Tool and method for calibrating the output pressure of a placement head of a thermal compression bonder

Abstract

The present invention provides a tool and method for calibrating the output pressure of a placement head of a thermal compression bonder. The tool includes a body portion, a hollow chamber formed within the body portion, and an air inlet and an air outlet formed on the body portion and leading to the hollow chamber. According to the present invention, the time required to calibrate the output pressure of a placement head of a thermal compression bonder is greatly reduced, resulting in a significant reduction in downtime, a significant increase in production efficiency, and the avoidance of the pain and potential quality issues resulting from the frequent installation and removal of the paster base and / or the calibration base by the operator.

Description

Technical Field

[0001] This invention relates to a thermosetting bonding machine for mounting wafers onto a substrate, and more particularly to tools and methods for calibrating the output pressure of the mounting head of the thermosetting bonding machine. Background Technology

[0002] In the semiconductor industry, as the density of input / output ports on chips increases, the pins on chips become smaller, and coreless substrates are increasingly being used. Furthermore, low-dielectric-constant materials are being employed for flip-chip packaging. In line with this trend, thermosetting bonding machines have been developed for mounting wafers onto substrates. For example... Figure 1 As shown, the thermosetting bonding machine 1 includes a placement platform 3, on which a placement base 5 with multiple recesses formed is disposed. The thermosetting bonding machine 1 also includes a placement head 13 having a body 7, a heater 9, and a nozzle 11. During operation, a substrate S is placed on each recess of the placement base 5, and the nozzle 11 of the placement head 13 picks up the wafer W and heats the wafer W to, for example, 250°C by the heater 9. The placement head 13 places the heated wafer W onto the corresponding substrate S and thermosets the wafer W onto the substrate S by applying pressure to the wafer W. It is crucial that the pressure applied by the placement head 13 to the wafer W (i.e., the output pressure of the placement head 13) matches a predetermined pressure to ensure product quality. It has been found that if the output pressure of the placement head 13 is greater than or less than the predetermined pressure, problems such as solder bridges and non-contact openings may occur in the final chip, which can seriously affect the chip yield. Therefore, it is necessary to calibrate the output pressure of the placement head 13 in a timely manner.

[0003] like Figure 2 As shown, the existing method for calibrating the output pressure of the placement head of a thermosetting bonding machine involves first cooling the high-temperature (e.g., 165°C) placement platform 3 to a room temperature, for example, below 30°C. Then, the placement base 5 mounted on the placement platform 3 is replaced with a calibration base 15, and a support 19 equipped with a force sensor 17 is placed on the calibration base 15. The output pressure of the placement head 13 is then calibrated to match a predetermined pressure. After calibration of the placement head 13's output pressure is complete, the calibration base 15 is removed and the placement base 5 is reinstalled. Finally, a fine-tuning calibration to restore production status is performed. This existing method for calibrating the placement head's output pressure is particularly time-consuming, especially in cooling the placement platform and installing and removing the placement base and / or calibration base. The entire calibration process takes approximately 10 hours, resulting in significant downtime and reduced production efficiency. In addition, the patch base and calibration base are each components weighing up to 5KG. Frequent installation and removal of the patch base and / or calibration base is a painful task for operators, and manual operation may also cause potential quality problems.

[0004] Therefore, it is necessary to improve the existing methods for calibrating the output pressure of the mounting head of a thermosetting bonding machine. Summary of the Invention

[0005] The purpose of this invention is to provide a tool and method for calibrating the output pressure of the mounting head of a thermosetting bonding machine. The tool and method according to this invention overcome at least one of the deficiencies in the prior art described above.

[0006] According to the present invention, a tool for calibrating the output pressure of the mounting head of a thermosetting bonding machine is provided, comprising:

[0007] Main body;

[0008] A hollow cavity formed within the main body; and

[0009] An air inlet and an exhaust outlet are formed on the main body and lead to the hollow cavity.

[0010] Preferably, at least one threaded hole is provided on the top of the main body to fix the support containing the force sensor to the main body.

[0011] Preferably, at least one support column is formed in the hollow cavity, extending from the top surface of the hollow cavity to the bottom surface of the hollow cavity.

[0012] Preferably, the support column is located at the position where a support on the main body is mounted, on which a mechanical sensor is mounted.

[0013] Preferably, the tool further includes legs extending downward from both ends of the bottom side of the main body.

[0014] Preferably, the main body and / or the legs are made of polytetrafluoroethylene.

[0015] Preferably, the tool further includes a support with a force sensor mounted on the top of the main body.

[0016] According to another aspect of the present invention, a method is provided for calibrating the output pressure of a placement head of a thermosetting bonding machine, wherein the thermosetting bonding machine includes a placement platform, a placement base disposed on the placement platform, and the placement head, the method comprising:

[0017] Place the tool, equipped with a mechanical sensor as described above, which is used to calibrate the output pressure of the mounting head of the thermosetting bonding machine, onto the patch base;

[0018] The output pressure of the placement head is calibrated to ensure that the output pressure of the placement head is consistent with the predetermined pressure.

[0019] Remove the tool equipped with the force sensor from the patch base; and

[0020] Perform calibration and fine-tuning to restore the production state.

[0021] Preferably, the method further includes supplying cooling air to the hollow chamber of the tool before placing the tool equipped with the force sensor on the patch base.

[0022] Preferably, calibrating the output pressure of the mounting head includes applying pressure to the force sensor through the mounting head and reading the output pressure of the mounting head based on the force sensor.

[0023] Preferably, when the output pressure of the mounting head is greater than the predetermined pressure, the input pressure of the mounting head is reduced; when the output pressure of the mounting head is less than the predetermined pressure, the input pressure of the mounting head is increased.

[0024] Preferably, the mechanical sensor is preheated before calibrating the output pressure of the mounting head.

[0025] Preferably, cooling air is supplied to the hollow chamber through the air inlet at a flow rate of 80 to 100 liters per minute.

[0026] According to the present invention, since there is no need to cool the patch platform and disassemble the patch base installed on the patch platform, the entire process of calibrating the output pressure of the placement head of the thermosetting bonding machine is shortened from about 10 hours to about 2 hours, greatly reducing downtime and significantly improving production efficiency. It also avoids the pain caused to operators and potential quality problems caused by frequent installation and disassembly of the patch base and / or calibration base. Attached Figure Description

[0027] Figure 1 A thermosetting bonding machine for mounting wafers onto a substrate is shown schematically.

[0028] Figure 2 The diagram schematically illustrates the calibration of the mounting head output pressure of a thermosetting bonding machine according to existing methods;

[0029] Figure 3 A 3D diagram schematically shows the tool used to calibrate the output pressure of the mounting head of a thermosetting bonding machine;

[0030] Figure 4 yes Figure 3 Side view of the tool shown;

[0031] Figure 5 yes Figure 3 The tool shown follows Figure 4 Sectional view along centerline 5-5; and

[0032] Figure 6 The illustration shows the use of Figure 3 The tool is used to calibrate the output pressure of the mounting head of the thermosetting bonding machine. Detailed Implementation

[0033] The preferred embodiments of the present invention are described in detail below with reference to examples. Those skilled in the art should understand that these embodiments are exemplary and do not imply any limitation on the present invention.

[0034] Figure 3 A 3D diagram schematically illustrates the tools used to calibrate the output pressure of the mounting head of a thermosetting bonding machine. Figure 4 yes Figure 3 The side view of the tool shown, and Figure 5 yes Figure 3 The tool shown follows Figure 4 Sectional view along centerline 5-5. (See example...) Figure 3-5 As shown, the tool 20 for calibrating the output pressure of the mounting head of a thermosetting bonding machine generally includes a body 21. Although the body is shown as a cuboid in the preferred embodiment, it should be understood that the body can be formed in any suitable shape, such as a cube or cylinder. A hollow chamber 23 is formed within the body 21, and an air inlet 25 and an air outlet 27 leading to the hollow chamber 23 are also formed on the body 21. At least one threaded hole 29 is provided at the top of the body 21 to accommodate a support 19 (e.g., a mechanical sensor 17) mounted on it. Figure 2 The tool 20 is secured to its main body 21 by screws screwed into threaded holes 29. Alternatively, the support 19 housing the force sensor 17 can also be secured to the main body 21 by other suitable means, such as snap-fit. At least one support post 31 extending from the top surface to the bottom surface of the hollow chamber 23 can be formed within the hollow chamber 23 of the main body 21. In a preferred embodiment, three support posts 31 are shown, and these posts 31 are preferably located on the main body 21 at the positions where the support 19 housing the force sensor 17 is mounted. This prevents the hollow chamber from collapsing due to excessive pressure on the main body during calibration of the mounting head's output pressure, and prevents the force sensor 17 from vibrating due to airflow. The tool 20 may also include feet 33 extending downwards from both ends of the bottom side of the main body 21 to further improve thermal insulation.

[0035] Although the tool 20 can be made of any suitable material, the body 21 and / or legs 33 of the preferred tool 20 are made of an insulating material such as plastic, for example, polytetrafluoroethylene which is heat-resistant and wear-resistant.

[0036] Before calibrating the output pressure of the mounting head of the thermosetting bonding machine, the support 19, which houses the force sensor 17, is fixed to the body 21 of the tool 20 by screws screwed into the threaded hole 29. Cooling air is then supplied through the air inlet 25 to the hollow chamber 23 within the body 21 of the tool 20, and the heated cooling air is discharged from the hollow chamber 23 through the exhaust port 27. To ensure cooling efficiency and keep the tool at a stable low temperature, such as 30°C, while preventing vibration and shock to the force sensor 17, the cooling air velocity is maintained at 80 to 100 liters per minute.

[0037] The following will combine Figure 6 This invention describes a method for calibrating the output pressure of the mounting head of a thermosetting bonding machine.

[0038] Figure 6 The illustration shows the use of Figure 3 The tool calibrates the output pressure of the placement head of the thermosetting bonder. Since the tool 20 according to the invention for calibrating the output pressure of the placement head of the thermosetting bonder can also provide heat insulation, such as... Figure 6 As shown, the method for calibrating the output pressure of the placement head of a thermosetting bonding machine according to the present invention allows the tool 20 equipped with the force sensor 17 to be placed directly onto the placement base 5 without cooling the placement platform 3 or removing the placement base 5 mounted on the placement platform 3. To prevent the tool 20 equipped with the force sensor 17 from contacting the placement base 5 and causing a temperature rise, cooling air can be supplied to the hollow chamber 23 of the tool 20 before placing it onto the placement base 5. The output pressure of the placement head 13 is then calibrated to match a predetermined pressure. After the output pressure of the placement head 13 is calibrated, the tool 20 equipped with the force sensor 17 is removed from the placement base 5. Finally, a fine-tuning calibration to restore the production state is performed.

[0039] During the calibration of the output pressure of the placement head 13, the placement head 13 applies pressure to the force sensor 17, and the output pressure of the placement head 13 is read from the force sensor 17. When the output pressure of the placement head 13 is greater than a predetermined pressure, the input pressure of the placement head 13 can be appropriately reduced until the output pressure of the placement head 13 matches the predetermined pressure; when the output pressure of the placement head 13 is less than the predetermined pressure, the input pressure of the placement head 13 can be appropriately increased until the output pressure of the placement head 13 matches the predetermined pressure. Furthermore, before calibrating the output pressure of the placement head 13, the force sensor 17 can be preheated to, for example, 30°C to help the force sensor 17 output a stable reading.

[0040] The method for calibrating the output pressure of the placement head of a thermosetting bonding machine according to the present invention avoids heat transfer from the placement platform and / or placement base to the mechanical sensor by utilizing the tool according to the invention. Therefore, the output pressure of the placement head of the thermosetting bonding machine can be calibrated without cooling the placement platform or removing the placement base mounted on the placement platform. This not only reduces the entire calibration process time from approximately 10 hours to approximately 2 hours, significantly reducing downtime and greatly improving production efficiency, but also avoids the pain and potential quality problems caused to operators by frequent installation and removal of the placement base and / or calibration base.

[0041] Although the invention has been described in detail with reference to preferred embodiments, it should be understood that such detailed description is for illustrative purposes only and does not constitute a limitation thereof. For example, in a preferred embodiment, the support with the force sensor is not part of the tool, but it should be understood that the support with the force sensor can also be incorporated into the tool. The scope of the invention is determined by the technical solutions defined in the claims.

Claims

1. A tool for calibrating the output pressure of the mounting head of a thermosetting bonding machine, comprising: Main body (21); A hollow cavity (23) is formed within the main body (21); An air inlet (25) and an exhaust outlet (27) formed on the main body (21) and leading to the hollow chamber (23); and A support (19) with a mechanical sensor (17) is mounted on the top of the main body (21). The air inlet (25), the hollow chamber (23) and the exhaust port (27) are used to allow cooling air to flow through the main body (21) to prevent heat transfer to the mechanical sensor (17).

2. The tool for calibrating the output pressure of the mounting head of a thermosetting bonding machine according to claim 1, characterized in that, At least one threaded hole (29) is provided on the top of the main body (21) so as to fix the support (19) containing the mechanical sensor (17) to the main body (21).

3. The tool for calibrating the output pressure of the mounting head of a thermosetting bonding machine according to claim 1, characterized in that, At least one support column (31) is formed in the hollow cavity (23) extending from the top surface of the hollow cavity (23) to the bottom surface of the hollow cavity (23).

4. The tool for calibrating the output pressure of the mounting head of a thermosetting bonding machine according to claim 3, characterized in that, The support column (31) is located on the main body (21) at the position where the support (19) on which the mechanical sensor (17) is mounted is installed.

5. The tool for calibrating the output pressure of the mounting head of a thermosetting bonding machine according to claim 1, characterized in that, It also includes legs (33) extending downward from both ends of the bottom side of the main body (21).

6. The tool for calibrating the output pressure of the mounting head of a thermosetting bonding machine according to claim 5, characterized in that, The main body (21) and / or the legs (33) are made of polytetrafluoroethylene.

7. A method for calibrating the output pressure of the mounting head of a thermosetting bonding machine, wherein, The thermosetting bonding machine includes a placement platform, a placement base disposed on the placement platform, and a placement head; the method includes: Place the tool, equipped with a mechanical sensor as described in any one of claims 1-6, for calibrating the output pressure of the mounting head of the thermosetting bonding machine onto the patch base; The output pressure of the placement head is calibrated to ensure that the output pressure of the placement head is consistent with the predetermined pressure. Remove the tool equipped with the force sensor from the patch base; and Perform calibration and fine-tuning to restore the production state.

8. The method for calibrating the output pressure of the mounting head of a thermosetting bonding machine according to claim 7, characterized in that, It also includes supplying cooling air to the hollow chamber of the tool before placing the tool equipped with the force sensor on the patch base.

9. The method for calibrating the output pressure of the mounting head of a thermosetting bonding machine according to claim 7, characterized in that, Calibrling the output pressure of the placement head includes applying pressure to the force sensor through the placement head and reading the output pressure of the placement head based on the force sensor.

10. The method for calibrating the output pressure of the mounting head of a thermosetting bonding machine according to claim 9, characterized in that, When the output pressure of the placement head is greater than the predetermined pressure, the input pressure of the placement head is reduced; when the output pressure of the placement head is less than the predetermined pressure, the input pressure of the placement head is increased.

11. The method for calibrating the output pressure of the mounting head of a thermosetting bonding machine according to claim 7, characterized in that, The mechanical sensor is preheated before calibrating the output pressure of the mounting head.

12. The method for calibrating the output pressure of the mounting head of a thermosetting bonding machine according to claim 8, characterized in that, Cooling air is supplied to the hollow chamber through the air inlet at a flow rate of 80 to 100 liters per minute.

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