Electronic device

Abstract

This invention discloses an electronic device, including a mid-frame, a heat dissipation unit, a shielding cover, a heat source module, and a heat dissipation device. The mid-frame includes a first surface; the heat dissipation unit is disposed on the first surface; the shielding cover is spaced apart from the heat dissipation unit, and the shielding cover has a shielding cavity; the heat source module is disposed between the heat dissipation unit and the shielding cover, and the heat source module includes a circuit board disposed on the heat dissipation unit and a first heat source component disposed on the circuit board, the first heat source component being disposed within the shielding cavity; the heat dissipation device is used to dissipate heat from the shielding cover and / or the heat source module. This electronic device has good heat dissipation efficiency and can reduce or avoid the occurrence of local overheating.

Description

Technical Field

[0001] This disclosure relates to the field of electronic technology, and in particular to an electronic device. Background Technology

[0002] Currently, electronic devices such as mobile phones, tablets, wearable devices, ranging devices, and scanning devices have become indispensable technological products in people's lives, studies, and entertainment. With the development of electronic devices, the number of CPU (Central Processing Unit) cores used in them has increased, and their performance has improved, leading to greater heat generation in these devices. Especially in recent years, temperature rise has gradually become an important consideration for consumers when purchasing electronic devices.

[0003] However, in the heat dissipation technology solutions for related electronic devices, there is still a problem of untimely heat dissipation leading to localized overheating of the electronic devices. Summary of the Invention

[0004] This disclosure provides an electronic device with good heat dissipation efficiency, which can reduce or avoid the occurrence of local overheating.

[0005] The technical solution is as follows: An electronic device is provided according to an embodiment of this disclosure, including a mid-frame, a heat dissipation unit, a shielding cover, a heat source module, and a heat dissipation device. The mid-frame includes a first surface; the heat dissipation unit is disposed on the first surface; the shielding cover is spaced apart from the heat dissipation unit, and the shielding cover has a shielding cavity; the heat source module is disposed between the heat dissipation unit and the shielding cover, and the heat source module includes a circuit board disposed on the heat dissipation unit and a first heat source component disposed on the circuit board, the first heat source component being disposed within the shielding cavity; the heat dissipation device is used to dissipate heat from the shielding cover and / or the heat source module. The heat dissipation device includes a cooling fan and a passive heat dissipation structure. The passive heat dissipation structure is disposed on the outside of the shielding cover, and the passive heat dissipation structure is integrally cast with the shielding cover. The cooling fan is disposed on the heat dissipation fins of the passive heat dissipation structure and faces the shielding cover.

[0006] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects: In use, the electronic device of this disclosure has a first heat source component fixed within a shielding cavity, and a heat dissipation device is used to improve the heat dissipation efficiency of the shielding cover. This allows the electronic device to achieve both good shielding and efficient heat dissipation, thereby preventing localized overheating of the first heat source component within the shielding cavity and improving operational stability and reliability. Furthermore, the heat source module is mounted on the middle frame via a heat dissipation unit, fully utilizing the area of ​​the middle frame for heat dissipation, further enhancing heat dissipation efficiency.

[0007] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the structure of a mobile terminal shown in one embodiment.

[0009] Figure 2 for Figure 1 The diagram shown is a front view of the structure of the middle frame.

[0010] Figure 3 for Figure 1 The diagram shown is an exploded view of part of the structure of the mobile terminal.

[0011] Figure 4 for Figure 3 The diagram shows a side view of the shielding module in the electronic device.

[0012] Figure 5 for Figure 4 The diagram shows a top view of the passive heat dissipation structure.

[0013] Figure 6 This is a side view of a shielding module in an electronic device according to another embodiment.

[0014] Figure 7 This is a partial cross-sectional schematic diagram of a shielding module in an electronic device according to another embodiment.

[0015] Figure 8 This is a partial cross-sectional schematic diagram of a shielding module in an electronic device according to another embodiment.

[0016] Figure 9 for Figure 3 The diagram shown is a rear view of the mid-frame heat dissipation module.

[0017] Figure 10 for Figure 9 The diagram shown is an exploded view of the mid-frame heat dissipation module.

[0018] Figure 11 for Figure 10 The diagram shows a partial structural schematic of the mid-frame heat dissipation module.

[0019] Figure 12 for Figure 11 An enlarged schematic diagram of A is shown.

[0020] Figure 13 for Figure 11 The diagram shows the heat dissipation status of the mid-frame heat dissipation module.

[0021] Figure 14 for Figure 13An enlarged schematic diagram of B is shown.

[0022] Figure 15 for Figure 9 A schematic diagram of another embodiment of the mid-frame heat dissipation module is shown.

[0023] Figure 16 This is a partial structural schematic diagram of the mid-frame heat dissipation module shown in another embodiment.

[0024] Explanation of reference numerals in the attached figures: 100. Middle frame; 101. First side; 102. Second side; 110. Cooling section; 120. Battery mounting section; 130. Loop pipe groove; 140. Sealing cap; 150. Mounting groove; 160. Thermally conductive adhesive layer; 200. Heat dissipation unit; 210. Heat dissipation plate; 220. Thermally conductive layer; 300. Shielding cover; 310. Shielding cavity; 400. Heat source module; 410. Circuit board; 420. First heat source component; 430. Second heat source component; 500. Heat dissipation device; 510. Passive heat dissipation structure; 511. 512. Heat sink; 520. Semiconductor cooling component; 530. Cooling fan; 600. Protective cover; 610. Vent hole; 700. Loop heat pipe; 710. Evaporator; 711. Liquid supply end; 712. Gas outlet end; 713. Evaporation section; 714. Liquid storage chamber; 720. Piping unit; 721. First delivery pipe; 722. Second delivery pipe; 723. Condenser; 724. Liquid supply branch; 725. Gas outlet branch; 730. Anti-backflow structure; 732. Tesla valve structure; 800. Working fluid. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative and do not limit the scope of protection of this disclosure.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure.

[0027] For ease of understanding, the technical terms involved in the embodiments of this disclosure will be explained and described below.

[0028] A vapor chamber (VC) is a vacuum cavity with a fine structure that provides excellent heat dissipation. Its materials include, but are not limited to, copper, stainless steel, and titanium alloy.

[0029] Cooling fans include miniature turbine fans or axial fans, etc.

[0030] Thermal Electric Cooler (TEL) is also called a Peltier cooler.

[0031] Thermal interface material (TEL) has good thermal conductivity, and its specific implementation methods include, but are not limited to, thermal grease, thermal adhesive, and thermal pads.

[0032] A loop heat pipe (LHP) is a closed-loop ring-shaped heat pipe with excellent heat dissipation capabilities.

[0033] Passive heat dissipation structure, passive heat dissipation component, with plate-shaped heat dissipation teeth.

[0034] RC components are a general term for resistors and capacitors.

[0035] Currently, electronic devices such as mobile phones, tablets, wearable devices, ranging devices, and scanning devices have become indispensable technological products in people's lives, studies, and entertainment. With the development of electronic devices, the number of CPU (Central Processing Unit) cores used in them has increased, and their performance has improved day by day, leading to greater heat generation and posing increasingly higher challenges to the heat dissipation performance of these devices. Especially in recent years, temperature rise has gradually become an important consideration for consumers when purchasing electronic devices. At the same time, better and more even heat dissipation performance is more attractive to consumers; therefore, improving the heat dissipation efficiency of electronic devices and avoiding localized overheating has become an increasingly important issue for the industry.

[0036] However, in the heat dissipation solutions for related electronic devices, insufficient heat dissipation is prone to occur, and the heat dissipation efficiency is difficult to improve. Insufficient heat dissipation can lead to localized overheating of electronic devices, which can easily affect their operating performance and even cause them to crash.

[0037] Based on this, the present disclosure provides an electronic device that can improve heat dissipation efficiency, avoid local overheating, ensure the operating performance of the electronic device, and improve the reliability of the electronic device.

[0038] The technical solution of this disclosure is further illustrated below with reference to the specific structural drawings.

[0039] like Figures 1 to 4 This is a structural diagram of an electronic device and an electronic device as shown in one embodiment. Wherein, Figure 1 This is a schematic diagram of the structure of a mobile terminal shown in one embodiment. Figure 2for Figure 1 The diagram shown is an exploded view of part of the structure of the mobile terminal. Figure 3 for Figure 2 The diagram shown is a front view of the structure of the middle frame. Figure 4 for Figure 3 The diagram shows a side view of the shielding module in the electronic device.

[0040] The embodiments of this disclosure provide an electronic device, which may be a mobile phone, tablet computer, e-reader, laptop computer, in-vehicle device, wearable device, ranging device, scanning device, etc., and includes a mid-frame 100, a shielding cover 300, a heat source module 400, and a heat dissipation device 500.

[0041] The middle frame 100 includes a first surface 101; a heat dissipation unit 200 is disposed on the first surface 101; a shielding cover 300 is spaced apart from the heat dissipation unit 200, and the shielding cover 300 is provided with a shielding cavity 310; a heat source module 400 is disposed between the first surface 101 and the shielding cover 300, and the heat source module 400 includes a circuit board 410 disposed on the heat dissipation unit 200 and a first heat source component 420 disposed on the circuit board 410, and the first heat source component 420 is disposed in the shielding cavity 310; a heat dissipation device 500 is used to dissipate heat from the shielding cover 300 and / or the heat source module 400.

[0042] When the electronic device of this disclosure is in use, the first heat source component 420 is fixed inside the shielding cavity 310, and the heat dissipation device 500 is used to improve the heat dissipation efficiency of the shielding cover 300. This allows the electronic device of this disclosure to have both good shielding effect and good heat dissipation efficiency, thereby avoiding local overheating of the first heat source component 420 inside the shielding cavity 310, which is beneficial to improving operational stability and reliability. In addition, the heat source module 400 is disposed on the middle frame 100 through the heat dissipation unit 200. This allows for rapid heat dissipation using the heat dissipation unit 200, while also making full use of the area of ​​the middle frame 100 for heat dissipation, which is beneficial to further improving heat dissipation efficiency.

[0043] In this embodiment of the disclosure, the middle frame 100 can be the frame structure of an electronic device. In addition to integrating the heat source module 400, other parts or all components of the electronic device can be directly or indirectly disposed on the middle frame 100 to assemble the electronic device.

[0044] Optionally, the middle frame 100 can be disposed inside the electronic device, and the edge of the middle frame 100 can be designed as part of the outer casing of the electronic device. When the edge of the middle frame 100 serves as the outer casing of the electronic device, it can protect the electronic device.

[0045] Optionally, the middle frame 100 may have a planar or near-planar structure, thus allowing for visual differentiation of the two sides of the middle frame 100, which may be referred to as the front and back of the middle frame 100, or alternatively, one side and the other side of the middle frame 100. The interior of the middle frame 100 may be partially hollowed out as needed to accommodate other components in the electronic device.

[0046] Optionally, part or all of the middle frame 100 may be made of metal or alloy materials (e.g., aluminum alloy). Of course, the material of the middle frame 100 may also be other, and this disclosure does not specifically limit this.

[0047] It should be noted that the heat dissipation unit 200 includes a heat dissipation plate 210 (Vapor Chamber, abbreviated as VC), heat pipes, graphene, etc.

[0048] Based on any of the above embodiments, in one embodiment, the heat dissipation unit 200 further includes a heat dissipation plate 210 with a phase change working fluid. Thus, the phase change working fluid can be selected according to actual needs to meet the heat dissipation requirements of different electronic devices and achieve better cost-effectiveness.

[0049] Based on any of the above embodiments, in one embodiment, the boiling point of the phase change working fluid is 20℃~90℃. Thus, the heat dissipation unit 200 has good thermal conductivity and heat dissipation performance when the electronic device operates at a temperature of 10℃~45℃. This allows the heat generated by the heat source module 400 to be dissipated and conducted away in a timely manner through the heat dissipation unit 200, preventing localized overheating of the electronic device.

[0050] The phase change working medium includes, but is not limited to, formaldehyde, methanol, ethanol, or a mixture thereof with pure water.

[0051] Furthermore, the start-up temperature of the heat exchanger 200 may need to be adjusted. For example, by adjusting the vacuum level inside the heat exchanger 200 and / or using phase change working fluids with different boiling points, the start-up temperature of the heat exchanger 200 can be lowered, thus achieving a fully gas-liquid phase change equilibrium state earlier.

[0052] like Figures 5 to 8 This is a structural diagram of a shielding module in an electronic device shown in some embodiments. Figure 4 for Figure 3 The diagram shows a side view of the shielding module in the electronic device. Figure 5 for Figure 4 The diagram shows a top view of the passive heat dissipation structure. Figure 6 This is a side view of a shielding module in an electronic device according to another embodiment. Figure 7 This is a partial cross-sectional schematic diagram of a shielding module in an electronic device according to another embodiment. Figure 8This is a partial cross-sectional schematic diagram of a shielding module in an electronic device according to another embodiment.

[0053] There are several ways to implement the heat dissipation device 500: Furthermore, the heat dissipation device 500 includes a passive heat dissipation structure 510 disposed on the outside of the shield 300. Thus, the passive heat dissipation structure 510 increases the heat dissipation area of ​​the shield 300, thereby improving the heat dissipation efficiency of the shield 300.

[0054] In some embodiments, the passive heat dissipation structure 510 includes a heat conductor 511 and heat dissipation fins 512. The heat dissipation fins 512 are disposed on the outer surface of the heat conductor 511. The heat conductor 511 transfers the heat generated by the heat source module 400 to the heat dissipation fins 512, and further transfers it to the outside air through the heat dissipation fins 512 to enhance the heat dissipation effect. For example, the heat conductor 511 and the heat dissipation fins 512 are provided as independent components. Alternatively, the passive heat dissipation structure 510 can be integrally cast to enhance mechanical properties.

[0055] The passive heat dissipation structure 510 is made of aluminum alloy. For example, the specific surface area of ​​the heat dissipation fin 512 is 4 to 10 times that of the heat conductor 511, for example, the specific surface area of ​​the heat dissipation fin 512 is 6.8 times that of the heat conductor 511.

[0056] When the cooling fan 530 is combined with the passive heat dissipation structure 510, the cooling fan 530 is located outside the heat conductor 511, and the heat dissipation fins 512 include multiple fins. A heat dissipation channel is formed between two adjacent fins. The heat dissipation channel is used to guide the airflow generated by the cooling fan 530, which helps to improve the heat dissipation efficiency.

[0057] Of course, the heat dissipation device 500 can also be equipped with an active heat dissipation component. This allows it to actively dissipate heat from the shielding cover 300 and / or the heat source module 400.

[0058] For example, in one embodiment, the heat dissipation device 500 includes a semiconductor cooling element 520. The heat-absorbing part of the semiconductor cooling element 520 is thermally conductively connected with the first heat source component 420, and the heat-dissipating part of the semiconductor cooling element is thermally conductively connected with the shielding cover 300. In this way, by using the semiconductor cooling element 520 as an active heat dissipation element, the heat-absorbing part actively absorbs the heat transferred from the first heat source component 420 and actively transfers the heat energy to the shielding cover 300 for heat dissipation, thereby reducing the temperature inside the shielding cavity 310, avoiding overheating at the shielding cover 300, and thus improving the reliability of the electronic equipment.

[0059] Alternatively, in another embodiment, the heat dissipation device 500 includes a cooling fan 530, which is positioned towards the shielding cover 300. In this way, the cooling fan 530 can generate turbulent airflow, further achieving more uniform heat dissipation from the shielding cover 300 and preventing overheating at the shielding cover 300. Furthermore, by interacting with external gas and introducing cool external gas into the electronic device to cool it down, the heat dissipation efficiency of the electronic device can be further improved.

[0060] The cooling fan 530 can be installed inside the electronic device or it can be detached and installed inside the electronic device; no further restrictions are imposed here.

[0061] Alternatively, in another embodiment, the heat dissipation device 500 includes a cooling fan 530 and a semiconductor cooling device 520. The heat-absorbing part of the semiconductor cooling device 520 is thermally connected with the first heat source component 420, and the heat-releasing part of the semiconductor cooling device is thermally connected with the shielding cover 300. The cooling fan 530 is positioned towards the shielding cover 300. In this way, the cooling fan 530 can actively blow air or create negative pressure on the shielding cover 300, increasing the airflow speed outside the shielding cover 300 and accelerating heat dissipation. At the same time, it can also accelerate the absorption of heat from the first heat source component 420 by the heat-absorbing part, further reducing the temperature inside the shielding cavity 310 and preventing overheating at the shielding cover 300.

[0062] In addition to active heat dissipation components, the heat dissipation device 500 can also integrate a passive heat dissipation structure 510.

[0063] For example, in one embodiment, the heat dissipation device 500 includes a cooling fan 530 and a passive heat dissipation structure 510. The passive heat dissipation structure 510 is fixed to the shielding cover 300, and the cooling fan 530 is disposed on the passive heat dissipation structure 510. Thus, the passive heat dissipation structure 510 absorbs heat from the shielding cover 300, accelerating the heat dissipation of the shielding cover 300. Simultaneously, the cooling fan 530 can generate turbulent airflow to improve the heat dissipation efficiency of the passive heat dissipation structure 510, resulting in high heat dissipation efficiency and uniform heat dissipation for the electronic device.

[0064] Alternatively, in another embodiment, the heat dissipation device 500 includes a passive heat dissipation structure 510 and a semiconductor cooling element 520. The heat-absorbing part of the semiconductor cooling element 520 is thermally conductively connected with the first heat source component 420, and the heat-releasing part of the semiconductor cooling element is thermally conductively connected with the shielding cover 300. The passive heat dissipation structure 510 is disposed on the outside of the shielding cover 300. In this way, the semiconductor cooling element 520 is used as an active heat dissipation element, which actively absorbs the heat transferred from the first heat source component 420 through the heat-absorbing part and actively transfers the heat energy to the shielding cover 300 for heat dissipation, thereby improving the heat dissipation efficiency. At the same time, the passive heat dissipation structure 510 improves the heat dissipation efficiency of the shielding cover 300, further accelerating the heat dissipation of the heat source module 400 and preventing overheating at the shielding cover 300.

[0065] Alternatively, in another embodiment, the heat dissipation device 500 includes a passive heat dissipation structure 510, a cooling fan 530, and a thermoelectric cooler 520. The heat-absorbing part of the thermoelectric cooler 520 is thermally conductively connected to the first heat source component 420, and the heat-releasing part of the thermoelectric cooler is thermally conductively connected to the shield 300. The passive heat dissipation structure 510 is disposed on the outside of the shield 300, and the cooling fan 530 is disposed on the passive heat dissipation structure 510. In this way, the thermoelectric cooler 520 is used as an active heat dissipation element, actively absorbing the heat transferred from the first heat source component 420 through the heat-absorbing part, thereby cooling the first heat source component 420; at the same time, the passive heat dissipation structure 510 absorbs the heat transferred to the shield 300 by the heat-releasing part, accelerating the heat dissipation efficiency of the shield 300. Furthermore, the cooling fan 530 can generate turbulent airflow to improve the heat dissipation efficiency of the passive heat dissipation structure 510, thereby making the electronic device have high heat dissipation efficiency and uniform heat dissipation, and avoiding overheating at the shielding cover 300.

[0066] The cooling fan 530, or the cooling fan 530 and the passive cooling structure 510, can be detachably installed in the electronic device. In some embodiments, the electronic device further includes a protective cover 600 that cooperates with the mid-frame 100 to form a protective space, and at least a portion of the heat dissipation device 500 is detachably connected to the protective cover 600. Thus, when the heat dissipation device 500 includes a cooling fan 530, the cooling fan 530 can be detachably mounted on the protective cover 600.

[0067] In some embodiments, when the electronic device is a mobile terminal, the protective cover 600 is a back cover.

[0068] Based on any of the above-described embodiments of the protective cover 600, in one embodiment, the protective cover 600 is provided with a vent 610 communicating with the protective space. Thus, when the electronic device can meet its heat dissipation requirements using the semiconductor cooler 520, the cooling fan 530 can be removed. When the semiconductor cooler 520 cannot meet the heat dissipation requirements, the cooling fan 530 can be connected to an external power source and installed in the electronic device, using the vent 610 to deliver external air into the electronic device, thereby improving the heat dissipation efficiency of the electronic device.

[0069] Optionally, the electronic device is a smart TV, and in any embodiment of the above-described cooling fan 530, the cooling fan 530 is detachably mounted on the rear cover. This allows for selective installation of the cooling fan 530 based on the smart TV model corresponding to different central processing unit specifications, thereby reducing production costs and avoiding wasted cooling performance.

[0070] Optionally, the protective cover 600 is provided with a waterproof and breathable membrane (not shown) that covers the vent 610. In this way, the waterproof and breathable membrane can ensure heat exchange efficiency while improving the waterproof and / or dustproof performance of electronic equipment.

[0071] In some embodiments, the vent 610 includes an air inlet and an air outlet. Thus, the cooling fan 530, in conjunction with the air inlet and outlet, enables directional airflow within the protected space, further improving heat dissipation efficiency.

[0072] To further improve the heat dissipation efficiency of the shield 300, in some embodiments, the heat dissipation device further includes a heat dissipation layer (not shown), which is disposed on the outer wall of the shield 300 and the heat dissipation unit 200.

[0073] The heat dissipation layer includes, but is not limited to, a graphene coating.

[0074] In this embodiment of the disclosure, the heat source module 400 refers to a device in an electronic device that radiates a lot of heat, including at least one heat source component, i.e., a heating element.

[0075] In one example, the heat source module 400 further includes a second heat source component 430, which is disposed on the opposite side of the circuit board 410 relative to the first heat source component 420. The second heat source component 430 is thermally connected to the heat dissipation unit 200. Thus, the heat dissipation unit 200 can also dissipate heat from the second heat source component 430, thereby effectively dissipating heat from the heat source module 400 and preventing localized overheating of the electronic device due to insufficient heat dissipation from the heat source module 400.

[0076] In practical applications, the heat radiated by electronic components is usually positively correlated with their power consumption; the greater the power consumption, the greater the heat radiated. Accordingly, the heat source component in this disclosure can be a device in an electronic device whose power consumption exceeds M% of the total power consumption, where M can be 20, 30, 40, etc.

[0077] Optionally, the heat source component may include a central processing unit, a processing device that integrates processing and storage functions, a power supply component (such as a battery), etc.

[0078] In one example, the first heat source component 420 is a blocking component, and the second heat source component 430 is a central processing unit (CPU), and they are respectively disposed on the two surfaces of the circuit board 410. The blocking component is disposed in the shielding cavity 310 and thermally conductively cooperates with the shielding cover 300, and the central processing unit thermally cooperates with the middle frame 100.

[0079] In some embodiments, the heat dissipation device includes a heat dissipation unit 200, which is thermally connected to the second heat source component 430. Thus, the heat dissipation unit 200 can improve the heat dissipation and thermal conductivity of the middle frame 100, facilitating heat dissipation of the second heat source component 430 and preventing overheating of the heat source module 400.

[0080] Optionally, the central processing unit is fixed to the heat dissipation unit 200 via the heat-conducting layer 220. The heat-conducting layer 220 can be disposed between the central processing unit and the heat dissipation unit 200 in various ways, such as by pasting, applying, or spraying, or by clamping the formed heat-conducting layer 220 between the central processing unit and the heat dissipation unit 200 through a fixed connection.

[0081] In one exemplary example, the thermally conductive layer 220 is elastic and is compressed between the central processing unit (CPU) and the heat spreader unit 200. In this way, the thermally conductive layer 220 can fully fill the gap between the CPU and the heat spreader unit 200, increasing the contact area and improving the heat dissipation efficiency of the CPU. Furthermore, the elasticity of the thermally conductive layer 220 provides cushioning and protects the CPU.

[0082] In some examples, the thermally conductive layer 220 is one of thermally conductive colloids such as thermally conductive silicone or thermally conductive rubber.

[0083] Similarly, the heat-conducting component can also be thermally connected to the middle frame 100 through the thermally conductive layer 220. In this way, the middle frame 100 can be fully utilized for heat dissipation.

[0084] Of course, the heat source component can be other than those specified in this disclosure.

[0085] In addition, in some embodiments, an elastic heat-conducting layer 220 may also be provided between the aforementioned independent adjacent components to improve the heat conduction effect between adjacent components and accelerate heat dissipation efficiency by utilizing the heat-conducting layer 220.

[0086] The aforementioned heat-conducting layer 220 may be disposed between the middle frame 100 and the second heat source component 430, and / or between the semiconductor cooling component 520 and the first heat source component 420, and / or between the shielding cover 300 and the first heat source component 420, etc.

[0087] To further improve the heat dissipation efficiency and effect of electronic devices, the heat dissipation efficiency of the middle frame 100 can be further improved, thereby enabling components directly or indirectly mounted on the middle frame 100 to have a good heat dissipation environment.

[0088] like Figure 9 and Figure 14 The diagram shows a schematic representation of the mid-frame heat dissipation module in some embodiments. Wherein, Figure 9 for Figure 2 The diagram shown is a rear view of the mid-frame heat dissipation module. Figure 10 for Figure 9 The diagram shown is an exploded view of the mid-frame heat dissipation module. Figure 11 for Figure 10 The diagram shows a partial structural schematic of the mid-frame heat dissipation module. Figure 12 for Figure 11 An enlarged schematic diagram of A is shown. Figure 13 for Figure 11 The diagram shows the heat dissipation status of the mid-frame heat dissipation module. Figure 14 for Figure 13 An enlarged schematic diagram of B is shown.

[0089] In some embodiments, the middle frame 100 further includes a cooling section 110 and a second surface 102 disposed opposite to the first surface 101. The electronic device also includes a loop heat pipe 700 and a working fluid 800. The loop heat pipe 700 is disposed on the second surface 102 and includes an evaporator 710 and a piping unit 720. The evaporator 710 is disposed opposite to the second heat source component 430 and includes a liquid replenishment end 711 and a gas outlet end 712. The piping unit 720... One end of the pipe unit 720 is connected to the liquid replenishment end 711, and the other end is connected to the gas outlet end 712. Part of the pipe unit 720 is thermally connected to the cooling section 110. The working fluid 800 is disposed in the loop heat pipe 700, and the liquid working fluid 800 can be converted into a gaseous state by the evaporator 710. The gaseous working fluid 800 can flow into the pipe unit 720 through the gas outlet end 712. The gaseous working fluid 800 can be reliquefied in the pipe unit 720 and sent to the liquid replenishment end 711.

[0090] In this way, the loop heat pipe 700 is integrated into the middle frame 100, and the evaporator 710 absorbs the heat from the second heat source component 430 to actively dissipate heat from the heat source module 400. Then, the heat is transferred to the cooling section 110 by the pipe unit 720. This makes full use of the space of the middle frame 100 for heat dissipation, thereby improving the heat dissipation performance of the middle frame 100 and facilitating the improvement of heat dissipation efficiency for components integrated into the middle frame 100, especially the heat source module 400 which is prone to heat generation.

[0091] In some embodiments, the first side 101 is the front of the middle frame 100, and the second side 102 is the back of the middle frame 100.

[0092] It should be noted that "cooling section 110" generally refers to a location where the temperature rises more slowly than that of the heat source module 400, that is, a location where the internal temperature of the electronic device is relatively lower than that of the "heat source module 400" during the use of the electronic device.

[0093] Optionally, the rear area, such as the battery compartment and the small plate area, which are far from the "heat source module 400", can be set as a cooling section 110 to accelerate the liquefaction of the working fluid 800.

[0094] It should be noted that "working fluid 800" includes, but is not limited to, coolant (such as water) and other fluids that can be applied to the loop heat pipe 700, and the boiling point of "working fluid 800" can be adjusted according to actual needs, without limitation.

[0095] The working fluid 800 may be, but is not limited to, formaldehyde, methanol, ethanol, or a mixture thereof with pure water.

[0096] It should be noted that "evaporator 710" includes structures such as capillary wicks, and its specific structure includes, but is not limited to, other evaporator 710 structures that can be applied to the loop heat pipe 700.

[0097] In some embodiments, when the electronic device of this disclosure is in use, the heat source module 400 generates heat due to operation. The evaporator 710 can actively absorb the heat transferred by the heat source module 400 through the middle frame 100, causing the liquid working fluid 800 in the evaporator 710 to absorb heat and evaporate, consuming thermal energy. Due to volume expansion, it flows to the cooling section 110 through the pipeline unit 720. During this process, the gaseous working fluid 800 transfers heat to the middle frame 100 and can release a large amount of heat and condense into liquid when flowing through the cooling section 110. The liquefied working fluid 800 will flow back to the liquid replenishment end 711 under the capillary force driven by the capillary wick in the evaporator 710. The liquid in the compensation chamber will be evaporated again by the evaporator 710, continuing to absorb heat. In this way, an evaporation-condensation cycle is formed, and the circulation of the working fluid 800 is driven by the capillary pressure generated by the capillary wick of the evaporator 710. The flow direction of the working fluid 800 is regular and the flow rate is fast, which can accelerate heat dissipation. Furthermore, the mid-frame 100 can be used to actively cool the heat of the heat source module 400, and the heat can be transported and dissipated over long distances to the cooling parts 110 such as the battery compartment and the small board. The size of the mid-frame 100 is fully utilized for heat dissipation, which greatly improves the heat dissipation efficiency of electronic devices.

[0098] The mid-frame 100 component disclosed herein achieves a significant improvement in core capabilities, including large heat transfer and long heat transfer distance, without increasing the thickness of the traditional mid-frame 100 and the overall stack thickness. It also combines the distribution of heat source parts and non-heat source parts (i.e., cooling part 110) to fully utilize the entire area of ​​the mid-frame 100 for efficient heat dissipation.

[0099] In some embodiments, at least a portion of the loop heat pipe 700 is embedded in the mid-frame 100. This allows for full utilization of the thickness space of the mid-frame 100 to integrate the loop heat pipe 700, increasing the contact area and thus improving heat dissipation efficiency, while also actively reducing the thickness of the protruding heat dissipation structure. Consequently, the mid-frame 100 assembly of this disclosure can adapt to the needs of thinner and lighter electronic devices, enabling the electronic devices of this disclosure to be designed to be thinner and lighter while possessing good heat dissipation performance, thereby enhancing product competitiveness.

[0100] like Figure 4 As shown, in some embodiments, the middle frame 100 and the cooling section 110 are spaced apart on both sides of the battery mounting section 120. This separates the middle frame 100 and the cooling section 110, allowing for sufficient heat dissipation. Simultaneously, it allows for heat dissipation of the battery mounting section 120 as it flows through it.

[0101] For example, the electronic device disclosed herein can integrate the central processing unit (CPU) of the heat source module 400 onto the motherboard, with the motherboard located at one end of the battery and the smaller board or charging control board placed at the other end. When the battery is not charging and the electronic device is in use, the CPU generates heat, which is dissipated using the loop heat pipe 700. Simultaneously, as the heat flows through the battery and the charging control board, the heat dissipation layer of the battery and the charging control board can also be utilized to accelerate heat dissipation, further improving heat dissipation efficiency. When the battery is charging, the loop heat pipe 700 can also be used for heat dissipation.

[0102] like Figure 2 and Figure 9 As shown, in some embodiments, at least a portion of the evaporator 710 overlaps with at least a portion of the middle frame 100 in its projection plane in the frontal view direction. Thus, the heat source component is mounted on the second heat source component 430. When the electronic device is in use, the heat source component can utilize the middle frame 100 for heat dissipation, ensuring that its heat energy only needs to travel a distance equal to the thickness of the middle frame 100 to transfer heat to the evaporator 710. This improves the heat absorption efficiency of the evaporator 710, causing the working fluid 800 to vaporize and rapidly dissipate heat from the heat source component, further accelerating the heat dissipation efficiency.

[0103] Based on any of the above embodiments, such as Figures 10 to 11 As shown, in some embodiments, the middle frame 100 is provided with a loop channel 130, and the middle frame 100 assembly also includes a sealing cap 140 covering the loop channel 130 and forming at least a portion of the loop heat pipe 700. Thus, by directly creating the loop channel 130 on the middle frame 100 and covering it with the sealing cap 140, the thickness of the middle frame 100 can be fully utilized to form at least a portion of the loop pipeline. This includes at least one of the following: at least a portion of the pipeline unit 720 or a liquid storage chamber 714.

[0104] The loop groove 130 can be formed by stamping, etching, laser engraving, milling and turning.

[0105] In some embodiments, the loop heat pipe groove 130 is an etching groove. Thus, etching technology can be used to form more loop heat pipe 700 structures on the mid-frame 100, such as pipe units 720, liquid storage chambers 714, evaporators 710, one-way valves, etc., making full use of the thickness of the mid-frame 100 to accommodate more loop heat pipes 700, which is beneficial for the ultra-thin design of electronic devices. At the same time, it can obtain a more precise loop heat pipe 700 structure, improving the reliability of the mid-frame 100 components.

[0106] In one example, the loop groove 130 is an etching groove, which includes capillary grooves. The loop groove 130 and the sealing cap 140 cooperate to form a loop heat pipe 700. In this way, the evaporator 710 can also be directly etched on the middle frame 100, which can simplify the assembly process and improve the production efficiency of the middle frame 100 assembly.

[0107] Optionally, in some embodiments, the sealing cap 140 is welded to the middle frame 100 for sealing. In this way, the welding sealing technology makes the sealing cap 140 and the middle frame 100 reliably sealed and fixed, and the two fit more tightly, which helps to reduce the size of the middle frame 100 assembly in the thickness direction.

[0108] Based on any of the above embodiments, such as Figure 9 or Figure 15 As shown, in some embodiments, the loop heat pipe 700 is flat. This allows for full utilization of the width and / or length dimensions of the mid-frame 100 to form a fluid channel, further reducing the thickness dimension of the mid-frame 100 assembly, which is beneficial for making electronic devices thinner and lighter. Simultaneously, it increases the contact area between the two, allowing the working fluid 800 to better absorb and dissipate heat.

[0109] Optionally, the maximum thickness of the loop heat pipe 700 is less than or equal to 0.5 mm. This allows electronic devices to be designed for ultra-thinness or to provide more space for other components. For example, this space can be used to accommodate a larger battery, thereby improving the battery life of the electronic device.

[0110] Optionally, the maximum thickness of the loop heat pipe 700 is less than or equal to 0.4 mm.

[0111] The thickness of the 700 loop heat pipe includes, but is not limited to, 0.5mm, 0.45mm, 0.4mm, 0.35mm, and 0.3mm.

[0112] In some embodiments, the evaporator 710 includes an evaporation section 713. The evaporation section 713 covers the middle frame 100 in its projection plane in the frontal view direction, and the area of ​​the evaporation section 713 is 1.5 to 2 times the area of ​​the middle frame 100. Thus, the evaporation section 713 can effectively dissipate heat from the heat source component, ensuring uniform and sufficient heat dissipation and preventing localized overheating of the heat source component.

[0113] Optionally, the evaporation section 713 includes a capillary wick.

[0114] Based on any of the above embodiments, such as Figure 11 and Figure 13As shown, in some embodiments, the piping unit 720 includes a first delivery pipe 721, a second delivery pipe 722, and a condenser pipe 723 that thermally engages with the cooling section 110. The condenser pipe 723 includes a cold end and a hot end. The cold end is connected to the liquid supply end 711 via the first delivery pipe 721, and the hot end is connected to the gas outlet end 712 via the second delivery pipe 722. Thus, by setting the condenser pipe 723, a circuitous condensation channel can be formed, fully utilizing the cooling section 110 for heat dissipation. Simultaneously, the condenser pipe 723, through the first delivery pipe 721 and the second delivery pipe 722, cooperates with the evaporator 710 to achieve the cyclic switching and orderly flow of the liquid working fluid 800 and the gaseous working fluid 800, resulting in higher heat dissipation reliability of the loop heat pipe 700.

[0115] Based on any of the above embodiments, in some embodiments, the inner diameter of the second delivery pipe 722 is larger than the inner diameter of the first delivery pipe 721. Thus, after the liquid working fluid 800 is vaporized, it can quickly flow into the second delivery pipe 722 (easily generating an airflow from positive pressure to negative pressure) and be transported to the condenser pipe 723 for cooling, which facilitates the circulation of the liquid working fluid 800 driven by the gaseous working fluid 800.

[0116] Optionally, the inner diameter of the second conveying pipe 722 is equal to 1, 1.5, or 2 times the inner diameter of the first conveying pipe 721.

[0117] Based on any of the above embodiments, in some embodiments, at least a portion of the condenser tube 723 overlaps with at least a portion of the cooling section 110 in the projection plane of the middle frame 100 in the frontal view direction. In this way, the heat dissipation distance can be minimized as much as possible, and the low temperature of the cooling section 110 can be fully utilized to cool the gas in the condenser tube 723.

[0118] Based on any of the above embodiments, such as Figure 11 and Figure 12 As shown, in some embodiments, the loop heat pipe 700 further includes an anti-backflow structure 730, which is disposed in the middle frame 100 so that the working fluid 800 flows through one end of the pipe unit 720 and into the evaporator 710 via the anti-backflow structure 730. Thus, the anti-backflow structure 730 ensures that the working fluid 800 circulates stably in the designed direction, thereby guaranteeing the stability and reliability of the loop heat pipe 700 operation.

[0119] The backflow prevention structure 730 includes, but is not limited to, structures such as one-way valves.

[0120] Alternatively, the anti-backflow mechanism is a Tesla valve structure 732.

[0121] like Figure 12 and Figure 14As shown, in some embodiments, the loop heat pipe 700 further includes a Tesla valve structure 732, which is disposed in the middle frame 100 so that the working fluid 800 flows through one end of the pipe unit 720 and into the evaporator 710 via the Tesla valve structure 732. Due to the Tesla valve's low forward flow resistance and extremely high reverse flow resistance, applying the Tesla valve structure 732 to the loop heat pipe 700 enables low-resistance backflow of the liquid working fluid 800 while preventing backflow of the liquid working fluid 800 within the evaporator 710. This ensures unidirectional low-resistance flow of the working fluid 800 within the evaporator 710, generating driving force and thus ensuring stable circulation of the loop heat pipe 700.

[0122] Optionally, the output area of ​​the Tesla valve structure 732 is generally designed to be equal to or approximately equal to the input area of ​​the capillary wick of the evaporator 710.

[0123] Based on any of the above embodiments, in some embodiments, the evaporator 710 includes an evaporation section 713 disposed between the liquid supply end 711 and the gas outlet end 712, and a Tesla valve structure 732 disposed between the liquid supply end 711 and the evaporation section 713, so that the working fluid 800 flows into the evaporation section 713 through the Tesla valve structure 732. In this way, the evaporator 710 and the Tesla valve structure 732 are coupled into one unit, which is beneficial for ultra-thin design, making the loop heat pipe 700 an ultra-thin flat plate with an overall thickness of less than 0.5mm. At the same time, the integrated evaporator 710 can be flexibly arranged; that is, multiple evaporators 710 can be set according to the multiple heat source locations on the electronic device. The Tesla valve structure 732 effectively prevents turbulence between multiple evaporators 710, ensuring stable operation between each evaporator 710, and facilitating modular assembly, which helps improve the production efficiency of the middle frame 100 assembly.

[0124] Based on the above embodiments, such as Figure 13 and Figure 14 As shown, in some embodiments, the evaporator 710 includes a liquid storage chamber 714, which is disposed between the liquid replenishment end 711 and the evaporation section 713. A Tesla valve structure 732 is disposed within the liquid storage chamber 714. By placing the Tesla valve structure 732 within the liquid storage chamber 714, the liquid working fluid 800 can be prevented from flowing out of the evaporator 710. This also helps to maintain the liquid working fluid 800 within the liquid storage chamber 714, ensuring that the evaporation section 713 can obtain the liquid working fluid 800 in a timely manner to continuously generate driving force. Furthermore, when the electronic equipment is not in use, the liquid storage chamber 714 can also store the liquid working fluid 800 for evaporation by the evaporation section 713.

[0125] Based on any of the above embodiments of the evaporation section 713, such as Figure 12 and Figure 14As shown, in some embodiments, there are at least two Tesla valve structures 732, which are arranged in parallel between the liquid replenishment end 711 and the evaporation section 713. Thus, employing at least two Tesla valves in parallel enhances the unidirectional flow capability of the Tesla valve structure 732 of this disclosure.

[0126] Optionally, the width of the Tesla valve structure 732 is less than 1 mm, the height is less than 0.5 mm, and the distance between two adjacent Tesla valve structures 732 is less than 1.5 mm.

[0127] like Figure 15 As shown, in some embodiments, the middle frame 100 is provided with a mounting groove 150 adapted to the loop heat pipe 700, and at least a portion of the loop heat pipe 700 is embedded in the middle frame 100 through the mounting groove 150. In this way, by using the mounting groove 150 to accommodate at least a portion of the loop heat pipe 700, it is easier for the loop heat pipe 700 to be embedded in the middle frame 100, thereby reducing the thickness of the middle frame 100 assembly.

[0128] Based on the above embodiments, in some embodiments, the middle frame 100 assembly further includes a thermally conductive adhesive layer 160, through which at least a portion of the loop heat pipe 700 is fixed within the mounting groove 150. In this way, the loop heat pipe 700 can be initially placed on the mounting groove 150 and then fixed using the thermally conductive adhesive layer 160, which improves the thermal conductivity of both components and facilitates their assembly.

[0129] The loop heat pipe 700 has a long heat transfer distance and strong anti-gravity capability, which solves the problem of traditional heat pipes being limited by their location and length. In addition, the loop heat pipe 700 of this disclosure separates the vapor channel and the liquid channel, with vapor and liquid flowing in their respective pipelines (e.g., vapor flows in the first delivery pipe 721 and liquid flows in the second delivery pipe 722), thereby eliminating the phenomenon of mutual carryover and ensuring high heat dissipation reliability; it also makes the installation of the loop heat pipe 700 flexible and convenient, no longer limited by the location and distance of the heat source and heat sink.

[0130] Based on any of the above embodiments, such as Figure 16 As shown, in some embodiments, the evaporator 710 includes two or more, with adjacent evaporators 710 spaced apart within the middle frame 100. The piping unit 720 includes a liquid replenishment branch 724 and an exhaust branch 725 corresponding to each evaporator 710. The liquid replenishment branch 724 is connected to the corresponding liquid replenishment end 711, and the exhaust branch 725 is connected to the corresponding exhaust end 712. Thus, the middle frame 100 assembly of this disclosure can actively dissipate heat from different heat source components on electronic devices, further improving heat dissipation efficiency.

[0131] By combining the aforementioned Tesla valve structure 732 or anti-backflow structure 730, each evaporator 710 has unidirectional flow characteristics, which can ensure that when the heat load difference is large, each evaporator 710 can also stably improve the circulation power and improve the stable operation of the parallel evaporator 710 structure.

[0132] Based on any of the above embodiments, in some embodiments, the greater the vapor generation rate between two adjacent evaporators 710, the larger the inner diameter of the corresponding liquid replenishment branch 724 and / or the inner diameter of the gas outlet branch 725. This allows for a reasonable distribution of the working fluid 800, ensuring smooth and sufficient compensation of the liquid working fluid 800 between each evaporator 710, thereby improving the reliability and stability of the middle frame 100 assembly during heat dissipation.

[0133] It should be noted that "a certain body" or "a certain part" can be a portion of the corresponding "component," meaning that "a certain body" or "a certain part" is integrally formed and manufactured with the "other parts of the component"; or it can be an independent component that can be separated from the "other parts of the component," meaning that "a certain body" or "a certain part" can be manufactured independently and then combined with the "other parts of the component" to form a whole. The expression of "a certain body" or "a certain part" in this disclosure is only one embodiment for ease of reading and is not intended to limit the scope of protection of this disclosure. Any technical solution that includes the above features and has the same function should be understood as an equivalent technical solution of this disclosure.

[0134] It should be noted that the "Tesla valve structure" can be one of the parts of the "evaporator" module, that is, it can be assembled into a module with the "other components of the evaporator" and then modularly assembled; or it can be relatively independent from the "other components of the evaporator" and can be installed separately, that is, it can form a whole with the "other components of the evaporator" in this device.

[0135] Similarly, the components included in the "heat dissipation device," "loop heat pipe," and "electronic device" of this disclosure can also be flexibly combined. They can be modularly produced according to actual needs and assembled as an independent module; or they can be assembled separately to form a module within the device. The division of the above components in this disclosure is merely one embodiment for ease of reading and is not intended to limit the scope of protection of this disclosure. Any solution that includes the above components and has the same function should be understood as an equivalent technical solution of this disclosure.

[0136] In the description of this disclosure, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0137] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0138] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0139] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0140] It should be noted that when an element is referred to as "fixed to," "set on," "fixed to," or "mounted on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intervening element. The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered to be within the scope of this specification.

[0141] The above embodiments are merely illustrative of several implementation methods of this disclosure, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure.

Claims

1. An electronic device, comprising: include: The middle frame, including the first side; Heat dissipation unit, wherein the heat dissipation unit is disposed on the first surface; A shielding cover is provided at an interval from the heat dissipation unit, and the shielding cover is provided with a shielding cavity; A heat source module is disposed between the heat dissipation unit and the shielding cover. The heat source module includes a circuit board disposed on the heat dissipation unit and a first heat source component disposed on the circuit board. The first heat source component is disposed inside the shielding cavity. as well as A heat dissipation device is used to dissipate heat from the shield and / or the heat source module. The heat dissipation device includes a cooling fan and a semiconductor cooling device disposed in the shield cavity. The heat-absorbing part of the semiconductor cooling device is thermally conductively connected with the first heat source component, and the heat-releasing part of the semiconductor cooling device is thermally conductively connected with the shield. The cooling fan is disposed towards the outside of the shield. The electronic device also includes a protective cover that cooperates with the mid-frame to form a protective space. The heat source module is disposed in the protective space, and the cooling fan is detachably disposed on the protective cover. The protective cover has a vent that communicates with the protective space. When the electronic device can meet the heat dissipation requirements using the semiconductor cooling device, the cooling fan is detached from the protective cover. When the semiconductor cooling device cannot meet the heat dissipation requirements, the cooling fan is connected to an external power source and installed in the electronic device through the protective cover, so as to send external gas into the electronic device through the vent.

2. The electronic device of claim 1, wherein, The heat dissipation device includes a passive heat dissipation structure, which is disposed on the outside of the shield.

3. The electronic device according to claim 1, characterized in that, The protective cover is provided with a waterproof and breathable membrane, which covers the ventilation holes.

4. The electronic device according to claim 1, characterized in that, The heat exchanger unit includes a heat exchanger plate containing a phase change working fluid, the boiling point of which is 20℃~90℃.

5. The electronic device according to any one of claims 1 to 4, characterized in that, The heat source module further includes a second heat source component, which is disposed on the other side of the circuit board relative to the first heat source component, and the second heat source component is thermally connected with the heat dissipation unit.

6. The electronic device according to claim 5, characterized in that, The first heat source component is a resistive container component, and the second heat source component is a central processing unit.

7. The electronic device according to claim 5, characterized in that, The mid-frame body further includes a cooling section and a second surface disposed opposite to the first surface, and the electronic device further includes: A loop heat pipe is disposed on the second surface. The loop heat pipe includes an evaporator and a piping unit. The evaporator is disposed opposite to the second heat source component. The evaporator includes a liquid inlet end and a gas outlet end. One end of the piping unit is connected to the liquid inlet end, and the other end is connected to the gas outlet end. A portion of the piping unit is thermally connected to the cooling section. The working fluid, which is disposed in the loop heat pipe and is in a liquid state, can be converted into a gaseous state by the evaporator. The gaseous working fluid can flow into the pipeline unit through the gas outlet. The gaseous working fluid can be reliquefied in the pipeline unit and sent to the liquid replenishment end.

8. The electronic device according to claim 7, characterized in that, The piping unit includes a first delivery pipe, a second delivery pipe, and a condenser pipe that is thermally connected to the cooling section. The condenser pipe includes a cold end and a hot end. The cold end is connected to the liquid replenishment end through the first delivery pipe, and the hot end is connected to the gas outlet end through the second delivery pipe.

9. The electronic device according to claim 7, characterized in that, The loop heat pipe also includes an anti-backflow structure, which is disposed on the middle frame body so that the working fluid flows through one end of the pipe unit and into the evaporator through the anti-backflow structure.

10. The electronic device according to claim 7, characterized in that, The loop heat pipe also includes a Tesla valve structure, which is disposed on the middle frame body so that the working fluid flows through one end of the pipe unit and into the evaporator via the Tesla valve structure.

11. The electronic device according to claim 10, characterized in that, The evaporator includes an evaporation section disposed between the liquid supply end and the gas outlet end, and a Tesla valve structure disposed between the liquid supply end and the evaporation section so that the working fluid flows into the evaporation section through the Tesla valve structure.

12. The electronic device according to claim 11, characterized in that, The evaporator includes a liquid storage chamber disposed between the liquid replenishment end and the evaporation section, and the Tesla valve structure is disposed within the liquid storage chamber; and / or, there are at least two Tesla valve structures, which are arranged in parallel between the liquid replenishment end and the evaporation section.

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