Electronic circuit and circuit board
Patent Information
- Application Number
- CN202111024379.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2021-03-24
- Filing Date
- 2021-09-02
- Publication Date
- 2026-09-15
- Estimated Expiration
- 2041-09-02
AI Technical Summary
[0028] According to the first aspect of the present invention, the electronic circuit can change the frequency band that suppresses the propagation of electromagnetic noise through the electronic circuit itself.
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Figure CN115134989B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to an electronic circuit and a circuit board. Background Technology
[0002] It is known that there are techniques for suppressing the propagation of electromagnetic noise by forming an EBG (Electromagnetic Band Gap Structure) on a circuit board.
[0003] For example, Patent Document 1 discloses an EBG structure that achieves miniaturization by using a vortex shape.
[0004] Furthermore, Patent Document 2 discloses an EBG structure that imparts capacitance by forming island-shaped conductors and achieves a broadband frequency band with noise reduction effect.
[0005] Furthermore, Patent Document 3 discloses an EBG structure that suppresses power consumption by connecting adjacent metal plates to each other via capacitors.
[0006] Furthermore, Reference 4 proposes a method to change the noise reduction frequency band by placing a circuit board with an EBG structure around the circuit board and changing the shape of the shielding box to a different shape.
[0007] Patent Document 1: Japanese Patent Application Publication No. 2014-197877
[0008] Patent Document 2: International Publication No. 2014 / 006796
[0009] Patent Document 3: Japanese Patent Application Publication No. 2008-288770
[0010] Patent Document 4: Japanese Patent Application Publication No. 2015-179699 Summary of the Invention
[0011] The purpose of this invention is to provide an electronic circuit that can change the noise reduction frequency band of an electronic circuit that reduces electromagnetic noise through the electronic circuit itself, and a circuit board on which the electronic circuit is mounted.
[0012] The electronic circuit of the invention involved in Scheme 1 is characterized by having:
[0013] A conductor post extends along the stacking direction, connected to the ground wire of the first layer of any one of a plurality of conductor layers stacked in a separate state;
[0014] The first conductor line extends in a strip shape, connected to the conductor post in a second layer (different from the first layer) among the plurality of conductor layers, and its end away from the conductor post is an open end; and
[0015] The second conductor line extends in a strip shape in any one of the plurality of conductor layers.
[0016] The first conductor line and the second conductor line each have a proximity portion that forms at least one pair of proximity portions that can be connected to each other.
[0017] The first end of the second conductor line that is away from the approach portion of the second conductor line is an open end.
[0018] The invention involved in Scheme 2 is the electronic circuit described in Scheme 1, characterized in that the approach portion is formed in the surface layer of the plurality of conductor layers or extends to the surface layer along the stacking direction.
[0019] The invention involved in Scheme 3 is the electronic circuit described in Scheme 2, characterized in that the pair of proximity parts are short-circuited to each other.
[0020] The invention involved in Scheme 4 is an electronic circuit as described in any one of Schemes 1 to 3, characterized in that the first conductor line is a conductor line whose end is different from the open end and connected to the conductor post.
[0021] The invention involved in Scheme 5 is the electronic circuit described in Scheme 4, characterized in that the approach portion of the first conductor line is formed at the open end of the first conductor line.
[0022] The invention involved in Scheme 6 is the electronic circuit described in Scheme 5, characterized in that the approach portion of the second conductor line is formed at a second end of the second conductor line that is different from the first end.
[0023] The invention involved in Scheme 7 is the electronic circuit described in Scheme 6, characterized in that the second conductor line extends in a shape that continues the shape of the first conductor line.
[0024] The invention involved in Scheme 8 is the electronic circuit described in Scheme 7, characterized in that the first conductor line and the conductor line that combines the first conductor line and the second conductor line connected to the first conductor line are both conductor lines that extend continuously or intermittently from one end toward the other end in the same direction of rotation.
[0025] The invention involved in Scheme 9 is a circuit board, characterized in that it is equipped with the electronic circuit described in any one of Schemes 1 to 8.
[0026] The invention involved in Scheme 10 is the circuit board described in Scheme 9, characterized in that it is equipped with a plurality of the electronic circuits.
[0027] Invention Effects
[0028] According to the first aspect of the present invention, the electronic circuit can change the frequency band that suppresses the propagation of electromagnetic noise through the electronic circuit itself.
[0029] According to the second aspect of the present invention, the electronic component is easier to connect to each other compared to the case where the proximity part exists in the surface layer.
[0030] According to the third aspect of the present invention, the electronic component can easily change the length of the conductor line.
[0031] According to the fourth aspect of the present invention, the electronic component can minimize the frequency band for suppressing the propagation of electromagnetic noise while having the same conductor line length.
[0032] The electronic components according to the fifth and sixth embodiments of the present invention are effective in reducing the frequency band that suppresses the propagation of electromagnetic wave noise.
[0033] According to the seventh aspect of the present invention, the electronic component can suppress the propagation frequency band of electromagnetic noise while changing the pattern of frequency characteristic suppression by connecting the proximity parts to each other.
[0034] According to the eighth aspect of the present invention, the electronic component achieves miniaturization compared to shapes other than a vortex shape.
[0035] According to the circuit board of the 9th and 10th embodiments of the present invention, the frequency band for suppressing the propagation of electromagnetic noise can be changed by the electronic circuit itself. Attached Figure Description
[0036] The embodiments of the present invention will be described in detail with reference to the following figures.
[0037] Figure 1 This is a schematic diagram illustrating an example of a circuit that constitutes a unit of the conventional EBG structure;
[0038] Figure 2 It is the equivalent circuit of the EBG structure, i.e., the distributed constant circuit;
[0039] Figure 3 This is a graph representing the frequency response of the admittance Y;
[0040] Figure 4 (A) Figure 4 (C) is a schematic diagram representing various shapes of EBG structures;
[0041] Figure 5 This is a diagram showing a unit of the EBG structure constituting the electronic circuit as described in the first embodiment of the present invention.
[0042] Figure 6This is a diagram showing a unit of the EBG structure constituting an electronic circuit as a second embodiment of the present invention.
[0043] Figure 7 This is a diagram showing a unit of the EBG structure constituting the electronic circuit as a third embodiment of the present invention.
[0044] Figure 8 This is a diagram showing a unit of the EBG structure constituting the electronic circuit as described in the fourth embodiment of the present invention.
[0045] Figure 9 This is a diagram showing a unit of the EBG structure constituting the electronic circuit as the fifth embodiment of the present invention.
[0046] Figure 10 (A) Figure 10 (C) is a diagram showing an embodiment of a conductor circuit having a shape other than a vortex shape.
[0047] Symbol Explanation
[0048] 10 - Circuit board, 11 - Ground line, 12 - Via, 13 - Short post, 21, 22, 23, 24, 25, 26, 27, 28 - Pads, 31, 32 - Via, 131 - First conductor line, 131a, 131b - Ends of the first conductor line, 132 - Second conductor line, 132a, 132b - Ends of the second conductor line, 133 - Third conductor line, 133a, 133b - Ends of the third conductor line. Detailed Implementation
[0049] Here, we will first explain the EBG structure (Electromagnetic Band Gap Structure). The EBG structure is a periodic structure with a band gap that suppresses the propagation of electromagnetic waves. By forming an EBG structure near an electronic circuit on a circuit board that emits electromagnetic noise, the propagation of electromagnetic noise emitted from that electronic circuit is suppressed.
[0050] Figure 1 This is a schematic diagram illustrating an example of a circuit that constitutes a unit of the conventional EBG structure.
[0051] Here, a circuit board with multiple conductor layers is used, and the first layer of any one of these multiple layers is called ground 11. Furthermore, a conductor post called a via 12, which extends along the stacking direction and is connected to the first layer, i.e., ground 11, is formed here. Also, a conductor line called a short post 13, which extends in a spiral shape, is formed in a second layer, different from the first layer. One end 13a of this short post 13 is connected to the via 12. The end 13b of this short post 13, away from the via 12, is open, i.e., an open end not directly connected to other conductors. By arranging multiple such conductors on the circuit board... Figure 1 The unit structure shown constitutes the EBG structure.
[0052] Here, the Figure 1 The short post 13 shown is not a vortex shape composed of curves, but rather a conductor line that extends while intermittently bending in the same direction of rotation from one end connected to the via 12 toward the other end. Specifically, the short post 13 is a conductor line that extends while intermittently bending at 90° in the same direction of rotation. Here, not only vortex shapes composed of continuous curves, but also shapes that extend while intermittently bending at 45° or 90° are also referred to as vortex shapes.
[0053] Figure 2 It is the equivalent circuit of the EBG structure, namely the distributed constant circuit.
[0054] The equivalent circuit of the EBG structure is based on this Figure 2 The circuit shown represents the distributed constant. Here, inductor L1 and capacitor C1 are the inductance and capacitance of the transmission line, respectively. The inductance L1 has less relation to the frequency characteristics of suppressing electromagnetic noise; the portion enclosed by the dashed line is related to its frequency characteristics. The admittance Y of the portion enclosed by the dashed line is...
[0055] [Formula 1]
[0056] @0001 is used to represent this.
[0057] Here,
[0058] Zstub represents the impedance of short post 13.
[0059] C1 is the capacitance between adjacent unit cells.
[0060] L2 is the inductor of via 12.
[0061] ω is the angular frequency
[0062] j is the symbol for a complex number.
[0063] Figure 3 This is a graph representing the frequency response of the admittance Y. Figure 3The vertical axis represents the imaginary component Im(Y) of the admittance Y, and the horizontal axis represents the frequency (GHz).
[0064] In Figure 3 The region where Im(Y) is negative, indicated by shading, is called the inductance region, and the region where it is positive is called the capacitance region. Furthermore, in this EBG structure, the propagation of electromagnetic noise at frequencies where Im(Y) is negative is suppressed within the inductance region, i.e., the frequency region where Im(Y) is negative. Here, the frequency region where Im(Y) is negative is related to the length of the short bar 13; the longer the short bar 13, the more the frequency characteristic pattern shifts towards the lower frequency side, and the shorter the short bar 13, the more the frequency characteristic pattern shifts towards the higher frequency side.
[0065] Figure 4 This is a schematic diagram representing various shapes of EBG structures.
[0066] Figure 4 (A) shows an EBG structure with a plurality of units of short linear columns 13 having the vortex shape described so far. Figure 1 Similarly, the short post 13 shown here is a conductor line that extends intermittently at 90° from one end connected to the via 12 toward the other end in the same direction of rotation. However, as long as it is a vortex shape as defined above, the EBG structure can also be constructed in any vortex shape.
[0067] and, Figure 4 (B) shows an EBG structure consisting of a plurality of short linear columns 13 arranged in a so-called meandering shape, extending simultaneously in a left-right reciprocating pattern. Figure 4 (B) shows a meandering shape in which the direction of extension is reversed by two bends at 90° along the same direction of rotation, but it is not limited to this. For example, it could be a shape that reverses while depicting a curve, or it could be a shape in which the direction of extension is reversed by four bends at 45°. One end 13a of each unit's short post 13 is connected to the through hole 12 of each unit. Moreover, each short post 13 extends in a meandering shape, with the end 13b on the side away from the through hole 12 becoming an open end.
[0068] and, Figure 4 (C) shows an EBG structure with a plurality of units having short posts 13 extending in a straight line. One end 13a of each unit's short post 13 is connected to a via 12 of that unit. Moreover, each short post 13 extends in a straight line, with the end 13b on the side away from the via 12 being an open end.
[0069] As illustrated in these examples, short posts 13 of various shapes can be used in the EBG structure. However, the length of the short post 13 from the point where it connects to the via 12 to the open end is related to the frequency of noise propagation that needs to be suppressed. To suppress low-frequency noise, a longer short post is required. Therefore, to suppress low-frequency noise, a short post 13 with a vortex shape and one end 13a connected to the via 12 is advantageous in terms of miniaturization.
[0070] Referring to the above description of the EBG structure, the embodiments of the present invention will be described below.
[0071] Figure 5 This is a diagram showing a unit of the EBG structure constituting an electronic circuit according to the first embodiment of the present invention. In this embodiment, a plurality of these EBG structures are arranged on a circuit board. Figure 5 The units shown are used to construct the EBG structure.
[0072] Here, with Figure 1 Similarly, in the conventional example shown, a circuit board 10 with multiple conductor layers is used, and the first layer of any one of these multiple layers is a ground line 11. Furthermore, a conductor post called a via 12 is formed here, extending in the stacking direction and connected to the first layer, i.e., the ground line 11. Also, a conductor line called a short post 13, extending in a spiral shape, is formed in a second layer different from the first layer. In this embodiment, the second layer is a surface layer formed on the surface of the circuit board 10. In this embodiment, the conductor line is a spiral shape extending while changing direction at 90°. However, it is not limited to a spiral shape extending while changing direction at 90°; as defined above, any conductor line extending while continuously or intermittently bending from one end to the other in the same rotational direction is acceptable.
[0073] The short line column 13 is composed of the first conductor line 131 and the second conductor line 132.
[0074] One end 131a of the first conductor line 131 is connected to the via 12 and extends toward the other end in a spiral shape. Moreover, the end 131b of the first conductor line 131 on the side away from the via 12 is open, that is, an open end that is not directly connected to other conductors. Furthermore, a pad 21 for connection with the second conductor line is formed at this end 131b.
[0075] Furthermore, regarding the second conductor line 132, one end 132a is located at the end 131b of the first conductor line 131, near the side away from the via 12, and extends in a shape that continues the spiral shape of the first conductor line 131. That is, the shape that combines the first conductor line 131 and the second conductor line 132 is also a spiral shape that directly extends the spiral shape of the first conductor line 131. Both ends 132a and 132b of the second conductor line 132 are open ends. Moreover, a pad 22 for connection with the first conductor line 131 is formed at the end 132a of the second conductor line 132 near the end 131b of the first conductor line 131.
[0076] Furthermore, a protective film (not shown) called photoresist is formed on the surface of the circuit board 10, but no protective film is formed around the pads 21 and 22. Figure 5 In the diagram, the area where no protective film is formed is shown by an ellipse. Therefore, even after the circuit board 10 has been fabricated, pads 21 and 22 can be connected as needed. Pads 21 and 22 correspond to an example of a pair of proximity portions described in this invention.
[0077] In the EBG structure, the noise reduction frequency where propagation is suppressed is approximately...
[0078] [Formula 2]
[0079] Noise reduction frequency = speed of light / (4 × length of the short bar) ... 2
[0080] @0002 is used to represent this.
[0081] That is, the noise reduction frequency depends on the length of the short bar.
[0082] In this embodiment, when pad 21 and pad 22 are not connected, only the first conductor line 131 functions as a short post. When pad 21 and pad 22 are connected, the conductor line combining the first conductor line 131 and the second conductor line 132 functions as a short post. That is, according to this embodiment, after fabricating the circuit board 10, the frequency of noise propagation can be changed.
[0083] This is effective in situations such as when the frequency of noise emitted from a circuit that is a noise source assembled on the circuit board 10 differs depending on the usage of the circuit determined when the circuit board 10 is assembled into the device (not shown), or when the frequency of noise changes due to changes over the years after use.
[0084] Here, pads 21 and 22 can be connected, for example, with jumpers or with passive components for shorting. Alternatively, and not limited to these, passive components including inductors or capacitors can be used for connection.
[0085] Figure 6 This is a diagram showing a unit of the EBG structure constituting an electronic circuit as described in the second embodiment of the present invention. In this embodiment, a plurality of these EBG structures are arranged on a circuit board. Figure 6 The units shown are used to construct the EBG structure.
[0086] Should Figure 6 The short line column 13 shown is composed of a first conductor line 131, a second conductor line 132, and a third conductor line 133.
[0087] One end 131a of the first conductor line 131 is connected to the via 12 and extends toward the other end in a spiral shape. Moreover, the end 131b of the first conductor line 131 away from the via 12 is open, that is, an open end that is not directly connected to other conductors. Furthermore, a pad 21 for connection with the second conductor line is formed at this end 131b.
[0088] Furthermore, regarding the second conductor line 132, one end 132a is located at the end 131b of the first conductor line 131, near the side away from the via 12, and extends in a shape that continues the spiral shape of the first conductor line 131. That is, the shape that combines the first conductor line 131 and the second conductor line 132 is also a spiral shape that directly extends the spiral shape of the first conductor line 131. Both ends 132a and 132b of the second conductor line 132 are open ends. Furthermore, a pad 22 for connecting to the first conductor line 131 is formed at the end 132a of the second conductor line 132 near the end 131b of the first conductor line 131. Moreover, a pad 23 for connecting to the third conductor line 133 is also formed at the other end 132b of the second conductor line 132.
[0089] Furthermore, regarding the third conductor line 133, one end 133a is located at the end 132b of the second conductor line 132, near the side away from the pad 21 of the first conductor line 131, and extends in a shape that continues the spiral shape of the first conductor line 131 and the second conductor line 132. That is, the shape that combines the first conductor line 131, the second conductor line 132, and the third conductor line 133 is also a spiral shape that directly extends the spiral shape formed by the first conductor line 131 and the second conductor line 132. Like the second conductor line 132, both ends 133a and 133b of the third conductor line 133 are open ends. Furthermore, a pad 24 for connection with the second conductor line 132 is formed at the end 133a of the third conductor line 133, near the end 132b of the second conductor line 132.
[0090] Furthermore, a protective film (not shown) called photoresist is formed on the surface of the circuit board 10, but no protective film is formed around pads 21 and 22, or around pads 23 and 24. Figure 6 In the diagram, ellipses are used to indicate the areas where no protective film has been formed. Thus, after fabricating the circuit board 10, pads 21 and 22, and pads 23 and 24 can be connected as needed.
[0091] In this embodiment, when pads 21 and 22 are not connected, only the first conductor line 131 functions as a short post 13. When pads 21 and 22 are connected, the conductor line combining the first conductor line 131 and the second conductor line 132 functions as a short post 13. Furthermore, when pads 23 and 24 are connected in addition to the connection between pads 21 and 22, the conductor line combining the first conductor line 131, the second conductor line 132, and the third conductor line 133 functions as a short post 13. That is, according to this embodiment, after fabricating the circuit board 10, the frequency of noise propagation suppression can be changed in two stages.
[0092] Figure 7 This is a diagram showing a unit of the EBG structure constituting an electronic circuit as described in the third embodiment of the present invention. In this embodiment, a plurality of these EBG structures are arranged on a circuit board. Figure 7 The units shown are used to construct the EBG structure.
[0093] Should Figure 7 The circuit shown is for... Figure 5 The circuit shown has an additional section; details regarding the reference are omitted here. Figure 5 Repeated explanation of the content to be explained.
[0094] In Figure 7In the case of the circuit shown, except for the one with Figure 5 In addition to having the same structure as the circuit shown, pads 25 and 26 are formed at positions adjacent to each other on the first conductor line 131 and the second conductor line 132. Moreover, no protective film is formed around these pads 25 and 26.
[0095] In Figure 7 In the example shown, when pads 21 and 22, and pads 25 and 26 are not connected, only the first conductor line 131 functions as a short post 13. Furthermore, if pads 21 and 22 are connected, it becomes a short post 13 that combines the lengths of the first conductor line 131 and the second conductor line 132. Furthermore, if pads 25 and 26 are connected, a conductor line shorter than the total length of the first conductor line 131 appears, extending from the via 12 to the end 132b of the second conductor line 132. Therefore, compared to the case where only the first conductor line 131 functions as a short post 13, connecting pads 21 and 22 can lower the noise reduction frequency to the lower frequency side, or connecting pads 25 and 26 can add noise reduction effects on the higher frequency side.
[0096] Figure 8 This is a diagram showing a unit of the EBG structure constituting an electronic circuit as described in the fourth embodiment of the present invention. In this embodiment, a plurality of these EBG structures are arranged on a circuit board. Figure 8 The units shown are used to construct the EBG structure.
[0097] In Figure 8 The explanation only applies to... Figure 7 The differences will be explained.
[0098] exist Figure 7 In the circuit shown, pads 25 and 26 are formed at adjacent positions on the first conductor line 131 and the second conductor line 132, but in this... Figure 8 In this case, pads 27 and 28 are formed at adjacent positions separated by a first conductor line 131. Furthermore, no protective film is formed around pads 27 and 28.
[0099] In Figure 8 In the example shown, if pad 27 and pad 28 are connected, a difference occurs compared to... Figure 7 The shorter pin connects pad 25 and pad 26, thus making it more efficient than the previous method. Figure 7 Compared to the case where pads 25 and 26 are connected, this can further enhance the noise reduction effect on the high-frequency side.
[0100] Figure 9This is a diagram showing a unit of the EBG structure constituting an electronic circuit as described in the fifth embodiment of the present invention. In this embodiment, a plurality of these EBG structures are arranged on a circuit board. Figure 9 The units shown are used to construct the EBG structure.
[0101] Here, regarding Figure 5 The differences between the examples shown will be explained.
[0102] exist Figure 5 (and Figures 6-8 In the example shown, the conductor lines constituting the short post 13 exist in the surface layer of the circuit board 10, but in this... Figure 9 In this circuit, the conductor lines are formed on the inner side of the circuit board 10, for example, the second conductor layer, rather than the surface layer. Therefore, vias 31 and 32 are also formed at the end 131b of the first conductor line 131 away from the via 12 and at the end 132a of the second conductor line 132 near the end 131b of the first conductor line 131, respectively. The via 31 is connected to the end 131b of the first conductor line 131 and to the pad 21 formed on the surface layer. The via 32 is connected to the end 132a of the second conductor line 132 and to the pad 22 formed on the surface layer. However, these vias 31 and 32 are not connected to the ground line 11.
[0103] As this example illustrates, conductor lines do not necessarily have to be formed on the surface layer. Furthermore, conductor lines can be connected vias and extend across multiple layers. However, for example, to connect conductor lines to each other, it may be desirable to connect them in the surface layer.
[0104] So far, EBG structures with vortex-shaped conductor lines have been described, but the EBG structure in this invention does not necessarily have to have vortex-shaped conductor lines.
[0105] Figure 10 This is a diagram illustrating an embodiment of a conductor circuit having a shape other than a vortex shape.
[0106] exist Figure 10 An example of an EBG structure with a meandering conductor line is shown in (A).
[0107] The short line column 13 is composed of the first conductor line 131 and the second conductor line 132.
[0108] One end 131a of the first conductor line 131 is connected to the via 12 and extends in a meandering shape toward the other end. Moreover, the end 131b of the first conductor line 131 on the side away from the via 12 is open, that is, an open end that is not directly connected to other conductors. Furthermore, a pad 21 for connection with the second conductor line is formed at this end 131b.
[0109] Furthermore, regarding the second conductor line 132, one end 132a is located at the end 131b of the first conductor line 131, near the side away from the via 12, and extends in a shape that continues the meandering shape of the first conductor line 131. That is, the shape that combines the first conductor line 131 and the second conductor line 132 is also a meandering shape that directly extends the meandering shape of the first conductor line 131. Both ends 132a and 132b of the second conductor line 132 are open ends. Moreover, a pad 22 for connection with the first conductor line 131 is formed at the end 132a of the second conductor line 132 near the end 131b of the first conductor line 131.
[0110] Furthermore, a protective film called photoresist (not shown) is formed on the surface of the circuit board 10, but no protective film is formed around the pads 21 and 22.
[0111] exist Figure 10 (B) shows an example of an EBG structure with a conductor line having a straight shape.
[0112] The short line column 13 is composed of the first conductor line 131 and the second conductor line 132.
[0113] One end 131a of the first conductor line 131 is connected to the via 12 and extends in a straight line toward the other end. Moreover, the end 131b of the first conductor line 131 away from the via 12 is open, that is, an open end that is not directly connected to other conductors. Furthermore, a pad 21 for connection with the second conductor line is formed at this end 131b.
[0114] Furthermore, regarding the second conductor line 132, one end 132a is located at the end 131b of the first conductor line 131, near the side away from the via 12, and extends in a shape that continues the straight shape of the first conductor line 131. That is, the shape that combines the first conductor line 131 and the second conductor line 132 is also a straight shape that directly extends the straight shape of the first conductor line 131. Both ends 132a and 132b of the second conductor line 132 are open ends. Moreover, a pad 22 for connection with the first conductor line 131 is formed at the end 132a of the second conductor line 132 near the end 131b of the first conductor line 131.
[0115] Furthermore, a protective film called photoresist (not shown) is formed on the surface of the circuit board 10, but no protective film is formed around the pads 21 and 22.
[0116] exist Figure 10 (C) shows the relationship with Figure 10 The EBG structure in (B) is approximately the same as the EBG structure.
[0117] In Figure 10 In (C), the second conductor line 132 is not formed on the extension of the straight shape of the first conductor line 131, but is formed at a slightly off-center position.
[0118] As this example shows, the second conductor line 132 does not necessarily have to extend in the same shape as the first conductor line 131; it can be designed freely.
[0119] The embodiments of the present invention described above are provided for illustrative purposes. Furthermore, these embodiments do not encompass the entirety of the invention, nor do they limit the invention to the disclosed methods. It will be apparent to those skilled in the art that various modifications and variations will be readily understood. These embodiments were chosen and described to most readily explain the principles and applications of the invention. Thus, those skilled in the art can understand the invention through various modifications that are assumed to be optimized for specific uses of various embodiments. The scope of the invention is defined by the foregoing claims and their equivalents.
Claims
1. An electronic circuit, characterized in that, have: A conductor post extends along the stacking direction, connected to the ground wire of the first layer of any one of a plurality of conductor layers stacked in a separate state; The first conductor line extends in a strip shape in a second layer, which is different from the first layer among the plurality of conductor layers, and is connected to the conductor post, with the end away from the conductor post being an open end; and The second conductor line extends in a strip shape in any one of the plurality of conductor layers. The first conductor line and the second conductor line each have a proximity portion that forms at least one pair of proximity portions that can be connected to each other. The first approach portion of the conductor line is located between its connection with the conductor post and the open end. The first end of the second conductor line that is away from the approach portion of the second conductor line is an open end.
2. The electronic circuit according to claim 1, characterized in that, The approach portion is formed in the surface layer of the plurality of conductor layers or extends to the surface layer along the stacking direction.
3. The electronic circuit according to claim 2, characterized in that, The two adjacent parts are short-circuited with each other.
4. The electronic circuit according to any one of claims 1 to 3, characterized in that, The first conductor line is a conductor line whose end, different from the open end, is connected to the conductor post.
5. The electronic circuit according to claim 4, characterized in that, The approach portion of the first conductor line is formed at the open end of the first conductor line.
6. The electronic circuit according to claim 5, characterized in that, The approach portion of the second conductor line is formed at a second end of the second conductor line that is different from the first end.
7. The electronic circuit according to claim 6, characterized in that, The second conductor line extends in a shape that continues the shape of the first conductor line.
8. The electronic circuit according to claim 7, characterized in that, The first conductor line and the conductor line that combines the first conductor line and the second conductor line connected to the first conductor line are both conductor lines that extend continuously or intermittently from one end toward the other in the same direction of rotation.
9. A circuit board, characterized in that, It is equipped with an electronic circuit according to any one of claims 1 to 8.
10. The circuit board according to claim 9, characterized in that, It is equipped with a plurality of the aforementioned electronic circuits.
Citation Information
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