Light measuring device

Abstract

The present application provides a light emitting device, a heat transfer member, and a light measuring device. The light emitting device includes a substrate, an electrode disposed on a surface of the substrate, the electrode having a light emitting element disposed on a surface thereof and being electrically connected to the light emitting element, a connection portion disposed on the surface of the substrate at a position separate from the electrode and being connected to a conductive portion having a reference potential, and a heat transfer member having a contact surface formed along the surface of the substrate and being in contact with the surface of the electrode and the surface of the connection portion, and transferring heat from the electrode to the connection portion.

Description

Technical Field

[0001] This invention relates to a light-emitting device, a heat transfer component, and a light measurement device. Background Technology

[0002] Patent Document 1 discloses a chip-type heating element, characterized in that, in a surface-mount chip component consisting of electrodes that are electrically and mechanically connected to a main body portion that also functions as a circuit element, there is a heat dissipation electrode provided for releasing heat generated by the main body portion.

[0003] Patent document 2 discloses a heat conduction device for heat dissipation of electrical components, characterized in that, on an electrical wiring printed circuit board on which the electrical components are mounted, arbitrary heat conductors for transferring heat generated by the electrical components are continuously arranged on any wiring on the board.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 6-169189

[0007] Patent Document 2: Japanese Patent Application Publication No. 10-84175 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] As a light-emitting device, a light-emitting device can be considered that includes a substrate such as a printed circuit board, electrodes disposed on the surface of the substrate, and light-emitting elements disposed on the surface of the electrodes, wherein the electrodes and the light-emitting elements are electrically connected. In such a light-emitting device, when the heat generated by the light-emitting element is only transferred from the electrodes to the substrate, it is sometimes impossible to efficiently release the heat of the light-emitting element.

[0010] The object of the present invention is to efficiently release the heat of the light-emitting element compared to a structure in which the heat generated by the light-emitting element is transferred from the electrode only to the substrate.

[0011] Methods for solving problems

[0012] According to a first aspect of the present invention, a light-emitting device is provided, comprising: a substrate; an electrode disposed on the surface of the substrate, having a light-emitting element disposed on its own surface and electrically connected to the light-emitting element; a connecting portion disposed on the surface of the substrate at a position separate from the electrode and connected to a conductive portion having a reference potential; and a heat-transferring member having a contact surface formed along the surface of the substrate and in contact with the surface of the electrode and the surface of the connecting portion, and transferring heat from the electrode to the connecting portion.

[0013] In the second aspect, the heat transfer component is an insulator.

[0014] In the third aspect, the contact portion of the heat transfer member with the surface of the electrode and the contact portion with the surface of the connection are metallized in an electrically isolated state.

[0015] The fourth aspect of the light-emitting device includes: a driving unit disposed on a side of the surface of the substrate opposite to the light-emitting element, and driving the light-emitting element, wherein the electrode extends from the light-emitting element to the opposite side of the driving unit opposite to the light-emitting element, and the contact surface contacts the extended portion of the electrode.

[0016] In the fifth aspect, the connecting portion is disposed on the opposite direction side to the extended portion, the heat transfer member is disposed from the extended portion toward the opposite direction side, and the contact surface contacts the connecting portion on the opposite direction side to the extended portion.

[0017] In the sixth aspect, the width of the cross direction of the extended portion intersecting the opposite direction is wider than the width of the cross direction of the portion of the electrode where the light-emitting element is disposed.

[0018] In the seventh aspect, the direction in which the heat transfer member transfers heat from the electrode to the connection is different from the direction in which the current flows between the light-emitting element and the electrode.

[0019] In the eighth aspect, the heat transfer component is a component with a higher thermal conductivity than the substrate.

[0020] The light-emitting device of the ninth aspect comprises: a substrate; an electrode disposed on the surface of the substrate, having a light-emitting element disposed on its own surface and electrically connected to the light-emitting element; a connecting portion disposed on the surface of the substrate at a position separate from the electrode and connected to a conductive portion having a reference potential; and a heat-transferring member made of an insulator, in contact with the surface of the electrode and the surface of the connecting portion, and transferring heat from the electrode to the connecting portion.

[0021] The heat transfer member of the tenth aspect has a first contact portion that contacts the heat-transferring object that carries away heat and a second contact portion that contacts the heat-transferring object. The heat transfer member is made of an insulator with high thermal conductivity. The first contact portion and the second contact portion are metallized in an electrically isolated state.

[0022] The eleventh aspect of the light measuring apparatus includes: a light-emitting device according to any one of the first to ninth aspects; a light-receiving unit that receives reflected light from an object irradiated by light emitted by the light-emitting device; and a processing unit that processes information related to the light received by the light-receiving unit to measure the distance from the light-emitting device to the object or the shape of the object.

[0023] Invention Effects

[0024] According to the structure of the first aspect, compared with the structure in which the heat generated by the light-emitting element is transferred from the electrode only to the substrate, the heat of the light-emitting element can be released efficiently.

[0025] According to the structure in the second aspect, compared with the structure in which the heat transfer component is a conductor, it is possible to prevent the electrode from conducting with the connection part.

[0026] According to the structure of the third aspect, it is possible to use a bonding material that has an affinity for metals to bond the electrodes and the connecting parts to the heat transfer components respectively.

[0027] According to the structure of the fourth aspect, the heat transfer member can be brought into contact with the electrode by utilizing the space on the opposite side of the driving part that is opposite to the light-emitting element.

[0028] According to the structure of the fifth aspect, the space on the opposite side to the extension of the electrode can be used to make the heat transfer member contact the connection part.

[0029] According to the structure in the sixth aspect, compared with the structure in which the width of the extended portion of the electrode is the same as that of the portion in which the light-emitting element is disposed, the contact width with the heat transfer component can be increased.

[0030] According to the structure in the seventh aspect, compared with the structure in which the direction of heat transfer from the electrode to the connection part is the same as the direction of current flow between the light-emitting element and the electrode, heat dissipation can be carried out at a position without affecting the current path.

[0031] According to the structure in the eighth aspect, compared with a structure in which the heat transfer component has the same thermal conductivity as the substrate, the heat dissipation effect of releasing the heat of the light-emitting element to the conductive part is better.

[0032] According to the structure of the ninth aspect, compared with the structure in which the heat generated by the light-emitting element is transferred from the electrode only to the substrate, the heat of the light-emitting element can be released efficiently.

[0033] According to the structure of the tenth aspect, it is possible to prevent the heat-transfer object from conducting with the heat transfer object, and it is possible to use a bonding material that has an affinity for metal to bond the heat-transfer object and the heat transfer object to the heat transfer member respectively.

[0034] According to the structure of the eleventh aspect, compared with the structure of a light-emitting device in which the heat generated by the light-emitting element is transferred from the electrode only to the substrate, the heat of the light-emitting element in the light-emitting device can be released efficiently. Attached Figure Description

[0035] Exemplary embodiments of the present invention are described in detail below with reference to the accompanying drawings, wherein: Figure 1 This is a top view showing the structure of the light-emitting device according to this embodiment.

[0036] Figure 2 This is a side sectional view showing the structure of the light-emitting device of this embodiment.

[0037] Figure 3 This is a top view showing the structure of the light-emitting device in the first modified example.

[0038] Figure 4 This is a top view showing the structure of the light-emitting device in the second modified example.

[0039] Figure 5 This is a side sectional view showing another application example of the heat transfer component.

[0040] Figure 6 This is a schematic diagram showing the structure of a light measuring device to which the light-emitting device of this embodiment is applied. Detailed Implementation

[0041] Hereinafter, an example of an embodiment of the present invention will be described with reference to the accompanying drawings.

[0042] (Light-emitting device 10)

[0043] First, the structure of the light-emitting device 10 in this embodiment will be described. Figure 1 This is a top view showing the structure of the light-emitting device 10 of this embodiment. Figure 2 This is a side sectional view showing the structure of the light-emitting device 10 of this embodiment.

[0044] Furthermore, the +X, -X, +Y, and -Y directions used in the following description are the arrow directions shown in the diagram. Additionally, the +X and -X directions, and the +Y and -Y directions, are intersecting directions (specifically, orthogonal directions).

[0045] Figure 1 and Figure 2 The light-emitting device 10 shown is a device that emits light, that is, a device that emits light. Specifically, as... Figure 1 and Figure 2 As shown, the light-emitting device 10 includes a substrate 20, a light-emitting element 40, a cathode pattern 30, a driving element 60, a connecting pattern 72, and a heat transfer member 80. Additionally, as... Figure 1 As shown, the light-emitting device 10 includes anode patterns 52 and 54, ground patterns 53 and 55, and capacitors 56 and 58. In addition, cathode pattern 30, connection pattern 72, anode patterns 52 and 54, and ground patterns 53 and 55 are wiring patterns formed on the surface 20A of substrate 20.

[0046] Figure 1 and Figure 2 The substrate 20 shown is an example of a "substrate". Specifically, the substrate 20 is, for example, a printed circuit board with a multilayer structure using an insulator such as glass epoxy resin. Figure 2 As shown, a ground plane 22 is disposed inside the substrate 20 as an inner layer. The ground plane 22 has a reference potential (i.e., a reference potential of 0V) in the circuit that causes the light-emitting element 40 to operate. Furthermore, the ground plane 22 is an example of a "conductive part".

[0047] Figure 1 and Figure 2 The cathode pattern 30 shown is an example of an "electrode". (As shown...) Figure 1 and Figure 2 As shown, a cathode pattern 30 is formed on surface 20A of substrate 20. Furthermore, surface 20A of substrate 20 is one face of substrate 20. In this embodiment, Figure 2 The upper side face is designated as surface 20A.

[0048] Furthermore, the cathode pattern 30 is electrically connected to the electrode on the cathode side of the light-emitting element 40. The cathode pattern 30 is electrically connected to the electrode on the cathode side of the light-emitting element 40, thereby forming part of the electrode on the cathode side of the light-emitting element 40.

[0049] like Figure 1 and Figure 2 As shown, the light-emitting element 40 is disposed on the surface 30A of the cathode pattern 30. The light-emitting element 40 is the part that generates light that is emitted to the outside of the light-emitting device 10. As an example, it is constructed using a vertically cambered surface-emitting laser (VCSEL) with the light-emitting points arranged in a two-dimensional shape. Furthermore, the light-emitting element 40 may be configured as a light-emitting part having a thyristor structure, which functions as a switch to selectively turn the light-emitting points on / off. Alternatively, the light-emitting element 40 may also be configured as a light-emitting part without a thyristor structure.

[0050] like Figure 1As shown, anode pattern 52 is formed on surface 20A of substrate 20 in the +Y direction relative to light-emitting element 40 and on the +Y direction relative to cathode pattern 30. Anode pattern 54 is formed on surface 20A of substrate 20 in the -Y direction relative to light-emitting element 40 and on the -Y direction relative to cathode pattern 30. Anode patterns 52 and 54 are electrically connected to electrodes on the anode side of light-emitting element 40 via wire bonding using multiple wires 51. Anode patterns 52 and 54 are electrically connected to a terminal of power supply 50.

[0051] Ground pattern 53 is formed on surface 20A of substrate 20 in the +Y direction relative to anode pattern 52. Ground pattern 55 is formed on surface 20A of substrate 20 in the -Y direction relative to anode pattern 54. Ground patterns 53 and 55 are electrically connected to ground 22 through a plurality of through holes 57 and 59 extending from surface 20A to ground 22 through substrate 20.

[0052] Capacitor 56 is a capacitive element and is configured to span the anode pattern 52 and the ground pattern 53. The capacitor 56 is electrically connected to the anode pattern 52 and the ground pattern 53, respectively.

[0053] Capacitor 58 is a capacitive element and is configured to span the anode pattern 54 and the ground pattern 55. Capacitor 58 is electrically connected to both the anode pattern 54 and the ground pattern 55. Charge is supplied from the power source 50 to capacitors 56 and 58 via the anode patterns 52 and 54, and the charge accumulates. The accumulated charge in capacitors 56 and 58 is then supplied to the light-emitting element 40.

[0054] The cathode pattern 30 extends in the +X direction relative to the light-emitting element 40. As will be described later, the end of the cathode pattern 30 in the +X direction becomes a connection portion 36 connected to the driving element 60.

[0055] The driving element 60 is an example of a "driving section". This driving element 60 is an element that drives the light-emitting element 40 and causes it to emit light, and is, for example, composed of a semiconductor integrated circuit. In this embodiment, the driving element 60 is disposed on the +X direction side relative to the light-emitting element 40 and is electrically connected to the connection portion 36 of the cathode pattern 30 via a connection terminal 62. The +X direction side is an example of "a direction side along the surface of the substrate".

[0056] Furthermore, a ground pad 18 is formed on the surface 20A of the substrate 20 in the +X direction relative to the connection portion 36. The ground pad 18 is electrically connected to the ground 22 through a plurality of through holes 19 extending from the surface 20A to the ground 22 through the substrate 20. Furthermore, the ground pad 18 is connected to the terminal (not shown) of the drive element 60 for connection to the ground 22.

[0057] Furthermore, the cathode pattern 30 extends in the -X direction relative to the light-emitting element 40. Therefore, the cathode pattern 30 has an extension portion 43 that extends in the -X direction relative to the light-emitting element 40. In addition, the -X direction is the opposite direction to the driving element 60, which is opposite to the light-emitting element 40.

[0058] Specifically, the extension portion 43 is positioned on the -X direction side relative to the anode patterns 52 and 54, and its width in the -Y direction is wider than the configuration portion 45 in the cathode pattern 30 where the light-emitting element 40 is located. The -Y direction is an example of "an intersecting direction that crosses the opposite direction".

[0059] (A structure that thermally connects the cathode pattern 30 to the ground 22)

[0060] Here, the structure for thermally connecting the cathode pattern 30 to the ground 22 (hereinafter referred to as the connection structure) will be described. Furthermore, thermal connection refers to a connection performed in a manner that transfers heat between the connected objects.

[0061] This connection structure has the function of transferring heat generated by the light-emitting element 40 to the ground 22. Specifically, in this embodiment, the connection structure is configured to include a connection pattern 72, a plurality of through holes 73, and a heat transfer member 80.

[0062] like Figure 1 and Figure 2 As shown, the connection pattern 72 is disposed on the surface 20A of the substrate 20 at a position separate from the cathode pattern 30. Specifically, the connection pattern 72 is disposed with a gap between itself and the cathode pattern 30 on the -X direction side relative to the extension portion 43 of the cathode pattern 30. A plurality of through holes 73 extend from the connection pattern 72 to the ground 22, electrically and thermally connecting the connection pattern 72 and the ground 22. Thus, the plurality of through holes 73 transfer heat from the connection pattern 72 to the ground 22.

[0063] The heat transfer member 80 is a member that transfers heat from the cathode pattern 30 to the connecting pattern 72. This heat transfer member 80 is made of an insulator with high thermal conductivity. Specifically, as the heat transfer member 80, ceramics such as aluminum nitride can be used, for example. More specifically, the heat transfer member 80 is a member with a higher thermal conductivity than the substrate 20. Specifically, it is formed of a material with a higher thermal conductivity than the substrate 20. Furthermore, in this embodiment, high thermal conductivity means 10 [W / mK] or higher. Additionally, in this embodiment, an insulator means a material with a volume resistivity of 10... 13 Structures with a value of [Ω·cm] or higher.

[0064] Furthermore, the heat transfer component 80 is formed in a block shape (i.e., a cuboid shape), such as... Figure 2As shown, a contact surface 82 is provided along the surface 20A of the substrate 20. This contact surface 82 contacts the surface 30A of the cathode pattern 30 (specifically, the surface 43A of the extension 43) and the surface 72A of the connecting pattern 72. Specifically, the heat transfer member 80 is disposed from the extension 43 toward the -X direction side, and the contact surface 82 contacts the connecting pattern 72 on the -X direction side relative to the extension 43. Thus, the heat transfer member 80 transfers heat from the extension 43 of the cathode pattern 30 to the connecting pattern 72.

[0065] The contact portions 82A and 82B of the contact surface 82 of the heat transfer member 80, which are in contact with the surface 30A of the cathode pattern 30 and the surface 72A of the connecting pattern 72, are metallized in an electrically isolated state. Here, metallization refers to the metallization of a non-metallic surface. Specifically, as an example, the metal film is formed on the surface of the heat transfer member 80 by vapor deposition methods such as chemical vapor deposition (CVD) and physical vapor deposition (PVD).

[0066] As an example, the metal film can be made of metallic materials such as aluminum and copper. Contact portions 82A and 82B are respectively bonded to the surface 30A of the cathode pattern 30 and the surface 72A of the connecting pattern 72 via a bonding material 89 that has an affinity for metals. The bonding material 89 can be, for example, a metallic material such as solder or silver paste.

[0067] In the heat transfer member 80, heat is transferred from the contact portion 82A to the contact portion 82B through the insulating portion. Therefore, the contact portion 82A can be considered as the contact portion that contacts the object that carries away heat. On the other hand, the contact portion 82B can be considered as the contact portion that contacts the object that transfers heat. Furthermore, the contact portion 82A is an example of a "first contact portion," and the contact portion 82B is an example of a "second contact portion."

[0068] In this embodiment, the direction of heat transfer from the cathode pattern 30 to the connecting pattern 72 by the heat transfer member 80 is different from the direction of current flow between the light-emitting element 40 and the cathode pattern 30. Specifically, the contact surface 82 of the heat transfer member 80 contacts the surface 30A of the cathode pattern 30 and the surface 72A of the connecting pattern 72, and heat is transferred from the cathode pattern 30 to the connecting pattern 72 along the contact surface 82 in the heat transfer member 80. Therefore, the heat transfer member 80 transfers heat in the -X direction. The light-emitting element 40 contacts the surface 30A of the cathode pattern 30 through its bottom surface 40B, and current flows between the light-emitting element 40 and the cathode pattern 30 in a direction perpendicular to the substrate 20. Thus, in this embodiment, the heat transfer direction of the heat transfer member 80 is different from the direction of current flow between the light-emitting element 40 and the cathode pattern 30.

[0069] Furthermore, as described above, the heat transfer component 80 is made of an insulator with high thermal conductivity, so the cathode pattern 30 and the connecting pattern 72 are thermally connected but electrically separated. Moreover, the state of electrical separation refers to a non-conductive state where no electricity flows between the separated components.

[0070] (Application example of light-emitting device 10)

[0071] As an example, the light-emitting device 10 can be applied to Figure 6 The light measurement device 100 shown. Figure 6 The light measurement device 100 shown includes the aforementioned light-emitting device 10, light-receiving unit 102, and processing unit 104. In the light measurement device 100, the object 103 is positioned opposite the light-emitting device 10 and the light-receiving unit 102. Furthermore, in... Figure 6 In this example, object 103 is a person. Additionally, Figure 6 This is a schematic diagram of the light measuring device 100 as viewed from above.

[0072] As an example, such as Figure 6 As shown by the solid line, the light-emitting device 10 irradiates two-dimensionally diffused light onto the object 103. For example... Figure 6 As shown by the dashed line, the light-receiving unit 102 receives reflected light from the object 103 illuminated by the light emitted by the light-emitting device 10. As an example, the light-receiving unit 102 can be a camera device that receives light from a two-dimensional direction.

[0073] As an example, the processing unit 104 is configured as a computer with an input / output unit for inputting and outputting data. The processing unit 104 measures the distance from the light-emitting device 10 to the object 103, or the shape of the object 103. Specifically, the processing unit 104 operates in the following manner.

[0074] The processing unit 104 controls the light-emitting device 10 to emit light from the light-emitting device 10 within a short time. That is, the light-emitting device 10 emits light in a pulsed manner. The processing unit 104 then calculates the optical path length from the emission of light from the light-emitting device 10 to the reflection of light from the object 103 and its arrival at the light-receiving unit 102, based on the time difference between the moment the light is emitted from the light-emitting device 10 and the moment the light-receiving unit 102 receives the reflected light from the object 103. The positions and intervals of the light-emitting device 10 and the light-receiving unit 102 are predetermined. Therefore, the processing unit 104 measures the distance from the light-emitting device 10 and the light-receiving unit 102, or the distance from a reference point (hereinafter referred to as the reference point) to the object 103. Furthermore, the reference point refers to a point set at a predetermined position from the light-emitting device 10 and the light-receiving unit 102.

[0075] This method is based on the measurement of light arrival time and is called the Time-of-Flight (TOF) method. If this method is performed on multiple points on the object 103, the three-dimensional shape of the object 103 can be measured. As described above, light from the light-emitting device 10 diffuses in two dimensions and illuminates the object 103. Then, reflected light from the portion of the object 103 that is closest to the light-emitting device 10 rapidly enters the light-receiving part 102. When an imaging device is used to acquire the aforementioned two-dimensional image, bright spots are recorded at the locations where the reflected light arrives in the frame image. Based on the bright spots recorded in a series of multiple frame images, the optical path length is calculated for each bright spot. Then, the distance to the light-emitting device 10, the light-receiving part 102, or the distance to a reference point is calculated. That is, the three-dimensional shape of the object 103 is calculated.

[0076] Alternatively, the light-emitting device 10 of this embodiment can also be used as another method for optical measurement methods that utilize structured light. The optical measurement device used is the same as that used with the light-emitting device 10. Figure 6 The light measuring device 100 shown is largely the same. The difference lies in that the pattern of light irradiated onto the object 103 is a random pattern of numerous light spots, which are received by the light receiving unit 102. Then, the processing unit 104 processes the light-related information. Here, as a processing method, the distance to the object 103 and the three-dimensional shape of the object 103 are calculated by calculating the positional offset of the numerous light spots instead of calculating the aforementioned time difference.

[0077] The optical measuring device 100 described above can be used to calculate the distance to an object. Furthermore, the optical measuring device 100 can calculate the shape of an object for object recognition. Then, the optical measuring device 100 can calculate the shape of a person's face for recognition (facial authentication). Moreover, the optical measuring device 100 can be mounted on a vehicle for detecting obstacles in front, behind, and to the sides. Thus, the optical measuring device 100 can be widely used for calculating distances, shapes, etc.

[0078] Furthermore, the light-emitting device 10 is not limited to the light measurement device 100 described above, and can be applied to various devices. For example, the light-emitting device 10, the light transmission path, and the light-receiving part can be combined for light transmission, and it can also be applied to biological detection, such as when light emitted from the light-emitting device 10 enters the interior of the object to be detected.

[0079] (The function of this implementation method)

[0080] In this embodiment, the heat generated by the light-emitting element 40 is transferred from the light-emitting element 40 in the order of cathode pattern 30, extension portion 43, heat transfer member 80, connecting pattern 72, through hole 73 and ground 22, and released to the ground 22. In addition, some of the heat generated by the light-emitting element 40 is also transferred from the cathode pattern 30 to the substrate 20.

[0081] As described above, in this embodiment, the heat generated by the light-emitting element 40 is transferred to the ground 22 through the heat transfer member 80, the connecting pattern 72, and the through hole 73. Therefore, compared to a structure where the heat generated by the light-emitting element 40 is transferred only from the cathode pattern 30 to the substrate 20, the heat of the light-emitting element 40 can be released more efficiently. Thus, according to this embodiment, compared to a structure where the heat generated by the light-emitting element 40 is transferred only from the cathode pattern 30 to the substrate 20, the degree of temperature reduction per unit time in the light-emitting element 40 is greater. As a result, high output and high duty cycle driving of the light-emitting element 40 is possible.

[0082] Furthermore, in this embodiment, the heat transfer member 80 is made of an insulator, thus preventing the cathode pattern 30 from becoming electrically connected to the connecting pattern 72, compared to a structure where the heat transfer member 80 is a conductor. Therefore, the cathode pattern 30 can be maintained electrically isolated from the ground 22.

[0083] Furthermore, in this embodiment, the contact portion 82A of the contact surface 82 of the heat transfer member 80, which contacts the surface 30A of the cathode pattern 30, and the contact portion 82B of the surface 72A of the connecting pattern 72, are metallized in an electrically isolated state. Therefore, as in this embodiment, by using a bonding material 89 that has an affinity for metals, the cathode pattern 30 and the connecting pattern 72 can be bonded to the heat transfer member 80, respectively.

[0084] In this embodiment, the contact surface 82 of the heat transfer member 80 contacts the extension portion 43 that extends in the opposite direction to the driving element 60 opposite to the light-emitting element 40. Therefore, the space on the opposite side of the driving element 60 opposite to the light-emitting element 40 can be used to bring the heat transfer member 80 into contact with the cathode pattern 30. Thus, the unused space on the opposite side of the driving element 60 opposite to the light-emitting element can be effectively utilized.

[0085] Furthermore, in this embodiment, the heat transfer member 80 is disposed from the extension portion 43 toward the -X direction side, and the contact surface 82 contacts the connection pattern 72 on the -X direction side relative to the extension portion 43. Therefore, the space on the -X direction side relative to the extension portion 43 can be utilized to make the heat transfer member 80 contact the contact surface 82. Thus, the unused space on the -X direction side relative to the extension portion 43 can be effectively utilized.

[0086] Furthermore, in this embodiment, the width of the extension portion 43 in the Y direction is wider than the configuration portion 45 in the cathode pattern 30 where the light-emitting element 40 is disposed. Therefore, compared to a structure where the width of the extension portion 43 is the same as that of the configuration portion 45, the contact width with the heat transfer member 80 is wider. As a result, the heat of the light-emitting element 40 can be released efficiently.

[0087] Furthermore, in this embodiment, the contact surface 82 of the heat transfer member 80 contacts the surface 30A of the cathode pattern 30 and the surface 72A of the connecting pattern 72, and the heat transfer member 80 transfers heat from the cathode pattern 30 to the connecting pattern 72 along the contact surface 82. Therefore, the heat transfer member 80 transfers heat in the -X direction. Thus, the direction in which the heat transfer member 80 transfers heat from the cathode pattern 30 to the connecting pattern 72 is different from the direction in which the current flows between the light-emitting element 40 and the cathode pattern 30. Therefore, compared to a structure where the direction in which the heat transfer member 80 transfers heat from the cathode pattern 30 to the connecting pattern 72 is the same as the direction in which the current flows between the light-emitting element 40 and the cathode pattern 30, heat dissipation can be achieved at a location that does not affect the current path.

[0088] Furthermore, in this embodiment, the thermal conductivity of the heat transfer member 80 is higher than that of the substrate 20. Therefore, compared to a structure where the heat transfer member 80 has the same thermal conductivity as the substrate 20, the heat dissipation effect of releasing heat from the light-emitting element 40 to the ground 22 is better.

[0089] Furthermore, the heat transfer member 80 according to this embodiment can prevent the heat-transfer object, i.e., the cathode pattern 30, from conducting with the heat transfer object, i.e., the connection pattern 72, and can use a bonding material that has an affinity for metal to bond the heat-transfer object and the heat transfer object to the heat transfer member respectively.

[0090] (First variation of cathode pattern 30)

[0091] In this embodiment, a cathode pattern 30 is used as an example of an electrode, but it is not limited to this. As an example of an electrode, such as... Figure 3 As shown, for example, anodized pattern 52 can also be used. The following refers to... Figure 3 The structure shown will be explained. Furthermore, for structures having the same characteristics as described above... Figure 1 and Figure 2 For parts with the same structure and function shown, the same reference numerals shall be appropriately used and their descriptions shall be omitted.

[0092] exist Figure 3 In the structure shown, the light-emitting element 40 is disposed on the surface 52A of the anode pattern 52 formed on the surface 20A of the substrate 20. The anode pattern 52 is electrically connected to the electrode on the anode side of the light-emitting element 40, thereby constituting part of the electrode on the anode side of the light-emitting element 40.

[0093] A ground pattern 53 is formed on the surface 20A of the substrate 20 in the +Y direction relative to the light-emitting element 40 and in the +Y direction relative to the anode pattern 52. A capacitor 56 is configured to span the anode pattern 52 and the ground pattern 53. The capacitor 56 is electrically connected to the anode pattern 52 and the ground pattern 53, respectively.

[0094] A ground pattern 55 is formed on the surface 20A of the substrate 20 in the -Y direction relative to the light-emitting element 40 and in the -Y direction relative to the anode pattern 52. A capacitor 58 is configured to span the anode pattern 52 and the ground pattern 55. The capacitor 58 is electrically connected to the anode pattern 52 and the ground pattern 55, respectively.

[0095] The cathode pattern 30 is formed on the surface 20A of the substrate 20 in the +X direction relative to the light-emitting element 40 and in the +X direction relative to the anode pattern 52. The cathode pattern 30 is electrically connected to the electrode on the cathode side of the light-emitting element 40 by means of a plurality of wires 51.

[0096] The end of the cathode pattern 30 in the +X direction becomes a connection portion 36 connected to the driving element 60. The driving element 60 is disposed on the +X direction side relative to the light-emitting element 40 and is electrically connected to the connection portion 36 of the cathode pattern 30 via a connection terminal 62. A ground pad 18 is formed on the surface 20A of the substrate 20 on the +X direction side relative to the connection portion 36.

[0097] exist Figure 3 In the structure shown, the heat transfer member 80 is in contact with the surface 52A of the anode pattern 52 and the surface 72A of the connecting pattern 72. Thus, the heat transfer member 80 transfers heat from the anode pattern 52 to the connecting pattern 72.

[0098] (Second variation of cathode pattern 30)

[0099] Additionally, as an example of an electrode, it can also be used Figure 4 The anode pattern 52 is shown below. The following refers to... Figure 4 The structure shown will be explained. Furthermore, for structures having the same characteristics as described above... Figure 1 and Figure 2 For parts with the same structure and function shown, the same reference numerals shall be appropriately used and their descriptions shall be omitted.

[0100] exist Figure 4 In the structure shown, the light-emitting element 40 is disposed on the surface 52A of the anode pattern 52 formed on the surface 20A of the substrate 20. The anode pattern 52 is electrically connected to the electrode on the anode side of the light-emitting element 40, thereby constituting part of the electrode on the anode side of the light-emitting element 40.

[0101] A ground pattern 53 is formed on the surface 20A of the substrate 20 in the +Y direction relative to the light-emitting element 40 and in the +Y direction relative to the anode pattern 52. A capacitor 56 is configured to span the anode pattern 52 and the ground pattern 53. The capacitor 56 is electrically connected to the anode pattern 52 and the ground pattern 53, respectively.

[0102] The cathode pattern 30 is formed on the surface 20A of the substrate 20 in the -Y direction relative to the light-emitting element 40 and in the -Y direction relative to the anode pattern 52. The cathode pattern 30 is electrically connected to the electrode on the cathode side of the light-emitting element 40 by means of a plurality of wires 51.

[0103] The end of the cathode pattern 30 on the -Y direction side becomes a connection portion 36 connected to the driving element 60. The driving element 60 is disposed on the -Y direction side relative to the light-emitting element 40 and is electrically connected to the connection portion 36 of the cathode pattern 30 via a connection terminal 62. A ground pad 18 is formed on the surface 20A of the substrate 20 on the -Y direction side relative to the connection portion 36.

[0104] exist Figure 4 In the structure shown, the anode pattern 52 extends in the -X direction relative to the light-emitting element 40. Therefore, the anode pattern 52 has an extension portion 43 extending in the -X direction relative to the light-emitting element 40. Specifically, the extension portion 43 is disposed in the -X direction relative to the cathode pattern 30, and its width in the -Y direction is wider than the disposed portion 45 of the anode pattern 52 where the light-emitting element 40 is disposed. Then, the heat transfer member 80 contacts the surface 43A of the extension portion 43 of the anode pattern 52 and the surface 72A of the connecting pattern 72. Thus, the heat transfer member 80 transfers heat from the extension portion 43 of the anode pattern 52 to the connecting pattern 72.

[0105] (Other application examples of heat transfer component 80)

[0106] like Figure 5 As shown, the heat transfer member 80 can also be disposed between the cathode pattern 30 and the ground 22. The specific structure of this heat transfer member 80 will be described below. Furthermore, to distinguish this heat transfer member 80 from the heat transfer member 80 described above, it will be referred to as heat transfer member 80 (X). Additionally, descriptions of parts identical to those of the heat transfer member 80 described above will be appropriately omitted.

[0107] like Figure 5 As shown, specifically, the heat transfer member 80(X) is disposed between the cathode pattern 30 and the ground plane 22 on the lower side relative to the light-emitting element 40. The heat transfer member 80(X) has contact surfaces 82 and 84 along the surface 20A of the substrate 20. Specifically, one surface of the heat transfer member 80(X) (specifically, is...) Figure 5The upper surface of the heat transfer component 80 (X) is the contact surface 82, and the other surface of the heat transfer component 80 (X) is specifically the upper surface of the heat transfer component 80 (X). Figure 5 The lower surface of the middle part is the contact surface 84.

[0108] Contact surfaces 82 and 84 are in contact with the back surface 30B of the cathode pattern 30 and the surface 22A of the grounding 22, respectively. Thus, the heat transfer member 80(X) transfers heat from the cathode pattern 30 to the grounding 22. In this case, heat is transferred from the cathode pattern 30 to the grounding 22 without passing through the connecting pattern 72 and the through-hole 73. Furthermore, in this case, the heat transfer member 80(X) transfers heat in a direction perpendicular to the substrate 20. Therefore, the heat transfer direction of the heat transfer member 80 and the direction of current flow between the light-emitting element 40 and the cathode pattern 30 are both perpendicular to the substrate 20.

[0109] Furthermore, in the heat transfer member 80(X), contact surfaces 82 and 84 are metallized in an electrically isolated state. In the heat transfer member 80(X), heat is transferred from contact surface 82 to contact surface 84 through an insulating portion; therefore, contact surface 82 can be considered a contact portion that contacts the object being transferred to carry away heat. On the other hand, contact surface 84B can be considered a contact portion that contacts the object being transferred to carry away heat. Moreover, contact surface 82 is an example of a "first contact portion," and contact surface 84 is an example of a "second contact portion."

[0110] (Other variations)

[0111] In this embodiment, substrate 20 is used as an example of a substrate, but it is not limited to this. As an example of a substrate, it may be a heat dissipation component disposed on surface 20A of substrate 20 and having a higher thermal conductivity than substrate 20, or it may be a component other than substrate 20.

[0112] In this embodiment, the heat transfer member 80 is made of an insulator, but it is not limited to this. For example, the heat transfer member 80 may also be a conductor. In this case, for example, an insulator is used in at least one of the connecting pattern 72 and the through hole 73 to maintain the state of electrical separation between the cathode pattern 30 and the ground 22.

[0113] In addition, in this embodiment, the contact portion 82A of the contact surface 82 of the heat transfer member 80 with the surface 30A of the cathode pattern 30 and the contact portion 82B with the surface 72A of the connecting pattern 72 are metallized in an electrically separated state, but it is not limited to this, and a heat transfer member 80 with an unprocessed contact surface 82 can also be used.

[0114] Furthermore, in this embodiment, the heat transfer member 80 contacts the connection pattern 72 formed on the surface 20A of the substrate 20, but is not limited thereto. For example, it may be a structure in which the connection pattern 72 is not formed on the surface 20A of the substrate 20, and the heat transfer member 80 directly contacts the through hole 73, or a structure in which the heat transfer member 80 contacts a member that transfers heat to the ground 22. In addition, in the structure in which the heat transfer member 80 contacts the through hole 73, the through hole 73 functions as an example of a "connection portion".

[0115] In this embodiment, the extension portion 43 extends in the opposite direction to the driving element 60, which is opposite to the light-emitting element 40, but it is not limited to this. For example, the extension portion 43 may also be a structure that extends in the +Y direction or the -Y direction.

[0116] Furthermore, in this embodiment, the width of the extended portion 43 in the Y direction is wider than the configuration portion 45 in the cathode pattern 30 where the light-emitting element 40 is disposed, but it is not limited to this. For example, the width of the extended portion 43 may be the same as that of the configuration portion 45.

[0117] Furthermore, in this embodiment, the direction of heat transfer from the cathode pattern 30 to the connecting pattern 72 by the heat transfer member 80 is different from the direction of current flow between the light-emitting element 40 and the cathode pattern 30, but it is not limited to this. For example, it is also possible that the direction of heat transfer from the cathode pattern 30 to the connecting pattern 72 by the heat transfer member 80 is the same as the direction of current flow between the light-emitting element 40 and the cathode pattern 30 (see [reference]). Figure 5 ).

[0118] In this embodiment, such as Figure 2 As shown, a ground plane 22 is disposed inside the substrate 20 as an inner layer, but it is not limited to this. For example, the ground plane 22 may also be disposed on the back side 20B of the substrate 20 (i.e., the side opposite to the surface 20A).

[0119] This invention is not limited to the embodiments described above, and various modifications, alterations, and improvements can be made without departing from its spirit. For example, the variations shown above can also be constructed by appropriately combining multiple examples.

Claims

1. An optical measurement device, comprising: Light-emitting device; The light-receiving part receives reflected light from the object being illuminated by the light-emitting device; as well as The processing unit processes information related to the light received by the light-receiving unit to measure the distance from the light-emitting device to the object or the shape of the object. The light-emitting device includes: Substrate; An electrode is disposed on the surface of the substrate, and a light-emitting element is disposed on its own surface and electrically connected to the light-emitting element. A connecting portion is disposed on the surface of the substrate at a position separate from the electrode and is connected to a conductive portion having a reference potential; A heat transfer member having a contact surface formed along the surface of the substrate and in contact with the surfaces of the electrode and the connection portion, and transferring heat from the electrode to the connection portion; and A driving unit is disposed on one side of the surface of the substrate opposite to the light-emitting element, and drives the light-emitting element. The electrode extends from the light-emitting element in the opposite direction to the driving portion opposite to the light-emitting element. The contact surface contacts the extended portion of the electrode. The connecting portion is positioned on the opposite side to the extended portion. The heat transfer member is arranged from the extension portion toward the opposite direction side, and the contact surface contacts the connection portion on the opposite direction side opposite to the extension portion.

2. The optical measurement device according to claim 1, wherein... The heat transfer component is an insulator.

3. The optical measurement device according to claim 2, wherein... The contact portions of the heat transfer member that are in contact with the surface of the electrode and the contact portions that are in contact with the surface of the connection are metallized in an electrically isolated state.

4. The optical measurement device according to claim 1, wherein the width of the cross direction of the extended portion intersecting the opposite direction is wider than the width of the cross direction of the portion of the electrode on which the light-emitting element is disposed.

5. The optical measurement apparatus according to any one of claims 1 to 4, wherein The direction in which the heat transfer component transfers heat from the electrode to the connection is different from the direction in which the current flows between the light-emitting element and the electrode.

6. The optical measurement apparatus according to any one of claims 1 to 4, wherein The heat transfer component is a component with a higher thermal conductivity than the substrate.

Images