Display device and method of manufacturing the same

Abstract

A display device includes a metal layer, a push layer, an insulating layer, and a conductive layer. The push layer is located below the metal layer, and the push layer partially overlaps the metal layer. The insulating layer covers the metal layer and the push layer. The conductive layer covers the insulating layer and the metal layer, and the conductive layer overlaps the push layer in a vertical projection direction. Because the display device has the push layer located below the metal layer, the distance between the upper surface of the conductive layer and the insulating layer located on the circuit of the metal layer can be increased. In this way, the electrical connector disposed on the bonding pad of the metal layer and the insulating layer located on the circuit of the metal layer will not be crushed and broken due to the alignment deviation of the machine, resulting in short circuit.

Description

Technical Field

[0001] This invention relates to a display device and a method for manufacturing the same. Background Technology

[0002] Current product designs often feature fine-pitch designs, while the alignment accuracy of the bonding equipment is approximately 5 micrometers. Therefore, during chip bonding, the distance between the conductive layer and the insulating layer may be smaller than the alignment deviation of the equipment. This misalignment can cause electrical connectors and the insulating layer to be squeezed together during the bonding pressurization process, leading to insulation layer rupture and a short circuit.

[0003] Therefore, in view of this, how to provide a display device that can avoid the insulation layer from being squeezed during the bonding and pressurization process of electrical connectors and insulation layer is still one of the goals that the industry urgently needs to study. Summary of the Invention

[0004] One object of the present invention is to provide a display device in which the electrical connector disposed on the bonding pad of the metal layer and the insulating layer on the line located on the metal layer are not squeezed and broken due to machine misalignment, thus causing a short circuit.

[0005] In one embodiment of the present invention, the display device includes a metal layer, a propulsion layer, an insulating layer, and a conductive layer. The propulsion layer is located below the metal layer and partially overlaps with the metal layer. The insulating layer covers the metal layer and the propulsion layer. The conductive layer covers the insulating layer and the metal layer, and overlaps with the propulsion layer in the vertical projection direction.

[0006] In one embodiment of the invention, the metal layer includes bonding pads and wiring, and the push layer overlaps with the bonding pads.

[0007] In one embodiment of the invention, the insulating layer includes a first portion located on the line, and there is a distance between the conductive layer and the first portion of the insulating layer, and this distance is less than or equal to 5 micrometers.

[0008] In one embodiment of the present invention, the propulsion layer comprises multiple blocks, and the blocks are separated from each other.

[0009] In one embodiment of the present invention, the propulsion layer comprises an organic material.

[0010] In one embodiment of the present invention, the thickness of the propulsion layer is less than 3 micrometers.

[0011] In one embodiment of the present invention, the insulating layer comprises an organic material.

[0012] In one embodiment of the present invention, the insulating layer comprises organic materials and inorganic materials.

[0013] Another object of the present invention is a method for manufacturing a display device.

[0014] In one embodiment of the present invention, a method for manufacturing a display device includes: forming a propulsion layer; forming a metal layer on the propulsion layer, wherein the propulsion layer and the metal layer partially overlap; forming an insulating layer on the metal layer, wherein the insulating layer covers the metal layer and the propulsion layer; and forming a conductive layer on the insulating layer, wherein the conductive layer covers the insulating layer and the metal layer, and wherein the conductive layer and the propulsion layer overlap in the vertical projection direction.

[0015] In one embodiment of the invention, forming the propulsion layer includes forming a plurality of blocks, and these blocks are separated from each other.

[0016] In one embodiment of the invention, the metal layer includes bonding pads and wiring, and forming the metal layer includes overlapping the push layer with the bonding pads.

[0017] In one embodiment of the present invention, the method of manufacturing a display device further includes connecting an electrical connector and a conductive layer, wherein the insulating layer includes a first portion located on a circuit, and the electrical connector is separate from the first portion of the insulating layer.

[0018] In the above embodiments, since the display device of the present invention has a push layer located below the metal layer, the distance between the upper surface of the conductive layer and the insulating layer on the circuit of the metal layer can be increased. This prevents the electrical connectors disposed on the bonding pads of the metal layer from being squeezed and broken due to machine misalignment, thus avoiding short circuits.

[0019] Compared to existing technologies, the display device of the present invention, having a push layer located below the metal layer, increases the distance between the upper surface of the conductive layer and the insulating layer on the lines of the metal layer. This prevents the electrical connectors disposed on the bonding pads of the metal layer from being squeezed and broken due to misalignment of the machine tool, thus avoiding short circuits. Attached Figure Description

[0020] Figure 1 This is a cross-sectional view of a display device according to an embodiment of the present invention.

[0021] Figure 2A This is a cross-sectional view of a well-known display device.

[0022] Figure 2B This is a cross-sectional view of a display device according to another embodiment of the present invention.

[0023] Figure 2C This is a cross-sectional view of a display device according to another embodiment of the present invention.

[0024] Figure 3 This is a cross-sectional view of a display device according to an embodiment of the present invention.

[0025] Figure 4 This is a top view of an intermediate step in a method for manufacturing a display device according to an embodiment of the present invention.

[0026] Figure 5 This is a top view of an intermediate step in a method for manufacturing a display device according to an embodiment of the present invention.

[0027] Figure 6 This is a top view of an intermediate step in a method for manufacturing a display device according to an embodiment of the present invention.

[0028] Figure 7 This is a top view of an intermediate step in a method for manufacturing a display device according to an embodiment of the present invention.

[0029] Explanation of key figure labels:

[0030] 100 - Display device; 110 - Metal layer; 110A - Bonding pad; 110B - Circuit; 120 - Propulsion layer; 122 - Block; 130 - Insulating layer; 132 - First part; 134 - Second part; 132S - Upper surface; 140 - Conductive layer; 140S - Upper surface; 150 - Bump; G1, G2 - Gap; D - Distance; T - Thickness; AA - Active area; BR - Bonding area; S - Displacement. Detailed Implementation

[0031] Several embodiments of the present invention will be disclosed below with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not essential. Furthermore, for the sake of simplicity, some well-known and conventional structures and elements will be illustrated in a simple schematic manner in the drawings. And for clarity, the thickness of layers and regions in the drawings may be exaggerated, and the same element symbols denote the same elements in the description of the drawings.

[0032] Figure 1 This is a cross-sectional view of a display device 100 according to an embodiment of the present invention. Figure 7 This is a top view of an intermediate step in a method for manufacturing a display device according to an embodiment of the present invention. Figure 1 For along Figure 7 The diagram shows a cross-sectional view of line segment 1-1. The display device includes a metal layer 110, a propulsion layer 120, an insulating layer 130, and a conductive layer 140. The propulsion layer 120 is located below the metal layer 110 and partially overlaps with the metal layer 110. The insulating layer 130 covers both the metal layer 110 and the propulsion layer 120.

[0033] Metal layer 110 includes bonding pad 110A and line 110B, and advance layer 120 overlaps with bonding pad 110A. Insulating layer 130 includes a first portion 132 on line 110B and a second portion 134 on bonding pad 110A. Conductive layer 140 covers the second portion 134 of insulating layer 130 and bonding pad 110A of metal layer 110, and conductive layer 140 overlaps with advance layer 120 in the vertical projection direction. Bonding pad 110A of metal layer 110 is exposed from insulating layer 130 to contact conductive layer 140, and conductive layer 140 is configured to prevent oxidation of metal layer 110. Conductive layer 140 covering the second portion 134 of insulating layer 130 has a distance D between it and the first portion 132 of insulating layer 130, and distance D is approximately less than or equal to 5 micrometers.

[0034] The metal layer 110 may be made of materials such as aluminum (Al), silver (Ag), or copper (Cu). The insulating layer 130 may contain organic or inorganic materials. The propulsion layer 120 comprises multiple separate blocks 122. The propulsion layer 120 contains organic materials, such as resin or polyvinylpyrrolidone (PVP). The conductive layer 140 is made of a transparent conductive material, such as indium tin oxide (ITO).

[0035] Figure 2A This is a cross-sectional view of a known display device. Current product designs often feature fine-pitch designs, and the alignment accuracy deviation of the chip placement equipment is approximately 5 micrometers. Therefore, it is possible that the distance D (less than or equal to 5 micrometers) between the conductive layer 140 and the first portion 132 of the insulating layer 130 may be less than the equipment alignment deviation. For example, when placing a bump 150 of an electronic device such as a chip to connect the conductive layer 140 and the chip, the displacement S between the center position of the bonding pad 110A and the center position of the bump 150 can be defined as the equipment alignment deviation. This alignment deviation may cause the bump 150 and the first portion 132 of the insulating layer 130 located on the line 110B to overlap, leading to the electrical connector and the first portion 132 of the insulating layer 130 being pressed together during the bonding process. This could cause the insulating layer 130 to crack, resulting in a short circuit.

[0036] Figure 2B This is a cross-sectional view of a display device 100a according to another embodiment of the present invention. The display device 100a includes... Figure 1 A cross-sectional view of the display device 100 after connecting the protrusion 150. Also refer to... Figure 1 and Figure 2BIn this embodiment, the bump 150 of the chip or other electronic device is connected to the conductive layer 140. After being subjected to an external force F during the bonding pressurization process, the bump 150 and the first portion 132 of the insulating layer 130 are still separated by a gap G2, and the gap G2 is smaller than the gap G1. (Comparison) Figure 1 and Figure 2A It can be seen that by setting the push layer 120 below the bonding pad 110A, the gap G1 between the upper surface 140S of the conductive layer 140 and the upper surface 132S of the first portion 132 of the insulating layer 130 can be increased. In this way, as... Figure 2B As shown, after the bump 150 on the conductive layer 140 is squeezed by an external force F, the bump 150 and the first part 132 of the insulating layer 130 are still separated by a gap G2, which can prevent the insulating layer 130 from cracking due to external force.

[0037] Figure 2C This is a cross-sectional view of a display device 100b according to another embodiment of the present invention. In this embodiment, after the bump 150 on the conductive layer 140 is pressed by an external force F, the bump 150 can contact the first portion 132 of the insulating layer 130. However, since the push layer 120 increases the gap G1 between the upper surface 140S of the conductive layer 140 and the upper surface 132S of the first portion 132 of the insulating layer 130, the pressure exerted by the bump 150 on the first portion 132 after engagement is insufficient to cause the insulating layer 130 to break.

[0038] The thickness T of the propulsion layer 120 is less than 3 micrometers. This design avoids excessively increasing the volume of the display device 100 and also prevents short circuits in the display device 100. Furthermore, in this embodiment, since the insulating layer 130 contains organic materials, it has better ductility, thus reducing the risk of the insulating layer 130 cracking under pressure.

[0039] Figure 3 This is a cross-sectional view of a display device 100c according to an embodiment of the present invention. The display device 100c is substantially the same as the display device 100, except that the insulating layer 130a of the display device 100c simultaneously comprises organic and inorganic materials. For example, the insulating layer 130a may comprise an inorganic material layer contacting the metal layer 110 and an organic material layer (not shown) covering the inorganic material layer. Therefore, the organic material layer of the insulating layer 130a can still reduce the risk of the insulating layer 130a cracking under pressure.

[0040] Figures 4 to 6 This is a top view of an intermediate step in a method for manufacturing a display device according to an embodiment of the present invention. Figure 4 As shown, multiple blocks 122 of the push layer 120 are formed in the bonding region BR adjacent to the active region AA by an etching and developing process. The blocks 122 of the push layer 120 are separated from each other and arranged in an alternating manner.

[0041] Next, as Figure 5 As shown, a metal layer 110 is formed on the push layer 120. The metal layer 110 includes a bonding pad 110A and a line 110B, and the bonding pad 110A of the metal layer 110 overlaps with the push layer 120. The line 110B connects the active region AA and the bonding pad 110A. In this embodiment, the push layer 120 has a rectangular top view shape, and the top view profile of the push layer 120 is larger than the bonding pad 110A, but the invention is not limited thereto. In other embodiments, the push layer 120 can be of any shape and size, such as elliptical, cylindrical, or irregular shape, as long as the gap G1 between the bump 150 and the first portion 132 of the insulating layer 130 can be increased.

[0042] Next, as Figure 6 As shown, an insulating layer 130 is formed on the metal layer 110. The insulating layer 130 includes a first portion 132 of a line 110B covering the metal layer 110 and a second portion 134 of a bonding pad 110A covering the metal layer 110. The second portion 134 of the insulating layer 130 overlaps with the bonding pad 110A and the push layer 120. See also... Figure 1 and Figure 6 The step of forming the insulating layer 130 further includes exposing the bonding pad 110A of the metal layer 110 from the insulating layer 130 for electrical connection to the conductive layer 140 in a subsequent process.

[0043] Finally, as Figure 7 As shown, a conductive layer 140 is formed on the insulating layer 130. See also... Figure 1 and Figure 7 The conductive layer 140 covers the insulating layer 130 and the metal layer 110, and the conductive layer 140 is electrically connected to the bonding pad 110A of the metal layer 110. The conductive layer 140 overlaps with the second portion 134 of the insulating layer 130, the bonding pad 110A, and the push layer 120. As described above, after the conductive layer 140 is formed, the conductive layer 140 can be sequentially connected to an electrical connector (e.g., Figure 2B The bump 150 shown is used to electrically connect to an external electronic device.

[0044] In summary, the display device of the present invention has a propulsion layer located below the metal layer, which increases the distance between the upper surface of the conductive layer and the insulating layer on the circuitry of the metal layer. This prevents the electrical connectors disposed on the bonding pads of the metal layer from being squeezed and cracked due to misalignment of the machine tool, thus avoiding short circuits. Furthermore, since the insulating layer contains organic materials, the risk of cracking due to compression is reduced.

[0045] Although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the claims.

Claims

1. A display device, characterized in that, Include: The metal layer includes bonding pads and wiring; A propulsion layer is located below the metal layer, and the propulsion layer overlaps with the bonding pad of the metal layer in the vertical projection direction, while the propulsion layer does not overlap with the circuit in the vertical projection direction; An insulating layer covering the metal layer and the propulsion layer, wherein the insulating layer includes a first portion located on the line; as well as A conductive layer covers the insulating layer and the metal layer, and the conductive layer overlaps with the propulsion layer in the vertical projection direction, while the conductive layer does not overlap with the circuit in the vertical projection direction, wherein the upper surface of the conductive layer located directly above the bonding pad is higher than the upper surface of the first portion.

2. The display device as claimed in claim 1, characterized in that, There is a distance between the conductive layer and the first portion of the insulating layer, and the distance is less than or equal to 5 micrometers.

3. The display device as claimed in claim 1, characterized in that, The propulsion layer comprises multiple blocks, and the multiple blocks are separated from each other.

4. The display device as claimed in claim 1, characterized in that, The propulsion layer contains organic materials.

5. The display device as claimed in claim 1, characterized in that, The thickness of the propulsion layer is less than 3 micrometers.

6. The display device as claimed in claim 1, characterized in that, The insulating layer contains organic materials.

7. The display device as claimed in claim 1, characterized in that, The insulating layer comprises organic and inorganic materials.

8. A method for manufacturing a display device, characterized in that, Include: Form a propulsion layer; A metal layer is formed on the propulsion layer, wherein the metal layer includes a bonding pad and a circuit, wherein the propulsion layer and the bonding pad of the metal layer overlap in the vertical projection direction, and the propulsion layer and the circuit do not overlap in the vertical projection direction; An insulating layer is formed on the metal layer, and the insulating layer covers the metal layer and the push layer, wherein the insulating layer includes a first portion located on the line; as well as A conductive layer is formed on the insulating layer, the conductive layer covering the insulating layer and the metal layer, and the conductive layer and the propulsion layer overlap in the vertical projection direction, while the conductive layer and the circuit do not overlap in the vertical projection direction, wherein the upper surface of the conductive layer located directly above the bonding pad is higher than the upper surface of the first portion.

9. The method for manufacturing a display device as claimed in claim 8, characterized in that, Forming the propulsion layer involves forming multiple blocks, which are separated from each other.

10. The method for manufacturing a display device as claimed in claim 8, characterized in that, It also includes an electrical connector connecting the conductive layer, wherein the electrical connector is separate from the first portion of the insulating layer.

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