A high-speed, high-precision six-sided appearance inspection device for chips

Abstract

This invention discloses a high-speed, high-precision six-sided appearance inspection device for chips, relating to the field of chip technology. It includes a marble linear motor motion platform. The marble linear motor motion platform internally includes a bottom steel frame, with four vibration-damping air floats installed around the top of the bottom steel frame. A marble platform is installed on top of the vibration-damping air floats, and a marble gantry frame is connected to the top of the marble platform. In this invention, a side-mounted inspection camera detects the height of the suction nozzle used to remove the chip from the carrier and place it into the tray. A height sensor measures the product height. With precise knowledge of both the nozzle and chip heights, a vertical linear motor module with a high-precision encoder ensures the nozzle accurately reaches the target height. This ensures precise distance between the nozzle and the chip before vacuum suction, guaranteeing that the nozzle can pick up the chip without damaging it.

Description

Technical Field

[0001] This invention belongs to the field of chip technology, specifically a high-speed, high-precision six-sided appearance inspection device for chips. Background Technology

[0002] In electronics, a chip is a way to miniaturize circuits (mainly including semiconductor devices, but also passive components, etc.) and is often manufactured on the surface of a semiconductor wafer. Mobile phones or camera devices also need chips to take pictures. Chips generally need to be inspected on their surface when they leave the factory to prevent defective products from leaving.

[0003] Existing methods for six-sided chip appearance inspection fall into two categories. One involves personnel inspecting the chips using a microscope. However, manual inspection is not only inefficient, but also prone to causing visual fatigue due to the small size of the chips, leading to defective products being rejected over extended periods. The other method involves inspection equipment. Such equipment often has visual positioning but does not perform chip height or nozzle height detection. Because the chips are very small, the nozzles and vacuum holes are also very small. Therefore, the nozzle needs to be very close to the chip to pick up the product, but the nozzle cannot touch the chip, as this could damage it. Thus, when the carrier is deformed, the product has certain tolerances, or there are height differences after nozzle replacement, it is easy to have difficulty accurately controlling the suction height, resulting in the inability to pick up the chip or damaging it. At the same time, the inspection equipment vibrates during operation, which can cause the visual positioning device on the equipment to shake, resulting in blurry images taken by the camera and affecting the chip inspection. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing six-sided chip appearance inspection methods, which fall into two categories. One method involves manual inspection using a microscope, which is not only inefficient but also prone to causing visual fatigue due to the small size of the chips, leading to defective products. The other method involves inspection equipment, which often has visual positioning but lacks chip height or nozzle height detection. Because chips are very small, the nozzle and vacuum holes are also small, requiring the nozzle to be very close to the chip to pick up the product. However, the nozzle cannot directly contact the chip, as this could damage it. Therefore, when the carrier is deformed, the product has certain tolerances, or there are height differences after nozzle replacement, it is easy to encounter situations where the suction height cannot be accurately controlled, resulting in the inability to pick up the chip or damage to it. In addition, the inspection equipment vibrates during operation, which can cause the visual positioning device on the equipment to shake, resulting in blurry images taken by the camera and affecting the chip inspection.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a high-speed, high-precision six-sided appearance inspection device for chips, comprising a marble linear motor motion platform;

[0006] The marble linear motor motion platform includes a bottom steel frame, with four vibration-damping air floats installed around the top of the bottom steel frame. A marble platform is installed on the top of the vibration-damping air floats, and a marble gantry frame is connected to the top of the marble platform. A first linear module is installed on each side of the marble gantry frame, and a first slider is installed on the surface of the first linear module. A fiber optic sensor is installed on one side of the marble gantry frame. A carrier linear module marble platform is connected to the top of the marble platform, and a second linear module is installed on the top of the carrier linear module marble platform. A second slider is installed on the surface of the second linear module, and a carrier is installed on the top of the second slider. A picking mechanism is installed on the surface of the first slider.

[0007] The internal part of the picking mechanism includes a first mounting plate, and a vacuum generator is mounted on one side of the first mounting plate. A linear rotary actuator is mounted on one side of the first mounting plate, and a suction nozzle is mounted at the bottom end of the linear rotary actuator. A positioning camera is mounted on the side of the first mounting plate.

[0008] Two pallet handling mechanisms are installed at the top of the marble platform, a detection mechanism is installed on the surface of the marble platform of the carrier linear module, a positioning mechanism is installed at the top of the marble platform, a defective product unloading mechanism is installed at the top of the marble platform, and a recording mechanism is installed on the surface of the marble gantry frame.

[0009] As a further description of the above technical solution:

[0010] The first mounting plate is connected to the surface of the first slider, the fiber optic sensor is symmetrical about the central axis of the marble gantry frame, and a laser sensor is installed at the top of the marble platform.

[0011] As a further description of the above technical solution:

[0012] The pallet handling mechanism includes two first supports, and four first cylinders are connected to the top of the first supports. One end of each first cylinder is connected to a linear guide rail, and one end of the linear guide rail is connected to a pallet support block. The top of the marble platform is connected to two second supports, and four concave blocks are connected to the top of the second supports. The inner wall of each concave block is rotatably connected to a rotating shaft, and the surface of the rotating shaft is connected to a pallet rotating support block.

[0013] A third servo module is installed at the top of the marble platform, and a lower support plate is connected to the surface of the third servo module. A support column is connected to the top of the lower support plate, and an upper support plate is connected to the top of the support column. Four guide rods are movably sleeved at the top of the upper support plate, and a guide rod connecting plate is connected to the bottom of the guide rods. A pallet support plate is connected to the top of the guide rods, and two first limit blocks are connected to the surface of the pallet support plate. Two second cylinders are connected to the surface of the pallet support plate, and a second limit block is connected to one end of each second cylinder. A pallet is provided at the top of the pallet support plate.

[0014] As a further description of the above technical solution:

[0015] A lifting device is installed at the top of the lower support plate.

[0016] As a further description of the above technical solution:

[0017] The detection mechanism includes a first detection industrial camera, a second detection industrial camera, a third detection industrial camera, and a second height sensor.

[0018] As a further description of the above technical solution:

[0019] The positioning mechanism includes an industrial camera inside.

[0020] As a further description of the above technical solution:

[0021] The defective product unloading mechanism includes a fourth servo module, which is connected to the top of the marble platform. A defective product tray support is mounted on the surface of the fourth servo module.

[0022] As a further description of the above technical solution:

[0023] The recording mechanism includes a camera mounting bracket, which is connected to the surface of the marble gantry frame. One side of the camera mounting bracket is connected to a first connecting plate with a cross-section of "U". A manual displacement stage is installed on one side of the first connecting plate. A second connecting plate is connected to one side of the manual displacement stage. A discharge detection camera is installed on one side of the second connecting plate. A fourth supplementary light source is installed on one side of the camera mounting bracket.

[0024] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0025] 1. In this invention, by employing a high-precision marble platform, camera, height sensor, and vibration-damping air bearing, the product can achieve high-precision handling and high-positioning accuracy detection, and efficiently and stably perform six-sided detection.

[0026] 2. In this invention, by increasing air flotation to reduce vibration transmission rate, the equipment detection is not affected by external vibration, the stabilization time of the equipment is shortened, and the wear and tear caused by the acceleration and deceleration of the moving part is reduced, thereby extending the service life of the equipment. The marble platform has a low natural frequency, which solves the problem of blurry camera photos caused by vibration.

[0027] 3. In this invention, after changing the suction nozzle, a laser sensor is used to detect the height of the loading suction nozzle that takes the chip out of the carrier and puts it into the carrier. A side detection camera is used to detect the height of the unloading suction nozzle that takes the chip out of the carrier and puts it into the carrier. The height of the product is measured by a height sensor. With the suction nozzle height and chip height accurately known, a vertical linear motor module with a high-precision encoder can ensure that the suction nozzle accurately reaches the target height. This ensures that the distance between the suction nozzle and the chip is accurate before vacuum suction of the chip is turned on, thus ensuring that the suction nozzle can pick up the chip without damaging it.

[0028] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0029] Figure 1 This is a side view diagram of a high-speed, high-precision six-sided appearance inspection device for chips according to the present invention;

[0030] Figure 2 This is a schematic diagram of the other side of a high-speed, high-precision six-sided appearance inspection device for chips according to the present invention;

[0031] Figure 3 This is a schematic diagram of the top part of the marble platform in this invention;

[0032] Figure 4 This is a schematic diagram of the top part of the marble linear motor motion platform in this invention;

[0033] Figure 5 This is a schematic diagram of the surface structure of the picking mechanism in this invention;

[0034] Figure 6 This is a schematic diagram of the surface structure of the pallet handling mechanism in this invention;

[0035] Figure 7 for Figure 6 Enlarged structural diagram at point A in the middle;

[0036] Figure 8 for Figure 6 Enlarged structural diagram at point B;

[0037] Figure 9 This is a schematic diagram of the surface structure of the lower support plate in this invention;

[0038] Figure 10 This is a schematic diagram of the surface structure of the detection mechanism in this invention;

[0039] Figure 11 for Figure 10 Enlarged structural diagram at point C;

[0040] Figure 12 for Figure 10 Enlarged structural diagram at point D;

[0041] Figure 13 This is a schematic diagram of the surface structure of the positioning mechanism in this invention;

[0042] Figure 14 This is a schematic diagram of the defective product unloading mechanism in this invention;

[0043] Figure 15 This is a schematic diagram of the surface structure of the recording mechanism in this invention.

[0044] Legend:

[0045] 1. Marble linear motor motion platform; 101. Vibration-damping air bearing; 102. Marble platform; 103. Marble gantry frame; 104. First linear module; 105. First slider; 106. Fiber optic sensor; 107. Carrier linear module marble platform; 108. Second linear module; 109. Second slider; 110. Carrier; 2. Picking mechanism; 201. First mounting plate; 202. Vacuum generator; 203. Linear rotary actuator; 204. Suction nozzle; 205. First servo module; 206. Third slider 207. Positioning camera; 208. First supplementary light source; 209. Height sensor bracket; 210. First height sensor; 3. Pallet handling mechanism; 301. First bracket; 302. First cylinder; 303. Linear guide rail; 304. Pallet support block; 305. Second bracket; 306. Concave block; 307. Rotating shaft; 308. Pallet rotating support block; 309. Third servo module; 310. Lower support plate; 311. Support column; 312. Upper support plate; 313. Guide rod; 314. Guide rod connecting plate 315. Pallet support plate; 316. First limiting block; 317. Second cylinder; 318. Second limiting block; 319. Pallet; 4. Detection mechanism; 401. Camera detection bracket; 402. First detection camera servo module; 403. Fifth slider; 404. First detection industrial camera; 405. Second supplementary light source; 406. Second detection camera servo module; 407. Sixth slider; 408. Second detection industrial camera; 409. Third detection camera servo module; 410. Seventh slider; 411. Third detection... 412. Industrial camera; 413. L-shaped bracket; 414. Second height sensor; 5. Positioning mechanism; 501. Second mounting plate; 502. Fifth servo module; 503. Eighth slider; 504. Industrial camera; 505. Third supplementary light source; 6. Defective product unloading mechanism; 601. Fourth servo module; 602. Defective product tray bracket; 7. Recording mechanism; 701. Camera mounting bracket; 702. First connecting plate; 703. Manual displacement stage; 704. Second connecting plate; 705. Outgoing inspection camera; 706. Fourth supplementary light source. Detailed Implementation

[0046] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0047] like Figures 1-15 As shown, a high-speed, high-precision six-sided appearance inspection device for chips includes a marble linear motor motion platform 1.

[0048] The marble linear motor motion platform 1 includes a bottom steel frame, and four vibration damping air floats 101 are installed around the top of the bottom steel frame. A marble platform 102 is installed on the top of the vibration damping air floats 101. A marble gantry frame 103 is connected to the top of the marble platform 102. A first linear module 104 is installed on both sides of the marble gantry frame 103. A first slider 105 is installed on the surface of the first linear module 104. A fiber optic sensor 106 is installed on one side of the marble gantry frame 103. A carrier linear module marble platform 107 is connected to the top of the marble platform 102. A second linear module 108 is installed on the top of the carrier linear module marble platform 107. A second slider 109 is installed on the surface of the second linear module 108. A carrier 110 is installed on the top of the second slider 109. A picking mechanism 2 is installed on the surface of the first slider 105.

[0049] The internal components of the picking mechanism 2 include a first mounting plate 201, a vacuum generator 202 mounted on one side of the first mounting plate 201, a linear rotary actuator 203 mounted on one side of the first mounting plate 201, and a suction nozzle 204 mounted at the bottom of the linear rotary actuator 203. A positioning camera 207 is mounted on the side of the first mounting plate 201. A first servo module 205 is mounted on one side of the first mounting plate 201, and a third slider 206 is mounted on the surface of the first servo module 205. The positioning camera 207 is connected to the surface of the third slider 206. A first supplementary light source is mounted on the surface of the first mounting plate 201. The first supplementary light source 208 is located directly below the positioning camera 207. The surface of the first mounting plate 201 is equipped with a height sensor bracket 209, and the surface of the height sensor bracket 209 is equipped with a first height sensor 210. After the first height sensor 210 measures the height of the product, the discharge positioning camera 207 moves and adjusts the height through the first servo module 205 to take pictures and position the chip. The suction nozzle 204 on the linear rotary actuator 203 positions and picks up the chip according to the position of the camera, and then the camera guides the positioning. The suction nozzle 204 on the linear rotary actuator 203 places the chip into the carrier 110.

[0050] Two pallet handling mechanisms 3 are installed at the top of the marble platform 102. A detection mechanism 4 is installed on the surface of the linear module marble platform 107. A positioning mechanism 5 is installed at the top of the marble platform 102, and a defective product unloading mechanism 6 is installed at the top of the marble platform 102. A recording mechanism 7 is installed on the surface of the marble gantry frame 103. A vibration-damping air flotation device 101 is used to eliminate the influence of vibrations generated during high-speed movement of the equipment and external vibrations on the detection. The marble platform 102 and the marble gantry frame 103 are made of marble, ensuring high precision. The linear module is driven by a direct-drive motor, which reduces force loss caused by force transmission, thereby increasing the driving force. The module's connecting plate and the main fixing plate of the mechanism—that is, the fixing plate used to fix the discharge positioning camera 207 module, the first height sensor 210 module, the linear rotary actuator 203, and the suction nozzle 204 module—are made into a single plate. Modal analysis is performed on this plate to minimize weight while meeting strength requirements. A marble linear motor platform is adopted. Through modal analysis, the structure is optimized to increase the natural frequency of the equipment and enhance the strength of the picking and unloading structure, thereby shortening the settling time of the picking and unloading mechanism. The speed of the equipment is increased by increasing the driving force, reducing the weight of the mover, and decreasing the settling time. The first linear module 104 facilitates the movement of the picking mechanism 2, and the second linear module 108 facilitates the movement of the carrier 110. The bottom of the chip placement slot in the carrier 110 avoids the solder ball support surface, and the solder ball holes are cut to avoid the solder balls. A high-precision linear motor marble structure ensures that the chip solder ball portion falls accurately into the solder ball hole of the carrier 110. Vacuum air is used to suck the chip in through the solder ball hole, thus placing the chip flat in the carrier 110. The linear rotary actuator 203 is SMAC, model LCR16; the height sensor is Keyence, model CL-3000; and the fiber optic sensor 106 is model FU-A100. Figure 3 and Figure 4 As shown, first linear modules 104 are installed on both sides of the marble gantry frame 103. The shorter first linear module 104 is the feeding linear module, and the longer first linear module 104 is the discharging linear module. Both of them are equipped with a picking mechanism 2.

[0051] like Figures 1-15As shown, the surfaces of the first mounting plate 201 and the first slider 105 are connected. The fiber optic sensor 106 is symmetrical about the central axis of the marble gantry frame 103. A laser sensor is installed at the top of the marble platform 102. The laser sensor is a Keyence brand, model IG-010. After changing the suction nozzle 204, for the feeding suction nozzle 204 that takes the chip out of the tray and puts it into the carrier 110, the height of the suction nozzle 204 is determined by the through-beam fiber optic sensor 106 combined with the vertical motor and the laser sensor. For the unloading suction nozzle 204 that takes the chip out of the carrier 110 and puts it into the tray, the height of the suction nozzle 204 is detected by a detection camera.

[0052] like Figures 6-9 As shown, the pallet handling mechanism 3 includes two first supports 301 inside, and four first cylinders 302 are connected to the top of the first supports 301. One end of the first cylinder 302 is connected to a linear guide rail 303, and one end of the linear guide rail 303 is connected to a pallet support block 304. The top of the marble platform 102 is connected to two second supports 305, and four concave blocks 306 are connected to the top of the second supports 305. The inner wall of the concave block 306 is rotatably connected to a rotating shaft 307, and the surface of the rotating shaft 307 is connected to a pallet rotating support block 308.

[0053] A third servo module 309 is installed at the top of the marble platform 102, and a lower support plate 310 is connected to the surface of the third servo module 309. A support column 311 is connected to the top of the lower support plate 310, and an upper support plate 312 is connected to the top of the support column 311. Four guide rods 313 are movably sleeved on the top of the upper support plate 312, and a guide rod connecting plate 314 is connected to the bottom of the guide rods 313. A tray support plate 315 is connected to the top of the guide rods 313, and two first limit blocks 316 are connected to the surface of the tray support plate 315. Two second cylinders 317 are connected to the surface of the tray support plate 315, and a second limit block 318 is connected to one end of each second cylinder 317. A tray 319 is provided at the top of the tray support plate 315. A photoelectric sensor is installed on the surface of the first bracket 301, and multiple [unclear text - possibly related to a device or sensor] are stacked on the first bracket 301. When pallet 319 is in operation, the operation of the third cylinder 322 causes the guide rod connecting plate 314 to move the guide rod 313, thereby moving the pallet support plate 315 at the top of the guide rod 313 to the bottom of the pallet 319 at the lowest end of the first bracket 301. The operation of the first cylinder 302 causes the pallet support block 304 on the linear guide rail 303 to move away from the bottom of the pallet 319. The operation of the third cylinder 322 causes the pallet support plate 315 to move the pallet 319 downward. After the pallet 319 is moved to the designated position, the operation of the first cylinder 302 causes the linear guide rail 303 to move the pallet support block 304 to the second to last pallet 319 and support it. The operation of the third servo module 309 then moves the pallet 319 on the pallet support plate 315 to the designated position.

[0054] like Figures 6-9 As shown, a lifting device is installed at the top of the lower support plate 310. The lifting device can be lifted by a servo motor, ball screw and ball nut, or by a cylinder. After the chip is unloaded from the tray 319 at the top of the tray support plate 315, it can be moved to the bottom of the second bracket 305 by the third servo module 309. The lifting device drives the tray support plate 315 to move upward, which can move the tray 319 on the tray support plate 315 to the bottom of the tray rotating support block 308 and press it. The tray rotating support block 308 can be rotated by the rotating shaft 307, thereby moving the tray 319 to the top of the second bracket 305 and removing the tray 319 from the surface of the tray rotating support block 308. By its own weight, the tray rotating support block 308 can be reset and its bottom end can contact the top of the second bracket 305, so that the empty tray 319 can be placed on the top of the second bracket 305.

[0055] like Figures 10-12As shown, the detection mechanism 4 includes a first detection industrial camera 404, a second detection industrial camera 408, a third detection industrial camera 411, and a second height sensor 413. The detection mechanism 4 also includes a camera detection bracket 401, which is connected to one side of the top of the linear module marble platform 107. A first detection camera servo module 402 is mounted on one side of the camera detection bracket 401, and a fifth slider 403 is mounted on its surface. The first detection industrial camera 404 is connected to the surface of the fifth slider 403. A second supplementary light source 405 is mounted directly below the first detection camera servo module 402. A second detection camera servo module 406 is mounted on the side of the second linear module 108, and a sixth slider 407 is mounted on its surface. The second detection industrial camera 408 is connected to the surface of the sixth slider 407. A third detection camera servo module 409 is mounted on the first detection camera servo module 402. A seventh slider 410 is mounted on the surface of the carrier, and a third industrial camera 411 is connected to the surface of the seventh slider 410. An L-shaped bracket 412 is connected to the top of the marble platform 107 of the carrier linear module. A second height sensor 413 is mounted on the surface of the L-shaped bracket 412. When the carrier 110 carrying the chip moves to the position of the second height sensor 413, it moves to the bottom of the first industrial camera 404 after the height is measured by the second height sensor 413. The first industrial camera 404 adjusts its height according to the height measurement signal through the first industrial camera servo module 402. After adjusting to the specified height, the top of the chip can be detected. After the top detection is completed, the carrier 110 is moved to the bottom of the suction nozzle 204, which picks up the chip and moves it to the second industrial camera 408 for four-sided detection. After the four-sided detection is completed, the chip is moved to the top of the third industrial camera 411 for bottom detection, so that all six sides of the chip can be detected.

[0056] like Figure 13 As shown, the positioning mechanism 5 includes an industrial camera 504 inside, and also includes a second mounting plate 501 connected to the top of the marble platform 102. The surface of the second mounting plate 501 is equipped with a fifth servo module 502, and an eighth slider 503 is mounted on its surface. The industrial camera 504 is connected to the surface of the eighth slider 503. The surface of the second mounting plate 501 is equipped with a third supplementary light source 505. The fifth industrial camera 504 is mainly responsible for automatically taking pictures of the chip under test in the tray 319, the chip on the suction nozzle 204, the chip in the carrier 110, and the empty carrier 110 or empty tray, and determining the center position of the chip, the center of the carrier 110 or the center of the empty tray.

[0057] like Figure 14As shown, the defective product unloading mechanism 6 includes a fourth servo module 601 inside, and the fourth servo module 601 is connected to the top of the marble platform 102. A defective product tray bracket 602 is installed on the surface of the fourth servo module 601. Three defective product unloading mechanisms 6 are installed on the top of the marble platform 102, which are mainly used to place different types of defective products. The fourth servo module 601 carries the defective product carrier tray to switch the unloading position and switch the position of the loading and unloading trays and the unloading position.

[0058] like Figure 15 As shown, the recording mechanism 7 includes a camera mounting bracket 701, which is connected to the surface of the marble gantry frame 103. One side of the camera mounting bracket 701 is connected to a first connecting plate 702 with a cross-section of "U". A manual displacement stage 703 is mounted on one side of the first connecting plate 702. A second connecting plate 704 is connected to one side of the manual displacement stage 703. A discharge detection camera 705 is mounted on one side of the second connecting plate 704. A fourth supplementary light source 706 is mounted on one side of the camera mounting bracket 701. The manual displacement stage 703 is a Yiheda brand, model HHQ01. The manual displacement stage 703 can adjust the discharge detection camera 705. The discharge detection camera 705 is used to photograph and archive the products on the discharge tray for product information traceability.

[0059] Working principle: The tray 319 containing the chip is manually placed on the top of the first support 301. The lifting device moves the guide rod connecting plate 314 and guide rod 313 upwards, allowing the tray support plate 315 at the top of the guide rod 313 to move to the bottom of the lowest tray 319 on the first support 301. The first cylinder 302 then moves the linear guide rail 303, causing the tray support block 304 to move away from one end of the lowest tray 319. The lifting device moves the tray 319 downwards. After reaching the designated position, the first cylinder 302 again moves the linear guide rail 303 to support the tray support block 304. Block 304 moves to the surface of the penultimate tray 319 and supports it. The operation of the second cylinder 317 causes the second limiting block 318 to press against the tray 319, pressing it against the surface of the first limiting block 316 and limiting its position. The operation of the third servo module 309 moves the tray 319 on the tray support plate 315 to a designated position. The operation of the first linear module 104 moves the first height sensor 210 to the top of the chip for height measurement, and the positioning camera 207 to the top of the chip for taking a picture. Based on the height measurement and image positioning, the linear rotary actuator 203 drives the suction nozzle 204 to move... The chip is picked up from the top by a suction nozzle 204 and placed inside a carrier 110. The carrier 110 and the chip are then moved to the bottom of the second height sensor 413 via a second linear module 108 for height measurement. After the height measurement, the chip is moved to the bottom of the first detection industrial camera 404. The first detection industrial camera 404 adjusts its height via a first detection camera servo module 402 based on the height measurement signal. After reaching the designated height, the chip in the carrier 110 is inspected from the top. After the top surface inspection, the chip is moved to a designated position via the second linear module 108. The suction nozzle 204 is located on the other side of the marble gantry frame 103. At the bottom of 04, the linear rotary actuator 203 drives the suction nozzle 204 to move to the top of the chip and pick it up. Then, it moves to the front of the second detection industrial camera 408 through the first linear module 104. Through the rotation and lifting of the linear rotary actuator 203, the four sides of the chip can be detected. After the detection is completed, the chip on the suction nozzle 204 is moved to the top of the third detection industrial camera 411, so that the bottom of the chip can be detected. Thus, the six sides of the chip can be detected. According to the detection results, the suction nozzle 204 and the linear module can move the chip to the defective product unloading mechanism 6 or the tray 319 on the other side of the top of the marble platform 102.

[0060] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A high-speed, high-precision six-sided appearance inspection device for chips, comprising a marble linear motor motion platform (1), characterized in that: The marble linear motor motion platform (1) includes a bottom steel frame inside, and four vibration damping air floats (101) are installed around the top of the bottom steel frame. A marble platform (102) is installed on the top of the vibration damping air floats (101). A marble gantry frame (103) is connected to the top of the marble platform (102). First linear modules (104) are installed on both sides of the marble gantry frame (103). First sliders (105) are installed on the surface of the first linear modules (104). A fiber optic sensor (106) is installed on one side of the marble gantry frame (103). A carrier linear module marble platform (107) is connected to the top of the marble platform (102). A second linear module (108) is installed on the top of the carrier linear module marble platform (107). A second slider (109) is installed on the surface of the second linear module (108). A carrier (110) is installed on the top of the second slider (109). A picking mechanism (2) is installed on the surface of the first slider (105). The internal part of the picking mechanism (2) includes a first mounting plate (201), and a vacuum generator (202) is mounted on one side of the first mounting plate (201), a linear rotary actuator (203) is mounted on one side of the first mounting plate (201), and a suction nozzle (204) is mounted at the bottom end of the linear rotary actuator (203). A positioning camera (207) is mounted on the side of the first mounting plate (201). The top of the marble platform (102) is equipped with two pallet handling mechanisms (3), the surface of the carrier linear module marble platform (107) is equipped with a detection mechanism (4), the top of the marble platform (102) is equipped with a positioning mechanism (5), the top of the marble platform (102) is equipped with a defective product unloading mechanism (6), and the surface of the marble gantry frame (103) is equipped with a recording mechanism (7). The first mounting plate (201) is connected to the surface of the first slider (105), the fiber optic sensor (106) is symmetrical about the central axis of the marble gantry frame (103), and a laser sensor is installed at the top of the marble platform (102). The pallet handling mechanism (3) includes two first supports (301) inside, and four first cylinders (302) are connected to the top of the first supports (301). One end of the first cylinder (302) is connected to a linear guide rail (303), and one end of the linear guide rail (303) is connected to a pallet support block (304). The top of the marble platform (102) is connected to two second supports (305), and four concave blocks (306) are connected to the top of the second supports (305). The inner wall of the concave blocks (306) is rotatably connected to a rotating shaft (307), and the surface of the rotating shaft (307) is connected to a pallet rotating support block (308). The top of the marble platform (102) is equipped with a third servo module (309), and the surface of the third servo module (309) is connected to a lower support plate (310). The top of the lower support plate (310) is connected to a support column (311), and the top of the support column (311) is connected to an upper support plate (312). The top of the upper support plate (312) is movably sleeved with four guide rods (313), and the bottom end of the guide rods (313) is connected to a guide rod connecting plate (314). The top of the guide rods (313) is connected to a pallet support plate (315), and the surface of the pallet support plate (315) is connected to two first limit blocks (316). The surface of the pallet support plate (315) is connected to two second cylinders (317), and one end of the second cylinders (317) is connected to a second limit block (318). The top of the pallet support plate (315) is provided with a pallet (319). The internal components of the inspection mechanism (4) include a first inspection industrial camera (404), a second inspection industrial camera (408), a third inspection industrial camera (411), and a second height sensor (413). The internal components of the inspection mechanism (4) also include a camera inspection bracket (401), which is connected to one side of the top of the linear module marble platform (107). A first inspection camera servo module (402) is mounted on one side of the camera inspection bracket (401), and a fifth slider (403) is also mounted on the surface of the camera inspection bracket (401). The first industrial camera (404) is connected to the surface of the fifth slider 403. A second supplementary light source (405) is installed directly below the first camera servo module (402). A second camera servo module (406) is installed on the side of the second linear module (108). A sixth slider (407) is installed on the surface of the second camera servo module (406). The second industrial camera (408) is connected to the surface of the sixth slider 407. A third camera servo module (409) is installed on the first camera servo module (402). The third detection camera servo module (409) has a seventh slider (410) mounted on its surface. The third detection industrial camera (411) is connected to the surface of the seventh slider 410. The top of the carrier linear module marble platform (107) is connected to an L-shaped bracket (412). The surface of the L-shaped bracket (412) is equipped with a second height sensor (413). When the carrier (110) containing the chip moves to the position of the second height sensor (413), after the height is measured by the second height sensor (413), it moves to the first detection industrial camera (404). At the bottom, the first detection industrial camera (404) adjusts the height according to the height measurement signal through the first detection camera servo module (402). After adjusting to the specified height, the top of the chip is detected. After the top detection is completed, the carrier (110) is moved to the bottom of the suction nozzle (204), the suction nozzle (204) picks up the chip and moves it to the second detection industrial camera (408) for four-sided detection. After the four-sided detection is completed, the chip is moved to the top of the third detection industrial camera (411) for bottom detection, thereby detecting all six sides of the chip.

2. The high-speed high-precision six-face appearance inspection equipment for chips according to claim 1, characterized in that: A lifting device is installed at the top of the lower support plate (310).

3. The high-speed, high-precision six-sided appearance inspection equipment for chips according to claim 1, characterized in that: The positioning mechanism (5) includes an industrial camera (504) inside.

4. The high-speed, high-precision six-sided appearance inspection equipment for chips according to claim 1, characterized in that: The defective product unloading mechanism (6) includes a fourth servo module (601) inside, and the fourth servo module (601) is connected to the top of the marble platform (102). A defective product tray bracket (602) is installed on the surface of the fourth servo module (601).

5. The high-speed, high-precision six-sided appearance inspection equipment for chips according to claim 1, characterized in that: Inside the recording mechanism (7), there is a camera mounting bracket (701), and the camera mounting bracket (701) is connected to the surface of the marble gantry frame (103). On one side of the camera mounting bracket (701), there is a first connecting plate (702) with a "U" - shaped cross - section. On one side of the first connecting plate (702), there is a manual displacement stage (703). On one side of the manual displacement stage (703), there is a second connecting plate (704). On one side of the second connecting plate (704), there is a discharge detection camera (705). On one side of the camera mounting bracket (701), there is a fourth supplementary light source (706).

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