Electronic product and display device

Abstract

This application relates to a display device including a folded region and a non-folded region. The display device includes a display panel and a front stack structure. The display panel has a front surface. The display panel is configured to display an image on the front surface. The front stack structure is disposed on the front surface of the display panel. The front stack structure includes an adhesive layer disposed across the folded region and the non-folded region. The adhesive layer comprises a UV-curable adhesive. The UV-curable adhesive includes vinyl silane and hydrosilane. The adhesive layer has a storage modulus of 0.05 MPa to 0.3 MPa in a temperature range of -20°C to 25°C.

Description

Technical Field

[0001] The implementation plan generally involves electronic products and display devices. Background Technology

[0002] Electronic products and display devices may include various components, and adhesives are used to bond these components together. Adhesives can be provided in the form of adhesive layers, adhesive sheets, adhesive films, etc., and can be classified into various types of adhesives based on their bonding mechanism. For example, adhesives include pressure-sensitive adhesives (PSA) in which the adhesive material acts under pressure, thermosetting adhesives that cure by heat, and photocurable adhesives that cure by light energy, etc.

[0003] The desired physical properties of adhesives can vary depending on the environment and characteristics of the electronic products and display devices used. For example, in the case of deformable electronic products, it is advantageous to set a storage modulus to accommodate repeated deformation and avoid permanent deformation.

[0004] The information disclosed in this section is only for understanding the background of the inventive concept and may therefore contain information that does not constitute prior art. Summary of the Invention

[0005] Some sectors offer electronic products that incorporate adhesives that allow for repeated deformation but prevent permanent deformation.

[0006] Some aspects offer display devices that incorporate adhesives that can be repeatedly deformed but prevent permanent deformation.

[0007] Other aspects will be set forth in the following detailed description and will be obvious to some extent from the disclosure or may be learned by practice of the inventive concept.

[0008] According to some embodiments, the display device includes a folded region and a non-folded region. The display device includes a display panel and a front stack structure. The display panel has a front surface. The display panel is configured to display an image on the front surface. The front stack structure is disposed on the front surface of the display panel. The front stack structure includes an adhesive layer disposed across the folded region and the non-folded region. The adhesive layer comprises a UV-curable adhesive. The UV-curable adhesive includes vinyl silane and hydrosilane. The adhesive layer has a storage modulus of 0.05 MPa to 0.3 MPa in a temperature range of -20°C to 25°C.

[0009] According to some embodiments, the display device includes a display panel, a first upper cover member, a second upper cover member, a third upper cover member, a first lower cover member, a second lower cover member, a third lower cover member, a first bonding layer, a second bonding layer, a third bonding layer, a fourth bonding layer, a fifth bonding layer, and a sixth bonding layer. The first upper cover member is disposed on the display panel. The second upper cover member is disposed on the first upper cover member. The third upper cover member is disposed on the second upper cover member. The first lower cover member is disposed below the display panel. The second lower cover member is disposed below the first lower cover member. The third lower cover member is disposed below the second lower cover member. The first bonding layer is disposed between the third upper cover member and the second upper cover member. The second bonding layer is disposed between the second upper cover member and the first upper cover member. The third bonding layer is disposed between the first upper cover member and the display panel. The fourth bonding layer is disposed between the display panel and the first lower cover member. The fifth bonding layer is disposed between the first lower cover member and the second lower cover member. The sixth bonding layer is disposed between the second lower cover member and the third lower cover member. Each of the first and second bonding layers is a UV-curable layer. Each of the first and second bonding layers has a storage modulus of 0.08 MPa to 0.3 MPa at -20°C and a storage modulus of 0.05 MPa to 0.2 MPa at 25°C.

[0010] According to some embodiments, an electronic product includes a first structure, a second structure, and an adhesive layer inserted between the first structure and the second structure to bond the first structure to the second structure. The adhesive layer comprises a UV-curable material. The adhesive layer has a storage modulus of 0.08 MPa to 0.3 MPa at -20°C and a storage modulus of 0.05 MPa to 0.2 MPa at 25°C.

[0011] According to various implementation schemes, since electronic products and / or display devices include adhesive layers that are capable of repeated deformation but prevent permanent deformation, deformation of the adhesive layer can be prevented from being reflected in the external shape of the electronic product or display device, which would otherwise be visually identifiable by the user.

[0012] The foregoing general description and the following detailed description are exemplary and illustrative, and are intended to provide further explanation of the claimed subject matter. Attached Figure Description

[0013] The accompanying drawings are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the inventive concept and, together with the description, serve to explain the principles of the inventive concept. In the drawings:

[0014] Figure 1 This is a cross-sectional view showing an electronic product according to an embodiment;

[0015] Figure 2 This shows the implementation scheme. Figure 1 A cross-sectional view showing the deformation of the external shape of an electronic product;

[0016] Figure 3 This shows the implementation scheme. Figure 1 A cross-sectional view showing the deformation of the external shape of an electronic product;

[0017] Figure 4 This illustrates the application of the implementation scheme to... Figure 1 A cross-sectional view of the external pressure on the electronic product;

[0018] Figure 5 This illustrates various implementation schemes. Figure 1 Figures showing various examples of temperature-dependent storage modulus of the adhesive layer;

[0019] Figure 6 This is a flowchart illustrating a method for forming an adhesive layer according to an embodiment;

[0020] Figure 7 , Figure 8 and Figure 9 This is a cross-sectional view illustrating a method for forming an adhesive layer according to an embodiment;

[0021] Figure 10 It is a perspective view of the display device according to the implementation plan;

[0022] Figure 11 This shows the implementation scheme. Figure 10 A diagram showing the folded state of the display device;

[0023] Figure 12 This shows the implementation scheme. Figure 10 A cross-sectional view of the display device;

[0024] Figure 13 This is a cross-sectional view showing the display panel according to the embodiment;

[0025] Figure 14 This is an exploded perspective view of the digitizer layer according to the implementation plan;

[0026] Figure 15It is based on the implementation plan. Figure 14 A cross-sectional view of the digitizer layer; and

[0027] Figure 16 This is a cross-sectional view of the display device according to the implementation scheme. Detailed Implementation

[0028] In the following description, numerous specific details are set forth for illustrative purposes to provide a thorough understanding of the various embodiments. As used herein, the terms "implementation" and "method" are used interchangeably and are non-limiting examples employing one or more of the inventive concepts disclosed herein. However, it will be apparent that various embodiments may be practiced without these specific details, or may be practiced with one or more equivalent arrangements. In other instances, well-known structures and arrangements are shown in block diagram form to avoid unnecessarily obscuring the various embodiments. Furthermore, the various embodiments may be distinct, but not necessarily exclusive. For example, the specific shape, configuration, and characteristics of an embodiment may be used or implemented in another embodiment without departing from the inventive concept.

[0029] Unless otherwise specified, the illustrated embodiments should be understood as exemplary features providing different details of some embodiments. Therefore, unless otherwise specified, features, components, modules, layers, films, panels, areas, aspects, etc. (hereinafter individually or collectively referred to as “elements”) of various examples may be combined, separated, interchanged and / or rearranged in other ways without departing from the inventive concept.

[0030] Crosshairs and / or shading are typically used in accompanying drawings to clarify boundaries between adjacent elements. Thus, the presence or absence of crosshairs or shading does not express or indicate any preference or need for particular materials, material properties, dimensions, scales, commonalities between illustrated elements, and / or any other characteristics, properties, or characteristics of the elements, unless otherwise specified. Furthermore, in the accompanying drawings, the dimensions and relative dimensions of elements may be enlarged for clarity and / or descriptive purposes. Thus, the dimensions and relative dimensions of individual elements are not necessarily limited to those shown in the accompanying drawings. When embodiments can be implemented differently, the specific process sequence may differ from the order of description. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of description. Furthermore, the same reference numerals denote the same elements.

[0031] When an element, such as a layer, is referred to as being "on," "connected to," or "linked to" another element, it can be directly on, directly connected to, or directly linked to the other element, or there can be an intermediate element. However, when an element is referred to as being "directly on," "directly connected to," or "directly linked to" another element, there is no intermediate element. Other terms and / or phrases used to describe relationships between elements should be interpreted in a similar manner, such as "between" versus "directly between," "adjacent" versus "directly adjacent," "on" versus "directly on," etc. Furthermore, the term "connected" can refer to a physical connection, an electrical connection, and / or a fluid connection. Additionally, the X-axis, Y-axis, and Z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as having only X, only Y, only Z, or any combination of two or more of X, Y, and Z, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any combination and all combinations of one or more of the relevant listed items.

[0032] Although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element.

[0033] Spatial relative terms such as “below,” “under,” “lower,” “lower part,” “above,” “upper,” “above,” “upper part,” and “side” (e.g., as in “sidewall”) may be used herein for descriptive purposes and thereby to describe the relationship between one element and another as illustrated in the accompanying drawings. Spatial relative terms are intended to cover different orientations of the equipment in use, operation, and / or manufacture other than those described in the accompanying drawings. For example, if the equipment in the accompanying drawings is flipped, an element described as “below” or “under” other elements or features would be oriented “above” other elements or features. Thus, the term “below” can encompass both the above and below orientations. Furthermore, the equipment may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and in such cases, the spatial relative descriptors used herein are interpreted accordingly.

[0034] The terminology used herein is for the purpose of describing some embodiments and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” are intended to also include the plural forms unless the context clearly indicates otherwise. Furthermore, the terms “comprises,” “comprising,” “includes,” and / or “including”, when used in this specification, specify the presence of a given feature, integer, step, operation, element, component, and / or group thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are used as approximations rather than terms of degree, and thus to explain the inherent deviations in measured, calculated, and / or provided values ​​that would be recognized by one of ordinary skill in the art.

[0035] This document describes various embodiments with reference to sectional views, isometric views, perspective views, plan views, and / or exploded views (which are schematic illustrations of idealized embodiments and / or intermediate structures). Thus, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances should be expected. Therefore, the embodiments disclosed herein should not be construed as limited to the specifically illustrated shapes of the areas, but should include deviations in shape resulting from, for example, manufacturing processes. In view of this, the areas illustrated in the figures may be schematic in nature, and the shapes of these areas may not reflect the actual shapes of the areas of the device, and thus are not intended to be limiting.

[0036] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms (e.g., those defined in common dictionaries) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0037] As is customary in the art, some embodiments are described and illustrated in the accompanying drawings with respect to functional blocks, units, and / or modules. Those skilled in the art will understand that these blocks, units, and / or modules are physically implemented via electronic (or optical) circuitry (e.g., logic circuitry), discrete components, microprocessors, hardwired circuitry, memory elements, wiring connections, etc., which can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. Where blocks, units, and / or modules are implemented via microprocessors or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and can optionally be driven by firmware and / or software. It is also conceivable that each block, unit, and / or module can be implemented via dedicated hardware, or a combination of dedicated hardware performing some functions and processors performing other functions (e.g., one or more programmed microprocessors and associated circuitry). Furthermore, without departing from the inventive concept, each block, unit, and / or module in some embodiments may be physically divided into two or more interactive and discrete blocks, units, and / or modules. Furthermore, without departing from the inventive concept, some implementation blocks, units and / or modules can be physically combined into more complex blocks, units and / or modules.

[0038] The various implementation schemes will be explained in detail below with reference to the accompanying drawings.

[0039] Figure 1 This is a cross-sectional view showing an electronic product according to an implementation scheme. Figure 2 This shows the implementation scheme. Figure 1 A cross-sectional view showing the deformation of the external shape of an electronic product. Figure 3 This shows the implementation scheme. Figure 1 A cross-sectional view showing the deformation of the external shape of an electronic product. Figure 4 This illustrates the application of the implementation scheme to... Figure 1 A cross-sectional view of the external pressure on the electronic product.

[0040] Electronic products include, for example, machines, electrical appliances, devices, and components thereof that operate by electric current or magnetic fields. Examples of electronic products may include, but are not limited to, smartphones, mobile phones, tablet computers (PCs), personal digital assistants (PDAs), portable multimedia players (PMPs), televisions, game consoles, watch-type electronic devices, head-mounted displays, PC monitors, laptops, billboards, electric vehicles, various medical devices, various household appliances (such as refrigerators, washing machines, etc.), Internet of Things (IoT) devices, etc.

[0041] Electronic products may include structures that perform various functions and may include adhesives for bonding various components. Adhesives may be provided in the form of adhesive layers, adhesive sheets, adhesive films, etc., disposed between various components. Although for the sake of simplicity... Figures 1 to 4 The illustration shows an electronic product comprising two structures and an adhesive layer for adhering the two structures, but the embodiments are not limited thereto, and the electronic product may include three or more structures and / or two or more adhesive layers.

[0042] refer to Figures 1 to 3 According to one example, an electronic product 1 may include a first structure 10, an adhesive layer 20 disposed on the first structure 10, and a second structure 30 disposed on the adhesive layer 20.

[0043] Each of the first structure 10 and the second structure 30 can be provided in various forms, such as layers, films, sheets, plates, etc. Furthermore, each of the first structure 10 and the second structure 30 can be formed of one layer or two or more layers. When each of the first structure 10 and the second structure 30 is formed of two or more layers, they can be made of the same material or different materials.

[0044] Each of the first structure 10 and the second structure 30 may be made of at least one of transparent material, opaque material and translucent material, or may be made of two or more of at least one of transparent material, opaque material and translucent material.

[0045] Each of the first structure 10 and the second structure 30 may possess any of a variety of properties (e.g., elasticity, plasticity, hardness, stiffness, ductility, brittleness, etc.). Each of the first structure 10 and the second structure 30 may be formed of two or more layers, and when they are made of different materials, they may possess two or more of the aforementioned properties. Furthermore, the first structure 10 and the second structure 30 may possess different properties among the aforementioned properties, or they may possess at least one of the same properties.

[0046] Each of the first structure 10 and the second structure 30 can perform any one or more functions. For example, they can perform at least one of various functions (e.g., emitting electromagnetic signals, insulating for electrical isolation, supporting or substrate for supporting other layers, optical functions, buffering functions, preventing external material penetration, shielding for shielding electromagnetic signals, heat dissipation for releasing heat, and emitting light through electrical signals), or they can perform two or more of a variety of non-limiting functions. Furthermore, the first structure 10 and the second structure 30 can perform different functions, or they can perform at least one of the same functions.

[0047] As described above, the first structure 10 and the second structure 30 can have various structures, shapes, materials, functions, properties, and the various examples described above are for illustrative purposes only, but the implementation is not limited thereto.

[0048] The adhesive layer 20 can be used to adhere the first structure 10 and the second structure 30. The adhesive layer 20 can be a UV-curable adhesive that is cured by ultraviolet (UV) light, unlike pressure-sensitive adhesives (PSA) in which the adhesive material is activated by pressure.

[0049] Although each of the first structure 10, the second structure 30, and the adhesive layer 20 is shown to have a rectangular cross-sectional shape, they can have various cross-sectional shapes, such as polygonal shapes (e.g., square, triangular, and pentagonal shapes), circular shapes, elliptical shapes, etc.

[0050] Electronic product 1 can be designed such that its external shape can be deformed by a user to improve space utilization or portability. For example, electronic product 1 can be designed such that at least a portion of electronic product 1 can be stretched by an applied tensile force, such as... Figure 2 As shown in the figure. Furthermore, electronic product 1 can be designed such that at least a portion of electronic product 1 can be bent, such as... Figure 3 As shown in the figure. Although not shown, electronic product 1 can be designed such that its external shape can be varied to form various shapes, such as rolled-up shapes, twisted shapes, etc.

[0051] When the external shape of electronic product 1 is deformed, the external shapes of the first structure 10 and the second structure 30 of electronic product 1 can also be deformed, and the external shape of the adhesive layer 20 disposed between the first structure 10 and the second structure 30 can also be designed to be deformable. However, in some cases, it may be desirable to design electronic product 1 such that the deformation of its external shape is not permanent, and that the external shape of electronic product 1 can return to its original shape. In this case, adhesive layer 20 is designed to be easily deformable and easily return to its original shape before deformation. The value of the storage modulus of adhesive layer 20 can be controlled to exhibit such properties. Here, storage modulus refers to the energy stored without loss due to the elasticity of the material.

[0052] The adhesive layer 20 can have a storage modulus G' from 0.05 MPa to 0.3 MPa, making it easily deformable and possessing restoring force to its original shape before deformation. When the adhesive layer 20 has a storage modulus greater than 0.3 MPa, it is not easily bent and may buckle or peel off. When the adhesive layer 20 has a storage modulus less than 0.05 MPa, it is easily deformable, but it may suffer significant energy loss due to repeated deformation, making it difficult to maintain its original external shape.

[0053] In addition, pressure can be applied to the electronic product 1 through other objects or a part of the human body (e.g., a finger), such as Figure 4 As shown in the diagram. In this case, the adhesive layer 20, as well as the first structure 10 and / or the second structure 30, can be deformed by external pressure. The storage modulus can be controlled so that the deformed adhesive layer 20 can be restored to its original shape by removing the external pressure. Therefore, the adhesive layer 20 can have a storage modulus of 0.05 MPa to 0.2 MPa, which is beneficial for the adhesive layer not to be permanently deformed due to the restoring force even when external pressure is repeatedly applied. Here, external pressure can refer to a force of about 5 N to 20 N (Newtons).

[0054] Electronic product 1 can be used in various temperature environments. For example, electronic product 1 can be used in environments ranging from low temperatures of -20°C to room temperatures of 25°C. Therefore, the storage modulus of adhesive layer 20 can be controlled so that the product is easily deformable in various temperature environments and has restorative force even when external pressure is applied, as described above. For example, adhesive layer 20 can have a storage modulus of 0.05 MPa to 0.3 MPa in a temperature range of -20°C to 25°C. For example, adhesive layer 20 can have a storage modulus of 0.08 MPa to 0.3 MPa at low temperatures such as -20°C to allow the display device to be easily bent, and can have a storage modulus of 0.05 MPa to 0.2 MPa at room temperatures such as 25°C to prevent permanent deformation caused by external pressure. However, the storage modulus of a material with viscoelastic properties (such as adhesive layer 20, for example, a material that has viscosity and elasticity when its external shape is deformed) can vary depending on the temperature.

[0055] Figure 5 This shows the implementation scheme. Figure 1 Figures showing various examples of temperature-dependent storage modulus of the adhesive layer.

[0056] The storage modulus of the adhesive layer 20 can change linearly or non-linearly with temperature. For example, the storage modulus of the adhesive layer 20 can decrease with increasing temperature, such as in... Figure 5In the second sample SP2 and the third sample SP3, the value may increase with increasing temperature, as in... Figure 5 In the fourth sample SP4. Furthermore, the adhesive layer 20 can have a constant storage modulus over a temperature range of at least -20°C to 25°C, as in Figure 5 In the first sample SP1.

[0057] For example, the first sample SP1 has a constant storage modulus of 0.1 MPa in the temperature range of -20℃ to 25℃, and the ratio of the storage modulus at -20℃ to that at 25℃ can be 1. The second sample SP2 has storage moduli of 0.3 MPa at -20℃ and 0.05 MPa at 25℃, and the ratio of the storage modulus at -20℃ to that at 25℃ can be 6. The third sample SP3 has storage moduli of 0.2 MPa at -20℃ and 0.1 MPa at 25℃, and the ratio of the storage modulus at -20℃ to that at 25℃ can be 2. The storage modulus of the fourth sample SP4 at -20℃ and at 25℃ are 0.08MPa and 0.09MPa, respectively, and the ratio of the storage modulus at -20℃ to that at 25℃ can be about 0.89.

[0058] Since the storage modulus of the adhesive layer 20 can vary with temperature, the ratio of the storage modulus of the second sample SP2 at -20°C to that at 25°C can be 6 or greater, which is relatively large compared to other samples such as the first, third, and fourth samples SP1, SP3, and SP4. However, an adhesive layer 20 in which the ratio of the storage modulus at -20°C to that at 25°C is 0.5 to 2 can be used, which is beneficial for uniformly maintaining the property that the adhesive layer 20 is easily deformable in the temperature range of -20°C to 25°C and has sufficient resilience even when external pressure is applied. In some embodiments, the ratio of the storage modulus of the adhesive layer 20 at -20°C to that at 25°C can be 0.8 to 1.2.

[0059] Because the adhesive layer 20 according to the embodiment has a storage modulus of 0.05 MPa to 0.3 MPa in a temperature range of -20°C to 25°C, and the ratio of the storage modulus at -20°C to the storage modulus at 25°C is 0.5 to 2, it is easily deformable in the temperature range of -20°C to 25°C, thus preventing the adhesive layer 20 from buckling or peeling due to deformation. Furthermore, this can help prevent the adhesive layer 20 from permanent deformation due to pressure from other objects or a part of the human body.

[0060] Properties, such as the magnitude of the storage modulus of the adhesive layer 20 or the change of the storage modulus with respect to temperature, can be controlled in various ways. For example, the adhesive layer 20 may comprise vinylsilane, hydrosilane, and silane-CH2-CH2-silane formed by combining vinylsilane with hydrosilane, such that the adhesive layer 20 can have a storage modulus of 0.05 MPa to 0.3 MPa in a temperature range of -20°C to 25°C by adjusting the content of the composition and / or the content of the crosslinking agent, and the ratio of the storage modulus at -20°C to the storage modulus at 25°C can be adjusted to 0.5 to 2. The adhesive layer 20 will be described in more detail below.

[0061] Adhesive layer 20 may comprise vinylsilane and hydrosilane as a UV-curable adhesive. When irradiated with ultraviolet light, the vinylsilane and hydrosilane can bond to form silane-CH2-CH2-silane, as shown in Formula 1. Specifically, when irradiated with ultraviolet light, the hydrogen atom of the hydrosilane can bond to the CH=CH2 bond of the vinylsilane. Because the vinylsilane and hydrosilane bond to silane-CH2-CH2-silane, adhesive layer 20 can be cured.

[0062] Chemical Formula 1

[0063]

[0064] Since the adhesive layer 20 contains silane-CH2-CH2-silane formed after curing, the ratio of its storage modulus at -20°C to its storage modulus at 25°C can be from 0.5 to 2.0. Furthermore, by adjusting the average molecular weight of the cured adhesive layer 20, the adhesive layer 20 can have a storage modulus of 0.08 MPa to 0.3 MPa at low temperatures (e.g., -20°C) and a storage modulus of 0.05 MPa to 0.2 MPa at room temperature (e.g., 25°C).

[0065] The storage modulus at -20°C and at 25°C, as well as the ratio of the storage modulus at -20°C to that at 25°C, can be controlled by adjusting the content of vinylsilane and hydrosilane, and the molecular weight of the cured adhesive layer 20. For example, the storage modulus can be increased when the content of vinylsilane and hydrosilane and / or the molecular weight of the cured adhesive layer 20 increases.

[0066] In some embodiments, the adhesive layer 20 may further comprise a crosslinking agent and / or a reaction delay agent.

[0067] Crosslinking agents can be used to crosslink polymer chains to adjust the mechanical strength, such as hardness or elasticity, of the adhesive layer 20. For example, the crosslinking agent may include at least one of vinyl silanes, hydroxysilanes, alkoxysilanes, and epoxysilanes. For instance, vinyl silanes as crosslinking agents can perform crosslinking. The storage modulus of the adhesive layer 20 can increase with increasing crosslinking agent content. Therefore, the storage modulus can be adjusted by regulating the crosslinking agent content.

[0068] Reaction retarders are used to inhibit silane-CH2-CH2-silane bonding between vinylsilanes and hydrosilanes. For example, reaction retarders may include at least one of triphenylphosphine, tributylamine, tetramethylethylenediamine, benzotriazole, ethynylene glycol, peroxide compounds, and maleic acid.

[0069] Because the adhesive layer 20 may contain a reaction delay agent, it can remain in a semi-cured state for approximately 30 minutes to 1 hour after exposure to ultraviolet light. The adhesive layer 20 can maintain its adhesive strength in the semi-cured state. Therefore, the adhesive layer 20 in its semi-cured state can attach the second structure 30 to the first structure 10.

[0070] Figure 6 This is a flowchart illustrating a method for forming an adhesive layer according to an embodiment. Figure 7 , Figure 8 and Figure 9 This is a cross-sectional view illustrating a method for forming an adhesive layer according to an embodiment. Reference will be made below. Figures 6 to 9 A more detailed description of the formation Figure 1 Methods for adhesive layers.

[0071] First, such as Figure 7 As shown, a liquid adhesive comprising vinylsilane, hydrosilane and a reaction delay agent is applied to the first structure 10 (step S110).

[0072] The adhesive can be applied in a liquid solution state using at least one of various methods, such as inkjet printing, inkjet injection, slot coating, and slot printing. Because the adhesive is applied in a liquid state, the surface of the adhesive layer 20 can become flat over a predetermined period of time. This predetermined period of time can be approximately 1 minute to 5 minutes.

[0073] Next, as Figure 8 As shown, ultraviolet (UV) rays are irradiated onto the adhesive layer 20 (step S120).

[0074] Due to ultraviolet (UV) irradiation, adhesive layer 20 may contain silane-CH2-CH2-silane produced by the reaction of vinylsilane and hydrosilane. In this way, adhesive layer 20 can be cured. However, due to the inclusion of a reaction delay agent, adhesive layer 20 can remain in a semi-cured state for approximately 30 minutes to 1 hour after UV irradiation. Therefore, adhesive layer 20 can maintain its adhesive strength for approximately 30 minutes to 1 hour after UV irradiation.

[0075] Next, as Figure 9 As shown, the second structure 30 is disposed on the adhesive layer 20 (step S130).

[0076] Although not limited to the following, the second structure 30 can be disposed on the adhesive layer 20 within approximately 30 minutes to 1 hour after the adhesive layer 20 is irradiated with ultraviolet light. For example, the second structure 30 can be disposed on the adhesive layer 20 in a semi-cured state before the adhesive layer 20 is fully cured, so that the first structure 10 and the second structure 30 can be adhered.

[0077] In another example, when the first structure 10 is transparent, the first structure 10 and the second structure 30 can be adhered through the adhesive layer 20 by providing the first structure 10 on an adhesive layer 20 in a liquid state and then curing the adhesive layer by irradiating it with ultraviolet light.

[0078] Since the adhesive layer 20 used for bonding the first structure 10 and the second structure 30 comprises a UV-curable adhesive containing silane-CH2-CH2-silane, the adhesive layer 20 has a storage modulus of 0.05 MPa to 0.3 MPa in a temperature range of -20°C to 25°C, and the ratio of the storage modulus at -20°C to the storage modulus at 25°C is 0.5 to 2. Therefore, it is advantageous to uniformly maintain the property that the adhesive layer 20 is easily deformable within the temperature range described above and has resilience even when external pressure is applied.

[0079] Figure 10 It is a perspective view of the display device according to the implementation plan. Figure 11 This shows the implementation scheme. Figure 10 A diagram showing the folded state of the display device. Figure 12 This shows the implementation scheme. Figure 10 A cross-sectional view of the display device.

[0080] The following describes a more specific implementation where the display device is an electronic product. However, the implementation is not limited to a display device and can be applied to other electronic products, such as the various electronic products described above.

[0081] Furthermore, a foldable display device can be an example of a display device whose external shape is deformable. A foldable display device can be bent, folded, and unfolded by a user, and touch input can be supported using a part of the body (e.g., a finger) or an external object (e.g., an electronic pen). Therefore, in the following description, a foldable display device will be described as one embodiment suitable for describing an adhesive layer whose external shape is deformable but prevents permanent deformation due to external pressure. Although not specifically shown in the accompanying drawings, similar to foldable display devices, various types of flexible display devices, such as bendable display devices, rollable display devices, torsionable display devices, and stretchable display devices, can have deformable external shapes and can be subjected to external pressure. Therefore, it can be understood that the following can be applied in substantially the same way to various types of flexible display devices.

[0082] exist Figures 10 to 12 The diagram illustrates a first direction X, a second direction Y, and a third direction Z. In a plan view, the first direction X can be parallel to one side of the display device 2, and can be, for example, the horizontal direction of the display device 2. The second direction Y can be parallel to another side of the display device 2 that contacts one side, and can be, for example, the vertical direction of the display device 2. The third direction Z can be the thickness direction of the display device 2. However, it should be understood that the directions mentioned in the various embodiments refer to relative directions, and the embodiments are not limited to the mentioned directions.

[0083] refer to Figure 10 and Figure 11 The display device 2 can be formed in a generally rectangular or square shape in a plan view. In a plan view, the display device 2 can have a rectangular shape including rounded corners or right angles, but the embodiment is not limited to this. The display device 2 may include four sides or edges, but the embodiment is not limited to this.

[0084] At least one of the front surface and the rear surface of the display device 2 may be a display surface. Here, "front surface" means a surface located on one side of a plane (a surface), and "rear surface" means a surface located on the other side of a plane (another surface; a surface opposite to a surface).

[0085] In one embodiment, the display surface may be located on the front surface of the display device 2, and the image may not be displayed on the rear surface. Such embodiments will be primarily described below, but the display device 2 may be a double-sided display device 2, wherein the image is displayed on both the front and rear surfaces.

[0086] Display device 2 includes an active area AR and an active area NAR. In display device 2, it is assumed that the area in which the screen is displayed is defined as the display area, the area in which the screen is not displayed is defined as the non-display area, and the area in which touch input of a part of the body (e.g., a finger) is detected is defined as the touch area. The display area and the touch area can be included in the active area AR. The display area and the touch area can overlap each other. For example, the active area AR can be the area in which the screen is displayed and the touch input is detected. The active area AR can have a rectangular shape or a rectangular shape with rounded corners. An example active area AR has a rectangular shape with right angles, and its length in the first direction X is longer than its length in the second direction Y. However, the implementation is not limited to this, and the active area AR can have various shapes, such as a rectangular shape, a square shape, other polygonal shapes, circular shapes, elliptical shapes, etc., in which the length in the second direction Y is longer than its length in the first direction X.

[0087] Active area AR can include multiple pixels. A pixel is a basic unit for displaying on a screen. Pixels can include, but are not limited to, red pixels, green pixels, and blue pixels configured to display red, green, and blue, respectively. Pixels can further include white pixels configured to display white. Multiple pixels can be arranged alternately in a planar view. For example, pixels can be arranged in a matrix, but the implementation is not limited to this.

[0088] Since the active region AR includes a touch area, pressure can be applied when a part of the body comes into contact with the front surface. At least one adhesive layer located in the active region AR can have a storage modulus sufficient to deform the external shape by the pressure of touch and to restore the original shape before the pressure was applied by removing the pressure.

[0089] The non-active area NAR can be positioned around the active area AR. The non-active area NAR can surround all sides of the active area AR (the four sides in the attached figure). However, the implementation is not limited to this, and the active area AR can be partially surrounded by the non-active area NAR. For example, the non-active area NAR can be positioned only around three sides of the display area. In this case, the other side of the display area can form the edge of the display device 2.

[0090] In the passive area NAR, signal lines and / or drive circuits for applying signals to the active area AR (display area or touch area) can be provided. The passive area NAR may not include a display area. A black matrix can be provided in the passive area NAR to prevent light leakage emitted from adjacent pixels. Furthermore, the passive area NAR may not include a touch area. In other embodiments, the passive area NAR may include a portion of the touch area. In this case, external pressure is applied by touch, such that at least one adhesive layer located in the passive area NAR can have a storage modulus sufficient to deform the external shape by pressure from the touch and restore the original shape before the pressure was applied by removing the pressure.

[0091] The display device 2 may be a foldable display device 2 capable of maintaining both a folded and unfolded state. The display device 2 may include at least one adhesive layer, as described later. The at least one adhesive layer disposed across the first non-folded region NFA1, the folded region FDA, and the second non-folded region NFA2 may have a storage modulus that allows the display device 2 to be easily deformed to maintain both a folded and unfolded state and to return to its pre-folded state.

[0092] In one embodiment, the display device 2 can be folded inward, wherein the display surface is disposed on its interior, such as... Figure 11 As shown in the figure. When the display device 2 is folded inward, the front surfaces of the display device 2 can face each other. In another example, the display device 2 can be folded outward, wherein the display surface is disposed on its exterior. When the display device 2 is folded outward, the rear surfaces of the display device 2 can face each other.

[0093] The display device 2 may include a folding region FDA, a first non-folding region NFA1, and a second non-folding region NFA2. The folding region FDA may be an area in which the display device 2 is folded or bent, and the first and second non-folding regions NFA1 and NFA2 may be areas in which the display device 2 is not folded or bent.

[0094] The first non-foldable region NFA1 can be located on one side of the foldable region FDA, and the second non-foldable region NFA2 can be located on the other side of the foldable region FDA.

[0095] The folded region FDA can be defined by a first fold line FL1 and a second fold line FL2. The first fold line FL1 can correspond to the boundary between the folded region FDA and the first non-folded region NFA1, and the second fold line FL2 can correspond to the boundary between the folded region FDA and the second non-folded region NFA2.

[0096] Each of the first fold line FL1 and the second fold line FL2 can be a straight line. In one embodiment, the first fold line FL1 and the second fold line FL2 can span the display device 2 along a second direction Y. The first fold line FL1 and the second fold line FL2 can have a constant gap therebetween in the extending direction.

[0097] The lengths of the first fold line FL1 and the second fold line FL2 can be the same and equal to the width of the folded region FDA in the second direction Y. The widths of the first non-folded region NFA1 and the second non-folded region NFA2 in the second direction Y can be the same and equal to the width of the folded region FDA in the second direction Y. However, the implementation is not limited to the above examples.

[0098] When the first fold line FL1 and the second fold line FL2 extend in the second direction Y, the width of the folded region FDA in the first direction X can be less than the width of the folded region FDA in the second direction Y. The width of the folded region FDA in the first direction X can be less than the width of the first non-folded region NFA1 in the first direction X and the width of the second non-folded region NFA2 in the first direction X.

[0099] The width of the first non-folded region NFA1 in the first direction X and the width of the second non-folded region NFA2 in the first direction X can be the same, but the implementation is not limited to this. Furthermore, the width of the first non-folded region NFA1 in the first direction X and the width of the second non-folded region NFA2 in the first direction X can be smaller than the width of the first non-folded region NFA1 in the second direction Y and the width of the second non-folded region NFA2 in the second direction Y, but the implementation is not limited to this.

[0100] Each of the active region AR and the non-active region NAR can overlap at least one of the folded region FDA, the first non-folded region NFA1, and the second non-folded region NFA2. Figure 10 and Figure 11 Examples are given for each overlapping folded region FDA, the first non-folded region NFA1, and the second non-folded region NFA2 in the active region AR and the non-active region NAR. For example, as shown... Figure 10 and Figure 11 As illustrated, each of the active region AR and the non-active region NAR can be arranged continuously regardless of the boundaries of the folded region FDA, the non-folded region FDA, fold lines, etc.

[0101] refer to Figure 12The display device 2 may include a display panel 100, a front stack structure 200 disposed on the front surface of the display panel 100, and a rear stack structure 300 disposed on the rear surface of the display panel 100. Each of the front stack structure 200 and the rear stack structure 300 may include at least one adhesive layer to be adhered to the display panel 100.

[0102] Display panel 100 is a panel used to display a screen or image. Examples of display panel 100 may include not only self-emissive display panels (e.g., organic light-emitting diode (OLED) panels, inorganic electroluminescent (EL) display panels, quantum dot light-emitting diode (QED) display panels, micro-LED display panels, nano-LED display panels, plasma display panels (PDP), field emission display panels (FED), and cathode ray tube (CRT) display panels), but also light-receiving display panels (e.g., liquid crystal display (LCD) panels and electrophoretic display (EPD) panels). Hereinafter, the organic light-emitting display panel as display panel 100 will be referred to as display panel 100. However, embodiments are not limited to organic light-emitting display panels, and other display panels mentioned above or known in the art may be used.

[0103] Figure 13 This is a cross-sectional view showing an example of a display panel according to an implementation scheme.

[0104] refer to Figure 13 The display panel 100 may include a substrate SUB, a circuit driving layer DRL on the substrate SUB, a light emitting layer EML on the circuit driving layer DRL, an encapsulation layer ENL on the light emitting layer EML, and a touch layer TSL on the encapsulation layer EML.

[0105] The substrate SUB can be a flexible substrate comprising a flexible polymer material, such as polyimide. Therefore, the display panel 100 can be bent, folded, twisted, or rolled. In some embodiments, the substrate SUB may include a plurality of sub-substrates overlapping in the thickness direction, with a barrier layer interposed therebetween. In this case, each sub-substrate may be a flexible substrate.

[0106] The circuit driving layer DRL can be disposed on the substrate SUB. The circuit driving layer DRL may include circuitry for driving the light-emitting layer EML of the pixel. The circuit driving layer DRL may include multiple thin-film transistors and one or more capacitors, but the implementation is not limited thereto.

[0107] The emissive layer (EML) can be disposed on the circuit driving layer (DRL). The EML can include organic light-emitting elements. Based on the driving signal transmitted from the DRL, the EML can emit light with various brightness levels.

[0108] An encapsulation layer (ENL) may be disposed on the light-emitting layer (EML). The encapsulation layer (ENL) may include at least one inorganic layer to prevent oxygen or moisture from penetrating into the light-emitting layer (EML). In addition, the encapsulation layer (ENL) may include at least one organic layer to protect the light-emitting layer (EML) from foreign substances such as dust.

[0109] A touch layer (TSL) can be disposed on an encapsulation layer (ENL). The touch layer (TSL) is a layer used to recognize touch input and can function as a touch component. The touch layer (TSL) can include a touch area located in the active region (AR) and a non-touch area located in the non-active region (NAR). The shapes of the touch area and the non-touch area can be substantially the same as the shapes of the active region AR and the non-active region NAR described above, but the implementation is not limited thereto, and at least a portion of the non-active region NAR can include a touch area. The touch layer (TSL) can include multiple sensing areas and sensing lines. The sensing areas and sensing lines can be arranged within the touch area.

[0110] Figure 13 The illustration shows a case where the touch component is integrated into (or as part of) the display panel 100 in the form of a touch layer (TSL), but the implementation is not limited to this. For example, the touch component may be provided as a panel separate from the display panel 100 or as a film and attached to the display panel 100. In this case, the touch component may be included in the front stack structure 200.

[0111] review Figure 12 The front stack structure 200 and rear stack structure 300 disposed on the display panel 100 may include layers that perform different functions. The front stack structure 200, on which a screen is displayed, may include, for example, a window 220, a window protective film 230, a polarizing film 210, and / or adhesive layers 241 to 243 for adhering them. Since the screen is displayed on the front surface of the display panel 100, the window 220, window protective film 230, polarizing film 210, and adhesive layers 241 to 243 included in the front stack structure 200 may be transparent. The rear stack structure 300 disposed on the rear surface of the display panel 100, on which no screen is displayed, may include a panel under-panel protective film 310, a cushioning member 320, a support member 330, a digitizer layer 340, a shielding member 350, and / or adhesive layers 361 to 365 for adhering them.

[0112] In some embodiments, the polarizing film 210 can be attached to the front surface of the display panel 100 via a third adhesive layer 243. The polarizing film 210 can be used to reduce the reflection of external light.

[0113] Window 220 can be disposed on polarizing film 210. Window 220 can be made of a transparent material and can include, for example, glass or plastic. When window 220 includes glass, ultrathin glass (UTG) with a thickness of 0.1 mm or less can be applied to provide flexibility. When window 220 includes plastic, window 220 can include a transparent polyimide film, but the embodiment is not limited thereto. Window 220 can be attached to the front surface of polarizing film 210 via a second adhesive layer 242.

[0114] A window protective film 230 may be applied to the window 220. The window protective film 230 may be adhered to the front surface of the window 220 via a first adhesive layer 241. The window protective film 230 may perform at least one of the following functions on the window 220: preventing scattering, absorbing impact, preventing scratches, and preventing glare. The window protective film 230 may comprise a resin and / or film with flexible properties.

[0115] The aforementioned front stacking structure 200 can be disposed across the first non-folding region NFA1, the folding region FDA, and the second non-folding region NFA2 of the display device 2. Therefore, at least one of the first to third adhesive layers 241 to 243 can have a storage modulus of 0.05 MPa to 0.3 MPa to facilitate folding and restoration to the original shape before folding.

[0116] Because the polarizing film 210, window 220, and window protective film 230 are flexible, the external shape of the first to third adhesive layers 241 to 243 used to adhere them can deform when external pressure is applied from the front surface of the display device 2. Therefore, at least one of the first to third adhesive layers 241 to 243 can have a storage modulus of 0.05 MPa to 0.3 MPa, so that even if deformation occurs due to external pressure, permanent deformation is prevented due to restoring force. Since external pressure is applied from the front surface of the display device 2, when the first adhesive layer 241 used to adhere the window protective film 230 and window 220 has a storage modulus of 0.05 MPa to 0.3 MPa, it is advantageous to prevent deformation of the first adhesive layer 241 caused by external pressure from being reflected in the front surface of the display device 2 and recognized by the user.

[0117] At least one of the first to third adhesive layers 241 to 243 can substantially adhere to Figure 1 The adhesive layers are identical. For example, at least one of the first to third adhesive layers 241 to 243 (which is a transparent UV-curable adhesive containing vinylsilane and hydrosilane) is cured by ultraviolet light, and therefore may contain silane-CH2-CH2-silane.

[0118] For example, the first adhesive layer 241 can substantially adhere to... Figure 1The first adhesive layer 241 is identical to the second adhesive layer 242 and the third adhesive layer 243, and each of the other adhesive layers 242 and 243 may comprise a transparent adhesive film or a transparent adhesive resin. Furthermore, the first adhesive layer 241 and any one of the second adhesive layer 242 and the third adhesive layer 243 may be substantially the same as... Figure 1 The adhesive layer 20 is identical to the first adhesive layer 241, and another may comprise a transparent adhesive film or a transparent adhesive resin. Alternatively, all first to third adhesive layers 241 to 243 may be substantially the same as the first adhesive layer 241. Figure 1 The adhesive layer 20 is the same.

[0119] Compared to when any one of the first to third adhesive layers 241 to 243 contains a UV-curable adhesive containing silane-CH2-CH2-silane, when at least two of the first to third adhesive layers 241 to 243 contain a UV-curable adhesive containing silane-CH2-CH2-silane, it is more advantageous to prevent permanent deformation even when external pressure is applied from the front surface of the display device 2.

[0120] Each of the first to third adhesive layers 241 to 243 may have a thickness of 10 μm to 100 μm. When the first to third adhesive layers 241 to 243 have a thickness of less than 10 μm, they are easily deformed but may not easily return to their original shape. Furthermore, when the first to third adhesive layers 241 to 243 have a thickness of more than 100 μm, it may be difficult to bend the display device 2, and buckling or peeling may occur due to repeated deformation.

[0121] A lower protective film 310 can be disposed on the rear surface of the display panel 100. The lower protective film 310 can be adhered to the rear surface of the display panel 100 via a fourth adhesive layer 361. The lower protective film 310 can be used to support the display panel 100 and protect the rear surface of the display panel 100. The lower protective film 310 can be, but is not limited to, a plastic film, such as polyethylene terephthalate (PET) film.

[0122] A cushioning member 320 may be disposed on the rear surface of the lower protective film 310 of the panel. The cushioning member 320 may be attached to the rear surface of the lower protective film 310 of the panel via a fifth adhesive layer 362. The cushioning member 320 may absorb external impacts applied from the rear surface of the display device 2 to prevent damage to the display panel 100. The cushioning member 320 may comprise an elastic material (e.g., rubber), a urethane-based material, or a foam molded from an acrylic-based material, etc.

[0123] The support member 330 may be disposed on the rear surface of the buffer member 320. The support member 330 may be attached to the rear surface of the buffer member 320 via a sixth adhesive layer 363. The support member 330 may be used to support the display panel 100 and the lower protective film 310 of the panel and to protect the rear surface of the display panel 100. In addition, the support member 330 may be disposed on the front surface of the digitizer layer 340, which will be described later, to support the digitizer layer 340 and to protect the front surface of the digitizer layer 340.

[0124] The support member 330 may be made of a rigid material. The support member 330 may contain, but is not limited to, at least one metallic material, such as iron, chromium, nickel, and manganese, or may contain stainless steel (SUS) as an alloy thereof. The support member 330 may include at least one opening provided in the folding area FDA to allow the display device 2 to be easily folded.

[0125] A digitizer layer 340 may be disposed on the rear surface of the support member 330. The digitizer layer 340 may be attached to the rear surface of the support member 330 via a seventh adhesive layer 364. The digitizer layer 340 may include conductive patterns for detecting the proximity or contact of an electronic pen, such as an electromagnetic resonance (EMR) stylus. The conductive patterns of the digitizer layer 340 may be configured to detect magnetic or electromagnetic signals. For example, when the electronic pen is located on the front surface of the display device 2 and is used to generate a magnetic field or electromagnetic signal, the generated magnetic field or electromagnetic signal may be input to the conductive patterns of the digitizer layer 340. The digitizer layer 340 may analyze the magnitude of the magnetic field or electromagnetic signal input at each location to determine the coordinates of the electronic pen input.

[0126] In the case where the display device 2 includes a digitizer layer 340 for supporting input with an electronic pen, pressure can be applied to the front surface of the display device 2 when the user touches or places the electronic pen on the front surface of the display device 2. Therefore, as described above, at least one of the first to third adhesive layers 241 to 243 may have a storage modulus of 0.05 MPa to 0.3 MPa so that even if deformation occurs due to external pressure, permanent deformation is prevented due to restoring force.

[0127] Figure 14 It is an exploded perspective view of the digitizer layer according to the implementation plan. Figure 15 It is based on the implementation plan. Figure 14 A cross-sectional view of the digitizer layer.

[0128] refer to Figure 14 and Figure 15According to one example, the digitizer layer 340 may include a base layer 341, a first conductive pattern 342 disposed on the front surface of the base layer 341, a first bonding member 344 disposed on the front surface of the first conductive pattern 342, a first cover layer 346 disposed on the front surface of the first bonding member 344, a second conductive pattern 343 formed on the rear surface of the base layer 341, a second bonding member 345 disposed on the rear surface of the second conductive pattern 343, and a second cover layer 347 disposed on the rear surface of the second bonding member 345.

[0129] The substrate 341 can serve as a base on which the first conductive pattern 342 and the second conductive pattern 343 are disposed. The substrate 341 may contain an insulating material. For example, the substrate 341 may contain polyimide, but the embodiments are not limited thereto.

[0130] First conductive patterns 342 may be arranged on the front surface of the base layer 341. Each first conductive pattern 342 may extend along a second direction Y. The first conductive patterns 342 may be arranged along a first direction X (or spaced apart from each other). Each first conductive pattern 342 may have a planar shape with a closed-loop structure (e.g., rectangular).

[0131] The second conductive pattern 343 can be disposed on the rear surface of the base layer 341. Each second conductive pattern 343 can extend along a first direction X. The second conductive pattern 343 can be disposed along a second direction Y. Each second conductive pattern 343 can have a planar shape with a closed-loop structure (e.g., rectangular).

[0132] Despite Figure 14 The illustration shows that each of the first conductive pattern 342 and the second conductive pattern 343 has a rectangular closed-loop structure in a plan view, but the embodiments are not limited thereto, and each of the first conductive pattern 342 and the second conductive pattern 343 may have a loop structure of various shapes in a plan view, such as polygonal shapes (e.g., rhomboid, pentagonal and hexagonal shapes), circular shapes and / or elliptical shapes.

[0133] Each of the first conductive pattern 342 and the second conductive pattern 343 may contain a metallic material, such as copper (Cu), silver (Ag), nickel (Ni), tungsten (W), etc.

[0134] Each first conductive pattern 342 and each second conductive pattern 343 may intersect each other in a plan view. Magnetic fields or electromagnetic signals emitted from the electronic pen may be absorbed by the first conductive patterns 342 and 343, and the position of the electronic pen relative to the first digitizer layer 340 may be determined due to the intersecting structure described above.

[0135] In some embodiments, at least a portion of the first conductive pattern 342 and the second conductive pattern 343 can generate a magnetic field in response to an input current, and the generated magnetic field or electromagnetic signal can be absorbed by the electronic pen. The electronic pen can re-emit the absorbed magnetic field, and the magnetic field emitted by the electronic pen can be absorbed by the first conductive pattern 342 and the second conductive pattern 343. The first conductive pattern 342 and the second conductive pattern 343 can convert the magnetic field or electromagnetic signal output from the electronic pen into an electrical signal.

[0136] A first cover layer 346 may be disposed on a first conductive pattern 342. The first cover layer 346 may comprise an insulating material. For example, the first cover layer 346 may comprise polyimide. The first cover layer 346 may be attached to the base layer 341 and the first conductive pattern 342 by means of a first bonding member 344 comprising, for example, a pressure-sensitive adhesive.

[0137] A second cover layer 347 may be disposed on the rear surface of the second conductive pattern 343. The second cover layer 347 may comprise an insulating material. For example, the second cover layer 347 may comprise polyimide. The second cover layer 347 may be adhered to the rear surface of the base layer 341 and the second conductive pattern 343 by means of a second bonding member 345 comprising, for example, a pressure-sensitive adhesive.

[0138] review Figure 12 The shielding member 350 can be disposed on the rear surface of the digitizer layer 340. The shielding member 350 can be attached to the rear surface of the digitizer layer 340 via the eighth adhesive layer 365. Since the shielding member 350 can contain magnetic metal powder (MMP), magnetic fields or electromagnetic signals that have passed through the digitizer layer 340 can flow into the shielding member 350. Therefore, the shielding member 350 can reduce the emission of magnetic fields or electromagnetic signals to the rear surface of the display device 2.

[0139] The fourth to eighth adhesive layers 361, 362, 363, 364 and 365 used for attaching the post-stacked structure 300 described above may contain, for example, pressure-sensitive adhesives, but the embodiments are not limited thereto.

[0140] Despite Figure 11 The rear stack structure 300 is illustrated across a first non-folding region NFA1, a folding region FDA, and a second non-folding region NFA2. However, at least one layer of the rear stack structure 300 may be separable from (or removed from) the folding region FDA and disposed within the first non-folding region NFA1 and the second non-folding region NFA2 to allow the display device 2 to be easily folded. In this case, at least one of the fourth to eighth adhesive layers 361 to 365 may be separable from the folding region FDA and disposed within the first non-folding region NFA1 and the second non-folding region NFA2.

[0141] Figure 16 This is a cross-sectional view of the display device according to the implementation scheme.

[0142] Figure 16 Display device 2 and Figure 12 The difference in the display device 2 of the embodiment is that at least one of the fourth to eighth adhesive layers 361', 362', 363', 364', and 365' (which is a UV-curable adhesive containing vinylsilane and hydrosilane) is cured by ultraviolet light, and therefore contains silane-CH2-CH2-silane. In the following, Figure 16 The description will focus on and Figure 12 The differences in the implementation plans.

[0143] At least one of the fourth to eighth adhesive layers 361' to 365' in the rear stacked structure 300 can be with Figure 1 The adhesive layer 20 is substantially the same. When at least one of the fourth to eighth adhesive layers 361' to 365' disposed on the rear surface of the display panel 100 and at least one of the first to third adhesive layers 241 to 243 disposed on the front surface of the display panel 100 is a photocurable adhesive containing silane-CH2-CH2-silane, permanent deformation can be more advantageously prevented even when external pressure is applied from the front surface of the display device.

[0144] In the fourth to eighth adhesive layers 361' to 365', the adhesive layer containing silane-CH2-CH2-silane can have a thickness of 10 μm to 100 μm. When the thickness is less than 10 μm, the adhesive layer may be easily deformed but may not easily return to its original shape. Furthermore, when the thickness is greater than 100 μm, it may be difficult to bend the display device, and buckling or peeling may occur due to repeated deformation.

[0145] The various implementation schemes will be described in more detail below through manufacturing examples and experimental examples.

[0146] Manufacturing Examples 1 to 4

[0147] UV-curable adhesive layers containing silane-CH2-CH2-silane and having various storage moduli are manufactured by adjusting the molecular weight and crosslinking amount of an adhesive composition containing any one of vinylsilane, hydrosilane and / or the crosslinking agents described above.

[0148] Experimental Example 1

[0149] The storage modulus of the UV-curable adhesive layers according to Manufacturing Examples 1 to 4 was measured at -20°C and at 25°C, and the results are shown in Table 1 below.

[0150] Table 1

[0151]

[0152] Referring to Table 1, in Manufacturing Example 1, the energy storage modulus measured at -20°C was 0.08 MPa, and the energy storage modulus measured at 25°C was 0.09 MPa. Therefore, the ratio of the energy storage modulus at -20°C to the energy storage modulus at 25°C in Manufacturing Example 1 was calculated to be approximately 0.89.

[0153] In Manufacturing Example 2, the energy storage modulus at -20°C was measured to be 0.15 MPa, and the energy storage modulus at 25°C was measured to be 0.14 MPa. Therefore, in Manufacturing Example 2, the ratio of the energy storage modulus at -20°C to the energy storage modulus at 25°C was calculated to be approximately 1.07.

[0154] In manufacturing example 3, the energy storage modulus was measured to be 0.18 MPa at -20°C and 0.11 MPa at 25°C. Therefore, the ratio of the energy storage modulus at -20°C to the energy storage modulus at 25°C was calculated to be approximately 1.64.

[0155] In manufacturing example 4, the energy storage modulus was measured to be 0.22 MPa at -20°C and 0.20 MPa at 25°C. Therefore, the ratio of the energy storage modulus at -20°C to the energy storage modulus at 25°C was calculated to be 1.10.

[0156] In the following text, a manufacturing example in which the UV-curable adhesive layer according to Manufacturing Examples 1 to 4 is applied to the adhesive layer of a display device will be described, and an experimental example using the manufacturing example will be described.

[0157] Manufacturing Example 5

[0158] The UV-curable adhesive layer according to Manufacturing Example 1 is applied to Figure 12 At each location of the first adhesive layer 241 and the second adhesive layer 242, and pressure-sensitive adhesive is applied to the other third to eighth adhesive layers 243 and 361 to 365. In this way, a material is manufactured as described above. Figure 11 The image shows a foldable display device in which the display surfaces are folded in a direction in which they face each other.

[0159] Manufacturing Example 6

[0160] The foldable display device is manufactured in the same manner as in Manufacturing Example 5, but the UV-curable adhesive layer according to Manufacturing Example 2 is applied to... Figure 12 At each location of the first adhesive layer 241 and the second adhesive layer 242.

[0161] Manufacturing Example 7

[0162] The foldable display device is manufactured in the same manner as in Manufacturing Example 5, but the UV-curable adhesive layer according to Manufacturing Example 3 is applied to... Figure 12 At each location of the first adhesive layer 241 and the second adhesive layer 242.

[0163] Manufacturing Example 8

[0164] The foldable display device is manufactured in the same manner as in Manufacturing Example 5, but the UV-curable adhesive layer according to Manufacturing Example 4 is applied to... Figure 12 At each location of the first adhesive layer 241 and the second adhesive layer 242.

[0165] Manufacturing Example 9

[0166] The foldable display device is manufactured in the same manner as in Manufacturing Example 5, but the UV-curable adhesive layer according to Manufacturing Example 1 is applied to... Figure 12 Each of the first adhesive layer 241, the second adhesive layer 242, the third adhesive layer 243, and the fourth adhesive layer 361.

[0167] Manufacturing Example 10

[0168] The foldable display device is manufactured in the same manner as in Manufacturing Example 5, but the UV-curable adhesive layer according to Manufacturing Example 1 is applied to... Figure 12 Each of the first adhesive layer 241, the second adhesive layer 242, the third adhesive layer 243, the fourth adhesive layer 361, the fifth adhesive layer 362, and the sixth adhesive layer 363.

[0169] Experimental Example 2

[0170] The number of folds and the number of pen writing failures were measured in the foldable display devices according to Manufacturing Examples 5 to 10.

[0171] At a room temperature of 25°C, the process of the display device going from folding to unfolding is set as one cycle, and the number of folds is counted until the display device can no longer return to its state before folding.

[0172] The number of times pen writing failures occurred (which is the number of times pressure was applied to the front surface of the display device with a force of 500 gf (gram force, about 5 N) using an electronic pen with a diameter of about 0.6 mm at room temperature of 25°C) until permanent deformation occurred on the front surface of the display device and was visually identifiable.

[0173] The results of Experiment Example 2 are shown in Table 2.

[0174] Table 2

[0175]

[0176] Referring to Table 2, when the UV-curable adhesive layer according to Manufacturing Example 1 is applied to the first adhesive layer 241 and the second adhesive layer 242, in Manufacturing Example 5, in which each of the first adhesive layer 241 and the second adhesive layer 242 has a storage modulus of 0.09 MPa at 25°C, the number of folds is 300,000 and the number of pen writing failures is 3,000.

[0177] When the UV-curable adhesive layer according to Manufacturing Example 2 or Manufacturing Example 3 is applied to the first adhesive layer 241 and the second adhesive layer 242, in Manufacturing Example 6, in which each of the first adhesive layer 241 and the second adhesive layer 242 has a storage modulus of 0.14 MPa (greater than 0.09 MPa) at 25°C, and in Manufacturing Example 7, in which each of the first adhesive layer 241 and the second adhesive layer 242 has a storage modulus of 0.11 MPa (greater than 0.09 MPa) at 25°C, the number of folds is 200,000, and the number of pen writing failures is 3,000.

[0178] When the UV-curable adhesive layer according to Manufacturing Example 4 is applied to the first adhesive layer 241 and the second adhesive layer 242, in Manufacturing Example 8, in which each of the first adhesive layer 241 and the second adhesive layer 242 has a storage modulus of 0.20 MPa (greater than 0.14 MPa) at 25°C, the number of folds is 150,000 and the number of pen writing failures is 5,000.

[0179] Furthermore, in Manufacturing Example 9, when the UV-curable adhesive layer according to Manufacturing Example 1 was applied to the first to fourth adhesive layers 241, 242, 243, and 361, each of the first to fourth adhesive layers 241, 242, 243, and 361 had a storage modulus of 0.09 MPa at 25°C, the number of pen writing failures was 4,000. In Manufacturing Example 10, when the UV-curable adhesive layer according to Manufacturing Example 1 was applied to the first to sixth adhesive layers 241 to 243 and 361 to 363, each of the first to sixth adhesive layers 241 to 243 and 361 to 363 had a storage modulus of 0.09 MPa at 25°C, the number of folds was 300,000, and the number of pen writing failures was 5,000.

[0180] While certain embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this specification. Therefore, the inventive concept is not limited to such embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalent arrangements that will be apparent to those skilled in the art.

Claims

1. A display device including a folding area and a non-folding area, the display device comprising: A display panel having a front surface, the display panel being configured to display an image on the front surface; as well as A front stacking structure disposed on the front surface of the display panel. in: The front stacking structure includes an adhesive layer disposed across the folded region and the non-folded region; The adhesive layer comprises a UV-curable adhesive and silane-CH2-CH2-silane; The UV-curable adhesive comprises vinylsilane and hydrosilane; and The adhesive layer has a storage modulus of 0.05 MPa to 0.3 MPa in a temperature range of -20°C to 25°C.

2. The display device of claim 1, wherein the ratio of the energy storage modulus of the adhesive layer at -20°C to the energy storage modulus at 25°C is 0.5 to 2.

0.

3. The display device as claimed in claim 1, wherein: The adhesive layer further comprises a crosslinking agent; and The crosslinking agent includes at least one of vinylsilane, hydroxysilane, alkoxysilane, and epoxysilane.

4. The display device as claimed in claim 1, further comprising: A touch layer is disposed on the display panel, the touch layer being configured to detect touch input. The adhesive layer has a storage modulus of 0.05 MPa to 0.2 MPa at 25°C.

5. The display device as claimed in claim 4, wherein: The touch layer is a digitizer layer disposed on the rear surface of the display panel; and The touch layer includes multiple conductive patterns configured to detect magnetic fields or electromagnetic signals applied from the electronic pen.

6. A display device, comprising: Display panel; A first upper cover member is disposed on the display panel; A second upper covering member is disposed on the first upper covering member; A third upper covering member is disposed on the second upper covering member; A first lower cover member is disposed below the display panel; A second lower covering member is disposed below the first lower covering member; A third lower covering member is disposed below the second lower covering member; A first bonding layer is disposed between the third upper covering member and the second upper covering member; A second bonding layer is disposed between the second upper covering member and the first upper covering member; A third bonding layer is disposed between the first upper covering member and the display panel; A fourth bonding layer is disposed between the display panel and the first lower cover member; A fifth bonding layer is disposed between the first lower covering member and the second lower covering member; as well as A sixth bonding layer is disposed between the second lower covering member and the third lower covering member. in: Each of the first bonding layer and the second bonding layer is a UV-curable layer; and Each of the first bonding layer and the second bonding layer has a storage modulus of 0.08 MPa to 0.3 MPa at -20°C and a storage modulus of 0.05 MPa to 0.2 MPa at 25°C, and the ratio of the storage modulus of each of the first bonding layer and the second bonding layer at -20°C to the storage modulus at 25°C is 0.8 to 1.

2.

7. The display device as claimed in claim 6, wherein: The first upper covering member is a polarizing film configured to reduce the reflection of external light; The second upper covering member is a window configured to protect the display panel; as well as The third upper covering member is a window protective film configured to perform at least one of the following functions on the window: preventing scattering, absorbing impact, preventing scratches, and preventing glare.

8. The display device as claimed in claim 6, wherein: Each of the third bonding layer and the fourth bonding layer is a UV-curable layer; as well as Each of the third and fourth bonding layers has a storage modulus of 0.08 MPa to 0.3 MPa at -20°C and a storage modulus of 0.05 MPa to 0.2 MPa at 25°C.

9. The display device as claimed in claim 8, wherein: The first lower cover member is a panel under-panel protective film configured to protect the display panel; The second lower cover member is a buffer member configured to absorb external impacts; and The third lower cover member is a support member configured to support the display panel.

10. The display device as claimed in claim 9, wherein: Each of the fifth and sixth bonding layers is a UV-curable layer; and Each of the fifth and sixth bonding layers has a storage modulus of 0.08 MPa to 0.3 MPa at -20°C and a storage modulus of 0.05 MPa to 0.2 MPa at 25°C.

11. The display device of claim 9, wherein the ratio of the energy storage modulus of each of the third to sixth bonding layers at -20°C to the energy storage modulus at 25°C is 0.8 to 1.

2.

12. The display device of claim 9, wherein each of the first to sixth bonding layers has a thickness of 10 μm to 100 μm.

13. The display device of claim 6, wherein each of the first bonding layer and the second bonding layer comprises vinylsilane and hydrosilane.

14. The display device of claim 13, wherein each of the first bonding layer and the second bonding layer comprises silane-CH2-CH2-silane.

15. Electronic products, including: First structure; Second structure; as well as An adhesive layer, inserted between the first structure and the second structure to bond the first structure to the second structure, comprises a UV-curable material. The adhesive layer has a storage modulus of 0.08 MPa to 0.3 MPa at -20°C and a storage modulus of 0.05 MPa to 0.2 MPa at 25°C. The ratio of the energy storage modulus of the adhesive layer at -20°C to that at 25°C is 0.5 to 2.

0.

16. The electronic product of claim 15, wherein the energy storage modulus of the adhesive layer increases with increasing temperature in the temperature range of -20°C to 25°C.

17. The electronic product of claim 15, wherein the adhesive layer comprises vinylsilane and hydrosilane.

18. The electronic product of claim 17, wherein the adhesive layer comprises silane-CH2-CH2-silane.

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