Packaging structure of display panel and preparation method thereof

Abstract

The present application discloses a packaging structure of a display panel and a preparation method thereof, wherein the packaging structure of the display panel comprises: a substrate having a display area and a non-display area surrounding the display area; a packaging cover plate arranged opposite to the substrate; a packaging component located in the non-display area of ​​the substrate and used to seal and connect the packaging cover plate and the substrate; and a barrier dam arranged on a side of the substrate facing the packaging cover plate and surrounding the periphery of the packaging component. The packaging structure of the display panel of the present application and the preparation method thereof can solve the problems of glue overflow or glue flushing in the process of packaging using the packaging cover plate.

Description

Technical Field

[0001] The present application relates to the technical field of display panels, and in particular to a packaging structure of a display panel and a preparation method thereof. Background Art

[0002] Compared with liquid crystal displays (LCDs), OLED (Organic Light Emitting Diode) display panels have the advantages of self-luminescence, fast response, wide viewing angle, high brightness, bright colors, and lightness. Currently, existing OLED display panels are mostly packaged with cover plates. Figure 1 The schematic diagram of the existing flexible OLED display panel using a cover plate for packaging is shown. Figure 1 As shown, in the process of encapsulating the substrate 920 using the cover plate 910, it is usually necessary to pre-apply a filling glue 931 (fill glue) on the cover plate 910, and form a first frame glue 932 (gater glue) and a second frame glue 933 (dam glue) at the edge of the cover plate 910; then, the cover plate 910 and the substrate 920 are aligned, pressed, and cured to complete the encapsulation. The first frame glue 932 and the second frame glue 933 are prepared in the form of a glue frame, so during the pressing process, the first frame glue 932 and / or the second frame glue 933 are prone to overflow or flushing, so that the second frame glue 933 will cover the cutting line 901 of the substrate 920, thereby causing defects such as broken pieces and burrs during the cutting process.

[0003] Therefore, there is an urgent need to design a packaging structure of a display panel and a manufacturing method thereof to solve the above problems. Summary of the invention

[0004] The present application provides a packaging structure of a display panel and a preparation method thereof, so as to solve the problems of glue overflow or glue flushing in the packaging process using a packaging cover plate.

[0005] To achieve the above-mentioned purpose, on the one hand, the present application provides a packaging structure of a display panel, comprising:

[0006] A substrate having a display area and a non-display area surrounding the display area;

[0007] A packaging cover plate, arranged opposite to the substrate;

[0008] A packaging component, located in the non-display area of ​​the substrate, used to seal and connect the packaging cover plate and the substrate; and

[0009] The barrier dam is arranged on a side of the substrate facing the packaging cover plate and surrounds the periphery of the packaging component.

[0010] Optionally, in some embodiments of the present application, the material of the barrier dam is an organic material.

[0011] Optionally, in some embodiments of the present application, the non-display area of ​​the substrate has a preset cutting line.

[0012] In a horizontal projection plane of the substrate, the barrier dam is located inside the preset cutting line.

[0013] Optionally, in some embodiments of the present application, the barrier dam is an annular structure provided around the periphery of the substrate.

[0014] Optionally, in some embodiments of the present application, a receiving groove recessed toward the substrate is provided on the end surface of the barrier dam away from the substrate.

[0015] Optionally, in some embodiments of the present application, in a direction perpendicular to the substrate, the height of the barrier dam is Hum, the recessed depth of the receiving groove is Dum, and D≤2 / 3H.

[0016] Optionally, in some embodiments of the present application, the packaging component includes:

[0017] A first plastic frame is located between the packaging cover plate and the substrate and connects the packaging cover plate and the substrate;

[0018] A second plastic frame is arranged around the periphery of the first plastic frame, the second plastic frame is located between the packaging cover plate and the substrate, and connects the packaging cover plate and the substrate;

[0019] A filling glue layer is filled in the sealed space between the substrate, the packaging cover plate and the first glue frame;

[0020] Furthermore, the barrier dam ring is arranged on the periphery of the second rubber frame.

[0021] On the other hand, the present application provides a method for preparing a packaging structure of a display panel, the method comprising:

[0022] A substrate is provided, comprising a display area and a non-display area surrounding the display area, a barrier dam is formed in the non-display area of ​​the substrate, the non-display area has a preset cutting line, and the barrier dam is located inside the cutting line;

[0023] Providing a packaging cover plate, and forming a packaging material on the packaging cover plate;

[0024] The packaging cover plate and the substrate are aligned and pressed in a manner that the packaging material and the barrier dam face each other and the barrier dam is located outside the packaging material, and the packaging material is cured to form a packaging component. The packaging component is located between the packaging cover plate and the substrate and seals the packaging cover plate and the substrate.

[0025] Optionally, in some embodiments of the present application, the step of providing a substrate further includes:

[0026] A receiving groove recessed toward the substrate is formed on the end surface of the barrier dam away from the substrate.

[0027] Optionally, in some embodiments of the present application, the step of forming a packaging material on the packaging cover includes:

[0028] Forming a first sealant material on the packaging cover plate and surrounding the packaging cover plate;

[0029] Forming a second sealant material on the package cover plate and surrounding the package cover plate, wherein the second sealant material surrounds the periphery of the first sealant material; and

[0030] Applying a filling glue material on the inner side of the first sealant material;

[0031] The step of pressing the package cover plate and the substrate together comprises:

[0032] In the process of aligning and pressing the package cover plate and the substrate, the first sealant material and the second sealant material are located between the barrier dam and the display area; and

[0033] In the process of curing the packaging material to form a packaging component, the filling glue material, the first frame glue material and the second frame glue material respectively form a filling glue layer, a first glue frame and a second glue frame.

[0034] Compared with the prior art, the packaging structure of the display panel and the method for preparing the packaging structure of the display panel described in the present application can prevent the packaging material from overflowing by forming a barrier dam on the substrate that can surround the periphery of the packaging component, thereby preventing the substrate from generating defects such as breakage and burrs during the cutting process. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0036] Figure 1 A schematic diagram of the packaging structure of an existing flexible OLED display panel.

[0037] Figure 2 It is a cross-sectional view of a first embodiment of a packaging structure of a display panel provided according to an embodiment of the present application.

[0038] Figure 3 FIG. 1 is a plan view of a first embodiment of a packaging structure of a display panel provided according to an embodiment of the present application.

[0039] Figure 4 It is a cross-sectional view of a second embodiment of a packaging structure of a display panel provided according to an embodiment of the present application.

[0040] Figure 5 1 is a schematic plan view of a second embodiment of a packaging structure of a display panel provided according to an embodiment of the present application.

[0041] Figure 6 to Figure 8 It is a schematic diagram of the variation process of the display panel packaging structure provided according to the embodiment of the present application corresponding to the first embodiment of the preparation method.

[0042] Figures 9 to 11 It is a schematic diagram of the variation process of the display panel packaging structure provided according to the embodiment of the present application corresponding to the second embodiment of the preparation method. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0044] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0045] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0046] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0047] The present application provides a display panel packaging structure 100 and a method for preparing the display panel packaging structure 100, which are described in detail below. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments of the present application.

[0048] See also Figure 2 and Figure 3 , Figure 2 This is a schematic diagram of a first embodiment of a packaging structure 100 of a display panel provided in the present application. Figure 3 for Figure 2 Schematic diagram of the floor plan.

[0049] like Figure 2 and Figure 3 As shown, the present application provides a packaging structure 100 of a display panel, and the packaging structure 100 of the display panel includes a substrate 10, a packaging cover plate 20, a packaging component 40 and a barrier dam 30. The substrate 10 has a display area 101 and a non-display area 102, and the packaging cover plate 20 is arranged opposite to the substrate 10. The packaging component 40 is located in the non-display area 102 of the substrate 10, and is used to seal and connect the packaging cover plate 20 and the substrate 10. The barrier dam 30 is arranged on the side of the substrate 10 facing the packaging cover plate, and the barrier dam 30 surrounds the periphery of the packaging component 40.

[0050] Compared with the prior art, the present application adds a barrier dam 30 on the substrate 10 and is arranged around the outer periphery of the packaging component 40, so that the packaging component 40 is blocked inside the barrier dam 30, thereby preventing the packaging material of the packaging component 40 from overflowing (i.e., glue flushing or overflowing) during the pressing process of the packaging cover plate 20 and the substrate 10, thereby avoiding the cutting abnormality (loss) problem caused by the overflow of the packaging material (i.e., glue flushing or overflowing). At the same time, in actual use, the barrier dam 30 can also block the intrusion of water and oxygen, protect the packaging component 40 and the substrate 10, and improve the sealing effect of the packaging component 40 and the reliability of the display panel.

[0051] The material of the barrier dam 30 is an organic material. By adopting an organic material, the barrier dam 30 can also disperse the cutting stress during the cutting process, thereby reducing the cracks and burrs on the edge of the substrate 10 caused by cutting. Furthermore, the material of the barrier dam 30 can be an organic polymer material. In a specific implementation, the organic material can be PFA or an organic photoresist material. However, it should be pointed out that the present application does not limit the material type of the barrier dam 30.

[0052] In a specific implementation, the display panel has a display function area and a non-display function area surrounding the display function area. Figure 2 As shown, the substrate 10 has a display area 101 and a non-display area 102 corresponding to the display function area and the non-display function area of ​​the display panel respectively.

[0053] Furthermore, the display area 101 is located in the central area of ​​the substrate 10, and the non-display area 102 is disposed around the periphery of the display area 101 in a manner adjacent to the outer periphery of the display area 101. In short, from the center of the substrate 10 to the edge of the substrate 10, the substrate 10 has the display area 101 and the non-display area 102 in sequence.

[0054] Schematically, the non-display area 102 of the substrate 10 has a preset cutting line 103. In the horizontal projection plane of the substrate 10, the preset cutting line 103 surrounds the periphery of the packaging component 40 in a manner of being spaced from the outer periphery of the packaging component 40.

[0055] In order to more clearly show the position of the preset cutting line 103 and the packaging component 40 of the present application, Figure 2 and Figure 3 A schematic diagram of the display panel before cutting is provided schematically. Figure 2 and Figure 3The preset cutting line 103 represents the preset cutting trajectory, and the preset trajectory can be understood as the preset path of the cutting knife in the cutting process. It can be understood that the preset cutting line 103 corresponds to the cutting line (i.e., the cutting trajectory) after cutting. It can also be understood that the preset cutting trajectory also corresponds to the cutting edge.

[0056] Please refer to Figure 2 and Figure 3 , based on the above embodiment, the barrier dam 30 is located on the inner side of the preset cutting line 103. More specifically, the orthographic projection of the barrier dam 30 on the substrate 10 is located between the packaging component 40 and the preset cutting line 103. At this time, there is a gap between the outer edge of the barrier dam 30 and the preset cutting line 103. Such a configuration can prevent the barrier dam 30 from easily falling off or failing due to the barrier dam 30 being too close to the cutting line 103 of the substrate 10 (i.e., the cutting edge of the substrate 10). At the same time, in the manufacturing process of the display panel, it can prevent the barrier dam 30 from covering the preset cutting line 103 due to processing errors or expansion deformation, and prevent the barrier dam 30 itself from causing cutting abnormalities.

[0057] In a specific implementation, the barrier dam 30 is a ring-shaped structure arranged around the periphery of the substrate 10. Figure 3 , when viewed from the horizontal projection plane of the display panel, the planar shape of the barrier dam 30 is annular. In this way, the barrier dam 30 plays a blocking role in the entire circumference of the substrate 10. For illustration, please refer to Figure 3 In this embodiment, the barrier dam 30 is in the shape of a rounded rectangle. However, it should be noted that the present application does not substantially limit the planar shape of the barrier dam 30. In specific implementation, the shape of the barrier dam 30 can be adaptively adjusted according to the planar shape of the display panel. More specifically, the barrier dam 30 is a continuous annular structure arranged around the periphery of the substrate 10.

[0058] Please refer to Figure 2 A receiving groove 302 is provided on the end surface 301 of the barrier dam 30 away from the substrate 10 and is recessed toward the substrate 10. The receiving groove 302 can be used to receive the overflowed packaging material to prevent the packaging material from being flushed or overflowing to the inside (i.e., the display area 101 side), thereby improving the stability of the display panel.

[0059] For more details, please refer to Figure 3 , observed from the horizontal projection plane of the display panel, the receiving groove 302 is an annular groove formed along the entire circumference of the barrier dam 30 . In addition, the opening of the receiving groove 302 is open to the side of the packaging cover plate 20 .

[0060] Furthermore, in order to allow the packaging material to overflow quickly and conveniently into the receiving groove 302 and improve the effect of the barrier dam 30 in preventing glue from rushing or overflowing, an overflow port connected to the receiving groove 302 is opened on the inner wall of the barrier dam 30 (i.e., the side wall of the barrier dam 30 close to the packaging component 40).

[0061] Alternatively, the height of the inner wall of the barrier dam 30 (i.e., the side wall of the barrier dam 30 close to the packaging component 40) is lower than the height of the outer wall of the barrier dam (i.e., the side wall of the barrier dam 30 away from the packaging component 40). Such a setting can also facilitate the purpose of introducing the overflowed packaging material into the receiving groove 302.

[0062] In the stacking direction of the substrate 10 and the package cover plate 20, the height of the barrier dam 30 is Hum, the recessed depth of the receiving groove 302 is Dum, and D≤2 / 3H. In this way, the strength and protection effect of the barrier dam 30 can be ensured while improving the ability of the receiving groove 302 to receive overflow glue.

[0063] Please refer to Figure 2 Further, the packaging cover plate 20 has a first surface 201 facing the substrate 10, wherein an end surface 301 of the barrier dam 30 away from the substrate 10 is coplanar with the first surface 201; or, the end surface 301 of the barrier dam 30 away from the substrate 10 is closer to the substrate 10 than the first surface 201.

[0064] In some embodiments, the substrate 10 is a display substrate. Figure 2 , the substrate 10 may be an OLED display substrate.

[0065] In some embodiments, the package cover plate may be a glass plate or a metal plate. Preferably, the package cover plate is a glass substrate.

[0066] For further information, please refer to Figure 2 The substrate 10 includes a base substrate 11, a thin film transistor layer 12, a light emitting device layer 13 and a packaging layer 14 stacked in sequence in a direction close to the packaging cover plate 20. The packaging layer 14 is an inorganic layer or a laminated film of an inorganic layer and an organic layer.

[0067] More specifically, the barrier dam 30 is formed on the surface of the base substrate 11 facing the package cover plate 20, and the barrier dam 30 protrudes from the base substrate 11 toward the package cover plate 20. In short, the barrier dam 30 is protruding on the surface of the base substrate 11 facing the package cover plate 20.

[0068] Based on the above embodiment, the packaging component 40 is disposed between the base substrate 11 and the packaging cover plate 20 and seals the packaging cover plate 20 and the base substrate 11 . There is a distance Lum between the two facing surfaces of the packaging cover plate 20 and the base substrate 11 , and H≤L.

[0069] Figure 2 and Figure 3 The case where the barrier dam 30 is directly formed on the base substrate 11 is only schematically shown. However, it should be noted that the film layer position of the barrier dam 30 of the present application is not limited thereto. For example, in some other embodiments, the barrier dam 30 can also be formed on the film layer of the thin film transistor layer 12.

[0070] Furthermore, in a specific implementation, the barrier dam 30 can be obtained by a separate process. In some other embodiments, the barrier dam 30 can be formed in the process of one or more film layers in the thin film transistor layer 12. In this way, the manufacturing efficiency can be improved, and the process and cost can be saved.

[0071] Please refer to Figure 3 Schematically, the packaging component 40 includes a filling glue layer 41, a first glue frame 42 and a second glue frame 43. The first glue frame 42 is located between the packaging cover plate 20 and the substrate 10, and connects the packaging cover plate 20 and the substrate 10. The second glue frame 43 is arranged around the periphery of the first glue frame 42, and the second glue frame 43 is located between the packaging cover plate 20 and the substrate 10, and connects the packaging cover plate and the substrate 10. The filling glue layer 41 is filled in the gap between the substrate 10, the packaging cover plate 20 and the first glue frame 42. The barrier dam 30 is arranged around the periphery of the second glue frame 43.

[0072] Further combined with the embodiment of the substrate 10, it can be known that the filling glue layer 41 is implemented in the form of a glue layer, and the filling glue layer 41 covers the encapsulation layer 14 and the base substrate 11. At the same time, the filling glue layer 41 is also connected to the first surface 201 of the encapsulation cover plate 20. At this time, the filling glue layer 41 can support the substrate 10 and the encapsulation cover plate 20, increase the mechanical strength of the display panel, and slow down the entry speed of water vapor. It can be understood that the transparency of the filling glue layer 41 is 90% to 100%, which will not affect the transmission of light. The first glue frame 42 and the second glue frame 43 are respectively implemented in the form of glue frames.

[0073] Further combined with the embodiment of the substrate 10, it can be known that the barrier dam 30 and the base substrate 11 enclose a first enclosed area to construct a first barrier layer; the second glue frame 43 is located between the base substrate 11 and the packaging cover plate 20, and the two are sealed and connected, and the second glue frame 43 and the base substrate 11 and the packaging cover plate 20 together enclose a second enclosed area to construct a second barrier layer; the first glue frame 42 is sealed and connected between the base substrate 11 and the packaging cover plate 20, and forms a third enclosed area with the base substrate 11 and the filling glue layer 41 to construct a third barrier layer; the base substrate 11 and the packaging cover plate 20 form a fourth enclosed area to construct a fourth barrier layer. Furthermore, the second enclosed area is located within the first enclosed area, the third enclosed area is located within the second enclosed area, the fourth enclosed area is located within the third enclosed area, and the light-emitting device layer 13 is located within the fourth enclosed area, thereby blocking the path for water and oxygen invasion, improving the water barrier property of the material, delaying the failure time of the light-emitting device layer 13, enhancing the packaging effect, and improving the problem of easy failure of the four corners of the display panel.

[0074] Please refer to Figure 4 and Figure 5 , Figure 4 and Figure 5 Schematic diagram of a second embodiment of a packaging structure 100 of a display panel provided in the present application. Figure 2 and Figure 3 The difference of the provided packaging structure 100 of the display panel is that the end surface 301 of the barrier dam 30 away from the substrate 10 is not provided with the receiving groove 302 .

[0075] Accordingly, please refer to Figure 6 to Figure 8 , Figure 6 to Figure 8 FIG. 1 is a schematic diagram of a variation process of the packaging structure of the display panel of the present application corresponding to the first embodiment of the preparation method. The preparation method of the packaging structure of the display panel described in this embodiment can be used to prepare Figure 2 and Figure 3 The packaging structure of the display panel shown.

[0076] The preparation method provided in the embodiments of the present application comprises the following steps:

[0077] S100, providing a packaging cover plate 20, and forming a packaging material 400 on the packaging cover plate 20;

[0078] S200, providing a substrate 10, comprising a display area 101 and a non-display area 102 surrounding the display area 101, wherein a barrier dam 30 is formed in the non-display area 102 of the substrate 10, the non-display area 102 having a preset cutting line 103, and the barrier dam 30 is located inside the preset cutting line 103;

[0079] S300, the packaging cover plate 20 and the substrate 10 are pressed together in such a manner that the packaging material 400 and the barrier dam 30 are facing each other and the barrier dam 30 is located outside the packaging material 400, and the packaging material 400 is cured to form a packaging component 40, wherein the packaging component 40 is located between the packaging cover plate 20 and the substrate 10 and seals and connects the packaging cover plate 20 and the substrate 10.

[0080] Compared with the prior art, the present application adds a barrier dam 30 in the non-display area 102 of the substrate, and the barrier dam 30 is located on the inner side of the preset cutting line 103, and the packaging material 400 on the packaging cover plate 20 is located on the inner side of the barrier dam 30, thereby preventing the packaging material 400 from overflowing (i.e., flushing or overflowing) during the pressing process of the packaging cover plate 20 and the substrate 10, thereby avoiding the cutting abnormality (loss) problem caused by the overflow of the packaging material 400 (i.e., flushing or overflowing).

[0081] Please refer to Figure 6 In the step 100, i.e., the step of forming the packaging material 400 on the packaging cover plate 20 specifically includes: forming a first sealant material 420 on the packaging cover plate 20 and surrounding the packaging cover plate 20; forming a second sealant material 430 on the packaging cover plate 20 and surrounding the packaging cover plate 20, wherein the second sealant material 430 surrounds the periphery of the first sealant material 420; and coating a filling sealant material 410 on the inner side of the first sealant material 420.

[0082] The filling glue material 410 is implemented in the form of multiple filling glue material particles. Based on this, the coating method of the filling glue material 410 may include: spraying, spin coating, and printing. Preferably, the coating method of the multiple filling glue materials is spraying. The spraying method can better control the particle size of the filling glue, and obtain multiple filling glues with a preset particle size, and the particle size is relatively consistent. Specifically, the particle size of the filling glue material 410 is 1 to 50 microns.

[0083] The first sealant material 420 and the second sealant material 430 are respectively implemented in the form of a sealant frame. At this time, the first sealant material 420 and the second sealant material 430 can be formed on the packaging cover plate 20 by a glue dispenser. In specific implementation, the first sealant material 420 and the second sealant material 430 can be made of organic materials such as epoxy resin or acrylic resin.

[0084] like Figure 7As shown, in the step S200, the substrate 10 has a display area 101 and a non-display area 102, and a preset cutting line 103 is provided in the non-display area 102. The substrate 10 includes a base substrate 11 and a thin film transistor layer 12 disposed on the base substrate 11, and the thin film transistor layer 12 is located in the display area 101.

[0085] The barrier dam 30 is directly formed on the side of the base substrate 11 where the thin film transistor layer 12 is provided. More specifically, the orthographic projection of the barrier dam 30 formed on the array substrate is located between the outer edge of the thin film transistor layer 12 and the preset cutting line 103. In an embodiment of the present application, the barrier dam 30 can be prepared by a separate process. In this case, the barrier dam 30 can be manufactured by coating or inkjet printing. In other embodiments, the barrier dam 30 can be obtained by preparing one or more film layers of the thin film transistor 12.

[0086] Furthermore, a receiving groove 302 is formed on the end surface of the barrier dam 30 away from the base substrate 11 and is recessed toward one side of the base substrate 11. In a specific implementation, the receiving groove 302 can be made by half tone or laser.

[0087] Please continue to refer to Figure 7 , the step S200 further includes: preparing a light emitting device layer 13 on the substrate 10, wherein the light emitting device layer 13 is formed on the thin film transistor layer 12 of the display area 101. Further, after the preparation of the light emitting device layer 13 is completed, a packaging layer 14 is also prepared on the light emitting device layer 13, and the packaging layer 14 covers the light emitting device layer 13 and the thin film transistor layer 12. Figure 7 As shown, at this time, there is a spacing area 104 between the encapsulation layer 14 and the barrier dam 30 .

[0088] like Figure 8 As shown, in the step S300 , the substrate 10 and the packaging cover plate 20 are first aligned and vacuum-bonded; then, the packaging material 400 is cured to form a packaging component 40 .

[0089] In the process of "aligning and vacuum bonding", the substrate 10 is arranged in a manner that the barrier dam 30, the light-emitting device layer 13, and the encapsulation layer 14 face the encapsulation cover plate 20, and the encapsulation cover plate 20 is opposed to each other in a manner that the filling glue material 410, the first frame glue material 420 and the second frame glue material 430 face the substrate 10; at the same time, the first frame glue material 420 and the second frame glue material 430 are bonded in a manner that the first frame glue material 420 and the second frame glue material 430 are aligned with the spacing area 104.

[0090] Obviously, during the above-mentioned alignment and pressing process, the barrier dam 30 can block the second glue material 430 in the spacing area 104, preventing the second glue material 430 from flowing to the side of the preset cutting line 103, thereby preventing the glue overflow problem from occurring. At the same time, the second glue material 430 will quickly flow into the receiving groove 302 on the barrier dam 30 under extrusion, and the second glue material 430 will be filled in the receiving groove 302. In this way, on the one hand, the structural strength of the barrier dam 30 itself can be improved, and on the other hand, the second glue material 430 can be prevented from overflowing to the side of the display area 101, preventing the problem of glue overflowing inward.

[0091] It is understandable that, in order to improve the effect of the packaging material 400 overflowing into the receiving groove 302, the height of the barrier dam 30 can be set to be smaller than the first sealant material 420 and the second sealant material 430, so that the end surface 301 of the barrier dam 30 away from the base substrate 11 and the first surface 201 are coplanar after the pressing process, so that the barrier dam 30 has a better barrier effect, and the packaging material 400 overflows more conveniently. Alternatively, the end surface of the barrier dam 30 away from the base substrate 11 is closer to the base substrate 11 than the first surface 201, so that the barrier dam 30 has a better barrier effect, and the packaging material 400 overflows more conveniently.

[0092] The curing process may be performed by ultraviolet light irradiation and / or heating. After the curing process, the filling glue material 410, the first frame glue material 420 and the second frame glue material 430 are respectively cured to form the filling glue layer 41, the first glue frame 42 and the second glue frame 43.

[0093] Please refer to Figures 9 to 11 , Figures 9 to 11 FIG. 1 is a schematic diagram of a display panel packaging structure of the present application corresponding to a method process of the second embodiment of the preparation method. Figure 6 to Figure 8 The difference between the method for preparing the display panel packaging structure provided is that the step of providing a substrate does not include: forming a receiving groove 302 recessed toward the base substrate 11 on the end surface 301 of the barrier dam 30 away from the base substrate 11. The method for preparing the display panel packaging structure of this embodiment can be used to prepare Figure 4 and Figure 5 The display panel packaging structure shown.

[0094] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0095] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims. In addition, the specification uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and its core idea of ​​the present application. The content of this specification should not be understood as a limitation on the present application.

Claims

1. A packaging structure of a display panel, characterized in that: include: A substrate having a display area and a non-display area surrounding the display area; A packaging cover plate, arranged opposite to the substrate; A packaging component, located in a non-display area of ​​the substrate, used to seal and connect the packaging cover plate and the substrate; as well as, A barrier dam is provided on a side of the substrate facing the package cover plate and surrounds the periphery of the package component; The non-display area of ​​the substrate has a preset cutting line, and the barrier dam is located inside the preset cutting line in a horizontal projection plane of the substrate; The package cover plate has a first surface facing the substrate, wherein an end surface of the barrier dam away from the substrate is coplanar with the first surface, and an orthographic projection of the package cover plate on the substrate is within the orthographic projection range of the barrier dam on the substrate; A receiving groove recessed toward the substrate is provided on the end surface of the barrier dam away from the substrate, and the height of the side wall of the barrier dam close to the packaging component is lower than the height of the side wall of the barrier dam away from the packaging component; In a direction perpendicular to the substrate, the height of the barrier dam is Hum, the recessed depth of the receiving groove is Dum, and D≤2 / 3H.

2. The packaging structure of the display panel according to claim 1, characterized in that: The material of the barrier dam is organic material.

3. The packaging structure of the display panel according to claim 1, characterized in that: The barrier dam is a ring-shaped structure arranged around the periphery of the substrate.

4. The packaging structure of the display panel according to claim 1, wherein: The packaging assembly comprises: A first plastic frame is located between the packaging cover plate and the substrate and connects the packaging cover plate and the substrate; A second plastic frame is arranged around the periphery of the first plastic frame, the second plastic frame is located between the packaging cover plate and the substrate, and connects the packaging cover plate and the substrate; A filling glue layer is filled in the sealed space between the substrate, the packaging cover plate and the first glue frame; Furthermore, the barrier dam ring is arranged on the periphery of the second rubber frame.

5. A method for preparing a packaging structure of a display panel, characterized in that: The preparation method comprises: A substrate is provided, comprising a display area and a non-display area surrounding the display area, a barrier dam is formed in the non-display area of ​​the substrate, the non-display area has a preset cutting line, and the barrier dam is located inside the cutting line; Providing a packaging cover plate, forming a packaging material on the packaging cover plate, wherein the packaging cover plate has a first surface facing the substrate, and the packaging material is formed on the first surface; The packaging cover plate and the substrate are aligned and pressed together in a manner that the packaging material and the barrier dam face each other and the barrier dam is located outside the packaging material, and the packaging material is cured to form a packaging component, wherein the packaging component is located between the packaging cover plate and the substrate and seals the packaging cover plate and the substrate; After the packaging cover plate and the substrate are aligned and pressed together, the end surface of the barrier dam away from the substrate is coplanar with the first surface, and the orthographic projection of the packaging cover plate on the substrate is within the orthographic projection range of the barrier dam on the substrate; The step of providing a substrate also includes: A receiving groove recessed toward the substrate is formed on the end surface of the barrier dam away from the substrate, and the height of the side wall of the barrier dam close to the packaging component is lower than the height of the side wall of the barrier dam away from the packaging component, wherein in the direction perpendicular to the substrate, the height of the barrier dam is Hum, the recessed depth of the receiving groove is Dum, and D≤2 / 3H.

6. The method for preparing a packaging structure according to claim 5, characterized in that: The step of forming a packaging material on the packaging cover plate comprises: Forming a first sealant material on the packaging cover plate and surrounding the packaging cover plate; Forming a second sealant material on the package cover plate and surrounding the package cover plate, wherein the second sealant material surrounds the periphery of the first sealant material; and Applying a filling glue material on the inner side of the first sealant material; The step of aligning and pressing the packaging cover plate and the substrate comprises: In the process of aligning and pressing the package cover plate and the substrate, the first sealant material and the second sealant material are located between the barrier dam and the display area; and In the process of curing the packaging material to form a packaging component, the filling glue material, the first frame glue material and the second frame glue material respectively form a filling glue layer, a first glue frame and a second glue frame.

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