Antenna device

Abstract

The antenna is disposed on the substrate (21) as part of a conductor (22). The antenna includes a main board (31) that provides a ground potential; and a patch portion (32) disposed facing the main board in the Z direction. The substrate has a non-disposing area (25) in which no conductor is disposed, which is the area between the outer periphery (24) and the main board in the plan view. The metal support portion (412) of the housing (41) contacts the non-disposing area on the bottom surface (20b) of the substrate.

Description

Technical Field

[0001] This disclosure generally relates to an antenna device. Background Technology

[0002] Patent Document 1 (Japanese Unexamined Patent Publication No. 2014-107746) discloses a comparative example of an antenna device in which an antenna including a patch portion and a main board is formed on a substrate. The disclosure of Patent Document 1 is incorporated herein by reference as an explanation of the technical elements of this disclosure.

[0003] The substrate is formed, for example, by cutting a so-called mother substrate (i.e., a substrate used to obtain a large number of sheets). Conductors are formed on the mother substrate for each substrate. Since the conductors are patterned to not overlap with the cut portions, the substrate has a non-distribution area from its outer edge within a predetermined range or width where no conductors are arranged. When a non-distribution area exists on the outer side or outer edge of the motherboard on the substrate, radio waves radiated from the patch portion may leak through the non-distribution area to the underside of the motherboard, and antenna characteristics such as antenna gain and directivity may deteriorate. Therefore, the above and other aspects of the antenna device can be further enhanced or improved. Summary of the Invention

[0004] One object of this disclosure is to provide an antenna device capable of suppressing antenna characteristic degradation.

[0005] The antenna device disclosed herein includes: a substrate having an insulating base member and a conductor disposed on the insulating base member; an antenna having a main board (or ground plane) and a patch portion, the main board being disposed on the insulating base member as at least a portion of the conductor and providing a ground potential, the patch portion being arranged to face the main board in the thickness direction of the substrate; and a metal member disposed separately from the conductor, wherein: the substrate has a non-disposal area in which no conductor is disposed, the non-disposal area being a region extending from the outer periphery of the substrate to the main board in a plan view, and the metal member contacting the non-disposal area on one surface of the substrate in the thickness direction or on a back surface opposite to said one surface.

[0006] According to the disclosed antenna device, the substrate has a non-distribution area where the main board serves as the edge portion of the conductor. Then, a metal member contacts the non-distribution area on one surface or back surface of the substrate. The metal member reflects radio waves radiated from the patch portion. In this way, it is possible to prevent radio waves radiated from the patch portion from leaking beneath the main board through the non-distribution area located outside the main board. As a result, it is possible to suppress the degradation of antenna characteristics.

[0007] The aspects disclosed in this specification employ different technical solutions to achieve their respective purposes. The reference numerals enclosed in parentheses in the claims and this section exemplarily illustrate the correspondence with portions of the embodiments described later, and are not intended to limit the scope of the technology. The purposes, features, and advantages disclosed in this specification will become apparent from the following detailed description and accompanying drawings. Attached Figure Description

[0008] The purpose, features, and advantages of this disclosure will become more apparent from the following detailed description with reference to the accompanying drawings, in which:

[0009] Figure 1 This is a cross-sectional view showing the antenna device according to the first embodiment;

[0010] Figure 2 It is a plan view showing the positional relationship between the non-arranged area and the support;

[0011] Figure 3 This is a graph showing the radiation characteristics of a reference example;

[0012] Figure 4 This is a graph showing the radiation characteristics of a reference example;

[0013] Figure 5 This is a diagram showing the radiation characteristics of a zero-order resonant antenna according to a reference example;

[0014] Figure 6 It is a diagram showing the radiation characteristics;

[0015] Figure 7 It is a diagram showing the radiation characteristics;

[0016] Figure 8 It is a diagram showing the radiation characteristics;

[0017] Figure 9 This is a cross-sectional view of the antenna device shown in the reference example;

[0018] Figure 10 This is a cross-sectional view showing the function of the support component;

[0019] Figure 11 This is a cross-sectional view showing a variant example;

[0020] Figure 12 This is a side view showing another variation;

[0021] Figure 13 It is along Figure 12 A cross-sectional view taken from line XIII-XIII;

[0022] Figure 14 This is a plan view showing another variation;

[0023] Figure 15 This is an enlarged cross-sectional view of the periphery of the non-arrangement area in the antenna device of the second embodiment;

[0024] Figure 16 This is a cross-sectional view showing the antenna device of the third embodiment;

[0025] Figure 17 It is a plan view showing the positional relationship between the non-arrangement area and the guide section;

[0026] Figure 18 This is a cross-sectional view showing yet another variation;

[0027] Figure 19 This is an enlarged cross-sectional view of the periphery of the non-arrangement area in the antenna device according to the fourth embodiment;

[0028] Figure 20 It is a plan view showing the positional relationship between the non-arranged area and the support; and

[0029] Figure 21 This is a cross-sectional view showing the antenna device according to the fifth embodiment. Detailed Implementation

[0030] In the following description, several embodiments will be illustrated with reference to the accompanying drawings. In each embodiment, the same reference numerals are assigned to corresponding elements, thus redundant descriptions may be omitted. In each embodiment, while only a portion of the configuration is described, the other portions of that configuration may be applied to other embodiments. Furthermore, not only the combinations of configurations explicitly shown in the descriptions of the various embodiments, but also the configurations of multiple embodiments may be combined at least partially, even if they are not explicitly described in this way, provided that such combination does not present particular difficulty.

[0031] (First Embodiment)

[0032] The antenna device according to this embodiment transmits and / or receives radio waves at a predetermined operating frequency. The antenna device is configured to transmit and / or receive radio waves in a frequency band used, for example, in short-range wireless communication. The operating frequency of this embodiment is 2.44 GHz. The operating frequency can be suitably designed and may be other frequencies (e.g., 5 GHz).

[0033] <Basic Structure of Antenna Devices>

[0034] First, refer to Figure 1 and Figure 2 Explain the basic structure of the antenna device. Figure 1 This is a cross-sectional view showing the antenna device of this embodiment. Figure 2 This is a plan view of the substrate viewed from the back side (also known as the bottom side). Figure 2In order to show the positional relationship between the non-arranged area of ​​the substrate and the support portion of the housing, the support portion is also shown. Figure 2 For convenience, the illustration of the protective film on the substrate has been omitted.

[0035] like Figure 1 and Figure 2 As shown, the antenna device 10 includes a substrate 20, an antenna 30, and a housing 40. Hereinafter, the thickness direction of the substrate 20 is defined as the Z-direction, and a direction orthogonal to the Z-direction is defined as the X-direction. A direction orthogonal to both the Z and X directions is defined as the Y-direction. Unless otherwise stated, the shape observed in a plane (i.e., a plan view) from the Z-direction, that is, the shape along the XY plane defined by the X and Y directions, is called the planar shape. The plan view viewed from the Z-direction can be simply referred to as a plan view. Figure 1 In the cross-sectional diagram shown, standard semiconductor device terminology can be used: top, bottom, left, and right, such as... Figure 1 As shown. For example, the Z direction is vertical (up and down), and the positive Z direction is upward. The positive X direction is to the right.

[0036] The substrate 20 has a base member 21 and a conductor 22. The substrate 20 can be referred to as a printed circuit board or wiring board. The substrate 20 includes a top surface 20a and a bottom surface 20b, which is the surface opposite to the top surface 20a in the Z direction. The base member 21 contains a dielectric material, such as resin. A wavelength shortening effect of the dielectric can be expected using the base member 21. The base member 21 can be, for example, a material composed solely of resin, a combination of resin and glass cloth, nonwoven fabric, or a ceramic-containing material. The base member 21 can be configured to include only one layer of insulating layer containing the dielectric, or it can be configured by laminating multiple insulating layers. The base member 21 corresponds to an insulating base member.

[0037] Conductor 22 is disposed on base member 21. Conductor 22 is formed on a printed circuit board using common wiring techniques. Conductor 22 includes conductor patterns and via conductors. The conductor pattern may also be referred to as a conductor layer. The conductor pattern is disposed in multiple layers on or in base member 21. That is, substrate 20 is a multilayer substrate. Conductor patterns are formed by patterning metal foil, such as copper foil. Via conductors are formed by arranging conductors (e.g., electroplated metal) in through-holes (vias) formed in the insulating layer constituting base member 21.

[0038] The substrate 20 has a protective film 23 on each of its top surface 20a and bottom surface 20b. The protective film 23 may also be referred to as a resist. An example of the protective film 23 is a photoresist. In the conductors 22 arranged in the surface layer, the portions except for those electrically connected to the outside, such as pads, are covered by the protective film 23.

[0039] The substrate 20 may have a substantially rectangular shape in a plane. The substrate 20 has a periphery 24 that defines the outer contour of the substrate 20 in a plan view. The periphery 24 is a side surface of the substrate 20 connecting the top surface 20a and the bottom surface 20b. The substrate 20 has a first periphery 241 and a second periphery 242 opposite to the first periphery 241 in the X direction as periphery 24. The first periphery edge 241 and the second periphery edge 242 are part of the periphery 24 and may be referred to as edge portions of the substrate 20. The substrate 20 has a non-arrangement area 25 between the first periphery edge 241 and the main board 31. The non-arrangement area 25 will be described later.

[0040] Antenna 30 has a main board 31, a patch portion 32, and a short-circuit portion 33. Each element constituting antenna 30 is arranged on base member 21 as part of conductor 22. Antenna 30 can be configured by using a portion of conductor 22. That is, antenna 30 is formed on substrate 20. Substrate 20 may include only the antenna 30 component as conductor 22, or it may further include circuit elements other than the antenna 30 component.

[0041] The motherboard 31 provides the ground potential for the antenna 30. The motherboard 31 is a conductor made of copper or the like. The direction perpendicular to the surface of the motherboard 31 is approximately parallel to the Z-direction. In the plan view, the area of ​​the motherboard 31 is larger than the area of ​​the patch portion 32. The motherboard 31 has dimensions that encompass / enclose the entire patch portion 32. The motherboard 31 preferably has the dimensions necessary for the stable operation of the antenna 30. The motherboard 31 is connected to a power supply circuit (not shown) to provide the ground potential.

[0042] The motherboard 31 of this embodiment has a generally rectangular planar shape with the X direction as the longitudinal direction and the Y direction as the transverse direction. The length of each side of the motherboard 31 is, for example, one or more wavelengths of a radio wave at the operating frequency, i.e., at least one wavelength or more wavelengths. The motherboard 31 is disposed on the bottom surface 20b of the substrate 20. The motherboard 31 is formed by patterning a metal foil, such as copper foil, disposed on the surface of the base member 21. The motherboard 31 is at least a portion of a conductor pattern on a surface layer disposed on the bottom surface 20b side of the substrate 20. The motherboard 31 is covered by a protective film 23.

[0043] The planar shape of the motherboard 31 can be appropriately varied. In this embodiment, as an example, the planar shape of the motherboard 31 is rectangular, but as another example, it can also be square or polygonal. It can also be circular. The circle can be a perfect circle or an ellipse. The motherboard 31 is preferably formed with a diameter larger than a circle of one wavelength. The motherboard 31 is not limited to a surface layer configuration on the bottom surface 20b side of the substrate. For example, it can also be arranged inside the substrate 20 as part of an inner layer conductor.

[0044] The surface mount portion 32 is a conductor made of a material such as copper. The surface mount portion 32 is a conductor arranged facing the motherboard 31 at a predetermined distance from the motherboard 31 in the Z direction. The surface mount portion 32 can also be referred to as a radiating element. In a plan view, the entire surface mount portion 32 overlaps with the motherboard 31. That is, the entire surface area (i.e., the bottom surface) of the surface mount portion 32 faces the motherboard 31 in the Z direction. The surface mount portion 32 is arranged substantially parallel to the motherboard 31. Substantially parallel is not limited to perfect parallelism. For example, the surface mount portion 40 may be tilted relative to the motherboard 31 by a few degrees to ten degrees.

[0045] The patch portion 32 in this embodiment is at least a portion of a conductor pattern disposed on a surface layer on the top surface 20a side of the substrate 20. The patch portion 32 is formed by patterning a metal foil disposed on the surface of the substrate 20. The patch portion 32 is covered by a protective film 23. The basic shape of the patch portion 32 is a generally square planar shape. The basic shape is the outer contour of the patch portion 32 in a planar view. The patch portion 32 may have slits opening in the outer contour. For example, a patch portion 32 with a generally H-shaped planar shape may be used, wherein two slits are arranged in a generally square plane. The patch portion 32 is not limited to being disposed on a surface layer on the top surface 20a. For example, it may also be disposed inside the substrate 20 as part of an inner conductor.

[0046] By arranging the surface mount portion 32 facing the motherboard 31, a capacitor is formed according to the area size of the surface mount portion 32 and its distance from the motherboard 31. The surface mount portion 32 has dimensions for forming a capacitor that resonates in parallel with an inductor included in the short-circuit portion 33 at a target frequency. The area size of the surface mount portion 32 is appropriately designed to provide the desired capacitor and thus operate at the desired operating frequency.

[0047] In this embodiment, the basic shape (i.e., outer contour) of the patch portion 32 is, for example, a square. However, as another configuration, the planar shape of the patch portion 32 can be a circle, a regular octagon, a regular hexagon, or the like. The basic shape of the patch portion 32 is preferably a line-symmetrical shape with each of two mutually orthogonal straight lines as an axis of symmetry, i.e., a bidirectional line-symmetrical shape. A bidirectional line-symmetrical shape is a figure that is line-symmetrical with a first straight line as an axis of symmetry, and is also line-symmetrical with respect to a second straight line orthogonal to the first straight line. Bidirectional line-symmetrical shapes correspond to, for example, ellipses, rectangles, circles, squares, regular hexagons, regular octagons, rhombuses, etc. Furthermore, the patch portion 32 is more preferably a point-symmetrical figure, for example, a circle, a square, a rectangle, or a parallelogram.

[0048] The surface mount unit 32 is connected to the power supply circuit via a power supply line (not shown). The power supply line may be configured to include a conductor pattern disposed on the same surface as the surface mount unit 32, or it may be configured to include through-hole conductors. Current input from the power supply circuit to the power supply line propagates to the surface mount unit 32 and energizes the surface mount unit 32. Note that the power supply method is not limited to a direct power supply method. A power supply method in which the power supply line and the surface mount unit 32 are electromagnetically coupled may also be used.

[0049] The short-circuit section 33 electrically connects the main board 31 and the surface mount section 32, preventing a short circuit between them. The short-circuit section 33 is a cylindrical conductor with one end connected to the main board 31 and the other end connected to the surface mount section 32. The short-circuit section 33 has, for example, a generally circular planar shape. The inductance provided in the short-circuit section 33 can be adjusted by adjusting its diameter and length. In the plan view, the short-circuit section 33 is connected to approximately the center of the surface mount section 32. The center of the surface mount section 32 corresponds to its center of gravity.

[0050] Since the patch portion 32 in this embodiment has a planar square shape, its center corresponds to the intersection of the two diagonals of the patch portion 32. The short-circuit portion 33 is a through conductor arranged in the through hole of the base member 21. The number of through conductors constituting the short-circuit portion 33 is not particularly limited. The short-circuit portion 33 may be formed by a plurality of through conductors arranged in parallel between the main board 31 and the patch portion 32.

[0051] Note that the antenna 30 can be connected to the power supply circuit (e.g., a wireless communication circuit) using communication cables such as coaxial cables or feeders. The power supply circuit can be mounted on the substrate 20. In this case, the power supply line can also be configured as conductor 22.

[0052] The housing 40 houses and protects other components of the antenna device 10. A portion of the housing 40 is formed using a metallic material. Another portion of the housing 40 is formed using a resin material to radiate radio waves from the patch portion 32 to the outside of the housing 40 and / or receive radio waves from the outside of the housing 40.

[0053] In this embodiment, the housing 40 comprises two parts separated in the Z direction, specifically a case 41 and a cover 42. The case 41 is formed of a metallic material. The cover 42 is formed of a resin material. The housing 40 is formed by assembling the case 41 and the cover 42 along the Z direction. The method of assembling the case 41 and the cover 42 is not particularly limited. Assembly methods such as screw fastening or adhesive bonding can be used.

[0054] The housing 41 has a box shape with an opening on one side in the Z direction. The housing 41 has a flange 410 surrounding the opening. The bottom wall portion 411 of the housing 41 has a planar shape, for example, generally rectangular. The housing 41 has a support portion 412 protruding in the Z direction from a portion of the bottom wall portion 411. The support portion 412 supports the bottom surface 20b of the substrate 20 to secure the substrate 20 within the housing 40. The substrate 20 is secured to the housing 41 in a state supported by the support portion 412. The housing 41 has a plurality of support portions 412. The plurality of support portions 412 are distributedly arranged within the housing 41. In this embodiment, the support portion 412 is connected to the flange 410, but the support portion 412 can be located away from the flange 410. For example, the height of the protrusion of the support portion 412 can be less than... Figure 1 The height shown, and at least a portion of the substrate 20 can be arranged in the Z direction within (i.e., recessed) the housing 41, such that the substrate 20 is substantially surrounded by the housing 41 (not shown) (except for the top side). Figure 1 In the middle, the substrate 20 is basically surrounded by the cover 42 (except for the bottom side).

[0055] The cover 42 also has a box shape with an opening on one side in the Z direction. The cover 42 has a flange 420 surrounding the opening. The housing 41 and the cover 42 are positioned and assembled such that the flanges 410 and 420 overlap each other.

[0056] Antenna Operation

[0057] Next, the operation of antenna 30 will be described. As described above, antenna 30 has a structure in which the main board 31 and the patch portion 32, which face each other, are connected by a short circuit portion 33. This structure is a so-called mushroom structure, which is the same as the basic structure of metamaterials. Since antenna 30 is an antenna that applies metamaterial technology, it can sometimes be called a metamaterial antenna.

[0058] Since the antenna 30 of this embodiment is designed to operate in a zero-order resonant mode at a desired operating frequency, it can be called a zero-order resonant antenna. In the dispersion characteristics of metamaterials, the resonance phenomenon at the frequency where the phase constant β becomes zero (0) is a zero-order resonance. The phase constant β is the imaginary part of the propagation coefficient γ of a wave propagating on a transmission line. The antenna 30 is capable of satisfactorily transmitting and / or receiving radio waves in a predetermined frequency band including the frequency at which the zero-order resonance occurs.

[0059] Antenna 30 typically operates via LC parallel resonance between a capacitor (formed between the main board 31 and the patch portion 32) and an inductor included in the short-circuit portion 33. The patch portion 32 is short-circuited to the main board 31 via the short-circuit portion 33 located in its central region. Furthermore, the area of ​​the patch portion 32 is the size of the capacitor used to form parallel resonance with the inductor included in the short-circuit portion 33 at the desired frequency (i.e., the operating frequency). Note that the inductor value (i.e., inductance) is determined based on the dimensions (e.g., diameter and length in the Z direction) of each portion of the short-circuit portion 33.

[0060] Therefore, when power at the operating frequency is supplied, parallel resonance occurs due to energy exchange between the inductor and capacitor, generating an electric field perpendicular to the motherboard 31 between the mainboard 31 and the patch portion 32. That is, an electric field in the Z direction is generated. This vertical electric field propagates from the short-circuit portion 33 to the outer portion of the patch portion 32, becoming vertically polarized at the outer portion of the patch portion 32, and propagating in space. Note that here, vertically polarized waves refer to radio waves whose electric field vibration direction is perpendicular to the motherboard 31 and the patch portion 32. Furthermore, the antenna 30 receives vertically polarized waves arriving from outside the antenna device 10 through LC parallel resonance.

[0061] Note that the resonant frequency of the zero-order resonance is independent of the antenna size. Therefore, the length of one side of the patch portion 32 can be shorter than half the wavelength of the zero-order resonant frequency. For example, a zero-order resonance can be generated even if one side has a length equal to a quarter wavelength. For example, when the operating frequency is 2.44 GHz, in a configuration including the substrate 20, the wavelength λε can be obtained as the square root of the dielectric constant of the substrate 20 (300 [mm / s] / 2.44 [GHz]). One side can be shorter than a quarter wavelength. However, for example, in this case, the gain (such as antenna gain) will be reduced.

[0062] <Non-designed areas and metal components>

[0063] Next, based on Figure 1 and Figure 2 The non-arrangement area 25 of the substrate 20, the support portion 412 of the housing 41 which is a metal component, and their positional relationship will be described.

[0064] In this embodiment, the antenna 30 is disposed near the periphery 24 of the substrate 20 in the X direction, specifically near the first peripheral edge 241. The patch portion 32 is disposed between the first peripheral edge 241 and the second peripheral edge 242, and is disposed close to the first peripheral edge 241. That is, the patch portion 32 is unevenly disposed towards the first peripheral edge 241 in the X direction. The first peripheral edge 241 is the side closest to the antenna 30 among the four sides (i.e., edges) of the periphery 24 of the substrate 20. In the plan view, the distance between the outer contour of the main board 31 and the outer contour of the patch portion 32 is the shortest relative to the patch portion 32 on the first peripheral edge 241 side. The antenna 30 may have such an offset arrangement considering other circuit elements formed on the substrate 20, electronic components mounted on the substrate 20, or similar components.

[0065] The non-distribution area 25 is a region on the substrate 20 extending from the periphery 24 to the main board 31, in which no conductor 22 is disposed. In this embodiment, the substrate 20 has a non-distribution area 25 located between the side edge 31a of the main board 31 and the first peripheral edge 241. The side edge 31a is one of the four sides (i.e., edges) that form the outer contour of the main board 31 in a plan view, and is the side edge facing the first peripheral edge 241. The side edge 31a is substantially parallel to the Y direction. The non-distribution area 25 is the region between the side edge 31a of the main board 31 and the first peripheral edge 241. The side edge 31a of the main board 31 substantially coincides with the edge of the area on the substrate 20 where the conductor 22 can be formed. That is, in this embodiment, the non-distribution area 25 is a region in which no conductor 22 is disposed, so as not to overlap with the cut portion of the substrate 20 obtained by cutting the mother substrate.

[0066] One of the support portions 412 contacts the non-distribution area 25 on the bottom surface 20b of the substrate 20. In plan view, the support portion 412 is adjacent to (vertically aligned) the side 31a of the main board 31 without gap. The support portion 412 is completely adjacent to the side 31a along the entire length of the side 31a without gap along the Y direction. That is, in plan view, the support portion 412 overlaps with the entire area of ​​the non-distribution area 25. The length of the support portion 412 in the Y direction is set to be slightly longer than the length of the non-distribution area 25, and the support portion 412 spans (i.e. covers / encloses) the non-distribution area 25 in the Y direction. One of the support portions 412, and therefore the housing 41, corresponds to the metal member disposed separately from the conductor 22.

[0067] Directivity and Antenna Gain

[0068] The results of electromagnetic field simulations evaluating this example and the reference example are shown below. Figure 3 , Figure 4 and Figure 5 The simulation results (i.e., radiation characteristics) of the reference example are shown. Figure 6 , Figure 7and Figure 8 The simulation results (i.e., radiation characteristics) for this example are shown. Figure 3 and Figure 6 , Figure 4 and Figure 7 ,as well as Figure 5 and Figure 8 They correspond to each other. Figures 3 to 8 This shows the positive (+) and negative (-) directions for each of the X, Y, and Z directions. Strictly speaking, Figure 1 and Figure 2 The diagram illustrates the X(+) direction, Y(+) direction, and Z(+) direction. This example shows an example of an antenna device 10 according to this embodiment. In the reference example, it is assumed that the reference numerals / numbers of elements that are the same as or related to elements in this embodiment are simply the codes / numbers in this embodiment with an 'r' appended to the end.

[0069] This example includes a metal support 412 that contacts the non-distribution area 25. On the other hand, the reference example does not have a support that contacts the non-distribution area 25. Except for the presence or absence of a support (i.e., a metal member), this example and the reference example are identical. The operating frequency is 2.44 GHz. Antennas 30 and 30r have the same configuration and are arranged near the first peripheral edges 241 and 241r of substrates 20 and 20r. That is, the non-distribution areas 25 and 25r are respectively located between the main boards 31 and 31r and the first peripheral edges 241 and 241r.

[0070] In the reference example, such as Figure 3 As shown, the electric field extends in the Z(-) direction through the non-distribution area 25r of the substrate 20r. That is, radio waves radiated from the patch portion 32r leak through the non-distribution area 25r, which exists outside the mainboard 31r, to the area below the mainboard 31r. In this way, radiated power leaks to the area below the mainboard 31r. Figure 3 The curved arrow shown represents the leakage of radio waves (i.e., electricity). Because the radiated power leaks through the non-distribution area 25r to below the mainboard 31r, the directionality is tilted relative to the Z(+) direction towards the X(-) direction, as... Figure 4 and Figure 5 As shown. Figure 5 The arrows shown indicate directionality. The maximum gain is -9.3 dBi.

[0071] In this example, such as Figure 6 As shown, since the support portion 412 is in contact with the non-distribution area 25, radio waves radiated from the patch portion 32 are reflected by the support portion 412, as indicated by the curved arrow. As a result, the diffusion of the electric field through the non-distribution area 25 in the Z(-) direction is suppressed. That is, radiated power leakage below the motherboard 31 is suppressed. Figure 7 and Figure 8As shown, because it can suppress downward leakage of electricity, the directionality is tilted in the X(+) direction relative to the Z(+) direction. Figure 8 The arrows shown indicate directionality. The maximum gain is -3.5 dBi.

[0072] <Summary of the First Embodiment>

[0073] Figure 9 This is a cross-sectional view showing the antenna device 10r of the reference example. Figure 9 Corresponding to Figure 1 . Figure 9 The solid white arrows indicate the directivity of antenna 30r. As described above, in the reference example, the metal component does not contact the non-distribution area 25r between the main board 31r and the first peripheral edge 241r. Therefore, as shown by the solid arrows, radio waves (i.e., electricity) radiated from the patch portion 32r leak through the non-distribution area 25r to below the main board 31r. As a result, the electric field is unintentionally biased, and the directivity deviates from the direction indicated by the dashed white arrows. As the simulation results show, the maximum gain is also low. As described above, if radio waves leak through the non-distribution area 25r to below the main board 31r, antenna characteristics such as antenna gain and directivity deteriorate.

[0074] Figure 10 This is a diagram showing the effect of the support portion 412 in the antenna device 10 of this embodiment. Figure 10 Corresponding to Figure 1 . Figure 10 The solid white arrows shown indicate the directivity of antenna 30. The dashed white arrows... Figure 9 The direction of directionality is also indicated. In this embodiment, on the bottom surface 20b of the substrate 20, the support portion 412 of the housing 41 contacts the non-distribution area 25 between the main board 31 and the first peripheral edge 241. Therefore, as shown by the solid arrow, radio waves radiated from the patch portion 32 are reflected by the support portion 412. That is, radiated radio waves (i.e., electricity) can be prevented from leaking below the main board 31 through the non-distribution area 25 located outside the main board 31. As a result, unintended bias of the electric field is mitigated (reduced), and directivity can be obtained in the target direction indicated by the dashed white arrow. Furthermore, the maximum gain is improved, as shown in the simulation results. As described above, according to this embodiment, it is possible to suppress the degradation of antenna characteristics such as antenna gain and directivity.

[0075] In the first embodiment ( Figure 1-3 and Figure 10 The support portion 412 is adjacent to the side 31a of the main board 31 without gap in the plan view. Therefore, leakage of radio waves from the gap between the main board 31 and the support portion 412 can be effectively suppressed. As a result, the degradation of antenna characteristics can be effectively suppressed.

[0076] In the first embodiment, the support portion 412 contacts the bottom surface 20b in plan view and overlaps with the entire non-distribution area 25. That is, in plan view, it covers the entire non-distribution area 25. In this way, since the propagation path of radio waves through the non-distribution area 25 is completely blocked by the support portion 412, radio wave leakage can be suppressed more effectively.

[0077] In this embodiment, one of the support portions 412 of the housing 41 constituting the outer casing 40 is intentionally positioned on the bottom surface 20b at a location that contacts the non-distribution area 25. As a result, one of the support portions 412 supports the substrate 20 and suppresses leakage of radio waves through the non-distribution area 25. As described above, this simple configuration can suppress the degradation of antenna characteristics.

[0078] <Variant Example>

[0079] The configuration in which a portion of the housing 41 contacts the non-arranged area 25 on the bottom surface 20b is not limited to the examples above. For example, it can be adopted... Figure 11 The configuration shown. Figure 11 This is a cross-sectional view showing a variant of the antenna device 10, and... Figure 1 Correspondingly, in a variant, the flange portion 410 extends outward relative to the side wall portion 413 of the housing 41, and the support portion 412 extends inward on the opposite side of the flange portion 410. The side wall portion 413 is the wall portion connecting the bottom wall portion 411 and the flange portion 410. The housing 41 has a plurality of support portions 412. Thus, one of the plurality of support portions 412 contacts the non-arranged area 25. Therefore, it is possible to... Figure 1 and Figure 2 The same configuration shown suppresses the degradation of antenna characteristics. Although not shown, the flange 410 can also be used as a support 412. That is, the non-arranged area 25 of the substrate 20 can be sandwiched between the flanges 410 and 420.

[0080] The housing 40 is not limited to a configuration that can be separated in the Z direction. For example, it can be adopted... Figure 12 and Figure 13 The configuration shown. Figure 12 This is a side view showing another variation of the antenna device 10. Figure 13 It is along Figure 12 The cross-sectional view taken from line XIII-XIII. Figure 12In order to easily distinguish the main body portion 43 and the cover portion 44, they are deliberately separated in the figure. In this variant, a so-called bag-shaped outer shell 40 is adopted. The outer shell 40 includes the main body portion 43 and the cover portion 44. The main body portion 43 has an upper wall portion 430 and a bottom wall portion 431 as walls in the Z direction, and side wall portions 432, 433 and 434. The main body portion 43 has an opening 435 at the edge opposite to the side wall portion 432 in the Y direction, which is one of the side wall portions. The cover portion 44 is attached to the main body portion 43 to close the opening 435 of the main body portion 43.

[0081] like Figure 13 As shown, the main body 43 has guide portions 436 and 437 for guiding the substrate 20 to the back side of the main body 43 (i.e., towards the sidewall portion 432). Guide portions 436 and 437 are arranged in pairs. Guide portions 436 and 437 protrude inwardly from the inner walls of the sidewall portions 433 and 434. The pair of guide portions 436 are provided at approximately the same position in the Z direction on each of the sidewall portions 433 and 434 arranged along the X direction. The guide portions 436 are integrally formed with the main body 43 by molding the main body 43 using a metal piece as an insert. The pair of guide portions 437 are provided at approximately the same position in the Z direction on each of the sidewall portions 433 and 434 arranged along the X direction. Regarding the distance to the guide portions 436, the guide portions 437 are arranged to provide a distance slightly larger than the thickness of the substrate 20. The guide portions 437 are formed using a resin material. For example, when molding the main body 43, the guide part 437 is integrally molded using the same material as the main body 43.

[0082] In the above configuration, the metal guide portion 436 contacts the non-arranged area 25 on the bottom surface 20b of the substrate 20. Therefore, it is possible to... Figure 1 and Figure 2 The configuration shown suppresses antenna characteristic degradation in the same way. In this variant, the main body 43 has a metal guide 436 and a resin guide 437. However, the main body 43 may also have only the metal guide 436. The guide 436 corresponds to a metal component.

[0083] An example is shown where the support portion 412 (i.e., the metal member) is adjacent to the main plate 31 without gap in a plan view. However, this disclosure is not limited to such a configuration. For example, alternative configurations may be employed. Figure 14 The configuration shown. Figure 14 This is a diagram showing another variation of the antenna device 10, and is related to... Figure 2 Correspondingly. Figure 14 The positional relationship between the non-arranged area 25 of the substrate 20 and the support portion 412 is shown. (Further details are needed.) Figure 14For simplicity, the protective film 23 is omitted from the illustration. In this variant, the support portion 412 is arranged to overlap with the main board 31 in the plan view. Accordingly, even if the positions of the housing 41 and the substrate 20 vary within the manufacturing tolerances during assembly, gaps are unlikely to occur between the main board 31 and the support portion 412. Therefore, the degradation of antenna characteristics can be effectively suppressed.

[0084] In addition, Figure 14 In the example shown, the support portion 412 overlaps with the entire area of ​​the non-distribution area 25 in the plan view, and also partially overlaps with the motherboard 31 within a predetermined range along the X direction from the side 31a. The support portion 412 spans a portion of the motherboard 31 in the Y direction in the plan view. Therefore, even if the positions of the housing 41 and the substrate 20 change as described above, the propagation path of radio waves through the non-distribution area 25 can be completely blocked.

[0085] (Second Embodiment)

[0086] The second embodiment is a variation of the foregoing embodiment as a basic configuration and can be described in conjunction with the foregoing embodiment. In the foregoing embodiment, the metal component is made to contact the non-distribution area on the back side of the substrate. Alternatively, the metal component may be made to contact the non-distribution area on the back side and electrically connected to the motherboard.

[0087] Figure 15 This is a cross-sectional view showing the antenna device 10 according to this embodiment. Figure 15 In this embodiment, the substrate 20 is fixed to the support portion 412 of the housing 41 by a fastening member 50. The substrate 20 is fixed to the support portion 412 by the fastening member 50 while being supported by the support portion 412. The fastening member 50 is made of metal. The fastening member 50 is, for example, a bolt or screw.

[0088] The substrate 20 has a through hole 26 extending from the upper surface 20a to the lower surface 20b through the substrate 20. The through hole 26 is located at a position in the plan view that does not overlap with the patch portion 32 but overlaps with the mainboard 31. For example... Figure 14 As shown, the support portion 412 is arranged to overlap a portion of the main board 31 in the plan view. The housing 41 has a hole 414 formed in the support portion 412. The hole 414 can be a non-through hole or a through hole. When the hole 414 is a non-through hole, a portion for fixing the fastening member 50 is formed in the hole 414, for example, an internal thread portion or a nut portion. When the hole 414 is a through hole, a nut or the like is arranged on the outside of the housing 41. The hole 414 is located at a position overlapping with the through hole 26 in the plan view.

[0089] <Summary of the Second Embodiment>

[0090] According to this embodiment, in the fixed state, the fastening member 50 contacts the main board 31, which forms a portion of the wall surface of the through hole 26. Additionally, the fastening member 50 contacts the support portion 412 on the wall surface forming the hole 414. That is, the support portion 412, and therefore the housing 41, is electrically connected to the main board 31 via the fastening member 50. In this way, the housing 41 has the same potential as the main board 31 (i.e., ground potential) and functions as the main board 31. Because the main board 31 is extended, the antenna gain can be improved.

[0091] <Variant Example>

[0092] The configuration for electrically connecting the housing 41 and the motherboard 31 is not limited to the examples above. For example, the protective film 23 on the bottom surface 20b can be partially removed to expose a portion of the motherboard 31 on the bottom surface 20b. In this case, the housing 41 can be electrically connected to the exposed portion (not shown) of the motherboard 31.

[0093] (Third Embodiment)

[0094] The third embodiment is a variation of the previous embodiment as a basic configuration and can be described in conjunction with the previous embodiment. In the foregoing embodiment, the metal member forms contact with the non-distribution area on the back side of the substrate. Alternatively, the metal member can form contact with the non-distribution area on the top surface 20a of the substrate.

[0095] Figure 16 This is a cross-sectional view showing the antenna device 10 according to this embodiment. Figure 16 Corresponding to Figure 13 . Figure 17 From Figure 16 A plan view of the substrate 20 as seen from the top surface 20a side of the antenna device 10 shown. Figure 17 In order to illustrate the positional relationship between the non-arrangement area 25 and the guide section 436, the guide section 436 is also shown. Figure 17 For convenience, the illustration of protective film 23 has been omitted.

[0096] like Figure 16 As shown, the antenna device 10 of this embodiment has the same... Figure 13 The antenna device 10 shown has a structure substantially the same. In this embodiment, the guides 436 and 437 are aligned with... Figure 13The configuration shown is arranged in the opposite manner. That is, the metal guide portion 436 is disposed on the top surface 20a side of the substrate 20, and the resin guide portion 437 is disposed on its bottom surface 20b side. The guide portion 436 contacts the non-disposal area 25 on the top surface 20a of the substrate 20. Similar to the support portion 412 shown in the first embodiment, the guide portion 436 is adjacent to the side edge 31a of the main board 31 without gap in the plan view. The guide portion 436 is completely adjacent to the side edge 31a without gap along the entire length of the side edge 31a in the Y direction. The support portion 412 overlaps with the entire non-disposal area 25 in the plan view. Other configurations are similar to... Figure 12 and 13 The same as shown.

[0097] <Summary of the Third Embodiment>

[0098] When the guide section 436 is absent, the radio waves (i.e., electricity) radiated by the surface mount section 32 leak through the non-mount area 25 to the area below the motherboard 31, such as Figure 16 As shown by the double-dotted arrow, in this embodiment, the metal guide portion 436 contacts the non-distribution area 25 on the top surface 20a. Therefore, as shown by the solid arrow, radio waves radiated from the patch portion 32 can be reflected by the guide portion 436. That is, it is possible to prevent radiated radio waves (i.e., electricity) from leaking below the motherboard 31 through the non-distribution area 25 located on the outside of the motherboard 31. As a result, similar to the configuration where the metal component contacts the non-distribution area 25 on the bottom surface 20b, it is possible to suppress the degradation of antenna characteristics such as antenna gain and directivity.

[0099] <Variant Example>

[0100] exist Figure 16 and Figure 17 In this example, the boot section 436 is adjacent to the motherboard 31 without any gap. However, this disclosure is not limited to this configuration. For example, as... Figure 14 In the example shown, guide section 436 can be arranged to overlap with motherboard 31. Furthermore, both guide sections 436 and 437 can be made of metal.

[0101] An example of guide portion 436 is shown as a metal member in contact with the top surface 20a, but this disclosure is not limited to such a configuration. That is, the guide portion is not limited to a metal member having a guiding function. For example, it can employ... Figure 18 The example shown. Figure 18 This is a cross-sectional view showing a variant of the antenna device 10, and... Figure 1 Correspondingly, in this variant, the metal part 421 is integrated with the cover 42. The metal part 421 is formed integrally with the cover 42, for example, as an embedded component. During assembly of the housing 41 and the cover 42, the metal part 421 forms contact with the non-arranged area 25 on the top surface 20a of the substrate 20. Therefore, it is possible to obtain... Figure 16 The guide portion 436 shown has the same effect. The metal part 421 corresponds to the metal component.

[0102] (Fourth Embodiment)

[0103] The fourth embodiment is a variation of the previous embodiment as a basic configuration and can be described in conjunction with the previous embodiment. In the previous embodiment, the metal member is arranged adjacent to or overlapping the motherboard without any gap. Alternatively, a gap may be provided between the metal member and the motherboard.

[0104] Figure 19 This is an enlarged cross-sectional view of the periphery of the non-arrangement area 25 in the antenna device 10 according to this embodiment. Figure 20 It is shown Figure 19 The plan view shows the positional relationship between the main board 31 and the support part 412 in the antenna device 10 shown. Figure 20 Corresponding to Figure 2 .exist Figure 20 For convenience, the protective film 23 is not shown.

[0105] In this embodiment, similar to the first embodiment, a support portion 412 of the housing 41 contacts the non-distribution area 25 on the bottom surface 20b of the substrate 20. The support portion 412 has a gap of distance D between it and the main board 31 (specifically, the side 31a of the main board 31). Distance D is the longest distance between the main board 31 and the support portion 412 in a plan view. The support portion 412 contacts only a portion of the non-distribution area 25 in the X direction. The support portion 412 is shorter than the non-distribution area 25 in the Y direction.

[0106] As an example, in this embodiment, assuming the radio wave wavelength at the operating frequency of antenna 30 is λ, the support portion 412 can be arranged to satisfy D ≦ λ × 1 / 4. Wavelength λ is the wavelength λε described above. Other configurations are the same as those described in the preceding embodiments.

[0107] <Summary of the Fourth Embodiment>

[0108] In this embodiment, the support portion 412 is arranged such that a gap exists between the support portion 412 and the motherboard 31. The support portion 412 (i.e., the housing 41), being a metallic component, only contacts a portion of the non-distribution area 25. The support portion 412 reflects a portion—in other words, not a small portion or a large portion—of radio waves (i.e., electricity) that would otherwise leak through the non-distribution area 25 to the area below the motherboard 31 without the support portion 412. Therefore, compared to a configuration where the support portion 412 does not contact the non-distribution area 25, it is possible to suppress the degradation of antenna characteristics.

[0109] The above shows an example of the support portion 412 contacting a portion of the non-distribution area 25 on the bottom surface 20b. However, this disclosure is not limited thereto. A metal member disposed separately from the conductor 22 may contact at least a portion of the non-distribution area 25 on either the top surface 20a or the bottom surface 20b of the substrate 20. As long as the metal member is in contact with at least a portion of the non-distribution area 25, the metal member is able to reflect radio waves (i.e., power) that may leak through the non-distribution area 25 to the area below the motherboard 31. In this way, the degradation of antenna characteristics can be suppressed compared to a configuration in which the metal member does not form contact with the non-distribution area 25.

[0110] In this embodiment, the support portion 412 is arranged such that the gap distance D satisfies D≦λ×1 / 4. As a result, even in a plan view, there is a gap between the motherboard 31 and the support portion 412 (i.e., the metal component), which is sufficiently small relative to the wavelength. Therefore, radio wave leakage from the gap can be suppressed.

[0111] (Fifth Embodiment)

[0112] The fifth embodiment is a variation of the previous embodiment as a basic configuration and can be combined with the description of the previous embodiment. In the foregoing embodiments, the substrate has a non-layout area. Alternatively, the substrate may have multiple non-layout areas.

[0113] Figure 21 This is a cross-sectional view showing the antenna device 10 according to this embodiment. Figure 21 Corresponding to Figure 1 .exist Figure 21 In the diagram, the dashed line that divides the substrate 20 in the X direction, i.e. the center line CL, is represented by a double-dotted line.

[0114] like Figure 21 As shown, the antenna 30 is arranged symmetrically in the X direction. The antenna 30 is arranged symmetrically with respect to the center line CL. In the X direction, the center of the main board 31 overlaps with the center line CL. In the X direction, the center of the patch portion 32 overlaps with the center line CL. In the X direction, the center of the short-circuit portion 33 overlaps with the center line CL. The main board 31 has a side 31b, which is one of four sides. Side 31b is the side opposite to side 31a in the X direction. Side 31b is the side facing the second peripheral edge 242 of the substrate 20. Side 31b is substantially parallel to the Y direction. Like side 31a, side 31b of the main board 31 substantially coincides with the edge of the formable region of the conductor 22 on the substrate 20.

[0115] The substrate 20 has two non-distribution areas 25. The substrate 20 is provided with a first non-distribution area 251 located between the main board 31 and the first peripheral edge 241, and a second non-distribution area 252 located between the main board 31 and the second peripheral edge 242 as non-distribution areas 25. The first non-distribution area 251 corresponds to the non-distribution area 25 described in the foregoing embodiments. The second non-distribution area 252 is a non-distribution area 25 opposite to the first non-distribution area 251 in the X direction. The X direction corresponds to a predetermined direction.

[0116] Furthermore, the housing 41 has a first support portion 4121 and a second support portion 4122, which are respectively part of a plurality of support portions 412. The first support portion 4121 contacts a first non-arrangement area 251 on the bottom surface 20b of the substrate 20. The second support portion 4122 also contacts a second non-arrangement area 252 on the bottom surface 20b.

[0117] exist Figure 21 In the same manner as in the first embodiment, the first support portion 4121 is adjacent to the side 31a of the motherboard 31 without gap in the plan view, and overlaps with the entire area of ​​the first non-arrangement area 251. Similarly, the second support portion 4122 is adjacent to the side 31b of the motherboard 31 without gap in the plan view, and overlaps with the entire area of ​​the second non-arrangement area 252.

[0118] <Summary of the Fifth Embodiment>

[0119] According to this embodiment, the housing 41, which is a metal component, contacts each of the first non-distribution area 251 and the second non-distribution area 252 on the bottom surface 20b of the substrate 20. Specifically, the first support portion 4121 of the housing 41 contacts the first non-distribution area 251. Therefore, radio waves radiated from the patch portion 32 are reflected by the first support portion 4121. Thus, it is possible to prevent radiated radio waves (i.e., electricity) from leaking below the motherboard 31 through the first non-distribution area 251 located outside the motherboard 31.

[0120] Furthermore, the second support portion 4122 of the housing 41 contacts the second non-distribution area 252. Therefore, radio waves radiated from the patch portion 32 are reflected by the second support portion 4122. Thus, it is possible to prevent radiated radio waves (i.e., electricity) from leaking below the motherboard 31 through the second non-distribution area 252 located outside the motherboard 31. As described above, the degradation of antenna characteristics can be effectively suppressed.

[0121] In a configuration with two non-arranged areas 25, the support 412 (i.e., the metal member) may contact only one non-arranged area 25. However, considering the balance of the electric field, it may be preferable for the support 412 to contact each non-arranged area 25.

[0122] The positional relationship between the motherboard 31 and the support part 412 is not limited to Figure 21 The example shown can be combined in various ways. That is, it can be combined between each of the multiple embodiments and variations. Furthermore, the number of non-arranged areas 25 is not limited to two. For example, the substrate 20 may have three non-arranged areas 25, and the metal member may form contact with each non-arranged area 25.

[0123] (Other embodiments)

[0124] The disclosure in this specification and accompanying drawings is not limited to the exemplary embodiments described herein. This disclosure includes exemplary embodiments and variations based on which those skilled in the art may modify them. For example, this disclosure is not limited to the combinations of components and / or elements shown in the above embodiments. This disclosure can be implemented in various combinations. This disclosure may have additional portions that can be added to embodiments. This disclosure includes those components and / or elements that are omitted from the embodiments. This disclosure includes the reassignment or combination of portions and / or elements between one embodiment and another. The scope of the disclosed technology is not limited to the description of the embodiments. Some of the scope of the disclosed technology is indicated by the claims and should be understood to include all variations with the same meaning and scope as the claims.

[0125] The disclosures in the specification, drawings, etc., are not limited to the descriptions in the claims. The disclosures in the specification, drawings, etc., include the technical ideas described in the claims, and further extend to technical ideas that are broader than those in the claims. Therefore, various technical ideas can be extracted from the disclosures in the specification, drawings, etc., and are not limited to the descriptions in the claims.

[0126] When an element or layer is described as “arranged above” or “connected”, the element or layer may be directly arranged above or connected to another element or layer, or an intermediate element or layer may exist between them. Conversely, when an element or layer is described as “directly arranged above” or “directly connected”, there is no intermediate element or layer. Other terms used to describe relationships between elements (e.g., “between” vs. “directly between”, and “adjacent” vs. “directly adjacent”) should be interpreted similarly. As used herein, the term “and / or” includes any and all combinations with respect to one or more of the associated listed items.

[0127] Spatial terms such as “inside,” “outside,” “back,” “bottom,” “low,” “top,” and “high” are used herein to facilitate the description of the relationship between one element or feature and another. In addition to the orientations depicted in the figures, spatial relative terms may be intended to include different orientations of the device in use or operation. For example, when the device in the figures is flipped, an element described as “below” or “directly below” another element or feature points “above” another element or feature. Therefore, the term “below” can include both “above” and “below.” The device may be oriented in other orientations (e.g., rotated 90 degrees or any other orientation), and the spatial relative terms used herein shall be interpreted accordingly.

[0128] An example of a zero-order resonant antenna is shown as antenna 30, but antenna 30 is not limited to this. It is also not limited to metamaterial antennas. For example, it can be applied to antennas having a structure including a main board 31 and a patch portion 32 but without a short-circuit portion 33, i.e., so-called patch antennas.

[0129] An example is shown in which the unplaced area 25 substantially coincides with the unplaced area of ​​the conductor 22 located remotely, so as not to overlap with the cut portion of the mother substrate to obtain multiple mother substrates. That is, an example is shown in which the sides 31a and 31b of the motherboard 31 substantially coincide with the edge of the formable area of ​​the conductor 22 on the substrate 20. However, the antenna device may have a configuration in which, in a plan view, the edge portion (i.e., the side) of the motherboard 31 is located inside the edge portion of the formable area of ​​the conductor 22, and the unplaced area where the conductor 22 is not placed is located between the motherboard 31 and the periphery 24. In the same case, by making the metal member contact the unplaced area on the top surface 20a or bottom surface 20b of the substrate 20, it is possible to suppress the leakage of radio waves (i.e., electricity) through the unplaced area to the area below the motherboard 31.

[0130] An example is shown in which a portion of the housing 40 serves as a metal member contacting the non-dispatch area 25 on the top surface 20a or bottom surface 20b of the substrate 20. However, this disclosure is not limited to such a configuration. For example, a metal component sandwiched between the substrate 20 and the housing 40 to secure the substrate 20 to the housing 40 may also contact the non-dispatch area 25. Furthermore, a portion of a heat dissipation component, such as a heat sink housed in the housing, may contact the non-dispatch area 25.

Claims

1. An antenna device, comprising: A substrate having an insulating base member and a conductor disposed on the insulating base member; Antenna, which has: A motherboard, at least a portion of which is arranged as a conductor on the insulating base member, and provides a ground potential; A surface mount portion is arranged to face the motherboard in the thickness direction of the substrate; and Metal components, which are disposed separately from the conductor, wherein The substrate has a non-conductor area in which no conductors are arranged, the non-conductor area being the region extending from the periphery of the substrate to the motherboard in a plan view. The metal member contacts the non-arranged area on the top surface of the substrate in the thickness direction or on the bottom surface opposite to the top surface, and A portion of the housing is formed using a metal material, and another portion is formed using a resin material, so that radio waves are radiated from the patch portion to the outside of the housing and / or received from the outside of the housing.

2. The antenna device as claimed in claim 1, wherein... The metal components are arranged so that they are adjacent to or overlap the motherboard without gaps in the plan view.

3. The antenna device as claimed in claim 2, wherein... The motherboard is disposed on a surface layer on the bottom surface side of the substrate, and The metal component contacts the non-distribution area on the bottom surface and is electrically connected to the motherboard.

4. The antenna device as claimed in claim 1, wherein... Assume the wavelength of the radio waves at the operating frequency of the antenna is λ. The metal component is positioned such that it maintains a gap of λ×1 / 4 or less from the main board in the plan view.

5. The antenna device according to any one of claims 1 to 4, wherein The substrate has a first peripheral edge and a second peripheral edge opposite to the first peripheral edge in a predetermined direction. The patch portion is positioned between the first peripheral edge and the second peripheral edge and is close to the first peripheral edge in the predetermined direction. The non-layout area is located between the first outer edge and the motherboard.

6. The antenna device according to any one of claims 1 to 4, wherein The substrate has a first non-arranged area in a predetermined direction and a second non-arranged area opposite to the first non-arranged area as non-arranged areas, and The metal component is in contact with each of the first non-arranged area and the second non-arranged area.

7. The antenna device according to any one of claims 1 to 4, wherein The substrate has at least one non-arranged area, and The metal component overlaps with the entire area of ​​at least one non-arranged area in the plan view.

8. The antenna device as claimed in any one of claims 1 to 4, wherein The antenna also includes a short-circuit section that electrically connects the patch portion and the motherboard.

9. The antenna device according to any one of claims 1 to 4, wherein The metal component is part of the housing used to house the substrate and the antenna.

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