A pressure sensing resistor and its manufacturing method

CN115183916BActive Publication Date: 2025-12-02厦门柔性电子研究院有限公司
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Patent Information

Application Number
CN202110362579.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-04-02
Publication Date
2025-12-02
Estimated Expiration
2041-04-02

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Abstract

This invention discloses a pressure-sensitive resistor and its manufacturing method. The pressure-sensitive resistor includes a substrate layer, a pressure-sensitive resistor ink layer, and an insulating protective layer. A via is provided on each side of the substrate layer. Electrode pads are disposed on one side of each via in the substrate layer, and lead pads are disposed on the other side. The electrode pads and lead pads are electrically connected after metallization through the vias. The pressure-sensitive resistor ink layer is disposed on the side of the substrate layer corresponding to the electrode pads, covering the substrate on and between the electrode pads. The insulating protective layer covers the pressure-sensitive resistor ink layer. Using this invention's pressure-sensitive resistor, the final product yield is largely unaffected by the pressure-sensitive resistor screen printing process, significantly improving product quality. This invention's pressure-sensitive resistor can be manufactured before or simultaneously with flexible circuit board manufacturing, shortening the overall production cycle of existing products, reducing production time, and improving production efficiency.
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Patent Citations

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