电路板焊接异常的标识方法、装置和电子设备
By recognizing size markings and component borders in circuit board images, generating test number bitmaps and comparing them, the problem of large errors in circuit board soldering inspection is solved, and high-accuracy soldering anomaly identification is achieved.
CN115170539BActive Publication Date: 2026-07-17NEUSOFT RUICHI AUTOMOTIVE TECH (DALIAN) CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NEUSOFT RUICHI AUTOMOTIVE TECH (DALIAN) CO LTD
- Filing Date
- 2022-07-26
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Existing technologies for circuit board soldering inspection suffer from large errors, which cannot guarantee production reliability, and manual inspection is inefficient and inaccurate.
Method used
By acquiring circuit board images, identifying size markings and component borders, generating a test location map, and comparing it with an ideal location map, soldering abnormalities are identified.
Benefits of technology
It improves the accuracy of circuit board soldering inspection, and can clearly identify the position, model and orientation of soldered components, with high inspection accuracy.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN115170539B_ABST
Abstract
本发明提供了一种电路板焊接异常的标识方法、装置和电子设备，涉及电路板检测的技术领域，包括：获取待测电路板的电路板图像，并识别电路板图像中的尺寸标识和器件边框，其中，尺寸标识用于表征待测电路板的尺寸，每个器件边框内用于焊接相应器件；根据尺寸标识、焊接器件和器件边框，生成待测电路板对应的待测号位图；基于待测号位图与待测电路板对应的理想号位图的比对结果，标识电路板图像中的焊接异常，解决了电路板错漏焊接检测不准的技术问题。
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