Printed wiring board and method for processing a printed wiring board

Abstract

The application discloses a printed circuit board and a preparation method of the printed circuit board. The printed circuit board comprises a primary processing circuit board, a dielectric layer and a reflective metal layer. The dielectric layer is arranged on the surface of the primary processing circuit board. The reflective metal layer is arranged on the surface of the dielectric layer away from the primary processing circuit board. The reflective metal layer is combined on the primary processing circuit board through the dielectric layer, the reflectivity of the primary processing circuit board is increased, the energy consumption is reduced, and the energy is effectively saved.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board manufacturing technology, and in particular to a printed circuit board and a method for processing printed circuit boards. Background Technology

[0002] In the field of LCD screen backlighting, LED backlighting has unparalleled advantages. In terms of appearance, LED backlighting allows for thinner and lighter LCD screens; in terms of visual presentation, LED backlighting significantly improves display quality, making colors more vivid and realistic; more importantly, LED backlighting also offers energy savings. The larger the LCD screen, the more LED chips are required for the backlight module. The higher the reflectivity of the PCB board carrying the LED chips, the higher the energy utilization rate of the LED backlight, and thus, the more energy-efficient it is.

[0003] The reflectivity of common LED backlight PCBs is only 80-85%, which is low, consumes a lot of energy, and is not conducive to energy saving. Summary of the Invention

[0004] This invention provides a printed circuit board and a method for processing the printed circuit board, in order to solve the technical problem of low reflectivity of printed circuit boards in the prior art.

[0005] To solve the above-mentioned technical problems, the first technical solution adopted by the present invention is: to provide a printed circuit board, including a pre-processed circuit board, a dielectric layer and a reflective metal layer; the dielectric layer is disposed on the surface of the pre-processed circuit board; the reflective metal layer is disposed on the surface of the dielectric layer away from the pre-processed circuit board.

[0006] Wherein, at least one surface layer of the initial processed circuit board is a circuit layer; a second opening is provided on the reflective metal layer, and a first opening is provided on the dielectric layer corresponding to the second opening, the first opening and the second opening cooperate to form a window to expose part of the circuit layer.

[0007] The reflective metal layer includes a first metal layer and a second metal layer, wherein the first metal layer is disposed between the dielectric layer and the second metal layer; the first metal layer is a copper foil layer and the second metal layer is a silver layer.

[0008] The reflective metal layer is a silver foil layer.

[0009] The medium layer is a semi-cured sheet or an adhesive layer.

[0010] To solve the above-mentioned technical problems, the second technical solution adopted by the present invention is: to provide a method for processing a printed circuit board, comprising: providing a preliminary processed circuit board; and sequentially distributing a dielectric layer and a reflective metal layer on the preliminary processed circuit board.

[0011] Wherein, at least one surface layer of the pre-processed circuit board is a circuit layer; the sequential arrangement of a dielectric layer and a reflective metal layer on the pre-processed circuit board specifically includes:

[0012] The dielectric layer and the reflective metal layer are laminated onto the pre-processed circuit board to form a series of stacked layers;

[0013] Windows are formed on the dielectric layer and the reflective metal layer to expose portions of the circuit layer.

[0014] The reflective metal layer is a silver foil layer.

[0015] The reflective metal layer includes a first metal layer and a second metal layer, wherein the first metal layer is disposed between the dielectric layer and the second metal layer; the first metal layer is a copper foil layer and the second metal layer is a silver layer.

[0016] Wherein, at least one surface layer of the pre-processed circuit board is a circuit layer; the sequential arrangement of a dielectric layer and a reflective metal layer on the pre-processed circuit board specifically includes:

[0017] The dielectric layer and the first metal layer are stacked sequentially on the pre-processed circuit board;

[0018] The first metal layer is etched to expose a portion of the dielectric layer;

[0019] A second metal layer is formed on the surface of the first metal layer away from the dielectric layer by electroplating or sputtering.

[0020] The exposed portion of the dielectric layer is removed to expose the portion of the circuit layer.

[0021] The beneficial effects of this invention are as follows: Unlike the prior art, the printed circuit board provided in this application includes a pre-processed circuit board, a dielectric layer, and a reflective metal layer; the dielectric layer is disposed on the surface of the pre-processed circuit board; the reflective metal layer is disposed on the surface of the dielectric layer away from the pre-processed circuit board. By bonding the reflective metal layer to the pre-processed circuit board through the dielectric layer, the reflectivity of the pre-processed circuit board is increased, energy consumption is reduced, and energy is effectively saved. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of the first embodiment of the printed circuit board provided in this application;

[0024] Figure 2 This is a schematic diagram of the structure of the second embodiment of the printed circuit board provided in this application;

[0025] Figure 3 This is a flowchart illustrating the first embodiment of the printed circuit board processing method provided in this application;

[0026] Figure 4 yes Figure 3 A schematic diagram of step S01 in the first embodiment of the provided printed circuit board processing method;

[0027] Figure 5 yes Figure 3 A flowchart illustrating step S02 in the first embodiment of the provided printed circuit board processing method;

[0028] Figure 6 yes Figure 5 A schematic diagram of step S021 in the first embodiment of the provided printed circuit board processing method;

[0029] Figure 7 yes Figure 5 A flowchart illustrating step S022 in the first embodiment of the provided printed circuit board processing method;

[0030] Figure 8 yes Figure 7 A schematic diagram of step S0221 in the first embodiment of the provided printed circuit board processing method;

[0031] Figure 9 yes Figure 7 A schematic diagram of step S0222 in the first embodiment of the provided printed circuit board processing method;

[0032] Figure 10 This is a flowchart illustrating step S02 in the second embodiment of the printed circuit board processing method provided in this application.

[0033] Figure 11 yes Figure 10 A schematic diagram of step S021 in the second embodiment of the provided printed circuit board processing method;

[0034] Figure 12 yes Figure 10 A schematic diagram of step S022 in the second embodiment of the provided printed circuit board processing method;

[0035] Figure 13 yes Figure 10 A schematic diagram of step S023 in the second embodiment of the provided printed circuit board processing method.

[0036] Figure 14 yes Figure 10 A schematic diagram of step S024 in the second embodiment of the provided printed circuit board processing method. Detailed Implementation

[0037] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0038] The terms "first," "second," and "third" in this application are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movement of components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. The terms "comprising" and "having," and any variations thereof, in the embodiments of this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or components inherent to these processes, methods, products, or devices.

[0039] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0040] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of the first embodiment of the printed circuit board provided in this application.

[0041] The printed circuit board includes a pre-processed circuit board 1, a dielectric layer 2, and a reflective metal layer 3. The dielectric layer 2 is disposed on the surface of the pre-processed circuit board 1; the reflective metal layer 3 is disposed on the surface of the dielectric layer 2 away from the pre-processed circuit board 1. At least one surface layer of the pre-processed circuit board 1 is a circuit layer 10, which is a copper conductive layer; the dielectric layer 2 is a prepreg layer or an adhesive layer, whichever can allow the reflective metal layer 3 to be disposed on the pre-processed circuit board 1, and this application does not impose any limitations on this.

[0042] Furthermore, windows 4 are formed on the dielectric layer 2 and the reflective metal layer 3 to expose a portion of the circuit layer 10. It is understood that forming windows 4 on the dielectric layer 2 and the reflective metal layer 3 is to at least expose the pads (not shown) of the circuit layer 10, thereby improving the reflectivity of the initial circuit board 1 without affecting the usability of the pads on the circuit layer 10. Specifically, a second opening 31 is provided on the reflective metal layer 3, and a first opening 21 is provided on the dielectric layer 2 corresponding to the second opening 31. The first opening 21 and the second opening 31 cooperate to form window 4; the first opening 21 and the second opening 31 have the same structural dimensions and are designed according to the portion of the circuit layer 10 that needs to be exposed.

[0043] In this embodiment, the reflective metal layer 3 is a silver foil layer, which is bonded to the pre-processed circuit board 1 through the dielectric layer 2. It is understood that since the circuit layer 10 on the pre-processed circuit board 1 is a copper conductive layer, placing the silver foil layer on the pre-processed circuit board 1 increases the reflectivity of the printed circuit board, as silver has a higher reflectivity than copper, thereby reducing energy consumption and achieving effective energy saving. The metal reflective layer 3 can also be a gold foil layer, etc., as long as the reflectivity of the reflective metal layer 3 is higher than that of copper.

[0044] Please see Figure 2 , Figure 2 This is a schematic diagram of the structure of the second embodiment of the printed circuit board provided in this application.

[0045] In the second embodiment, the printed circuit board has a structure that is basically the same as that in the first embodiment, except that the structure of the reflective metal layer 3 is different.

[0046] The printed circuit board includes a pre-processed circuit board 1, a dielectric layer 2, and a reflective metal layer 3. The dielectric layer 2 is disposed on the surface of the pre-processed circuit board 1; the reflective metal layer 3 is disposed on the surface of the dielectric layer 2 away from the pre-processed circuit board 1. At least one surface layer of the pre-processed circuit board 1 is a circuit layer 10, which is a copper conductive layer; the dielectric layer 2 is a prepreg layer or an adhesive layer, whichever can allow the reflective metal layer 3 to be disposed on the pre-processed circuit board 1, and this application does not impose any limitations on this.

[0047] In this embodiment, the reflective metal layer 3 includes a first metal layer 32 and a second metal layer 33. The first metal layer 32 is disposed between the second metal layer 33 and the dielectric layer 2. The first metal layer 32 is a copper foil layer, and the second metal layer 33 is a silver layer. The second metal layer 33 is formed on the surface of the first metal layer 32 away from the dielectric layer 2 by sputtering or electroplating silver powder. The second metal layer 33 and the first metal layer 32 are bonded to the initial processed circuit board 1 together through the dielectric layer 2.

[0048] Understandably, since silver powder cannot be directly applied to the pre-processed circuit board 1, it is applied to the first metal layer 32 and then bonded to the pre-processed circuit board 1 via the dielectric layer 2. The circuit layer 10 on the pre-processed circuit board 1 is a copper conductive layer. A silver layer is applied to the outside of the pre-processed circuit board 1. Silver has a higher reflectivity than copper, thereby increasing the reflectivity of the printed circuit board, reducing energy consumption, and achieving effective energy savings. Based on the dielectric function of the first metal layer 32, the first metal layer 32 can also be an aluminum foil layer, etc.; from the perspective of processing technology and cost, a copper foil layer is preferred for the first metal layer 32. The second metal layer 33 can also be formed from gold powder, etc., as long as the reflectivity of the second metal layer 33 is higher than that of copper.

[0049] Furthermore, windows 4 are formed on the dielectric layer 2 and the reflective metal layer 3 to expose a portion of the circuit layer 10. It is understood that forming windows 4 on the dielectric layer 2 and the reflective metal layer 3 is to at least expose the pads (not shown) of the circuit layer 10, thereby increasing the reflectivity of the initial circuit board 1 without affecting the usability of the pads on the circuit layer 10. Specifically, a third opening 34 is provided on the first metal layer 32, a fourth opening 35 is provided on the second metal layer 33 corresponding to the third opening 34, and a first opening 21 is provided on the dielectric layer 2 corresponding to the third opening 34. The first opening 21, the third opening 34, and the fourth opening 35 cooperate to form window 4; the first opening 21, the third opening 34, and the fourth opening 35 have the same structural dimensions and are designed according to the portion of the circuit layer 10 that needs to be exposed.

[0050] Please see Figures 3-9 , Figure 3 This is a flowchart illustrating the first embodiment of the printed circuit board processing method provided in this application. Figure 4 yes Figure 3 A schematic diagram of step S01 in the first embodiment of the provided printed circuit board processing method. Figure 5 yes Figure 3 The flowchart of step S02 in the first embodiment of the provided printed circuit board processing method is shown. Figure 6 yes Figure 5 A schematic diagram of step S021 in the first embodiment of the provided printed circuit board processing method. Figure 7 yes Figure 5The flowchart of step S022 in the first embodiment of the provided printed circuit board processing method is shown. Figure 8 yes Figure 7 A schematic diagram of step S0221 in the first embodiment of the provided printed circuit board processing method. Figure 9 yes Figure 7 A schematic diagram of step S0222 in the first embodiment of the provided printed circuit board processing method.

[0051] The first embodiment of the printed circuit board processing method includes:

[0052] S01: Provides pre-processed circuit boards.

[0053] At least one surface of the pre-processed circuit board 1 is a circuit layer 10, which is a copper conductive layer. The difference between the pre-processed circuit board 1 and a conventional printed circuit board is that no solder resist ink is applied; that is, a conventional printed circuit board can be obtained by applying solder resist ink to the surface of the pre-processed circuit board 1.

[0054] S02: A dielectric layer and a reflective metal layer are sequentially set on the initial processing circuit board.

[0055] If one surface of the circuit board 1 was initially a circuit layer 10, and this surface needs to be treated to improve its reflectivity, then a dielectric layer 2 and a metal reflective layer 3 are sequentially disposed on this surface. If both surfaces of the circuit board 1 were initially circuit layers 10, and only one surface needs to be treated to improve its reflectivity, then only the dielectric layer 2 and the metal reflective layer 3 are sequentially disposed on that surface; if both surfaces need to be treated to improve their reflectivity, then the dielectric layer 2 and the metal reflective layer 3 are sequentially disposed on both surfaces.

[0056] Specifically, the dielectric layer 2 and the reflective metal layer 3 are sequentially disposed on the initial processed circuit board 1, including:

[0057] S021: A dielectric layer and a reflective metal layer are laminated onto a pre-processed circuit board to form a series of stacked layers.

[0058] In this embodiment, the reflective metal layer 3 is a silver foil layer; the dielectric layer 2 is a prepreg layer or an adhesive layer, whichever can be used to place the reflective metal layer 3 on the pre-processed circuit board 1. This application does not limit this. The reflective metal layer 3 is a silver foil layer, which is bonded to the pre-processed circuit board 1 through the dielectric layer 2. It is understood that since the circuit layer 10 on the pre-processed circuit board 1 is a copper conductive layer, placing the silver foil layer on the pre-processed circuit board 1 results in a higher reflectivity of silver than copper, thereby increasing the reflectivity of the printed circuit board, reducing energy consumption, and achieving effective energy saving. The metal reflective layer 3 can also be a gold foil layer, etc., as long as the reflectivity of the reflective metal layer 3 is higher than that of copper. When the metal reflective layer 3 is a silver foil layer or a gold foil layer, the dielectric layer 2 and the reflective metal layer 3 are stacked sequentially on the pre-processed circuit board 1 and then pressed together to achieve bonding of the metal reflective layer 3 on the pre-processed circuit board 1.

[0059] S022: A window is formed on the dielectric layer and the reflective metal layer to expose part of the circuit layer.

[0060] The window 4 is formed on the dielectric layer 2 and the reflective metal layer 3 to expose at least the pads (not shown) of the circuit layer 10, thereby improving the reflectivity of the initial circuit board 1 without affecting the use of the pads on the circuit layer 10. In other words, the window 4 is formed on the dielectric layer 2 and the reflective metal layer 3 to expose the pads on the circuit board 10 that need to be exposed.

[0061] Specifically, step S022 includes:

[0062] S0221: Etch the reflective metal layer to expose part of the dielectric layer.

[0063] A second opening 31 is formed on the reflective metal layer 3 by etching. The second opening 31 exposes a portion of the dielectric layer 2. The exposed portion of the dielectric layer 2 corresponds to the pads of the circuit layer 10 that need to be exposed at the location of the initial circuit board 1. In other words, the portion of the reflective metal layer 3 corresponding to the location of the pads that need to be exposed on the circuit layer 10 is etched.

[0064] S0222: Remove the exposed portion of the dielectric layer to expose the line layer portion.

[0065] In this embodiment, laser windowing technology is used to remove the exposed portion of the dielectric layer 2 after step S0221 to form a first opening 21 on the dielectric layer 2, thereby exposing part of the circuit layer 10, that is, exposing the pads on the circuit layer 10 that need to be exposed.

[0066] It is understood that step S022 can achieve the following: a second opening 31 is provided on the reflective metal layer 3, and a first opening 21 is provided on the dielectric layer 2 corresponding to the second opening 31. The first opening 21 and the second opening 31 cooperate to form a window 4. The first opening 21 and the second opening 31 have the same structural dimensions and are designed according to the part of the circuit layer 10 that needs to be exposed.

[0067] Please see Figures 10-13 , Figure 10 This is a flowchart illustrating step S02 in the second embodiment of the printed circuit board processing method provided in this application. Figure 11 yes Figure 10 A schematic diagram of step S021 in the second embodiment of the provided printed circuit board processing method. Figure 12 yes Figure 10 A schematic diagram of step S022 in the second embodiment of the provided printed circuit board processing method. Figure 13 yes Figure 10 A schematic diagram of step S023 in the second embodiment of the provided printed circuit board processing method. Figure 14 yes Figure 10 A schematic diagram of step S024 in the second embodiment of the provided printed circuit board processing method.

[0068] The second embodiment of the printed circuit board processing method differs from the first embodiment in that the structure of the reflective metal layer 3 is different and the specific operation of step S02 is different. In the second embodiment, step S01 is the same as in the first embodiment.

[0069] A second embodiment of the printed circuit board processing method includes:

[0070] S01: Provides pre-processed circuit boards.

[0071] At least one surface of the pre-processed circuit board 1 is a circuit layer 10, which is a copper conductive layer. The difference between the pre-processed circuit board 1 and a conventionally printed circuit board is that no solder resist ink is applied; that is, a conventionally printed circuit board can be obtained by applying solder resist ink to the surface of the pre-processed circuit board 1. In the second embodiment, the structure of the pre-processed circuit board 1 is the same as that in the first embodiment, see [link to documentation]. Figure 4 .

[0072] S02: A dielectric layer and a reflective metal layer are sequentially set on the initial processing circuit board.

[0073] If one surface of the initially processed circuit board 1 is a circuit layer 10 and requires an increase in reflectivity, then a dielectric layer 2 and a metal reflective layer 3 are sequentially disposed on that surface. If both surfaces of the initially processed circuit board 1 are circuit layers 10, and only one surface requires an increase in reflectivity, then only that surface is sequentially disposed of with the dielectric layer 2 and the metal reflective layer 3; if both surfaces require an increase in reflectivity, then both surfaces are sequentially disposed of with the dielectric layer 2 and the metal reflective layer 3. The dielectric layer 2 is a semi-cured sheet or adhesive layer, which is sufficient to allow the reflective metal layer 3 to be disposed on the initially processed circuit board 1; this application does not impose any limitations on this.

[0074] In this embodiment, the reflective metal layer 3 includes a first metal layer 32 and a second metal layer 33. The first metal layer 32 is disposed between the second metal layer 33 and the dielectric layer 2. The first metal layer 32 is a copper foil layer, and the second metal layer 33 is a silver layer. The second metal layer 33 is formed on the surface of the first metal layer 32 away from the dielectric layer 2 by sputtering or electroplating silver powder. It is understood that since silver powder cannot be directly disposed on the pre-processed circuit board 1, the silver powder is disposed on the first metal layer 32 and then bonded to the pre-processed circuit board 1 through the dielectric layer 2. That is, the second metal layer 33 and the first metal layer 32 are bonded to the pre-processed circuit board 1 together through the dielectric layer 2.

[0075] A dielectric layer 2 and a first metal layer 32 are sequentially stacked and laminated on the initial processed circuit board 1, and a second metal layer 33 is formed on the surface of the first metal layer 32, thereby realizing the sequential placement of the dielectric layer 2 and the reflective metal layer 3 on the initial processed circuit board 1. The circuit layer 10 on the initial processed circuit board 1 is a copper conductive layer. A silver layer is placed on the outside of the initial processed circuit board 1. The reflectivity of silver is higher than that of copper, thereby improving the reflectivity of the printed circuit board, reducing energy consumption, and achieving effective energy saving. Depending on the mediating role of the first metal layer 32, the first metal layer 32 can also be an aluminum foil layer, etc.; from the perspective of processing technology and cost, the first metal layer 32 is preferably a copper foil layer. The second metal layer 33 can also be formed by gold powder, etc., as long as the reflectivity of the second metal layer 33 is higher than that of copper.

[0076] Specifically, the dielectric layer 2 and the reflective metal layer 3 are sequentially disposed on the initial processed circuit board 1, including:

[0077] S021: The dielectric layer and the first metal layer are stacked sequentially on the pre-processed circuit board.

[0078] After stacking the dielectric layer 2 and the reflective metal layer 3 sequentially on the initial processing circuit board 1, they are pressed together.

[0079] S022: Etch the first metal layer to expose a portion of the dielectric layer.

[0080] A third opening 34 is formed on the first metal layer 32 by etching. The third opening 34 exposes a portion of the dielectric layer 2. The exposed portion of the dielectric layer 2 corresponds to the pads of the circuit layer 10 that need to be exposed at the location of the initial circuit board 1. In other words, the portion of the first metal layer 32 corresponding to the location of the pads that need to be exposed on the circuit layer 10 is etched.

[0081] S023: A second metal layer is formed on the surface of the first metal layer away from the dielectric layer by electroplating or sputtering.

[0082] Since the material forming the second metal layer 33 is silver powder, the second metal layer 33 is formed on the surface of the first metal layer 32 away from the dielectric layer 2 by electroplating or sputtering, and the formed second metal layer 33 has a fourth opening 35 at the position corresponding to the third opening 34 of the first metal layer 32.

[0083] S024: Remove the exposed portion of the dielectric layer to expose the line layer portion.

[0084] In this embodiment, laser windowing technology is used to remove the exposed portion of the dielectric layer 2 after step S022, thereby partially exposing the circuit layer 10, specifically the pads on the circuit layer 10 that need to be exposed. The exposed dielectric layer 2 is removed only after the second metal layer 33 is formed by electroplating or sputtering silver powder onto the first metal layer 32. This protects the pads on the initial circuit board 1 that need to be exposed, preventing the areas where the pads are located from being electroplated or sputtered with silver powder, which could affect the usability of the pads.

[0085] In step S02, a third opening 34 is provided on the first metal layer 32, a fourth opening 35 is provided on the second metal layer 33 corresponding to the third opening 34, and a first opening 21 is provided on the dielectric layer 2 corresponding to the third opening 34. The first opening 21, the third opening 34, and the fourth opening 35 cooperate to form a window 4. The first opening 21, the third opening 34, and the fourth opening 35 have the same structural dimensions and are designed according to the parts of the circuit layer 10 that need to be exposed. It can be understood that the window 4 is formed on the dielectric layer 2 and the reflective metal layer 3 to at least expose the pads (not shown) of the circuit layer 10, thereby improving the reflectivity of the initial circuit board 1 without affecting the use of the pads on the circuit layer 10. In other words, the window 4 is formed on the dielectric layer 2 and the reflective metal layer 3 to expose the pads on the circuit board 10 that need to be exposed.

[0086] The printed circuit board provided in this application includes a pre-processed circuit board, a dielectric layer, and a reflective metal layer. The dielectric layer is disposed on the surface of the pre-processed circuit board; the reflective metal layer is disposed on the surface of the dielectric layer away from the pre-processed circuit board. By bonding the reflective metal layer to the pre-processed circuit board through the dielectric layer, the reflectivity of the pre-processed circuit board is increased, energy consumption is reduced, and energy is effectively saved. In this application, the surface of the pre-processed circuit board is coated with solder resist ink to obtain the commonly known printed circuit board. That is, by replacing the solder resist ink on the circuit board with a reflective metal layer, the reflectivity of the printed circuit board can be effectively increased to over 99%.

[0087] The above description is merely an embodiment of the present invention and does not limit the scope of patent protection of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A method for processing a printed circuit board, characterized in that, include: A pre-processed circuit board is provided; at least one surface layer of the pre-processed circuit board is a circuit layer; the pre-processed circuit board is not coated with solder resist ink; A dielectric layer and a reflective metal layer are stacked sequentially on the pre-processed circuit board; the reflective metal layer includes a first metal layer and a second metal layer, the first metal layer being disposed between the dielectric layer and the second metal layer; the first metal layer is a copper foil layer, and the second metal layer is sputtered or electroplated silver powder; wherein, the first metal layer serves as a medium between the second metal layer and the dielectric layer. Specifically, the dielectric layer and the reflective metal layer are sequentially disposed on the pre-processed circuit board, including: The dielectric layer and the first metal layer are stacked sequentially on the pre-processed circuit board; The first metal layer is etched to form a third opening, thereby exposing a portion of the dielectric layer; A second metal layer is formed on the surface of the first metal layer away from the dielectric layer by electroplating or sputtering. The second metal layer is etched at the position corresponding to the third opening to form the fourth opening; The exposed portion of the dielectric layer is removed to form a first opening, and the first opening, the third opening, and the fourth opening cooperate to form a window to expose the circuit layer portion. The reflective metal layer is used to replace the solder resist ink.

2. The processing method according to claim 1, characterized in that, The medium layer is a semi-cured sheet or adhesive layer.

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