dissipation module are configured with specific means of the first heat transfer element and the second heat transfer element, so that the first processing element and the second processing element can be each other's temporary heat storage area, and by providing an additional heat storage area, the first processing element or the second processing element does not accumulate heat.

[0042] For example, when the second processing element is not activated, it can be used to store heat from the first processing element. For the first processing element, this undoubtedly provides an additional heat diversion and storage area, while also reducing the burden on the heat dissipation module and delaying the rapid rise in internal temperature of the portable electronic device, thereby improving heat dissipation capacity. At the same time, due to the presence of the third heat transfer element, if there is too much heat at the second processing element, it can be further transferred to the first processing element through the third heat transfer element, and then transferred to the heat dissipation module through the second heat transfer element.

[0043] In this way, the aforementioned heat transfer path effectively prevents heat from lingering and accumulating in specific locations, thus avoiding a rapid increase in the temperature of electronic components. Furthermore, the aforementioned component configuration and layout are sufficient to allow heat dissipation modules with lower heat dissipation capabilities to effectively cool processing components that generate more heat.

Claims

1. A heat dissipation system for a portable electronic device, comprising: The first processing element has region one and region two; Second processing element; A heat dissipation module is located between the first processing element and the second processing element; The first heat transfer element is in thermal contact with the area 1, the second processing element and the heat dissipation module; as well as The second heat transfer element is in thermal contact with the heat dissipation module in the second area. In load mode one, the first processing element generates heat from region one. In load mode two, the first processing element generates heat from both region one and region two. The heat generated by the first processing element in load mode one is less than the heat generated in load mode two. When the first processing element is in load mode one and the second processing element is not activated, the heat generated in region one is transferred through the first heat transfer element to the heat dissipation module and the second processing element. When the first processing element is in load mode two and the second processing element is not activated, the heat generated in region one is transferred to the heat dissipation module and the second processing element through the first heat transfer element, and the heat generated in region two is transferred to the heat dissipation module through the second heat transfer element. Wherein, the heat dissipation capacity of the heat dissipation module is greater than the maximum heat that the first processing element can generate, the heat dissipation capacity of the heat dissipation module is greater than the maximum heat that the second processing element can generate, and the heat dissipation capacity of the heat dissipation module is less than the sum of the maximum heat that the first processing element can generate and the maximum heat that the second processing element can generate; and the first processing element and the second processing element will not be under heavy load at the same time in actual operation.

2. The heat dissipation system of the portable electronic device as claimed in claim 1 further includes a third heat transfer element, a third region that is in thermal contact with the first processing element, the heat dissipation module and the second processing element, the first region and the second region corresponding to the chip of the first processing element, and the third region corresponding to the chipless region of the first processing element.

3. The heat dissipation system of the portable electronic device as claimed in claim 2, wherein the first processing element is a central processing unit with multiple cores, the first region and the second region each correspond to at least one core, and the third region corresponds to a coreless area of ​​the central processing unit.

4. The heat dissipation system for a portable electronic device as claimed in claim 2, wherein the second region is located between the first region and the third region, and the second heat transfer element is located between the first heat transfer element and the third heat transfer element.

5. The heat dissipation system for a portable electronic device as claimed in claim 2, wherein the first heat transfer element is in thermal contact with region four of the second processing element, the third heat transfer element is in thermal contact with region five of the second processing element, region four corresponds to the chip area of ​​the second processing element, and region five corresponds to the chipless area of ​​the second processing element.

6. The heat dissipation system for the portable electronic device as claimed in claim 5, wherein region four is adjacent to region five.

7. The heat dissipation system for a portable electronic device as claimed in claim 2, wherein the heat generated by the first processing element in load mode 3 is greater than the heat generated by the first processing element in load mode 2, and greater than the sum of the heat transfer capabilities of the first heat transfer element and the second heat transfer element, and the heat generated by the first processing element in load mode 3 is transferred to the second processing element via the first heat transfer element and the third heat transfer element, and is transferred to the heat dissipation module via the second heat transfer element.

8. The heat dissipation system of the portable electronic device as claimed in claim 2, wherein, in load mode four, the heat generated by the second processing element is transferred to the heat dissipation module via the first heat transfer element, and also transferred to the first processing element via the third heat transfer element, and then transferred to the heat dissipation module via the second heat transfer element.

9. The heat dissipation system for a portable electronic device as claimed in claim 8, wherein the heat generated by the second processing element in load mode five is less than the heat generated in load mode four, and the heat generated by the second processing element in load mode five is transferred to the heat dissipation module and the first processing element only through the first heat transfer element.

10. The heat dissipation system of the portable electronic device as claimed in claim 9, wherein the boundary between the load mode four and the load mode five is 15% of the power generated by the second processing element relative to the maximum power of the second processing element.

11. The heat dissipation system of the portable electronic device as claimed in claim 2, wherein the heat dissipation module is located between the first processing element and the second processing element in the heat transfer path of the third heat transfer element.

12. The heat dissipation system of the portable electronic device as claimed in claim 1, wherein the second processing element is a graphics processor.

13. The heat dissipation system of the portable electronic device as claimed in claim 1, wherein the boundary between the first load mode and the second load mode is 40% of the power generated by the first processing element relative to the maximum power of the first processing element.

14. The heat dissipation system of the portable electronic device as claimed in claim 1, wherein the heat dissipation module is located between the first processing element and the second processing element in the heat transfer path of the first heat transfer element.

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